JP2017050218A - Contact material - Google Patents

Abstract

A contact member capable of preventing contact between a contact portion and an end face of an opening while reducing the thickness is provided. A base portion fixed to a first substrate, a contact portion that contacts the second substrate, and a spring portion that movably supports the contact portion with respect to the base portion, A contact member in which at least a part of the base portion and the spring portion is dropped into an opening formed in the first substrate, up to a position where the contact portion or the spring portion comes into contact with the first substrate A stopper is provided to restrict movement. [Selection] Figure 1

Description

  The present invention relates to a contact member.

  In an electronic device, there may be a case where a substrate spaced apart and a frame of the electronic device housing are electrically connected to perform frame grounding, or a pair of substrates spaced apart is electrically connected ( Hereinafter, the frame and the substrate may be collectively referred to as a substrate or the like). In such a case, a pair of facing substrates and the like are electrically connected using a contact member (Patent Document 1).

  In order to reduce the thickness of the electronic device, it is conceivable to provide an opening at the position where the contact member is provided on the substrate so that a part of the contact member is dropped into the opening. In the following description, a contact member partially dropped into an opening formed in the substrate may be referred to as a substrate dropping type contact member.

JP 2002-015801 A

  The contact member has a contact portion for connecting to a substrate or the like, and a spring portion for generating a spring load that presses the contact portion against the substrate or the like. When connecting a board | substrate etc. with a contact member, a contact part is pushed by a board | substrate etc. and a spring part deform | transforms in connection with this and a spring load generate | occur | produces. The contact portion is pressed against the terminal of the substrate by this spring load.

  However, since the part of the contact member of the board dropping type is in the opening formed in the board, the contact and the spring part are at the edge of the opening as compared with the configuration in which the contact member is arranged on the board. Get closer. Further, when the contact member moves in the opening, the contact member may be displaced from a predetermined mounting position and fixed to the substrate.

  When the contact member is deviated from the predetermined mounting position and fixed, the contact portion or the spring portion comes into contact with the substrate, and an appropriate spring load cannot be generated at the spring portion. In this case, the contact portion cannot properly press-contact with the terminal of the substrate, and there is a possibility that a connection failure occurs between the substrate and the contact member.

  One exemplary object of an aspect of the present invention is to provide a contact member that can improve connection reliability with a substrate while reducing the thickness.

According to one aspect of the invention,
A base portion fixed to the first substrate; a contact portion that contacts the second substrate; and a spring portion that movably supports the contact portion relative to the base portion, the base portion and the A contact member in which at least a part of the spring portion is dropped into an opening formed in the first substrate,
A stopper portion is provided for restricting the contact portion or the spring portion from moving to a position where the contact portion or the spring portion contacts the first substrate.

  According to an aspect of the present invention, it is possible to improve connection reliability with a substrate while reducing the thickness.

It is a perspective view of the contact member by one Embodiment. It is a figure which shows the contact member by one Embodiment, (A) is a top view, (B) is a front view, (C) is a bottom view, (D) is a right view, (E) is a left view. . It is sectional drawing explaining operation | movement of the contact member by one Embodiment, (A) is a figure which shows the state before a connection, (B) is a figure which shows the state after a connection. It is sectional drawing which shows the state by which the contact member by one Embodiment was soldered in the position shifted | deviated in opening (the 1). It is sectional drawing which shows the state by which the contact member by one Embodiment was soldered in the position which shifted | deviated in opening (the 2). It is sectional drawing explaining operation | movement of the contact member by a reference example, (A) is a figure which shows the state before a connection, (B) is a figure which shows the state after a connection. It is sectional drawing which shows the state by which the contact member by a reference example was soldered in the position which shifted | deviated in opening (the 1). It is sectional drawing which shows the state by which the contact member by a reference example was soldered in the position which shifted | deviated in opening (the 2). It is a perspective view of the contact member by one embodiment by other embodiments.

  Reference will now be made to non-limiting exemplary embodiments of the invention with reference to the accompanying drawings.

  In the description of all attached drawings, the same or corresponding members or parts are denoted by the same or corresponding reference numerals, and redundant description is omitted. Also, the drawings are not intended to show relative ratios between members or parts unless otherwise specified. Accordingly, specific dimensions can be determined by one skilled in the art in light of the following non-limiting embodiments.

