JP2017007354A - Device for and method of taking out resin molded article - Google Patents

Abstract

An object of the present invention is to provide a take-out device capable of preventing deformation of a resin molded product when adsorbing and taking out a resin molded product such as a light guide plate. In a take-out device in which a light guide plate, which is a resin molded product molded with a mold, is adsorbed by an adsorbent and is taken out from the mold, the take-out device includes an adsorbent that adsorbs the entire surface of one side of the light guide plate, A vacuum pump for generating a suction force on the optical plate; a suction block material for holding the adsorbent; and a base for holding the suction block material. The suction block material has a plurality of through holes. In addition, the suction block member is provided with an adsorbent so as to cover all the through holes formed in the suction block member, and the adsorbent has an elastic communication having a large number of fine holes formed therein. It is a porous material, The hole diameter of the through-hole of the said suction block material is formed larger than the fine hole diameter of the said communicating porous material, It is characterized by the above-mentioned. [Selection] Figure 2

Description

  The present invention relates to a take-out apparatus capable of adsorbing and taking out a flat resin-molded product employed in a liquid crystal display panel and the like, and more specifically, a resin-molded product attached to a mold. The present invention relates to a take-out device and a take-out method suitable for taking out a light guide plate, which can prevent deformation of the taken out light guide plate when releasing the light guide plate from the mold.

  2. Description of the Related Art In recent years, a light guide plate has been adopted in a display monitor such as a liquid crystal in order to uniformly emit light. Such a light guide plate is provided with a light condensing pattern for reflecting light on one surface of the plate material and a diffusion pattern for collecting light on the front surface to improve luminance on the other surface. In general, resin molded products such as light guide plates are molded by the mold of an injection molding machine, but when such resin molded products are released from the mold, warping and uneven temperature changes If this occurs, the quality of the product may be adversely affected. Therefore, it is desired to prevent such a problem.

  3 and 4 show a schematic configuration of a take-out device that sucks and holds a light guide plate that has been conventionally used, the former being a rear view and the latter being a side view. In the take-out device 100 shown in the figure, nine relatively large suction cups 102 for adsorbing the light guide plate 101 with negative pressure suction force are provided on the base 103, and the light guide plate 101 attached to the mold. When the mold is released, nine suction cups 102 are sucked to one light guide plate 101 and the light guide plate 101 is taken out. As related to such technology, Patent Document 1 (specifications paragraphs [0032], [0035], FIG. 2, FIG. 4, FIG. 5) includes a plurality of relatively large suction cups for adsorbing the light guide plate. A forming apparatus is disclosed.

JP 2003-145593 A

  3 and FIG. 4 and the technique disclosed in Patent Document 1 in which a single light guide plate 101 is attracted by a plurality of relatively large suction cups 102, the suction cup 102 abuts on which suction force is generated. When the suction cup 102 is attracted to the light guide plate 101, a difference occurs in stress with respect to the light guide plate 101, and a warp occurs between the portion where the suction cup is not brought into contact. Further, when the light guide plate 101 having a high temperature of 60 ° C. to 70 ° C. is taken out from the mold immediately after molding by the mold, if a relatively large suction cup 102 is adsorbed to the light guide plate 101, the suction cup 102 is adsorbed. The temperature of the portion of the light guide plate 101 facing the suction cup 102 suddenly decreases due to the relatively large volume of air between the suction cup 102 and the light guide plate 101, and the light guide plate 101 facing the suction cup 102. A so-called kiss mark may be formed in this part, or a temperature difference will occur between the part adsorbed by the suction cup 102 and the part not adsorbed, and the light guide plate will be deformed due to the shrinkage difference accompanying the temperature difference. was there.

  In addition, an injection molding machine is used when molding a resin molded product, but when molding a thin plate-shaped resin molded product such as a light guide plate with a mold of the injection molding machine, a resin is placed in the mold. Since the resin near the gate to be supplied becomes high temperature, the part of the resin molded product near the gate is firmly attached to the surface of the mold as the temperature rises, while the resin molded product is away from the gate. Since this part does not become hot compared with the vicinity of the gate, the adhesion of the mold surface is weakened. Therefore, when releasing a resin molded product from a mold, an important issue is how to take out a resin molded product in which non-uniform adhesion occurs due to the difference in the part in a normal state without causing defects. It was.

  The present invention has been made in view of the above problems, and an extraction device that can suppress deformation of a resin molded product such as a thin light guide plate when adsorbed and extracted. And it aims at providing the taking-out method of a resin molded product.

The invention of this take-out device is
Supplying thermoplastic resin to the mold cavity, holding the resin molded product attached to the mold by suction after molding the resin molded product, and taking out the resin molded product from the mold A device,
A single adsorbent having a plurality of holes formed in contact with the resin molded product, and a negative suction sucked through the plurality of holes when holding the resin molded product in contact with the adsorbent. Pressure generating means,
The adsorbent includes a high-density hole arrangement region in which a plurality of holes are arranged at high density, and a plurality of low-density plurals with a density that is coarser than the plurality of holes in the high-density hole arrangement region. And a low density hole arrangement region in which the holes are arranged.

  In the invention of the take-out apparatus, the adsorbent is an elastic body.

  The surface of the elastic body in the invention of the take-out apparatus is characterized by being fluorine-coated.

  The invention of the take-out device is characterized in that the diameters of the plurality of holes in the high-density hole arrangement region and the plurality of holes in the low-density hole arrangement region are 2 mm or less.

  In the invention of the take-out device, the resin molded product is a flat light guide plate.

