JP2018169186A - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

To provide an electronic component conveyance device and an electronic component inspection device with which it is possible to accurately determine the state of a switching valve.SOLUTION: The electronic component conveyance device comprises: a conveyance unit for conveying an electronic component; a placement unit on which the electronic component is placed; a supply line for supplying a fluid for adjusting the temperature of the placement unit to the placement unit; a discharge line for discharging the fluid from the placement unit; at least one switching valve, arranged in the supply line, which operates so as to switch the supply line between a state where the fluid is passable and a state where the fluid is shut off; a detection unit, arranged in the discharge line, for detecting the flow of the fluid passing through the discharge line; and a control unit capable of controlling the operation of the switching valve. The control unit determines the state of the switching valve on the basis of control information for actuating the switching valve and the result of detection by the detection unit.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  In general, in a component inspection apparatus that inspects the electrical characteristics of an electronic component, a handler is used that conveys the electronic component before or after the inspection between the tray on the base and the inspection socket. Some of such component inspection apparatuses inspect the electrical characteristics of the electronic component after setting the electronic component to a low temperature of 0 ° C. or lower.

  Therefore, a handler that cools an electronic component to a low temperature is known (see, for example, Patent Document 1). In the handler described in Patent Document 1, a support portion that supports an electronic component is configured by a tray that accommodates a plurality of electronic components and a case on which the tray is placed. Then, the dry air that has been dried as a refrigerant is cooled by a refrigerator, and the cooled dry air is supplied to a cooling path formed inside the case, thereby cooling the tray through the case. The electronic parts are cooled via

JP 2004-347329 A

  In a handler that cools an electronic component to a low temperature, such as the handler described in Patent Document 1, a switching valve that switches between passing and shutting off dry air is usually arranged in the middle of a cooling path through which dry air passes. is there. However, Patent Document 1 does not disclose or suggest the state of this switching valve (for example, whether it is operating normally or whether it has failed and has stopped operating). .

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

The electronic component transport apparatus of the present invention includes a transport unit that transports an electronic component,
A placement section on which the electronic component is placed;
A supply line for supplying a fluid for adjusting the temperature of the mounting unit to the mounting unit;
A discharge line for discharging the fluid from the mounting portion;
At least one switching valve disposed in the supply line, allowing the passage of fluid in the supply line in an open state and being switchable to block the passage of the fluid in a closed state; and disposed in the discharge line; A detector for detecting the flow of the fluid passing through the discharge line;
A control unit capable of controlling the switching valve,
The control unit is configured to determine the state of the switching valve based on control information of the switching valve and a detection result of the detection unit.

  As a result, the operator who operates the electronic component transport device checks the judgment result of the state of the switching valve, and when the operation of the switching valve is normal, the electronic component transport device can transport the electronic component. it can. On the other hand, if there is any malfunction in the operation of the switching valve, the operator can replace the switching valve with, for example, a new switching valve. Thereby, a switching valve can operate | move normally, Therefore The electronic component can be smoothly conveyed by an electronic component conveying apparatus.

In the electronic component transport apparatus according to the present invention, it is preferable that the fluid is a refrigerant that cools the mounting portion.
Thereby, a mounting part can be rapidly cooled to desired target temperature.

In the electronic component transport apparatus according to the present invention, it is preferable that the mounting portion is fixed.
Thereby, temperature control can be stably performed with respect to the electronic component on a mounting part.

  In the electronic component conveying apparatus of the present invention, it is preferable that the placing section is supported so as to be movable.

  Thereby, the placement unit can stably transport the electronic component from a predetermined position to another predetermined position.

  In the electronic component transport apparatus according to the present invention, it is preferable that the placement unit is configured to be able to grip the electronic component.

  Thereby, the mounting part can lift an electronic component, for example, can convey as it is.

  In the electronic component conveying apparatus of the present invention, it is preferable that the switching valve includes a first switching valve and at least one second switching valve that is disposed on the downstream side of the first switching valve in the supply line. .

  Thereby, for example, it is possible to perform control that appropriately combines opening and closing of each switching valve of the first switching valve and the second switching valve.

In the electronic component transport device of the present invention, the supply line has a branch line branched into a plurality on the downstream side of the portion where the first switching valve is disposed,
It is preferable that the second switching valve is disposed in each branch line.

  Thus, for example, by appropriately combining opening and closing of each switching valve of the first switching valve and the second switching valve, fluid supply to each placement unit, fluid supply stop to each placement unit, each placement It is possible to easily select the supply of the refrigerant to any one of the units.

  In the electronic component transport device of the present invention, the control unit makes the determination by closing one of the first switching valve and the second switching valve and opening the other switching valve. Is preferred.

  Thereby, according to the open / close state of the first switching valve and the second switching valve, it is determined whether the operation of the first switching valve is in a normal state or whether the operation of the second switching valve is in a normal state. Can be appropriately performed.

  In the electronic component transport device of the present invention, the control unit closes the first switching valve and opens the second switching valve, and the detection value at the detection unit is a preset value. In this case, it is preferable to make the determination that the operation of the first switching valve is in a normal state.

  Thereby, the operator who operates an electronic component conveyance apparatus can convey the electronic component by an electronic component conveyance apparatus, if it confirms that the action | operation of a 1st switching valve is a normal state. On the other hand, when the opposite determination is made, the operator can replace the first switching valve with, for example, a new first switching valve.

  In the electronic component transport device of the present invention, the control unit opens the first switching valve and closes the second switching valve, and the detection value at the detection unit is a preset value. In this case, it is preferable to make the determination that the operation of the second switching valve is in a normal state.

  Thereby, the operator who operates an electronic component conveyance apparatus can convey an electronic component by an electronic component conveyance apparatus, if it confirms that the action | operation of a 2nd switching valve is a normal state. On the other hand, when the opposite determination is made, the operator can replace the second switching valve with, for example, a new second switching valve.

  In the electronic component transport device of the present invention, the control unit opens the first switching valve and opens the second switching valve of one of the second switching valves arranged in each branch line. As described above, when the remaining second switching valve is in a closed state and the detection value at the detection unit is a preset value, the operation of the second switching valve in the open state is normal. It is preferable to make the above determination if the state is not correct.

  Thereby, the operator who operates an electronic component conveyance apparatus can convey an electronic component by an electronic component conveyance apparatus, if it confirms that the action | operation of a 2nd switching valve is a normal state. On the other hand, when the opposite determination is made, the operator can replace the second switching valve with, for example, a new second switching valve.

  In the electronic component conveying apparatus of the present invention, it is preferable that the switching valve is opened when energized to allow the passage of the fluid, and closed when not energized to shut off the fluid.

  As a result, for example, when the environment in which the electronic component transport apparatus is used becomes a power failure, it is possible to prevent the fluid from being shut down and thus the fluid from being continuously supplied unnecessarily.

  In the electronic component transport device of the present invention, the detection unit is configured by a pressure gauge that detects the pressure of the fluid that passes through the discharge line, or a flow meter that detects the flow rate of the fluid that passes through the discharge line. It is preferable.

  Thereby, it is possible to easily grasp the state of the flow of the fluid passing through the discharge line, that is, how much the fluid is flowing, with a simple configuration.

An electronic component inspection apparatus of the present invention includes a transport unit that transports an electronic component,
A placement section on which the electronic component is placed;
A supply line for supplying a fluid for adjusting the temperature of the mounting unit to the mounting unit;
A discharge line for discharging the fluid from the mounting portion;
At least one switching valve disposed in the supply line and capable of switching through the supply line in an open state and switchable to block the fluid in a closed state;
A detector that is disposed in the discharge line and detects a flow of the fluid passing through the discharge line;
A control unit capable of controlling the switching valve;
An inspection unit capable of inspecting the electronic component,
The control unit is configured to determine the state of the switching valve based on control information of the switching valve and a detection result of the detection unit.

  Thereby, the operator who operates the electronic component inspection apparatus can check the judgment result of the state of the switching valve, and if the operation of the switching valve is normal, the electronic component inspection apparatus can inspect the electronic component. it can. On the other hand, if there is any malfunction in the operation of the switching valve, the operator can replace the switching valve with, for example, a new switching valve. As a result, the switching valve can operate normally, so that the electronic component inspection by the electronic component inspection device can be performed smoothly.

