JP2018148003A - Mounting use data management device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting use data management device capable of correcting mounting use data used when mounting a component on a board or guiding the correction of the mounting use data. A mounting/use data management device includes an image acquisition unit, a monitoring unit, and a correction management unit. The image acquisition unit images a plurality of component mounting boards of the same type in which the components are mounted on the board, and acquires an image of each of the plurality of component mounting boards. The monitoring unit monitors a change between the plurality of component mounting boards of the image acquired by the image acquisition unit, and when a change in the image is recognized, the change and the image when the change is recognized are acquired. It is judged whether there is a correlation with deterioration of quality of the component mounting board. The correction management unit corrects the mounting use data used when the target component, which is the component mounted in the area where the image has changed, is corrected or the mounting use data when the correlation is recognized by the monitoring unit. I will guide you through the correction. [Selection diagram] Fig. 4

Description

  The present specification discloses a technique related to a mounting / use data management apparatus that manages mounting / use data used when a component is mounted on a board.

  The quality control device described in Patent Literature 1 determines an appropriate monitoring reference value based on the observation data of the mounter and the inspection data of each inspection device. Then, the monitoring reference setting unit outputs the information of the determined monitoring reference value to the monitor of the analyzer or the work terminal, and prompts the operator to correct the mounting program for the mounter. In addition, the monitoring standard setting unit can automatically set (rewrite) the mounting program stored in the mounter or the production facility management apparatus. As a result, the quality control apparatus described in Patent Document 1 attempts to update the monitoring reference value used in the automatic diagnosis function of the mounter to a more appropriate value and reduce oversight of the mounter abnormality.

Japanese Patent Laid-Open No. 2015-142084

  However, the quality control device described in Patent Document 1 captures a plurality of component mounting substrates on which components are mounted on the substrate, and mounts the mounter based on changes in the captured images between the plurality of component mounting substrates. It does not modify the program. Therefore, for example, when the shape or the like of the component mounted on the component mounting board is changed, the mounting program may not be properly corrected.

  The present specification discloses a mounting / use data management apparatus capable of correcting mounting / use data used when mounting a component on a substrate or guiding the correction of the mounting / use data.

  The present specification discloses a wearing / using data management apparatus including an image acquisition unit, a monitoring unit, and a correction management unit. The image acquisition unit images a plurality of component mounting boards of the same type in which components are mounted on the board, and acquires images of the plurality of component mounting boards. The monitoring unit monitors a change between the plurality of component mounting boards of the image acquired by the image acquisition unit, and when the change of the image is recognized, the change and the image in which the change is acquired are acquired. It is determined whether or not there is a correlation with quality deterioration in the component mounting board. The correction management unit corrects the mounting usage data used when mounting the target component, which is the component mounted in the area where the image has changed, when the correlation is recognized by the monitoring unit, or the mounting usage data Guide you through the corrections.

  According to the above mounting / use data management apparatus, the mounting / use data management apparatus includes the correction management unit. The correction management unit corrects the mounting usage data or corrects the mounting usage data when a correlation between the image change between the plurality of component mounting boards and the deterioration of the quality of the component mounting boards is recognized. To guide you. Accordingly, the mounting / use data management apparatus can correct the mounting / use data or guide the correction of the mounting / use data based on the change in the image between the plurality of component mounting boards.

1 is a configuration diagram illustrating an example of a substrate production line 10. FIG. It is a top view which shows an example of component mounting board PWB1. It is a figure which shows an example of the data contained in mounting | wearing use data SD1. FIG. 4 is a block diagram showing an example of a control block of the wearing / using data management device 80. 5 is a flowchart showing an example of a control flow by the wearing / using data management device 80. It is a figure which shows an example of the change of an image when the vertical dimension KX1 of the components P1 changes. It is a figure which shows an example of the dispersion | variation in the vertical dimension of the component P1 between several (10 sheets) component mounting board | substrates PWB1. It is a figure which shows the example of a display of mounting | wearing use data SD1 before and behind correction. It is a figure which shows the other example of a display of mounting | wearing use data SD1 before and behind correction. It is a figure which shows the example of a display which displays the mounting | wearing use data SD1 before and behind correction in a superimposed manner. It is a figure which shows an example of the relationship between dispersion | variation range (DELTA) KXU1 of the vertical dimension KX1 of the component P1 between several (10 sheets) component mounting board | substrates PWB1, and tolerance | permissible_range (DELTA) KXC1 which shows the range where quality is favorable.

