JP2012024771A - Ultrasonic vibration joining device and ultrasonic vibration joining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology for readily applying ultrasonic vibrations in a plurality of different directions continuously by a simple structure without greatly changing an arranging direction of a joined object.SOLUTION: Since the ultrasonic vibration is applied to a substrate 5a and a joining part by abutment of a joining tool 36a at a first joining position with upward (a first direction) movement of a resonator 32 by a drive unit 11, and the ultrasonic vibration is applied to a substrate 5b and a joining part by abutment of a joining tool 36b with downward (a second direction) movement of the resonator 32 by the drive unit 11, the ultrasonic vibrations can be readily applied in the plurality of different directions continuously by the simple structure in which the drive unit 11 for vertically moving the resonator 32 is provided even not altering greatly the orientation of the substrates 5a and 5b and a fin 6.

Description

  The present invention relates to an ultrasonic vibration bonding technique for bonding superposed objects by ultrasonic vibration.

  2. Description of the Related Art Conventionally, an ultrasonic vibration bonding apparatus including a resonator to which a vibrator is connected is known. Generally, a bonding action unit for applying ultrasonic vibration in contact with an object to be bonded is connected to the resonator. Is provided. Then, the vibration oscillated from the vibrator in accordance with the natural frequency of the resonator is amplified by the resonator, and the amplified ultrasonic vibration is applied to the object to be joined by the joining action portion.

  For example, an ultrasonic vibration bonding apparatus described in Patent Document 1 includes a resonator that is supported and fixed by a support member, and a vibrator that is connected to one end of the resonator and that is formed by a piezoelectric element or the like to oscillate ultrasonic vibration. And a bonding tool attached and fixed to the other end of the resonator. Then, the ultrasonic vibration oscillated from the vibrator is amplified by the resonator and transmitted to the bonding tool, and the ultrasonic vibration transmitted to the bonding tool is applied to the object to be bonded to bond the object to be bonded.

Japanese Unexamined Patent Publication No. 2007-142049 (paragraphs 0034 to 0037, FIG. 1, etc.)

  In the ultrasonic vibration bonding apparatus of Patent Document 1, a bonding tool that applies ultrasonic vibration to a bonded portion of an object to be bonded is formed to protrude downward from the resonator, and is bonded below the resonator facing the bonding tool. Ultrasonic vibration is applied to the joint portion of the article to be joined disposed at the position. In other words, since ultrasonic vibration can be applied only from one direction to the joint portion of the article to be joined, it is necessary to always place the joint portion of the article to be joined at the joining position.

  Therefore, when a joining portion is provided on each of two surfaces substantially orthogonal to each other inside a plate-like member bent in a substantially L shape as an object to be joined, When it is necessary to apply ultrasonic vibrations to a plurality of joints arranged in different directions, such as when joints are provided on each side surface, in conventional devices, the ultrasonic waves are Since the ultrasonic vibration cannot be applied, in order to apply the ultrasonic vibration to each joint part, each joint part is arranged at the joining position facing the bonding tool. Has to be changed greatly, which is very complicated.

  The present invention has been made in view of the above-described problems, and can easily apply ultrasonic vibration continuously in a plurality of different directions with a simple configuration without greatly changing the arrangement direction of the objects to be joined. It aims at providing the technology that can do.

  In order to solve the above-described problem, an ultrasonic vibration bonding apparatus according to the present invention applies ultrasonic vibration to bonding portions of a plurality of objects to be bonded to each other to bond the objects to be bonded. In the vibration bonding apparatus, a resonator is connected to one end of the resonator and resonates with ultrasonic vibration of the resonator, and provided at the other end of the resonator to contact the object to be bonded. A joining means for applying ultrasonic vibrations to the joining portion; and a moving means for moving the resonator in at least two different directions, the joining means moving the resonator in the first direction by the moving means. The ultrasonic vibration is applied to the joint at the first joint position by the movement, and the ultrasonic vibration is applied to the joint at the second joint position by the movement of the resonator in the second direction by the moving means. Applying to Is characterized (claim 1).

  Moreover, the ultrasonic vibration welding apparatus according to the present invention includes the bonding of the objects to be bonded arranged at the first bonding position when the resonator is moved in the first direction by the moving unit. Holding the periphery of the part and holding the periphery of the joined part of the article to be joined disposed at the second joining position when the resonator is moved in the second direction by the moving means. Further, it is characterized by further comprising a fixing means for pressing and holding (Claim 2).

  Further, in the ultrasonic vibration welding apparatus according to the present invention, the moving means includes a support portion that supports the resonator, and a drive mechanism that switches the support portion to the first direction or the second direction. And a pressurizing mechanism that pressurizes the resonator in the first direction or the second direction (Claim 3).

  Further, an ultrasonic vibration bonding method according to the present invention is an ultrasonic vibration bonding method in which ultrasonic vibration is applied to bonding portions of a plurality of objects to be bonded to each other to bond the objects to be bonded. Ultrasonic wave by moving the resonator in the first direction by moving means that moves at least in two different directions and bringing the joining means provided in the resonator into contact with the object to be joined at the first joining position. Applying vibration to the joint, moving the resonator in the second direction by the moving means, and bringing the joining means into contact with the object to be joined at a second joining position causes the ultrasonic vibration to It applies to a junction part, It is characterized by the above-mentioned (Claim 4).

  According to the first and fourth aspects of the invention, due to the movement of the resonator in the first direction by the moving means, the ultrasonic vibration causes the joining means to contact the object to be joined at the first joining position. Since the ultrasonic vibration is applied when the joining means comes into contact with the article to be joined at the second joining position due to the movement of the resonator in the second direction by the moving means, the arrangement of the article to be joined Even if the direction is not largely changed, ultrasonic vibration can be applied continuously in a plurality of different directions with a simple configuration in which a moving means for moving the resonator in at least two different directions is provided.

  According to the second aspect of the present invention, when the resonator moves in the first direction by the moving means, the periphery of the joint portion of the object to be joined disposed at the first joining position is pressed by the fixing means. When the resonator is moved in the second direction by the moving means, the periphery of the joint portion of the object to be joined disposed at the second joint position is pressed and held. It is possible to prevent positional deviation from occurring in a plurality of objects to be joined that are overlapped when is applied to the joint.

  In addition, since the ultrasonic vibration is applied to the bonded portion in a state where the periphery of the bonded portion is pressed by the fixing means, the ultrasonic vibration to be applied to the bonded portion to be bonded is not the other of the peripheral bonded. Therefore, it is possible to prevent peeling or the like from occurring in the joint that has already been joined.

  According to invention of Claim 3, the support part which supports a resonator is switched and driven by the drive mechanism in the 1st direction or the 2nd direction, and the resonator is a pressurizing mechanism in the 1st direction or the 2nd direction. Therefore, the moving position of the resonator and the pressure applied to the object to be bonded by the bonding means provided in the resonator and contacting the object to be bonded can be controlled.

