JP2018160534A - Lithographic apparatus and method of manufacturing article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an advantageous technique for reducing a difference in internal temperature between a plurality of processes. SOLUTION: A plurality of processing units for forming a pattern on a substrate, a transport unit for transporting a substrate to each of the plurality of processing units, and an internal temperature in each of the plurality of processing units are controlled. The transport unit includes a control unit, and the transport unit has a temperature sensor provided in a portion inserted inside the processing unit when the substrate is transported to each of the plurality of processing units. Based on the detection result of the temperature sensor obtained when the substrate is conveyed by the conveying unit, the internal temperature in each of the plurality of processing units is set so as to reduce the difference in the internal temperature between the plurality of processing units. Control. [Selection diagram] Fig. 1

Description

  The present invention relates to a lithographic apparatus and a method for manufacturing an article.

  In order to improve productivity, a lithographic apparatus used for manufacturing a semiconductor device or the like includes a so-called cluster type having a plurality of processing units for performing a pattern forming process on a substrate (see Patent Document 1). .

JP 2011-210992 A

  In a cluster type lithography apparatus, if there is a difference in internal temperature between multiple processing units, the difference in internal temperature causes a difference in thermal deformation of the substrate. Can be different.

  Therefore, an object of the present invention is to provide an advantageous technique for reducing the difference in internal temperature among a plurality of processing units.

  In order to achieve the above object, a lithographic apparatus according to one aspect of the present invention includes a plurality of processing units that perform a process of forming a pattern on a substrate, and a transport unit that transports the substrate to each of the plurality of processing units. And a control unit that controls an internal temperature in each of the plurality of processing units, and the transfer unit is a portion that is inserted into the processing unit when the substrate is transferred to each of the plurality of processing units The control unit reduces a difference in internal temperature between the plurality of processing units based on a detection result of the temperature sensor obtained when the substrate is transferred by the transfer unit. As described above, the internal temperature in each of the plurality of processing units is controlled.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide an advantageous technique for reducing a difference in internal temperature between a plurality of processes.

It is the schematic which shows the imprint apparatus of 1st Embodiment. It is a figure which shows the structure of a process part. It is a figure which shows the state which is delivering the board | substrate on the board | substrate stage by the conveyance part. It is a flowchart which shows the method of controlling the internal temperature of each process part. It is the schematic which shows the imprint apparatus of 3rd Embodiment. It is a figure which shows the manufacturing method of articles | goods.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member thru | or element, and the overlapping description is abbreviate | omitted. In the following embodiments, an explanation will be given using an imprint apparatus that forms a pattern of an imprint material on a substrate using a mold as a lithography apparatus, but the present invention is not limited thereto. For example, the present invention can be applied to lithography apparatuses such as an exposure apparatus that exposes a substrate and transfers a mask pattern onto the substrate, and a drawing apparatus that irradiates the substrate with charged particle beams to form a pattern on the substrate. it can.

  The imprint apparatus is an apparatus that forms a cured product pattern in which the concave / convex pattern of the mold is transferred by bringing the imprint material supplied on the substrate into contact with the mold and applying energy for curing to the imprint material. It is. That is, the imprint apparatus is used for manufacturing a semiconductor device or the like, and performs an imprint process for forming a pattern on an imprint material supplied on a substrate, using a mold in which an uneven pattern is formed. For example, the imprint apparatus cures the imprint material in a state where the mold on which the pattern is formed is in contact with the imprint material on the substrate. Then, the imprint apparatus can form a pattern on the imprint material by widening the interval between the mold and the substrate and peeling (releasing) the mold from the cured imprint material.

  As the imprint material, a curable composition (also referred to as an uncured resin) that cures when given energy for curing is used. As the energy for curing, electromagnetic waves, heat, or the like is used. The electromagnetic wave is, for example, light such as infrared light, visible light, or ultraviolet light whose wavelength is selected from a range of 10 nm to 1 mm.

  A curable composition is a composition which hardens | cures by irradiation of light or by heating. Among these, the photocurable composition cured by light contains at least a polysynthetic compound and a photopolymerization initiator, and may contain a non-polysynthetic compound or a solvent as necessary. The non-polysynthetic compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

  The imprint material is applied in a film form on the substrate by a spin coater or a slit coater. Alternatively, the liquid ejecting head may be applied on the substrate in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets. The imprint material has a viscosity (viscosity at 25 ° C.) of, for example, 1 mPa · s or more and 100 mPa · s or less.

