JP2017208450A - Lithographic apparatus and article manufacturing method - Google Patents

Abstract

An advantageous technique for accurately transporting a substrate onto a stage is provided. A lithographic apparatus for forming a pattern on a substrate includes: a first structure provided with a stage for holding the substrate; and a second structure provided with a transfer unit for holding the substrate and transferring it onto the stage. A detection unit that detects a distance to the surface of the substrate that is supported by the first structure and held by the transfer unit, and a substrate that is held by the transfer unit based on a detection result of the detection unit, A calibration unit that obtains a relative position and a relative inclination with respect to the stage and calibrates the relative position and the relative inclination. [Selection] Figure 1

Description

  The present invention relates to a lithographic apparatus and a method for manufacturing an article.

  In the lithographic apparatus, even while the pattern is formed on the substrate held by the stage, the transport unit that transports the substrate to the stage can operate, for example, for preparing the substrate on which the pattern is to be formed next. In this case, if the vibration generated in the transport unit is transmitted to the stage, it may be difficult to form the pattern on the substrate with high accuracy. Therefore, in the lithography apparatus, it is preferable that the stage and the transport unit are provided in different structures.

  However, if the stage and the transfer unit are provided in different structures, the relative position and inclination of the first structure provided with the stage and the second structure provided with the transfer unit will increase with time. Can change (change over time can occur). As a result, it may be difficult to accurately place the substrate on the stage by the transport unit, or the substrate may come into contact with the stage during transport of the substrate by the transport unit. In Patent Document 1, a detection unit that detects the distance between the first structure and the second structure is provided, and the relative relationship between the first structure and the second structure is determined based on the detection result of the detection unit. A method for calibrating the general position and inclination has been proposed.

JP-A-6-163357

  In the imprint apparatus, not only the relative position and inclination of the first structure and the second structure, but also a change with time may occur in the position of the transport unit with respect to the second structure, for example. In this case, in the method described in Patent Document 1, it is insufficient to calibrate the relative position and relative inclination between the substrate and the stage held by the transport unit, and the substrate is transported on the stage with high accuracy by the transport unit. Can be difficult.

  Therefore, an object of the present invention is to provide an advantageous technique for accurately transporting a substrate onto a stage.

  In order to achieve the above object, a lithographic apparatus according to one aspect of the present invention is a lithographic apparatus that forms a pattern on a substrate, the first structure provided with a stage that holds the substrate, and a substrate holding the substrate. And a detection unit for detecting a distance to the surface of the substrate supported by the first structure and held by the transfer unit, and the detection A calibration unit that calculates a relative position and a relative tilt between the substrate held by the transport unit and the stage based on a detection result of the unit, and calibrates the relative position and the relative tilt. .

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, an advantageous technique for accurately transporting a substrate onto a stage can be provided.

It is a figure which shows the imprint apparatus of 1st Embodiment. It is a figure which shows the imprint apparatus when the relative position and relative inclination of a 1st structure and a 2nd structure have changed. It is a flowchart which shows the method of calibrating the relative position and relative inclination of the board | substrate and stage which were hold | maintained by the conveyance part. It is a figure which shows the positional relationship of a detection part and a board | substrate. It is a figure which shows the positional relationship of a detection part and a board | substrate. It is a figure which shows the positional relationship of a detection part and a board | substrate. It is the figure which looked at the imprint apparatus of 2nd Embodiment from the top. It is a figure which shows the imprint apparatus of 2nd Embodiment. It is a figure which shows the positional relationship of a 1st structure and a 2nd structure. It is a figure which shows the positional relationship of a 1st structure and a 2nd structure. It is a figure which shows the manufacturing method of articles | goods.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member thru | or element, and the overlapping description is abbreviate | omitted. In the following embodiments, the lithographic apparatus will be described using an imprint apparatus that forms a pattern on an imprint material on a substrate using a mold, but is not limited thereto. For example, the present invention can also be applied to lithography apparatuses such as an exposure apparatus that transfers a mask pattern onto a substrate and a drawing apparatus that irradiates a substrate with a charged particle beam to form a pattern on the substrate.

<First Embodiment>
An imprint apparatus 100 according to the first embodiment of the present invention will be described. The imprint apparatus is an apparatus that forms a cured product pattern in which the concave / convex pattern of the mold is transferred by bringing the imprint material supplied on the substrate into contact with the mold and applying energy for curing to the imprint material. It is. The imprint apparatus is used for manufacturing a semiconductor device or the like, and performs an imprint process for transferring the pattern onto an imprint material supplied on a shot region of a substrate, using a mold in which an uneven pattern is formed. For example, the imprint apparatus cures the imprint material in a state where the mold on which the pattern is formed is in contact with the imprint material on the substrate. The imprint apparatus can form a pattern on the imprint material by widening the gap between the mold and the substrate and peeling (releasing) the mold from the cured imprint material.