The invention of the method for taking out the resin molded product is as follows:
When holding the resin molded product attached to the mold, the high temperature portion of the resin molded product is sucked through a plurality of holes in the high density hole arrangement region, and from the high temperature portion of the resin molded product. The resin molded product is taken out by sucking the low temperature portion of the resin molded product having a low temperature through a plurality of holes in the low density hole arrangement region of the adsorbent.

  In the invention of the method for taking out the resin molded product, the diameters of the plurality of holes in the high-density hole arrangement region and the plurality of holes in the low-density hole arrangement region are formed to be 2 mm or less, and these diameters are The resin molded product is sucked by a plurality of holes in a high density hole arrangement region of 2 mm or less and a plurality of holes in the low density hole arrangement region.

  In the invention of the method for taking out the resin molded product, the resin molded product is a flat light guide plate.

  According to the present invention, when a resin molded product such as a light guide plate is adsorbed by an adsorbent and taken out from the mold, a single adsorbent is brought into contact with one side of the resin molded product to form a relatively formed adsorbent. By applying a small through-hole, the resin molded product can be adsorbed and taken out. Therefore, in the conventional technique of attracting a single light guide plate with a plurality of relatively large suction cups, a portion where the suction cups that generate suction force abut and a suction cup that does not generate suction force do not come into contact. Since a large difference occurs in the stress on the light guide plate, a warp occurs, or when a light guide plate of 60 ° C. to 70 ° C. is taken out of the mold, a relatively large suction cup is adsorbed to the light guide plate. There is a large temperature difference between the part sucked by the suction cup and the part not sucked, and the light guide plate may be deformed due to the shrinkage difference caused by the temperature difference. Can be resolved.

  In addition, an injection molding machine is used when molding a resin molded product, but when molding a thin plate-shaped resin molded product such as a light guide plate with a mold of the injection molding machine, a resin is placed in the mold. Since the resin near the gate to be supplied becomes high temperature, the part of the resin molded product near the gate is firmly attached to the surface of the mold as the temperature rises, while the resin molded product is away from the gate. This part does not become hot compared to the vicinity of the gate, so the adhesion of the surface of the mold is weak. Suction is performed at the hole portion, and the low-temperature portion where the adhesion of the resin molded product to the mold is weak is sucked through a plurality of holes in the low density hole arrangement region. As a result, when the resin molded product is released from the mold by using a suction force according to the difference in adhesion force due to the difference in the part of the resin molded product, the resin molded product is deformed and a defective product is generated. It can be suppressed so that it won't go away.

  Furthermore, since the adsorbent is silicon rubber, and the whole has elasticity, when the adsorbent is brought into contact with a resin molded product such as a light guide plate, the resin molded product can be prevented from being damaged. The resin molded product can be reliably held so as not to fall. Furthermore, since the surface of the adsorbent that comes into contact with the resin molded product is subjected to fluorine coating, the adsorbing surface that comes into contact with the resin molded product of the adsorbent can be formed into fine irregularities, Thereby, the resin molded product attached to the mold of the injection molding machine can be easily released (peeled) from the mold.

It is a front view which shows the state which adsorb | sucked and hold | maintained the light-guide plate with the taking-out apparatus of Example 1. FIG. It is sectional drawing which shows the state which adsorb | sucked and hold | maintained the light-guide plate with the taking-out apparatus of Example 1. FIG. It is a rear view which shows the conventional taking-out apparatus. It is a side view which shows the state which adsorb | sucked and hold | maintained the light-guide plate with the suction cup of the conventional taking-out apparatus. It is a front view which shows the state which adsorb | sucked and hold | maintained the light-guide plate with the taking-out apparatus of Example 2. FIG. It is sectional drawing which shows the state which adsorb | sucked and hold | maintained the light-guide plate with the taking-out apparatus of Example 2. FIG.

  Examples of the present invention will be described below. Of course, it goes without saying that the present invention can be easily applied to configurations other than those described in the embodiments without departing from the spirit of the invention.

  The take-out device 1 of Example 1 shown in FIGS. 1 and 2 is a flat plate of 60 ° C. to 70 ° C. that is attached to a mold of an injection molding machine and has a relatively thin thickness (0.1 mm to 0.00 mm). This is used when the light guide plate 2 as a resin molded product is taken out (released).

  The take-out device 1 includes an adsorbent 3 that adsorbs the entire surface of one surface of a flat light guide plate 2, a vacuum pump 4 that serves as a negative pressure generating means that generates a suction force when adsorbing the light guide plate 2 with the adsorbent 3, and A suction block member 5 that holds the adsorbent 3, a base 6 that holds the suction block member 5, and an arm 7 are provided.

  The adsorbent 3 has an adsorbing surface 3 a that can adsorb and adsorb the entire surface of the light guide plate 2 on one side, and the edge on the other surface 3 b side opposite to the adsorbing surface 3 a. A space (vacuum chamber) 8 is provided in a portion fixed integrally and surrounded by the inner surface of the base 6 and the inner surface of the suction block member 5.

  Further, as shown in FIG. 2, the suction block member 5 has a plurality of through holes 9 formed at equal intervals. The through holes 9 communicate the space 8 and the outside of the suction block member 5. It is formed like this.

