JP2018123398A - Plating method and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the film thickness distribution of plating in the width direction of a strip-shaped plating region uniform when electroplating a strip-shaped strip extending along a longitudinal direction with a strip-shaped plating region and a non-plating region. Provided are plating methods and devices thereof that can be used. SOLUTION: A strip-shaped strip 24 having a strip-shaped plating region extending along a longitudinal direction on at least one surface is continuously fed into a plating bath 18, and a strip 24 and an anode 26 in the plating bath 26. In a plating method in which a current is passed between the two and the plating region of the strip 24 is electroplated, the strip-shaped shielding plate 38 is plated so as to face the peripheral edge extending in the longitudinal direction of the plating region in the plating bath. Arranged between the region and the anode 26, the shielding plate shields from the region facing the widthwise inner portion of the peripheral edge extending in the longitudinal direction of the plating region toward the region facing the widthwise end of the peripheral edge. A plating device that forms an inclined surface 38a on a shielding plate so that the distance between the plate and the peripheral edge extending in the longitudinal direction of the plating region is gradually reduced. [Selection diagram] FIG. 1B

Description

  The present invention relates to a plating method and an apparatus thereof, and more particularly, to a plating method and an apparatus for plating a part of a material to be plated.

  Conventionally, as a method of plating a part of the material to be plated, a tape is previously applied to a portion (non-plating region) where the material to be plated is not plated, and a part of the material to be plated is masked by this tape. A method of plating a material to be plated and removing the tape after plating is known.

  Also, in an electroplating apparatus for plating a tape-shaped product conductor conveyed along the anode while facing the anode in the plating tank, the width of the tape-shaped product conductor between the anode and the tape-shaped product An insulating shielding plate having a narrower opening is provided, and the plating becomes thick at the end of the tape-like product due to the current component that reaches the end of the conductor of the tape-like product from the outside, and near the center. It has been proposed to suppress the thinning (see, for example, Patent Document 1).

JP 2009-293114 A (paragraph number 0010-0020)

  However, when the strip material in which the strip-shaped plating region extends along the longitudinal direction is continuously fed into the plating bath and the strip is electroplated in the strip shape, the shielding plate of Patent Document 1 is used. However, it is difficult to suppress the current from being easily concentrated on the peripheral edge extending in the longitudinal direction of the strip-shaped plating region, and it is difficult to make the film thickness distribution in the width direction of the strip-shaped plating region uniform. It is.

  In addition, a strip-shaped shielding plate is provided between the peripheral edge extending in the longitudinal direction of the belt-shaped plating region and the anode, so that the plating region and the anode correspond to the peripheral edge extending in the longitudinal direction of the plating region in the plating bath. Even if it is disposed between them, it is difficult to make the film thickness distribution of the plating in the width direction of the band-shaped plating region sufficiently uniform.

  Therefore, in view of such a conventional problem, the present invention provides a strip-shaped plating region in the width direction when the strip-shaped plating region is electroplated in a strip shape on the strip-shaped strip material extending along the longitudinal direction. An object of the present invention is to provide a plating method and apparatus capable of uniforming the film thickness distribution of the plating.

  As a result of diligent research to solve the above problems, the present inventors have continuously fed a strip-shaped strip material in which at least one surface has a strip-shaped plating region extending in the longitudinal direction into the plating bath. In the plating method in which electroplating is performed on the plating region, the peripheral portion extending in the longitudinal direction of the plating region in the plating bath is provided with a shielding plate for reducing the current density between the peripheral portion extending in the longitudinal direction of the plating region and the anode. The shielding plate is disposed between the plating region and the anode so as to face the plate, and the shield plate is opposed to the widthwise inner end portion of the peripheral portion extending in the longitudinal direction of the plating region. By forming the shielding plate so that the distance between the shielding plate and the peripheral edge extending in the longitudinal direction of the plating region gradually decreases toward the region, the thickness distribution of the plating in the width direction of the belt-like plating region is made uniform. To do Found that it is, it has led to the completion of the present invention.

