JP2005072295A - Tape carrier structure and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tape carrier structure capable of saving resources and reducing costs in the manufacturing stage and responding to the needs for downsizing and thinning of electronic parts, Tape carrier for bottom electrode type electronic parts that can be easily removed and mounted with high density, or tape carrier for WSP that facilitates formation of solder bump electrodes, tape carrier base material used for these, and their An object is to provide a manufacturing method.
SOLUTION: An adhesive tape 8 comprising a metal foil 4 constituting a metal layer 5, a plating layer 6 formed on the surface of the metal foil 4, and an adhesive layer 8a adhered to a plating surface 6a of the plating layer 6. The tape carrier substrate 2 in which the metal foil 4 and the plating layer 6 are etched to form the lower surface electrode piece 10 and the manufacturing method thereof. In addition, the tape carrier 18 in which the electronic element 12 is bonded to the lower surface electrode piece 10 through the conductive adhesive 14 and the manufacturing method thereof.
[Selection] Figure 1

Description

  The present invention relates to a tape carrier structure in which electronic elements are arranged on a tape, and in particular, a tape carrier suitably used for forming solder bumps on electrodes of various components having electronic components and electrodes, and the same. It is related with the tape carrier base material used for a tape carrier, and those preparation methods.

  In portable digital AV devices and information terminal devices, the devices are becoming smaller and thinner, and electronic components such as resistors and capacitors mounted on the printed circuit boards of these small electronic devices are also becoming smaller and thinner. Needs are increasing.

  With semiconductor packages, area mounting type package systems such as BGA (Ball Grid Array), LGA (Land Grid Array), and CSP (Chip Size Package) have been proposed along with miniaturization. Furthermore, a WSP (Wafer Scale Package) or the like that is mounted while being cut from a silicon wafer is often used. In these packages, particularly, a structure of a solder bump adopting an FC (Flip Chip) connection method has been actively proposed. Also, solder bonding using bumps formed of solder balls is mainly used for mounting BGA and CSP on printed wiring boards.

  On the other hand, as a conventional capacitor, there is the capacitor 20 shown in FIG. 7A, and the capacitor 20 is obtained by the following steps. As shown in FIG. 2B, first, the anode rod 24 of the electronic element 22 and the terminal portion 28a provided on the lead frame 26 are joined by welding or the like, and the electronic element 22 and the terminal portion 28b are connected by the wire 30. Bond. Next, after the electronic element 22 and the terminal portions 28a and 28b are resin-sealed with the mold resin 32, the electronic element 22 is separated from the lead frame 26 by cutting at predetermined portions of the terminal portions 28a and 28b, and the mold resin 32 is removed. The portions of the terminal portions 28a and 28b protruding from the capacitor 20 are bent toward the bottom surface of the capacitor 20 along the mold resin 32 (see, for example, Patent Document 1).

  However, the capacitor 20 obtained in this manner has a high component height, and a solder fillet is formed at the time of mounting on the board, so that high-density mounting cannot be performed, and the need for miniaturization and thinning can be met. Absent.

  Therefore, a chip capacitor 40 having a bottom electrode structure as shown in FIG. 8 is disclosed in order to meet the needs for miniaturization and thinning (see, for example, Non-Patent Document 1). In the chip capacitor 40, a bottom electrode type plating filling tape 42 (FIG. 9D) is used. As shown in FIGS. 9A to 9D, in the manufacturing process of the plating filling tape 42, first, a fine opening 46 having a desired shape is provided in a polyimide tape 44 with an adhesive (thickness: 62 μm) by a punching method. Thereafter, the polyimide tape 44 and the copper foil 48 are thermocompression-bonded with a roll laminator ((a) in the figure). Then, the inside of the fine opening 46 of the polyimide tape 44 is filled with a copper plating 50 to a thickness of about 50 μm ((b) in the figure). Next, the copper foil 48 is processed by a photoetching method to form the fine wiring 52 ((c) in the figure). Finally, a lead-free tin-silver alloy plating 54 is applied to the formation surface of the fine wiring 52 and the filling surface of the copper plating 50 serving as the lower surface electrode for chip mounting and printed wiring board mounting ((d) in the figure). ).

  The chip capacitor 40 assembled using the plated filling tape 42 obtained in this way can be downsized compared to the capacitor 20 using the conventional lead frame 26 shown in FIG. Further, since the chip capacitor 40 has a bottom electrode structure, the mounting distance between the chip capacitor 40 and the printed wiring board is close, and as a result, the electrical characteristics are also good.

Japanese Unexamined Patent Publication No. 09-092585 (2nd page, Fig. 5-6) Satoshi Chinda, 3 others, “Copper-plated tape base material for bottom electrode type electronic parts”, MES2002, 12th Microelectronics Symposium Proceedings, Japan Institute of Electronics Packaging, October 2002, p. 327-330

  However, since the plating filling tape 42 used for the chip capacitor 40 requires many steps, the manufacturing cost increases. Further, the conventional capacitor 20 and the chip capacitor 40 must be sealed with the top tape 64 in the embossed empty portion 62 of the carrier tape 60 as shown in FIG. However, at the time of mounting, it is necessary to take out the enclosed capacitor 20 and the like again from the carrier tape 60, and the work of enclosing and taking out was complicated.

