JP2019046891A - Processing device - Google Patents

Abstract

An object of the present invention is to prevent a means for holding a workpiece from being changed or erroneous mounting when changing the outer diameter size of the workpiece. A holding unit (14) for holding a workpiece (W), a processing unit (70) for processing a workpiece held by the holding unit, and a transport unit (70) for holding and transporting the workpiece. 30) a processing device (10) comprising: input means (71) for inputting an operation command; display means (71) for displaying information input from the input means; and control means (80), The holding means includes a chuck table (14) formed in accordance with the outer diameter of the workpiece and capable of being attached and detached in accordance with the outer diameter of the workpiece, and at least the chuck table has an outer diameter size of the workpiece. The size change setting screen (73) of the display means for setting the change of the processing apparatus in accordance with the outer diameter size of the workpiece is colored for each outer diameter of the workpiece. The color set in is displayed. [Selection diagram] FIG.

Description

  The present invention relates to a processing apparatus for processing a plurality of sizes of workpieces.

  Various processing devices are used in the manufacture of semiconductors and the like. For example, in a cutting apparatus, a wafer to be processed is transferred from a stored cassette to a processing chuck table by a transfer arm, subjected to cutting, and transferred to a spinner cleaning means table by another transfer arm and cleaned. And store in cassette after washing. A chuck table or a transfer arm of an appropriate size adapted to the outer diameter size of the wafer is selectively disposed (see Patent Document 1).

JP, 2011-159823, A

  In the above processing apparatus, when changing the object to be processed to a wafer of another size, the means involved in holding and transporting the wafer, such as a chuck table or transport arm, corresponds to the one corresponding to the new wafer size. change. If a chuck table or a transfer arm not compatible with the wafer size is used, an error may occur during processing or transfer. However, in the conventional processing apparatus, the operator may not recognize a change leak or erroneous attachment of the chuck table etc., and may notice an error after actually driving the processing apparatus.

  The present invention has been made in view of such problems, and provides a processing apparatus capable of preventing a change leakage of a means for holding a workpiece and erroneous attachment when changing the outer diameter size of the workpiece. The purpose is

  The present invention drives a holding device for holding a workpiece, a processing device for processing the workpiece held by the holding device, a transport device for holding and transporting the workpiece, and a processing device. Processing apparatus comprising: input means for inputting an operation command for the purpose; display means for displaying information input from the input means; and control means, wherein the holding means is an outer diameter of the workpiece And the chuck table is configured to be attachable to and detachable from the workpiece according to the outer diameter of the workpiece, and at least the chuck table is set for each outer diameter size of the workpiece. The display unit's size change setting screen for setting the change of the processing apparatus according to the outer diameter size of the workpiece is set for each outer diameter of the workpiece. And the color is displayed.

  According to the above processing apparatus, the chuck table to be attached / detached and changed according to the outer diameter size of the workpiece is colored in the color set for each outer diameter of the workpiece, and the size change setting screen of the display means Also, the color set for each outer diameter of the workpiece is displayed. Therefore, when the chuck table incompatible with the outer diameter size of the workpiece is disposed, the operator who operates the processing apparatus can visually appeal and intuitively prompt awareness, and the change of the chuck table or the leakage of the chuck table It is possible to prevent problems such as erroneous mounting.

  As described above, according to the processing apparatus of the present invention, when changing the outer diameter size of the object to be processed, it is possible to prevent the leakage of change of the means for holding the object to be processed and erroneous mounting.

It is a perspective view showing the processing device of this embodiment. It is a perspective view which shows the inside of the processing apparatus of this Embodiment. It is a perspective view which shows the chuck table of a processing apparatus, (A) is a chuck table for small diameter wafers, (B) shows the chuck table for large diameter wafers. It is a top view which shows the conveyance arm of a processing apparatus, (A) shows the conveyance arm for small diameter wafers, (B) shows the conveyance arm for large diameter wafers. It is a figure which shows the control structure of a processing apparatus. It is a figure which shows an example of the screen display of the operation panel of a processing apparatus.

  Hereinafter, the present embodiment will be described with reference to the attached drawings. FIG. 1 is a perspective view of the processing apparatus of the present embodiment, and FIG. 2 is a perspective view showing the inside of the processing apparatus. In addition, the processing apparatus demonstrated below is an example, and is not limited to this structure.

  The processing apparatus 10 shown in FIG. 1 performs cutting and cleaning on a wafer W which is a workpiece. A grid-like planned dividing line is formed on the surface of the wafer W, and a device is formed in each area divided by the planned dividing line. The wafer W is accommodated in the cassette 11 in a state supported by the ring frame F via a dicing tape T attached to the back surface (hereinafter, this state is referred to as a wafer unit U). U is pulled out and carried into the processing device 10. A plurality of wafer units U can be accommodated in the cassette 11.

