JP2017024398A - Molding die and resin molding device - Google Patents

Abstract

Disclosed is a mold that prevents a workpiece held on a mold clamping surface from being displaced or dropped out, and can ensure a large resin package size. A workpiece holding portion 6d is arranged to be opposed to an upper mold clamping surface 6a of a mold 6 at a plurality of locations along the outer shape of the workpiece W and pressed against and held against the outer circumferential surface of the workpiece W. It has. [Selection] Figure 5

Description

The present invention relates to a mold that can hold a work without dropping onto a mold clamping surface and can expand a resin mold area, and a resin mold apparatus including the mold.
In the following description, the single wafer film includes a film formed by cutting a long or large size film into a predetermined size in addition to an individual film previously formed into a predetermined size.

  As a resin molding apparatus used in the current semiconductor manufacturing factory, for example, in molding a WLP (Wafer Level Package) or PLP (Panel Level Package) as a workpiece, a resin wafer is molded by using, for example, a φ8 inch or φ12 inch size semiconductor wafer. , □ 300 mm to □ 600 mm size (each side has a size of 300 mm to 600 mm), and resin molding is performed using a rectangular panel (substrate, carrier, etc.).

  At this time, in the case of a mold die in which a cavity concave portion is provided in the upper die, generally, a high viscosity resin is collectively supplied to the center position on the work for molding. In this case, in order to fill the resin supplied onto the workpiece into the cavity, it is necessary to flow the mold resin to a large extent, which may cause an unfilled area of the mold resin. On the other hand, a cavity recess is provided in the lower mold, the lower mold clamping surface including the lower mold cavity recess is covered with a film, and a mold resin is supplied with a uniform thickness. The resin mold is performed by dipping.

  When transporting the workpiece to the upper mold, the upper clamp surface and the work loader are aligned, and the workpiece conveyed by the work loader is sucked and held, or the workpiece is moved by the chuck claw provided on the lower surface of the upper mold insert. The outer peripheral edge is held (Patent Document 1; see FIG. 23).

Japanese Patent Laying-Open No. 2015-13371

In order to deaerate the mold space in which the mold (closed with a workpiece such as a semiconductor wafer or a rectangular substrate) is held by suction, the mold is closed under reduced pressure. . However, when the mold space is depressurized, when the work is attracted and held on the upper mold clamping surface, the differential pressure becomes small and the work may fall off.
Also, when holding the workpiece on the upper mold clamping surface with chuck claws, it is necessary to provide space for the chuck claws to escape in the opposed lower mold, which reduces the size of the lower mold cavity recess, that is, the size of the resin package. There was a problem that efficiency and yield decreased.

The object of the present invention is to solve the above-mentioned problems of the prior art, and provide a mold that can prevent the displacement and dropping of the work held on the mold clamping surface and can ensure a large resin package size. There is.
In addition, a resin mold apparatus is provided that is equipped with the above mold dies to increase the size of the resin package as much as possible to improve production efficiency and yield, and to improve the molding quality of large-sized molded products. There is to do.

In order to achieve the above object, the present invention comprises the following arrangement.
A mold that holds a workpiece on a clamp surface of one of the molds and clamps the workpiece on the other mold to be resin-molded. It is provided with a work holding part that is opposed to and arranged at a plurality of locations along the outer shape and that presses and holds the work against the outer peripheral surface of the work.
If the mold is used, work holding portions that are pressed against and held by one mold clamping surface against the outer peripheral surface of the work are arranged opposite to each other at a plurality of locations along the outer shape of the work. It can prevent dropping and displacement, centering the work and holding it on the mold clamping surface.

It is preferable that the workpiece holding part includes an elastic member that is pressed against the outer peripheral surface of the workpiece and elastically deforms.
As a result, when the work holding portion is pressed at a position facing the work outer peripheral surface, the elastic member is elastically deformed to sandwich and hold the work, so that it is possible to reliably prevent the work from falling or misaligned.

When the work is brought into close contact with the one mold clamping surface, the work outer peripheral surface may be pressed against each other by the work holding portions arranged to face each other.
Thereby, a workpiece | work can be positioned and hold | maintained with the simple structure of a workpiece | work holding | maintenance part.

A work suction mechanism for sucking and holding the work may be provided on the one mold clamping surface.
Thereby, not only the workpiece | work holding by the workpiece | work against the workpiece | work outer peripheral surface by a workpiece | work holding | maintenance part but the workpiece | work position shift | offset | difference and drop-off can be reliably prevented by attracting and holding the workpiece on one mold clamping surface.

  When the workpiece holding portion is provided on the upper mold clamping surface, it is possible to prevent the workpiece held on the upper mold clamping surface from dropping and to improve the reliability of the apparatus.

  If a pressure reducing mechanism for forming a pressure reducing space between the pair of molds is provided, the work outer peripheral surface is held by the work holding portion even if the pressure reducing space is formed in the closed mold mold. The workpiece will not fall off from the mold clamping surface.

  In the resin mold apparatus including any of the molds described above, the size of the resin package portion can be increased as much as possible, the productivity and the yield are improved, and the molding quality of a large-sized molded product is improved. Improvements can be made.

If the above-described mold die is used, it is possible to prevent the position of the workpiece held on the die clamping surface from being displaced or dropped off, and to ensure a large size of the resin package portion.
Further, in the resin molding apparatus provided with the above mold, the size of the resin package portion can be increased as much as possible to improve productivity and yield, and the molding quality of a large size molded product can be improved. .

It is a plane layout figure which shows schematic structure of the resin mold apparatus. It is explanatory drawing which shows the conveyance preparation of a single wafer film, and a mold resin supply process. It is a top view of a film conveyance apparatus. It is sectional drawing which shows the structure of a mold die. It is explanatory drawing which shows the structural example of the upper type | mold workpiece holding part of FIG. It is explanatory drawing which shows the structure of the workpiece holding part with respect to the upper mold | type which concerns on another example. It is explanatory drawing seen from the top which shows the layout structural example of a workpiece | work holding | maintenance part. It is explanatory drawing which shows the workpiece | work supply process with respect to an upper mold | type. It is explanatory drawing of a resin mold process. It is sectional explanatory drawing which shows the structural example of the workpiece holding part which concerns on another example. It is a principal part enlarged view in the modification of the upper mold | type shown in FIG. It is sectional explanatory drawing which shows the structural example of the workpiece holding part which concerns on another example.

  Hereinafter, preferred embodiments of a film transport device and a resin mold device including the same according to the present invention will be described in detail with reference to the accompanying drawings. In the following description, for example, a rectangular workpiece having sides of about 600 mm is used as the workpiece, and a resin molding apparatus that performs resin molding using a single-sided film having a larger size as the film will be described. As an example, the resin mold apparatus will be described assuming that the lower mold is a movable mold and the upper mold is a fixed mold. The resin mold apparatus includes a mold opening / closing mechanism, but the illustration is omitted, and the configuration of the mold will be mainly described.

