JP2019080028A - Light emitting device - Google Patents

Abstract

A light-emitting device with improved reliability is provided. A light emitting device is a resin package having a plurality of leads including first and second leads, a first resin portion, a second resin portion, and a third resin portion, wherein the second resin portion is an element. A resin package which is located around the mounting area and forms a recess having an inner wall surface by the plurality of leads and the first resin portion; a light emitting element arranged in the element mounting area; The light-reflecting member is located between the second resin portion and the sealing member that covers the second resin portion and the light-emitting element, the light-reflecting member being located in a region of the recess surrounded by the light reflecting member. The second resin portion has a depression on the surface, and a part of the sealing member is located within the depression of the second resin portion. [Selection] Fig. 2B

Description

  The present disclosure relates to a light emitting device.

  Semiconductor light emitting devices represented by LEDs are widely used for various illuminations, backlights of liquid crystal display devices, and the like. For example, Patent Document 1 below discloses an LED device provided with a resin package having a metal part and a resin part. The resin package is provided with a recess, and the LED element is disposed in the recess. In patent document 1, improvement of light extraction efficiency is aimed at by providing a reflecting layer in the inner wall of a crevice.

  Patent Document 1 discloses, in FIG. 13, a structure in which a partition wall surrounding the LED element is further formed in the inside of the recess. In the technique described in Patent Document 1, after the LED element is disposed in the recess of the resin package, the barrier rib and the reflective layer are sequentially formed. The partition surrounding the LED element prevents the adhesion of the composition for forming the reflective layer to the side surface of the LED element. After the formation of the reflective layer, application of a composition containing a transparent resin and phosphor particles, and curing of the applied composition form a wavelength conversion layer that covers the LED element, the reflective layer, and the partition walls.

JP, 2014-158011, A

  However, peeling may occur between the structure, such as the wavelength conversion layer, which seals the LED element and the partition wall, and the partition wall, for example. The exfoliation of the structure for sealing the LED element reduces the reliability of the LED device.

  The light emitting device of the present disclosure is a resin package including a plurality of leads including a first lead and a second lead, a first resin portion, a second resin portion, and a third resin portion, and the first resin portion is a resin package. The second resin portion is located around the element mounting area, and the third resin portion is located between the first lead and the second lead, and the plurality of the plurality of resin films constitute the outer surface of the resin package. A recess having an inner wall surface is formed by the lead and the first resin portion, and a resin package in which a part of the top surface of the plurality of leads is located on the bottom surface of the recess, and light emission disposed in the element mounting region An element, a light reflecting member positioned between the inner wall surface and the second resin portion in the recess, and a portion of the recess surrounded by the light reflecting member; 2 Resin part and the light emitting element covered And a sealing member that, the second resin part has a depression in the surface, a portion of the sealing member is positioned in said recess of said second resin part.

  According to the embodiments of the present disclosure, it is possible to obtain a highly reliable light emitting device.

It is a schematic perspective view seen from the upper surface side of the light emitting device by a 1st embodiment. It is a typical perspective view seen from the undersurface side of a light emitting device by a 1st embodiment. It is the typical perspective view which looked at the structure which removed the light reflective member from the light-emitting device by 1st Embodiment from the upper surface side. It is a schematic top view of the structure which removed the light reflective member from the light-emitting device by 1st Embodiment. It is a typical end elevation which shows the 2C-2C line cross section of FIG. 2B. It is a schematic top view which expands and shows a part of FIG. 2B. It is a schematic end view when the light-emitting device 101 is cut | disconnected in the position of the 2C-2C line shown to FIG. 2B. It is a typical end elevation view which expands and shows hollow 32v shown in Drawing 2E, and its circumference. FIG. 21 is a schematic top view showing another example of the shape and arrangement of the recess 32 v. It is a typical top view of the 1st lead and the 2nd lead. It is a typical bottom view of the 1st lead and the 2nd lead. FIG. 1 is a schematic top view of a light emitting device according to a first embodiment. FIG. 6 is a schematic end view showing a cross section taken along line 6A-6A of FIG. 5; It is a typical end elevation which shows the 6B-6B line cross section of FIG. It is a typical end elevation which shows the 6C-6C line cross section of FIG. FIG. 2 is a schematic top view of a collective substrate 201. It is a typical top view showing four light emitting device equivalent fields 101 '. FIG. 10 is a schematic top view showing a portion corresponding to four light emitting device corresponding areas 101 'of the lead frame 202; FIG. 7 is a process cross-sectional view illustrating a manufacturing process of the light emitting device according to the first embodiment. FIG. 7 is a process cross-sectional view illustrating a manufacturing process of the light emitting device according to the first embodiment. It is a typical top view taking out and showing a portion corresponding to four light emitting device equivalent fields 101 'among a plurality of light emitting device equivalent fields 101' of a lead frame with a resin molding object. It is a schematic top view which shows the state by which the light emitting elements 41 and 42 were mounted in the element mounting area | region 21 r of 1st read equivalent area | region 21 '. FIG. 7 is a process cross-sectional view illustrating a manufacturing process of the light emitting device according to the first embodiment. FIG. 7 is a process cross-sectional view illustrating a manufacturing process of the light emitting device according to the first embodiment. It is process sectional drawing for demonstrating the modification of the manufacturing method of a light-emitting device. It is a schematic cross section which expands and shows the convex part 212 and its periphery which are shown to FIG. 13A. It is a figure which expands and shows a part of FIG. 13A. It is a typical top view for explaining other modifications of the manufacturing method of a light emitting device. FIG. 10 is a schematic top view of a structure in which the light reflective member 50 and the sealing member 75 are removed from the light emitting device 102 according to the second embodiment. It is a typical end elevation of the light-emitting device 102 in 15B-15B line | wire of FIG. 15A. It is a typical end elevation view which expands and shows convex part 32p shown in Drawing 15B, and its circumference. It is process sectional drawing which shows the manufacturing process of the light-emitting device by 2nd Embodiment. It is a schematic cross section which expands and shows the recessed part 214 shown to FIG. 16A and its periphery.

  Hereinafter, the light emitting device of the present disclosure will be described in detail with reference to the drawings. The following embodiments are illustrative, and the configuration of the light emitting device according to the present disclosure is not limited to the following embodiments. In the following description, terms that indicate particular directions or positions (e.g., "above", "below" and other terms that include those terms) may be used. These terms are only used for the sake of clarity as to the relative orientation or position in the referenced drawings. The sizes, positional relationships, and the like of components shown in the drawings may be exaggerated for the sake of clarity, and may not reflect the sizes and positional relationships of components in an actual light emitting device. In addition, in order to avoid becoming complicated too much, illustration of a part of element may be abbreviate | omitted in drawing.

  In the following description of the embodiments, the terms “resin package”, “lead frame with resin molded body”, “collective substrate” and the like may be the same terms before and after providing a light emitting element, a wire, etc. .

First Embodiment
[Light Emitting Device 101]
A light emitting device 101 according to a first embodiment of the present disclosure will be described. FIGS. 1A and 1B are schematic perspective views of the light emitting device 101 as viewed from the upper surface side and the lower surface side, respectively.

  The light emitting device 101 includes a resin package 10, at least one light emitting element, and a light reflective member 50. The resin package 10 is a housing of the light emitting device 101 and has a recess 11. In the configuration illustrated in FIGS. 1A and 1B, the light emitting device 101 includes two light emitting elements 41 and 42. The light emitting element 41 and the light emitting element 42 are located in the recess 11 of the resin package 10.

  The light emitting device 101 further includes a sealing member 75 that covers the light emitting element 41 and the light emitting element 42. In this example, the sealing member 75 covers at least the light emitting elements 41 and 42 and the light reflecting member 50 inside the recess 11. In FIG. 1A, the sealing member 75 is shown as a transparent member to show the internal structure. In the other drawings of the present disclosure, the sealing member 75 may be shown as a transparent member as in FIG. 1A.

  Each component will be described in detail below.

[Resin package 10]
The resin package 10 has an upper surface 10a and a lower surface 10b opposite to the upper surface 10a. In the configuration illustrated in FIGS. 1A and 1B, resin package 10 has a substantially rectangular outer shape in top view, and has four outer side surfaces. The four outer side surfaces include an outer side surface 10c, an outer side surface 10d opposite to the outer side surface 10c, an outer side surface 10e, and an outer side surface 10f opposite to the outer side surface 10e. In addition, the external shape of the resin package 10 in top view is not limited to a quadrangle, and may have another shape.

  The resin package 10 is provided with a recess 11 having an opening 11 a on the upper surface 10 a. The resin package 10 includes a resin body 30 and a plurality of leads integrally formed with the resin body 30. The resin body 30 has a first resin portion 31 constituting the outer side surfaces 10 c to 10 f of the resin package 10 and a second resin portion 32 formed inside the concave portion 11 so as to surround the light emitting elements 41 and 42. As described later, the second resin portion 32 has one or more recesses and / or one or more protrusions on its surface.

  In the configuration illustrated in FIGS. 1A and 1B, the resin package 10 has a first lead 21 and a second lead 22. As shown in FIG. 1B, a portion of the lower surface 21 b of the first lead 21 and a portion of the lower surface 22 b of the second lead 22 are exposed from the lower surface 10 b of the resin package 10. The first lead 21 and the second lead 22 have an arrangement such that the lower surface 21 b and the lower surface 22 b are positioned on substantially the same plane.

  As described later, the first lead 21 has one or more extending portions 21h, and the second lead 22 also has one or more extending portions 22h. As schematically shown in FIGS. 1A and 1B, the end face of the extending portion 21h which is a part of the first lead 21 is exposed from the outer side faces 10c, 10e and 10f of the resin package 10 here. Further, the end face of the extending portion 22 h which is a part of the second lead 22 is exposed from the outer side surface 10 d of the resin package 10.