  On the outside of the suction block material 5, the adsorbent 3 is mounted so as to cover all the through holes 9 formed in the suction block material 5. The adsorbent 3 is a continuous porous material. In this embodiment, the adsorbent 3 has a large number of micropores having a diameter of 1 mm or less, more specifically 0.5 mm or less, and more specifically about 10 μm to 500 μm (0.5 mm). It is a formed continuous porous material (for example, silicon rubber, urethane rubber) having elasticity, which is different from the independent foam material, and the hole diameter of the through hole 9 of the suction block material 5 is larger than the hole diameter of the continuous porous material. To do.

  Further, the vacuum pump 4 is connected to the base 6 through the tube body 10, and by driving the vacuum pump 4, a negative pressure is applied to the space portion 8 formed by the inner surface of the base 6 and the inner surface of the suction block material 5. Is generated. Then, using the negative pressure, the outside air outside the take-out device 1 is sucked through the holes of the adsorber 3 and the through-holes 9 of the suction block material 5 and hits the adsorbing surface 3a which is the outer surface of the adsorbing body 3. The light guide plate 2 attached to the mold and in contact with the mold is sucked and held. Then, the light guide plate 2 adsorbed by the adsorbing body 3 can be conveyed to a predetermined position or the like by the conveying means (not shown) provided in the take-out device 1 via the arm 7.

  As described above, according to the present extraction device 1, when the light guide plate 2 as a resin molded product is adsorbed by the adsorption body 3 and taken out from the mold, the single adsorption of the entire light guide plate 2 over one side is performed. The body 3 can be brought into contact with and adsorbed and taken out. Therefore, in the conventional technique of attracting a single light guide plate with a plurality of relatively large suction cups, a portion where the suction cups that generate suction force abut and a suction cup that does not generate suction force do not come into contact. Since a large difference occurs in the stress on the light guide plate, a warp occurs, or when a light guide plate of 60 ° C. to 70 ° C. is taken out of the mold, a relatively large suction cup is adsorbed to the light guide plate. There is a large temperature difference between the part sucked by the suction cup and the part not sucked, and the light guide plate may be deformed due to the shrinkage difference caused by the temperature difference. Can be resolved.

  Further, the adsorbent 3 is a continuous porous material made of, for example, silicon rubber or urethane rubber, and the whole has elasticity, so that the light guide plate 2 is damaged when the adsorbent 3 is brought into contact with the light guide plate 2. It is possible to prevent the light guide plate 2 from being dropped, and it is possible to securely hold the light guide plate 2 so as not to fall. Further, the surface of the light guide plate 2 (the surface on which the adsorbing body 3 abuts) and the surface of the adsorbing body 3 (the adsorption surface 3a in contact with the light guiding plate 2) are coated with fluorine in a non-vacuum state. Therefore, the suction surface 3a that is in contact with the light guide plate 2 of the adsorbing body 3 can be formed in a fine concavo-convex shape, whereby the light guide plate 2 attached to the mold or the like of the injection molding machine can be Can be easily released (peeled).

  Further, the adsorbing body 3 of the take-out device 1 is not a plurality but a single adsorbing body 3 and is intended to adsorb and hold a single (one piece) light guide plate 2. The single adsorbing body 3 includes a light guide plate. A plurality of communicating holes for adsorbing 2 are formed. By adopting such a configuration, the size of the adsorbent 3 is larger than the size of the light guide plate 2 so that the adsorbent 3 in surface contact with the light guide plate 2 protrudes outside the light guide plate 2. Even if it is a small size, the light guide plate 2 can be adsorbed. That is, in each of the conventional suction cups, if the suction cup is the same size or larger than the suction cup, the suction target object such as a light guide plate can be sucked by the suction cup. In the case of a smaller size, there is a gap between the suction cup and the suction object, and suction force cannot be generated, so the suction object cannot be sucked and held by the suction cup. Then, as shown in FIG. 2, even if the size of the light guide plate 2 is smaller than the size of the adsorbent 3 and the light guide plate 2 in surface contact with the outside of the adsorbent 3 protrudes, the adsorbent By adopting a communicating porous material as 3, the light guide plate 2 can be adsorbed and held by the adsorbent 3.

  The take-out device 51 of Example 2 shown in FIGS. 5 and 6 is a flat plate of 60 ° C. to 70 ° C. that is attached to a mold of an injection molding machine and has a relatively thin thickness (0.1 mm to 0.00 mm). This is used when taking out (releasing) the light guide plate 52, which is a resin molded product.

  The take-out device 51 includes an adsorbing body 53 having elasticity that adsorbs one surface of a flat light guide plate 52, and a vacuum pump 54 serving as a negative pressure generating means for generating a suction force when adsorbing the light guide plate 52 with the adsorbing body 53. And a base 56 that holds the adsorbent 53 and an arm 57. The adsorbent 53 is made of silicon rubber, and the surface thereof is coated with fluorine in a non-vacuum state, so that fine irregularities (so-called rough state) are formed.

  The adsorbing body 53 has an adsorbing surface 53a on one side with which one side of the light guide plate 52 abuts, and an edge portion on the other surface 53b side opposite to the adsorbing surface 53a is integrally fixed to the base 56. A space (vacuum chamber) 58 is provided in a portion surrounded by the inner surface and the inner surface of the adsorbent 53. Each space 58 is connected by a passage (not shown), and the space 58 can obtain a uniform suction force by the vacuum pump 54.

  Further, as shown in FIGS. 5 and 6, the adsorbent 53 is circular and has a diameter of about 1.0 mm (more specifically, 0 mm, more specifically) so that the space 58 communicates with the outside of the take-out device 51. A plurality of through holes 59 of .5 mm to 2.0 mm) are formed. However, the through hole 59 is determined by the size of the light guide plate 52 and the like.