  First, a schematic configuration of the resin molding apparatus will be described with reference to FIG. In this resin molding apparatus, a control unit (not shown) controls each unit described later to perform various operations. The molding apparatus in the present embodiment is configured by connecting a workpiece processing unit Uw, two press units Up, and a dispensing unit Ud, and automatically performs resin molding on the workpiece W in the apparatus.

  The workpiece processing unit Uw includes, for example, a workpiece supply unit 1, a molded product storage unit 2, a curing furnace 3, and a robot transfer device 4. In the workpiece supply unit 1, for example, a rectangular panel (a substrate, a carrier, etc.) having a size of about 600 mm on each side is accommodated as the workpiece W. The molded product storage unit 2 stores a molded product M resin-molded in a press unit 5 described later. The curing furnace 3 heats and cures the resin package part by storing the molded product M resin-molded by the press part 5 to be described later in a multi-stage shelf provided in the furnace and after-curing it. The robot transport device 4 delivers and transports the workpiece W and the molded product M between the parts arranged so as to surround the robot transport device 4. For example, the robot conveyance device 4 takes out and supplies the workpiece W from the workpiece supply unit 1, conveys the molded product M to the cure furnace 3, and sequentially conveys and stores the molded product M from the cure furnace 3 to the molded product storage unit 2. For example, a vertical articulated type, a horizontal articulated type, or a multi-joint type robot that combines these is used as the robot conveyance device 4, and the workpiece W and the molded product M are held and conveyed by the robot hand 4 a by suction or gripping. To do. In the workpiece processing unit Uw, a cooling unit for cooling the molded product M, an inspection unit for performing an appearance inspection of the molded product, a data reading unit for reading molding conditions associated with individual workpieces W, and a workpiece W Alternatively, the reversing unit 30 that reverses the front and back of the molded product M may be disposed around the robot transport device 4. For example, when the surface (molding surface) to be resin-molded in the workpiece W is supplied upward in the workpiece supply unit 1, the reversing unit 30 directs the molding surface to the lower surface. Further, the reversing unit 30 is reversed so that the molding surface faces upward before the molded product M in which the resin mold molding is completed is stored in the molded product storage unit 2.

  The press unit 5 in the press unit Up includes a compression mold 6 (upper mold 6A and lower mold 6B) that opens and closes to a known mold opening / closing mechanism that raises and lowers the platen relative to the posts 5a provided at the four corners. Yes. In this embodiment, the press units Up are provided at two places, but may be provided at one place or three or more places.

  The film hand 13 (film transport device) is configured so that the press unit 5 is in a state in which a mold resin (for example, a granule resin or a powder resin) is supplied from the dispenser 9 to the single wafer film F supplied from the film supply unit 8 in the dispensing unit Ud. Is transferred into the mold 6. The film supply unit 8 is provided with a film roll 8a in which a long film is wound in a roll shape. In a state where the film end is drawn out from the film roll 8a, it is cut (cut) into a rectangular shape of an arbitrary size and prepared as a single wafer film F on the stage 17. The dispenser 9 is a mold resin R (granular resin) necessary for a single resin mold on the sheet film F in a state in which the film film 13 to be described later is supported by applying a necessary tension (tension). Supply. In addition, instead of the granule resin, a powder resin, a liquid resin, a sheet resin, or a combination thereof may be used.

  The sheet film F has heat resistance and is easily peeled off from the mold surface, and has flexibility and extensibility, for example, PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth. A monolayer film or a multi-layer film mainly composed of polypropylene film, polyvinylidine chloride, or the like is preferably used.

  The panel loader 10 is a so-called work loader, receives the workpiece W from the robot hand 4a of the robot transport device 4, and carries it into the mold 6 (upper die 6A) of the press unit 5. Further, the panel loader 10 receives the molded product M from the mold 6 a and delivers it to the robot hand 4 a of the robot transport device 4. When the panel loader 10 takes out the molded product M from the mold 6, the used single-wafer film F is also sucked and held, and the taken-out single-wafer film F is collected by the film collecting unit 12.

  The film loader 11 receives a sheet film F held with a required tension applied to the film hand 13 and a mold resin R (granular resin) supplied onto the film F, and receives a mold 6 (lower mold 6B). Transport to. The panel loader 10 and the film loader 11 are provided so as to reciprocate along a plurality of guide rails 14 laid along the longitudinal direction of the apparatus. In addition, a loader hand (not shown) is moved to each part (for example, the press part 5) so as to be orthogonal to the position on the guide rail 14.

Here, the structure of the film hand 13 is demonstrated with reference to FIG.2 and FIG.3.
As shown in FIG. 2B, the film hand 13 includes a frame (for example, a rectangular frame 13a) having a predetermined shape corresponding to a lower mold clamping surface surrounding a lower mold cavity recess 6C described later. Further, a fulcrum frame body 13b that serves as a fulcrum portion in the film hand 13 and applies tension to the sheet film F is provided in a rectangular shape along the rectangular frame body 13a (see FIG. 3). As a fulcrum part, you may use the outer corner | angular part of the rectangular frame 13a instead of providing the fulcrum frame 13b.

  A plurality of film chucks 13c (film gripping portions) are provided outside the film hand 13 for gripping the outer peripheral edge of the single-sheet film F over the entire circumference. Specifically, as shown in FIG. 2B, a pair of film chucks 13c (film gripping portions) are provided on opposite sides in order to grip and convey the rectangular sheet F. As the pair of film chucks 13c, an open / close type chuck is used, and the outer peripheral edge portion of the rectangular sheet F is sandwiched and held on each side. Both ends in the longitudinal direction of the pair of film chucks 13c are respectively supported by a pair of rotating levers 13d (rotating members). The pair of rotation levers 13d is provided to be rotatable around a rotation shaft 13e formed inside the film chuck 13c in the rectangular frame 13a. For this reason, the pair of film chucks 13c is provided on the opposite side of the rotary shaft 13e in the rotary lever 13d. The rotation lever 13d is provided with an offset mechanism that rotates only in the direction of offset with respect to the fulcrum frame 13b.