  FIG. 2A is a schematic perspective view of a structure in which the sealing member 75 and the light reflecting member 50 are removed from the light emitting device 101 as viewed from the top side. FIG. 2B is a schematic top view of the light emitting device 101 with the sealing member 75 and the light reflective member 50 removed. FIG. 2C schematically shows an end face when cut along line 2C-2C in FIG. 2B. In addition, in FIG. 2C, in order to avoid that the drawing becomes excessively complicated, the illustration of the below-mentioned wire which electrically connects the light emitting element 42 and the first lead 21 to each other is omitted.

  The first lead 21 has an upper surface 21a opposite to the lower surface 21b, and the second lead 22 has an upper surface 22a opposite to the lower surface 22b. In this example, the light emitting elements 41 and 42 are disposed on the upper surface 21 a of the first lead 21, and the protective element 60 is disposed on the upper surface 22 a of the second lead 22. As shown in FIG. 2B, a portion of the top surface 21a of the first lead 21 and a portion of the top surface 22a of the second lead 22 are located on the bottom surface 11b of the recess 11. As described later, the first lead 21 has a first groove 21j and a second groove 21k provided on the upper surface 21a. The first groove 21j is positioned at least at a part of the periphery of the element mounting area 21r schematically shown by a broken line in FIG. 2B, and the second groove 21k extends from the first groove 21j. The element mounting area 21 r is an area where the light emitting elements 41 and 42 are mounted. Details of the first lead 21 and the second lead 22 will be described later.

[Resin body 30]
The resin body 30 includes a first resin portion 31, a second resin portion 32, and a third resin portion 33 positioned between the first lead 21 and the second lead 22. A portion of the top surface 33 a of the third resin portion 33 is located on the bottom surface 11 b of the recess 11.

  The first resin portion 31 has inner side surfaces 31c, 31d, 31e and 31f located on the opposite side of the outer surfaces 10c, 10d, 10e and 10f of the resin package 10. As shown in FIG. 2B, the inner side 31c and the inner side 31d face each other, and the inner side 31e and the inner side 31f face each other. In this example, adjacent two of the inner side surfaces 31c, 31d, 31e and 31f are connected to form a curved surface, and a clear boundary is not formed between the two inner side surfaces.

  The inner side surfaces 31 c, 31 d, 31 e and 31 f constitute the inner wall surface of the recess 11. The recess 11 of the resin package 10 is defined by the inner side surfaces 31 c, 31 d, 31 e and 31 f of the first resin portion 31, a part of the upper surface 21 a of the first lead 21 and a part of the upper surface 22 a of the second lead 22. Be done.

  In the resin package 10 shown in FIG. 2B, the opening 11a of the recess 11 has a substantially square outer shape in top view, and four corner portions are rounded. The outer edge of the bottom surface 11b of the recess 11 is rounded at a position of four corners in a top view so as to draw a circular arc having a larger radius than the four corners of the outer edge of the opening 11a. The resin package 10 may have an anode mark or a cathode mark formed by chamfering one corner of the opening 11 a of the recess 11 in top view. The anode mark or the cathode mark functions as a mark indicating the polarity of the first lead 21 and the second lead 22.

  As shown to FIG. 2B, the 2nd resin part 32 of the resin body 30 is arrange | positioned around element mounting area 21r. In the configuration illustrated in FIG. 2B, the first portion 32c of the second resin portion 32 has an annular shape that surrounds the element mounting area 21r without breaks. Here, a portion of the first portion 32 c is located on the upper surface 21 a of the first lead 21, and another portion is located on the second portion 32 d of the second resin portion 32. The remaining portion of the first portion 32 c is located on the upper surface 33 a of the third resin portion 33.

  The second resin portion 32 suppresses the light reflective member 50 from covering the side surfaces of the light emitting elements 41 and 42 in the process of forming the light reflective member 50. As shown in FIG. 1A, the light reflective member 50 is located between the inner wall surface of the recess 11 and the second resin portion 32. By forming the light reflective member 50 so that the side surfaces of the light emitting elements 41 and 42 are not directly covered, it is possible to suppress the light emitted to the side of the light emitting elements 41 and 42 from being blocked in the light reflective member 50. Can.

  In this example, the second resin portion 32 has an outer shape different from the outer shape of the light emitting device 101 in top view. While the outer shape of the light emitting device 101, that is, the outer shape of the resin package 10 is substantially square in top view, the first portion 32c of the second resin portion 32 has a substantially pentagonal outer shape in top view here doing. In the configuration illustrated in FIG. 2B, in particular, the first portion 32c has an inclined portion 32s extending obliquely with respect to the outer side surface 10c in top view. The first portion 32c also has an arc-shaped portion connecting a portion extending parallel to the outer side surface 10d in top view and a portion extending parallel to the outer side surface 10f in top view.

  As well represented in FIG. 2C, the second resin portion 32 is in a first portion 32c located above the plane including the upper surface 21a of the first lead 21 and in the first groove 21j of the first lead 21. And a second portion 32 d located below the plane including the upper surface 21 a of the first lead 21. In the present embodiment, the first portion 32c of the second resin portion 32 has a recess 32v on its surface. By providing the depressions 32v in the second resin portion 32, an effect of increasing the surface area of the second resin portion 32 can be obtained. Further, by forming the second portion 32 d of the second resin portion 32 in the first groove 21 j of the first lead 21, the area in which the second portion 32 d and the first lead 21 contact each other can be increased. And adhesion between them can be improved. That is, it is possible to more reliably arrange the second resin portion 32 on the bottom surface 11b.

  FIG. 2D is an enlarged view of a part of FIG. 2B. As described with reference to FIG. 2C, here, the first portion 32c of the second resin portion 32 protrudes from the upper surface 21a of the first lead 21 toward the opening 11a, and one or more recesses are formed on the surface It has 32v. In this example, a plurality of depressions 32v are formed in the first portion 32c, but the number of depressions 32v may be one.

  As described with reference to FIG. 1A, the light emitting device 101 includes the light emitting element 41 and the sealing member 75 covering the light emitting element 42. The sealing member 75 also covers the second resin portion 32 disposed in the recess 11.

  2E schematically shows a cross section when the light emitting device 101 is cut at the position of the 2C-2C line shown in FIG. 2B, and FIG. 2F schematically shows the depression 32v shown in FIG. 2E and the periphery thereof enlarged. Show. The hatched portions in FIGS. 2E and 2F represent the sealing member 75. In FIG. 2E, the wire 43c (see FIG. 2D) for electrically connecting the light emitting element 42 and the first lead 21 to each other is omitted for simplicity.

  As schematically shown in FIG. 2F, in the present embodiment, a part of the sealing member 75 is located in the recess 32v of the second resin portion 32. The contact area between the second resin portion 32 and the sealing member 75 is provided by providing the recess 32 v in the second resin portion 32 and forming the sealing member 75 so that a part thereof is positioned in the recess 32 v. Can be increased. By the increase in the contact area between the second resin portion 32 and the sealing member 75, the bond between the second resin portion 32 and the sealing member 75 can be made stronger. As a result, the effect of suppressing the peeling of the sealing member 75 from the second resin portion 32 is obtained, and the reliability of the light emitting device 101 is improved.

  Refer again to FIG. 2D. In the configuration illustrated in FIG. 2D, the recess 32 v has a shape extending mainly along the extending direction of the second resin portion 32. In addition, one of them is located in the vicinity of a portion of the first portion 32 c where the second resin portion 32 and the resin connection portion 34 described later are connected. The resin connection portion 34 has a structure disposed in the second groove 21k of the first lead 21. One end of the resin connection portion 34 is connected to the second portion 32d of the second resin portion 32, and the other end is the first resin portion It is in contact with the inner surface 31 c of 31. Further, in this example, one of the recesses 32v is located below the wire 43c electrically connecting the light emitting element 42 to the portion of the top surface 21a of the first lead 21 outside the element mounting region 21r. . In other words, a part of the wire 43 c is located above the recess 32 v of the second resin portion 32.

  A wire 43 d is further connected to the light emitting element 42, and one end of the wire 43 d is connected to the second lead 22. Similarly, one end of the wires 43a and 43b is connected to the light emitting element 41, and the other ends of the wires 43a and 43b are a portion of the first lead located outside the element mounting region 21r and a second Connected to lead 22. As can be seen from FIGS. 2B and 2D, a portion of the first lead 21 and a portion of the second lead 22 are exposed between the second resin portion 32 and the inner wall surface of the recess 11 here. By exposing a part of the first lead 21 and a part of the second lead 22 between the second resin portion 32 and the inner wall surface of the recess 11, one end is connected to the other end of the wire connected to the light emitting element Area can be secured.

  As illustrated in FIG. 3, the second resin portion 32 may have a recess 32 v ′ extending along a direction intersecting the extending direction of the second resin portion 32 in top view. In the example shown in FIG. 3, the wire 43a is disposed across the recess 32v '. A recess 32v 'is formed under the wire electrically connecting the light emitting element disposed in the element mounting area 21r to the first lead 21 or the second lead so that at least a part of the recess 32v' is located. Thus, the wires can be arranged more easily. The recess 32 v ′ may have a shape that connects the region inside the first portion 32 c of the second resin portion 32 and the region outside the first portion 32 c. An uncured resin material for forming the light reflective member 50 if at least a part of the portion included in the recess 32 v ′ of the surface of the first portion 32 c protrudes from the upper surface 21 a of the first lead 21. Can exert a function to hold back If it has a shape extending along the direction in which the second resin portion 32 extends, as in the case of the recess 32v described above, the second resin portion 32 and the sealing member 75 can be secured while securing the function of blocking the uncured resin material. The contact area between them can be increased and is beneficial.

