JP2016032079A - Sticking method and sticking device of pressure-sensitive adhesive sheet - Google Patents

Abstract

An object of the present invention is to suppress the generation of a gap between a member to be stuck and an adhesive sheet.
An elastic plate-like sticking member 3 is held by a frame 4 having an opening 4A so as to face a sticking surface 3A of the sticking member 3 located in the opening 4A with a gap. The adherend member 8 is disposed, the adhesive sheet 6 is disposed between the sticking surface 3A and the sticking member 8 with the adhesive surface 6A facing the sticking member 8 side, and fluid is supplied to the opposite side of the sticking surface 3A. Then, when the sticking member 3 is expanded from the opening 4A, the sticking surface 3A is pressed against the sticking member 8 to stick the adhesive sheet 6, and the sticking surface 3A of the sticking member 3 in the unexpanded state is covered with the sticking surface 3A. The distance h (× 10 ⁻³ m) from the sticking member 8, the diameter D (× 10 ⁻³ m) of the circle inscribed in the opening 4 A, and the fluid supply amount Q (× 10 ⁻³ m ³ / s) ^{preparative, Q × (h / D)} 2 ≧ 0.75 (× 10 -6 m 3 / s) controlled to satisfy the That.
[Selection] Figure 2

Description

  The present invention relates to an adhesive sheet attaching method and an attaching device for attaching an adhesive sheet such as a protective tape to a member to be attached such as a semiconductor wafer.

  As such an adhesive sheet sticking device, for example, Patent Document 1 discloses a table that supports a plate-like member (a member to be stuck) such as a semiconductor wafer and a pressing force applied to a sheet arranged along the plate-like member. And a deformable pressing member (sticking member) that imparts the sheet, and by deforming the pressing member so as to be close to the sheet, the sheet is plated by the adhesive layer (adhesive surface) on the plate-like member side of the sheet. What is affixed to a shaped member is described.

  Here, in the sticking device described in Patent Document 1, the first space in the case for housing the table and the first space are formed on the opposite side across the pressing member. The space is depressurized or substantially vacuumed, and then the second space is released from the depressurized or substantially vacuumed state, so that the pressure member is deformed so as to be close to the sheet by the pressure difference and is pressed against the plate-like member. Is affixed to the plate member.

JP 2008-066597 A

  By the way, in particular, in the above-described semiconductor wafers, those having hemispherical electrodes (bumps) formed on the surface to which the sheet is attached have recently been used frequently, and projections such as these electrodes have been used. If it is formed on the pasting surface, a gap is easily generated between the pasted sheet and the pasting surface, and the adhesiveness to the sheet is partially impaired. In the case of a semiconductor wafer, if the adhesiveness to the sheet is impaired in this way, for example, when the semiconductor chip is cut out from the semiconductor wafer to which the sheet is stuck in the dicing process, the semiconductor chip is scattered, or the backside grinding of the semiconductor wafer There is a possibility that the cooling water supplied sometimes enters the gap. In addition, in this specification, a space | gap means the non-adhesion location (gap) which generate | occur | produces between an adhesive sheet and a to-be-bonded member, when an adhesive sheet is stuck to a to-be-bonded member.

  The present invention has been made under such a background, and even if a protrusion is formed on a surface to be bonded of a member to be bonded, the pressure-sensitive adhesive capable of suppressing the generation of a gap between the pressure-sensitive adhesive sheet. It aims at providing the sticking method and sticking apparatus of a sheet | seat.

  Here, when the inventor of the present invention has made various studies, the phenomenon in which a gap is formed between the pressure-sensitive adhesive sheet and the member to be bonded is likely to occur at the center of the surface to be bonded. I understood. And further research, in order to suppress the occurrence of such a gap in the central portion of the surface to be bonded, using a material that expands due to the supply of fluid as a bonding member that pressure-bonds the adhesive sheet to the member to be bonded, It has been found that it is effective to increase the fluid supply amount (flow rate) when inflating the affixing member, the interval between the affixing member and the affixed member to be large, and the area of the portion where the affixing member bulges to be small. I came to get.

