JP2019008989A - Socket and inspection jig - Google Patents

Abstract

To eliminate inconvenience caused by moisture thereby to stabilize an electrical connection between a contact probe of a socket and an electrode of an inspection substrate.SOLUTION: A socket 1 includes contact probes 20 and an insulating support 10 to support the contact probes. A recessed portion 15 where a plunger 22 of each contact probe 20 projects is provided in an arrangement region of the contact probes 20 on an inspection substrate mounting side of the insulating support 10. The recessed portion 15 opens to an outer surface other than a surface on the inspection substrate mounting side of the insulating support 10, and is a gap S3 for ventilation.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a socket provided with a contact probe for inspecting a semiconductor or the like, and an inspection jig.

  11 is a schematic enlarged sectional view of a conventional socket and inspection jig, FIG. 12 is a plan view, FIG. 13 is a sectional view taken along line XIII-XIII in FIG. 12, FIG. 14 is a sectional view taken along line XIV-XIV in FIG. A side view and FIG. 16 are bottom views. As shown in these drawings, the socket 50 includes an insulating support 60 composed of a pin block 61, a pin plate 62 and a guide 63, and a plurality of contact probes 20 supported by the insulating support 60. The guide 63 guides and positions a semiconductor (IC, LSI, etc.) 40 as an inspection object at a predetermined measurement position. The inspection jig 70 includes a socket 50 and an inspection substrate 30 (a substrate for connecting the contact probe 20 and the measuring device), and the inspection substrate 30 is closely fixed to the substrate mounting surface of the insulating support 60. Yes.

  At the time of measurement, the first plunger 21 of the contact probe 20 is connected to the electrode 41 of the semiconductor 40, and the second plunger 22 of the contact probe 20 is connected to the electrode 31 of the inspection substrate 30. Since the electrode 31 of the inspection substrate 30 is connected to the measurement apparatus, the electrode 41 of the semiconductor 40 is connected to the measurement apparatus via the inspection jig 70.

  In the socket 50 and the inspection jig 70 of the conventional example, a ventilation gap S <b> 2 is provided between the pin block 61 and the pin plate 62, and opens on the side surface of the insulating support 60. However, no ventilation means is provided between the pin plate 62 and the inspection substrate 30.

  By the way, in the semiconductor inspection, a temperature test assuming the use environment of the semiconductor is normally performed, and the socket 50 and the inspection jig 70 for semiconductor inspection are used in the same temperature test environment. Become. Specifically, the inspection substrate 30 is attached to the test tank so that the socket 50 of the inspection jig 70 is inside the test tank. At this time, the test substrate 30 serves as a wall that partitions the internal atmosphere and the external air of the test tank. Problems in that case include dew condensation, freezing dew on the socket 50, contact probe 20, and inspection substrate 30 by changing the state of the temperature test chamber from high temperature (normal temperature) → low temperature → high temperature (normal temperature) → low temperature, etc. There is frost generation. This is due to a phenomenon in which the amount of saturated water vapor changes with temperature change and the water vapor becomes liquid or solidifies. The standard of each temperature condition in the temperature test is high temperature> 50 ° C. normal temperature≈25 ° C. low temperature <0 ° C.

  In addition, the cause of condensation and frost is not only due to the temperature change of the test tank, but also the temperature change of the contact probe itself due to the energization of the contact probe 20 or the inspection substrate itself without the heat insulating material. It may be caused by the temperature test tank structure that becomes the shield of the material.

  The generated dew condensation, frost dew, and frost enter the gap between the installation surface of the test substrate 30 and the socket 50 and the plunger 22 of the contact probe 20 and the socket hole (the through hole 62a of the pin plate 62). A defect in which a current flows) and a short-circuit defect (short-circuit defect), and an open defect (a defect in which the plunger cannot move) is generated by freezing the moisture in a low temperature state (for example, region A in FIG. 11).