  In addition, the embodiments described below are examples, not limiting the invention, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

  1-3 is a figure explaining one Embodiment of 1 A of contact members. 1 is a perspective view of the contact member 1A disposed on the first substrate 100, FIG. 2 is a six-face view of the contact member 1A, and FIG. 3 is a diagram illustrating the contact member 1A disposed on the first substrate 100. It is sectional drawing of 1 A of contact members made.

  The contact member 1 </ b> A is disposed between the first substrate 100 and the second substrate 200 that are disposed to face each other as shown in FIG. 3, for example, so that the first substrate 100 and the second substrate 200 are connected to each other. Connect electrically. The first substrate 100 and the second substrate 200 may be substrates such as a printed circuit board disposed in an electronic device, or may be a housing frame of an electronic device.

  As shown in FIGS. 1 and 2, the contact member 1 </ b> A includes a base portion 2, a spring portion 3, a contact portion 5, stopper portions 6 and 7, joint portions 8 and 9, and a suction portion 10.

  The contact member 1A can be formed, for example, by pressing a metal flat plate. When press working is used, the base portion 2, the spring portion 3, the contact portion 5, the stopper portions 6, 7, the joint portions 8, 9 and the suction portion 10 can be integrally formed.

  As a material of the contact member 1A, for example, a metal plate having conductivity and spring properties such as phosphor bronze, beryllium copper, and SUS can be used. If necessary, the whole or a part of the surface of the contact member 1A may be plated with nickel, copper, gold, or the like.

  The contact member 1 </ b> A is disposed on either the first substrate 100 or the second substrate 200. When the contact member 1A is disposed, the contact member 1A is soldered to the first substrate 100 or the second substrate 200. In the following description, an example in which the contact member 1A is disposed on the first substrate 100 will be described.

  The base portion 2 serves as a base portion of the contact member 1A and is located at the bottom of the contact member 1A. The base portion 2 is substantially T-shaped as seen from the bottom (viewed from the bottom) as shown in FIG. Further, on the rear side of the base portion 2 (X2 direction side in FIG. 1), a spring portion 3, an arm portion 3b, and a contact portion 5 are formed.

  In the spring portion 3, when the second substrate 200 is connected to the first substrate 100 by the contact member 1 </ b> A, an elastic force for pressing the contact portion 5 to the terminal 201 of the second substrate 200 is generated. The spring part 3 has a curved part 3a and an arm part 3b. The bending portion 3a has one end connected to the base portion 2 and the other end connected to the arm portion 3b.

  The curved portion 3a is formed in a U shape and can be elastically deformed. The arm portion 3b extends from the curved portion 3a so as to face the base portion 2, and is formed to extend in the longitudinal direction of the base portion 2 (indicated by arrows X1 and X2 in the drawing). In the following description, directions indicated by arrows X1 and X2 in the drawings are referred to as the extending direction of the spring portion 3, the X1 direction is referred to as the front, and the X2 direction is referred to as the rear.

  The contact portion 5 is formed at the front end portion of the arm portion 3b. Therefore, the contact portion 5 is swung by the spring portion 3 (moves in the directions indicated by A1 and A2 in FIG. 3B).

  Moreover, the contact part 5 is formed in U shape, and is formed so that it may protrude from the arm part 3b. The protruding direction of the contact portion 5 with respect to the arm portion 3 b is a direction facing the second substrate 200.

  Next, the stopper parts 6 and 7 will be described.

  The stopper portions 6 and 7 are formed so as to stand on both sides of the base portion 2. Moreover, the stopper parts 6 and 7 are extended long along the extension direction (X1, X2 direction) of the spring part 3. FIG. As shown in FIGS. 2C and 2D, the stopper portion 6 and the stopper portion 7 face each other in parallel, and the spring portion 3 and the contact portion 5 are disposed therebetween.

  Here, the positions of the front end portions 6A and 7A and the positions of the rear end portions 6B and 7B of the stopper portions 6 and 7 will be described with reference to FIG. Since the front end portion 6A and the rear end portion 6B of the stopper portion 6 and the front end portion 7A and the rear end portion 7B of the stopper portion 7 have the same configuration, only the stopper portion 6 is shown and described in FIG. The description of 7 will be omitted.