The present invention has been made in order to achieve the above-described object based on such knowledge, and the adhesive sheet sticking method of the present invention includes an elastic plate-like sticking member formed by a frame having an opening. The holding member is disposed so as to face the sticking surface of the sticking member located in the opening of the frame with a space therebetween, and an adhesive surface is provided between the sticking surface and the sticking member. By placing an adhesive sheet toward the pasting member side, supplying fluid to the side opposite to the pasting surface of the pasting member and expanding the pasting member from the opening to the pasting member side, A pressure-sensitive adhesive sheet sticking method for sticking the pressure-sensitive adhesive sheet by pressing the sticking surface against the member to be stuck, wherein an interval h (× 10) between the sticking surface of the sticking member in an unexpanded state and the sticking member ^-3 m), A diameter D (× 10 ⁻³ m) of a circle inscribed in the opening and a supply amount Q (× 10 ⁻³ m ³ / s) of the fluid are ^expressed by Q × (h / D) ² ≧ 0.75 Control is performed so as to satisfy (× 10 ⁻⁶ m ³ / s).

The adhesive sheet sticking device of the present invention includes an elastic plate-like sticking member held by a frame in which an opening is formed, and an interval between the sticking surface of the sticking member located in the opening of the frame. A sticking portion that arranges the sticking member so as to face each other and supplying fluid to the side opposite to the sticking surface of the sticking member to expand the sticking member from the opening to the sticking member side And a fluid supply means for pressing the sticking surface against the member to be stuck, and an adhesive sheet disposed between the sticking surface and the member to be stuck facing the sticking member side. An adhesive sheet sticking device for sticking to a member, wherein the fluid supply means includes an interval h (× 10 ⁻³ m) between the sticking surface of the sticking member in an unexpanded state and the sticking member, Of the circle inscribed in the opening Based on the diameter D (× 10 ⁻³ m), the fluid supply amount Q (× 10 ⁻³ m ³ / s) is expressed as Q × (h / D) ² ≧ 0.75 (× 10 ⁻⁶ m ³ / s), and a control means for controlling to satisfy ³ / s).

In such an adhesive sheet sticking method and sticking device, the diameter D of the circle inscribed in the opening of the frame, which is the denominator of h / D, is reduced to reduce the portion where the sticking member swells, or the sticking member that is a molecule When the distance h between the adhesive member and the member to be pasted is increased and, as described above, Q × (h / D) ² is controlled to be as large as 0.75 (× 10 ⁻⁶ m ³ / s), The affixing member expands so that the affixing surface has a spherical shape with a large curvature, and is pressed against the affixing member with a small area from the center. Further, when Q × (h / D) ² is largely controlled by increasing the fluid supply amount Q, the sticking speed when the sticking member expands and is pressed against the sticking member increases. In this specification, the term “expansion” means that the elastic adhesive member receives pressure from the fluid, so that the opening portion of the frame and a portion located in the periphery thereof are elastically deformed and extended to be pushed out to the adherend member side. Swells like a balloon.

  Therefore, since the pressure-sensitive adhesive member starts to be pressed against a relatively small area at the center of the surface to be bonded, and the pressure-sensitive adhesive sheet is quickly applied from there, the adhesive member is particularly recommended. It becomes possible to suppress generation | occurrence | production of the space | gap in the center part of a surface. However, the diameter D of the circle inscribed in the opening determined by the size of the opening is influenced by the size of the selected member to be pasted and the adhesive sheet, and the interval h between the pasting member and the member to be pasted is also If the control is performed freely, the size and complexity of the apparatus will be increased. Therefore, in the sticking apparatus of the present invention, the fluid supply amount Q is controlled by the control means.

Here, when Q × (h / D) ² is less than 0.75 (× 10 ⁻⁶ m ³ / s), generation of voids cannot be sufficiently suppressed as will be described in an example described later. . In order to suppress the generation of voids more reliably, Q × (h / D) ² is preferably 1.00 (× 10 ⁻⁶ m ³ / s) or more, and 2.50 (× 10 More preferably, it is ⁻⁶ m ³ / s) or more. Note that Q × (h / D) ² is preferably as large as possible, but the diameter D and the interval h are limited as described above, and the fluid supply amount Q is also affixed as described in Patent Document 1, for example. Since there is an upper limit when air is supplied by releasing the space on the side opposite to the attachment surface of the member from a reduced pressure or a substantially vacuum state, Q × (h / D) ² is 30.00 (× 10 ⁻⁶ m ³ / s) or less, preferably 20.00 (× 10 ⁻⁶ m ³ / s) or less, more preferably 10.00 (× 10 ⁻⁶ m ³ / s) or less. More preferred.