  That is, in the plating method according to the present invention, a strip-like strip material having a strip-like plating region extending along the longitudinal direction on at least one surface is continuously fed into the plating bath to electroplate the plating region. In the plating method, the plating region and the anode are arranged so that the shielding plate for reducing the current density between the peripheral portion extending in the longitudinal direction of the plating region and the anode is opposed to the peripheral portion extending in the longitudinal direction of the plating region in the plating bath. The shield plate and the plating are arranged from the region facing the widthwise inner side portion of the peripheral edge extending in the longitudinal direction of the plating region to the region facing the widthwise end portion of the peripheral edge. The shielding plate is formed so that the distance from the peripheral edge extending in the longitudinal direction of the region is gradually reduced.

  In this plating method, it is preferable that the shielding plate extends over substantially the entire length of the plating region in the plating bath. Moreover, it is preferable to mask non-plating area | regions other than the plating area | region of a strip-shaped strip. In addition, when the plating region is composed of a plurality of strip-shaped plating regions and the non-plating region is composed of a plurality of strip-shaped non-plating regions, the plurality of strip-shaped plating regions and non-plating regions are alternately arranged in the width direction. The shield plate is composed of a plurality of strip-shaped shield plates, and the strip strip-shaped shield plates are arranged so as to face the peripheral edge portions extending in the longitudinal direction of the plurality of strip-shaped plating regions. It is preferably arranged between the material and the anode. Further, when at least one of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating regions, a strip-shaped narrow plating region shielding plate is provided. , Disposed between the strip and the anode so as to face the widthwise central portion extending in the longitudinal direction of the narrow plating region in the plating bath over a part of the entire length of the narrow plating region in the plating bath. It is preferable to reduce the current density between the strip and the anode during a part of the plating time in the strip plating region.

  In addition, the plating apparatus according to the present invention continuously feeds a strip-shaped strip material extending along the longitudinal direction on at least one surface into the plating tank to perform electroplating on the plating region. In the plating apparatus, the shielding plate is disposed between the strip material conveyance path and the anode so as to face the peripheral edge extending in the longitudinal direction of the plating region in the plating tank, and the shielding plate is disposed in the longitudinal direction of the plating region. The distance between the shielding plate and the peripheral edge extending in the longitudinal direction of the plating region gradually decreases from the area facing the widthwise inner portion of the peripheral edge to the area facing the widthwise end of the peripheral edge. A shielding plate is formed.

  In this plating apparatus, it is preferable that the shielding plate extends over substantially the entire length of the plating region in the plating tank. Moreover, it is preferable to mask non-plating area | regions other than the plating area | region of a strip-shaped strip. In addition, when the plating region is composed of a plurality of strip-shaped plating regions and the non-plating region is composed of a plurality of strip-shaped non-plating regions, the plurality of strip-shaped plating regions and non-plating regions are alternately arranged in the width direction. The shield plate is composed of a plurality of strip-shaped shield plates, and the strip-shaped shield plates are opposed to the peripheral edge portions extending in the longitudinal direction of the plurality of strip-shaped plating regions. It is preferably disposed between the material transport path and the anode. In addition, when at least one of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating regions, a strip-shaped narrow plating region shielding plate is provided. The strip is disposed between the strip conveying path and the anode so as to face the central portion in the width direction extending in the longitudinal direction of the narrow plating area in the plating tank over a part of the entire length of the narrow plating area in the plating tank. It is preferable.

  According to the present invention, when electroplating is performed on a strip-shaped strip material in which the strip-shaped plating region extends along the longitudinal direction, the film thickness distribution of the plating in the width direction of the strip-shaped plating region is made uniform. be able to.

