JP2018170340A - Electronic device packaging tape - Google Patents

Abstract

The present invention provides an electronic device package tape capable of preventing metal chips from being generated when dicing a wafer.
An electronic device packaging tape 1 of the present invention is provided by laminating an adhesive tape 5 having a base film 51 and an adhesive layer 52 on the opposite side of the adhesive film 52 from the base film 51. The metal layer 3 and an adhesive layer 4 for adhering the metal layer 3 to the back surface of the electronic device are separated into a shape corresponding to the electronic device, and the adhesive layer 4 is characterized in that a plurality of separated metal layers 3 are held at predetermined intervals.
[Selection] Figure 1

Description

  The present invention relates to an electronic device package tape, and more particularly to an electronic device package tape having a metal layer.

  In recent years, electronic devices such as mobile phones and notebook PCs are required to be thinner and smaller. Therefore, in order to reduce the thickness and size of electronic device packages such as semiconductor packages mounted on electronic devices, the number of electrodes of electronic devices and circuit boards is increased, and the pitch is also narrowed. An example of such an electronic device package is a flip chip (FC) mounting package.

  In the flip chip mounting package, as described above, since the number of electrodes is increased or the pitch is narrowed, an increase in the amount of heat generation is a problem. Thus, as a heat dissipation structure of the flip chip mounting package, it has been proposed to provide a metal layer on the back surface of the electronic device via an adhesive layer (see, for example, Patent Document 1).

  Further, in the flip chip mounting package, the linear expansion coefficient of the electronic device and the linear expansion coefficient of the circuit board may be greatly different. In this case, when the intermediate product is heated and cooled in the manufacturing process of the electronic device package, there is a difference in the amount of expansion and contraction between the electronic device and the circuit board. This difference causes warpage in the electronic device package. As a structure for suppressing such warpage, it has been proposed to provide a metal layer on the back surface of an electronic device via an adhesive layer (see, for example, Patent Document 2).

  Furthermore, in flip chip mounting packages, it has also been proposed to provide a metal layer on the back surface of an electronic device via an adhesive layer and use this metal layer as a protective layer for laser marking (see, for example, Patent Document 3). . Further, Patent Document 3 discloses a flip chip type semiconductor back film in which a metal layer and an adhesive layer are provided on an adhesive layer of an adhesive tape in which an adhesive layer is laminated on a substrate.

Japanese Patent Laid-Open No. 2007-233502 Japanese Patent No. 5487847 Japanese Patent No. 5419226

  In the case of using a film for flip chip type semiconductor back surface integrated with an adhesive tape as described in Patent Document 3, the back surface of the semiconductor wafer is bonded onto the adhesive layer, and the semiconductor wafer is bonded to the metal layer and the adhesive. The semiconductor chip is diced together with the layers to be separated into chips, and the separated semiconductor chips are picked up from the adhesive tape with the adhesive layer and the metal layer attached to the back surface, and flip-chip connected to the substrate. Specifically, the bump and the conductive material are pressed while the semiconductor chip is pressed by bringing the bump formed on the circuit surface side of the semiconductor chip into contact with a conductive material such as solder for bonding attached to the connection pad of the substrate. Is melted to ensure electrical continuity between the semiconductor chip and the substrate, and the semiconductor chip is fixed to the adherend.

  However, when the metal layer is diced together with the wafer and the adhesive layer, cutting scraps of the metal layer called whiskers are generated, and the cutting scraps are adhered and held on the dicing surface of the adhesive layer, so that the electronic device package is contaminated. There was a problem.

  Then, this invention makes it a subject to provide the tape for electronic device packages which can prevent that the cutting waste of a metal layer is generated when dicing a wafer.

  In order to solve the above problems, an electronic device package tape according to the present invention is provided by laminating a pressure-sensitive adhesive tape having a base film and a pressure-sensitive adhesive layer on the side opposite to the base film of the pressure-sensitive adhesive layer. And an adhesive layer for adhering the metal layer to the back surface of the electronic device, the metal layer being separated into a shape corresponding to the electronic device, and the adhesive The layer is characterized in that a plurality of the separated metal layers are held at a predetermined interval.

  In the electronic device package tape, the adhesive layer has a shape corresponding to the wafer, and is cut into a shape corresponding to the electronic device together with the wafer in a state of being bonded to the wafer. It is preferable to be separated.

  In the tape for electronic device package, a step reduction portion is formed between the metal layers to reduce a step between the surface of the metal layer on the pressure-sensitive adhesive layer side and the top of the metal layer on the pressure-sensitive adhesive layer side. Preferably it is.

  In the electronic device package tape, it is preferable that a step between the surface of the metal layer on the pressure-sensitive adhesive layer side and a top portion on the pressure-sensitive adhesive layer side of the step reduction portion between the metal layers is less than 3 μm.

  In the electronic device package tape, it is preferable that the step reduction portion is formed by the adhesive layer.

  In the electronic device package tape, the metal layer preferably contains copper or aluminum.

  In the electronic device package tape, the adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. It is preferable to do.

In the electronic device package tape, the pressure-sensitive adhesive layer contains an acrylic ester represented by CH ₂ = CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms) and a hydroxyl group. It is preferable to contain an acrylic polymer comprising a monomer and an isocyanate compound having a radical-reactive carbon-carbon double bond in the molecule.

  ADVANTAGE OF THE INVENTION According to this invention, when dicing a wafer, it can prevent that the cutting waste of a metal layer is generated.

It is sectional drawing which shows typically the structure of the tape for electronic device packages which concerns on embodiment of this invention. (A) is a top view which shows typically the structure of the tape for electronic device packages which concerns on embodiment of this invention, (B) is the same sectional drawing. It is a perspective view which shows typically the structure of the tape for electronic device packages which concerns on embodiment of this invention. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device packages which concerns on embodiment of this invention, (A) is a longitudinal cross-sectional view which shows the bonding process of a metal layer, (B) is a metal layer. It is a transversal direction sectional view which shows the cutting process of (C), (C) is a perspective view which shows the removal process of an unnecessary part, (D) is a longitudinal direction sectional view which shows the bonding process to the adhesive bond layer of a metal layer. It is. It is explanatory drawing which shows typically the manufacturing method of the tape for electronic device packages which concerns on embodiment of this invention, (A) is a transversal direction sectional drawing which shows the cutting process of an adhesive bond layer, (B) is the 1st. It is a transversal direction sectional view which shows the bonding process of the 2nd slightly adhesive tape, (C) is a transversal direction sectional view which shows the bonding process of an adhesive layer, (D) is the cutting process of an adhesive layer. FIG. It is sectional drawing for demonstrating the usage method of the tape for electronic device packages which concerns on embodiment of this invention. It is sectional drawing for demonstrating the embedding state to the adhesive bond layer of the metal layer which concerns on the Example and comparative example of this invention. It is sectional drawing which shows the modification of the electronic device package of this invention.

  Hereinafter, embodiments of the present invention will be described in detail.

  FIG. 1 is a cross-sectional view showing an electronic device package tape 1 according to an embodiment of the present invention. The electronic device package tape 1 has a pressure-sensitive adhesive tape 5 including a base film 51 and a pressure-sensitive adhesive layer 52 provided on the base film 51, and the adhesive layer 4 is formed on the pressure-sensitive adhesive layer 52. And a metal layer 3 are provided. The metal layer 3 is separated into a shape corresponding to the electronic device, and a plurality of metal layers 3 are held at predetermined intervals so as to be embedded in the adhesive layer. In the present invention, the mode in which the adhesive layer 4 holds the metal layer 3 includes a mode in which the metal layer 3 is held indirectly via a primer layer or the like for improving the adhesion between the two. In the present embodiment, a semiconductor chip will be described as an example of an electronic device.

  The electronic device package tape 1 of the present invention corresponds to a ring frame (not shown) used when the adhesive tape 5 dices the semiconductor wafer W (see FIG. 6), as shown in FIGS. It is preferably cut into a shape (pre-cut processing). The adhesive layer 4 is also preferably cut (precut process) into a predetermined shape corresponding to the semiconductor wafer W, and precut process is performed in the present embodiment.