  Furthermore, in this example, the recess 32 v ′ is located in the inclined portion 32 s of the first portion 32 c. As can be seen from FIG. 3, the inclined portion 32 s is an inner surface that constitutes the inner wall surface of the recess 11 as compared to a portion of the first portion 32 c that extends parallel to the outer surface 10 c and a portion that extends parallel to the outer surface 10 e. The distance from 31c and 31e is large. When the light reflecting member 50 is disposed by positioning the depression at a portion farther from the inner wall surface of the recess 11 in the first portion 32c, the uncured resin material for forming the light reflecting member 50 is used. The possibility of entering the element mounting area 21r beyond the first portion 32c is reduced. That is, the side surfaces of the light emitting elements 41 and 42 can be prevented from being covered by the light reflective member 50.

  Thus, the outer shape in a top view of the second resin portion 32 is made different from the outer shape of the light emitting device 101, for example, by providing the inclined portion 32s in the first portion 32c, the position farther from the inner wall surface of the recess 11 It becomes possible to arrange the depression in the As will be described in detail later, the light reflective member 50 drops the uncured resin material in the region between the inner wall surface of the recess 11 and the second resin portion 32, for example, and spreads the resin material by flow. And may be formed by curing a resin material. That is, in the bottom surface 11b of the recess 11, the region between the inner wall surface of the recess 11 and the first portion 32c of the second resin portion 32 has a function as a flow channel for the flow of the uncured resin material. It can. Therefore, arranging the recess by avoiding the portion of the first portion 32c where the distance from the inner wall surface of the recess 11 is smaller is that the side surfaces of the light emitting elements 41 and 42 are covered by the light reflecting member 50. It is advantageous to evasion.

  The shape, number, and arrangement of the depressions of the first portion 32c of the second resin portion 32 are not limited to the examples described with reference to FIGS. 2C to 2F and FIG. For example, the recess is formed at a bending portion connecting two portions of the first portion 32c extending parallel to the outer surface of the resin package 10 (for example, a portion extending parallel to the outer surface 10c and a portion extending parallel to the outer surface 10f). It may be located. Alternatively, a plurality of depressions may be provided in the second resin portion 32, or in addition to the depressions, one or more convex portions protruding from the surface of the first portion 32c may be formed in the first portion 32c of the second resin portion 32. You may provide. In the example shown in FIGS. 2C, 2E and 2F, the recess 32v is located near the top of the first portion 32c. However, the positions of the recess and the protrusion in the height direction with reference to the bottom surface 11 b of the recess 11 are arbitrary, and the shape of the recess in a cross sectional view is not limited to a specific shape. The shape of the depression in the top view is not limited to the elliptical shape as illustrated in FIG. 3, and may be, for example, an irregular shape.

  The maximum value of the width of the recess 32v in top view may be about the same as the width of the first portion 32c. Here, the "width" of the recess 32v refers to the distance between both ends of the recess 32v along the direction perpendicular to the extension direction of the portion of the first portion 32c where the recess 32v is located. The "width" of 32c refers to the distance between the ends of the first portion 32c along a direction perpendicular to the direction in which the first portion 32c extends.

  Please refer to FIG. 2C and FIG. 2D. As described above, the resin package 10 may further include the resin connection portion 34 located on the bottom surface 11 b of the recess 11. The resin connection portion 34 is a portion of the resin body 30 located between the second resin portion 32 and the first resin portion 31 and connects them to each other. As shown in FIG. 2C, here, the resin connection portion 34 does not protrude from the upper surface 21a of the first lead 21, and the upper surface 34a of the resin connection portion 34 and the upper surface 21a of the first lead 21 have substantially the same height. Located in When the uncured resin material for forming the light reflective member 50 is applied on the bottom surface 11 b of the recess 11 by making the upper surface 34 a of the resin connection portion 34 substantially the same height as the upper surface 21 a of the first lead 21. It is possible to allow the uncured resin material to flow naturally on the bottom surface 11 b without being blocked by the resin connection portion 34. Even when the resin connection portion 34 protrudes beyond the upper surface 21 a of the first lead 21, the uncured resin material can be obtained by making the height of the resin connection portion 34 lower than the height of the second resin portion 32. The material of the light reflective member 50 can be spread on the bottom surface 11 b while avoiding the flow of the resin from being blocked by the resin connection 34.

  By providing the resin connection portion 34 connecting the second resin portion 32 and the first resin portion 31 to the resin package 10, it is possible to prevent peeling of the second resin portion 32 from the bottom surface 11b of the recess 11. The formation of the resin connection portion 34 contributes to the improvement of the reliability of the light emitting device 101.

  As described above, the resin body 30 has the third resin portion 33 located between the first lead 21 and the second lead 22. As shown in FIG. 2C, the top surface 33 a of the third resin portion 33 is located on the bottom surface 11 b of the recess 11. The upper surface 33a is at the same height as the upper surface 21a of the first lead 21 and the upper surface 22a of the second lead 22, and does not protrude from the upper surface 21a of the first lead 21 and the upper surface 22a of the second lead 22.

  The third resin portion 33 has a lower surface 33b opposite to the upper surface 33a. The lower surface 33 b of the third resin portion 33 is located on the lower surface 10 b of the resin package 10. As shown in FIG. 2B, the third resin portion 33 is connected to the wall portion of the first resin portion 31 having the inner side surface 31e and the wall portion having the inner side surface 31f.

  A portion of the first portion 32 c of the second resin portion 32 is located on the upper surface 33 a of the third resin portion 33. When the second resin portion 32 and the third resin portion 33 have this positional relationship, when the uncured resin material to be the resin body 30 flows into the mold by the molding method, the third resin It is possible to introduce a resin material from the space forming the resin portion 33 to the space forming the second resin portion 32. When a part of the first portion 32c of the second resin portion 32 is connected to the third resin portion 33, it is beneficial to prevent the second resin portion 32 from peeling and detaching from the resin package 10. is there.

  The resin body 30 is formed using a resin material. A thermosetting resin, a thermoplastic resin, etc. can be used as a resin material used as a base material. Examples of resin materials to be base materials are: epoxy resin composition, silicone resin composition, modified epoxy resin composition such as silicone modified epoxy resin, modified silicone resin composition such as epoxy modified silicone resin, unsaturated polyester resin, saturated resin Cured products of polyester resin, polyimide resin composition, modified polyimide resin composition, etc., polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT It is resin such as resin. In particular, when a thermosetting resin such as an epoxy resin composition and a modified silicone resin composition is used, the first resin portion 31, the second resin portion 32, and the third resin portion 33 can be easily formed integrally from the same resin material. It is.

  When the viscosity of the material for forming the resin body 30 in the uncured state is 10 Pa · s to 40 Pa · s, the material for forming the resin body 30 is made to flow sufficiently inside the mold, The first resin portion 31, the second resin portion 32, the third resin portion 33, and the resin connection portion 34 can be collectively formed by a molding method, which is useful. It is more useful that the viscosity of the material for forming the resin body 30 in the uncured state is 15 Pa · s to 25 Pa · s.

  It is advantageous that the resin material as the base material of the resin body 30 contains a light reflective material. As the light reflective substance, it is possible to use a material which hardly absorbs the light from the light emitting element and which has a large difference in refractive index with respect to the resin material to be the base material. Examples of such light reflective materials are titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, aluminum nitride and the like.

  Further, the resin body 30 may be a resin material as a base material, such as acetylene black, carbon such as activated carbon or graphite, iron oxide, manganese dioxide, transition metal oxide such as cobalt oxide or molybdenum oxide, or colored organic pigment etc. You may contain. By forming the resin body 30 in a color similar to black or black, the reflectance of the resin body 30 to external light (in many cases, sunlight) is reduced, and a portion of the light emitting device 101 from which light is emitted The contrast ratio between the other parts can be improved.

[First lead 21 and second lead 22]
The first lead 21 and the second lead 22 have conductivity and function as electrodes for feeding the light emitting elements 41 and 42. The number of leads included in the resin package 10 is not limited to two, that is, the first lead 21 and the second lead 22. The resin package 10 may further include, for example, a third lead. The third lead may function as a power feeding electrode or may function as a heat dissipating member. When the resin package 10 further includes the third lead in addition to the first lead 21 and the second lead 22, the third resin portion 33 of the resin body 30 may be, for example, between the first lead 21 and the third lead, And disposed between the second lead 22 and the third lead.

  FIG. 4A is a schematic top view showing the first lead 21 and the second lead 22 taken from the light emitting device 101, and FIG. 4B is a schematic showing the first lead 21 and the second lead 22 taken from the light emitting device 101. Bottom view. The first lead 21 has, for example, a substantially rectangular shape, and has side portions 21c, 21d, 21e and 21f. The side portion 21 d faces the second lead 22. The side 21 c is located opposite to the side 21 d. The side portion 21 e and the side portion 21 f are opposite to each other and do not face the second lead 22.

  The extending portion 21 h is located near the center of each of the side portions 21 c, 21 e and 21 f in top view. The extending portion 21 h is a part of the first lead 21. The end face of each extension 21h at the side parts 21c, 21e and 21f may be exposed from the resin body 30 at the outer side faces 10c, 10e and 10f of the resin package 10, as shown in FIGS. 1A and 1B. Here, the end faces of the respective extending portions 21 h are substantially flush with the outer side surfaces 10 c, 10 e and 10 f of the resin package 10.

