JP2018150584A - Transparent substrate with large conductive pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transparent substrate with a large conductive pattern which can be applied to a large panel at low cost and can secure invisibility of a thin wire circuit. SOLUTION: A transparent substrate 1 with a large conductive pattern contains a coating composition for electroless plating containing metal particles which are cores of electroless plating on one surface of a transparent base material 10 and the transparent base material 10. A thin wire pattern portion 20 having a line width of 100 μm or less and an electroless plating layer 30 provided on the surface of the thin wire pattern portion 20 on the opposite side of the transparent base material 10 are provided. [Selection diagram] Fig. 1

Description

  The present invention relates to a transparent substrate with a large conductive pattern. In particular, the present invention relates to a transparent substrate with a large conductive pattern that forms a thin wire circuit by electroless plating.

  Conventionally, a conductive sheet having a transparent substrate, a first conductive portion formed on one main surface of the transparent substrate, and a second conductive portion in contact with the other main surface of the transparent substrate. The unit has a plurality of first and second fine line conductive patterns each having a conductive fine line part and a capacitance sensing part formed on the fine line at a predetermined interval. The conductive pattern is arranged so as to intersect when the conductive sheet is seen through, the first and second fine wire conductive patterns are substantially linear, and the line width of the fine wire portion is 0.1. There is known a conductive sheet that is ˜25 μm and the first and second capacitance sensing units are not open (see, for example, Patent Document 1). According to the conductive sheet described in Patent Document 1, the resistance of the transparent conductive pattern formed on the substrate can be reduced.

JP 2012-053644 A

  Here, although it is described in Patent Document 1 that it can be applied to a 32-inch type and a 42-inch type (for example, refer to the description in paragraph [0128] of Patent Document 1), Patent Document 1 describes. In the described conductive sheet, the first and second capacitance sensing portions of the thin line conductive pattern use ITO as a constituent component, and when the panel is enlarged, the resistance of the conductive pattern is reduced. Not only is there a limit, it also increases costs. Moreover, in patent document 1, the point which suppresses presence of metals, such as an electrode below a panel, visually recognizing to a user's naked eye is not considered.

  Accordingly, an object of the present invention is to provide a transparent substrate with a large conductive pattern that can be applied to a large panel at low cost and can ensure the invisibility of a thin wire circuit.

  In order to achieve the above object, the present invention contains a transparent base material and a coating composition for electroless plating containing metal particles serving as the core of electroless plating on one surface of the transparent base material, and has a thickness of 100 μm or less. There is provided a transparent substrate with a large conductive pattern comprising a fine line pattern part having a line width and an electroless plating layer provided on the surface of the fine line pattern part opposite to the transparent substrate.

  Further, in the transparent substrate with a large conductive pattern, the thin line pattern portion absorbs at least part of light having a wavelength exhibiting at least the maximum reflectance in the reflection spectrum of the electroless plating layer, whereby the electroless plating layer It is preferable to reduce the reflection of light from.

  In the transparent substrate with a large conductive pattern, the coating composition for electroless plating absorbs at least part of light having a wavelength exhibiting at least the maximum reflectance in the spectrum of light reflected by the electroless plating layer. Thus, it is preferable to correct the reflection spectrum of the electroless plating layer by including an additive for correcting the spectrum.

  In the transparent substrate with a large conductive pattern, the reflectance of light reflected by the electroless plating layer through the fine line pattern portion is preferably 10% or less.

In the transparent substrate with a large conductive pattern, the electroless plating coating composition contains (A) a composite of metal particles and a dispersant, (B) a solvent, and (C) a binder, and a fine line pattern portion However, it is preferable to have a film thickness of less than 0.8 g / m ² .

  Further, in the transparent substrate with a large conductive pattern, the metal particles include at least one kind of metal particles selected from the group consisting of palladium particles, gold particles, silver particles, and platinum particles, and the dispersant is a hydroxyl group, And a dispersant for a copolymer polymer having at least one group selected from the group consisting of carboxyl groups.

  According to the transparent substrate with a large conductive pattern according to the present invention, it is possible to provide a transparent substrate with a large conductive pattern that can be applied to a large panel at low cost and can ensure the invisibility of a thin wire circuit.

It is sectional drawing of the transparent substrate with a large sized conductive pattern which concerns on this Embodiment. It is a graph of the optical spectrum of the coating composition for electroless plating which concerns on the reflection spectrum of gold | metal | money, silver, and copper and this Embodiment. It is a reflection spectrum at the time of forming the layer which consists of a coating composition for electroless plating on electroless copper plating. It is a reflection spectrum at the time of forming the layer which consists of a coating composition for electroless plating on electroless silver plating. It is a reflection spectrum at the time of forming the layer which consists of a coating composition for electroless plating on electroless gold plating. It is a figure of the change of the reflectance by the difference in the application quantity of the coating composition for electroless plating. It is an absorption spectrum of the additive which concerns on this embodiment. It is a figure of the leveling of the reflection spectrum by an additive. A comparison of the change in reflectivity due to the difference in the coating amount of a layer consisting only of the coating composition for electroless plating and the change in reflectivity due to the difference in the coating amount of the coating composition for electroless plating containing additives is there. It is a figure of the leveling of the reflection spectrum by an additive. It is a flowchart of manufacture of the transparent substrate with a large sized conductive pattern which concerns on this Embodiment. It is a flowchart of manufacture of the thin wire | line pattern part which concerns on this Embodiment. It is a flowchart of manufacture of the transparent substrate with a large sized conductive pattern which concerns on the other modification of this Embodiment. It is sectional drawing of a laminated structure provided with the transparent substrate with a large sized conductive pattern which concerns on this Embodiment in a structure. It is the figure which plotted the maximum value of the reflectance with respect to the film thickness of the coating composition for electroless plating.

[Outline of transparent substrate 1 with large conductive pattern]
The transparent substrate 1 with a large conductive pattern according to the present embodiment is a substrate that can be used in at least a part of members constituting a liquid crystal panel, a touch panel, and / or a display, and is 20 inches or more or 32 inches or more. From the standpoint of maintaining an appropriate electrical resistance even when applied to a panel, a fine line pattern portion containing metal particles serving as the core of electroless plating on a transparent substrate and a surface provided on the surface of the fine line pattern portion. A transparent substrate provided with an electroplating layer. Furthermore, the transparent substrate 1 with a large conductive pattern is configured to reduce the spectrum of light reflected on the electroless plating layer by the fine line pattern portion from the viewpoint of suppressing the presence of the electroless plating layer to the naked eye of the user. It is preferable to include a predetermined additive for leveling so that the reflectance is suppressed.

  The transparent substrate 1 with a large conductive pattern according to the present embodiment was created based on the knowledge obtained by the inventor by examining the following points. That is, first, in a panel using a conventionally used transparent conductive film (indium tin oxide (ITO)), there is a limit in reducing the electrical resistance of ITO, and the material cost and manufacturing cost are high. It is difficult to realize a large panel at a low cost. In addition, in other conductive materials (such as zinc oxide and tin oxide) excluding ITO, for example, zinc oxide has a low material cost while having a high resistivity and a low pattern conduction reliability. Larger is not suitable for manufacturing. Furthermore, other conductive materials other than ITO have a limit in transparency and are not suitable for the production of transparent substrates.

  In addition, when forming a pattern using metal film or metal sputtering, the metal resistivity is low, so the manufacture of large panels is possible. On the other hand, a large amount of pure metal waste is generated in the etching process for pattern formation. Therefore, not only is the manufacturing cost high, but it can also adversely affect the environment. Furthermore, when a pattern is formed using metal nano ink, a large panel can be manufactured, but the conduction reliability of the circuit is low.

  As a result of examining the above-described disadvantages of the prior art as described above, the present inventor has formed a thin line pattern portion on a base material using a coating composition for electroless plating containing metal particles serving as the core of electroless plating. Forming and forming an electroless plating layer by applying electroless plating treatment to this fine line pattern part can not only facilitate the manufacture of large panels, but also reduce the waste of materials used and reduce costs I found. Furthermore, the present inventor has found that the spectrum of light reflected by the electroless plating layer can be corrected to a desired spectrum by adding a predetermined additive to the coating composition for electroless plating. That is, the present inventor can reflect the electroless plating layer by controlling the kind and amount of the additive added to the electroless plating coating composition and / or the film thickness of the electroless plating coating composition. It was found that the reflection spectrum of the light to be corrected can be corrected to a desired reflection spectrum (that is, the reflection spectrum can be adjusted). Thereby, the user who visually recognizes the transparent substrate 1 with a large conductive pattern can be prevented from substantially recognizing the reflection of light by the electroless plating layer. Alternatively, the chromaticity a * and b * of the L * a * b * color system measured in accordance with JIS Z 8729 (2004) and JIS Z 8722 (2009) is used for the reflection of light by the electroless plating layer. The lightness L * can be changed to reflection of light of a color (for example, a dark color) whose color is controlled to a predetermined value.

[Details of transparent substrate with large conductive pattern]
FIG. 1 shows an outline of a cross section of a transparent substrate with a large conductive pattern according to the present embodiment. Specifically, FIG. 1A shows an outline of a cross section of the transparent substrate 1 with a large conductive pattern according to the present embodiment, and FIG. 1B shows a transparent with a large conductive pattern according to a modification of the present embodiment. The outline of the section of substrate 1a is shown. Moreover, FIG.1 (c) shows the outline | summary of the cross section of the transparent substrate 1b with a large sized conductive pattern which concerns on the other modification of this embodiment, FIG.1 (d) shows the further another modification of this embodiment. An outline of a cross section of the transparent substrate 1c with a large conductive pattern is shown.