  As shown in FIGS. 2 and 3, an electronic device package tape 1 according to the present invention includes an adhesive tape 5 (label) cut into a shape corresponding to a metal layer 3, an adhesive layer 4, and a ring frame (not shown). It is preferable that the long thin adhesive tape 2 formed with a plurality of laminated bodies in which the parts 5a) are laminated is wound into a roll shape, and in the present embodiment, is wound into a roll shape. However, the laminated body provided in the slightly adhesive tape 2 may be cut one by one.

  When pre-cut and wound into a roll, as shown in FIGS. 2 and 3, the electronic device package tape 1 has a long slightly adhesive tape 2 on the slightly adhesive tape 2. Is an adhesive layer 4 having a predetermined planar shape, a plurality of metal layers 3 that are embedded so as to be embedded in the adhesive layer 4, and a metal layer on the opposite side of the metal layer 3 from the slightly adhesive tape 2 side. 3 and the adhesive layer 4 are laminated to cover the metal layer 3 and the adhesive layer 4 and have a predetermined planar shape provided so as to be in contact with the slightly adhesive tape 2 around the adhesive layer 4. An adhesive tape 5 having a label part 5a and a peripheral part 5b surrounding the outside of the label part 5a is provided.

  The label part 5a has a shape corresponding to a ring frame for dicing. The shape corresponding to the shape of the ring frame for dicing is preferably a similar shape that is substantially the same shape as the inside of the ring frame and larger than the size of the inside of the ring frame. Moreover, although it does not necessarily need to be circular, the shape close | similar to circle is preferable and it is more preferable that it is circular. The peripheral part 5b includes a form that completely surrounds the outside of the label part 5a and a form that is not completely enclosed as shown. Note that the peripheral portion 5b may not be provided.

  Furthermore, the metal layer 3 has a plane size of the metal layer 3 ≦ the size of the plane of the second surface (back surface) of the electronic device on which the bonding of the metal layer 3 and the adhesive layer 4 is planned. It has been cut and separated into pieces. In the present embodiment, the size of the plane of the metal layer 3 = the size of the plane of the second surface (back surface) of the electronic device, but the size of the plane of the metal layer 3 <the second surface (back surface) of the electronic device. It may be the size of the plane.

  The adhesive layer 4 has a predetermined label shape, and this label shape is a shape corresponding to the semiconductor wafer W, and a ring frame is bonded to the peripheral portion of the label portion 5a of the adhesive tape 5, The shape is smaller than the label portion 5a so that it can be pushed up by the push-up member of the pickup device. The label shape of the adhesive layer 4 does not necessarily have to be a circle, but a shape close to a circle is preferable, and a circle is more preferable.

  The metal layer 3 has an overall shape in which pieces are gathered in a shape corresponding to the adhesive layer 4, that is, a shape corresponding to the semiconductor wafer W. Each component will be described below.

<Base film 51>
The substrate film 51 can be used without particular limitation as long as it is a conventionally known one, but has radiation transparency when a radiation curable material is used as the adhesive layer 52 described later. It is preferable to use one.

  For example, as the material, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic Α-olefin homopolymer or copolymer such as acid methyl copolymer, ethylene-acrylic acid copolymer, ionomer or a mixture thereof, polyurethane, styrene-ethylene-butene or pentene copolymer, polyamide-polyol Listed are thermoplastic elastomers such as copolymers, and mixtures thereof. Moreover, the base film 51 may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer.

  The thickness of the base film 51 is not particularly limited and may be appropriately set, but is preferably 50 to 200 μm.

  In order to improve the adhesion between the base film 51 and the pressure-sensitive adhesive layer 52, the surface of the base film 51 is subjected to chemical or physical treatment such as chromic acid treatment, ozone exposure, flame exposure, high-voltage impact exposure, or ionizing radiation treatment. Surface treatment may be applied.

  In the present embodiment, the pressure-sensitive adhesive layer 52 is provided directly on the base film 51. However, a primer layer for increasing adhesion, an anchor layer for improving machinability during dicing, stress You may provide indirectly through a relaxation layer, an antistatic layer, etc.

<Adhesive layer 52>
The resin used for the pressure-sensitive adhesive layer 52 is not particularly limited, and a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, or the like used for the pressure-sensitive adhesive may be used. An acrylic pressure-sensitive adhesive having an acrylic polymer as a base polymer is preferable.

  Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, isopropyl ester). Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, (E.g., linear or branched alkyl ester having 1 to 30 carbon atoms, particularly 4 to 18 carbon atoms) of an alkyl group such as octadecyl ester and eicosyl ester) ) Acrylic acid cycloalkyl esters (e.g., cyclopentyl ester, acrylic polymer or the like using one or more of the monomer component cyclohexyl ester etc.). In addition, (meth) acrylic acid ester means acrylic acid ester and / or methacrylic acid ester, and (meth) of the present invention has the same meaning.

  The acrylic polymer contains units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or cycloalkyl ester, if necessary, for the purpose of modifying cohesive force, heat resistance and the like. May be. Examples of such monomer components include, for example, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxyl group-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; Styrene Contains sulfonic acid groups such as phonic acid, allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamidepropanesulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalenesulfonic acid Monomers; Phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; acrylamide, acrylonitrile and the like. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less based on the total monomer components.

  Furthermore, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization as necessary. Examples of such polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) An acrylate etc. are mentioned. These polyfunctional monomers can also be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties.

  The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more component monomers. The pressure-sensitive adhesive layer 52 preferably has a composition that suppresses the inclusion of a low-molecular-weight substance from the viewpoint of preventing contamination of the wafer. From this point, the main component is an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000. Therefore, the pressure-sensitive adhesive can be of an appropriate crosslinking type by an internal crosslinking method, an external crosslinking method, or the like.

  Moreover, in order to control the crosslinking density of the pressure-sensitive adhesive layer 52 to improve pickup properties, for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelate compound, an amino resin system A method of crosslinking using an appropriate external crosslinking agent such as a compound or peroxide, or a method of mixing a low molecular compound having two or more carbon-carbon double bonds and crosslinking by irradiation with energy rays, etc. A suitable method such as the above can be adopted. When using an external cross-linking agent, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. Generally, about 10 parts by weight or less, further 0.1 to 10 parts by weight is preferably blended with respect to 100 parts by weight of the base polymer. In addition, from the viewpoint of preventing deterioration and the like, additives such as various tackifiers and anti-aging agents may be used for the pressure-sensitive adhesive in addition to the above components.

  As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 52, a radiation curable pressure-sensitive adhesive is suitable. Examples of the radiation-curable pressure-sensitive adhesive include additive-type radiation-curable pressure-sensitive adhesives in which a radiation-curable monomer component or a radiation-curable oligomer component is blended with the above-mentioned pressure-sensitive adhesive.

  Examples of the radiation curable monomer component to be blended include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra ( Examples thereof include (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate. These monomer components can be used alone or in combination of two or more.

  Examples of the radiation curable oligomer component include various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene, and those having a molecular weight in the range of about 100 to 30,000 are suitable. The compounding amount of the radiation-curable monomer component or oligomer component can be appropriately determined in accordance with the type of the pressure-sensitive adhesive layer, and the amount capable of reducing the adhesive strength of the pressure-sensitive adhesive layer. Generally, it is, for example, about 5 to 500 parts by weight, preferably about 70 to 150 parts by weight with respect to 100 parts by weight of a base polymer such as an acrylic polymer constituting the pressure-sensitive adhesive.

  As the radiation curable pressure-sensitive adhesive, in addition to the additive-type radiation curable pressure-sensitive adhesive, a base polymer having a carbon-carbon double bond in the polymer side chain or main chain or at the main chain terminal was used. An internal radiation-curable pressure-sensitive adhesive is also included. Intrinsic radiation curable adhesives do not need to contain oligomer components, which are low molecular components, or do not contain much, so they are stable without the oligomer components moving through the adhesive over time. This is preferable because an adhesive layer having a layered structure can be formed.

  As the base polymer having a carbon-carbon double bond, those having a carbon-carbon double bond and having adhesiveness can be used without particular limitation. As such a base polymer, those having an acrylic polymer as a basic skeleton are preferable. Examples of the basic skeleton of the acrylic polymer include the acrylic polymers exemplified above.

