JP2018148125A - Electronic equipment and manufacturing method of electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electronic equipment capable of dissipating heat effectively regardless of at which position of a board multiple heating components are placed, and capable of being assembled or manufactured simply, and to provide a manufacturing method of electronic equipment.SOLUTION: Electronic equipment includes a board, a first heating component and a second heating component mounted on the board, and a first heat slinger and a second heat slinger provided, respectively, in the first and second heating components, and thermally connected with the first and second heating components. The first and second heat slingers have first and second faces abutting on the first and second heating components, and third and fourth faces provided substantially perpendicularly to the first and second faces. The third and fourth faces constitute a surface of substantially the same height from the board, and one radiator is mounted on the third and fourth faces via an adhesive sheet.SELECTED DRAWING: Figure 7

Description

  The present invention relates to an electronic device that can effectively dissipate heat generated by a heat-generating component in the electronic device and can be easily assembled, and a method for manufacturing the electronic device.

  2. Description of the Related Art In recent years, along with high density mounting due to downsizing of electronic devices, an increase in the amount of heat generated by a heat generating component such as a semiconductor mounted on a substrate constituting the electronic device and the concentration of the heat generating component have become problems.

  In order to solve this problem, cooling is generally performed by mounting a radiator such as a heat sink on a heat-generating component and dissipating the heat from a plurality of heat radiation fins formed on the heat sink. For example, Patent Document 1 discloses an electronic device in which a plurality of heat generating components are attached to one heat sink to dissipate heat from the heat generating components.

JP 2006-210516 A

  However, depending on the arrangement of the plurality of heat generating components on the substrate, the above heat dissipation structure may not be possible. In addition, if an assembly with multiple heat-generating components attached to a heat sink is to be connected by flow soldering, dimensional accuracy is required to insert the lead terminals of the heat-generating components into the holes in the board. Manufactured such as being pressed into the board without being inserted into the hole and bent in an unintended direction, and because the heat-generating component is attached to the heat sink, soldering to the board becomes insufficient when connecting with flow solder There was a problem above.

  The present invention has been made in view of the above problems, and can radiate heat effectively and be easily assembled and manufactured regardless of where a plurality of heat generating components are arranged on the board. An object is to provide a possible electronic device and a method of manufacturing the electronic device.

  The electronic device according to the present invention is provided on each of the substrate, the first heat generating component and the second heat generating component mounted on the substrate, the first heat generating component, and the second heat generating component. A first heat radiating plate and a second heat radiating plate thermally connected to the first heat radiating component and the second heat radiating component, wherein the first heat radiating plate and the second heat radiating plate are the first heat radiating plate and the second heat radiating plate. The first surface and the second surface that are in contact with the heat generating component and the second heat generating component, and the third surface and the fourth surface provided substantially perpendicular to the first surface and the second surface. The third surface and the fourth surface constitute a surface having substantially the same height from the substrate, and an adhesive sheet is interposed between the third surface and the fourth surface. One radiator is mounted.

  According to the present invention, the first heat generating component and the second heat generating component mounted on the substrate are thermally connected to the first surface and the second surface of the first heat radiating plate and the second heat radiating plate. One radiator is mounted on the third surface and the fourth surface provided substantially perpendicular to the first surface and the second surface via an adhesive sheet. Therefore, since heat from a plurality of heat generating components can be radiated with a single radiator, a large heat radiating area can be secured and heat dissipation can be improved.

  In the electronic device according to the present invention, the first heat-generating component and the second heat-generating component are mounted on the substrate at a position where they are not aligned with the side of the substrate. Even when the heat-generating component is arranged at a position that is not aligned with the side of the substrate, a wide heat radiation area can be secured, so that heat can be effectively radiated.

  Further, in the method for manufacturing an electronic device according to the present invention, the first heat generating component, the second heat generating component, the first heat radiating plate, and the second heat radiating plate are solder-connected to the substrate. The radiator can be attached to the third surface and the fourth surface via the adhesive sheet. Accordingly, since the heat radiator is attached after soldering the heat generating component and the heat radiating plate, the lead terminal of the heat generating component is not damaged, and the assembly and manufacturing can be easily performed without insufficient soldering.