  As shown by hatching in FIG. 4A, the first lead 21 is connected to the first groove 21 j and one end connected to the first groove 21 j on the side of the upper surface 21 a located on the bottom surface 11 b of the recess 11. And 2 grooves 21k. As described above, here, the first groove 21 j is located at least at a part of the periphery of the element mounting area 21 r. The first grooves 21 j may be disposed all around the element mounting area 21 r, in other words, all around the element mounting area 21 r. The first groove 21 j and the second groove 21 k can be formed by etching, pressing, or the like.

  Further, as shown by hatching in FIG. 4B, the first lead 21 has a side edge groove portion 21g along the side portions 21d, 21e and 21f on the lower surface 21b side. The side edge groove 21 g is recessed from the lower surface 21 b to the upper surface 21 a side. The portion along the side portions 21 e and 21 f of the side edge groove portion 21 g is embedded in the first resin portion 31. By forming the resin body 30 so that the side edge groove portion 21 g is positioned in the first resin portion 31, the adhesion between the resin body 30 and the first lead 21 is improved. The side edge grooves 21g can be formed by etching, pressing, or the like.

  Similar to the first lead 21, the second lead 22 has, for example, a substantially rectangular shape, and has side portions 22c, 22d, 22e and 22f. In the resin package 10, the first lead 21 and the second lead 22 are positioned at a predetermined interval, and the side portion 22c of the second lead 22 faces the side portion 21d of the first lead 21.

  The extending portion 22 h is located near the center of the side portion 22 d in top view. The extending portion 22 h is a part of the second lead 22. The end face of the extending portion 22h at the side portion 22d can be exposed from the resin body 30 at the outer side surface 10d of the resin package 10, as shown in FIG. 1B. Here, the end face of the extending portion 22 h is substantially flush with the outer side surface 10 d of the resin package 10.

  As shown by hatching in FIG. 4B, the second lead 22 has side edge groove portions 22g along the side portions 22c, 22e and 22f of the lower surface 22b. The side edge groove 22g is recessed from the lower surface 22b toward the upper surface 22a. The portion along the side portions 22 e and 22 f of the side edge groove portion 22 g is embedded in the first resin portion 31. By forming the resin body 30 so that the side edge groove portion 22 g is positioned in the first resin portion 31, the adhesion between the resin body 30 and the second lead 22 is improved. The side edge groove 22g can be formed by etching, pressing, or the like. Hereinafter, a portion of the second lead 22 excluding the extending portion 22h and a portion of the first lead 21 excluding the extending portion 21h may be referred to as a main portion.

  The first lead 21 and the second lead 22 include a frame, a plurality of pairs of a portion to be a main portion of the first lead 21 and a portion to be a main portion of the second lead 22, the pair and the frame A lead frame including a plurality of coupling portions coupled to each other can be obtained by cutting at the position of the coupling portions. The above-described extending portions 21 h and 22 h are parts of a connecting portion that connects a portion to be a main portion of the first lead 21 and a portion to be a main portion of the second lead 22 in the lead frame. As described later, the light emitting device 101 can be obtained by cutting the structure in which the resin body 30 is integrally formed on the lead frame at the position of the connecting portion of the lead frame. According to such a process, in the outer side surfaces 10c, 10d, 10e and 10f of the resin package 10, the extending portion 21h and the extending portion 22h, which were a part of the connecting portion, are substantially flush with the surface of the resin body 30. Exposed. After being separated into pieces, the structure including the main body portion of the first lead 21 and the extension portion 21 h constitutes the first lead 21. Similarly, after being singulated, the structure including the main body of the second lead 22 and the extension 22 h constitutes the second lead 22.

  In the present embodiment, the first lead 21 has a larger area than the second lead 22 in top view. This is because the element mounting area 21 r is provided in the first lead 21. The element mounting area 21 r may be provided on the second lead 22. When the element mounting area 21 r is provided in the second lead 22, the area of the second lead 22 can exceed the area of the first lead 21 in top view. The element mounting area 21 r may be provided across the first lead 21 and the second lead 22. In this case, in top view, the first lead 21 and the second lead 22 can have substantially the same area.

  The resin package 10 may include a third lead in addition to the first lead 21 and the second lead 22. In the case where the resin package 10 has the third lead, for example, the element placement area 21 r is provided in the first lead 21. For example, the first lead 21 is disposed between the second lead 22 and the third lead, and at this time, the area of the second lead 22 and the third lead is substantially the same in top view, and the first lead 21 is The area of the lead 21 can be made larger than the area of the second lead 22 and the area of the third lead.

  Each of the first lead 21 and the second lead 22 may have a substrate and a metal layer covering the substrate. The substrate is typically a plate-like member. The substrate includes, for example, metals such as copper, aluminum, gold, silver, iron, nickel or alloys thereof, or phosphor bronze, iron-containing copper and the like. These may be a single layer, or may have a laminated structure like a clad material. From the viewpoint of cost and heat dissipation, it is advantageous to select copper as the material that constitutes the substrate. The metal layer contains, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper or an alloy of these.

  The first lead 21 and the second lead 22 may have a region where the metal layer is not provided. Further, in the first lead 21 and the second lead 22, the metal layer formed on the upper surface 21a, 22a may be different from the metal layer formed on the lower surface 21b, 22b. For example, even if the metal layer formed on the upper surfaces 21a and 22a is a metal layer composed of multiple layers including a nickel layer, and the metal layer formed on the lower surfaces 21b and 22b is a metal layer not including a nickel layer Good.

[Light-emitting element 41, 42]
Refer again to FIG. 2D. For the light emitting elements 41 and 42, semiconductor light emitting elements such as light emitting diode elements can be used. Here, the light emitting device 101 includes two light emitting elements 41 and 42, but the number of light emitting elements included in the light emitting device 101 is not limited to this example, and may be one. , May be three or more. Emitting elements 41 and 42 may in particular comprise a light emitting capable nitride semiconductor of ultraviolet to visible range _{(In x Al y Ga 1-} x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1). For example, the light emitting elements 41 and 42 may emit blue light and green light, respectively. When the light emitting device has three light emitting elements, the three light emitting elements may emit blue light, green light, and red light, respectively.

  The light emitting elements 41 and 42 are located in the element mounting region 21 r of the first lead 21 and are joined to the first lead 21 by a joining member. As the bonding member, for example, a resin containing the resin material exemplified as the material constituting the resin body 30, tin-bismuth, tin-copper, tin-silver or gold-tin solder, silver, gold or A conductive paste such as palladium, a bump, an anisotropic conductive material, or a brazing material such as a low melting point metal can be used.

  As described above, the light emitting element 41 is electrically connected to the first lead 21 and the second lead 22 by the wires 43a and 43b. Similarly, the light emitting element 42 is electrically connected to the first lead 21 and the second lead 22 by the wires 43 c and 43 d. Here, the light emitting element 41 and the light emitting element 42 are connected in parallel between the first lead 21 and the second lead 22. The light emitting element 41 and the light emitting element 42 may be connected in series.

[Protective element 60]
The light emitting device 101 can have a protective element 60. The protective element 60 improves the electrostatic withstand voltage of the light emitting device 101. As the protective element 60, various protective elements mounted on a general light emitting device such as a Zener diode can be used. The protective element 60 is disposed, for example, on the upper surface 22 a of the second lead 22 and embedded in the light reflective member 50. By forming the light reflective member 50 so as to cover the protective element 60, absorption of light from the light emitting elements 41 and 42 into the protective element 60 can be suppressed.

  Protective element 60 is typically connected in parallel with light emitting elements 41 and 42. In this example, one of the two terminals of the protective element 60 is connected to the top surface 21 a of the first lead 21 by the wire 61. The other terminal of the protective element 60 is electrically connected to the upper surface 22 a of the second lead 22 by a brazing material such as solder, conductive paste, bump, anisotropic conductive material, or low melting point metal.

[Light Reflective Member 50]
Please refer to FIG. FIG. 5 is a schematic top view of the light emitting device 101. As shown by hatching in FIG. 5, the light reflective member 50 is located in a region surrounded by the inner side surfaces 31 c, 31 d, 31 e and 31 f of the recess 11 and the second resin portion 32 in top view. As can be understood by comparing FIG. 2B and FIG. 5, the light reflective member 50 has the second resin portion of the inner side surfaces 31 c, 31 d, 31 e and 31 f and the upper surface 21 a of the first lead 21 in the recess 11. It is formed to cover a portion located outside 32, the upper surface 22 a of the second lead 22, and a part of the upper surface 33 a of the third resin portion 33. The light reflective member 50 is not provided in the region inside the second resin portion 32, that is, in the element mounting region 21r. The second resin portion 32 described above can be said to have a structure that defines the position of the inner edge of the light reflective member 50.

  6A schematically shows an end face when cut along line 6A-6A in FIG. 5, and FIG. 6B schematically shows an end face when cut along line 6B-6B in FIG. FIG. 6C schematically shows an end face when cut along line 6C-6C in FIG.

  As shown in FIGS. 6A to 6C, the light reflective member 50 has an inclined surface 50s between the inner side surfaces 31c, 31d, 31e and 31f and the second resin portion 32. The inclined surface 50 s is recessed toward the bottom surface 11 b of the recess 11. The light reflective member 50 can reflect the light emitted from the light emitting elements 41 and 42 and incident on the light reflective member 50 toward the opening 11 a of the concave portion 11 by the inclined surface 50 s. Improve efficiency.

  An inclination angle formed by a straight line connecting the upper end portion and the lower end portion of the inclined surface 50s and the bottom surface 11b of the recess 11 connects the upper end portion and the lower end portion of the inner side surface (for example, the inner side surface 31d) of the first resin portion 31. It can be made smaller than the inclination angle formed by the straight line and the bottom surface 11 b of the recess 11. This is because the light reflective member 50 can be formed in the vicinity of the light emitting element as compared with the first resin portion 31. By forming the light reflective member 50 in the vicinity of the light emitting element, light emitted from the light emitting elements 41 and 42 and incident on the light reflective member 50 can be efficiently reflected toward the opening 11 a.

