JP2018157010A - Semiconductor package placement apparatus, manufacturing apparatus, semiconductor package placement method, and electronic component manufacturing method - Google Patents

Abstract

A semiconductor package is arranged with high accuracy. A semiconductor package placement device (C) has a suction mechanism (14) for sucking a semiconductor package (10) and a first one for imaging a semiconductor package (10) sucked by the suction mechanism (14). 1 for imaging the image pickup element (28), the arrangement member (22) for arranging the semiconductor package (10) adsorbed by the adsorption mechanism (14), and the opening (33) of the arrangement member (22). A second image sensor (27). The suction mechanism (14) is movable in the uniaxial direction, and the second image sensor (27) is attached to the suction mechanism (14). The semiconductor for the opening (33) based on the imaging data of the semiconductor package (10) imaged by the first imaging element (28) and the imaging data of the opening (33) imaged by the second imaging element (27). The semiconductor package (10) is placed on the placement member (22) by aligning the package (10). [Selection] Figure 1

Description

  The present invention relates to a semiconductor package placement apparatus, a manufacturing apparatus, a semiconductor package placement method, and an electronic component manufacturing method.

  For example, Patent Document 1 discloses a method of forming EMI (electromagnetic interference) shielding on a BGA (ball grid array) semiconductor package by sputtering. The method described in Patent Document 1 is performed as follows.

  First, a double-sided adhesive means is installed on a template on which many through holes are formed. Next, the double-sided adhesive means corresponding to the through holes of the template is removed, and a large number of openings are formed in the double-sided adhesive means. Next, a BGA semiconductor package is arranged on the double-sided adhesive means so that the ball electrode is contained in the opening of the double-sided adhesive means. Thereafter, an electromagnetic shielding film, which is a metal film, is formed on the surface of the BGA semiconductor package opposite to the ball electrode side by sputtering.

Korean Patent No. 10-1590593

  However, in the method described in Patent Document 1, when the ball electrode does not fit in the opening of the double-sided adhesive means and the ball electrode runs on the double-sided adhesive means or on the template, the metal particles are formed on the BGA semiconductor package during sputtering. In some cases, product defects occurred around the ball electrode. For this reason, it is required to arrange the BGA semiconductor package with high accuracy on the double-sided bonding means, but Patent Document 1 does not disclose any technique for arranging the BGA semiconductor package with high accuracy.

  According to the embodiments disclosed herein, an adsorption mechanism for adsorbing a semiconductor package, a first image sensor for imaging a semiconductor package adsorbed by the adsorption mechanism, and a semiconductor package adsorbed by the adsorption mechanism And a second image sensor for imaging the opening of the arrangement member, the suction mechanism is movable in a uniaxial direction, and the second image sensor is attached to the suction mechanism The semiconductor package is positioned by aligning the semiconductor package with the opening based on the image data of the semiconductor package imaged by the first image sensor and the image data of the aperture imaged by the second image sensor. A semiconductor package placement apparatus placed on a member can be provided.

  According to the embodiments disclosed herein, it is possible to provide a manufacturing apparatus including a semiconductor package substrate cutting device for cutting a semiconductor package substrate to manufacture a semiconductor package, and the semiconductor package placement device described above. it can.

  According to the embodiment disclosed herein, the step of sucking the semiconductor package by the suction mechanism, the step of moving the suction mechanism on which the semiconductor package is sucked to the placement member in the uniaxial direction, and the suction mechanism during the movement of the suction mechanism Imaging a semiconductor package adsorbed on the first imaging element; imaging an aperture of the arrangement member by a second imaging element attached to the adsorption mechanism; and semiconductor imaged by the first imaging element A semiconductor package including a step of aligning the semiconductor package with respect to the opening based on the imaging data of the package and the imaging data of the opening imaged by the second image sensor, and a step of arranging the semiconductor package on the arrangement member Can be provided.

  According to the embodiments disclosed herein, a step of cutting a semiconductor package substrate to produce a semiconductor package, a step of placing a semiconductor package on a placement member by the semiconductor package placement method, and a placement member Forming a conductive film on the semiconductor package disposed on the semiconductor device, a method for manufacturing an electronic component can be provided.

  It becomes possible to arrange the semiconductor package with high accuracy.