  As shown in FIG. 1, the processing apparatus 10 includes a base 12 and a cabinet 13. In FIG. 1, the front-rear direction of the processing apparatus 10 is represented as an X-axis direction, the left-right direction as a Y-axis direction, and the up-down direction as a Z-axis direction. The base 12 is covered with the cabinet 13 at the rear in the X-axis direction, and on the front side in the X-axis direction of the base 12 not covered by the cabinet 13, the cassette installation area E1 and the loading / unloading area E2 It has a region E3. Further, on the rear side covered by the cabinet 13, there is a processing area E4 adjacent to the loading / unloading area E2 in the X-axis direction (see FIG. 2). The center of the upper surface of the base 12 is opened so as to extend from the loading / unloading area E2 toward the processing area E4, and this opening is a movable plate 15 movable with the chuck table 14 and a bellows-like waterproof cover 16 It is covered. In FIG. 2, the moving plate 15 and the waterproof cover 16 are not shown.

  An elevating stage 17 on which the cassette 11 is mounted is provided in the cassette installation area E1 located at one end in the Y-axis direction. The elevating stage 17 is movable up and down in the Z-axis direction. When the wafer unit U is pulled out of the cassette 11 during processing, or when the wafer unit U is accommodated in the cassette 11 after processing, the elevating stage 17 is operated to operate the cassette Set 11 to the appropriate height position.

  A cleaning unit 18 is provided in a cleaning area E3 located on the opposite side of the loading / unloading area E2 in the Y-axis direction to the cassette installation area E1. The cleaning means 18 has a spinner table 20 capable of holding the wafer unit U in a cylindrical cleaning space 19 opened on the upper surface of the base 12. The spinner table 20 has a holding surface 21 capable of exerting a negative pressure from a suction source (not shown), and four clamps 22 are provided around the holding surface 21. The wafer W can be suctioned and held on the holding surface 21 with the dicing tape T interposed therebetween, and the ring frame F around the wafer W can be held and fixed by the respective clamps 22. The spinner table 20 is rotatable about an axis in the Z-axis direction.

  The spinner table 20 can move up and down in the Z-axis direction in the cleaning space 19. The position of the spinner table 20 shown in FIG. 1 is a delivery position in which the holding surface 21 has risen to near the upper surface of the base 12, and the spinner table 20 can move downward in the cleaning space 19 from the delivery position. In the cleaning space 19, a cleaning nozzle (not shown) and an air nozzle (not shown) are provided. The cleaning nozzle ejects cleaning water toward the wafer W held by the holding surface 21, and the air nozzle blows dry air toward the wafer W held by the holding surface 21.

  Above the base 12, transfer means 30 for transferring the wafer unit U among the cassette installation area E1, the loading / unloading area E2, and the cleaning area E3 is provided. The transfer means 30 has a first transfer arm 31 and a second transfer arm 41, and the first transfer arm 31 and the second transfer arm 41 are respectively moved in the Y-axis direction by a moving mechanism provided on the front of the cabinet 13. It is moved in the Z-axis direction. The first transfer arm 31 holds a work (ring frame F) in a state in which contamination (cutting waste) generated by cutting is not attached, as in the wafer unit U before processing and the wafer unit U after cleaning. Transport. The second transport arm 32 holds and transports a work (ring frame F) in a state in which contamination (cutting waste) generated by cutting adheres, as in the wafer unit U before cleaning after processing. It is.

  The moving mechanism for moving the first transfer arm 31 has a pair of upper and lower Y-axis guides 32 and a ball screw 33 extending in the Y-axis direction, and the ball screw 33 is centered on the axis in the Y-axis direction by a motor 34 provided at the end. It is rotatable. The slider 35 is slidably supported in the Y-axis direction with respect to the Y-axis guide 32, and has a nut (not shown) with which the ball screw 33 is screwed. When the ball screw 33 is rotated by the motor 34, the slider 35 moves in the Y-axis direction.

  The first transfer arm 31 is attached to the lower end of the slider 35 so as to be capable of moving up and down in the Z-axis direction via an elevating mechanism such as an air cylinder, and has a bending arm 36, a bracket 37, a holding pad 38 and a drawing portion 39. . The bending arm 36 has an L-shaped configuration including an extending portion in the Z-axis direction connected to the slider 35 via an elevating mechanism, and an extending portion in the X-axis direction bent with respect to the extending portion. Have. The bracket 37 has an H-shaped shape combining an extending portion in the X-axis direction and a pair of extending portions in the Y-axis direction, and is attached to the lower portion of the bending arm 36. A total of four holding pads 38 are attached to the four ends of the bracket 37. Each holding pad 38 can suction and hold the ring frame F of the wafer unit U by suction from a suction source (not shown). The lead-out portion 39 is provided with a clamp capable of gripping the outer peripheral edge portion of the ring frame F of the wafer unit U at the tip of a plate which protrudes from the bending arm 36 in the Y-axis direction.