  Methods for curing the imprint material include a thermal cycle method using heat and a photocuring method using light. In this embodiment, an example in which the photocuring method is employed will be described. In the photocuring method, an uncured ultraviolet curable resin is supplied onto a substrate as an imprint material, and the imprint material is irradiated with light (ultraviolet light) in a state where the mold and the imprint material are in contact with each other. This is a method of curing a printing material.

  As the imprint material, a curable composition (also referred to as an uncured resin) that cures when given energy for curing is used. As the energy for curing, electromagnetic waves, heat, or the like is used. The electromagnetic wave is, for example, light such as infrared light, visible light, or ultraviolet light whose wavelength is selected from a range of 10 nm to 1 mm.

  A curable composition is a composition which hardens | cures by irradiation of light or by heating. Among these, the photocurable composition cured by light contains at least a polysynthetic compound and a photopolymerization initiator, and may contain a non-polysynthetic compound or a solvent as necessary. The non-polysynthetic compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

  The imprint material is applied in a film form on the substrate by a spin coater or a slit coater. Alternatively, the liquid ejecting head may be applied on the substrate in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets. The imprint material has a viscosity (viscosity at 25 ° C.) of, for example, 1 mPa · s or more and 100 mPa · s or less.

[Device configuration]
The configuration of the imprint apparatus 100 according to the first embodiment will be described with reference to FIG. FIG. 1 is a schematic diagram illustrating an imprint apparatus 100 according to the first embodiment. The imprint apparatus 100 includes the first structure 10 installed on the first floor 40a via the support unit 30 and the second structure 20 installed on the second floor 40b. Here, in this embodiment, the first floor 40a on which the first structure 10 is installed and the first floor 40a and the first structure 10 are described in order to easily understand the change over time of the relative position and the relative inclination between the first structure 10 and the second structure 20. The second floor 40b to which the two structures 20 are fixed is shown separately. However, in practice, the first floor 40a and the second floor 40b may be one continuous floor.

  First, the first structure 10 will be described. The first structure 10 includes, for example, an imprint head 11 that holds the mold 1, a stage 12 that holds the substrate 2, an irradiation unit 13 that irradiates the substrate 2 held by the stage 12 through the mold 1, A detection unit 14 and a control unit 15 can be provided. The first structure 10 can be fixed to the first floor via the support part 30.

  The mold 1 is usually made of a material that can transmit ultraviolet rays such as quartz, and an imprint material supplied on the substrate is formed in a partial region (pattern region) on the substrate side surface. An uneven pattern is formed for this purpose. Moreover, glass, ceramics, metal, semiconductor, resin, etc. are used as the board | substrate 2, and the member which consists of a material different from a board | substrate may be formed in the surface as needed. Specifically, the substrate 2 is a silicon wafer, a compound semiconductor wafer, quartz glass, or the like. Further, before applying the imprint material, an adhesion layer may be provided to improve the adhesion between the imprint material and the substrate, if necessary.

  The imprint head 11 holds the mold 1 by, for example, vacuum adsorption force or electrostatic force, and moves the mold 1 in the Z direction (imprint direction) so that the mold 1 and the imprint material on the substrate are brought into contact with each other or separated. To drive. The imprint head 11 corrects not only the function of driving the mold 1 in the Z direction but also the adjustment function of adjusting the position of the mold 1 in the XY direction and θ direction (rotation direction around the Z axis) and the inclination of the mold 1. It may have a tilt function or the like.

  The stage 12 is configured to hold the substrate 2 by, for example, a vacuum suction force or an electrostatic force and to be movable in the XY direction (direction perpendicular to the stamping direction). The stage 12 not only has a function of moving the substrate 2 in the XY direction, but also has a function of moving the substrate 2 in the Z direction, an adjustment function of adjusting the position of the substrate 2 in the θ direction, and a correction for the inclination of the substrate 2. It may have a tilt function. Further, the stage 12 has a pin 12a that can protrude from a surface (holding surface) that holds the substrate 2, and the pin 12a protrudes from the holding surface when the substrate 2 is transferred from the transfer unit 21 described later onto the stage. Let And when the board | substrate 2 is delivered on the said pin 12a by the conveyance part 21, the stage 12 reduces the protrusion amount of the pin 12a from a holding surface. Accordingly, the substrate 2 is disposed on the holding surface of the stage 12 and is held by the stage 12.