1 is a schematic configuration diagram of an ultrasonic vibration bonding apparatus according to a first embodiment of the present invention. It is the schematic of the resonator of FIG. 1, (a) is a top view, (b) is a front view. It is a schematic block diagram of the to-be-joined object in 1st Embodiment of this invention. It is explanatory drawing which shows the joining procedure of the to-be-joined object of FIG. It is explanatory drawing which shows the joining procedure of the to-be-joined object of FIG. It is explanatory drawing which shows the joining procedure of the to-be-joined object of FIG. It is explanatory drawing which shows the joining procedure of the to-be-joined object of FIG. It is explanatory drawing which shows the joining procedure of the to-be-joined object of FIG. It is explanatory drawing which shows the joining procedure of the to-be-joined object of FIG. It is a partial schematic block diagram of the ultrasonic vibration joining apparatus in 2nd Embodiment of this invention. It is a partial schematic block diagram of the resonator shown in FIG. It is a partial schematic block diagram of the ultrasonic vibration joining apparatus in 3rd Embodiment of this invention. It is a modification of the ultrasonic vibration joining apparatus of FIG. It is a figure which shows an example of a to-be-joined object. It is a principal part enlarged view of the ultrasonic vibration joining apparatus in 4th Embodiment of this invention.

<First Embodiment>
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic configuration diagram of an ultrasonic vibration bonding apparatus according to the present invention. 2A and 2B are schematic views of a resonator provided in the ultrasonic vibration bonding apparatus shown in FIG. 1, wherein FIG. 2A is a plan view and FIG. 2B is a front view. FIG. 3 is a schematic configuration diagram of the object to be joined. 4 to 9 are explanatory views showing the joining procedure of the objects to be joined.

1. 1. Apparatus Configuration The ultrasonic vibration bonding apparatus 1 shown in FIG. 1 applies ultrasonic vibration to the bonded portions of the objects to be bonded to each other and bonds the objects to be bonded. The fin 6 as the other object to be bonded is disposed between the substrate 5a and the substrate 5b as one of the objects to be bonded, and ultrasonic vibration is applied to the bonding part 6a of the fin 6 to thereby form the substrate. The joining portions 6a and 6b of the fin 6 are joined to the joining surfaces 50a and 50b of 5a and 5b, respectively.

  The ultrasonic vibration bonding apparatus 1 includes a base 10, a drive unit 11 provided on the base 10, a head unit 12 coupled to the drive unit 11, a mounting unit 13 in which an object to be bonded is disposed, And a control device 14 that controls the entire ultrasonic vibration bonding apparatus 1.

  The drive unit 11 includes a support column 15 provided on the base 10, a drive mechanism 18, and a support base 16 that is coupled to the drive mechanism 18 and disposed above the base 10. The base 10 is provided with four support columns 15 around the drive mechanism 18 so as to surround the drive mechanism 18. The support table 16 has a guide portion 17 having a guide hole (not shown). 15 are formed at four locations corresponding to 15. The support base 16 is disposed above the base 10 with the support column 15 inserted through the guide holes of the guide portion 17. When the drive mechanism 18 is driven, the support base 16 The peripheral surface is guided by the guide portion 17 that is in sliding contact with the outer peripheral surface of the support column 15, and moves above the base 10 in the vertical direction.

  The drive mechanism 18 includes a drive motor 20, a ball screw 21 connected to the rotation shaft of the drive motor 20, a guide 22 that is screwed to the ball 21, and a cam follower 23 provided on the guide 22. The guide 22 is provided by being guided by an LM guide 22 a (Linear Motion Guide) that guides the movement in the horizontal direction parallel to the ball screw 21. Therefore, when the drive motor 20 is excited and rotated in one direction, the guide 22 screwed into the ball screw 21 moves horizontally along the LM guide 22a in the direction away from the drive motor 10, and the drive motor 20 is excited. When the current is reversed and the drive motor 20 rotates in the other direction, the guide 22 screwed into the ball screw 21 moves horizontally along the LM guide 22a, which is the direction approaching the drive motor 10.

  The drive mechanism 18 includes a plate cam 24 a disposed on the front side of the cam follower 23 provided on the guide 22 and a plate cam 24 b disposed on the rear side of the cam follower 23. An inclined surface that abuts the cam follower 23 from the upper front side is formed on the rear side of the plate cam 24a, and an inclined surface that abuts the cam follower 23 from the lower rear side is formed on the front side of the plate cam 24b. Yes.

  Further, an upward air cylinder 25a is provided on the tongue-like surface formed on the front side of the plate cam 24a so as to pressurize upward, and the lower surface on the front side of the support base 16 and the plate cam 24a are arranged. It is connected via an upward air cylinder 25a.

  Further, a substantially central portion on the rear side of the support base 16 is bent downward to form a concave portion 26 having a substantially L shape in cross section, and an extension portion 27 having a substantially U shape in cross section on the rear side of the plate cam 24b. Is formed. Then, the upper surface of the substantially L-shaped recess 26 of the support base 16 and the lower surface of the substantially U-shaped extension 27 of the plate cam 24b are arranged to face each other so that a substantially letter-shaped space in cross section is formed. Then, the concave portion 26 of the support base 16 and the extension portion 27 of the plate cam 24b are connected to each other via a downward air cylinder 25b disposed on the lower surface of the extension portion 27 to pressurize downward. .

  Therefore, when the drive motor 20 is driven and the cam follower 23 (guide 22) moves forward, the inclined surface of the plate cam 24a is pressed by the cam follower 23, whereby the plate cam 24a moves upward, and the plate cam 24a The support base 16 connected to the plate cam 24a and the plate cam 24b connected to the support base 16 move upward integrally.

  When the drive motor 20 is driven and the cam follower 23 (guide 22) moves backward, the inclined surface of the plate cam 24b is pressed by the cam follower 23, whereby the plate cam 24b moves downward, and the plate cam 24b The support base 16 connected to the plate cam 24b and the plate cam 24a connected to the support base 16 move downward integrally.

  That is, the movement of the guide 22 in the front-rear direction is converted into the movement of the support base 16 in the vertical direction by the cam follower 23 and the plate cams 24a, 24b formed in the guide 22, whereby the support base 16 is driven by a drive mechanism. 18 is driven to switch upward or downward.

  The support base 16 is provided with a height detection means 28 formed by a linear encoder or the like, and the height detection means 28 can detect the height of the support base 16.

  The head unit 12 is supported by the resonator support 30 provided on the upper surface on the front side of the support 16, the resonator support 31 formed on the resonator support 30, and the resonator support 31. A resonator 32, a vibrator 33 connected to one end on the rear side of the resonator 32, and stripper units 34 and 35 arranged in parallel on the other end on the front side of the resonator 32 are provided.

