TW201908266A - Method for manufacturing packaging body having sealant layer attached thereto, and method for manufacturing airtight packaging - Google Patents

Abstract

The present invention is a method for manufacturing a sealing substrate with a sealing material layer and a method for manufacturing a hermetically sealed package, wherein the method for manufacturing a sealing substrate with a sealing material layer of the present invention is characterized by having: preparing to have a base portion and providing the base portion The process of encapsulating the base of the upper frame part, and the process of kneading the sealing material and the medium to make a sealing material paste with a resin content of less than 0.6% by mass, and coating the top of the frame part of the encapsulating base , Drying the sealing material paste, the process of making a dry film, and the engineer who obtains the sealing material layer by sintering the dry film when irradiating laser light on the dry film.

Description

Manufacturing method of sealing substrate with sealing material layer and manufacturing method of airtight package

The invention relates to a manufacturing method of a sealing substrate with a sealing material layer and a manufacturing method of an airtight package

The airtight package generally includes a package base having a base portion and a frame portion provided on the base portion, a glass cover having light permeability, and internal components housed in the internal space surrounded by the above.

Internal elements such as MEMS (Micro Electro Mechanical System) elements mounted inside the hermetic package may deteriorate due to moisture immersed from the surrounding environment. Conventionally, in order to integrate the encapsulation base and the glass cover, an organic resin-based adhesive having low-temperature curability has been used. However, the organic resin-based adhesive system cannot completely shield moisture or gas, and may deteriorate internal components over time.

On the other hand, when a composite powder containing glass powder is used as a sealing material, the closed portion is less likely to be deteriorated by moisture in the surrounding environment, and it becomes easy to ensure the airtight reliability of the airtight package.

However, the softening temperature of the glass powder-based adhesive is higher than that of the organic resin-based adhesive, and there is a possibility of thermally deteriorating internal components during adhesion. From such a situation, in recent years, the laser seal has been noticed.

In laser sealing, generally speaking, after irradiating laser light with a wavelength of near infrared rays on the sealing material layer, the sealing material layer is softened and deformed, and the glass cover and the package base are airtightly integrated. In addition, in laser sealing, only the portion to be sealed can be heated locally without thermally deteriorating internal components, and the base and the glass cover can be hermetically integrated. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open 2014-224006 　　 [Patent Document 2] Japanese Patent Laid-Open 2014-177356

[Problem to be solved by invention]

In the case of laser sealing the package base and the glass cover, generally, a sealing material layer is formed on the glass cover side, but no sealing material layer is formed on the package base side.

However, when the sealing material layer is not formed on the package substrate side, and the sealing material layer is formed on the glass cover side, during laser sealing, it is difficult to form a reaction layer at the interface between the package substrate and the sealing material layer, which becomes difficult to form on the package substrate The interface with the sealing material layer ensures the sealing strength.

In addition, when the sealing material layer is previously formed on the top of the frame portion of the package base by firing in an electric furnace, the internal components contained in the frame portion of the package base deteriorate thermally.

The present invention is configured in view of the above circumstances, and its technical problem is to provide a method of effectively ensuring the sealing strength at the interface between the encapsulation base and the sealing material layer while preventing thermal degradation of internal components. [Means to solve the problem]

The present inventors have repeated the results of various experiments and found that the above problems can be solved when the dry film is sintered by laser light irradiation while using a sealing material paste with a low resin ratio. That is, the method for manufacturing a sealing substrate with a sealing material layer of the present invention is characterized by including: a process of preparing a packaging substrate having a base portion and a frame portion provided on the base portion, and kneading the sealing material and the medium to produce a resin The process of sealing material paste with an amount of less than 0.6% by mass, and the process of coating and drying the sealing material paste on the top of the frame portion of the encapsulation base, making a dry film, and drying the film by irradiating laser light At this time, an engineer who sinters the dried film to obtain a sealing material layer.

The method for manufacturing a sealing substrate with a sealing material layer according to the present invention is characterized in that after producing a sealing material paste whose resin amount becomes less than 0.6% by mass, it is coated and dried to produce a dry film. According to this, when the dried film is sintered by the irradiation of laser light, the energy loss due to the heat of decomposition of the resin becomes small, so that a low-output laser light can be used. As a result, thermal degradation of internal components can be suppressed. Furthermore, when the dried film is sintered by the irradiation of laser light, the resin becomes less likely to remain in the sealing material layer. As a result, during laser sealing, the resin material is less likely to be re-decomposed in the sealing material layer, and poor flow or foaming of the sealing material layer can be prevented.

In addition, the method for manufacturing a sealing substrate with a sealing material layer of the present invention sinters the dried film when irradiating laser light on the dried film to obtain a sealing material layer with an average thickness of 1.0 to 10.0 μm.

