JP2017090090A - Radiation detector and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiation detector and a manufacturing method thereof which can improve the reliability of an adhesion layer.SOLUTION: A radiation detector includes: an array substrate having a substrate and a plurality of photoelectric conversion elements provided on one surface side of the substrate; scintillator layers provided on the plurality of photoelectric conversion elements and converting radiation rays into fluoresce; a surface part opposingly facing the upper surface of the scintillator layer; a moisture-proof body including a peripheral surface part provided on a peripheral edge of the surface part and opposingly facing the side surface of the scintillator layer and an annular collar part provided on an end part opposite to the surface part side and opposingly facing the array substrate; an adhesion layer provided between the collar part and the array substrate; and a support layer between the collar part and the array substrate and provided on the scintillator layer side rather than on the adhesion layer and containing the same resin as the resin contained in the adhesion layer.SELECTED DRAWING: Figure 2

Description

  Embodiments described herein relate generally to a radiation detector and a manufacturing method thereof.

An example of the radiation detector is an X-ray detector. In an X-ray detector, X-rays are converted into fluorescence, that is, visible light by a scintillator layer, and this fluorescence is signaled using a photoelectric conversion element such as an amorphous silicon (a-Si) photodiode or a CCD (Charge Coupled Device). An X-ray image is acquired by converting the charge.
In some cases, a reflective layer is further provided on the scintillator layer in order to improve the use efficiency of fluorescence and improve sensitivity characteristics.

In order to suppress degradation of resolution characteristics due to moisture or the like, the scintillator layer and the reflective layer need to be isolated from the external atmosphere. In particular, when the scintillator layer is made of CsI (cesium iodide): Tl (thallium), CsI: Na (sodium), or the like, there is a possibility that degradation of resolution characteristics due to moisture or the like may increase.
Therefore, as a structure capable of obtaining high moisture-proof performance, a technique for covering the scintillator layer and the reflective layer with a hat-shaped moisture-proof body made of aluminum has been proposed.
In the hat-shaped moisture-proof body, the collar portion of the moisture-proof body is bonded to the surface of the array substrate.

  Here, the plurality of photoelectric conversion elements, the scintillator layer, the reflective layer, and the moisture-proof body are provided in the central region (effective pixel area) of the array substrate. A plurality of wiring pads to which the flexible printed circuit board is connected are provided in the peripheral area of the array substrate. The photoelectric conversion element provided in the central region of the array substrate and the wiring pad provided in the peripheral region of the array substrate are electrically connected by a control line and a data line.

Therefore, the collar portion of the moisture-proof body is bonded onto the control line and the data line. Generally, the adhesive has an insulating property. Therefore, even if the collar portion of the moisture-proof body formed of aluminum is bonded on the control line and the data line, no short circuit or the like occurs.
However, an adhesive is applied to the collar or the array substrate in an environment of atmospheric pressure or higher, and then the collar and the array substrate are pressure-bonded via the adhesive in an environment where the pressure is lower than the atmospheric pressure. When the adhesive is cured in the above environment, the tip end side of the collar portion is lifted, and the scintillator layer 5 side of the collar portion may come into contact with the array substrate.
When the collar portion contacts the array substrate, the insulation between the collar portion, the control line, and the data line may be deteriorated.

Further, when the collar portion is deformed, the thickness of the adhesive layer formed between the collar portion and the array substrate becomes non-uniform.
When the thickness of the adhesive layer is not uniform, a force is easily applied in the direction of lifting the collar portion with the thinned portion as a fulcrum, and the adhesive layer may be peeled off.
In addition, the adhesive may move toward the scintillator layer before the adhesive is cured, and the width dimension of the adhesive layer below the collar portion may be shortened.

When the thickness of the adhesive layer becomes uneven or the width dimension of the adhesive layer becomes short, it is difficult to stabilize the adhesion (adhesive force) between the collar portion and the array substrate. For this reason, the reliability of the adhesive layer may be reduced.
For this reason, development of a technique capable of improving the reliability of the adhesive layer has been desired.

JP 2012-37454 A

  The problem to be solved by the present invention is to provide a radiation detector capable of improving the reliability of an adhesive layer and a manufacturing method thereof.

  A radiation detector according to an embodiment is provided on an array substrate having a substrate and a plurality of photoelectric conversion elements provided on one surface side of the substrate, and provided on the plurality of photoelectric conversion elements. A scintillator layer that converts to fluorescence, a surface portion that faces the top surface of the scintillator layer, a peripheral surface portion that is provided at the periphery of the surface portion and that faces a side surface of the scintillator layer, and the surface portion side of the peripheral surface portion A moisture-proof body having an annular collar portion provided at an opposite end portion and facing the array substrate, an adhesive layer provided between the collar portion and the array substrate, the collar portion and the array A support layer that is provided between the substrate and the scintillator layer side of the adhesive layer and includes the same resin as the resin included in the adhesive layer.

1 is a schematic perspective view for illustrating an X-ray detector 1 according to the present embodiment. 1 is a schematic cross-sectional view of an X-ray detector 1. FIG. (A) is a schematic front view of the moisture-proof body 7. FIG. (B) is a schematic side view of the moisture-proof body 7. (A), (b) is a schematic cross section for demonstrating adhesion | attachment of the moistureproof body 7 which concerns on a comparative example. (A), (b) is a schematic cross section for demonstrating adhesion | attachment of the moistureproof body 7 which concerns on this Embodiment. (A)-(c) is a schematic cross section for illustrating the deformation | transformation of the collar part 7c. It is a schematic cross section for illustrating the case where adhesives 18 and 28 are applied.