  According to the present invention, an electronic device and an electronic device that can effectively dissipate heat and can be easily assembled and manufactured no matter where a plurality of heat generating components are arranged on the substrate. A manufacturing method can be provided.

It is the figure which showed typically the component layout (block diagram) of the electronic device which concerns on 1st Embodiment of this invention. It is the figure which showed typically the thermal radiation structure of the heat-emitting component (bridge diode) of the electronic device which concerns on 1st Embodiment of this invention. It is the figure which showed typically the thermal radiation structure of the heat-emitting component (switch element and diode) of the electronic device which concerns on 1st Embodiment of this invention. It is the figure which showed typically the layout of the thermal radiation structure (before heat radiator attachment) of the heat-emitting component of the electronic device which concerns on 1st Embodiment of this invention. It is the figure which showed typically the layout of the electronic device when attaching a heat radiator with the adhesive sheet from the state of FIG. 4 (the figure seen from the upper surface). It is the figure which showed typically the cut surface AA of the electronic device of FIG. FIG. 7 is an exploded perspective view of FIG. 6.

  Hereinafter, preferred embodiments of the present invention will be described. The subject of the present invention is not limited to the following embodiment. In addition, the constituent elements described below include those that can be easily assumed by those skilled in the art and substantially the same elements, and the constituent elements can be appropriately combined.

  Embodiments of the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

  First, with reference to FIG. 1, a component layout of an electronic device according to a preferred embodiment of the present invention will be described. FIG. 1 is an example of a component layout of an electronic device according to an embodiment of the present invention.

  In this embodiment, a power supply device will be described as an example of an electronic device. As shown in FIG. 1, the power supply device includes a substrate 100, an input terminal 110 mounted on the substrate 100, a line filter 120, a rectifier circuit 130, a PFC (POWER FACTOR CONTROL) circuit 140, and a switching circuit 150. A transformer 160, a rectifier circuit 170, a smoothing circuit 180, and an output terminal 190.

  When voltage is input to the input terminal 110 of the power supply device, noise is reduced by the line filter 120, voltage is rectified by the rectifier circuit 130, harmonics are suppressed by the PFC circuit 140, and switching control of the switching circuit 150 is performed. Thus, the voltage converted by the transformer 160 having the primary winding connected to the switching circuit 150, and the predetermined voltage rectified and smoothed by the smoothing circuit 180 and the rectifying circuit 170 connected to the secondary winding of the transformer 160 is output terminal. 190.

  Although not shown in each drawing described below including FIG. 1, the substrate 100 has through holes for inserting lead terminals of heat-generating components into the substrate, holes for inserting terminals of heat sinks, etc. into the substrate. Provided, and heat-generating components and the like are mounted in various layouts.

Next, a heat dissipation structure for a heat generating component according to the first embodiment of the present invention will be specifically described with reference to FIG. The heat dissipating structure of the heat generating component is an embodiment of the heat sink made of a substrate 100, a bridge diode 131 which is an example of a heat generating component mounted on the substrate 100, and a material having good heat conductivity such as metal. The sheet metal 132 which is an example and the heat radiator 200 mentioned later are comprised. A bridge diode of the rectifier circuit 130 will be described as an example of the heat generating component. In addition, a switch element such as a FET (FIELD EFFECT TRANSISTOR) of the PFC circuit 140, a rectifier element such as a diode element, and the main of the switching circuit 150 Examples thereof include a switch element, a transformer 160, and a rectifier element such as a diode element of the rectifier circuit 170.
The bridge diode 131 includes a resin-molded main body 131a, a mounting hole 131b penetrating from the front surface to the back surface of the main body 131a, and a lead terminal 131c for inserting the bridge diode 131 into the substrate 100 and making an electrical connection. ing.

  The sheet metal 132 is formed in an L shape, and has a first plate part 133 erected substantially perpendicularly to the substrate 100 and a second plate extending substantially perpendicularly from the upper end of the first plate part 133. It is comprised from the board part 134. FIG. In addition, a terminal 137 is provided at the lower end of the first plate portion 133 so as to be inserted into the hole of the substrate 100 and fixed. The first plate portion 133 has a first surface 133a that contacts the main body 131a of the bridge diode 131, and the second plate portion 134 has a third surface 134a on which a heat radiator described later is mounted. The first plate portion 133 is provided with a screw hole 135 for fixing the sheet metal 132 and the bridge diode 131.

