JP2018078189A - Electronic components - Google Patents

Abstract

Kind Code: A1 An electronic component in which the occurrence of cracks in a base body is suppressed and mounting strength is ensured is provided. A laminated common mode filter CF is arranged on a first main surface 1a of a base body 1 and has a resin film I having electrical insulation. The resin film I covers the edge in the second direction D2 of the first electrode layer E1 included in the electrode portions 11a and 12a arranged on the first main surface 1a and is in contact with the edge. . The second electrode layer E2 and the third electrode layer E3 included in the electrode portions 11a and 12a are arranged on the regions exposed from the resin film I in the first electrode layer E1 included in the electrode portions 11a and 12a. ing. [Selection drawing] Fig. 4

Description

  The present invention relates to an electronic component.

  An electronic component including an element body and a plurality of external electrodes arranged on the element body is known (for example, see Patent Document 1). The element body has a rectangular parallelepiped shape, and includes a main surface and a pair of side surfaces facing each other and adjacent to the main surface. A plurality of external electrodes are disposed at both ends of the element body in the direction in which the pair of side surfaces face each other. Each external electrode has a first electrode portion disposed on the main surface and a second electrode portion disposed on the side surface. The main surface is a mounting surface facing an electronic device (for example, a circuit board or an electronic component) on which the electronic component is solder-mounted.

JP 2010-192643 A

  An object of one aspect of the present invention is to provide an electronic component in which generation of cracks in an element body is suppressed and mounting strength is ensured.

  As a result of our research, the following matters were found. When the electronic component is solder-mounted on the electronic device, an external force that acts on the electronic component from the electronic device may act as stress on the element body from the solder fillet formed at the time of solder mounting through the external electrode. For example, when the electronic device is a substrate, the external force acts on the electronic component by bending the substrate. The stress acting on the element body tends to concentrate on the edge of the external electrode, particularly the edge in the direction in which the pair of side surfaces of the first electrode portion disposed on the main surface which is the mounting surface is opposed. Therefore, there is a possibility that cracks may occur in the element body starting from these end edges.

  An electronic component according to an aspect of the present invention has a rectangular parallelepiped shape, and includes a main surface that is a mounting surface, and a pair of side surfaces that face each other and are adjacent to the main surface. The first electrode part arranged on the main surface and the second electrode part arranged on the side surface are arranged in plural on both ends of the element body in the direction in which the body and the pair of side surfaces face each other The first electrode portion and the second electrode portion are disposed on the base body, and the first electrode portion and the second electrode portion are disposed on the element body. A resin layer, and a resin film in a direction in which the pair of side surfaces of the sintered metal layer included in the first electrode portion are opposed to each other. The plating layer that covers at least the edge and is in contact with the edge and includes the first electrode portion includes the first electrode portion. Is disposed on a region exposed from the resin film in sintered metal layer are Nde.

  In the electronic component according to one aspect of the present invention, the resin film functions as a solder resist when the electronic component is solder-mounted on an electronic device. Since the resin film covers at least the edges in the direction in which the pair of side surfaces of the sintered metal layer included in the first electrode portion are opposed to each other, the solder fillet is disposed on the main surface. It does not reach the end edge in the direction in which the pair of side surfaces of the sintered metal layer included in is facing each other. For this reason, even when an external force acts on the electronic component through the solder fillet, it is difficult for stress to concentrate on the edge, and the edge is unlikely to be a starting point of a crack. Therefore, the generation of cracks in the element body is suppressed.

  Since the plating layer included in the first electrode portion is disposed on the region exposed from the resin film in the sintered metal layer included in the first electrode portion, not only the second electrode portion but also the first electrode portion is included. The electrode part is also connected to the electronic device via solder. Therefore, compared with the electronic component in which the entire sintered metal layer included in the first electrode portion is covered with the resin film, in the electronic component according to this aspect, a reduction in mounting strength is prevented.

  The resin film may integrally cover the edge of the sintered metal layer included in the first electrode portions of at least two adjacent external electrodes. In this case, the resin film can be easily formed.

  The resin film is provided for each external electrode, and may cover the edge of the sintered metal layer of the first electrode portion included in the corresponding external electrode. In this case, the amount of resin used to form the resin film is reduced.

  The resin film covers the entire edge of the sintered metal layer included in the first electrode portion, and may be in contact with the edge. In this case, stress is unlikely to concentrate over the entire circumference of the edge of the sintered metal layer included in the first electrode portion, and the edge is unlikely to be a starting point of a crack over the entire circumference.

  According to one aspect of the present invention, it is possible to provide an electronic component in which generation of cracks in the element body is suppressed and mounting strength is ensured.