In addition, the manufacturing method of the sealing substrate with a sealing material layer of the present invention is that the absorption rate of the monochromatic light with a wavelength of 808 nm of the sealing material layer is preferably 5-50% per 1 μm thickness.

In addition, the manufacturing method of the sealing substrate with a sealing material layer of the present invention is preferably provided with an engineer that houses internal components in the frame portion of the packaging substrate before forming a dry film on top of the frame portion of the packaging substrate.

In addition, the manufacturing method of the sealing substrate with a sealing material layer of the present invention is that the sealing substrate is any one of glass ceramics, aluminum nitride, aluminum oxide, or these composite materials.

In addition, the manufacturing method of the gas-tight package of the present invention includes: a process of manufacturing a sealing substrate with a sealing material layer through the above-mentioned manufacturing method of sealing substrate with a sealing material layer, and a process of preparing a glass cover, and by The process of laminating the sealing material layer and arranging the package base and the glass cover, and irradiating laser light from the side of the glass cover to obtain a hermetically sealed package by integrating the glass cover and the package base airtightly when the sealing material layer is softened and deformed The better.

The manufacturing method of the sealing substrate with a sealing material layer of the present invention includes: preparing a packaging substrate having a base and a frame portion provided on the base. The package base system having a base portion and a frame portion provided on the base portion can accommodate internal components in the frame portion. The frame portion of the package base is attached to the outer periphery of the package base, and it is preferably formed in a frame shape. As such, it is possible to expand the effective area for functioning as a device. In addition, it becomes a space where the internal components can be easily accommodated in the airtight package, and also makes it easy to perform wire bonding and the like.

The width of the top of the frame portion is ideally 100 to 3000 μm, 200 to 1500 μm, especially 300 to 900 μm. When the width of the top of the frame body is too narrow, it becomes difficult to form a sealing material layer on the top of the frame body. On the other hand, when the width of the top of the frame portion is too wide, the effective area for functioning as a device becomes smaller.

The height of the frame portion of the package base, that is, the height minus the thickness of the base from the package base is ideally 100 to 3000 μm, especially 200 to 2500 μm. As such, it is easy to achieve thinness of the airtight package while properly storing the internal components.

The thickness of the base of the package base is preferably 0.1 to 4.5 mm, especially 0.2 to 3.5 mm. Through this, a thinner hermetic package can be sought.

Any one of encapsulation base system glass, glass ceramic, aluminum nitride, aluminum oxide, or these composite materials (for example, integrated aluminum nitride and glass ceramic) is preferred. The glass ceramic is easy to form the sealing material layer and the reaction layer, and can ensure a strong sealing strength at the interface of the encapsulation substrate and the sealing material layer. It is easier to form the heat through hole, which can properly prevent the excessive temperature rise of the airtight package. Aluminum nitride and aluminum oxide have good heat dissipation properties, which can properly prevent excessive temperature rise of the hermetic package.

Glass ceramics, aluminum nitride, and alumina are preferably dispersed with black pigments (sintered with black pigments dispersed). As such, the package substrate can absorb the laser light transmitted through the sealing material layer. As a result, at the time of laser sealing, the place in contact with the sealing material layer of the package base is heated, so that the formation of the reaction layer can be promoted at the interface of the sealing material layer and the package base.

The manufacturing method of the sealing substrate with a sealing material layer of the present invention is a process of kneading a sealing material and a medium to produce a sealing material paste whose resin amount becomes less than 0.6% by mass. The sealing material is generally a composite material powder containing a glass powder and a refractory filler powder, and a laser absorbing material such as color pigments may be added as necessary. In addition, the sealing material is a material that softens and deforms during laser sealing and hermetically encapsulates the base and the glass cover. The medium generally refers to a mixture of a resin and a solvent, that is, a viscous solution in which the resin is dissolved, to disperse the sealing material, and to uniformly apply the sealing material paste to the top of the frame portion of the encapsulation base. In addition, in the medium, if necessary, surfactants, tackifiers, etc. may be added.

As the sealing material, various materials can be used. Among them, it is preferable to use a composite powder of bismuth-based glass powder and refractory filler powder from the viewpoint of improving the laser sealing strength. As the composite powder, a composite powder containing 55-100% by volume of bismuth-based glass powder and 0-45% by volume of refractory filler powder is preferred, and a composite powder containing 60-95% by volume of bismuth-based glass powder and 5-40 The composite powder of vol.% refractory filler powder is more preferable. It is particularly desirable to use a composite powder containing 60-85 vol.% bismuth glass powder and 15-40 vol.% refractory filler powder. If the refractory filler powder is added, the thermal expansion coefficient of the sealing material layer becomes the thermal expansion coefficient that is easily integrated into the glass cover and the package base. As a result, it becomes easy to prevent undue stress after laser sealing from remaining in the closed portion. On the other hand, when the content of the refractory filler powder is too large, the content of the bismuth-based glass powder becomes relatively small, the surface smoothness of the sealing material layer decreases, and the laser sealing accuracy tends to decrease.