[About transparent substrate 1 with large conductive pattern]
As shown in FIG. 1A, a transparent substrate 1 with a large conductive pattern is formed on a transparent substrate 10 having a size of 20 inches or more or 24 inches or more, preferably 32 inches or more, and one surface of the transparent substrate 10. The fine wire pattern part 20 comprised including the coating composition for electroless plating, and the electroless plating layer 30 provided in the surface on the opposite side of the transparent base material 10 of the fine wire pattern part 20 are provided. A plurality of fine line pattern portions 20 can be arranged at a predetermined interval on one surface of the transparent substrate 10.

(Transparent substrate 10)
The transparent substrate 10 is not limited to a rectangular shape, but can have various shapes such as an elliptical shape and a circular shape. As an example, the transparent substrate 10 has a substantially rectangular shape in plan view, and the diagonal of the square is preferably 24 inches or more, more preferably 32 inches or more. The transparent base material 10 can have a thickness corresponding to the application of the transparent substrate 1 with a large conductive pattern. For example, the transparent substrate 10 preferably has a thickness of 10 μm or more, more preferably 50 μm or more, preferably 700 μm or less, and more preferably 200 μm or less. Moreover, the transparent base material 10 is transparent with respect to at least visible light, and is comprised using the material which has insulation. For example, the transparent base material 10 can be comprised using glass, a transparent ceramic, or a plastic film. Examples of the polymer material constituting the plastic film include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethylene, polypropylene, polystyrene, acrylic resin, and the like. In addition, as the transparent base material 10, you may use the nonwoven fabric (or woven fabric) of the transparent fiber comprised from glass fiber etc.

(Fine line pattern part 20)
The fine line pattern portion 20 is configured to contain, on one surface of the transparent substrate 10, a coating composition for electroless plating that includes metal particles that are the core of electroless plating. Further, the fine line pattern portion 20 can reduce the reflection of light from the electroless plating layer 30 by absorbing at least a part of the light reflected by the electroless plating layer 30. The fine line pattern portion 20 has a line width of 0.1 μm or more, preferably 0.5 μm or more, and a line width of 30 μm or less from the viewpoint of suppressing glare when observed from the outside. The line width is preferably 10 μm or less, more preferably 5 μm or less.

  Moreover, it is preferable that the thin wire | line pattern part 20 has a thickness which can absorb at least one part of the light of the wavelength which shows the maximum reflectance among the reflection spectra of the electroless-plating layer 30 at least. In particular, the fine line pattern portion 20 has a thickness greater than or equal to a predetermined thickness, and thus absorbs at least a part of light having a wavelength showing at least the maximum reflectance in the reflection spectrum of the electroless plating layer 30. It is preferable to do. Thereby, the thin line pattern part 20 reduces the reflection of the light of the predetermined wavelength from the electroless plating layer 30.

  Further, by adjusting the thickness of the thin line pattern portion 20, the degree of darkening of the color of the electroless plating layer 30 when the electroless plating layer 30 is observed from the outside (for example, optical density, or JIS Z 8729 ( 2004) and JIS Z 8722 (2009), the chromaticity a * and b * of the L * a * b * color system and the lightness L *) can be adjusted to a desired degree of darkening. From the viewpoint of reducing the reflection of light by the electroless plating layer 30 by adjusting the reflection spectrum of the electroless plating layer 30 and preventing the metal color of the electroless plating layer 30 from being substantially visually recognized from the outside. The thickness of the portion 20 is preferably 3 μm or more. For example, the fine line pattern unit 20 may have a thickness of 0.1 μm or more, and may have a thickness of 1 μm or more, or a thickness of 2 μm or more. Further, the fine line pattern portion 20 can be configured to include a plurality of fine line pattern portions 20.

  And the fine line pattern part 20 is when the transparent substrate 1 with a large sized conductive pattern is visually recognized from the outside (for example, in FIG. 1A, the other surface of the transparent substrate 10 (the surface on which the fine line pattern part 20 is not provided). ) When viewed from the side), the chromaticity a * and b * of the L * a * b * color system measured according to JIS Z 8729 (2004) and JIS Z 8722 (2009) is 10 or less, It is desirable to have a color with a lightness L * of less than 60 (that is, it is preferably darkened). Here, the chromaticities a * and b * are preferably 5 or less, and most preferably 0. Further, the lightness L * is preferably 45 or less, more preferably 35 or less, still more preferably 30 or less, and most preferably 15 or less.

  Moreover, the fine line pattern part 20 is when the transparent substrate 1 with a large sized conductive pattern is visually recognized from the outside (for example, in FIG. 1A, the other surface of the transparent substrate 10 (the surface on which the fine line pattern part 20 is not provided). ) When viewed from the side), it is desirable to have a predetermined optical density. Here, the predetermined optical density is preferably 0.3 or more, more preferably 1.0 or more, still more preferably 1.6 or more, and most preferably 2.0 or more.

  Moreover, as a coating composition for electroless plating, the composition containing (A) the composite of a metal particle and a dispersing agent, (B) solvent, and (C) binder can be used. Here, the coating composition for electroless plating darkens the fine line pattern portion 20 by including an additive (D) that corrects the spectrum of light reflected by the electroless plating layer 30 in a direction in which the reflectance decreases. can do. Specifically, the additive (D) is preferably a material that corrects the spectrum by leveling the spectrum of light reflected by the metal material that constitutes the electroless plating layer 30. In addition, when using the coating composition for electroless plating which does not contain (D) additive, the electroless-plating layer 30 is comprised by controlling the thickness of the thin wire | line pattern part 20 based on the Lambert-Beer law. The spectrum of light reflected by the metal material can be controlled in the direction in which the reflectance decreases. In addition, when it is not necessary to consider the cost increase by using a large amount of the electroless plating coating composition constituting the fine line pattern portion 20, it is possible to control only the thickness of the fine line pattern portion 20.

<(A) component>
The component (A) is a composite of metal particles and a dispersant, and can be obtained, for example, by reducing metal particles under a predetermined dispersant. As the metal particles, at least one kind of metal particles selected from the group consisting of palladium particles, gold particles, silver particles, copper particles, and platinum particles can be used.

  Examples of the dispersant include polycarboxylic acid polymer dispersants such as polycarboxylic acid ammonium salt, polycarboxylic acid sodium salt, polycarboxylic acid triethylamine salt, polycarboxylic acid triethanolamine salt; polyoxyethylene alkyl ether carboxylic acid Block copolymer type polymer dispersant having hydroxyl group such as salt, alkyl hydroxy ether carboxylate; acrylic acid-maleic acid copolymer, styrene-maleic acid copolymer, acrylic acid-sulfonic acid copolymer, etc. A block copolymer type polymer dispersant having a carboxyl group can be used. A dispersing agent can be used by 1 type, and can also be used in combination of 2 or more type. Among these dispersants, it is preferable to use a copolymer polymer having at least one group selected from the group consisting of a hydroxyl group and a carboxyl group, particularly a block copolymer polymer dispersant.

  The component (A), that is, the metal complex can be synthesized by reducing metal ions in the presence of a dispersant, for example. As an example, a metal complex can be synthesized by mixing a dispersant and metal ions in a predetermined solvent and reducing the metal ions. Examples of the method for reducing metal ions include a method in which a dispersant and metal ions are allowed to coexist in a solvent, and a reducing agent is mixed therewith. Thereby, a metal ion and a reducing agent contact and a metal ion is reduce | restored. Various reducing agents can be used as the reducing agent, for example, secondary or tertiary amines such as hydrazine hydrate (hydrazine monohydrate), sodium borohydride, N, N dimethylethanolamine, diethanolamine and the like. Etc. can be used.

  Moreover, as a solvent used when synthesize | combining (A) component, you may use the same solvent as (B) component. A solvent can be used by 1 type and can also be used in combination of 2 or more type of solvent.

<(B) component>
(B) As a solvent, it is preferable that water and / or an aprotic polar solvent are included from a viewpoint of ensuring the dispersibility of the metal complex in the coating composition for electroless plating. In addition, a solvent can be used by 1 type and can also be used in combination of 2 or more type.

  Here, examples of the aprotic polar solvent include N-methylpyrrolidone, dimethylformamide, dimethylacetamide, dimethylsulfoxide, and γ-butyrolactone. The solvent may be replaced with another solvent after a metal ion (for example, palladium ion) undergoes a reduction reaction (for example, the solvent may be changed from water to N-methylpyrrolidone).

  In addition to water and / or an aprotic polar solvent, the solvent (B) includes alcohols such as methanol and ethanol; ketones such as acetone, methyl ethyl ketone and cyclohexanone; ethylene glycol monomethyl ether, ethylene glycol monobutyl ether and the like. Glycol ethers; aromatic carboxylic acid esters such as methyl benzoate, ethyl benzoate and methyl salicylate; aromatic hydrocarbons such as toluene and xylene; methyl cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, methyl carbitol acetate, It may contain glycol ether esters such as butyl carbitol acetate; alkanol esters such as ethyl acetate and butyl acetate.

  There is no restriction | limiting in particular as content of the (B) solvent in the coating composition for electroless plating, According to the printing method, it can adjust suitably.