1. Board production line 10
A plurality of component mounting boards PWB1 are produced by the board production line 10. FIG. 1 shows a configuration example of the substrate production line 10. FIG. 2 shows an example of a component mounting board PWB1 in which components P1 and P2 are mounted on the board W1. In FIG. 2, for convenience of explanation, only two components P1 and P2 are shown, but many components are mounted on the actual board W1. The components P1 and P2 are, for example, electronic components, and an electronic circuit is configured by mounting the components P1 and P2 on the substrate W1. In this specification, the substrate W1 on which the components P1 and P2 are mounted is referred to as a component mounting substrate PWB1. Further, in the component mounting board PWB1, only one component may be mounted on the board W1.

  As shown in FIG. 1, the board production line 10 includes a solder printing machine 20, a solder printing inspection machine 30, a component mounting machine 40, a board appearance inspection machine 50, a reflow machine 60, and a line management device 70. I have. The solder printer 20 prints paste-like solder on an electrode portion (not shown) on the substrate W1. The solder printing machine 20 and the solder printing inspection machine 30 are connected by a board transfer device 11. The solder printing inspection machine 30 inspects the solder printing state of the substrate W1 conveyed by the substrate conveying device 11. The solder printing inspecting machine 30 and the component mounting machine 40 are connected by the board transfer device 12. The component mounting machine 40 mounts the components P1 and P2 on the solder of the substrate W1 transferred by the substrate transfer device 12. Specifically, the component mounting machine 40 includes a component mounting head 40H having a plurality of suction nozzles 41. Each of the plurality of suction nozzles 41 can pick up the components and mount the components on the substrate W1. The component mounting machine 40 can also include a component mounting head having one suction nozzle 41.

  The component mounting machine 40 and the board visual inspection machine 50 are connected by a board transfer device 13. The board appearance inspection machine 50 inspects the appearance state of the component mounting board PWB1 transferred by the board transfer device 13. The board appearance inspection machine 50 includes an image acquisition device 51 that images the component mounting board PWB1. The board appearance inspection machine 50 determines whether or not the component mounting board PWB1 is normal (allowable range) for various inspection items based on the image captured by the image acquisition device 51. For example, inspection items include mounting position shifts of the components P1 and P2 on the substrate W1, missing parts of the components P1 and P2, differences in the component types of the components P1 and P2, and differences in the polarities of the components P1 and P2. The substrate appearance inspection machine 50 and the reflow machine 60 are connected by the substrate transfer device 14. The reflow machine 60 re-melts and solidifies the solder of the component mounting board PWB1 (the component mounting board PWB1 determined to be normal by the board visual inspection machine 50) transferred by the board transfer device 13, and the board W1 and the parts P1, The connection state with P2 is stabilized.

  The line management device 70 includes a known central processing unit, a storage device, and an input / output interface, and these are electrically connected via a bus (all not shown). The line management apparatus 70 can perform various arithmetic processes using these. As shown in FIG. 1, the line management device 70 includes a display device 71, an input device 72, and a communication line 73. The display device 71 is a known display device, and can display the production status, control status, and the like of the line management device 70. The display device 71 can also display mounting usage data SD1 before and after correction, which will be described later. The input device 72 is a known input device, and an operator who operates the line management device 70 can give various instructions to the line management device 70. The line management device 70 is communicably connected to the solder printing machine 20, the solder printing inspection machine 30, the component mounting machine 40, the board appearance inspection machine 50, and the reflow machine 60 via the communication line 73. The communication line 73 may be wired or wireless. The configuration of the substrate production line 10 shown in FIG. 1 is an example, and the substrate production line 10 can take various known forms. The board production line 10 may have a line configuration including a plurality of component mounting machines 40, for example.

2. Board coordinate system and mounting usage data SD1
As shown in FIG. 2, the substrate W1 is provided with position marks FM1 and FM2. The position marks FM1 and FM2 are positioning reference portions of the substrate W1 called fiducial marks, and the position marks FM1 and FM2 are provided on the outer edge portion of the substrate W1. A substrate coordinate system is set based on the position marks FM1 and FM2. The substrate coordinate system is a coordinate system set on the substrate W1, and the substrate coordinate system is defined by the positional relationship between the position marks FM1, FM2, the X axis direction Xb, the Y axis direction Yb, and the origin position B0. it can. In the present embodiment, the position mark FM1 is provided at the origin position B0. The component mounting machine 40, for example, measures the angle θb between the arrow L1 connecting the position marks FM1 and FM2 and the X-axis direction Xb, so that the board coordinate system (X-axis direction Xb, Y-axis direction Yb, origin position B0). Can be known.

