JP2019068015A - Glass-ceramic laminate, method of manufacturing the same, electronic component package, and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a glass-ceramic laminated plate capable of enhancing airtightness, a manufacturing method thereof, an electronic component package, and a manufacturing method thereof. A glass-ceramic laminated plate (11) includes a substrate (12) having a laminated structure of glass-ceramics, and a vitreous layer (13) provided on an end surface of the substrate (12) so as to seal between layers of the laminated structure of the substrate (12). . The method for manufacturing the glass-ceramic laminate 11 includes, for example, a preparatory step of preparing a base material of the glass-ceramic laminate 11 and scanning a laser beam for fusing the base material along a planned cutting line for cutting the base material. And a glassy layer forming step of forming the glassy layer 13. [Selection diagram] Figure 1

Description

  The present invention relates to a glass ceramic laminate, a method of manufacturing the same, an electronic component package, and a method of manufacturing the same.

  Conventionally, as disclosed in Patent Documents 1 and 2, for example, a ceramic laminated board is known as a wiring board for forming a circuit. As disclosed in Patent Document 2, a glass ceramic laminate may be used as the ceramic laminate.

JP, 2015-216322, A JP, 2016-154185, A

  In recent years, since the glass ceramic laminate is obtained by firing at a relatively low temperature, its utility value is increased. Since the end face of such a glass ceramic laminate is a cut surface cut by a dicer, the interlayer portion of the glass ceramic layer is exposed. For this reason, there is a possibility that gas may intrude between layers from the end face of the glass ceramic laminate. Such gas intrusion into the layers of the glass ceramic laminates is one factor that reduces the airtightness of the glass ceramic laminates and the electronic component package using the laminates.

  The present invention has been made in view of these circumstances, and an object thereof is to provide a highly airtight glass ceramic laminate, a method of manufacturing the same, an electronic component package, and a method of manufacturing the same.

  The glass-ceramics laminated board which solves the said subject is equipped with the board | substrate which has a laminated structure of glass ceramics, and the glassy layer provided in the end surface of the said board | substrate so that the interlayer of the laminated structure of the said board | substrate may be sealed. According to this configuration, the vitreous layer can suppress entry of gas from the end face of the substrate having the laminated structure of glass ceramic to the interlayer of the substrate.

  In the above-mentioned glass ceramic laminate, the substrate may have a recess opened in the main surface of the substrate. According to this configuration, it is possible to suppress the entry of gas into the recess through the interlayer of the glass ceramic laminate, and it is possible to improve the airtightness of the recess of the substrate.

  In the glass ceramic laminate, the thickness of the vitreous layer is preferably in the range of 5 μm to 50 μm. According to this configuration, the airtightness can be further enhanced, and the peeling from the end face of the substrate can be suppressed.

  In the glass ceramic of the substrate used for the glass ceramic laminate, a ceramic filler in a particulate state is dispersed in a glass matrix, and the vitreous layer substantially does not contain the ceramic filler in the particulate state. Is preferred. According to this configuration, both high strength and high airtightness can be achieved.

  A method of manufacturing a glass ceramic laminate comprises: a substrate having a laminated structure of glass ceramics; and a vitreous layer provided on an end face of the substrate so as to seal the layers of the laminated structure of the substrate. It is a manufacturing method of a board, Comprising: The preparatory process of preparing the base material of a glass-ceramics laminated plate, The said glassy by scanning the laser beam which melts and cuts the said base material along the cutting scheduled line which cuts the said base material And a vitreous layer forming step of forming a layer.

  The manufacturing method of the said glass-ceramics laminated board may further be equipped with the removal process of removing the dross formed at the time of the melt | fusion cutting of the said base material after the said vitreous layer formation process. According to this method, problems caused by dross can be suppressed.

  In the method of manufacturing a glass ceramic laminate, the base material of the glass ceramic laminate has a recess opened to one of the two main surfaces of the base, and in the vitreous layer forming step, It is preferable to irradiate the said laser beam from the other main surface side among both main surfaces of a base material.

  According to this method, for example, even if a functional layer such as a plating layer is provided on the other main surface in the base material of a glass ceramic laminate, the functional layer is contaminated by dross or damaged by removal of dross Can be avoided.