It is a typical top view of the manufacturing apparatus of an embodiment. It is a typical enlarged plan view of an example of one side of a semiconductor package. (A) is a typical top view of an example of the surface of a support base, (b) is a schematic plan view of an example of the surface of the adhesive sheet after formation of opening. FIG. 2 is a schematic enlarged plan view of a region surrounded by a broken line in FIG. 1. It is a typical side view illustrating an example of the operation in which the suction mechanism is sucking the semiconductor package. It is typical sectional drawing illustrating another example of the operation | movement in which the adsorption | suction mechanism is adsorbing the semiconductor package. It is a typical side view illustrating an example of an operation in which the first image sensor acquires image data of a semiconductor package from the lower side of the semiconductor package sucked by the suction mechanism. It is a typical side view illustrating an example of the operation in which the second image sensor acquires imaging data of the opening of the arrangement member from above. It is typical sectional drawing illustrating an example of the operation | movement which aligns a semiconductor package. It is typical sectional drawing illustrating an example of the operation | movement which arrange | positions a semiconductor package. It is typical sectional drawing illustrating an example of the process of coat | covering the surface on the opposite side to the installation side of the ball electrode of a semiconductor package with a conductive film. It is typical sectional drawing of an example of the electronic component manufactured by the manufacturing apparatus of embodiment.

  Hereinafter, embodiments will be described. In the drawings used to describe the embodiments, the same reference numerals represent the same or corresponding parts.

  In FIG. 1, the typical top view of the manufacturing apparatus of embodiment is shown. 1 includes a semiconductor package substrate supply device A (hereinafter referred to as “substrate supply device A”) and a semiconductor package substrate cutting device B (hereinafter referred to as “substrate cutting device B”). And a semiconductor package placement device C (hereinafter referred to as “placement device C”) and a conductive film forming device (hereinafter referred to as “film formation device”) (not shown).

  The substrate supply device A includes a substrate supply unit 3 for supplying the semiconductor package substrate 4 to the substrate cutting device B. In the present embodiment, the substrate supply apparatus A also includes a control unit 2 that controls all operations of the substrate supply apparatus A, the substrate cutting apparatus B, the arrangement apparatus C, and the film forming apparatus. Note that the control unit 2 is not limited to the one provided in the substrate supply apparatus A, and may be provided in another apparatus of the manufacturing apparatus 1. The control unit 2 may be divided into a plurality of units and provided in at least two of the substrate supply device A, the substrate cutting device B, the arrangement device C, and the film forming device.

  The semiconductor package substrate 4 is a cutting object that is finally cut and separated into a plurality of semiconductor packages 10. The semiconductor package substrate 4 is, for example, a base material made of a printed circuit board or a lead frame, a semiconductor chip-like component mounted on each of a plurality of regions of the base material, and a plurality of regions covered together. And a formed sealing resin.

  The substrate cutting apparatus B includes a cutting table 7 for mounting the semiconductor package substrate 4 before cutting or the semiconductor package 10 after cutting, a rotating mechanism 6 for rotating the cutting table 7, and the rotating mechanism 6 and the cutting table. 7 includes a moving mechanism 5 for moving 7, a rotary blade 9 for cutting the semiconductor package substrate 4, and a cutting mechanism 8 having the rotary blade 9.

  The substrate cutting apparatus B operates as follows, for example. First, the semiconductor package substrate 4 supplied from the substrate supply apparatus A in the X-axis direction is installed on a cutting table 7 installed on the rotation mechanism 6. Next, the moving mechanism 5 moves the cutting table 7 together with the rotating mechanism 6 to the cutting position of the semiconductor package substrate 4 in the Y-axis direction. Next, the rotation mechanism 6 adjusts the direction of the semiconductor package substrate 4 to be cut by rotating the cutting table 7, and the cutting mechanism 8 moves in the X-axis direction to move the rotary blade 9 relative to the semiconductor package substrate 4. Adjust the cutting position.

  Next, the semiconductor package substrate 4 is cut by the rotary blade 9. After the semiconductor package substrate 4 is cut and divided into a plurality of semiconductor packages 10, the cutting table 7 on which the plurality of divided semiconductor packages 10 are installed is moved in the Y-axis direction in the direction opposite to that before cutting. Return to the position. Thereby, the operation of the substrate cutting apparatus B is completed.

  The placement apparatus C includes an inspection table 12 for inspecting the semiconductor package 10 by installing the semiconductor package 10 after the semiconductor package substrate 4 is cut, and an inspection for inspecting the semiconductor package 10 installed on the inspection table 12. A mechanism 11 and a storage table 15 for installing the semiconductor package 10 after inspection are provided.