  Next, with reference to FIG. 3, the modification of the thermal radiation structure of the heat-emitting component which concerns on 1st Embodiment of this invention is demonstrated concretely. The difference from FIG. 2 is that the L-shaped shape of the sheet metal 132 is changed to a U-shape like the sheet metal 143, and the two heat generating components 141 and 142 are brought into contact with the sheet metal 143.

The sheet metal 143 is formed in a U shape, and connects the first plate portions 144 and 146 erected substantially perpendicular to the substrate 100 and the upper end portions of the first plate portions 144 and 146. As described above, the second plate portion 145 extends substantially perpendicularly from the first plate portions 144 and 146. In addition, terminals 149 and 149 that are inserted into the holes of the substrate 100 and fixed therein are provided at lower ends of the first plate portions 144 and 146. The first plate portions 144 and 146 have second surfaces 144a and 146a that are in contact with the main body 141a and 142a of the FET 141 and the diode element 142 which are an example of the heat generating component, and the second plate portion 145 includes: It has the 4th surface 145a in which the heat radiator mentioned later is mounted.
The first plate portions 144 and 146 are provided with screw holes 147 and 147 for fixing the metal plate 143, the FET 141, and the diode element 142. As described above, when the heat generating components are arranged close to each other, a plurality of heat generating components can be attached to the first surface using the sheet metal 143. In this embodiment, a structure using a U-shaped sheet metal as shown in FIG. 3 is an embodiment in which the PFC circuit 140 is incorporated.

With reference to FIG.2 and FIG.3, the assembly of the thermal radiation structure of a heat-emitting component is demonstrated. First, it demonstrates based on FIG.
First, the bridge diode 131 is attached to the first surface 133a. The mounting hole 131b provided in the main body 131a of the bridge diode 131 and the screw hole 135 provided in the first plate portion 133 of the sheet metal 132 are aligned, and these are screwed and fixed by the screw 136. Then, in a state where the bridge diode 131 and the sheet metal 132 are combined, the lead terminal 131 c and the terminal 137 are inserted into a plurality of through holes and holes provided in the substrate 100. The bridge diode 131 and the sheet metal 132 can be attached by a fixing metal fitting such as a clip or an adhesive member.

  Similarly, in the sheet metal 143 of FIG. 3, the FET 141 and the diode element 142 are attached to the second surfaces 144a and 146a. The mounting holes 141b and 142b provided in the main bodies 141a and 142a of the FET 141 and the diode element 142 and the screw holes 147 and 147 provided in the first plate portions 144 and 146 of the sheet metal 143 are aligned, and the screws 148, These are screwed and fixed by 148. Then, in a state where the FET 141, the diode element 142 and the sheet metal 143 are combined, the lead terminals 141 c and 142 c and the terminals 149 and 149 are inserted into a plurality of through holes and holes provided in the substrate 100. The sheet metal 143 is stable because both of the first plate portions 144 and 146 are inserted and fixed to the substrate 100, and the third surface 145 a of the second plate portion 145 is more horizontal to the substrate 100. It is easy to become.

  The component layout diagram of FIG. 4 will be described. FIG. 4 is a schematic layout diagram (viewed from above) in which each assembly combining the heat generating component and the sheet metal described above is mounted on the substrate 100. The dotted line in FIG. 4 shows the boundary between the first plate portion and the second plate portion corresponding to the plate thickness of the first plate portion. A rectangular shape surrounded by a dotted line indicates a heat-generating component attached to each sheet metal, and the radiator 200 is a heat sink placed on the sheet metal.

  In this embodiment, the rectifier circuit 130, the PFC circuit 140, the switching circuit 150, and the rectifier circuit 170 are provided with heat generating components 131, 141, 142, 151, and 171 respectively, and an L-shaped sheet metal or a U-shaped sheet metal is used. Is provided. The transformer 160 is a heat generating component that generates heat from the coil winding and the core.