  Further, the electronic component can be transported to the inspection unit, and thus the inspection for the electronic component can be performed by the inspection unit. Moreover, the electronic component after inspection can be conveyed from the inspection unit.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a fluid circuit diagram for the temperature adjustment unit of the electronic component inspection apparatus shown in FIG. FIG. 4 is a flowchart showing a control program of the control unit of the electronic component inspection apparatus shown in FIG. FIG. 5 is a flowchart showing a control program of the control unit of the electronic component inspection apparatus shown in FIG. FIG. 6 is a flowchart showing a control program of the control unit of the electronic component inspection apparatus shown in FIG. FIG. 7 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 8 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 9 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 10 is a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 11 shows a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 12 shows a form (an example) displayed on the monitor of the electronic component inspection apparatus shown in FIG. FIG. 13 is a fluid circuit diagram for the temperature adjustment unit of the electronic component inspection apparatus (second embodiment) of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
Hereinafter, with reference to FIGS. 1-12, 1st Embodiment of the electronic component conveying apparatus and electronic component inspection apparatus of this invention is described. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as an “X direction (first direction)”, a direction parallel to the Y axis is also referred to as a “Y direction (second direction)”, and a direction parallel to the Z axis is referred to as “ Also referred to as “Z direction (third direction)”. The direction in which the arrow in each direction is directed is called “positive”, and the opposite direction is called “negative”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered. Also, the upper side in FIGS. 1 and 7 to 12, that is, the Z-axis direction positive side is referred to as “up” or “upward”, and the lower side, that is, the Z-axis direction negative side is referred to as “down” or “downward”. Sometimes.

  The electronic component conveying apparatus 10 of the present invention has the appearance shown in FIG. The electronic component transport apparatus 10 of the present invention is a handler, and includes a transport unit 25 that transports an electronic component, a mounting unit (for example, a device supply unit 14) on which the electronic component is mounted, and a temperature of the mounting unit. The common path 56 (supply line) for supplying the fluid to be adjusted to the placement unit, the discharge path 64A (discharge line) for discharging the fluid from the placement unit, and the common path 56 (supply line) are arranged in an open state. At least one switching valve (first switching valve 54, second switching valve 59A, and second switching valve) that allows passage of fluid through the common path 56 (supply line) and that can be switched to shut off passage of fluid when closed. 59B), a detection unit 53 that is disposed in the discharge path 64A (discharge line) and detects the flow of fluid passing through the discharge path 64A (discharge line), and a control unit 800 that can control the switching valve. The control unit 800 Based on the detection result of the control information and the detection unit 53 of the switching valve, it makes a determination of the state of the switching valve.

  As a result, as will be described later, the operator who operates the electronic component transport apparatus 10 confirms the determination result of the state of the switching valve, and when the operation of the switching valve is normal, Parts can be transported. On the other hand, if there is any malfunction in the operation of the switching valve, the operator can replace the switching valve with, for example, a new switching valve. Thereby, a switching valve can operate | move normally, Therefore The electronic component conveyance by the electronic component conveyance apparatus 10 can be performed smoothly.

  As shown in FIG. 2, the electronic component inspection apparatus 1 of the present invention includes an electronic component transport apparatus 10 and further includes an inspection unit 16 that inspects the electronic component. That is, the electronic component inspection apparatus 1 of the present invention includes a transport unit 25 that transports an electronic component, a mounting unit (for example, the device supply unit 14) on which the electronic component is mounted, and a fluid that adjusts the temperature of the mounting unit. Is disposed in the common path 56 (supply line) for supplying the liquid to the mounting section, the discharge path 64A (discharge line) for discharging the fluid from the mounting section, and the common path 56 (supply line). At least one switching valve (a first switching valve 54, a second switching valve 59A and a second switching valve 59B) capable of switching the fluid in the (supply line) and blocking the passage of the fluid when closed; The detection unit 53 that is arranged in the discharge path 64A (discharge line) and detects the flow of fluid passing through the discharge path 64A (discharge line), the control unit 800 that can control the switching valve, and the electronic component can be inspected. The inspection unit 16; And, the control unit 800, based on the detection result of the control information and the detection unit 53 of the switching valve, makes a determination of the state of the switching valve.

  Thereby, the electronic component inspection apparatus 1 which has the advantage of the electronic component conveying apparatus 10 mentioned above is obtained. Further, the electronic component can be transported to the inspection unit 16, and therefore, the inspection unit 16 can inspect the electronic component. In addition, the inspected electronic component can be transported from the inspection unit 16.

Hereinafter, the configuration of each unit will be described in detail.
As shown in FIGS. 1 and 2, an electronic component inspection apparatus 1 having an electronic component transport apparatus 10 transports an electronic component such as an IC device that is, for example, a BGA (Ball Grid Array) package, and the electronic component in the transport process. It is a device for inspecting and testing (hereinafter simply referred to as “inspection”) the electrical characteristics of In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”. In this embodiment, the IC device 90 has a flat plate shape.

  In addition to the above-mentioned IC devices, for example, “LSI (Large Scale Integration)”, “CMOS (Complementary MOS)”, “CCD (Charge Coupled Device)”, or “modules” in which a plurality of IC devices are packaged. IC "," quartz device "," pressure sensor "," inertial sensor (acceleration sensor) "," gyro sensor "," fingerprint sensor ", and the like.

The electronic component inspection apparatus 1 (electronic component transport apparatus 10) includes a tray supply area A1, a device supply area A2, an inspection area A3, a device collection area A4, and a tray removal area A5. As will be described later, each wall is divided. Then, the IC device 90 passes through the respective areas in the direction of the arrow α ₉₀ from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. Thus, the electronic component inspection apparatus 1 includes the electronic component transport apparatus 10 having the transport unit 25 that transports the IC device 90 so as to pass through each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit. 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side, and the inspection area A3 is arranged, that is, in FIG. The upper side is used as the back side.

  In addition, the electronic component inspection apparatus 1 is used by mounting in advance a so-called “change kit” that is exchanged for each type of IC device 90. This change kit includes a placement portion on which an IC device 90 (electronic component) is placed. In the electronic component inspection apparatus 1 of the present embodiment, the placement units are installed at a plurality of locations, and include, for example, a temperature adjustment unit 12, a device supply unit 14, and a device collection unit 18 described later. In addition, the placement unit (placement unit on which the IC device 90 (electronic component) is placed) serving as a change kit includes a portion (gripping unit) for gripping the IC device 90 of the device transport head 13 and a device transport head. 17 includes a portion (gripping portion) that grips the 17 IC devices 90 and a portion (gripping portion) that grips the IC device 90 of the device transport head 20. In addition to the above-described change kit, the mounting unit on which the IC device 90 (electronic component) is mounted also includes a tray 200 prepared by the user, a collection tray 19, and an inspection unit 16. is there.

  The tray supply area A1 is a material supply unit to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. The tray supply area A1 can also be said to be a mounting area in which a plurality of trays 200 can be stacked and mounted. In the present embodiment, each tray 200 has a plurality of recesses (pockets) arranged in a matrix. One IC device 90 can be stored and placed in each recess.

The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 conveyed from the tray supply area A1 are respectively conveyed and supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply region A1 and the device supply region A2. The tray transport mechanism 11A is a part of the transport unit 25, and moves the tray 200 together with the IC device 90 placed on the tray 200 in the positive direction in the Y direction, that is, in the direction of the arrow _{α11A in} FIG. be able to. As a result, the IC device 90 can be stably fed into the device supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 in the negative direction in the Y direction, that is, in the direction of the arrow _α11B in FIG. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

  In the device supply area A2, a temperature adjustment unit (soak plate (English notation: soak plate, Chinese notation (example): soaking plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. Yes. Further, a device supply unit 14 that moves so as to straddle the device supply area A2 and the inspection area A3 is also provided.

  The temperature adjustment unit 12 is a mounting unit on which a plurality of IC devices 90 are mounted, and is referred to as a “soak plate” that can cool the mounted IC devices 90 collectively. With the soak plate, the IC device 90 before being inspected by the inspection unit 16 can be cooled in advance and adjusted to a temperature suitable for the inspection (low temperature inspection). In addition, cooling in each temperature adjustment part 12 is possible by the action | operation of the cooling unit 900 mentioned later.