<First Embodiment>
An imprint apparatus 100 according to the first embodiment of the present invention will be described. The imprint apparatus 100 according to the present embodiment is a so-called cluster type imprint apparatus having a plurality of processing units 10 each performing imprint processing. FIG. 1 is a schematic diagram illustrating an imprint apparatus 100 according to the present embodiment. The imprint apparatus 100 includes, for example, a plurality of processing units 10 (six processing units 10a to 10f in FIG. 1), a second processing unit 20 (pre-processing unit), a conveyance unit 30, and a control unit 40. May be included.

  Each of the plurality of processing units 10 performs an imprint process for forming a pattern of the imprint material 3 on the substrate using the mold 1. The configuration of the processing unit 10 will be described later. The second processing unit 20 performs preprocessing on the substrate 2 on which imprint processing is performed. The pretreatment performed in the second processing unit 20 can include, for example, a process of forming an adhesion layer on the substrate for improving the adhesion between the substrate 2 and the imprint material 3 supplied thereon. The transport unit 30 transports the substrate 2 preprocessed by the second processing unit 20 to each of the plurality of processing units 10. The transport unit 30 can include, for example, a hand 31 that holds the substrate 2, a transport path 32 in which the hand 31 moves, and a temperature adjustment unit 33 that controls the temperature of the transport path 32. The temperature control unit 33 controls the temperature of the transport path 32 by, for example, flowing a temperature-controlled gas through the transport path 32. The control unit 40 is configured by a computer having a CPU, a memory, and the like, for example, and controls each unit of the imprint apparatus 100.

  Next, the configuration of the processing unit 10 will be described with reference to FIG. FIG. 2 is a schematic diagram illustrating the configuration of one processing unit 10. The processing unit 10 includes, for example, an imprint head 11, a substrate stage 12, a curing unit 13, a measurement unit 14, and a supply unit 15. A pattern of the imprint material 3 is formed on the substrate using the mold 1. The imprint process to be formed is performed.

  The mold 1 is usually made of a material that can transmit ultraviolet rays, such as quartz, and an imprint material 3 supplied onto the substrate is provided in a partial region (pattern region 1a) on the substrate side surface. A concave / convex pattern is formed for transfer to the substrate. As the substrate 2, glass, ceramics, metal, semiconductor, resin, or the like is used, and a member made of a material different from the substrate may be formed on the surface as necessary. Specifically, the substrate 2 is a silicon wafer, a compound semiconductor wafer, quartz glass, or the like. Further, before applying the imprint material, an adhesion layer may be provided to improve the adhesion between the imprint material and the substrate, if necessary.

  The imprint head 11 holds the mold 1 by a vacuum suction force or the like, and drives the mold 1 in the Z direction so that the mold 1 and the imprint material 3 on the substrate are brought into contact with each other or separated. The substrate stage 12 is configured to be movable on the surface plate 16 while holding the substrate 2. Specifically, the substrate stage 12 includes a chuck 12a that holds the substrate 2 by a vacuum suction force or the like, and a moving unit 12b that mechanically holds the chuck 12a and moves on the surface plate 16 in the XY directions. sell. The curing unit 13 cures the imprint material 3 by irradiating the imprint material 3 with light (for example, ultraviolet rays) while the mold 1 and the imprint material 3 on the substrate are in contact with each other. The measuring unit 14 detects a mark provided on the mold 1 and a mark provided on the substrate 2, and measures a relative position between the pattern region 1 a of the mold 1 and the shot region of the substrate 2. The supply unit 15 supplies (discharges) the imprint material accommodated in the tank 15a onto the substrate.