It is a perspective view which shows the lamination | stacking common mode filter which concerns on one Embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on this embodiment. It is a disassembled perspective view which shows the structure of an element body. It is a figure for demonstrating the cross-sectional structure of a 1st external electrode, a 2nd external electrode, and a resin layer. It is a figure for demonstrating the cross-sectional structure of a 3rd external electrode, a 4th external electrode, and a resin layer. It is a figure for demonstrating the mounting structure of the lamination | stacking common mode filter which concerns on this embodiment. It is a figure for demonstrating the mounting structure of the lamination | stacking common mode filter which concerns on this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a figure for demonstrating the cross-sectional structure of a 1st external electrode, a 3rd external electrode, and a resin layer. It is a figure for demonstrating the cross-sectional structure of a 2nd external electrode, a 4th external electrode, and a resin layer. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment. It is a top view which shows the lamination | stacking common mode filter which concerns on the modification of this embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  With reference to FIGS. 1-5, the structure of the lamination | stacking common mode filter CF which concerns on this embodiment is demonstrated. FIG. 1 is a perspective view showing a laminated common mode filter according to the present embodiment. FIG. 2 is a plan view showing the laminated common mode filter according to the present embodiment. FIG. 3 is an exploded perspective view showing the configuration of the element body. FIG. 4 is a diagram for explaining a cross-sectional configuration of the first external electrode, the second external electrode, and the resin layer. FIG. 5 is a diagram for explaining a cross-sectional configuration of the third external electrode, the fourth external electrode, and the resin layer. In the present embodiment, a laminated common mode filter CF will be described as an example of an electronic component.

  As shown in FIGS. 1 to 3, the laminated common mode filter CF includes an element body 1, a first external electrode 11, a second external electrode 12, and a third external electrode 13 disposed on the outer surface of the element body 1. , And a fourth external electrode 14. The laminated common mode filter CF includes an electronic device (for example, a circuit board or a circuit board) such that the first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 are connected to the signal lines, respectively. Solder mounted on electronic components).

  The element body 1 has a rectangular parallelepiped shape. The element body 1 has, as its outer surfaces, a first main surface 1a and a second main surface 1b facing each other, a first side surface 1c and a second side surface 1d facing each other, and a first surface facing each other. It has three side surfaces 1e and a fourth side surface 1f. The direction in which the first main surface 1a and the second main surface 1b face each other is the first direction D1, and the direction in which the first side surface 1c and the second side surface 1d face each other is the second direction D2. A direction in which the third side surface 1e and the fourth side surface 1f are opposed to each other is a third direction D3. In the present embodiment, the first direction D1 is the height direction of the element body 1, the second direction D2 is the longitudinal direction of the element body 1, and the third direction D3 is the width direction of the element body 1. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridge lines are chamfered and a rectangular parallelepiped shape in which corners and ridge lines are rounded.

  The first side surface 1c and the second side surface 1d extend in the first direction D1 so as to connect the first main surface 1a and the second main surface 1b. The first side surface 1c and the second side surface 1d are adjacent to the first main surface 1a and are also adjacent to the second main surface 1b. The first side surface 1c and the second side surface 1d also extend in the third direction D3 (the short side direction of the first main surface 1a and the second main surface 1b).

  The third side surface 1e and the fourth side surface 1f extend in the first direction D1 so as to connect the first main surface 1a and the second main surface 1b. The first side surface 1c and the second side surface 1d are adjacent to the first main surface 1a and are also adjacent to the second main surface 1b. The third side surface 1e and the fourth side surface 1f also extend in the second direction D2 (the long side direction of the first main surface 1a and the second main surface 1b).

  The element body 1 includes a nonmagnetic body portion 3 and a pair of magnetic body portions 5 arranged so as to sandwich the nonmagnetic body portion 3 in the first direction D1. The element body 1 is composed of a plurality of laminated insulator layers. In the nonmagnetic part 3, a plurality of nonmagnetic layers 4 are laminated as an insulator layer. That is, the nonmagnetic body portion 3 is constituted by a plurality of laminated nonmagnetic body layers 4. In each magnetic part 5, a plurality of magnetic layers 6 are laminated as an insulator layer. That is, the magnetic body portion 5 is composed of a plurality of laminated magnetic body layers 6. The plurality of insulator layers include a plurality of nonmagnetic layers 4 and a plurality of magnetic layers 6.

  Each nonmagnetic layer 4 is made of a sintered body of a ceramic green sheet containing, for example, a nonmagnetic material (such as a Cu—Zn ferrite material, a dielectric material, or a glass ceramic material). Each magnetic layer 6 is made of a sintered body of a ceramic green sheet containing, for example, a magnetic material (Ni—Cu—Zn ferrite material, Ni—Cu—Zn—Mg ferrite material, Ni—Cu ferrite material, etc.). Composed.

  In the actual element body 1, the nonmagnetic material layers 4 and the magnetic material layers 6 are integrated so that the boundary between the layers cannot be visually recognized. In the first direction D1, that is, the direction in which the first main surface 1a and the second main surface 1b are opposed to each other, a plurality of insulator layers, that is, a plurality of nonmagnetic layers 4 and a plurality of magnetic layers 6 are laminated. This corresponds to the direction (hereinafter simply referred to as “stacking direction”).

  As shown in FIG. 3, the multilayer common mode filter CF includes a first coil conductor 21, a second coil conductor 22, a third coil conductor 23, and a fourth coil conductor 24 in the nonmagnetic body portion 3. . Each of the conductors 21 to 24 includes a conductive material (for example, Ag or Pd). Each of the conductors 21 to 24 is configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder).

  The first coil conductor 21 has a spiral shape and is disposed between a pair of nonmagnetic layers 4 adjacent to each other in the stacking direction. One end (outer end) 21a of the first coil conductor 21 is exposed at the first side surface 1c. The other end (inner end) 21 b of the first coil conductor 21 is connected to a first pad conductor 41 located on the same layer as the first coil conductor 21. In the present embodiment, the first coil conductor 21 and the first pad conductor 41 are integrally formed.

