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JP2018058203A - ケミカルメカニカル研磨パッドの表面を成形するための装置 - Google Patents

ケミカルメカニカル研磨パッドの表面を成形するための装置 Download PDF

Info

Publication number
JP2018058203A
JP2018058203A JP2017184624A JP2017184624A JP2018058203A JP 2018058203 A JP2018058203 A JP 2018058203A JP 2017184624 A JP2017184624 A JP 2017184624A JP 2017184624 A JP2017184624 A JP 2017184624A JP 2018058203 A JP2018058203 A JP 2018058203A
Authority
JP
Japan
Prior art keywords
polishing layer
cmp polishing
pad
cmp
rotating grinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017184624A
Other languages
English (en)
Japanese (ja)
Inventor
ジェフリー・ジェームズ・ヘンドロン
James Hendron Jeffrey
ジェフリー・ロバート・スタック
Robert Stack Jeffrey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2018058203A publication Critical patent/JP2018058203A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2017184624A 2016-09-29 2017-09-26 ケミカルメカニカル研磨パッドの表面を成形するための装置 Pending JP2018058203A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/279,677 2016-09-29
US15/279,677 US20180085891A1 (en) 2016-09-29 2016-09-29 Apparatus for shaping the surface of chemical mechanical polishing pads

Publications (1)

Publication Number Publication Date
JP2018058203A true JP2018058203A (ja) 2018-04-12

Family

ID=61564486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017184624A Pending JP2018058203A (ja) 2016-09-29 2017-09-26 ケミカルメカニカル研磨パッドの表面を成形するための装置

Country Status (7)

Country Link
US (1) US20180085891A1 (zh)
JP (1) JP2018058203A (zh)
KR (1) KR20180035697A (zh)
CN (1) CN107877359A (zh)
DE (1) DE102017008997A1 (zh)
FR (1) FR3056431A1 (zh)
TW (1) TW201819110A (zh)

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3001054B1 (ja) * 1998-06-29 2000-01-17 日本電気株式会社 研磨装置及び研磨パッドの表面調整方法
JP2000079551A (ja) * 1998-07-06 2000-03-21 Canon Inc コンディショニング装置及びコンディショニング方法
TW383644U (en) * 1999-03-23 2000-03-01 Vanguard Int Semiconduct Corp Dressing apparatus
US6302772B1 (en) * 1999-04-01 2001-10-16 Mitsubishi Materials Corporation Apparatus and method for dressing a wafer polishing pad
US6350183B2 (en) * 1999-08-10 2002-02-26 International Business Machines Corporation High pressure cleaning
US6857942B1 (en) * 2000-01-11 2005-02-22 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for pre-conditioning a conditioning disc
US6969305B2 (en) * 2000-02-07 2005-11-29 Ebara Corporation Polishing apparatus
DE10025173A1 (de) * 2000-05-24 2001-11-29 Swarovski Tyrolit Schleif Verfahren zum Schleifen von insbesondere Nickel enthaltenden metallischen Werkstücken
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
JP2002144218A (ja) * 2000-11-09 2002-05-21 Ebara Corp 研磨装置
US6896583B2 (en) * 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
TWI260256B (en) 2002-03-25 2006-08-21 Thomas West Inc Conditioner and conditioning methods for smooth pads
US6899612B2 (en) * 2003-02-25 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad apparatus and methods
US20050178666A1 (en) * 2004-01-13 2005-08-18 Applied Materials, Inc. Methods for fabrication of a polishing article
JP2007069323A (ja) * 2005-09-08 2007-03-22 Shinano Denki Seiren Kk 定盤表面調整用砥石及び表面調整方法
US20070135024A1 (en) * 2005-12-08 2007-06-14 Itsuki Kobata Polishing pad and polishing apparatus
DE602008002445D1 (de) * 2007-01-30 2010-10-28 Ebara Corp Poliervorrichtung
KR101916492B1 (ko) * 2011-03-07 2018-11-07 엔테그리스, 아이엔씨. 화학 및 기계적 평탄화 패드 컨디셔너
JP5898420B2 (ja) * 2011-06-08 2016-04-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
CN106463379B (zh) * 2014-03-21 2019-08-06 恩特格里斯公司 具有细长切割边缘的化学机械平坦化垫调节器
JP6328977B2 (ja) * 2014-03-31 2018-05-23 株式会社荏原製作所 基板研磨装置
CN105500208A (zh) * 2016-01-21 2016-04-20 苏州新美光纳米科技有限公司 Cmp工艺抛光垫的修整装置
CN106041741B (zh) * 2016-06-21 2018-09-04 大连理工大学 一种含有多孔结构的cmp抛光垫修整器

Also Published As

Publication number Publication date
US20180085891A1 (en) 2018-03-29
CN107877359A (zh) 2018-04-06
DE102017008997A1 (de) 2018-03-29
FR3056431A1 (fr) 2018-03-30
KR20180035697A (ko) 2018-04-06
TW201819110A (zh) 2018-06-01

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