  An electronic component package for solving the above problems is an electronic component package comprising a glass ceramic laminate, an electronic component, and a lid material, wherein the glass ceramic laminate is a substrate having a laminated structure of glass ceramics, and the substrate And a vitreous layer provided on the end face of the substrate so as to seal the layers of the laminated structure, the substrate having a recess opening in the main surface of the substrate, and the electronic component being in the recess While being accommodated, the opening of the said recessed part is sealed by the said cover material.

  According to this configuration, the vitreous layer can suppress entry of gas from the end face of the substrate having the laminated structure of glass ceramic to the interlayer of the substrate. Thereby, the gas can be prevented from invading the recess through the interlayer of the glass ceramic laminate, so that the airtightness of the recess of the substrate can be enhanced.

  The method of manufacturing an electronic component package is a method of manufacturing an electronic component package including a glass ceramic laminate, an electronic component, and a lid material, wherein the glass ceramic laminate is a substrate having a laminated structure of glass ceramics, and the substrate And a vitreous layer provided on the end face of the substrate so as to seal the layers of the laminated structure, wherein the substrate has a recess opening in the main surface of the substrate, and the manufacturing method The method includes a preparation step of preparing a base material of a glass ceramic laminate, and a packaging step, and the packaging step includes an accommodating step of accommodating the electronic component in the concave portion, and an opening of the concave portion in which the electronic component is accommodated. Attaching the lid material for sealing, and the glassy material by scanning a laser beam for melting and cutting the base material along a planned cutting line for cutting the base material It is preferable to provide a vitreous layer forming step of forming a.

  According to the present invention, the airtightness of the glass ceramic laminate can be enhanced.

It is a sectional view showing a glass ceramics laminated board in an embodiment. (A) is a top view which shows the base material of a glass-ceramics laminated board, (b) is a top view which shows a glass-ceramics laminated board. It is a side view explaining the manufacturing method of a glass ceramic laminated board. It is a flowchart explaining the manufacturing method of an electronic component package. It is a top view which shows the location which observed the glass-ceramics laminated board with the scanning electron microscope (SEM). It is a SEM photograph of the glass-ceramics laminated board of Experiment 1. FIG. It is a SEM photograph of the glass-ceramics laminated board of Experiment 3. FIG. (A)-(e) are XRD (X-ray diffraction) charts.

  Hereinafter, embodiments of a glass ceramic laminate, a method of manufacturing the same, an electronic component package, and a method of manufacturing the same will be described with reference to the drawings. In the drawings, for convenience of explanation, part of the configuration may be shown exaggerated or simplified. Also, the dimensional ratio of each part may be different from the actual one.

<Glass ceramic laminates>
FIG. 1 shows a cross-sectional view of the glass ceramic laminate shown in FIG. 2 (b) along line 1-1. As shown in FIG. 1 and FIG. 2 (b), the glass-ceramics laminated plate 11 is provided on the end face of the substrate 12 so as to seal the interlayer of the laminated structure of the substrate 12 and the substrate 12 having the laminated structure of glass ceramics. And a vitreous layer 13. The substrate 12 of the present embodiment has a recess 14 that opens to one of the two main surfaces of the substrate 12.

  The substrate 12 has a structure in which a peripheral wall portion constituting a peripheral wall of the recess 14 is stacked on a flat plate portion. The substrate 12 is provided with a glass ceramic layer and a circuit part whose illustration is omitted. The circuit portion of the substrate 12 (circuit substrate) includes, for example, wiring such as inner layer wiring and outer layer wiring. The circuit unit may include a resistor, an inductor, a capacitor, and the like. The substrate 12 may be provided with a thermal via for radiating heat generated from the electronic component. The thickness of the substrate 12 is, for example, in the range of 0.5 mm or more and 5 mm or less.

