JP2017038031A - Light emitting device and manufacturing method thereof - Google Patents

Abstract

A light emitting device capable of more efficiently dissipating heat generated by light emission of a light emitting element is provided. A light emitting device includes a mounting substrate having a mounting area, a mount formed of a porous material having a back surface bonded to the surface of the mounting area, and a back surface bonded to the surface of the mount. A light emitting element 30, a bonding wire 31 connected to element electrodes 32 and 33 formed on the surface of the light emitting element 30, and a sealing resin 60 for sealing the mount 40, the light emitting element 30, and the bonding wire 31. Have. [Selection] Figure 1

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

  2. Description of the Related Art A light emitting device called a COB (Chip On Board) in which a light emitting element such as an LED (light emitting diode) element is mounted on a general-purpose substrate such as a ceramic substrate or a metal substrate is known. In such a light-emitting device, for example, an LED element that emits blue light is sealed with a resin containing a phosphor, and light obtained by exciting the phosphor with light from the LED element is mixed, depending on the application. White light is obtained. In the light emitting device, as the luminance of the light emitting element is improved, heat generated by light emission of the light emitting element increases. However, if the heat generated by light emission of the light emitting element is not dissipated, the ambient temperature of the light emitting element rises and the light emitting element There is a possibility that the emission intensity of the light source will be reduced. In order to prevent a decrease in light emission intensity of the light emitting element, various techniques for releasing heat generated by light emission of the light emitting element are known.

  For example, Patent Document 1 discloses an insulating base formed of ceramics provided with a metal body penetrating in the thickness direction, an upper surface insulating layer formed of ceramics laminated on the surface of the insulating base, and an upper surface layer. A light emitting device having a light emitting element mounted on an insulating layer is described. In the light emitting device described in Patent Document 1, the upper surface insulating layer is formed on the surface of the metal body, the upper dense portion on which the light emitting element is mounted, and the upper dense portion formed around the upper dense portion. Is formed by the upper porous portion having a low density.

  In the light-emitting device described in Patent Document 1, heat generated by light emission from the light-emitting element is conducted and diffused to the metal body through the upper dense portion, thereby improving heat dissipation characteristics. Further, by arranging the upper porous portion around the upper dense portion on which the light emitting element is mounted, light from the light emitting element is irregularly reflected at the void grain boundary in the upper porous portion, so that The reflectance is improved and the light emission efficiency of the light emitting device is improved.

JP 2011-205009 A

  However, in the light-emitting device described in Patent Document 1, the light-emitting element is bonded to the upper surface insulating layer by an adhesive containing a resin having a lower thermal conductivity than the upper surface insulating layer and the metal body, and thus the heat dissipation efficiency is reduced. As a result, the temperature of the light emitting element rises and the light emission efficiency may decrease.

  In view of the above, an object of the present invention is to provide a light emitting device that can more efficiently dissipate heat generated by light emission of a light emitting element.

  In order to achieve the above object, a light emitting device according to the present invention includes a mounting substrate having a mounting region, a pedestal formed of a porous material having a back surface bonded to the surface of the mounting region, and a back surface on the surface of the pedestal. It has a bonded light emitting element, a bonding wire connected to an element electrode formed on the surface of the light emitting element, and a sealing resin that seals the gantry, the light emitting element, and the bonding wire.

  Furthermore, the light-emitting device according to the present invention preferably includes a plurality of light-emitting elements and a plurality of mounts that are arranged so as to correspond to any one of the plurality of light-emitting elements.

  Furthermore, in the light emitting device according to the present invention, it is preferable that a plurality of light emitting elements are bonded to the gantry.

  Furthermore, the light emitting device according to the present invention preferably further includes a reflective layer formed on the surface of the gantry.

  Furthermore, in the light emitting device according to the present invention, the gantry is preferably made of porous ceramics.

  Furthermore, in the light emitting device according to the present invention, it is preferable that the mounting substrate includes a metal plate on which one frame is disposed.

  Further, the manufacturing method for manufacturing the light emitting device according to the present invention includes bonding the back surface of the light emitting element to the surface of the mount made of a porous material, and bonding the back surface of the mount to the surface of the mounting area of the mounting substrate. The method includes connecting a bonding wire to an element electrode formed on the element surface and filling a base, a light emitting element, and a sealing resin for sealing the bonding wire.

