JP2016006445A - Vibration mirror package and projector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration mirror package capable of suitably performing electrical connection to a vibration mirror component.SOLUTION: A MEMS mirror package 3b (vibration mirror package) comprises: a MEMS mirror component 31 including a mirror part 31a, a drive part 31b, and a first electrode 32; a recess part 33c for storing the MEMS mirror component 31; and an electrode connection part 34 disposed at a position corresponding to a first electrode 32 of the MEMS mirror component 31 on a bottom surface 33d of the recess part 33c. The MEMS mirror package comprises an attachment plate 33 where a wiring patter 36 to which the electrode connection part 34 is formed at one end part is formed on a surface. The MEMS mirror component 31 and the attachment plate 33 are bonded by a conductive adhesive 8 while the first electrode 32 and the electrode connection part 34 are arranged so as to face each other, thereby, the first electrode 32 and the electrode connection part 34 are electrically connected.

Description

  The present invention relates to a vibrating mirror package and a projector, and more particularly to a vibrating mirror package and a projector including a vibrating mirror element.

  Conventionally, a vibration mirror package including a vibration mirror element is known (see, for example, Patent Document 1).

  Patent Document 1 discloses a vibrating mirror package including a MEMS element including a mirror part and a member to which the MEMS element is attached. The MEMS element has an electrode pad and is electrically connected to an electrode provided on a member to which the MEMS element is attached by a bonding wire. The bonding wire is not sealed with resin or the like so as not to restrict the driving of the vibrating mirror part.

JP 2011-91436 A

  However, in the said patent document 1, there exists a problem that it may short-circuit when bonding wires contact. In addition, there is a problem that noise may occur due to the proximity of bonding wires. In short, there is a problem that it is difficult to make an appropriate electrical connection to the vibrating mirror element.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a vibrating mirror package and a projector capable of appropriately performing electrical connection to the vibrating mirror element. Is to provide.

  A vibrating mirror package according to a first aspect of the present invention includes a vibrating mirror element that includes a mirror portion, a drive unit that drives the mirror portion, a first electrode, a recess that houses the vibrating mirror element, and an inner portion of the recessed portion. An oscillating mirror including an electrode connecting portion provided at a position corresponding to the first electrode of the oscillating mirror element on a side surface, and an attachment member having a wiring pattern provided on the surface with the electrode connecting portion provided on one end thereof The element and the attachment member are electrically connected to each other with the conductive adhesive in a state where the first electrode and the electrode connecting portion are arranged to face each other, so that the first electrode and the electrode connecting portion are electrically connected. And are fixed to each other.

  In the oscillating mirror package according to the first aspect of the present invention, as described above, the oscillating mirror element and the mounting member are bonded with the conductive adhesive in a state where the first electrode and the electrode connecting portion are opposed to each other. By doing so, the first electrode and the electrode connecting portion are electrically connected and fixed to each other. As a result, the vibrating mirror element and the mounting member are electrically connected and fixed to each other by the conductive adhesive, so that a short circuit or noise occurs as in the case of using a conventional bonding wire. Can be prevented. That is, it is possible to appropriately connect the vibrating mirror element with the conductive adhesive. In the present invention, the vibrating mirror element including the first electrode is housed in the recess. Thereby, since a vibration mirror element is accommodated in the recessed part of an attachment member, components can be arrange | positioned efficiently. As a result, the apparatus can be reduced in size. In the present invention, an electrode connection portion which is one end portion of the wiring pattern is provided at a position corresponding to the first electrode on the inner side surface of the recess, and the wiring pattern is formed on the surface of the mounting member. Thereby, since the wiring pattern is formed on the surface of the mounting member, it is possible to prevent the optical path from being restricted by the bonding wire as in the case of using the conventional bonding wire. As a result, a wide range of light scanning angles can be secured.

  In the vibrating mirror package according to the first aspect, preferably, the attachment member is provided on a surface different from the surface on the side where the mirror portion is irradiated with light, and is connected to the other end of the wiring pattern. In addition. If comprised in this way, a vibration mirror element shall be electrically connected with the exterior (flexible wiring board etc.) in the position away from the vibration mirror element by the 2nd electrode connected to the other end part of a wiring pattern. Can do. Thereby, when electrically connecting a 2nd electrode and the exterior, it can suppress that a vibrating mirror element is exposed to the high temperature exceeding heat-resistant temperature. As a result, it is possible to suppress the vibration mirror element from being damaged by heat.

  In the vibrating mirror package according to the first aspect, preferably, the concave portion of the mounting member is in the vicinity of the edge where the vibrating mirror element is disposed, and on the adhesive surface to which the vibrating mirror element is bonded by the conductive adhesive. It has an adhesive relief part for releasing the conductive adhesive. If comprised in this way, since the application amount of a conductive adhesive can be balanced by letting away an excess conductive adhesive to an adhesive escape part, a vibration mirror element inclines with respect to an attachment member. It is possible to suppress the adhesion in a state of being damaged.

  In this case, preferably, the adhesive relief portion is formed at each of a plurality of corners of the edge portion of the bonding surface. If comprised in this way, since the excess conductive adhesive can be escaped in a well-balanced manner by the adhesive escape portions formed respectively at the plurality of corners, the balance of the application amount of the conductive adhesive can be more stable. Can be taken. As a result, it is possible to further suppress the vibration mirror element from being attached to the attachment member in a tilted state.

  In the vibration mirror package according to the first aspect, preferably, the inner surface of the concave portion of the mounting member constitutes a positioning portion for positioning the vibration mirror element. If comprised in this way, since a vibration mirror element can be easily positioned and fixed with respect to an attachment member by the inner surface of the recessed part which comprises a positioning part, the work burden of an installation operator can be reduced. it can.