<(C) component>
(C) As the binder, a binder resin can be used. As the binder resin, a resin that is dispersed or dissolved in the component (B) can be used. For example, examples of the binder resin include epoxy resin, polyester resin, acrylic resin, polyurethane resin, polyamide resin, polyimide resin, shellac resin, melamine resin, urea resin, and the like. Here, it is preferable to use at least one resin selected from the group consisting of a polyester resin, a polyamide resin, and a polyimide resin. The binder resin can be used alone or in combination of two or more.

  There is no restriction | limiting in particular as content of (C) binder in the coating composition for electroless-plating, About 102 mass parts or more and 2000 mass parts or less are preferable with respect to 100 mass parts of (A) component.

<(D) Additive>
(D) As an additive, the material which absorbs at least one part of the light of the wavelength which shows the maximum reflectance among the reflection spectra of the electroless-plating layer 30 can be used. That is, as the additive (D), a material that corrects the reflection spectrum of light reflected on a predetermined metal surface in a direction in which the reflectance is reduced can be used. Specifically, as the additive (D), an insulating material that absorbs light in a predetermined wavelength range can be used, and for example, an inorganic dye and / or an organic dye can be used. As an example, as the additive (D), a dye that absorbs light of 400 nm to 500 nm, a dye that absorbs light of 500 nm to 750 nm, and / or a dye that absorbs light of 750 nm to 1000 nm can be used.

  For example, as a dye that absorbs light of 400 nm to 500 nm, trade names FDB-001 (maximum absorption wavelength 420 nm), trade names FDB-002 (maximum absorption wavelength 431 nm), trade names FDB-003 manufactured by Yamada Chemical Co., Ltd. (Maximum absorption wavelength 437 nm), trade name FDB-004 (maximum absorption wavelength 445 nm), trade name FDB-005 (maximum absorption wavelength 452 nm), trade name FDB-006 (maximum absorption wavelength 473 nm), trade name FDB-0017 (maximum) For example, an absorption wavelength of 496 nm).

  Further, for example, as a dye that absorbs light of 500 nm to 750 nm, FDG-001 (maximum absorption wavelength 503 nm), FDG-002 (maximum absorption wavelength 525 nm), FDG-003 (maximum absorption wavelength) manufactured by Yamada Chemical Co., Ltd. 547 nm), FDG-004 (maximum absorption wavelength 578 nm), FDG-005 (maximum absorption wavelength 583 nm), FDG-006 (maximum absorption wavelength 585 nm), FDG-007 (maximum absorption wavelength 594 nm), FDR-001 (maximum absorption wavelength) Absorption wavelength 609 nm), FDR-002 (maximum absorption wavelength 680 nm), FDR-003 (maximum absorption wavelength 695 nm), FDR-004 (maximum absorption wavelength 716 nm), FDR-005 (maximum absorption wavelength 725 nm), etc. can be used. .

  Furthermore, for example, as a dye that absorbs light of 750 nm to 1000 nm, FDN-001 (maximum absorption wavelength 754 nm), FDN-002 (maximum absorption wavelength 807 nm), FDN-003 (maximum absorption wavelength) manufactured by Yamada Chemical Industries, Ltd. 853 nm), FDN-004 (maximum absorption wavelength 880 nm), FDN-005 (maximum absorption wavelength 910 nm), FDN-006 (maximum absorption wavelength 927 nm), FDN-007 (maximum absorption wavelength 956 nm), FDN-008 (maximum absorption wavelength) 992 nm) or the like.

  (D) An additive can be used by 1 type, or 2 or more types can be mixed and used for it. For example, the chromaticity a * and b * of the L * a * b * color system measured according to JIS Z 8729 (2004) and JIS Z 8722 (2009) of the color of the electroless plating layer 30, and the brightness It is preferable to darken the electroless plating layer 30 by controlling L * to a predetermined value and / or adjusting the optical density. That is, the electroless plating layer 30 includes at least one of the components (A) to (C), preferably (C) light absorption by the binder and light absorption by at least one or more (D) additives. It is preferable to level the reflection spectrum of light reflected by the metal material that constitutes in a direction in which the reflection of light by the electroless plating layer 30 decreases. In this case, depending on the absorption of light by the metal material constituting the electroless plating layer 30 and / or at least one of the components (A) to (C), the type of additive used as the component (D), and The amount can be determined as appropriate. Thereby, leveling and / or the level of leveling can be adjusted. Therefore, even if the light reflected on the electroless plating layer 30 through the fine line pattern portion 20 is emitted to the outside of the transparent substrate 1 with a large conductive pattern, the pattern composed of the fine line pattern portion 20 and the electroless plating layer 30. Can be recognized as black with various impressions (ie, “colorless” black) such as reddish black, bluish black, and blackish black.

  The coating composition for electroless plating can be produced by weighing and mixing (A) component, (B) component, (C) component, and / or (D) additive in predetermined amounts. In addition, (D) additive can also be previously mixed with at least 1 component among (A) component, (B) component, and (C) component. (D) When the additive is used in combination, the thickness of the fine line pattern portion 20 can be reduced, so that the cost is reduced as compared with the case where the reflection spectrum of the electroless plating layer 30 is corrected only by the fine line pattern portion 20. be able to.

(Electroless plating layer 30)
The electroless plating layer 30 is provided on the surface of the fine line pattern portion 20 opposite to the side in contact with the transparent substrate 10. The electroless plating layer 30 is made of, for example, electroless metal plating such as Ni, Co, Pd, Cu, Ag, Au, Pt, Sn, Ru, or Rh, or NiB, NiCoWP, NiMoP, CoP, CoNiP, CoWP, CoSnP. , CoZnP, CoMnP, or other electroless alloy plating. From the viewpoint of ensuring good electrical conductivity, the electroless plating layer 30 is preferably formed by electroless Au plating, electroless Cu plating, or electroless Ag plating, and is electroless from the viewpoint of cost and corrosion resistance. More preferably, it is formed by Cu plating. In addition, electroless alloy plating has different properties from single metals, such as improving corrosion resistance.

[Transparent substrate with large conductive pattern 1a]
Unlike the transparent substrate 1 with a large conductive pattern, the transparent substrate 1a with a large conductive pattern shown in FIG. 1B further includes a fine line pattern portion 20 and an electroless plating layer 30 on the other surface of the transparent substrate 10. Except for the point, it has substantially the same configuration and function as the transparent substrate 1 with a large conductive pattern. Therefore, only the differences will be described below.

  The transparent substrate 1a with a large conductive pattern includes a transparent base material 10, a fine line pattern portion 20 (hereinafter referred to as “first fine line pattern portion 20”) provided on one surface of the transparent base material 10, and a transparent base material. 10 of the transparent substrate 10 of the fine line pattern part 20 (hereinafter referred to as “second fine line pattern part 20”) provided on the other surface of the first fine line pattern part 20 and the second fine line pattern part 20. And an electroless plating layer 30 provided on each of the opposite surfaces. In the transparent substrate with a large conductive pattern 1a, it is preferable that at least one of the first fine line pattern part 20 and the second fine line pattern part 20 contains (D) an additive. In addition, both the electroless plating layer 30 provided on the surface of the first fine line pattern portion 20 and the electroless plating layer 30 provided on the surface of the second fine wire pattern portion 20, or any one surface (each non-electrolytic plating layer 30). A blackening treatment may be applied to the surface of the electroplating layer 30 opposite to the side in contact with the fine line pattern portion. Here, at least the electroless plating layer 30 on the user side observing the transparent substrate 1a with a large conductive pattern may be subjected to a blackening process. Then, the light incident on the transparent substrate 1 a with a large conductive pattern from the transparent substrate 10 side passes through the fine line pattern portion 20 and is reflected by the electroless plating layer 30. Then, the reflected light again passes through the fine line pattern portion 20 and the transparent substrate 10 and is emitted to the outside as reflected light. In this case, it is preferable that the light reflectance (calculated from incident light and reflected light) when observed from the outside of the transparent substrate 1a with a large conductive pattern is 10% or less. The same applies to the other transparent substrates with large conductive patterns described below.

  Further, the color of the first fine line pattern portion 20 and the color of the second fine line pattern portion 20 may be the same as or different from each other. That is, when the transparent substrate 1 with a large conductive pattern is visually recognized from the outside, the color of the first fine line pattern portion 20 and the color of the second fine line pattern portion 20 are JIS Z 8729 (2004) and JIS Z 8722 ( The chromaticity a * and b * and the lightness L * of the L * a * b * color system measured in accordance with 2009) can be the same or different from each other. In addition, the lightness L * of the L * a * b * color system measured in accordance with JIS Z 8729 (2004) and JIS Z 8722 (2009) of the first thin line pattern portion 20, and the second thin line pattern The difference ΔL from the lightness L * of the L * a * b * color system measured in accordance with JIS Z 8729 (2004) and JIS Z 8722 (2009) of the part 20 is preferably 20 or less, It is more preferably 15 or less, and further preferably 10 or less.

  In addition, the color of the 1st fine line pattern part 20 and the 2nd fine line pattern part 20 is respectively (D) the kind of additive added to each fine line pattern part 20, (D) the quantity of an additive, and / or each It can be adjusted by changing the thickness or the like of the fine line pattern portion 20.

[About transparent substrate 1b with large conductive pattern]
The transparent substrate 1b with a large conductive pattern shown in FIG. 1 (c) is different from the transparent substrate 1a with a large conductive pattern in that the thin line pattern portion 20 provided on the other surface of the transparent substrate 10 and the electroless plating layer 30 are Except for the different order of arrangement, it has substantially the same configuration and function as the transparent substrate with a large conductive pattern 1a. Therefore, only the differences will be described below.