  In addition to the temperature adjustment unit 12, the cooling unit 900 was placed on each of the above-described placement units (for example, the device supply unit 14 that requires temperature adjustment, the gripping unit of the device transport head 17, and the inspection unit 16). The IC device 90 can also be cooled.

The temperature adjusting unit 12 as such a mounting unit is fixed. As a result, the temperature of the IC device 90 on the temperature adjustment unit 12 can be adjusted stably.
Further, the temperature adjusting unit 12 is grounded (grounded).

  In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any one of the temperature adjustment units 12.

  Moreover, each temperature adjustment part 12 may be comprised so that the IC device 90 can be heated collectively in addition to cooling. In this case, the IC device 90 before being inspected by the inspection unit 16 can be preliminarily heated and adjusted to a temperature suitable for the inspection (high temperature inspection).

The device transport head 13 has a grip portion for gripping the IC device 90, is supported so as to be movable in the X direction and the Y direction in the device supply region A2, and is supported so as to be movable in the Z direction. The device transport head 13 is also a part of the transport unit 25, and transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device described later. The IC device 90 can be transported to and from the supply unit 14. In FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow α _13X , and the movement of the device transport head 13 in the Y direction is indicated by an arrow α _13Y .

  The device supply unit 14 is a mounting unit on which the IC device 90 whose temperature has been adjusted by the temperature adjusting unit 12 is mounted. The “supply shuttle plate” can transport the IC device 90 to the vicinity of the inspection unit 16. Or it is simply called a “supply shuttle”. The device supply unit 14 can also be a part of the transport unit 25.

The device supply 14 as mounting portion, during the X direction and the inspection area A3 and the device supply area A2, i.e., is supported on the reciprocally movable (movable) along the arrow alpha ₁₄ direction. As a result, the device supply unit 14 can stably transport the IC device 90 from the device supply region A2 to the vicinity of the inspection unit 16 in the inspection region A3, and the IC device 90 can be transferred to the device transport head 17 in the inspection region A3. After being removed, the device supply area A2 can be returned again.

  In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. The device supply unit 14 on the Y direction negative side is referred to as “device supply unit 14A”, and the device supply unit on the Y direction positive side. 14 may be referred to as “device supply unit 14B”. Then, the IC device 90 on the temperature adjustment unit 12 is transported to the device supply unit 14A or the device supply unit 14B in the device supply region A2. Further, like the temperature adjustment unit 12, the device supply unit 14 is configured to be able to cool the IC device 90 placed on the device supply unit 14. As a result, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 in the inspection region A3 while maintaining the temperature adjustment state. The device supply unit 14 may also be configured to be able to heat the IC device 90, as with the temperature adjustment unit 12. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

Tray transporting mechanism 15, the positive side of the X direction empty tray 200 in a state where all of the IC devices 90 is removed in the device supply area A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. After this transport, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transport head 17 are provided.

  The device transport head 17 is a part of the transport unit 25 and, like the temperature adjustment unit 12, is configured to be able to cool the gripped IC device 90. The device transport head 17 has a gripping part (mounting part). The grip portion (mounting portion) is configured to be able to grip the IC device 90 (electronic component). Thereby, the IC device 90 in which the temperature adjustment state is maintained can be gripped, and the IC device 90 can be transported in the inspection area A3 while maintaining the temperature adjustment state.

  Such a device transport head 17 is supported so as to be able to reciprocate in the Y direction and the Z direction within the inspection area A3, and is a part of a mechanism called an “index arm”. Accordingly, the device transport head 17 can lift the IC device 90 from the device supply unit 14 carried in from the device supply region A2, transport the IC device 90 on the inspection unit 16, and place the device.

In FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α _17Y . The device transport head 17 is supported so as to be reciprocally movable in the Y direction, but is not limited thereto, and may be supported so as to be reciprocally movable in the X direction. In the configuration shown in FIG. 2, two device transport heads 17 are arranged in the Y direction. The device transport head 17 on the Y direction negative side is referred to as “device transport head 17A”, and the device on the Y direction positive side. The transport head 17 may be referred to as “device transport head 17B”. The device transport head 17A can take charge of transporting the IC device 90 from the device supply unit 14A to the test unit 16 in the inspection area A3, and the device transport head 17B is a device of the IC device 90 in the test area A3. Transport from the supply unit 14B to the inspection unit 16 can be performed.

  The device transport head 17 may also be configured to be able to heat the IC device 90, as with the temperature adjustment unit 12.

  The inspection unit 16 is a mounting unit that mounts an IC device 90 that is an electronic component and inspects the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90. Then, the IC device 90 can be inspected when the terminals of the IC device 90 and the probe pins are electrically connected, that is, contacted. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16.

  Similar to the temperature adjustment unit 12, such an inspection unit 16 can cool the IC device 90 and adjust the IC device 90 to a temperature suitable for the inspection. Note that the inspection unit 16 may be configured to be able to heat the IC device 90 in the same manner as the temperature adjustment unit 12.

  The device collection area A4 is an area in which a plurality of IC devices 90 that have been inspected in the inspection area A3 and completed the inspection are collected. In the device recovery area A4, a recovery tray 19, a device transport head 20, and a tray transport mechanism 21 are provided. Further, a device collection unit 18 that moves so as to straddle the inspection area A3 and the device collection area A4 is also provided. An empty tray 200 is also prepared in the device collection area A4.

  The device collection unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed and can transport the IC device 90 to the device collection region A4. It is simply called the “recovery shuttle”. The device collection unit 18 can also be a part of the transport unit 25.

The device collecting unit 18, between the examination region A3 and the device collection area A4 X-direction, i.e., are reciprocally movably supported along the arrow alpha ₁₈ direction. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the device collection unit 18 on the Y direction negative side is referred to as “device collection unit 18 </ b> A”. In other words, the device collection unit 18 on the Y direction positive side may be referred to as a “device collection unit 18B”. Then, the IC device 90 on the inspection unit 16 is transported to and placed on the device collection unit 18A or the device collection unit 18B. The IC device 90 is transported from the inspection unit 16 to the device recovery unit 18A by the device transport head 17A, and the transport from the inspection unit 16 to the device recovery unit 18B is performed by the device transport head 17B. The device collection unit 18 is also grounded, like the temperature adjustment unit 12 and the device supply unit 14.

  The collection tray 19 is a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the device collection area A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the device collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. It becomes. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Three empty trays 200 are also arranged along the X direction. This empty tray 200 is also a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the device recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transport head 20 is supported so as to be movable in the X direction and the Y direction within the device collection area A4, and further has a portion that is also movable in the Z direction. The device transport head 20 is a part of the transport unit 25, and can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the movement of the device transport head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device transport head 20 in the Y direction is indicated by an arrow α _20Y .

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the device collection region within A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

Further, a tray transport mechanism 22A and a tray transport mechanism 22B that transport the trays 200 one by one in the Y direction are provided so as to straddle the device recovery area A4 and the tray removal area A5. The tray transport mechanism 22A is a part of the transport unit 25, and is a moving unit that can reciprocate the tray 200 in the Y direction, that is, the direction of the arrow α _22A . Thereby, the inspected IC device 90 can be transported from the device collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the positive direction in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device collection area A4.

  For example, the control unit 800 includes a tray transport mechanism 11A, a tray transport mechanism 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport. The operations of the head 17, the device collection unit 18, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B can be controlled. In addition, the control unit 800 can also control the operation of each unit of the cooling unit 900 (for example, the first switching valve 54, the second switching valve 59A, the second switching valve 59B, the detection unit 53, etc.).

  The operator can set or confirm the operating conditions of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the electronic component inspection apparatus 1. As shown in FIG. 1, a mouse table 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the drawing. This mouse is used when operating the screen displayed on the monitor 300.

  In addition, an operation panel 700 is arranged on the lower right side of FIG. The operation panel 700 instructs the electronic component inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state of the electronic component inspection apparatus 1 and the like by a combination of colors that emit light. The signal lamp 400 is disposed on the electronic component inspection apparatus 1. Note that the electronic component inspection apparatus 1 has a built-in speaker 500, and the operational state of the electronic component inspection apparatus 1 can also be notified by the speaker 500.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the device supply area A2 are separated by a first partition 231 and the device supply area A2 and the inspection area A3 are separated by a second partition 232. The inspection area A3 and the device collection area A4 are separated by a third partition wall 233, and the device collection area A4 and the tray removal area A5 are separated by a fourth partition wall 234. The device supply area A2 and the device collection area A4 are also partitioned by the fifth partition wall 235.