  The plurality of holes 59a and 59b, which are the plurality of through-holes, are formed in the adsorbent 53 with a high-density hole arrangement region H arranged at a high density and a plurality of holes in the high-density hole arrangement region H. It has a low density hole arrangement region L in which a plurality of holes 59b are arranged at a lower density than the portion 59a.

  In addition, the vacuum pump 54 is connected to the base 56 through the tube body 60. By driving the vacuum pump 54, the inner surface of the base 56 and the inner surface of the adsorbent body 53 are connected via the tube body 60 and the path 61. A negative pressure is generated in the space 58 formed to surround the space 58. Then, when the light guide plate 52 attached to the mold is held and taken out using the negative pressure, the outside air outside the take-out device 51 is sucked through the holes 59a and 59b of the adsorbent 53. The high temperature portion of the light guide plate 52 accompanying the injection filling of the molten resin is sucked by the plurality of holes 59a in the high density hole arrangement region H, and the light guide plate 52 having a temperature lower than that of the high temperature portion of the light guide plate 52. The low temperature portion is sucked through the plurality of holes 59b in the low density hole arrangement region L, and is thereby stuck to the mold that is in contact with the adsorption surface 53a that is the outer surface of the adsorption body 53. The light guide plate 52 is held. Then, the light guide plate 52 adsorbed by the adsorbing body 53 can be conveyed to a predetermined position or the like by an unillustrated conveying means provided in the take-out device 51 via the arm 57.

  As described above, according to the take-out device 51, when the light guide plate 52 as a resin molded product is adsorbed by the adsorption body 53 and taken out from the mold, the single adsorption body 53 is brought into contact with one surface of the light guide plate 52. The light guide plate 52 can be adsorbed and taken out by applying the relatively small through-holes 59 (59a, 59b) formed in the adsorbent 53. Therefore, in the conventional technique of attracting a single light guide plate with a plurality of relatively large suction cups, a portion where the suction cups that generate suction force abut and a suction cup that does not generate suction force do not come into contact. Since a large difference occurs in the stress on the light guide plate, a warp occurs, or when a light guide plate of 60 ° C. to 70 ° C. is taken out of the mold, a relatively large suction cup is adsorbed to the light guide plate. There is a large temperature difference between the part sucked by the suction cup and the part not sucked, and the light guide plate may be deformed due to the shrinkage difference caused by the temperature difference. Can be resolved.

  An injection molding machine is used for molding a resin molded product. However, when a thin resin molded product such as the light guide plate 52 is molded by a mold of the injection molding machine, a resin is placed in the mold. Since the resin near the gate (in this embodiment, the position of the “gate” is in the vicinity of the arm 57) becomes high temperature, the portion of the resin molded product near the gate is heated. In addition to being firmly attached to the surface of the mold, the part of the resin molded product away from the gate does not become hot compared to the vicinity of the gate, so the adhesion of the surface of the mold is weakened. The high-temperature portion where the adhesion of the resin molded product (light guide plate 52) is strong is sucked by the plurality of holes 59a in the high-density hole arrangement region H, and the adhesion of the resin molded product (light guide plate 52) to the mold. The region where the temperature is weak and the temperature is low is a duplication of the low density hole arrangement region L. Sucking at the hole portion 59b. Thus, when the resin molded product (light guide plate 52) is released from the mold by using a suitable suction force according to the difference in adhesion due to the difference in the part of the molded resin molded product (light guide plate 52). In addition, it is possible to prevent the resin molded product (light guide plate 52) from being deformed and generating defective products.

  Further, since the adsorbing body 53 is made of silicon rubber and has elasticity as a whole, the light guiding plate 52 can be prevented from being damaged when the adsorbing body 53 is brought into contact with the light guiding plate 52. The light guide plate 52 can be reliably held so as not to fall. Further, since the surface of the adsorbent 53 with which the light guide plate 52 abuts (the adsorbing surface 53a abutted with the light guide plate 52) is coated with fluorine in a non-vacuum state, the light guide plate 52 of the adsorber 53 is exposed. It is possible to form the suction surface 53a that is in contact with the surface of the mold so as to have fine irregularities, whereby the light guide plate 52 attached to the mold or the like of the injection molding machine can be easily released (separated) from the mold. This can be facilitated.

  As described above, the take-out devices of the first and second embodiments described above can be sucked and held and taken out without deforming the light guide plate that is an optical component, but any member that is not an optical component (for example, Since it can also be applied to a housing of a portable terminal or the like and a cover thereof, it can be effectively used in various technical fields as an extraction device or a holding device. Moreover, although the flat light-guide plate was demonstrated as an example of a resin molded product, it cannot be overemphasized that the shape may not be restricted to a flat thing but a curved thing.

51 Extraction device 52 Light guide plate (resin molded product)
53 Adsorbent 54 Vacuum pump (negative pressure generating means)
56 Base 58 Space 59a A plurality of holes 59b in the high density hole arrangement area A plurality of holes 59b in the low density hole arrangement area H A high density hole arrangement area L A low density hole arrangement area

The present invention relates to a method out take-off及Vito of adsorbed tabular resin molded article of a liquid crystal display (LCD) panel or the like removable resin molded article, and more particularly, resins stuck to the mold The present invention relates to a take-out apparatus and take-out method suitable for taking out a light guide plate, which can prevent deformation of the taken out light guide plate when the light guide plate as a molded product is released from a mold.