  The transparent substrate 1b with a large conductive pattern includes a transparent substrate 10, a fine line pattern portion 20 (hereinafter referred to as “first fine line pattern portion 20”) provided on one surface of the transparent substrate 10, and a transparent substrate. 10, the electroless plating layer 30 provided on the other surface, the electroless plating layer 30 provided on the surface of the first thin line pattern portion 20 on the opposite side of the transparent substrate 10, and the other surface of the transparent substrate 10. And a fine line pattern portion 20 (hereinafter referred to as “second fine line pattern portion 20”) provided on the surface of the electroless plating layer 30 on the opposite side of the transparent substrate 10. In the transparent substrate 1b with a large conductive pattern, it is preferable that at least one of the first fine line pattern part 20 and the second fine line pattern part 20 contains (D) an additive. In addition, the surface side of each thin wire | line pattern part 20 respond | corresponds to the side by which the transparent substrate 1b with a large sized conductive pattern is visually recognized from the outside (in the example of FIG.1 (c), it is visually recognized from the downward direction of a figure).

[Transparent substrate with large conductive pattern 1c]
The transparent substrate 1c with a large conductive pattern shown in FIG. 1 (d) is different from the transparent substrate 1 with a large conductive pattern, and includes a thin line pattern portion 20 provided on one surface of the transparent substrate 10 and an electroless plating layer 30. Except for the difference in arrangement order, it has substantially the same configuration and function as the transparent substrate 1 with a large conductive pattern. Therefore, only the differences will be described below.

  The transparent substrate 1c with a large conductive pattern is provided on the transparent substrate 10, the electroless plating layer 30 provided on one surface of the transparent substrate 10, and the surface of the electroless plating layer 30 on the opposite side of the transparent substrate 10. And a fine line pattern portion 20 to be provided. In the transparent substrate 1c with a large conductive pattern, it is preferable that the fine line pattern portion 20 contains (D) an additive. In addition, the surface side of the fine line pattern part 20 respond | corresponds to the side by which the transparent substrate 1c with a large conductive pattern is visually recognized from the outside (in the example of FIG.1 (d), it is visually recognized from the upper direction of a figure).

  Here, from the viewpoint of facilitating manufacture of a large panel, eliminating waste of materials to be used, and reducing costs, the transparent substrate 1 with a large conductive pattern, the transparent substrate with a large conductive pattern 1a, the transparent substrate with a large conductive pattern 1b, And the transparent substrate 1c with a large sized conductive pattern can be used suitably. From the viewpoint of correcting the reflection spectrum of light reflected by the electroless plating layer to a desired reflection spectrum, the transparent substrate 1 with a large conductive pattern, the transparent substrate 1b with a large conductive pattern, and / or the transparent substrate with a large conductive pattern 1c can be suitably used. In addition, from the viewpoint of correcting the reflection spectrum of light reflected by the electroless plating layer to a desired reflection spectrum, the electroless plating layer is formed using electroless black plating or the electroless plating layer is blackened. In that case, a transparent substrate 1a with a large conductive pattern may be used.

[(D) Correction of reflection spectrum by additive]
FIG. 2 shows the reflection spectrum of gold, silver, and copper, and the coating composition for electroless plating according to the embodiment of the present invention (however, (D) does not contain the additive. In the description of FIGS. 2 to 6). The same applies to the coating composition for electroless plating.) FIG. That is, FIG. 2 (a) shows the reflection spectrum of gold, silver, and copper, FIG.2 (b) shows an example of the light absorption characteristic of the coating composition for electroless plating, FIG.2 (c) An example of the transmittance | permeability of the coating composition for electroless plating is shown.

  As shown in FIG. 2A, each metal has a predetermined reflectance for each wavelength of light to be irradiated. On the other hand, as an example, the coating composition for electroless plating has a characteristic that the absorption coefficient gradually decreases as the wavelength shifts from 400 nm to 800 nm as shown in FIG. 2B, and as shown in FIG. 2C. The transmittance gradually increases as the wavelength is shifted from 400 nm to 800 nm. For example, the coating composition for electroless plating has an extinction coefficient of about 1.22 at a wavelength of 380 nm and a transmittance of about 8%, an extinction coefficient at a wavelength of 780 nm of about 0.66, and a transmittance of about 22%. .

  FIG. 3 shows an example of a reflection spectrum when a layer made of a coating composition for electroless plating is formed on electroless copper plating, and FIG. 4 shows a coating composition for electroless plating on electroless silver plating. FIG. 5 shows an example of a reflection spectrum when a layer made of a coating composition for electroless plating is formed on electroless gold plating. 3 to 5, the horizontal axis represents wavelength (nm) and the vertical axis represents reflectance (%).

  Moreover, FIG. 6 shows an example of the change of the reflectance by the difference in the application amount of the coating composition for electroless plating. Specifically, FIG. 6A is an example of a change in reflectance due to a difference in the coating amount of the coating composition for electroless plating when a layer made of the coating composition for electroless plating is formed on the electroless copper plating. FIG. 6B shows an example of a change in reflectivity due to a difference in coating amount of the coating composition for electroless plating when a layer made of the coating composition for electroless plating is formed on the electroless silver plating. FIG. 6C shows an example of a change in reflectance due to a difference in the coating amount of the electroless plating coating composition when a layer made of the electroless plating coating composition is formed on the electroless gold plating. Indicates. In FIG. 6, the vertical axis is a logarithmic axis, and the maximum value of the reflectance is plotted among the reflection spectra measured in a predetermined wavelength range for each coating amount of the electroless plating coating composition.

First, referring to FIG. The reflection spectrum 400 of FIG. 3 shows the reflection spectrum of the electroless copper plating in which the layer of the coating composition for electroless plating is not formed on the surface. A reflection spectrum 402 in FIG. 3 is a reflection spectrum when 0.3 g / m ^{2 of a} coating composition for electroless plating is applied on copper plating, and a reflection spectrum 404 is for electroless plating on copper plating. The reflection spectrum is obtained when 0.5 g / m ^{2 of the} coating composition is applied, and the reflection spectrum 406 is the reflection spectrum obtained when 0.7 g / m ^{2 of the} coating composition for electroless plating is applied on the copper plating. The reflection spectrum 408 is a reflection spectrum when 1.0 g / m ^{2 of the} electroless plating coating composition is applied on the copper plating (hereinafter, the film thickness of the electroless plating coating composition is expressed as “g / m ² ").

As shown to Fig.6 (a), when the film thickness of the coating composition for electroless plating on electroless copper plating is increased, the maximum value of a reflectance will fall according to the increase in film thickness. In FIG. 6 (a), the maximum reflectance when the coating composition for electroless plating is not applied is 88%, and the maximum reflectance when the coating amount is 0.3 g / m ² is 35%. %, The maximum reflectance when the coating amount is 0.5 g / m ² is 19%, and the maximum reflectance when the coating amount is 0.7 g / m ² is 10%. The maximum reflectance is 4% when is 1.0 g / m ² .

  Then, as shown in FIG. 3, when the film thickness of the electroless plating coating composition on the electroless copper plating is increased, the entire reflection spectrum is corrected and leveled in the direction in which the reflectance decreases over the entire wavelength range. Is done. In addition, the thicker the coating composition for electroless plating, the greater the degree of correction and leveling, and the correction and leveling are performed in such a direction that the reflectance of the entire reflection spectrum is further reduced. However, the reflectivity in the long wavelength region is higher than the reflectivity in the short wavelength region.

Reference is now made to FIG. The reflection spectrum 410 of FIG. 4 shows the reflection spectrum of electroless silver plating in which the layer of the coating composition for electroless plating is not formed on the surface. And the reflection spectrum 412 of FIG. 4 is a reflection spectrum at the time of apply | coating the coating composition for electroless plating 0.3g / m < ² > on silver plating, and the reflection spectrum 414 is for electroless plating on silver plating. The reflection spectrum when the coating composition is applied at 0.5 g / m ² , and the reflection spectrum 416 is the reflection spectrum when the coating composition for electroless plating is applied at 0.7 g / m ² on the silver plating. The reflection spectrum 418 is a reflection spectrum when 1.0 g / m ^{2 of a} coating composition for electroless plating is applied on silver plating.

As shown in FIG. 6 (b), when the film thickness of the electroless plating coating composition on the electroless silver plating is increased, the maximum value of the reflectivity is lowered as the film thickness is increased. In FIG. 6B, the maximum reflectance when the coating composition for electroless plating is not applied is 98%, and the maximum reflectance when the coating amount is 0.3 g / m ² is 39. %, The maximum reflectance when the coating amount is 0.5 g / m ² is 21%, and the maximum reflectance when the coating amount is 0.7 g / m ² is 12%. The maximum reflectance is 5% when is 1.0 g / m ² .

  Then, as shown in FIG. 4, when the film thickness of the electroless plating coating composition on the electroless silver plating is increased, the entire reflection spectrum is corrected and leveled in the direction in which the reflectance decreases over the entire wavelength range. Is done. In addition, the thicker the coating composition for electroless plating, the greater the degree of correction and leveling, and the correction and leveling are performed in such a direction that the reflectance of the entire reflection spectrum is further reduced. However, the reflectivity in the long wavelength region is higher than the reflectivity in the short wavelength region.