  The moving mechanism for moving the second transfer arm 41 has a pair of upper and lower Y-axis guides 42 and a ball screw 43 extending in the Y-axis direction, and the ball screw 43 is centered on the axis in the Y-axis direction by a motor 44 provided at the end. It is rotatable. The slider 45 is slidably supported in the Y-axis direction with respect to the Y-axis guide 42, and has a nut (not shown) with which the ball screw 43 is screwed. When the ball screw 43 is rotated by the motor 44, the slider 45 moves in the Y-axis direction.

  The second transfer arm 41 is attached to the lower end of the slider 45 so as to be able to move up and down in the Z-axis direction via an elevating mechanism such as an air cylinder, and the bending arm 46, the bracket 47, the holding pad 48 and the cover portion 49. Have. The bending arm 46 has an L-shaped configuration including an extending portion in the Z-axis direction connected to the slider 45 via the elevating mechanism, and an extending portion in the Y-axis direction bent with respect to the extending portion. Have. A cover 49 is attached to the lower part of the bending arm 46. The cover 49 has a circular shape that can close the opening of the cleaning space 19 formed in the base 12. The bracket 47 is supported on the lower surface side of the cover 49. The bracket 47 has an H-like shape combining an extending portion in the X-axis direction and a pair of extending portions in the Y-axis direction, and a total of four holding pads 48 are attached to four ends of the bracket 47 It is done. Each holding pad 48 can suction and hold the ring frame F of the wafer unit U by a suction force from a suction source (not shown).

  Further, in the loading and unloading area E2, a pair of centering guides 40 extending in the Y-axis direction are provided. Each centering guide 40 has a support surface capable of supporting the ring frame F of the wafer unit U from the lower side, and an upright wall projecting upward from the support surface, and the ring frame is formed on the support surface of the pair of centering guides 40 In the state where F is mounted, the outer peripheral portion of the ring frame F is sandwiched by the standing wall portion, thereby positioning the wafer unit U in the X-axis direction.

  As shown in FIG. 2, on the base 12 (the area covered with the movable plate 15 and the waterproof cover 16 shown in FIG. 1), the chuck table 14 extends in the X-axis direction from the loading / unloading area E2 to the processing area E4. A cutting feed means 50 for cutting feed is provided. The cutting and feeding means 50 has a pair of X-axis guides 51 disposed on the base 12 and extending in the X-axis direction, and a ball screw 52 provided between the pair of X-axis guides 51. It is rotatable about an axis in the X-axis direction by a motor 53 provided in. The X-axis table 54 is supported slidably in the X-axis direction with respect to the X-axis guide 51, and has a nut (not shown) with which the ball screw 52 is screwed. When the ball screw 52 is rotated by the motor 53, the X-axis table 54 moves in the X-axis direction.

  A chuck table 14 (see FIG. 1) is rotatably supported about the Z-axis at the top of the X-axis table 54. The chuck table 14 is attachable to and detachable from the X-axis table 54. The chuck table 14 has a holding surface 55 (see FIG. 1) formed of a porous ceramic material on the upper surface side, and can apply negative pressure to the holding surface 55 by a suction source (not shown). The negative pressure causes the wafer W to be held by suction on the holding surface 55 with the dicing tape T interposed therebetween. Four clamps 56 are provided around the chuck table 14, and each clamp 56 clamps and fixes the ring frame F around the wafer W.

  On the upper surface of the base 12, a gate-shaped column 57 erected so as to straddle the moving path of the chuck table 14 and the X-axis table 54 in the processing area E4 is provided. The column 57 is provided with an index feeding means 60 for index feeding the cutting means 70 in the Y axis direction, and a cut feed means 61 for cutting and feeding the cutting means 70 in the Z axis direction. The index feeding means 60 has a pair of Y-axis guides 62 extending in the Y-axis direction disposed on the front of the column 57, and a total of two Y-axis tables 63 slidably supported by the respective Y-axis guides 62. ing. The cutting and feeding means 61 includes a pair of Z-axis guides 64 extending in the Z-axis direction disposed on each Y-axis table 63 and a total of two Z-axis tables 65 slidably supported by each Z-axis guide 64. Have.

  At the lower part of each Z-axis table 65, one cutting means 70 for cutting the wafer W is provided. Nuts (not shown) are formed on the back sides of the Y-axis tables 63 and the Z-axis tables 65, respectively, and ball screws 66 and 67 are screwed into these nuts. A motor 68 is connected to one end of the ball screw 66, and a motor 69 is connected to one end of the ball screw 67. The Y-axis table 63 is moved along the Y-axis guide 62 in the Y-axis direction by the ball screw 66 being rotationally driven by the motor 68, and the Z-axis table is rotated by the ball screw 67 by the motor 69. 65 is moved along the Z-axis guide 64 in the Z-axis direction. That is, by driving the motor 68 and the motor 69, each cutting means 70 is moved in the Y axis direction and the Z axis direction.

  Each cutting means 70 is configured by mounting a cutting blade on a spindle that rotates about an axis in the Y-axis direction, and cutting the wafer W held by the chuck table 14 while cutting the cutting blade. Make a cut. Movement of the chuck table 14 in the X axis direction by the cutting feed means 50 (cutting feed), movement of the Y axis table 63 by the index feeding means 60 in the Y axis direction (index feeding), Z axis table 65 by the cutting feed means 61 By appropriately performing movement (cutting feed) in the Z-axis direction, cutting along the planned dividing line on the surface of the wafer W can be performed.