  As described above, according to the present invention, it is possible to suppress a gap from being formed between the adhesive sheet and the adhesive sheet, particularly in the central portion of the adherend member. For example, the adherend member is a semiconductor wafer. In some cases, even if protrusions are formed on the surface to be pasted, the semiconductor chip cut out in the dicing process is prevented from scattering due to non-adhesion, and cooling water entering the back surface of the semiconductor wafer is prevented from entering the gap. Can do.

In one Embodiment of the sticking apparatus of the adhesive sheet of this invention, it is the schematic which shows the state which the sticking member has not expanded. In embodiment shown in FIG. 1, it is the schematic which shows the state which the sticking member expanded and began to be pressed on the to-be-sticked member.

  1 and 2 show an embodiment of a pressure-sensitive adhesive sheet pasting device of the present invention. In the sticking device of the present embodiment, a box-shaped upper case 1 having an opening at the bottom and a box-shaped lower case 2 having an opening at the top are provided so as to be opposed to each other in the vertical direction. When the upper and lower cases 1 and 2 are close to each other and the upper and lower parts that are opened are in close contact with each other, a closed space sealed inside is formed. The closed spaces in the upper and lower cases 1 and 2 are connected to a decompression device such as a vacuum pump (not shown) and can be decompressed to a decompressed state or a substantially vacuum state.

  On the lower surface of the top plate portion 1A of the upper case 1, a plate-like diaphragm 3 having elasticity such as rubber is used as a sticking member in this embodiment, and an annular plate-like frame 4 in which a circular opening 4A is formed. Is held by. The diaphragm 3 is a disk having a certain thickness, and is concentric with the circle formed by the opening 4A of the frame 4 so that the peripheral edge is sandwiched between the frame 4 and the top plate 1A. It is held fixed. A portion of the lower surface of the diaphragm 3 located in the opening 4A is a pasting surface 3A in the present embodiment.

  The sticking member is not particularly limited as long as it is an elastic body that can be expanded and contracted by a fluid, but natural rubber and synthetic rubber are preferable, and isoprene rubber, butadiene rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, acrylic rubber, and the like. Synthetic rubbers such as urethane rubber and silicone rubber are particularly preferred. In addition, the outer shape is not particularly limited as long as the shape of the sticking member is a plate shape. If the size includes the opening 4A of the frame 4, a circular shape, an elliptical shape, a triangular shape, a rectangular shape, a polygonal shape, an indefinite shape, or the like. The opening 4A of the frame 4 is not limited to a circular shape as long as the opening 4A of the frame 4 is similarly included in the sticking member.

  Furthermore, the thickness of the sticking member is not particularly limited as long as it can be expanded and contracted by a fluid, but is preferably 1 mm or more and 20 mm or less, and more preferably 2 mm or more and 10 mm or less. The sticking member needs to return to its original size after being stretched and deformed, and durability over time is required, but if the thickness is less than 1 mm, the durability may be inferior. In addition, if the thickness exceeds 20 mm, the plate becomes hard and may not extend to a desired size by the fluid. The sticking member 3A has a flat sticking surface 3A, and the surface opposite to the sticking surface 3A is formed in a convex shape with a portion located on the back side of the central portion of the sticking surface 3A protruding. Is preferred.

  The portion of the diaphragm 3 held in this way between the top plate portion 1A opposite to the attaching surface 3A is hermetically sealed with respect to the closed space in the upper and lower cases 1 and 2, and the top plate portion 1A. Is connected to a pipe 5 as a part of the fluid supply means in the present embodiment connected to. The pipe 5 is connected to a decompression device such as a vacuum pump as fluid supply means (not shown) via a flow rate adjusting valve 5A, and this flow rate adjusting valve 5A is connected to a computer or the like as the control means 5B in this embodiment. The flow rate of the fluid supplied through the pipe 5 is controllable.

  Furthermore, in this embodiment, the adhesive sheet 6 is attached to the pasting surface 3 </ b> A of the diaphragm 3 and disposed between the pasting member described below. The pressure-sensitive adhesive sheet 6 is preliminarily cut into a circular shape having a smaller diameter than the opening 4A, and in this embodiment, the pressure-sensitive adhesive sheet 6 is disposed by being adsorbed to the pasting surface 3A by static electricity. The lower surface of the pressure-sensitive adhesive sheet 6 arranged in this manner opposite to the sticking surface 3A is a pressure-sensitive adhesive surface 6A coated with a pressure-sensitive adhesive.