Hereinafter, embodiments will be illustrated with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
Moreover, the radiation detector according to the embodiment of the present invention can be applied to various types of radiation such as γ rays in addition to X-rays. Here, as an example, a case of X-rays as a representative example of radiation will be described as an example. Therefore, by replacing “X-ray” in the following embodiments with “other radiation”, the present invention can be applied to other radiation.

(First embodiment)
First, the X-ray detector 1 according to the first embodiment is illustrated.
FIG. 1 is a schematic perspective view for illustrating an X-ray detector 1 according to the present embodiment.
In order to avoid complication, in FIG. 1, the protective layer 2 f, the reflective layer 6, the moisture-proof body 7, the adhesive layer 8, the support layer 10, and the like are omitted.
FIG. 2 is a schematic cross-sectional view of the X-ray detector 1.
In order to avoid complication, the signal processing unit 3 and the image transmission unit 4 are not illustrated in FIG.
The X-ray detector 1 that is a radiation detector is an X-ray flat sensor that detects an X-ray image that is a radiation image. The X-ray detector 1 can be used for general medical purposes, for example. However, the use of the X-ray detector 1 is not limited to general medical use.

As shown in FIGS. 1 and 2, the X-ray detector 1 includes an array substrate 2, a signal processing unit 3, an image transmission unit 4, a scintillator layer 5, a reflective layer 6, a moisture-proof body 7, an adhesive layer 8, and a support plate. 9 and a support layer 10 are provided.
The array substrate 2 includes a substrate 2a, a photoelectric conversion unit 2b, a control line (or gate line) 2c1, a data line (or signal line) 2c2, a wiring pad 2d1, a wiring pad 2d2, and a protective layer 2f.

The substrate 2a has a plate shape and is made of a translucent material such as non-alkali glass.
A plurality of photoelectric conversion units 2b are provided on one surface of the substrate 2a.
The photoelectric conversion unit 2b has a rectangular shape and is provided in a region defined by the control line 2c1 and the data line 2c2. The plurality of photoelectric conversion units 2b are arranged in a matrix.
One photoelectric conversion unit 2b corresponds to one pixel.

The photoelectric conversion unit 2b is provided with a photoelectric conversion element 2b1 and a thin film transistor (TFT) 2b2 which is a switching element.
The photoelectric conversion unit 2b can be provided with a storage capacitor (not shown) that stores the signal charge converted in the photoelectric conversion element 2b1. The storage capacitor (not shown) has, for example, a rectangular flat plate shape and can be provided under the thin film transistor 2b2. However, depending on the capacitance of the photoelectric conversion element 2b1, the photoelectric conversion element 2b1 can also serve as a storage capacitor (not shown).

The photoelectric conversion element 2b1 can be, for example, a photodiode.
The thin film transistor 2b2 performs switching between accumulation and emission of electric charges generated when fluorescence enters the photoelectric conversion element 2b1. The thin film transistor 2b2 can include a semiconductor material such as amorphous silicon (a-Si) or polysilicon (P-Si). The thin film transistor 2b2 includes a gate electrode 2b2a, a source electrode 2b2b, and a drain electrode 2b2c. Gate electrode 2b2a of thin film transistor 2b2 is electrically connected to corresponding control line 2c1. The source electrode 2b2b of the thin film transistor 2b2 is electrically connected to the corresponding data line 2c2. The drain electrode 2b2c of the thin film transistor 2b2 is electrically connected to the corresponding photoelectric conversion element 2b1 and a storage capacitor (not shown).

A plurality of control lines 2c1 are provided in parallel with each other at a predetermined interval. For example, the control line 2c1 extends in the row direction.
One control line 2c1 is electrically connected to one of a plurality of wiring pads 2d1 provided near the periphery of the substrate 2a. One wiring pad 2d1 is electrically connected to one of a plurality of wirings provided on the flexible printed board 2e1. The other ends of the plurality of wirings provided on the flexible printed circuit board 2e1 are electrically connected to a control circuit (not shown) provided on the signal processing unit 3, respectively.

A plurality of data lines 2c2 are provided in parallel with each other at a predetermined interval. The data line 2c2 extends, for example, in the column direction orthogonal to the row direction.
One data line 2c2 is electrically connected to one of a plurality of wiring pads 2d2 provided near the periphery of the substrate 2a. One wiring pad 2d2 is electrically connected to one of a plurality of wirings provided on the flexible printed board 2e2. The other ends of the plurality of wirings provided on the flexible printed board 2e2 are electrically connected to an amplification / conversion circuit (not shown) provided on the signal processing unit 3, respectively.

The protective layer 2f has a first layer 2f1 and a second layer 2f2. The first layer 2f1 is provided so as to cover the photoelectric conversion unit 2b, the control line 2c1, and the data line 2c2. The second layer 2f2 is provided on the first layer 2f1.
The first layer 2f1 and the second layer 2f2 can be formed of an insulating material.
The first layer 2f1 and the second layer 2f2 can be formed of an inorganic material such as silicon nitride (SiN), for example.
The first layer 2f1 and the second layer 2f2 can also be formed of an organic material such as acrylic resin, polyethylene, polypropylene, butyral, for example.