  FIG. 3A shows a state where the contact member 1 </ b> A is mounted at a predetermined position of the first substrate 100. FIG. 3B shows a state where the first substrate 100 and the second substrate 200 are connected by the contact member 1A.

  When the second substrate 200 is connected to the first substrate 100 by the contact member 1A, the contact portion 5 is pressed by the second substrate 200 and moves in the A2 direction. As the contact portion 5 moves, the spring portion 3 is elastically deformed.

  The front end portion 6A of the stopper portion 6 is positioned in front of the front end position of the contact portion 5 after movement as shown in FIG. In the example shown in FIG. 3B, the front end portion 6A is separated forward (X1 direction) by the distance indicated by the arrow LA1 in the drawing with respect to the front end position of the contact portion 5 after movement.

  Further, the rear end portion 6B of the stopper portion 6 is located behind the rear end position of the spring portion 3 after elastic deformation. In the example shown in FIG. 3B, the rear end portion 6B is separated backward (X2 direction) by a distance indicated by an arrow LB1 in the drawing with respect to the rear end position of the spring portion 3 after elastic deformation.

  Next, the joint portions 8 and 9 will be described. The joint 8 and the joint 9 are parts to be soldered to the first substrate 100. The joint portion 8 is formed at the front and rear positions of the upper end portion of the stopper portion 6, and is bent to extend outward with respect to the stopper portion 6. The joint portion 9 is formed at the front and rear positions of the upper end portion of the stopper portion 7, and is bent so as to extend outward with respect to the stopper portion 7.

  The extending direction of the joint portions 8 and 9 is set to be substantially parallel to the surface direction of the base portion 2. Moreover, the junction parts 8 and 9 are set so that the height with respect to the base part 2 may become the same (this height is shown by h in FIG. 2).

  The suction unit 10 is a part that is sucked by the suction nozzle of the automatic mounting machine. The automatic mounting machine conveys the contact member 1 </ b> A to the opening 101 of the first substrate 100 by sucking the suction portion 10 with a suction nozzle.

  The suction portion 10 is formed to be bent at the center position of the upper end portion of the stopper portion 6 so as to extend inward from the stopper portion 6. Therefore, the adsorption | suction part 10 is located in the upper part of the curved part 3a. In addition, although the example which provided the adsorption | suction part 10 in the stopper part 6 is shown in this embodiment, it is also possible to provide in the stopper part 7. FIG.

  Next, mounting of the contact member 1A on the first substrate 100 will be described.

  As shown in FIGS. 1 and 3, an opening 101 is formed in the first substrate 100. The opening 101 has a shape and a size capable of dropping the base portion 2, the spring portion 3, and the stopper portions 6 and 7, which are a part of the contact member 1 </ b> A, into the inside. Specifically, the size of the opening 101 is set to be larger than the size of the portion dropped into the opening 101 of the contact member 1A in consideration of the mountability by the automatic mounting machine.

  The joint portions 8 and 9 are set to contact the outer peripheral portion of the opening 101 of the first substrate 100 in a state where a part of the contact member 1A is dropped into the opening 101. Therefore, even when the contact member 1 </ b> A is inserted into the opening 101, the contact member 1 </ b> A does not fall out of the opening 101 due to the joint portions 8 and 9 coming into contact with the first substrate 100.

  Terminals 108 and 109 are formed at positions corresponding to the joints 8 and 9 in the outer peripheral position of the opening 101 as shown in FIG. The joint 8 is soldered to the terminal 108, and the joint 9 is soldered to the terminal 109.

  The contact members 1 </ b> A are mounted on the first substrate 100 by soldering the joint portions 8 and 9 to the terminals 108 and 109. For soldering the joints 8 and 9 and the terminals 108 and 109, for example, reflow can be used.

  As shown in FIGS. 1 and 3, the contact member 1 </ b> A has the base portion 2, the spring portion 3, and the stopper portions 6 and 7 that are a part of the contact member 1 </ b> A dropped into the opening 101 of the first substrate 100. The overall thickness of the first substrate 100 can be reduced.

