JP2018170323A - Soldering apparatus and electronic component manufacturing method - Google Patents

Abstract

An object of the present invention is to prevent the occurrence of defective solder without giving excessive vibration energy to an electronic component or the like.
A heating device 6 for heating a soldering object 2, a vibration device 4 for vibrating the soldering object 2 heated by the heating device 6, and a vibration time of the vibration device 4 are controlled. And a vibration control unit 3.
[Selection] Figure 1

Description

  The present invention relates to a soldering apparatus and an electronic component manufacturing method.

Because of the advantages of shortening the soldering process time, low oxidation corrosion resistance, heating temperature stability, etc., the fine pitch substrate is soldered using the heat generated when the heating steam is liquefied, called VPS (Vapor Phase Soldering). Soldering is used.
BGA (Ball Grid Array) parts are used as a kind of integrated circuit package.

  On the other hand, as a soldering device used in a production line of electronic equipment, there is one described in Patent Document 1. This soldering device is irradiated with an electron beam such as infrared rays by applying hot air while vibrating. The solder is heated, and the components are clamped to apply ultrasonic vibration. Patent Document 2 discloses a technique related to soldering by VPS heating.

JP 2010-021346 A Japanese Patent Laid-Open No. 11-233916

  On the other hand, when soldering a BGA component, an oxide film remains on the solder surface without joining due to the difference in deflection between the substrate and the BGA component, and the difference in deflection is eliminated. In rare cases, a phenomenon in which electrical bonding is incomplete even when the joints are joined, that is, a so-called Head in Pillow phenomenon (pillow defect phenomenon) occurs. Since this failure mode occurs on the back side of the BGA component, it is not possible to visually confirm the occurrence of the failure, and it is necessary to perform an X-ray inspection over time, which requires a lot of labor for the inspection to maintain the production quality. There was a problem.

  In Patent Document 1, the target component is vibrated by ultrasonic waves while the solder is melted. However, if this ultrasonic wave is too small, the destruction of the oxide film at the joint is insufficient. If the vibration energy is excessive, the electronic component or the like may be mechanically damaged.

  The present invention has been made in view of the above problems, and an object of the present invention is to prevent the occurrence of solder failure without giving excessive vibration energy to an electronic component or the like.

  In order to solve the above problems, a first aspect of the present invention is to add a heating device for heating an electronic component including a soldering target and a soldering target that is a part of the electronic component heated by the heating device. And a vibration control unit that controls a vibration time of the vibration device.

  In order to solve the above-described problem, a second aspect of the present invention includes a step of supporting an electronic component including a soldering target at a predetermined position, and heating a soldering target that is a part of the electronic component at the predetermined position. A heating step for vibrating, a vibration step for vibrating the soldering object heated by the heating step, and a vibration control step for controlling the vibration time in the vibration step together with the heating step.

  According to the present invention, it is possible to prevent occurrence of defective solder without giving excessive vibration energy to an electronic component or the like.

It is a perspective view which shows 1st Embodiment concerning the minimum structure of this invention. It is the schematic which shows the reflow apparatus which concerns on 2nd Embodiment of this invention. It is the schematic which shows the reflow apparatus which concerns on 3rd Embodiment of this invention. It is the schematic which shows the reflow apparatus which concerns on 4th Embodiment of this invention. It is an expanded sectional view of the soldering part for demonstrating the effect | action of soldering by embodiment of this invention.

A first embodiment according to the minimum configuration of the present invention will be described with reference to FIG. In the following description, the direction perpendicular to the paper surface of FIG. 1 (the arrow heads toward the back of the paper surface) is defined as the X-axis direction, the left-right direction is the Y-axis direction, and the vertical direction is the Z-axis direction.
Reference numeral 1 denotes a support device. The support device 1 supports an electronic component including the soldering object 2 in a stationary state or a moving state. Reference numeral 3 denotes a vibration control unit. The vibration control unit 3 controls the vibration device 4 that applies vibration to the soldering target 2 from above the support device 1 and the support device 5 that supports the vibration device 4, and thereby controls the vibration device 4. Positioning is performed in a predetermined direction. In addition, the vibration control unit 3 controls the vibration device 4 and / or the support device 5 so that the vibration direction, strength, time, and positioning with respect to the soldering target 2 (for example, on the substrate a) Positioning with respect to the electronic component 2b). Reference numeral 6 denotes a heating device that heats the soldering object 2 on the support device 1 to a temperature at which the solder paste and / or solder balls melt.