  As shown in FIG. 2A, the resonator 32 has a length of one wavelength of the resonance frequency so that the position f2 at the substantially center of the resonator 32 and the both end positions f0 and f4 are the maximum amplitude points. Is formed. At this time, the positions f3 and f1 that are 1/4 wavelength away from the maximum amplitude point correspond to the minimum amplitude point. The resonator 32 is formed in a cylindrical shape having a substantially circular cross-sectional shape when viewed from the front. Further, both side surfaces are tapered toward the other end side so as to be tapered in front view from the position f3 of the resonator 32, and the shape of the front view at the position f4 of the resonator 32 is up and down. It is formed in a substantially elongated rectangular shape.

  Further, the positions f3 and f1, which are the minimum amplitude points of the resonator 32, are formed to have a smaller diameter than the other portions, and thereby, the positions f3 and f1 of the resonator 32 have a concave shape along the outer peripheral surface. A supported portion (not shown) is formed. In this embodiment, the supported portion is formed so that the cross-sectional shape orthogonal to the central axis of the resonator 32 is an octagon, but the cross-sectional shape of the supported portion is an octagon. The shape is not limited, and it may be formed in a circular shape or other polygonal shapes.

  Then, the supported part is clamped by the resonator support part 31 so as to resonate so that the long axis of the rectangle that is the forward view shape of the other end (position f4) of the resonator 32 is disposed in the forward direction. A vessel 32 is supported. The resonator 32 is fixed to the resonator support 31 by clamping the supported portion with a clamp member and fixing it with a bolt, or a mechanical clamp mechanism configured to be electrically controllable or attached with one touch. Any device may be used as long as the resonator 32 can be securely supported and fixed, for example, by clamping the supported portion with a possible clamping mechanism.

  A resonator 33 is connected to one end (position f0) of the resonator 32 so as to be coaxial with the central axis of the resonator 32. The resonator 32 is controlled by the control device 14. Resonates with ultrasonic vibrations oscillated from the center and vibrates in the central axis direction.

  Further, on the upper side and the lower side of the other end (position f4) of the resonator 32, bonding tools 36a and 36b that apply ultrasonic vibration of the resonator 32 to the bonded portion of the bonded object by contacting the bonded object. (Corresponding to the “joining means” of the present invention).

  In this embodiment, the bonding tools 36a and 36b are made of the same metal as that of the resonator 32, and are bonded to the resonator 32 with a thermosetting resin or the like, but are formed by cutting directly from the resonator 32. May be. Further, the joining tools 36a and 36b may be formed of a material other than metal such as cemented carbide tungsten carbide, ceramics, diamond or the like, and the formed joining tools 36a and 36b may be formed of metal brazing such as Ni, Cu or Ag. It may be adhered to the resonator 32.

  The joining tool 36a applies ultrasonic vibration to the joining portion 6a of the fin 6 at the first joining position by the upward movement of the resonator 32 (support 16) by the driving unit 11, and the joining tool 36b The ultrasonic vibration is applied to the joint 6 b of the fin 6 at the second joint position by the downward movement of the resonator 32 (support 16) by the drive unit 11.

  In addition, by the vertical movement of the support base 16 by the drive unit 11, the height of the axis of the resonator 32 can be moved from the predetermined standby position in the vertical direction with a width of about 30 mm. The stand 16 corresponds to the moving means and the support portion in the present invention.

  Further, when the drive motor 20 is driven, the guide 22 moves forward and the support base 16 moves upward, so that when the welding tool 36a comes into contact with the upper workpiece, the guide base 22 moves upward. Although the movement stops, the plate cam 24a moves further upward as the guide 22 moves forward. Accordingly, the upward air cylinder 25a is held between the lower surface of the support 16 and the tongue-like surface of the plate cam 24a, and the piston shaft of the upward air cylinder 25a is immersed in the upward air cylinder 25a. By monitoring the amount of immersion in the air cylinder 25a with a sensor such as a photo interrupter, it is possible to detect contact with an object to be joined above the joining tool 36a.

  Further, when the drive motor 20 is driven, the guide 22 moves rearward and the support base 16 moves downward, so that when the welding tool 36b comes into contact with the lower workpiece, the support base 16 is moved downward. Although the movement stops, the plate cam 24b moves further downward as the guide 22 moves rearward. Accordingly, the downward air cylinder 25b is held between the recess 26 of the support 16 and the extension 27 of the plate cam 24b, and the piston shaft of the downward air cylinder 25b is immersed in the downward air cylinder 25b. By monitoring the amount of immersion in the downward air cylinder 25b with a sensor such as a photo interrupter, it is possible to detect contact with an object to be joined below the joining tool 36b.

  Further, as shown in FIG. 2A, stopper units 34 and 35 are disposed on both sides of the resonator 32. The stripper unit 34 includes fixed tools 37a and 37b formed of urethane rubber or the like at the tip positions where the stripping units 36a and 36b are juxtaposed. Similarly, the stripper unit 35 has the tip that is juxtaposed with the joint tools 36a and 36b. Fixing tools 38a and 38b formed of urethane rubber or the like are provided at positions.

  Each of the stripper units 34 and 35 includes an air cylinder (not shown), and the stripper units 34 and 35 move up and down independently of the vertical movement of the resonator 32 when the air cylinder is driven. When the drive unit 11 moves the resonator 32 upward, the stripper units 34 and 35 fix the periphery of the joint 6a of the fin 6 disposed at the upper first joint position to the fixing tools 37a and 38a. In the state in which the joint portion 6a is held by the stripper units 34 and 35, the joining tool 36a comes into contact with the joint portion 6a, so that ultrasonic vibration is applied to the joint portion 6a. Bonded to the bonding surface 50a of the substrate 5a.

  Further, when the drive unit 11 moves the resonator 32 downward, the stripper units 34 and 35 fix the periphery of the joint 6b of the fin 6 arranged at the second joint position below the fixing tools 37b and 38b. In the state where the joint portion 6b is held by the stripper units 34 and 35, the joining tool 36b comes into contact with the joint portion 6b so that ultrasonic vibration is applied to the joint portion 6b. Bonded to the bonding surface 50b of the substrate 5b. The stripper units 34 and 35 correspond to the fixing means in the present invention.

  The mounting unit 13 includes a lower stage 40, a lower stage table 41, an upper stage 45, and an upper stage table 46 on the base 10. Each of the lower stage 40 and the upper stage 45 includes a holding mechanism (not shown) that holds the substrates 5b and 5a, which are objects to be bonded. In this embodiment, the lower stage 40 and the upper stage 45 are provided with a holding mechanism by vacuum suction. However, the holding mechanism may be one using electrostatic suction or another holding mechanism.

  Further, the lower stage table 41 and the upper stage table 46 are provided with moving axes that can be moved in parallel and rotationally, and the substrates for the bonding tools 36a and 36b of the resonator 32 by moving the lower stage 40 and the upper stage 45 in parallel and rotating. The positions of 5a and 5b are adjusted.