  In this example, the first portion 32 c of the second resin portion 32 has a height from the top surface 21 a of the first lead 21 to h 1. When the height h1 of the first portion 32c is smaller than the height h2 of the light emitting elements 41 and 42 from the upper surface 21a, the light emitted from the light emitting elements 41 and 42 is incident on the inclined surface 50s of the light reflecting member 50 This is advantageous because the light emitted from the light emitting elements 41 and 42 can be efficiently emitted from the opening 11a to the outside.

  It is advantageous if the light reflective member 50 is formed of a member having a low transmittance to light from the light emitting element and external light or the like, or from which it is difficult to absorb light from the light emitting element and external light. The light reflective member 50 can be formed, for example, from a mixture of resin and light scattering particles. For example, a thermosetting resin, a thermoplastic resin, or the like can be used as a base material of the light reflective member 50. Specific examples of the base material are phenol resin, epoxy resin, BT resin, polyphthalamide (PPA), silicone resin and the like. Light is more efficiently reflected by the light reflective member 50 by dispersing a reflecting member which is difficult to absorb light from the light emitting element and has a large difference in refractive index between the resin and the base material in the resin as the base material. be able to. It is beneficial for the light reflective member 50 to have a white color. As the reflective member, light scattering particles such as titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide or aluminum nitride can be used.

  It is useful that the reflectance of the light reflective member 50 for the light emitted from the light emitting element is higher than the reflectance of the resin body 30. For example, the content of the reflective member such as titanium oxide dispersed in the light reflective member 50 is larger than the content of the light reflective material dispersed in the resin body 30. The content of the reflective member in the light reflective member 50 is preferably 1.5 times or more of the content of the light reflective material in the resin body 30, and more preferably twice or more. More preferably, it is 5 times or more. For example, the ratio of titanium oxide to the uncured resin material for forming the resin body 30 may be 15 to 20% by weight. At this time, the ratio of titanium oxide to the uncured resin material for forming the light reflective member 50 may be 30 to 60% by weight.

  It is advantageous that the viscosity of the resin material for forming the light reflective member 50 in the uncured state is lower than the viscosity of the material for forming the resin body 30 in the uncured state. The viscosity of the light reflective member 50 in the uncured state is, for example, preferably 1 Pa · s to 20 Pa · s, and more preferably 5 Pa · s to 15 Pa · s. By adjusting the viscosity of the resin material for forming the light reflective member 50 in the uncured state to such a range, good flow when the material of the light reflective member 50 is applied in the recess 11 In this case, it is possible to prevent the light reflective member 50 from being underfilled. It is advantageous that the light reflective member 50 has high thixotropy in an uncured state.

  In the configuration illustrated in FIGS. 6A to 6C, the width w1 of the first portion 32c of the second resin portion 32 is smaller than the width w2 of the first groove 21j of the first lead 21. By reducing the width w1 of the first portion 32c, when forming the light reflective member 50, it is possible to secure a sufficient path for flowing an uncured material. As a result, the light reflective member 50 can be efficiently formed, and the effect that the surface of the light reflective member 50 to be the reflective surface can be easily inclined can be obtained. As a result, the light emitted from the light emitting elements 41 and 42 can be efficiently extracted upward. Further, by enlarging the width w2 of the first groove 21j with respect to the width w1 of the first portion 32c, the area in which the second resin portion 32 and the first lead 21 contact each other increases, and from the first lead 21 It is possible to reduce the possibility of peeling of the second resin portion 32 of the

[Sealing member 75]
The sealing member 75 is located in a region surrounded by the light reflective member 50 in the recess 11 and covers the light emitting elements 41 and 42 located at the bottom of the recess 11 and the second resin portion 32 of the resin body 30. ing. In other words, the sealing member 75 mainly occupies the portion of the concave portion 11 other than the light emitting elements 41 and 42, the second resin portion 32, and the light reflective member 50. By covering the light emitting elements 41 and 42 with the sealing member 75, the light emitting elements 41 and 42 can be protected from external force, dust, moisture and the like.

  As a material for forming the sealing member 75, a resin material such as a thermosetting resin or a thermoplastic resin can be used similarly to the base material constituting the resin body 30. As a base material for forming the sealing member 75, it is beneficial to select a material having a transmittance of 60% or more to the light emitted from the light emitting elements 41 and 42, and the light emitting elements 41 and 42. It is more useful that the transmittance to light emitted from the light source is 90% or more. As a material of the sealing member 75, for example, a silicone resin, an epoxy resin, an acrylic resin, or a resin material containing one or more of them can be used. The sealing member 75 may be a single layer or may be composed of a plurality of layers. Light scattering particles such as titanium oxide, silicon oxide, zirconium oxide and aluminum oxide may be dispersed in a resin as a base material.

  The sealing member 75 may contain a material that converts the wavelength of light from the light emitting elements 41 and 42, such as a phosphor. Phosphors include cerium-activated yttrium aluminum garnet, cerium-activated lutetium aluminum garnet, europium and / or chromium-activated nitrogen-containing calcium aluminosilicate (a part of calcium is replaced with strontium Or S), europium-activated sialon, europium-activated silicate, europium-activated strontium aluminate, manganese-activated potassium fluorosilicate, etc. may be used. The total content of the light scattering particles and / or the phosphors dispersed in the base material may be, for example, about 10 to 150% by weight with respect to the resin material constituting the base material of the sealing member 75.

[Wires 43a to 43d, Wire 61]
As the wires 43a to 43d and the wire 61, for example, a wire of a metal such as gold, copper, silver, platinum, aluminum, palladium or an alloy containing one or more of them can be used. A wire formed of a material mixed with silicon or the like may be used for the wires 43a to 43d and / or the wire 61. When the material of the wire contains gold, a wire is obtained which is excellent in thermal resistance etc. and is not easily broken by the stress from the sealing member 75, and when the material of the wire contains silver, high light reflectance is obtained. Advantageously, the wire shown is obtained. In particular, it is beneficial to use a wire that contains both gold and silver. When the wires 43a to 43d and / or the wire 61 are wires containing both gold and silver, the content ratio of silver is, for example, 15% to 20%, 45% to 55%, 70% to 90% or 95 It can be in the range of% or more and 99% or less. In particular, when the content ratio of silver is 45% or more and 55% or less, the possibility of sulfidation can be reduced while obtaining high light reflectance. The wire diameter of the wire can be appropriately selected, and can be, for example, 5 μm or more and 50 μm or less. The wire diameter of the wire is more preferably 10 μm or more and 40 μm or less, and even more preferably 15 μm or more and 30 μm or less.

[Method of Manufacturing Light Emitting Device 101]
One embodiment of a method of manufacturing a light emitting device of the present disclosure will be described. The method of manufacturing a light emitting device of the present disclosure includes a step (A) of preparing a collective substrate, and a step (B) of singulating the collective substrate to obtain a plurality of light emitting devices. Each step will be described in detail below.

(A) Step of Preparing Assembly Substrate FIG. 7A is a schematic top view of the assembly substrate 201. The collective substrate 201 includes the lead frame 202 in a part thereof. In the collective substrate 201, a plurality of portions (hereinafter, referred to as light emitting device corresponding regions 101 ') each forming a light emitting device are two-dimensionally arranged. FIG. 7B is a schematic top view showing four light emitting device corresponding regions 101 ′ in an extracted manner. Each of the light emitting device corresponding regions 101 ′ has the same structure as the light emitting device 101 described with reference to FIGS. 1A to 6C except that the light emitting device corresponding region 101 ′ is not divided into pieces.

  FIG. 8 shows the lead frame 202 taken out of the collective substrate 201. In FIG. 8, among the plurality of light emitting device corresponding regions 101 ′, portions corresponding to the four light emitting device corresponding regions 101 ′ are representatively shown. The double-dotted line rectangle in FIG. 8 indicates a portion corresponding to one light emitting device corresponding area 101 '.

  As shown in FIG. 8, in each of the light emitting device corresponding regions 101 ', a portion to be the first lead 21 (hereinafter referred to as a first lead corresponding region 21') and a portion to be the second lead 22 (hereinafter referred to as a second A pair of read equivalent regions 22 'is formed. In the example shown in FIG. 8, the first lead equivalent regions 21 'and the second lead equivalent regions 22' are alternately arranged along the y direction shown in FIG. In addition, a plurality of first lead corresponding areas 21 ′ or second lead corresponding areas 22 ′ are arranged along the x direction orthogonal to the y direction. In the y direction in FIG. 8, the side portion 21 c of the first lead equivalent region 21 ′ and the side portion 22 d of the second lead equivalent region 22 ′ are connected by the connecting portion 24. The connection portion 23 connects the side portion 21 f of the first lead equivalent region 21 ′ and the side portion 21 e of the first lead equivalent region 21 ′ adjacent to each other in the x direction.

  For example, after obtaining a lead frame with a resin molded body in which the resin body 30 is formed on the lead frame 202, the collective substrate 201 arranges the light emitting elements 41, 42 and the like on the lead frame with the resin molded body. It can be obtained by further forming 50 and the sealing member 75.

  The lead frame with resin molded body is manufactured by forming the resin body 30 on the lead frame 202. For forming the resin body 30 on the lead frame 202, transfer molding, injection molding, compression molding, or the like can be applied. For example, a lead frame with a resin molded body can be formed by sandwiching the lead frame 202 with a mold including an upper mold and a lower mold and pouring a resin material into a space in the mold.