  In the processing unit 10, the imprint head 11, the substrate stage 12, the curing unit 13, the measurement unit 14, and the supply unit 15 are accommodated in the chamber 17, and the control unit 40 controls the internal temperature of the chamber 17 (processing unit). 10 internal temperature) is controlled. For example, the processing unit 10 adjusts the internal temperature of the chamber 17 by supplying temperature sensors 18 a and 18 b (second temperature sensor) that detect the internal temperature of the chamber 17 and the temperature-controlled gas to the inside of the chamber 17. Temperature control units 19a and 19b. And the control part 40 controls the temperature control part 19a so that the internal temperature of the chamber 17 may become target temperature based on the detection result of the temperature sensor 18a. Similarly, the control unit 40 controls the temperature adjustment unit 19b based on the detection result of the temperature sensor 18b so that the internal temperature of the chamber 17 becomes the target temperature.

  In such a processing unit 10, in order to accurately form the pattern of the mold 1 on the imprint material 3 on the substrate, it is preferable to control the internal temperature of the chamber 17 with high accuracy. For example, when a silicon wafer is used as the substrate 2, since the linear expansion coefficient of the silicon wafer is 2.6 μm / mK, when the temperature of the substrate 2 changes by 0.01 ° C., the wafer having a diameter of 300 mm is heated by 7.8 nm. Will be transformed. In recent years when accuracy of several nanometers is required in the wafer process, even if such a minute thermal deformation of the substrate occurs, the required accuracy in forming a pattern on the substrate may not be satisfied. Therefore, in the processing unit 10, for example, highly accurate temperature sensors having a resolution of about 0.01 ° C. can be used as the temperature sensors 18a and 18b.

  However, a high-accuracy temperature sensor with a resolution of about 0.01 ° C. may cause a change with time of about 0.01 ° C./year, and this change with time may be different for each temperature sensor. That is, in the cluster-type imprint apparatus 100 having the plurality of processing units 10, the temporal change of the temperature sensor differs between the plurality of processing units, and the internal temperature differs among the plurality of processing units. Thus, when a difference in internal temperature occurs between a plurality of processing units, a difference occurs in the thermal deformation of the substrate due to the difference in internal temperature, and the pattern formation accuracy on the substrate differs among the plurality of processing units. In addition, it is complicated to calibrate the temperature sensors in each of the plurality of processing units 10 because the number of temperature sensors is large, and it is necessary to stop the imprint process when calibrating the temperature sensors. Can also be disadvantageous. Therefore, the transport unit 30 in the imprint apparatus 100 according to the present embodiment includes a temperature sensor 34 provided at a portion inserted into the processing unit 10 when the substrate 2 is transported to each of the plurality of processing units 10. . And the control part 40 is based on the detection result of the temperature sensor 34 obtained at the time of the conveyance of the board | substrate 2 by the conveyance part 30, and a some process part is reduced so that the difference of the internal temperature between several process parts may be reduced. Control the internal temperature in each of 10.

  Hereinafter, a method for controlling the internal temperature in each of the plurality of processing units 10 in the imprint apparatus 100 of the present embodiment will be described. Here, based on the detection result of the temperature sensor 34 obtained when the substrate 2 is delivered by the transport unit 30 on the substrate stage 12 arranged at the delivery position of the substrate 2 in the treatment unit, each processing unit An example of controlling the internal temperature of 10 will be described. FIG. 3 is a diagram illustrating a state in which the substrate 2 is transferred onto the substrate stage 12 by the transport unit 30. FIG. 3A is a view of the state seen from above (Z direction), and FIG. 3B is a view of the state seen from the side (−X direction).

  The transport unit 30 causes the hand 31 to hold the substrate 2 that has been pre-processed by the second processing unit 20, and moves the hand 31 along the transport path 32 before the processing unit 10 to transport (load in) the substrate 2. To move. Then, as shown in FIG. 3, the transfer unit 30 inserts the hand 31 holding the substrate 2 into the processing unit 10 (chamber 17), and on the pins 12c protruding from the substrate stage 12 (chuck 12a). Deliver the substrate 2. After the substrate 2 is transferred onto the pins 12c, the substrate stage 12 reduces the protruding amount of the pins 12c from the chuck 12a, and the substrate 2 is brought into contact with the chuck 12a while the substrate 2 and the chuck 12a are in contact with each other. Hold.