  Furthermore, in the conventional manufacturing process of the capacitor 20, the pattern of desired terminal portions 28a and 28b formed on the lead frame 26 is formed by punching the lead frame 26, but the punched portion is wasted. Further, even after the electronic element 22 is cut off by the terminal portions 28a and 28b, the lead frame 26 is wasted.

  In addition, semiconductor packages such as BGA and CSP mainly employ solder bonding by bumps formed with solder balls when mounted on a printed wiring board, but with the miniaturization of semiconductor packages, the solder ball pitch is also minimized. Therefore, it is very difficult to inject the underfill agent into a narrow gap between the printed wiring board and the semiconductor package.

  Therefore, the present invention provides a tape carrier structure that can save resources and reduce costs at the manufacturing stage and can meet the needs for downsizing and thinning of electronic components. In particular, the tape carrier structure can be detached from the carrier tape when mounting electronic components. Tape carrier for bottom electrode type electronic components that can be mounted easily and with high density, or tape carrier for WSP that facilitates formation of solder bump electrodes, tape carrier substrate used therefor, and production thereof It aims to provide a method.

That is, the gist of the present invention is an adhesive tape having an adhesive layer on at least one surface;
A metal layer adhered to the surface of the adhesive layer,
The metal layer is a tape carrier base material constituting a conductor pattern.

  In the tape carrier substrate, the metal layer may be made of a metal selected from copper, silver, tin, nickel, aluminum, and an alloy containing at least one of them.

  In the tape carrier substrate, the metal layer may be composed of a metal foil selected from a copper foil, a silver foil, a tin foil, a nickel foil, an aluminum foil, and an alloy foil made of the alloy.

  Moreover, in this tape carrier base material, there exists in having a plating layer in the surface which faces the said adhesion layer of the said metal foil.

  Further, in the tape carrier substrate, the plating layer is made of tin plating or tin alloy plating, and the tin alloy is tin-copper, tin-bismuth, tin-silver, tin-silver-copper, tin-zinc. It is to consist of either.

  In the tape carrier substrate, the adhesive layer may be made of an adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays.

  In the tape carrier substrate, the conductor pattern is an electrode and / or an electronic circuit, and the electrode is a bottom electrode piece.

Another aspect of the present invention is the tape carrier substrate,
Comprising an electronic element,
The electronic element is a tape carrier bonded to the conductor pattern.

  In the tape carrier, the electronic element is bonded to the conductor pattern via an adhesive flux.

Still another aspect of the present invention is a method for producing the tape carrier substrate,
Preparing an adhesive tape comprising an adhesive layer;
Forming a conductor pattern with a metal layer on the surface of the adhesive layer.

Still another aspect of the present invention is a method for producing the tape carrier substrate,
Preparing a metal foil and an adhesive tape comprising an adhesive layer;
Attaching the adhesive tape to the metal foil;
And etching the metal foil to form a conductor pattern.

  In the method for producing a tape carrier substrate, the conductor pattern may be an electrode and / or an electronic circuit, and the adhesive layer may be made of an adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays. .

Further, another gist of the present invention is a method for producing the tape carrier,
Preparing an adhesive tape having an adhesive layer and an electronic element;
Forming a conductive pattern with a metal layer on the surface of the adhesive layer;
Joining the electronic element to the conductor pattern.

Also, a method for producing the tape carrier,
Preparing a metal foil, an adhesive tape including an adhesive layer, and an electronic element;
Attaching the adhesive tape to the metal foil;
Etching the metal foil to form a conductor pattern;
And a step of bonding the lower surface electrode piece and the electronic element.

Furthermore, the step of joining the electronic element in the method for producing the tape carrier to the conductor pattern,
Applying adhesive flux to the conductor pattern;
Joining the electronic element to the conductor pattern via the adhesive flux.

Still further, the step of bonding the electronic element to the conductor pattern comprises:
Adhering the adhesive flux formed into a tape shape on the surface on which the conductor pattern is formed;
A step of crimping the electronic element to the conductor pattern via the adhesive flux.

  Further, in the method for producing the tape carrier, the conductor pattern is an electrode and / or an electronic circuit, and further, the adhesive layer can be made of an adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays.

In addition, another gist of the present invention is the step of preparing the tape carrier substrate and the electronic element,
Bonding the electronic element to the conductor pattern to obtain a tape carrier;
Irradiating the adhesive tape constituting the tape carrier with ultraviolet rays;
And a step of separating the conductive pattern to which the electronic element is bonded from the adhesive tape.

Further, in the electronic device mounting method, the step of obtaining the tape carrier,
Applying adhesive flux to the conductor pattern;
Joining the electronic element to the conductor pattern via the adhesive flux.

