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JP2018167367A - 研削装置 - Google Patents

研削装置 Download PDF

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Publication number
JP2018167367A
JP2018167367A JP2017067439A JP2017067439A JP2018167367A JP 2018167367 A JP2018167367 A JP 2018167367A JP 2017067439 A JP2017067439 A JP 2017067439A JP 2017067439 A JP2017067439 A JP 2017067439A JP 2018167367 A JP2018167367 A JP 2018167367A
Authority
JP
Japan
Prior art keywords
grinding
plate
outer peripheral
workpiece
holding table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017067439A
Other languages
English (en)
Japanese (ja)
Inventor
舞 羽田
Mai Haneda
舞 羽田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2017067439A priority Critical patent/JP2018167367A/ja
Priority to KR1020180032017A priority patent/KR20180111542A/ko
Priority to CN201810257274.7A priority patent/CN108687587B/zh
Priority to TW107110776A priority patent/TW201838019A/zh
Publication of JP2018167367A publication Critical patent/JP2018167367A/ja
Pending legal-status Critical Current

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Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/07—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table
    • B24B7/08—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table having an abrasive wheel built in
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • H10P72/78—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2017067439A 2017-03-30 2017-03-30 研削装置 Pending JP2018167367A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017067439A JP2018167367A (ja) 2017-03-30 2017-03-30 研削装置
KR1020180032017A KR20180111542A (ko) 2017-03-30 2018-03-20 연삭 장치
CN201810257274.7A CN108687587B (zh) 2017-03-30 2018-03-27 磨削装置
TW107110776A TW201838019A (zh) 2017-03-30 2018-03-28 研削裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017067439A JP2018167367A (ja) 2017-03-30 2017-03-30 研削装置

Publications (1)

Publication Number Publication Date
JP2018167367A true JP2018167367A (ja) 2018-11-01

Family

ID=63844312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017067439A Pending JP2018167367A (ja) 2017-03-30 2017-03-30 研削装置

Country Status (4)

Country Link
JP (1) JP2018167367A (zh)
KR (1) KR20180111542A (zh)
CN (1) CN108687587B (zh)
TW (1) TW201838019A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113427339A (zh) * 2020-03-04 2021-09-24 株式会社迪思科 加工装置
JP2024013274A (ja) * 2022-07-20 2024-02-01 株式会社ディスコ 吸引保持監視方法、及び加工装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11400563B2 (en) * 2018-12-07 2022-08-02 Disco Corporation Processing method for disk-shaped workpiece
JP7328099B2 (ja) * 2019-09-19 2023-08-16 株式会社ディスコ 研削装置および研削方法
JP7353715B2 (ja) * 2019-10-25 2023-10-02 株式会社ディスコ 被加工物の研削方法
JP7405563B2 (ja) * 2019-11-01 2023-12-26 株式会社ディスコ クリープフィード研削方法及び研削装置
JP7517875B2 (ja) * 2020-06-25 2024-07-17 株式会社ディスコ チャックテーブル及び加工装置
CN111805328A (zh) * 2020-07-30 2020-10-23 清华大学 用于晶圆磨削的可倾斜的主轴组件
CN114211326A (zh) * 2021-06-15 2022-03-22 惠州市宏程智能装备科技有限公司 一种用于金属板材表面处理的自动化板材研磨机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116842A (ja) * 2003-10-09 2005-04-28 Shinko Electric Ind Co Ltd ウェーハ吸着ステージ及びウェーハの吸着方法
JP2012020374A (ja) * 2010-07-15 2012-02-02 Disco Corp 研削装置
JP2016219756A (ja) * 2015-05-26 2016-12-22 株式会社ディスコ 加工システム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108273A (ja) * 2004-10-04 2006-04-20 Disco Abrasive Syst Ltd ウエーハの分割方法および分割装置
JP5914062B2 (ja) * 2012-03-09 2016-05-11 株式会社ディスコ 板状ワークの保持解除方法及び加工装置
JP5908757B2 (ja) * 2012-03-14 2016-04-26 株式会社ディスコ 保持テーブルの良否判断方法
JP6305245B2 (ja) * 2014-06-30 2018-04-04 株式会社ディスコ チャックテーブル
JP6494451B2 (ja) * 2015-07-06 2019-04-03 株式会社ディスコ チャックテーブル及び洗浄装置
CN204857698U (zh) * 2015-07-30 2015-12-09 吴根明 一种半导体真空吸盘
CN106154769A (zh) * 2016-08-25 2016-11-23 中国电子科技集团公司第十研究所 薄膜电路带孔瓷片光刻真空夹具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116842A (ja) * 2003-10-09 2005-04-28 Shinko Electric Ind Co Ltd ウェーハ吸着ステージ及びウェーハの吸着方法
JP2012020374A (ja) * 2010-07-15 2012-02-02 Disco Corp 研削装置
JP2016219756A (ja) * 2015-05-26 2016-12-22 株式会社ディスコ 加工システム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113427339A (zh) * 2020-03-04 2021-09-24 株式会社迪思科 加工装置
JP2024013274A (ja) * 2022-07-20 2024-02-01 株式会社ディスコ 吸引保持監視方法、及び加工装置

Also Published As

Publication number Publication date
CN108687587A (zh) 2018-10-23
CN108687587B (zh) 2021-08-17
KR20180111542A (ko) 2018-10-11
TW201838019A (zh) 2018-10-16

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