  According to the above configuration, the soldering object 2 (the substrate 2a and the electronic component 2b) supported by the support device 1 is heated by the heating device 6, and the vibration position of the vibration device 4 is controlled in this heated state. For example, the electronic component 2b can be soldered to the substrate 2a by melting the solder by controlling the vibration time such as intermittent vibration.

FIG. 2 is a diagram showing a schematic configuration of a reflow apparatus in the second embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same component as 1st Embodiment in the figure, and description is simplified.
The substrate 200 to be soldered is preliminarily coated with a solder paste, and an SMT (Surface Mount Technology) component, that is, an electronic component 203 (for example, a chip resistor or a chip capacitor) as a surface-mounted electronic component and a first one. In a state where the BGA component 201 and the second BGA component 202 are mounted, they are carried into the VPS device 600 and conveyed by the conveying belt 100 in the VSP device 600. At this time, an electronic component 203 such as a chip resistor or a chip capacitor may be mounted on the back surface of the substrate 200.

  The substrate 200 is fixed to a conveyor belt 100 guided by a guide roller 101 and traveling in the Y direction via a substrate support 102, and a VPS device as a heating device (the contour line shown is a sealed space of the VPS device). The solder paste and the solder balls are melted and soldered while being heated while moving through 600). That is, in the second embodiment, not only the substrate 200 is supported, but also the substrate 200 is supported while being moved by using the transport belt 100 corresponding to the substrate support device in the first embodiment. .

  A heat medium tank 602 is provided below the conveyor belt 100 in the VPS device 600, and the liquid phase heat medium 603 stored in the heat medium tank 602 is heated by the heater 604 to obtain a gas phase state. The solder reflow process is performed by the energy released when the heat medium 603 in the vapor phase is in the liquid phase.

Reference numeral 300 denotes a vibration control unit which receives operation information from the VPS device control unit 601 that controls the VPS device 600 and receives a substrate 200 (in this embodiment, more specifically, a substrate that supports the second BGA component 202). The position of the support tool 102) in the VPS device 600 is grasped.
In the vibration control unit 300, the mounting position information of the second BGA component 202 mounted on the substrate 200 is input and stored in advance. Further, the vibration control unit 300 infers from the position information the timing at which the substrate 200 is heated in the VPS device 600 as a heating device, and the solder ball disposed below the second BGA component 202 is melted. The arm system 500 is moved to bring the arm system 500 into contact with the second BGA part 202.

  In the arm system 500, for example, a first arm 501, a second arm 502, and a third arm 503 each having a one-dimensional degree of freedom are connected in series with different displacement directions. The tip of the third arm 503 can be brought into contact with the second BGA component 202. These first to third arms 501 to 503 are uniaxial driving devices such as pneumatic cylinders and linear actuators, for example. However, considering the high temperature in the VPS device 600 and the weather resistance under steam of the heat medium. Therefore, it is desirable that the mechanism be easy to maintain, replace parts, etc. and be low cost.

  In FIG. 2, since the connection of the first, second, and third arms 501, 502, and 503 is expressed for the sake of convenience, the operating directions of the first arm 501 and the third arm 503 coincide. However, for example, the displacement direction of the first arm 501 indicated by the arrow X in the figure is the X-axis direction, and the displacement direction of the second arm 502 indicated by the arrow Y is the Y-axis direction, and is indicated by the arrow Z. The displacement direction of the third arm 503 is the Z-axis direction. Note that the displacement directions of the first, second, and third arms 501, 502, and 503 are not necessarily orthogonal to each other. If they can be displaced in different directions, the X-axis, Y-axis, The tip of the third arm 503 can be arranged at an arbitrary position in the Z-axis direction.