  The mounting position of the component P1 on the board W1 can be expressed using the board coordinate system. The mounting position in the X-axis direction Xb of the component P1 having the circuit number R1 is the mounting position XM1, and the mounting position in the Y-axis direction Yb is the mounting position YM1. The rotation angle at the mounting position (mounting position XM1, mounting position YM1) of the component P1 is the rotation angle θ1. The rotation angle θ1 shown in the figure represents 0 ° (no rotation). Furthermore, as for the size of the component P1, the size (vertical dimension) in the vertical direction (arrow X direction) of the component P1 is the vertical dimension KX1. The size (lateral dimension) in the horizontal direction (arrow Y direction) of the component P1 is the horizontal dimension KY1. The size (height dimension) in the height direction of the component P1 is a height dimension KH1. Since FIG. 2 is a plan view, the height dimension KH1 is not shown in the figure. The center (size center) of the component P1 is indicated by the center position C1, and the center of gravity of the component P1 is indicated by the center of gravity position G1. In the part P1, the center position C1 and the center of gravity position G1 coincide. Further, the part P1 that can be sucked by the suction nozzle 41 is indicated by a suction surface SA1.

  What has been described above for the component P1 can be similarly applied to the component P2. The mounting position in the X-axis direction Xb of the component P2 having the circuit number IC1 is the mounting position XM2, and the mounting position in the Y-axis direction Yb is the mounting position YM2. The rotation angle at the mounting position (mounting position XM2, mounting position YM2) of the component P2 is the rotation angle θ2. Further, the size of the component P2 is a vertical dimension KX2, a horizontal dimension KY2, and a height dimension KH2. The center of the part P2 is indicated by the center position C2, and the center of gravity of the part P2 is indicated by the center of gravity position G2. Further, the part P2 that can be sucked by the suction nozzle 41 is indicated by a suction surface SA2.

  In addition, the part P2 differs in the center position C2 and the gravity center position G2. The component P2 includes a main body part P2a, a first electrode part P2b, a second electrode part P2c, and a third electrode part P2d. The main body portion P2a indicates a portion in which an integrated circuit (not shown) is accommodated. The first electrode portion P2b, the second electrode portion P2c, and the third electrode portion P2d indicate portions (lead portions) that are electrically and mechanically connected to the pattern of the substrate W1. The center position of the main body part P2a is eccentric with respect to the center position C2 of the component P2, and the main body part P2a is relative to any of the first electrode part P2b, the second electrode part P2c, and the third electrode part P2d. But the mass is large. Therefore, the center-of-gravity position G2 of the part P2 moves relative to the center position C2 of the part P2 by the deviation ΔKX2 in the X-axis direction Xb and moves by the deviation ΔKY2 in the Y-axis direction Yb.

  FIG. 3 shows an example of data included in the mounting usage data SD1. The mounting use data SD1 refers to data used when the component mounting machine 40 produces the component mounting board PWB1. The mounting use data SD1 includes data used when the suction nozzle 41 of the component mounting machine 40 sucks the components P1 and P2 and mounts the components P1 and P2 sucked by the suction nozzle 41 on the substrate W1. Further, the mounting use data SD1 includes production conditions relating to the production of the component mounting board PWB1, production equipment used, information relating to the board W1 and the parts P1 and P2, and the like. As shown in the figure, in the present embodiment, the mounting use data SD1 includes a sequence number, a circuit number, a component number, a mounting position, a suction position, a nozzle type, a component supply position, a component size, a component shape, and the like. Information on the thickness of the substrate W1 is included. The mounting position includes coordinates in the X-axis direction Xb (Xb coordinates), coordinates in the Y-axis direction Yb (Yb coordinates), and a rotation angle. The size of the part includes a vertical dimension, a horizontal dimension, and a height dimension.

  The circuit number, part number, mounting position, and part size are as described above. The sequence number indicates the mounting order of the components P1 and P2 when the suction nozzle 41 of the component mounting machine 40 sucks the components P1 and P2 and mounts the components P1 and P2 on the substrate W1. The mounting use data SD1 shown in the figure indicates that the parts P1 and P2 are mounted in the order of the part P1 and the part P2. The suction position indicates the position of the part sucked by the suction nozzle 41 in the part. The mounting usage data SD1 shown in the figure indicates that the center position C1 or the center of gravity position G1 is used as the suction position for the part P1, and the center of gravity position G2 is used as the suction position for the part P2. Thereby, the posture at the time of suction of the component P1 is stabilized, and the posture at the time of mounting the component P1 is stabilized. The same can be said for the component P2.

  The nozzle type indicates the type of the suction nozzle 41. The nozzle diameter of the suction nozzle 41 and the shape or material of the nozzle tip 42 shown in FIG. 1 are designated according to the part. The mounting usage data SD1 shown in the figure indicates that the suction nozzle 41 of the nozzle type NZ1 is used for the component P1, and the suction nozzle 41 of the nozzle type NZ2 is used for the component P2. The component supply position indicates the position of a component supply medium (for example, feeder, tray unit, etc.) that supplies the component. The mounting usage data SD1 shown in the figure indicates that the component P1 is supplied from the component supply medium F1 for the component P1, and the component P2 is supplied from the component supply medium F2 for the component P2.

