TWI883196B - Processing equipment - Google Patents

Abstract

[Topic] Provide a processing device that can automatically move a movable unit to a desired position during maintenance. [Solution] A processing device for processing a workpiece, comprising: a movable movable unit, an input unit, a display unit, and a control unit, wherein the control unit controls the movable unit, the input unit, and the display unit, and the control unit has a memory unit for storing the name and position information of maintenance, wherein the position information displays the position of the movable unit when performing maintenance, and the display unit displays a selection button for selecting maintenance. If the selection button is selected, the control unit moves the movable unit to the position indicated by the position information, and the name and position information of maintenance stored in the memory unit can be changed by operating the input unit.

Description

Processing equipment

The present invention relates to a processing device for processing a workpiece.

In the manufacturing process of component chips, a wafer with components such as IC (Integrated Circuit) and LSI (Large Scale Integration) can be formed in multiple areas divided by predetermined division lines (cutting streets) arranged in a grid. By dividing this wafer along the predetermined division lines, multiple component chips with components can be obtained. Component chips are installed in various electronic devices such as mobile phones and personal computers.

For example, a dicing device can be used to divide the wafer. The dicing device includes: a holding table that holds the workpiece; and a dicing unit that is equipped with a ring-shaped dicing blade for cutting the workpiece. The workpiece is cut and divided by rotating the dicing blade installed in the dicing unit and cutting into the workpiece.

Furthermore, in recent years, along with the miniaturization of electronic devices, thinner device chips are also required. Therefore, wafer thinning is sometimes performed before wafer division. Wafer thinning can be performed using a grinding device that grinds the workpiece with multiple grinding stones, a polishing device that grinds the workpiece with a polishing pad, etc.

The above-mentioned processing devices such as cutting devices, grinding devices, and polishing devices have a touch panel that functions as a user interface. The touch panel displays an operation screen for operating the processing device, and the operator inputs information such as processing conditions into the processing device by operating the touch panel (see Patent Document 1). [Known Technical Document] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2009-117776

[Problems to be solved by the invention] In the operation of a processing device, in addition to processing the workpiece, the processing device is also maintained. For example, the operation of each component of the processing device is inspected, cleaned, and parts are replaced at a predetermined frequency. In addition, when performing maintenance, the movable components (movable units) contained in the processing device must first be arranged at a predetermined position.

For example, an operator refers to the operation screen displayed on the touch panel and moves the movable unit to the predetermined maintenance position. At this time, due to human factors such as operation errors, the movable unit may move to a position different from the expected maintenance position. In this case, there is a concern that the movable unit may come into contact with other components and be damaged, or that maintenance may not be performed properly.

Therefore, a processing device may be equipped with a system that automatically performs maintenance that is performed particularly frequently. For example, an operation screen including a selection button for performing predetermined maintenance is displayed on a touch panel. Then, if the operator selects the selection button, a series of processes including the movement of the movable unit are automatically performed, and maintenance is performed. This makes it less likely that a malfunction caused by an operator's operation error will occur.

However, manufacturers of processing equipment generally select maintenance that is considered to be performed frequently, and only install a system for automatically performing this maintenance in the processing equipment. Therefore, when the user of the processing equipment performs independent maintenance that is not pre-registered in the processing equipment, the operator must individually perform the operation of moving the movable unit, which makes it easy to make an operation error.

The present invention is made in view of this problem, and its object is to provide a processing device that can automatically move a movable unit to a desired position during maintenance.

[Technical means for solving the problem] According to one aspect of the present invention, a processing device is provided, which processes a workpiece and has: a movable unit that can move; an input unit; a display unit; and a control unit that controls the movable unit, the input unit, and the display unit. The control unit has a memory unit that stores the name and position information of maintenance, and the position information displays the position of the movable unit when the maintenance is performed. The display unit displays a selection button for selecting the maintenance. When the selection button is selected, the control unit moves the movable unit to the position indicated by the position information. The name of the maintenance and the position information stored in the memory unit can be changed by operating the input unit.

In addition, preferably, when the memory unit does not store the name of the maintenance and the position information, the display unit displays an empty field as the selection button, and when the memory unit stores the name of the maintenance and the position information, the display unit displays a display field indicating the name of the maintenance as the selection button. Furthermore, preferably, the movable unit is a holding table for holding the workpiece or a processing unit for processing the workpiece.