The softening point of the sealing material is preferably 510°C or lower, 480°C or lower, and particularly 450°C or lower. If the softening point of the sealing material is too high, the surface smoothness of the sealing material layer may not be improved. The lower limit of the softening point of the sealing material is not particularly limited, but when considering the thermal stability of the glass powder, the softening point of the sealing material is preferably 350° C. or higher. Here, the "softening point" corresponds to the fourth point of inflection when measured with a macro DTA device.

The bismuth-based glass system is composed of glass, with mole %, containing Bi ₂ O ₃ 28~60%, B ₂ O ₃ 15~37%, ZnO 0~30%, CuO+MnO (the combined amount of CuO and MnO) 1 ~40% is better. The content range of each component will be explained below as the reason for the above limitation. However, in the description of the glass composition range,% display means mole %.

Bi ₂ O ₃ is a main component for lowering the softening point. The content of Bi ₂ O ₃ is ideally 28 to 60%, 33 to 55%, especially 35 to 45%. When the content of Bi ₂ O ₃ is too small, the softening point becomes too high, and the softening fluidity tends to decrease. On the other hand, when the content of Bi ₂ O ₃ is too large, the glass is likely to be devitrified during laser sealing, and therefore, the softening fluidity is easily reduced due to devitrification.

The B ₂ O ₃ system is an essential component as a glass-forming component. The content of B ₂ O ₃ is ideally 15 to 37%, 19 to 33%, especially 22 to 30%. When the content of B ₂ O ₃ is too small, it is not easy to form a glass network, and the glass becomes easily devitrified during laser sealing. On the other hand, when the content of B ₂ O ₃ is too large, the viscosity of the glass becomes higher, and the softening fluidity tends to decrease.

The ZnO-based component improves devitrification resistance. The content of ZnO is ideally 0~30%, 3~25%, 5~22%, especially 5~20%. When the content of ZnO is too large, the composition balance of the glass composition collapses, and devitrification resistance tends to decrease.

CuO and MnO are components that greatly increase the laser absorption energy. The synthesis amount of CuO and MnO is ideally 1-40%, 3-35%, 10-30%, especially 15-30%. When the combined amount of CuO and MnO is too small, the laser absorption energy tends to decrease. On the other hand, when the combined amount of CuO and MnO is too large, the softening point becomes too high, and even if laser light is irradiated, the glass becomes difficult to soften and flow. In addition, the glass becomes thermally unstable, and the glass becomes easily devitrified during laser sealing. However, the content of CuO is ideally 1-30%, especially 10-25%. The MnO content is desirably 0-25%, 1-25%, especially 3-15%.

In addition to the above components, for example, the following components may be added.

The SiO ₂ system improves water resistance. The content of SiO ₂ is ideally 0 to 5%, 0 to 3%, 0 to 2%, especially 0 to 1%. If the content of SiO ₂ is too large, the softening point may increase inappropriately. In addition, during laser sealing, the glass becomes easily devitrified.

The Al ₂ O ₃ system improves water resistance. The content of Al ₂ O ₃ is preferably 0 to 10%, 0.1 to 5%, especially 0.5 to 3%. If the content of Al ₂ O ₃ is too large, the softening point may increase inappropriately.

Li ₂ O, Na ₂ O and K ₂ O are components that reduce the devitrification resistance. Therefore, the content of Li ₂ O, Na ₂ O, and K ₂ O is preferably less than 0 to 5%, 0 to 3%, and particularly 0 to 1%.

MgO, CaO, SrO, and BaO are components that increase devitrification resistance, but increase the softening point. Therefore, the content of MgO, CaO, SrO, and BaO are each 0 to 20%, 0 to 10%, especially 0 to 5%.

Fe ₂ O ₃ is a component that improves devitrification resistance and laser absorption energy. The content of Fe ₂ O ₃ is desirably 0 to 10%, 0.1 to 5%, especially 0.4 to 2%. When the content of Fe ₂ O ₃ is too large, the composition balance of the glass composition collapses, and the devitrification resistance tends to decrease.

Sb ₂ O ₃ is a component for improving devitrification resistance. The content of Sb ₂ O ₃ is ideally 0 to 5%, especially 0 to 2%. When the content of Sb ₂ O ₃ is too large, the composition balance of the glass composition collapses, and devitrification resistance tends to decrease.