  The second coil conductor 22 has a spiral shape and is disposed between a pair of nonmagnetic layers 4 adjacent in the stacking direction. One end (outer end) 22a of the second coil conductor 22 is exposed at the second side surface 1d. The other end (inner end) 22 b of the second coil conductor 22 is connected to a second pad conductor 42 located on the same layer as the second coil conductor 22. In the present embodiment, the second coil conductor 22 and the second pad conductor 42 are integrally formed.

  The third coil conductor 23 has a spiral shape and is disposed between a pair of nonmagnetic layers 4 adjacent in the stacking direction. One end (outer end) 23a of the third coil conductor 23 is exposed at the first side face 1c. The other end (inner end) 23 b of the third coil conductor 23 is connected to a third pad conductor 43 located in the same layer as the third coil conductor 23. In the present embodiment, the third coil conductor 23 and the third pad conductor 43 are integrally formed.

  The fourth coil conductor 24 has a spiral shape and is disposed between a pair of nonmagnetic layers 4 adjacent in the stacking direction. One end (outer end) 24a of the fourth coil conductor 24 is exposed at the second side surface 1d. The other end (inner end) 24 b of the fourth coil conductor 24 is connected to a fourth pad conductor 44 located in the same layer as the fourth coil conductor 24. In the present embodiment, the fourth coil conductor 24 and the fourth pad conductor 44 are integrally formed.

  The first coil conductor 21 and the third coil conductor 23 are adjacent to each other via the nonmagnetic layer 4 in the stacking direction, and the second coil conductor 22 and the fourth coil conductor 24 are stacked via the nonmagnetic layer 4. Next to each other in the direction. The third coil conductor 23 is located between the first coil conductor 21 and the second coil conductor 22 in the stacking direction. That is, the first to fourth coil conductors 21 to 24 are arranged in the order of the first coil conductor 21, the third coil conductor 23, the second coil conductor 22, and the fourth coil conductor 24 in the stacking direction. The first to fourth coil conductors 21 to 24 are wound in the same direction as viewed from the stacking direction and are positioned so as to overlap each other.

  The first pad conductor 41 and the second pad conductor 42 are positioned so as to overlap each other when viewed from the stacking direction. Between the first pad conductor 41 and the second pad conductor 42, a fifth pad conductor 45 located in the same layer as the third coil conductor 23 is seen from the stacking direction, and the first and second pad conductors 41, 42 and are arranged so as to overlap each other. That is, the first pad conductor 41 and the fifth pad conductor 45 are adjacent to each other through the nonmagnetic layer 4 in the stacking direction, and the fifth pad conductor 45 and the second pad conductor 42 are adjacent to each other in the stacking direction. 4 next to each other.

  The first pad conductor 41, the fifth pad conductor 45, and the second pad conductor 42 are connected via the first through-hole conductor 51, respectively. The first through-hole conductor 51 is a non-magnetic layer 4 positioned between the first pad conductor 41 and the fifth pad conductor 45 and a non-magnetic layer positioned between the fifth pad conductor 45 and the second pad conductor 42. And the magnetic layer 4.

  The third pad conductor 43 and the fourth pad conductor 44 are positioned so as to overlap each other when viewed from the stacking direction. Between the third pad conductor 43 and the fourth pad conductor 44, a sixth pad conductor 46 located in the same layer as the second coil conductor 22 is seen from the stacking direction, and the third and fourth pad conductors 43, 44 and are arranged so as to overlap each other. That is, the third pad conductor 43 and the sixth pad conductor 46 are adjacent to each other through the nonmagnetic layer 4 in the stacking direction, and the sixth pad conductor 46 and the fourth pad conductor 44 are nonmagnetic layers in the stacking direction. 4 next to each other.

  The third pad conductor 43, the sixth pad conductor 46, and the fourth pad conductor 44 are connected via the second through-hole conductor 52, respectively. The second through-hole conductor 52 is a nonmagnetic layer 4 positioned between the third pad conductor 43 and the sixth pad conductor 46 and a non-magnetic layer positioned between the sixth pad conductor 46 and the fourth pad conductor 44. And the magnetic layer 4.

  The first coil conductor 21 and the second coil conductor 22 are electrically connected through the first pad conductor 41, the fifth pad conductor 45, the second pad conductor 42, and the first through-hole conductor 51. The first coil conductor 21 and the second coil conductor 22 constitute a first coil C1. The third coil conductor 23 and the fourth coil conductor 24 are electrically connected through the third pad conductor 43, the sixth pad conductor 46, the fourth pad conductor 44, and the second through-hole conductor 52. The third coil conductor 23 and the fourth coil conductor 24 constitute a second coil C2.

  The laminated common mode filter CF includes a first coil C1 and a second coil C2 in the element body 1 (nonmagnetic body portion 3). In the first coil C1 and the second coil C2, the first coil conductor 21 and the third coil conductor 23 are adjacent to each other in the stacking direction, and the third coil conductor 23 and the second coil conductor 22 are adjacent to each other in the stacking direction. And the second coil conductor 22 and the fourth coil conductor 24 are arranged in the non-magnetic member 3 so as to be adjacent to each other in the stacking direction. The first coil C1 and the second coil C2 are magnetically coupled to each other.