  FIG. 9A shows a state in which the lead frame 202 is disposed between the upper mold 210U and the lower mold 210D. The two-dot chain rectangle in FIG. 9A represents a portion corresponding to the cross section shown in FIG. 2C.

  As illustrated, the upper mold 210U has a first space 210c for forming the first resin portion 31 and a second space 210d for forming the first portion 32c of the second resin portion 32. On the other hand, no space is formed in the lower mold 210D in the present embodiment. In the upper mold 210U, the second space 210d does not communicate with the first space 210c, and is an independent space. The second space 210d includes a space 210d1 and a space 210d2.

  The lead frame 202 located between the upper mold 210U and the lower mold 210D has a third space 202e on the lower surface side, a fourth space 202d on the upper surface side, and a fifth space 202f on the lower surface side. The third space 202 e corresponds to the shape of the third resin portion 33, and can be formed by filling the third space 202 e with a resin material and curing the resin material. The fourth space 202 d of the lead frame 202 includes the first groove 21 j and the second groove 21 k of the first lead 21, and the fourth space 202 d is filled with a resin material, and the second resin portion is cured by curing the resin material. The 32 second portions 32 d and the resin connection 34 can be formed, respectively. The resin material filled in the fifth space 202 f and cured may constitute a part of the first resin portion 31.

  When arranging the lead frame 202 between the upper mold 210U and the lower mold 210D, here, as shown in FIG. 9A, the release sheet 300 is interposed between the upper mold 210U and the lead frame 202. By interposing the release sheet 300 between the mold and the lead frame 202, sticking of the cured resin material to the mold can be prevented. Therefore, even if the viscosity of the uncured resin material filled in the space in the mold is relatively low, it becomes easy to separate the cured resin material from the mold. Also, for example, the mold cleaning for each shot may be unnecessary. As the release sheet 300, a sheet having a certain degree of stretchability is used. As the release sheet 300, for example, a resin sheet or a resin film-like member such as a fluororesin-based resin film marketed under the name of an ETFE film can be used. The release sheet 300 may be a single layer or may be composed of a plurality of layers. The release sheet 300 may have a thickness of, for example, about 12 micrometers or more and 100 micrometers or less.

  FIG. 9B shows a state in which the lead frame 202 is sandwiched between the upper mold 210U and the lower mold 210D. As described above, in the upper mold 210U, the first space 210c and the second space 210d are separated. However, as shown in FIG. 9B, by sandwiching the lead frame 202 with the upper mold 210U and the lower mold 210D, the first space 210c of the upper mold 210U is the second groove 21k of the fourth space 202d of the lead frame 202. Connected to Similarly, the space 210 d 1 of the upper mold 210 U is connected to the first groove 21 j of the fourth space 202 d of the lead frame 202. Further, a space 210 d 2 of the second space 210 d of the upper mold 210 U is connected to the third space 202 e of the lead frame 202. In the state shown in FIG. 9B, the first space 210c also communicates with the fifth space 202f.

  Since the space of the upper mold 210U and the space of the lead frame 202 are connected as described above, the resin body 30 and the above-mentioned space in the mold sandwiched between the upper mold 210U and the lower mold 210D When the uncured resin material is injected, these spaces are filled with the uncured resin material. The uncured resin material filled in the first space 210c is, as shown by the broken arrow in FIG. 9B, the space of the second space 210d via the second groove 21k and the first groove 21j of the fourth space 202d. It is transported to 210d1. Similarly, the uncured resin material filled in the third space 202e is transferred from the third space 202e to the space 210d2 of the second space 210d, as shown by a broken arrow in FIG. 9B. Thus, the uncured resin material intrudes into all the spaces. Spaces 210d1 and 210d2 shown separately in FIGS. 9A and 9B are two different cross sections of annular spaces, and are in communication in the state shown in FIG. 9B.

  As described above, according to the method of manufacturing a light emitting device of the present disclosure, when the second groove 21 k of the first lead 21 on which the resin connection portion 34 of the resin body 30 is formed is the second resin portion It functions as a gate to the second space 210d for forming 32. For this reason, when manufacturing the resin package 10 by shaping | molding using a metal mold | die, it becomes possible to form the 2nd resin part 32 with formation of the 1st resin part 31 and the 3rd resin part 33. FIG.

  As described above, when the resin material is injected, the second space 210d is connected to other spaces at a plurality of places in the mold. In this example, the second space 210d is connected to the first space 210c for forming the first resin portion 31 via the fourth space 202d including the first groove 21j and the second groove 21k, and The third space 202 e for forming the third resin portion 33 is also connected. Since uncured resin material is supplied to the second space 210d from a plurality of places, the possibility of insufficient filling of the resin material in the second space 210d in the mold can be reduced.

  For example, as shown in FIG. 4A, the second groove 21k functioning as a gate can be connected to the first groove 21j at a substantially intermediate portion with respect to both ends of a portion of the first groove 21j extending in the substantially horizontal direction of the drawing. . By connecting the second groove 21k at a substantially middle portion to both ends of the first groove 21j, the uncured resin material transferred from the first space 210c to the second groove 21k of the fourth space 202d can be The two grooves 21k can be branched at a position where they are connected to the first groove 21j, and can flow in two directions in the first groove 21j and in the space 210d1 of the mold. As a result, it is possible to uniformly fill the second space 210d with the uncured resin material in a shorter time.

  After filling the uncured resin material, heat is applied to the resin material in the mold to temporarily cure the resin material. At the time of filling of the uncured resin material, for example, the release sheet 300 can be intentionally wrinkled by adjusting the clamp pressure applied to the upper mold 210U and the lower mold 210D. The clamp pressure may be, for example, about 500 kN or more and 1200 kN or less. When the release sheet 300 is wrinkled, a part of the release sheet 300 protrudes into the second space 210d. In this state, when the uncured resin material is filled and the resin material in the mold is temporarily cured, a depression is formed in the resin body in the second space 210d at a position where the release sheet 300 has a wrinkle. be able to.

  Thereafter, the lead frame 202 to which the temporarily cured resin material is attached is removed from the mold, and main curing of the resin material is performed at a temperature higher than that of the temporary curing. As a result, a lead frame with a resin molded body in which the resin body 30 is formed on the lead frame 202 is obtained. By the main curing of the resin material, it is possible to obtain the second resin portion 32 having a recess at a position corresponding to the wrinkle of the release sheet 300 in the mold.

  FIG. 10 shows a portion corresponding to four light emitting device corresponding regions 101 'among the plurality of light emitting device corresponding regions 101' of the lead frame with resin molded body. As a result of connecting the second space 210d and the first space 210c to each other through the fourth space 202d including the first groove 21j and the second groove 21k and the third space 202e, the resin connection portion 34 and the third resin The second resin portion 32 is connected to the first resin portion 31 of the resin package 10 by the portion 33. For this reason, peeling from the upper surface of the first lead equivalent region 21 'of the second resin portion 32 is suppressed.

  Next, as shown in FIG. 11, the light emitting elements 41 and 42 are disposed inside the concave portion 11 of each light emitting device equivalent region 101 '. For example, the light emitting elements 41 and 42 are fixed to the element placement area 21 r of the first lead equivalent area 21 ′ surrounded by the second resin portion 32 using a bonding member such as a resin. Further, the light emitting elements 41 and 42 are electrically connected to the first lead equivalent region 21 'and the second lead equivalent region 22' by the wires 43a, 43b, 43c and 43d. The protective element 60 is disposed in the recess 11 as necessary. In this example, one terminal of the protective element 60 is electrically and physically connected to the second lead equivalent region 22 ′ by solder or the like, and the other terminal is electrically connected to the first lead equivalent region 21 ′ by the wire 61. Connected to

  Next, the light reflective member 50 is formed in the recess 11 of each light emitting device corresponding area 101 '. For example, after applying an uncured resin material to the region between the inner wall surface of the recess 11 and the second resin portion 32 by potting, the resin material is cured. The potting method is a method in which a resin material is applied or dropped, and the resin material is disposed in an appropriate area by the flow of the resin material.

  According to the method of manufacturing a light emitting device of the present disclosure, since the second resin portion 32 is disposed around the element mounting area 21r, the element mounting can be performed even if the uncured resin material is moved in the recess 11. The flow of the resin material to the center of the region 21 r can be blocked by the second resin portion 32. Therefore, the position of the inner edge of the uncured resin material can be defined by the second resin portion 32, and the uncured resin material for forming the light reflective member 50 can be appropriately disposed on the bottom surface 11 b of the recess 11. As described with reference to FIG. 2C, here, since the resin connection portion 34 has the upper surface 34a at substantially the same height as the upper surface 21a of the first lead 21, the resin connection portion 34 is a light reflective member 50. Does not impede the flow of the uncured resin material to form

  Thereafter, the uncured resin material applied to a predetermined region in the recess 11 is cured by heat, light or the like. Furthermore, the concave portion formed by the inclined surface 50s of the light reflective member 50 is filled with an uncured resin material to cover at least the light emitting elements 41 and 42 and the second resin portion 32. At this time, the uncured resin material is also disposed inside the recess 32 v of the second resin portion 32. Thereafter, the resin material applied in the recess formed by the inclined surface 50s is cured to form a sealing member 75 covering the light emitting elements 41 and 42 and the second resin portion 32. By arranging the uncured resin material inside the recess 32v of the second resin portion 32, the sealing member 75 can be formed, a part of which is positioned inside the recess 32v. By forming the sealing member 75, a collective substrate 201 having a plurality of light emitting devices 101 which are not separated as shown in FIG. 7A is completed.

