JP2018010888A - 電磁波シールド材 - Google Patents
電磁波シールド材 Download PDFInfo
- Publication number
- JP2018010888A JP2018010888A JP2016136743A JP2016136743A JP2018010888A JP 2018010888 A JP2018010888 A JP 2018010888A JP 2016136743 A JP2016136743 A JP 2016136743A JP 2016136743 A JP2016136743 A JP 2016136743A JP 2018010888 A JP2018010888 A JP 2018010888A
- Authority
- JP
- Japan
- Prior art keywords
- shielding material
- electromagnetic wave
- conductive
- base material
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016136743A JP2018010888A (ja) | 2016-07-11 | 2016-07-11 | 電磁波シールド材 |
| CN201710531323.7A CN107613628B (zh) | 2016-07-11 | 2017-07-03 | 电磁波屏蔽材料 |
| KR1020170085359A KR101949143B1 (ko) | 2016-07-11 | 2017-07-05 | 전자파 쉴드재 |
| TW106122503A TWI800485B (zh) | 2016-07-11 | 2017-07-05 | 電磁波遮蔽材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016136743A JP2018010888A (ja) | 2016-07-11 | 2016-07-11 | 電磁波シールド材 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2018010888A true JP2018010888A (ja) | 2018-01-18 |
Family
ID=60995750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016136743A Pending JP2018010888A (ja) | 2016-07-11 | 2016-07-11 | 電磁波シールド材 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2018010888A (zh) |
| KR (1) | KR101949143B1 (zh) |
| CN (1) | CN107613628B (zh) |
| TW (1) | TWI800485B (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6624331B1 (ja) * | 2019-08-01 | 2019-12-25 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、および電磁波シールド性配線回路基板 |
| CN112888288B (zh) * | 2021-01-18 | 2022-10-28 | 哈尔滨工业大学 | 一种基于超薄掺杂金属/介质复合结构的电磁屏蔽曲面光学窗 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005056906A (ja) * | 2003-08-05 | 2005-03-03 | Reiko Co Ltd | 電磁波遮蔽性転写フイルム |
| JP2012231021A (ja) * | 2011-04-26 | 2012-11-22 | Fujimori Kogyo Co Ltd | Fpc用電磁波シールド材 |
| JP2013256125A (ja) * | 2011-12-26 | 2013-12-26 | Mitsui Chemicals Inc | 多層成形体およびその製造方法、並びに放熱性部材 |
| JP2015138813A (ja) * | 2014-01-20 | 2015-07-30 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、および電磁波シールドシート付きプリント配線板 |
| JP2016040837A (ja) * | 2011-11-24 | 2016-03-24 | タツタ電線株式会社 | シールドフィルム、シールドプリント配線板、及び、シールドフィルムの製造方法 |
| JP2016086036A (ja) * | 2014-10-23 | 2016-05-19 | 住友ベークライト株式会社 | 電磁波シールド用フィルムの製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005068227A (ja) * | 2003-08-21 | 2005-03-17 | Suzuka Fuji Xerox Co Ltd | ポリイミドフィルムおよび該ポリイミドフィルムを使用した電子写真用転写・定着部材 |
| JP2006245160A (ja) * | 2005-03-02 | 2006-09-14 | Sharp Corp | フェライトリングコア収納ケース |
| JP5726048B2 (ja) * | 2011-11-14 | 2015-05-27 | 藤森工業株式会社 | Fpc用電磁波シールド材 |
| JP2017193673A (ja) * | 2016-04-22 | 2017-10-26 | パナソニックIpマネジメント株式会社 | 脱硫方法及び脱硫器 |
-
2016
- 2016-07-11 JP JP2016136743A patent/JP2018010888A/ja active Pending
-
2017
- 2017-07-03 CN CN201710531323.7A patent/CN107613628B/zh active Active
- 2017-07-05 KR KR1020170085359A patent/KR101949143B1/ko active Active
- 2017-07-05 TW TW106122503A patent/TWI800485B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005056906A (ja) * | 2003-08-05 | 2005-03-03 | Reiko Co Ltd | 電磁波遮蔽性転写フイルム |
| JP2012231021A (ja) * | 2011-04-26 | 2012-11-22 | Fujimori Kogyo Co Ltd | Fpc用電磁波シールド材 |
| JP2016040837A (ja) * | 2011-11-24 | 2016-03-24 | タツタ電線株式会社 | シールドフィルム、シールドプリント配線板、及び、シールドフィルムの製造方法 |
| JP2013256125A (ja) * | 2011-12-26 | 2013-12-26 | Mitsui Chemicals Inc | 多層成形体およびその製造方法、並びに放熱性部材 |
| JP2015138813A (ja) * | 2014-01-20 | 2015-07-30 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、および電磁波シールドシート付きプリント配線板 |
| JP2016086036A (ja) * | 2014-10-23 | 2016-05-19 | 住友ベークライト株式会社 | 電磁波シールド用フィルムの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101949143B1 (ko) | 2019-02-18 |
| TWI800485B (zh) | 2023-05-01 |
| CN107613628A (zh) | 2018-01-19 |
| KR20180006851A (ko) | 2018-01-19 |
| CN107613628B (zh) | 2021-10-01 |
| TW201819183A (zh) | 2018-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD03 | Notification of appointment of power of attorney |
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| A02 | Decision of refusal |
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