Furthermore, in the electronic device mounting method, the step of obtaining the tape carrier includes:
Adhering the adhesive flux formed into a tape shape on the surface on which the conductor pattern is formed;
A step of crimping the electronic element to the conductor pattern via the adhesive flux.

Further, in the electronic device mounting method, the adhesive flux includes a thermoplastic resin or a precursor of a thermosetting resin,
Further, the method includes a step of heating the conductor pattern separated from the adhesive tape and bonded to the electronic element.

  The tape carrier base material of the present invention can achieve cost reduction and resource saving by simplifying the structure of the tape carrier base material itself, and cost reduction, resource saving, and The production efficiency can be improved.

  Moreover, a tape carrier can be easily obtained by joining an electronic element to the conductor pattern formed on the tape carrier substrate of the present invention, for example, the lower surface electrode piece. Therefore, after manufacturing the electronic component, a process of encapsulating in the carrier tape is not required, and cost reduction and resource saving in the manufacturing process can be achieved.

  Furthermore, in the bonding step of the electronic element, the electronic element can be easily positioned and fixed by applying an adhesive flux to the conductor pattern. In addition, when soldering the electronic element and the conductor pattern, effects such as removal of the oxide film on the metal surface, prevention of reoxidation by heating during soldering, and improvement of wetting by reducing the surface tension of the solder can be obtained. In particular, when adhesive tape shaped tape is applied, the gap between the electronic component and the substrate can be filled with the adhesive flux when mounted on the substrate, and the substrate is not injected separately. And the bonding strength between the electronic parts can be improved.

  Further, by using the adhesive tape as the carrier tape, the electronic components can be separated from the tape carrier directly or only by irradiation with ultraviolet rays at the time of mounting the substrate, and the mounting efficiency at the time of mounting can be improved.

  Furthermore, by using the tape carrier substrate of the present invention, it is possible to easily obtain an electronic component having a bottom electrode structure or a WSP having a solder bump electrode, so that the needs for miniaturization and thinning of the electronic component itself can be met. At the same time, high-density mounting becomes possible, and it is possible to meet the needs for miniaturization and thinning of electronic devices such as portable personal computers, mobile phones, digital cameras, and PDAs (Personal Digital Assistants).

  Furthermore, in the plating layer according to the present invention, by using lead-free tin alloy plating, it is possible to easily cope with lead-free in recent environmental problems.

  Hereinafter, although the aspect of this invention is demonstrated, the aspect of this invention is not limited to what was shown below.

  FIG. 1 shows a tape carrier base material (hereinafter referred to as “tape base material”) according to the present invention, which can be suitably used particularly for a bottom electrode type electronic component. The tape base material 2 is obtained through the manufacturing steps shown in FIGS. First, the surface of a metal foil 4 constituting the metal layer 5, for example, a copper foil, is plated with tin or the like to form a plating layer 6 ((a) in the figure). Next, the adhesive tape 8 having the adhesive layer 8a is adhered to the plating surface 6a of the plating layer 6 ((b) in the figure). Finally, the metal foil 4 and the plating layer 6 are processed by a photoetching method to form the lower surface electrode piece 10 ((c) in the figure). FIG. 4D is a cross-sectional view showing a tape carrier 18 in which an electronic element 12 such as a tantalum electrolytic capacitor element is joined to the lower surface electrode piece 10 via a conductive adhesive 14. 2B, the electronic element 12 separated from the adhesive tape 8 is composed of a solder portion for preparing an electrical connection between the lower surface electrode made of the metal foil 4 and the mounting board made of the plating layer 6. 1 is a cross-sectional view of a lower surface electrode type electronic component (hereinafter referred to as “electronic component”) 16 including the lower surface electrode piece 10 to be manufactured.

  Here, as the metal foil 4 constituting the metal layer 5, in addition to copper foil, silver foil, tin foil, nickel foil, aluminum foil, two or more metals selected from copper, silver, tin, nickel, and aluminum are used. Or an alloy foil made of an alloy containing at least one of copper, silver, tin, nickel, and aluminum and another metal, and a copper foil having a high conductivity can be used. It can be suitably used by reducing ESR (equivalent series resistance) and thinning. The metal foil 4 is obtained by a continuous plating method using a cathode drum made of stainless steel, titanium or the like.

  The plating layer 6 connects the electrode made of the metal foil 4 and the mounting substrate when the electronic component 16 (FIG. 2B) having the electronic element 12 bonded to the lower surface electrode piece 10 is mounted on the substrate. It is the plating layer for board | substrate mounting provided in order to do. Although this plating layer 6 is not necessarily provided, it is preferable that the plating layer 6 is provided on the surface of the metal foil 4 in order to facilitate connection to the mounting substrate. Furthermore, the plating layer 6 is composed of tin plating or tin alloy plating. Examples of the tin alloy plating include tin-copper plating, tin-bismuth plating, tin-silver plating, tin-silver-copper plating, and tin-zinc plating. Etc. can be used. In addition, although plating containing lead such as tin-lead plating can be used, in order to cope with lead-free in recent environmental problems, in the present invention, tin-plated tin alloy plating including tin-copper plating is used. Is preferably used.