The outermost exterior of the electronic component inspection apparatus 1 is covered with a cover. Examples of the cover include a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.
As shown in FIG. 3, the electronic component inspection apparatus 1 (electronic component transport apparatus 10) has a cooling unit 900. The cooling unit 900 functions as a cooling means (temperature adjusting means) for cooling (temperature adjusting) the mounting unit together with the IC device 90. As the mounting unit, the temperature adjusting unit 12 and the device supplying unit 14 are used. And a gripping part of the device transport head 17 and an inspection part 16. Below, the cooling in the device supply part 14 is demonstrated typically. In addition, the device supply part 14 has the recessed part (pocket) 141 and the recessed part (pocket) 142 as an example. One IC device 90 can be stored and placed in each of the recess 141 and the recess 142.

  In addition, the cooling unit 900 may adjust the temperature of all the placement units among the temperature adjustment unit 12, the device supply unit 14, the gripping unit of the device transport head 17, and the inspection unit 16. At least one placement unit may be selected from the units, and the temperature of the selected placement unit may be adjusted. When adjusting the temperature of all the placement units, the temperature of each placement unit may be the same or different.

  The cooling unit 900 can adjust the temperature of the IC device 90 housed in the recess 141 and the recess 142, respectively. For example, the cooling unit 900 can be adjusted to be −45 ° C. as the first target temperature, which is a temperature for low-temperature inspection. Further, for example, the cooling unit 900 can be adjusted to be 18 ° C. (normal temperature) as the second target temperature higher than the first target temperature. Of course, each target temperature is not limited to this, and can be set to any temperature.

  In the cooling unit 900, the storage tank 55 stores a fluid that adjusts the temperature of the IC device 90 mounted on the device supply unit 14 (mounting unit). This fluid is a refrigerant that cools the device supply unit 14 (mounting unit) together with the IC device 90, and for example, liquid nitrogen can be used as the refrigerant. Thereby, it can cool rapidly to 1st target temperature.

  The storage tank 55 is connected to a common path 56 mainly composed of a pipe line (liquid supply pipe or air supply pipe). The common path 56 is a supply line that supplies the device supply unit 14 (mounting unit) with a refrigerant (fluid) that adjusts the temperature of the IC device 90 mounted on the device supply unit 14 (mounting unit). The common path 56 is preferably provided with a heat insulating material (not shown) on the outer periphery of the pipe line. The first supply path 57A and the first supply path 57B described below are also the same as the common path 56.

  A first switching valve 54 is arranged in the middle of the common path 56. The first switching valve 54 is a valve that can be in an open state and a closed state, that is, a valve that can be opened and closed, and is a main plug that can be switched between supply of refrigerant and stop of supply by opening and closing.

  The common path 56 (supply line) has a branch line branched into a plurality (two in the configuration shown in FIG. 3) on the downstream side of the portion where the first switching valve 54 is arranged. The first supply path 57A and the first supply path 57B are branched.

  The first supply path 57A is connected to the inflow end EnA of the medium flow path 58A formed in the device supply section 14 so as to pass directly under the recess 141. A second switching valve 59A is arranged in the middle of the first supply path 57A. The second switching valve 59A is an openable / closable valve, that is, an openable / closable valve. Thus, the supply amount of the refrigerant to the medium flow path 58A can be controlled.

  The first supply path 57B is a pipe having a channel cross-sectional area substantially equal to that of the first supply path 57A, and the inflow end EnB of the medium channel 58B formed in the device supply unit 14 so as to pass directly under the recess 142. It is connected to the. A second switching valve 59B is arranged in the middle of the first supply path 57B, and this second switching valve 59B is an openable / closable valve, that is, an openable / closable valve. Thus, the amount of refrigerant supplied to the medium flow path 58B can be controlled.

  As described above, the common path 56 (supply line) is provided with a plurality of switching valves that operate so as to be able to switch between passage and blocking of the refrigerant (fluid) in the common path 56 (supply line). The switching valve is disposed on the downstream side of the first switching valve 54 that can be opened and closed as described above and the first switching valve 54 of the common path 56 (supply line), and at least can be opened and closed as described above. It includes one second switching valve, that is, the second switching valve 59A and the second switching valve 59B in this embodiment.

Further, as described above, the common path 56 (supply line) has a branch line that branches into two (plurality) downstream from the portion where the first switching valve 54 is disposed. A second switching valve 59A is arranged in each branch line, that is, the first supply path 57A, and a second switching valve 59B is arranged in the first supply path 57B.
With such a configuration, for example, by appropriately combining opening and closing of each switching valve of the first switching valve 54, the second switching valve 59A, and the second switching valve 59B, collective supply of refrigerant to both the recess 141 and the recess 142, It is possible to easily select the collective supply stop of the refrigerant to both the concave portion 141 and the concave portion 142 and the supply of the refrigerant to one of the concave portion 141 and the concave portion 142.

  In the configuration shown in FIG. 3, the common path 56 is branched into two corresponding to the number of recesses (the recesses 141 and the recesses 142) of the device supply unit 14, but is not limited thereto. For example, when the device supply unit 14 has one concave portion, branching in the common path 56 is omitted, and one second switching valve is disposed downstream of the first switching valve 54. Become. In addition, when the number of recesses included in the device supply unit 14 is three or more, the number of branches in the common path 56 is also three or more, and the second number of the same number as the number of branches is provided downstream of the first switching valve 54. A switching valve will be arranged.

  Further, according to the present invention, the configuration of the fluid circuit in the cooling unit 900 (for example, the arrangement pattern of the pipes of the common path 5, the first supply path 57A, the first supply path 57B, the first switching valve 54, the second The type, arrangement, number of installations, etc. of each switching valve of the switching valve 59A and the second switching valve 59B are not limited to those shown in FIG.

  The first switching valve 54, the second switching valve 59 </ b> A, and the second switching valve 59 </ b> B (switching valve) are opened when energized to allow the passage of refrigerant (fluid), and closed when de-energized and the refrigerant ( It is of the so-called “normally closed type” that shuts off fluid). Thereby, for example, when the environment in which the electronic component inspection apparatus 1 is used becomes a power failure, it is possible to prevent the refrigerant from being cut off and thus the refrigerant from being continuously supplied unnecessarily.

  The downstream side of the portion where the second switching valve 59A of the first supply path 57A is disposed and the downstream side of the portion of the first supply path 57B where the second switching valve 59B is disposed share the vaporization container 60. doing. The inside of the vaporization container 60 is partitioned into a vaporization chamber 61A and a vaporization chamber 61B having a larger flow path cross-sectional area than the first supply path 57A and the first supply path 57B. Liquid nitrogen passing through the first supply path 57A flows into the vaporizing chamber 61A, and liquid nitrogen passing through the first supply path 57B flows into the vaporizing chamber 61B. The liquid nitrogen that has flowed into the vaporizing chamber 61A and the vaporizing chamber 61B flows out of the vaporizing vessel 60 as nitrogen gas having a temperature lower than the first target temperature. The refrigerant that has become nitrogen gas can flow into the medium flow path 58A to cool the inside of the recess 141, and can flow into the medium flow path 58B to cool the inside of the recess 142.

  Further, inside the device supply unit 14, a heater 62 </ b> A is provided immediately below the recess 141, and a heater 62 </ b> B is provided immediately below the recess 142. The heater 62A can heat the inside of the recess 141, and the heater 62B can heat the inside of the recess 142. Then, the IC device 90 placed in the recess 141, that is, in the recess 141, is controlled to the first target temperature by cooling with the nitrogen gas passing through the medium flow path 58A and heating by the heater 62A. Similarly, the IC device 90 placed in the recess 142, that is, placed in the recess 142, is controlled to the first target temperature by cooling with the nitrogen gas passing through the medium flow path 58B and heating by the heater 62B.

  The concave portion 141 is provided with a temperature sensor 63A that detects the temperature in the concave portion 141, and the concave portion 142 is provided with a temperature sensor 63B that detects the temperature in the concave portion 142.