The average particle size D ₅₀ of the glass powder is ideally less than 15 μm, 0.5 to 10 μm, especially 1 to 5 μm. The smaller the average particle diameter D _{50 of} the glass powder, the lower the softening point of the glass powder. Here, the "average particle diameter D ₅₀ "refers to a value measured on a volume basis by a laser diffraction method.

As the refractory filler powder, one or more types selected from chrysotile, zircon, tin oxide, niobium oxide, zirconium phosphate-based ceramics, zinc silicate, β-eucryptite, and β-quartz solid solution are preferred. In particular, β-eucryptite or crocidolite is preferred. These refractory filler powders are added to the case where the coefficient of thermal expansion is low, the mechanical strength is high, and the compatibility with bismuth-based glass is good.

The average particle size D ₅₀ of the refractory filler powder is desirably less than 2 μm, particularly 0.1 μm or more and less than 1.5 μm. When the average particle size D _{50 of} the refractory filler powder is too large, the surface smoothness of the sealing material layer tends to decrease, and at the same time, the average thickness of the sealing material layer tends to increase. As a result, the laser sealing accuracy tends to decrease. .

The 99% particle size D ₉₉ of the refractory filler powder is desirably less than 5 μm, 4 μm or less, particularly 0.3 μm or more and 3 μm or less. When the 99% particle size D _{99 of} the refractory filler powder is too large, the smoothness of the surface of the sealing material layer is likely to be reduced. At the same time, the average thickness of the sealing material layer becomes easy to increase, and as a result, the laser sealing accuracy becomes easy reduce. Here, "99% particle size D ₉₉ "refers to a value measured on a volume basis by the laser diffraction method.

In order to improve the light absorption characteristics, the sealing material may further contain a laser absorber, but the laser absorber has the effect of promoting devitrification of bismuth glass. Therefore, the content of the laser absorber in the sealing material layer is desirably 10% by volume or less, 5% by volume or less, 1% by volume or less, 0.5% by volume or less, and particularly those that are not substantially contained are preferred. When the devitrification resistance of the bismuth-based glass is good, in order to improve the laser absorption energy, a laser absorber of 1% by volume or more, particularly 3% by volume or more, may be introduced. However, as the laser absorber, Cu-based oxides, Fe-based oxides, Cr-based oxides, Mn-based oxides, spinel-type composite oxides, and the like can be used.

The thermal expansion coefficient of the sealing material is ideally 55×10 ^-7 ~110×10 ^-7 /℃, 60×10 ^-7 ~105×10 ^-7 /℃, especially 65×10 ^-7 ~100×10 ^-7 / ℃. As such, the thermal expansion coefficient of the sealing material is integrated into the thermal expansion coefficient of the glass cover or the package base, and the stress remaining in the closed portion becomes smaller. However, the "coefficient of thermal expansion" refers to the value measured with a TMA (Push Rod Thermal Expansion Coefficient) device in the temperature range of 30 to 300°C.

The sealing material paste is usually produced by kneading the sealing material and the medium through three rollers or the like. The vehicle system, as described above, usually contains a resin and a solvent. The resin is added for the purpose of adjusting the viscosity of the paste. However, high-molecular resins, for example, resins with a molecular weight of more than 250, generate a large heat of decomposition when irradiated with laser light, and sintering of the dried film becomes difficult.

The amount of resin in the sealing material paste is less than 0.6% by mass, and ideally 0.5% by mass or less, 0.4% by mass or less, 0.3% by mass or less, 0.2% by mass or less, and particularly less than 0.1% by mass. When the amount of resin in the sealing material paste is too large, when the dry film is sintered by the irradiation of laser light, the energy loss due to the heat of decomposition of the resin increases, making it impossible to use low-output laser light. As a result, internal components become prone to thermal degradation. Furthermore, when the dried film is sintered by the irradiation of laser light, the resin tends to remain in the sealing material layer. As a result, at the time of laser sealing, re-decomposition of the resin occurs in the sealing material layer, and it becomes easy to cause poor flow or foaming in the sealing material layer.

In the manufacturing method of the sealing substrate with a sealing material layer of the present invention, it is most desirable to use a vehicle that does not substantially contain a resin (a vehicle with a resin amount of less than 0.1% by mass), but a small amount of resin is added to the vehicle In this case, as the resin, acrylate (acrylic resin), ethyl cellulose, polyethylene glycol derivatives, nitrocellulose, polymethylstyrene, polyethylene carbonate, polypropylene carbonate, methacrylate, etc. can be used . As the solvent used for the vehicle, N, N'-dimethylformamide (DMF), α-terpineol, higher alcohol, γ-butyrolactone (γ-BL), tetralin, terpene can be used Ethylene, diethylene glycol butyl ether acetate, ethyl acetate, isoamyl acetate, diethylene glycol monoethyl ether, ethylene glycol ethyl ether acetate, benzyl alcohol, toluene, 3-methoxy-3-methylbutanol , Triethylene glycol monomethyl ether, triethylene glycol dimethyl ether, dipropylene glycol methyl ether, dipropylene glycol butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monobutyl ether, propylene carbonate, dimethyl sulfoxide (DMSO ), N-methyl-2-pyrrolidone, etc.