  The fifth and sixth pad conductors 45 and 46 and the first and second through-hole conductors 51 and 52 include a conductive material (for example, Ag or Pd). The fifth and sixth pad conductors 45 and 46 and the first and second through-hole conductors 51 and 52 are configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder). . The first and second through-hole conductors 51 and 52 are formed by sintering a conductive paste filled in a through-hole formed in a ceramic green sheet that constitutes the corresponding nonmagnetic layer 4. The

  The first external electrode 11 and the third external electrode 13 are disposed on the first side surface 1 c side of the element body 1. That is, the first external electrode 11 and the third external electrode 13 are arranged at one end of the element body 1 in the second direction D2. The first external electrode 11 and the third external electrode 13 are formed so as to cover a part of the first side surface 1c along the first direction D1, and a part of the first main surface 1a and the second main surface. It is formed in a part of 1b. The first external electrode 11 is located closer to the third side face 1e, and the third outer electrode 13 is located closer to the fourth side face 1f.

  The second external electrode 12 and the fourth external electrode 14 are disposed on the second side surface 1 d side of the element body 1. That is, the second external electrode 12 and the fourth external electrode 14 are disposed at the other end of the element body 1 in the second direction D2. The second external electrode 12 and the fourth external electrode 14 are formed so as to cover a part of the second side surface 1d along the first direction D1, and a part of the first main surface 1a and the second main surface. It is formed in a part of 1b. The second external electrode 12 is located closer to the third side face 1e, and the fourth outer electrode 14 is located closer to the fourth side face 1f.

  As shown in FIG. 4, the first external electrode 11 is disposed on the electrode portion 11a disposed on the first major surface 1a, the electrode portion 11b disposed on the second major surface 1b, and the first side surface 1c. It has the electrode part 11c which is made. The first external electrode 11 is not formed on the second side surface 1d, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is disposed only on the three surfaces 1a, 1b, and 1c. The adjacent electrode portions 11a, 11b, and 11c are connected at the ridge portion of the element body 1 and are electrically connected.

  The electrode portion 11 c covers all ends exposed at the first side surface 1 c of the first coil conductor 21. The first coil conductor 21 is connected to the electrode portion 11c at the end exposed at the first side surface 1c. That is, the first external electrode 11 and the first coil conductor 21 are electrically connected. One end 21 a of the first coil conductor 21 functions as a connection conductor with the first external electrode 11.

  As shown in FIG. 4, the second external electrode 12 is disposed on the electrode portion 12a disposed on the first major surface 1a, the electrode portion 12b disposed on the second major surface 1b, and the second side surface 1d. The electrode portion 12c is formed. The second external electrode 12 is not formed on the first side surface 1c, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is disposed only on the three surfaces 1a, 1b, and 1d. The adjacent electrode portions 12a, 12b, and 12c are connected at the ridge portion of the element body 1, and are electrically connected.

  The electrode portion 12 c covers all ends exposed at the second side surface 1 d of the second coil conductor 22. The second coil conductor 22 is connected to the electrode portion 12c at the end exposed at the second side surface 1d. That is, the second external electrode 12 and the second coil conductor 22 are electrically connected. One end 22 a of the second coil conductor 22 functions as a connection conductor with the second external electrode 12.

  As shown in FIG. 5, the third external electrode 13 is disposed on the electrode portion 13a disposed on the first major surface 1a, the electrode portion 13b disposed on the second major surface 1b, and the first side surface 1c. It has the electrode part 13c made. The third external electrode 13 is not formed on the second side surface 1d, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is disposed only on the three surfaces 1a, 1b, and 1c. The adjacent electrode portions 13a, 13b, and 13c are connected at the ridge portion of the element body 1 and are electrically connected.

  The electrode portion 13 c covers all end portions exposed to the first side surface 1 c of the third coil conductor 23. The third coil conductor 23 is connected to the electrode portion 13c at the end exposed at the first side surface 1c. That is, the third external electrode 13 and the third coil conductor 23 are electrically connected. One end portion 23 a of the third coil conductor 23 functions as a connection conductor with the third external electrode 13.

  As shown in FIG. 5, the fourth external electrode 14 is disposed on the electrode portion 14a disposed on the first major surface 1a, the electrode portion 14b disposed on the second major surface 1b, and the second side surface 1d. The electrode portion 14c is formed. The fourth external electrode 14 is not formed on the first side surface 1c, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is disposed only on the three surfaces 1a, 1b, and 1d. The adjacent electrode portions 14a, 14b, and 14c are connected at the ridge portion of the element body 1 and are electrically connected.

  The electrode portion 14 c covers all ends exposed at the second side surface 1 d of the fourth coil conductor 24. The fourth coil conductor 24 is connected to the electrode portion 14c at the end exposed at the second side surface 1d. That is, the fourth external electrode 14 and the fourth coil conductor 24 are electrically connected. One end 24 a of the fourth coil conductor 24 functions as a connection conductor with the fourth external electrode 14.