  The method for introducing the carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods can be adopted. However, it is easy in terms of molecular design to introduce the carbon-carbon double bond into the polymer side chain. is there. For example, after a monomer having a functional group is previously copolymerized with an acrylic polymer, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is converted into a radiation curable carbon-carbon double bond. A method of performing condensation or addition reaction while maintaining the above.

  Examples of combinations of these functional groups include carboxylic acid groups and epoxy groups, carboxylic acid groups and aziridyl groups, hydroxyl groups and isocyanate groups, and the like. Among these combinations of functional groups, a combination of a hydroxyl group and an isocyanate group is preferable because of easy tracking of the reaction. Moreover, the functional group may be on either side of the acrylic polymer and the compound as long as the acrylic polymer having the carbon-carbon double bond is generated by a combination of these functional groups. In the preferable combination, it is preferable that the acrylic polymer has a hydroxyl group and the compound has an isocyanate group. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate, and the like. Further, as the acrylic polymer, those obtained by copolymerizing the above-exemplified hydroxy group-containing monomers, ether compounds of 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, or the like are used.

  The internal radiation curable pressure-sensitive adhesive can use the base polymer (particularly acrylic polymer) having the carbon-carbon double bond alone, but the radiation curable monomer component does not deteriorate the characteristics. And photopolymerizable compounds such as oligomer components can also be blended. The compounding amount of the photopolymerizable compound is usually in the range of 30 parts by weight or less, preferably in the range of 0 to 10 parts by weight, with respect to 100 parts by weight of the base polymer.

  The radiation curable pressure-sensitive adhesive preferably contains a photopolymerization initiator when cured by ultraviolet rays or the like.

Among the acrylic polymers described above, in particular, an acrylate ester represented by CH ₂ ═CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, Acrylic polymer A comprising an isocyanate compound having a radical reactive carbon-carbon double bond is preferred.

  When the number of carbon atoms in the alkyl group of the acrylic acid alkyl ester is less than 4, the polarity is high and the peeling force becomes too large, so that the pickup property may be lowered. On the other hand, when the number of carbon atoms in the alkyl group of the acrylic acid alkyl ester exceeds 18, the glass transition temperature of the pressure-sensitive adhesive layer 52 becomes too high, and the adhesive properties at room temperature are deteriorated. 3 peeling may occur.

  The acrylic polymer A may contain units corresponding to other monomer components as necessary.

  In the acrylic polymer A, an isocyanate compound having a radical reactive carbon-carbon double bond is used. That is, it is preferable that the acrylic polymer has a configuration in which a double bond-containing isocyanate compound is subjected to an addition reaction with a polymer based on a monomer composition such as an acrylic ester or a hydroxyl group-containing monomer. Therefore, the acrylic polymer preferably has a radical reactive carbon-carbon double bond in its molecular structure. Thereby, it can be set as the active energy ray hardening-type adhesive layer (ultraviolet ray hardening-type adhesive layer etc.) hardened | cured by irradiation of an active energy ray (ultraviolet rays etc.), and the peeling force of the metal layer 3 and the adhesive layer 52 Can be reduced.

  Examples of the double bond-containing isocyanate compound include methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate, and the like. A double bond containing isocyanate compound can be used individually or in combination of 2 or more types.

  Moreover, in order to adjust the adhesive force before active energy ray irradiation and the adhesive force after active energy ray irradiation to an active energy ray hardening-type adhesive, an external crosslinking agent can also be used suitably. Specific examples of the external crosslinking method include a method of adding a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, a melamine crosslinking agent, and reacting them. When using an external cross-linking agent, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. The amount of the external crosslinking agent used is generally 20 parts by weight or less (preferably 0.1 to 10 parts by weight) with respect to 100 parts by weight of the base polymer. Further, the active energy ray-curable pressure-sensitive adhesive may contain various conventionally known additives such as tackifiers, anti-aging agents, and foaming agents in addition to the above components, if necessary.

  The thickness of the pressure-sensitive adhesive layer 52 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 μm. The pressure-sensitive adhesive layer 52 may be composed of a single layer or a plurality of layers.

<Metal layer 3>
The metal constituting the metal layer 3 is not particularly limited. For example, the metal layer 3 may be at least one selected from the group consisting of stainless steel, aluminum, iron, titanium, tin, nickel, and copper. It is preferable from the point of warpage prevention. Among these, it is particularly preferable to contain copper from the viewpoint of high thermal conductivity and obtaining a heat dissipation effect. Moreover, it is especially preferable that aluminum is included from a viewpoint of the curvature prevention of the electronic device package 11 (refer FIG.6 (D)).

  The thickness of the metal layer 3 can be appropriately determined in consideration of heat dissipation, warp prevention of the electronic device package, workability, and the like, and is usually in the range of 2 to 200 μm. When the metal layer 3 is 200 μm or less, the winding process is easy, and when the metal layer 3 is 50 μm or less, it is preferable in that it can contribute to thinning of the electronic device package 11. On the other hand, at least 2 μm is necessary from the viewpoint of heat dissipation.

  As such a metal layer 3, a metal foil can be used, and the metal foil may be an electrolytic foil or a rolled foil.

<Adhesive layer 4>
The adhesive layer 4 is a film obtained by previously forming an adhesive.

  The adhesive layer 4 is formed of at least a thermosetting resin, and is preferably formed of at least a thermosetting resin and a thermoplastic resin.

  Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, Thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate), polyamideimide resin, or fluorine resin Etc. A thermoplastic resin can be used individually or in combination of 2 or more types. Among these thermoplastic resins, acrylic resins are less ionic impurities and have excellent stress relaxation properties, phenoxy resins are both high flexibility and strength and high toughness. This is particularly preferable because reliability can be easily secured.

  The acrylic resin is not particularly limited, and is linear or branched having 30 or less carbon atoms (preferably 1 to 18 carbon atoms, more preferably 6 to 10 carbon atoms, and particularly preferably 8 or 9 carbon atoms). Examples thereof include a polymer containing one or more esters of acrylic acid or methacrylic acid having an alkyl group as components. That is, in the present invention, acrylic resin has a broad meaning including methacrylic resin. Examples of the alkyl group include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, t-butyl group, isobutyl group, pentyl group, isopentyl group, hexyl group, heptyl group, and 2-ethylhexyl group. Octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, dodecyl group (lauryl group), tridecyl group, tetradecyl group, stearyl group, octadecyl group and the like.

  In addition, the other monomer for forming the acrylic resin (a monomer other than an alkyl ester of acrylic acid or methacrylic acid having an alkyl group with 30 or less carbon atoms) is not particularly limited. For example, acrylic acid, Carboxyl group-containing monomers such as methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid or crotonic acid, acid anhydride monomers such as maleic anhydride or itaconic anhydride, (meth) 2-hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, (meth) 10-hydroxydecyl acrylate Hydroxyl group-containing monomers such as (meth) acrylic acid 12-hydroxylauryl or (4-hydroxymethylcyclohexyl) -methyl acrylate, styrenesulfonic acid, allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid Sulfonic acid group-containing monomers such as (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate or (meth) acryloyloxynaphthalene sulfonic acid, or phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate Is mentioned. In addition, (meth) acrylic acid means acrylic acid and / or methacrylic acid, and (meth) of the present invention has the same meaning.

  Examples of the thermosetting resin include an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, and a thermosetting polyimide resin. A thermosetting resin can be used individually or in combination of 2 or more types. As the thermosetting resin, an epoxy resin containing a small amount of ionic impurities that corrode semiconductor elements is particularly suitable. Moreover, a phenol resin can be used suitably as a hardening | curing agent of an epoxy resin.

  The epoxy resin is not particularly limited. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy. Bifunctional epoxy such as resin, biphenyl type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, phenol novolac type epoxy resin, orthocresol novolak type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylolethane type epoxy resin Epoxy resin such as resin, polyfunctional epoxy resin, hydantoin type epoxy resin, trisglycidyl isocyanurate type epoxy resin or glycidylamine type epoxy resin It can be used.

  As examples of the epoxy resin, novolak type epoxy resins, biphenyl type epoxy resins, trishydroxyphenylmethane type epoxy resins, and tetraphenylolethane type epoxy resins are particularly preferable. This is because these epoxy resins are rich in reactivity with a phenol resin as a curing agent and are excellent in heat resistance and the like.

