JP2018052035A - Substrate protection film, method for manufacturing mems device and method for manufacturing liquid jet head - Google Patents

Abstract

The present invention provides a substrate protective film, a MEMS device manufacturing method, and a liquid ejecting head manufacturing method that can handle automation of pasting and peeling on a substrate. A substrate protective film (41) to be attached to a substrate (37, 38) constituting the MEMS device in the manufacture of the MEMS device, and directed toward an outer edge side of the substrate rather than an end of an adhesion region with the substrate. It has the extended part (51) extended, and the edge of the said extended part is not adhere | attached on the board | substrate, It is characterized by the above-mentioned. [Selection] Figure 9

Description

  The present invention relates to, for example, a substrate protective film used for protecting a substrate at the time of manufacturing a MEMS device, a method for manufacturing a MEMS device, and a method for manufacturing a liquid jet head.

  Some MEMS (Micro Electro Mechanical Systems) devices are bonded with an adhesive in a state where a plurality of substrates are stacked. As a liquid ejecting head as an aspect of the MEMS device, for example, there is a liquid jet head in which a plurality of substrates such as a substrate in which a flow path such as a pressure chamber is formed is stacked (see, for example, Patent Document 1). In such a configuration, a silicon single crystal substrate (hereinafter simply referred to as a silicon substrate) is used as the substrate, and the flow path and the like are formed by etching the silicon substrate. .

Japanese Patent Laying-Open No. 2015-024528

  By the way, in the manufacturing process of MEMS provided with said board | substrate, in order to process a board | substrate or to convey a board | substrate between process stages, it is a board | substrate with the suction holding jig in which several suction holes were opened. There is a case where a structure for adsorbing and holding is used. In this case, for example, a structure such as a drive element or an empty portion may be disposed on the surface of the substrate that is sucked and held by the suction holding jig (hereinafter referred to as a holding surface). A protective film for protecting the surface is attached to the holding surface. Automation of the process of sticking such a protective film on the holding surface of a board | substrate and the process of peeling a protective film from a holding surface after predetermined | prescribed processing is desired. In particular, it was a problem in automating the peeling of the substrate protective film once attached to the substrate without tearing or leaving part of it on the substrate.

  The present invention has been made in view of such circumstances, and the object of the present invention is to provide a substrate protective film, a MEMS device manufacturing method, and a liquid ejecting head that can handle automation such as pasting and peeling on a substrate. It is to provide a manufacturing method.

The substrate protective film of the present invention has been proposed to achieve the above object, and is a substrate protective film that is attached to a substrate that constitutes the MEMS device in the production of the MEMS device,
It has the extended part extended toward the outer edge side of the said board | substrate rather than the edge of the adhesion | attachment area | region with the said board | substrate.
The “substrate” is meant to include both a single substrate and a laminate of a plurality of substrates.

  According to the above invention, since the extension part is located on the outer edge side of the substrate with respect to the adhesion region between the substrate protective film and the substrate and is not adhered to the substrate, the end of the extension part is defined as a starting point of peeling. can do. This makes it possible to automate the pasting and peeling of the substrate protective film on the substrate, and in particular, while suppressing problems such as tearing of the substrate protective film, the substrate protective film stuck to the substrate is It becomes easy to peel off using the edge as a starting point of peeling.

  In the above configuration, it is desirable to employ a configuration having an opening that can expose the alignment mark at a position corresponding to the alignment mark related to the positioning of the substrate.

  According to this configuration, the substrate can be aligned based on the alignment mark while the substrate protective film is still attached to the substrate. Thereby, since a board | substrate is arrange | positioned in a prescription | regulation position with a board | substrate protective film affixed, it becomes possible to process by the photolithographic method etc., for example.

  In the above configuration, it is desirable to employ a configuration in which the sides that define the opening are connected by a curve.

  According to this configuration, since there is no corner in the portion that defines the opening, it is possible to suppress local concentration of stress in the opening when the substrate protection film is peeled off from the substrate. The tearing is suppressed.

  The said structure WHEREIN: It is desirable to employ | adopt the structure by which the said extension part was formed two or more in the position which differs in the outer peripheral direction of the said board | substrate protective film.

  According to this configuration, it is possible to cope with the case where the substrate transport direction and the direction of sticking and peeling of the substrate protective film are different due to the relationship between the crystal orientation of the substrate and the orientation of the parts partitioned on the substrate, etc. Become.

Moreover, the manufacturing method of the MEMS device of the present invention includes a protective film sticking step of sticking the substrate protective film having any one of the above structures to a substrate constituting the MEMS device,
An alignment step of positioning the substrate in a state of holding the substrate by adsorbing the affixed substrate protection film with an adsorption holding jig;
A processing step of processing the positioned substrate;
A peeling step of peeling the substrate protective film from the substrate after processing;
Have
In the peeling step, a peeling tape is welded to the extending portion, and the substrate protective film is peeled from the substrate together with the peeling tape, starting from the extending portion.