  Here, the temperature sensor 34 is provided in the hand 31 as shown in FIG. 3, and the hand 31 is inserted into the processing unit 10 when the substrate 2 is transported to the processing unit 10. The temperature sensor 34 detects the internal temperature of the processing unit 10 (chamber 17). In the example shown in FIG. 3, the temperature sensor 34 is provided in the hand 31. However, the temperature sensor 34 is not limited thereto, and the temperature is set at a portion inserted into the processing unit 10 when the substrate 2 is transported to the processing unit 10. The sensor 34 may be provided. Moreover, since it is preferable that the temperature sensor 34 detects the temperature of the gas supplied from the temperature control part 19 (for example, the temperature control part 19b which spouts a gas in a horizontal direction) of the process part 10, it seems that the said gas hits directly. It is good to be provided in the transport unit 30 (hand 31). Furthermore, the temperature sensor 34 may be provided so as not to contact the substrate 2 because the temperature of the substrate 2 can be detected if it contacts the substrate 2 held by the hand 31. Similarly, it may be provided so as not to contact the substrate stage 12 when the substrate 2 is transferred to the substrate stage 12.

  Thus, the detection of the internal temperature of the processing unit 10 by the temperature sensor 34 provided in the transport unit 30 (hand 31) can be performed when the substrate 2 is transported to each of the plurality of processing units 10. That is, in this embodiment, the internal temperature in each of the plurality of processing units can be detected by the common temperature sensor 34 provided in the hand 31. Thus, the control unit 40 is configured to reduce the difference in internal temperature between the plurality of processing units based on the information indicating the internal temperature of each of the plurality of processing units 10 detected by the temperature sensor 34. The internal temperature in each of the processing units 10 can be controlled. For example, the control unit 40 calibrates the detection results of the temperature sensors 18a and 18b provided in each of the plurality of processing units 10 based on the information, and the plurality of processing units based on the detection results of the calibrated temperature sensors 18a and 18b. The temperature control parts 19a and 19b in each of 10 are controlled. Thereby, the difference of the internal temperature between several process parts can be reduced.

  FIG. 4 is a flowchart illustrating a method for controlling the internal temperature of each processing unit 10 in the imprint apparatus 100 according to the present embodiment. The flowchart shown in FIG. 4 shows the inside of each processing unit 10 based on the detection result of the temperature sensor 34 obtained when the substrate 2 preprocessed by the second processing unit 20 is carried into each processing unit 10. The example which controls temperature is shown. Each process of the flowchart can be controlled by the control unit 40.

  In S <b> 11, the control unit 40 determines a target processing unit 10 (hereinafter, the target processing unit 10) that should transport the substrate 2 that has been preprocessed by the second processing unit 20 among the plurality of processing units 10. . For example, the control unit 40 may determine the target processing unit 10 based on information indicating the status of imprint processing in each of the plurality of processing units 10. In S <b> 12, the control unit 40 controls the transport unit 30 to hold the substrate 2 in the hand 31 and move the hand 31 along the transport path 32 to the front of the target processing unit 10. In S13, the control unit 40 inserts the hand 31 holding the substrate 2 into the target processing unit 10 and carries the substrate 2 into the target processing unit 10 (for example, the substrate 2 on the substrate stage). The transport unit 30 is controlled so that it is delivered. In S <b> 14, the control unit 40 controls the transport unit 30 to extract the hand 31 from the target processing unit 10.

  In S15, the control unit 40 obtains the detection result of the internal temperature of the target processing unit 10 obtained from the temperature sensor 34 of the hand 31 during the step S13 and the temperature sensor 18 of the target processing unit 10 during the step S13. The detection result of the internal temperature of the target processing unit 10 is acquired. And the difference (temperature difference (DELTA) T) of those detection results is calculated | required. In S16, the control unit 40 determines whether or not the temperature difference ΔT obtained in S15 is equal to or greater than a threshold value. If the temperature difference ΔT is greater than or equal to the threshold, the process proceeds to S17, and if the temperature difference ΔT is smaller than the threshold, the process proceeds to S18.

  In S <b> 17, the control unit 40 switches the temperature sensor 18 of the target processing unit 10 so that the detection result of the temperature sensor 18 of the target processing unit 10 approaches the detection result of the temperature sensor 34 of the hand 31 based on the temperature difference ΔT. Calibrate. In S <b> 18, the control unit 40 determines whether there is a new substrate 2 (next substrate) that has been preprocessed by the second processing unit 20. If there is a next substrate, the process returns to S11. In this case, since the next substrate can be transported to another processing unit 10, steps S <b> 11 to S <b> 17 can be performed on the other processing unit 10. Therefore, the control unit 40 can calibrate the temperature sensor 18 provided in each of the plurality of processing units 10 by using the temperature sensor 34 provided in the hand 31 in common. Thereby, the control part 40 can control the internal temperature in each of the some process part 10 so that the difference of the internal temperature between several process parts may reduce.