Still referring to FIG. The reflection spectrum 420 of FIG. 5 shows the reflection spectrum of electroless gold plating in which the layer of the coating composition for electroless plating is not formed on the surface. And the reflection spectrum 422 of FIG. 5 is a reflection spectrum at the time of apply | coating 0.3 g / m < ² > of the coating composition for electroless plating on gold plating, and the reflection spectrum 424 is for electroless plating on gold plating. The reflection spectrum when 0.5 g / m ^{2 of the} coating composition is applied, and the reflection spectrum 426 is the reflection spectrum when 0.7 g / m ^{2 of the} coating composition for electroless plating is applied on the gold plating. The reflection spectrum 428 is a reflection spectrum when 1.0 g / m ^{2 of a} coating composition for electroless plating is applied onto gold plating.

As shown in FIG.6 (c), when the film thickness of the coating composition for electroless plating on electroless gold plating is increased, the maximum value of the reflectivity decreases as the film thickness increases. In FIG. 6C, the maximum reflectance when the coating composition for electroless plating is not applied is 94%, and the maximum reflectance when the coating amount is 0.3 g / m ² is 38. %, The maximum reflectance when the coating amount is 0.5 g / m ² is 20%, and the maximum reflectance when the coating amount is 0.7 g / m ² is 11%. The maximum reflectance is 4% when is 1.0 g / m ² .

  As shown in FIG. 5, when the film thickness of the electroless plating coating composition on the electroless gold plating is increased, the entire reflection spectrum is corrected and leveled in the direction in which the reflectance decreases over the entire wavelength range. Is done. In addition, the thicker the coating composition for electroless plating, the greater the degree of correction and leveling, and the correction and leveling are performed in such a direction that the reflectance of the entire reflection spectrum is further reduced. However, the reflectivity in the long wavelength region is higher than the reflectivity in the short wavelength region.

  That is, in the present embodiment, the reflection spectrum of the electroless plating layer 30 is determined in advance by the fine line pattern portion 20 containing the electroless plating coating composition (however, excluding additives in the present description). Correction and leveling can be performed in the direction in which the reflectance decreases in the wavelength range.

  Here, from the viewpoint of further leveling the reflection spectrum, that is, from the viewpoint of further reducing the reflectance in the long wavelength region, the coating composition for electroless plating contains an additive that absorbs light in a predetermined wavelength range. It is preferable to include. The reflection spectrum of the electroless plating layer 30 is reflected in a predetermined wavelength range by the fine line pattern portion 20 containing an additive that absorbs light in a predetermined wavelength range and a coating composition for electroless plating. Is further leveled in the direction of decreasing.

  FIG. 7 shows an example of an absorption spectrum of the additive according to the present embodiment. The horizontal axis in FIG. 7 is the wavelength (nm), and the vertical axis is the extinction coefficient.

  For example, a dye having a maximum absorption wavelength indicated by an absorption spectrum 500 of 609 nm (for example, FDR-001), a dye having a maximum absorption wavelength indicated by an absorption spectrum 502 of 680 nm (for example, FDR-002), and a maximum indicated by an absorption spectrum 504 A dye having an absorption wavelength of 725 nm (for example, FDR-005), a dye having a maximum absorption wavelength indicated by an absorption spectrum 506 of 754 nm (for example, FDN-001), and a dye having a maximum absorption wavelength of 807 nm indicated by an absorption spectrum 508 Each absorption spectrum (for example, FDN-002) is shown in FIG. As shown in FIG. 7, the dye as an additive has a function of mainly absorbing a predetermined wavelength (maximum absorption wavelength).

  The reflection spectrum of the electroless plating layer 30 is such that the reflectance decreases in a predetermined wavelength range due to absorption by the fine line pattern portion 20 (that is, electroless plating coating composition) and absorption by a predetermined additive. Correction and leveling.

  FIG. 8 shows an example of leveling of the reflection spectrum by the additive. Specifically, FIG. 8A shows the leveling of the reflection spectrum when a layer made of a coating composition for electroless plating according to this embodiment containing a predetermined additive is formed on electroless copper plating. FIG. 8B shows an example of a change in the maximum value of the reflectance due to the difference in the application amount of the coating composition for electroless plating containing the additive.

  Specifically, the example which added the pigment | dye as the following five types of additives to the coating composition for electroless plating is shown.

Dye 1: A dye having a maximum absorption wavelength of 609 nm (for example, FDR-001)
Dye 2: A dye having a maximum absorption wavelength of 680 nm (for example, FDR-002)
Dye 3: A dye having a maximum absorption wavelength of 725 nm (for example, FDR-005)
Dye 4: A dye having a maximum absorption wavelength of 754 nm (for example, FDN-001)
Dye 5: Dye having a maximum absorption wavelength of 807 nm (for example, FDN-002)

In addition, the amount of addition of the pigment 1 alone when the coating amount when the coating composition for electroless plating containing five kinds of additives is applied on a predetermined electroless metal plating is 1 g / m ² . coating amount of 0.003 g / ^{m 2,} and the dye 2 single coating amount of 0.004 g / ^{m 2,} and the coating amount of dye 3 alone is 0.003 g / ^{m 2,} and the the coating amount of the dye 4 alone 0. 002g / ^{m 2} becomes an amount that the coating amount of the dye 5 alone is 0.008 g / ^{m 2.} In other words, the addition amount is 0.3% for Dye 1, 0.4% for Dye 2, and 0.3% for Dye 3 with respect to the total mass of the coating composition for electroless plating and the five types of additives. %, Dye 4 is 0.2%, and dye 5 is 0.8%. Hereinafter, in the present description, a coating composition for electroless plating containing five kinds of additives is referred to as a coating composition for electroless plating containing additives.

The reflection spectrum 430 of FIG. 8A shows the reflection spectrum of copper plating in which the layer of the coating composition for electroless plating containing an additive is not formed on the surface. And the reflection spectrum 432 of Fig.8 (a) is a reflection spectrum at the time of apply | coating the coating composition for electroless plating containing an additive on copper plating 0.3g / m < ² >, and the reflection spectrum 434 is copper plating. It is a reflection spectrum when 0.5 g / m ^{2 of the} coating composition for electroless plating containing an additive is applied on the top, and the reflection spectrum 436 represents a coating composition for electroless plating containing an additive on the copper plating. The reflection spectrum is obtained when 7 g / m ^{2 is} applied, and the reflection spectrum 438 is a reflection spectrum obtained when 0.9 g / m ^{2 of the} coating composition for electroless plating containing an additive is applied on the copper plating.

  As can be seen by comparing FIG. 8A and FIG. 3, when a layer made of an electroless plating coating composition containing an additive is formed on electroless copper plating, in a long wavelength region having a wavelength of about 580 nm or more, The reflection spectrum is corrected and leveled in the direction in which the reflectance decreases. For example, as shown in the reflection spectrum 432, the reflectance gradually increased in a long wavelength region having a wavelength of about 580 nm or more in FIG. 3, whereas in FIG. Is lowered and leveled as a whole reflection spectrum.

And when the film thickness of the coating composition for electroless plating containing an additive on electroless copper plating is increased, the maximum value of the reflectivity decreases as the film thickness increases. In FIG. 8A, the maximum reflectance when the coating composition for electroless plating is not applied is 88.2%, and the maximum reflectance when the coating amount is 0.3 g / m ^2. Is 21.3%, the maximum reflectance when the coating amount is 0.5 g / m ² is 8.6%, and the maximum reflectance when the coating amount is 0.7 g / m ² is 3%. The maximum reflectance when the coating amount is 0.9 g / m ² is 1.4%.

  And as shown to Fig.8 (a), when the film thickness of the coating composition for electroless plating containing an additive on electroless copper plating is increased, the reflectance spectrum is reduced in the direction in which the reflectance decreases over the entire wavelength range. The whole is leveled. Moreover, the thicker the film thickness of the coating composition for electroless plating containing additives, the greater the leveling level, and the leveling in the direction in which the reflectance of the entire reflection spectrum is further reduced.

  FIG. 9 shows a change in reflectivity due to a difference in the coating amount of a layer composed only of a coating composition for electroless plating and a change in reflectivity due to a difference in the coating amount of an electroless plating paint composition containing an additive. An example of comparison is shown.

  Specifically, FIG. 9 is a diagram in which FIG. 6 (a) and FIG. 8 (b) are combined. As can be seen from the comparison of the graph 450 of the layer consisting only of the coating composition for electroless plating and the graph 452 of the layer consisting of the coating composition for electroless plating containing additive, the coating composition for electroless plating containing additive is used. It can be seen that the maximum value of the reflectance of the electroless plating layer can be further reduced. Although it can be determined whether or not an additive is added according to the use of the coating composition for electroless plating according to the present embodiment, the coating composition for electroless plating is an additive from the viewpoint of further reducing the reflectance. It is preferable to contain.

  FIG. 10 shows another example of leveling of the reflection spectrum by the additive. Specifically, FIG. 10A shows leveling of a reflection spectrum when a layer made of a coating composition for electroless plating according to this embodiment containing a predetermined additive is formed on electroless copper plating. FIG. 10B shows an example of the change in reflectance due to the difference in the coating amount of the coating composition for electroless plating containing the additive.

  Specifically, an example in which a dye (Dye 5: a dye having a maximum absorption wavelength of 807 nm (for example, FDN-002)) as an additive is added to the coating composition for electroless plating is shown.

In addition, when the coating amount when the coating composition for electroless plating containing the additive is applied on a predetermined electroless metal plating is 1 g / m ² , the coating amount of the dye 5 alone is The amount is 0.01 g / m ² . In other words, the addition amount is a mass at which the dye 5 is 1.0% with respect to the total mass of the coating composition for electroless plating and the additive. Hereinafter, in the present description, a coating composition for electroless plating containing an additive is referred to as a coating composition for electroless plating containing an additive.