  According to this, the substrate protective film is affixed to the substrate, the substrate is positioned, the processed substrate is processed, and the series of steps from the substrate being processed to the separation of the substrate protective film is automated. Is possible. As a result, the manufacturing efficiency of the MEMS device is improved.

  In addition, a method for manufacturing a liquid jet head according to the present invention is characterized by passing through the above-described method for manufacturing a MEMS device.

  According to this, since the extension part of the substrate protection film is located on the outer edge side of the substrate with respect to the adhesion region between the substrate protection film and the substrate and is not adhered to the substrate, the end of the extension part is peeled off. Can be the starting point. This makes it possible to attach a substrate protection film to a substrate, position the substrate, process the positioned substrate, and automate a series of steps from peeling the substrate protection film to the processed substrate It becomes. As a result, the manufacturing efficiency of the liquid jet head is improved.

2 is a perspective view illustrating an internal configuration of the printer. FIG. It is sectional drawing explaining the structure of a MEMS device (recording head). It is the sectional view on the AA line in FIG. It is a flowchart explaining the manufacturing process of a MEMS device (recording head). It is process drawing explaining the manufacturing process of a MEMS device (recording head). It is process drawing explaining the manufacturing process of a MEMS device (recording head). It is process drawing explaining the manufacturing process of a MEMS device (recording head). It is a schematic diagram explaining the structure of a film sticking apparatus. It is a top view explaining the structure of a board | substrate protective film. It is sectional drawing of the area | region X in FIG. It is an enlarged view explaining the structure of a notch part. It is process drawing explaining the manufacturing process of a MEMS device (recording head). It is process drawing explaining the manufacturing process of a MEMS device (recording head). It is process drawing explaining the manufacturing process of a MEMS device (recording head). It is a schematic diagram which shows the state by which an extension part and a peeling tape are welded with a heating jig. It is process drawing explaining the manufacturing process of a MEMS device (recording head). It is process drawing explaining the manufacturing process of a MEMS device (recording head).

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In the embodiments described below, various limitations are made as preferred specific examples of the present invention. However, the scope of the present invention is not limited to the following description unless otherwise specified. However, the present invention is not limited to these embodiments. In this embodiment, a description will be given using a recording head (inkjet head) 2 which is one aspect of the MEMS device. In the recording head 2, for example, a piezoelectric element 19 (see FIG. 3) is provided as a drive element that receives an electric signal from the outside and drives the movable region, and a pressure chamber 15 ( This corresponds to FIG. The present invention can also be applied to a configuration in which a drive element converts a pressure change in space into an electrical signal and outputs the electrical signal to the outside of the MEM device.

  FIG. 1 is a perspective view illustrating an internal configuration of a printer 1 (a type of liquid ejecting apparatus). The printer 1 has a recording head 2 (a kind of liquid ejecting head) attached thereto, and a carriage 4 to which an ink cartridge 3 as a liquid supply source is detachably attached. The carriage 4 is attached to the recording medium 2 in the paper width direction, that is, A carriage moving mechanism 7 that reciprocates in the main scanning direction and a paper feed mechanism 8 that conveys a recording medium 2 such as a recording sheet in a sub-scanning direction orthogonal to the main scanning direction are provided. The carriage 4 is configured to move in the main scanning direction by a carriage moving mechanism 7. The printer 1 records characters, images, and the like on the recording medium 2 while sequentially transporting the recording medium 2 and reciprocating the carriage 4. It is also possible to employ a configuration in which the ink cartridge 3 is disposed not on the carriage 4 but on the main body side of the printer 1 and ink in the ink cartridge 3 is supplied to the recording head 2 side through an ink supply tube.

  FIG. 2 is a plan view of the recording head 2 in the present embodiment, and FIG. 3 is a cross-sectional view of the main part of the recording head 2 taken along line AA in FIG. The recording head 2 in this embodiment is configured by laminating a flow path forming substrate 10, a nozzle plate 11, an actuator unit 12, a sealing plate 13, and the like. The flow path forming substrate 10 is made of, for example, a silicon single crystal substrate having a surface orientation (110) on the surface (bonding surface) to which the nozzle plate 11 and the sealing plate 13 are bonded. In the flow path forming substrate 10, vacancies defining the pressure chambers 15 are formed side by side in the nozzle row direction by anisotropic etching. The pressure chamber 15 is a space formed by closing one opening of the above-described empty portion of the flow path forming substrate 10 by the nozzle plate 11 and closing the other opening of the empty portion by the diaphragm 14. . The pressure chamber 15 (empty portion) in the present embodiment has a substantially parallelogram-shaped opening that is long in a direction orthogonal to the nozzle row direction.

  In a region outside the pressure chamber 15 in the longitudinal direction of the flow path forming substrate 10 (the side opposite to the side communicating with the nozzle 18), a reservoir 16 common to the pressure chambers 15 extends along the nozzle row direction. Is formed. The reservoir 16 and each pressure chamber 15 communicate with each other through an individual supply port 17 provided for each pressure chamber 15. The reservoir 16 is provided for each type of ink (for each color), and common ink is stored in the plurality of pressure chambers 15. The individual supply port 17 is formed with a narrower width than the pressure chamber 15, and imparts flow path resistance to the ink flowing from the reservoir 16 into the pressure chamber 15.