  Returning to FIG. 1, a touch panel type operation panel 71 is installed on the outer surface of the processing device 10. The operation panel 71 doubles as an input unit for inputting an operation command for driving the processing device 10 and a display unit for displaying the input information and displaying the progress of processing and the like.

  As shown in FIGS. 5 and 6, the display screen of the operation panel 71 has a setting screen display area 72. A plurality of setting screens categorized according to the operation content are prepared, and when the operator inputs an operation command, the corresponding setting screen is read out and displayed in the setting screen display area 72. The setting screen displayed in the setting screen display area 72 is configured of a button icon which can be selected and operated, an input area where numerical values can be input, and the like.

  The processing apparatus 10 can process wafers of different outer diameter sizes. When changing the outer diameter size of the wafer, the size change setting screen 73 is displayed in the setting screen display area 72 of the operation panel 71 in order to set the change in the processing apparatus 10. An example of the size change setting screen 73 is shown in FIG. Although the peripheral edge of the size change setting screen 73 is virtually shown by a dashed dotted line in FIG. 6, the dashed dotted line is not actually displayed on the setting screen display area 72.

  The size change setting screen 73 includes a table size setting unit 74 that issues a size change command of the chuck table 14. In the table size setting unit 74, a first display unit 74a that displays the size of the currently selected chuck table 14 and a second display unit 74b that allows the new chuck table 14 size to be displayed as a pull-down menu. And are included. When the size of the chuck table 14 selected by the second display unit 74 b is determined, the display on the first display unit 74 a is switched to the changed value, and the size change command of the chuck table 14 is accepted. The size change setting screen 73 includes setting items other than the table size setting unit 74, operation buttons, and the like, and settings other than the size change of the chuck table 14 can be executed according to the change of the wafer size. The explanation is omitted.

  As shown in FIG. 5, the operation panel 71 is controlled by a control unit 80 that centrally controls each part of the processing apparatus 10. The control means 80 includes an input processing unit 81 which senses an operation on the operation panel 71 to input a signal, and a display control unit 82 which controls display of the operation panel 71.

  The control means 80 further includes a color storage unit 83. In the processing apparatus 10, the color is standardized and set for each outer diameter size of the wafer W, and this standardization information is stored in the color storage unit 83. For example, a management ID (ID1) is attached as standard data A to the first outer diameter size, and red is associated as a color representing the standard data A. The second outer diameter size is assigned management ID (ID 2) as standard data B, and blue is associated as a color representing standard data B. Standard data A and B and color information (hereinafter referred to as standard display color) associated with the standard data A and B are stored in the color storage unit 83 (see FIG. 6).

  An operation example of the processing apparatus 10 having the above configuration will be described. The cassette 11 accommodating a plurality of wafer units U is placed on the elevation stage 17, and the height of the cassette 11 is adjusted by the elevation of the elevation stage 17. The motor 34 of the transport means 30 is driven to move the first transport arm 31 toward the cassette installation area E1 in the Y-axis direction, and the drawer 39 grips the outer peripheral edge of the ring frame F. Subsequently, the first transfer arm 31 moves to the loading / unloading area E2 side in the Y-axis direction, and the wafer unit U gripped by the drawer 39 is pulled out of the cassette 11 into the loading / unloading area E2.

  The ring frame F of the wafer unit U pulled out of the cassette 11 is placed on the pair of centering guides 40, and the gripping of the wafer unit U by the drawer portion 39 is released. The wafer unit U is positioned in the X-axis direction by synchronously moving the pair of centering guides 40 toward each other in the X-axis direction and sandwiching the outer peripheral edge of the ring frame F with the upright wall. Next, the first transfer arm 31 is positioned above the positioned wafer unit U, and the first transfer arm 31 is lowered while applying suction to the four holding pads 38. Each holding pad 38 is attracted to the upper surface of the ring frame F, and the first transfer arm 31 holds the wafer unit U. When delivery of the wafer unit U to the first transfer arm 31 is completed, the pair of centering guides 40 move in the X axis direction in the separating direction.

  At this point in time, the chuck table 14 aligns the center of the holding surface 55 with the center of the wafer W, stands by in the loading / unloading area E2, and is in a state where a suction force is applied to the holding surface 55. When the first transfer arm 31 holding the wafer unit U is lowered, the wafer W contacts the holding surface 55 of the chuck table 14 via the dicing tape T and is held by suction. Further, the ring frame F is held and fixed by four clamps 56 provided around the holding surface 55. When the delivery of the wafer unit U to the chuck table 14 is completed, the suction of the holding pad 38 is released, and the first transfer arm 31 is retracted and moved upward.