1 is a plan view schematically showing an embodiment of a plating apparatus according to the present invention. 1B is a cross-sectional view schematically shown by cutting along line IB-IB in FIG. 1A. FIG. It is the typical side view which looked at the shielding board of the plating apparatus shown to FIG. 1A and FIG. 1B from the right side of FIG. 1A. It is sectional drawing cut | disconnected typically by the ID-ID line | wire of FIG. 1C. It is sectional drawing which shows typically the modification of the shielding board of the plating apparatus shown to FIG. 1A and FIG. 1B. It is a top view which shows the state which affixed the masking tape on the strip used in embodiment of the plating method by this invention. It is a figure which shows the positional relationship of the shielding board of an Example, and a strip. It is a figure which shows the positional relationship of the shielding board of Comparative Example 1, and a strip. It is a figure which shows the positional relationship of the shielding board of Comparative Example 2, and a strip. It is a figure which shows the change of the thickness of Ag plating film in the width direction of the strip of an Example and a comparative example.

  In the embodiment of the plating method according to the present invention, the belt-like plating region extends along the longitudinal direction on at least one surface (preferably, the plating is performed so that the belt-like plating region extends along the longitudinal direction on at least one surface). Strip strips (masking non-plating areas other than the area) are continuously fed into the plating bath (including the plating solution in the plating tank), and the strips (as the cathode) in the plating bath In a plating method in which an electric current is passed between the anode and the plating region of the strip material is electroplated, a shielding plate for reducing the current density between the peripheral edge extending in the longitudinal direction of the plating region and the anode is provided in the plating bath. The plating region is disposed between the plating region and the anode so as to face a peripheral portion extending in the longitudinal direction (preferably over substantially the entire length), and the shielding plate extends in the longitudinal direction of the plating region. Shielding is performed so that the distance between the shielding plate and the peripheral edge extending in the longitudinal direction of the plating area gradually decreases from the area facing the widthwise inner portion of the peripheral edge toward the area facing the widthwise end of the peripheral edge. Form a plate.

  In this plating method, when the plating region is composed of a plurality of strip-shaped plating regions and the non-plating region is composed of a plurality of strip-shaped non-plating regions, the plurality of strip-shaped plating regions and the non-plating regions are arranged in the width direction. Alternatingly arranged, the shielding plate is composed of a plurality of strip-shaped shielding plates, and the plurality of strip-shaped shielding plates are opposed to the peripheral edge portion extending in the longitudinal direction of each of the plurality of strip-shaped plating regions. In addition, it is preferably disposed between the strip material and the anode.

  In this case, when at least one of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating regions, a strip-shaped shielding plate for the narrow plating region Is disposed between the strip and the anode so as to face the widthwise central portion extending in the longitudinal direction of the narrow plating region in the plating bath over a part of the entire length of the narrow plating region in the plating bath. Thus, it is preferable to reduce the current density between the strip and the anode during a part of the plating time in the plating region of the strip.

  In the embodiment of the plating apparatus according to the present invention, the belt-shaped plating region extends along the longitudinal direction on at least one surface (preferably, the belt-shaped plating region extends along the longitudinal direction on at least one surface. Shielding (preferably strip-shaped) in a plating apparatus that continuously feeds a strip-shaped strip material into the plating tank and electroplats the plated area by masking the non-plated area other than the plated area. The plate is arranged between the strip conveying path and the anode so as to face the peripheral edge extending in the longitudinal direction (preferably over substantially the entire length) of the plating region in the plating tank, and the shielding plate is disposed in the longitudinal direction of the plating region. The distance between the shielding plate and the peripheral edge extending in the longitudinal direction of the plating region from the area facing the widthwise inner portion of the peripheral edge extending in the direction toward the area facing the widthwise end of the peripheral edge is As reduced, the shield plate is formed.

  In this plating apparatus, when the plating region is composed of a plurality of strip-shaped plating regions and the non-plating region is composed of a plurality of strip-shaped non-plating regions, the plurality of strip-shaped plating regions and the non-plating regions are arranged in the width direction. Alternatingly arranged, the shielding plate is composed of a plurality of strip-shaped shielding plates, and the plurality of strip-shaped shielding plates are opposed to the peripheral edge portion extending in the longitudinal direction of each of the plurality of strip-shaped plating regions. In addition, it is preferably disposed between the conveying path of the strip material and the anode.