  The nozzle plate 11 is bonded to the lower surface of the flow path forming substrate 10 (the surface opposite to the vibration plate 14 side) via an adhesive, a heat welding film, or the like. The nozzle plate 11 is a plate material in which a plurality of nozzles 18 are arranged in a row at a predetermined pitch. In this embodiment, the nozzle row is configured by arranging a plurality of nozzles 18 at a predetermined pitch (for example, 360 [dpi]). Each nozzle 18 communicates with the end of the pressure chamber 15 opposite to the individual supply port 17. The nozzle plate 11 is made of, for example, glass ceramics, a silicon single crystal substrate, or stainless steel.

The actuator unit 12 in the present embodiment includes a diaphragm 14, a piezoelectric element 19, a lead electrode 20, and the like. The diaphragm 14 includes an elastic film 21 formed on the upper surface of the flow path forming substrate 10 and an insulating film 22 formed on the elastic film 21. The elastic film 21 is made of, for example, silicon dioxide (SiO ₂ ), and the insulating film 22 is made of, for example, zirconium oxide (ZrO ₂ ). A portion of the diaphragm 14 corresponding to the pressure chamber 15, that is, a portion that closes the upper opening of the pressure chamber 15 (empty portion) is displaced in a direction away from or near to the nozzle 18 due to the bending deformation of the piezoelectric element 19. Functions as a flexible surface (driving region). A communication opening 23 communicating with the reservoir 16 is formed at a portion of the diaphragm 14 corresponding to the reservoir 16 of the flow path forming substrate 10.

  A piezoelectric element 19 is formed in a portion corresponding to the pressure chamber 15 in the insulating film 22 of the vibration plate 14. The piezoelectric element 19 is configured by laminating a lower electrode film 25 (first electrode), a piezoelectric film 26, and an upper electrode film 27 (second electrode) in this order from the diaphragm 14 side. In the present embodiment, the lower electrode film 25 and the piezoelectric film 26 are patterned for each pressure chamber 15, and the lower electrode film 25 is an individual electrode for each piezoelectric element 19. On the other hand, the upper electrode film 27 is an electrode common to each piezoelectric element 19. That is, the upper electrode film 27 is continuously formed across the pressure chambers 15 along the pressure chamber juxtaposition direction. In the stacking direction, the portion where the upper electrode film 27, the piezoelectric film 26, and the lower electrode film 25 overlap is a piezoelectric active portion in which piezoelectric distortion occurs due to voltage application to both electrode layers. That is, the upper electrode film 27 is a common electrode of the piezoelectric element 19, and the lower electrode film 25 is an individual electrode of the piezoelectric element 19.

  On the upper electrode film 27, a lead electrode 20 made of gold (Au) is formed via an adhesion layer (not shown) such as NiCr. The lead electrode 20 is patterned corresponding to each lower electrode film 25 that is an individual electrode, and is electrically connected to the lower electrode film 25. A drive voltage (drive pulse) is selectively applied to each piezoelectric element 19 through the lead electrode 20.

  The piezoelectric film 26 in the present embodiment is formed on the vibration plate 14 so as to cover the lower electrode film 25. As the piezoelectric film 26, a ferroelectric piezoelectric material such as lead (Pb), titanium (Ti) and zirconium (Zr), for example, lead zirconate titanate (PZT), niobium oxide, What added metal oxides, such as nickel oxide or magnesium oxide, etc. can be used.

  A sealing plate 13 having an accommodation space 29 that can accommodate the piezoelectric element 19 is joined to the upper surface of the actuator unit 12 opposite to the lower surface that is the joining surface with the flow path forming substrate 10. The sealing plate 13 is a hollow box-shaped member having an accommodation cavity 29 opened on the lower surface side which is a joint surface with the flow path forming substrate 10 on which the actuator unit 12 is laminated. In the present embodiment, Similar to the flow path forming substrate 10, it is made of a silicon single crystal substrate. The accommodation space 29 is a recess formed halfway in the height direction of the sealing plate 13 from the lower surface side to the upper surface side of the sealing plate 13. The dimension (inner method) of the accommodation empty portion 29 in the nozzle row direction is set to a size that can accommodate all the piezoelectric elements 19 in the same row. In addition, the dimension of the housing empty portion 32 in the direction orthogonal to the nozzle row is set to a size that can accommodate the piezoelectric body active of the piezoelectric element 19. Further, as shown in FIG. 3, the sealing plate 13 is located at a position outside of the accommodation empty portion 29 in the direction orthogonal to the nozzle row, and includes the communication opening 23 and the flow path of the diaphragm 14. In a region corresponding to the reservoir 16 of the formation substrate 10, a liquid chamber cavity 30 is provided. The liquid chamber hollow portion 30 is provided along the direction in which the pressure chambers 15 are arranged so as to penetrate the sealing plate 13 in the thickness direction, and communicate with the communication opening 23 and the reservoir 16 in series as described above. To do.