  A discharge path 64A serving as a discharge line for discharging the refrigerant (fluid) from the concave portion 141 side of the device supply section 14 (mounting section) is connected to the outflow end ExA of the medium flow path 58A. The discharge path 64 </ b> A is connected to a storage box 50 as a storage container having a space for storing the device supply unit 14, and introduces the refrigerant (nitrogen gas) discharged from the medium flow path 58 </ b> A into the storage box 50.

  In addition, a discharge path 64B (discharge line) for discharging the refrigerant (fluid) from the concave portion 142 side of the device supply unit 14 (mounting unit) is connected to the outflow end ExB of the medium flow path 58B. The discharge path 64B is connected to the discharge path 64A at the connection portion 65, and discharges the refrigerant (nitrogen gas) discharged from the medium flow path 58B to the discharge path 64A.

  The discharge path 64A allows a gas flow from the medium flow path 58A to the connection section 65 upstream of the connection section 65 with the discharge path 64B, and a refrigerant (from the connection section 65 to the medium flow path 58A). A check valve 66A for suppressing the flow of (nitrogen gas) is disposed. Similarly, in the discharge path 64B, the flow of the refrigerant (nitrogen gas) from the medium flow path 58B to the connection section 65 is allowed upstream of the connection section 65 with the discharge path 64A, and the medium flow from the connection section 65 is allowed. A check valve 66B that suppresses the flow of the refrigerant (nitrogen gas) to the path 58B is disposed. By providing the check valve 66A and the check valve 66B, for example, the refrigerant discharged from the medium flow path 58A flows back into the medium flow path 58B through the discharge path 64B and is discharged from the medium flow path 58B. It is possible to prevent the discharged refrigerant from flowing backward through the discharge path 64A and flowing into the medium flow path 58A.

  Further, in the discharge path 64A, a heat exchanger 67 as a heating unit is disposed on the downstream side of the connection part 65 with the discharge path 64B. The heat exchanger 67 is a so-called plate heat exchanger, and is connected to a discharge path 64 </ b> A and a purge air supply path 70 to which purge air that is dry air from a dry air supply source 69 is supplied. In the heat exchanger 67, the refrigerant flowing through the discharge path 64A and the purge air flowing through the purge air supply path 70 are in parallel flow, and heat exchange is performed between these refrigerant and the purge air.

  Further, in the discharge path 64A, on the downstream side of the heat exchanger 67, the gas flow from the heat exchanger 67 to the storage box 50 is allowed, and the backflow of the gas from the storage box 50 to the heat exchanger 67 is suppressed. A check valve 68 is disposed. By providing such a check valve 68, the moisture content from the storage box 50 to the heat exchanger 67, the medium flow path 58A, the medium flow path 58B, and the vaporization container 60 through the discharge path 64A is higher than that of the refrigerant (nitrogen gas). It can suppress that a lot of air flows. As a result, when the second switching valve 59A and the second switching valve 59B are controlled to be opened again, the heat exchanger 67, the medium flow path 58A, the medium flow path 58B, It is possible to suppress the occurrence of dew condensation or icing in the flow path of the refrigerant (nitrogen gas) such as the vaporization container 60.

  Further, on the downstream side of the check valve 68 of the discharge path 64A (discharge line), detection is performed to detect the state of the refrigerant (fluid) passing through the discharge path 64A (discharge line) (for example, pressure and flow rate). A part 53 is arranged. The detection unit 53 includes a pressure gauge (pressure sensor) 531 that detects the pressure of the refrigerant (fluid) that passes through the discharge path 64A (discharge line) or the refrigerant (fluid) that passes through the discharge path 64A (discharge line). It consists of a flow meter (flow sensor) 532 (see FIG. 13) that detects the flow rate. In the configuration shown in FIG. 3, the detection unit 53 includes a pressure gauge 531. By using the pressure gauge 531, it is possible to easily grasp the state of the flow of the refrigerant passing through the discharge path 64 </ b> A, that is, how much the refrigerant is flowing, with a simple configuration.

  The dry air supply source 69 is composed of a compressor and a dryer, compresses the air around the electronic component inspection apparatus 1, dries it, and supplies it to the purge air supply path 70. The supply amount to the purge air supply path 70 is controlled by a purge air supply valve 71 that changes the flow path cross-sectional area of the purge air supply path 70. The purge air supply path 70 is connected to the storage box 50, and the purge air that has flowed out of the heat exchanger 67 is introduced into the storage box 50. In the purge air supply path 70, an air heater 72 for heating the purge air is disposed between the purge air supply valve 71 and the heat exchanger 67. The heat exchanger 67 is supplied with purge air heated by the air heater 72.

  Further, the purge air supply path 70 allows a gas flow from the heat exchanger 67 to the storage box 50 on the downstream side of the heat exchanger 67, and prevents a backflow of gas from the storage box 50 to the heat exchanger 67. A check valve 73 to be suppressed is arranged. By providing such a check valve 73, it is possible to suppress the flow of air having a moisture content higher than that of the refrigerant (nitrogen gas) from the storage box 50, and to maintain the heat exchanger 67 and the purge air supply path 70 in a dry state. Can do.

  The dry air supply source 69 supplies the dry air generated by the dry air supply source 69 to the second supply passage 75 as a temperature rising gas in addition to the purge air supply passage 70. The second supply path 75 is branched at the branching section 76 into a second supply path 75A and a second supply path 75B. The second supply path 75A is connected to the first supply path 57A by a connecting portion 77A, and the second supply path 75B is connected to the first supply path 57B by a connecting portion 77B.

  As a control valve for controlling the supply amount of the temperature rising gas to the second supply passage 75 by changing the cross-sectional area of the second supply passage 75 upstream of the branching portion 76 in the second supply passage 75. A temperature rising gas supply valve 78 is arranged. Further, between the temperature rising gas supply valve 78 and the branching portion 76 in the second supply path 75, the temperature rising gas is heated to a predetermined temperature higher than 18 ° C. which is the second target temperature, for example, 60 ° C. An air heater 79 is disposed as a heating unit. That is, when the second switching valve 59A and the second switching valve 59B are closed and the temperature rising gas supply valve 78 is in the open state, the first supply path 57A and the first supply path 57B have a second target temperature. Therefore, the temperature rising gas having a higher temperature flows in, and the concave portion 141 and the concave portion 142 are directly heated by the temperature rising gas.

  The second supply path 75A allows the flow of the temperature rising gas from the second supply path 75 to the first supply path 57A, and allows the flow of nitrogen gas from the first supply path 57A to the second supply path 75. A check valve 80A serving as a deterring part for deterring is arranged. Similarly, in the second supply path 75B, the flow of the temperature rising gas from the second supply path 75 to the first supply path 57B is allowed, and the flow of nitrogen gas from the first supply path 57B to the second supply path 75 is allowed. A check valve 80 </ b> B is disposed as a deterring unit that deters this.

  The cooling unit 900 configured as described above performs cooling control (cooling operation) for cooling the device supply unit 14 together with the IC device 90 and normal temperature recovery control (normal temperature recovery operation) for returning the cooling state to normal temperature. Can do.

  In the cooling control, the first switching valve 54 is opened (OPEN), the second switching valve 59A is opened (OPEN), the second switching valve 59B is opened (OPEN), and the temperature rising gas supply valve 78 is turned on. “CLOSE”, purge air supply valve 71 “OPEN”, heater 62A “ON”, heater 62B “ON”, air heater 72 “ON”, air heater 79 “OFF” Run as.

  In the normal temperature return control, the first switching valve 54 is “closed”, the second switching valve 59A is “closed”, the second switching valve 59B is “closed”, and the temperature rising gas supply valve 78 is closed. "OPEN", purge air supply valve 71 "OPEN", heater 62A "ON", heater 62B "ON", air heater 72 "ON", air heater 79 "ON" Is executed.

  By the way, when using the electronic component inspection apparatus 1, the user of the electronic component inspection apparatus 1 separately prepares a storage tank 55 and connects it to the common path 56 of the electronic component inspection apparatus 1. When foreign matter such as dust, dust, or other metal powder is mixed in the storage tank 55, the foreign matter passes through the common path 56 together with the refrigerant, and the first switching valve 54, the second switching valve 59A and There is a risk of being caught by one of the second switching valves 59B. In this case, it is conceivable that the switching valve on which the foreign matter is caught is difficult to perform a normal opening / closing operation. For example, if the switching valve should be in a closed state, but remains open due to a foreign object being caught, the refrigerant continues to be supplied unnecessarily. In addition, the wasteful supply of the refrigerant causes excessive cooling to make the temperature control impossible, or the heater 62A and the heater 62B must be operated excessively in order to eliminate excessive cooling. Occurs. In addition, it is conceivable that the first switching valve 54, the second switching valve 59A, and the second switching valve 59B are difficult to perform a normal opening / closing operation due to deterioration over time. In this case, the same problem occurs.