  Conventionally, with respect to the moisture condensation, freezing dew, and frost problems, the entire temperature test tank is heated to a high temperature and dried before the temperature test is started to temporarily remove moisture from the entire apparatus. Alternatively, there is a method in which the socket and the inspection substrate are removed and left in a high temperature dry state for a long time. However, although these methods have no problem with the contact performance immediately after dehumidification and drying, moisture generated by the long-term temperature test environment is generated and deposited inside the device, which causes leak, short, and open defects again. End up.

 Further, as a dehumidifying measure performed simultaneously with the semiconductor inspection, a method of dehumidifying by blowing dry air into the socket (between the semiconductor and the socket, between the pin block and the pin plate) during the semiconductor inspection (for example, a ventilation gap S2 in the conventional example) However, there is a problem in that it cannot sufficiently dehumidify moisture that has entered the surface between the inspection board and the socket and the gap between the contact probe plunger and the socket hole.

JP, 2006-207511, A Patent document 1 is an example of a socket for semiconductor inspection.

  As described above, condensation, frost dew, and frost accompanying the temperature test enter the gap between the inspection board and socket and the contact probe plunger and socket hole, causing leakage, short circuit, and open defects. End up.

  The present invention has been made in view of such a situation, and an object of the present invention is to eliminate inconvenience due to moisture and to stabilize electrical connection between the contact probe and the electrode of the inspection substrate. To provide a socket and an inspection jig.

One aspect of the present invention is a socket. The socket includes a contact probe and an insulating support that supports the contact probe,
A concave portion from which the contact probe protrudes is provided in a region where the contact probe is disposed on the inspection substrate mounting side of the insulating support, and the concave portion is a surface other than the surface of the insulating support on the inspection substrate mounting side. It is characterized by opening on the outer surface.

  It is preferable that the concave portion serves as a ventilation path.

  A hygroscopic material or a heat insulating material may be disposed in the recess.

  The height difference between the surface of the insulating support that is in contact with the inspection substrate and the bottom surface of the recess is preferably 0.15 mm or more and 0.2 mm or less.

Another embodiment of the present invention is an inspection jig. The inspection jig includes a contact probe, an insulating support that supports the contact probe, and an inspection substrate that is mounted on one side of the insulating support,
A concave portion from which the contact probe protrudes is provided in an arrangement region of the contact probe on the inspection substrate mounting side of the insulating support, and the concave portion opens on a side surface of the insulating support. To do.

  It should be noted that any combination of the above-described constituent elements, and those obtained by converting the expression of the present invention between methods and systems are also effective as aspects of the present invention.

  According to the present invention, the contact probe placement region on the inspection substrate mounting side of the insulating support that supports the contact probe is provided with a recess from which the plunger of the contact probe protrudes, and the recess is communicated with the outside air. It is possible to eliminate the inconvenience due to moisture and to stabilize the electrical connection between the contact probe and the electrode of the inspection substrate.

1 is a schematic enlarged cross-sectional view showing a first embodiment of a socket and an inspection jig according to the present invention. FIG. 3 is a plan view of the first embodiment. III-III sectional drawing of FIG. IV-IV sectional drawing of FIG. FIG. 3 is a side view of the first embodiment. The bottom view. FIG. 3 is a schematic enlarged cross-sectional view for explaining the effect of the first embodiment. FIG. 4 is a schematic enlarged cross-sectional view showing a second embodiment of the present invention. FIG. 5 is a schematic enlarged cross-sectional view showing a third embodiment of the present invention. FIG. 6 is a schematic enlarged cross-sectional view showing a fourth embodiment of the present invention. The general enlarged sectional view of the conventional example of a socket and an inspection jig. The top view of a prior art example. XIII-XIII sectional drawing of FIG. XIV-XIV sectional drawing of FIG. The side view of a prior art example. The bottom view.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent component, member, process, etc. which are shown by each drawing, and the overlapping description is abbreviate | omitted suitably. In addition, the embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