  In this case, when at least one of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating regions, a strip-shaped shielding plate for the narrow plating region Between the strip conveying path and the anode so as to face the central part in the width direction extending in the longitudinal direction of the narrow plating area in the plating tank over a part of the entire length of the narrow plating area in the plating tank. Preferably they are arranged.

  Embodiments of a plating method and apparatus according to the present invention will be described below in detail with reference to the accompanying drawings.

  As shown in FIGS. 1A and 1B, a plating apparatus 10 according to the present embodiment includes a plating cell 14 to which a plating solution 12 (such as a silver plating solution) is supplied, and a plating cell 14 that accommodates the plating cell 14 therein. A plating tank 18 including an overflow tank 16 for storing the plating solution 12 overflowed from the cell 14 is provided.

  An opening for allowing a predetermined amount or more of the plating solution 12 in the plating cell 14 to overflow as shown by an arrow A and to be stored in the overflow tank 16 at the upper part of the side walls on both sides in the width direction of the plating cell 14 of the plating tank 18. 14b is formed.

  The plating solution 12 accumulated at the bottom of the overflow tank 16 of the plating tank 18 flows as indicated by an arrow B and is stored in the reserve tank 22, and is supplied into the plating cell 14 of the plating tank 18 by the pump 20 as indicated by an arrow C. Has been circulating.

  A pair of slits 14 a serving as inlets and outlets for the strip material 24 (conductive metal such as copper strip) are provided on the side walls at the longitudinal ends of the plating cell 14 in the plating tank 18. And a pair of slits 16a as inlets and outlets for the strips 24 (each facing the slits 14a) at the center in the width direction of the side walls at both ends in the longitudinal direction of the overflow tank 16. The slits 14a and 16a extend in the vertical direction so that the width direction of the strip-like strip material 24 becomes the vertical direction.

  In the plating cell 14 of the plating tank 18, a pair of anodes 26 are provided so as to face each of both surfaces of the strip material 24 fed into the plating cell 14. Further, on the outside of the overflow tank 16 of the plating tank 18, a power feeding plate (or power feeding roll) 28 is provided to face each of the pair of slits 16 a on the side walls at both ends in the longitudinal direction. The anode 26 is connected to the plus (+) side of a rectifier (external DC power source) 30 provided outside the plating tank 18, and the power feeding plate (or feeding roll) 28 is connected to the minus (−) side of the rectifier 30. Then, the current flows between the strip 24 (as the cathode) and the anode 26 fed into the plating tank 16 in the direction of arrow D while being in contact with the power supply plate 28 (or being sandwiched between the power supply rolls 28). Can be shed.

  A plurality of (two in the illustrated embodiment) masking tapes 32 are spaced from each other and extend along the strip 24 in parallel to each of both surfaces of the strip 24 fed into the plating tank 16. A strip-shaped non-plated region is formed by being pasted, and a plating film 34 is formed on a striped portion (a plurality of strip-shaped plated regions) where the masking tape 32 on the surface of the strip 24 is not pasted. It has become.