  2. Description of the Related Art In recent years, a light guide plate has been adopted in a display monitor such as a liquid crystal in order to uniformly emit light. Such a light guide plate is provided with a light condensing pattern for reflecting light on one surface of the plate material and a diffusion pattern for collecting light on the front surface to improve luminance on the other surface. In general, resin molded products such as light guide plates are molded by the mold of an injection molding machine, but when such resin molded products are released from the mold, warping and uneven temperature changes If this occurs, the quality of the product may be adversely affected. Therefore, it is desired to prevent such a problem.

  3 and 4 show a schematic configuration of a take-out device that sucks and holds a light guide plate that has been conventionally used, the former being a rear view and the latter being a side view. In the take-out device 100 shown in the figure, nine relatively large suction cups 102 for adsorbing the light guide plate 101 with negative pressure suction force are provided on the base 103, and the light guide plate 101 attached to the mold. When the mold is released, nine suction cups 102 are sucked to one light guide plate 101 and the light guide plate 101 is taken out. As related to such technology, Patent Document 1 (specifications paragraphs [0032], [0035], FIG. 2, FIG. 4, FIG. 5) includes a plurality of relatively large suction cups for adsorbing the light guide plate. A forming apparatus is disclosed.

JP 2003-145593 A

  3 and FIG. 4 and the technique disclosed in Patent Document 1 in which a single light guide plate 101 is attracted by a plurality of relatively large suction cups 102, the suction cup 102 abuts on which suction force is generated. When the suction cup 102 is attracted to the light guide plate 101, a difference occurs in stress with respect to the light guide plate 101, and a warp occurs between the portion where the suction cup is not brought into contact. Further, when the light guide plate 101 having a high temperature of 60 ° C. to 70 ° C. is taken out from the mold immediately after molding by the mold, if a relatively large suction cup 102 is adsorbed to the light guide plate 101, the suction cup 102 is adsorbed. The temperature of the portion of the light guide plate 101 facing the suction cup 102 suddenly decreases due to the relatively large volume of air between the suction cup 102 and the light guide plate 101, and the light guide plate 101 facing the suction cup 102. A so-called kiss mark may be formed in this part, or a temperature difference will occur between the part adsorbed by the suction cup 102 and the part not adsorbed, and the light guide plate will be deformed due to the shrinkage difference accompanying the temperature difference. was there.

  In addition, an injection molding machine is used when molding a resin molded product, but when molding a thin plate-shaped resin molded product such as a light guide plate with a mold of the injection molding machine, a resin is placed in the mold. Since the resin near the gate to be supplied becomes high temperature, the part of the resin molded product near the gate is firmly attached to the surface of the mold as the temperature rises, while the resin molded product is away from the gate. Since this part does not become hot compared with the vicinity of the gate, the adhesion of the mold surface is weakened. Therefore, when releasing a resin molded product from a mold, an important issue is how to take out a resin molded product in which non-uniform adhesion occurs due to the difference in the part in a normal state without causing defects. It was.

  The present invention has been made in view of the above problems, and an extraction device that can suppress deformation of a resin molded product such as a thin light guide plate when adsorbed and extracted. And it aims at providing the taking-out method of a resin molded product.

The invention of this take-out device is
The thermoplastic resin supplied to the mold cavity and held by sucking the light guide plate are stuck to the mold after molding the light guide plate as a resin molded article, the light guide plate from said mold A take-out device for taking out,
The take-out device includes an adsorbent that adsorbs the entire surface of one side of a flat light guide plate, negative pressure generating means for generating a suction force when adsorbing the light guide plate with the adsorbent, and a suction block that holds the adsorbent Material and a base for holding the suction block material,
The adsorbent has an adsorbing surface on one side that can adsorb the entire surface of the light guide plate and affixed to the suction block material. And having a space as a vacuum chamber in a portion solidified by the inner surface of the base and the inner surface of the suction block member,
A plurality of through holes are formed in the suction block material, and the through holes are formed so as to communicate the space portion and the outside of the suction block material.
Further, the suction block member is mounted with the adsorbent so as to cover all the through-holes formed in the suction block member, and the adsorbent is an elastic communicating porous material in which a large number of fine holes are formed. And the hole diameter of the through-hole of the said suction block material is formed larger than the fine hole diameter of the said communicating porous material, It is characterized by the above-mentioned.

The invention of the method of taking out the light guide plate as the resin molded product is as follows:
After forming the light guide plate as a resin molded product using the above-mentioned take-out device and holding the light guide plate attached to the mold by suction, when taking out the light guide plate from the mold,
By driving the negative pressure generating means, a negative pressure is generated in the space formed by the inner surface of the base and the inner surface of the suction block material, and the outside air is passed through the fine holes of the adsorbent and the suction block material. The light guide plate adsorbed by the adsorbing body is sucked and held by bringing the adsorbing surface, which is the outer surface of the adsorbing body, into contact with the entire surface of the light guide plate attached to the mold. It is characterized by being conveyed to a predetermined position and taken out.

  According to the present invention, when a resin molded product such as a light guide plate is adsorbed by an adsorbent and taken out from the mold, a single adsorbent is brought into contact with one side of the resin molded product to form a relatively formed adsorbent. By applying a small through-hole, the resin molded product can be adsorbed and taken out. Therefore, in the conventional technique of attracting a single light guide plate with a plurality of relatively large suction cups, a portion where the suction cups that generate suction force abut and a suction cup that does not generate suction force do not come into contact. Since a large difference occurs in the stress on the light guide plate, a warp occurs, or when a light guide plate of 60 ° C. to 70 ° C. is taken out of the mold, a relatively large suction cup is adsorbed to the light guide plate. There is a large temperature difference between the part sucked by the suction cup and the part not sucked, and the light guide plate may be deformed due to the shrinkage difference caused by the temperature difference. Can be resolved.