  The first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 include a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. That is, each electrode part 11a-11c, 12a-12c, 13a-13c, 14a-14c contains the 1st electrode layer E1, the 2nd electrode layer E2, and the 3rd electrode layer E3. The third electrode layer E3 constitutes the outermost layer of the first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14, respectively.

  The first electrode layer E1 is formed by applying a conductive paste to the surface of the element body 1 and baking it. The first electrode layer E1 is a sintered metal layer formed by sintering a metal component (metal powder) contained in the conductive paste. That is, the first electrode layer E1 is a sintered metal layer disposed on the element body 1. In the present embodiment, the first electrode layer E1 is a sintered metal layer made of Ag. The first electrode layer E1 may be a sintered metal layer made of Pd. As the conductive paste, a powder made of Ag or Pd mixed with a glass component, an organic binder, and an organic solvent is used.

  The second electrode layer E2 is formed on the first electrode layer E1 by a plating method. In the present embodiment, the second electrode layer E2 is a Ni plating layer formed on the first electrode layer E1 by Ni plating. The second electrode layer E2 may be a Cu plating layer.

  The third electrode layer E3 is formed on the second electrode layer E2 by a plating method. In the present embodiment, the third electrode layer E3 is a Sn plating layer formed by Sn plating on the second electrode layer E2. The second electrode layer E2 and the third electrode layer E3 constitute a plating layer disposed on the first electrode layer E1. That is, in the present embodiment, the plating layer formed on the first electrode layer E1 has a two-layer structure.

  The first electrode layer E1 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, and 14a to 14c is integrally formed. The second electrode layer E2 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, and 14a to 14c is integrally formed. The third electrode layer E3 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, and 14a to 14c is also integrally formed.

  In each electrode part 11a, 12a, 13a, 14a, the edge in the second direction D2 (the direction in which the first side surface 1c and the second side surface 1d face each other) in the first electrode layer E1, that is, the first electrode An end portion of the layer E1 in the second direction D2 is exposed from the second electrode layer E2 and the third electrode layer E3. In each electrode part 11a, 12a, 13a, 14a, only a part of 1st electrode layer E1 is covered with the plating layer comprised by the 2nd electrode layer E2 and the 3rd electrode layer E3. That is, the first electrode layer E1 included in each electrode portion 11a, 12a, 13a, 14a includes a portion covered with a plating layer constituted by the second electrode layer E2 and the third electrode layer E3, and And a portion exposed from the plating layer. The portion exposed from the plating layer in the first electrode layer E1 includes an edge (end portion) in the second direction D2 in the first electrode layer E1.

  In each electrode part 11b, 11c, 12b, 12c, 13b, 13c, 14b, and 14c, the whole 1st electrode layer E1 is covered with the plating layer comprised by the 2nd electrode layer E2 and the 3rd electrode layer E3. ing.

  The laminated common mode filter CF is solder-mounted on an electronic device (for example, a circuit board or an electronic component). In the laminated common mode filter CF, the first main surface 1a is a mounting surface facing the electronic device.

  The laminated common mode filter CF includes a resin film I as shown in FIGS. The resin film I has electrical insulation and is disposed on the first main surface 1a. The resin film I covers the edge (end part) in the second direction D2 of the first electrode layer E1 of each electrode part 11a, 12a, 13a, 14a and is in contact with the edge (end part). . That is, the resin film I covers a portion exposed from the plating layer in the first electrode layer E1 of each electrode portion 11a, 12a, 13a, 14a and is in contact with the portion. The plating layers (second electrode layer E2 and third electrode layer E3) are disposed on the region of the first electrode layer E1 exposed from the resin film I.

  The resin film I is formed by the edge (end) of the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, and 14a of the four first to fourth external electrodes 11, 12, 13, and 14 adjacent to each other. Part). The resin film I also covers the regions exposed from the electrode portions 11a, 12a, 13a, and 14a on the first main surface 1a, and is in contact with the regions. The resin film I covers a part of each of the third side face 1e and the fourth side face 1f and is in contact with the part. That is, the resin film I is formed not only on the first main surface 1a but also around each of the third side surface 1e and the fourth side surface 1f.

  The resin film I is made of an insulating resin such as an epoxy resin, for example. The resin film I is formed, for example, by applying an insulating resin coating agent and solidifying it. For the application of the insulating resin coating agent, a screen printing method, a spray coating method, or the like can be used. As the insulating resin coating agent, a thermosetting insulating resin coating agent, an ultraviolet curable insulating resin coating agent, or a coating agent containing both of these insulating resin coating agents can be used.

  As shown in FIGS. 6 and 7, when the laminated common mode filter CF is solder-mounted on the electronic device ED, the resin film I functions as a solder resist. The electronic device ED is, for example, a circuit board or another electronic component. 6 and 7 are views for explaining the mounting structure of the laminated common mode filter according to the present embodiment.

  The resin film I covers the end edge (end part) in the second direction D2 of the first electrode layer E1 of each electrode part 11a, 12a, 13a, 14a, and plating is performed on the end edge (end part). Since the layers (second electrode layer E2 and third electrode layer E3) are not disposed, the solder fillet SF is the end of each electrode portion 11a, 12a, 13a, 14a in the first electrode layer E1 in the second direction D2. The edge (end) is never reached. For this reason, even when an external force acts on the laminated common mode filter CF through the solder fillet SF, stress is unlikely to concentrate on the edge (edge) in the second direction D2 in the first electrode layer E1, and the edge ( Edge) is unlikely to be the starting point of cracks. Therefore, in the laminated common mode filter CF, generation of cracks in the element body 1 is suppressed.