  Subsequently, as shown in FIG. 2, the motor 53 of the cutting and feeding means 50 is driven to convey the chuck table 14 supported by the X-axis table 54 from the loading / unloading area E2 to the processing area E4. In the processing area E4, the cutting means 70 cuts the wafer W along the planned dividing line. In cutting, the cutting blade of the cutting means 70 is aligned with the planned dividing line of the cutting object, and the chuck table 14 is moved in the X-axis direction by the cutting feed means 50 while cutting the cutting edge of the rotating cutting blade into the wafer W. Cutting is performed by cutting feed. When cutting of one line is completed, the cutting feed means 61 is operated to pull up the cutting means 70, and then the cutting means 70 is moved in the Y-axis direction by the index feeding means 60 to cut the next cutting blade Align and cut in the same way. When cutting of all planned dividing lines arranged in the Y-axis direction is completed, the chuck table 14 is rotated 90 degrees so that the uncut planned lines are arranged in the Y-axis direction, and the uncut planned lines are the same. Cut into The cutting process by the cutting means 70 is a full cut in which the cutting blade is penetrated completely in the thickness direction of the wafer W and a half cut in which the groove is formed by cutting the surface of the wafer W halfway to the thickness direction It may be any of groove formation processing).

  When cutting in the processing area E4 is completed, the motor 53 of the cutting and feeding means 50 is driven to return the chuck table 14 supported by the X-axis table 54 to the loading / unloading area E2. Then, the second transfer arm 41 is positioned above the loading / unloading area E2, and the brackets 47 are lowered while attracting force is applied to the four holding pads 48, and the holding pads 48 are adsorbed on the upper surface of the ring frame F. By releasing the suction force acting on the holding surface 55 and releasing the clamping of the ring frame F by the clamp 56, the holding of the wafer unit U by the chuck table 14 is released, and the second transfer arm 41 releases the wafer unit U. Switch to the state of suction holding.

  After holding the wafer unit U by the second transfer arm 41, the motor 44 of the transfer means 30 is driven to move the second transfer arm 41 from the loading / unloading area E2 to the cleaning area E3 in the Y-axis direction, and the wafer unit U is moved. It is located above the cleaning means 18. At this time, the spinner table 20 is located at the upper delivery position (see FIG. 1) in the cleaning space 19, and a suction force is applied to the holding surface 21 of the spinner table 20. Then, when the second transfer arm 41 holding the wafer unit U is lowered, the wafer W is held in contact with the holding surface 21 of the spinner table 20 via the dicing tape T and held by suction. Further, the ring frame F is clamped and fixed by four clamps 22 provided around the spinner table 20. When delivery of the wafer unit U to the spinner table 20 is completed, the suction of the holding pad 48 is released. At this time, the opening of the cleaning space 19 is closed by the cover portion 49 provided on the upper portion of the bracket 47, and the second transfer arm 41 maintains the lowered state even after delivery of the wafer unit U to the spinner table 20. The cover 49 continues to close the opening of the cleaning space 19.

  Subsequently, the spinner table 20 is lowered in the cleaning space 19, and while rotating the spinner table 20, cleaning water is sprayed from the cleaning nozzle (not shown) toward the wafer W to clean the wafer W. By this cleaning, chips and the like generated in the cutting process are washed away from the wafer W. After cleaning with cleaning water, dry air is blown from an air nozzle (not shown) to dry the wafer W. Since the opening of the cleaning space 19 is closed by the cover 49, scattering of the cleaning liquid to the outside of the cleaning space 19 during cleaning can be prevented.

  When the cleaning and drying of the wafer W are completed in the cleaning space 19, the spinner table 20 is raised to the delivery position (see FIG. 1), and the second transfer arm 41 is retracted upward from the cleaning space 19. Then, the first transfer arm 31 is moved to the cleaning space 19 to apply suction force to each holding pad 38 so that each holding pad 38 is adsorbed on the upper surface of the ring frame F of the wafer unit U. By releasing the suction force acting on the holding surface 21 of the spinner table 20 and releasing the clamping by the clamp 22, the holding of the wafer unit U is transferred from the spinner table 20 to the first transfer arm 31.

  Subsequently, the first transfer arm 31 holding the wafer unit U is pulled up and moved from the cleaning area E3 to the loading / unloading area E2. In the loading / unloading area E2, the pair of centering guides 40 stands by at an interval at which the wafer units U can be placed, and the first transfer arm 31 is lowered to place the wafer units U on the centering guides 40 for centering. The guide 40 positions the wafer unit U in the X-axis direction.

  Finally, by moving the first transfer arm 31 toward the cassette installation area E1 while holding the ring frame F by the drawer 39, the wafer unit U in which the wafer W has been completely cut and cleaned is accommodated in the cassette 11. Be done.

  The above-described series of operations completes the processing of the single wafer W by the processing apparatus 10. In the processing apparatus 10, it is possible to simultaneously perform the cutting of the wafer W in the processing area E4 and the cleaning of another wafer W in the cleaning area E3.