  The irradiation unit 13 includes a light source that emits light (ultraviolet light) for curing the imprint material, and the imprint material is in contact with the imprint material on the substrate during the imprint process. The imprint material is cured by irradiating the material with light. The control unit 15 includes, for example, a CPU, a memory, and the like, and controls a process of transferring the substrate 2 onto the stage and an imprint process by the transfer unit 21 (controls each part of the imprint apparatus 100). Here, in the present embodiment, the control unit 15 is provided in the first structure 10, but is not limited thereto, and may be provided in, for example, the second structure 20 or other structures. It may be placed on the floor.

  The support unit 30 can include, for example, a base surface plate 31, a vibration isolation mount 32, and a change unit 33. A plurality of vibration isolation mounts 32 are disposed between the first structure 10 and the base surface plate 31 to reduce the transmission of vibrations from the first floor 40a to the first structure 10, and at the first structure 10. It is configured to reduce resonance caused by the generated vibration. The changing unit 33 includes a plurality of actuators arranged between the base surface plate 31 and the first floor 40a, and controls the position and inclination of the first structure 10 by individually controlling the plurality of actuators. To change. Thereby, the changing unit 33 can change the relative position and the relative inclination between the first structure 10 and the second structure 20.

  Here, in this embodiment, although the change part 33 is provided between the 1st structure 10 and the 1st floor 40a, it is not restricted to it, For example, the 2nd structure 20 and the 2nd It may be provided between the floor 40b. That is, the changing unit 33 may be provided so that the relative position and the relative inclination between the first structure 10 and the second structure 20 can be changed. In addition, when the position and inclination of the first structure 10 can be changed by the vibration isolation mount 32, the vibration isolation mount 32 also changes the relative position and inclination of the first structure 10 and the second structure 20. It can function as the changing unit 33 for changing.

  Next, the second structure 20 will be described. The second structure 20 may be provided with a transport unit 21 that holds the substrate 2 and transports the substrate 2 onto the stage. The transport unit 21 includes, for example, a hand 21a that holds the substrate 2 by vacuum suction or the like, an arm 21b that supports the hand 21a and has a plurality of joints, and a drive unit 21c that drives the hand 21a via the arm 21b. Have. The transport unit 21 is, for example, a substrate 2 on a stage 12 provided in the first structure 10 from a slot that accommodates a plurality of substrates 2 or a pre-alignment unit that detects the center or notch of the substrate 2. Transport. Further, the transport unit 21 is configured to move the substrate 2 in a direction parallel to the surface of the substrate 2 held by the hand 21a.

  In the imprint apparatus 100 configured as described above, the relative position and the relative inclination between the first structure 10 provided with the stage 12 and the second structure 20 provided with the transport unit 21 change over time. (A change with time may occur.) For example, after installing the imprint apparatus 100 (on the floor), if another apparatus is installed around the imprint apparatus 100, the floor may sink. In this case, if the subsidence amount of the floor is different between the first floor 40a where the first structure 10 is arranged and the second floor 40b where the second structure 20 is arranged, as shown in FIG. The relative position and the relative inclination between the first structure 10 and the second structure 20 can change.

  FIG. 2 is a diagram illustrating the imprint apparatus 100 when a change in the relative position and the relative inclination between the first structure 10 and the second structure 20 occurs over time. FIG. 2 shows an example in which the first floor 40a sinks in the −Z direction from the original position 40a ′ indicated by the broken line, and accordingly, the second floor 40b is inclined from the original position 40b ′ indicated by the broken line. ing. In this case, the relative position and relative tilt between the substrate 2 and the stage 12 held by the transport unit 21 (hand 21a) also change from the ideal state (target relative position and target relative tilt). As a result, it is difficult for the transport unit 21 to accurately place the substrate 2 on the stage, or the substrate 2 is in contact with the stage 12 (pin 12a) while the transport unit 21 is transporting the substrate 2. Can occur. Therefore, in the imprint apparatus 100, it is preferable to calibrate the relative position and relative inclination between the substrate 2 and the stage 12 held by the transport unit 21.