  The shape of the part indicates information regarding a two-dimensional or three-dimensional shape. When the image acquisition unit 81 to be described later acquires a three-dimensional image, it is preferable that the information regarding the shape is three-dimensional information. The information on the shape may be numerical information or image information. Examples of image information include an image obtained by capturing a part with a camera, an image drawn with computer graphics, and an address (link destination) for acquiring these images. The mounting usage data SD1 shown in the figure indicates that the part P1 includes shape information SH1, and the part P2 includes shape information SH2. The shape information SH1 and the shape information SH2 are both three-dimensional image information, but the information is different because the parts P1 and P2 have different shapes. Moreover, the thickness of the board | substrate W1 has shown the thickness of the board | substrate W1 of the site | part in which components are mounted | worn. When the thicknesses of the parts are different, even when the height dimensions of the parts are the same, the amount of the parts pushed in when the parts are mounted on the substrate W1 is different. For example, it is assumed that the substrate W1 has a recess and a component is mounted in the recess. The mounting usage data SD1 shown in the figure indicates that the thickness of the substrate W1 is the thickness TH1 for the component P1, and the thickness of the substrate W1 is the thickness TH2 for the component P2. Note that the mounting / use data management apparatus 80 can extract and manage a part of the mounting / use data SD1 (for example, the size of the part, the shape of the part, etc.) separately.

3. Wearing data management device 80
The mounting use data SD1 differs for each board type of the component mounting board PWB1 to be produced. Even if the board types are the same, the quality of the component mounting board PWB1 to be produced may be affected by changes in the board W1 and changes (including variations) in the parts mounted on the board W1. Therefore, the wearing / using data management apparatus 80 according to the present embodiment modifies the wearing / using data SD1 or guides the modification of the wearing / using data SD1 as necessary.

  FIG. 4 shows an example of a control block of the wearing / using data management device 80. When viewed as a control block, the wearing / use data management device 80 includes an image acquisition unit 81, a monitoring unit 82, and a correction management unit 83. In the present embodiment, the image acquisition unit 81 is provided in the board appearance inspection machine 50 shown in FIG. 1, and the monitoring unit 82 and the correction management unit 83 are provided in the line management device 70 shown in FIG. The mounting use data management device 80 can be provided in any of the component mounting machine 40, the board appearance inspection machine 50, and the line management device 70. In addition, the wearing / using data management device 80 may be provided with a known image acquisition device, and the image acquisition unit 81 may be provided in the image acquisition device. Similarly, the mounting / use data management device 80 may be provided with a known arithmetic device separately and the monitoring unit 82 and the correction management unit 83 may be provided in the arithmetic device.

  FIG. 5 shows an example of a control flow by the wearing / using data management device 80. The image acquisition unit 81 performs the process shown in step S11. The monitoring unit 82 makes the determinations shown in step S12 and step S13. The correction management unit 83 performs the process shown in step S14. The mounting usage data management device 80 corrects the mounting usage data SD1 as necessary for each board type of the component mounting board PWB1 to be produced or repeats the processing and determination shown in FIG. SD1 correction can be guided.

3-1. Image acquisition unit 81
The image acquisition unit 81 images a plurality of component mounting boards PWB1 of the same type (in this embodiment, 10) on which the parts P1 and P2 are mounted on the board W1. And the image acquisition part 81 acquires each image of several (10 sheets) component mounting board PWB1 (step S11 shown in FIG. 5). In the present embodiment, the image acquisition unit 81 uses the image acquisition device 51 of the board appearance inspection machine 50 to image a plurality (ten) of component mounting boards PWB1. As described above, the image acquisition unit 81 can also image a plurality (ten) of component mounting boards PWB1 using an image acquisition device equivalent to the image acquisition device 51. The image of the component mounting board PWB1 may be a two-dimensional image or a three-dimensional image. When the monitoring unit 82 described later monitors changes in the shapes of the components P1 and P2 in the image of the component mounting board PWB1, it is preferable that the image of the component mounting board PWB1 is a three-dimensional image. . The same applies to the case where the monitoring unit 82 monitors a change in the thickness of the substrate W1.

3-2. Monitoring unit 82
The monitoring unit 82 monitors changes between a plurality (ten) of component mounting boards PWB1 in the image acquired by the image acquisition unit 81. Then, when the change in the image is recognized, the monitoring unit 82 determines whether or not there is a correlation between the change and the deterioration in quality in the component mounting board PWB1 when the image in which the change is recognized is acquired. (Step S12 and Step S13 shown in FIG. 5).

  FIG. 6 shows an example of an image change when the vertical dimension KX1 of the component P1 changes. The broken-line rectangle indicates the shape of the part P1 extracted from the image before the vertical dimension KX1 of the part P1 changes. A solid square represents the shape of the part P1 extracted from the image after the vertical dimension KX1 of the part P1 has changed. In the figure, the part P1 after the image is changed is indicated by a part P1a, and the vertical dimension of the part P1a is indicated by a vertical dimension KX1a. As described above, in this specification, a component (in this case, the component P1a) mounted in the region where the image has changed is referred to as a target component PX1.