  According to the present invention, it is possible to provide a light emitting device capable of more efficiently dissipating heat generated by light emission of the light emitting element.

(A) is a perspective view of the light-emitting device which concerns on 1st Embodiment, (B) is sectional drawing of the light-emitting device shown to (A). (A) is the elements on larger scale of the light-emitting device shown in FIG. 1, (B) is the elements on larger scale of the light-emitting device shown in (A). (A) is a perspective view which shows the 1st manufacturing process of the light-emitting device shown in FIG. 1, (B) is sectional drawing corresponding to (A). (A) is a perspective view which shows the 2nd manufacturing process of the light-emitting device shown in FIG. 1, (B) is sectional drawing corresponding to (A). (A) is a perspective view which shows the 3rd manufacturing process of the light-emitting device shown in FIG. 1, (B) is sectional drawing corresponding to (A). (A) is a perspective view which shows the 4th manufacturing process of the light-emitting device shown in FIG. 1, (B) is sectional drawing corresponding to (A). (A) is a perspective view which shows the 5th manufacturing process of the light-emitting device shown in FIG. 1, (B) is sectional drawing corresponding to (A). (A) is a perspective view which shows the 6th manufacturing process of the light-emitting device shown in FIG. 1, (B) is sectional drawing corresponding to (A). (A) is a perspective view which shows the 7th manufacturing process of the light-emitting device shown in FIG. 1, (B) is sectional drawing corresponding to (A). (A) is a partial cross-sectional view of the light emitting device according to the first comparative example, (B) is a partial cross sectional view of the light emitting device according to the second comparative example, and (C) is a portion of the light emitting device shown in FIG. It is sectional drawing. (A)-(C) is a figure which shows the mounting state of the LED element in the light-emitting device shown to FIG. 10 (A), (D)-(F) shows the mounting state of the LED element in the light-emitting device shown in FIG. FIG. (A) is a perspective view of the light-emitting device which concerns on 2nd Embodiment, (B) is sectional drawing of the light-emitting device shown to (A). (A) is a perspective view of the light-emitting device which concerns on 3rd Embodiment, (B) is sectional drawing of the light-emitting device shown to (A).

  Hereinafter, a light emitting device and a manufacturing method thereof will be described with reference to the drawings. However, it should be understood that the present invention is not limited to the drawings or the embodiments described below.

(Outline of Light Emitting Device According to Embodiment)
In the light emitting device according to the embodiment, the light emitting element is bonded to the mounting region of the mounting substrate via a gantry formed of a porous material. When the pedestal formed of a porous material, the light emitting element, and the mounting substrate are bonded by an adhesive, excess adhesive penetrates into the pedestal by capillarity, so that the gantry, the light emitting element, and the mounting substrate The thickness of the adhesive at the interface becomes a minimum thickness. The heat dissipation efficiency of the light-emitting device according to the embodiment is improved as compared with the case where the light-emitting element is bonded to the mounting region with the adhesive because the thickness of the adhesive with low thermal conductivity is minimized. To do.

(Structure and function of light emitting device according to the first embodiment)
FIG. 1A is a perspective view of the light emitting device according to the first embodiment as a finished product, and FIG. 1B is a cross-sectional view taken along line IA-IB in FIG.

  The light emitting device 1 includes an LED element as a light emitting element, and is used as various lighting devices such as an illumination LED and an LED bulb. The light emitting device 1 includes a mounting substrate 10, a circuit substrate 20, a plurality of LED elements 30, a plurality of mounts 40, a resin frame 50, a sealing resin 60, and a heat conducting member 61.

  The mounting substrate 10 has a square shape as an example, and is a metal substrate having a circular mounting region 11 on the surface of which the LED element 30 is mounted. Since the mounting substrate 10 also functions as a heat dissipation substrate that dissipates heat generated by the LED elements 30, it is made of, for example, aluminum having excellent heat resistance and heat dissipation. The material of the mounting substrate 10 may be another metal such as copper or ceramics as long as it is excellent in heat resistance and heat dissipation.

