JP2016035969A - 回路基板及びその製造方法 - Google Patents

回路基板及びその製造方法 Download PDF

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Publication number: JP2016035969A
Authority: JP; Japan
Prior art keywords: via hole; layer; circuit board; insulating layer; conductor layer
Prior art date: 2014-08-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2014158210A

Other languages

English (en)

Japanese (ja)

Inventor

中村　茂雄

Shigeo Nakamura

茂雄中村

亮宮本

Akira Miyamoto

亮宮本

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Ajinomoto Co Inc

Original Assignee

Ajinomoto Co Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-08-01

Filing date

2014-08-01

Publication date

2016-03-17

2014-08-01 Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc

2014-08-01 Priority to JP2014158210A priority Critical patent/JP2016035969A/ja

2015-07-03 Priority to TW104121696A priority patent/TWI685285B/zh

2015-07-30 Priority to CN201510458071.0A priority patent/CN105323960B/zh

2015-07-30 Priority to KR1020150107998A priority patent/KR102338968B1/ko

2016-03-17 Publication of JP2016035969A publication Critical patent/JP2016035969A/ja

Status Pending legal-status Critical Current

Links

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239000011733 molybdenum Substances 0.000 description 1
KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
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JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
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DGBWPZSGHAXYGK-UHFFFAOYSA-N perinone Chemical compound C12=NC3=CC=CC=C3N2C(=O)C2=CC=C3C4=C2C1=CC=C4C(=O)N1C2=CC=CC=C2N=C13 DGBWPZSGHAXYGK-UHFFFAOYSA-N 0.000 description 1
125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
229960001553 phloroglucinol Drugs 0.000 description 1
239000010452 phosphate Substances 0.000 description 1
NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
239000001007 phthalocyanine dye Substances 0.000 description 1
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LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical compound C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
229910052761 rare earth metal Inorganic materials 0.000 description 1
229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
230000001105 regulatory effect Effects 0.000 description 1
239000013557 residual solvent Substances 0.000 description 1
229920003987 resole Polymers 0.000 description 1
GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
229960001755 resorcinol Drugs 0.000 description 1
238000000790 scattering method Methods 0.000 description 1
230000035939 shock Effects 0.000 description 1
230000008054 signal transmission Effects 0.000 description 1
229910000077 silane Inorganic materials 0.000 description 1
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
229910010271 silicon carbide Inorganic materials 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
229910052814 silicon oxide Inorganic materials 0.000 description 1
238000001179 sorption measurement Methods 0.000 description 1
125000003003 spiro group Chemical group 0.000 description 1
239000003381 stabilizer Substances 0.000 description 1
229910000018 strontium carbonate Inorganic materials 0.000 description 1
VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1
TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
239000006228 supernatant Substances 0.000 description 1
230000001629 suppression Effects 0.000 description 1
229920003051 synthetic elastomer Polymers 0.000 description 1
239000000454 talc Substances 0.000 description 1
229910052623 talc Inorganic materials 0.000 description 1
150000003505 terpenes Chemical class 0.000 description 1
235000007586 terpenes Nutrition 0.000 description 1
239000006234 thermal black Substances 0.000 description 1
238000002230 thermal chemical vapour deposition Methods 0.000 description 1
229920001169 thermoplastic Polymers 0.000 description 1
229920002803 thermoplastic polyurethane Polymers 0.000 description 1
239000004416 thermosoftening plastic Substances 0.000 description 1
239000002562 thickening agent Substances 0.000 description 1
150000003568 thioethers Chemical class 0.000 description 1
VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
230000007704 transition Effects 0.000 description 1
150000003918 triazines Chemical class 0.000 description 1
239000013638 trimer Substances 0.000 description 1
BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
238000004506 ultrasonic cleaning Methods 0.000 description 1
238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
229910052720 vanadium Inorganic materials 0.000 description 1
GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
238000007740 vapor deposition Methods 0.000 description 1
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
238000005406 washing Methods 0.000 description 1
239000001018 xanthene dye Substances 0.000 description 1
239000008096 xylene Substances 0.000 description 1
125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
229910001928 zirconium oxide Inorganic materials 0.000 description 1
229910000166 zirconium phosphate Inorganic materials 0.000 description 1
LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Laser Beam Processing (AREA)