  A compliance substrate 38 including a sealing film 32 and a fixing plate 37 is bonded onto the sealing plate 13. The sealing film 32 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide film, a thin stainless film, etc.), and one surface of the liquid chamber cavity 30 is sealed by the sealing film 32. Yes. The fixing plate 37 is thicker than the sealing film 32 and is formed of a harder material (for example, stainless steel). Since the region of the fixing plate 37 facing the reservoir is an opening 33a that is completely removed in the thickness direction, one surface of the reservoir is sealed only by the flexible sealing film 32. Yes. In addition, a wiring opening 34 that penetrates the sealing plate 13 in the thickness direction is formed in the sealing plate 13 between the accommodation space 29 and the liquid chamber space 30. The other end of the lead electrode 20 whose one end is connected to the lower electrode film 25 of the piezoelectric element 19 in the accommodation space 29 is exposed in the wiring opening 34. A terminal of a wiring member such as COF (Chip On Film) (not shown) from the printer main body side is electrically connected to the exposed portion of the lead electrode 20. The lower surface of the sealing plate 13 is bonded to the upper surface of the flow path forming substrate 10 on which the actuator unit 12 is laminated by an adhesive. As the adhesive, for example, an epoxy or urethane adhesive is employed.

  In the recording head 2 configured as described above, ink is taken into the reservoir 16 from the ink cartridge 3 through the liquid chamber empty portion 30 and the like, and the flow path from the reservoir 16 to the nozzle 18 through the pressure chamber 15 is filled with ink. Then, by supplying a drive signal from the printer body side, an electric field corresponding to the potential difference between the two electrodes is applied between the lower electrode film 25 and the upper electrode film 25 corresponding to the pressure chamber 15, and the piezoelectric element 19 and When the working surface of the vibration plate 14 is bent and deformed, pressure fluctuation occurs in the ink in the pressure chamber 15. By controlling the pressure fluctuation, ink can be ejected from the nozzle 18 or the meniscus in the nozzle 18 can be slightly vibrated to the extent that ink is not ejected.

  FIG. 4 is a flowchart for explaining the production of the recording head 2 in the present embodiment. 5 to 17 are process diagrams relating to the manufacturing process of the recording head 2. In the manufacturing process of the recording head 2 in the present embodiment, first, as shown in FIG. 5, the elastic film 21 and the insulating film 22 are sequentially formed on one surface of the first silicon substrate 36 that is the material of the flow path forming substrate 10. Thus, the diaphragm 14 is formed. Further, the lower electrode film 25, the piezoelectric film 26, and the upper electrode film 27 are sequentially formed on the diaphragm 14 to form the piezoelectric element 19. Hereinafter, the illustration of the structure such as the piezoelectric element 19 formed on the first silicon substrate 36 is omitted as appropriate. Next, as shown in FIG. 6, the second silicon substrate 37 for the sealing plate 13 in which the accommodation voids 29 and the like are formed in advance on one surface where the piezoelectric elements 19 and the like are formed is an adhesive or the like. To form a laminated body 38 (a kind of substrate in the present invention). At this time, the piezoelectric element 19 of the first silicon substrate 36 is accommodated in the accommodating space 29 of the second silicon substrate 37. Subsequently, a polishing device (back surface) is formed from the other surface opposite to the one surface on which the piezoelectric elements 19 and the like are formed so that the first silicon substrate 36 has a necessary thickness as the flow path forming substrate 10. Grinded by a grinder) or the like. Subsequently, as shown in FIG. 7, a resist 39 used in a photolithography method for forming a flow path such as the pressure chamber 15 is applied to the other surface of the first silicon substrate 36. Processing is performed to accelerate the curing of the resist 39 (S1). As the resist 39, a silicon nitride film or the like is employed.

  Subsequently, a process such as a photolithography method is performed on the first silicon substrate 36 on the surface of the stacked body 38 opposite to the first silicon substrate 36 side of the second silicon substrate 37 (hereinafter referred to as a holding surface). In order to protect the second silicon substrate 37 when sucked and held by the sucking and holding jig 60, the substrate protective film 41 is used to prevent the etching solution from entering the piezoelectric element 19 and preventing foreign substances from entering. However, it sticks by the film sticking apparatus 40 demonstrated below (protective film sticking process S2).

  FIG. 8 is a schematic diagram illustrating the configuration of the film sticking device 40. The film sticking device 40 includes a feeding roller 42 that feeds out the substrate protective film 41, a pre-cut portion 43 that cuts the substrate protective film 41 sent from the steering roller 42 along a predetermined sticking shape, The peeling part 45 which peels the board | substrate protective film 41 from the peeling paper 44, the sticking part 46 which sticks the board | substrate protective film 41 cut by the predetermined sticking shape to the 2nd silicon substrate 37 in the laminated body 38, and the peeling paper 44 A winding roller 47 for winding is provided. The feeding roller 42 has a substrate protective film 41 with release paper wound in a roll shape, and sequentially feeds the substrate protective film 41 with release paper toward a subsequent processing stage. As the substrate protection film 41, for example, a photosensitive resin film (resist film) is employed. The pre-cut portion 43 has a cutting roller 48 and a receiving roller 49, and is attached to the laminated body 38 on the substrate protective film 41 when passing between the rollers 48 and 49 through the substrate protective film 41. The cut is made by the cutting roller 48 so that the pasting shape is as follows.