  As an example, the circuit board 20 has a square shape having the same size as the mounting board 10 and has a circular opening 21 at the center thereof. The back surface of the circuit board 20 is fixed on the mounting substrate 10 by an adhesive sheet, for example. A wiring pattern 23 of the LED element 30 is formed on the surface of the circuit board 20 so as to surround the opening 21. In addition, a pair of connection electrodes 24 for connecting the light emitting device 1 to an external power source are formed at two corners located diagonally on the surface of the circuit board 20. One of the connection electrodes 24 is an anode, and the other of the connection electrodes 24 is a cathode. The light emitting device 1 emits light when the pair of connection electrodes 24 are connected to an external power source and a voltage is applied.

  2A is a partially enlarged sectional view of a portion indicated by an arrow A in FIG. 1A, and FIG. 2B is a partially enlarged sectional view of a portion indicated by an arrow B in FIG. is there.

  Each of the plurality of LED elements 30 is an example of a light emitting element, and is, for example, a blue LED that emits blue light having an emission wavelength band of about 450 to 460 nm. Each of the plurality of LED elements 30 is mounted on the mounting region 11 of the mounting substrate 10 exposed from the opening 21 of the circuit substrate 20 via the mount 40. Each of the plurality of LED elements 30 is arranged in a grid pattern in the mounting region 11 of the mounting substrate 10. Here, an example in which 21 LED elements 30 are mounted is shown. The LED element 30 has a pair of element electrodes 32 and 33 on the surface, and the element electrodes 32 of the adjacent LED elements 30 are electrically connected by bonding wires 31. The other end of the bonding wire 31 whose one end is connected to the element electrode 33 of the LED element 30 located on the outer peripheral side of the opening 21 is connected to the wiring pattern 23 of the circuit board 20. By connecting the wiring pattern 23 and the device electrodes 32 and 33 of the plurality of LED elements 30 in series, each of the plurality of LED elements 30 is supplied with current from the wiring pattern 23 via the bonding wires 31.

  Each of the plurality of mounts 40 is a cubic member formed of a porous material having a relatively high thermal conductivity, and is formed of a porous ceramic containing alumina, for example. In another example, the gantry 40 is formed of a porous metal formed by fixing a metal powder such as aluminum by heating or the like. In one example, the reflectivity of the gantry 40 when reflecting light having a band of 450 to 460 nm is 97%. Each of the plurality of mounts 40 is disposed so as to correspond to any one of the plurality of LED elements 30. The surface of the gantry 40 is bonded to the back surface of the LED element 30, and the back surface of the gantry 40 is bonded to the surface of the mounting substrate 10. The gantry 40 is bonded to the surface of the mounting substrate 10 by being pressed by an adhesive disposed on the surface of the mounting substrate 10. When the gantry 40 is pressed against the surface of the mounting substrate 10, a part of the adhesive disposed on the surface of the mounting substrate 10 is positioned on the surface of the mounting substrate 10 as indicated by an arrow C in FIG. This contributes to adhesion to the back surface of the gantry 40. However, when the gantry 40 is pressed against the surface of the mounting substrate 10, the excess adhesive penetrates into the gantry 40 made of a porous material by capillary action. Similarly, when the front surface of the gantry 40 and the back surface of the LED element 30 are bonded, as shown by an arrow D in FIG. 2B, a part of the adhesive contributes to the bonding, and the extra adhesive is porous. It penetrates into the gantry 40 made of a quality material by capillary action. As the adhesive that bonds the back surface of the gantry 40 and the surface of the mounting substrate 10, an adhesive having desired characteristics is adopted. For example, the adhesive that bonds the back surface of the gantry 40 and the surface of the mounting substrate 10 is a silicone resin.

  The porous material forming the gantry 40 is an aggregate of a large number of ceramic particles or metal particles, and is a porous body in which a large number of minute pores are formed between the numerous ceramic particles or metal particles. The pores of the porous material are classified into two pores, that is, open pores that are pores communicating with the outside air and closed pores that are pores confined inside. The porous material forming the gantry 40 is determined by whether or not the open pores, which are holes communicating with the outside air, can permeate the extra adhesive used for bonding the gantry 40. That is, the volume of the open pores of the porous material forming the gantry 40 is larger than the total volume of at least the volume of the adhesive used for bonding the LED elements and the volume of the adhesive used for bonding the gantry 40. It only has to be.