A reflection spectrum 440 in FIG. 10A shows a reflection spectrum of copper plating in which a layer of an electroless plating coating composition containing an additive is not formed on the surface. And the reflection spectrum 442 of Fig.10 (a) is a reflection spectrum at the time of apply | coating 0.3 g / m < ² > of the coating composition for electroless plating containing an additive on copper plating, and the reflection spectrum 444 is copper plating. It is a reflection spectrum when 0.5 g / m ^{2 of the} coating composition for electroless plating containing an additive is applied on the top, and the reflection spectrum 446 shows a coating composition for electroless plating containing an additive on the copper plating. This is a reflection spectrum when 7 g / m ^{2 is} applied, and the reflection spectrum 448 is a reflection spectrum when 0.9 g / m ^{2 of the} coating composition for electroless plating containing an additive is applied onto copper plating.

  As can be seen by comparing FIG. 10 (a) and FIG. 3, when a layer made of an electroless plating coating composition containing an additive is formed on electroless copper plating, in a long wavelength region having a wavelength of about 650 nm or more, The reflection spectrum is corrected and leveled in the direction in which the reflectance decreases. For example, as shown in the reflection spectrum 442, the reflectance gradually increased in a long wavelength region having a wavelength of about 650 nm or more in FIG. 3, whereas in FIG. Is lowered and leveled as a whole of the reflection spectrum. In particular, in the wavelength region including the maximum value of the reflectance, when the coating composition for electroless plating containing an additive is used, the reflection spectrum is corrected in the direction of greatly reducing the reflectance.

And when the film thickness of the coating composition for electroless plating containing an additive on electroless copper plating is increased, the maximum value of the reflectivity decreases as the film thickness increases. In FIG. 10A, the maximum reflectance when the coating composition for electroless plating is not applied is 88%, and the maximum reflectance when the coating amount is 0.3 g / m ² is 26. %, The maximum reflectance when the coating amount is 0.5 g / m ² is 12%, and the maximum reflectance when the coating amount is 0.7 g / m ² is 6%. The maximum reflectivity when 3 is 0.9 g / m ² is 3%.

  And as shown to Fig.10 (a), when the film thickness of the coating composition for electroless plating containing an additive on electroless copper plating is increased, the reflectance spectrum is reduced in the direction in which the reflectance decreases over the entire wavelength range. The whole is leveled. Moreover, the thicker the film thickness of the coating composition for electroless plating containing additives, the greater the leveling level, and the leveling in the direction in which the reflectance of the entire reflection spectrum is further reduced.

  As described above, the leveled spectrum which is a spectrum obtained by leveling the reflection spectrum according to the coating composition for electroless plating according to the present embodiment, the type of additive, the number of types of additive used, and / or the amount thereof. Can be controlled freely. That is, according to the transparent substrate 1 with a large conductive pattern according to the present embodiment, a leveled spectrum according to the application can be designed. Specifically, it is selected from the group consisting of the film thickness of the coating composition for electroless plating, the types of additives, the number of types of additives used, and the amount of additives added to the coating composition for electroless plating. By adjusting at least one of these, a leveled spectrum can be designed.

[Method of manufacturing transparent substrate 1 with large conductive pattern]
FIG. 11 shows an example of the flow of manufacturing the transparent substrate with a large conductive pattern according to the embodiment of the present invention. Specifically, FIG. 11A shows an example of the outline of the manufacturing flow of the transparent substrate 1 with a large conductive pattern, and FIG. 11B shows the outline of the manufacturing flow of the transparent substrate 1a with a large conductive pattern. An example is shown. FIG. 12 shows an example of the flow of manufacturing the fine line pattern portion according to the embodiment of the present invention.

  Reference is made to the flow of manufacturing the transparent substrate 1 with a large conductive pattern shown in FIG. First, as shown to (a-1) of Fig.11 (a), the transparent base material 10 is prepared (base material preparation process). In this case, one surface 100a of the transparent substrate 10 may be subjected to a cleaning process. Next, as shown to (a-2) of Fig.11 (a), the thin wire | line pattern part 20 is formed in the one surface 100a of the transparent base material 10 using the coating composition for electroless plating (pattern formation). Process).

  In the pattern forming step, the fine line pattern portion 20 can be formed on the one surface 100a of the transparent substrate 10 using an inkjet printing method, a gravure offset printing method, a flexographic printing method, or the like. Here, when manufacturing the transparent substrate 1 with a large conductive pattern, the transparent substrate 10 is enlarged and / or the line width of the fine line pattern portion 20 is reduced (for example, a fine line pattern having a line width of 5 μm or less is formed). From the standpoint of realizing (A), it is preferable to use a flexographic printing method. In particular, it is preferable to use a flexographic printing method in which the minimum line width of the fine line pattern portion 20 can be set to 200 nm and the thickness of the fine line pattern portion 20 can be adjusted to at least about 1 nm to about 2 μm.

  For example, as shown in FIG. 12, in the pattern forming step, the fine line pattern portion 20 can be formed by a flexographic printing method. Specifically, first, as shown in FIG. 12A, the rotating body 210, the blanket 200 provided on at least a part of the surface of the rotating body 210, and the electroless plating coating composition are supplied to the blanket 200. A flexographic printing apparatus including an injector 220 and a rotary body 240 that is disposed in the vicinity of the rotary body 210 and has a printing member 230 provided on the surface thereof with a convex portion 235 corresponding to the fine line pattern portion 20 on at least a part of the body surface. Can be used.

  Then, as shown in FIG. 12A, the electroless plating coating composition 25 is supplied from the injector 220 onto the surface of the blanket 200. Thereby, the coating composition 25 for electroless plating is held on the surface of the blanket 200. And as shown in FIG.12 (b), the coating composition for electroless plating is applied to the surface of the convex part 235 of the printing member 230 in which the convex part 235 corresponding to the fine line pattern part 20 was provided in the surface from the blanket 200. Is transferred (first transfer step). That is, the rotating body 210 and the rotating body 240 are rotated in a predetermined direction in such an arrangement that the electroless plating coating composition 25 on the surface of the blanket 200 is in contact with the surface of the convex portion 235. Thereby, the coating composition 25 for electroless plating is transferred onto the surface of the convex portion 235.

  Next, as shown in FIG.12 (c), the electroless-plating coating composition 25 of the surface of the convex part 235 of the printing member 230 is transcribe | transferred to the transparent base material 10 (2nd transcription | transfer process). That is, the rotary body 240 is rotated in an arrangement in which the surface of the convex portion 235 of the printing member 230 and the one surface 100a of the transparent substrate 10 are in contact with each other, and the transparent substrate 10 is moved in a predetermined direction in accordance with the rotation. Let Thereby, the fine line pattern portion 20 is formed on the one surface 100a of the transparent substrate 10.

  And as shown to (a-3) of Fig.11 (a), the electroless-plating layer 30 is formed by the electroless-plating method on the surface of the thin wire | line pattern part 20 formed with the coating composition for electroless-plating. (Electroless plating process). That is, the thin wire pattern portion 20 is brought into contact with the plating solution, and the electroless plating layer 30 is formed by electroless plating. Thereby, the transparent substrate 1 with a large conductive pattern is manufactured.

  The plating solution for electroless plating is not particularly limited as long as it is a plating solution used for electroless plating. Various conditions of electroless plating are not particularly limited. For example, under the conditions of the electroless plating treatment, the treatment temperature is about 25 ° C. or more and 45 ° C. or less in an electroless copper plating bath, and the treatment time is about 10 minutes or more and 20 minutes or less.

  Reference is made to the flow of manufacturing the transparent substrate with a large conductive pattern 1a shown in FIG. The production of the transparent substrate 1a with a large conductive pattern is different from the production of the transparent substrate 1 with a large conductive pattern in that the thin line pattern portion 20 and the electroless plating layer 30 are formed on the other surface 100b of the transparent base material 10. Can be manufactured by substantially the same process as the manufacturing method of the transparent substrate 1 with a large conductive pattern. Therefore, a detailed description is omitted except for differences.

  As shown in (b-2) of FIG. 11B, the fine line pattern portion 20 is formed on both the one surface 100a and the other surface 100b of the transparent substrate 10 (double-sided pattern forming step). In the double-sided pattern forming step, the flexographic printing method can be used as described above. Subsequently, the surface of the fine line pattern portion 20 provided on the one surface 100a of the transparent substrate 10 and the surface of the fine line pattern portion 20 provided on the other surface 100b are electrolessly electrolessly plated. The plating layer 30 is formed (electroless plating process). Here, the surface of the fine line pattern portion 20 provided on the one surface 100a by immersing the transparent substrate 10 having the fine line pattern portion 20 formed on both the one surface 100a and the other surface 100b in the plating solution. And the electroless plating layer 30 can be simultaneously formed on the surface of the fine line pattern portion 20 provided on the other surface 100b. Thereby, the transparent substrate 1a with a large conductive pattern is manufactured.

[Method for producing transparent substrate 1b with a large conductive pattern]
FIG. 13 shows an example of the flow of manufacturing a transparent substrate with a large conductive pattern according to another modification of the embodiment of the present invention.