  Furthermore, the phenol resin acts as a curing agent for the epoxy resin. For example, a novolak type phenol resin such as a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butylphenol novolak resin, a nonylphenol novolak resin, or a resol type. Examples thereof include phenol resins and polyoxystyrene such as polyparaoxystyrene. A phenol resin can be used individually or in combination of 2 or more types. Of these phenol resins, phenol novolac resins and phenol aralkyl resins are particularly preferred. This is because the connection reliability of the semiconductor device can be improved.

  The mixing ratio of the epoxy resin and the phenol resin is preferably such that, for example, the hydroxyl group in the phenol resin is 0.5 equivalent to 2.0 equivalents per equivalent of epoxy group in the epoxy resin component. More preferred is 0.8 equivalent to 1.2 equivalent. That is, if the blending ratio of both is out of the above range, sufficient curing reaction does not proceed and the properties of the cured epoxy resin are likely to deteriorate.

  Moreover, the thermosetting acceleration | stimulation catalyst of an epoxy resin and a phenol resin may be used. The thermosetting acceleration catalyst is not particularly limited, and can be appropriately selected from known thermosetting acceleration catalysts. A thermosetting acceleration | stimulation catalyst can be used individually or in combination of 2 or more types. As the thermosetting acceleration catalyst, for example, an amine curing accelerator, a phosphorus curing accelerator, an imidazole curing accelerator, a boron curing accelerator, a phosphorus-boron curing accelerator, or the like can be used.

  As the curing agent for the epoxy resin, it is preferable to use a phenol resin as described above, but known curing agents such as imidazoles, amines, and acid anhydrides can also be used.

  It is important that the adhesive layer 4 has adhesiveness (adhesiveness) to the back surface (circuit non-formed surface) of the semiconductor wafer. Therefore, in order to crosslink the adhesive layer 4 to some extent in advance, a polyfunctional compound that reacts with the functional group at the end of the molecular chain of the polymer may be added as a crosslinking agent. Thereby, the adhesive property under high temperature can be improved and heat resistance can be improved.

  The crosslinking agent is not particularly limited, and a known crosslinking agent can be used. Specifically, for example, an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent, a metal salt Examples thereof include a system crosslinking agent, a carbodiimide crosslinking agent, an oxazoline crosslinking agent, an aziridine crosslinking agent, and an amine crosslinking agent. As the crosslinking agent, an isocyanate crosslinking agent or an epoxy crosslinking agent is suitable. Moreover, the said crosslinking agent can be used individually or in combination of 2 or more types.

  In the present invention, instead of using a cross-linking agent or using a cross-linking agent, it is possible to carry out a cross-linking treatment by irradiation with an electron beam or ultraviolet rays.

  The adhesive layer 4 can be appropriately mixed with other additives as necessary. Examples of other additives include fillers (fillers), flame retardants, silane coupling agents, ion trapping agents, bulking agents, antioxidants, antioxidants, and surfactants.

  The filler may be either an inorganic filler or an organic filler, but an inorganic filler is suitable. By blending a filler such as an inorganic filler, the adhesive layer 4 can be improved in thermal conductivity, adjusted in elastic modulus, and the like. Examples of the inorganic filler include silica, clay, gypsum, calcium carbonate, barium sulfate, alumina, beryllium oxide, silicon carbide, aluminum nitride, silicon nitride and other ceramics, aluminum, copper, silver, gold, nickel, chromium, Examples include various inorganic powders made of metals such as lead, tin, zinc, palladium, solder, alloys, and other carbon. A filler can be used individually or in combination of 2 or more types. Among these, silica or alumina is particularly suitable as the filler, and fused silica is particularly suitable as the silica. In addition, it is preferable that the average particle diameter of an inorganic filler exists in the range of 0.001 micrometer-80 micrometers. The average particle diameter of the inorganic filler can be measured by, for example, a laser diffraction type particle size distribution measuring apparatus.

  The blending amount of the filler (particularly inorganic filler) is preferably 98% by weight or less (0% by weight to 98% by weight) with respect to the organic resin component, and particularly in the case of silica, 0% by weight to 70% by weight. In the case of a functional inorganic filler such as heat conduction or conductivity, the content is preferably 10 to 98% by weight.

  Examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resin. A flame retardant can be used individually or in combination of 2 or more types. Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and the like. A silane coupling agent can be used individually or in combination of 2 or more types. Examples of the ion trapping agent include hydrotalcites and bismuth hydroxide. An ion trap agent can be used individually or in combination of 2 or more types.

  The adhesive layer 4 contains, in particular, (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler from the viewpoints of adhesiveness and reliability. It is preferable to do.

  (A) By using an epoxy resin, high adhesiveness, water resistance, and heat resistance can be obtained. As the epoxy resin, the above-described known epoxy resins can be used. (B) The above-mentioned well-known hardening | curing agent can be used for a hardening | curing agent.

(C) Acrylic resin has both high flexibility and strength and high toughness. A preferable acrylic resin has a Tg (glass transition temperature) of −50 ° C. to 50 ° C., and is obtained by polymerizing a monomer having an epoxy group, a glycidyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group or a carboxyl group as a crosslinkable functional group. It is a crosslinkable functional group-containing (meth) acrylic copolymer. Furthermore, higher toughness can be obtained by containing acrylonitrile or the like and exhibiting rubber properties.
In addition, (C) phenoxy resin has high strength because phenoxy resin has a long molecular chain and is similar in structure to epoxy resin, acts as a flexible material in a composition with high crosslink density, and imparts high toughness. However, a tough composition can be obtained. Preferable phenoxy resins are those having a main skeleton of bisphenol A type, and other preferable examples include commercially available phenoxy resins such as bisphenol F type phenoxy resin, bisphenol A / F mixed type phenoxy resin and brominated phenoxy resin.

  (D) As the surface-treated inorganic filler, an inorganic filler surface-treated with a coupling agent can be mentioned. As the inorganic filler, the above-described known inorganic fillers can be used, and silica and alumina are preferable. Due to the surface treatment with the coupling agent, the dispersibility of the inorganic filler is improved. For this reason, since it is excellent in fluidity | liquidity, the adhesive force with a metal layer can be improved. Further, since the inorganic filler can be highly filled, the water absorption rate can be lowered and the moisture resistance can be improved.

  For example, the surface treatment of the inorganic filler with the silane coupling agent is performed by dispersing the inorganic filler in the silane coupling agent solution by a known method, so that the hydroxyl group and the silane coupling agent present on the surface of the inorganic filler are mixed. This is performed by reacting a hydrolyzable group such as an alkoxy group with a hydrolyzed silanol group to form a Si—O—Si bond on the surface of the inorganic filler.

  Although the thickness of the adhesive layer 4 is not particularly limited, it is usually preferably 3 μm or more, more preferably 5 μm or more from the viewpoint of easy handling, and preferably 100 μm or less in order to contribute to thinning of the semiconductor package, 50 μm or less is more preferable. The adhesive layer 4 may be composed of a single layer or a plurality of layers.

The water absorption rate of the adhesive layer 4 is preferably 1.5 vol% or less. The method for measuring the water absorption rate is as follows. That is, using a 50 × 50 mm adhesive layer 4 (film adhesive) as a sample, the sample was dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then measured for dry mass. And M1. The sample is immersed in distilled water at room temperature for 24 hours and then taken out. The surface of the sample is wiped off with a filter paper and quickly weighed to obtain M2. The water absorption rate is calculated by the following equation (1).
Water absorption (vol%) = [(M2-M1) / (M1 / d)] × 100 (1)
Here, d is the density of the film.
If the water absorption exceeds 1.5 vol%, package cracks may occur during solder reflow due to the absorbed water.

The saturated moisture absorption rate of the adhesive layer 4 is preferably 1.0 vol% or less. The method for measuring the saturated moisture absorption rate is as follows. That is, a circular adhesive layer 4 (film adhesive) having a diameter of 100 mm was used as a sample, the sample was dried in a vacuum dryer at 120 ° C. for 3 hours, allowed to cool in a desiccator, and then the dry mass was measured. To do. The sample is absorbed in a constant temperature and humidity chamber at 85 ° C. and 85% RH for 168 hours, then taken out, and weighed quickly to obtain M2. The saturated moisture absorption rate is calculated by the following equation (2).
Saturated moisture absorption (vol%) = [(M2-M1) / (M1 / d)] × 100 (2)
Here, d is the density of the film.
When the saturated moisture absorption rate exceeds 1.0 vol%, the value of vapor pressure increases due to moisture absorption during reflow, and good reflow characteristics may not be obtained.