  Therefore, the electronic component inspection apparatus 1 is configured to prevent such a problem. Hereinafter, this configuration and operation will be described.

  The control unit 800 detects control information for operating the first switching valve 54, the second switching valve 59A, and the second switching valve 59B (switching valve) (a signal indicating whether to open or close), and detection. Based on the detection result of the unit 53 (pressure gauge 531), the state of each switching valve is determined. Hereinafter, this determination is referred to as “switching valve state determination”. Specifically, the “switching valve state determination” means whether the switching valve is operating normally, that is, whether the switching valve is operating in a temperature-controllable state, or the switching valve is operating abnormally. It is a judgment. If there is a switching valve that is determined to be abnormal as a result of the determination, the switching valve can be replaced with a new switching valve, for example. As a result, the switching valve can be operated normally, that is, the temperature can be controlled, and thus the above-described problems can be prevented.

  The control unit 800 can perform three controls for determining the states of the first switching valve 54, the second switching valve 59A, and the second switching valve 59B, respectively. This control program will be described with reference to the flowcharts of FIGS. The timing for performing this control is not particularly limited, and for example, it is preferable to start each lot before the start of transportation (inspection), after the completion of transportation (inspection) of each lot, or at regular intervals by a timer operation.

FIG. 4 is a flowchart of the first control program.
The control unit 800 switches one of the first switching valve 54 and the second switching valve (second switching valve 59A, second switching valve 59B) to a closed state and the other switching valve to an open state. The valve state is judged (judgment). In the first control program, the control unit 800 closes the first switching valve 54 (step S101) and opens the second switching valve 59A and the second switching valve 59B (step S102). In this state, the pressure gauge 531 (detector 53) is operated to detect the pressure value P ₁ (detected value) (step S103). The pressure value _{P 1} is, it is determined whether or not the reference value _{M 1} set in advance (step S104). In step S104, when the pressure value P ₁ (detection value) at the pressure gauge 531 (detection unit 53) is a preset reference value M ₁ (value), the operation of the first switching valve 54 is normal. If it is in the correct state, the switching valve state determination (determination) is performed, and the fact is notified on the monitor 300 or the like (step S105). As a result of the determination in step S104, when the pressure value P ₁ is not the reference value M ₁ (the pressure value P ₁ is greater than the reference value M _1), when there is an abnormality in the operation of the first switching valve 54 The switching valve state is determined, and notification to that effect is given by the monitor 300 or the like (step S106). As the reference value M _1, for example, it may be the atmospheric pressure when running a first control program.

  The operator who operates the electronic component inspection apparatus 1 can inspect the IC device 90 by the electronic component inspection apparatus 1 after confirming the notification in step S105. On the other hand, when the notification in step S106 is confirmed, the operator can know that the first switching valve 54 is clogged with foreign matter and that the operation is abnormal. The operator can replace the first switching valve 54 with, for example, a new first switching valve 54. Thereby, the 1st switching valve 54 can operate | move normally, Therefore The test | inspection of the IC device 90 can be performed, preventing the malfunction mentioned above.

FIG. 5 is a flowchart of the second control program.
The control unit 800 switches one of the first switching valve 54 and the second switching valve (second switching valve 59A, second switching valve 59B) to a closed state and the other switching valve to an open state. The valve state is judged (judgment). In the second control program, the control unit 800 opens the first switching valve 54 (step S201), and closes the second switching valve 59A and the second switching valve 59B (step S202). In this state, the pressure gauge 531 (detector 53) is operated to detect the pressure value P ₂ (detected value) (step S203). The pressure value _{P 2} determines whether the reference value _{M 2} which is set in advance (step S204). In step S204, when the pressure value P ₂ (detected value) in the pressure gauge 531 (detecting unit 53) is a preset reference value M ₂ (value), the second switching valve 59A, the second switching valve When the operation of the valve 59B is in a normal state, a switching valve state determination (determination) is performed, and that fact is notified on the monitor 300 or the like (step S205). Further, the determination in step S204 results, the pressure value _{P 2} is not a reference value _{M 2} if (pressure value _{P 2} is greater than the reference value _{M 2),} the second switching valve 59A and the second switch valve 59B If there is an abnormality in at least one of the operations, the switching valve state is determined, and this is notified on the monitor 300 or the like (step S206). As the reference value M _2, for example, it may be the atmospheric pressure when running a second control program.

  Then, after confirming the notification in step S205, the operator can inspect the IC device 90 by the electronic component inspection apparatus 1. On the other hand, if the notification in step S206 is confirmed, the operator can know that at least one of the second switching valve 59A and the second switching valve 59B is clogged with foreign matter, and that the operation is abnormal. . Then, the operator can replace the abnormal second switching valve among the second switching valve 59A and the second switching valve 59B, for example, with a new second switching valve. As a result, the second switching valve 59A and the second switching valve 59B can operate normally, and thus the IC device 90 can be inspected while preventing the above-described problems.

FIG. 6 is a flowchart of the third control program.
The control unit 800 opens the first switching valve 54 (step S301). Next, one second switching valve among the second switching valves arranged in each branch line is opened, and the remaining second switching valves are closed. That is, the second switching valve 59A disposed in the first supply path 57A is opened (step S302), and the second switching valve 59B disposed in the first supply path 57B is closed (step S303). In this state, the pressure gauge 531 (detector 53) is operated to detect the pressure value P ₃ (detected value) (step S304). This pressure value _{P 3,} it is determined whether the reference value _{M 3} which is set in advance (step S305). In step S305, when the pressure value P ₃ (detected value) at the pressure gauge 531 (detecting unit 53) is a preset reference value M ₃ (value), the second switching valve 59A (open state and If the operation of the second switching valve) is in a normal state, the switching valve state determination (determination) is performed, and the fact is notified on the monitor 300 or the like (step S306). As a result of the determination in step S305, when the pressure value P ₂ is not a reference value M ₃ (for example, the pressure value P ₃ has the same as the atmospheric pressure), there is abnormality in the operation of the second switching valve 59A Then, the switching valve state is determined, and that fact is notified on the monitor 300 or the like (step S307).

Next, the second switching valve 59A is closed (step S308), and the second switching valve 59B is opened (step S309). In this state, by operating the pressure gauge 531 detects the pressure value _{P 3} (step S310). The pressure value _{P 3} is equal to or a reference value _{M 3} (step S311). In step S311, when the pressure value P ₃ was the reference value M _3, a certain the switching valve state determining at is normal operational state of the second switching valve 59B (second switching valve in the open state) This is reported to that effect on the monitor 300 or the like (step S312). As a result of the determination in step S311, when the pressure value P ₂ is not a reference value M ₃ (for example, the pressure value P ₃ has the same as the atmospheric pressure), there is abnormality in the operation of the second switching valve 59B Then, the switching valve state is determined, and that fact is notified on the monitor 300 or the like (step S313). The reference value M ₃ are, for example, can be any size other than atmospheric pressure.

  The operator can inspect the IC device 90 by the electronic component inspection apparatus 1 after confirming the notification in step S306 and step S312. On the other hand, if the notification in step S207 and step S313 is confirmed, the operator can know that the second switching valve 59A and the second switching valve 59B themselves have failed, for example, and the operation is abnormal. Then, the operator can replace the second switching valve 59A and the second switching valve 59B with, for example, new second switching valve 59A and second switching valve 59B. As a result, the second switching valve 59A and the second switching valve 59B can operate normally, and thus the IC device 90 can be inspected while preventing the above-described problems.

  By the first control program, the second control program, and the third control program as described above, the states of the first switching valve 54, the second switching valve 59A, and the second switching valve 59B (for example, whether they are operating normally). Or whether there is an abnormality in the operation). Thereby, the electronic component inspection apparatus 1 can be operated while preventing the above-described problems.