  The control device 14 controls the drive motor 20 of the drive unit 11 based on the detection signal of the height position of the head unit 12 by the height detection unit 28, and feedback-controls the height of the head unit 12. That is, when the drive motor 20 is driven by the control device 14 based on the detection signal of the height detection means 28 and the guide 22 moves forward, the inclined surface of the plate cam 24a is pressed forward by the cam follower 23 and the cam follower 23 When the head portion 12 moves upward due to sliding contact with the inclined surface and the guide 22 moves rearward, the inclined surface of the plate cam 24b is pressed rearward, and the cam follower 23 and the inclined surface come into sliding contact with each other. 12 moves downward.

  Further, the control device 14 controls an electropneumatic converter (not shown) disposed in the upward air cylinder 25a and the downward air cylinder 25b to supply air to the upward air cylinder 25a and the downward air cylinder 25b. The pressure applied to the substrates 5a and 5b and the bonding portions 6a and 6b of the fins 6 by the bonding tools 36a and 36b is adjusted by pressing the resonator 32 upward or downward. That is, after the joining tools 36a and 36b of the resonator 32 and the joining portions 6a and 6b of the fin 6 come into contact with each other, an electropneumatic converter (not shown) disposed in the upward air cylinder 25a and the downward air cylinder 25b. Air is supplied to the upward air cylinder 25a and the downward air cylinder 25b, the support 16 is further raised or lowered, and a predetermined pressure is applied to the joints 6a and 6b of the fin 6.

  Further, the control means 14 supplies air to the upward air cylinder 25a in order to cancel the weight of the support base 16 and the head unit 12 when the downward air cylinder 25b pressurizes the resonator 32 downward. In this way, when the resonator 32 is pressed downward, the weight of the support base 16 and the head portion 12 is canceled by the upward pressure applied by the upward air cylinder 25a. Since only the pressurizing force due to the air supply to the cylinder 25b is applied, the pressurizing force applied to the object to be joined (joined portion 6b) by the resonator 32 can be accurately controlled.

  Further, the control device 14 includes an operation panel (not shown) for controlling the entire ultrasonic vibration bonding apparatus, and ultrasonic vibration obtained from the voltage value and / or current value applied to the vibrator 33. Controls energy, operation of air cylinders disposed in the stripper units 34 and 35, and the like. As described above, the upward air cylinder 25a and the downward air cylinder 25b correspond to the pressurizing mechanism of the present invention.

2. Next, a structure to be bonded will be described. FIG. 3 shows a schematic configuration diagram of the substrates 5a and 5b which are one object to be bonded and the fins 6 which are the other objects to be bonded. In addition, a to-be-joined object is used as a heat sink after joining.

  The substrates 5a and 5b and the fins 6 are made of metal such as iron or aluminum, and as shown in FIG. 3, the substrates 5a and 5b are arranged so that the bonding surfaces 50a and 50b face each other. A plurality of fins 6 that are objects to be joined are arranged between 5a and 5b. And the junction part 6a of each fin 6 is joined to the junction surface 50a of the board | substrate 5a in a predetermined position in order, and the junction part 6b of each fin 6 is joined to the junction surface 50b of the board | substrate 5b in order to a predetermined position.

3. Next, a series of operations for bonding the bonding surface 50a of the substrate 5a and the bonding portion 6a of the fin 6, the bonding surface 50b of the substrate 5b, and the bonding portion 6b of the fin 6 by ultrasonic vibration will be described. 4 to 9, only the positional relationship among the substrates 5a and 5b, the fins 6, and the resonator 32 is shown, and the other parts of the apparatus are not shown.

  First, the substrate 5a and the fins 6, which are objects to be joined, are installed on the mounting portion 13. The substrate 5a is supplied to the upper stage 45 by a transfer device (not shown) and is sucked and held. And the board | substrate 5a is arrange | positioned in the 1st joining position above the joining tool 36a so that a joining part may correspond to the position of the joining tool 36a of the resonator 32. FIG. For the alignment between the substrate 5a and the bonding tool 36a, a position detection means (not shown) formed by a camera or the like provided with a two-field optical system lens is introduced between the substrate 5a and the bonding tool 36a. Based on the relative position of the substrate 5a and the joining tool 36a, the upper stage 45 is translated and rotated by the upper stage table 46, thereby adjusting the position of the substrate 5a.

  Next, as shown in FIG. 4, the fins 6 are transported below the substrate 5a by a transport device (not shown), and the joint portions 6a of the fins 6 are arranged at predetermined positions on the joint surface 50a of the substrate 5a. Then, as shown in FIG. 5, the stripper units 34 and 35 are lifted by an air cylinder (not shown), and the fixing tools 37a and 38a come into contact with the lower surface of the joint 6a of the fin 6 in FIG. At this time, the fixing tools 37a and 38a are in contact with the lower surface of the bonding portion 6a so as to sandwich the position to which ultrasonic vibration is applied by the bonding tool 36a from both sides, and the bonding portion 6a of the fin 6 and the substrate 5a are moved downward. Press upward from the top and fix. In addition, the applied pressure to the fin 6 and the board | substrate 5a by the stripper units 34 and 35 at this time is about 50 N as an example.

  Thereafter, as shown in FIG. 6, the drive motor 20 installed in the drive unit 11 is controlled by the control device 14, thereby raising the resonator 32. When the joining tool 36a of the resonator 32 comes into contact with the joining portion 6a of the fin 6, the operation of the drive motor 20 is stopped by the control device 14.

  Further, an electropneumatic converter (not shown) is controlled by the control device 14 so that air is supplied to the upward air cylinder 25a, and the bonding surface 50a of the substrate 5a and the bonding portion 6a of the fin 6 are pressurized with a predetermined pressure. Is done. At this time, the pressure applied to the bonding portion 6a of the fin 6 and the substrate 5a by the resonator 32 is adjusted between 200 N and 2000 N according to the size of the area of the bonding portion. If the area of the bonding portion is small, for example, 200 N For example, if the area of the joint portion is large, the pressure is adjusted to about 1500 N. In FIG. 6, the stripper unit 34 is not shown.

  Thereafter, the vibrator 33 is controlled by the control device 14 to start application of ultrasonic vibration to the substrate 5a and the bonding portion 6a. During bonding, for example, the current applied to the vibrator 33 by the control device 14 The ultrasonic vibration energy obtained from the value and the voltage value, the vibration amplitude of the resonator 32, and the applied pressure are monitored and controlled.

  When the joining is completed, the pressurization by the upward air cylinder 25a is released, and the resonator 32 and the stripper units 34 and 35 are lowered to predetermined positions as shown in FIG. And the board | substrate 5a and the fin 6 are moved by the mounting part 13 so that the next joining position may be arrange | positioned above the joining tool 36a of the resonator 32. FIG. Thereafter, the stripper units 34 and 35 are raised again, and the substrate 5a and the joint 6a of the fin 6 are fixed. And the drive motor 20 of the drive part 11 is controlled by the control apparatus 14, the resonator 32 is raised, and joining operation similar to the above-mentioned is performed.