  Specifically, as shown in FIG. 3, the rotation shaft 13e of the film chuck 13c is provided with a ratchet mechanism 13f in which the ratchet teeth engage with the ratchet pawl. The ratchet mechanism 13f allows the film chuck 13c to rotate only in a direction away from the fulcrum frame 13b (a direction indicated by an arrow in FIG. 2C) by a predetermined angle around the rotation shaft 13e. Accordingly, the film chuck 13c can be transported in a state where the tension applied to the sheet film F is maintained by holding the film chuck 13c at a predetermined rotational position rotated in one direction. In addition, it can replace with the ratchet mechanism 13f, and can also be set as the structure which adds arbitrary tension | tensile_strength to the sheet | seat film F with a drive mechanism like a servomotor or a torque motor, and maintains the added tension | tensile_strength. In this case, the film hand 13 is likely to be larger than the configuration in which the ratchet mechanism 13f is provided, but it is preferable in that the tension applied to the sheet film F can be adjusted at any time.

  As shown in FIG. 2 (C), a lift drive mechanism (cylinder drive, solenoid drive, motor drive, etc.) (not shown) is used while holding the outer peripheral edge (four sides) of the sheet F by a pair of film chucks 13c. The rotary lever 13d is pushed up by the push-up pin 15 that moves up and down. At this time, the rotating lever 13d rotates around the rotating shaft 13e to offset the film chuck 13c in a direction away from the fulcrum frame 13b (in the direction of the arrow). Thereby, the edge part of the sheet-fed film F which covers the frame body opening part of the film hand 13 increases the quantity by which it separates via the fulcrum frame body 13b, and is hold | maintained integrally in the state which applied the required tension | tensile_strength. When the rotating lever 13d is returned to the original position, when the rotating lever 13d is pushed up to a predetermined angle by the push-up pin 15 again, the meshing of the ratchet mechanism 13f (see FIG. 3) is released and the rotating lever 13d is also moved. And return to the position.

  As shown in FIG. 2C, the film chuck 13c is rotated about the rotation shaft 13e to separate the film chuck 13c from the fulcrum frame 13b, so that the ends of the single-wafer film F are supported by the fulcrum frame 13b. The amount of separation through the wire can be increased to increase the tension. Particularly, since the tension of the sheet film F can be adjusted for each side of the film by each rotation around the rotation axis 13e of the film chuck 13c arranged on the four sides, an appropriate tension is applied to the sheet film F. The film hand 13 that can be used can be made small and simple.

  A mold resin R (granular resin) necessary for one resin molding is dispensed from the dispenser 9 (see FIG. 1) through the trough 16 (see FIG. 2 (D)) on the sheet film F to which the required tension is applied. It is supplied and supplied uniformly on the single-wafer film F (see FIG. 2E). In addition, an inclined portion 13g having a larger opening diameter is formed in the upper opening of the rectangular frame 13a as the opening end portion has a rectangular shape in plan view. By supplying the mold resin R to the inner side of the inclined portion 13g, the mold resin R can be supplied onto the sheet film F in an arbitrary shape. In this case, the inclined portion 13g prevents the mold resin R supplied on the sheet film F from running on the rectangular frame 13a. In addition, mold resin R can also be supplied in a circular area | region on the sheet | seat film F by making the inner side of the rectangular frame 13a including the inclination part 13g circular. According to this, it is possible to use the same sheet-fed film F transport structure regardless of the shape of the cavity such as the outer circular shape or the outer rectangular shape, only by changing the partial structure.

  Then, as shown in FIG. 2 (F), the film hand 13 (rectangular frame 13a) is chucked by the film loader 11 and conveyed to the mold 6 in a state where the mold resin R is supplied to the sheet film F. Is done.

  Here, when the single wafer film F is lifted from the stage 17 by the film loader 11, if the tension is insufficient, the single wafer film F may hang down at the center or the like due to the weight of the mold resin R. Therefore, the film drooping detection unit 20 may be provided at a position close to the stage 17 (see FIG. 2E). As the film drooping detection unit 20, for example, a laser sensor that includes a light emitting unit and a light receiving unit and detects a shielding state and a shielding position between them can be used. In this case, it is preferable to provide the light emitting part and the light receiving part at a position sandwiching the film hand 13. Further, the film drooping detection unit 20 can detect when the film hand 13 is suspended from an appropriate position when the film hand 13 is lifted by detecting a shield in the space on the stage 17. Only one set of the film sag detection unit 20 may be provided so as to detect the sag in one direction, or two sets may be provided so as to detect in two intersecting directions as shown in FIG. The film drooping detection unit 20 may have any configuration as long as the drooping of the single-wafer film F can be detected. For example, a contact sensor (switch) may be used, and when the film hand 13 is lifted to a predetermined height, it may be detected that the film hanging down is in contact.

  The film chuck 13c that holds each side of the rectangular sheet F shown in FIG. 3 can be made uniform or different in the amount pushed up on each side. In this case, for example, by making the push-up amount by the push-up pin 15 provided for each side of the single-sheet film F uniform, it is possible to apply a tension corresponding to the rotation amount around the rotary shaft 13e. Moreover, the amount pushed up for each set of the pair of film chucks 13c on the opposite sides can be varied. In this case, depending on the length of each side of the sheet film F and the ease with which the film is stretched depending on the direction drawn from the film roll 8a, etc., the amount to be pushed up for each set of film chucks 13c varies. The tension applied to each side of the film F can also be made uniform. For example, in the case of a horizontally long film as shown in FIG. 3, the push-up amount of the pair of film chucks 13 c on the two sides (right side and left side) pulled in the longitudinal direction (left and right direction in the figure) is reduced in the short direction (same figure). The up-and-down direction of the pair of film chucks 13c on the two sides (upper side and lower side) to be pulled may be different. That is, the push-up amount of the film chuck 13c in the longitudinal direction may be set larger than the push-up amount of the film chuck 13c in the short direction. In other words, by pulling more with respect to a long side, it can be made to be in a uniformly pulled state regardless of the length of the side. According to this, the tension | tensile_strength applied to the sheet | seat film F in the direction of a longitudinal direction and a transversal direction can be equalized.

Further, as shown in FIG. 3, the film chuck 13c may be divided into a plurality of parts on one side, without being limited to the case where the single-sided film F is chucked integrally for each side. In this case, depending on the state (position) of the wrinkles generated in the sheet film F, the amount of rotation of the film chuck 13c at the side position is changed and tension is applied to twist the sheet film F to stretch the wrinkles. It can be held in the state. For example, if the tension is partially increased, wrinkles are generated at other positions. For this reason, after the film chuck 13c is uniformly pushed up and tension is applied, when a wrinkle occurs, the tension of the portion is weakened or the tension other than that portion is increased. Can do. Further, the film chuck 13c is not only configured to be gripped on the side of the sheet film F by a predetermined length so as to be pulled so as to intersect the extending direction of the side, but also from the center at the corner of the sheet film F. A configuration may be adopted in which the corners of the single-wafer film F are gripped in order to stretch in the direction of separation.
As a result, by changing the offset amount of the divided film chuck 13c from the fulcrum frame 13b, the sheet film F is twisted in accordance with the direction of the wrinkles generated on the sheet film F and the size of the wrinkles. The generation of wrinkles inherent to the film can be eliminated by applying tension.