  First, as shown to (c-1) of FIG.13 (c), the transparent base material 10 is prepared (base material preparation process). Next, as shown in (c-2) of FIG. 13 (c), a thin line pattern portion 20 is formed on one surface 100a of the transparent substrate 10 using a coating composition for electroless plating (pattern formation). Process). And as shown to (c-3) of FIG.13 (c), the electroless-plating layer 30 is formed by the electroless-plating method on the surface of the fine wire pattern part 20 formed with the coating composition for electroless-plating. (Electroless plating process). Since these base material preparation process, pattern formation process, and electroless plating process are the same processes as the description in FIG. 11 and FIG. 12, detailed description is omitted.

  Subsequently, as shown in FIG. 13C-4, the fine line pattern portion 20 is formed on one surface 150 of the base material 15 having flexibility or flexibility using the electroless plating coating composition. (Second pattern formation step). The base material 15 includes, for example, a material having flexibility and solvent resistance. Moreover, the method same as the description in FIG. 12 can be employ | adopted for the method of forming the thin wire | line pattern part 20 in the surface 150 of the base material 15. FIG. Next, the surface of the fine line pattern portion 20 formed on the one surface 150 of the base material 15 (that is, the surface opposite to the side in contact with the base material 15 of the fine wire pattern portion 20) is electrolessly plated. The electroless plating layer 30 is formed (second electroless plating step). The second electroless plating process can employ the same method as the above electroless plating process. Thereby, the base material 3 with a conductive pattern is manufactured.

  Next, as shown in (c-5) of FIG. 13, the conductive pattern-attached base material 3 is formed on the other surface 100b of the transparent base material 10 having the fine line pattern portion 20 and the electroless plating layer 30 on the one surface 100a. One surface 150 side is made to oppose, and the electroless-plating layer 30 of the base material 3 with a conductive pattern is affixed on the surface 100b (transfer process). A predetermined adhesive may be used for pasting. And the base material 15 is removed (base material removal process). Thereby, as shown to (c-6) of FIG. 13, by forming the electroless plating layer 30 and the fine line pattern part 20 on the other surface 100b of the transparent base material 10 from the surface 100b side, A transparent substrate 1b with a large conductive pattern is manufactured.

  Instead of the second pattern formation step, the second electroless plating step, the transfer step, and the substrate removal step, the following steps may be employed. That is, a metal film forming step of forming a predetermined metal film on the other surface 100b of the transparent substrate 10 using a vapor deposition method such as a sputtering method, and a thin wire using an electroless plating coating composition on the metal film A transparent substrate 1b with a large conductive pattern is manufactured through a pattern forming step for forming the pattern portion 20 and an etching step for removing the metal film in the region excluding the region where the fine line pattern portion 20 is formed by etching or the like. May be. Further, the metal material removed by the etching process may be subjected to a predetermined treatment and reused.

  Moreover, the transparent substrate 1c with a large conductive pattern described in FIG. 1 (d) uses the substrate 3 with a conductive pattern obtained by the second pattern formation step and the second electroless plating step, and further It can manufacture by forming the electroless-plating layer 30 and the fine wire pattern part 20 in the one surface 100a of the transparent base material 10 using the transfer process of this, and a base material removal process (transfer manufacturing method).

  Specifically, in this transfer manufacturing method, when a base material (hereinafter referred to as “target base material”), which is feared of durability against various solvents, is used as the transparent base material 10, or in the manufacturing process, the target base material is used. It can be used when it is difficult to directly apply the electroless plating coating composition and / or when it is difficult to directly form the electroless plating layer 30 by electroless plating. Examples of the base material in which durability against various solvents is concerned include members constituting liquid crystal panels such as polarizing plates and color filters.

  That is, in the transfer manufacturing method according to the present embodiment, first, the fine line pattern portion 20 is formed on one surface of a predetermined base material using the electroless plating coating composition (the second pattern forming step and the above). The same process). The predetermined base material includes, for example, a material having flexibility and solvent resistance. Moreover, the method same as the description in FIG. 12 can be used for the method of forming the fine line pattern part 20 on the surface of a predetermined base material. Next, an electroless plating layer 30 is formed on the surface of the fine line pattern portion 20 formed on one surface of a predetermined substrate by an electroless plating method (the same process as the above-described second electroless plating process) .) Then, one surface of the target base material is opposed to the surface of the predetermined base material on which the electroless plating layer 30 is formed, and the one surface of the target base material from the electroless plating layer 30 side. The electroless plating layer 30 and the fine line pattern portion 20 are attached (transfer process). In the transfer step, a predetermined adhesive may be applied to one surface of the target substrate and / or the surface of the electroless plating layer 30 of the predetermined substrate. Then, a predetermined base material is removed (equipment removal step). Thereby, the transparent substrate 1c with a large sized conductive pattern demonstrated in FIG.1 (d) can be manufactured.

  Thereby, for example, since the liquid crystal display unit can be configured using the transparent substrate 1c with a large conductive pattern, in the liquid panel in which the liquid crystal display unit and the touch panel unit are independent, the transparent substrate with the large conductive pattern is provided in the liquid crystal display unit. The liquid crystal display unit and the touch panel unit can be integrated using 1c. Thereby, members, such as an optical transparent adhesion film (OCA), can be omitted, for example.

[Laminated structure]
FIG. 14 shows a conceptual example of a cross section of a laminated structure provided with a transparent substrate with a large conductive pattern according to an embodiment of the present invention.

  First, reference is made to FIG. As an example, the laminated structure 5 shown in FIG. 14A is configured by laminating a plurality of transparent substrates 1c with a large conductive pattern described in FIG. Specifically, the first transparent substrate 1c with a large conductive pattern and the one surface 100a side of the first transparent substrate 1c with a large conductive pattern (that is, the electroless plating layer 30 and the fine line pattern portion 20 are provided. The transparent optical adhesive film 50 on the one surface 100a side of the second large conductive pattern-containing transparent substrate 1c and the second large conductive pattern-attached transparent substrate 1c. And a cover glass 40 bonded together. That is, the 1st transparent substrate 1c with a large conductive pattern and the 2nd transparent substrate 1c with a large conductive pattern are the one surface 100a side of the transparent substrate 1c with a 1st large conductive pattern, and a 2nd large conductive pattern attachment. The other surface 100 b side of the transparent substrate 1 c is bonded through the transparent optical adhesive film 50.

  Moreover, the laminated structure 5 is arrange | positioned at the edge part area | region of the one surface 100a of the 1st large sized conductive pattern transparent substrate 1c, and is electrically connected with the electroless-plating layer 30 of the 1st large sized conductive pattern transparent substrate 1c. A flexible printed circuit board 70 connected to the second electroconductive plating layer 30 of the second large electroconductive pattern-containing transparent substrate 1 disposed on the end region of one surface 100a of the second electroconductive substrate with a large electroconductive pattern 1c, A flexible printed circuit board 72 that is electrically connected can also be provided. The flexible printed circuit board 70 and the flexible printed circuit board 72 may be connected to an external controller (not shown).

  And when the laminated structure 5 is observed from the direction 300 in which the laminated structure 5 is visually recognized, the fine line pattern portion 20 of the first transparent substrate with a large conductive pattern 1c and the second transparent substrate with a large conductive pattern 1c It is arranged on the side where the fine line pattern portion 20 can be visually recognized. By adding the additive which concerns on this embodiment to each thin wire | line pattern part 20, it can suppress making the user who observed the laminated structure 5 recognize reflection of the light by the electroless-plating layer 30. FIG.

  Next, refer to FIG. As an example, the laminated structure 7 shown in FIG. 14B includes the transparent substrate 1b with a large conductive pattern described in FIG. Specifically, the transparent film 60 is attached to one surface of the transparent substrate 1b with a large conductive pattern via the transparent optical adhesive film 50, and the cover glass 40 is attached to the other surface via the transparent optical adhesive film 52. It is done. Moreover, the laminated structure 7 is arrange | positioned at the edge part area | region of one surface of the transparent substrate 1b with a large conductive pattern, and the flexible printed circuit board 70 electrically connected with the electroless-plating layer 30 provided in one surface side. And a flexible printed circuit board 72 that is disposed in an end region on the other surface of the transparent substrate 1c with a large conductive pattern and is electrically connected to the electroless plating layer 30 on the other surface side. The flexible printed circuit board 70 and the flexible printed circuit board 72 may be connected to an external controller (not shown).

  When the laminated structure 7 is observed from the direction 305 for visually recognizing the laminated structure 7, the fine line pattern portion 20 on one surface side of the transparent substrate with a large conductive pattern 1b and the fine line pattern portion 20 on the other surface side. It is arranged on the side where can be visually recognized. By adding the additive which concerns on this embodiment to each thin wire | line pattern part 20, it can suppress making the user who observed the laminated structure 7 aware of reflection of the light by the electroless-plating layer 30. FIG.

  Any of the transparent substrate 1 with a large conductive pattern to the transparent substrate 1b with a large conductive pattern according to the present embodiment includes, for example, a product including any of the transparent substrate 1 with a large conductive pattern or the transparent substrate 1b with a large conductive pattern, It can be used as a touch panel, a liquid crystal panel, a display, or the like. Moreover, any of the transparent substrate 1 with a large conductive pattern or the transparent substrate 1b with a large conductive pattern is a panel having a laminated structure of a plurality of members, for example, the transparent substrate with a large conductive pattern 1 or the transparent with a large conductive pattern Any of the substrates 1b can be used as a panel provided as one member constituting the laminated structure. In this case, it is preferable that one of the transparent substrate 1 with a large conductive pattern or the transparent substrate 1b with a large conductive pattern is disposed on the outermost side of the laminated structure.