The manufacturing method of the sealing substrate with a sealing material layer of the present invention is preferably provided with an engineer that houses internal components in the frame portion of the packaging substrate before forming a dry film on top of the frame portion of the packaging substrate. As such, the manufacturing efficiency of the hermetic package can be improved.

The manufacturing method of the sealing substrate with a sealing material layer of the present invention includes: applying and drying the sealing material paste on the top of the frame portion of the packaging substrate to make a drying film. The coating of the sealing material paste is preferably a coating machine such as a dispenser or a screen printing machine. As such, it is possible to improve the dimensional accuracy of the coated film or the dried film.

The drying of the coating film is higher than the lower limit temperature of the volatilization of the solvent in the sealing material paste, and lower than the heat resistance temperature of the internal components.

The manufacturing method of the sealing substrate with a sealing material layer of the present invention includes the steps of: irradiating laser light to the dried film and sintering the dried film to obtain a sealing material layer. As the laser irradiated to the dry film, various lasers can be used. In particular, the near infrared semiconductor laser system is ideal for easy handling.

In order to homogenize the sintered state, the laser beam diameter is preferably larger than the width of the dry film.

The external environment when irradiating with laser light is not particularly limited, and it may be in an atmospheric environment, or in an inactive environment such as a nitrogen environment.

When irradiating laser light, it is better to prepare the package substrate for heating at a temperature above 100°C and below the heat resistance temperature of the internal components. As a result, the temperature difference between the inner and outer surfaces of the dried film becomes smaller, and the surface state of the sealing material layer is likely to be uniform and smooth.

The laser scanning system for the dried film can also be performed at a certain speed, and the speed can be changed in an arbitrary range.

The contact position of the sealing material layer and the frame body portion is formed to be separated from the inner end edge of the top of the frame body portion, and preferably formed from the outer end edge of the frame body portion and separated It is more preferable to be at a position separated by 50 μm or more, 60 μm or more, 70 to 2000 μm, especially 80 to 1000 μm from the inner edge of the top of the frame body. When the distance between the inner edge of the top of the frame and the sealing material layer is too short, during laser sealing, the heat generated by local heating is not easily dissipated. During the cooling process, the glass cover becomes easy to break. On the other hand, when the distance between the inner edge of the top of the frame and the encapsulating material layer is too long, it becomes difficult to reduce the size of the hermetic package. In addition, those formed at positions separated from the top edge of the frame body by 50 μm or more, 60 μm or more, 70 to 2000 μm, and particularly 80 to 1000 μm are preferable. When the distance between the outer edge of the top of the frame and the sealing material layer is too short, during laser sealing, the heat generated by local heating is not easily dissipated, and the glass cover becomes easily damaged during the cooling process. On the other hand, when the separation distance between the outer edge of the frame body and the end edge and the sealing material layer is too long, it becomes difficult to reduce the size of the hermetic package.

The surface roughness Ra of the surface of the sealing material layer is desirably less than 0.5 μm, 0.2 μm or less, especially 0.01 to 0.15 μm. In addition, the surface roughness RMS of the sealing material layer is desirably less than 1.0 μm, 0.5 μm or less, particularly 0.05 to 0.3 μm. As such, the laser sealing accuracy is improved. Here, "surface roughness Ra" and "surface roughness RMS" are, for example, can be measured by a stylus type or non-contact type laser film thickness meter or surface roughness meter. However, as a method for specifying the surface roughness Ra and RMS of the sealing material layer as described above, there are a method of grinding the surface of the sealing material layer and a method of reducing the particle size of the refractory filler powder.

The average thickness of the sealing material layer is desirably 10.0 μm or less, particularly 1.0 μm or more and less than 6.0 μm. When the average thickness of the sealing material layer is smaller, the thermal expansion coefficient of the sealing material layer and the glass cover is not integrated, which can reduce the stress remaining in the closed portion after laser sealing. In addition, the laser sealing accuracy can also be improved. However, as a method of specifying the average thickness of the sealing material layer as described above, a method of thinly applying a sealing material paste and a method of polishing the surface of the sealing material layer can be mentioned.