(B) Step of singulating the collective substrate to obtain a plurality of light emitting devices Next, a predetermined position of the collective substrate 201 including the plurality of light emitting device corresponding regions 101 ′ provided with the light reflective members 50 in the recess 11 is determined. Cut off. In this example, the collective substrate 201 is cut at a position indicated by a thick arrow CL in FIG. 12A. By cutting the collective substrate 201, as shown in FIG. 12B, the collective substrate 201 is singulated to obtain a plurality of light emitting devices 101.

  As a method of singulating the collective substrate 201, various methods such as cutting using a lead cut die or a dicing saw or cutting using a laser beam can be used. When the collective substrate 201 includes a plurality of resin packages 10 integrally molded, the lead frame 202 and the resin body 30 may be simultaneously cut when the collective substrate 201 is singulated. The plurality of resin packages 10 may be integrally molded or separately molded. In the case where the resin packages 10 are separately formed for each light emitting device corresponding area 101 ′, the lead frame 202 may be cut at a position between two resin packages 10 adjacent to each other for singulation.

  The collective substrate 201 may be prepared by, for example, purchasing a collective substrate manufactured in advance, in addition to manufacturing and preparing according to the above-described manufacturing process. Moreover, it is not restricted to the form using the collective substrate provided with the several resin package 10, For example, it is also possible to prepare and use one resin package 10. FIG.

  The formation method of the hollow 32v is not limited to the example mentioned above. For example, as shown to FIG. 13A-FIG. 13C, you may use upper mold 210U 'which has one or more convex part 212 which protrudes toward the inside of 2nd space 210d. Here, FIG. 13B shows the convex portion 212 shown in FIG. 13A and its periphery taken out and enlarged, and FIG. 13C shows a part of FIG. 13A in an enlarged manner. By forming one or more projections 212 in the upper mold 210U 'in advance, it is possible to form a recess of a desired shape at a desired position of the first portion 32c. As in the example described with reference to FIGS. 9A and 9B, a release sheet 300 may be interposed between the upper mold 210U ′ and the lead frame 202.

  Alternatively, a lead frame with a resin molded body is formed using an upper mold having no second space 210d, and the second resin portion is formed by applying an uncured resin material to the lead frame with a resin molded body and curing the resin material. 32 first portions 32c may be formed.

  FIG. 14 shows a part of a lead frame with a resin molded body formed using an upper mold which does not have the second space 210d. In the example shown in FIG. 14, the second resin portion 32 ′ does not include a portion protruding from the top surface of the first lead equivalent region 21 ′. After obtaining such a resin molded body-attached lead frame, an uncured resin material is linearly applied to the bottom surface 11b of the recess 11 of each light emitting device equivalent region 101 'using a dispenser or the like.

  As shown by the broken arrow P in FIG. 14, for example, the uncured resin material is moved from the position of the resin connection portion 34 to the bottom of the recess 11 while moving the nozzle of the dispenser along the shape of the element mounting area 21r. Grant to 11b. At this time, by changing the amount of the resin material injected from the nozzle or changing the moving speed of the nozzle, the amount of the resin material applied to the bottom surface 11b is adjusted to obtain a cured structure. The height of the surface of a certain first portion 32c can be changed. For example, if the speed of movement of the nozzle in the vicinity of the resin connection portion 34 is increased, the height of the portion in the vicinity of the resin connection portion 34 in the cured structure can be selectively reduced. As a result, it is possible to obtain a lead frame with a resin molded body having a recess 32v in a portion near the resin connection portion 34 in the first portion 32c.

[effect]
According to the light emitting device 101, the surface area of the second resin portion 32 can be increased by providing the one or more recesses 32v on the surface of the second resin portion 32. By the increase of the surface area of the second resin portion 32, the contact area between the second resin portion 32 and the sealing member 75 is increased, and the second resin portion 32 and the sealing member 75 can be bonded more firmly. By the improvement of the adhesion of the sealing member 75, peeling of the sealing member 75 from the recess 11 is suppressed, and the reliability of the light emitting device 101 is improved. Note that this effect can also be obtained by providing a convex portion instead of the depression 32v.

  The recess 32v extends in a direction intersecting with the extending direction of the second resin portion 32, and at least a portion of the recess 32v is located below the wire electrically connecting the light emitting element to the lead. At the position, the height of the first portion 32c of the second resin portion 32 can be partially reduced. Therefore, it is possible to more easily arrange the wire in the recess 11. If the depressions 32v extend substantially in parallel with the direction in which the second resin portion 32 extends, the surface area of the second resin portion 32 can be increased without impairing the function of blocking the uncured resin material. .

  By providing the resin connection portion 34 connecting the first resin portion 31 and the second resin portion 32 to the resin package 10, the possibility of peeling the second resin portion 32 from the lead can be reduced. Therefore, the second resin portion 32 can be disposed more reliably on the bottom surface 11 b of the recess 11. The recess 32 v may be located in the vicinity of a portion of the second resin portion 32 where the second resin portion 32 and the resin connection portion 34 are connected.

  Also, by providing a groove in the lead and forming the second resin portion 32 so that a part of the second resin portion 32 is located inside the groove, the adhesion between the lead and the second resin portion 32 is achieved. Improve. That is, it is possible to more reliably arrange the second resin portion 32 on the bottom surface 11b.

Second Embodiment
FIG. 15A is a schematic top view showing a structure in which the light reflective member 50 and the sealing member 75 are removed from the light emitting device 102 according to the second embodiment of the present disclosure. The main difference between the light emitting device 101 according to the first embodiment and the light emitting device 102 is that the second resin portion 32 of the light emitting device 102 has one or more convex portions 32 p on its surface. The other structure of the light emitting device 102 may be similar to that of the light emitting device 101. Therefore, points different from the light emitting device 101 will be mainly described below.

  In the configuration illustrated in FIG. 15A, the second resin portion 32 of the resin body 30 is located above the plane including the upper surface 21a of the first lead 21 similarly to the light emitting device 101 according to the first embodiment. It includes a portion 32 e and a second portion 32 d disposed in the first groove 21 j of the first lead 21. The first portion 32e has the convex portion 32p that protrudes from its surface. In this example, four convex portions 32p are provided, and one of them is located in the vicinity of a portion where the second resin portion 32 and the resin connection portion 34 are connected.

  15B schematically shows an end face when the light emitting device 102 is cut along a plane perpendicular to the lower surface 10b of the resin package 10 at the position of line 15B-15B shown in FIG. 15A, and FIG. 15C shows a convex shown in FIG. The portion 32p and the periphery thereof are schematically shown enlarged. The hatched portions in FIGS. 15B and 15C indicate the sealing member 75 as in FIGS. 2E and 2F.

  As schematically shown in FIG. 15C, in the present embodiment, the convex portion 32p provided on the first portion 32e is covered by the sealing member 75. By providing the convex portion 32 p in the second resin portion 32, it is possible to increase the surface area of the second resin portion 32 as in the case where the recess 32 v is provided. Furthermore, by forming the sealing member 75 so as to cover the convex portion 32p, the contact area between the second resin portion 32 and the sealing member 75 is increased as compared to the case where the convex portion 32p is not provided. Thus, the bond between the second resin portion 32 and the sealing member 75 can be further strengthened. As a result, peeling of the sealing member 75 from the second resin portion 32 is suppressed, and the reliability of the light emitting device 102 is improved. In addition, a convex part and a hollow may be mixed in the surface of the 1st part 32e.

  Refer again to FIG. 15A. Similar to the above-described depressions 32v and 32v ', the number, shape, and arrangement of the protrusions 32p in the first portion 32e of the second resin portion 32 are basically arbitrary. However, in order to prevent the side surfaces of the light emitting elements 41 and 42 from being covered by the light reflective member 50, the first portion 32e is projected to a position where the distance from the inner wall surface of the recess 11 is relatively short. It is advantageous to form the portion 32p. This is because the second resin portion 32 has a function of blocking the uncured resin material for forming the light reflective member 50 at the position of the second resin portion 32. In addition, when the convex portion 32 p has a shape extending mainly along the extending direction of the second resin portion 32, the uncured resin material for forming the light reflective member 50 at the position of the second resin portion 32. It is useful because it can stop more effectively.

  In the example shown to FIG. 15A, the site | part which the 2nd resin part 32 and the resin connection part 34 connect has a small distance from the inner wall face of the recessed part 11 compared with the inclined part 32s of the 1st part 32e. This is because, when the uncured resin material is dropped in the region between the inner wall surface of the recess 11 and the second resin portion 32 and the resin material is spread by the flow, compared to the position of the inclined portion 32s, This means that the resin material easily passes over the first portion 32e in the vicinity of the portion where the second resin portion 32 and the resin connection portion 34 are connected. Therefore, as shown in FIG. 15A, the height of the first portion 32c can be partially set by forming the convex portion 32p at a position where the distance from the inner wall surface of the concave portion 11 is relatively small among the first portions 32e. In order to prevent entry of the resin material into the inner region of the first portion 32e, the

[Method of Manufacturing Light Emitting Device 102]
Similar to the first embodiment, the light emitting device 102 is obtained by performing the step (A) of preparing the collective substrate and the step (B) of singulating the collective substrate to obtain a plurality of light emitting devices. Can. The steps after obtaining the collective substrate may be the same as in the first embodiment, and thus the description of the step (B) is omitted here.

(A) Step of Preparing Assembly Substrate First, a lead frame with a resin molded body is fabricated. As in the first embodiment, in the lead frame with a resin molded body, for example, the lead frame 202 is sandwiched by a mold provided with an upper mold and a lower mold, and a resin material is poured into the space in the mold It can be formed by curing the material.

