JP2012038880A - Sheet pasting device and pasting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet pasting device and a pasting method capable of preventing a slack caused in an adhesive sheet pasted on a ring frame from staying on a surface adhered to an object to be adhered and becoming a wrinkle.SOLUTION: The sheet pasting device comprises: a first case 13 and a second case 12 which accommodate a table 11 for supporting an object to be adhered W and have a decompression chamber C formed therein; support means 15 which supports a ring frame RF and directs an adhesive sheet S for blocking an open portion of the ring frame to the object to be adhered; and pressing means 20 and P2 for pressing the adhesive sheet S against the object to be adhered W. The device pastes the adhesive sheet S to the object to be adhered W while reducing a pressure in the decompression chamber C. The support means 15 comprises a frame support part 35 for supporting the ring frame RF, and a sheet support part 36 for supporting a portion of the adhesive sheet S which is located inside the ring frame RF and outside the object to be adhered W.

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more specifically, when sticking an adhesive sheet that is stuck in advance so as to close an opening of a ring frame on an adherend such as a semiconductor wafer. The present invention relates to a sheet sticking apparatus and a sticking method that can take a slack of the sticking.

  Conventionally, a protective sheet for protecting the circuit surface is affixed to a semiconductor wafer (hereinafter sometimes simply referred to as a “wafer”), or a dicing tape or an adhesive sheet for die bonding is affixed to the back surface. It has been done.

  In Patent Document 1, an elastic sheet is arranged in a case constituted by an upper case and a lower case to form an upper decompression chamber and a lower decompression chamber, and an opening of a ring frame is previously provided above the elastic sheet. By placing the adhesive sheet (adhesive sheet) and the wafer attached so as to be closed, and depressurizing the upper and lower decompression chambers, the lower decompression chamber is controlled to approach atmospheric pressure, thereby deforming the elastic sheet. The structure which sticks an adhesive sheet toward the outer side from the center part of a wafer is disclosed.

Japanese Patent Laid-Open No. 10-233430

  However, in the sheet sticking device disclosed in Patent Document 1, in the case where the adhesive sheet previously stuck so as to close the opening of the ring frame is loose, the adhesive surface between the wafer and the adhesive sheet This causes inconvenience that wrinkles are generated and sheet sticking is poor.

[Object of invention]
The object of the present invention is that even if the adhesive sheet previously stuck so as to close the opening of the ring frame is loose, this looseness is located within the adhesion surface with the adherend and becomes a wrinkle. It is providing the sheet sticking apparatus and sticking method which can prevent.

  In order to achieve the above object, the present invention provides a table for supporting an adherend, a first case and a second case for accommodating the table and forming a decompression chamber therein, and an opening that is closed by an adhesive sheet. The pressure frame is formed by supporting means for supporting the ring frame and supporting the adhesive sheet at a position facing the adherend, and pressing means for pressing and sticking the adhesive sheet to the adherend. In the sheet sticking apparatus for sticking the adhesive sheet to the adherend under reduced pressure, the support means includes a frame support portion for supporting the ring frame, an inner side of the ring frame, and an outer side of the adherend. It has the structure of having the sheet | seat support part which supports this adhesive sheet part.

  The present invention employs a configuration in which drive means for moving the frame support portion and the seat support portion up and down relatively is provided.

  The present invention also provides a step of preparing a ring frame whose opening is closed by an adhesive sheet, a step of supporting an adherend, and a support of the ring frame at a position where the adhesive sheet faces the adherend. And a step of supporting an adhesive sheet portion inside the ring frame and outside the adherend, a step of accommodating the adherend and the adhesive sheet in a decompression chamber, and a step of decompressing the decompression chamber; And a step of pressing and adhering the adhesive sheet to the adherend in the decompressed decompression chamber.

According to the present invention, since the supporting means having the frame supporting portion and the sheet supporting portion is provided, the sheet supporting portion can be used even if the adhesive sheet previously stuck to close the opening of the ring frame is loosened. The adhesive sheet can be affixed to the adherend without the slack, and the slack is located in the adhesive surface with the adherend as in the past, resulting in poor sheet adhesion. Such inconveniences can be solved. And since an adhesive sheet is affixed on a to-be-adhered body toward the outer side from a center part, an adhesive sheet can be reliably affixed without interposing a space between an adherend and an adhesive sheet.
In addition, when the driving means for moving the frame support portion and the sheet support portion relative to each other is provided, the adhesive sheet can be attached to the adherend without wrinkles regardless of the looseness of the adhesive sheet. .
Note that in this specification, reduced pressure includes a vacuum.