  The resin frame 50 is a circular frame made of, for example, white resin in accordance with the size of the opening of the circuit board 20, and is formed so as to border the opening 21 on the surface of the circuit board 20. It is fixed at a position overlapping the wiring pattern 23. The resin frame 50 is a dam material for preventing the sealing resin 60 from flowing out, and the light emitted from the LED element 30 to the side is above the light emitting device 1 which is the surface direction of the LED element 30. It also functions as a reflector that reflects toward the surface.

  The sealing resin 60 is injected into the opening 21 to cover and protect and seal the plurality of mounts 40, the plurality of LED elements 30, and the bonding wires 31 integrally. For example, as the sealing resin 60, it is preferable to use a colorless and transparent resin such as an epoxy resin or a silicone resin, and particularly a heat resistant resin. In the example shown in FIG. 1A, the sealing resin 60 is formed in a disk shape on the mounting substrate 10 by the resin frame 50.

The sealing resin 60 is mixed with phosphors such as a green phosphor and a red phosphor. The light emitting device 1 emits white light obtained by mixing blue light from the LED element 30 which is a blue LED and green light and red light obtained by exciting the green phosphor and the red phosphor thereby. To do. The green phosphor is a particulate phosphor material such as (BaSr) ₂ SiO ₄ : Eu ²⁺ that absorbs blue light emitted from the LED element 30 and converts the wavelength into green light. The red phosphor is a particulate phosphor material such as CaAlSiN ₃ : Eu ²⁺ that absorbs blue light emitted from the LED element 30 and converts the wavelength into red light. The combination of the phosphors mixed in the sealing resin 60 is not limited to the green phosphor and the red phosphor. For example, a yellow phosphor such as YAG (yttrium aluminum garnet) may be further mixed, or the yellow phosphor A combination different from the above, such as red phosphor and the like, may be used. Or depending on the use of the light-emitting device 1, the sealing resin 60 may contain only one type of phosphor.

(Manufacturing process of the light emitting device according to the first embodiment)
3 to 9 are diagrams showing manufacturing steps of the light emitting device 1. 3 is a perspective view of the first step, FIG. 4 (A) is a perspective view of the second step following the first step, and FIG. 5 (A) is a perspective view of the third step following the second step. FIG. 6A is a perspective view of the fourth step following the third step. FIG. 7A is a perspective view of the fifth step following the fourth step, FIG. 8A is a perspective view of the sixth step following the fifth step, and FIG. 9A is the sixth step. FIG. 10A is a perspective view of a subsequent seventh step, and FIG. 10A is a perspective view of an eighth step following the seventh step. 4B is a cross section taken along line IIA-IIB in FIG. 4A, and FIG. 5B is a cross section taken along line IIIA-IIIB in FIG. ) Is a cross section taken along line IVA-IVB in FIG. 7B is a cross section taken along line VA-VB in FIG. 7A, and FIG. 8B is a cross section taken along line VIA-VIB in FIG. 8A. ) Is a cross section taken along line VIIA-VIIB in FIG. FIG. 4C is a diagram illustrating a state where the LED element 30 and the mount 40 are bonded.

  When manufacturing the light emitting device 1, first, as shown in FIG. 3, the wafer 300 on which the plurality of LED elements 30 are formed and the porous material 400 are bonded together with an adhesive (not shown). When the wafer 300 and the porous material 400 are bonded, a part of the adhesive contributes to the bonding, and the excess adhesive penetrates into the porous material 400. Next, as shown in FIGS. 4 (A) and 4 (B), the bonded wafer 300 and porous material 400 are diced for each formation region of the LED element 30, and as shown in FIG. 4 (C). Then, the LED element 30 and the gantry 40 are cut out in a bonded state.

