JP2017013199A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2017013199A JP2017013199A JP2015134192A JP2015134192A JP2017013199A JP 2017013199 A JP2017013199 A JP 2017013199A JP 2015134192 A JP2015134192 A JP 2015134192A JP 2015134192 A JP2015134192 A JP 2015134192A JP 2017013199 A JP2017013199 A JP 2017013199A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- input
- cutting blade
- blade
- color
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H10P54/00—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H10P70/18—
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- H10P72/06—
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- H10P72/3202—
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- H10P72/7402—
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- H10P72/7612—
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- H10W10/00—
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- H10W10/01—
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- H10W46/00—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Dicing (AREA)
- Numerical Control (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
14 モニタ(入力手段、表示手段)
21 保持手段
36 切削ブレード
37 切削手段
71 ブレードケース
72 ケースホルダ
81 制御手段
82 特性記憶部
84 表示制御部
87 所定エリア
W 被加工物
Claims (1)
- 被加工物を保持する保持手段と、該保持手段が保持する被加工物を切削する切削ブレードを回転可能に装着する切削手段と、情報を入力する入力手段と、該入力手段から入力された情報を表示する表示手段と、制御手段と、を備える切削装置であって、
該切削ブレードの特性が色によって設定されており、
該制御手段は、該切削ブレードの特性が設定された色とIDとを記憶する特性記憶部と、該入力手段で入力された入力IDと該特性記憶部に記憶された該IDとを照合して該入力された該入力IDに対する該特性記憶部が記憶する該色で該表示手段の所定エリアを表示する表示制御部と、を備える切削装置。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015134192A JP2017013199A (ja) | 2015-07-03 | 2015-07-03 | 切削装置 |
| TW105117409A TWI714593B (zh) | 2015-07-03 | 2016-06-02 | 切割裝置 |
| CN201610509534.6A CN106313347B (zh) | 2015-07-03 | 2016-06-30 | 切削装置 |
| KR1020160082344A KR20170004880A (ko) | 2015-07-03 | 2016-06-30 | 절삭 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015134192A JP2017013199A (ja) | 2015-07-03 | 2015-07-03 | 切削装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2017013199A true JP2017013199A (ja) | 2017-01-19 |
Family
ID=57725470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015134192A Pending JP2017013199A (ja) | 2015-07-03 | 2015-07-03 | 切削装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2017013199A (ja) |
| KR (1) | KR20170004880A (ja) |
| CN (1) | CN106313347B (ja) |
| TW (1) | TWI714593B (ja) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018129329A (ja) * | 2017-02-06 | 2018-08-16 | 株式会社ディスコ | 切削装置 |
| KR20190024700A (ko) * | 2017-08-31 | 2019-03-08 | 가부시기가이샤 디스코 | 가공 장치 |
| KR20190085866A (ko) * | 2018-01-11 | 2019-07-19 | 가부시기가이샤 디스코 | 가공 장치 및 가공 수단의 부착 방법 |
| CN110450287A (zh) * | 2019-06-26 | 2019-11-15 | 云浮市科特机械有限公司 | 一种石材自动化生产方法 |
| JP2020144420A (ja) * | 2019-03-04 | 2020-09-10 | 株式会社ディスコ | 加工装置および加工管理部材 |
| KR20200120513A (ko) | 2019-04-12 | 2020-10-21 | 가부시기가이샤 디스코 | 절삭 장치 |
| JP2021154394A (ja) * | 2020-03-25 | 2021-10-07 | Dmg森精機株式会社 | 工具マガジン装置 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6998158B2 (ja) * | 2017-09-07 | 2022-01-18 | 株式会社ディスコ | 切削ブレード供給装置 |
| JP7017949B2 (ja) * | 2018-03-02 | 2022-02-09 | 株式会社ディスコ | 加工装置 |
| CN109514302A (zh) * | 2018-12-11 | 2019-03-26 | 浙江英洛华装备制造有限公司 | 易割片的切割辅助装置 |