The residual volatile content of the adhesive layer 4 is preferably 3.0 wt% or less. The method for measuring the remaining volatile components is as follows. That is, using an adhesive layer 4 (film adhesive) having a size of 50 × 50 mm as a sample, measuring the initial mass of the sample as M1, and heating the sample at 200 ° C. for 2 hours in a hot air circulating thermostat, Weigh to M2. The remaining volatile content is calculated by the following equation (3).
Residual volatile matter (wt%) = [(M2-M1) / M1] × 100 (3)
If the residual volatile content exceeds 3.0 wt%, the solvent is volatilized by heating during packaging, and voids are generated inside the adhesive layer 4, which may cause package cracks.

  The ratio of the linear expansion coefficient of the metal layer 3 to the linear expansion coefficient of the adhesive layer 4 (the linear expansion coefficient of the metal layer 3 / the linear expansion coefficient of the adhesive layer 4) is preferably 0.2 or more. If the ratio is less than 0.2, peeling between the metal layer 3 and the adhesive layer 4 is likely to occur, and package cracking may occur during packaging, which may reduce reliability.

  The metal layer 3 in the present embodiment is separated into a shape corresponding to the semiconductor chip C (see FIG. 6) and embedded in the adhesive layer 4, and the surface of the metal layer 3 on the pressure-sensitive adhesive layer 52 side and The top of the adhesive layer 4 between the metal layers 3 on the pressure-sensitive adhesive layer 5 side (in this embodiment, the surface of the adhesive layer 4 between the adjacent metal layers 3 on the pressure-sensitive adhesive layer 52 side) and There is substantially no step z (see FIG. 7). That is, the surface of the metal layer 3 on the pressure-sensitive adhesive layer 52 side and the surface of the adhesive layer 4 between the adjacent metal layers 3 are flush with each other.

  Since the metal layer 3 is separated into a shape corresponding to the semiconductor chip C (see FIG. 6), there is no need to cut the metal layer 3 when dicing the semiconductor wafer W into the semiconductor chip C. The cutting waste of the layer 3 is not generated.

  In the present embodiment, the metal layer 3 is embedded in the adhesive layer 4, and the adhesive of the adhesive layer 4 between the surface of the metal layer 3 on the adhesive layer 52 side and the adjacent metal layers 3. Although there is substantially no step z with the surface on the side of the adhesive layer 52, as shown in FIG. 7, the surface on the side of the adhesive layer 52 of the metal layer 3 and the adjacent metal layers 3 There may be a level difference z between the adhesive layer 4 and the surface on the pressure-sensitive adhesive layer 52 side. Furthermore, as shown in FIG. 8, the metal layer 3 may not be embedded in the adhesive layer 4.

  However, the step z between the surface on the pressure-sensitive adhesive layer 52 side of the metal layer 3 and the surface on the pressure-sensitive adhesive layer 52 side of the adhesive layer 4 between the adjacent metal layers 3 is preferably less than 3 μm, Furthermore, a state where there is substantially no step z is preferable.

  The surface of the metal layer 3 on the pressure-sensitive adhesive layer 52 side protrudes toward the pressure-sensitive adhesive layer 52 side from the top of the adhesive layer 4 between the adjacent metal layers 3 on the pressure-sensitive adhesive layer 5 side, and the step z is 3 μm. When the semiconductor wafer W is bonded to the adhesive layer 4 as described above, the pressure on the semiconductor wafer W of the adhesive layer 4 between the metal layers 3 becomes insufficient, and air is involved in the part, There is a risk of voids. Although this void is generated between the adhesive layer 4 and the semiconductor wafer W between the metal layers 3, this portion is not a problem because it is a portion that is cut and removed in the dicing process. However, the voids are formed on the adhesive layer 4 and the portion of the semiconductor wafer W that becomes the semiconductor chip C due to vibration when the semiconductor wafer W is bonded to the next process or vibration during the dicing process. Since there is a possibility of shifting between the two, it is preferable that there is no.

  The top part of the pressure-sensitive adhesive layer 5 side between the adjacent metal layers 3 protrudes toward the pressure-sensitive adhesive layer 52 side than the surface of the metal layer 3 on the pressure-sensitive adhesive layer 52 side, and the step z is 3 μm or more. The heat and pressure when the semiconductor wafer W is bonded to the agent layer 4 softens the adhesive layer 4 and adheres to the surface of the metal layer 3, which may reduce heat dissipation.

  In the above case, the level difference z is the thickness y of the portion where the metal layer 3 is held in the adhesive layer 4 with the metal layer 3 and the portion where only the adhesive layer 4 is not held. This corresponds to the difference from the thickness x.

  Further, in the electronic device package tape 1 of the present embodiment, the metal layer 3 is embedded and held in the adhesive layer 4, but is not necessarily embedded in the adhesive layer 4. FIG. As shown in FIG. 2, the metal layer 3 may be adhered and held on the surface of the adhesive layer 4. In this case, the adhesive layer 4 is between the metal layers 3 on the surface on the pressure-sensitive adhesive layer side, on the surface of the metal layer 3 on the pressure-sensitive adhesive layer 52 side, and between the adjacent metal layers 3. You may have the level | step difference reduction part 7 which reduces the level | step difference with the top part by the side of the adhesive layer 52 of this.

  By providing the step reducing portion 7, it is preferable that the step z ′ between the surface of the metal layer 3 on the adhesive layer 5 side and the top of the step reducing portion 7 on the adhesive layer 5 side is less than 3 μm. . The surface on the pressure-sensitive adhesive layer 52 side of the metal layer 3 protrudes toward the pressure-sensitive adhesive layer 52 side from the top on the pressure-sensitive adhesive layer 5 side of the step reducing portion 7, and if the step z ′ is 3 μm or more, adhesion When the semiconductor wafer W is bonded to the agent layer 4, the pressure on the semiconductor wafer W of the adhesive layer 4 between the metal layers 3 becomes insufficient, and air may be caught in the part, and a void may be generated. is there. When the top of the step reduction portion 7 on the pressure-sensitive adhesive layer 5 side protrudes more toward the pressure-sensitive adhesive layer 52 than the surface of the metal layer 3 on the pressure-sensitive adhesive layer 52 side, the step z ′ is 3 μm or more. The heat and pressure when the semiconductor wafer W is bonded to the layer 4 softens the step reduction portion 7 and adheres to the surface of the metal layer 3, which may reduce heat dissipation.

  In the above case, the step z ′ is the thickness y ′ of the portion where the metal layer 3 is held and the maximum thickness x ′ of the portion where the step reduction portion 7 is provided in the adhesive layer 4 with the metal layer 3. It corresponds to the difference.

<Slight adhesive tape 2>
As the slightly adhesive tape 2, for example, a tape having a resin film and an adhesive layer for the slightly adhesive tape provided on one surface of the resin film can be suitably used. A known material can be used as the material of the resin film constituting the slightly adhesive tape 2. For example, polyester (PET, PBT, PEN, PBN, PTT), polyolefin (PP, PE) can be used. Examples thereof include films obtained by partially replacing these materials, copolymers (EVA, EEA, EBA), and further improving adhesion and mechanical strength. Moreover, the laminated body of these films may be sufficient. From the viewpoint of heat resistance, smoothness, and availability, polyethylene terephthalate, polypropylene, and polyethylene are preferably selected.

  The thickness of the resin film constituting the slightly adhesive tape 2 is not particularly limited and may be appropriately set, but is preferably 10 to 150 μm.

  As the resin used for the adhesive layer for the slightly adhesive tape, known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, etc. used for the adhesive can be used. An acrylic adhesive having a polymer as a base polymer is preferred.

  Examples of the acrylic polymer include (meth) acrylic acid alkyl esters (for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, isopropyl ester). Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, (E.g., linear or branched alkyl ester having 1 to 30 carbon atoms, particularly 4 to 18 carbon atoms) of an alkyl group such as octadecyl ester and eicosyl ester) ) Acrylic acid cycloalkyl esters (e.g., cyclopentyl ester, acrylic polymer or the like using one or more of the monomer component cyclohexyl ester etc.). In addition, (meth) acrylic acid ester means acrylic acid ester and / or methacrylic acid ester, and (meth) of the present invention has the same meaning.