[Effect of the invention] In a processing device of one aspect of the present invention, if a selection button for selecting maintenance is selected, the movable unit moves to the position indicated by the position information stored in the memory. Moreover, the position information stored in the memory becomes changeable by operating the input unit. Therefore, the user of the processing device can freely set the position of the movable unit during maintenance by operating the input unit. Thereby, even when performing maintenance that is not pre-registered in the processing device, the movable unit can be automatically moved to the position desired by the user.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. First, an example of the structure of a processing device of the present embodiment will be described. FIG. 1 is a three-dimensional diagram showing a processing device 2. The processing device 2 is a cutting device for cutting a workpiece 11. In addition, in FIG. 1 , the X-axis direction (processing feed direction, first horizontal direction, front-back direction) and the Y-axis direction (indexing feed direction, second horizontal direction, left-right direction) are mutually perpendicular directions. Furthermore, the Z-axis direction (vertical direction, up-down direction, height direction) is a direction perpendicular to the X-axis direction and the Y-axis direction.

The processing device 2 includes a base 4 that supports or accommodates the components of the processing device 2. A rectangular opening 4a is formed at a corner of the front side of the base 4, and a rectangular opening 4b having a long side along the X-axis direction is formed on the side of the opening 4a.

A cassette loading platform (cassette elevator) 6 is provided inside the opening 4a, and the cassette loading platform (cassette elevator) 6 carries a cassette 8 that can accommodate a plurality of workpieces 11. The cassette loading platform 6 has a lifting mechanism (not shown) and is lifted and lowered along the Z-axis direction by the lifting mechanism. In addition, the outline of the cassette 8 is represented by a two-point chain in FIG. 1 .

The cassette 8 contains a plurality of workpieces 11 to be processed by the processing device 2. For example, the workpiece 11 includes a disk-shaped wafer 13 made of a semiconductor material such as silicon. The wafer 13 is divided into a plurality of regions by a plurality of predetermined dividing lines (cutting paths) arranged in a grid-like manner in a mutually intersecting manner. In addition, components such as ICs and LSIs are formed on the front sides of the regions divided by the predetermined dividing lines. If the wafer 13 is cut and divided along the predetermined dividing lines by the processing device 2, a plurality of component chips each having a component can be obtained.

A circular adhesive film (dicing adhesive film) 15 made of resin or the like and having a diameter larger than that of the wafer 13 is adhered to the back side of the wafer 13. Furthermore, a ring-shaped frame 17 made of metal or the like is adhered to the outer periphery of the adhesive film 15. A circular opening having a diameter larger than that of the wafer 13 is provided in the center of the frame 17, and the wafer 13 is adhered to the center of the adhesive film 15 in a manner arranged inside the opening of the frame 17. Thus, the wafer 13 is supported by the frame 17 through the adhesive film 15. That is, the workpiece 11 shown in FIG. 1 is a frame unit including the wafer 13, the adhesive film 15, and the frame 17.

However, there is no limitation on the type, material, shape, structure, size, etc. of the object 11 processed by the processing device 2. For example, the object 11 may include a wafer 13 made of semiconductors other than silicon (GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, etc. Also, there is no limitation on the type, number, shape, structure, size, and arrangement of components formed on the wafer 13, and the wafer 13 may not have any components formed thereon.

Furthermore, the wafer 13 may not be supported by the frame 17, and the wafer 13 may not be attached with the adhesive film 15. Furthermore, the workpiece 11 may be a resin package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate.

A pair of detectors (sensors) 10 are provided inside the opening 4a, and the pair of detectors (sensors) 10 detect the workpiece 11 accommodated in the cartridge 8. For example, the detector 10 is a reflective photoelectric sensor having a light-emitting portion (light-emitting element) for irradiating light toward the side of the cartridge 8 and a light-receiving portion (light-receiving element) for receiving reflected light.

When the cassette 8 contains the workpiece 11, the light irradiated by the detector 10 is reflected by the side surface of the workpiece 11 (the side surface of the frame 17) and enters the detector 10. On the other hand, when the cassette 8 does not contain the workpiece 11, the light irradiated by the detector 10 is not reflected by the workpiece 11. Therefore, it can be determined whether the cassette 8 contains the workpiece 11 based on the amount of light received by the detector 10.

A ball screw type moving mechanism 12 and a dust and drip proof cover 14 covering a portion of the moving mechanism 12 are arranged inside the opening 4b. The moving mechanism 12 includes a moving stage 12a whose upper surface is exposed from the dust and drip proof cover 14, and moves the moving stage 12a along the X-axis direction.

A holding table (chuck table) 16 for holding the workpiece 11 is provided on the moving table 12a. The upper surface of the holding table 16 constitutes a holding surface 16a for holding the workpiece 11. The holding surface 16a is connected to a suction source (not shown) such as an ejector through a suction path (not shown) and a valve (not shown) formed inside the holding table 16. In addition, a plurality of clamps 18 for holding and fixing the workpiece 11 (frame 17) are provided around the holding table 16.