The absorption rate (thickness direction) of monochromatic light with a wavelength of 808 nm of the sealing material layer is ideally 20 to 90%, especially 30 to 60%. In addition, the absorption rate of the monochromatic light with a wavelength of 808 nm of the sealing material layer is preferably 5 to 50%, especially 7 to 30% per 1 μm of thickness. When the absorption rate of monochromatic light with a wavelength of 808 nm is too low, the sealing material layer becomes difficult to soften and deform, and it is necessary to excessively increase the laser output. As a result, internal components may be thermally degraded. In addition, when the absorption rate of monochromatic light with a wavelength of 808 nm is too high, sufficient heat cannot be transferred to the interface between the package substrate and the sealing material layer, the reaction between the two does not proceed, and there is sintering of the sealing material layer Become inadequate. Here, "light absorption rate of monochromatic light at a wavelength of 808 nm" refers to a value in which the reflectance and transmittance are measured with a spectrophotometer, and the total value is subtracted from 100%.

The manufacturing method of the gas-tight package of the present invention includes: a process of manufacturing a encapsulating substrate with a sealing material layer through the above-mentioned manufacturing method of a encapsulating substrate with a sealing material layer, a process of preparing a glass lid, and The process of arranging the package base and the glass cover layer by layer, and irradiating the laser light from the side of the glass cover, by softening and deforming the sealing material layer, the airtight integration of the glass cover and the package base to obtain a hermetically sealed package is good.

As the glass cover, various glasses can be used. For example, alkali-free glass, borosilicate glass, soda lime glass can be used.

The thickness of the glass cover is preferably 0.01~2.0mm, 0.1~1mm, especially 0.2~0.7mm. Through this, a thinner hermetic package can be sought.

A functional film may be formed on the surface of the inner element side of the glass cover, or a functional film may be formed on the surface of the outer side of the glass cover. Especially as a functional film, an anti-reflection film is preferred. Through this, it is possible to reduce the light reflected on the surface of the glass cover.

The manufacturing method of the hermetic package of the present invention has a process of laminating the packaging base and the glass cover by the sealing material layer. In this case, the glass cover may be disposed below the package base, but from the viewpoint of laser sealing efficiency, it is preferable to arrange the glass cover above the package base.

A sealing material layer is preferably formed on the surface of the glass cover. In this case, the center lines of the sealing material layer formed on the package base and the sealing material layer formed on the glass cover overlap each other, and the package base and Glass cover is better. In addition, it is preferable that the sealing pattern formed on the sealing material layer of the glass cover is slightly the same as the sealing pattern formed on the top of the frame body portion of the package base. As such, those who can improve both the laser seal accuracy and the laser seal strength.

The manufacturing method of the airtight package of the present invention includes the steps of: irradiating laser light from the side of the glass cover, and softening and deforming the sealing material layer, and integrating the glass cover and the package base to obtain the airtight package.

The environment for laser sealing is not particularly limited, and it may be in an atmospheric environment, or in an inactive environment such as a nitrogen environment.

When performing laser sealing, when the glass cover is prepared to be heated at a temperature (above 100°C and below the heat resistance temperature of the internal components), cracking of the glass cover by thermal shock can be suppressed. In addition, after the laser sealing, when the annealing laser is irradiated from the glass cover side, cracking of the glass cover by thermal shock can be suppressed.

When performing laser sealing, at a temperature (above 100°C and below the heat resistance temperature of internal components), when preparing to heat the package base, it can hinder the heat conduction to the package base side during laser sealing, and can be efficient Laser sealer.

Laser sealing is preferred when the glass cover is pressed. Through this, it is possible to promote the softening and deformation of the sealing material layer during laser sealing.

Hereinafter, the present invention will be described simultaneously with reference to the drawings. FIG. 1 is a cross-sectional conceptual diagram for explaining one embodiment of the present invention. The hermetic package 1 includes a package base 10 and a glass cover 11. The package base 10 has a base 12 and a frame 13 on the outer peripheral edge of the base 12. In addition, the internal element 14 is housed in the frame portion 13 of the package base 10. In addition, a sealing material layer 16 is formed on the top portion 15 of the frame portion 13, and the surface of the top portion 15 is previously polished, and the surface roughness Ra is 0.15 μm or less. In addition, the width of the sealing material layer 16 is slightly smaller than the width of the frame portion 13. Furthermore, the sealing material layer 16 is formed by applying and drying the sealing material paste to form a dried film, and then irradiating the dried film with laser light to sinter it. The amount of the sealing material paste-based resin is less than 0.6% by mass, and is produced by kneading the sealing material and the medium with three rollers or the like. The sealing material contains bismuth glass containing transition metal oxide in the glass composition and refractory filler powder. However, electrical wiring (not shown) electrically connecting the internal element 14 and the outside is formed in the package base 10.