  FIG. 16A shows a state in which the lead frame 202 is sandwiched between the upper mold 210U ′ ′ and the lower mold 210D. The double-dotted line rectangle in FIG. 16A represents a portion corresponding to the cross section shown in FIG. 15B.

  Here, an upper mold 210U ′ ′ provided with a second space 210d including a space 210d1 ′ and a space 210d2 is used. As shown in FIG. 16A, the upper mold 210U ′ ′ has a recess 214 recessed toward the inside of the upper mold 210U ′ ′ in the space 210d1 ′. FIG. 16B is an enlarged view of the recess 214 shown in FIG. 16A and the periphery thereof. When the uncured resin material to be the resin body 30 is injected into the space in the mold sandwiched between the upper mold 210U ′ ′ and the lower mold 210D, the uncured resin material is filled in these spaces. . At this time, the inside of the recess 214 is also filled with the uncured resin material.

  After filling the uncured resin material, heat is applied to the resin material in the mold to temporarily cure the resin material. Thereafter, the lead frame 202 to which the temporarily cured resin material is attached is removed from the mold, and main curing of the resin material is performed at a temperature higher than that of the temporary curing. Thereby, a resin molded body-attached lead frame is obtained. By curing the resin material disposed inside the recess 214 of the upper mold 210U ′ ′, the above-described protrusion 32p can be formed. By adjusting the number, the shape, and the arrangement of the concave portions 214 in the upper mold 210U ′ ′, the convex portions 32p can be formed on the second resin portion 32 in an arbitrary number, the shape, and the arrangement.

  After obtaining the resin molded body-attached lead frame, the light emitting elements 41, 42 and the like are disposed on the resin molded body-attached lead frame. Thereafter, an uncured resin material is applied to the region between the inner wall surface of the recess 11 and the second resin portion 32 by potting, for example, to cure the resin material. As in the first embodiment, also in this embodiment, since the position of the inner edge of the uncured resin material can be defined by the second resin portion 32, the uncured resin material for forming the light reflective member 50 is used. It is possible to appropriately arrange in a predetermined area of the recess 11. The light reflective member 50 can be formed by curing the uncured resin material applied to a predetermined region in the recess 11 with heat, light or the like.

  Next, the concave portion formed by the inclined surface 50s of the light reflective member 50 is filled with an uncured resin material to cover at least the light emitting elements 41 and 42 and the second resin portion 32. At this time, the convex portion 32p of the second resin portion 32 can be covered with an uncured resin material. By curing the resin material provided in the recess formed by the inclined surface 50s, the sealing member 75 covering the light emitting elements 41 and 42 and the second resin portion 32 is obtained. By forming the sealing member 75, a collective substrate having a plurality of light emitting devices 102 which are not separated is completed.

  The formation method of the convex part 32p is not limited to the example mentioned above. For example, a lead frame with a resin molded body is formed using an upper mold having no second space 210d, and the second resin portion is formed by applying an uncured resin material to the lead frame with a resin molded body and curing the resin material. 32 first portions 32e may be formed. Using the upper mold having no second space 210d, a lead frame with a resin molded body is formed, which includes a second resin portion 32 'not having a portion projecting from the upper surface of the first lead equivalent region 21'. An uncured resin material may be linearly applied to the bottom surface 11b of the recess 11 of each light emitting device equivalent region 101 'using a dispenser or the like as indicated by a broken arrow P in the inside.

  For example, the uncured resin material is applied to the bottom surface 11 b of the recess 11 while moving the nozzle of the dispenser along the shape of the element placement area 21 r starting from the position of the resin connection portion 34. At this time, for example, among the structures after curing, the speed of movement of the nozzle in the vicinity of the resin connection portion 34 is reduced, or the resin material is applied by overlapping in the vicinity of the resin connection portion 34. The height of the portion in the vicinity of the connection portion 34 can be selectively increased. As a result, it is possible to obtain a lead frame with a resin molded body including the first portion 32 e provided with the convex portion 32 p at a position near the resin connection portion 34.

  Alternatively, a release sheet having a hole intentionally provided may be interposed between the upper mold and the lead frame 202. For example, when a hole is provided in a portion corresponding to a space to be filled with the resin material for forming the second resin portion 32 in the release sheet disposed in the upper mold, the resin injected into the space A part of the material gets into the inside of the hole of the release sheet. By temporarily curing the resin material in this state, it is possible to cause the surface of the second resin portion 32 to protrude at the position of the hole of the release sheet. After such a structure is obtained, the second resin portion 32 including the first portion 32e having the convex portion 32p on the surface can be formed by performing main curing of the resin material.

  The depressions 32 v and 32 v ′ and the convex portion 32 p described above may be provided in the second portion 32 d of the second resin portion 32. The effect of increasing the surface area of the second resin portion 32 can also be obtained by providing the depressions 32v, 32v 'or the projections 32p in the second portion 32d instead of or in addition to the first portion 32c. . Therefore, the adhesion of the sealing member 75 to the second resin portion 32 is improved as in the case where the first portions 32c and 32e of the second resin portion 32 are provided with the depressions 32v and 32v 'or the projections 32p, Peeling of the sealing member 75 from the bottom surface 11 b of 11 can be prevented.

DESCRIPTION OF REFERENCE NUMERALS 10 resin package 10 a upper surface 10 b of resin package 10 lower surface 10 c to 10 f of resin package 10 outer surface 11 of resin package 10 recessed portion 11 a opening of recessed portion 11 b bottom surface of recessed portion 21 first lead 21 ′ first lead equivalent region 21 a first The upper surface 21b of the lead 21 The lower surface 21c to 21f of the first lead 21 The side portion 21g of the first lead 21 The side edge groove portion 21h of the first lead 21 The extending portion 21j of the first lead 21 The first groove 21k of the first lead 21 Second groove 21r of lead 21 element mounting area 22 second lead 22 'second lead equivalent area 22a upper surface of second lead 22 22b lower surface of second lead 22c-22f side portion of second lead 22 22g second lead 22 side edge groove portion 22 h stretched portion of second lead 22 23, 24 connecting portion 30 resin body 31 The first resin portion 31c to 31f of the resin body 30 The inner side surface 32 of the first resin portion 31 The second resin portion 32c, 32e of the resin body 30 The first portion 32d of the second resin portion 32 The second portion 32d of the second resin portion 32 32s slopes 32v of the first part 32c, 32v 'hollow of the second resin part 32p convex part of the second resin part 32 third resin part 33a of the resin body 30a upper surface of the third resin part 33b of the third resin part Lower surface 34 Resin connection portion 34a Upper surface 41 of resin connection portion 34, 42 Light emitting elements 43a to 43d, 61 Wire 50 Light reflective member 50s Sloped surface of light reflective member 50 Protective element 75 Sealing member 101, 102 Light emitting device 101 'Light Emitting Device Equivalent Region 201 Assembly Substrate 202 Lead Frame 210D Lower Mold 210U, 210U', 210U '' Upper Mold 212 Convex Part 214 of Upper Mold 210U 'Upper Mold Recess 300 release sheet of 210U ''

Claims (9)

A resin package having a plurality of leads including a first lead and a second lead, a first resin portion, a second resin portion, and a third resin portion, wherein the first resin portion is an outer surface of the resin package. The second resin portion is located around the element mounting area, and the third resin portion is located between the first lead and the second lead, and the plurality of leads and the first resin And a resin package in which a recess having an inner wall surface is formed, and a part of the upper surface of the plurality of leads is located on the bottom surface of the recess.
A light emitting element disposed in the element mounting area;
A light reflective member positioned between the inner wall surface and the second resin portion in the recess;
And a sealing member which is located in a region surrounded by the light reflective member in the concave portion and covers the second resin portion and the light emitting element.
The second resin portion has a recess on the surface,
The part of the said sealing member is a light-emitting device located in the said hollow of the said 2nd resin part.   The light emitting device according to claim 1, wherein the recess extends in a direction intersecting a direction in which the second resin portion extends. The light emitting device further includes a wire electrically connecting a portion of the plurality of leads outside the element mounting region and the light emitting element with each other,
The light emitting device according to claim 2, wherein a part of the wire is located above the recess of the second resin portion.   The light emitting device according to any one of claims 1 to 3, wherein the resin package further includes a resin connection portion located on a bottom surface of the recess and connecting the first resin portion and the second resin portion. .   The light emitting device according to claim 4, wherein the recess is located in the vicinity of a portion where the resin connection portion and the second resin portion are connected. A resin package having a plurality of leads including a first lead and a second lead, a first resin portion, a second resin portion, and a third resin portion, wherein the first resin portion is an outer surface of the resin package. The second resin portion is located around the element mounting area, and the third resin portion is located between the first lead and the second lead, and the plurality of leads and the first resin And a resin package in which a recess having an inner wall surface is formed, and a part of the upper surface of the plurality of leads is located on the bottom surface of the recess.
A light emitting element disposed in the element mounting area;
A light reflective member positioned between the inner wall surface and the second resin portion in the recess;
And a sealing member which is located in a region surrounded by the light reflective member in the concave portion and covers the second resin portion and the light emitting element.
The second resin portion has a convex portion on the surface,
The said convex part is a light-emitting device covered by the said sealing member.   The light emitting device according to claim 6, wherein the resin package further includes a resin connection portion located on a bottom surface of the recess and connecting the first resin portion and the second resin portion.   The light emitting device according to claim 7, wherein the convex portion is located in the vicinity of a portion where the resin connection portion and the second resin portion are connected. The first lead has a first groove on at least a part of the periphery of the element mounting area on the top surface located on the bottom surface of the recess.
The light emitting device according to any one of claims 1 to 8, wherein at least a part of the second resin portion is disposed in the first groove.

Images