The moving mechanism 12 moves the holding table 16 and the moving table 12a in the X-axis direction (processing feed). In addition, the holding table 16 is connected to a rotation drive source (not shown) such as a motor, and the rotation drive source rotates the holding table 16 around a rotation axis substantially parallel to the Z-axis direction.

A pair of guide rails 20 are provided on the upper side of the opening 4b. The pair of guide rails 20 approach and separate from each other while maintaining a state roughly parallel to the Y-axis direction. The pair of guide rails 20 respectively have: a supporting surface that supports the lower surface side of the workpiece 11 (frame 17); and a side surface that is roughly perpendicular to the supporting surface and contacts the outer periphery of the workpiece 11 (frame 17). The pair of guide rails 20 clamp the workpiece 11 along the X-axis direction and perform alignment of the workpiece 11.

The door-shaped first supporting structure 22 is arranged above the base 4 so as to straddle the opening 4b. The slide rail 24 is fixed to the front surface side (the guide rail 20 side) of the first supporting structure 22 along the Y-axis direction. The transport unit (transport mechanism) 28 is connected to the slide rail 24 via the moving mechanism (lifting mechanism) 26.

The conveying unit 28 contacts the upper surface of the workpiece 11 (the upper surface of the frame 17) and attracts and holds the workpiece 11. The conveying unit 28 is raised and lowered by the moving mechanism 26 and moves in the Y-axis direction along the slide rail 24. The conveying unit 28 conveys the workpiece 11 between the cassette 8 and the guide rail 20 and between the guide rail 20 and the holding table 16.

A gripping portion (gripping mechanism) 28a for gripping the workpiece 11 is provided at the front end portion on the opening 4a side (cassette 8 side) of the conveying unit 28. The conveying unit 28 is moved along the Y-axis direction while the gripping portion 28a grips the end portion (end portion of the frame 17) of the workpiece 11 accommodated in the cassette 8, thereby extracting the workpiece 11 from the cassette 8 onto the pair of guide rails 20. Furthermore, the conveying unit 28 is moved along the Y-axis direction while the gripping portion 28a grips the workpiece 11 disposed on the pair of guide rails 20, thereby accommodating the workpiece 11 in the cassette 8.

Furthermore, the slide rail 30 is fixed to the front surface side of the first support structure 22 along the Y-axis direction. The transport unit (transport mechanism) 34 is connected to the slide rail 30 through the moving mechanism (elevating mechanism) 32. The transport unit 34 contacts the upper surface of the workpiece 11 (the upper surface of the frame 17) and attracts and holds the workpiece 11. In addition, the transport unit 34 is raised and lowered by the moving mechanism 32 and moves in the Y-axis direction along the slide rail 30. The transport unit 34 transports the workpiece 11 between the holding table 16 and the cleaning unit 50 and between the cleaning unit 50 and the guide rail 20.

The door-shaped second supporting structure 36 is arranged behind the first supporting structure 22 in a manner spanning the opening 4b. A pair of ball screw type moving mechanisms 38a and 38b are fixed to both side ends of the front surface side (first supporting structure 22 side) of the second supporting structure 36. In addition, a processing unit 40a is fixed to the lower part of the moving mechanism 38a, and a processing unit 40b is fixed to the lower part of the moving mechanism 38b. The processing units 40a and 40b are cutting units that cut the workpiece 11 (wafer 13) by means of an annular cutting blade 42.

The processing unit 40a is moved along the Y-axis direction and the Z-axis direction by the moving mechanism 38a, thereby adjusting the position of the processing unit 40a in the Y-axis direction and the Z-axis direction. Similarly, the processing unit 40b is moved along the Y-axis direction and the Z-axis direction by the moving mechanism 38b, thereby adjusting the position of the processing unit 40b in the Y-axis direction and the Z-axis direction.

The processing units 40a and 40b each have a cylindrical housing 44 (see FIG. 2 ), and the housing 44 accommodates a cylindrical spindle 46 (see FIG. 2 ). The spindle 46 is arranged along the Y-axis direction, and the front end (one end side) of the spindle 46 is exposed outside the housing 44. An annular cutting blade 42 is installed at the front end of the spindle 46, and a rotation drive source (not shown) such as a motor that rotates the spindle 46 is connected to the base end (the other end side) of the spindle 46.