JP2014158210A 2014-08-01 2014-08-01 回路基板及びその製造方法 Pending JP2016035969A (ja)

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JP2014158210A JP2016035969A (ja)	2014-08-01	2014-08-01	回路基板及びその製造方法
TW104121696A TWI685285B (zh)	2014-08-01	2015-07-03	電路基板及其製造方法
CN201510458071.0A CN105323960B (zh)	2014-08-01	2015-07-30	电路板及其制造方法
KR1020150107998A KR102338968B1 (ko)	2014-08-01	2015-07-30	회로 기판 및 이의 제조 방법

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Application Number	Title	Priority Date	Filing Date
JP2018203542A Division JP6798537B2 (ja)	2018-10-30	2018-10-30	回路基板及びその製造方法

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Publication Number	Publication Date
JP2016035969A true JP2016035969A (ja)	2016-03-17

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Country Status (4)

Country	Link
JP (1)	JP2016035969A (zh)
KR (1)	KR102338968B1 (zh)
CN (1)	CN105323960B (zh)
TW (1)	TWI685285B (zh)

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JP2016086000A (ja) *	2014-10-22	2016-05-19	太陽インキ製造株式会社	ドライフィルムおよびプリント配線板
JP2017199824A (ja) *	2016-04-28	2017-11-02	株式会社ジェイデバイス	半導体パッケージの製造方法
JP2018026437A (ja) *	2016-08-09	2018-02-15	新光電気工業株式会社	配線基板及びその製造方法
JP2018188625A (ja) *	2017-05-10	2018-11-29	味の素株式会社	樹脂組成物層
JP2019029637A (ja) *	2017-07-28	2019-02-21	サムソンエレクトロ−メカニックスカンパニーリミテッド．	プリント回路基板
US10306759B2 (en)	2016-12-27	2019-05-28	Shinko Electric Industries Co., Ltd.	Wiring substrate
JP2019085494A (ja) *	2017-11-07	2019-06-06	味の素株式会社	樹脂組成物
KR20190084890A (ko) *	2018-01-09	2019-07-17	아지노모토 가부시키가이샤	수지 조성물
JP2020082351A (ja) *	2018-11-14	2020-06-04	味の素株式会社	支持体付き樹脂シート及び樹脂組成物層
US10886211B2 (en)	2018-04-05	2021-01-05	Shinko Electric Industries Co., Ltd.	Wiring board and semiconductor package
JPWO2021084860A1 (zh) *	2019-10-30	2021-05-06
US11197379B2 (en)	2017-03-31	2021-12-07	Mitsubishi Gas Chemical Company, Inc.	Method for producing printed wiring board
WO2024190442A1 (ja) *	2023-03-10	2024-09-19	味の素株式会社	回路基板の製造方法

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JP6728760B2 (ja) *	2016-02-25	2020-07-22	味の素株式会社	支持体付き樹脂シート
CN107278053A (zh) *	2016-04-08	2017-10-20	东莞市斯坦得电子材料有限公司	用于印制线路板导通孔金属化前导通孔壁环氧树脂的膨松软化工艺
JP6852627B2 (ja) *	2017-09-11	2021-03-31	味の素株式会社	樹脂組成物
JP6859916B2 (ja) *	2017-10-13	2021-04-14	味の素株式会社	樹脂組成物層
CN113811080A (zh) *	2020-06-16	2021-12-17	深南电路股份有限公司	一种电路板及其制备方法
TWI807464B (zh) *	2020-11-06	2023-07-01	日商互應化學工業股份有限公司	印刷線路板及印刷線路板的製造方法
TWI824308B (zh) *	2020-12-02	2023-12-01	黃信翔	可減少化學處理步驟的化學鎳金製程方法及系統