  Next, an example of a form for setting execution of the switching valve state determination and an example of a form for displaying the execution result will be described with reference to FIGS. The “form” may also be referred to as “screen”, “dialog”, “window”, or the like.

  First, a form FM1 shown in FIG. Form FM1 is a main screen. The form FM1 includes a button group BT100, a first item group IT110, a second item group IT120, a third item group IT130, a fourth item group IT140, a fifth item group IT150, and a sixth item group. IT160 is included.

  The button group BT100 includes an “end” button BT101, a “shutdown” button BT102, a “product type setting” button BT103, a “unit setting” button BT104, and a “maintenance” button. A BT 105, a “user-defined” button BT 106, and a “calculator” button BT 107 are included.

  The first item group IT110 includes an item IT111 for setting “user selection”, an item IT112 for setting “temperature mode”, an item IT113 for setting “tester connection”, and an item IT114 for setting “transport mode”. An item IT115 for setting “start mode”, an item IT116 for setting “bin setting”, an item IT117 for displaying “humidity and temperature of each region”, an item IT118 for setting “setting data”, An item IT119 for setting “test site” is included.

  The second item group IT120 includes an item IT121 for setting “supply shuttle”, an item IT122 for setting “soak plate (temperature adjustment unit)”, an item IT123 for setting “arm 2”, and “arm 1”. An item IT124 for setting, an item IT125 for setting “socket heater”, and an item IT126 for setting “socket air, socket cooling” are included.

  The third item group IT130 includes an item 131 for displaying “information on oxygen concentration in each region” and an item 132 for displaying “oxygen concentration determination value”.

  The fourth item group IT140 includes, as “supply / storage counter”, an item IT141 for “supply” confirmation, an item IT142 for “total” confirmation, an item IT143 for “good / defective product”, and “storage 1”. “Containment 4 · Fixed 1 to Fixed 4” confirmation item IT 144 is included.

  The fifth item group IT150 includes, as “contact counters”, an item IT151 for setting “general”, an item IT152 for setting “by product type”, an item IT153 for setting “% by product type”, and “arm 1. The item IT154 for confirming “arm 2” is included.

  The sixth item group IT160 includes, as “tester category”, an item IT161 for checking “arm 2” and an item IT162 for checking “arm 1”.

  Next, when the button BT105 of the button group BT100 is operated, as shown in FIG. 8, the form FM2 is displayed so as to overlap the form FM1. Form FM2 is an icon menu. The form FM2 includes a “build” button BT201, a “start mode” button BT202, a “counter” button BT203, a “counter clear” button BT204, and a “temperature monitor” button. Button BT205, “Tower Light” button BT206, “Password” button BT207, “Security” button BT208, “Production Management” button BT209, and “Function Setting” button BT210 A button BT211 for "controller", a button BT212 for "DIO setting", a button BT213 for "I / F monitor", a button BT214 for "low temperature operation", and a button for "handler ID" A BT 215 and an “Exit” button BT 216 are included.

  Next, when the button BT214 of the form FM2 is operated, the monitor 300 displays a low temperature operation setting screen, that is, the form FM3 shown in FIG. The form FM3 includes a first item group IT310, a second item group IT320, a third item group IT330, and a fourth item group IT340.

  The first item group IT310 includes, as “small windows”, an item IT311 for “open warning time” and an item IT312 for “warning humidity”.

  The second item group IT320 includes, as “dew point monitoring”, an item IT321 for “collection area (offset)”, an item IT322 for “+ set temperature”, and an item IT323 for “unloader area”. Yes.

  The third item group IT330 includes, as the “unloading operation”, an item IT331 for “waiting for the door closing time” and an item IT332 for “purge time after unloading”.

  The fourth item group IT340 includes, as “LN2 valve check”, an item IT341 for “sensor stabilization waiting time”, an item IT342 for “Check LN2 valve regularly (stopped)”, and a “check interval” Item IT343. Then, by checking the item IT342 and pressing the “OK” button BT351, execution of the switching valve state determination can be set. On the other hand, when the check on the item IT342 is omitted, the setting for executing the switching valve state determination is canceled. The fourth item group IT340 includes a “cancel” button BT352 and an “apply” button BT353 in addition to the button BT351. In the item IT341, the time until the refrigerant in the common path 56 is completely discharged can be set. If the pressure detected by the pressure gauge 531 becomes atmospheric pressure within this set time, it is determined that the refrigerant has completely escaped from the common path 56.

  After checking the item IT342 and pressing the “OK” button BT351, when the time input in the item IT343 has elapsed, the form FM4 shown in FIG. 10 is displayed. Form FM4 includes item IT410, item IT420, button BT430, and button BT440.

  In item IT410, for example, “Because the specified time (12 hours) has passed, check the operation of the LN2 valve. If you want to start immediately, select [Run Now]. Is displayed, select [Defer Execution]. Then, when selecting [Execute Immediately], the button BT430 for “Execute Immediately” is pressed. On the other hand, in the case of selecting [Execution postponement], the button BT440 for "Execution postponement (15 minutes)" is pressed.

In the item IT420, the time counted down is displayed.
When the operation of the first switching valve 54, the second switching valve 59A, and the second switching valve 59B is abnormal after the switching valve state determination is performed, the form FM5 shown in FIG. 11 or FIG. 12 is displayed. Is done. Form FM5 includes item IT510, item IT520, item IT530, item IT540, item IT550, and layout LO560.

  The item IT510 is “error code”. In FIG. 11, “612” is displayed, and in FIG. 12, “613” is displayed.

  The item IT520 is a “unit” number. In both FIG. 11 and FIG. 12, “15” is displayed.

  The item IT530 is “unit name”. In both FIG. 11 and FIG. 12, “temperature adjustment” is displayed.

  In the item IT540, a switching valve having an abnormal operation is displayed as a “title”. In FIG. 11, “LN2 main valve is abnormal. LN2 valve failure confirmation sensor is OFF. RETRY, please start after selecting” is displayed. In FIG. 12, “LN2 control valve is abnormal. LN2 valve failure confirmation sensor is OFF. RETRY, please start after selecting” is displayed.

  In the item IT550, as “details”, detailed information about the switching valve having an abnormality in operation is displayed. In Fig. 11, "If you want to check again, please start after selecting RETRY. If you want to stop cooling, please reset after selecting PAUSE. (1) The LN2 main valve may be broken. Close the LN2 supply valve. ”Is displayed. In Fig. 12, "If you want to check again, please start after selecting RETRY. If you want to stop cooling, please select RESET after selecting PAUSE. (1) One of the LN2 control valves may be broken. Please close the LN2 supply valve. ”Is displayed.

  The layout LO560 displays the layout (arrangement) of the main part of the electronic component inspection apparatus 1. In FIG. 12, “LN2” is circled.

Second Embodiment
Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to FIG. 13, but the description will focus on the differences from the above-described embodiment, and the same matters will be described. Is omitted.
This embodiment is the same as the first embodiment except that the configuration of the detection unit is different.

  The detection unit 53 is a pressure gauge (pressure sensor) 531 (see FIG. 3) that detects the pressure of the refrigerant (fluid) that passes through the discharge path 64A (discharge line), or the refrigerant that passes through the discharge path 64A (discharge line). It is composed of a flow meter (flow rate sensor) 532 that detects the flow rate of (fluid). As shown in FIG. 13, in this embodiment, the detection unit 53 includes a flow meter 532. By using the flow meter 532, it is possible to easily grasp the state of the flow of the refrigerant passing through the discharge path 64A, that is, how much the refrigerant is flowing, with a simple configuration.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Moreover, in each said embodiment, the structure which cools a mounting part for every IC device was described, and although it was a refrigerant | coolant as a fluid to be used, for example, the structure which heats a mounting part for every IC device It may be. In this case, the fluid to be used may be water (hot water) or oil, for example.