<Embodiment 1>
1 is a schematic enlarged sectional view showing a first embodiment of a socket and an inspection jig according to the present invention, FIG. 2 is a plan view, FIG. 3 is a sectional view taken along line III-III in FIG. 2, and FIG. IV sectional view, FIG. 5 is a side view, FIG. 6 is a bottom view, and FIG. As shown in these drawings, the socket 1 includes an insulating support 10 having a structure in which a pin block 11, a pin plate 12 and a guide 13 are integrated, and a plurality of contact probes 20 supported by the insulating support 10. . The inspection jig 2 includes a socket 1 and an inspection substrate 30 that is mounted on the opposite side of the guide 13 of the insulating support 10. The inspection substrate 30 is tightly fixed to the substrate mounting surface of the insulating support 10. As will be described later in detail, a ventilation gap S <b> 3 is formed between the insulating support 10 and the inspection substrate 30.

  The contact probe 20 includes a conductive metal tube 23, first and second plungers 21 and 22 provided at both ends thereof, and a coil spring 24 provided in the conductive metal tube 23. The coil spring 24 biases the first plunger 21 and the second plunger 22 in a direction away from each other, and the tips of the first plunger 21 and the second plunger 22 protrude from both ends of the tube 23, respectively.

  The guide 13 of the insulating support 10 guides and positions a semiconductor (IC, LSI, etc.) 40 as an object to be inspected at a predetermined measurement position. The guide holding portion 11e of the pin block 11 allows the pin block 11 to It is held movably on one side within the range of the gap S1. The pin block 11 and the pin plate 12 have through holes 11a and 12a, and hold the contact probes 20 arranged in the through holes 11a and 12a so as not to drop off. The guide 13 also has through holes 13a corresponding to the through holes 11a and 12a. During measurement of the semiconductor 40, the guide 13 is moved in a direction in which the gap S1 is reduced so as to press the electrode 41 of the semiconductor 40 against the first plunger 21. The semiconductor 40 is held from above by a holding member (not shown) and is held by the guide 13.

  On the other side of the pin block 11, a recess 11b for arranging the pin plate 12 is formed, and the pin plate 12 is arranged and fixed therein. Further, a ventilation gap S <b> 2 is formed between the pin block 11 and the pin plate 12, and is opened on the side surface of the insulating support 10. The ventilation gap S2 is provided for dehumidification around the through holes 11a and 12a and the tube 23.

  Further, the depth from the substrate mounting surface 11d of the pin block 11 for mounting the inspection substrate 30 in close contact to the pin plate mounting surface 11c of the recess 11b (the depth seen in the axial direction of the contact probe 20) is the pin plate 12. Therefore, the concave portion 15 from which the second plunger 22 protrudes is provided in the arrangement region of the contact probe 20 on the inspection substrate mounting side of the insulating support 10. That is, when the inspection substrate 30 is mounted on the insulating support 10, a ventilation gap S <b> 3 is formed between the insulating support 10 and the inspection substrate 30, and the ventilation gap S <b> 3 opens on the side surface of the insulating support 10. ing.

  As shown in FIGS. 3 to 5, positioning pins 16 are erected and fixed to the board mounting surface 11 d of the pin block 11, and the positioning pins 16 are fitted into the positioning holes of the inspection board 30, so that they are used for inspection. The substrate 30 is positioned and fixed to the substrate mounting surface 11d of the pin block 11 (that is, the substrate mounting surface of the insulating support 10).

  The difference in height between the substrate mounting surface 11d of the insulating support 10 that contacts the inspection substrate 30 and the bottom surface of the recess 15 (the surface 12b of the pin plate 12 facing the inspection substrate 30) is 0.15 mm or more and 0. .2 mm or less is set. The height difference is determined in consideration of the stroke of the second plunger 22 and the like, but if it is less than 0.15 mm, the ventilation effect is small, and if it is more than 0.2 mm, the positioning accuracy of the second plunger 22 decreases.