(Effect of embodiment)
Since the transparent substrate 1 with a large conductive pattern according to the present embodiment can form the fine line pattern portion 20 using the coating composition for electroless plating, and can form the electroless plating layer 30 on the surface of the fine line pattern portion 20, A transparent substrate with a conductive pattern can be provided at a low cost, even if it is used for a large panel of 32 inches or more, and the increase in electrical resistance does not substantially adversely affect it. Moreover, by including a predetermined additive in the coating composition for electroless plating, the spectrum of light reflected by the electroless plating layer 30 can be leveled in the direction in which the reflectance decreases. Thereby, according to the transparent substrate 1 with a large conductive pattern, the influence of light reflection by the electroless plating layer 30 can be substantially eliminated even when the user observes from the outside. The visibility of the image can be improved by improving the invisibility of the layer 30 and improving the contrast when the transparent substrate 1 with a large conductive pattern is applied to a liquid crystal panel or a touch panel.

[Example]
Hereinafter, description will be made using examples.

<Examples 1-5, Comparative Examples 1-6>
Each compounding substance was added at the blending ratio shown in Table 1, mixed and stirred to prepare a coating composition for electroless plating.

In Table 1, the unit of the compounding amount of each compounding substance is “part by mass”. Further, in Table 1, the details of the compounding substances are as follows.
(Metaloid)
Product name: Metalloid (manufactured by IOX)
(Dye 1)
Product name: FDR-001 (manufactured by Yamada Chemical Co., Ltd.)
(Dye 2)
Product name: FDR-002 (manufactured by Yamada Chemical Co., Ltd.)
(Dye 3)
Product name: FDR-005 (manufactured by Yamada Chemical Co., Ltd.)
(Dye 4)
Product name: FDN-001 (manufactured by Yamada Chemical Co., Ltd.)
(Dye 5)
Product Name: FDN-002 (manufactured by Yamada Chemical Co., Ltd.)

<Application of coating composition for electroless plating on plating>
The prepared coating composition for electroless plating was applied onto an electroless copper plating prepared in advance by electroless plating on a PET film using a wire bar. The film thickness of electroless copper plating is 0.2 μm, and the film thickness (g / m ² ) of the coating composition for electroless plating is as shown in Table 1.

<Physical properties of coating film>
The coating composition for electroless plating applied on the copper plating was checked for adhesion and plating availability. The adhesion of the coating composition for electroless plating was confirmed by conducting a tape peeling test specified in JIS8504. The results are shown in Table 1. The evaluation criteria are as follows.

Good adhesion: ○
Poor adhesion: ×

<Verification of invisibility>
About the coating composition for electroless plating apply | coated on copper plating, copper plating was observed visually from the application side of the coating composition for electroless plating, and the color of copper plating was confirmed. Moreover, about the coating composition for electroless plating apply | coated on copper plating, the reflection spectrum was measured using the spectrophotometer, and the maximum reflectance ( _Rmax ) was measured. The results are shown in Table 1. The evaluation criteria are as follows.

When the color of copper plating cannot be confirmed visually: ○
When the color of copper plating can be confirmed visually: ×

  FIG. 15 is a diagram in which the maximum reflectance is plotted against the film thickness of the electroless plating coating composition. Specifically, the maximum reflectance measured in the measurement of the reflection spectrum was plotted against the film thicknesses of Examples 1 to 5 and Comparative Examples 1 to 6. In addition, the vertical axis | shaft of FIG. 11 is a logarithmic axis.

As can be seen with reference to Table 1 and FIG. 15, in the coating compositions for electroless plating according to Examples 1 to 5, the maximum reflectance is the upper limit of invisibility (line 510, reflection in FIG. 15). The rate was 10% or less.) And less than the upper limit of adhesion (line 512 in FIG. 15 with a film thickness of less than 0.8 g / m ² ). That is, in Example 1, as shown in data 520, the film thickness is 0.5 g / m ² and the adhesion is good, and the maximum reflectance is 8%, which is below the upper limit of invisibility. It was. In Example 2, as shown in data 522, the film thickness is 0.6 g / m ² , the adhesion is good, and the maximum reflectance is 5%, which is below the upper limit of invisibility. It was. In Example 3, as shown in data 524, the film thickness was 0.7 g / m ² and the adhesion was good, and the maximum reflectance was 4%, which was below the upper limit of invisibility. It was. In Example 4, as shown in data 526, the film thickness is 0.6 g / m ² , the adhesion is good, and the maximum reflectance is 8%, which is below the upper limit of invisibility. It was. In Example 5, as shown in data 528, the film thickness is 0.7 g / m ² and the adhesion is good, and the maximum reflectance is 6%, which is below the upper limit of invisibility. It was.

On the other hand, as shown in data 530 in Comparative Example 1, although the film thickness was 0.7 g / m ² and the adhesion was good, the maximum reflectance was 11%, which exceeded the upper limit of invisibility. . In Comparative Example 2, as shown in data 532, the maximum reflectance was 5%, which was below the upper limit of invisibility, but the film thickness was 1.0 g / m ² and the adhesion was poor. It was. In Comparative Example 3, as shown in data 534, although the film thickness was 0.4 g / m ² and the adhesion was good, the maximum reflectance was 14%, which exceeded the upper limit of invisibility. . In Comparative Example 4, as shown in data 536, the maximum reflectance was 2%, which was below the upper limit of invisibility, but the film thickness was 0.8 g / m ² and the adhesion was poor. It was. In Comparative Example 5, as shown in data 538, although the film thickness was 0.5 g / m ² and the adhesion was good, the maximum reflectance was 12%, which exceeded the upper limit of invisibility. . In Comparative Example 6, as shown in data 540, the maximum reflectance was 4%, which was below the upper limit of invisibility, but the film thickness was 0.8 g / m ² and the adhesion was poor. It was.

  As described above, it was shown that all of the electroless plating coating compositions according to Examples 1 to 5 have good adhesion and can appropriately suppress reflection from the electroless plating layer.

  While the embodiments and examples of the present invention have been described above, the embodiments and examples described above do not limit the invention according to the claims. In addition, it should be noted that not all combinations of features described in the embodiments and examples are essential to the means for solving the problems of the invention.

(reference)
In addition, you may specify the transparent substrate with a large sized conductive pattern which concerns on this embodiment as follows.
“With a transparent substrate,
On one surface of the transparent substrate, a fine line pattern portion containing a coating composition for electroless plating containing metal particles serving as the core of electroless plating,
An electroless plating layer provided on the opposite surface of the transparent substrate of the fine line pattern portion,
The reflectance of light reflected by the electroless plating layer through the fine line pattern portion is 10% or less,
The transparent substrate with a large conductive pattern in which the coating composition for electroless plating contained in the fine line pattern portion has a film thickness of less than 0.8 g / m ² . "

DESCRIPTION OF SYMBOLS 1, 1a, 1b, 1c Large substrate with conductive pattern 3 Base material with conductive pattern 5, 7 Laminated structure 10 Transparent substrate 15 Base material 20 Fine wire pattern part 25 Electroless plating coating composition 30 Electroless plating layer 40 Cover glass 50, 52 Transparent optical adhesive film 60 Transparent film 70, 72 Flexible printed circuit board 100a, 100b Surface 150 Surface 200 Blanket 210 Rotating body 220 Injector 230 Printing member 235 Convex part 240 Rotating body 300, 305 Direction 400, 402, 404, 406, 408 Reflection spectrum 410, 412, 414, 416, 418 Reflection spectrum 420, 422, 424, 426, 428 Reflection spectrum 430, 432, 434, 436, 438 Reflection spectrum 440, 442, 444 446, 448 reflection spectrum 450, 452 graphs 500,502,504,506,508 absorption spectrum 510 line 512 line 520,522,524,526,528 data 530,532,534,536,538,540 data

Claims (6)

A transparent substrate;
On one surface of the transparent substrate, containing a coating composition for electroless plating containing metal particles serving as the core of electroless plating, a fine line pattern portion having a line width of 100 μm or less,
A transparent substrate with a large conductive pattern, comprising: an electroless plating layer provided on a surface of the fine line pattern portion opposite to the transparent substrate.   The fine line pattern portion absorbs at least part of light having a wavelength exhibiting at least the maximum reflectance in the reflection spectrum of the electroless plating layer, thereby reducing light reflection from the electroless plating layer. The transparent substrate with a large conductive pattern according to claim 1.   An additive for correcting the spectrum by absorbing at least a part of light having a wavelength exhibiting at least the maximum reflectance of the spectrum of light reflected by the electroless plating layer, wherein the coating composition for electroless plating is used. The transparent substrate with a large conductive pattern according to claim 1 or 2, wherein the reflection spectrum of the electroless plating layer is corrected by containing the electroless plating layer.   The transparent substrate with a large conductive pattern according to claim 2 or 3, wherein a reflectance of light reflected by the electroless plating layer through the fine line pattern portion is 10% or less. The electroless plating coating composition is
(A) a composite of the metal particles and a dispersant,
(B) contains a solvent, and (C) a binder,
The transparent substrate with a large conductive pattern according to claim 1, wherein the fine line pattern portion has a film thickness of less than 0.8 g / m ² . The metal particles include at least one metal particle selected from the group consisting of palladium particles, gold particles, silver particles, and platinum particles,
The transparent substrate with a large conductive pattern according to claim 5, wherein the dispersant is a copolymer polymer dispersant having at least one group selected from the group consisting of a hydroxyl group and a carboxyl group.