  The adhesive tape 8 includes an adhesive layer 8a on one surface of a tape-like member 21 made of a synthetic resin such as polyester, polyvinyl chloride, or polyolefin. For example, a phenol resin adhesive, a polyurethane adhesive, a polyvinyl acetate adhesive, a rubber adhesive, or the like can be applied to the adhesive layer 8a. However, the adhesive strength of these various adhesives is preferably such that the bottom electrode piece 10 can be easily separated from the adhesive tape 8. That is, the electronic component 16 in which the electronic element 12 is bonded to the lower surface electrode piece 10 is separated from the adhesive tape 8 and mounted on the mounting substrate when mounted on the substrate, and therefore the electronic component 16 must be separable from the adhesive tape 8. I must. Therefore, the above-mentioned various adhesives can temporarily bond the electronic component 16 including the lower surface electrode piece 10 on the pressure-sensitive adhesive tape 8 and can temporarily separate the lower surface electrode piece 10 from the pressure-sensitive adhesive tape 8 when the electronic component 16 is mounted. It is preferable to have the property.

  Moreover, the adhesive tape 8 may be provided with an adhesive layer 8b made of an adhesive having a property that the adhesive strength is reduced or disappears by irradiating ultraviolet rays. Any known pressure-sensitive adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays can be applied to the pressure-sensitive adhesive layer 8b. Examples of the pressure-sensitive adhesive include polymers or oligomers such as acrylate esters and methacrylate esters, and diluents. And a monomer that acts as a crosslinking agent, an ultraviolet sensitizer such as benzoin and a halogen compound, a stabilizer, an antioxidant, and the like.

  Here, specific examples of the pressure-sensitive adhesive tape 8 including the pressure-sensitive adhesive layer 8b according to the present invention include back grinding and etching UV tapes, SP-552M and SP-594M manufactured by Furukawa Electric Co., Ltd. Each of the UV tapes is an adhesive tape 8 having excellent etching resistance, in which the tape-like member 21 is made of polyolefin and the adhesive layer 8b is made of an acrylic resin adhesive. For example, the adhesive strength when these UV tapes (adhesive tape 8) are attached to the Si wafer mirror surface is 1.4 to 1.5 N / 25 mm before ultraviolet irradiation, and 0.03 to 0 after ultraviolet irradiation. 0.08 / 25 mm. That is, the adhesive tape 8 having the adhesive layer 8b can securely fix the electronic component 16 on the adhesive tape 8 with a strong adhesive force before the ultraviolet irradiation, while the adhesive force sharply weakens after the ultraviolet irradiation. Thus, the electronic component 16 can be easily peeled off.

  The tape base material 2 (FIG. 1 (c)) having the above configuration has fewer steps in the manufacturing stage than the plating filling tape 42 shown in FIG. 9 (d), and the cost can be reduced.

  Further, as shown in FIG. 1D, a tape carrier 18 is obtained by bonding an electronic element 12 with a conductive adhesive 14 to a lower surface electrode piece 10 composed of a metal foil 4 and a plating layer 6 of a tape substrate 2. Can be obtained. The conductive adhesive 14 is an epoxy resin-based or phenol resin-based adhesive, in which a conductive filler such as silver powder, copper powder, aluminum powder, and a solvent, an additive, etc. are blended as necessary. In joining the metal foil 4 and the electronic element 12, any known conductive adhesive can be applied and is not particularly limited.

  Moreover, the lower surface electrode piece 10 and the electronic element 12 may be joined by solder. In addition, as solder used for joining, solder containing flux, for example, solder cream, cored solder, or the like is preferably used. The flux has effects such as removal of an oxide film on the metal surface, prevention of reoxidation by heating during soldering, and improvement of wetting by reducing the surface tension of the solder. Therefore, by using solder containing flux, workability can be improved in the joining work between the lower surface electrode piece 10 and the electronic element 12.

  Here, in joining of the lower surface electrode piece 10 and the electronic element 12 in the present invention, there are two types, SS type and SZ-101 type of fine flux FB50-A (Harima Kasei Co., Ltd.) of adhesive flux. used. The SS type has a flux halogen content of 0.18 to 0.22% and an aqueous solution resistance of 75 ± 25 kΩ · cm. The SZ type has a halogen content of 0.15 to 0.25% and an aqueous solution resistance of 18 ± 5 kΩ · cm. As a result of applying this to the lower surface electrode piece 10 and bonding the electronic element 12, sufficient bonding strength was obtained and the efficiency of the bonding operation could be improved. In addition, as a fine bond coating method, a dispensing method, a screen printing, a stamping, a transfer method, a tampo printing, and the like can be applied, and there is no particular limitation.