A frame-shaped sealing material layer 17 is formed on the surface of the glass cover 11. The sealing material layer 17 is formed by sintering the sealing material, and is composed of the same material as the sealing material layer 16, and the sealing material contains bismuth glass containing transition metal oxide in the glass composition and refractory filler powder. In addition, the width of the sealing material layer 17 is slightly the same as the width of the sealing material layer 16. Moreover, the thickness of the sealing material layer 17 is smaller than the thickness of the sealing material layer 16.

In addition, the glass cover 11 is upward, and the center lines in the width direction of the sealing material layer 16 and the sealing material layer 17 are in contact with each other, and the package base 10 and the glass cover 11 are stacked. Then, the laser light L emitted from the laser irradiation device 18 is irradiated along the sealing material layer 16 and the sealing material layer 17 from the glass cover 11 side. As a result, after the sealing material layer 16 and the sealing material layer 17 are softened and flowed, the airtight structure of the airtight package 1 is formed by hermetically sealing the base body 10 and the glass cover 11 together. [Example]

The present invention will be described below based on examples. However, the following examples are purely illustrative. The present invention is not limited to the following embodiments.

Table 1 shows examples of the present invention (Sample Nos. 1 to 4) and comparative examples (Sample Nos. 5 to 8).

First, prepare a glass batch in which various raw materials such as oxides and carbonates are mixed at a desired glass composition, and then put this into a platinum crucible and melt at 1200°C for 2 hours. Next, each obtained molten glass is formed into a sheet shape through a water-cooled roller. Finally, the flake-shaped bismuth-based glass was pulverized with a ball mill and subjected to air classification to obtain bismuth-based glass powder. However, the glass powders of the sample Nos. 1, ₂ , 5, and 6 are composed of glass, with mole %, containing Bi ₂ O ₃ 39%, B ₂ O ₃ 23.7%, ZnO 14.1%, Al ₂ O ₃ 2.7 %, CuO 20%, Fe ₂ O ₃ 0.6%, in addition, the glass powder of the relevant sample Nos. _{2, 3} , 7, and 8 is used as the glass composition, with Mo %, containing Bi ₂ O ₃ 45%, B ₂ O ₃ 27.7%, ZnO 19.1%, Al ₂ O ₃ 3.7%, CuO 4.0%, Fe ₂ O ₃ 0.6%.

Next, the obtained bismuth-based glass powder was mixed at 70.0% by volume and the refractory-filled powder at a ratio of 30.0% by volume to produce a sealing material (composite powder). Here, the average particle size D _{50 of the} bismuth-based glass powder is 1.0 μm, the 99% particle size D _{99 is} 2.5 μm, the average particle size D _{50 of the} refractory filler powder is 1.0 μm, and the 99% particle size D _{99 is} 2.5 μm. However, the refractory filler powder is β-eucryptite.

When the thermal expansion coefficient of the obtained sealing material was measured, the thermal expansion coefficient was 71 × 10 ^-7 /°C. However, if the thermal expansion coefficient is measured by a push-bar TMA device, the measurement temperature range is 30 to 300°C.

Next, as follows, along the center line of the top of the frame portion of the package base made of alumina (30 mm×30 mm, frame portion height 3 mm, frame portion width 2 mm), have the thickness in the table and form the width 0.5mm layer of sealing material.

When detailed, the viscosity is firstly about 100 Pa･s (25℃, Shear rate: 4). After kneading the above-mentioned sealing material and the vehicle, the three rollers are used to further knead the powder to uniformity. Disperse and paste into a paste to obtain a sealing material paste.

In Sample Nos. 1 and 3, a terpene-based solution was used as a vehicle. In Sample Nos. 2 and 4, a composition in which ethyl cellulose resin was dissolved in a terpene-based solution was used as a vehicle. In Sample Nos. 5 to 8, a composition in which ethyl cellulose resin was dissolved in tripropylene glycol monomethyl ether was used as a vehicle. However, the compounding ratios of the bismuth-based glass and the medium of the sample No. 5 and the sample No. 6 and the sample No. 7 and the sample No. 8 are different.

Then, the center line of the top of the frame portion of the encapsulation base and the center line of the width direction of the sealing material layer are consistent, after printing the above-mentioned sealing material paste through a screen printing machine, through the atmospheric environment, by 100 When drying at 10°C for 10 minutes, a dry film is formed on the top of the frame portion of the package base.

Furthermore, when the dried film is placed upward, the package substrate is fixed with a jig, a semiconductor laser with a wavelength of 808 nm is irradiated at an irradiation speed of 8 mm/sec, and when the dried film is softened and deformed and sintered, a sealing material layer is formed On top of the frame portion of the package base. When observing the surface state of the sealing material layer with a microscope, the structure with high surface smoothness was evaluated as “○”, the structure with low surface smoothness was evaluated as “△”, and the structure without sintering itself was evaluated as “×”.