  The glass ceramic which comprises the board | substrate 12 of the glass ceramic laminated plate 11 is a thing in which the ceramic filler (powder of ceramic material) of the particulate state is disperse | distributed in the glass matrix. It is preferable that the vitreous layer 13 of the glass-ceramics laminated plate 11 does not substantially contain the ceramic filler in a particulate state. Here, the vitreous layer 13 substantially free of the particulate ceramic filler is the peak integrated intensity of a specific ceramic filler particle in the glass ceramic portion in thin film X-ray diffraction measurement (incident angle: 0.2 °). Is 100, it means that the peak integrated intensity based on the above-mentioned ceramic filler particles in the vitreous layer 13 measured similarly is less than 30.

  The above-mentioned peak integrated intensity in glass ceramics can be measured by thin film X-ray diffraction measurement, for example on a cut surface mechanically cut by a dicer. In the vitreous layer 13, when the ceramic filler particles are incorporated into a part of the network of the glass matrix and become amorphous, it is considered that the peak integrated intensity is smaller than that of the glass ceramic portion as described above.

  The vitreous layer 13 of the glass ceramic laminate 11 can be formed by melting and cutting the base material with laser light, or modifying the cut surface of the base material with laser light. The vitreous layer 13 may be provided on the entire end face of the substrate 12 or may be provided partially. The vitreous layer 13 may be provided, for example, only on the end face constituting one side of the substrate 12 having a rectangular shape in plan view. The thickness of the glassy layer 13 is preferably in the range of 5 μm to 50 μm. When the thickness of the vitreous layer 13 is 5 μm or more, the airtightness can be further enhanced. In the case where the thickness of the vitreous layer 13 is 50 μm or less, for example, peeling from the end face of the substrate 12 can be suppressed. The thickness of the vitreous layer 13 is the minimum thickness when the vitreous layer 13 is observed with a scanning electron microscope.

<Method of manufacturing glass ceramic laminate>
As shown in FIGS. 2 (a) and 2 (b), the method of manufacturing the glass-ceramics laminate 11 includes a preparation step of preparing the base 15 of the glass-ceramics laminate 11 and a cutting schedule for cutting the base 15 And a vitreous layer forming step of forming the vitreous layer 13 by scanning a laser beam for melting and cutting the base material 15 along the line CL.

  The base material 15 of the glass-ceramics laminated plate 11 has the 1st lamination | stacking part 15a and the 2nd lamination | stacking part 15b which are demarcated by the cutting proposed line CL. The first stacked portion 15 a has a recess 14 that opens to one of the two main surfaces of the first stacked portion 15 a (upper surface). The second stacked unit 15 b has a recess 14 that opens to one of the two main surfaces of the second stacked unit 15 b (upper surface). Further, the first stacked unit 15a and the second stacked unit 15b each have a circuit unit whose illustration is omitted. In addition, the part along the cutting planned line CL of the base material 15 does not have a circuit part.

  The base material 15 of the glass ceramic laminate 11 can be obtained by a known method of forming a circuit pattern using a green sheet for glass ceramic. Glass ceramics are also called low temperature co-fired ceramics (LTCC: Low Temperature Co-fired Ceramics). As a ceramic material (material of a ceramic filler) which comprises glass ceramics, an alumina, titanium, a niobium oxide, a zirconia, and a willemite are mentioned, for example. The glass ceramic may contain a pigment. The green sheet is obtained, for example, by forming a slurry containing a glass powder, a ceramic powder, a pigment, and an organic solvent by a doctor blade method. The base material 15 of the glass-ceramics laminated plate 11 is obtained, for example, by laminating a plurality of green sheets processed according to a circuit pattern, pressing it, and firing it at a temperature higher than the softening temperature of the glass.

  As shown in FIG. 3, the vitreous layer forming step can be performed using a manufacturing apparatus provided with a known laser unit 16. The laser unit 16 of the manufacturing apparatus includes a light source 16a and an optical system 16b for condensing the laser light LA emitted from the light source 16a. The manufacturing apparatus further includes a support 17 for supporting the base material 15 of the glass ceramic laminate 11.