  In addition, an injection molding machine is used when molding a resin molded product, but when molding a thin plate-shaped resin molded product such as a light guide plate with a mold of the injection molding machine, a resin is placed in the mold. Since the resin near the gate to be supplied becomes high temperature, the part of the resin molded product near the gate is firmly attached to the surface of the mold as the temperature rises, while the resin molded product is away from the gate. This part does not become hot compared to the vicinity of the gate, so the adhesion of the surface of the mold is weak. Suction is performed at the hole portion, and the low-temperature portion where the adhesion of the resin molded product to the mold is weak is sucked through a plurality of holes in the low density hole arrangement region. As a result, when the resin molded product is released from the mold by using a suction force according to the difference in adhesion force due to the difference in the part of the resin molded product, the resin molded product is deformed and a defective product is generated. It can be suppressed so that it won't go away.

  Furthermore, since the adsorbent is silicon rubber, and the whole has elasticity, when the adsorbent is brought into contact with a resin molded product such as a light guide plate, the resin molded product can be prevented from being damaged. The resin molded product can be reliably held so as not to fall. Furthermore, since the surface of the adsorbent that comes into contact with the resin molded product is subjected to fluorine coating, the adsorbing surface that comes into contact with the resin molded product of the adsorbent can be formed into fine irregularities, Thereby, the resin molded product attached to the mold of the injection molding machine can be easily released (peeled) from the mold.

It is a front view which shows the state which adsorb | sucked and hold | maintained the light-guide plate with the taking-out apparatus of Example 1. FIG. It is sectional drawing which shows the state which adsorb | sucked and hold | maintained the light-guide plate with the taking-out apparatus of Example 1. FIG. It is a rear view which shows the conventional taking-out apparatus. It is a side view which shows the state which adsorb | sucked and hold | maintained the light-guide plate with the suction cup of the conventional taking-out apparatus. It is a front view which shows the state which adsorb | sucked and hold | maintained the light-guide plate with the taking-out apparatus of Example 2. FIG. It is sectional drawing which shows the state which adsorb | sucked and hold | maintained the light-guide plate with the taking-out apparatus of Example 2. FIG.

  Examples of the present invention will be described below. Of course, it goes without saying that the present invention can be easily applied to configurations other than those described in the embodiments without departing from the spirit of the invention.

1 and 2 show an embodiment of the present invention. The take-out device 1 of this embodiment is a resin molded product having a relatively thin thickness (about 0.1 mm to 0.5 mm) of a flat plate shape of 60 ° C. to 70 ° C., which is attached to a mold of an injection molding machine. It is used when taking out the light guide plate 2 (release).

  The take-out device 1 includes an adsorbent 3 that adsorbs the entire surface of one surface of a flat light guide plate 2, a vacuum pump 4 that serves as a negative pressure generating means that generates a suction force when adsorbing the light guide plate 2 with the adsorbent 3, and A suction block member 5 that holds the adsorbent 3, a base 6 that holds the suction block member 5, and an arm 7 are provided.

  The adsorbent 3 has an adsorbing surface 3 a that can adsorb and adsorb the entire surface of the light guide plate 2 on one side, and the edge on the other surface 3 b side opposite to the adsorbing surface 3 a. A space (vacuum chamber) 8 is provided in a portion fixed integrally and surrounded by the inner surface of the base 6 and the inner surface of the suction block member 5.

  Further, as shown in FIG. 2, the suction block member 5 has a plurality of through holes 9 formed at equal intervals. The through holes 9 communicate the space 8 and the outside of the suction block member 5. It is formed like this.

  On the outside of the suction block material 5, the adsorbent 3 is mounted so as to cover all the through holes 9 formed in the suction block material 5. The adsorbent 3 is a continuous porous material. In this embodiment, the adsorbent 3 has a large number of micropores having a diameter of 1 mm or less, more specifically 0.5 mm or less, and more specifically about 10 μm to 500 μm (0.5 mm). It is a formed continuous porous material (for example, silicon rubber, urethane rubber) having elasticity, which is different from the independent foam material, and the hole diameter of the through hole 9 of the suction block material 5 is larger than the hole diameter of the continuous porous material. To do.

  Further, the vacuum pump 4 is connected to the base 6 through the tube body 10, and by driving the vacuum pump 4, a negative pressure is applied to the space portion 8 formed by the inner surface of the base 6 and the inner surface of the suction block material 5. Is generated. Then, using the negative pressure, the outside air outside the take-out device 1 is sucked through the holes of the adsorber 3 and the through-holes 9 of the suction block material 5 and hits the adsorbing surface 3a which is the outer surface of the adsorbing body 3. The light guide plate 2 attached to the mold and in contact with the mold is sucked and held. Then, the light guide plate 2 adsorbed by the adsorbing body 3 can be conveyed to a predetermined position or the like by the conveying means (not shown) provided in the take-out device 1 via the arm 7.

  As described above, according to the present extraction device 1, when the light guide plate 2 as a resin molded product is adsorbed by the adsorption body 3 and taken out from the mold, the single adsorption of the entire light guide plate 2 over one side is performed. The body 3 can be brought into contact with and adsorbed and taken out. Therefore, in the conventional technique of attracting a single light guide plate with a plurality of relatively large suction cups, a portion where the suction cups that generate suction force abut and a suction cup that does not generate suction force do not come into contact. Since a large difference occurs in the stress on the light guide plate, a warp occurs, or when a light guide plate of 60 ° C. to 70 ° C. is taken out of the mold, a relatively large suction cup is adsorbed to the light guide plate. There is a large temperature difference between the part sucked by the suction cup and the part not sucked, and the light guide plate may be deformed due to the shrinkage difference caused by the temperature difference. Can be resolved.