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- 2015-07-03 TW TW104121696A patent/TWI685285B/zh active
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Publication number	Priority date	Publication date	Assignee	Title
JP2016086000A (ja) *	2014-10-22	2016-05-19	太陽インキ製造株式会社	ドライフィルムおよびプリント配線板
JP2017199824A (ja) *	2016-04-28	2017-11-02	株式会社ジェイデバイス	半導体パッケージの製造方法
US11152293B2 (en)	2016-08-09	2021-10-19	Shinko Electric Industries Co., Ltd.	Wiring board having two insulating films and hole penetrating therethrough
JP2018026437A (ja) *	2016-08-09	2018-02-15	新光電気工業株式会社	配線基板及びその製造方法
US10306759B2 (en)	2016-12-27	2019-05-28	Shinko Electric Industries Co., Ltd.	Wiring substrate
US10887985B2 (en)	2016-12-27	2021-01-05	Shinko Electric Industries Co., Ltd.	Wiring substrate
EP3606300B1 (en) *	2017-03-31	2024-08-28	Mitsubishi Gas Chemical Company, Inc.	Method for producing printed circuit board
US11197379B2 (en)	2017-03-31	2021-12-07	Mitsubishi Gas Chemical Company, Inc.	Method for producing printed wiring board
JP2018188625A (ja) *	2017-05-10	2018-11-29	味の素株式会社	樹脂組成物層
JP7279303B2 (ja)	2017-05-10	2023-05-23	味の素株式会社	樹脂組成物層
JP2019029637A (ja) *	2017-07-28	2019-02-21	サムソンエレクトロ−メカニックスカンパニーリミテッド．	プリント回路基板
JP2019085494A (ja) *	2017-11-07	2019-06-06	味の素株式会社	樹脂組成物
KR20190084890A (ko) *	2018-01-09	2019-07-17	아지노모토 가부시키가이샤	수지 조성물
KR102752113B1 (ko) *	2018-01-09	2025-01-10	아지노모토 가부시키가이샤	수지 조성물
JP2019119819A (ja) *	2018-01-09	2019-07-22	味の素株式会社	樹脂組成物
JP7296191B2 (ja)	2018-01-09	2023-06-22	味の素株式会社	硬化性樹脂組成物、樹脂シート、プリント配線板及び半導体装置
JP2022003125A (ja) *	2018-01-09	2022-01-11	味の素株式会社	樹脂組成物
JP7272392B2 (ja)	2018-01-09	2023-05-12	味の素株式会社	樹脂組成物
US10886211B2 (en)	2018-04-05	2021-01-05	Shinko Electric Industries Co., Ltd.	Wiring board and semiconductor package
JP7196551B2 (ja)	2018-11-14	2022-12-27	味の素株式会社	支持体付き樹脂シート及び樹脂組成物層
JP2020082351A (ja) *	2018-11-14	2020-06-04	味の素株式会社	支持体付き樹脂シート及び樹脂組成物層
KR20220065014A (ko) *	2019-10-30	2022-05-19	교세라 가부시키가이샤	배선 기판
JPWO2021084860A1 (zh) *	2019-10-30	2021-05-06
WO2021084860A1 (ja) *	2019-10-30	2021-05-06	京セラ株式会社	配線基板
KR102752220B1 (ko) *	2019-10-30	2025-01-10	교세라 가부시키가이샤	배선 기판
US12245366B2 (en)	2019-10-30	2025-03-04	Kyocera Corporation	Wiring board
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JPWO2024190442A1 (zh) *	2023-03-10	2024-09-19
JP7790629B2 (ja)	2023-03-10	2025-12-23	味の素株式会社	回路基板の製造方法

Also Published As

Publication number	Publication date
KR20160016665A (ko)	2016-02-15
TW201615065A (en)	2016-04-16
KR102338968B1 (ko)	2021-12-15
CN105323960A (zh)	2016-02-10
CN105323960B (zh)	2020-06-19
TWI685285B (zh)	2020-02-11

Publication	Publication Date	Title
KR102247157B1 (ko)	2021-05-04	프린트 배선판의 제조 방법
KR102338968B1 (ko)	2021-12-15	회로 기판 및 이의 제조 방법
JP6413831B2 (ja)	2018-10-31	回路基板及びその製造方法
KR102259479B1 (ko)	2021-06-03	프린트 배선판의 제조 방법
JP7140175B2 (ja)	2022-09-21	回路基板及びその製造方法
KR20140042704A (ko)	2014-04-07	지지체 함유 프리폴리머 시트
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