  Next, as shown in FIGS. 5A and 5B, the mounting substrate 10 and the circuit substrate 20 having the opening 21 are overlapped and bonded together. Next, as shown in FIGS. 6A and 6B, an adhesive 70 is disposed in a region where the LED element 30 is mounted in the mounting region 11 of the mounting substrate 10 exposed from the opening 21 of the circuit substrate 20. Is done. Next, as shown in FIGS. 7A and 7B, each is mounted on the gantry 40 with the adhesive disposed in the mounting region 11 of the mounting substrate 10 exposed from the opening 21 of the circuit substrate 20. The plurality of LED elements 30 are pressed and bonded. When the mounting substrate 10 and the plurality of LED elements 30 respectively mounted on the mount 40 are bonded by the adhesive 70, a part of the adhesive 70 contributes to the bonding, and the excess adhesive penetrates into the mount 40. To do.

  Next, as shown in FIGS. 8A and 8B, the adjacent LED elements 30 are electrically connected to each other by the bonding wire 31, and the bonding wire that has come out of the LED element 30 on the outer peripheral side of the opening 21. 31 is connected to the wiring pattern 23 of the circuit board 20. In one example, the bonding wire 31 is connected to the LED element 30 by ultrasonic welding. Next, as shown in FIGS. 9A and 9B, the resin frame 50 is fixed on the wiring pattern 23 of the circuit board 20. Then, the opening portion 21 is filled with a silicone resin containing a phosphor or the like to form the sealing resin 60. Through the above steps, the light-emitting device 1 illustrated in FIGS. 1A and 1B is completed.

(Operational effect of the light emitting device according to the first embodiment)
In the light emitting device 1, each of the LED elements 30 as a plurality of light emitting elements is mounted on the mounting region 11 of the mounting substrate 10 via the mount 40 formed of a porous material having a high thermal conductivity. The adhesive 70 disposed when mounting the LED element 30 and the gantry 40 on the mounting area 11 is located at the interface between the back surface of the gantry 40 and the mounting area 11 and contributes to adhesion between the gantry 40 and the mounting area 11. Further, the excess adhesive penetrates into the gantry 40 when the gantry 40 is pressed against the surface of the mounting substrate 10. The adhesive having a relatively low thermal conductivity is positioned at the interface between the back surface of the gantry 40 and the surface of the mounting region 11 with a minimum thickness because the extra adhesive penetrates into the gantry 40. Become. Similarly, the adhesive located at the interface between the back surface of the LED element 30 and the surface of the mount 40 has a minimum thickness. Since the thickness of the adhesive located at the interface between the mounting region 11 and the LED element 30 and the gantry 40 is minimized, the light emitting device 1 minimizes the decrease in thermal conductivity due to the adhesive. The heat dissipation efficiency from the LED element 30 can be improved. Since the LED element 30 and the gantry 40 are sealed with the sealing resin 60, the bonding strength between the mounting region 11 and the LED element 30 and the gantry 40 is the light emitting device sealed with the sealing resin 60. The reliability of 1 is not affected. The bonding strength between the mounting region 11 and the LED element 30 and the gantry 40 may be any strength that allows the bonding wire 31 to be connected to the LED element 30 by ultrasonic welding.

  10A is a partial cross-sectional view of the light emitting device according to the first comparative example, FIG. 10B is a partial cross sectional view of the light emitting device according to the second comparative example, and FIG. 10C is the light emitting device. FIG.

  In the light emitting device 101 according to the first comparative example, the LED element 30 is mounted on the mounting substrate 10 via the adhesive 80. The adhesive 80 is made of a silicone resin and has a thermal conductivity of about 0.2 (W / m * K). In the light emitting device 102 according to the second comparative example, the LED element 30 is mounted on the mounting substrate 10 via an adhesive 81 containing metal particles 82. The adhesive 81 has a higher thermal conductivity than the adhesive by containing the metal particles 82, and in one example, the thermal conductivity is about 1 (W / m * K). In the light emitting device 1 according to the first embodiment, the LED element 30 is mounted on the mounting substrate 10 via the mount 40 on which the adhesive with the minimum thickness is located on the front surface and the back surface, and the mounting substrate 10 and the LED element 30 are mounted. The thermal conductivity between and can be 10 (W / m * K) or more. The thermal conductivity between the mounting substrate 10 and the LED element 30 of the light emitting device 1 according to the first embodiment is a first comparative example in which the mounting substrate 10 and the LED element 30 are bonded with an adhesive 80 containing a silicone resin. The light emitting device 101 according to the present invention can be higher by two digits or more. The thermal conductivity between the mounting substrate 10 and the LED element 30 of the light emitting device 1 according to the first embodiment is such that the mounting substrate 10 and the LED element 30 are bonded with an adhesive 81 containing metal particles 82. It can be made one digit higher than that of the light emitting device 102 according to the second comparative example.