  The monitoring unit 82 can determine that the image of the component mounting board PWB1 has changed when the attribute of the object to be monitored exceeds a preset allowable range. In the example described above, the monitoring unit 82 determines that the vertical dimension of the component P1 exceeds the upper limit value of the preset allowable range (a value larger than the vertical dimension KX1 and smaller than the vertical dimension KX1a). It is determined that the image of the substrate PWB1 has changed. In addition, when the attribute of the object to be monitored is three-dimensional, it follows the height direction of the component in at least two directions of the vertical direction (arrow X direction) and the horizontal direction (arrow Y direction) of the component. It is good to monitor the change of the image of the direction. The component mounting posture, the height of the component, the three-dimensional shape of the component, and the like are examples of the three-dimensional attributes. For example, when there is no change in the height dimension of the component in the direction along the vertical direction (arrow X direction) of the component, the monitoring unit 82 is in the direction along the horizontal direction of the component (arrow Y direction) Monitor the height of the part.

  FIG. 7 shows an example of variation in the vertical dimension of the component P1 between a plurality (ten) of component mounting boards PWB1. The horizontal axis of the figure shows the imaging order of a plurality (10) of component mounting boards PWB1, and the vertical axis shows the vertical dimension of the component P1. A polygonal line L2 shows an example of a change in the vertical dimension of the component P1. Variation in the vertical dimension KX1 of the component P1 between a plurality (five) of component mounting boards PWB1 before the image of the imaging order No. 1 to No. 5 changes (difference obtained by subtracting the minimum value from the maximum value of the vertical dimension KX1) ) Is the variation ΔKX1. The vertical dimension KX1 indicates the vertical dimension of the component P1 included in the mounting usage data SD1 before correction. The above is the same for a plurality (five) of component mounting boards PWB1 after the images in the imaging order from No. 6 to No. 10 have changed, and in the same figure, the variation ΔKX1a and the vertical dimension KX1a are used. It is shown in the figure. As described above, the attributes of the object to be monitored vary among the plurality of component mounting boards PWB1.

  Therefore, the monitoring unit 82 calculates the variation among the plural (10) component mounting boards PWB1 from the image with respect to the shape and size of the parts P1 and P2 mounted on the board W1, and takes the calculated fluctuation into account. Thus, it is preferable to determine the change of the image. In this case, the monitoring unit 82 can set the allowable range of the attribute of the object to be monitored, for example, according to the calculated variation. In the example described above, the monitoring unit 82 sets the allowable range of the vertical dimension of the component P1 with a margin corresponding to the error with respect to the calculated variation ΔKX1. As a result, the monitoring unit 82 can determine a change in the image in consideration of variations among a plurality (ten) of component mounting boards PWB1. Therefore, the mounting / use data management device 80 can guide the correction of the mounting / use data SD1 in consideration of the variation among the plural (10) component mounting boards PWB1, or the correction of the mounting / use data SD1.

  When the change in the image is recognized, the monitoring unit 82 determines whether or not there is a correlation between the change and the quality deterioration in the component mounting board PWB1 when the image in which the change is recognized is acquired. For example, when the board appearance inspection machine 50 determines that the component mounting board PWB1 is abnormal (exceeding the allowable range for the inspection items), the monitoring unit 82 determines that the quality of the component mounting board PWB1 is degraded. Can do. Even when the inspection result by the board appearance inspection machine 50 is normal, but the change in the image of the component mounting board PWB1 exceeds the predetermined allowable range set in advance, the monitoring unit 82 also It can be determined that quality degradation occurs in PWB1.

  As shown in FIG. 6, when the vertical dimension KX1 of the component P1 changes, the center position C1 that is the suction position of the component P1 moves to the center position C1a. If the suction position is not changed for the part P1a in which the vertical dimension KX1 of the part P1 is changed, the suction position of the part P1a is decentered from the center position C1a. As a result, the component suction rate of the component P1a that is the target component PX1 may decrease.

  The component adsorption rate refers to the success rate of adsorption to the component adsorption opportunity. For example, the component mounting machine 40 records the success or failure of suction each time a component is sucked by the suction nozzle 41. The component mounting machine 40 can image a component sucked by the suction nozzle 41 with a component camera (not shown) provided in the component mounting machine 40, and determine the success or failure of the suction from the captured image. The component mounting machine 40 can calculate the component suction rate by dividing the number of times that the component has been successfully sucked by the number of times that the component has been sucked by the suction nozzle 41 (total number of times). For example, even when the part P1 is switched to the part P1a, if the suction conditions (for example, the type of the suction position and the suction nozzle 41) are the same, the part suction rate may be lower than before the part P1 is switched. .