  As described above, the imprint apparatus 100 according to the present embodiment uses the temperature sensor 34 provided in the hand 31 of the transport unit 30 when the substrate 2 is transported to each of the plurality of process units 10. The internal temperature in each of these is detected. And based on the information which shows the internal temperature in each of the some processing part 10 detected by the temperature sensor 34, each of the some processing part 10 is reduced so that the difference of the internal temperature between several processing parts may be reduced. Control the internal temperature at. Thereby, the difference of the pattern formation accuracy resulting from the difference of the internal temperature between several process parts can be reduced.

  Further, since the temperature sensor 34 of the transport unit 30 (hand 31) also changes with time, periodic calibration is required. However, the number of the temperature sensors 34 of the transport unit 30 is equal to the temperature sensors 18 in the plurality of processing units 10. Therefore, the time required for calibration can be shortened. That is, the time for stopping the imprint process for calibrating the temperature sensor can be shortened, which can be advantageous in terms of productivity.

  Here, in the present embodiment, an example in which the internal temperature in each of the plurality of processing units 10 is controlled based on the detection result of the temperature sensor 34 obtained when the substrate 2 is carried into each of the plurality of processing units 10. explained. However, the present invention is not limited thereto, and the internal temperature in each of the plurality of processing units 10 is controlled based on the detection result of the temperature sensor 34 obtained when the substrate 2 is unloaded from each of the plurality of processing units 10. Also good. That is, “when the substrate is transported” may include at least one of when the substrate is loaded and when the substrate is unloaded.

Second Embodiment
An imprint apparatus according to a second embodiment of the present invention will be described. The apparatus configuration of the imprint apparatus according to the second embodiment is the same as that of the imprint apparatus 100 according to the first embodiment. In the second embodiment, the control unit 40 controls the temperature adjustment unit 33 so that the temperature of the conveyance path 32 becomes the target temperature based on the detection result of the temperature sensor 34 during the movement of the hand 31 along the conveyance path 32. Control (control the temperature of the conveyance path 32). For example, the target temperature of the transport path 32 is preferably set to be the same as the target temperature of the internal temperature in each of the plurality of processing units 10. Thus, by controlling the internal temperature in each of the plurality of processing units 10 and the temperature of the conveyance path 32 based on the detection result by the common temperature sensor 34, the difference between the internal temperature and the temperature of the conveyance path 32 is achieved. Can be reduced. That is, the thermal deformation of the substrate 2 caused by the temperature difference between the transport path 32 and the inside of each processing unit 10 can be reduced.

<Third Embodiment>
A third embodiment according to the present invention will be described. FIG. 5 is a diagram showing an imprint apparatus 300 according to the third embodiment, and is the same as the imprint apparatus 100 (FIG. 1) according to the first embodiment except for the configuration of the transport unit 30. In the imprint apparatus 300 according to the third embodiment, the conveyance path 32 is divided into a plurality of regions, and a temperature control unit 33 is provided for each of the plurality of regions. In the example shown in FIG. 5, the conveyance path 32 is divided into three regions 32a to 32c. A temperature adjustment unit 33a that adjusts the temperature of the region 32a, a temperature adjustment unit 33b that adjusts the temperature of the region 32b, and a region 32c. A temperature adjustment unit 33c for adjusting the temperature is provided.

  Based on the detection result of the temperature sensor 34 during the movement of the hand 31 along the transport path 32, the controller 40 adjusts each temperature adjustment section 33a so that the temperature of each of the regions 32a to 32c in the transport path 32 becomes the target temperature. Control ~ 33c. Specifically, the control unit 40 controls the temperature adjustment unit so that the temperature of the region 32a becomes the target temperature based on the detection result of the temperature sensor 34 when the hand 31 is moving in the region 32a of the conveyance path 32. 33a is controlled. Similarly, the control unit 40 sets the temperature of the region 32b (region 32c) to the target temperature based on the detection result of the temperature sensor 34 when the hand 31 is moving in the region 32b (region 32c) of the transport path 32. The temperature adjustment unit 33b (temperature adjustment unit 33c) is controlled so as to be. In this way, by individually controlling the temperature of each of the plurality of regions in the transport path 32, the temperature of the transport path 32 can be accurately controlled.