  Next, the configuration of the mold 6 provided in the press unit 5 will be described with reference to FIG. The present example illustrates a mold 6 for compression molding. The mold 6 is provided with a heater (not shown) at an arbitrary position so that the mold resin R is heat-cured and the workpiece W is resin-molded to produce a molded product M. On the upper clamp surface 6a of the upper mold 6A, a vent hole 6b and a vent path 6c communicating with the vent hole 6b are formed to attract and hold the workpiece W. Further, work holding pins 6d are provided at opposing positions on the outer edge of the rectangular work W at a plurality of positions. The work holding pin 6d presses and holds the outer peripheral surface of the work W. The work holding pin 6d may be a cylindrical pin or a prismatic pin, and is preferably configured to be pressed against the work W via an elastic body. The workpiece holding pin 6d may be a guide for centering the workpiece W when the workpiece W is sucked and held. According to such a configuration, for example, the area of the cavity can be widened as compared with a configuration in which the outer periphery of the workpiece W is held by an L-shaped claw-shaped hook.

  In the lower die 6B, a lower die cavity piece 6f that forms a bottom portion of the lower die cavity is integrally supported on the lower die block 6e. Around the lower mold cavity piece 6f, a lower mold movable clamper 6g that forms the side of the lower mold cavity is floatingly supported on the lower mold block 6e via a coil spring 6h. A lower mold cavity recess 6C is formed by the lower mold cavity piece 6f and the lower mold movable clamper 6g. A gap between the lower mold movable clamper 6g and the lower mold cavity piece 6f is sealed with a seal ring 6i (O-ring). The lower mold movable clamper 6g is provided with ventilation paths 6g1 and 6g2 for attracting and holding the sheet film F on the lower mold surface including the lower mold cavity recess 6C. The air passage 6g1 adsorbs the film inner peripheral side from the gap between the lower mold cavity piece 6f and the lower mold movable clamper 6g, and the air passage 6g2 adsorbs the film outer peripheral side on the clamp surface of the lower mold movable clamper 6g. ing. Thereby, the sheet film F is adsorbed so as to follow the concave shape of the lower mold cavity concave portion 6C. It should be noted that a pair of upper and lower clamp blocks (not shown) are provided between the upper mold 6A and the lower mold 6B when a mold clamping operation is started to form a decompression space in the mold. Good.

  A pusher 6j is provided outside the lower mold movable clamper 6g of the lower mold 6B (tension applying mechanism). The pusher 6j is provided in order to further increase the tension on the single-wafer film F. For example, when the sheet film F is carried into the lower mold 6B together with the film hand 13 by the film loader 11, the sheet film F is stretched by the radiant heat from the lower mold 6B, and the tension is lowered. In this case, when the tension of the sheet film F decreases and sagging occurs, the central part of the sheet film F hangs down due to the weight of the sheet film F or the weight of the supplied mold resin R. In this case, when the sheet film F is placed on the lower mold 6B, the sagging of the sheet film F may become wrinkles. Further, when the sagging of the central portion of the sheet film F becomes large, it is assumed that the mold resin R gathers in the center and it is difficult to supply the mold resin R uniformly in the cavity. For this reason, the pusher 6j is provided at a position corresponding to the rotation lever 13d of the lower mold 6B. For example, the pusher 6j is moved up and down by an elevating drive mechanism (for example, a drive mechanism such as cylinder drive, solenoid drive, motor drive, etc.). It is configured to be rotatable. The pusher 6j is provided to increase the offset amount of the pair of film chucks 13c and further increase the tension on the single-wafer film F. The pusher 6j can also be used to release the ratchet mechanism 13f.

  When the sheet load film F is placed on the lower die 6B (lower die movable clamper 6g) together with the film hand 13 by the film loader 11, the pusher 6j disposed immediately below the rotary lever 13d is actuated to move the rotary lever 13d. The film chuck 13c is rotated to increase the offset amount. Thereby, it can prevent that the tension | tensile_strength of the sheet | seat film F falls before a metal mold | die clamp. Of course, when the sheet F is approaching the lower die 6B, it can be rotated in the direction to increase the offset amount of the film chuck 13c.

  Here, a specific configuration example of the work holding pin 6d provided on the upper die 6A will be described with reference to FIG. The work holding pins 6d are arranged at predetermined intervals at a plurality of positions along the outer shape of the work W held by suction on the upper mold clamping surface 6a (see FIG. 7). In addition, it is preferable that the workpiece holding pins 6d are arranged at positions facing each other so that the force applied to the workpiece W is canceled and the position is not displaced. The work holding pin 6d has, for example, an L-shaped one end 6d1 accommodated in the upper mold 6A so as to be swingable about the rotation shaft 6d2, and the other end 6d3 is an upper mold clamping surface 6a of the upper mold 6A. More protruding. For this reason, the other end 6d3 can move back and forth in the horizontal direction (left and right direction in FIG. 5) on the upper clamp surface 6a of the upper mold 6A. Specifically, the other end 6d3 is a direction approaching the outer peripheral surface of the work W and facing the center side of the work W (right direction in FIG. 5), and a direction away from the outer peripheral surface of the work W (see FIG. 5 (left direction in FIG. 5).

  The other end 6d3 projecting from the upper clamp surface 6a is covered with an elastic member (rubber cover) 6d4. Further, the work holding pin 6d is arranged in a direction (counterclockwise direction in FIG. 5) in which the other end portion 6d3 stands up from the upper clamp surface 6a around the rotation shaft 6d2 by a coil spring 6d5 provided in the upper die 6A. Always energized.

As a result, the other end 6d3 of the work holding pin 6d is pressed against the side surface (outer peripheral surface) of the work W. Accordingly, the workpiece W can be prevented from dropping even if a force in the direction of dropping is applied to the workpiece W due to the dead weight of the workpiece W or by a negative pressure below the workpiece W by a decompression mechanism (not shown). it can. Further, the workpiece W can be held while being centered on the upper mold clamping surface 6a. Further, the elastic member 6d4 that presses the outer peripheral surface of the workpiece W is elastically deformed, so that the workpiece W can be reliably prevented from falling. For example, when the workpiece W is a wafer, the cross-sectional shape on the outer peripheral surface thereof is a shape in which the upper and lower corners are greatly rounded. In other words, the center position of the workpiece W in the thickness direction is convex. In this case, when the elastic member 6d4 is pressed against the side surface of the workpiece W, the center position in the thickness direction is in a state of being bitten into the elastic member 6d4. For this reason, when the workpiece W is a wafer, the function of preventing the workpiece W from dropping by the elastic member 6d4 is more effectively exhibited.
Further, by using both the pressing of the workpiece holding pins 6d against the outer peripheral surface of the workpiece W and the suction holding of the workpiece W from the air suction holes 6b, the displacement and dropping of the workpiece W with respect to the upper clamp surface 6a can be ensured. Can be prevented.