  In the plating cell 14 of the plating tank 18, a pair of struts extending vertically upward from the bottom surface of the plating cell 14 so as to face one surface of the strip 24 on each of the inlet port side and the outlet port side. 36 and a pair of support pillars 36 extending vertically upward from the bottom surface of the plating cell 14 so as to face the other surface of the strip 24. A pair of support columns 36 provided so as to oppose each of both surfaces of the strip 24 have a longitudinal direction of each of the plurality of strip-shaped plating regions of the strip 24 over substantially the entire length of the strip 24 in the plating cell 14. A plurality of (three in the illustrated embodiment) shielding plates 38 (for the belt-shaped plating region peripheral portion) arranged so as to face the peripheral portion extending in the direction are fixed. The shielding plate 38 and the plating region in the longitudinal direction from the region facing the widthwise inner portion of the peripheral edge extending in the longitudinal direction of the plating region toward the region facing the widthwise end of the peripheral edge. An inclined surface 38a is formed at the end of the shielding plate 38 so that the distance from the peripheral edge extending in the direction gradually decreases. In the present embodiment, the width of the shielding plate 38 is set so that the end surface of the width direction end facing the peripheral edge extending in the longitudinal direction of the plating region of the shielding plate 38 is directed toward the peripheral edge extending in the longitudinal direction of the plating region. The inclined surface 38a is formed as an end surface that is inclined so as to gradually decrease, but without forming such an end surface, the peripheral edge portion extending in the longitudinal direction of the strip-shaped shielding plate 38 extends in the longitudinal direction of the plating region. The inclined surface 38a may be formed by bending away from the peripheral edge. With such a shielding plate 38, the current density between the anode 26 and the peripheral edge in the longitudinal direction (parts of the shielding widths a, b, c, d) of the plurality of strip-shaped (stripe-shaped) plating regions of the strip 24. Thus, the plating film 34 at the peripheral edge in the longitudinal direction of the strip-shaped plating region of the strip 24 is prevented from becoming thicker than the central portion thereof. In addition, the width | variety (shielding width) of the peripheral part extended in the longitudinal direction of each of the some strip | belt-shaped plating area | region of the strip | belt material 24 can be suitably determined from the width | variety etc. of a plating area | region. Further, the difference between the maximum interval and the minimum interval between the inclined surface 38a of the shielding plate 38 and the peripheral edge portion extending in the longitudinal direction of the plating region (in this embodiment, the thickness of the shielding plate 38, and the shielding plate 30 is bent). When the inclined surface 38a is formed, the difference in the distance between the tip and bent portions of the shielding plate 30 and the peripheral edge extending in the longitudinal direction of the plating region is preferably 5 to 20 mm. The length of the direction inclined surface 38a is preferably 10 to 40 mm.

  Moreover, the full length of the strip 24 in the plating cell 14 is opposed to the central portion extending in the longitudinal direction of the strip-shaped plating region that is narrower than the other strip-shaped plating regions among the plurality of strip-shaped plating regions of the strip 24. At least one (for the narrow plating region) shielding plate 40 (one for the narrow plating region) arranged so as to extend over a part of the length of the adjacent shielding (for the peripheral portion of the belt-like plating region) The plate 38 is fixed to the plate 38, and the shielding plate 40 reduces the time during which the narrow strip-shaped plating region of the strip 24 conveyed in the plating cell 14 faces the anode 26, thereby plating the strip 24. By reducing the current density between the plating region in the plating tank and the cathode during a part of the plating time in the region, the plating film 34 in the narrow band-shaped plating region is replaced with the plating film in the other band-shaped plating region. 34 So as to prevent consisting of a thick Ri. In addition, the length of the shielding plate 40 can be appropriately determined from the relationship between the width of the narrow band-shaped plating region and the width of the other band-shaped plating region.

  Further, as shown in FIG. 2, a plurality of strip-shaped plating of the strip material 24 is provided between the support column 36 and the shield plate 38 by providing an interval adjusting plate 42 for adjusting the interval between the shield plate 38 and the strip material 24. The reduction in current density between the peripheral edge of each region extending in the longitudinal direction and the anode 26 may be adjustable.

  If the strip 24 plated with a plurality of strips (stripes) in this way is cut along a cutting line (indicated by a dotted line 44 in FIG. 3) extending along the longitudinal direction, a plurality of platings are performed in one plating. Strip material can be obtained. In addition, the strip 24 plated with stripes in this way can be pressed before or after cutting to produce contacts, terminal parts, etc. such as connectors and switches. When manufacturing contacts and terminal parts such as connectors and switches, the width of the strip 24 is preferably about 30 to 500 mm, and the width of the strip-like plating region on the surface of the strip 24 is several mm. It is preferably about ˜100 mm.