The weak vibration generator 400 functions as a vibration generator that generates vibration and applies weak vibration to the second BGA component 202 through the arm system 500. The frequency of this vibration can be set in the range of several Hz to several tens of MHz, and the vibration direction in the X direction / Y direction / Z direction and the amplitude in each direction can be controlled.
As in the example of FIG. 1, the Y direction is defined as the traveling direction of the transport belt 103, the X direction is defined as a horizontal direction perpendicular to the traveling direction of the transport belt 103, and the Z direction is defined as a vertical direction.

  The vibration control unit 300 controls the weak vibration generator 400 to apply vibrations intermittently (intermittently) in the range of several tens of μs to several hundreds of milliseconds, and this vibration is vibrated at the tip of the third arm 503 (this part is vibrated). (Referred to as a contact 503a for transmission) to the second BGA component 202. The reason why the vibration is intermittently (intermittently) in this manner is that the vibration is transmitted to components such as a chip capacitor having a small weight disposed around the second BGA component 202, and these components resonate. The purpose is to prevent it from happening. In addition, by providing a period during which vibration is not caused, it is possible to allow time for the solder ball whose oxide film is broken by vibration to flow and become familiar with the soldering surface. However, when the influence on a component having a small weight is so small that it can be ignored, it is not essential to provide a period during which vibration is not caused.

In addition, the vibration control unit 300 controls the arm system 500 (mainly the second arm 502 because it moves in the direction of the arrow Y) while applying vibration intermittently so as to follow the traveling speed of the conveyor belt 103. The contactor 503a and the BGA component 201 are maintained in contact with each other and controlled so as to be stably vibrated.
Further, the vibration control unit 300 starts to generate vibration after the solder of the substrate 200 is melted by the inert vapor. The reason is to prevent the component from falling off the substrate 200, and the vibration propagating to the substrate 200 can be reduced by utilizing the effect of vibration absorption of the solder that has become the liquid after melting the solder.
Furthermore, depending on the size of the BGA and soldering conditions, it is assumed that there are cases where the oxide film cannot be broken even if vibration is applied. In this case, by controlling to increase the amplitude (increase the vibration intensity), to increase the vibration frequency (the higher the frequency, the greater the energy), and to increase the vibration period, It is also effective to increase the probability of breaking the oxide film.

  It is almost impossible to adjust the magnitude of the appropriate amplitude and the period for applying vibration while actually observing the state of the solder melted by the heating state. This is because it is generally difficult to observe the situation between the BGA components 201 and 202 and the substrate 200 with visible light, and it is also common to determine the state of solder using an X-ray image, an ultrasonic image, or the like. Absent. Therefore, as a simple method, for example, it is determined from the image inside the VPS device 10 whether the BGA components 201 and 202 vibrate with a large amplitude or cause a positional shift. If there is, it is determined that it has an influence, and the amplitude is determined by a rule of increasing / increasing the amplitude of vibration as much as possible within a range that does not affect the BGA parts 201 and 202 and the surrounding small parts. May be. For example, the amplitude may be as large as possible within a range in which small components such as the peripheral electronic component 203 do not fall off the substrate 200.

  Further, in order to reduce the influence on the BGA parts 201 and 202 and surrounding small parts, the vibration generated by the weak vibration generator 400 is changed by changing the direction of the vibration generated by the weak vibration generator 400 or the vibration generated by the weak vibration generator 400. When the direction is constant, the vibration direction is changed to the X direction / Y direction / Z by changing the direction in which the distal third arm 503 contacts the second BGA part 202 by operating the entire arm system 500. It is also effective to increase the probability of breaking the oxide film by applying vibration in various directions to the oxide film while avoiding resonance by applying vibration while changing the direction. When changing the X direction / Y direction / Z direction and the vibration direction, for example, by gradually changing the tip position of the arm 503 to rotate, it is possible to increase the probability of breaking the oxide film due to the stirring effect in the solder ball. It becomes possible.

  When the plurality of BGA components 201 and 202 are mounted on one substrate 200, such as the first BGA component 201 and the second component 202, the vibration control unit 300 is a component that decreases in temperature ( The first BGA component 201) close to the exit in the direction of arrow A is given priority to give vibration. The reason for this is that as the temperature decreases, the deflection of the component decreases, and the shape of the solder ball approaches ideal. This is because the deflection is reduced and the probability of breaking the oxide film is increased by giving vibration until the last timing when the solder is melted.