Note that the first layer 2f1 and the second layer 2f2 can be formed of the same material, or can be formed of different materials. For example, the first layer 2f1 can be formed from an inorganic material, and the second layer 2f2 can be formed from an organic material. The first layer 2f1 can be formed from an organic material, and the second layer 2f2 can be formed from an inorganic material. In this case, if the second layer 2f2 is formed of an organic material, the adhesion (adhesive force) between the second layer 2f2 and the scintillator layer 5 can be improved. If the second layer 2f2 is formed of an inorganic material, the adhesion (adhesion) between the second layer 2f2 and the adhesive layer 8 can be improved.
Alternatively, the region where the scintillator layer 5 of the second layer 2f2 is provided may be formed from an organic material, and the region outside the region where the scintillator layer 5 of the second layer 2f2 is provided may be formed from an inorganic material. In this way, the adhesion force (adhesion force) between the second layer 2f2 and the scintillator layer 5 and the adhesion force (adhesion force) between the second layer 2f2 and the adhesion layer 8 can be improved. .

The signal processing unit 3 is provided to face the array substrate 2 with the support plate 9 interposed therebetween.
The signal processing unit 3 is provided with a control circuit (not shown) and an amplification / conversion circuit (not shown).
A control circuit (not shown) controls the operation of each thin film transistor 2b2, that is, the on state and the off state. For example, a control circuit (not shown) sequentially applies the control signal S1 to each control line 2c1 via the flexible printed board 2e1, the wiring pad 2d1, and the control line 2c1. The thin film transistor 2b2 is turned on by the control signal S1 applied to the control line 2c1, and the image data signal S2 from the photoelectric conversion unit 2b can be received.

An amplification / conversion circuit (not shown) includes, for example, a plurality of charge amplifiers, a parallel / serial converter, and an analog / digital converter.
The plurality of charge amplifiers are electrically connected to each data line 2c2.
The plurality of parallel / serial converters are electrically connected to the plurality of charge amplifiers, respectively.
The plurality of analog / digital converters are electrically connected to the plurality of parallel / serial converters, respectively.

  A plurality of charge amplifiers (not shown) sequentially receive the image data signal S2 from each photoelectric conversion unit 2b via the data line 2c2, the wiring pad 2d2, and the flexible printed board 2e2.

A plurality of charge amplifiers (not shown) sequentially amplify the received image data signal S2.
A plurality of parallel / serial converters (not shown) sequentially convert the amplified image data signal S2 into a serial signal.
A plurality of analog / digital converters (not shown) sequentially convert the image data signal S2 converted into a serial signal into a digital signal.

  The image transmission unit 4 is electrically connected to an amplification / conversion circuit (not shown) of the signal processing unit 3 via a wiring 4a. The image transmission unit 4 may be integrated with the signal processing unit 3.

  The image transmission unit 4 configures an X-ray image based on the image data signal S2 converted into a digital signal by a plurality of analog / digital converters (not shown). The configured X-ray image data is output from the image transmission unit 4 to an external device.

The scintillator layer 5 is provided on the plurality of photoelectric conversion elements 2b1, and converts incident X-rays into fluorescence, that is, visible light.
The scintillator layer 5 is provided so as to cover an area (effective pixel area) where the plurality of photoelectric conversion elements 2b1 are provided.

  The scintillator layer 5 includes, for example, thallium activated cesium iodide (cesium iodide (CsI): thallium (Tl)), thallium activated sodium iodide (sodium iodide (NaI): thallium (Tl)), europium activated cesium bromide (Cesium bromide (CsBr): Europium (Eu)) or the like can be used.

The scintillator layer 5 is an aggregate of columnar crystals.
The scintillator layer 5 made of an aggregate of columnar crystals can be formed using, for example, a vacuum deposition method.
The thickness dimension of the scintillator layer 5 can be about 600 μm, for example. The thickness dimension of the pillars (pillars) of the columnar crystals can be, for example, about 8 μm to 12 μm on the outermost surface.

The scintillator layer 5 can also be formed using, for example, terbium activated gadolinium sulfate (Gd ₂ O ₂ S / Tb, or GOS). In this case, for example, the scintillator layer 5 can be formed as follows. First, particles made of terbium-activated gadolinium sulfate are mixed with a binder material. Next, a mixed material is applied so as to cover the effective pixel area. Next, the applied material is baked. Next, a groove is formed in the fired material using a blade dicing method or the like. At this time, a matrix-like groove portion can be formed so that the quadrangular columnar scintillator layer 5 is provided for each of the plurality of photoelectric conversion portions 2b.

  Further, the groove between the columnar crystals or between the square columnar scintillator layers 5 can be filled with air (air) or an inert gas such as nitrogen gas for preventing oxidation. Moreover, you may make it the groove part between columnar crystals and between the square columnar scintillator layers 5 be in a vacuum state.

  The reflective layer 6 is provided in order to improve the use efficiency of fluorescence and improve sensitivity characteristics. In other words, the reflection layer 6 reflects the light emitted from the scintillator layer 5 toward the side opposite to the side where the photoelectric conversion unit 2b is provided, and is directed toward the photoelectric conversion unit 2b.

The reflective layer 6 covers the X-ray incident side of the scintillator layer 5.
The reflective layer 6 can be provided on at least the upper surface 5 a of the scintillator layer 5. The reflective layer 6 can also be provided on the side surface 5 b of the scintillator layer 5.