  In the laminated common mode filter CF, the resin film I covers the edges (end portions) in the second direction D2 of the first electrode layers E1 of the electrode portions 11a, 12a, 13a, and 14a. For this reason, generation | occurrence | production of the crack resulting from the external force (flexing stress) which acts when the electronic device ED bends in the 2nd direction D2 especially is suppressed.

  In the present embodiment, since the entire electrode portions 11c, 12c, 13c, and 14c are exposed from the resin film I, the solder fillets are formed on the electrode portions 11c, 12c, 13c, and 14c as shown in FIGS. SF is formed. For this reason, the mounting strength of the laminated common mode filter CF is ensured.

  The plating layers (second electrode layer E2 and third electrode layer E3) included in the electrode portions 11a, 12a, 13a, and 14a are disposed on the region exposed from the resin film I in the first electrode layer E1. Yes. For this reason, in the laminated common mode filter CF, not only the electrode portions 11c, 12c, 13c, and 14c but also the electrode portions 11a, 12a, 13a, and 14a are connected to the electronic device ED via solder. Therefore, in the laminated common mode filter CF, the entire first electrode layer E1 included in the electrode portions 11a, 12a, 13a, and 14a is covered with the resin film I, and the electrode portions 11a, 12a, 13a, and 14a are plated layers. As compared with the laminated common mode filter CF which does not contain, the mounting strength is prevented from being lowered.

  In the laminated common mode filter CF, the first external electrode 11 and the third external electrode 13 are disposed on the first side surface 1 c side of the element body 1. For this reason, the first external electrode 11 and the third external electrode 13 are not formed so as to cover the entire first side surface 1c, and the respective surface areas of the first external electrode 11 and the third external electrode 13 do not have to be small. I do not get. Similarly, since the second external electrode 12 and the fourth external electrode 14 are disposed on the second side surface 1d side of the element body 1, the surface areas of the second external electrode 12 and the fourth external electrode 14 need not be small. I do not get. On the other hand, in the laminated common mode filter CF, as described above, not only the electrode portions 11c, 12c, 13c, and 14c but also the electrode portions 11a, 12a, 13a, and 14a are connected to the electronic device ED via solder. Therefore, the mounting strength of the laminated common mode filter CF is ensured.

  In the present embodiment, the resin film I is formed of the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, and 14a of the four first to fourth external electrodes 11, 12, 13, and 14 adjacent to each other. The said edge (end part) is covered integrally. For this reason, it is easy to form the resin film I in the laminated common mode filter CF.

  Next, the configuration of the laminated common mode filter CF according to the modification of the present embodiment will be described with reference to FIGS. 8 to 11 are plan views of the laminated common mode filter according to the present modification. In each modification, the shape of the resin film is different from the above-described laminated common mode filter CF.

  The laminated common mode filter CF shown in FIGS. 8 and 9 includes two resin films Ia and Ib. The two resin films Ia and Ib are separated in the second direction D2, and the first main surface 1a is exposed between the resin film Ia and the resin film Ib. The resin film Ia has the edge (end) of the first electrode layer E1 included in the electrode portions 11a and 13a of the two first and third external electrodes 11 and 13 adjacent to each other in the third direction D3. Covered integrally. The resin film Ib includes the edge (end) of the first electrode layer E1 included in the electrode portions 12a and 14a of the two second and fourth external electrodes 12 and 14 adjacent to each other in the third direction D3. Covered integrally.

  The laminated common mode filter CF shown in FIG. 10 also includes two resin films Ia and Ib. The two resin films Ia and Ib are separated in the third direction D3, and the first main surface 1a is exposed between the resin film Ia and the resin film Ib. The resin film Ia has the edge (end) of the first electrode layer E1 included in the electrode portions 11a and 12a of the two first and second external electrodes 11 and 12 adjacent to each other in the second direction D2. Covered integrally. The resin film Ib has the edge (end) of the first electrode layer E1 included in each of the electrode portions 13a, 14a of the two third and fourth external electrodes 13, 14 adjacent to each other in the second direction D2. Covered integrally.

  In the laminated common mode filter CF of each modification shown in FIGS. 8 to 10, the generation of cracks in the element body 1 is suppressed, the mounting strength is ensured, and the resin film I can be easily formed. .

  The laminated common mode filter CF shown in FIG. 11 includes four resin films Ic, Id, Ie, and If. The four resin films Ic, Id, Ie, If are provided for each of the first to fourth external electrodes 11, 12, 13, and 14 and are separated from each other. The resin film Ic covers only the edge (end) of the first electrode layer E1 included in the electrode portion 11a of the first external electrode 11. The resin film Id covers only the edge (end portion) of the first electrode layer E1 included in the electrode portion 12a of the second external electrode 12. The resin film Ie covers only the edge (end portion) of the first electrode layer E1 included in the electrode portion 13a of the third external electrode 13. The resin film If covers only the edge (end) of the first electrode layer E1 included in the electrode portion 14a of the fourth external electrode 14.