  That is, assuming that the height of the contact member 1A is H and the thickness of the first substrate 100 is W as shown in FIG. 3A, the contact member 1A is surface-mounted on the first substrate 100. Then, the total height of the contact member 1A and the first substrate 100 becomes (H + W). On the other hand, by adopting a configuration in which a part of the contact member 1A is dropped into the opening 101 of the first substrate 100 as in this embodiment, the overall height of the contact member 1A and the first substrate 100 is It becomes H, and it can achieve thickness reduction compared with the structure which carries out the surface mounting of a contact member.

  Next, the movement of the contact member 1A in the opening 101 that occurs when the contact member 1A is soldered to the first substrate 100 will be described.

  In order to solder the contact member 1A to the first substrate 100, a solder paste is applied onto the terminals 108 and 109 of the first substrate 100, and then the contact member 1A is inserted into the opening 101 and joined portions 8 and 9 are connected. Is placed on the terminals 108 and 109. Subsequently, by reflowing the first substrate 100 on which the contact member 1A is mounted, the joint portions 8 and 9 and the terminals 108 and 109 are soldered, and the contact member 1A is mounted on the first substrate 100.

  When reflowing, the solder paste melts, so that a phenomenon that the joints 8 and 9 float with respect to the terminals 108 and 109 may occur. The size of the opening 101 is set larger than the size of the portion dropped into the opening 101 of the contact member 1A. Therefore, the contact member 1A may move inside the opening 101 during reflow.

  Here, the reference contact member 20 will be described with reference to FIGS. 6-8, the same code | symbol is attached | subjected about the structure corresponding to the structure shown in FIGS. 1-3, and the description is abbreviate | omitted.

  6A shows a state in which the contact member 20 is mounted on the first substrate 100, and FIG. 6B shows a state in which the second substrate 200 is connected to the first substrate 100 by the contact member 20. Is shown.

  In the reference example, the front end portion 26 </ b> A of the side plate portion 26 is located behind the front end position of the contact portion 5 in a state of being pressed by the second substrate. In the example shown in FIG. 6B, the front end portion 26A is separated backward (X2 direction) by a distance indicated by an arrow LA20 in the drawing with respect to the front end position of the contact portion 5 pushed by the second substrate.

  Further, the rear end portion 26B of the side plate portion 26 is located in front of the rear end portion position of the spring portion 3 after elastic deformation. In the example shown in FIG. 6B, the rear end portion 26B is spaced forward (X1 direction) by a distance indicated by an arrow LB20 in the drawing with respect to the rear end position of the spring portion 3 after elastic deformation.

  When the contact member 20 according to the reference example is inserted into the opening 101 of the first substrate 100 and the reflow process is performed, the solder 8 melts and the joints 8 and 9 are floated with respect to the terminals 108 and 109, and the inside of the opening 101. Thus, the contact member 20 becomes movable.

  FIG. 7 shows a case where the contact member 20 is soldered in the opening 101 while moving forward (X1 direction).

  In the side plate portion 26 according to the reference example, the front end portion 26A is located behind the front end position of the contact portion 5 pressed by the second substrate, but the side plate portion 26 is at the front side opening edge portion 102 of the opening 101 during reflow. When the contact part 5 is pressed to the second substrate 200, the contact part 5 may come into contact with the first substrate 100 as shown in FIG.

  On the other hand, FIG. 8 shows a case where the contact member 20 is soldered in the opening 101 while moving backward (X2 direction).

  In the side plate portion 26 according to the reference example, the rear end portion 26B of the side plate portion 26 is located in front of the rear end portion position of the spring portion 3 after elastic deformation. For this reason, when the contact member moves during reflow, the spring portion may come into contact with the rear opening edge of the first substrate 100 as shown in FIG.

  When the contact portion 5 abuts on the first substrate 100 as shown in FIG. 7 and the spring portion 3 abuts on the rear opening edge 103 of the first substrate 100 as shown in FIG. The displacement of the spring portion 3 is restricted by the first substrate 100. For this reason, an appropriate spring load cannot be generated in the spring portion 3, and a connection failure may occur between the contact portion 5 and the second substrate 200.

  FIG. 4 shows a case where the contact member 1 </ b> A according to the present embodiment is soldered in a state of moving forward (X1 direction) within the opening 101.