  The work holding pin 6d shown in FIG. 5 can be arbitrarily opened and closed by a drive source as shown in FIG. FIG. 11 is an enlarged view of a main part in a modified example of the upper mold 6A shown in FIG. 5, and the same components as those in FIG. In the upper die 6A shown in FIG. 11, the push-down pin 6d6 is always pressed against the one end 6d1 side of the work holding pin 6d. The push-down pin 6d6 can be swung around the rotation shaft 6d2 by being lowered at an arbitrary timing by a drive source (not shown) such as an air cylinder or a servo motor. For example, before setting the workpiece W on the upper mold clamping surface 6a, the other end 6d3 is moved in a direction away from the workpiece W (left direction in the figure). As a result, the other end 6d3 can be retracted from the region where the workpiece W is placed, and the workpiece W can be set on the upper clamping surface 6a without interfering with the other end 6d3. When holding the workpiece W set on the upper clamp surface 6a with the workpiece holding pin 6d, the pressing pin 6d6 is raised to swing the workpiece holding pin 6d by the urging force of the coil spring 6d5. The end 6d3 is moved in a direction approaching the outer peripheral surface of the workpiece W (right direction in the figure). Thereby, the other end 6d (elastic member 6d4) can be pressed and held on the side surface of the workpiece W set on the upper clamp surface 6a.

  6A and 6B show a modification of the work holding pin 6d. The work holding pin 6k is formed in a U-shape, and the pin body 6k1 is accommodated in the upper mold 6A so as to be swingable about the rotation shaft 6k2. One end portion 6k3 of the pin main body 6k1 is provided so as to be able to protrude and retract below the upper mold clamping surface 6a corresponding to the workpiece suction surface. Further, the other end 6k4 of the pin main body 6k2 is always protruded downward from the upper mold clamping surface 6a. The other end 6k4 that contacts the workpiece W is covered with an elastic member 6k5.

  Further, the one end portion 6k3 side of the pin main body 6k1 is always urged by the coil spring 6k6 so as to protrude downward from the upper mold clamping surface 6a. For this reason, the other end 6k4 of the pin main body 6k1 is in a state where the elastic member 6k5 is inclined in a direction away from the outer peripheral surface of the workpiece W (clockwise direction in FIG. 6A).

  When the workpiece W is aligned and overlapped with the upper clamping surface 6a by the panel loader 10 (see FIG. 1), the workpiece holding pin 6k resists the bias of the coil spring 6k6 as shown in FIG. 6B. Then, the one end 6k3 is pushed into the upper mold 6A, and the pin body 6k1 rotates a predetermined amount in the counterclockwise direction around the rotation shaft 6k2. As a result, the other end 6k4 is pressed against the outer peripheral surface of the workpiece W via the elastic member 6k5. Further, the work W is held on the upper clamp surface 6a by air suction from the vent hole 6b. In this manner, the work holding pin 6k can be rotated by pressing the work W against the upper mold clamping surface 6a to press the elastic member 6k5 against the outer peripheral surface of the work W.

The form and layout example of the work holding pins 6d (6k) will be described with reference to FIGS. In FIG. 7, the work holding pins 6d are illustrated and described.
7A and 7B assume that the workpiece W is circular, such as a semiconductor wafer or a carrier plate. The work holding pins 6d (6k) are arranged at predetermined intervals along the outer shape of the work W, and are provided at positions facing the radial direction. In the circular workpiece W, the workpiece holding pin 6d (6k) is preferably pressed (pressed) against the workpiece W by rotating the workpiece holding pin 6k toward the center point of the workpiece W. Note that the work holding pins 6d (6k) may not be provided at positions facing the radial direction. For example, when the work is circular, the work W is arranged at equal intervals (5 equal parts, 7 equal parts, etc.) along the outer shape, or the pressing force by the work holding pins 6d (6k) is offset. It may be arranged in a position.
Thereby, the workpiece | work W can be centered toward radial direction center with the pressing force of the workpiece | work holding pin 6d which opposes. FIG. 7 (A) illustrates the case where the pin shape is a cylindrical shape, and FIG. 7 (B) is a block shape having a surface to be pressed widely along the arc shape of the workpiece W. The case where is used is illustrated.

  7C and 7D assume that the workpiece W is rectangular such as a semiconductor substrate or a carrier plate. The work holding pins 6d (6k) are arranged at predetermined intervals on each side of the work W, and are provided at positions facing each other across a line symmetric center line. As a result, the workpiece W can be centered toward the center (center) of the opposite side by the pressing force of the opposing workpiece holding pins 6d. FIG. 7C illustrates an example in which the pin shape is a cylindrical shape, and FIG. 7D is a rectangular shape (block having a surface to be pressed widely along the linear side of the workpiece W (block). The case where what made the shape was used is illustrated.

Next, an operation of supplying a work to the mold 6 by the panel loader 10 will be described with reference to FIG. FIG. 8 illustrates only the upper mold 6A.
In FIG. 8A, the panel loader 10 sucks and conveys the workpiece W with the semiconductor chip mounting surface as the lower surface side. That is, an escape recess 10a for accommodating a semiconductor chip or the like is formed on the upper surface of the panel loader 10, and a vent hole 10b capable of attracting and holding the workpiece W is formed around the recess 10a. Further, the relief recess 10a is formed with a vent hole 10c for discharging air in order to make it easy to deliver the workpiece W when delivering the workpiece W to the upper clamping surface 6a and to prevent the workpiece W from sagging due to its own weight. .

  As shown in FIG. 8 (A), the semiconductor chip mounting surface of the workpiece W is placed toward the relief recess 10a, air is sucked from the vent hole 10b to suck and hold the workpiece W on the loader upper surface, and the relief recess 10a. The air is discharged from the vent hole 10c that communicates with the workpiece W and is held while preventing the workpiece W from sagging due to its own weight. Here, since the work W is sucked and held in the vent hole 10b, the work W does not move from a predetermined position even if air is discharged from the vent hole 10c. In addition, the air discharged from the vent hole 10c can be heated and preheated and the workpiece W can be arbitrarily extended by thermal expansion. In this case, it is possible to reduce the displacement due to the difference in coefficient of thermal expansion after the workpiece W is pressed against the upper mold clamping surface 6a heated by a heater (not shown). Thus, the panel loader 10 holding the workpiece W enters the mold 6 that has been opened.