  The placement device C is also sucked by the suction mechanism 14 for sucking the semiconductor package 10, the first image sensor 28 for imaging the semiconductor package 10 sucked by the suction mechanism 14, and the suction mechanism 14. And a second imaging element 27 for imaging an opening 33 of an arrangement member 22 to be described later for arranging the semiconductor package 10. In the present embodiment, the suction mechanism 14 is movable only in the X-axis direction, and the second image sensor 27 is attached at a position along the X-axis direction of the suction mechanism 14.

  The placement device C also includes a placement member supply unit 19, a placement member 22, a placement table 16 for placing the placement member 22, an alignment mechanism 17 for aligning the placement member 22, and a placement table 16. A transport mechanism (not shown) that can move in the axial direction and a vacuum pump 23 are provided. The arrangement member 22 is a sticking member including a support base 20 such as a metal stencil and a resin sheet 18 on the support base 20.

  As the resin sheet 18, for example, a sheet including a resin sheet-like base material and an adhesive layer (adhesive layer) made of an adhesive applied to at least one surface of the sheet-like base material can be used. . As the adhesive, for example, a pressure sensitive adhesive (pressure sensitive adhesive) can be used. As the resin sheet 18, for example, a resin sheet in which a silicone-based adhesive is applied on both sides of a polyimide film can be used. Here, in the resin sheet 18, an adhesive can be formed by applying an adhesive to at least the surface of the sheet-like base material on the side to which the semiconductor package 10 is attached, but the side to which the semiconductor package 10 is attached. The adhesive layer may be formed by applying an adhesive to the surface of the sheet-like substrate and the surface of the sheet-like substrate on the opposite side. Thus, since the adhesive layer (adhesive layer) is provided at least on the arrangement surface of the semiconductor package 10 in the resin sheet 18, the semiconductor package 10 can be adhered to the arrangement member 22 that is an adhesion member.

  The placement device C operates as follows, for example. First, the inspection table 12 on which the semiconductor package 10 is placed is moved in the X-axis direction. While the inspection table 12 is moving, the inspection mechanism 11 inspects whether or not the semiconductor package 10 is a non-defective product. If it is determined by this inspection that the semiconductor package 10 is not good, the semiconductor package 10 is discarded at this point. On the other hand, when it is determined that the semiconductor package 10 is a non-defective product, the semiconductor package 10 is reversed and the semiconductor package 10 is placed on the storage table 15. The semiconductor package 10 is installed on the storage table 15 with the ball electrode 13 shown in the schematic enlarged plan view of FIG. 2 facing downward (storage table 15 side), for example. Thereafter, the storage table 15 moves in the Y-axis direction to the suction position of the semiconductor package 10 by the suction mechanism 14.

  Further, the arrangement member 22 including the support base 20 and the resin sheet 18 on the support base 20 is supplied from the arrangement member supply unit 19. The arrangement member 22 is moved on the X-axis direction to place the arrangement member 22 on the arrangement table 16. Then, for example, by irradiating a portion of the resin sheet 18 corresponding to the opening 32 of the support base 20 shown in the schematic plan view of FIG. 3A with, for example, a laser beam, for example, the schematic of FIG. As shown in the plan view, a plurality of openings 33 are also formed in the resin sheet 18.

  In addition, the arrangement | positioning member 22 is good also as a structure which attached the resin sheet 18 so that the opening of the frame-shaped member may be covered using the frame-shaped member made from metal etc. as the support base 20. FIG. In this case, the plurality of openings are formed only in the resin sheet 18.

  Moreover, when using the support base 20 in which the some opening 32 was formed, it is good also as a structure which provided frame-like members, such as metal, in the outer periphery of the support base 20 further. In this case, for example, the support base 20 and the frame member may be arranged on the same side with respect to the resin sheet 18. The size of the resin sheet 18 is made larger than that of the support base 20 in which the plurality of openings 32 are formed, and the resin sheet 18 may be attached to a frame-like member in which an opening larger than the support base 20 is formed inside. The thickness of the frame-shaped member can be made larger than the thickness of the support base 20. By setting it as the arrangement | positioning member 22 of such a structure, a frame-shaped member can be used as a conveyance member.