  At the time of measurement, the semiconductor 40 is pressed from above by a pressing member (not shown) and held by the guide 13, the first plunger 21 of the contact probe 20 is connected to the electrode 41 of the semiconductor 40, and the second plunger 22 of the contact probe 20. Is connected to the electrode 31 of the inspection substrate 30. Since the electrode 31 of the inspection substrate 30 is connected to the measuring device, the electrode 41 of the semiconductor 40 is connected to the measuring device via the inspection jig 2.

  According to the present embodiment, the following effects can be achieved.

(1) By providing a ventilation gap S3 between the insulating support 10 and the inspection substrate 30, the contact portion between the contact probe 20 and the electrode 31 of the inspection substrate 30 is opened (exposed to the ventilation gap S3). It is possible to prevent moisture from flowing into the gap between the second plunger 22 and the through hole 12a.

(2) By providing the ventilation gap S3, the contact portion between the contact probe 20 and the electrode 31 of the inspection substrate 30 can be opened, and moisture can be evaporated to the test environment atmosphere.

(3) By using the ventilation gap S3 as a path for dry air and forcibly blowing dry air, the contact portion between the contact probe 20 and the electrode 31 of the inspection substrate 30 can be directly dried. is there. Further, by forcedly blowing dry air, it is also possible to remove the sliding foreign matter C (dust, debris) generated from the sliding portion of the contact probe 20 shown in FIG. 7 by blowing.

(4) From the above, it is possible to remove the adverse effects due to dew condensation, frost dew, and frost associated with the temperature test, and to stabilize the electrical connection between the contact probe 20 and the electrode of the inspection substrate 30. Furthermore, by providing the ventilation gap S3, the contact surface of the socket 1 with the inspection board 30 is reduced, and the ventilation gap S3 can block direct heat conduction between the socket 1 and the inspection board 30. . Thereby, in the temperature test in which the inspection jig 2 having the socket 1 is attached to the test tank, the heat of the test tank is prevented from escaping from the opposite surface of the socket mounting surface of the inspection substrate 30 when the test tank is in a high temperature state. It is possible to prevent the outside air from entering from the opposite side of the socket mounting surface of the inspection substrate 30 when the test tank is in a low temperature state. As a result, the temperature of the test tank during the temperature test can be stably and efficiently maintained.

<Embodiment 2>
FIG. 8 is a schematic enlarged cross-sectional view showing the second embodiment of the present invention. The overall outer shape of the insulating support is substantially the same as that of the first embodiment, but the divided structure is different. In the second embodiment, the insulating support 10A has a structure in which the pin block 11A, the pin plate 12A, and the guide 13 are integrated, but the pin plate 12A is interposed between the inspection substrate 30 and the pin block 11A. That is, the pin plate 12A having the recess 15 is integrated with the pin block 11A, the inspection substrate 30 is closely fixed to the substrate mounting surface 12d of the pin plate 12A, and the place where the recess 15 is provided is the ventilation gap S3. It becomes. The outer shape of the insulating support 10A is substantially the same as that of the insulating support 10. Other configurations are the same as those of the first embodiment, and the same or corresponding parts are denoted by the same reference numerals as those of the first embodiment and description thereof is omitted.

  Also according to the second embodiment, the same effect as that of the first embodiment can be obtained.

<Embodiment 3>
FIG. 9 is a schematic enlarged cross-sectional view showing Embodiment 3 of the present invention. The overall outer shape of the insulating support is substantially the same as that of Embodiment 1, but the divided structure is different. In the third embodiment, the insulating support 10B has a structure in which the pin block 11B, the pin plate 12B, the spacer 14, and the guide 13 are integrated. That is, instead of the pin plate 12A having the recess 15 of the second embodiment, a laminated structure of the flat pin plate 12B and the spacer 14 is formed, and the through hole 19 that becomes the recess 15 at the time of stacking is formed in the spacer 14 in advance. ing. The inspection substrate 30 is fixed to the insulating support 10B with the spacer 14 interposed between the pin plate 12B and the inspection substrate 30. Thereby, the place which provided the through-hole 19 (the recessed part 15 of the insulation support body 10B) of the spacer 14 becomes the clearance gap S3. The outer shape of the insulating support 10B is substantially the same as that of the insulating support 10. Other configurations are the same as those of the first embodiment, and the same or corresponding parts are denoted by the same reference numerals as those of the first embodiment and description thereof is omitted.