  Further, in the light emitting device 1, the thickness of the adhesive located at the interface between the mounting region 11 and the LED element 30 and the gantry 40 is minimized by causing the extra adhesive to permeate the gantry 40. In the light emitting device 1, the distance between the mounting region 11 and the LED element 30 can be reduced by reducing the thickness of the adhesive located at the interface between the mounting region 11 and the LED element 30 and the gantry 40. It can be approximately the same as the height. In the light emitting device 1, the distance between the mounting region 11 and the LED element 30 can be made uniform by making the distance between the mounting region 11 and the LED element 30 substantially the same as the height of the mount 40.

  11 (A) to 11 (C) are views showing the mounted state of the LED element 30 in the light emitting device 101 according to the first comparative example, and FIGS. 11 (D) to 11 (F) are related to the first embodiment. FIG. 3 is a diagram showing a mounting state of LED elements 30 in the light emitting device 1. 11 (A) and 11 (D) are the first state, FIGS. 11 (B) and 11 (E) are the second state following the first state, and FIGS. 11 (C) and 11 (F) are This is a third state following the second state.

  In the light emitting device 101 according to the first comparative example, as shown in FIG. 11A, the LED element 30 is pressed by the adhesive 80 disposed on the surface of the mounting substrate 10, and then in FIG. As shown, it is bonded to the mounting substrate 10 via an adhesive 80. The LED element 30 is gradually lowered by its own weight until the adhesive 80 is cured, and is mounted on the mounting substrate 10 via the adhesive 80 as shown in FIG. Since the distance between the mounting substrate 10 and the LED element 30 at the time of mounting differs depending on mounting conditions such as the pressure at the time of pressing and the ambient temperature, the distance between the mounting substrate 10 and the LED element 30 at the time of mounting is different. It is not easy to make the distance uniform.

  On the other hand, in the light emitting device 1 according to the first embodiment, as shown in FIGS. 3 and 11 (D), after the LED element 30 and the mount 40 are bonded via an adhesive 71, FIGS. ), The adhesive 70 disposed on the surface of the mounting substrate 10 is pressed. As a result, the LED element 30 is bonded to the mounting substrate 10 via the mount 40 and the adhesives 70 and 71 as shown in FIG. The adhesives 70 and 71 gradually penetrate into the gantry 40 when the temperature rises and the viscosity decreases until the adhesives 70 and 71 are cured. As shown in FIG. The distance between the substrate 10 and the LED element 30 is substantially the same as the height of the gantry 40.

(Light Emitting Device According to Second Embodiment)
FIG. 12A is a perspective view of the light emitting device according to the second embodiment as a finished product, and FIG. 1B is a cross-sectional view taken along the line VIIIA-VIIIB of FIG.

  The light emitting device 2 is different from the light emitting device 1 in that a gantry 41 is arranged instead of the gantry 40. Since the configuration of the light-emitting device 2 other than the gantry 41 has the same configuration and function as the configuration of the light-emitting device 1 with the same reference numerals, detailed description thereof is omitted here.

  The gantry 41 is a member formed of a porous material having a circular shape having substantially the same diameter as the opening 21. The gantry 41 is formed of a porous ceramic or a porous metal having a relatively high thermal conductivity like the gantry 41. A plurality of LED elements 30 are mounted on the gantry 41. In the example shown in FIGS. 12A and 12B, all 21 LED elements 30 are mounted on the gantry 41.