  As described above, in the processing apparatus 10, it is possible to process a plurality of types of wafers W having different outer diameter sizes. When changing the outer diameter of the wafer W to be processed, the means for holding and transporting the wafer W is changed to one corresponding to the outer diameter of the wafer W after the change.

  Specifically, a plurality of types of chuck tables 14 for processing for holding the wafer W at the time of cutting are prepared with different outer diameter sizes, and chuck tables of appropriate sizes corresponding to the outer diameter size of the wafer W to be processed. 14 are mounted on the X-axis table 54 (FIG. 2). The chuck table 14A shown in FIG. 3A and the chuck table 14B shown in FIG. 3B have different diameters, and the outer diameter of the chuck table 14B is larger than the outer diameter of the chuck table 14A.

  The chuck table 14A is for holding the wafer W of the outer diameter size of the standard data A (see FIG. 5) stored in the color storage unit 83 of the control means 80, and the chuck table 14B is a color storage unit 83. The wafer W of the outside diameter size of the standard data B (refer to FIG. 5) stored in the above is to be held. The chuck table 14A and the chuck table 14B are colored in the standard display color associated with the standard data A and B of each wafer W to be held. That is, red which is the standard display color of the standard data A is colored in the chuck table 14A, and blue which is the standard display color of the standard data B is colored in the chuck table 14B.

  More specifically, as shown in FIGS. 3A and 3B, the small diameter chuck table 14A and the large diameter chuck table 14B respectively have disk-shaped base portions 58A and 58B. The base portions 58A and 58B have a circular recess in which the upper surface side is open at a central portion, and the holding surfaces 55A and 55B are provided in the circular recess. Then, the base portion 58A is colored in red, which is the standard display color of the standard data A, and the base portion 58B is colored in blue, which is the standard display color of the standard data A. 3 (A) and 3 (B), the difference in color between the base portion 58A and the base portion 58B is expressed by hatching and black and white for convenience of drawing.

  Which part of the chuck table 14 is colored can be arbitrarily selected. Although FIG. 3A and FIG. 3B show the case where the colors of the base portions 58A and 58B of the chuck tables 14A and 14B are made different, the colors of the holding surfaces 55A and 55B may be made different. .

  When changing the size of the chuck table 14, the operator causes the size change setting screen 73 (FIG. 6) to be displayed in the setting screen display area 72 of the operation panel 71, and inputs the changed table size into the table size setting unit 74. Decide. Then, the control means 80 (FIG. 5) reads the information stored in the color storage unit 83 according to the input of the operation command to the input processing unit 81, and the standard of the wafer W corresponding to the chuck table 14 after resizing. The standard display color matching the data is selected, and the display of the standard display color is performed on the operation panel 71.

  In the present embodiment, as shown in FIG. 6, the setting screen display area 72 of the operation panel 71 is the display area of the standard display color, and the background color of the size change setting screen 73 is colored in the standard display color. Ru. For example, when the use of the chuck table 14A (FIG. 3A) corresponding to the standard data A (see FIG. 6) is selected, the display control unit 82 of the control means 80 sets the background color of the size change setting screen 73 Make it red and display the screen. When the use of the chuck table 14B (FIG. 3B) corresponding to the standard data B (see FIG. 6) is selected, the display control unit 82 sets the background color of the size change setting screen 73 to blue and displays the screen. Do. By displaying the standard display color on the operation panel 71, the operator can intuitively recognize that the resizing operation of the chuck table 14 has been performed.

  Note that which part of the operation panel 71 is to be colored can be arbitrarily selected. Unlike the mode shown in FIG. 6, the standard display color may be displayed in an area other than the setting screen display area 72. However, since the display of the standard display color is for notifying the change of the outer diameter size of the wafer W, the display area of the standard display color includes at least the size change setting screen 73.

  When the chuck table 14 having a size not corresponding to the size of the wafer W to be processed is mounted, the standard display color displayed on the operation panel 71 does not match the standard display color colored on the chuck table 14 . For example, while the standard display color displayed on the operation panel 71 is blue, it is assumed that the small-diameter chuck table 14A (FIG. 3 (A)) attached to the processing device 10 is colored in red. The diameter of the chuck table 14A with respect to the wafer W to be held is insufficient, and an error may occur when holding or transporting. Thus, when the chuck table 14 is incompatible with the processing conditions, the operator can easily recognize the color of the chuck table 14 and recognize it.

  As described above, it is possible to intuitively identify as the color difference whether or not the chuck table 14 fitted to the selected processing condition (wafer outer diameter size) is attached. It is possible to prevent a problem such as erroneous mounting of the chuck table 14 which does not conform to the processing conditions.

  It is possible to color a standard display color also to components other than the chuck table 14. As an example, the case where the standard display color is colored in the first transfer arm 31 and the second transfer arm 41 will be described with reference to FIG. The brackets 37 and 47 in the first transfer arm 31 and the second transfer arm 41 have substantially the same configuration, and the brackets 37 and 47 are collectively shown in FIG.