  On the other hand, a table 7 as a pasting portion is installed on the upper surface of the bottom of the lower case 2 directly below the diaphragm 3, and the semiconductor wafer 8 as a member to be pasted in this embodiment is placed on the table 7 on the table 7. It arrange | positions so that it may oppose 3 A of sticking surfaces at intervals. The semiconductor wafer 8 is also disk-shaped, and is disposed concentrically with the circular pasting surface 3A and the opening 4A of the frame 4, and the outer diameter thereof is the same as that of the adhesive sheet 6.

  In the sticking method of the pressure-sensitive adhesive sheet 6 according to one embodiment of the present invention in which the pressure-sensitive adhesive sheet 6 is stuck to the semiconductor wafer 8 (a member to be stuck) by the sticking device of the present embodiment configured as described above, first, the upper and lower cases 1, 2 The semiconductor wafer 8 is disposed on the table 7 in a state in which the closed space is opened while being spaced apart, and the adhesive sheet 6 is adsorbed and disposed on the attaching surface 3A of the diaphragm 3. Next, the upper and lower cases 1 and 2 are brought close to each other to bring the upper and lower portions into close contact with each other, thereby forming a closed space sealed inside as shown in FIG.

  Thereafter, the decompression device connected to the closed space and the decompression device connected to the pipe 5 gradually reduce the pressure between the closed space, the diaphragm 3 and the top plate portion 1A of the upper case 1, A reduced pressure state or a substantially vacuum state with the same pressure is used. When the predetermined pressure is reached, the upper and lower cases 1, 2 are opened by opening the flow regulating valve 5A and opening the space between the top plate portion 1A opposite to the attachment surface 3A of the diaphragm 3 under atmospheric pressure. As shown in FIG. 2, the adhesive surface 3 </ b> A has a spherical shape and the diaphragm 3 expands toward the semiconductor wafer 8 side due to the differential pressure with the closed space on the adhesive surface 3 </ b> A side. That is, in the present embodiment, the fluid that expands the diaphragm (sticking member) 3 is air (atmosphere).

The diaphragm 3 thus expanded is pressed against the semiconductor wafer 8 from the central portion of the attaching surface 3A, and the adhesive sheet 6 is attached to the upper surface (surface to be attached) of the semiconductor wafer 8 from the central portion. The air supply amount Q (× 10 ⁻³ m ³ / s) at this time is measured by a flow meter (not shown) installed in the middle of the pipe 5 between the flow regulating valve 5 A and the diaphragm 3. It is controlled by the control means 5B for adjusting the opening / closing of the provided flow rate adjusting valve 5A. Further, when the diaphragm 3 expands from the state shown in FIG. 2, the diaphragm 3 adheres to the semiconductor wafer 8 as a whole and the entire surface of the adhesive sheet 6 is adhered to the semiconductor wafer 8. The semiconductor wafer 8 is taken out and transferred to a subsequent process such as a dicing process.

And in the sticking method of the adhesive sheet 6 of this embodiment, the space | interval h (* 10 <^-3> m) of the sticking surface 3A of the diaphragm 3 of the unexpanded state shown in FIG. The diameter D (× 10 ⁻³ m) of the opening 4A and the supply amount (flow rate) Q (× 10 ⁻³ m ³ / s) of air are ^expressed as Q × (h / D) ² ≧ 0.75. Control is performed so as to satisfy (× 10 ⁻⁶ m ³ / s). Moreover, in the sticking apparatus of the adhesive sheet 6 of this embodiment, based on these space | interval h (* 10 <^-3> m) and diameter D (* 10 <^-3> m), as mentioned above, the supply amount Q ( × 10 ⁻³ m ³ / s) is controlled to satisfy Q × (h / D) ² ≧ 0.75 (× 10 ⁻⁶ m ³ / s). When the opening 4A of the frame 4 is not circular, the diameter D may be the diameter D of a circle inscribed in the opening 4A, that is, the diameter D of the largest circle included in the opening 4A.