  Further, the adsorbent 3 is a continuous porous material made of, for example, silicon rubber or urethane rubber, and the whole has elasticity, so that the light guide plate 2 is damaged when the adsorbent 3 is brought into contact with the light guide plate 2. It is possible to prevent the light guide plate 2 from being dropped, and it is possible to securely hold the light guide plate 2 so as not to fall. Further, the surface of the light guide plate 2 (the surface on which the adsorbing body 3 abuts) and the surface of the adsorbing body 3 (the adsorption surface 3a in contact with the light guiding plate 2) are coated with fluorine in a non-vacuum state. Therefore, the suction surface 3a that is in contact with the light guide plate 2 of the adsorbing body 3 can be formed in a fine concavo-convex shape, whereby the light guide plate 2 attached to the mold or the like of the injection molding machine can be Can be easily released (peeled).

  Further, the adsorbing body 3 of the take-out device 1 is not a plurality but a single adsorbing body 3 and is intended to adsorb and hold a single (one piece) light guide plate 2. The single adsorbing body 3 includes a light guide plate. A plurality of communicating holes for adsorbing 2 are formed. By adopting such a configuration, the size of the adsorbent 3 is larger than the size of the light guide plate 2 so that the adsorbent 3 in surface contact with the light guide plate 2 protrudes outside the light guide plate 2. Even if it is a small size, the light guide plate 2 can be adsorbed. That is, in each of the conventional suction cups, if the suction cup is the same size or larger than the suction cup, the suction target object such as a light guide plate can be sucked by the suction cup. In the case of a smaller size, there is a gap between the suction cup and the suction object, and suction force cannot be generated, so the suction object cannot be sucked and held by the suction cup. Then, as shown in FIG. 2, even if the size of the light guide plate 2 is smaller than the size of the adsorbent 3 and the light guide plate 2 in surface contact with the outside of the adsorbent 3 protrudes, the adsorbent By adopting a communicating porous material as 3, the light guide plate 2 can be adsorbed and held by the adsorbent 3.

5 and 6 show an embodiment as a related invention. The take-out device 51 of this embodiment is a resin molded product with a relatively thin thickness (about 0.1 mm to 0.5 mm) of a flat plate shape of 60 ° C. to 70 ° C., which is attached to a mold of an injection molding machine. This is used when the light guide plate 52 is taken out (released).

  The take-out device 51 includes an adsorbing body 53 having elasticity that adsorbs one surface of a flat light guide plate 52, and a vacuum pump 54 serving as a negative pressure generating means for generating a suction force when adsorbing the light guide plate 52 with the adsorbing body 53. And a base 56 that holds the adsorbent 53 and an arm 57. The adsorbent 53 is made of silicon rubber, and the surface thereof is coated with fluorine in a non-vacuum state, so that fine irregularities (so-called rough state) are formed.

  The adsorbing body 53 has an adsorbing surface 53a on one side with which one side of the light guide plate 52 abuts, and an edge portion on the other surface 53b side opposite to the adsorbing surface 53a is integrally fixed to the base 56. A space (vacuum chamber) 58 is provided in a portion surrounded by the inner surface and the inner surface of the adsorbent 53. Each space 58 is connected by a passage (not shown), and the space 58 can obtain a uniform suction force by the vacuum pump 54.

  Further, as shown in FIGS. 5 and 6, the adsorbent 53 is circular and has a diameter of about 1.0 mm (more specifically, 0 mm, more specifically) so that the space 58 communicates with the outside of the take-out device 51. A plurality of through holes 59 of .5 mm to 2.0 mm) are formed. However, the through hole 59 is determined by the size of the light guide plate 52 and the like.

  The plurality of holes 59a and 59b, which are the plurality of through-holes, are formed in the adsorbent 53 with a high-density hole arrangement region H arranged at a high density and a plurality of holes in the high-density hole arrangement region H. It has a low density hole arrangement region L in which a plurality of holes 59b are arranged at a lower density than the portion 59a.

  In addition, the vacuum pump 54 is connected to the base 56 through the tube body 60. By driving the vacuum pump 54, the inner surface of the base 56 and the inner surface of the adsorbent body 53 are connected via the tube body 60 and the path 61. A negative pressure is generated in the space 58 formed to surround the space 58. Then, when the light guide plate 52 attached to the mold is held and taken out using the negative pressure, the outside air outside the take-out device 51 is sucked through the holes 59a and 59b of the adsorbent 53. The high temperature portion of the light guide plate 52 accompanying the injection filling of the molten resin is sucked by the plurality of holes 59a in the high density hole arrangement region H, and the light guide plate 52 having a temperature lower than that of the high temperature portion of the light guide plate 52. The low temperature portion is sucked through the plurality of holes 59b in the low density hole arrangement region L, and is thereby stuck to the mold that is in contact with the adsorption surface 53a that is the outer surface of the adsorption body 53. The light guide plate 52 is held. Then, the light guide plate 52 adsorbed by the adsorbing body 53 can be conveyed to a predetermined position or the like by an unillustrated conveying means provided in the take-out device 51 via the arm 57.