| JP6944103B2 (ja) * | 2019-10-22 | 2021-10-06 | エヌティーエンジニアリング株式会社 | 作業機械の加工状態監視方法及びシステム |
| JP7674150B2 (ja) * | 2021-05-20 | 2025-05-09 | 株式会社ディスコ | タッチパネル |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004272837A (ja) * | 2003-03-12 | 2004-09-30 | Toyota Motor Corp | 中間体形状データ作成装置および工具軌跡作成装置および最終体製作用データ作成システム |
| JP2007279914A (ja) * | 2006-04-04 | 2007-10-25 | Hitachinaka Techno Center:Kk | 配線接続管理システム |
| JP2009083016A (ja) * | 2007-09-28 | 2009-04-23 | Disco Abrasive Syst Ltd | 切削装置 |
| JP2012000704A (ja) * | 2010-06-16 | 2012-01-05 | Disco Corp | 切削ブレードの管理方法 |
| JP2012004262A (ja) * | 2010-06-16 | 2012-01-05 | Disco Abrasive Syst Ltd | 切削ブレードの管理方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9012044D0 (en) | 1990-05-30 | 1990-07-18 | British Telecomm | Cellular radio |
| JP5055732B2 (ja) * | 2005-09-15 | 2012-10-24 | 村田機械株式会社 | 段取工具情報表示装置 |
| EP2985664B1 (en) * | 2013-04-11 | 2019-08-21 | Citizen Watch Co., Ltd. | Offset number setting device |
-
2015
- 2015-07-03 JP JP2015134192A patent/JP2017013199A/ja active Pending
-
2016
- 2016-06-02 TW TW105117409A patent/TWI714593B/zh active
- 2016-06-30 KR KR1020160082344A patent/KR20170004880A/ko not_active Ceased
- 2016-06-30 CN CN201610509534.6A patent/CN106313347B/zh active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004272837A (ja) * | 2003-03-12 | 2004-09-30 | Toyota Motor Corp | 中間体形状データ作成装置および工具軌跡作成装置および最終体製作用データ作成システム |
| JP2007279914A (ja) * | 2006-04-04 | 2007-10-25 | Hitachinaka Techno Center:Kk | 配線接続管理システム |
| JP2009083016A (ja) * | 2007-09-28 | 2009-04-23 | Disco Abrasive Syst Ltd | 切削装置 |
| JP2012000704A (ja) * | 2010-06-16 | 2012-01-05 | Disco Corp | 切削ブレードの管理方法 |
| JP2012004262A (ja) * | 2010-06-16 | 2012-01-05 | Disco Abrasive Syst Ltd | 切削ブレードの管理方法 |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018129329A (ja) * | 2017-02-06 | 2018-08-16 | 株式会社ディスコ | 切削装置 |
| KR20190024700A (ko) * | 2017-08-31 | 2019-03-08 | 가부시기가이샤 디스코 | 가공 장치 |
| JP2019046891A (ja) * | 2017-08-31 | 2019-03-22 | 株式会社ディスコ | 加工装置 |
| KR102542087B1 (ko) * | 2017-08-31 | 2023-06-09 | 가부시기가이샤 디스코 | 가공 장치 |
| KR20190085866A (ko) * | 2018-01-11 | 2019-07-19 | 가부시기가이샤 디스코 | 가공 장치 및 가공 수단의 부착 방법 |
| CN110026876A (zh) * | 2018-01-11 | 2019-07-19 | 株式会社迪思科 | 加工装置、以及加工单元的安装方法 |
| JP2019123020A (ja) * | 2018-01-11 | 2019-07-25 | 株式会社ディスコ | 加工装置及び加工手段の取り付け方法 |
| KR102665142B1 (ko) | 2018-01-11 | 2024-05-10 | 가부시기가이샤 디스코 | 가공 장치 및 가공 수단의 부착 방법 |
| JP2020144420A (ja) * | 2019-03-04 | 2020-09-10 | 株式会社ディスコ | 加工装置および加工管理部材 |
| JP7198119B2 (ja) | 2019-03-04 | 2022-12-28 | 株式会社ディスコ | 加工装置 |
| KR20200120513A (ko) | 2019-04-12 | 2020-10-21 | 가부시기가이샤 디스코 | 절삭 장치 |
| JP2020174150A (ja) * | 2019-04-12 | 2020-10-22 | 株式会社ディスコ | 切削装置 |
| JP7229640B2 (ja) | 2019-04-12 | 2023-02-28 | 株式会社ディスコ | 切削装置 |
| CN110450287B (zh) * | 2019-06-26 | 2020-03-10 | 云浮市科特机械有限公司 | 一种石材自动化生产方法 |
| CN110450287A (zh) * | 2019-06-26 | 2019-11-15 | 云浮市科特机械有限公司 | 一种石材自动化生产方法 |
| JP2021154394A (ja) * | 2020-03-25 | 2021-10-07 | Dmg森精機株式会社 | 工具マガジン装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI714593B (zh) | 2021-01-01 |
| TW201707904A (zh) | 2017-03-01 |
| CN106313347B (zh) | 2020-10-09 |
| KR20170004880A (ko) | 2017-01-11 |
| CN106313347A (zh) | 2017-01-11 |
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