The reflective layer 6 can be formed, for example, by applying light scattering particles made of titanium oxide (TiO ₂ ) or the like, a material in which a resin and a solvent are mixed onto the scintillator layer 5 and drying the material. .
The reflective layer 6 can also be formed by depositing a layer made of a metal having a high light reflectance such as a silver alloy or aluminum on the scintillator layer 5.
Moreover, the reflective layer 6 can also be formed using the board which the surface consists of a metal with high light reflectivity, such as a silver alloy and aluminum, for example.

The reflective layer 6 illustrated in FIG. 2 is formed by applying a material prepared by mixing a submicron powder made of titanium oxide, a binder resin, and a solvent to the X-ray incident side of the scintillator layer 5. Is formed by drying.
In this case, the thickness dimension of the reflective layer 6 can be about 100 μm.
The reflective layer 6 is not necessarily required, and may be provided according to characteristics such as resolution and luminance required for the X-ray detector 1.

Further, a fluorescent absorption layer can be provided in place of the reflective layer 6.
That is, the reflective layer 6 or the fluorescence absorption layer can be provided at least between the surface portion 7 a and the scintillator layer 5. In addition, the reflective layer 6 or the fluorescence absorption layer can be provided between the peripheral surface portion 7 b and the scintillator layer 5.

The fluorescence absorption layer absorbs the light emitted from the scintillator layer 5 toward the side opposite to the side where the photoelectric conversion unit 2b is provided, and does not go to the photoelectric conversion unit 2b.
If a fluorescent absorption layer is provided, the luminance is lowered, but the resolution can be improved.
The fluorescent absorption layer can be formed, for example, by forming a layer made of Fe ₃ O ₄ , CuO, AlTiN or the like on the X-ray incident side of the scintillator layer 5.
The fluorescent absorption layer can also be formed using a black resin sheet or the like.
In the following, a case where the reflective layer 6 is provided will be exemplified.

The moisture-proof body 7 is provided to suppress deterioration of the characteristics of the reflective layer 6 and the scintillator layer 5 due to moisture contained in the air.
The moisture-proof body 7 covers the scintillator layer 5 and the periphery of the area on the array substrate 2 where the scintillator layer 5 is provided.
For example, when the reflective layer 6 is provided, the moisture-proof body 7 covers the periphery of the area where the reflective layer 6 and the scintillator layer 5 on the array substrate 2 are provided.
For example, when the reflective layer 6 is not provided, the moisture-proof body 7 covers the periphery of the upper surface 5a of the scintillator layer 5, the side surface 5b of the scintillator layer 5, and the region on the array substrate 2 where the scintillator layer 5 is provided. ing.

There may be a gap between the moisture-proof body 7 and the reflective layer 6 or the like, or the moisture-proof body 7 and the reflective layer 6 may be in contact with each other.
For example, if the hat-shaped moisture-proof body 7 and the array substrate 2 are sealed in an environment where the pressure is lower than the atmospheric pressure, the moisture-proof body 7 and the reflective layer 6 can be brought into contact with each other.

FIG. 3A is a schematic front view of the moisture-proof body 7.
FIG. 3B is a schematic side view of the moisture-proof body 7.
As shown in FIGS. 3A and 3B, the moisture-proof body 7 has a hat shape, and has a surface portion 7a, a peripheral surface portion 7b, and a collar portion (cage) portion 7c.
The moisture-proof body 7 can be formed by integrally molding the surface portion 7a, the peripheral surface portion 7b, and the collar portion 7c.

The surface portion 7 a faces the upper surface 5 a of the scintillator layer 5.
The peripheral surface portion 7b is provided so as to surround the periphery of the surface portion 7a. The peripheral surface portion 7b extends from the periphery of the surface portion 7a toward the array substrate 2 side. The peripheral surface portion 7 b is provided at the periphery of the surface portion 7 a and faces the side surface 5 b of the scintillator layer 5.

The collar part 7c is provided so that the edge part on the opposite side to the surface part 7a side of the surrounding surface part 7b may be enclosed. The collar part 7c is extended toward the outer side from the edge part of the surrounding surface part 7b. The collar portion 7c has an annular shape. The collar portion 7c is provided at the end of the peripheral surface portion 7b opposite to the surface portion 7a side, and faces the array substrate 2.
The collar portion 7 c is bonded to the surface of the array substrate 2.

If the moisture-proof body 7 has a hat shape, the rigidity can be increased.
Further, when the moisture-proof body 7 is bonded to the array substrate 2, positioning can be performed using a three-dimensional shape composed of the surface portion 7a and the peripheral surface portion 7b.
Therefore, it is possible to improve workability and adhesion accuracy when the moisture-proof body 7 is bonded to the surface of the array substrate 2.

The moisture-proof body 7 (surface portion 7a, peripheral surface portion 7b, and collar portion 7c) can be formed from a material having a small moisture permeability coefficient.
The moistureproof body 7 can include, for example, a metal material.
The moisture-proof body 7 can be formed from, for example, a metal material such as a metal containing copper, a metal containing aluminum, stainless steel, or Kovar material. The moisture-proof body 7 can also be formed from, for example, a laminated film in which a resin film and a metal film are laminated. In this case, the resin film may be formed of, for example, polyimide resin, epoxy resin, polyethylene terephthalate resin, Teflon (registered trademark), low density polyethylene, high density polyethylene, elastic rubber, or the like. The metal film may be formed of a metal material such as a metal containing copper, a metal containing aluminum, stainless steel, or Kovar material, for example.
In this case, if the moisture-proof body 7 is formed using a metal material whose effective moisture permeability coefficient is almost zero, the moisture that permeates the moisture-proof body 7 can be almost completely eliminated.