The dicing blade 42 is a processing tool that cuts into the workpiece 11 (wafer 13) and cuts the workpiece 11. It is formed by fixing abrasive grains made of diamond, cubic boron nitride (cBN: cubic Boron Nitride), etc. with a binder. For example, as the dicing blade 42, an electrocast hub-type blade having a cutting edge formed by fixing abrasive grains with nickel plating, etc., or an annular washer-type blade having a cutting edge formed by fixing abrasive grains with a binder made of metal, ceramic, resin, etc. can be used. In addition, the materials of the abrasive grains and binder contained in the dicing blade are not limited, and are appropriately selected according to the material of the workpiece 11, the content of the cutting process, etc.

Imaging units (cameras) 48 are provided adjacent to the processing units 40a and 40b, respectively, for photographing the workpiece 11 held by the holding table 16. The images obtained by the imaging unit 48 can be used for aligning the workpiece 11 held by the holding table 16 with the processing units 40a and 40b.

For example, when processing the wafer 13, the wafer 13 is placed on the holding table 16 through the adhesive film 15, and the frame 17 is fixed by the clamp 18. In this state, if the negative pressure of the suction source acts on the holding surface 16a, the wafer 13 is sucked and held by the holding table 16 through the adhesive film 15. Then, while a liquid (cutting liquid) such as pure water is supplied to the wafer 13, the cutting blade 42 installed in the processing unit 40a or the processing unit 40b is rotated and cut into the wafer 13, thereby cutting the wafer 13.

In addition, FIG1 shows an example of a so-called facing dual spindle type cutting device in which the processing device 2 has two processing units 40a, 40b and a pair of cutting blades 42 are arranged in a manner facing each other. However, the number of processing units provided in the processing device 2 may also be one set.

A cleaning unit 50 is disposed on the side of the opening 4b opposite to the opening 4a. The cleaning unit 50 includes a rotating table 52 for holding the workpiece 11 in a cylindrical cleaning space. The rotating table 52 is connected to a rotation drive source (not shown) for rotating the rotating table 52 at a predetermined speed.

A nozzle 54 is disposed above the rotating table 52, and the nozzle 54 supplies a cleaning fluid (e.g., a mixed fluid of water and air) toward the workpiece 11 held by the rotating table 52. The workpiece 11 is cleaned by supplying the fluid from the nozzle 54 toward the workpiece 11 while the rotating table 52 holding the workpiece 11 is rotated.

After the processing by the processing units 40a and 40b, the workpiece 11 is transported to the cleaning unit 50 by the transport unit 34 and cleaned by the cleaning unit 50. Thereafter, the workpiece 11 is transported to the pair of guide rails 20 by the transport unit 34. Then, after the pair of guide rails 20 align the workpiece 11, the transport unit 28 holds the workpiece 11 with the holding portion 28a and stores the workpiece 11 in the cartridge 8.

A cover 56 is provided on the upper side of the base 4, and the cover 56 covers the components mounted on the base 4. In FIG. 1, the outline of the cover 56 is represented by a two-point chain line. In addition, the processing device 2 has: an input unit (input part, input device) 58, which is used to input information into the processing device 2; and a display unit (display part, display device) 60, which displays various information about the processing device 2. For example, a keyboard, a mouse, etc. can be used as the input unit 58, and various displays can be used as the display unit 60.

1 , a touch panel 62 may be provided on the side of the cover 56. In this case, the touch panel 62 functions as an interface for both the input unit 58 and the display unit 60. The operator can input information such as processing conditions into the processing device 2 by touch operation of the touch panel 62.

A notification unit (notification section) 64 for notifying the operator of predetermined information is provided on the upper surface side of the cover 56. For example, a warning light is provided as the notification unit 64, and the warning light lights up or flashes when an abnormality occurs in the processing device 2 to notify the operator of the abnormality. However, the notification unit 64 is not limited. For example, the notification unit 64 may also be a speaker that emits a sound (warning sound) notifying the abnormality when an abnormality occurs in the processing device 2. In addition, by making the display unit 60 display predetermined information, the display unit 60 can also function as the notification unit 64.

The components constituting the processing device 2 (the cassette mounting table 6, the detector 10, the moving mechanism 12, the holding table 16, the clamp 18, the guide rail 20, the moving mechanism 26, the conveying unit 28, the moving mechanism 32, the conveying unit 34, the moving mechanisms 38a, 38b, the processing units 40a, 40b, the imaging unit 48, the cleaning unit 50, the input unit 58, the display unit 60, the notification unit 64, etc.) are connected to the control unit (control part) 66. The control unit 66 controls the operation of each component of the processing device 2.