  A tape carrier 18a shown in FIG. 2A is an example of a tape carrier when mounted on a substrate, and the adhesive tape 8 in the tape carrier 18a is an adhesive layer 8b made of an adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays. (Not shown). By irradiating the tape carrier 18a having the electronic element 12 bonded to the lower surface electrode piece 10 formed on the adhesive tape 8 with ultraviolet rays, the adhesive force of the adhesive layer 8b is reduced, and the lower surface to which the electronic element 12 is bonded. The electrode piece 10 can be separated from the adhesive tape 8, and an electronic component 16 as shown in FIG. Therefore, the cutting process from the lead frame 26 and the bending process of the terminal portions 28a and 28b in the embodiment shown in FIG. 7 are not required, and waste that has occurred in the lead frame 26 can be eliminated, thereby reducing costs and resources. I can do it.

  Moreover, since the lower surface electrode piece 10 in the electronic component 16 separated from the adhesive tape 8 includes the plating layer 6 for connection to the mounting substrate, when the electronic component 16 is mounted on the mounting substrate, Can be easily connected.

  Furthermore, in the prior art, a step of pre-encapsulating the electronic components in the embossed voids 62 of the carrier tape 60 shown in FIG. In 18a, the encapsulation process of the electronic component 16 can be omitted. In particular, when the pressure-sensitive adhesive tape 8 having the pressure-sensitive adhesive layer 8b is used as a carrier tape, the electronic component 16 may be dropped from the pressure-sensitive adhesive tape 8 because the electronic component 16 is fixed with a strong adhesive force before irradiation with ultraviolet rays. In addition, the tape carrier 18a that can be easily handled can be obtained without the need to enclose the electronic component 16 in the stage before mounting on the substrate. On the other hand, when the electronic component 16 is mounted, the electronic component 16 can be easily detached from the adhesive tape 8 by simply irradiating ultraviolet rays, so that the mounting efficiency can be improved and the electronic component 16 can be mounted. Since the pressure-sensitive adhesive tape 8 is pasted up to this point, oxidation of the plating surface 6a of the plating layer 6 can be prevented.

  In addition, since the electronic component 16 having the bottom electrode structure can be easily obtained by using the tape base material 2, it is possible to meet the needs for miniaturization and thinning of the electronic component itself, and at the time of mounting on the substrate, it has a high density. Since mounting is possible, it will be possible to meet the needs for downsizing and thinning electronic devices. That is, by applying the electronic component 16 obtained by the present invention to a portable personal computer, a mobile phone, a digital camera, a PDA (Personal Digital Assistant), etc. that are desired to be further reduced in size and thickness, it is extremely reduced in size and thickness. Can be obtained.

  In addition, although it is also possible to utilize the adhesive tape 8 provided with the adhesive layer 8a as a carrier tape, the adhesive layer 8a has temporary adhesiveness that can easily separate the electronic component 16 from the adhesive tape 8 as described above. The adhesive which has is applied. Therefore, although it is excellent in that it can be easily separated from the adhesive tape 8 when the electronic component 16 is mounted, it is easy to handle the tape carrier 18a and fix the electronic component 16 to the adhesive tape 8 in the stage before mounting. Considering, it is preferable to use the adhesive tape 8 provided with the adhesive layer 8b. When the adhesive tape 8 is used as a carrier tape, a sprocket hole 19 for delivery of the adhesive tape 8 is provided at the longitudinal end of the adhesive tape 8.

  As mentioned above, although the tape base material 2 of this invention was explained in full detail based on the manufacturing process, the aspect of this invention is not limited to said thing.

  For example, as shown in FIG. 3, an adhesive tape 8 having an adhesive layer 8a or 8b is attached to the surface of a metal foil 4 made of tin or the like (FIG. 3A), and the metal foil 4 is photoetched. It may be the tape base material 2a in which the lower surface electrode piece 10a is formed by processing ((b) in the figure). Since the tape base material 2a does not require the step of forming the plating layer 6 in the manufacturing process (FIG. 1A), further cost reduction, resource saving, and improvement in manufacturing efficiency are possible as compared with the tape base material 2. Can be planned. However, since the tape base material 2a does not include the plating layer 6, when mounting the electronic component 16a (FIG. 4B) obtained using the tape base material 2a on the substrate, it is separately soldered or equivalent to this. The adhesive to be used will be used.

  Further, as shown in FIG. 4A, the tape carrier 18b is bonded to the lower surface electrode piece 10a formed on the tape base 2a by bonding the electronic element 12 with a conductive adhesive 14 or a solder cream. Can be obtained. That is, when the electronic component 16a (FIG. 5B) composed of the lower surface electrode piece 10a and the electronic element 12 is mounted on the substrate, when the adhesive tape 8 includes the adhesive layer 8a, the adhesive tape 8 is directly attached to the adhesive layer 8b. In the case where the electronic component 16 is provided, the electronic component 16a can be easily separated from the adhesive tape 8 by irradiating ultraviolet rays, and the mounting efficiency is improved. Furthermore, since a conventional electronic component sealing step is not required, cost reduction and resource saving can be achieved.

  As mentioned above, although the metal layer 5 was comprised from metal foil 4, such as copper foil, and the conductor pattern formed on the adhesive tape 8 was the bottom electrode piece 10 about this invention, the aspect of this invention was demonstrated. It is not limited to this.