  Further, when the suction position of the component P1a is decentered from the center position C1a, the mounting position may be shifted. The mounting position deviation is an error between the planned mounting position of the component P1a that is the target component PX1 and the actual mounting position where the component P1a that is the target component PX1 is actually mounted. In the example described above, the planned mounting position is the mounting position of the component P1 (mounting position XM1, mounting position YM1) (see FIGS. 2 and 3). As shown in FIG. 6, when the deviation between the center position C1 and the center position C1a is a deviation ΔC1, the actual mounting position moves in the X-axis direction Xb by a deviation ΔC1 from the mounting position (mounting position XM1, mounting position YM1). It becomes easy to move to the position. Furthermore, if the suction position of the component P1a is decentered from the center position C1a, the mounting posture of the component P1 that is the target component PX1 may be deteriorated. For example, there is a possibility that a component standing to be mounted in a state where the component P1a is lifted with respect to the substrate W1 occurs. The same can be said for the center position C1a with respect to the center of gravity position G1.

  The component mounting machine 40, for example, captures the component P1 mounted on the substrate W1 with a board camera (not shown) provided in the component mounting machine 40, and determines a mounting position deviation, a mounting posture, and the like from the captured image. be able to. When the board camera cannot acquire a three-dimensional image, for example, the component mounting posture may be captured using an image acquisition device that can acquire a three-dimensional image. In addition, the board appearance inspection machine 50 can also pick up the component P1 mounted on the board W1 with, for example, the image acquisition device 51 and determine the mounting position deviation, the mounting posture, and the like from the captured image.

  The monitoring unit 82 includes a component suction rate of the target component PX1, a mounting position shift indicating an error between a planned mounting position of the target component PX1 and an actual mounting position where the target component PX1 is actually mounted, and a mounting posture of the target component PX1. It is preferable to determine that there is a correlation when at least one of them exceeds an allowable range. Accordingly, the monitoring unit 82 can easily determine the presence or absence of a correlation between the change in the image and the quality deterioration in the component mounting board PWB1 when the image in which the change is recognized is acquired.

  The permissible range can be set according to the judgment standard of the board appearance inspection machine 50 (normal range in which the component mounting board PWB1 is judged to be normal). In addition, the allowable range can be set in accordance with a judgment standard (a predetermined range narrower than the normal range) that is stricter than the judgment standard of the board appearance inspection machine 50. Further, the allowable range can be set in consideration of the variation among a plurality (10) of component mounting boards PWB1 with respect to the shape and size of the parts P1 and P2 mounted on the board W1.

3-3. Correction management unit 83
When the correlation is recognized by the monitoring unit 82, the correction management unit 83 corrects the mounting use data SD1 used when mounting the target component PX1, which is a component mounted in the area where the image has changed, or Then, correction of the wearing use data SD1 is guided (step S14 shown in FIG. 5). Then, the processing and determination by the wearing / using data management device 80 shown in FIG. In addition, in step S12 or step S13 shown in FIG. 5, when the condition is not satisfied (in the case of No), the above-described processing by the correction management unit 83 is not executed, and the processing by the wearing / using data management device 80 is temporarily ended. To do.

  The correction management unit 83 can determine the correction value of the mounting use data SD1 based on the mounting state of the target component PX1. In addition, the correction management unit 83 calculates a variation between a plurality (five in this embodiment) of component mounting boards PWB1 for the target component PX1, and corrects the mounting usage data SD1 in consideration of the calculated variation. The value can also be determined. In the example illustrated in FIG. 7, the correction management unit 83 calculates a variation among a plurality (five) of component mounting boards PWB1 whose imaging order is No. 6 to No. 10 for the component P1a that is the target component PX1. The average of the vertical dimension variation ΔKX1a of the component P1a is defined as the vertical dimension KX1a described above. At this time, the correction management unit 83 can set the vertical dimension of the component P1a to the vertical dimension KX1a.

  FIG. 8A shows an example of the mounting usage data SD1 before and after correction. This figure shows that the component P1 having the circuit number R1 is a correction target of the mounting use data SD1. In addition, the drawing shows that with respect to the mounting usage data SD1 before correction, the vertical dimension of the component P1 is the vertical dimension KX1, and the suction position of the component P1 is the center position C1. Further, FIG. 5 shows that the vertical dimension of the component P1a is the vertical dimension KX1a and the suction position of the component P1a is the center position C1a with respect to the corrected mounting usage data SD1. The vertical dimension KX1a is the average of the vertical dimension variation ΔKX1a of the component P1a described above.