For example, the control unit 66 is composed of a computer, including: a processing unit that performs operations such as calculations required for the operation of the processing device 2; and a memory unit that stores various information (data, programs, etc.) used for the processing performed by the processing unit. The processing unit is composed of a processor such as a CPU (Central Processing Unit). In addition, the memory unit is composed of various memories that function as a main memory device, an auxiliary memory device, etc.

The workpieces 11 contained in the cassette 8 are transported one by one from the cassette 8 to the holding table 16 by the transport unit 28, and are processed by the processing units 40a and 40b. Furthermore, the processed workpieces 11 are transported to the cleaning unit 50 by the transport unit 34, and after being cleaned, are transported by the transport units 28 and 34, and are contained in the cassette 8.

Fig. 2 is a block diagram showing the control unit 66. In addition, in Fig. 2, in addition to illustrating the functional structure of the control unit 66, a part of the components of the processing device 2 connected to the control unit 66 (holding table 16, fixture 18, moving mechanism 38a, processing unit 40a, touch panel 62) are also illustrated.

The control unit 66 includes: a processing unit 68 that processes a signal (input signal) input from a component of the processing device 2 and generates a signal (control signal) for controlling the operation of the component of the processing device 2; and a memory unit 70 that stores information (data, program, etc.) used for processing performed by the processing unit 68.

The processing unit 40a is connected to the moving mechanism 38a. Specifically, a pair of Y-axis guide rails 80 arranged along the Y-axis direction are fixed on the front surface side of the second support structure 36. Then, the flat plate-shaped Y-axis moving plate 82 of the moving mechanism 38a is installed on the pair of Y-axis guide rails 80 along the pair of Y-axis guide rails 80 and can slide in the Y-axis direction.

A nut portion (not shown) is provided on the rear surface (back side) of the Y-axis moving plate 82, and a Y-axis ball screw 84 arranged along a pair of Y-axis guide rails 80 is screwed into the nut portion. In addition, a Y-axis pulse motor (not shown) is connected to the end of the Y-axis ball screw 84. If the Y-axis pulse motor rotates the Y-axis ball screw 84, the Y-axis moving plate 82 moves in the Y-axis direction along the Y-axis guide rails 80.

A pair of Z-axis guide rails 86 are fixed along the Z-axis direction to the front surface (front side) of the Y-axis moving plate 82. Then, a flat Z-axis moving plate 88 is installed on the pair of Z-axis guide rails 86 along the Z-axis guide rails 86 and can slide in the Z-axis direction.

A nut portion (not shown) is provided on the rear surface (back side) of the Z-axis moving plate 88, and a Z-axis ball screw 90 arranged along a pair of Z-axis guide rails 86 is screwed into the nut portion. In addition, a Z-axis pulse motor 92 is connected to the end of the Z-axis ball screw 90. If the Z-axis pulse motor 92 rotates the Z-axis ball screw 90, the Z-axis moving plate 88 moves in the Z-axis direction along the Z-axis guide rail 86. Then, a processing unit 40a is fixed to the lower part of the Z-axis moving plate 88.

The structure of the moving mechanism 38b (see FIG. 1 ) is the same as that of the moving mechanism 38a. However, the Y-axis moving plate 82 of the moving mechanism 38a and the Y-axis moving plate 82 of the moving mechanism 38b are connected to different Y-axis ball screws 84.

The control signal generated by the control unit 66 is input to the components of the processing device 2 to control the operation of the components. For example, the control unit 66 generates a control signal for causing the display unit 60 (touch panel 62) to display a predetermined image, and outputs the control signal to the display unit 60. As a result, various screens (operation screens) for performing selection processing, inputting information, etc. are displayed on the display area 60a of the display unit 60.

Furthermore, if the operator operates the input unit 58 (touch panel 62), the input unit 58 outputs a signal corresponding to the operator's operation (selection processing, input information, etc.) to the control unit 66. Then, the signal output from the input unit 58 is input to the processing unit 68 of the control unit 66, and the processing unit 68 performs a predetermined process according to the input signal.

For example, when performing maintenance on the processing device 2, an operation screen (maintenance screen) for selecting maintenance is displayed on the display area 60a of the display unit 60 (touch panel 62). FIG. 3 is an image diagram showing the operation screen (maintenance screen) 100. The operation screen 100 includes a plurality of selection keys for selecting the processing performed by the processing device 2. Furthermore, the operation screen 100 may also include operation keys (keyboard, numeric keypad, etc.) for inputting information into the processing device 2.