  Then, when all of the plurality of joining positions set in the joining portion 6a of the substrate 5a and the fin 6 are joined, as shown in FIG. 7, the resonator 32 and the stripper units 34 and 35 are lowered again to predetermined positions. Is done.

  Next, the substrate 5b, which is an object to be bonded, is placed on the mounting portion 13. The substrate 5b is supplied to the lower stage 40 by a transfer device (not shown), and is sucked and held on the lower stage 40 so that a predetermined bonding position of the substrate 5b and a predetermined bonding position of the bonding portion 6b of the fin 6 correspond to each other. Is done. Note that the position adjustment of the substrate 5b is performed by the parallel movement of the lower stage table 41 of the lower stage 40.

  As shown in FIG. 8, the stripper units 34 and 35 are lowered by an air cylinder (not shown), and the fixing tools 37 b and 38 b are brought into contact with the upper surface of the joint 6 b of the fin 6. At this time, the fixing tools 37b and 38b are in contact with the upper surface of the joint portion 6b of the fin 6 so as to sandwich the position where the ultrasonic vibration is applied by the joining tool 36b from both sides. And the junction part 6b of the fin 6 and the board | substrate 5b are pressed and fixed toward upper direction from the downward direction. In addition, the applied pressure to the fin 6 and the board | substrate 5b by the stripper units 34 and 35 at this time is about 50 N as an example.

  Thereafter, as shown in FIG. 9, the resonator 32 is lowered by controlling the drive motor 20 installed in the drive unit 11 by the control device 14. When the joining tool 36b of the resonator 32 comes into contact with the joining portion 6b of the fin 6, the operation of the drive motor 20 is stopped by the control device 14.

  Next, an electropneumatic converter (not shown) is controlled by the control device 14 so that air is supplied to the downward air cylinder 25b, and the bonding surface 50b of the substrate 5b and the bonding portion 6b of the fin 6 are applied with a predetermined pressure. Pressed. At this time, the pressure applied to the bonding portion 6b and the substrate 5b of the fin 6 by the resonator 32 is adjusted between 200 N and 2000 N according to the size of the area of the bonding portion. If the area of the bonding portion is small, for example, 200 N For example, if the area of the joint portion is large, the pressure is adjusted to about 1500 N. In FIG. 6, the stripper unit 34 is not shown.

  Thereafter, the control device 14 controls the vibrator 33 to start ultrasonic vibration bonding. When the substrate 5b and the joint portion 6b of the fin 6 are joined at all joining positions, the resonator 32 and the stripper units 34 and 35 are lowered to a predetermined position as shown in FIG.

  Further, new fins 6 to be bonded to the substrates 5a and 5b are transferred to a predetermined position between the substrate 5a and the substrate 5b by a transfer device (not shown), and the bonding of the fins 6 is repeated in the same manner as described above. The plurality of fins 6 are bonded to the substrates 5a and 5b.

  When the predetermined number of fins 6 are joined to the substrates 5a and 5b, the lower stage 40 and the upper stage 45 are released from suction, and the substrate 5a, the substrate 5b and the fins are removed by a transfer device (not shown). 6 is discharged in a mounted state, and a series of joining operations are completed.

  As described above, according to the embodiment described above, the ultrasonic vibration is brought into contact with the bonding tool 36a at the first bonding position by the movement of the resonator 32 upward (first direction) by the driving unit 11. Is applied to the substrate 5a and the bonding portion 6a, and the ultrasonic vibration is brought into contact with the bonding tool 36b at the second bonding position by the downward movement (second direction) of the resonator 32 by the driving unit 11, whereby the substrate Since it is applied to 5b and the joining part 6b, a plurality of parts can be easily arranged with a simple configuration in which the driving part 11 that moves the resonator 32 in the vertical direction is provided without greatly changing the arrangement direction of the substrates 5a, 5b and the fins 6. It is possible to apply ultrasonic vibration continuously in different directions.

  Therefore, the substrate 6a and the joint 6a of the fin 6 arranged at the first joining position are joined when the resonator 32 is moved upward without largely changing the arrangement direction of the substrates 5a and 5b and the fin 6. Since the substrate 5b and the joint 6b of the fin 6 disposed at the second joining position can be joined at the time of the downward movement of the resonator 32, the substrates 5a, 5b and the fin 6 can be easily and continuously connected. Even when the bonded portions of the objects to be bonded are arranged above and below the resonator 32, the objects to be bonded can be easily bonded.

  Further, when the driving unit 11 moves the resonator 32 upward by the fixing tools 37a and 38a of the stripper units 34 and 35, the periphery of the joint 6a of the fin 6 arranged at the first joint position is pressed down. When the resonator 32 is moved in the second direction by the drive unit 11 by the fixing tools 37b and 38b of the stripper units 34 and 35, the fins 6 arranged at the second joining position are joined. Since the periphery of the portion 6b is pressed and held, it is possible to prevent a positional shift from occurring in the plurality of substrates 5a and 5b and the fins 6 that are superimposed when ultrasonic vibration is applied to the bonding portions 6a and 6b. Can do.

  In addition, since ultrasonic vibration is applied to the joints 6a and 6b while the periphery of the joint position of the joints 6a and 6b is pressed by the stripper units 34 and 35, the joints 6a and 6b to be joined are applied. Since the ultrasonic vibration to be applied is prevented from being transmitted to the peripheral bonded portions, it is possible to prevent peeling or the like from occurring at the portions where the bonding has already been completed.

  Further, the support base 16 that supports the resonator 32 is driven to be switched upward or downward by the drive mechanism 18, the resonator 32 is pressurized upward by the upward cylinder 25a, and the resonator 32 is pressurized downward by the downward cylinder 25b. Therefore, the height of the resonator 32 is adjusted by the drive mechanism 18 together with the support 16 so that the object to be joined and the joining tools 36a and 36b of the resonator 32 come into contact with each other, and then joined by the upward cylinder 25a or the downward cylinder 25b. The applied pressure applied to the objects to be joined by the tools 36a and 36b can be easily adjusted. Therefore, the moving position of the resonator 32 and the pressure applied to the object to be bonded by the bonding tools 36a and 36b provided in the resonator 32 and contacting the object to be bonded can be accurately controlled.

  The bonding tools 36a and 36b are not limited to the two upper and lower portions of the resonator 32, and the positions and the number of the bonding tools 36a and 36b may be appropriately changed as long as they are formed on the outer periphery of the resonator 32.