In such a sticking method and sticking device for the pressure-sensitive adhesive sheet 6, in order to control Q × (h / D) ² to be larger than 0.75 (× 10 ⁻⁶ m ³ / s), the supply amount Q , Increase the spacing h, decrease the diameter D, or employ two or all three of these means together. When the distance h is increased or the diameter D is decreased, the curvature of the spherical surface formed by the pasting surface 3A when the expanded diaphragm 3 shown in FIG. As a result, the sticking surface 3A presses the center of the surface to be stuck of the semiconductor wafer 8, and the adhesive sheet 6 is stuck. Further, increasing the supply amount Q increases the attaching speed when the adhesive sheet 6 is attached by pressing the diaphragm 3 against the semiconductor wafer 8 in this way.

  Therefore, according to the sticking method and sticking device for the pressure-sensitive adhesive sheet 6 having the above-described configuration, the pressure-sensitive adhesive sheet 6 can be quickly stuck by reducing the area when the diaphragm 3 is pressed from the center of the surface to be stuck of the semiconductor wafer 8. Therefore, it is possible to suppress a gap that is likely to occur at the center of the surface to be bonded of the semiconductor wafer 8. For this reason, for example, even if the semiconductor wafer 8 with the bumps formed on the surface to be bonded is a member to be bonded, the semiconductor chip cut out in the dicing process is scattered or the cooling water enters the gap. Can be prevented.

Further, in order to satisfy Q × (h / D) ² ≧ 0.75 (× 10 ⁻⁶ m ³ / s), for example, the supply amount Q is constant, the height of the table 7 is changed, and the interval h is set. It is also possible to control the frame 4 by exchanging the frame 4 with one having a different diameter D of the opening 4A. However, if the interval h is variably adjusted, the apparatus may be enlarged or complicated. In addition, the diameter D of the opening 4A is often limited by the size of the member to be pasted or the pressure-sensitive adhesive sheet 6. On the other hand, in the sticking device for the pressure sensitive adhesive sheet 6 of this embodiment, the supply amount Q of the fluid (air) is controlled by the control means 5B, which leads to complication of the device structure, and the member to be pasted and the pressure sensitive adhesive. Without being limited to the size of the sheet 6, reliable and precise control can be performed.

In particular, when air as a fluid is supplied by opening the side opposite to the attachment surface 3A of the diaphragm 3 from the reduced pressure state or the substantially vacuum state to the atmosphere as in this embodiment, there is an upper limit on the supply amount Q. Therefore, Q × (h / D) ² is preferably 30.00 (× 10 ⁻⁶ m ³ / s) or less, more preferably 20.00 (× 10 ⁻⁶ m ³ / s) or less. More preferably, it is set to 10.00 (× 10 ⁻⁶ m ³ / s) or less. However, other fluids such as nitrogen, oxygen, argon, and other liquids such as water, oil, etc. may be supplied as the fluid to be supplied. The diaphragm 3 may be expanded by supplying it with pressure.

  Further, in the present embodiment, the case where the adhesive sheet 6 is pasted to the semiconductor wafer 8 as the member to be pasted has been described, but glass, polarizing plates, bottles, bottles, cardboard boxes, other articles, etc. other than the semiconductor wafer 8 are covered. It is also possible to apply the present invention to affix the adhesive sheet to the affixing member. Furthermore, in this embodiment, the pressure-sensitive adhesive sheet 6 cut into a circle in advance is adsorbed to the sticking surface 3A of the diaphragm 3 as a sticking member and stuck to the sticking member. For example, a tape-like pressure-sensitive adhesive sheet wound around a roll Even if the tape is fed between the pasting member and the pasting member and applied to the pasting member, it is cut, or the cut adhesive sheet is pasted on the supporting tape and pasted to the pasting member, and then the supporting tape is peeled off. Good.

Examples of the present invention will be given below to demonstrate the effects of the present invention. In this embodiment, the diameter D of the opening of the frame is 375 (× 10 ⁻³ m), and the distance h between the unexpanded diaphragm and the semiconductor wafer is 15 (× 10 ⁻³ m) and 20 (× 10 ^-3 m) Using the two types of the pasting device of the embodiment, the closed space in the upper and lower cases, the closed space between the diaphragm and the top plate portion are depressurized to a substantially vacuum state, and then the control means Air supply amount Q (× 10 ⁻³ m ³ / s) satisfies Q × (h / D) ² ≧ 0.75 (× 10 ⁻⁶ m ³ / s) by adjusting the opening and closing of the flow regulating valve. In this way, the space between the diaphragm and the top plate is opened under atmospheric pressure, and an 8 inch diameter semiconductor wafer is bonded to an 8 inch diameter adhesive sheet (Adwill (registered trademark) model number LE5000S manufactured by Lintec Corporation). Was affixed. The diaphragm is made of rubber having a thickness of 7 mm and a hardness of 65 degrees.