  For example, the conductor pattern formed of the metal layer 5 on the adhesive tape 8 may be a conductor pattern such as an electrode or an electronic circuit suitable for the shape and structure of the electronic element in addition to the illustrated bottom electrode piece 10. On the other hand, the electronic element 12 bonded to the conductor pattern formed on the adhesive tape 8 is not limited to a capacitor or the like, and may be a wafer chip or the like. In addition, a conductor pattern or electrode of a semiconductor mounting package substrate made of a resin such as plastic, ceramic, or the like in a semiconductor package such as BGA, LGA, or CSP, or a conductor in which a pattern or electrode of a semiconductor bare chip is formed on an adhesive tape 8 It may be joined to the pattern.

  As another embodiment of the present invention, as shown in FIG. 5, the adhesive surface of the adhesive tape 8 having an adhesive layer 8 b made of an adhesive having a property that the adhesive strength is reduced or disappears by irradiating ultraviolet rays is applied to the adhesive surface of the adhesive tape 8. In addition, a plating layer 6 of tin or the like is formed by an electroless plating method or the like (the same figure (a)), and then, instead of the metal foil 4 constituting the metal layer 5 shown in FIG. A solder layer 9 of tin, tin-silver, tin-copper, or the like is formed by electroplating or the like (FIG. 5B). By processing the plating layer 6 and the solder layer 9 by the photoetching method, the tape base material 2b on which the conductor pattern of the solder electrode 10b is formed is obtained ((c) in the figure).

  Further, in this embodiment, the adhesive flux 11 is applied to the surface of the solder electrode 10b thus obtained (FIG. 4D), and the semiconductor mounting package is provided via the applied adhesive flux 11. By joining the electrodes 15 provided on the substrate 13, a tape carrier 18c on which a semiconductor package such as a BGA is mounted can be easily obtained ((e) in the figure). In addition, the figure (f) is sectional drawing which shows the state from which the adhesive tape 8 was isolate | separated from the tape carrier 18c.

  Therefore, the semiconductor package mounted on the tape carrier 18c does not need to be provided with bumps formed of solder balls when mounted on a printed wiring board or the like. In the conventional WSP, when bumps are formed on the chip electrodes, they are formed by vapor deposition or ion plating, or after masking, by electroplating or cream solder printing. The manufacturing cost is high because an expensive apparatus is required to carry out, while the latter method has a problem that bumps cannot be formed when the electrode pitch is 100 μm or less, and solder bridges are generated. . However, by producing the tape carrier 18c according to the present invention, a fine pitch electrode of 100 μm or less can be obtained and the cost can be reduced.

  Further, since the semiconductor package can be easily separated from the tape carrier 18c only by ultraviolet irradiation (FIG. 5 (f)), the mounting efficiency can be improved. On the other hand, the adhesive flux 11 has a function such as removal of an oxide film on the metal surface in the same manner as a normal flux, and due to its adhesiveness, a semiconductor pattern such as a solder electrode 10b is used without a separate adhesive. The mounting package substrate 13 can be fixed.

  As still another aspect of the present invention, a tape carrier 18d shown in FIG. 6 is obtained through the steps of FIGS. 6 (a) to 6 (c) (the same as the steps of FIGS. 5 (a) to 5 (c)). A tape-shaped adhesive flux 11 is attached to the surface of the tape substrate 2b on which the solder electrode 10b is formed (FIG. 6 (d)), and the attached tape-like adhesive flux 11 is attached. The package substrate 13 for semiconductor mounting is joined to the solder electrode 10b and the package substrate 13 for semiconductor mounting. Further, the gap between the adjacent solder electrodes 10b is filled by pressing the excess adhesive flux 11 with the semiconductor mounting package substrate 13 ((e) in the figure).

  Therefore, when the semiconductor package such as BGA mounted on the tape carrier 18d obtained in this way is mounted on the mounting substrate 17 (figure (f)), conventionally, an underfill agent is applied to the gap of 100 μm or less. Although it was difficult to inject, in this embodiment, when the tape carrier 18d is obtained, the adhesive flux 11 is filled in the gap between the conductor patterns. The trouble of injecting an underfill agent into the gap can be saved.

  Furthermore, any known adhesive flux can be applied to the adhesive flux 11 in the above-described embodiment. In particular, when the adhesive flux 11 includes a thermoplastic resin or a precursor of a thermosetting resin, a tape carrier. By irradiating the adhesive tape 8d of 18d with ultraviolet rays to separate the solder electrode 10b and mounting it on the mounting substrate 17, solder bonding between the electrode 15 of the semiconductor mounting package substrate 13 and the solder electrode 10b is performed. The semiconductor mounting package substrate 13 and the mounting substrate 17 can be bonded simultaneously with the adhesive flux 11. That is, it is possible to improve the bonding strength between the semiconductor package having the semiconductor mounting package substrate 13 and the mounting substrate 17 without using an underfill agent.