  As the laser beam LA, a high-power pulsed fiber laser beam can be suitably used. Here, an example of the conditions of the laser light LA will be described. The oscillation wavelength of the laser light LA can be used without limitation in the wavelength range if the glass ceramic has an absorption band. In addition, by mixing the pigment in the glass ceramic itself and making it black, it is possible to expand the selected range of the oscillation wavelength. The average output of the laser beam LA is preferably in the range of 50 to 150 W. The pulse width of the laser light LA is preferably in the range of 10 to 500 μs. The pulse energy of the laser light LA is preferably in the range of 10 to 1000 mJ. The repetition frequency of the laser light LA is preferably 100 to 15000 Hz. The condensing position of the laser light LA may be, for example, aligned with the main surface of the base material 15 of the glass ceramic laminate 11 or a predetermined depth from the main surface (for example, the depth from the main surface is 0.5 You may match with the position used as -3 mm). The condensing diameter of the laser light LA is, for example, about 20 μm. The scanning speed of the laser light LA is preferably in the range of 1 to 10 mm / s. As an assist gas used at the time of irradiation of laser beam LA, inert gas, such as nitrogen, air, etc. are mentioned, for example. The pressure of the assist gas is preferably about 10 to 20 atm.

  The manufacturing apparatus is provided with a moving mechanism that enables relative movement of the laser unit 16 and the support 17 in the direction along the XYZ axes. The manufacturing apparatus includes a control unit that scans and controls the moving mechanism so as to irradiate the laser light LA along a predetermined planned cutting line CL.

In the vitreous formation step of the present embodiment, the laser light LA is irradiated from the main surface side opposite to the concave portion 14 in the base material 15 of the glass ceramic laminate 11.
Here, in the vitreous formation step, dross (unwanted matter generated by melting) is formed when the base material 15 of the glass ceramic laminate 11 is melted and cut. The dross is formed on the main surface side opposite to the irradiation side of the laser light LA. That is, in the present embodiment, a dross is formed on the main surface side having the recess 14 among both main surfaces of the glass ceramic laminate 11.

  The manufacturing method of the glass-ceramics laminated board 11 of this embodiment is further equipped with the removal process of removing a dross after a vitreous layer formation process. In this removal step, for example, dross is removed by grinding.

<Electronic component package>
As shown in FIG. 1, the electronic component package 18 includes a glass ceramic laminate 11, an electronic component 19 and a lid 20. The glass ceramic laminate 11 includes the substrate 12 and the vitreous layer 13 stacked as described above. The electronic component 19 is accommodated in the recess 14 opened in the main surface of the substrate 12. Examples of the electronic component 19 include an IC chip, an imaging device, and a light emitting device. The electronic component 19 can be mounted on the substrate 12 by, for example, wire bonding.

  The opening of the recess 14 of the substrate 12 is sealed by a lid 20. As the lid member 20, a thin plate material such as a thin glass plate or a thin ceramic plate is suitably used. The lid member 20 is bonded to the main surface of the glass ceramic laminate 11 using, for example, a sealing material (bonding material) such as glass frit and a resin material.

<Method of Manufacturing Electronic Component Package>
As shown in FIG. 4, the method of manufacturing the electronic component package 18 includes a preparation step S1 of preparing the base material 15 of the glass ceramic laminate 11 and a package step S2.

  The packaging process S2 of the present embodiment includes the vitreous layer forming process S21 and the dross removing process S22 described in the method of manufacturing the glass ceramic laminate 11. The packaging step S2 further includes an accommodation step S23 for accommodating the electronic component 19 in the recess 14 of the substrate 12 in the glass ceramic laminate 11, and a lid 20 for sealing the opening of the recess 14 in which the electronic component 19 is accommodated. And mounting step S24 of mounting.

  The housing step S23 can be performed by a known method of housing (mounting) the electronic component 19 in the recess 14 of the substrate 12 in the glass ceramic laminate 11. In the mounting step S24, the lid material 20 is mounted on the glass ceramic laminate 11 by bonding the lid 20 to the main surface (upper surface) of the glass ceramic laminate 11 with a sealing material.

  The dross removing step S22 in the method of manufacturing the electronic component package 18 may be performed as a pre-step of the mounting step S24. That is, the dross removing step S22 is not limited to the previous step of the storing step S23, and can be performed as a step subsequent to the storing step S23.