Moreover, as a comparative example with respect to these examples, Q × (h / D) ² is 0.75 (× 10 ⁻⁶ m ³ //) using the sticking device having an interval h of 15 (× 10 ⁻³ m). The same pressure-sensitive adhesive sheet as described above was affixed to the semiconductor wafer by controlling the air supply amount Q (× 10 ⁻³ m ³ / s) to be less than s). Then, in these examples and comparative examples, the ratio between the area of the portion where a gap was generated between the adhered adhesive sheet and the semiconductor wafer and the area of the adhesive sheet was visually evaluated. These results are shown in Table 1 together with the interval h, the supply amount Q, and Q × (h / D) ² . In the evaluation, a case where no generation of voids is recognized is indicated by a round mark, a case where the ratio is less than 1% and a slight generation is observed, a triangular mark, and a case where the ratio is 1 to 3% is a cross mark. is there.

From the results of Table 1, in Comparative Example 1 where Q × (h / D) ² <0.75 (× 10 ⁻⁶ m ³ / s), voids occurred exceeding 1% of the area of the pressure-sensitive adhesive sheet. In contrast, in Examples 1 to 11 that satisfy Q × (h / D) ² ≧ 0.75 (× 10 ⁻⁶ m ³ / s), the area of the portion where the void is generated is 1%. It was suppressed to less than. In particular, in Examples 1 to 5 where Q × (h / D) ² ≧ 2.50 (× 10 ⁻⁶ m ³ / s), no voids were generated.

3 Diaphragm (Attaching material)
3A sticking surface 4 frame 4A opening of frame 4 5 piping (fluid supply means)
5A Flow adjustment valve 5B Control means 6 Adhesive sheet 6A Adhesive surface 7 Table (attachment part)
8 Semiconductor wafer (bonding material)
D Diameter of the opening 4A of the frame 4 h Distance between the unexpanded diaphragm 3 and the semiconductor wafer 8

Claims (2)

An elastic plate-shaped sticking member is held by a frame in which an opening is formed, and the member to be stuck is arranged so as to face the sticking surface of the sticking member located in the opening of the frame with a gap. Then, an adhesive sheet is disposed between the sticking surface and the adherend member with the adhesive face facing the sticking member, and fluid is supplied to the opposite side of the sticking member to the sticking surface. A pressure-sensitive adhesive sheet sticking method for sticking the pressure-sensitive adhesive sheet by pressing the sticking surface against the sticking member by inflating a member from the opening to the sticking member side,
A distance h (× 10 ⁻³ m) between the pasting surface of the pasting member in an unexpanded state and the member to be pasted, a diameter D (× 10 ⁻³ m) of a circle inscribed in the opening, The fluid supply amount Q (× 10 ⁻³ m ³ / s) is controlled so as to satisfy Q × (h / D) ² ≧ 0.75 (× 10 ⁻⁶ m ³ / s). How to stick the adhesive sheet. The plate-like sticking member having elasticity held by the frame in which the opening is formed and the sticking member are arranged so as to face the sticking surface of the sticking member located in the opening of the frame with a space therebetween A fluid for supplying a fluid to the opposite side of the affixing part and the affixing surface of the affixing member and expanding the affixing member from the opening to the affixed member side, thereby pressing the affixing surface against the affixed member A pressure-sensitive adhesive sheet sticking device for sticking a pressure-sensitive adhesive sheet disposed between the sticking surface and the sticking member with the sticking surface facing the sticking member side to the sticking member. ,
It said fluid supply means, the distance h between the a landing member and attaching surface of the sticking member unexpanded (× 10 -3 ^m), the diameter D of the circle inscribed in the opening (× 10 ^{- 3} m) and on the basis, the supply amount Q of the fluid ^{(× 10 -3 m 3 / s} ), satisfies the ^{Q × (h / D) 2} ≧ 0.75 (× 10 -6 m 3 / s) A pressure-sensitive adhesive sheet affixing device, characterized by comprising control means for controlling in this manner.

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