  FIG. 4 is a schematic enlarged plan view of a region surrounded by a broken line 21 in FIG. 1 at this stage. Operations after this stage of the placement device C will be described with reference to FIGS. First, the suction mechanism 14 moves in the X-axis direction to above the suction position of the semiconductor package 10 disposed on the storage table 15. Next, for example, as shown in the schematic side view of FIG. 5, the suction mechanism 14 sucks the side opposite to the ball electrode 13 side of the semiconductor package 10 by the suction member 30.

  In the example shown in FIG. 5, for convenience of explanation, the case where the suction mechanism 14 sucks only one semiconductor package 10 is shown. However, the present invention is not limited to this case. For example, the schematic cross-sectional view of FIG. As shown in FIG. 3, the suction mechanism 14 may suck a plurality of semiconductor packages 10 simultaneously. In addition, the space | interval between the adjacent adsorption | suction members 30 shown by FIG. 6 is set to L1.

  Next, the suction mechanism 14 that sucks the semiconductor package 10 moves in the X-axis direction from above the suction position of the semiconductor package 10 toward above the placement member 22. At this time, for example, as shown in the schematic side view of FIG. 7, the first image sensor 28 acquires image data of the semiconductor package 10 from the lower side of the semiconductor package 10 sucked by the suction mechanism 14. Examples of the image data acquired by the first image sensor 28 include position data of the semiconductor package 10. Imaging data acquired by the first imaging element 28 is transmitted to the control unit 2 of the substrate supply apparatus A.

  After the imaging data of the semiconductor package 10 is acquired by the first imaging element 28, the suction mechanism 14 further moves in the X-axis direction from above the first imaging element 28 to above the arrangement member 22. Thereafter, for example, as shown in the schematic side view of FIG. 8, the second imaging element 27 attached to the suction mechanism 14 acquires imaging data of the opening 33 of the arrangement member 22 from above. Examples of the imaging data acquired by the second imaging element 27 include the position of the opening 33 of the arrangement member 22. Imaging data acquired by the second imaging element 27 is also transmitted to the control unit 2 of the substrate supply apparatus A.

  The opening 33 of the arrangement member 22 imaged by the second image sensor 27 can be at least one of the opening 32 of the support base 20 and the opening 33 of the resin sheet 18.

  In the above description, the case has been described in which the imaging data of the semiconductor package 10 is acquired by the first imaging element 28 and then the imaging data of the opening 33 of the arrangement member 22 is acquired by the second imaging element 27. After the imaging data acquisition order of the first imaging element 28 and the second imaging element 27 is switched and the imaging data of the opening 33 of the arrangement member 22 is acquired by the second imaging element 27, the first imaging element 28 is acquired. The imaging data of the semiconductor package 10 may be acquired by the above.

  Thereafter, the control unit 2 arranges based on the imaging data of the semiconductor package 10 imaged by the first imaging element 28 and the imaging data of the opening 33 of the arrangement member 22 imaged by the second imaging element 27. The semiconductor package 10 is aligned with the opening 33 of the member 22.

  The alignment of the arrangement member 22 is performed by, for example, rotating the arrangement member 22 by a rotation mechanism (not shown) so that the arrangement direction of the plurality of openings 33 is parallel to the X axis. For example, the arrangement member 22 can be moved in the Y-axis direction by a transport mechanism (not shown) so that the alignment direction and the axial direction (X-axis direction) of the suction mechanism 14 are aligned. Thereby, the alignment of the semiconductor package 10 with respect to the opening 33 of the arrangement member 22 in the Y-axis direction is completed.

  The alignment of the semiconductor package 10 is performed, for example, as shown in the schematic cross-sectional view of FIG. 9, by moving the semiconductor package 10 in the X-axis direction by the suction mechanism 14, and from the interval L1 to L2 between the adjacent suction members 30. It can be performed by moving the semiconductor package 10 in the X-axis direction according to the change of the above, or moving the semiconductor package 10 in the X-axis direction by a combination thereof. Thereby, the arrangement member 22 is arranged so that the ball electrode 13 of the semiconductor package 10 is accommodated in the opening 33 of the resin sheet 18 on which the adhesive layer (adhesive layer) is arranged on the support base 20 via the resin base material 31. The alignment of the semiconductor package 10 with respect to the opening 33 in the X-axis direction is completed.