  Therefore, the imprint apparatus 100 according to the first embodiment includes a detection unit 14 and a calibration unit, and calibrates the relative position and relative inclination between the substrate 2 and the stage 12 held by the transport unit 21. The detection unit 14 is supported by the first structure 10 and is a distance to the surface of the substrate 2 held by the transport unit 21 (hand 21a), specifically, a portion of the surface of the substrate 2 that is within the detection region. Can be configured to detect the distance to. The detection unit 14 may include, for example, a laser interferometer that emits light (laser light) and detects a distance to a portion of the surface of the substrate 2 irradiated with light as a detection region. However, the present invention is not limited to this, and may be configured to include a non-contact type sensor that detects a distance to a place within the detection region on the surface of the substrate 2 without using light, such as a capacitance sensor. The calibration unit obtains the relative position and relative tilt between the substrate 2 held by the transport unit 21 and the stage 12 based on the detection result of the detection unit 14, and calibrates the relative position and relative tilt. In the present embodiment, a description will be given assuming that the calibration unit is included in the control unit 15.

[Calibration method]
Hereinafter, a method for calibrating the relative position and relative tilt between the substrate 2 and the stage 12 held by the transport unit 21 will be described with reference to FIG. FIG. 3 is a flowchart illustrating a method of calibrating the relative position and the relative inclination between the substrate 2 held by the transport unit 21 and the stage 12. Each step of the flowchart shown in FIG. 3 can be controlled by the control unit 15 (calibration unit). Hereinafter, the substrate 2 held by the transport unit 21 is referred to as “substrate 2 on the transport unit”.

  Here, the calibration of the relative position and the relative inclination between the substrate 2 on the transport unit and the stage 12 is periodically performed, for example, every substrate, every lot, every predetermined period (every day, every month, etc.). Is preferred. Hereinafter, an example in which the distance is detected by the detection unit 14 at one location on the surface of the substrate 2 on the transport unit will be described. For example, the distance by the detection unit 14 at a plurality of locations on the surface of the substrate. May be detected. In this case, as a detection result of the detection unit 14, for example, an average value of the results detected at the plurality of locations can be used. Thus, by using the results detected at a plurality of locations, errors due to the flatness (unevenness) of the surface of the substrate 2 can be reduced.

  In S <b> 10, the control unit 15 causes the transport unit 21 to start transporting the substrate 2 onto the stage. And the control part 15 is preset so that the predetermined location (for example, center) of the surface of the board | substrate 2 may be arrange | positioned in the detection area | region (area | region where the light inject | emitted from the detection part 14 is irradiated) of the detection part 14. FIG. The transport unit 21 (drive unit 21c) is controlled according to the transport path (transport profile). In S11, the control unit 15 causes the detection unit 14 to detect the distance to the surface (predetermined location) of the substrate 2 on the transport unit. Hereinafter, the state of relative inclination between the substrate 2 on the transport unit and the detection unit 14 when the detection by the detection unit 14 is performed in S11 is referred to as an initial state.

  In S12, the control unit 15 determines whether or not the distance detected by the detection unit 14 in S11 is within an allowable range (allowable range of the target distance). If the distance detected by the detection unit 14 is within the allowable range, the process proceeds to S24, and the control unit 15 does not calibrate the relative position and relative inclination between the substrate 2 and the stage 12 on the conveyance unit, and the conveyance unit. 21 transfers the substrate 2 onto the stage. On the other hand, when the distance detected by the detection unit 14 is not within the allowable range, the process proceeds to S13 and the calibration is performed.

  Here, the reason for determining whether to perform calibration according to the distance detected by the detection unit 14 will be described. For example, the substrate 2 on the transport unit when the relative position (Z direction) and relative tilt between the substrate 2 on the transport unit and the stage 12 are in an ideal state (target relative position and target relative tilt) is detected by the detection unit 14. On the other hand, it shall be arrange | positioned in the position 2a shown in FIG. Then, for example, when the relative position and the relative inclination between the first structure 10 and the second structure 20 change with time, the substrate 2 on the transport unit is positioned at the position 2b shown in FIG. It is assumed that they are arranged in In this case, an error ΔZ can occur in the distance detected by the detection unit 14 with respect to the ideal position 2a (target distance). Therefore, when the distance detected by the detection unit 14 is not within the allowable range, the control unit 15 determines that the relative position and relative inclination between the substrate 2 and the stage 12 on the transport unit are deviated from the ideal state. Can do. It should be noted that the situation where the error ΔZ does not occur and only the inclination of the substrate 2 on the transport unit is deviated from the ideal state is very rare.

  Returning to the flowchart of FIG. 3, steps S13 to S21 will be described. Steps S13 to S21 are steps for obtaining a relative inclination between the substrate 2 on the transport unit and the stage 12. The transport unit 21 of the present embodiment is configured to move the substrate 2 in a direction parallel to the surface of the substrate 2 with the second structure 20 as a reference. Accordingly, even if the substrate 2 is moved with respect to the detection unit 14 by the transport unit 21, the substrate 2 only moves as indicated by the arrows shown in FIG. The position (Z direction) does not change. Therefore, in the method of passing the substrate through the detection region of the detection unit 14, the relative inclination between the substrate 2 on the transport unit and the stage 12 cannot be obtained.