  Moreover, in order to improve the productivity of the plating material by the plating apparatus 10 of the present embodiment, a plurality of plating tanks 18 may be arranged in series, and the speed at which the strip material 24 is fed to the plating tank 18 may be increased.

  Examples of the plating method and apparatus according to the present invention will be described in detail below.

[Example]
As a strip material (material to be plated) 24, a coil material is prepared by winding a long strip material having a plate width of 151 mm and a plate thickness of 0.6 mm made of tough pitch copper (C1100R-1 / 2H) into a coil shape. Using a two-reel (hoop) plating apparatus, as a pretreatment, washing with water, electrolytic degreasing, washing with water, and washing with sulfuric acid were performed.

Next, an Ag strike plating solution (consisting of 3 g / L of potassium potassium cyanide and 90 g / L of potassium cyanide) is used as the plating solution 12, and electroplating is performed at a current density of 2 A / dm ² for 10 seconds. An Ag strike plating film was formed on the strip after the pretreatment.

Next, using the Ag plating solution (consisting of 3 g / L silver potassium cyanide, 90 g / L potassium cyanide and 180 mg / L potassium selenocyanate) as the plating solution 12, the length of the strip material subjected to Ag strike plating was used. A shielding plate 38 (see FIG. 4A) is disposed (see FIG. 4A) so that the inclined surface 38a faces the peripheral portion having a width of 14 mm extending in the direction (see FIG. 4A) (the shielding plate facing the peripheral portion extending in the longitudinal direction of the strip). (Similar to the plating apparatus shown in FIGS. 1A to 1D except that 38 is disposed), electroplating is performed until the minimum film thickness becomes 1 μm at a current density of 5 A / dm ² , and Ag is used. An Ag plating film was formed on the strike plating film.

  Thus, the thickness of the Ag plating film in the width direction of the strip material subjected to Ag plating was measured with a fluorescent X-ray film thickness meter at intervals of 1 mm.

[Comparative Example 1]
Except for using a shielding plate whose end face in the width direction is substantially perpendicular to the main surface and arranging the shielding plate so as not to face the peripheral edge extending in the longitudinal direction of the strip (see FIG. 4B), it is the same as the embodiment. By this method, the strip was subjected to Ag plating, and the thickness of the Ag plating film was measured.

[Comparative Example 2]
Implementation was performed except that the shielding plate was arranged so as to face the peripheral edge of the width of 6 mm extending in the longitudinal direction of the strip using a shielding plate whose width direction end face was substantially perpendicular to the main surface (see FIG. 4C). By the same method as in the example, the strip was subjected to Ag plating, and the thickness of the Ag plating film was measured.

  Changes in the thickness of the Ag plating film in the width direction of the strips of these examples and comparative examples are shown in FIG. As shown in FIG. 5, in the example, compared with Comparative Examples 1 and 2, the increase in the thickness of the Ag plating film at both ends of the strip can be considerably reduced, and the film of the Ag plating film in the width direction can be reduced. It can be seen that the thickness distribution can be made uniform. As shown in FIG. 5, in Comparative Example 2, the thickness of the Ag plating film is considerably reduced at the end portion on the upper end side in the width direction of the strip material. The thickness can be prevented from decreasing.

DESCRIPTION OF SYMBOLS 10 Plating apparatus 12 Plating solution 14 Plating cell 14a Slit 14b Opening 16 Overflow tank 16a Slit 18 Plating tank 20 Pump 22 Reserve tank 24 Strip material 26 Anode 28 Power supply plate (or power supply roll)
Reference Signs List 30 Rectifier 32 Masking Tape 34 Plating Film 36 Prop 38 (For Belt-Plating Area Perimeter) Shielding Plate 38a Inclined Surface 40 (For Narrow Plating Area) Shielding Plate 42 Spacing Adjustment Plate 44 Cutting Line