  The panel loader 10 aligns the workpiece holding pins 6d provided on the upper clamp surface 6a of the upper die 6A and the outer shape of the workpiece W. At this time, the air suction operation may be started in advance from the vent hole 6b of the upper mold 6A and the vent path 6c communicating therewith by an upper mold intake / exhaust mechanism (not shown).

  As shown in FIG. 8B, the panel loader 10 is raised to press the workpiece W against the upper mold clamping surface 6a. At this time, air is discharged from the air suction hole 10b that has adsorbed the workpiece W of the panel loader 10 and air is discharged from the vent hole 10c communicating with the escape recess 10a, so that the workpiece W is reliably placed on the upper clamp surface 6a. Can be handed over. At this time, by increasing the air discharged from the vent hole 10c (increasing the pressure), the workpiece W may be pressurized and pressed against the upper mold clamping surface 6a in a state where the workpiece W is held at a medium height. Is possible. In this case, air does not remain in the gap between the upper clamping surface 6a and the workpiece W, and the workpiece W can be held flat.

  When the workpiece W is pressed against the upper mold clamping surface 6a, the workpiece holding pins 6d are pressed against the outer peripheral surface to be centered. In this way, since the workpiece W can be centered by the workpiece holding pin 6d, a separate alignment pin for centering becomes unnecessary. After the alignment (centering) is completed, the air is sucked and held on the upper mold clamping surface 6a by air suction from the vent hole 6b.

  Thus, as shown in FIG. 8C, when the panel loader 10 is retracted from the upper mold clamping surface 6a, the workpiece W is transferred from the upper surface of the panel loader 10 to the upper clamping surface 6a of the upper mold 6A. It is. At this time, since the work outer peripheral surface is pressed by the work holding pins 6d opposed to the periphery of the work W and the work W is sandwiched and held while elastically deforming the elastic member 6d4 (see FIG. 5), the work W falls. And misalignment can be reliably prevented.

  Further, according to the configuration as shown in the present embodiment, even if the workpiece W pressed against the heated upper clamp surface 6a is heated, the workpiece holding pin is heated even if the outer diameter increases due to thermal expansion. Since the other end 6d3 of 6d can be moved back and forth, the state held with an appropriate force can be maintained. Further, when the elastic member 6d4 is provided, it is possible to absorb the increase in the outer diameter of the workpiece W due to heating and maintain the state held with an appropriate force.

Next, an example of the resin molding operation following FIG. 8C will be described with reference to FIG. 9A, it is assumed that the sheet film F and the granular resin R are carried into the lower mold 6B by the film loader 11 as described above.
In FIG. 9A, a large-size work W (rectangular panel, rectangular substrate, etc.) each having a side of 600 mm is carried into the upper mold 6A by a panel loader 10 (see FIG. 1), for example, and the upper mold clamping surface It is adsorbed and held by a vent 6b and a vent 6c provided in 6a. At this time, the outer peripheral surface of the rectangular workpiece W is transferred to the upper die 6A by pressing and holding the outer peripheral surface of the workpiece W by the workpiece holding pins 6d provided at the opposing positions at a plurality of locations. In addition, the rectangular workpiece W is centered by the workpiece holding pin 6d when the outer peripheral surface of the workpiece W is uniformly pressed by the workpiece holding pin 6d. In addition, carrying in of the sheet | seat film F and the granule resin R, and carrying in of the workpiece | work W may be performed simultaneously, and after carrying in the workpiece | work W, the sheet | seat film F and the granule resin R may be carried in.

  Next, as shown in FIG. 9B, the mold 6 is closed. For example, the lower mold 6B is raised and the workpiece W is clamped between the upper mold 6A. Before the upper mold 6A and the lower mold 6B clamp the workpiece W, an upper mold chamber block 6p and a lower mold chamber block 6m, which will be described later, are interposed between the upper mold 6A and the lower mold 6B via a sealing material 6n. It is preferable that the mold space is closed by clamping to form a decompression space, and molding is performed in a decompressed atmosphere (see FIG. 10).

  Subsequently, by further clamping the mold 6, the coil spring 6 h is compressed and moved so that the lower mold movable clamper 6 g approaches the lower mold block 6 e. Thereby, the height (depth) of the cavity in the lower mold cavity recess 6C is lowered (shallow), and the workpiece W is immersed in the molten granular resin R in the lower mold cavity recess 6C and heated by applying resin pressure. Pressurize. In FIG. 9C, the mold clamping operation of the mold 6 is completed, and the workpiece W is immersed in the granule resin R melted in the lower mold cavity recess 6C, and is heated and pressurized to be cured (compression molding). ) Indicates the state.

  When the heat curing in the mold 6 is completed, the mold 6 is opened. Here, the mold opening is performed while maintaining the suction holding of the molded product M on the upper clamp surface 6a of the upper mold 6A and the suction holding on the lower mold clamping surface including the lower mold cavity recess 6C of the sheet F. Is called. As a result, as shown in FIG. 9D, in a state where the mold is opened, the molded product M is attracted and held by the upper clamp surface 6a of the upper mold 6A, and the single wafer film F is in the lower mold cavity recess 6C. It will be in the state where it was adsorbed and held by the lower mold clamping surface containing. In this way, the molded product M and the used sheet-fed film F are held in separate molds so that they can be taken out from the press unit 5 and conveyed to the respective storage / accommodation destinations. Can be simplified.

  Subsequently, in FIG. 1, the panel loader 10 enters the mold mold 6 that has been opened, and the molded product M is released from the suction of the air holes 6b from the upper mold 6A and is sucked from the air holes 10b to suck the work W into the loader. It is sucked and held on the upper surface and delivered to the panel loader 10. In addition, the used single wafer film F is delivered from the lower mold 6B to the opposite surface (lower surface side) of the panel loader 10. At this time, in order to deliver the molded product M from the upper mold clamp surface 6a to the panel loader 10, compressed air is ejected from the vent hole 6b, and at the same time, the single wafer film F is delivered from the lower mold surface to the panel loader 10. It is preferable to eject compressed air from the paths 6g1 and 6g2 (see FIG. 9D). The molded product M is delivered from the panel loader 10 to the robot hand 4a of the robot transport device 4. The used single wafer film F is discharged from the panel loader 10 to the film collecting unit 12 and collected. The robot hand 4 a holds the molded product M and carries it into a predetermined curing furnace 3. After-curing of the molded product M is performed in the curing furnace 3. Subsequently, the robot hand 4 a takes out the molded product M from the curing furnace 3, thereby completing all processes for the workpiece W and completing the manufacturing process of the molded product M. Subsequently, the molded product M is carried into the molded product storage unit 2 where the molded product M is stored.