  Therefore, the control unit 15 of the present embodiment is based on the change in the distance detected by the detection unit 14 when the relative inclination between the substrate 2 on the transport unit and the detection unit 14 is changed in the steps S13 to S21. Thus, the relative inclination between the substrate 2 on the transport unit and the detection unit 14 is obtained. The control unit 15 can obtain in advance information indicating the positional relationship between the detection unit 14 and the stage 12 supported together by the first structure 10. Therefore, the relative tilt between the substrate 2 on the transport unit and the stage 12 can be obtained based on the information and the relative tilt between the substrate 2 on the transport unit and the detection unit 14.

  In S13, the control unit 15 relatively tilts the substrate 2 on the transport unit and the detection unit 14 based on whether or not the distance detected by the detection unit 14 in S11 is shorter than the target distance. Predict direction (relative slope trend). For example, when the distance detected by the detection unit 14 is longer than the target distance, the control unit 15 causes the substrate 2 on the transport unit to move to the opposite end from the end on the stage side, as shown in FIG. Predict that the part is inclined to be higher. On the other hand, when the distance detected by the detection unit 14 is shorter than the target distance, the control unit 15 causes the substrate 2 on the transport unit to be lower at the opposite end than the end on the stage side. Predict that it is leaning to. Here, in the determination based on whether or not the distance detected by the detection unit 14 is shorter than the target distance, it is difficult to accurately predict the tendency of the relative inclination between the substrate 2 on the transport unit and the detection unit 14. is there. That is, it can be said that the process of S13 only arbitrarily determines the direction in which the substrate 2 on the transport unit and the detection unit 14 are relatively inclined in the following process of S14. In step S13, the control unit 15 determines the substrate 2 on the transport unit based on the distance from the tip of the hand 21a to the connecting portion between the arm 21b and the drive unit 21c and the distance detected by the detection unit 14. And the relative inclination between the detector 14 and the detector 14 may be predicted (calculated).

  In S14, the control unit 15 changes the relative tilt between the substrate 2 on the transport unit and the detection unit 14 from the initial state based on the tendency of the relative tilt predicted in S13. For example, as illustrated in FIG. 6, the control unit 15 tilts the first structural body 10 by the changing unit 33 based on the tendency of the relative inclination predicted in S <b> 13, so that the substrate 2 and the detection unit 14 on the transport unit. The relative inclination is changed from the initial state so as to reduce the relative inclination. In S15, the control unit 15 causes the detection unit 14 to detect the distance to the surface of the substrate 2 on the transport unit.

  In S16, the control unit 15 determines whether or not the distance detected by the detection unit 14 in S15 is shorter than the distance detected by the detection unit 14 in S11. For example, as shown in FIG. 6, it is assumed that the distance L ′ detected in S15 is shorter than the distance L detected in S11. In this case, the control unit 15 calibrates the relative inclination between the substrate 2 on the transport unit and the stage 12 in the direction in which the substrate 2 on the transport unit and the detection unit 14 are relatively inclined in S14 (first direction). It is determined that the direction is correct, and the process proceeds to S20. On the other hand, when the distance detected in S15 is not shortened (when the distance is long), the control unit correctly sets the first direction as the direction for calibrating the relative inclination between the substrate 2 on the transport unit and the stage. If it is not determined, the process proceeds to S17.

  In S17, the control unit 15 returns the relative tilt between the substrate 2 on the transport unit and the detection unit 14 to the initial state, and changes the relative tilt in the direction opposite to the first direction (second direction). In S18, the control unit 15 causes the detection unit 14 to detect the distance to the surface of the substrate 2 on the transport unit. In S19, the control unit 15 determines whether or not the distance detected by the detection unit 14 in S18 is shorter than the distance detected by the detection unit 14 in S11. When the distance detected in S18 is shorter than the distance detected in S11, the control unit 15 determines that the second direction is correct as a direction for calibrating the relative inclination between the substrate 2 on the transport unit and the stage. Then, the process proceeds to S20. On the other hand, when the distance detected in S18 is not shorter than the distance detected in S11 (when the distance becomes longer), the second direction calibrates the relative inclination between the substrate 2 on the transport unit and the stage. Judging that the direction is not correct. In this case, there is no change over time in the relative tilt between the substrate 2 on the transfer unit and the stage 12, and there is a change over time only in the relative position (Z direction) between the substrate 2 on the transfer unit and the stage. It becomes. Therefore, in this case, the process proceeds to S23.