Claims (11)

In a plating method in which a strip plate-like strip material extending along the longitudinal direction on at least one surface is continuously fed into the plating bath to electroplate the plating region, the longitudinal direction of the plating region A shielding plate for reducing the current density between the peripheral edge extending to the anode and the anode is disposed between the plating area and the anode so as to oppose the peripheral edge extending in the longitudinal direction of the plating area in the plating bath, and the shielding. A shield plate and a peripheral edge extending in the longitudinal direction of the plating area from an area facing the widthwise inner side portion of the peripheral edge extending in the longitudinal direction of the plating area toward the area facing the edge in the width direction of the peripheral edge A plating method, wherein a shielding plate is formed so as to gradually reduce the interval of. The plating method according to claim 1, wherein the shielding plate extends over substantially the entire length of the plating region in the plating bath. The plating method according to claim 1, wherein a non-plating region other than the plating region of the strip-like strip material is masked. The plating region is composed of a plurality of strip-shaped plating regions and the non-plating region is composed of a plurality of strip-shaped non-plating regions, and the plurality of strip-shaped plating regions and non-plating regions are alternately arranged in the width direction, The shield plate is composed of a plurality of strip-shaped shield plates, and the strips of the strip-shaped shield plates are opposed to the peripheral edge portions extending in the longitudinal direction of the plurality of strip-shaped plating regions. The plating method according to claim 3, wherein the plating method is arranged between a material and the anode. At least one strip-shaped plating region of the plurality of strip-shaped plating regions is a narrow plating region narrower than the other strip-shaped plating regions, and the strip-shaped narrow plating region shielding plate includes the plating bath. It is arranged between the strip material and the anode so as to face the widthwise central portion extending in the longitudinal direction of the narrow plating region in the plating bath over a part of the entire length of the narrow plating region. The plating method according to claim 4, wherein the current density between the strip and the anode is reduced during a part of the plating time in the plating region of the strip. In a plating apparatus that continuously feeds a strip-shaped strip material extending along the longitudinal direction on at least one surface into a plating tank and electroplats the plating region, the shielding plate is plated It is arranged between the conveying path of the strip material and the anode so as to face the peripheral portion extending in the longitudinal direction of the plating region in the tank, and the shielding plate is provided on the inner side in the width direction of the peripheral portion extending in the longitudinal direction of the plating region. That the shielding plate is formed so that the distance between the shielding plate and the peripheral edge extending in the longitudinal direction of the plating region gradually decreases from the facing region to the region facing the widthwise end of the peripheral portion. A plating apparatus that is characterized. The plating apparatus according to claim 6, wherein the shielding plate extends over substantially the entire length of the plating region in the plating tank. The plating apparatus according to claim 6 or 7, wherein a non-plating region other than the plating region of the strip-like strip material is masked. The plating region is composed of a plurality of strip-shaped plating regions and the non-plating region is composed of a plurality of strip-shaped non-plating regions, and the plurality of strip-shaped plating regions and non-plating regions are alternately arranged in the width direction, The shield plate is composed of a plurality of strip-shaped shield plates, and the strip strip-shaped shield plates are opposed to the peripheral edge portions extending in the longitudinal direction of the plurality of strip-shaped plating regions. The plating apparatus according to claim 8, wherein the plating apparatus is disposed between a material conveyance path and the anode. At least one of the plurality of strip-shaped plating regions is a narrow plating region whose width is narrower than other strip-shaped plating regions, and the strip-shaped narrow plating region shielding plate is the plating tank. It is arranged between the conveying path of the strip material and the anode so as to face the central portion in the width direction extending in the longitudinal direction of the narrow plating region in the plating tank over a part of the entire length of the narrow plating region in The plating apparatus according to claim 9, wherein the plating apparatus is provided. A method for producing a plating material, comprising: cutting a strip material electroplated in a strip shape by the plating method according to any one of claims 1 to 5 to produce a plurality of plating materials.

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