  The acrylic polymer contains units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or cycloalkyl ester, if necessary, for the purpose of modifying cohesive force, heat resistance and the like. May be. Examples of such monomer components include, for example, carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; maleic anhydride Acid anhydride monomers such as itaconic anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate Hydroxyl group-containing monomers such as 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; Styrene Contains sulfonic acid groups such as phonic acid, allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamidepropanesulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalenesulfonic acid Monomers; Phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; acrylamide, acrylonitrile and the like. One or more of these copolymerizable monomer components can be used. The amount of these copolymerizable monomers used is preferably 40% by weight or less based on the total monomer components.

  Furthermore, since the acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization as necessary. Examples of such polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) An acrylate etc. are mentioned. These polyfunctional monomers can also be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by weight or less of the total monomer components from the viewpoint of adhesive properties.

  The acrylic polymer can be prepared, for example, by applying an appropriate method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method to a mixture of one or more component monomers. The pressure-sensitive adhesive layer for the fine pressure-sensitive adhesive tape preferably has a composition in which the inclusion of a low molecular weight substance is suppressed from the viewpoint of preventing contamination of the wafer. From this point, an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000. Since the main component is preferable, the pressure-sensitive adhesive can be of an appropriate crosslinking type by an internal crosslinking method, an external crosslinking method, or the like.

  In addition, the adhesive strength of the pressure-sensitive adhesive layer for the fine pressure-sensitive adhesive tape is adjusted in consideration of holding of the pressure-sensitive adhesive layer 5 and the adhesive layer 4, peelability, and the like. The adhesive strength of the pressure-sensitive adhesive layer for fine pressure-sensitive adhesive tapes can be adjusted by controlling the cross-linking density of the pressure-sensitive adhesive layer for fine pressure-sensitive adhesive tapes. For example, polyfunctional isocyanate compounds, polyfunctional epoxy compounds, melamine compounds, metals Mixing with a low molecular weight compound having two or more carbon-carbon double bonds or a method of crosslinking using an appropriate external crosslinking agent such as a salt compound, metal chelate compound, amino resin compound, or peroxide Thus, an appropriate method such as a method of performing a crosslinking treatment by irradiation of energy rays or the like can be adopted. When using an external cross-linking agent, the amount used is appropriately determined depending on the balance with the base polymer to be cross-linked and further depending on the intended use as an adhesive. Generally, it is preferable to add about 20 parts by weight or less, and further 0.1 to 20 parts by weight with respect to 100 parts by weight of the base polymer.

  The thickness of the pressure-sensitive adhesive layer for the fine pressure-sensitive adhesive tape is not particularly limited and can be appropriately determined, but is generally about 3 to 200 μm. Moreover, the adhesive layer for fine adhesive tapes may be comprised by the single layer, or may be comprised by multiple layers.

<Method for Producing Electronic Device Package Tape 1>
<Step 1 (Processing of Adhesive Layer 4)>
Next, a method for manufacturing the electronic device package tape 1 according to the present embodiment will be described. First, the adhesive layer 4 is formed using a conventional method of preparing a resin composition and forming it into a film-like layer (step 1). Specifically, for example, the resin composition is applied onto the separator S (see FIG. 4D) and dried (when heat curing is necessary, for example, heat treatment is performed as necessary to dry the resin composition). ), A method of forming the adhesive layer 4 and the like. As the separator S, polyester (PET, PBT, PEN, PBN, PTT) series, polyolefin (PP, PE) series, copolymer (EVA, EEA, EBA) series, and these materials are partially substituted, Furthermore, a film having improved adhesion and mechanical strength can be used. Moreover, the laminated body of these films may be sufficient. The resin composition may be a solution or a dispersion.

<Process 2 (processing of metal layer 3)>
Moreover, as shown to FIG. 4 (A), the metal layer 3 is bonded using the fine adhesive tape BN for temporary holding | maintenance which has slight adhesiveness, and the roller r (step 2). As the metal layer 3, a commercially available metal foil may be used. As the temporary holding fine adhesive tape BN, the same one as the above-mentioned fine adhesive tape 2 can be used.

  As shown in FIG. 4B, a cut K is formed by using a cutting blade or the like so as to cut the metal layer 3 into a shape corresponding to the semiconductor chip C (see FIG. 6). Thereafter, as shown in FIG. 4C, the unnecessary portion 6 around the shape corresponding to the semiconductor chip C is peeled off from the temporary holding fine adhesive tape BN and removed (step 3).

  Next, as shown in FIG. 4D, the metal layer 3 cut into a shape corresponding to the semiconductor chip C is formed on the separator S while being held on the temporary holding fine adhesive tape BN. The metal layer 3 is embedded and held in the adhesive layer 4 by being placed on the adhesive layer 4 and heated and pressurized using a hot press machine (step 4). Thereafter, the separator S is peeled off (step 5).

<Modification of steps 1 and 2>
Alternatively, a solution of the resin composition of the adhesive layer 4 is applied onto the temporary holding fine adhesive tape BN and the metal layer 3 between the metal layers 3 separated into individual pieces and held on the temporary holding fine adhesive tape BN. You may make it heat-paste with the separator S by making and drying.

<Step 3 (cutting the adhesive layer 4)>
After the metal layer 3 is held on the adhesive layer 4, as shown in FIG. 5A, the adhesive layer 4 is cut into a shape corresponding to the wafer W using the pressing blade O1 (step 6). . Thereafter, the unnecessary portion 12 around the shape of the adhesive layer 4 corresponding to the wafer W is peeled off from the temporary holding fine adhesive tape BN and removed (step 7).

<Step 4 (bonding of the fine adhesive tape 2 and peeling of the temporary adhesive fine adhesive tape BN)>
Next, as shown in FIG. 5B, the slightly adhesive tape 2 is bonded onto the adhesive layer 4 (step 8). Thereafter, the temporary holding fine adhesive tape BN is peeled off (step 9). The adhesive force of the temporary holding fine adhesive tape BN is smaller than that of the fine adhesive tape 2, and when the temporary holding fine adhesive tape BN is peeled off, the adhesive layer 4 and the metal layer 3 remain on the fine adhesive tape 2 side.

<Process 5 (Processing of adhesive tape (DC tape) 5)>
Next, the adhesive tape 5 is produced. The base film 51 can be formed by a conventionally known film forming method. Examples of the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method. Next, the pressure-sensitive adhesive layer composition is applied on the base film 51 and dried (heat-crosslinked as necessary) to form the pressure-sensitive adhesive layer 52. Examples of the coating method include roll coating, screen coating, and gravure coating. The pressure-sensitive adhesive layer composition may be directly applied to the base film 51 to form the pressure-sensitive adhesive layer 52 on the base film 51, and the pressure-sensitive adhesive layer composition was subjected to a peeling treatment on the surface. The pressure-sensitive adhesive layer 52 may be transferred to the base film 51 after being applied to release paper or the like to form the pressure-sensitive adhesive layer 52. Thereby, the adhesive tape 5 in which the adhesive layer 52 was formed on the base film 51 is produced.

<Step 6 (bonding and cutting of adhesive tape (DC tape) 5)>
Thereafter, as shown in FIG. 5C, the adhesive tape (DC tape) 5 is applied to the fine adhesive tape 2 provided with the metal layer 3 and the adhesive layer 4 so that the metal layer 3 and the adhesive layer 52 are in contact with each other. (Step 10), and in some cases, as shown in FIG. 5D, the adhesive tape 5 is also cut into a circular label shape or the like of a predetermined size using the press cutting blade O2 (Step 11). The unnecessary part 13 is peeled off and removed from the slightly adhesive tape 2 (step 12), whereby the electronic device package tape 1 is produced.