  FIG. 9 is a plan view for explaining the pasting shape of the substrate protective film 41. FIG. 10 is a cross-sectional view of the region X in FIG. Further, FIG. 11 is a plan view illustrating the configuration of the notch 52 in the substrate protective film 41. In addition, the broken line in FIG. 9 and FIG. 11 has shown the shape (outer shape) of the laminated body 38 (2nd silicon substrate 37) to which the board | substrate protective film 41 is affixed. The substrate protective film 41 in the present embodiment includes a circular film main body portion 41 ′ following the planar shape of the second silicon substrate 37 in the laminated body 38 to be attached, and an outer peripheral edge with respect to the center of the film main body portion 41 ′. An extended portion 51 extending outward, and a notched portion 52 (a type of opening in the present invention) retreated (notched) from the outer peripheral edge of the substrate protective film 41 toward the inside (center side); have. The film body 41 ′ is set to be slightly smaller than the outer shape of the second silicon substrate 37 in the laminated body 38 to be pasted. For this reason, in the state where the film body portion 41 ′ is positioned and attached to the second silicon substrate 37, the outer peripheral edge of the film main body portion 41 ′ is located slightly inside (closer to the center) than the outer peripheral edge of the second silicon substrate 37.

  A plurality of extending portions 51 formed so as to protrude outward from the outer peripheral edge of the film main body portion 41 ′ are formed in different positions in the circumferential direction of the film main body portion 41 ′. In the present embodiment, the first extension portion 51a formed at a position corresponding to the orientation flat (hereinafter referred to as orientation flat OF) of the second silicon substrate 37, and the first extension portion 51a are the film body portion. The substrate extension film 41 is provided with a second extending portion 51b formed at a position where the angle of 90 ° is different with respect to the center of 41 ′. As described above, the plurality of extending portions 51 are formed with different positions in the circumferential direction of the substrate protective film 41 (film main body portion 41 ′), so that the substrate (the second silicon substrate 37 in the present embodiment) is formed. The orientation of the substrate and the direction of sticking and peeling of the substrate protective film depend on the crystal orientation and the orientation of the parts (the sealing plate 13 and the flow path forming substrate 10 in this embodiment) partitioned on the substrate. It is possible to cope with different cases. That is, regarding the substrate protective film 41 in the present embodiment, the substrate (second silicon substrate 37) is attached to and peeled from the substrate in a direction parallel to the surface direction of the orientation flat OF. The substrate protective film 41 can also be employed in a configuration in which pasting and peeling are performed on the substrate in a direction orthogonal to the surface direction.

  As shown in FIG. 10, the upper and lower surfaces of the second silicon substrate 37, that is, the surface to which the first silicon substrate 36 is bonded (first surface) and the surface to which the substrate protective film 41 is attached (second surface). A chamfered portion 53 is formed in advance on each of the outer peripheral edge portions. The substrate protective film 41 is bonded in a region (adhesive region indicated by Ba in FIG. 10) on the inner side (center side of the film main body 41 ′) than the chamfered portion 53. In the state where the substrate protective film 41 is adhered to the second silicon 37, the extending portion 51 extends toward the outer peripheral edge of the second silicon substrate 37 from the end of the bonding region Ba. The end of the protruding portion 51 is a free end that is not bonded to the second silicon substrate 37. And in the protective film peeling process mentioned later, it is comprised so that the board | substrate protective film 41 may be peeled from the 2nd silicon substrate 37 from the edge of the said extension part 51 as the starting point.

  As shown in FIG. 9, the notch portions 52 are formed at two positions in total in the substrate protective film 41 with different positions. Here, alignment marks 56 a and 56 b are formed in advance on the holding surface of the second silicon substrate 37. These alignment marks 56a and 56b are formed, for example, on one side and the other side in the surface direction of the orientation flat in a region outside the region where a plurality of regions to be the sealing plate 13 are partitioned. For these alignment marks 56a and 56b, various types of alignment marks formed by, for example, etching or plating can be employed. In short, any mark may be used as a reference for positioning the flow path forming substrate 10 (laminated body 38) in the photolithography method with respect to the flow path forming substrate 10. The notch 52 is formed at a position where the alignment marks 56a and 56b can be exposed in a state where the substrate protective film 41 is stuck to the holding surface of the second silicon substrate 37.