  In the manufacturing process of the light emitting device 2, there is no process corresponding to the process shown in FIG. 3, and the gantry 41 is bonded to the mounting region 11 of the mounting substrate 10 between the process shown in FIG. 5 and the process shown in FIG. Having the process is different from the manufacturing process of the light emitting device 1. The manufacturing process of the light emitting device 2 is different from the manufacturing process of the light emitting device 1 in that only the wafer 300 is diced in the process shown in FIG. Further, the manufacturing process of the light emitting device 2 is different from the manufacturing process of the light emitting device 1 in that the adhesive 70 is arranged not on the mounting area 11 but on the mount 41 bonded to the mounting area 11 in the process shown in FIG. To do. Further, the manufacturing process of the light emitting device 2 is different from the manufacturing process of the light emitting device 1 in that only the LED element is pressed and mounted in the process shown in FIG.

  In the light emitting device 2, the volume of the gantry 41 is larger than the total volume of the plurality of gantry 40 used in the light emitting device 1. Since the volume of the gantry 41 is large, an adhesive that bonds the mounting substrate and the gantry 41 and an adhesive that bonds the LED element 30 and the gantry 41 do not completely penetrate into the gantry 41 and do not penetrate into the surface or the back surface of the gantry 41. The risk of forming a thick adhesive layer is low.

(Light Emitting Device According to Third Embodiment)
FIG. 13A is a perspective view of a light emitting device according to a second embodiment as a finished product, and FIG. 1B is a cross-sectional view taken along the line IXA-IXB in FIG.

  The light emitting device 3 is different from the light emitting device 2 in that a reflective plating layer 42 is formed on the surface of the gantry 41. Since the configuration of the light emitting device 3 other than the reflective plating layer 42 has the same configuration and function as the configuration of the light emitting device 2 denoted by the same reference numerals, detailed description thereof is omitted here.

  The reflective plating layer 42 is formed by silver plating. The reflective plating layer 42 is formed in a region other than the region where the LED element 30 is mounted on the surface of the gantry 41.

  The manufacturing process of the light emitting device 3 is different from the manufacturing process of the light emitting device 2 in that it includes a step of forming the reflective plating layer 42 on the surface of the gantry 41. The reflective plating layer 42 is formed by silver-plating the surface of the gantry 41 in a state where a mask (not shown) that shields a region where the LED element 30 is mounted is disposed on the surface of the gantry 41.

  In the light emitting device 3, the reflectance of light emitted from the side surface or the back surface of the LED element 30 is made higher than that of the light emitting device 2 by metal plating the surface of the gantry 41 made of a porous material having a relatively low reflectance. Can be bigger.

1, 2, 3 Light-emitting device 10 Mounting substrate 11 Mounting region 20 Circuit substrate 30 LED element 31 Bonding wire 40, 41 Mounting frame 42 Reflective plating layer 50 Resin frame 60 Sealing resin

Claims (7)

A mounting board having a mounting area;
A pedestal formed of a porous material and having a back surface adhered to the surface of the mounting region;
A light emitting device having a back surface adhered to the surface of the mount;
A bonding wire connected to an element electrode formed on the surface of the light emitting element;
A sealing resin for sealing the mount, the light emitting element, and the bonding wire;
A light emitting device comprising: A plurality of the gantry and the light emitting element are respectively disposed,
2. The light-emitting device according to claim 1, wherein each of the plurality of mounts is disposed to correspond to any one of the plurality of light-emitting elements.   The light-emitting device according to claim 1, wherein a plurality of the light-emitting elements are bonded to the mount.   The light-emitting device according to claim 3, further comprising a reflective layer formed on a surface of the mount.   The light emitting device according to any one of claims 1 to 4, wherein the porous material is a porous ceramic.   The light emitting device according to any one of claims 1 to 5, wherein the mounting substrate includes a metal plate on which one of the mounts is disposed. Adhering the back surface of the light emitting element to the surface of the gantry made of porous material,
Glue the back of the mount to the surface of the mounting area of the mounting board,
A bonding wire is connected to the device electrode formed on the surface of the light emitting device,
Filling with a sealing resin for sealing the mount, the light emitting element and the bonding wire,
The manufacturing method which manufactures the light-emitting device characterized by the above-mentioned.

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