FIG. 3 shows an example in which an operation screen 100 includes: a plurality of selection buttons (maintenance execution buttons) 102 for selecting maintenance; a selection button (confirmation button) 104 for confirming information input into the operation screen 100; and a selection button (end button) 106 for closing the operation screen 100. For example, the operation screen 100 includes six selection buttons 102 (selection buttons 102a to 102f). However, the number of selection buttons 102 is not limited.

The selected buttons 102a to 102d are respectively assigned with the scheduled maintenance to be performed in the processing device 2. Then, the name of the maintenance to be performed when the selected buttons 102a to 102d are selected is displayed inside the outline of the selected buttons 102a to 102d. That is, the selected buttons 102a to 102d are display fields that display the name of the maintenance. For example, the manufacturer of the processing device 2 selects maintenance A to D that is frequently performed and pre-assigns them to the selected buttons 102a to 102d.

The operator can select any one of the selection keys 102a to 102d by touching the area displaying the selection keys 102a to 102d of the touch panel 62. Then, the processing device 2 executes any one of the maintenance A to D corresponding to the selected selection key 102.

On the other hand, the maintenance that the user can freely set is assigned to the selection keys 102e and 102f. In the initial state of the operation screen 100, the maintenance is not assigned to the selection keys 102e and 102f, and as shown in FIG3, an empty field is displayed as the selection keys 102e and 102f. Then, the user of the processing device 2 can set the maintenance to be performed when the selection keys 102e and 102f are selected by operating the input unit 58 (touch panel 62). In addition, the detailed steps for assigning the maintenance to the selection keys 102e and 102f will be described later.

If any of the selection buttons 102 assigned with maintenance is selected, the movable unit included in the processing device 2 is first moved to a position suitable for maintenance. The movable unit corresponds to the constituent elements included in the processing device 2 that are configured to be movable within the processing device 2. For example, the cassette mounting table 6, the moving mechanism 12, the holding table 16, the fixture 18, the guide rail 20, the moving mechanism 26, 32, the conveying unit 28, 34, the moving mechanism 38a, 38b, the processing unit 40a, 40b, the shooting unit 48, etc. are equivalent to the movable unit.

The position of the movable unit at the time of maintenance is pre-stored in the memory section 70 (see FIG. 2 ) of the control unit 66 according to the content of each maintenance. Then, the processing device 2 moves the movable unit to a position suitable for the maintenance assigned to the selection key 102 selected by the operator. Thereby, it becomes unnecessary for the operator to manually move the movable unit to a predetermined position.

Then, after the movable unit is arranged at the predetermined position, the selected maintenance is performed. Examples of maintenance include: confirmation of the movement of each movable unit, confirmation of the movement and cleaning of the detector 10 in the state where the cassette mounting table 6 has been lowered (the detector 10 is exposed), replacement of the holding table 16, cleaning of the holding table 16 and its surroundings in the state where the processing units 40a and 40b have been evacuated from above the holding table 16, confirmation of the state of the holding table 16 (whether there is damage, etc.) by photographing the holding table 16 with the camera unit 48, replacement of the cutting blade 42 installed in the processing units 40a and 40b, and correction of the shape of the surface (supporting surface) of the processing units 40a and 40b that contacts the cutting blade 42.

Next, a specific example of the operation of the processing device 2 will be described. The operation of the processing device 2 is controlled by the control unit 66. FIG4 is a flow chart showing the operation of the control unit 66 when performing maintenance.

First, the operator refers to the operation screen 100 (see FIG. 3 ) displayed on the touch panel 62 (display unit 60 ), and operates the touch panel 62 (input unit 58 ) to select the selection key 102 corresponding to the maintenance to be performed. In this way, information indicating the selected maintenance (maintenance selection information) is input from the touch panel 62 to the processing unit 68 (step S11 ).

If the maintenance selection information is input, the processing unit 68 accesses the memory unit 70 and reads the information indicating the position of each movable unit when the selected maintenance is performed (position information). Then, the processing unit 68 generates a control signal for moving each movable unit to the position indicated by the read position information, and outputs it to each movable unit. In this way, the movable units are moved to positions suitable for maintenance (step S12).

For example, when the selected maintenance is to replace the cutting blade 42, the moving mechanisms 38a and 38b are controlled by the control signal to arrange the processing units 40a and 40b at predetermined positions. Also, when the selected maintenance is to photograph the holding platform 16 by the imaging unit 48, the moving mechanism 12 and the moving mechanisms 38a and 38b are controlled by the control signal to arrange the holding platform 16 and the imaging unit 48 at predetermined positions.