Next, test examples will be described.
(Test Example 1)
The base material of the glass-ceramics laminated plate was prepared, and the glassy layer formation process was performed by scanning a laser beam with respect to this base material. First, after laminating a plurality of green sheets, they were pressed and fired at a temperature equal to or higher than the softening temperature of glass to produce a base material (thickness: 3.7 mm) of a glass ceramic laminate.

The composition of the base material of this glass ceramic laminate is 50% of glass, 49% of alumina powder, and 1% of pigment (Fe-Cr-O based pigment) in mass%. The composition of the glass is, in mass%, SiO ₂ : 66%, B ₂ O ₃ : 15%, CaO + BaO + MgO: 12%, Na ₂ O + K ₂ O + Li ₂ O: 4%, other oxides (including ZrO ₂ ): 3 %.

  Next, a vitreous layer forming step of obtaining a glass ceramic laminate from the base material of the glass ceramic laminate was performed. In the glassy layer forming step, high-power pulsed fiber laser light was used as the laser light. The conditions of the laser light are as follows.

Oscillation wavelength: 1.07 μm
Average power: 120W
Pulse width: 400 μs
Pulse energy: 600mJ
The repetition frequency is 200 Hz
Focusing position: 1 mm deep from the main surface of the base material of the glass ceramic laminate plate Focusing diameter of laser light: 20 μm
Scanning speed: 5 mm / s
Assist gas: Nitrogen gas (18 atm)
(Test Example 2)
In Test Example 2, a glass ceramic laminate was produced in the same manner as in Test Example 1 except that the pulse width, pulse energy and repetition frequency were changed as follows among the conditions of the laser light in the vitreous layer forming step. .

Pulse width: 50 μs
Pulse energy: 50mJ
The repetition frequency is 2400 Hz
(Test Example 3)
In Test Example 3, a glass-ceramic laminate was produced in the same manner as in Test Example 1 except that the vitreous layer forming step was changed to a cutting step using a commercially available dicer. In the cutting step of Test Example 3, the cutting speed was set to 1 mm / s. If it is faster than this cutting speed, it is difficult to cut the base material of the glass ceramic laminate.

(result)
As shown in FIG. 5, the end W of the glass-ceramics laminate 11 obtained in Test Example 1 was observed from the Z-axis direction by a scanning electron microscope (SEM). The photograph is shown in FIG.

As shown in FIG. 6, a vitreous layer 13 more compact than the glass ceramic constituting the substrate 12 was formed at the end portion W of the glass ceramic laminate 11 of Test Example 1.
The end W of the glass ceramic laminate 11 obtained in Test Example 2 is similarly observed by a scanning electron microscope (SEM). As a result, the glass constituting the substrate 12 is formed at the end W of the glass ceramic laminate 11 A vitreous layer 13 denser than the ceramic was formed.

  As shown in FIG. 7, the end of the glass ceramic laminate obtained in Test Example 3 has a porous structure, and formation of a new layer like the glass ceramic laminate of Test Examples 1 and 2 can be confirmed. It was not.

  FIG. 8 is an XRD (X-ray diffraction) chart, and FIG. 8A is an end portion W of the glass ceramic laminate 11 obtained in Test Example 1, and FIG. 8B is obtained in Test Example 2 The edge part W of the glass-ceramics laminated board 11, and FIG.8 (c) have shown each XRD chart of the edge part of the glass-ceramics laminated board obtained by Experiment 3. FIG. Further, FIG. 8 (d) shows an XRD chart of alumina, and FIG. 8 (e) shows an XRD chart of a pigment.

  From the results of FIG. 8, the peak intensity based on alumina of Test Examples 1 and 2 is lower than the peak intensity based on alumina of Test Example 3. From this, it is understood that the vitreous layer 13 different from the glass ceramic is formed on the end face of the glass ceramic laminate 11 of the test examples 1 and 2. The vitreous layer 13 is considered to have a structure in which alumina is incorporated as a part of the glass network.

  In addition, as a result of measuring the peak integrated intensity of the ceramic filler particles by thin film X-ray diffraction measurement (incident angle: 0.2 °), the peak integrated intensity of Test Example 1 when the peak integrated intensity of Test Example 3 is 100. Was 9%, and the peak integrated intensity of Test Example 2 was 17%.