  As described above, according to the take-out device 51, when the light guide plate 52 as a resin molded product is adsorbed by the adsorption body 53 and taken out from the mold, the single adsorption body 53 is brought into contact with one surface of the light guide plate 52. The light guide plate 52 can be adsorbed and taken out by applying the relatively small through-holes 59 (59a, 59b) formed in the adsorbent 53. Therefore, in the conventional technique of attracting a single light guide plate with a plurality of relatively large suction cups, a portion where the suction cups that generate suction force abut and a suction cup that does not generate suction force do not come into contact. Since a large difference occurs in the stress on the light guide plate, a warp occurs, or when a light guide plate of 60 ° C. to 70 ° C. is taken out of the mold, a relatively large suction cup is adsorbed to the light guide plate. There is a large temperature difference between the part sucked by the suction cup and the part not sucked, and the light guide plate may be deformed due to the shrinkage difference caused by the temperature difference. Can be resolved.

  An injection molding machine is used for molding a resin molded product. However, when a thin resin molded product such as the light guide plate 52 is molded by a mold of the injection molding machine, a resin is placed in the mold. Since the resin near the gate (in this embodiment, the position of the “gate” is in the vicinity of the arm 57) becomes high temperature, the portion of the resin molded product near the gate is heated. In addition to being firmly attached to the surface of the mold, the part of the resin molded product away from the gate does not become hot compared to the vicinity of the gate, so the adhesion of the surface of the mold is weakened. The high-temperature portion where the adhesion of the resin molded product (light guide plate 52) is strong is sucked by the plurality of holes 59a in the high-density hole arrangement region H, and the adhesion of the resin molded product (light guide plate 52) to the mold. The region where the temperature is weak and the temperature is low is a duplication of the low density hole arrangement region L. Sucking at the hole portion 59b. Thus, when the resin molded product (light guide plate 52) is released from the mold by using a suitable suction force according to the difference in adhesion due to the difference in the part of the molded resin molded product (light guide plate 52). In addition, it is possible to prevent the resin molded product (light guide plate 52) from being deformed and generating defective products.

  Further, since the adsorbing body 53 is made of silicon rubber and has elasticity as a whole, the light guiding plate 52 can be prevented from being damaged when the adsorbing body 53 is brought into contact with the light guiding plate 52. The light guide plate 52 can be reliably held so as not to fall. Further, since the surface of the adsorbent 53 with which the light guide plate 52 abuts (the adsorbing surface 53a abutted with the light guide plate 52) is coated with fluorine in a non-vacuum state, the light guide plate 52 of the adsorber 53 is exposed. It is possible to form the suction surface 53a that is in contact with the surface of the mold so as to have fine irregularities, whereby the light guide plate 52 attached to the mold or the like of the injection molding machine can be easily released (separated) from the mold. This can be facilitated.

  As described above, the take-out devices of the first and second embodiments described above can be sucked and held and taken out without deforming the light guide plate that is an optical component, but any member that is not an optical component (for example, Since it can also be applied to a housing of a portable terminal or the like and a cover thereof, it can be effectively used in various technical fields as an extraction device or a holding device. Moreover, although the flat light-guide plate was demonstrated as an example of a resin molded product, it cannot be overemphasized that the shape may not be restricted to a flat thing but a curved thing.

51 Extraction device 52 Light guide plate (resin molded product)
53 Adsorbent 54 Vacuum pump (negative pressure generating means)
56 Base 58 Space 59a A plurality of holes 59b in the high density hole arrangement area A plurality of holes 59b in the low density hole arrangement area H A high density hole arrangement area L A low density hole arrangement area

Claims (8)

Supplying thermoplastic resin to the mold cavity, holding the resin molded product attached to the mold by suction after molding the resin molded product, and taking out the resin molded product from the mold A single adsorbent body formed with a plurality of holes abutting against the resin molded product, and the plurality of holes when holding the resin molded product abutted against the adsorbent Negative pressure generating means for sucking through the section,
The adsorbent includes a high-density hole arrangement region in which a plurality of holes are arranged at high density, and a plurality of low-density plurals with a density that is coarser than the plurality of holes in the high-density hole arrangement region. And a low-density hole arrangement region in which the holes are arranged.   The take-out apparatus according to claim 1, wherein the adsorbent is an elastic body.   The take-out apparatus according to claim 2, wherein the surface of the elastic body is coated with fluorine.   4. The diameter of the plurality of holes in the high-density hole arrangement region and the plurality of holes in the low-density hole arrangement region is formed to be 2 mm or less. The take-out device described in 1.   The take-out apparatus according to any one of claims 1 to 4, wherein the resin molded product is a flat light guide plate.   The take-out apparatus according to any one of claims 1 to 4, wherein when holding the resin molded product attached to the mold, the high-temperature portion of the resin molded product is placed in the high-density hole arrangement region. And sucking the low temperature part of the resin molded product having a temperature lower than that of the high temperature part of the resin molded product through the plurality of holes in the low density hole arrangement region of the adsorbent, A method for removing a resin molded product, comprising: taking out the resin molded product.   The diameters of the plurality of holes in the high-density hole arrangement region and the plurality of holes in the low-density hole arrangement region are formed to be 2 mm or less, and the diameter of the high-density hole arrangement region in which the diameter is 2 mm or less The method of taking out a resin molded product according to claim 6, wherein the resin molded product is sucked by a plurality of holes and a plurality of holes in the low density hole arrangement region.   The method for taking out a resin molded product according to claim 7, wherein the resin molded product is a flat light guide plate.

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