<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is suitable, for example, for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to the present embodiment includes a step of forming a pattern on the imprint material applied to the substrate using the above-described imprint apparatus (a step of performing imprint processing on the substrate), and a pattern is formed by such a step. And processing the processed substrate. Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles, or temporarily when various articles are manufactured. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

  Next, a specific method for manufacturing an article will be described. As shown in FIG. 6A, a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared, and subsequently, the substrate 1z is formed on the surface of the workpiece 2z by an inkjet method or the like. A printing material 3z is applied. Here, a state is shown in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate.

  As shown in FIG. 6B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side with the concave / convex pattern formed thereon. As shown in FIG.6 (c), the board | substrate 1z with which the imprint material 3z was provided, and the type | mold 4z are made to contact, and a pressure is applied. The imprint material 3z is filled in a gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated as energy for curing through the mold 4z, the imprint material 3z is cured.

  As shown in FIG. 6D, after the imprint material 3z is cured, when the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. This cured product pattern has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product, and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave / convex pattern of the die 4z is transferred to the imprint material 3z. It will be done.

  As shown in FIG. 6 (e), when etching is performed using the pattern of the cured product as an etching resistant mask, a portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the grooves 5z and Become. As shown in FIG. 6F, when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, a film for interlayer insulation contained in a semiconductor element or the like, that is, a constituent member of an article without being removed after processing.

  As mentioned above, although preferred embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

10: processing section, 20: second processing section, 30: transport section, 31: hand, 32: transport path, 33: temperature control section, 34: temperature sensor, 40: control section, 100: imprint apparatus

Claims (9)

A plurality of processing units each performing a process of forming a pattern on the substrate;
A transport unit that transports a substrate to each of the plurality of processing units;
A control unit for controlling an internal temperature in each of the plurality of processing units;
Including
The transport unit includes a temperature sensor provided in a portion inserted into the processing unit when the substrate is transported to each of the plurality of processing units,
The control unit is configured to reduce the difference in internal temperature between the plurality of processing units based on a detection result of the temperature sensor obtained when the substrate is transported by the transport unit. A lithographic apparatus, characterized in that the internal temperature in each is controlled. Each of the plurality of processing units includes a temperature adjustment unit that adjusts the internal temperature,
The control unit controls the temperature control unit in each of the plurality of processing units based on a detection result of the temperature sensor obtained when the substrate is transported by the transport unit. A lithographic apparatus according to claim 1. Each of the plurality of processing units includes a second temperature sensor that detects an internal temperature,
The control unit is configured to detect the plurality of temperature sensors based on the detection result of the second temperature sensor calibrated by the detection result of the temperature sensor obtained when the substrate is transferred to each of the plurality of processing units by the transfer unit. The lithographic apparatus according to claim 2, wherein the temperature control unit in each of the processing units is controlled. The transport unit has a hand for holding a substrate,
The lithographic apparatus according to claim 1, wherein the temperature sensor is provided in the hand.   The lithographic apparatus according to claim 4, wherein the temperature sensor is provided in the hand so as not to contact a substrate held by the hand. The transport unit includes a transport path for transporting a substrate to each of the plurality of processing units,
The lithographic apparatus according to claim 1, wherein the control unit controls the temperature of the conveyance path based on a detection result of the temperature sensor. The transport path is divided into a plurality of regions,
The lithographic apparatus according to claim 6, wherein the control unit controls the temperature of each of the plurality of regions in the transport path based on a detection result of the temperature sensor. A second processing unit for pre-processing the substrate;
The lithographic apparatus according to claim 1, wherein the transport unit transports a substrate from the second processing unit to each of the plurality of processing units. A forming step of forming a pattern on the substrate using the lithography apparatus according to claim 1;
A processing step of processing the substrate on which the pattern is formed in the forming step;
Including
A method for manufacturing an article, wherein the article is manufactured from the substrate processed in the processing step.

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