According to the embodiment described above in detail, the following effects are exhibited.
(1) The glass-ceramics laminated plate 11 comprises a substrate 12 having a laminated structure of glass ceramics, and a vitreous layer 13 provided on the end face of the substrate 12 so as to seal the layers of the laminated structure of the substrate 12 There is. According to this configuration, the vitreous layer 13 can suppress intrusion of gas or the like from the end face of the substrate 12 having the laminated structure of glass ceramics to the interlayer of the substrate 12. Therefore, the airtightness of the glass-ceramics laminated board 11 can be improved.

Further, since the adhesion between the glass contained in the glass ceramic forming the substrate 12 and the vitreous layer 13 is good, peeling of the vitreous layer 13 hardly occurs.
Further, as the smoothness of the end face of the glass-ceramics laminated plate 11 is enhanced, an error at the time of conveyance such as picking is less likely to occur.

  (2) The substrate 12 of the glass-ceramics laminated plate 11 has a recess 14 that opens in the main surface of the substrate 12. According to this configuration, the gas can be prevented from entering the recess 14 through the layers of the glass ceramic laminate 11, and therefore, the airtightness of the recess 14 of the substrate 12 can be improved.

  (3) The thickness of the vitreous layer 13 of the glass ceramic laminate 11 is preferably in the range of 5 μm to 50 μm. In this case, the airtightness can be further enhanced, and the peeling from the end face of the substrate 12 can be suppressed.

  (4) The glass ceramic in the substrate 12 of the glass ceramic laminate 11 is a ceramic matrix in which particles of ceramic filler are dispersed in a glass matrix. On the other hand, it is preferable that the vitreous layer 13 of the glass-ceramics laminated board 11 does not contain the ceramic filler of a particulate state substantially. In this case, both high strength and high airtightness can be achieved.

  (5) The method of manufacturing the glass ceramic laminate 11 includes a preparation step of preparing the base material 15 of the glass ceramic laminate 11 and a vitreous layer forming step of forming the vitreous layer 13. In the glassy layer forming step, the laser light LA for melting and cutting the base material 15 is scanned along the planned cutting line CL for cutting the base material 15 of the glass ceramic laminate 11.

According to this method, the vitreous layer 13 can be formed on the end face of the substrate 12 simultaneously with the cutting of the base material 15 of the glass ceramic laminate 11.
(6) The method of manufacturing the glass ceramic laminate 11 preferably further includes a removal step of removing the dross formed at the time of melting and cutting the base material 15 of the glass ceramic laminate 11 after the vitreous layer forming step. In this case, problems caused by dross can be suppressed.

  (7) In the method of manufacturing the glass-ceramics laminate 11, the base material 15 of the glass-ceramics laminate 11 has a recess 14 that opens to one of the two main surfaces of the base 15. Further, in the vitreous layer forming step, the laser light LA is emitted from the other main surface side of the both main surfaces of the base material 15. In this case, even if a functional layer such as a plating layer is provided on the other main surface of the base material 15 of the glass ceramic laminate 11, for example, the functional layer is contaminated by dross or damaged by removal of the dross. It becomes possible to avoid receiving.

  (8) The electronic component package 18 includes the glass ceramic laminate 11, the electronic component 19 and the lid 20. The substrate 12 has a recess 14 opened in the main surface of the substrate 12, and the electronic component 19 is accommodated in the recess 14. The opening of the recess 14 of the substrate 12 is sealed by a lid 20.

  According to this configuration, the vitreous layer 13 can suppress entry of gas from the end face of the substrate 12 having the laminated structure of glass ceramics to the interlayer of the substrate 12. As a result, it is possible to suppress the entry of gas into the recess 14 through the interlayer of the glass-ceramics laminated plate 11, and therefore the airtightness of the recess 14 of the substrate 12 can be enhanced.

  (9) The method of manufacturing the electronic component package 18 includes the above-described vitreous layer forming step, the accommodation step of accommodating the electronic component 19 in the recess 14 of the substrate 12 in the glass ceramic laminate 11, and the recess in which the electronic component 19 is accommodated. And a mounting step of mounting a lid 20 for sealing the opening 14.