  For example, as described above, after the alignment of the semiconductor package 10 in the X-axis direction and the Y-axis direction with respect to the opening 33 of the arrangement member 22 is completed, as shown in the schematic cross-sectional view of FIG. The semiconductor package 10 adsorbed by the adsorbing member 30 is moved downward so that the ball electrode 33 is accommodated in the opening 33 of the arrangement member 22. As a result, the semiconductor package 10 is placed and pasted on the placement member 22.

  For example, when the semiconductor package 10 is a BGA semiconductor package in which the ball electrode 13 is disposed on one surface of the semiconductor package 10, the ball electrode 13 is adjacent to the peripheral edge 10 a of the semiconductor package 10 as shown in FIG. And the distance from the ball electrode 13 of the semiconductor package 10 to the peripheral edge 10a may be very short. In this case, for example, as shown in FIG. 10, it is necessary to install a short distance region from the ball electrode 13 to the peripheral edge 10 a outside the opening 33 while the ball electrode 13 is housed in the opening 33. Very high precision placement technology is required.

  In the arrangement device C of the manufacturing apparatus according to the embodiment, the suction mechanism 14 is movable only in the X-axis direction, and the second imaging element 27 that images the opening 33 of the placement member 22 is located with respect to the suction mechanism 14. It is mounted in a fixed state. This not only makes it difficult for the detection position of the semiconductor package 10 to be detected in the Y-axis direction by the first image sensor 28, but also shifts the detection position of the opening 33 in the Y-axis direction by the second image sensor 27. Is less likely to occur. Therefore, the semiconductor package 10 can be placed on the placement member 22 with high accuracy so that the ball electrode 13 is accommodated in the opening 33 of the placement member 22.

  1 and 4 show a state in which the second image sensor 27 is attached at a position adjacent to the suction mechanism 14 in the X-axis direction. The second image sensor 27 may be attached in a fixed state with respect to the suction mechanism 14 and may be attached to a position adjacent to the suction mechanism 14 in the Y-axis direction.

  1 and 4 illustrate the case where two suction mechanisms 14 are used, but only one suction mechanism 14 may be used. When only one suction mechanism 14 is used, only one first image sensor 28 and second image sensor 27 can be used.

  In FIGS. 1 and 4, the first image sensor 28 and the second image sensor 27 are added to each of the two suction mechanisms 14, and the first image sensor 28 and the second image sensor 27 are combined. Two are provided. The first imaging device 28 and the second imaging device 27 are shared by the two suction mechanisms 14, and the two suction mechanisms 14, one first imaging device 28, and one second imaging device 27 are used. It is also possible to adopt a configuration that was In this case, one first image sensor 28 is made common to the two suction mechanisms 14 by making one first image sensor 28 movable in the Y-axis direction of FIGS. 1 and 4. can do. In addition, one second imaging element 28 is attached in a state fixed to one of the two suction mechanisms 14, and, for example, based on the imaging data acquired by the second imaging element 27, for example, the opening 33 of the arrangement member 22. By generating the coordinate data, it is possible to share one second image sensor 27 for the two suction mechanisms 14. For example, the imaging data of the openings 33 of the arrangement members 22 corresponding to the two suction mechanisms 14 is acquired by one second imaging element 27, and the arrangement corresponding to the two suction mechanisms 14 based on the imaging data. Coordinate data of the opening 33 of the member 22 may be generated. Here, as the order of acquisition of imaging data by the first imaging element 28 and the second imaging element 27, for example, imaging of the semiconductor package 10 adsorbed by the first adsorption mechanism 14 by the first imaging element 28, Imaging of the opening 33 of the arrangement member 22 corresponding to the first and second suction mechanisms 14 by the second imaging device 27 and the semiconductor package 10 sucked by the second suction mechanism 14 by the first imaging device 28 The order of imaging may be used.

  Next, for example, as shown in the schematic cross-sectional view of FIG. 11, the surface of the semiconductor package 10 opposite to the installation side of the ball electrode 13 is covered with a conductive film 25 made of, for example, a metal film or the like by a film forming apparatus (not shown). To do. Thereafter, for example, as shown in the schematic cross-sectional view of FIG. 12, the electronic component 24 composed of the semiconductor package 10 after the formation of the conductive film 25 is taken out from the placement member 22, thereby completing the manufacture of the electronic component 24. Here, a sputtering apparatus or the like can be used as the film forming apparatus. Further, the surface on which the conductive film 25 is formed on the semiconductor package 10 can be any surface other than the surface on which the ball electrode 13 is installed. For example, when the shape of the semiconductor package 10 is a substantially rectangular parallelepiped, the conductive film 25 can be formed on five surfaces other than the installation surface of the ball electrode 13. The conductive film 25 can function as an electromagnetic shield film, for example.