  FIG. 11 is an enlarged view for explaining the configuration of the notch 52. As shown in FIG. 11, these notches 52 are defined by three sides 57a, 57b, and 57c, and these sides 57 are smoothly connected via a curve (R shape) ( Is continuous). In addition, the outer edge and the side 57a of the substrate protective film 41 are smoothly continuous via a curve, and similarly, the outer edge and the side 57a of the substrate protective film 41 are also continuous via a curve. That is, no corners are formed in the portion constituting the notch 52. For this reason, in the protective film peeling process mentioned later, when peeling the board | substrate protective film 41 from the laminated body 38 (2nd silicon substrate 37), it is suppressed that stress concentrates locally in the notch part 52, thereby. In addition, the substrate protective film 41 is prevented from tearing at the notch 52. Furthermore, regarding the width W of the notch 52, that is, the dimension (inner dimension) in the direction orthogonal to the alignment direction of the notches 56a and 56b, the substrate protective film 41 is peeled off in the protective film peeling step (S6) described later. The peeling tape 65 is pressed against the substrate protective film 41 and the extending portion 51 by a heating jig 66 (see FIG. 15), and the peeling tape 65 at the pressed portion is flexed to the substrate protective film 41 side to the maximum extent. Even in this case, the size is set such that the most bent portion does not come into contact with the second silicon substrate 37. The opening according to the present invention is not limited to the shape like the notch 52 illustrated in the present embodiment, and is, for example, a window-shaped opening surrounded by the material of the substrate protection film 41. Also good.

  The substrate protective film 41 that has been cut along the pasting shape in the pre-cut portion 43 is subsequently peeled off from the release paper 44 in the peeling portion 45. The peeling portion 45 has a first guide surface 45a that guides the substrate protection film 41 from the pre-cut portion 43 side to the sticking portion 46 side, and a second guide surface 45b that guides the release paper 44 to the take-up roller 47 side. doing. The end of the release paper 44 is connected in advance to the take-up roller 47, and is peeled off from the substrate protection film 41 at the portion where the first guide surface 45a and the second guide surface 45b intersect and guided to the second guide surface 45b. Then, it is configured to be sequentially wound around the winding roller 47. Thereby, only the substrate protective film 41 peeled from the release paper 44 is sent to the sticking part 46 side. A sticking roller 54 is provided in the sticking part 46. The affixing unit 46 sandwiches the substrate protection film 41 with the laminated body 38 that is sent below the affixing roller 54 in a posture in which the second silicon substrate 37 side is directed to the affixing roller 54 side. The substrate protection film 41 is attached to (bonded to) the second silicon substrate 37 of the laminate 38 by rotating the sticking roller 54 counterclockwise in the drawing with the film 41 pressed to the laminate 38 side. Since the substrate protective film 41 affixed to the second silicon substrate 37 is notched along the affixed shape as described above, the portion other than the affixed shape (the surplus part) is the second silicon. Only the portion peeled off from the substrate 37, wound up on a collecting roll (not shown), collected, and cut into a pasted shape remains on the second silicon substrate 37. Here, in the present embodiment, the cutout portion 52 formed in the substrate protection film 41 has a shape cut out from the outer edge of the substrate protection film 41 toward the inside (center side). Before the separation, the portion in the notch 52 is continuous with the surplus portion. For this reason, for example, compared with a window-shaped configuration that is separate from the surplus portion, it is suppressed that the surplus portion remains inside the notch 52 when the pasted shape portion and the surplus portion are separated. The

  Thus, if the substrate protective film 41 is attached to the second silicon substrate 37, as shown in FIG. 12, prior to the processing of the flow path for the second silicon substrate 37 by the photolithography method, An alignment step S3 for arranging 38 at a specified position is performed. In the alignment step S3, the alignment body 58 and the camera 61 are used to align the stacked body 38. The alignment substrate 58 is made of a light-transmitting plate material such as glass whose linear expansion coefficient is as small as possible. The alignment substrate 58 is provided with a pair of reference marks 59 that define the position of the laminated body 38 in the substrate surface direction. In the alignment step S3, each reference mark 59 on the alignment substrate 58 is recognized by the camera 61 arranged below the alignment substrate 58, and each position is stored. Subsequently, the laminated body 38 in which the substrate protective film 41 is attached to the holding surface of the second silicon substrate 37 is placed between the alignment substrate 58 and the camera 61 with the holding surface side being sucked and held by the suction holding jig 60. Positioned between. The suction holding jig 60 is a jig for holding the laminated body 38, and a suction path 62 is formed therein. The suction path 62 is divided into a plurality of openings and opens on the suction surface that sucks the stacked body 38. The suction holding jig 60 sucks the substrate protective film 41 by the suction force generated on the suction surface side through the suction path 62 by a suction mechanism such as a suction pump (not shown) to suck and hold the laminated body 38 on the suction surface. . The suction holding jig 60 is configured not to cover the alignment mark 56 of the second silicon substrate 37 in a state where the stacked body 38 is held.

  As described above, in the alignment step S3, the laminated body 38 in which the substrate protective film 41 is attached to the holding surface of the second silicon substrate 37 is held in the state where the holding surface side is sucked and held by the suction holding jig 60. In the state of being arranged between the camera 58 and the camera 61, the notch 52 is provided in the substrate protection film 41, so that the alignment mark 56 of the second silicon substrate 37 is exposed in the notch 52. Is done. Accordingly, the alignment mark 56 can be recognized by the camera 61, and the position of the stacked body 38 is adjusted so that the alignment mark 56 is aligned with the position corresponding to the reference mark 59 of the alignment substrate 58 stored in advance. Positioned. As a result, it is possible to perform the alignment process without any problem while protecting the holding surface of the second silicon substrate 37 when the substrate protection film 41 is stuck and when being sucked and held by the suction holding jig 60. Become.

