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JP2018163980A - 基板処理方法および基板処理装置 - Google Patents

基板処理方法および基板処理装置 Download PDF

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Publication number
JP2018163980A
JP2018163980A JP2017060073A JP2017060073A JP2018163980A JP 2018163980 A JP2018163980 A JP 2018163980A JP 2017060073 A JP2017060073 A JP 2017060073A JP 2017060073 A JP2017060073 A JP 2017060073A JP 2018163980 A JP2018163980 A JP 2018163980A
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JP
Japan
Prior art keywords
substrate
mixed gas
unit
ultraviolet irradiation
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017060073A
Other languages
English (en)
Japanese (ja)
Inventor
隆行 郷原
Takayuki Gohara
隆行 郷原
豊秀 林
Toyohide Hayashi
豊秀 林
波多野　章人
Akito Hatano
章人 波多野
皓太 宗徳
Kota Sotoku
皓太 宗徳
弘明 高橋
Hiroaki Takahashi
弘明 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2017060073A priority Critical patent/JP2018163980A/ja
Priority to KR1020197025385A priority patent/KR20190112093A/ko
Priority to CN201880013272.1A priority patent/CN110366769A/zh
Priority to PCT/JP2018/004149 priority patent/WO2018173525A1/ja
Priority to TW107107149A priority patent/TWI686867B/zh
Publication of JP2018163980A publication Critical patent/JP2018163980A/ja
Pending legal-status Critical Current

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    • H10P76/204—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H10P14/6512—
    • H10P72/0402—
    • H10P95/90—

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017060073A 2017-03-24 2017-03-24 基板処理方法および基板処理装置 Pending JP2018163980A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017060073A JP2018163980A (ja) 2017-03-24 2017-03-24 基板処理方法および基板処理装置
KR1020197025385A KR20190112093A (ko) 2017-03-24 2018-02-07 기판 처리 방법 및 기판 처리 장치
CN201880013272.1A CN110366769A (zh) 2017-03-24 2018-02-07 基板处理方法以及基板处理装置
PCT/JP2018/004149 WO2018173525A1 (ja) 2017-03-24 2018-02-07 基板処理方法および基板処理装置
TW107107149A TWI686867B (zh) 2017-03-24 2018-03-05 基板處理方法以及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017060073A JP2018163980A (ja) 2017-03-24 2017-03-24 基板処理方法および基板処理装置

Publications (1)

Publication Number Publication Date
JP2018163980A true JP2018163980A (ja) 2018-10-18

Family

ID=63585277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017060073A Pending JP2018163980A (ja) 2017-03-24 2017-03-24 基板処理方法および基板処理装置

Country Status (5)

Country Link
JP (1) JP2018163980A (zh)
KR (1) KR20190112093A (zh)
CN (1) CN110366769A (zh)
TW (1) TWI686867B (zh)
WO (1) WO2018173525A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7441620B2 (ja) * 2019-08-29 2024-03-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7569752B2 (ja) * 2021-06-07 2024-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04302145A (ja) * 1991-03-29 1992-10-26 Hitachi Ltd 洗浄方法
JPH06224168A (ja) * 1992-11-27 1994-08-12 Hitachi Ltd 有機物除去方法及びその方法を使用するための装置
JP2001144080A (ja) * 2000-08-09 2001-05-25 Hitachi Ltd 表面処理方法及び表面処理装置
JP2002018379A (ja) * 2000-07-04 2002-01-22 Seiko Epson Corp 薄膜剥離方法、薄膜剥離装置及び電子デバイスの製造方法
JP2002134401A (ja) * 2000-07-04 2002-05-10 Seiko Epson Corp 基材処理方法、基材処理装置及び電子デバイスの製造方法
JP2003273059A (ja) * 2002-03-19 2003-09-26 Mitsubishi Electric Corp 基板処理方法およびその装置
JP2004327610A (ja) * 2003-04-23 2004-11-18 Mitsubishi Electric Corp 半導体ウエハのフォトレジスト除去方法
JP2005136439A (ja) * 1999-12-03 2005-05-26 Mitsubishi Electric Corp 基板処理方法
JP2016219656A (ja) * 2015-05-22 2016-12-22 ウシオ電機株式会社 光処理装置および光処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3671389B2 (ja) * 1999-12-03 2005-07-13 三菱電機株式会社 基板処理方法および装置
JP2000286251A (ja) 1999-03-31 2000-10-13 Japan Storage Battery Co Ltd 紫外線処理装置
JP3756092B2 (ja) * 2001-09-06 2006-03-15 大日本スクリーン製造株式会社 基板処理装置
JP5019741B2 (ja) * 2005-11-30 2012-09-05 東京エレクトロン株式会社 半導体装置の製造方法および基板処理システム
DE102009058962B4 (de) 2009-11-03 2012-12-27 Suss Microtec Photomask Equipment Gmbh & Co. Kg Verfahren und Vorrichtung zum Behandeln von Substraten
JP5782279B2 (ja) * 2011-01-20 2015-09-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04302145A (ja) * 1991-03-29 1992-10-26 Hitachi Ltd 洗浄方法
JPH06224168A (ja) * 1992-11-27 1994-08-12 Hitachi Ltd 有機物除去方法及びその方法を使用するための装置
JP2005136439A (ja) * 1999-12-03 2005-05-26 Mitsubishi Electric Corp 基板処理方法
JP2002018379A (ja) * 2000-07-04 2002-01-22 Seiko Epson Corp 薄膜剥離方法、薄膜剥離装置及び電子デバイスの製造方法
JP2002134401A (ja) * 2000-07-04 2002-05-10 Seiko Epson Corp 基材処理方法、基材処理装置及び電子デバイスの製造方法
JP2001144080A (ja) * 2000-08-09 2001-05-25 Hitachi Ltd 表面処理方法及び表面処理装置
JP2003273059A (ja) * 2002-03-19 2003-09-26 Mitsubishi Electric Corp 基板処理方法およびその装置
JP2004327610A (ja) * 2003-04-23 2004-11-18 Mitsubishi Electric Corp 半導体ウエハのフォトレジスト除去方法
JP2016219656A (ja) * 2015-05-22 2016-12-22 ウシオ電機株式会社 光処理装置および光処理方法

Also Published As

Publication number Publication date
KR20190112093A (ko) 2019-10-02
TWI686867B (zh) 2020-03-01
TW201838034A (zh) 2018-10-16
CN110366769A (zh) 2019-10-22
WO2018173525A1 (ja) 2018-09-27

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