  Also in the laminated common mode filter CF of the modification shown in FIG. 11, the generation of cracks in the element body 1 is suppressed, and the mounting strength is ensured. In this modification, resin films Ic, Id, Ie, If are provided for each of the first to fourth external electrodes 11, 12, 13, 14, and the corresponding first to fourth external electrodes 11, 12, 13 and 14 covers the edge (end) of the first electrode layer E1 included in the electrode portions 11a, 12a, 13a, and 14a. For this reason, the amount of the resin used for forming the resin films Ic, Id, Ie, If is reduced.

  Next, the configuration of the multilayer common mode filter CF according to the modification of the present embodiment will be described with reference to FIGS. FIG. 12 is a plan view of a multilayer common mode filter according to this modification. FIG. 13 is a diagram for explaining a cross-sectional configuration of the first external electrode, the third external electrode, and the resin layer. FIG. 14 is a diagram for explaining a cross-sectional configuration of the second external electrode, the fourth external electrode, and the resin layer.

  In the laminated common mode filter CF shown in FIG. 12, the edge of the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, and 14a has the second electrode layer E2 and the third electrode over the entire circumference. Exposed from layer E3. Also in this modification, in each electrode part 11a, 12a, 13a, 14a, only a part of 1st electrode layer E1 is covered with the plating layer comprised by the 2nd electrode layer E2 and the 3rd electrode layer E3. Yes. That is, the first electrode layer E1 included in each electrode portion 11a, 12a, 13a, 14a includes a portion covered with a plating layer constituted by the second electrode layer E2 and the third electrode layer E3, and And a portion exposed from the plating layer. The portion of the first electrode layer E1 exposed from the plating layer includes the edge of the first electrode layer E1, and is located outside the plating layer as viewed from the first direction D1.

  In this modification, as shown in FIGS. 13 and 14, in each of the electrode portions 11a, 12a, 13a, and 14a, the third direction D3 (the third side surface 1e and the fourth side surface 1f in the first electrode layer E1 has Edges in the opposite direction), that is, both end portions in the third direction D3 of the first electrode layer E1 are exposed from the second electrode layer E2 and the third electrode layer E3. Although a new illustration is omitted, in this modification, as shown in FIGS. 4 and 5, in the second direction D <b> 2 in the first electrode layer E <b> 1 included in each electrode portion 11 a, 12 a, 13 a, 14 a. The edge of the first electrode layer E1 in the second direction D2 is also exposed from the second electrode layer E2 and the third electrode layer E3.

  The resin film I covers the entire edge of the first electrode layer E1 of each electrode portion 11a, 12a, 13a, 14a and is in contact with the edge. That is, the resin film I covers a portion exposed from the plating layer in the first electrode layer E1 of each electrode portion 11a, 12a, 13a, 14a and is in contact with the portion. The plating layers (second electrode layer E2 and third electrode layer E3) are disposed on the region of the first electrode layer E1 exposed from the resin film I.

  In the laminated common mode filter CF of the modification shown in FIGS. 12 to 14, the resin film I covers the entire edge of the edge of the first electrode layer E <b> 1 included in each electrode portion 11 a, 12 a, 13 a, 14 a. Covers and touches the edge. For this reason, it is difficult for stress to concentrate over the entire circumference of the edge of the first electrode layer E1 included in each electrode portion 11a, 12a, 13a, 14a, and the edge is unlikely to be a starting point of a crack over the entire circumference.

  In the laminated common mode filter CF of this modification, the resin film I covers the edges in the second direction D2 of the first electrode layers E1 of the electrode portions 11a, 12a, 13a, and 14a over the entire circumference. For this reason, the generation | occurrence | production of the crack resulting from the external force (flexure stress) which acts when not only the external force which acts when the electronic device ED bends in the second direction D2 but also the electronic device ED bends in the third direction D3. It is suppressed.

  Also in this modification, the plating layers (second electrode layer E2 and third electrode layer E3) included in the electrode portions 11a, 12a, 13a, and 14a are exposed from the resin film I in the first electrode layer E1. Is placed on top. Therefore, also in this modified example, the mounting strength of the laminated common mode filter CF is ensured as in the above-described embodiment.

  Next, the configuration of the multilayer common mode filter CF according to the modification of the present embodiment will be described with reference to FIGS. 15 to 17 are plan views of the laminated common mode filter according to the present modification. In each modified example, the shape of the resin film is different from the laminated common mode filter CF of the modified example shown in FIGS.

  The laminated common mode filter CF shown in FIG. 15 includes four resin films Ic, Id, Ie, and If. The four resin films Ic, Id, Ie, If are provided for each of the first to fourth external electrodes 11, 12, 13, and 14 and are separated from each other. The resin film Ic covers only the edge of the first electrode layer E1 included in the electrode portion 11a of the first external electrode 11 over the entire circumference. The resin film Id covers only the edge of the first electrode layer E1 included in the electrode portion 12a of the second external electrode 12 over the entire circumference. The resin film Ie covers only the edge of the first electrode layer E1 included in the electrode portion 13a of the third external electrode 13 over the entire circumference. The resin film If covers only the edge of the first electrode layer E1 included in the electrode portion 14a of the fourth external electrode 14 over the entire circumference.