Further, the thickness dimension of the moisture-proof body 7 can be determined in consideration of X-ray absorption and rigidity. In this case, if the moisture-proof body 7 is too thick, X-ray absorption becomes too large. If the thickness of the moisture-proof body 7 is too thin, the rigidity is reduced and the moisture-proof body 7 is easily damaged.
The moisture-proof body 7 can be formed using, for example, an aluminum foil having a thickness dimension of 0.1 mm.

As shown in FIG. 2, the adhesive layer 8 is provided between the collar portion 7 c and the array substrate 2. The adhesive layer 8 adheres the moisture-proof body 7 and the array substrate 2.
The adhesive layer 8 includes, for example, an ultraviolet curable adhesive, a delayed curable adhesive (an ultraviolet curable adhesive in which a curing reaction becomes apparent after a certain time after ultraviolet irradiation), a natural (normal temperature) curable adhesive, And any one of the thermosetting adhesives can be cured.

The support plate 9 is provided between the array substrate 2 and the signal processing unit 3.
The array substrate 2 is provided on one surface of the support plate 9, and the signal processing unit 3 is provided on the other surface.
The support plate 9 is made of a material that absorbs X-rays such as a lead plate.
The signal processing unit 3 is provided with a control circuit and an amplification / conversion circuit that have low resistance to X-rays. Therefore, by providing a support plate 9 that absorbs X-rays, the control circuit and the amplification / conversion circuit are protected.
The support plate 9 is held inside a housing (not shown) that houses the X-ray detector 1.

The support layer 10 is provided between the collar portion 7 c and the array substrate 2. The support layer 10 is provided closer to the scintillator layer 5 than the adhesive layer 8.
The support layer 10 supports the collar portion 7c and makes the thickness of the adhesive layer 8 as uniform as possible.
The support layer 10 can be provided intermittently around the scintillator layer 5.
The support layer 10 preferably has a frame shape surrounding the scintillator layer 5. If the support layer 10 has a frame shape, the adhesive 18 can be prevented from flowing out to the scintillator layer 5 side when the adhesive layer 8 is formed.

  The support layer 10 can have insulating properties. If the support layer 10 has an insulating property, the insulating property between the collar portion 7c formed of aluminum or the like, and the control line 2c1 and the data line 2c2 can be improved.

As will be described later, the support layer 10 can be formed using, for example, an adhesive 28 having a high viscosity.
The support layer 10 can also be formed by increasing the viscosity of the adhesive 18 in the region on the scintillator layer 5 side after applying the adhesive 18.
The support layer 10 can contain the same resin as that contained in the adhesive layer 8.

Moreover, the support layer 10 can also be made into the linear body or frame-shaped body formed, for example from the inorganic material or the organic material.
Examples of the inorganic material include ceramic materials such as SiO ₂ , SiON, Al ₂ O ₃ , and ZrO ₂ , water glass, quartz glass, and liquid crystal glass.
Inorganic materials have a low moisture permeability coefficient compared to organic materials, so that it is difficult for water to pass through. Therefore, if the support layer 10 is formed using an inorganic material, moisture can be prevented from entering the moisture-proof body 7.
The organic material can be, for example, acrylic resin, polyethylene, polypropylene, butyral, and the like.
However, if the support layer 10 is formed using the adhesives 18 and 28, the support layer 10 can have the function of the adhesive layer 8.
Details regarding the method of forming the support layer 10 will be described later.

Next, the operation of the support layer 10 will be further described.
4A and 4B are schematic cross-sectional views for illustrating the adhesion of the moisture-proof body 7 according to the comparative example.
4A and 4B show a case where the support layer 10, the high viscosity region of the adhesive 18, and the high viscosity adhesive 28 are not provided.
First, the adhesive 18 is applied to the collar portion 7c.
Next, as shown in FIG. 4A, the scintillator layer 5 is covered with a moisture-proof body 7 in an environment where the pressure is lower than the atmospheric pressure. Subsequently, the collar portion 7 c and the array substrate 2 are pressure-bonded via the adhesive 18. At this time, the thickness dimension of the adhesive 18 is set within a predetermined range.

Next, as shown in FIG. 4B, the adhesive 18 is cured to bond the moisture-proof body 7 to the array substrate 2 in an environment at atmospheric pressure or higher.
Then, the moisture-proof body 7 is pressed by the external air pressure, and the moisture-proof body 7 and the reflective layer 6 come into contact with each other.
However, when the moisture-proof body 7 is pressed by the external pressure, the collar portion 7c may be deformed. For example, the tip side of the collar portion 7c is lifted, and the scintillator layer 5 side of the collar portion 7c may approach the array substrate 2.
When the collar portion 7c is deformed, the thickness of the adhesive layer 8 formed between the collar portion 7c and the array substrate 2 becomes non-uniform.

If the thickness of the adhesive layer 8 is not uniform, the portion between the collar portion 7c and the control line 2c1 and the data line 2c2 in the portion where the thickness is reduced (for example, below the connecting portion between the collar portion 7c and the peripheral surface portion 7b). There is a risk that the insulation of the steel will deteriorate.
Moreover, it becomes easy to apply force in the direction which lifts the collar part 7c by using the part where thickness became thin as a fulcrum, and there exists a possibility that peeling of the contact bonding layer 8 may arise.
In addition, the adhesive 18 may move toward the scintillator layer 5 until the adhesive 18 is cured, and the width dimension of the adhesive layer 8 below the collar portion 7c may be shortened.