  When the alignment (positioning) of the stacked body 38 is completed, the pressure chamber 15 is then applied to the first silicon substrate 37 by photolithography in a state where the stacked body 38 is sucked and held by the suction holding jig 60. Processing for forming a flow path such as is performed (processing step). First, the resist 39 formed on the silicon substrate 36 is exposed through a mask pattern (not shown) related to the formation of the flow path (exposure step S4). Subsequently, the exposed resist 39 is developed (development step S5). As a result, the exposed portion of the resist 39 is removed and patterned into a predetermined shape for forming a flow path of the first silicon substrate 36. If the resist 39 is patterned through exposure and development, the substrate protective film 41 is subsequently peeled from the second silicon substrate 37 (protective film peeling step S6).

  In the protective film peeling step S6, first, as shown in FIG. 13, the peeling tape 65 is attached to the surface of the substrate protective film 41 opposite to the second silicon substrate 37 side by the pressure roller 64. The release tape 65 is a sheet material in which an adhesive layer is provided on the surface of the substrate protective film 41 on a flexible synthetic resin base material. As shown in FIG. 13, the pressing roller 64 sandwiches the peeling tape 65 between itself and the substrate protection film 41, and the extension portion 51 of the substrate protection film 41 sandwiches the center of the film body 41 ′. Then, the peeling tape 65 is affixed to the entirety of the substrate protection film 41 by rolling while pressing the peeling tape 65 against the substrate protection film 41 side from the opposite edge toward the extension portion 51. Next, as shown in FIG. 14, the portion where the extending portion 51 of the substrate protective film 41 and the peeling tape 65 overlap is heated by the heating jig 66 (heater) while the laminate 38 (second silicon substrate 37). ) Side, the extension 51 and the peeling tape 65 are welded to each other. Thereby, the board | substrate protective film 41 and the peeling tape 65 are joined more firmly in this part.

  FIG. 15 is a schematic diagram (a sectional view in the width direction of the extending portion 51) showing a state in which the extending portion 51 and the peeling tape 65 are welded by the heating jig 66. As described above, with respect to the width W of the cutout portion 52 provided in the extending portion 51, the heating tape 66 is pressed from the peeling tape 65 side to the extending portion 51 side, so that the peeling tape 65 in the pressed portion is the substrate. Even when it is bent to the maximum extent toward the protective film 41, the lowest point of the bent portion 65 a is set to a size that does not contact the second silicon substrate 37. This prevents the adhesive material of the peeling tape 65 from sticking to the second silicon substrate 37 and remaining.

  If the portion where the extending portion 51 of the substrate protection film 41 and the peeling tape 65 overlap is welded, then, as shown in FIG. 16, from the end of the peeling tape 65 on the extending portion 51 side, By being pulled back in the direction indicated by the arrow, the substrate protection film 41 is attached from the end of the extension part 51 to the extension part 51 of the film main body part 41 ′ along with the peeling tape 65. The second silicon substrate 37 is sequentially peeled off toward the opposite edge across the center (protective film peeling step S6). As described above, the end of the extended portion 51 is a free end that is not bonded to the second silicon substrate 37, and the extended portion 51 is welded to the release tape 65. Accordingly, the substrate protection film 41 is more reliably peeled from the second silicon substrate 37. Further, regarding the notch 52, as described above, the sides 57 that define the notch 52 are smoothly continuous via a curve (R shape) and have no corners. When the substrate protective film 41 is peeled off from the silicon substrate 37, the substrate protective film 41 is prevented from tearing at the notch 52.

  After the protective film peeling step S6, the first silicon substrate 36 in the stacked body 38 is etched using the patterned resist 39 as a mask (etching step S7). In this etching process, as shown in FIG. 17, voids that serve as flow paths such as the pressure chamber 15 and the reservoir 16 are formed by dry etching, wet etching, or a combination thereof. In addition, since the formation method of the flow path etc. by an etching is known, detailed description is abbreviate | omitted. In the etching process, if a flow path such as the pressure chamber 15 is formed in the first silicon substrate 36, the resist 39 is removed, and then the outer side of the stacked body 38 of the first silicon substrate 36 and the second silicon substrate 37 is removed. Unnecessary portions of the peripheral portion (portions outside the broken line in FIG. 17) are removed by cutting with, for example, dicing. The nozzle plate 11 having the nozzles 18 formed on the surface of the first silicon substrate 36 opposite to the second silicon substrate 37 is bonded, and the compliance substrate 31 is bonded to the second silicon substrate 37. The recording head 2 in this embodiment is manufactured by dividing the first silicon substrate 36 and the like into one chip size as shown in FIG.