  The laminated common mode filter CF shown in FIG. 16 includes two resin films Ia and Ib. The two resin films Ia and Ib are separated in the second direction D2. The resin film Ia covers the entire edge of the first electrode layer E1 included in the electrode portions 11a and 13a of the two first and third external electrodes 11 and 13 adjacent to each other in the third direction D3. And it covers it integrally. The resin film Ib covers the entire edge of the first electrode layer E1 included in the electrode portions 12a and 14a of the two second and fourth external electrodes 12 and 14 adjacent to each other in the third direction D3, And it covers it integrally.

  The laminated common mode filter CF shown in FIG. 17 also includes two resin films Ia and Ib. The two resin films Ia and Ib are separated in the third direction D3. The resin film Ia extends over the entire edge of the first electrode layer E1 included in the electrode portions 11a and 12a of the two first and second external electrodes 11 and 12 adjacent to each other in the second direction D2. And it covers it integrally. The resin film Ib covers the entire edge of the first electrode layer E1 included in the electrode portions 13a and 14a of the two third and fourth external electrodes 13 and 14 adjacent to each other in the second direction D2, And it covers it integrally.

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  The 1st external electrode 11, the 2nd external electrode 12, the 3rd external electrode 13, and the 4th external electrode 14 do not necessarily need to have electrode part 11b, 12b, 13b, 14b. That is, the first external electrode 11 and the third external electrodes 11 and 13 may be disposed only on the two surfaces 1a and 1c, and the second external electrode 12 and the fourth external electrodes 12 and 14 You may arrange | position only to 1a and 1d.

  The first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 are not necessarily three layers including the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. It may not have a structure. For example, a conductive resin layer may be disposed between the first electrode layer E1 and the second electrode layer E2. That is, the second electrode layer E2 may be disposed on the first electrode layer E1 via the conductive resin layer. The conductive resin layer can be formed by curing the conductive resin applied on the first electrode layer E1. As the conductive resin, a thermosetting resin mixed with a metal powder and an organic solvent is used. As the metal powder, for example, Ag powder is used. As the thermosetting resin, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin is used.

  The plating layer disposed on the first electrode layer E1 does not necessarily have a two-layer structure including the second electrode layer E2 and the third electrode layer E3. The plating layer disposed on the first electrode layer E1 may be a single layer, or may have a laminated structure of three or more layers. For example, the plating layer disposed on the first electrode layer E1 has a three-layer structure including a Ni plating layer, a Cu plating layer formed on the Ni plating layer, and a Sn plating layer formed on the Cu plating layer, Alternatively, a three-layer structure including a Cu plating layer, a Ni plating layer formed on the Cu plating layer, and a Sn plating layer formed on the Ni plating layer may be used.

  The number of external electrodes respectively disposed at the end portions in the second direction D2 of the element body 1 is not limited to “two”. The number of external electrodes respectively disposed at the end portions of the element body 1 in the second direction D2 may be “three” or more.

  In the present embodiment and the modification, the multilayer common mode filter CF is described as an example of the electronic component, but applicable electronic components are not limited to the multilayer capacitor and the multilayer common mode filter. Applicable electronic components are, for example, multilayer electronic components such as multilayer capacitors, multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, or multilayer composite components, or electronic components other than multilayer electronic components.

  DESCRIPTION OF SYMBOLS 1 ... Element body, 1a ... 1st main surface, 1c ... 1st side surface, 1d ... 2nd side surface, 11 ... 1st external electrode, 11a, 11b, 11c ... Electrode part which 1st external electrode has, 12 2nd external electrode, 12a, 12b, 12c ... electrode part which 2nd external electrode has, 13 ... 3rd external electrode, 13a, 13b, 13c ... electrode part which 3rd external electrode has, 14 ... the fourth external electrode, 14a, 14b, 14c ... the electrode part of the fourth external electrode, CF ... the laminated common mode filter, D2 ... the second direction, E1 ... the first electrode layer, E2 ... the second electrode layer , E3 ... third electrode layer, I, Ia, Ib, Ic, Id, Ie, If ... resin film.

Claims (4)

An element body having a rectangular parallelepiped shape and having a main surface that is a mounting surface and a pair of side surfaces that face each other and are adjacent to the main surface;
A plurality of first electrodes disposed on both ends of the element body in a direction in which the pair of side surfaces oppose each other, a first electrode disposed on the main surface, and a second electrode disposed on the side An external electrode having a portion;
A resin film disposed on the main surface and having electrical insulation,
The first electrode part and the second electrode part include a sintered metal layer disposed on the element body, and a plating layer disposed on the sintered metal layer,
The resin film covers at least an edge in the direction in which the pair of side surfaces of the sintered metal layer included in the first electrode portion is opposed, and is in contact with the edge,
The plating component included in the first electrode portion is an electronic component disposed on a region exposed from the resin film in the sintered metal layer included in the first electrode portion.   2. The electronic component according to claim 1, wherein the resin film integrally covers the edge of the sintered metal layer included in the first electrode portions of at least two adjacent external electrodes.   The said resin film is provided for every said external electrode, The said 1st electrode part of the corresponding said external electrode has covered the said edge of the said sintered metal layer of Claim 1. Electronic components.   The said resin film has covered the edge of the said sintered metal layer which said 1st electrode part contains over the perimeter, and is in contact with the said edge. Electronic components.

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