  As the adhesive flux 11, in addition to the above, a non-cleaning type or sublimation type adhesive flux can also be suitably used in that the step of cleaning the flux residue can be omitted.

  5 and 6, the semiconductor mounting package substrate 13 is joined to the solder electrode 10b. However, the solder electrode 10b is joined by joining the electronic element 12, the wafer chip, or the like. It is also possible to obtain the electronic component 16b (not shown). Furthermore, the solder electrode 10b can be easily formed on the mounting substrate 17a by joining the solder electrode 10b to a conductor pattern or an electrode formed on the mounting substrate 17a (not shown). Can be easily mounted without providing bumps formed by solder balls.

  In addition, as a method for forming a conductor pattern such as an electrode or an electronic circuit, an additive method, a build-up method, or the like can be applied in addition to the above-described photoetching method. The forming method is not particularly limited, and the metal layer 5 Is not limited to the embodiment constituted by the metal foil 4, for example, a metal layer 5 made of a metal selected from copper, silver, tin, nickel, aluminum, etc. by a plating method, a vapor deposition method, an ion plate method or the like, An alloy containing two or more metals selected from copper, silver, tin, nickel, and aluminum, or a metal made of an alloy containing at least one of copper, silver, tin, nickel, and aluminum and another metal Layer 5 may be formed.

  Also about the adhesive tape 8, it is not limited to the aspect provided with the adhesion layer 8a or 8b only on one side, The adhesive tape provided with the adhesion layer 8a or 8b on both surfaces may be used. When applying an adhesive tape having an adhesive layer 8a or the like on both sides to the present invention, a conductor pattern composed of the metal layer 5, the plating layer 6 and the like is formed not only on one side of the adhesive tape but also on both sides. May be.

  The electronic parts 16 and 16a can be used as the conventional carrier tape 60 by removing the electronic parts 16 and 16a directly from the tape carriers 18a and 18b or by irradiating ultraviolet rays when mounted on the substrate. Although it is preferable, the electronic components 16 and 16a may be removed from the tape carriers 18a and 18b in advance and may be enclosed in the embossed empty portion 62 of the conventional carrier tape 60 in a stage before mounting.

  Further, in the above-described tape carriers 18, 18a, 18b, 18c, 18d, the process of separating the lower surface electrode pieces 10, 10a and the solder electrodes 10b, which are conductor patterns formed on each tape carrier, from the adhesive tape 8 is performed on the substrate. For example, it may be separated from the adhesive tape 8 when the electronic element 12 or the like is joined to the conductor pattern formed on the adhesive tape 8. However, by separating the conductor pattern from the adhesive tape 8 immediately before mounting on the substrate, oxidation of the metal layer 5 and the plating layer 6 facing the adhesive surfaces of the adhesive layers 8a and 8b of the adhesive tape 8 can be prevented. In this respect, separation immediately before mounting is more preferable.

  Although the embodiments of the present invention have been described above, the present invention can be implemented in various modifications, modifications, and variations based on the knowledge of those skilled in the art without departing from the spirit thereof. All belong to the scope of the present invention.

(A)-(c) is sectional drawing which shows the manufacturing process of the tape base material of this invention, (d) is the tape by which the electronic element was joined to the lower surface electrode piece of the tape base material shown to (c). It is sectional drawing which shows a carrier. (A) is a perspective view which shows an example of the tape carrier of this invention, (b) is sectional drawing of the electronic component isolate | separated from the tape carrier shown to (a). (A) And (b) is sectional drawing which showed the other manufacturing process of the tape base material of this invention, (c) is an electronic element joined to the lower surface electrode piece of the tape base material shown to (b). It is sectional drawing which shows the done tape carrier. (A) is a perspective view which shows the other example of the tape carrier of this invention, (b) is sectional drawing of the electronic component isolate | separated from the tape carrier shown to (a). (A)-(c) is sectional drawing which shows the manufacturing process of the tape base material of this invention, (d) And (e) is a package for semiconductor mounting to the solder electrode of the tape base material shown to (c). It is sectional drawing which shows the process of joining a board | substrate and obtaining a tape carrier, (f) is sectional drawing which shows the semiconductor package isolate | separated from the tape carrier shown to (e). (A)-(c) is sectional drawing which shows the manufacturing process of the tape base material of this invention, (d) And (e) is a package for semiconductor mounting to the solder electrode of the tape base material shown to (c). It is sectional drawing which shows the process of joining a board | substrate and obtaining a tape carrier, (f) is sectional drawing which shows the state which mounted the semiconductor package isolate | separated from the tape carrier shown in (e) on the mounting board | substrate. (A) is a schematic diagram which shows the one aspect | mode of the conventional capacitor | condenser, (b) is a perspective view which shows the manufacturing method of the conventional capacitor | condenser. It is sectional drawing which shows the one aspect | mode of the conventional chip capacitor. (A)-(d) is sectional drawing which shows the manufacturing process of a lower surface electrode type plating filling tape. It is a schematic diagram which shows the state with which the capacitor | condenser was enclosed with the carrier tape.