  Further, prior to the bonding of the substrate 5a disposed at the upper first bonding position and the bonding portion 6a of the fin 6, the bonding of the substrate 5b and fin 6 disposed at the lower second bonding position is performed first. You may join to. Further, the substrate 5a and the bonding portion 6a of the fin 6 arranged at the first bonding position and the substrate 5b and the bonding portion 6b of the fin 6 arranged at the second bonding position may be alternately bonded.

<Second Embodiment>
A second embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a partial schematic configuration diagram of the ultrasonic vibration bonding apparatus according to the second embodiment. FIG. 11 is a partial schematic configuration diagram of the resonator shown in FIG. Hereinafter, differences from the first embodiment will be described in detail. 10 and 11, the same reference numerals as those in FIGS. 1 to 9 denote the same or corresponding elements.

  The ultrasonic vibration bonding apparatus shown in this embodiment is different from the first embodiment in that the resonator 52 provided in the head unit 50 of this embodiment rotates in a predetermined direction with the central axis as a rotation center while vibrating. As a result, the substrates 55a and 55b and the fins 56 as the objects to be bonded are bonded by the bonding tool 53 disposed in the resonator 52.

  As shown in FIG. 10, the head unit 50 of this embodiment includes a resonator 52, a joining tool 53, and a resonator support unit 60.

  As shown in FIG. 11, a supported portion 71 is formed in a concave shape on the outer periphery of the resonator 52, and the resonator support portion 60 is fitted into the supported portion 71 so that the resonator 52 is supported. Yes. That is, the resonator support part 60 is divided into two parts and is inserted into the supported part 71 so as to sandwich the resonator 52, and the inserted object inserted into the supported part 71. And a ball bearing 78 fitted to the outer periphery of 75. The ball bearing 78 includes an inner peripheral portion 76a, an outer peripheral portion 76b, and a sphere 77 disposed between the inner peripheral portion 76a and the outer peripheral portion 76b. The inner peripheral portion 76a, the outer peripheral portion 76b, and the sphere 77 are respectively provided. Make sliding contact.

  Then, as shown in FIG. 10, the drive unit 11 (see FIG. 1) is lowered so as to contact a predetermined position on the upper surface of the bonding portion 56 b of the substrate 55 b and the fin 56 on which the bonding tool 53 is overlaid. In a state where the fins 56 are overlapped with each other, the pressure is applied with a predetermined pressure, and ultrasonic vibration is applied.

  At this time, since the lower stage 40 and the upper stage 45 are moved in the direction of the arrow Y shown in FIG. 1, the bonding tool 53 that pressurizes the bonding portion 56 b of the substrate 55 b and the fin 56 is used for the lower stage 40 and the upper stage 45. As it moves, it rotates in a driven manner, whereby the resonator 52, the fitting insert 75 and the inner peripheral part 76 a rotate together with the welding tool 53. Then, by the movement of the substrates 55 a and 55 b and the fins 56 accompanying the movement of the lower stage 40 and the upper stage 45, the bonding tool 53 is rotated continuously from the bonding tool 53 that rotates to the bonding position in the arrow Y direction of the bonding portion 56 b of the substrate 55 b and the fins 56. Ultrasonic vibration is applied to the substrate 55b, and the substrate 55b and the joint 56b of the fin 56 are joined.

  Similarly, the drive unit 11 (see FIG. 1) raises the substrate 55a and the fins 56 so as to come into contact with a predetermined position on the lower surface of the substrate 56a and the fin 56 on which the bonding tool 53 is superimposed. In a superposed state, the pressure is applied with a predetermined pressure, and ultrasonic vibration is applied.

  At this time, since the lower stage 40 and the upper stage 45 are moved in the direction of arrow Y shown in FIG. 1, the bonding tool 53 that pressurizes the bonding portions 56 a of the substrate 55 a and the fins 56 is used for the lower stage 40 and the upper stage 45. As it moves, it rotates in a driven manner, whereby the resonator 52, the fitting insert 75 and the inner peripheral part 76 a rotate together with the welding tool 53. Then, by the movement of the substrates 55a and 55b and the fins 56 accompanying the movement of the lower stage 40 and the upper stage 45, the bonding tool 53 is rotated continuously from the bonding tool 53 that rotates to the bonding position in the arrow Y direction of the bonding portion 56a of the substrate 55a and the fins 56. Ultrasonic vibration is applied to the substrate 55ba, and the joint portion 56a of the fin 56 is joined.

  Therefore, in the second embodiment, every time the objects to be bonded are bonded at a predetermined position, the substrate 55a, 55b and the joining portions 56a and 56b of the fin 56 can be continuously and efficiently joined.

<Third Embodiment>
A third embodiment of the present invention will be described with reference to FIG. FIG. 12 is a partial schematic configuration diagram of an ultrasonic vibration bonding apparatus according to the third embodiment. Hereinafter, differences from the first and second embodiments will be described in detail. In FIG. 12, the same reference numerals as those in FIGS. 1 to 9 denote the same or corresponding elements.

  As shown in FIG. 12, the drive unit 111 in this embodiment adjusts the pressure applied to the object to be joined by the joining tools 153a and 153b of the resonator 152 by moving the head unit 150 in the vertical direction, and at the same time, the head unit. The drive part 118 which moves 150 to the left-right direction is provided.

  The drive unit 118 includes a shaft motor 120 disposed above and below the head unit 150 and a shaft motor 130 coupled to a support unit 140 that supports the head unit 150. The shaft motor 120 has a magnet motor shaft 121 provided in the horizontal direction and a cylindrical motor coil 122 through which the magnet motor shaft 121 is inserted. The shaft motor 130 includes a magnet motor shaft 131 provided in the vertical direction and a cylindrical motor coil 132 through which the magnet motor shaft 131 is inserted. In addition, the bases 133 that support the upper and lower ends of the magnet motor shaft 131 of the shaft motor 130 are coupled to the motor coils 122 of the shaft motor 120 that are arranged vertically.

  In this embodiment, the magnet motor shafts 121 and 131 are formed by arranging magnets in a cylindrical stainless steel cylinder, and energize the motor coil 122 with a three-phase alternating current under the control of the control device 14. Accordingly, the motor coil 122 can be arbitrarily moved in the left-right direction, and the motor coil 132 can be arbitrarily moved in the vertical direction by energizing the motor coil 132 with three-phase alternating current.

  The support unit 140 includes a base 141 coupled to the motor coil 132 of the shaft motor 130, and a pressure detection unit 143 formed by a load cell or the like while the magnet motor shaft 131 is inserted through an insertion hole (not shown). And a base portion 142 connected to the base portion 141.

  In addition, the support part 140 includes an air cylinder 144 that connects the base part 133 above the shaft motor 130 and the base part 142 of the support part 140. The air cylinder 144 has a function of canceling the weights of the base portion 142 and the head portion 150 by performing air supply control so that the base portion 142 is always pulled upward with a constant force. Therefore, the resonator 152 (base 142) is supported by the support 140 while being pulled upward by the air cylinder 144.