  Thus, according to the present embodiment, by using the film hand 13 that conveys the above-described single-wafer film F, the amount of film used is reduced to reduce the running cost, and the molding quality of a large-sized molded product is improved. And the installation area can be reduced.

  Next, another example of the work holding part provided in the mold 6 will be described with reference to FIG. One of the major features of this other example is that the chuck body 40b, which is a work holding portion, is configured to be able to appear and retract in the upper mold 6A. As shown in FIG. 10A, the upper die 6A includes a plurality of (for example, six, eight, etc.) chucks 40 at positions facing the outer periphery of the workpiece W on the upper die clamping surface 6a. Yes. The tip of the chuck 40 protrudes from the lower surface of the upper die 6A so as to be rotatable, and presses the outer peripheral surface of the workpiece W from the outside to hold the outer peripheral surface of the workpiece W so as to prevent the fall. As an example, the chuck 40 includes a chuck body 40b that is rotatably supported with respect to a rotation shaft 40a provided in the upper die 6A, an elastic member 40c that covers a lower end portion of the chuck body 40b, and a chuck body 40b. And a rotation urging member 40d that always presses in the rotation direction (counterclockwise direction in FIG. 10A) about the rotation shaft 40a. As a result, the elastic member 40c is pressed against the outer peripheral surface from the side of the workpiece W, whereby the elastic member 40c is elastically deformed so that the workpiece W bites into the elastic member 40c. Therefore, if such a chuck 40 is used, the workpiece W can be held on the upper mold 6A by the elastic member 40c provided on the chuck body 40b, and displacement and dropping can be prevented. Further, the outer peripheral position of the lower mold cavity 6C can be expanded to a position close to the outer peripheral position of the workpiece W, and the number of workpieces can be increased to improve productivity.

  Further, as shown in FIG. 10A, the chuck 40 has its rotation angle of the chuck body 40b regulated by a stopper 40e provided on the upper die 6A. Thereby, the area | region divided by the type | mold inner peripheral position P of the lower end of the elastic member 40c in the some chuck | zipper 40 can also be made larger than the outer periphery shape of the workpiece | work W. FIG. In other words, the lower end of the chuck body 40b can be opened toward the outside of the apparatus. Therefore, when the workpiece W is set on the upper die 6A from below, the workpiece W does not interfere with the chuck 40, and the workpiece W can be easily set on the upper die 6A.

  In FIG. 10A, a lower mold block 6m is disposed on the lower mold block 6e so as to surround the outer side of the lower movable clamper 6h. Further, the upper mold chamber block 6p is disposed so as to surround the upper mold 6A so as to face the lower mold chamber block 6m. A sealing material 6n is provided on the clamp surface of the lower mold chamber block 6m. The upper mold chamber block 6p is formed with a ventilation path 6q for forming a reduced pressure space in the mold 6. The air passages 6c and 6q provided on the upper die 6A side are connected to the upper die intake / exhaust mechanism 6r, and the air passages 6g1 and 6g2 provided on the lower die 6B side are connected to the lower die intake / exhaust mechanism 6s.

  When the mold 6 is clamped, as shown in FIG. 10 (B), the upper mold chamber block 6p and the lower mold chamber block 6m crush the sealing material 6n to form a closed space in the mold 6 and vent. A reduced pressure space is formed by air suction from the path 6q. Even if a reduced pressure space is formed in the mold mold 6 that is closed, the work outer peripheral surface is held by the chuck 40, so that the work W will not fall off the upper mold clamp surface 6a due to the differential pressure.

  Moreover, the chuck | zipper 40 can also be provided in the upper mold | type 6A so that raising / lowering is possible. In this case, for example, an accommodation recess 40h in which the chuck body 40b can protrude and retract is provided on the upper clamp surface 6a of the upper mold 6A. The chuck body 40b is provided with a long hole-like lifting hole 40f into which the rotating shaft 40a is inserted. One end of an elevating elastic body 40g (for example, a coil spring) is connected to the bottom of the housing recess 40h, and the other end is connected to the upper end of the chuck body 40b. The lifting elastic body 40 is biased so that the lower end of the chuck body 40b always protrudes from the upper clamp surface 6a.

  As shown in FIG. 10B, when the workpiece W is clamped on the mold 6 and the lower body movable clamper 6g pushes up the chuck body 40b against the urging force of the lifting elastic body 40g, it moves up and down on the rotating shaft 40a. The chuck body 40b rises while the use hole 40f is guided, the lifting elastic body 40g is pressed and shrunk, and the chuck body 40b is housed in the housing recess 40h. In addition, the elastic member 40b is pressed against the outer peripheral surface of the workpiece W to be clamped by pressing the chuck body 40b against the stopper 40e by the rotating elastic body 40d. According to this, it is not necessary to provide a retreat space for the chuck 40 in the lower mold movable clamper 6g, and the mold configuration can be simplified. Further, the release film F can be prevented from being distorted, and stable sticking to the lower mold 6B can be secured. The chuck mechanism in the present embodiment is not limited to the other embodiments, and can be arbitrarily applied as long as it is a compression mold having a structure in which the lower mold 6B includes the lower mold cavity 6C.

In the above-described embodiment, the case where the workpiece W is conveyed by the panel loader 10 and transferred to the upper clamp surface 6a of the mold 6 has been described. However, the workpiece W is transferred to the lower clamp surface. Also good.
Moreover, although the case where the rectangular workpiece W was resin-molded using the rectangular sheet F was described, the circular workpiece W (for example, a semiconductor wafer, an annular carrier, etc.) is used together with the rectangular sheet F. You may make it convey.
Moreover, although the mold 6 has been described using a compression mold, it may be a transfer mold.

  The dispensing unit Ud can be used by being incorporated in a resin molding apparatus as described above, but can also be used as a single unit. In this case, the film hand 13 holding the sheet film F to which a predetermined tension is applied in the dispensing unit Ud may be prepared, and the film hand may be supplied to the separately provided press unit Up.

  Further, for example, the reversing part 30 (see FIG. 1) that reverses the front and back of the workpiece W or the molded product M may be used for resin molding on both surfaces of the workpiece W. In this case, after resin molding is performed on one surface of the workpiece W, it is returned to the workpiece processing unit Uw, and the molded product M is inverted by the reversing unit 30 and then molded on the other surface of the workpiece W (molded product M). You may do. Moreover, it can replace with the inversion part 30, and can also be set as the robot conveyance apparatus 4 which can invert the robot hand 4a.