  In S <b> 20, the control unit 15 obtains the relative inclination between the substrate 2 on the transport unit and the detection unit 14. For example, the control unit 15 determines that the substrate 2 on the transport unit and the detection unit 14 are in the direction (first direction or second direction) that is determined to be correct as the direction for correcting the relative tilt between the substrate 2 on the transport unit and the stage. The detection unit 14 performs detection while changing the relative inclination of the. At this time, for example, when a laser interferometer is used as the detection unit 14, the distance detected by the detection unit 14 when the optical axis of the light emitted from the laser interferometer and the surface of the substrate 2 are perpendicular to each other. Is the shortest. Thus, by causing the detection unit 14 to perform detection while changing the relative inclination between the substrate 2 and the detection unit 14, the control unit 15 changes the relative inclination between the substrate 2 and the detection unit 14 on the transport unit. The relationship with the change in the distance detected by the detection unit 14 can be obtained. And the control part 15 can obtain | require the relative inclination of the board | substrate 2 on a conveyance part, and the detection part 14 based on the said relationship.

  In S21, the control unit 15 obtains the relative tilt between the substrate 2 on the transport unit and the stage 12 based on the relative tilt between the substrate 2 on the transport unit and the detection unit 14 obtained in S20. For example, the control unit 15 can obtain information indicating the positional relationship between the detection unit 14 and the stage 12 in advance as described above. Therefore, based on the relative tilt between the substrate 2 on the transport unit and the detection unit 14 determined in S20 and the information, the relative tilt between the substrate 2 on the transport unit and the stage 12 can be determined. Specifically, the relative inclination between the substrate 2 and the detection unit 14 when the distance detected by the detection unit 14 becomes the smallest when the relative inclination between the substrate 2 on the transport unit and the detection unit 14 is changed. Therefore, the relative inclination between the substrate 2 on the transport unit and the stage 12 can be obtained.

  In S22, the control unit 15 causes the first structure 10 and the second structure so that the relative inclination becomes the target relative inclination based on the relative inclination between the substrate 2 on the transport unit and the stage 12 obtained in S21. The changing unit 33 changes the relative inclination with the body 20. In S23, the control unit 15 sets the first position so that the relative position (Z direction) between the substrate 2 and the stage 12 on the transport unit becomes the target relative position based on the distance detected by the detection unit 14 in S11. The changing unit 33 changes the relative position (Z direction) between the structure 10 and the second structure 20. In this manner, the relative position and relative tilt between the substrate 2 on the transport unit and the stage 12 are calibrated. In S <b> 24, the control unit 15 transports the substrate 2 onto the stage by the transport unit 21.

  As described above, the imprint apparatus 100 according to the first embodiment detects the distance to the surface of the substrate 2 on the transport unit by the detection unit 14 supported by the first structure 10, and based on the detection result. The relative position and relative inclination between the substrate 2 and the stage 12 are obtained. Then, based on the relative position and relative inclination between the substrate 2 and the stage 12 on the transport unit thus obtained, calibration is performed so that the relative position and relative inclination become the target relative position and the target relative inclination. Thereby, the board | substrate 2 can be accurately conveyed by the conveyance part 21 on a stage.

  Here, in this embodiment, the relative position between the substrate 2 on the transport unit and the stage 12 is changed by changing the relative position and relative inclination between the first structure 10 and the second structure 20 by the changing unit 33. An example of correcting the relative inclination has been described. However, it is not limited to that. For example, when the angle of the substrate 2 on the transfer unit can be changed by the transfer unit 21 itself, the transfer unit 21 calibrates the relative position and relative inclination between the substrate 2 on the transfer unit and the stage 12. May be. That is, the control unit 15 may perform the calibration by changing the angle at which the transport unit 21 holds the substrate 2. Moreover, in this embodiment, the distance to the surface of the board | substrate 2 hold | maintained by the conveyance part 21 (hand 21a) is detected by the detection part 14, and based on the detection result, the relative position of the said board | substrate 2 and the stage 12 is detected. Although the relative inclination was calibrated, it is not limited to this. For example, the distance to the hand 21a not holding the substrate 2 may be detected by the detection unit 14, and the calibration may be performed based on the detection result.

Second Embodiment
An imprint apparatus 200 according to the second embodiment of the present invention will be described. FIG. 7 is a diagram of the imprint apparatus 200 according to the second embodiment viewed from above. As illustrated in FIG. 7, the imprint apparatus 200 according to the second embodiment includes a second structure 20 provided with a transport unit 21 and a plurality of first structures disposed so as to sandwich the second structure 20. 10a to 10d. Each of the plurality of first structures 10a to 10d is provided with an imprint head 11, a stage 12, an irradiation unit 13, and a detection unit 14, and imprint processing can be performed in each of the first structures 10a to 10d.