Next, the processing unit 68 generates a control signal for executing the selected maintenance and outputs it to the component to be maintained. For example, a program for generating a control signal for implementing each maintenance is pre-stored in the memory unit 70. Then, the processing unit 68 reads and executes the program corresponding to the selected maintenance from the memory unit 70, and generates control signals in sequence. In this way, the selected maintenance is executed (step S13).

Also, as described above, the operator can assign desired maintenance to a portion of the selection buttons 102 (selection buttons 102e, 102f) included in the operation screen 100 (see FIG3). FIG5 is a flow chart showing the operation of the control unit 66 when assigning maintenance.

First, the operator operates the touch panel 62 (input unit 58) and selects a user-assignable maintenance selection key 102e from the selection keys 102 included in the operation screen 100 (see FIG. 3). For example, the selection key 102e is selected by continuously touching the area of the touch panel 62 where the selection key 102e is displayed for a certain period of time (long press, long touch).

Next, the operator inputs information about the maintenance assigned to the selection button 102e (maintenance information) into the touch panel 62 (input unit 58). Specifically, the name of the maintenance, information indicating the position of each movable unit when the maintenance is performed (position information), etc. are input as the maintenance information. As the name of the maintenance, a string indicating the content of the maintenance is input. In addition, as the position information of the movable unit, the moving direction and moving distance of the movable unit from the reference position (origin position), the coordinates of the destination of the movable unit, etc. are input.

For example, when maintenance of the processing units 40a and 40b is assigned to the selection button 102e, the position information of the processing units 40a and 40b when the maintenance is performed is input. Examples of the position information of the processing units 40a and 40b include: the Y coordinate and Z coordinate of the processing units 40a and 40b; the Y coordinate of the Y-axis moving plate 82 and the Z coordinate of the Z-axis moving plate 88; the number of rotations of the Y-axis pulse motor and the Z-axis pulse motor 92, etc.

The maintenance information input to the touch panel 62 is input to the processing unit 68 together with the information indicating the selected selection button 102 (button selection information) (step S21). Then, the processing unit 68 accesses the memory unit 70, associates the maintenance information with the button selection information, and stores it in the memory unit 70 (step S22).

Furthermore, the processing unit 68 generates a control signal for displaying the name of the maintenance included in the maintenance information on the selected selection button 102e, and outputs the control signal to the touch panel 62 (display unit 60). Thus, the name of the maintenance is displayed on the selection button 102e (step S23).

Through the above-mentioned actions, the maintenance (replacement of the cutting blade 42) designated by the operator is assigned to the selection button 102e. Thereafter, if the operator selects the selection button 102e (step S11), the processing unit 68 reads the maintenance information stored in the memory unit 70 and moves each movable unit to a position suitable for performing the maintenance (step S12). Thereafter, the maintenance is performed manually or automatically.

In addition, the above description is for the following situation: before the implementation of step S21, the maintenance information (maintenance name and position information of the movable unit) of the maintenance assigned to the selection keys 102e and 102f is not stored in the memory unit 70, and the selection keys 102e and 102f are empty fields (refer to FIG. 3). However, in the case where the maintenance has been assigned to the selection keys 102e and 102f, the maintenance assigned to the selection keys 102e and 102f can be changed or deleted.

Specifically, when the operator selects the selection button 102e or 102f and inputs the maintenance information, the processing unit 68 overwrites the maintenance information stored in the selection button 102e or 102f in the memory unit 70 with the newly input maintenance information. In this way, the maintenance assigned to the selection button 102e or 102f is changed. Furthermore, when the operator selects the selection button 102e or 102f and inputs the information to delete the maintenance information, the processing unit 68 deletes the maintenance information stored in the selection button 102e or 102f in the memory unit 70. As a result, the maintenance of the selection buttons 102e and 102f is deleted, and the selection buttons 102e and 102f become empty fields.

The operation of the control unit 66 when executing maintenance and the operation of the control unit 66 when assigning maintenance are realized by, for example, executing a program stored in the memory unit 70. Specifically, a program describing each step shown in FIG. 4 and a program describing each step shown in FIG. 5 are stored in advance in the memory unit 70. Then, when information is input to the processing unit 68 from the touch panel 62, the processing unit 68 selects the program stored in the memory unit 70 and executes it. In this way, the execution or assignment of maintenance is performed.

As described above, in the processing device 2 of the present embodiment, if the selection key 102 for selecting maintenance is selected, the movable unit moves to the position indicated by the position information stored in the memory section 70. Then, the position information stored in the memory section 70 becomes changeable by operating the input unit 58 (touch panel 62). Therefore, the user of the processing device 2 can freely set the position of the movable unit during maintenance by operating the input unit 58. Thereby, even when performing maintenance that is not pre-registered in the processing device 2, the movable unit can be automatically moved to the position desired by the user.