  Further, the pressure detection means 143 can detect forces in both the compression direction and the extension direction, whereby the pressure applied to the object to be joined by the joining tool 153a and the joining tool 153b. The pressure detecting means 143 can detect the pressure applied to the upper object to be joined.

  The drive mechanism 118 detects a relative position of the motor coils 122 and 132 with respect to the magnet motor shafts 121 and 131 and outputs a position detection signal of the motor coils 122 and 132 to the control device 14 (not shown). ). As such a position sensor, various linear sensors can be employed. For example, if a magnetic sensor is employed as the position sensor, the position sensor measures a change in magnetism accompanying the movement of the motor coils 122 and 132. Thus, the positions of the motor coils 122 and 132 can be detected.

  Further, a linear scale may be provided on the magnet motor shafts 121 and 131, and the position of the motor coils 122 and 132 may be detected by reading the linear scale with a position sensor. As described above, any position sensor may be employed as long as it can reliably detect the positions of the motor coils 122 and 132 with respect to the magnet motor shafts 121 and 131.

  If comprised in this way, the drive mechanism 118 will energize the support part 140 by energizing the motor coil 122 based on control by the control apparatus 14 by feeding back the position detection signal of the motor coil 122 by a position sensor. The supported head unit 150 can be controlled to move to any position in the left-right direction, and the motor coil 132 is energized based on the control by the control device 14 by feeding back the position detection signal of the motor coil 132 by the position sensor. Thus, the head unit 150 supported by the support unit 140 can be controlled to move to an arbitrary position in the vertical direction.

  Further, the drive mechanism 118 can control the pressure applied to the object to be joined by the joining tool 153a based on the control by the control means 14 by feeding back the detection signal of the pressure detecting means 143. The pressure applied to the upper object to be joined by the tool 153b can be controlled. As described above, the drive mechanism 118 functions as the pressure mechanism of the present invention.

  Next, a modification of the third embodiment will be described with reference to FIG. FIG. 13 is a modification of the ultrasonic vibration bonding apparatus of FIG. Hereinafter, differences from the third embodiment will be described in detail. In FIG. 13, the same reference numerals as those in FIG. 12 denote the same or corresponding parts.

  As shown in FIG. 13, the head portion 250 in this modification has a configuration substantially the same as that of the resonator 52 in the second embodiment, and includes a resonator 252 provided with a bonding tool 253 having a circular shape when viewed from the front. I have. And similarly to 2nd Embodiment, the resonator 252 is supported by the support part 240 so that it can rotate centering | focusing on the center axis | shaft of the resonator 252. As shown in FIG.

  In this modification, a stripper unit 145 provided in parallel with the resonator 252 is further provided. The stripper unit 145 is different from the stripper units 34 and 35 described above in that a fixed tool 145a provided at a position parallel to the joining tool 253 at the tip of the stripper unit 145 has a circular shape when viewed from the front. It is a point formed so as to be rotatable about a rotation axis parallel to the rotation axis of 252 (see the arrow in FIG. 13).

  According to the stripper unit 145 formed in this way, when the ultrasonic vibration is applied by the bonding tool 253, the periphery of the bonded portion of the object to be bonded is pressed by the fixed tool 145a, so that the resonator 242 rotates. When moving in the left-right direction, the fixing tool 145a of the stripper unit 145 can always be pressed while rotating around the contact portion between the joining tool 253 and the object to be joined.

  As described above, according to the third embodiment, the head portions 150 and 250 can be arbitrarily moved in the left-right direction in addition to the vertical direction. Ultrasonic vibration can be applied to the workpiece at a plurality of positions above and below. For example, as shown in FIG. 14, when solar cells 206 having an anode and a cathode on the upper and lower surfaces are connected in series by an electrode sheet 207, first, as shown in FIG. The anode of the cell 206 and the electrode sheet 207 are joined, and only the arrangement relationship in the vertical direction between the solar battery cell 206 and the electrode sheet 207 and the joining tool 253 (joining tools 153a and 153b) is shown in FIG. In other words, the cathode of the solar battery cell 206 on the lower surface side and the electrode sheet 207 can be easily joined. FIG. 14 is a view showing an example of the object to be joined.

<Fourth embodiment>
A fourth embodiment of the present invention will be described with reference to FIG. FIG. 15 is an enlarged view of a main part of the ultrasonic vibration bonding apparatus according to the fourth embodiment. Hereinafter, differences from the first embodiment will be described in detail. In FIG. 15, the same reference numerals as those in FIGS. 1 to 14 denote the same or corresponding elements.

  As shown in FIG. 15, the head portion 350 in this embodiment includes a resonator 352, and joining tools 353a and 353b are formed at the top and bottom of the resonator 352 so that ultrasonic vibrations can be applied in two different directions. ing. Further, a stripper unit 345 having a fixed tool 345a in which a rectangular insertion window 345b is formed is provided so as to surround the bonding tool 353a by inserting the bonding tool 353a through the insertion window 345b of the fixed tool 345b. Although the stripper unit is also provided on the joining tool 353b side, the configuration and operation thereof are the same as the configuration and operation of the stripper unit 345 provided on the joining tool 353a side. The description of the operation is omitted.

  The stripper unit 345 includes a moving part (not shown) formed by an air cylinder or the like, and the fixed tool 345a moves up and down independently of the vertical movement of the resonator 352 by the moving part. When the resonator 352 moves in order to apply ultrasonic vibration to the bonded portion of the object to be bonded by the bonding tool 353a, the stripper unit 345 includes a fixed tool around the bonded portion to which ultrasonic vibration is applied. The object to be joined is held by being surrounded and pressed by 345a.

  Further, a suction hole 345c is formed in the fixed tool 345a to communicate the outer side surface of the fixing tool 345a of the stripper unit 345 and the inner side surface of the insertion window 345b. And, by sucking from the suction hole 345c by a suction unit (not shown) provided outside, dust or dust generated during ultrasonic vibration joining by the joining tool 353a is inserted into the outer surface of the joining tool 353a. It is removed by suction through a space between the inner surface of the window 345b.

  As described above, according to the fourth embodiment, the same effects as those of the first embodiment can be obtained, and dust or dust generated during joining can be sucked and removed by the suction unit.

<Others>
Note that the present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. Also good.

  For example, in the first embodiment described above, the joining tools 36a and 36b, which are joining means, are formed at two places above and below the resonator 32. However, the joining tools 36a and 36b are not limited to two places above and below but are formed on the outer periphery of the resonator 32. If so, the position and number may be changed as appropriate, and when the resonator is moved by moving means that moves the resonator in at least two different directions, ultrasonic vibration can be applied to the joint portion of the object to be joined. The joining tool may be formed as described above.