  FIG. 8 is a view showing a TT cross section in FIG. 7. The first structures 10b and 20d are installed so as to sandwich the second structure 20 therebetween. Thus, when the some 1st structure 10 is installed, the detection result of the detection part 14 in each of the some 1st structure 10 is compared. Thereby, in the process of S13 of the flowchart shown in FIG. 3, the tendency of the relative inclination between the substrate 2 on the transport unit and the detection unit 14 in each of the plurality of first structures 10 can be accurately predicted. That is, it is possible to increase the possibility that the steps S17 to S19 in the flowchart of FIG. 3 are omitted. Here, since the configurations of the first structure 10 and the second structure 20 are the same as those described in the first embodiment, the description thereof is omitted here. Further, in FIG. 8, a hand 21a is provided for each of the first structures 10b and 10d. However, the present invention is not limited to this, and a common hand 21a is provided for the first structures 10b and 10d. Also good.

  For example, it is assumed that the distance detected by the detection unit 14 of the first structure 10b is larger than the target distance, and the distance detected by the detection unit 14 of the first structure 10d is smaller than the target distance. There are two possible states for obtaining such a detection result. In the first state, as shown in FIG. 9A, the first structure 10b and the second structure 20 are inclined toward each other, and the first structure 10d and the second structure 20 are separated from each other. It is in a state inclined to. In the second state, as shown in FIG. 9B, the height of the first structure 10b is shifted in the vertical direction (+ Z direction) with respect to the second structure 20, and the first structure In this state, the height of the body 10d is shifted in the vertical direction (−Z direction) with respect to the second structure 20. However, regarding the second state, it is very rare that the first structure 10 shifts in the vertical direction with respect to the second structure. Therefore, the control unit 15 can predict that the substrate 2 and the detection unit 14 (stage 12) on the transport unit are inclined as illustrated in FIG.

Furthermore, by comparing the error [Delta] Z ₁ and [Delta] Z ₂ with respect to a target distance of distance detected respectively by the detection unit 14 in the first structure 10b and 10d, the relative inclination between the substrate 2 on the transport unit and the detection unit 14 Can be predicted. For example, when the error ΔZ ₁ and the error ΔZ ₂ are the same, the relative inclination between the substrate 2 on the transport unit and the detection unit 14 is generated by the same amount in the opposite direction in the first structures 10b and 10d. Can be predicted. That is, only the relative inclination between the substrate 2 and the detection unit 14 is obtained in one of the first structures 10b and 10d, and the tendency of the relative inclination between the substrate 2 and the detection unit 14 in the other is opposite to the relative inclination in the one. Direction and can be predicted to occur by the same amount.

  Further, for example, a case is assumed where the distances detected by the detection units 14 of the first structures 10b and 10d are both smaller than the target distance. Thus, when the detection result of the detection part 14 shows the same tendency in the 1st structures 10b and 10d, the relative inclination of the board | substrate 2 on the conveyance part and the detection part 14 is shown to Fig.10 (a). A trend can be predicted. On the other hand, it is assumed that the distances detected by the detection units 14 of the first structures 10b and 10d are both greater than the target distance. In this case, it can be predicted that the relative inclination between the substrate 2 on the transport unit and the detection unit 14 has the tendency shown in FIG.

  As described above, in the imprint apparatus 200 according to the second embodiment, the conveyance unit in each of the plurality of first structures is based on the result of comparison of the detection results of the detection unit 14 in each of the plurality of first structures 10. The tendency of the relative inclination between the upper substrate 2 and the detection unit 14 can be predicted. Therefore, by using the method described above in S13 of the flowchart shown in FIG. 3, the shape of the relative inclination between the substrate 2 on the transport unit and the detection unit 14 can be accurately predicted, and steps S17 to S19 are performed. Can be reduced. That is, in the imprint apparatus 200 according to the second embodiment, the relative inclination between the substrate 2 on the transport unit and the stage 12 based on the result of comparing the detection results of the detection unit 14 in each of the plurality of first structures 10. Can be requested. Thereby, the time required for calibration can be significantly reduced.