  The first transfer arm 31 and the second transfer arm 41 can hold wafers W having different diameters by changing the distance between the holding pad 38 and the holding pad 48 according to the diameter of the wafer W to be transferred. Specifically, as shown in FIG. 4, the bracket 37 of the first transfer arm 31 and the bracket 47 of the second transfer arm 41 are respectively connected to the connection plates 37a and 47a extending in the X-axis direction and the connection plates 37a and 47a. A pair of carrier plates 37b and 47b slidable in the X-axis direction is provided, and holding pads 38 and 48 are provided near both ends of each carrier plate 37b and 47b. By sliding the transfer plates 37b and 47b on the connection plates 37a and 47a, the distance between the holding pads 38 and 48 changes, and wafer units U of different diameters can be held. FIG. 4A shows a small diameter setting for holding a small diameter wafer unit US, and FIG. 4B shows a large diameter setting for holding a large diameter wafer unit UL.

  Coloring indicator portions 37c and 47c are formed on the connection plates 37a and 47a at positions overlapping with the transfer plates 37b and 47b at the time of setting for small diameter, and color indicator portions at positions overlapping the transfer plates 37b and 47b at setting for large diameter 37d and 47d are formed. In the coloring indicator portions 37c and 47c, the standard display color corresponding to the wafer W (wafer unit US) held in the small diameter setting is colored, and in the coloring indicator portions 37d and 47d, the wafer W held in the large diameter setting The standard display color corresponding to (wafer unit UL) is colored. For example, red which is the standard display color of the standard data A (see FIG. 5) is colored in the color indicator portions 37c and 47c, and blue which is the standard display color of the standard data B (see FIG. 5) is the color indicator portion 37d and 47d To color.

  When the setting for the small diameter is selected by the first transport arm 31 and the second transport arm 41, as shown in FIG. 4A, the transport plates 37b and 47b are slid to positions overlapping the coloring indicators 37c and 47c. As a result, all the holding pads 38 and 48 are arranged to overlap the ring frame F of the small diameter wafer unit US, and the wafer unit US can be held by suction. When setting the large diameter by the first transfer arm 31 and the second transfer arm 41, as shown in FIG. 4B, the transfer plates 37b and 47b are slid to the positions overlapping the coloring indicators 37d and 47d. . As a result, all the holding pads 38 and 48 are arranged to overlap the ring frame F of the large diameter wafer unit UL, and the wafer unit UL can be held by suction.

  As described above, in the first transfer arm 31 and the second transfer arm 41, the coloring indicator portions 37c and 47c and the coloring indicator portions 37d and 47d, in which the standard display color corresponding to the outer diameter size of the wafer W is colored, are used as indicators. , Change the position of the holding pads 38, 48 according to the wafer size. The setting of the first transfer arm 31 and the second transfer arm 41 (the positions of the transfer plates 37 b and 47 b) for each outer diameter size of the wafer W can be intuitively identified as a color difference, and thus the setting does not match the wafer size Can be prevented.

  That is, coloring in the holding means and the transfer means in the present embodiment means a plurality of pieces exchanged according to the outer diameter of the wafer W as in the chuck tables 14A and 14B of FIGS. 3 (A) and 3 (B). 4A and 4B, a plurality of specific members whose setting is changed according to the outer diameter of the wafer W as shown in the brackets 37 and 47 of FIGS. 4A and 4B. It includes any of the embodiments in which colored portions of color are formed.

  For example, as a modified example of the first transfer arm 31 and the second transfer arm 41, a plurality of brackets 37 and 47 in which the distance between the holding pad 38 and the holding pad 48 is fixed are prepared and the outside of the wafer W is conveyed. Depending on the difference in diameter, it is also possible to use a configuration in which the entire brackets 37, 47 are replaced. In this case, like the chuck tables 14A and 14B in FIGS. 3A and 3B, the outer diameters of the wafer W to be transferred correspond to the plurality of types of brackets 37 and 47 to be replaced. Color the standard display color one by one.

  In the above, an example of coloring the standard display color to the chuck table 14 and the transfer arms 31 and 41 among the constituent members of the processing apparatus 10 has been described, but further coloring the standard display color to the spinner table 20 and the centering guide 40 Is also possible. The spinner table 20 may be colored in the base portion that supports the holding surface 21 as in the chuck table 14, or may be colored in the holding surface 21. About the centering guide 40, when changing attachment or detachment according to the outside diameter size of the wafer W to position, corresponding standard display color is colored to each centering guide 40. FIG.

  As described above, in the processing apparatus 10 of the present embodiment, the color is standardized and set for each outer diameter size of the wafer W, and the standardized color (standard display color) is determined according to the outer diameter size of the wafer W The chuck table 14 to be attached / detached and the transfer arms 31 and 41 subjected to the setting change are colored, and the color is also displayed on the size change setting screen 73 of the operation panel 71. As a result, the operator of the processing apparatus 10 complains about whether the chuck table 14 and the transfer arms 31 and 41 currently attached are suitable for holding and transferring the wafer W to be processed from now. Intuitive awareness can be promoted, and errors in processing and transportation can be prevented in advance.