  The correction management unit 83 can automatically correct the mounting usage data SD1. Thereby, the wearing / using data management device 80 can automate the modification of the wearing / using data SD1. Further, the correction management unit 83 may guide the correction of the mounting usage data SD1 without immediately correcting the mounting usage data SD1. In this case, an operator who operates the board production line 10 shown in FIG. 1 determines whether or not the mounting usage data SD1 needs to be corrected.

  The guide method for correcting the mounting use data SD1 is not limited. For example, the correction management unit 83 can display the contents shown in FIG. 8A on a known display device and guide the correction of the mounting use data SD1. For example, the correction management unit 83 can display the content shown in FIG. 8A on the display device 71 of the line management device 70 shown in FIG. In addition, the correction management unit 83 may display the content illustrated in FIG. 8A on a display device of a portable terminal possessed by an operator who operates the substrate production line 10 or the like.

  FIG. 8B shows another display example of the mounting use data SD1 before and after correction. This figure schematically shows that the shape of the part P1 or the part P1a is displayed in the order of the first display, the second display, the third display, and the fourth display in the example shown in FIG. The first display is a display of the shape of the component P1 extracted from the image of the component mounting board PWB1 whose imaging order is the fourth. The second display is a display of the shape of the component P1 extracted from the image of the component mounting board PWB1 with the fifth imaging order. The third display is a display of the shape of the component P1a extracted from the image of the component mounting board PWB1 with the sixth imaging order. The fourth display is a display of the shape of the component P1a extracted from the image of the component mounting board PWB1 with the seventh imaging order. For the first display to the fourth display, for example, an image obtained by imaging the component P1 (component P1a) with a camera or the like, an image drawn with computer graphics, or the like can be used.

  The correction management unit 83 displays the shape of the component P1 or the component P1a in the order of the first display, the second display, the third display, and the fourth display, so that the operator who operates the board production line 10 or the like. The change of the image can be visually recognized, and the motivation to correct the mounting use data SD1 can be given. In the figure, only the first display to the fourth display are shown for convenience of explanation. The correction management unit 83 can sequentially display the shape of the component P1 (component P1a) extracted from each image of a plurality (ten) of component mounting boards PWB1.

  FIG. 8C shows a display example in which the mounting usage data SD1 before and after correction is displayed in an overlapping manner. In the figure, a broken-line rectangle and a solid-line rectangle are displayed so as to overlap each other. The broken-line rectangle indicates the shape of the part P1 extracted from the image before the vertical dimension KX1 of the part P1 changes. A solid rectangle indicates the shape of the part P1a extracted from the image after the vertical dimension KX1 of the part P1 has changed. As described above, for these displays, for example, an image obtained by imaging the component P1 (component P1a) with a camera or the like, an image drawn with computer graphics, or the like can be used.

  As described above, it is preferable that the correction management unit 83 displays the mounting usage data SD1 before and after correction in a superimposed manner and guides the correction of the mounting usage data SD1. Thereby, an operator who operates the board production line 10 can easily visually recognize the change in the mounting usage data SD1 before and after the correction. Further, an operator who operates the board production line 10 can easily determine whether or not the mounting usage data SD1 needs to be corrected.

4). Effects of Embodiment According to the wearing / using data management device 80 of the present embodiment, the wearing / using data management device 80 includes the correction management unit 83. The correction management unit 83 corrects the mounting usage data SD1 when a correlation between the change in the image between the plurality (10) of the component mounting boards PWB1 and the deterioration of the quality of the component mounting boards PWB1 is recognized. Or, the user guides the modification of the wearing use data SD1. As a result, the mounting / use data management apparatus 80 according to the present embodiment corrects the mounting / use data SD1 based on the change in the image between a plurality of (10) component mounting boards PWB1 or the mounting / use data SD1. Can be guided.

5. Modified Embodiment The above-described embodiment has been described by taking as an example a case where the attribute of the object monitored by the monitoring unit 82 has changed beyond the range of variation among a plurality (10) of component mounting boards PWB1. Specifically, the vertical dimension KX1 of the component P1 mounted on the component mounting board PWB1 changes beyond the range of the variation ΔKX1. However, the embodiment is not limited to the above-described embodiment. For example, the attribute of the object monitored by the monitoring unit 82 is within a range of variation among a plurality (10) of component mounting boards PWB1, but the adjustment of the mounting usage data SD1 is insufficient. As assumed. Also in this case, the wearing / using data management device 80 can correct the wearing / using data SD1.

  FIG. 9 shows an example of the relationship between the variation range ΔKXU1 of the vertical dimension KX1 of the component P1 between a plurality (ten) of component mounting boards PWB1 and the allowable range ΔKXC1 indicating a range with good quality. The horizontal axis of the figure shows the imaging order of a plurality (10) of component mounting boards PWB1, and the vertical axis shows the vertical dimension of the component P1. A broken line L3 indicates an example of a change in the vertical dimension of the component P1. In the present modification, the monitoring unit 82 determines that the image acquired by the image acquisition unit 81 has changed even when the change in the vertical dimension KX1 of the component P1 is included in the variation range ΔKXU1.