The schematic sectional drawing of the sheet sticking apparatus which concerns on this embodiment. The schematic sectional drawing which shows the state which formed the initial stage adhesive part in the adhesive sheet. The schematic sectional drawing which shows the state by which the adhesive sheet was affixed on the to-be-adhered body under pressure reduction. The schematic sectional drawing which shows the state by which the adhesive sheet was affixed on the to-be-adhered body under atmospheric pressure. The schematic sectional drawing of the sheet sticking apparatus which concerns on a modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In FIG. 1, a sheet sticking apparatus 10 can accommodate a wafer W with a table 11 that supports a wafer W as an adherend and an adhesive sheet S at a position facing the wafer W, and the adhesive sheet S. A lower case (first case) 13 that forms a sealed first space C1, and a pressure in the first space C1 can be controlled, and is configured by a decompression pump, an air regulator, a solenoid valve, and the like (not shown). An upper case (second case) 12 that forms a second space C2 (see FIG. 2) sealed with the pressure control means P1 and the adhesive sheet S on the opposite side of the first space C1 with the adhesive sheet S interposed therebetween. The pressure of the second space C2 can be controlled, and the wafer W is brought into contact with the adhesive sheet S and the second pressure control means P2 constituted by a decompression pump, an air regulator, an electromagnetic valve, etc. (not shown). Is constituted by a contact means 16. The second pressure control means P2 also functions as a pressing means. Moreover, the decompression chamber C is comprised by the 1st space C1 and the 2nd space C2. Here, as the wafer W in the present embodiment, a wafer having an annular convex portion W1 formed on the outer periphery by back surface grinding is employed.

  The table 11 is formed so as to be able to hold the wafer W on the upper surface side through holding means (not shown). The table 11 is fixed to the upper end of the output shaft 21 of the linear motion motor 20 as a driving device which is a contact means 16 supported in the lower case 13, and can be moved up and down by the advancement and retraction of the output shaft 21. . The direct acting motor 20 also functions as a pressing unit.

  The upper case 12 is formed of a flat plate having a circular shape in plan view, and is provided so as to be movable up and down via a driving device (not shown). A pipe 23 penetrating in the thickness direction is provided at the center of the upper case 12, and a pipe 25 connected to the pipe 23 is connected to the second pressure control means P2. An annular outer elastic member 26 made of an elastic body is disposed on the outer peripheral edge of the lower surface of the upper case 12, and can be disposed on a concentric circle inside thereof at a position facing the convex portion W <b> 1 of the wafer W. An inner elastic member 27 made of an elastic body is disposed. The lower surfaces of the outer elastic member 26, the inner elastic member 27, and the upper case 12 are provided so as to be flush with each other, but the lower surface position of each elastic member 26, 27 is relative to the lower surface position of the upper case 12. You may comprise so that it may project in the up-down direction relatively.

  The lower case 13 is provided in an open top cylindrical shape with a bottom, and has support means 15. The bottom wall 13A of the lower case 13 is provided with a pipe 31 penetrating in the thickness direction, and a pipe 33 connected to the pipe 31 is connected to the first pressure control means P1.

  The support means 15 includes a frame support portion 35 that supports the ring frame RF whose opening is closed by the adhesive sheet S, and a sheet that supports the portion of the adhesive sheet S that is inside the ring frame RF and outside the wafer W. It is comprised by the linear motion motor LM as a drive device which is a drive means which raises / lowers the support part 36, the flame | frame support part 35, and the sheet | seat support part 36 relatively. In the present embodiment, the frame support portion 35 is constituted by a peripheral wall 13B constituting the lower case 13, and is provided with a holding means (not shown) that positions and holds the ring frame RF placed on the upper surface thereof. The seat support portion 36 includes a cylindrical body 38 disposed on the inner peripheral side of the frame support portion 35, and a receiving body that is disposed on the upper end surface of the cylindrical body 38 and is provided with the same shape as the outer elastic member 26. The side elastic member 40 is comprised. The sheet support portion 36 functions to eliminate the slackness of the adhesive sheet S via the linear motor LM when the ring frame RF is placed on the upper surface of the frame support portion 35. If this amount of slack is known in advance, the direct acting motor LM can be omitted. The upper surface of the receiving side elastic member 40 is formed as a non-adhesion treated surface coated with a fluororesin or the like so that the adhesive of the adhesive sheet S does not adhere. Moreover, rubber | gum, resin, etc. can be illustrated as an elastic body which comprises the outer side, inner side elastic members 26 and 27, and the receiving side elastic member 40. FIG.

  Next, the sheet sticking method in this embodiment is demonstrated, referring also to FIG. 2 thru | or FIG.

  As shown in FIG. 1, in an open state in which the upper case 12 is separated from the lower case 13, the wafer W is placed on the table 11 via a transfer means (not shown), and the wafer is held by a holding means (not shown). Hold W. Thereafter, the ring frame RF whose opening is closed by the adhesive sheet S is placed on the frame support 35 by a conveying means (not shown). Then, when the ring frame RF is fixed by a holding means (not shown), the frame support portion 35 is driven so that the linear motion motor LM is driven and the sheet support portion 36 is moved up and down so that the adhesive sheet S is not loosened.