<Third Embodiment>
In 1st Embodiment and 2nd Embodiment, the example which comprised the detection part 14 so that the distance to one location in the surface of the board | substrate 2 was detected was demonstrated. However, the present invention is not limited to this. For example, the detection unit 14 may be configured to include a plurality of laser interferometers and to simultaneously detect the distance at a plurality of locations on the surface of the substrate 2. By configuring the detection unit 14 in this way, the steps (S12 to S19) of detecting the distance by the detection unit 14 while changing the relative inclination between the substrate 2 on the transport unit and the detection unit 14 are not performed. The relative inclination between the substrate 2 on the transport unit and the stage 12 can be obtained. However, increasing the number of laser interferometers can lead to an increase in device cost. The detection unit 14 may include an angle sensor that detects the inclination (angle) of the substrate 2 on the transport unit.

<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is suitable, for example, for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method of manufacturing an article according to the present embodiment includes a step of forming a pattern on the resin applied to the substrate using the above-described lithography apparatus (imprint apparatus) (a step of performing imprint processing on the substrate), and a pattern is formed in this step. And a step of processing the substrate on which the substrate is formed. Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  The lithography apparatus can include an exposure apparatus and a drawing apparatus in addition to the above-described imprint apparatus. Below, the example which manufactures articles | goods using an imprint apparatus is demonstrated.

  The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles, or temporarily when various articles are manufactured. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

  Next, a specific method for manufacturing an article will be described. As shown in FIG. 11A, a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared, and subsequently, the substrate 1z is formed on the surface of the workpiece 2z by an inkjet method or the like. A printing material 3z is applied. Here, a state is shown in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate.

  As shown in FIG. 11B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the concave / convex pattern is formed facing. As shown in FIG. 11C, the substrate 1 provided with the imprint material 3z is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in a gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated as energy for curing through the mold 4z, the imprint material 3z is cured.

  As shown in FIG. 11D, after the imprint material 3z is cured, when the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. This cured product pattern has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product, and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave / convex pattern of the die 4z is transferred to the imprint material 3z. It will be done.

  As shown in FIG. 11 (e), when etching is performed using the pattern of the cured product as an anti-etching mask, the portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the grooves 5z and Become. As shown in FIG. 11 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, a film for interlayer insulation contained in a semiconductor element or the like, that is, a constituent member of an article without being removed after processing.

  As mentioned above, although preferred embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

10: first structure, 11: imprint head, 12: stage, 13: irradiation unit, 14: detection unit, 15: control unit, 20: second structure, 21: transport unit, 30: support unit, 33 : Change unit, 100: imprint apparatus

Claims (10)

A lithographic apparatus for forming a pattern on a substrate,
A first structure provided with a stage for holding a substrate;
A second structure provided with a transport unit that holds the substrate and transports the substrate onto the stage;
A detection unit for detecting a distance to the surface of the substrate supported by the first structure and held by the transport unit;
Based on the detection result of the detection unit, a calibration unit that calculates the relative position and the relative tilt between the substrate held by the transport unit and the stage, and calibrates the relative position and the relative tilt;
A lithographic apparatus comprising:   The lithographic apparatus according to claim 1, wherein the calibration unit performs the calibration by changing a position and an inclination of the first structure with respect to the second structure.   The lithography apparatus according to claim 1, wherein the calibration unit performs the calibration by changing an angle at which the transport unit holds the substrate.   The calibration unit is configured to change the relative position between the substrate and the stage based on the change in the distance detected by the detection unit when the relative inclination between the substrate held by the transport unit and the detection unit is changed. The lithographic apparatus according to claim 1, wherein an inclination is obtained.   The calibration unit is configured such that when the relative inclination between the substrate held by the transport unit and the detection unit is changed, the distance detected by the detection unit is the smallest between the substrate and the detection unit. The lithographic apparatus according to claim 1, wherein a relative inclination between the substrate and the stage is obtained based on a relative inclination.   The lithographic apparatus according to claim 1, wherein the calibration unit performs the calibration when the distance detected by the detection unit is not within an allowable range. . A plurality of the first structures arranged so as to sandwich the second structure;
The calibration unit is configured to compare the detection result of the detection unit in each of the plurality of first structures with the substrate held by the transport unit and the stage in each of the plurality of first structures. The lithographic apparatus according to claim 1, wherein a relative position and a relative inclination of the lithographic apparatus are obtained.   The lithographic apparatus according to claim 1, wherein the detection unit includes a sensor that detects a distance to a location within the detection region of the substrate.   The lithographic apparatus according to claim 1, wherein the detection unit includes a sensor that detects an angle of the substrate with respect to the detection unit. Forming a pattern on a substrate using the lithographic apparatus according to any one of claims 1 to 9,
Processing the substrate on which the pattern is formed in the step;
A method for producing an article comprising:

Images