  Although the case of processing the wafer W of two types (standard data A and standard data B shown in FIG. 6) having different outer diameter sizes has been described in the form of the present embodiment, the outside of the wafer processed by the processing apparatus is described. The diameter size may be three or more. In this case, the standard display color is set for each of the outer diameter sizes of three or more types of wafers, and the information is stored in the color storage unit 83 of the control unit 80. Further, the chuck table 14 and the transfer arms 31 and 41 corresponding to the outer diameter size of three or more types of wafers are prepared, and the corresponding standard display colors are colored.

  The operation panel 71 of the processing apparatus 10 according to the present embodiment functions as both an input unit for inputting an operation command and a display unit for displaying information, but the input unit and the display unit may be provided separately. When the input unit and the display unit are provided separately, the size change setting screen displayed on the display unit is a display-only screen that displays the setting content and the like input from the input unit.

  When light emitting means (such as LED lamps) are provided on the outer surface of the processing apparatus 10 separately from the operation panel 71 and the standard display color set for each outer diameter size of the wafer is displayed on the size change setting screen 73 of the operation panel 71 Alternatively, the light emitting means may emit light in the same standard display color. This makes it easy for the operator at a position where it is difficult to visually recognize the size change setting screen 73 of the operation panel 71 to recognize the standard display color.

  Furthermore, light emitting means such as an LED lamp is provided on the holding means side which is changed depending on the outer diameter size of the wafer like the first transfer arm 31 and the second transfer arm 41, and the light emitting means emits light in the corresponding standard display color. It is also possible. That is, the coloring of the holding means may be realized by the light emission of the light emitting means.

  The processing apparatus 10 according to the present embodiment performs cutting and cleaning on the wafer W which is a workpiece, but the processing content on the workpiece is not limited to cutting and cleaning. For example, a chuck table for holding a wafer is widely used in various processes such as grinding, polishing, and laser processing, and application to an apparatus for performing processes other than such cutting is also possible.

  The material of the workpiece, the type of device formed on the workpiece, and the like are not limited. For example, various workpieces such as a semiconductor device wafer, an optical device wafer, a package substrate, a semiconductor substrate, an inorganic material substrate, an oxide wafer, a raw ceramic substrate, and a piezoelectric substrate may be used as a workpiece. As a semiconductor device wafer, a silicon wafer or a compound semiconductor wafer after device formation may be used. A sapphire wafer or a silicon carbide wafer after device formation may be used as the optical device wafer. Further, a CSP (Chip Size Package) substrate may be used as the package substrate, silicon, gallium arsenide or the like may be used as the semiconductor substrate, and sapphire, ceramics, glass or the like may be used as the inorganic material substrate. Furthermore, as the oxide wafer, lithium tantalate or lithium niobate after device formation or before device formation may be used.

  Moreover, although each embodiment of this invention was described, you may combine the said embodiment and modification with the whole or partial as another embodiment of this invention.

  Furthermore, the embodiments of the present invention are not limited to the above-described embodiments and modifications, and various changes, substitutions, and modifications may be made without departing from the scope of the technical idea of the present invention. Furthermore, if technical progress of the technology or another technology derived therefrom can realize the technical concept of the present invention in another way, it may be implemented using that method. Therefore, the claims cover all the embodiments that can be included within the scope of the technical idea of the present invention.

  As described above, according to the processing apparatus of the present invention, when changing the size of the outer diameter of the workpiece, it is possible to prevent a change in the means for holding the workpiece and incorrect mounting, and at the time of driving the processing apparatus. It can contribute to error reduction and productivity improvement.

10 processing apparatus 11 cassette 12 base 13 cabinet 14 chuck table (holding means)
18 cleaning means 20 spinner table 30 transport means 31 first transport arm 37 bracket 37c coloring index section 37d coloring index section 40 centering guide 41 second transport arm 47 bracket 47c coloring index section 47d coloring index section 50 cutting feed means 54 X axis table 55 holding surface 58A base portion 58B base portion 60 index feeding means 61 cutting feed means 70 cutting means (processing means)
71 Operation panel (input means, display means)
72 setting screen display area 73 size change setting screen 74 table size setting unit 80 control means E1 cassette installation area E2 loading and unloading area E3 cleaning area E4 processing area
F ring frame U wafer unit W wafer (workpiece)

Claims (1)

A holding unit for holding a workpiece, a processing unit for processing the workpiece held by the holding unit, a transport unit for holding and transporting the workpiece, and an operation command for driving the processing apparatus A processing unit comprising: input means for inputting the information; display means for displaying the information inputted from the input means; and control means,
The holding means includes a chuck table formed in accordance with the outer diameter of the workpiece, and the chuck table is configured to be detachable and changeable in accordance with the outer diameter of the workpiece.
At least the chuck table is colored in a color set for each outer diameter size of the workpiece,
The color set for each outer diameter of the workpiece is displayed on the size change setting screen of the display means for setting the change of the processing device according to the outer diameter size of the workpiece. And a processing device characterized by