  The stopper portion 6 provided in the contact member 1A is located in front of the front end position (indicated by arrow P2 in FIG. 4) of the contact portion 5 after the front end portion 6A is pushed by the second substrate. For this reason, even if the contact member 1 </ b> A moves forward (X1 direction) in the opening 101 during reflow, the front end 6 </ b> A of the stopper 6 contacts the front opening edge 102 of the opening 101.

  Thus, even if the front end portion 6A is soldered in a state of being in contact with the front side opening edge portion 102, the front end position of the contact portion 5 and the front side opening edge portion 102 in a state of being pressed by the second substrate. Are separated. Therefore, even when the second substrate 200 is mounted on the first substrate 100 and the contact portion 5 is pressed by the second substrate 200, the contact portion 5 does not come into contact with the first substrate 100.

  On the other hand, FIG. 5 shows a case where the contact member 1 </ b> A is soldered in the opening 101 while moving backward (X2 direction).

  In the stopper portion 6 of the contact member 1A, the rear end portion 6B is located behind the rear end position of the spring portion 3 after elastic deformation (indicated by the arrow P3 in FIG. 5). For this reason, even if the contact member 1 </ b> A moves backward (X2 direction) in the opening 101, the rear end portion 6 </ b> B of the stopper portion 6 contacts the rear opening edge portion 103 of the opening 101.

  Thus, even if the rear end portion 6B of the stopper portion 6 is soldered in a state of being in contact with the front side opening edge portion 102, the rear end position of the spring portion 3 and the rear side opening edge portion 103 after being elastically deformed. Are in a separated state. Therefore, even if the second substrate 200 is mounted on the first substrate 100 and the contact portion 5 is pressed by the second substrate 200, the spring portion 3 does not come into contact with the first substrate 100.

  Further, as shown in FIGS. 2D and 2E, since the stopper portions 6 and 7 are erected on both side positions of the spring portion 3 and the contact portion 5, the first portion is formed from the side portion of the contact member. The substrate 100 does not come into contact with the spring portion 3 and the contact portion 5.

  As described above, the contact member 1A according to the present embodiment is provided with the stopper portions 6 and 7, so that the spring portion 3 or the contact portion 5 is in contact with the first substrate 100 in the opening 101 when the solder is melted. Movement up to is restricted. For this reason, since the spring part 3 maintains the state separated from the 1st board | substrate 100, even if the contact member 1A moves within the opening 101 and is soldered, the spring part 3 does not contact the 1st board | substrate. Therefore, an appropriate spring load can be generated. Thereby, it is possible to prevent connection failure between the contact portion 5 and the second substrate 200.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments described above, and various modifications are possible within the scope of the gist of the present invention described in the claims. It can be modified and changed.

  Specifically, in the contact member 1A shown in FIGS. 1 to 3, the stopper portions 6 and 7 are provided on both sides of the base portion 2. However, like the contact member 1B shown in FIG. It is good also as a structure which formed the stopper part 12 and the junction part 13 also in the position which opposes the contact part 5 in the front side (X1 direction side). In the contact member 1 </ b> B, when the contact member 1 </ b> B moves forward in the opening 101, the movement is restricted by the stopper portion 12 coming into contact with the front-side opening edge portion 102.

1A, 1B, 20 Contact member 2 Base part 3 Spring part 3a Curved part 3b Arm part 5 Contact part 6, 7 Stopper part 6A, 7A Front end part 6B, 7B Rear end part 8, 9, 13 Joint part 10 Adsorption part 12 Stopper Portion 100 First substrate 101 Opening 102 Front opening edge 103 Rear opening edge 200 Second substrate 201, 108, 109 Terminal

Claims (3)

A base portion fixed to the first substrate; a contact portion that contacts the second substrate; and a spring portion that movably supports the contact portion relative to the base portion, the base portion and the spring A contact member in which at least a part of the part is dropped into an opening formed in the first substrate,
A contact member comprising a stopper portion for restricting movement of the contact member within the opening.   The contact member according to claim 1, wherein a suction portion that is sucked by a suction nozzle is provided in the stopper portion. The contact member according to claim 1, wherein the stopper portion is provided with a joint portion to be soldered to the first substrate.

Images