  Reference numeral 302 denotes a camera, and the camera 302 sends a captured image to the vibration control unit 300. The vibration control unit 300 can analyze the received image and then use it to improve the positional accuracy of the BGA component 202. Alternatively, a BGA image database is held in 300 and compared with the database, it becomes possible to specify a target BGA component to be given vibration without inputting BGA position information for each substrate. Alternatively, by obtaining coordinates only from the BGA position information for each substrate, it is possible to eliminate the need for position information feedback from the camera 302 based on the image.

In the solder reflow apparatus, while the BGA components 201 and 202 fixed by the substrate support 102 on the transport belt 100 are transported, the VPS device 600 is filled with the vapor of the heat medium 603 to fill the substrate 200 and the BGA components 201. 202, the solder paste and the solder bumps are heated to perform a reflow process. The vibration control unit 300 controls the arm system 500 so as to bring the vibrating piece 503a into contact with the second BGA component 202 at a predetermined position (moving the predetermined position), and weakly applies the second BGA component 202 to the second BGA component 202. The vibration of the vibration generator 400 is transmitted and excited.
In this excitation, the vibration control unit 300 controls the excitation time, such as the start, end, and interruption of the excitation, and the amplitude and direction of the excitation as necessary. Further, the arm system 500 is controlled to move the vibrator 503a in accordance with the movement of the second BGA component 202.

The relationship between the deflection and the soldering state in the solder reflow process will be described with reference to FIGS.
In FIG. 5A, the left side shows an ideal state, that is, a connection state in which the board 2a and the electronic component 2b such as a BGA package are solidified integrally with the solder balls 7 being slightly crushed, and the right side is a so-called Head in It is the figure which showed the state which Pillow phenomenon generate | occur | produced and isolate | separated into the upper solder 7a and the lower solder 7b. On the right side, the solder is solidified while being divided into upper and lower parts, and this is because the oxide film on the surface of the solder does not break at the melting to solidification stage existing in between, and the upper and lower solders cannot be united together There is. Here, the lower side is a substrate, and the upper side is a BGA package.

The oxide film that causes the Head in Pillow phenomenon is that the solder paste 8 on the substrate side and the solder bumps (solder balls) 7 on the BGA side are separated by the warpage of the BGA package 2b due to heat. Is done. FIG. 5B shows this state.
However, the warpage returns when the BGA package 2b contracts due to a decrease in temperature as it approaches the outlet of the VPS device 600. When the warpage returns, the flux activity disappears when it comes into contact with the solder paste 8 on the substrate 2a side, and the surface oxide film cannot be removed. As a result, when the upper and lower solders cannot be fused and are sandwiched between the substrate 2a and the BGA package 2b and cannot be integrated, they become a head in pillar phenomenon state. This state is shown in FIG. 4c. That is, at the right end restored most late, the upper solder 7a and the lower solder 7b are in an insufficiently fused state.

  In the soldering apparatus according to the first embodiment, the vibration control unit 300 intermittently applies vibrations to destroy the surface oxide film of the melted solder when the second BGA component 202 is soldered. Thus, good fluidity can be obtained to prevent solder failure, and damage to other electronic components can be reduced by excessive vibration energy.

A third embodiment of the present invention will be described with reference to FIG. In the figure, the same components as those in the first and second embodiments are denoted by the same reference numerals, and the description will be simplified.
FIG. 3 is a diagram showing a schematic configuration of a reflow apparatus in the third embodiment of the present invention.
In the second embodiment, the target BGA component 202 is vibrated using the arm system 500, but in the third embodiment of FIG. 3, as in the side view of the reflow device shown in FIG. The difference is that vibration is applied to the target BGA component 202 using vibration from the transducer 401 constituting the ultrasonic array 400 as a weak vibration generator. In other words, the ultrasonic array 400 includes ultrasonic transducers 401 arranged in a matrix as shown in FIG. 3B as viewed from below (as viewed from the bottom in the Z-axis direction). As a whole, it functions as a weak vibration generator.