In addition, the sealing material paste is applied to the surface of one side of borosilicate glass (BDA made by NEG) with a thickness of 0.3 mm and 29.8 mm × 29.8 mm in the same pattern as the sealing material layer formed on the encapsulation base, in an atmospheric environment In this process, after drying at 100°C for 10 minutes, it was fired at 520°C for 10 minutes through an electric furnace to produce a glass cover with a sealing material layer.

Finally, the sealing material layer formed on the packaging base and the sealing material layer formed on the glass cover are in contact with each other, and the packaging base and the glass cover are laminated and arranged. After that, while pressing the glass cover with a pressing jig, a semiconductor laser with a wavelength of 808 nm is irradiated from the glass cover side toward the sealing material layer at an irradiation speed of 15 mm/sec, and when the sealing material layer is softened and deformed, it is airtight The substrate and the glass cover are encapsulated in an integrated manner to obtain a hermetically sealed package. However, the average width seen from above the sealing material layer after laser sealing is set to be 110% of the average width seen from above the sealing material layer before laser sealing. Shoot output.

For the airtight package obtained, evaluate the airtight reliability. When describing in detail, after the high-temperature, high-humidity and high-pressure test (temperature 85° C., relative humidity 85%, 1000 hours) is performed on the resulting airtight package, when the vicinity of the sealing material layer is observed, the glass cover is completely unconfirmed When the structure of breakage, breakage, etc. is "○", the structure of breakage, breakage, etc. of the glass cover is confirmed as "X", and the airtightness reliability is evaluated. However, since the sintering of the sample No. 6 to 8 series sealing material layers is insufficient, this evaluation is omitted.

It is understood from Table 1 that the amount of resin in the sample Nos. 1 to 4 series sealing material paste is appropriate, and the sintered state of the sealing material layer is good. As a result, the airtight reliability through laser sealing is also good. On the other hand, the sample No. 5 to 8 series had a large amount of resin in the sealing material paste, and the sintered state of the sealing material layer was poor, and it was confirmed that many bubbles remained. [Possibility of industrial use]

The hermetic package produced by the manufacturing method of the present invention is optimal for hermetic packages mounted with internal components such as MEMS (Micro Electro Mechanical System) components, but in addition, for piezoelectric vibration elements, or A hermetically sealed package containing a wavelength conversion element and the like in which quantum dots are dispersed in resin can also be suitably applied.

1‧‧‧ Hermetically sealed

10‧‧‧Package substrate

11‧‧‧Glass cover

12‧‧‧Base

13‧‧‧frame

14‧‧‧Internal components

15‧‧‧Top of the frame

16, 17‧‧‧ Sealing material layer

18‧‧‧Laser irradiation device

L‧‧‧Laser

FIG. 1 is a schematic cross-sectional view for explaining one embodiment of the present invention.

Claims (6)

A method for manufacturing a packaging substrate with a sealing material layer, characterized by including: a process of preparing a packaging substrate having a base portion and a frame portion portion provided on the base portion, and combining the sealing material and the medium to produce a resin amount of less than 0.6 mass % Of the sealing material paste process, 　　 on the top of the frame portion of the encapsulation base, coating and drying the sealing material paste, the process of making the dry film, and the drying film is sintered by irradiating the laser light to the dry film The engineer of the sealing material layer. The method for manufacturing a sealing substrate with a sealing material layer as described in item 1 of the scope of the patent application, wherein the dried film is sintered by irradiating laser light to the dried film to obtain a sealing material layer with an average thickness of 1.0 to 10.0 μm. For example, the method for manufacturing a packaging substrate with a sealing material layer as described in item 1 or 2 of the patent application scope, wherein the absorption rate of monochromatic light with a wavelength of 808 nm of the sealing material layer is 5-50% per 1 μm thickness. The method for manufacturing a packaging substrate with a sealing material layer as described in item 1 or 2 of the patent application scope, wherein, before forming a dry film on the top of the frame portion of the packaging substrate, it is provided with Engineers within the frame. For example, the method for manufacturing a packaged substrate with a sealing material layer as described in item 1 or 2 of the patent application scope, wherein the packaged substrate is any one of glass ceramic, aluminum nitride, aluminum oxide, or a composite material of these By. A method of manufacturing a hermetically sealed package, characterized by comprising: manufacturing a packaged substrate with a sealing material layer via the method for manufacturing a packaged substrate with a sealing material layer as described in any one of claims 1 to 5 Engineering, 　　preparation of the glass cover, 　　the process of stacking the package base and the glass cover by the sealing material layer, and irradiating the laser light from the glass cover side, by softening and deforming the sealing material layer, the airtight integrated glass cover and An engineer who encapsulates a substrate to obtain a hermetically sealed package.