  Next, when the upper case 12 is lowered so that the outer elastic member 26 sandwiches the adhesive sheet S from above and below with the receiving elastic member 40, the upper open portion of the lower case 13 is closed and sealed by the adhesive sheet S. A first space C1 is formed, and a second space C2 sealed by the upper case 12 and the adhesive sheet S is formed. Thereafter, the first and second spaces C1 and C2 are depressurized at the same pressure reduction rate via the first and second pressure control means P1 and P2, and the first and second spaces C1 and C2 are finally the same. A predetermined internal pressure state is set. Then, the atmosphere is introduced only into the second space C2 via the second pressure control means P2, and the pressure in the second space C2 is set to be relatively higher than the pressure in the first space C1. As shown in FIG. 2, the adhesive sheet S swells downward, and the central part thereof is formed as the initial adhesive part S <b> 1 closest to the wafer W. Note that only the first space C1 is further depressurized via the first pressure control means P1, or the atmosphere is introduced only into the second space C2 via the second pressure control means P2 and the first pressure control means P1. In addition, by further reducing only the pressure in the first space C1, the pressure in the second space C2 is set to be relatively higher than the pressure in the first space C1, thereby forming the initial bonding portion S1. Also good.

  After the initial bonding portion S1 is formed, when the table 11 is moved up by driving the linear motor 20 as shown by a two-dot chain line in FIG. When S1 comes into contact and then the table 11 is raised, as shown in FIG. 3, the adhesive sheet S is sandwiched between the convex portion W1 of the wafer W and the inner elastic member 27, and the rise of the table 11 is stopped. Let At this time, a third space C3 is formed in the second space C2 and sealed between the adhesive sheet S and the inner side of the inner elastic member 27, and in the first space C1, A sealed fourth space C4 is formed between the adhesive sheet S and the convex portion W1 of the wafer W. After that, when the atmosphere is introduced into the third space C3 so that the third space C3 gradually becomes atmospheric pressure via the second pressure control means P2, as shown in FIG. The space C4 disappears when pushed by the atmospheric pressure of the third space C3. At this time, the linear motion motor 20 and the second pressure control means P2 function as pressing means.

  Thereafter, when the atmosphere is introduced into the first space C1 so that the first space C1 gradually becomes atmospheric pressure via the first pressure control means P1, and the first space C1 becomes atmospheric pressure. Then, the upper case 12 is raised. Thereafter, the wafer W attached to the adhesive sheet S is taken out by a transfer means (not shown) and transferred to another process, and thereafter the same operation as described above is repeated.

  Therefore, according to such an embodiment, even if the adhesive sheet S pasted so as to close the opening of the ring frame RF is loosened, the sheet support portion 36 eliminates this loosening and the adhesive sheet S can be attached to the wafer W.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, as shown in FIG. 5, the upper case 12 may be configured to have an elastic sheet 70, and the elastic sheet 70 may be inflated and the adhesive sheet S may be pressed against the wafer W and pasted. In this case, the space formed by the upper case 12 and the elastic sheet 70 becomes the second space C2.

  Further, in the above-described embodiment, the wafer W has a shape having the convex portion W1 on the outer periphery. However, a wafer having no convex portion W1 or a wafer having bumps as electrodes can be targeted.

  Further, the upper case 12 and the lower case 13 may be arranged upside down or may be arranged to open and close in the horizontal direction. Further, in the above embodiment, the upper case 12 can be moved up and down, but the lower case 13 can be moved up and down, and the upper and lower cases 12 and 13 can be moved respectively. In addition, the outer elastic member 26 and the inner elastic member 27 may be configured as an integral member, or an elastic body may be provided on the entire lower surface side of the upper case 12.

  Further, although the frame support portion 35 is configured by the peripheral wall 13B of the lower case 13, the frame support portion 35 may be configured to support the ring frame RF independently in the lower case 13.

Furthermore, the adherend in the present invention is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound semiconductor wafer.
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

10 Sheet pasting device 11 Table 12 Upper case (second case)
13 Lower case (first case)
15 support means 20 linear motion motor (pressing means)
35 Frame support part 36 Sheet support part C Decompression chamber LM Linear motion motor (drive means)
P2 Second pressure control means (pressing means)
RF ring frame S Adhesive sheet W Semiconductor wafer (Substrate)

Claims (3)

A table for supporting the adherend, a first case and a second case for accommodating the table and forming a decompression chamber therein, a ring frame whose opening is closed by an adhesive sheet, and the adhesive sheet Supporting means for supporting the adhesive sheet at a position facing the adherend, and pressing means for pressing and adhering the adhesive sheet to the adherend, forming the decompression chamber and attaching the adhesive sheet under reduced pressure In the sheet sticking device that sticks to the body,
The support means includes a frame support portion that supports the ring frame, and a sheet support portion that supports an adhesive sheet portion inside the ring frame and outside the adherend. apparatus.   The sheet sticking apparatus according to claim 1, further comprising a driving unit that moves the frame support part and the sheet support part up and down relatively. Preparing a ring frame whose opening is closed by an adhesive sheet;
A step of supporting the adherend;
Supporting the ring frame at a position where the adhesive sheet faces the adherend, and supporting an adhesive sheet portion inside the ring frame and outside the adherend;
Storing the adherend and the adhesive sheet in a decompression chamber;
Depressurizing the decompression chamber;
And a step of pressing and adhering the adhesive sheet to an adherend in the decompressed decompression chamber.

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