  Further, instead of a configuration in which the work holding pin 6d shown in FIG. 11 can be arbitrarily opened and closed, as shown in FIG. 12, an additional drive mechanism is not additionally provided, for example, a panel loader 10 that is essential as a device configuration. The workpiece holding pin 6d can be configured to be openable and closable by the delivery operation of the workpiece W to the upper clamping surface 6a. For example, as shown in FIG. 12, the upper die 6A includes a work holding pin 60, an elastic member 61 that covers the tip of the work holding pin 60, and a coil spring 62 that constantly biases the work holding pin 60 in the closing direction. Yes. The work holding pin 60 is formed in, for example, a U-shape as shown in the figure, and has one end 60a at a position away from the position where the work W is placed and the other end 60b at a position closer thereto. It protrudes downward from the mold clamping surface 6a. One end 60a protruding from the upper clamp surface 6a has an inclined surface at the tip. In addition, an inclined surface facing the one end 60a is also formed at the tip of the push-up pin 10d provided upright on the upper surface of the panel loader 10. When the workpiece W is transferred to the upper mold 6A of the panel loader 10, that is, the sliding operation is performed while the push pins 10d and the inclined surfaces of the one end 60a are pressed against each other in conjunction with the lifting and lowering operation of the panel loader 10, the workpiece The holding pin 60 can be opened and closed. In addition, if these inclined surfaces are provided in at least one of them, an equivalent effect can be achieved. The distal end portion of the other end portion 60b protruding from the upper mold clamping surface 6a is covered with an elastic member 61 having the same function as the elastic member of the above-described embodiment. The work holding pin 60 is always urged by the coil spring 62 in a direction in which the other end 60b approaches the mounting position of the work W (direction to press against the work outer peripheral surface; right direction in FIG. 12).

  An example of the opening / closing operation of the work holding pin 60 will be described. When the panel loader 10 holding the workpiece W is raised and brought close to the upper mold clamping surface 6a, the push-up pin 10d is pressed against the inclined surface of the one end portion 60a. By the raising operation of the push-up pin 10d, the one end portion 60a of the work holding pin 60 moves in the left direction in FIG. Accordingly, the other end 60b of the work holding pin 60 is retracted from the work W mounting area. Subsequently, the panel loader 10 is brought close to and attracted and held until the workpiece W is set on the upper mold clamping surface 6a, and then the panel loader 10 is lowered, whereby the coil spring 62 is attached. Due to the force, the other end 60 b of the work holding pin 60 moves in a direction approaching the work W. Thereby, the elastic member 61 of the other end part 60b is pressed against the outer peripheral surface of the work W, and the work W is held. In this way, the mechanism for driving the work holding pin 60 can be simplified by opening and closing the work holding pin 60 using the lifting and lowering operation of the panel loader 10 as shown in FIG.

  In the above-described embodiment, the configuration in which the work holding pin 6d is provided in the upper mold 6A has been described. However, the work holding pin 6d may be provided in the lower mold 6B. In this case, it is possible to prevent the workpiece W from being displaced or lifted, and to mold the workpiece W at an appropriate position.

  Further, the work holding pin 6d may be configured such that the elastic member 6d4 is omitted. In this case, for example, by setting the position of the elastic member 6d4 as a friction surface provided with arbitrary irregularities, it is possible to make it possible to reliably prevent the fall without combining additional members. For example, in place of the elastic member 6d4 at the contact portion of the workpiece W at the tip of the pin, a knurled (oblique, flat or crossed) surface, pear surface, corrugated surface or multi-step groove surface is provided to prevent falling by frictional force. You can also

  The work holding pin 6d has been described as being pressed against the outer peripheral surface of the work W. However, the work holding pin 6d is inserted into a hole provided in the work W, and the work holding pin 6d is inserted into the inner peripheral surface of the hole. The workpiece W may be held by pressing. In this case, for example, not only the workpiece holding pin 6d is pressed toward the center / center of the workpiece W but also the workpiece holding pin 6d may be pressed toward the outer periphery of the workpiece W. Further, the workpiece W may be a ring frame that holds a tape to which a chip to be molded is attached on the outer periphery.

  Ud Dispense unit Up Press unit Uw Work processing unit W Work 1 Work supply unit 2 Molded product storage unit M Molded product 3 Cure furnace 4 Robot transfer device 4a Robot hand 5 Press unit 6 Mold die 6A Upper die 6B Lower die 6C Lower die Cavity recess 6a Upper clamp surface 6b, 10b, 10c Ventilation hole 6c, 6g1, 6g2, 6q Ventilation path 6d, 6k, 60 Workpiece holding pin 6e Lower mold block 6f Lower mold cavity piece 6g Lower mold movable clamper 6h Coil spring 6i Seal Ring 6j Pusher 6k1 Pin body 6k2, 13e, 40a Rotating shaft 6k3, 60a One end 6k4, 60b The other end 6k5, 40c, 61 Elastic member 6k6, 62 Coil spring 6m Lower mold chamber block 6n sealing material 6p upper mold chamber block 6r upper mold intake / exhaust mechanism 6s lower mold intake / exhaust mechanism 8 film supply unit 8a film roll F single wafer film 9 dispenser 10 panel loader 10a escape recess 11 film loader 12 film recovery unit 13, 19 fulcrum Frame 13a Rectangular frame 13b Support rod 13c, 19a Film chuck 13d Rotating lever 13f Ratchet mechanism 13g Guide member 13h Movable member 13i Support member 13j Receiving part 13k Film pressing part 13m Pressing spring 14 Guide rail 15 Lifting pin 16 Trough 17 Stage 18 Cutter 19b Chuck holding portion 19c Slider 19d Frame body portion 19e Flange portion 19f Support point portion 20 Film hanging detection 30 reversing unit 40 chuck 40b chuck body 40d biasing the rotary member for 40e stopper 40f lifting hole 40g lifting elastic body 40h housing recess

Claims (7)

A mold that holds a workpiece on the clamp surface of one of the pair of molds and clamps the other mold to resin mold,
The one mold clamping surface is provided with a work holding portion which is arranged to be opposed to each other at a plurality of locations along the outer shape of the work and is pressed against and held by the outer peripheral surface of the work. Mold mold.   The mold according to claim 1, wherein the workpiece holding portion includes an elastic member that is pressed against the outer peripheral surface of the workpiece and elastically deforms.   3. The mold according to claim 1, wherein when the work is brought into close contact with the one mold clamping surface, the work outer peripheral surface is pressed against each other by the work holding portions arranged to face each other.   The mold die according to any one of claims 1 to 3, wherein a workpiece suction mechanism for sucking and holding the workpiece is provided on the one mold clamping surface.   The mold according to any one of claims 1 to 4, wherein the work holding portion is provided on an upper mold clamping surface.   The mold according to any one of claims 1 to 5, further comprising a decompression mechanism that forms a decompression space between the pair of molds.   A resin mold apparatus comprising the mold according to any one of claims 1 to 6.

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