These heat generating components are not arranged along the longitudinal direction or the short direction of the substrate 100 but are arranged randomly. Further, the longitudinal direction or the lateral direction constituting the third surface and the fourth surface of the second plate portion are not arranged in a certain direction. That is, each heat generating component is mounted on the substrate 100 at a position that is not aligned with the longitudinal side or the lateral side of the substrate 100.
However, the height from the substrate 100 of the third surface 134a of the second plate portion 134 of the sheet metal 132 mounted on the substrate 100 and the fourth surface 145a of the second plate portion 145 of the sheet metal 143 are substantially the same. is there. Note that the height of the upper surface (third surface or fourth surface) of the L-shaped metal plates 152 and 172, which is the heat dissipation structure of the heat generating components of the switching circuit 150 and the rectifier circuit 170, from the substrate 100 is also the third level of the metal plate 132. The surface 134a of the sheet metal and the fourth surface 145a of the sheet metal 143 are substantially identical. If the third surface and the fourth surface form a sheet metal and form surfaces having substantially the same height from the substrate 100, they are also referred to as the third surface and the fourth surface. Similarly, the first surface and the second surface of the sheet metals 152 and 172 that are erected substantially perpendicularly to the substrate 100 also constitute a sheet metal and a surface that contacts the heat-generating component. The first surface is also referred to as the second surface.

  After inserting terminals to be connected to the substrate 100 by solder flow, such as terminals of heat generating components and sheet metal terminals, and mounting each component constituting the power supply device from the input terminal 110 to the output terminal 190, the solder flow To make a flow solder connection.

  The component layout diagram of FIG. 5 will be described. FIG. 5 is a view in which a radiator 200 is attached to a sheet metal for radiating heat generating components mounted on the substrate 100 after the flow solder connection. In the present embodiment, the rectifier circuit 130, the PFC circuit 140, the switching circuit 150, the transformer 160, and the rectifier circuit 170 include heat generating components. The radiator 200 is placed via the adhesive sheet 210 so as to cover each component including these heat generating components. The adhesive sheet 210 may be composed of a single sheet that is bonded in advance to the lower surface (the third surface or the surface close to the fourth surface) of the radiator 200, or the third surface or the fourth surface. You may comprise from several sheets each adhere | attached on the surface. In the present embodiment, the transformer 160 is thermally conductive so as to be thermally connected between the first surface of the L-shaped sheet metal newly provided for heat dissipation of the transformer 160 and the coil winding of the transformer 160. It is also possible to adopt a structure in which a heat-insulating resin is provided and the heat sink 200 is mounted on the third surface of the L-shaped sheet metal via the adhesive sheet 210 to dissipate the transformer 160. At this time, the L-shaped sheet metal is installed so that the insulation distance between the primary and secondary sides of the transformer 160 is not shortened.

  FIG. 6 is a diagram schematically showing a cut surface AA of the electronic apparatus of FIG. FIG. 7 is an exploded perspective view of FIG.

  The cut surface AA is a cross-sectional view cut across the components constituting the rectifier circuit 130 and the components constituting the rectifier circuit 170. The main body 131a of the bridge diode 131 is arranged such that its plane (surface on which the mounting hole 131b is provided) is substantially parallel to the short side of the substrate 100. On the other hand, the heat generating component 171 of the rectifier circuit 170 is disposed substantially at right angles to the plane of the main body 131a of the bridge diode 131. Similarly, the first surface 133 a of the first heat radiating plate in contact with the bridge diode 131 is also arranged substantially in parallel with the plane of the main body 131 a of the bridge diode 131. On the other hand, the second surface 171 a of the second heat radiating plate that comes into contact with the heat generating component 171 is disposed substantially parallel to the main body plane of the heat generating component 171. That is, the bridge diode 131 and the heat generating component 171 are mounted on the substrate 100 at positions that are not aligned along the side of the substrate 100.

As described above, the height h of the third surface 134a and the fourth surface 172a of the heat sink from the substrate 100 is approximately even when the heat generating components are not arranged in alignment on the substrate 100. Set to the same height. The third plane 134a and the fourth plane 172a constitute the same plane, and one radiator 200 can be placed on the same plane via the adhesive sheet 210.
Thus, it is possible to provide an electronic device that can effectively dissipate heat and can be easily assembled and manufactured regardless of where the heat generating components are arranged in any position on the substrate. it can.