Reference numeral 301 denotes a vibration control unit. The vibration control unit 301 acquires substrate position information from the VPS device control unit 601 and controls the ultrasonic array support unit 402 that supports the ultrasonic array 400.
The vibration control unit 301 controls the phase of the ultrasonic array 400 to intermittently apply a directivity ultrasonic wave to the target BGA part 202 over a time range of several tens of μs to several hundreds of milliseconds. The reason for intermittently applying vibration is not to affect the electronic component 203 such as a small-weight chip capacitor disposed around the BGA component 202, and particularly to prevent vibration with excessive amplitude due to resonance. The purpose is to do.

  In addition, it is also intended to provide a time for a solder ball whose oxide film is broken by vibration to become compatible by providing an intermittent operation, that is, a period during which no vibration occurs. However, it is not essential to provide a period during which vibration is not caused unless there is an effect on a component having a small weight.

  Further, the ultrasonic array support unit 402 maintains the distance from the substrate surface and the horizontal position in accordance with an instruction from the vibration control unit 301. That is, the position is controlled to move in the arrow Z direction so as to maintain an optimum distance for applying vibration to the target BGA component 202, and the position is controlled by moving in the arrow Y direction. The ultrasonic array support unit 402 may further be movable in the X coordinate direction. In this case, a plurality of (for example, eight) transducers 401 constituting the ultrasonic array 400 are arrayed in the Y axis direction. In the X-axis direction, there are fewer than eight, for example, one, two, that is, one or two arrays in the Y-axis direction, and the ultrasonic array support unit 402 in the X-axis direction. May be aligned with the BGA component 201 in the X-axis direction.

  The camera 302 sends the captured image to the vibration control unit 301 as in the second embodiment. The vibration control unit 301 can analyze the sent video and improve the accuracy of position determination of the second BGA component 202. Alternatively, the BGA image database is stored in the vibration control unit 301 and compared with the database, the BGA component 202 to be subjected to vibration is specified without inputting the BGA position information for each substrate 200. It is also possible. Alternatively, it is possible to adopt a configuration in which position control by the ultrasonic array support unit 402 is not required by obtaining coordinates only from BGA position information for each substrate 200. That is, instead of the position information based on the image obtained from the camera 302, known position information may be used. Further, the weak vibration control unit 301 as the vibration control unit performs image analysis, measures the vibration intensity from the image information of the second BGA component 202 that has given vibration, and instructs the ultrasonic array 400 to obtain the ultrasonic intensity. A configuration in which feedback control is performed is also effective.

  Further, while the vibration is intermittently applied, the ultrasonic irradiation direction can be made to follow the traveling speed of the transport belt 100 by the phase control of the ultrasonic array 400, and the vibration can be stably applied. Further, the ultrasonic array support unit 402 moves the entire ultrasonic array 400 (without changing the positional relationship between the transducers of the ultrasonic array) in the direction of arrow Y in FIG. The irradiation direction can be made to follow the movement of the BGA component 202. In addition, since the ultrasonic transducers are arranged in a matrix, by controlling the movement of the ultrasonic transducers or by operating only some of the transducers in a straight line (array) along the X-axis direction, It is possible to irradiate ultrasonic waves only to a predetermined area. That is, the target BGA component 202 is controlled by the phase control (and the ON-OFF control of the operation range) of the ultrasonic vibration of each transducer 401 of the ultrasonic array 400 and the control of moving the position of the entire ultrasonic array 400. It is possible to reduce the influence of ultrasonic waves on other regions by applying ultrasonic vibration toward Furthermore, by controlling the phase of the ultrasonic wave generated by each transducer 401 of the ultrasonic array 400, the phase is such that the ultrasonic wave is concentrated on the target BGA component in the same manner as the concentration of the radio wave due to the reflection of the parabolic antenna. It is also effective to vibrate each ultrasonic array. This method can also reduce the influence of ultrasound on other areas. At this time, it is effective to adjust the ultrasonic array 400 in the Z and Y directions so that the ultrasonic wave is efficiently adjusted so that the ultrasonic waves concentrate on the parts.