According to this method, the vitreous layer 13 can be formed on the end face of the substrate 12 simultaneously with the cutting of the base material 15 of the glass ceramic laminate 11.
(Modification example)
The above embodiment may be modified as follows.

The recess 14 in the substrate 12 of the glass ceramic laminate 11 may be omitted.
The laser light LA used in the vitreous formation step can be irradiated from either one of the two main surfaces of the base material 15 of the glass ceramic laminate 11.

-The removal process of removing the dross formed in the vitreous formation process may be omitted.
In the method of manufacturing the electronic component package 18, in the packaging process, the vitreous layer forming process may be performed after the accommodation process and the mounting process are performed.

  The glass ceramic laminate can also be used for applications other than electronic materials having a circuit portion.

DESCRIPTION OF SYMBOLS 11 ... Glass-ceramics laminated board, 12 ... Board | substrate, 13 ... Glassy layer, 14 ... Recess, 15 ... Base material, 18 ... Electronic component package, 19 ... Electronic component, 20 ... Lid material, CL ... Planned cutting line, LA ... Laser light.

Claims (9)

  What is claimed is: 1. A glass ceramic laminate comprising: a substrate having a laminated structure of glass ceramic; and a vitreous layer provided on an end face of the substrate so as to seal the layers of the laminated structure of the substrate.   The said board | substrate has a recessed part opened to the main surface of the said board | substrate, The glass-ceramics laminated board of Claim 1 characterized by the above-mentioned.   The thickness of the said vitreous layer is 5 micrometers or more and 50 micrometers or less, The glass ceramics laminated board of Claim 1 or Claim 2 characterized by the above-mentioned. In the glass ceramic, a ceramic filler in a particulate state is dispersed in a glass matrix,
The glass-ceramic laminate according to any one of claims 1 to 3, wherein the vitreous layer substantially does not contain the ceramic filler in the particulate state. A method of manufacturing a glass ceramic laminate, comprising: a substrate having a laminated structure of glass ceramics; and a vitreous layer provided on an end face of the substrate so as to seal the layers of the laminated structure of the substrate;
A preparation step of preparing a base material of the glass ceramic laminate plate,
And a vitreous layer forming step of forming the vitreous layer by scanning a laser beam for melting and cutting the base material along a predetermined cutting line for cutting the base material. Manufacturing method.   The method for producing a glass ceramic laminate according to claim 5, further comprising a removing step of removing the dross formed at the time of melting and cutting the base material after the vitreous layer forming step. The base material of the glass ceramic laminate has a recess opened to one of the main surfaces of the base material,
The said glassy layer formation process WHEREIN: The said laser beam is irradiated from the main surface side of the other among the main surfaces of the said base material, The manufacturing of the glass-ceramics laminated board of Claim 5 or Claim 6 characterized by the above-mentioned. Method. An electronic component package comprising a glass ceramic laminate, an electronic component, and a lid,
The glass ceramic laminate includes a substrate having a laminated structure of glass ceramics, and a vitreous layer provided on an end face of the substrate so as to seal the layers of the laminated structure of the substrate.
The substrate has a recess opening in the main surface of the substrate, the electronic component is accommodated in the recess, and the opening of the recess is sealed by the lid member. Parts package. A method of manufacturing an electronic component package comprising a glass ceramic laminate, an electronic component, and a lid,
The glass ceramic laminate includes a substrate having a laminated structure of glass ceramics, and a vitreous layer provided on an end face of the substrate so as to seal the layers of the laminated structure of the substrate, and the substrate is Having a recess opening on the main surface of the substrate,
The manufacturing method includes a preparation step of preparing a base material of the glass ceramic laminate, and a package step.
The packaging step includes a storage step of housing the electronic component in the concave portion, a mounting step of mounting a lid material for sealing the opening of the concave portion in which the electronic component is housed, and cutting the base material A vitreous layer forming step of forming the vitreous layer by scanning laser light for melting and cutting the base material along a planned cutting line, and a method of manufacturing an electronic component package.