  The adhesive sheet 210 has adhesiveness on both sides and has very strong adhesiveness. One surface of the adhesive sheet 210 is bonded to each of the third surface 134a of the sheet metal 132, the fourth surface 145a of the sheet metal 143, the third surface of the sheet metal 152, and the fourth surface 172a of the sheet metal 172, and then radiates heat. By placing the vessel 200 on the other surface of the adhesive sheet 210 and bonding it, the third surface 134 a of the sheet metal 132, the fourth surface 145 a of the sheet metal 143, the third surface of the sheet metal 152, and the fourth surface of the sheet metal 172. The surface 172a and the radiator 200 can be bonded and fixed.

  As described above, the present invention is provided on the substrate 100, the first heat generating component 131 and the second heat generating component 171 mounted on the substrate 100, and the first heat generating component 131 and the second heat generating component 171, respectively. A first heat dissipating plate 132 and a second heat dissipating plate 172 thermally connected to the first heat generating component 131 and the second heat generating component 171, and the first heat dissipating plate 132 and the second heat dissipating plate 172. The heat radiating plate 172 is substantially the same as the first surface 133a and the second surface 171a contacting the first heat generating component 131 and the second heat generating component 171 and the first surface 133a and the second surface 171a. The third surface 134a and the fourth surface 172a are provided vertically, and the third surface 134a and the fourth surface 172a form surfaces having substantially the same height h from the substrate 100. , On the third surface 134a and the fourth surface 172a Through the adhesive sheet 210 is an electronic device in which one radiator 200 is mounted.

  By installing a heatsink after inserting each component into the board, multiple heat generating parts and heat dissipating metal plates are placed at any position on the board, such as a position that is not aligned with the side of the board. However, it is possible to provide an electronic device and an electronic device manufacturing method that can effectively dissipate heat and can be easily assembled and manufactured.

Although the present invention has been described in detail with reference to a preferred embodiment of an electronic device and a method for manufacturing the electronic device, the present invention is not limited to the above embodiment.
For example, although a bridge diode, an FET, and a diode are illustrated as the heat generating components, the present invention is not limited to this, and may be an IGBT (INSULATED GATE BIPOLLAR TRANSISTOR), a GaNFET (GALLIUM NITRIDE FIELD EFFECT TRANSISTOR), or the like.

  Further, the structure of the heat radiating plate has been described by exemplifying the L-shaped sheet metal and the U-shaped sheet metal.

  Moreover, although the heat radiator demonstrated and demonstrated the heat sink, it is not restricted to this, For example, it mounts via the adhesive sheet on the 3rd surface and 4th surface of a heat sink, such as a chassis of an electronic device, Anything is acceptable as long as it satisfies the functions.

  It is preferable that the adhesive sheet has not only adhesiveness but also sufficient insulation.

  The adhesive member is not limited to the adhesive sheet described as an example, and an adhesive may be used.

  DESCRIPTION OF SYMBOLS 100 ... Switching power supply device 110 ... Input terminal 120 ... Line filter 130 ... Rectifier circuit 140 ... PFC circuit 150 ... Switching circuit 160 ... Transformer 170 ... Rectifier circuit 180 ... Smoothing circuit 190 ... Output terminal 200 ... radiator, 210 ... adhesive sheet

Claims (3)

A substrate,
A first heat generating component and a second heat generating component mounted on the substrate;
A first heat radiating plate and a second heat radiating plate provided on the first heat generating component and the second heat generating component, respectively, and thermally connected to the first heat generating component and the second heat generating component; Prepared,
The first heat radiation plate and the second heat radiation plate include a first surface and a second surface that are in contact with the first heat generation component and the second heat generation component, and the first surface and the second surface. And a third surface and a fourth surface provided substantially perpendicular to
The third surface and the fourth surface constitute surfaces having substantially the same height from the substrate, and one radiator is provided on the third surface and the fourth surface via an adhesive sheet. An electronic device characterized by being mounted.   2. The electronic device according to claim 1, wherein the first heat-generating component and the second heat-generating component are mounted on the substrate at a position that is not aligned with a side of the substrate. After the first heat generating component, the second heat generating component, the first heat radiating plate, and the second heat radiating plate are solder-connected to the substrate, the third surface and the fourth surface are connected. The method of manufacturing an electronic device according to claim 1, wherein the radiator is attached via the adhesive sheet.

Images