<Modification of Manufacturing Method of Electronic Device Package Tape 1>
In the above description, the case where the gap between the metal layers 3 is filled with the adhesive layer 4 or the step reduction portion 7 is provided with the adhesive layer 4 has been described. However, a resin other than the adhesive layer 4 is used to form the gap between the metal layers 3. Alternatively, the step reduction portion 7 may be formed. In this case, a solution of a resin composition different from the adhesive layer 4 is applied and dried on the temporary holding fine adhesive tape BN between the metal layers 3 held by the temporary holding fine adhesive tape BN, The adhesive layer 4 formed on the separator S may be heat bonded. Or the metal layer 3 cut | disconnected in the shape corresponding to the semiconductor chip C is bonded on the adhesive bond layer 4 in the state hold | maintained at the temporary holding fine adhesive tape BN, and the temporary holding fine adhesive tape After BN is peeled off, a resin composition solution different from the adhesive layer 4 may be screen-printed between the metal layers 3, or a resin composition solution different from the adhesive layer 4 between the metal layers 3. May be added dropwise.

<How to use>
Next, a method for manufacturing a semiconductor device using the electronic device package tape 1 of the present embodiment will be described with reference to FIG.

  The manufacturing method of a semiconductor device includes a step of attaching a semiconductor wafer W on the electronic device package tape 1 (mounting step), a step of dicing the semiconductor wafer W to form a semiconductor chip C (dicing step), a metal A step of separating the laminate of the layer 3, the adhesive layer 4 and the semiconductor chip C from the adhesive layer 52 of the adhesive tape 5 (pickup step), and a step of pre-curing the obtained laminate (pre-curing step). And a step of flip chip connection of the semiconductor chip C onto the adherend 8 (flip chip connection step). The pre-curing step is not an essential step and may be performed as necessary. Moreover, you may implement suitably another process as needed.

[Mounting process]
First, the fine adhesive tape 2 arbitrarily provided on the electronic device package tape 1 is appropriately peeled off, and as shown in FIG. 6A, the semiconductor wafer W is adhered to the adhesive layer 4, This is adhesively held and fixed (mounting process). At this time, the adhesive layer 4 is in an uncured state (including a semi-cured state). The electronic device package tape 1 is attached to the back surface of the semiconductor wafer W. The back surface of the semiconductor wafer W means a surface opposite to the circuit surface (also referred to as a non-circuit surface or a non-electrode forming surface). Although the sticking method is not specifically limited, the method by pressure bonding is preferable. The crimping is usually performed while pressing from the pressure-sensitive adhesive tape 5 side by a pressing means such as a crimping roll. Therefore, when the surface on the pressure-sensitive adhesive layer 52 side of the metal layer 3 protrudes toward the pressure-sensitive adhesive layer 52 side from the top of the pressure-sensitive adhesive layer 4 side of the adhesive layer 4 between the adjacent metal layers 3, the metal layer The adhesive layer 4 between the three cannot be sufficiently pressed.

[Dicing process]
Next, as shown in FIG. 6B, the semiconductor wafer W is diced. As a result, the semiconductor wafer W is cut into a predetermined size and divided into pieces (small pieces), whereby the semiconductor chip C is manufactured. For example, the dicing is performed from the circuit surface side of the semiconductor wafer W according to a conventional method. In this step, for example, a cutting method called full cut that cuts up to the electronic device package tape 1 can be adopted. It does not specifically limit as a dicing apparatus used at this process, A conventionally well-known thing can be used. At this time, since the metal layer 3 is cut into a shape corresponding to the semiconductor chip C and separated into pieces, the metal layer 3 is not cut in the dicing process. For this reason, the cutting waste of the metal layer 3 is not generated. Further, since the semiconductor wafer W is bonded and fixed with excellent adhesion by the electronic device package tape 1, chip chipping and chip jumping can be suppressed, and damage to the semiconductor wafer W can also be suppressed. In addition, when expanding the tape 1 for electronic device packages, this expansion can be performed using a conventionally well-known expanding apparatus.

[Pickup process]
As shown in FIG. 6C, the semiconductor chip C is picked up, and the semiconductor chip C is peeled from the adhesive tape 5 together with the adhesive layer 4 and the metal layer 3. The pickup method is not particularly limited, and various conventionally known methods can be employed. For example, a method of pushing up each semiconductor chip C from the base film 51 side of the electronic device package tape 1 with a needle and picking up the pushed-up semiconductor chip C with a pick-up device can be mentioned.

[Precuring process]
Precuring is performed in which the adhesive layer 4 in the laminate of the metal layer 3, the adhesive layer 4, and the semiconductor chip C is preliminarily cured so that no bumping occurs in the adhesive layer 4 in the subsequent flip chip connection process. The pre-curing conditions may be appropriately set within a range in which the adhesive layer 4 does not bump, but it is preferable to heat at 100 to 150 ° C. for about 4 hours to 15 minutes.

[Flip chip connection process]
As shown in FIG. 6D, the picked-up semiconductor chip C is fixed to an adherend 8 such as a substrate by a flip chip bonding method (flip chip mounting method). Specifically, the semiconductor chip C is always placed on the adherend 8 such that the circuit surface (also referred to as a surface, a circuit pattern formation surface, an electrode formation surface, etc.) of the semiconductor chip C faces the adherend 8. Fix according to law. For example, flux is first attached to the bumps 9 as connection portions formed on the circuit surface side of the semiconductor chip C. Next, the bump 9 and the conductive material 10 are melted while bringing the bump 9 of the semiconductor chip C into contact with the bonding conductive material 10 (solder or the like) attached to the connection pad of the adherend 8 and pressing it. The electrical conduction between the semiconductor chip C and the adherend 8 can be ensured, and the semiconductor chip C can be fixed to the adherend 8 (flip chip bonding step). At this time, a gap is formed between the semiconductor chip C and the adherend 8, and the gap distance is generally about 30 μm to 300 μm. After the flip chip bonding (flip chip connection) of the semiconductor chip C on the adherend 8, the flux remaining on the facing surface or gap between the semiconductor chip C and the adherend 8 is washed and removed. A sealing material (sealing resin or the like) is filled and sealed.

  As the adherend 8, various substrates such as a lead frame and a circuit substrate (such as a wiring circuit substrate) can be used. The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate and a plastic substrate. Examples of the plastic substrate include an epoxy substrate, a bismaleimide triazine substrate, and a polyimide substrate. Also, a chip-on-chip structure can be obtained by using another semiconductor chip as the adherend 8 and flip-chip connection of the semiconductor chip C.

<Example>
Next, in order to further clarify the effects of the present invention, examples and comparative examples will be described in detail, but the present invention is not limited to these examples.
<Adhesive layer composition>
As the acrylic copolymer (A1) having a functional group, a copolymer comprising 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, the ratio of 2-ethylhexyl acrylate being 60 mol%, and the weight average molecular weight being 700,000 Was prepared. Next, 2-isocyanatoethyl methacrylate is added so that the iodine value becomes 20, and an acrylic copolymer (a1) having a glass transition temperature of −50 ° C., a hydroxyl value of 10 mgKOH / g, and an acid value of 5 mgKOH / g. Was prepared.

  To 100 parts by mass of the acrylic copolymer (a1), 5 parts by mass of Coronate L (trade name, manufactured by Tosoh Corporation) is added as a polyisocyanate, and Esacure KIP 150 (trade name, Lamberti) is used as a photopolymerization initiator. The mixture obtained by adding 3 parts by mass of the product was dissolved in ethyl acetate and stirred to prepare an adhesive layer composition (1).

The following was produced as a base film.
<Base film>
Resin beads of ethylene-methacrylic acid copolymer were melted at 200 ° C. and formed into a long film having a thickness of 100 μm and a loop stiffness of 7 mN using an extruder to prepare a base film. As the ethylene-methacrylic acid copolymer, Nucleol NO35C (trade name) manufactured by Mitsui DuPont Polychemical Co., Ltd. was used.

<Adhesive tape>
The pressure-sensitive adhesive layer composition was applied to a release liner composed of a polyethylene-terephthalate film subjected to a release treatment so that the thickness after drying was 10 μm, and dried at 110 ° C. for 3 minutes to obtain a pressure-sensitive adhesive layer. Then, it bonded together with the said base film and produced the adhesive tape.