Explanation of symbols

2, 2a, 2b: Tape carrier substrate (tape substrate)
4: Metal foil 6: Plating layer 6a, 6b: Plating surface 8: Adhesive tape 8a, 8b: Adhesive layer 10, 10a: Bottom electrode piece 10b: Solder electrode 11: Adhesive flux 12, 22: Electronic device 13: Semiconductor mounting Package substrate 14: conductive adhesive 16, 16a: bottom electrode type electronic component (electronic component)
17: Mounting substrate 18, 18a, 18b, 18c, 18d: Tape carrier 19: Sending sprocket hole 20: Capacitor 26: Lead frame 28a, 28b: Terminal portion 40: Chip capacitor 42: Plating filling tape 60: Carrier tape 62 : Embossed sky

Claims (25)

An adhesive tape having an adhesive layer on at least one surface;
A metal layer adhered to the surface of the adhesive layer,
A tape carrier base material in which the metal layer constitutes a conductor pattern.   The tape carrier substrate according to claim 1, wherein the metal layer is made of a metal selected from copper, silver, tin, nickel, aluminum, and an alloy containing at least one of them.   The tape according to claim 1 or 2, wherein the metal layer is composed of a metal foil selected from a copper foil, a silver foil, a tin foil, a nickel foil, an aluminum foil, and an alloy foil made of the alloy. Carrier substrate.   The tape carrier base material according to claim 1, wherein a plating layer is provided on a surface of the metal layer facing the adhesive layer.   The tape carrier substrate according to claim 4, wherein the plating layer is made of tin plating or tin alloy plating.   6. The tape carrier substrate according to claim 5, wherein the tin alloy is composed of any one of tin-copper, tin-bismuth, tin-silver, tin-silver-copper, and tin-zinc.   The tape carrier substrate according to any one of claims 1 to 6, wherein the adhesive layer is made of an adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays.   The tape carrier base material according to claim 1, wherein the conductor pattern is an electrode and / or an electronic circuit.   The tape carrier substrate according to claim 8, wherein the electrode is a bottom electrode piece. A tape carrier substrate according to claims 1 to 9,
Comprising an electronic element,
A tape carrier, wherein the electronic element is bonded to the conductor pattern.   The tape carrier according to claim 10, wherein the electronic element is bonded to the conductor pattern via an adhesive flux. Preparing an adhesive tape comprising an adhesive layer;
And a step of forming a conductive pattern with a metal layer on the surface of the adhesive layer. Preparing a metal foil and an adhesive tape comprising an adhesive layer;
Attaching the adhesive tape to the metal foil;
And a step of forming a conductive pattern by etching the metal foil.   The method for producing a tape carrier substrate according to claim 13, wherein the conductor pattern is an electrode and / or an electronic circuit.   The method for producing a tape carrier substrate according to any one of claims 12 to 14, wherein the adhesive layer is made of an adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays. Preparing an adhesive tape having an adhesive layer and an electronic element;
Forming a conductor pattern with a metal layer on the surface of the adhesive layer;
A step of bonding the electronic element to the conductor pattern. Preparing a metal foil, an adhesive tape including an adhesive layer, and an electronic element;
Attaching the adhesive tape to the metal foil;
Etching the metal foil to form a conductor pattern;
A step of bonding the electronic element to the conductor pattern. The step of bonding the electronic element to the conductor pattern comprises:
Applying adhesive flux to the conductor pattern;
The method for producing a tape carrier according to claim 16, further comprising a step of bonding the electronic element to the conductor pattern via the adhesive flux. The step of bonding the electronic element to the conductor pattern comprises:
Adhering the adhesive flux formed into a tape shape on the surface on which the conductor pattern is formed;
The method for producing a tape carrier according to claim 16, further comprising a step of crimping the electronic element to the conductor pattern via the adhesive flux.   20. The method for producing a tape carrier according to claim 16, wherein the conductor pattern is an electrode and / or an electronic circuit.   21. The method for producing a tape carrier according to claim 16, wherein the adhesive layer is made of an adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays. Preparing the tape carrier substrate according to claim 1 and an electronic element;
Bonding the electronic element to the conductor pattern to obtain a tape carrier;
Irradiating the adhesive tape constituting the tape carrier with ultraviolet rays;
Separating the conductive pattern to which the electronic element is bonded from the adhesive tape. Obtaining the tape carrier,
Applying adhesive flux to the conductor pattern;
The method for mounting an electronic device according to claim 22, further comprising a step of bonding the electronic device to the conductor pattern through the adhesive flux. Obtaining the tape carrier,
Adhering the adhesive flux formed into a tape shape on the surface on which the conductor pattern is formed;
The method for mounting an electronic device according to claim 22, further comprising a step of crimping the electronic device to the conductor pattern through the adhesive flux. The adhesive flux includes a precursor of a thermoplastic resin or a thermosetting resin,
The method for mounting an electronic device according to claim 24, further comprising a step of heating the conductor pattern separated from the adhesive tape and bonded to the electronic device.

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