  When the thickness of the adhesive layer 8 becomes uneven or the width dimension of the adhesive layer 8 becomes short, it is difficult to stabilize the adhesive force (adhesive force) between the collar portion 7c and the array substrate 2. Become. Therefore, the reliability of the adhesive layer 8 may be reduced.

FIGS. 5A and 5B are schematic cross-sectional views for illustrating the adhesion of the moisture-proof body 7 according to the present embodiment.
5A and 5B show the case where any one of the support layer 10, the high-viscosity region of the adhesive 18, and the high-viscosity adhesive 28 is provided.
First, the adhesive 18 is applied to at least one of the collar portion 7 c of the moisture-proof body 7 and the periphery of the scintillator layer 5.
Subsequently, the viscosity of the region on the peripheral surface portion 7 b side of the adhesive 18 applied to the collar portion 7 c or the region on the scintillator layer 5 side of the adhesive 18 applied around the scintillator layer 5 is increased.
Alternatively, the adhesive 18 and the adhesive 28 having a higher viscosity than the adhesive 18 are applied to at least one of the collar portion 7 c of the moisture-proof body 7 and the periphery of the scintillator layer 5. In this case, the adhesive 28 is applied to the peripheral surface portion 7 b side of the adhesive 18 applied to the collar portion 7 c or to the scintillator layer 5 side of the adhesive 18 applied around the scintillator layer 5.
Alternatively, the support layer 10 can be provided on at least one of the collar portion 7 c and the array substrate 2.

Next, as shown in FIG. 5A, the moisture-proof body 7 is placed on the scintillator layer 5 in an environment where the pressure is lower than the atmospheric pressure.
Next, as shown in FIG. 5B, the adhesive 18 is cured to bond the moisture-proof body 7 to the array substrate 2 in an environment at atmospheric pressure or higher.
In addition, the support layer 10 is formed by curing the high-viscosity region of the adhesive 18 or the high-viscosity adhesive 28.
The moisture-proof body 7 is pressed by the external pressure, and the moisture-proof body 7 and the reflective layer 6 come into contact with each other.

In the present embodiment, since any one of the support layer 10, the high-viscosity region of the adhesive 18, and the high-viscosity adhesive 28 is provided, the scintillator layer 5 side of the collar portion 7c is prevented from being pushed down. can do. Moreover, it can also suppress that the front end side of the collar part 7c lifts. That is, the deformation of the collar portion 7c can be suppressed.
If the deformation of the collar portion 7c can be suppressed, the thickness of the adhesive layer 8 can be suppressed from becoming non-uniform.
If it is possible to prevent the thickness of the adhesive layer 8 from becoming uneven, it becomes difficult to apply a force in the direction of lifting the collar portion 7c, so that the adhesive layer 8 is difficult to peel off.
Further, if any one of the support layer 10, the high-viscosity region of the adhesive 18, and the high-viscosity adhesive 28 is provided, the adhesive on the scintillator layer 5 side until the adhesive 18 is cured. It can suppress that 18 moves. Therefore, it can suppress that the width dimension of the contact bonding layer 8 under the collar part 7c becomes short.

  If the non-uniform thickness of the adhesive layer 8 can be suppressed, or the width dimension of the adhesive layer 8 can be suppressed from being shortened, the gap between the collar portion 7c and the array substrate 2 can be reduced. Adhesion (adhesion) can be stabilized. Therefore, the reliability of the adhesive layer 8 can be improved.

As described above, the moisture-proof body 7 is formed using, for example, an aluminum foil having a thickness dimension of 0.1 mm.
For this reason, since the rigidity of the collar portion 7c is considerably low, it is difficult to prevent the collar portion 7c from being deformed at all.

6A to 6C are schematic cross-sectional views for illustrating the deformation of the collar portion 7c.
As shown to Fig.6 (a), the collar part 7c may deform | transform so that the front end side may be lifted.
As shown in FIG. 6B, the center portion of the collar portion 7c may be deformed so as to be pushed down.
As shown in FIG.6 (c), it may deform | transform so that the prior application side of the collar part 7c may be pushed down.

However, if any of the support layer 10, the high-viscosity region of the adhesive 18, and the high-viscosity adhesive 28 is provided, the collar portion 7 c is not greatly deformed.
For example, if the maximum value of the thickness of the adhesive layer 8 is T1, and the minimum value of the thickness of the adhesive layer 8 is T2, it is possible to satisfy T1 / T2 ≦ 5.
In the case where the support layer 10, the high viscosity region of the adhesive 18, and the high viscosity adhesive 28 are not provided, T1 / T2 may be about 25.
If T1 / T2 ≦ 5, the adhesion (adhesive force) between the collar portion 7c and the array substrate 2 can be stabilized.

(Second Embodiment)
Next, a method for manufacturing the X-ray detector 1 according to the second embodiment is illustrated.
First, the array substrate 2 is created.
The array substrate 2 can be formed by sequentially forming, for example, a photoelectric conversion unit 2b, a control line 2c1, a data line 2c2, a protective layer 2f, a wiring pad 2d1, and a wiring pad 2d2 on the substrate 2a.
The array substrate 2 can be formed using, for example, a semiconductor manufacturing process.
The wiring pad 2d1 is also provided inside a hole provided in the protective layer 2f, and the wiring pad 2d1 is electrically connected to the control line 2c1.
The wiring pad 2d2 is also provided inside a hole provided in the protective layer 2f, and the wiring pad 2d2 is electrically connected to the data line 2c2.