(2) Preparation of adhesive layer

<Adhesive layer>
Acrylic resin (manufactured by Nagase ChemteX Corporation, trade name “Taisan Resin SG-P3”, Mw 850,000, Tg 12 ° C.) 80 parts by mass and naphthalene type epoxy resin (manufactured by DIC Corporation, trade name “HP-4700”) 10 An adhesive layer composition solution was prepared by dissolving 10 parts by mass of phenol resin (trade name “MEH7851”, manufactured by Meiwa Kasei Co., Ltd.) as a curing agent in methyl ethyl ketone. This adhesive layer composition solution was applied on a release film (release liner) made of a polyethylene terephthalate film having a thickness of 50 μm after the silicone release treatment, and then dried at 130 ° C. for 5 minutes. Thereby, an adhesive layer having a thickness of 5 μm was produced.

(3) Preparation of metal layer <metal layer>
F2-WS (trade name, manufactured by Furukawa Electric Co., Ltd., copper foil, thickness 18 μm)

(4) Production of slightly adhesive tape

The following was produced as a slightly adhesive tape.
(Resin film)
Styrene-hydrogenated isoprene-styrene block copolymer (SEPS) (Kuraray Co., Ltd., trade name “Septon KF-2104”) and homopropylene (PP) (Ube Industries, Ltd., trade name “J-105G”) ) Were mixed at a blending ratio of 40:60 at 200 ° C. and molded into a long film having a thickness of 90 μm using an extruder to prepare a resin film.

(Adhesive layer composition for fine adhesive tape)
The acrylic copolymer (A2) having a functional group is composed of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate and methacrylic acid, the ratio of 2-ethylhexyl acrylate is 70 mol%, the weight average molecular weight is 500,000, and the glass transition temperature. An acrylic copolymer (a2) having a hydroxyl value of 30 gKOH / g and an acid value of 5 mgKOH / g was prepared at -50 ° C.
8 parts by mass of a polyisocyanate compound (trade name “Coronate L”, manufactured by Tosoh Corporation) is added to 100 parts by mass of the acrylic copolymer (a2), dissolved in ethyl acetate, stirred, and the base material Tape adhesive layer composition e-1 was obtained.
<Slight adhesive tape>

  The prepared pressure-sensitive adhesive layer composition for a fine pressure-sensitive adhesive tape was applied to a release liner made of a polyethylene-terephthalate film subjected to a release treatment so that the thickness after drying was 10 μm, and dried at 110 ° C. for 3 minutes. Then, it bonded together with the said resin film and produced the fine adhesive tape in which the adhesive layer for fine adhesive tapes was formed on the resin film.

(5) Production of tape for electronic device package <Example 1>
The fine adhesive tape and the metal layer obtained as described above were bonded together under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s. Thereafter, the metal layer was cut into individual pieces having a size of 10 × 10 mm, and unnecessary portions were removed by cutting so that the distance between adjacent pieces was 0.5 mm. Thereafter, the metal layer was bonded to the adhesive layer under the conditions of a bonding angle of 120 °, a pressure of 0.2 MPa, and a speed of 10 mm / s while being held on the slightly adhesive tape. And after peeling off the slightly adhesive tape, as shown in FIG. 8, the thickness x after drying of the adhesive layer composition solution between the metal layers and the portion of the adhesive layer only between the metal layers is 23 μm. The solution was added dropwise and dried at 130 ° C. for 5 minutes.

  Then, the adhesive layer is pre-cut into a circular shape corresponding to the wafer, the adhesive layer of the adhesive tape and the metal layer side of the metal layer held by the adhesive layer are bonded together, and the adhesive tape is bonded to the ring frame The tape was precut into a shape that can be made, and the electronic device package tape of Example 1 was produced.

<Examples 2 to 19, Comparative Example 1>
The electronic device package tapes of Examples 2 to 19 were produced in the same manner as in Example 1 except that the thickness x of the adhesive layer between metal layers and the interval between metal layers were changed to the combinations shown in Tables 1 and 2. did. Examples 6-9 and 15-19 used the process of screen-printing an adhesive layer composition solution in the state which masked the metal layer instead of the process of dripping the adhesive layer composition solution between metal layers. . Moreover, the tape for electronic device packages of the comparative example 1 was carried out similarly to Example 1 except having bonded the metal layer with the adhesive bond layer without cut | disconnecting to a 10x10 square mm, and pre-cutting with the adhesive bond layer in the circular shape. Was made.

  The following evaluation was performed on the tapes for electronic device packages according to Examples 1 to 19 and Comparative Example 1. The results are shown in Tables 1 and 2.

  The adhesive layer of the tape for electronic device packages according to each of the examples and comparative examples was heated and pasted at 70 ° C. for 10 seconds on the back surface of a 200 μm thick silicon wafer with bumps (bump: copper pillar and solder, bump height: about 40 μm). After combining, dicing was performed and divided into 10 × 10 mm evaluation chips.

(Void evaluation)
After bonding the adhesive layer to the silicon wafer, visually observe the tape for electronic device packaging from the adhesive tape side. If the void is not confirmed as good, ○, if the void is confirmed as acceptable It evaluated by (triangle | delta). In addition, even if the void was confirmed, it was an acceptable product, this void is generated between the adhesive layer between the metal layers and the semiconductor wafer, the part is in the dicing process, This is because it is not a problem because it is a part to be cut and removed.

(Evaluation of adhesion of adhesive to metal layer surface)
After bonding the adhesive layer to the silicon wafer, visually check whether the adhesive has adhered to the surface of the metal layer. As a permissible product, the product was confirmed as Δ.

(Evaluation of generation of metal layer cutting waste)
After dicing, the presence or absence of cutting chips on the metal layer was visually observed. A case where no cutting waste was confirmed was evaluated as “Good”, and a case where cutting waste was confirmed was evaluated as “Poor”.

  As shown in Tables 1 and 2, the tapes for electronic device packages according to Examples 1 to 19 are preliminarily cut into a shape corresponding to the semiconductor chip in the tape for electronic device packaging. Good results.

  Moreover, as for the tape for electronic device packages which concerns on Examples 1-9, the metal layer is embedded in the adhesive bond layer, the surface at the side of the adhesive layer of a metal layer, and the adhesive layer side of the adhesive bond layer between metal layers Since the level difference from the top of the film was less than 3 μm, particularly excellent results were obtained in the void evaluation and the adhesion evaluation of the adhesive on the surface of the metal layer.

  In contrast, the electronic device package tape according to Comparative Example 1 was inferior in the evaluation of the generation of metal chips, because the metal layer was not cut into a shape corresponding to the semiconductor chip in advance.

1: Electronic device package tape 2: Slight adhesive tape 3: Metal layer 4: Adhesive layer 5: Adhesive tape 5a: Label portion 5b: Peripheral portion

Claims (8)

An adhesive tape having a base film and an adhesive layer;
A metal layer provided on the side opposite to the base film of the adhesive layer; and
An adhesive layer for adhering the metal layer to the back surface of the electronic device;
The metal layer is singulated into a shape corresponding to the electronic device,
A tape for electronic device packages, wherein a plurality of the separated metal layers are held at predetermined intervals on the adhesive layer.   The adhesive layer has a shape corresponding to a wafer, and is cut into a shape corresponding to the electronic device together with the wafer in a state of being bonded to the wafer. The tape for electronic device packages of Claim 1.   A step reduction portion is formed between the metal layers to reduce a step between the surface of the metal layer on the pressure-sensitive adhesive layer side and the top of the metal layer on the pressure-sensitive adhesive layer side. The tape for electronic device packages of Claim 1 or Claim 2.   The level | step difference of the surface by the side of the said adhesive layer of the said metal layer and the top part by the side of the said adhesive layer of the said level | step-difference reduction part between the said metal layers is less than 3 micrometers. The tape for electronic device packages as described in any one.   5. The electronic device package tape according to claim 3, wherein the step reduction portion is formed of the adhesive layer. 6.   The tape for an electronic device package according to any one of claims 1 to 5, wherein the metal layer contains copper or aluminum.   The adhesive layer contains (A) an epoxy resin, (B) a curing agent, (C) an acrylic resin or a phenoxy resin, and (D) a surface-treated inorganic filler. The tape for electronic device packages as described in any one of Claims 6. The pressure-sensitive adhesive layer has an acrylic ester represented by CH ₂ = CHCOOR (wherein R is an alkyl group having 4 to 18 carbon atoms), a hydroxyl group-containing monomer, and radical reactivity in the molecule. The tape for electronic device packages as described in any one of Claims 1-7 containing the acrylic polymer comprised including the isocyanate compound which has a carbon-carbon double bond.