In addition, in the present embodiment, although the processing device 2 is described as a cutting device having processing units 40a, 40b (cutting units) for cutting the workpiece 11, the type of the processing device 2 is not limited. For example, the processing device 2 may be a grinding device having a grinding unit for grinding the workpiece 11 or a polishing device having a polishing unit for grinding the workpiece 11.

The grinding unit of the grinding device has a main shaft, and a ring-shaped grinding wheel with a plurality of grinding stones fixed thereon is installed at the front end of the main shaft. The grinding wheel is rotated while the grinding stones are brought into contact with the workpiece 11, thereby grinding the workpiece 11. In addition, the grinding unit of the polishing device has a main shaft, and a disc-shaped polishing pad is installed at the front end of the main shaft. The workpiece 11 is polished while the polishing pad is brought into contact with the workpiece 11 while rotating.

Furthermore, the processing device 2 may also be a laser processing device that processes the object 11 by irradiating a laser beam. The laser processing device includes a laser irradiation unit that irradiates a laser beam for processing the object 11. For example, the laser irradiation unit includes: a laser oscillator that pulses and oscillates a laser beam of a predetermined wavelength; and a condenser that condenses the laser beam oscillated by the laser oscillator. The laser beam irradiated by the laser irradiation unit is condensed on the surface or inside of the object, thereby performing laser processing on the object 11.

In addition, the structures, methods, etc. of the above-mentioned embodiments may be appropriately modified and implemented without departing from the scope of the purpose of the present invention.

2: Processing device 4: Base 4a: Opening 4b: Opening 6: Cassette loading platform (Cassette elevator) 8: Cassette 10: Detector (Sensor) 11: Workpiece 12: Moving mechanism 12a: Moving platform 13: Wafer 14: Dust and drip-proof cover 15: Adhesive film (cutting adhesive film) 16: Holding platform (chuck platform) 16a: Holding surface 17: Frame 18: Clamp 20: Guide rail 22: First support structure 24: Slide rail 26: Moving mechanism (elevator) 28: Transport unit (transport mechanism) 28a: Grip (grip mechanism) 30: Slide rail 32: Moving mechanism (lifting mechanism) 34: Transport unit (transporting mechanism) 36: Second support structure 38a, 38b: Moving mechanism 40a, 40b: Processing unit 42: Cutting blade 44: Housing 46: Spindle 48: Camera unit (camera) 50: Cleaning unit 52: Rotating table 54: Nozzle 56: Cover 58: Input unit (input unit, input device) 60: Display unit (display unit, display device) 60a: Display area 62: Touch panel 64: Notification unit (notification unit) 66: Control unit (control unit) 68: Processing unit 70: Memory unit 80: Y-axis guide rail 82: Y-axis moving plate 84: Y-axis ball screw 86: Z-axis guide rail 88: Z-axis moving plate 90: Z-axis ball screw 92: Z-axis pulse motor 100: Operation screen (maintenance screen) 102,102a~102f: Selection button (maintenance execution button) 104: Selection button (Confirm button) 106: Selection button (End button)

Figure 1 is a three-dimensional diagram showing a processing device. Figure 2 is a block diagram showing a control unit. Figure 3 is an image diagram showing an operation screen. Figure 4 is a flow chart showing the actions of the control unit when performing maintenance. Figure 5 is a flow chart showing the actions of the control unit when assigning maintenance.

100: Operation screen (maintenance screen)

102,102a~102f: Select key (maintenance execution key)

104:Select button (confirm button)

106:Select button (end button)

Claims (2)

A processing device for processing a workpiece is characterized in that it has: a movable unit that can move; an input unit; a display unit; and a control unit that controls the movable unit, the input unit, and the display unit, the control unit has a memory unit that stores the name and position information of maintenance, the position information displays the position of the movable unit when the maintenance is performed, the display unit displays a selection button for selecting the maintenance, if the selection button is selected, the control unit moves the movable unit to the position indicated by the position information, the name of the maintenance and the position information stored in the memory unit can be changed by operating the input unit, In the case where the memory unit does not store the name of the maintenance and the location information, the display unit displays an empty field as the selection button. In the case where the memory unit stores the name of the maintenance and the location information, the display unit displays a display field indicating the name of the maintenance as the selection button. A processing device as claimed in claim 1, wherein the movable unit is a holding table for holding the object to be processed or a processing unit for processing the object to be processed.