  As shown in the drawing, a plurality of (five) component mounting boards PWB1 (hereinafter referred to as first group component mounting boards) whose imaging order is 1, 3, 5, 7, and 9 are referred to as images. The vertical dimension of the part P1 extracted from is included in the allowable range ΔKXC1. Therefore, the quality of the component mounting board PWB1 is not deteriorated in the first group component mounting board. On the other hand, a plurality (five) of component mounting boards PWB1 (hereinafter referred to as second group component mounting boards) whose imaging order is 2, 4, 6, 8, 8 and 10 are extracted from the image. The vertical dimension of the made part P1 exceeds the allowable range ΔKXC1. Therefore, the quality of the component mounting board PWB1 is deteriorated in the second group component mounting board. In this case, the monitoring unit 82 determines that there is a correlation between the image change and the quality deterioration of the component mounting board PWB1 for the second group component mounting board.

  It is preferable that the correction management unit 83 calculates the variation of the vertical dimension KX1 of the component P1 between a plurality (10) of component mounting boards PWB1 and determines the correction value of the mounting use data SD1 in consideration of the calculated variation. It is. For example, the correction management unit 83 calculates an average value of the variation range ΔKXU1, and sets the average value as a correction value of the wearing use data SD1. Specifically, the correction management unit 83 sets the average value AVR1 of the variation range ΔKXU1 as the vertical dimension of the corrected component P1. In this way, the mounting / use data management device 80 can correct the mounting / use data SD1 that has been insufficiently adjusted, or can guide the correction of the mounting / use data SD1 that has been poorly adjusted.

  The board appearance inspection machine 50 resets the allowable range ΔKXC1 indicating a range in which the quality is good with reference to the corrected mounting use data SD1. As a result, the inspection data is corrected, and the inspection result is good for a plurality (ten) of component mounting boards PWB1. Moreover, a deformation | transformation form can take the various form already described by embodiment. For example, it is preferable that the correction management unit 83 displays the mounting usage data SD1 before and after correction in a superimposed manner and guides the correction of the mounting usage data SD1. Further, the embodiment and the modification are described by taking an example in which the vertical dimension KX1 of the component P1 is changed. However, the correction management unit 83 can correct various mounting usage data SD1 including the mounting usage data SD1 shown in FIG.

6). Management of Mounting Usage Data SD1 There is a possibility that the adjustment of the mounting usage data SD1 is insufficient at the initial production stage (corresponding to a modified form) of the component mounting board PWB1. In this case, the correction management unit 83 may correct the original (master file) in accordance with the correction of the mounting use data SD1. On the other hand, in the mass production period (corresponding to the embodiment) of the component mounting board PWB1, the supply destination (vendor) for supplying the board W1 and the parts P1 and P2 may be changed. In addition, the mass production period (corresponding to the embodiment) of the component mounting board PWB1 may be supplied with different production times (lots) of the board W1 and the parts P1 and P2. In these cases, the correction management unit 83 may only correct the mounting usage data SD1 currently used by the component mounting machine 40 without correcting the original (master file).

80: Wear / use data management device,
81: Image acquisition unit, 82: Monitoring unit, 83: Correction management unit,
W1: Board, P1, P1a, P2: Parts
PWB1: Component mounting board, PX1: Target component,
SD1: wearing usage data.

Claims (4)

An image acquisition unit that images a plurality of component mounting boards of the same type in which components are mounted on the board, and acquires images of each of the plurality of component mounting boards;
When a change between the plurality of component mounting boards of the image acquired by the image acquisition unit is monitored, and when the change in the image is recognized, the change and the image in which the change is recognized are acquired A monitoring unit that determines the presence or absence of a correlation between quality deterioration in the component mounting board of
When the correlation is recognized by the monitoring unit, the mounting usage data used when mounting the target component, which is the component mounted in the area where the image has changed, is corrected, or the mounting usage data A revision management section to guide the revision of
A wearing / use data management device comprising:   The monitoring unit calculates a variation among the plurality of component mounting boards from the image with respect to the shape and size of the component mounted on the board, and changes the image in consideration of the calculated variation. The wearing / using data management apparatus according to claim 1, wherein   The monitoring unit includes a component adsorption rate of the target component, a mounting position shift indicating an error between a mounting position of the target component and an actual mounting position where the target component is actually mounted, and a mounting posture of the target component The wearing / using data management apparatus according to claim 1, wherein when there is at least one of an allowable range, the correlation is determined to be present. 4. The mounting usage data management apparatus according to claim 1, wherein the correction management unit displays the mounting usage data before and after correction in a superimposed manner and guides the correction of the mounting usage data. 5.

Images