Similarly to the second embodiment, the vibration control unit 301 controls the ultrasonic array 400 to start generating vibration after the solder of the substrate 200 is melted by the inert vapor. By this control, it is possible to prevent parts from falling off the board 200 and to reduce vibrations that propagate to the board 200.
Furthermore, depending on the size of the BGA and soldering conditions, it is assumed that there are cases where the oxide film cannot be broken even if vibration is applied. In this case, a measure to increase the amplitude (increase the vibration intensity), a measure to increase the vibration frequency (energy increases as the frequency becomes higher), and a longer measure to increase the vibration period increase the probability of breaking the oxide film. It is also effective to do.
Even in the third embodiment, when a plurality of BGA parts 201 and 202 are mounted on one substrate 200 for the same reason as in the other embodiments, it is close to the exit in the direction of arrow A. It is desirable to give vibration preferentially to a part whose temperature decreases, such as the first BGA part 201.

In the solder reflow apparatus, the reflow process is performed by heating while conveying the BGA parts 201 and 202 on the conveyor belt 100. The vibration control unit 301 controls the ultrasonic array 400 to irradiate the ultrasonic US to a region around the second BGA component 202 that is in a predetermined position (moves the predetermined position) to apply vibration. Then, the vibration is transmitted to the second BGA component 202 by the ultrasonic wave US and is vibrated.
In this excitation, the vibration control unit 301 controls the excitation time such as the start, end, and intermittent of the excitation, and the amplitude and direction of the excitation by phase control of the ultrasonic array 400 as necessary. To control. Further, the movement of the ultrasonic array support unit 402 is controlled to move the ultrasonic US irradiation area of the ultrasonic array 400 in accordance with the movement of the transport belt 100.

A fourth embodiment of the present invention will be described with reference to FIG. In the figure, the same reference numerals are given to the same components as those in the first, second, and third embodiments, and the description will be simplified.
FIG. 4 is a diagram showing a schematic configuration of a reflow apparatus in the fourth embodiment of the present invention.
Reference numeral 403 denotes a weak vibration control unit which has a function of measuring the ambient temperature and a function of generating a vibration of several Hz to several tens of MHz according to the information. At this time, in order to prevent parts from falling off the substrate 200, the vibration direction to be generated is only the horizontal direction of the Y direction or the X direction. In the fourth embodiment, control is performed so as to generate vibration in a direction connecting the center of gravity of the substrate 200 and the weak vibration control unit 403.

The weak vibration control unit 403 is fixed to the substrate 200 by any means that can be detachably fixed to the substrate 200 such as a clip or a permanent magnet so that the substrate 200 can be directly subjected to horizontal vibration. desirable.
Further, the weak vibration control unit 403 starts to generate vibration after the solder of the substrate 200 is melted by the thermal energy accompanying the liquefaction of the inert vapor. The reason is to prevent the component from falling off the substrate 200, as in the other embodiments, but to utilize the phenomenon that the liquid solder after solder melting absorbs vibration and is less likely to drop off. It is.

  As the vibration frequency, the higher the frequency, the greater the energy that can be given to the solder balls. Therefore, a higher frequency is desirable, but the relatively heavy BGA components 201 and 202 and the relatively light weight peripheral component such as a peripheral capacitor 203 It is also effective to give a low frequency with a large amplitude by using the weight difference (inertia difference). It is also effective to increase the probability of breaking the oxide film by switching the effective frequency in a time division manner.

In order to realize such vibration control, the weak vibration control unit 403 passes the peak temperature inside the VPS device 600 (specifically, the temperature of the second BGA component 202 to be soldered) by the ambient temperature observation function. Then, after a certain period of time has elapsed, vibration generation starts, and vibration is intermittently applied to the substrate 200 in the range of several tens of μs to several hundreds of milliseconds. The reason why the vibration is intermittently applied is to reduce the weight of the component such as a chip capacitor having a small weight disposed around the BGA component 202 and secure a time for the melted solder to be adjusted. is there.
The vibration continues until the temperature of the entire substrate 200 becomes equal to or lower than the solder melting point. The reason for this is that as the temperature decreases, the deflection of the parts decreases, and the shape of the solder ball approaches the ideal.Therefore, the probability of breaking the oxide film by giving vibration to the last minute timing when the solder is melted in a better situation. This is to increase it.
The vibration control described above may be performed by measuring the time after the processing target is put into the VPS device 600 regardless of the temperature, or by integrating the time information and the observed ambient temperature information. And may be controlled. Alternatively, accurate vibration control may be performed by performing wireless communication with the VPS device control unit 601.
The fourth embodiment has an advantage that the weak vibration control unit 403 can be attached to an object to be soldered, and therefore can be implemented without special modification of the existing VPS device itself.