  It should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Manufacturing apparatus, 2 Control part, 3 Substrate supply part, 4 Semiconductor package substrate, 5 Moving mechanism, 6 Rotating mechanism, 7 Cutting table, 8 Cutting mechanism, 9 Rotary blade, 10 Semiconductor package, 10a Perimeter, 11 Inspection mechanism, 12 Inspection table, 13 ball electrode, 14 adsorption mechanism, 15 storage table, 16 arrangement table, 17 alignment mechanism, 18 resin sheet, 19 arrangement member supply unit, 20 support base, 21 broken line, 22 arrangement member, 23 vacuum pump, 24 Electronic components, 25 conductive film, 27 second image sensor, 28 first image sensor, 31 resin base material, 32, 33 opening, A substrate supply device, B substrate cutting device, C placement device.

Claims (11)

An adsorption mechanism for adsorbing a semiconductor package;
A first imaging element for imaging the semiconductor package adsorbed by the adsorption mechanism;
An arrangement member for arranging the semiconductor package to be adsorbed by the adsorption mechanism;
A second imaging device for imaging the opening of the arrangement member,
The suction mechanism is movable in a uniaxial direction,
The second image sensor is attached to the suction mechanism,
Based on the imaging data of the semiconductor package imaged by the first imaging element and the imaging data of the opening imaged by the second imaging element, the semiconductor package is aligned with the opening. A semiconductor package placement device for placing the semiconductor package on the placement member. The suction mechanism is movable in the uniaxial direction between the upper position of the suction position of the semiconductor package and the upper side of the arrangement member,
During the movement of the suction mechanism, the first imaging element images the semiconductor package sucked by the suction mechanism from below,
The semiconductor package placement device according to claim 1, wherein the second image pickup device picks up the opening from above after image pickup by the first image pickup device. The arrangement member includes a plurality of the openings,
The semiconductor package placement apparatus according to claim 1, further comprising a rotation mechanism for rotating the placement member so that a plurality of the openings are aligned in the uniaxial direction.   4. The semiconductor package placement device according to claim 1, further comprising a transport mechanism capable of moving the placement member in a second uniaxial direction orthogonal to the uniaxial direction. 5.   The semiconductor package placement device according to claim 1, wherein the placement member is a sticking member including a resin sheet. A semiconductor package substrate cutting device for cutting a semiconductor package substrate to produce the semiconductor package;
A manufacturing apparatus comprising: the semiconductor package placement apparatus according to claim 1. A process of adsorbing a semiconductor package by an adsorption mechanism;
A step of uniaxially moving the suction mechanism to which the semiconductor package is sucked up to a placement member;
Imaging the semiconductor package adsorbed by the adsorption mechanism during movement of the adsorption mechanism with a first imaging element;
Imaging the opening of the arrangement member with a second imaging element attached to the suction mechanism;
A step of aligning the semiconductor package with respect to the opening based on imaging data of the semiconductor package imaged by the first imaging element and imaging data of the opening imaged by the second imaging element; When,
Placing the semiconductor package on the placement member. The step of moving in the uniaxial direction includes the step of moving the suction mechanism on which the semiconductor package is sucked in the uniaxial direction from above the suction position of the semiconductor package to above the placement member,
The step of imaging with the first imaging element includes the step of imaging the semiconductor package from which the first imaging element is adsorbed by the adsorption mechanism from below,
The method of arranging a semiconductor package according to claim 7, wherein the step of imaging with the second imaging device includes a step of imaging the opening from above by the second imaging device.   The semiconductor package placement method according to claim 7, further comprising a step of rotating the placement member so that a plurality of the openings of the placement member are aligned in the uniaxial direction.   10. The semiconductor package placement method according to claim 7, further comprising a step of moving the placement member in a second uniaxial direction orthogonal to the uniaxial direction. 11. Cutting a semiconductor package substrate to produce the semiconductor package;
A step of arranging the semiconductor package on the arrangement member by the semiconductor package arrangement method according to any one of claims 7 to 10.
Forming a conductive film on the semiconductor package arranged on the arrangement member.

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