  Further, the detection unit that detects the flow of the fluid passing through the discharge line is not limited to a pressure gauge or a flow meter, and may be, for example, a temperature sensor that detects the temperature of the fluid. In addition, for example, the passage and stop of fluid may be detected simply by ON / OFF.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus, 10 ... Electronic component conveyance apparatus, 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 ... Temperature adjustment part, 13 ... Device conveyance head, 14 ... Device supply part, 14A ... Device supply part, DESCRIPTION OF SYMBOLS 14B ... Device supply part, 141 ... Concave part (pocket), 142 ... Concave part (pocket), 15 ... Tray conveyance mechanism, 16 ... Inspection part, 17 ... Device conveyance head, 17A ... Device conveyance head, 17B ... Device conveyance head, 18 ... Device collection unit, 18A ... Device collection unit, 18B ... Device collection unit, 19 ... Collection tray, 20 ... Device conveyance head, 21 ... Tray conveyance mechanism, 22A ... Tray conveyance mechanism, 22B ... Tray conveyance mechanism, 231 ... First 1 partition, 232 ... 2nd partition, 233 ... 3rd partition, 234 ... 4th partition, 235 ... 5th partition, 241 ... flow 242 ... side cover 243 ... side cover 244 ... rear cover 245 ... top cover 25 ... conveying unit 50 ... storage box 53 ... detecting unit 531 ... pressure gauge (pressure sensor) 532 ... flow meter ( Flow rate sensor), 54 ... first switching valve, 55 ... storage tank, 56 ... common channel, 57A ... first supply channel, 57B ... first supply channel, 58A ... medium channel, 58B ... medium channel, 59A ... 2 switching valve, 59B ... 2nd switching valve, 60 ... vaporization container, 61A ... vaporization chamber, 61B ... vaporization chamber, 62A ... heating heater, 62B ... heating heater, 63A ... temperature sensor, 63B ... temperature sensor, 64A ... discharge path , 64B ... discharge path, 65 ... connection part, 66A ... check valve, 66B ... check valve, 67 ... heat exchanger, 68 ... check valve, 69 ... dry air supply source, 70 ... purge air supply path 71 ... Purge air supply valve, 72 ... Air heater, 73 ... Check valve, 75 ... Second supply path, 75A ... Second supply path, 75B ... Second supply path, 76 ... Branch, 77A ... Connector, 77B ... Connection part, 78 ... Temperature rising gas supply valve, 79 ... Air heater, 80A ... Check valve, 80B ... Check valve, 90 ... IC device, 200 ... Tray, 300 ... Monitor, 301 ... Display screen, 400 ... Signal lamp , 500 .. Speaker, 600... Mouse table, 700. Control panel, 800. Control unit, 900. Cooling unit, A 1. Tray supply area, A 2 ... Device supply area, A 3 ... Inspection area, A 4 ... Device collection area, A 5. Tray removal area, EnA ... inflow end, EnB ... inflow end, ExA ... outflow end, ExB ... outflow end, BT100 ... button group, BT101 ... button, BT102 ... button, BT 103 ... button, BT104 ... button, BT105 ... button, BT106 ... button, BT107 ... button, BT201 ... button, BT202 ... button, BT203 ... button, BT204 ... button, BT205 ... button, BT206 ... button, BT207 ... button, BT208 ... Button, BT209 ... button, BT210 ... button, BT211 ... button, BT212 ... button, BT213 ... button, BT214 ... button, BT215 ... button, BT216 ... button, BT351 ... button, BT352 ... button, BT353 ... button, BT430 ... button, BT440 ... button, FM1 ... form, FM2 ... form, FM3 ... form, FM4 ... form, FM5 ... form, IT110 ... first item group, IT111 ... item, IT112 ... item, IT113 ... Item, IT115 ... Item, IT117 ... Item, IT117 ... Item, IT118 ... Item, IT119 ... Item, IT120 ... Second Item Group, IT121 ... Item, IT122 ... Item, IT123 ... Item, IT124 ... Item , IT125 ... item, IT126 ... item, IT130 ... third item group, IT131 ... item, IT132 ... item, IT140 ... fourth item group, IT141 ... item, IT142 ... item, IT143 ... item, IT144 ... item, IT150 ... item IT151 ... Item, IT152 ... Item, IT153 ... Item, IT154 ... Item, IT160 ... Sixth Item Group, IT161 ... Item, IT162 ... Item, IT310 ... First Item Group, IT311 ... Item, IT312 ... Item, IT320 ... second item group, IT321 ... IT, IT322 ... item, IT323 ... item, IT330 ... third item group, IT331 ... item, IT332 ... item, IT340 ... fourth item group, IT341 ... item, IT342 ... item, IT343 ... item, IT410 ... item, IT420 ... item, IT510 ... item, IT520 ... item, IT530 ... item, IT540 ... item, IT550 ... item, LO560 ... layout, M 1 _... reference value, M 2 _... reference value, M 3 _... reference value, P 1 _... pressure value, P ₂ ... Pressure value, P ₃ ... Pressure value, S101 to S106 ... Step, S201 to S206 ... Step, S301 to S313 ... Step, α _11A ... Arrow, α _11B ... Arrow, α _13X ... Arrow, α _13Y ... Arrow, α _{14 ...} arrow, α _{15 ...} arrow, α _{17Y ...} arrow, α _{18 ...} arrow, α _{20X ...} arrow, α _20Y ... Mark, α _{21 ...} arrow, α _{22A ...} arrow, α _{22B ...} arrow, α _{90 ...} arrow

Claims (14)

A transport unit for transporting electronic components;
A placement section on which the electronic component is placed;
A supply line for supplying a fluid for adjusting the temperature of the mounting unit to the mounting unit;
A discharge line for discharging the fluid from the mounting portion;
At least one switching valve disposed in the supply line and capable of switching through the supply line in an open state and switchable to block the fluid in a closed state;
A detector that is disposed in the discharge line and detects a flow of the fluid passing through the discharge line;
A control unit capable of controlling the switching valve,
The electronic component transport apparatus, wherein the control unit determines a state of the switching valve based on control information of the switching valve and a detection result of the detection unit.   The electronic component conveying apparatus according to claim 1, wherein the fluid is a refrigerant that cools the placement unit.   The electronic component transport apparatus according to claim 1, wherein the placement unit is fixed.   The electronic component transport apparatus according to claim 1, wherein the placement unit is supported so as to be movable.   The electronic component transport apparatus according to claim 1, wherein the placement unit is configured to be capable of gripping the electronic component.   2. The electronic component transport device according to claim 1, wherein the switching valve includes a first switching valve and at least one second switching valve that is disposed downstream of the first switching valve in the supply line. The supply line has a branch line branched into a plurality on the downstream side of the portion where the first switching valve is disposed,
The electronic component transport apparatus according to claim 6, wherein the second switching valve is disposed in each branch line.   The electronic part conveyance according to claim 6, wherein the control unit makes the determination by closing one switching valve of the first switching valve and the second switching valve and opening the other switching valve. apparatus.   The control unit closes the first switching valve, opens the second switching valve, and opens the first switching valve when the detection value at the detection unit is a preset value. The electronic component conveying apparatus according to claim 8, wherein the determination is made that the operation of is in a normal state.   The control unit opens the first switching valve, closes the second switching valve, and closes the second switching valve when the detection value at the detection unit is a preset value. The electronic component conveying apparatus according to claim 8, wherein the determination is made that the operation of is in a normal state.   The control unit opens the first switching valve, opens one second switching valve among the second switching valves arranged in the branch lines, and opens the remaining second switching valves. When the detection value at the detection unit is a preset value, the determination is made that the operation of the second switching valve in the open state is normal. The electronic component conveying apparatus according to claim 7.   2. The electronic component conveying device according to claim 1, wherein the switching valve is opened when energized to allow the fluid to pass therethrough and is closed when de-energized to block the fluid.   2. The electron according to claim 1, wherein the detection unit includes a pressure gauge that detects a pressure of the fluid that passes through the discharge line, or a flow meter that detects a flow rate of the fluid that passes through the discharge line. Parts transport device. A transport unit for transporting electronic components;
A placement section on which the electronic component is placed;
A supply line for supplying a fluid for adjusting the temperature of the mounting unit to the mounting unit;
A discharge line for discharging the fluid from the mounting portion;
At least one switching valve disposed in the supply line and capable of switching through the supply line in an open state and switchable to block the fluid in a closed state;
A detector that is disposed in the discharge line and detects a flow of the fluid passing through the discharge line;
A control unit capable of controlling the switching valve;
An inspection unit capable of inspecting the electronic component,
The electronic component inspection apparatus, wherein the control unit determines the state of the switching valve based on control information of the switching valve and a detection result of the detection unit.

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