Next, the scintillator layer 5 is formed on the array substrate 2 having the plurality of photoelectric conversion elements 2b1.
For example, the scintillator layer 5 is formed so as to cover a region (effective pixel area) where the plurality of photoelectric conversion units 2b are formed on the array substrate 2.
The scintillator layer 5 can be formed, for example, by forming a film made of cesium iodide: thallium using a vacuum deposition method. In this case, the thickness dimension of the scintillator layer 5 can be about 600 μm. The column dimension of the columnar crystal can be about 8 to 12 μm on the outermost surface.
Further, by selecting the shape of the vapor deposition mask, the vicinity of the periphery of the scintillator layer 5 can be tapered.

Next, the reflective layer 6 is formed so as to cover the X-ray incident side of the scintillator layer 5.
The reflective layer 6 can be formed, for example, by applying light scattering particles made of titanium oxide (TiO ₂ ) or the like, a material in which a resin and a solvent are mixed onto the scintillator layer 5 and drying the material. .
Drying can be performed at room temperature or in an atmosphere of about 40 ° C.
The coating thickness of the resin including the light scattering particles can be set to about 100 μm, for example. The characteristics of the reflective layer 6 (fluorescence reflectance, the spread of fluorescence inside the reflective layer 6, etc.) can be changed according to the application (application for priority on luminance, application for priority on resolution, etc.). The characteristics of the reflective layer 6 can be changed by, for example, the concentration of light scattering particles.
Further, depending on the application, the reflective layer 6 can be omitted, and a fluorescent absorption layer can be provided instead of the reflective layer 6.
Moreover, a moisture-proof performance can be given to some extent by further adding a filler material.

Next, an adhesive 18 for forming the adhesive layer 8 and an adhesive 28 for forming the support layer 10 are applied in an environment of atmospheric pressure or higher. Note that the viscosity of the adhesive 28 is higher than the viscosity of the adhesive 18.
FIG. 7 is a schematic cross-sectional view for illustrating the case where the adhesives 18 and 28 are applied.
First, as shown in FIG. 7, the adhesive 18 is applied to the distal end side of the collar portion 7c, and the adhesive 28 is applied to the peripheral surface portion 7b side of the collar portion 7c. The adhesives 18 and 28 can also be applied on the array substrate 2. In this case, the adhesive 28 is applied around the scintillator layer 5.
The adhesives 18 and 28 can be applied using, for example, a dispenser.
If the adhesive 28 having a higher viscosity than the adhesive 18 is applied, the adhesive 18 can be prevented from flowing out to the scintillator layer 5 side when the moisture-proof body 7 is adhered.

Further, the adhesive 18 is applied to at least one of the collar portion 7c and the array substrate 2, and the region applied to the peripheral surface portion 7b of the adhesive 18 applied to the collar portion 7c or the adhesion applied to the array substrate 2 is applied. The viscosity of the region of the agent 18 on the scintillator layer 5 side can also be increased.
For example, when the adhesive 18 is an ultraviolet curable adhesive, the adhesive 18 in the region on the scintillator layer 5 side is irradiated with ultraviolet rays to increase the viscosity of the adhesive 18. In addition, since it is before bonding the collar part 7c and the array board | substrate 2, an ultraviolet-ray can be directly irradiated to the apply | coated adhesive agent.
For example, when the adhesive 18 is a thermosetting adhesive, the adhesive 18 in the region on the scintillator layer 5 side is heated to increase the viscosity of the adhesive 18.
If the support layer 10 is formed using the adhesives 18 and 28, the support layer 10 can also have the function of the adhesive layer, so that the adhesion force between the collar portion 7c and the array substrate 2 ( Adhesive force) can be improved.

The frame-like or linear support layer 10 can be formed on the collar portion 7c or the array substrate 2 by using, for example, a vapor phase growth method.
The frame-like or linear support layer 10 can also be formed, for example, by adhering a frame-like or linear member on the collar portion 7c or the array substrate 2.

Next, the moisture-proof body 7 is bonded onto the array substrate 2.
The scintillator layer 5 is covered with a hat-shaped moisture-proof body 7 in an environment where the pressure is lower than the atmospheric pressure.
Subsequently, in an environment where the pressure is lower than the atmospheric pressure, the collar portion 7c and the array substrate 2 are pressure-bonded and temporarily fixed through the high-viscosity region of the adhesive 18 (or the high-viscosity adhesive 28).
Subsequently, the environment in which the moisture-proof body 7 and the array substrate 2 are provided is set to atmospheric pressure or higher with the collar portion 7c temporarily fixed. For example, the inside of the vacuum chamber provided with the moistureproof body 7 and the array substrate 2 is opened to the atmosphere.
Subsequently, in an environment of atmospheric pressure or higher, the adhesive 18 is completely cured to form the bonding layer 8, and the moisture-proof body 7 is bonded to the array substrate 2.
For example, when the adhesive 18 is an ultraviolet curable adhesive, the adhesive 18 is cured by irradiating the adhesive 18 with ultraviolet rays from the back surface side of the substrate 2a.
For example, when the adhesive 18 is a thermosetting adhesive, the adhesive 18 is heated to cure the adhesive 18.
When the support layer 10 is formed using the adhesive 28, the adhesive 18 is cured to form the adhesive layer 8 between the collar portion 7c and the array substrate 2, and the adhesive 28 is cured. A support layer 10 is formed between the collar portion 7 c and the array substrate 2.
When the support layer 10 is formed using the adhesive 18, the adhesive 18 is cured to form the adhesive layer 8 and the support layer 10 between the collar portion 7 c and the array substrate 2.