  Thus, by adopting the substrate protective film 41 according to the present invention, the substrate protective film 41 is attached to the substrate (the laminate 38 in the present embodiment), the substrate is positioned, and the processed substrate is processed. It is possible to automate a series of steps until the substrate protective film 41 is peeled from the processed substrate. As a result, the manufacturing efficiency of the MEMS device (recording head 2) is improved. In particular, it becomes easy to peel off the substrate protective film 41 once attached to the substrate with the end of the extended portion 51 as a starting point of peeling while suppressing problems such as tearing of the substrate protective film 41. Moreover, since the opening (notch 52) which can expose the said alignment mark is provided in the position corresponding to the alignment mark of a board | substrate, alignment of a board | substrate is performed based on an alignment mark with the board | substrate protective film 41 affixed on the board | substrate. It becomes possible. As a result, the substrate is placed at the specified position while the substrate protective film 41 is stuck, so that, for example, processing by a photolithography method or the like can be performed.

In the above, the laminated body 38 in which the first silicon substrate 36 and the second silicon substrate 37 are laminated is exemplified as the substrate, and the configuration in which the substrate protective film 41 is attached to and peeled from the laminated body 38 is exemplified. However, the present invention can also be applied to the manufacture of a MEMS device having a similar substrate or a liquid jet head.
Moreover, in the said embodiment, although the structure in which the notch part 52 was formed in the board | substrate protective film 41 was illustrated, it is not restricted to this, The notch part 52 does not necessarily need to be provided.

  In the above embodiment, the ink jet recording head 2 is described as an example of the liquid ejecting head. However, the present invention can be applied to other liquid ejecting heads. For example, a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an electrode material ejecting head used for forming an electrode such as an organic EL (Electro Luminescence) display, FED (surface emitting display), a biochip (biochemical element) The present invention can also be applied to bioorganic matter ejecting heads and the like used in the production of In a color material ejecting head for a display manufacturing apparatus, a solution of each color material of R (Red), G (Green), and B (Blue) is ejected as a kind of liquid. Further, an electrode material ejecting head for an electrode forming apparatus ejects a liquid electrode material as a kind of liquid, and a bioorganic matter ejecting head for a chip manufacturing apparatus ejects a bioorganic solution as a kind of liquid.

  DESCRIPTION OF SYMBOLS 1 ... Printer, 2 ... Recording head, 3 ... Ink cartridge, 4 ... Carriage, 6 ... Recording medium, 7 ... Carriage moving mechanism, 8 ... Paper feed mechanism, 10 ... channel forming substrate, 11 ... nozzle plate, 12 ... actuator unit, 13 ... sealing plate, 14 ... vibrating plate, 15 ... pressure chamber, 16 ... reservoir, 17 ... Individual supply port, 18 ... Nozzle, 19 ... Piezoelectric element, 20 ... Lead electrode, 21 ... Elastic film, 22 ... Insulating film, 23 ... Communication opening, 25 ... Lower electrode film, 26 ... Piezoelectric film, 27 ... Upper electrode film, 29 ... Storage cavity, 30 ... Liquid chamber cavity, 31 ... Compliance substrate, 32. .. Sealing film, 33 ... Fixing plate, 34 ... Wiring opening, 36 ... First silicon substrate, 37 ... Second silicon substrate, 38 ... Laminate, 39 ... Resist, 40 ... Film sticking device, 41 ... Substrate protective film, 42 ... Unloading row -43 ... Pre-cut section, 44 ... Release paper, 45 ... Release section, 46 ... Pasting section, 47 ... Winding roller, 48 ... Cutting roller, 49 ... Receiving Roller, 51 ... Extension, 52 ... Notch, 53 ... Chamfer, 54 ... Sticking roller, 56 ... Alignment mark, 57 ... Side, 58 ... Alignment Substrate, 59 ... Reference mark, 60 ... Suction holding jig, 61 ... Camera, 62 ... Suction path, 64 ... Pressure roller, 65 ... Peeling tape, 66 ... Heating jig

Claims (6)

A substrate protective film attached to a substrate constituting the MEMS device in the manufacture of the MEMS device,
It has an extension part extended toward the outer edge side of the substrate rather than the end of the adhesion field with the substrate, The substrate protection film characterized by things.   The substrate protective film according to claim 1, further comprising an opening capable of exposing the alignment mark at a position corresponding to the alignment mark related to the positioning of the substrate.   The board | substrate protective film of Claim 2 with which the edge | side which divides the said opening part is connected by the curve.   4. The substrate protective film according to claim 1, wherein a plurality of the extending portions are formed at different positions in the outer peripheral direction of the substrate protective film. 5. A protective film sticking step of sticking the substrate protective film according to any one of claims 1 to 4 to a substrate constituting the MEMS device;
An alignment step of positioning the substrate in a state of holding the substrate by adsorbing the affixed substrate protection film with an adsorption holding jig;
A processing step of processing the positioned substrate;
A peeling step of peeling the substrate protective film from the substrate after processing;
Have
In the peeling step, a peeling tape is welded to the extension part, and the substrate protective film is peeled off from the substrate together with the peeling tape from the extension part as a starting point.   A manufacturing method of a liquid jet head, wherein the manufacturing method of the MEMS device according to claim 5 is performed.

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