  Also according to the third embodiment, the same effect as that of the first embodiment can be obtained.

<Embodiment 4>
FIG. 9 is a schematic enlarged sectional view showing a fourth embodiment of the present invention. In addition to the configuration of the first embodiment, a moisture absorbing material (dehumidifying material) or a heat insulating material 16 is provided in the recess 15 of the insulating support 1. ing. The hygroscopic material or the heat insulating material 16 has a structure in which the second plunger 22 is penetrated so as not to prevent contact between the second plunger 22 of the contact probe 20 and the electrode 31 of the inspection substrate 30. Other configurations are the same as those of the first embodiment, and the same or corresponding parts are denoted by the same reference numerals as those of the first embodiment and description thereof is omitted.

  By providing the hygroscopic material or the heat insulating material 16 in the recess 15 of the insulating support 1, condensation, frost dew, and frost are generated around the contact portion between the second plunger 22 of the contact probe 20 and the test substrate 30. The electrical connection between the contact probe 20 and the inspection substrate 30 can be stabilized.

  Further, when the heat insulating material 16 is provided in the concave portion 15, the heat insulating material 16 blocks direct heat conduction between the socket 1 and the inspection substrate 30, whereby the inspection jig 2 having the socket 1 is formed. In the temperature test attached to the test tank, when the test tank is in a high temperature state, it is possible to prevent the heat of the test tank from escaping from the opposite side of the socket mounting surface of the inspection substrate 30 and when the test tank is in a low temperature state. It becomes possible to prevent heat of outside air from entering from the opposite surface of the socket mounting surface of the inspection substrate 30. As a result, the temperature of the test tank during the temperature test can be stably and efficiently maintained.

  The present invention has been described above by taking the embodiment as an example. However, it is understood by those skilled in the art that various modifications can be made to each component and each processing process of the embodiment within the scope of the claims. By the way. Hereinafter, modifications will be described.

  In each embodiment, the structure of the contact probe and the insulating support that supports the contact probe can be appropriately changed according to the type of the inspection object.

  In each embodiment, the openings of the ventilation gaps S2 and S3 provided in the insulating support are provided on the four side surfaces of the insulation support. However, when forced air is supplied to the ventilation gaps S2 and S3, the openings are supplied. You may limit to two places, an air side and an exhaust side.

1,50 Socket 2,70 Inspection jig 10, 10A, 10B, 60 Insulating support 15 Recess 16 Resorbing material (dehumidifying material) or heat insulating material 20 Contact probe 30 Inspection substrate 31, 41 Electrode 40 Semiconductor S2, S3 For ventilation Gap

Claims (5)

A contact probe;
An insulating support for supporting the contact probe,
A concave portion from which the contact probe protrudes is provided in a region where the contact probe is disposed on the inspection substrate mounting side of the insulating support, and the concave portion is a surface other than the surface of the insulating support on the inspection substrate mounting side. A socket characterized by opening on the outer surface.   The socket according to claim 1, wherein the recess serves as a ventilation path.   The socket according to claim 1, wherein a hygroscopic material or a heat insulating material is disposed in the recess.   4. The height difference between the surface of the insulating support that is in contact with the inspection substrate and the bottom surface of the concave portion is 0.15 mm or more and 0.2 mm or less. 5. The listed socket. A contact probe;
An insulating support for supporting the contact probe;
An inspection substrate mounted on one side of the insulating support,
A concave portion from which the contact probe protrudes is provided in an arrangement region of the contact probe on the inspection substrate mounting side of the insulating support, and the concave portion opens on a side surface of the insulating support. Inspection jig to do.

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