  The VPS devices used in the second to fourth embodiments mainly include an in-line type that heats a soldering target while being conveyed by a belt conveyor, and a predetermined number of soldering targets in a stationary state in a heating container. There is a batch type that is installed and heated, and in this specification, the in-line type as shown in FIGS. 2 to 4 is assumed, but the support device of the first embodiment in FIG. This case is also included. That is, it is needless to say that the present invention can be applied to a batch-type device by making a slight change to the components such as the vibration device and the vibration control unit of each embodiment.

  As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, this invention is not limited to the said embodiment, A various deformation | transformation is possible within the range of the invention described in the claim. Needless to say, they are also included in the scope of the present invention.

  The present invention can be used for manufacturing electronic devices by solder reflow.

DESCRIPTION OF SYMBOLS 1 Support apparatus 2 Soldering object 2a Board | substrate 2b Electronic component (BGA package)
DESCRIPTION OF SYMBOLS 3 Vibration control part 4 Excitation apparatus 5 Support apparatus 6 Heating apparatus 100 Conveyor belt 101 Guide roller 102 Substrate support 200 Substrate 201 (First) BGA part 202 (Second) BGA part 203 Electronic part 300 Vibration control part 301 (Weak) Vibration control unit 302 Camera 400 Weak vibration generator (ultrasonic array)
401 Vibrator 402 Ultrasonic Array Support Unit 403 Weak Vibration Control Unit 500 Arm System 501 First Arm 502 Second Arm 503 Third Arm 503a Contactor 600 VPS Device 601 VPS Device Control Unit 602 Heat Medium Tank 603 Heat Medium 604 Heater

Claims (10)

A heating device for heating an electronic component including a soldering target;
A vibration device that vibrates the soldering target that is a part of an electronic component heated by the heating device;
A vibration control unit for controlling the vibration time of the vibration device;
Soldering apparatus having   The soldering device according to claim 1, wherein the vibration device intermittently vibrates the soldering target by controlling a vibration time of the vibration device.   3. The soldering according to claim 1, wherein the vibration control unit vibrates the soldering object during a period until the solder is solidified by controlling the vibration time of the vibration device. apparatus.   The soldering device according to any one of claims 1 to 3, wherein the vibration control unit controls a vibration position of the vibration target device to be soldered according to a position of the solder target. The vibration exciter has a contact that transmits vibration in contact with a soldering target;
The soldering apparatus according to any one of claims 1 to 4, wherein the vibration control unit controls the excitation position by controlling at least one of a position and a posture of the contact.   The soldering apparatus according to any one of claims 1 to 4, wherein the vibration control unit controls a phase of an ultrasonic array to be irradiated so that an ultrasonic amplitude is strengthened most in the soldering target.   The vibration control unit controls the position of the vibration device by controlling the position of the vibration device so that the ultrasonic wave strongly reaches the soldering target. The soldering apparatus as described.   The soldering device according to any one of claims 1 to 7, wherein the vibration control unit controls a direction in which the vibrating device vibrates the soldering target.   The soldering device according to any one of claims 1 to 3, wherein the vibration device is attached to a substrate on which the electronic component to be soldered is mounted and applies vibration to the substrate. A step of supporting an electronic component including a soldering target at a predetermined position, and a heating step of heating the soldering target that is a part of the electronic component at a predetermined position;
A vibration step for vibrating the soldering object heated by this heating step;
A vibration control step for controlling the excitation time in the vibration step together with the heating step,
Manufacturing method of electronic component having

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