Next, the array substrate 2 and the signal processing unit 3 are electrically connected via the flexible printed boards 2e1 and 2e2.
Further, the signal processing unit 3 and the image transmission unit 4 are electrically connected through the wiring 4a.
In addition, circuit components and the like are mounted as appropriate.

Next, the array substrate 2, the support plate 9, the signal processing unit 3, the image transmission unit 4, and the like are stored in a housing (not shown).
Then, as necessary, an electrical test, an X-ray image test, a high-temperature and high-humidity test, a cooling / heating cycle test, and the like for confirming whether there is an abnormality in the photoelectric conversion element 2b1 or an abnormality in electrical connection are performed.
The X-ray detector 1 can be manufactured as described above.

  As mentioned above, although several embodiment of this invention was illustrated, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, changes, and the like can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and equivalents thereof. Further, the above-described embodiments can be implemented in combination with each other.

  1 X-ray detector, 2 array substrate, 2a substrate, 2b photoelectric conversion unit, 2b1 photoelectric conversion element, 3 signal processing unit, 4 image transmission unit, 5 scintillator layer, 5a upper surface, 5b side surface, 6 reflection layer, 7 moisture barrier 7a Surface part, 7b Peripheral surface part, 7c Collar part, 8 Adhesive layer, 10 Support layer, 18 Adhesive, 28 Adhesive

Claims (8)

An array substrate having a substrate and a plurality of photoelectric conversion elements provided on one surface side of the substrate;
A scintillator layer that is provided on the plurality of photoelectric conversion elements and converts radiation into fluorescence;
A surface portion facing the top surface of the scintillator layer, a peripheral surface portion provided at a peripheral edge of the surface portion and facing a side surface of the scintillator layer, and provided at an end of the peripheral surface portion opposite to the surface portion side. A moistureproof body having an annular collar facing the array substrate;
An adhesive layer provided between the collar portion and the array substrate;
Between the collar portion and the array substrate, provided on the scintillator layer side of the adhesive layer, a support layer containing the same resin as the resin included in the adhesive layer,
Radiation detector equipped with. 2. The radiation detector according to claim 1, wherein a maximum value of the thickness of the adhesive layer is T <b> 1 and a minimum value of the thickness of the adhesive layer is T <b> 2.
T1 / T2 ≦ 5   The radiation detector according to claim 1, wherein the support layer is provided so as to surround the periphery of the scintillator layer. Forming a scintillator layer on an array substrate having a plurality of photoelectric conversion elements;
A surface portion facing the top surface of the scintillator layer, a peripheral surface portion provided at a peripheral edge of the surface portion and facing a side surface of the scintillator layer, and provided at an end of the peripheral surface portion opposite to the surface portion side. Applying a first adhesive to at least one of the collar portion of the moisture-proof body having an annular collar portion facing the array substrate, and the array substrate;
Increasing the viscosity of the region on the peripheral surface portion side of the first adhesive applied to the collar portion, or the region on the scintillator layer side of the first adhesive applied to the array substrate;
Applying the moisture barrier to the scintillator layer;
Crimping the collar portion and the array substrate through a region of high viscosity of the first adhesive;
Curing the first adhesive to form an adhesive layer and a support layer between the collar portion and the array substrate;
A method of manufacturing a radiation detector comprising: The step of pressure-bonding the collar portion and the array substrate through the high-viscosity region of the first adhesive is performed in an environment whose pressure is reduced from atmospheric pressure,
The method of manufacturing a radiation detector according to claim 4, wherein the step of forming the adhesive layer and the support layer is performed in an environment of atmospheric pressure or higher. Forming a scintillator layer on an array substrate having a plurality of photoelectric conversion elements;
A surface portion facing the top surface of the scintillator layer, a peripheral surface portion provided at a peripheral edge of the surface portion and facing a side surface of the scintillator layer, and provided at an end of the peripheral surface portion opposite to the surface portion side. At least one of the collar portion of the moisture-proof body having an annular collar portion facing the array substrate, and the array substrate, the second adhesive having a higher viscosity than the first adhesive and the first adhesive. Applying the adhesive of
Applying the moisture barrier to the scintillator layer;
Crimping the collar portion and the array substrate via the second adhesive;
The first adhesive is cured to form an adhesive layer between the collar portion and the array substrate, and the second adhesive is cured to cure a support layer between the collar portion and the array substrate. Forming a step;
A method of manufacturing a radiation detector comprising:   In the step of applying the first adhesive and the second adhesive, the second adhesive is applied to the peripheral surface portion side of the collar portion or around the scintillator layer. 6. A method for producing a radiation detector according to item 6. The step of pressure-bonding the collar portion and the array substrate via the second adhesive is performed in an environment where the pressure is reduced from atmospheric pressure,
The method for producing a radiation detector according to claim 6 or 7, wherein the step of forming the adhesive layer and the support layer is performed in an environment of atmospheric pressure or higher.

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