  Further, the stripper units 34 and 35 as the fixing means are not limited to the configuration described in the above embodiment, and may be other mechanisms, shapes, and materials. For example, even if it is not the structure arrange | positioned at the both sides of the resonator 32, what is necessary is just to fix the to-be-joined joined objects. Further, the material of the fixing tools 37a, 37b, 38a, 38b is not limited to urethane rubber, and other materials may be used. Further, for example, when the entire stripper units 34 and 35 are formed of a damping alloy or the like, it is possible to suppress the vibration of the stripper units 34 and 35 themselves and improve the durability.

  Further, the moving means is not limited to the configuration of the driving units 11 and 111 described above, and may be other configurations. The moving direction of the resonator by the moving means is not limited to the vertical direction and the horizontal direction, and is oblique. Of course, it may be configured to move in the direction. Further, the upward cylinder 25a and the downward cylinder 25b are not limited to the air cylinder as described above, and other fluids may be used. Further, instead of the upward cylinder 25a and the downward cylinder 25b, a pressure mechanism may be formed by a linear motor or the like.

  Further, the shape, material, size, and the like of the resonators 32, 52, 152, 252 are not limited to those shown in the above-described embodiment, and may be any size, and the size in the central axis direction. Is not limited to the length of one wavelength of the resonance frequency, and may be any length.

  Furthermore, the lower stage 40 and the upper stage 45 may be provided with a heater, and the objects to be bonded may be ultrasonically bonded to each other while the objects to be bonded are heated. The heater may be of any system such as a constant heat system or a pulse heat system.

  In this case, since the energy by the ultrasonic vibration and the energy by the heating are used in combination, the objects to be joined can be joined by the joining energy generated efficiently. Further, the control device 14 appropriately controls the heating temperature, heating timing, etc. together with the pressure and ultrasonic vibration energy, thereby joining the objects to be joined with less pressure and ultrasonic vibration energy in a short time. can do. Therefore, it is possible to prevent damage or the like from occurring on the object to be bonded by applying an excessive pressure or ultrasonic vibration energy to the object to be bonded at the time of device creation.

  Further, in the above-described third embodiment, there is further provided a joining tool for joining the objects to be joined by applying ultrasonic vibrations to the joining parts of the objects to be joined arranged in the left-right direction by moving the resonator in the left-right direction. It may be provided. At this time, the pressure detection means is provided at an appropriate position of the base portion 133 that supports the upper and lower ends of the magnet motor shaft 131 of the shaft motor 130 in the same manner as the support portions 140 and 240, so that the welding tools are arranged on the left and right. What is necessary is just to detect that it contacted the thing.

  In the third embodiment described above, the head units 150 and 250 may be supported from both the left and right sides by the same configuration as the support unit 140 and the shaft motor 130. In this way, the pressure applied to the workpiece can be increased by the two shaft motors 130.

  Further, a stripper unit having the same configuration as the stripper unit 145 in the modification of the above-described third embodiment may be further provided in the ultrasonic vibration bonding apparatus in the second embodiment.

  Further, in the above-described embodiment, the resonator and the stripper unit are configured to be driven independently. However, the resonator and the stripper unit are supported by supporting the stripper unit together with the resonator by the support portion. And may move together. At this time, the stripper unit has a first position where the fixing tool protrudes from the tip of the welding tool in the moving direction of the resonator, and is substantially the same as the tip of the welding tool or slightly closer to the resonator than the tip of the welding tool. The fixing tool is supported by the support means so as to be movable relative to the resonator between the second position and the fixed tool is biased in the direction of the first position by a biasing means such as a spring. Has moved to.

  With this configuration, the stripper unit fixing tool supported by the support portion together with the resonator moves in the direction of the joint portion together with the resonator when applying ultrasonic vibration to the joint portion of the object to be joined. However, since the fixing tool is urged by the urging means and moved to the first position protruding from the tip of the welding tool, the fixing tool is moved around the bonding portion of the workpiece. Abut first. After the fixed tool comes into contact with the object to be joined, as the resonator is further moved in the direction of the joint, the fixed tool presses the periphery of the joint with the urging force of the urging means. It moves in the direction of the second position against the biasing force. Then, when the tip of the welding tool comes into contact with the joint, the movement of the resonator is stopped, and the joint is joined by the fixed tool biased in the direction of the object to be joined (direction of the first position) by the biasing means. The ultrasonic vibration is applied from the joining tool to the joint in a state where the periphery of the joint is pressed.

1 Ultrasonic vibration bonding apparatus 5a, 5b, 55a, 55b Substrate (object to be bonded)
6,56 fins (objects to be joined)
11,111 Drive unit (moving means)
14 control device 16 support stand (support part)
18 Drive mechanism 25a Upward air cylinder (pressure mechanism)
25b Downward air cylinder (pressure mechanism)
32, 52, 152, 252 Resonator 33 Vibrator 34, 35 Stripper unit (fixing means)
36a, 36b, 53, 153a, 153b, 253 Joining tool (joining means)
118 Drive mechanism (pressure mechanism)
140,240 Supporting part 206 Solar cell (bonded object)
207 Electrode sheet (joint)

Claims (4)

In an ultrasonic vibration bonding apparatus that applies ultrasonic vibration to a bonded portion of a plurality of objects to be bonded to each other to bond the objects to be bonded,
A resonator coupled to one end to resonate with the ultrasonic vibration of the transducer;
A joining means that is provided at the other end of the resonator and abuts against the object to be joined to apply ultrasonic vibration of the resonator to the joint;
Moving means for moving the resonator in at least two different directions,
The joining means applies ultrasonic vibration to the joining portion at a first joining position by the movement of the resonator in the first direction by the moving means, and the second means of the resonator by the moving means. An ultrasonic vibration bonding apparatus, wherein ultrasonic vibration is applied to the bonding portion at a second bonding position by movement in a direction.   During the movement of the resonator in the first direction by the moving unit, the periphery of the bonded portion of the object to be bonded disposed at the first bonding position is held and held by the moving unit. It further comprises a fixing means for pressing and holding the periphery of the joint portion of the article to be joined disposed at the second joining position when the resonator moves in the second direction. The ultrasonic vibration bonding apparatus according to claim 1.   The moving means includes a support unit that supports the resonator, a drive mechanism that switches and drives the support unit in the first direction or the second direction, and the resonator in the first direction or the second direction. The ultrasonic vibration bonding apparatus according to claim 1, further comprising a pressurizing mechanism that pressurizes in the direction of. In the ultrasonic vibration bonding method of applying ultrasonic vibration to the bonded portions of a plurality of objects to be bonded to each other to bond the objects to be bonded,
By moving the resonator in the first direction by moving means that moves the resonator in at least two different directions, the bonding means provided in the resonator is brought into contact with the object to be bonded at the first bonding position. Ultrasonic vibration is applied by applying ultrasonic vibration to the joint, moving the resonator in the second direction by the moving means, and bringing the joining means into contact with the workpiece at a second joining position. Is applied to the bonding portion.

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