  In the vibrating mirror package according to the first aspect, preferably, the mounting member penetrates from the surface opposite to the concave portion to the concave portion, and transmits the light irradiated to the mirror portion, and the light guide hole portion. And a second electrode that is electrically connected to the electrode connecting portion by a wiring pattern. The mirror portion of the vibrating mirror element is bonded to the vibrating mirror element by a conductive adhesive. It is arranged on the adhesive surface side. If comprised in this way, since the 1st electrode and mirror part which are adhere | attached with respect to the electrode connection part of an attachment member with a conductive adhesive will be arrange | positioned on the same surface side, The wiring for electrically connecting the first electrode and the mirror portion can be easily formed.

  In the vibration mirror package according to the first aspect, preferably, the attachment member further includes a second electrode provided on a surface opposite to the concave portion and connected to the electrode connection portion by a wiring pattern, The mirror portion is disposed on a surface opposite to the bonding surface side to which the vibrating mirror element is bonded by the conductive adhesive. If comprised in this way, since the recessed part of an attachment member will be provided in the surface by which the light is irradiated to a mirror part, a vibration mirror element will be provided from the opposite side to the 2nd electrode side (installation surface side) of an attachment member. Can be attached. That is, the vibrating mirror element can be arranged on the exposed surface side (light path side) of the mounting member. As a result, there is no need to provide a light guide hole (light guide hole part) as in the case where the vibration mirror element is attached to the attachment member from the installation surface side. The optical path length can be shortened by the depth of).

  In the vibrating mirror package according to the first aspect, the attachment member is preferably a reinforcing member that reinforces the vibrating mirror element. If comprised in this way, since a vibration mirror element is reinforced by the attachment member which has a function as a reinforcement member, it can suppress that a vibration mirror element deform | transforms with a heat | fever, external stress, etc. FIG.

  A projector according to a second aspect of the present invention includes a light source unit that emits light for projecting an image, a mirror unit that reflects light from the light source unit, a drive unit that drives the mirror unit, and a first electrode. Including an oscillating mirror element, a recess in which the oscillating mirror element is accommodated, and an electrode connection portion provided at a position corresponding to the first electrode of the oscillating mirror element on the inner surface of the recess, and electrode connection at one end And a vibrating mirror element and the mounting member are made of a conductive adhesive in a state where the first electrode and the electrode connecting portion are opposed to each other. By being bonded, the first electrode and the electrode connecting portion are electrically connected and fixed to each other.

  In the projector according to the second aspect of the present invention, as described above, the vibrating mirror element and the mounting member are bonded with the conductive adhesive in a state where the first electrode and the electrode connecting portion are opposed to each other. Thus, the first electrode and the electrode connecting portion are electrically connected and fixed to each other. As a result, the vibrating mirror element and the mounting member are electrically connected and fixed to each other by the conductive adhesive, so that a short circuit or noise occurs as in the case of using a conventional bonding wire. Can be prevented. That is, it is possible to appropriately connect the vibrating mirror element with the conductive adhesive. In the present invention, the vibrating mirror element including the first electrode is housed in the recess. Thereby, since a vibration mirror element is accommodated in the recessed part of an attachment member, components can be arrange | positioned efficiently. As a result, the main body of the projector can be reduced in size. In the present invention, an electrode connection portion which is one end portion of the wiring pattern is provided at a position corresponding to the first electrode on the inner side surface of the recess, and the wiring pattern is formed on the surface of the mounting member. Thereby, since the wiring pattern is formed on the surface of the mounting member, it is possible to prevent the optical path from being restricted by the bonding wire as in the case of using the conventional bonding wire. As a result, it is possible to provide a projector capable of securing a wide range of light scanning angles.

  According to the present invention, as described above, it is possible to provide a vibrating mirror package and a projector that can appropriately perform electrical connection to the vibrating mirror element.

It is the block diagram which showed the whole structure of the projector by 1st-3rd embodiment of this invention. It is the perspective view which showed the MEMS mirror package of the projector by 1st Embodiment of this invention. It is the top view which showed the MEMS mirror package which scans the horizontal direction of the projector by 1st Embodiment of this invention. It is sectional drawing in alignment with the 500-500 line in the state which attached the MEMS mirror element to the attachment board of FIG. It is the elements on larger scale which expanded the part of the MEMS mirror element in FIG. It is the top view which showed the MEMS mirror package which scans the perpendicular direction of the projector by 1st Embodiment of this invention. It is the top view which showed the MEMS mirror package which scans the horizontal direction of the projector by 2nd Embodiment of this invention. It is the top view which showed the MEMS mirror package which scans the horizontal direction of the projector by 3rd Embodiment of this invention. It is sectional drawing along the 600-600 line in the state which attached the MEMS mirror to the attachment plate of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
The configuration of the projector 100 according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the projector 100 according to the first embodiment of the present invention includes a light emitting unit 1, an optical scanning unit 2, and a control unit 7.

  The light emitting unit 1 is configured to combine red, blue, and green light for projecting the image 90 and emit the resultant light toward the optical scanning unit 2. The light scanning unit 2 is configured to scan light emitted from the light emitting unit 1 in a predetermined direction. The projector 100 is configured to project the image 90 onto the screen 91 by scanning the light emitted from the light emitting unit 1 with the optical scanning unit 2.

  Next, the configuration of each unit of the projector 100 will be described in detail.

  The light emitting unit 1 includes three (red (R), green (G), and blue (B)) light source units 10a to 10c, three prisms 11a to 11c, and a light source driver 12.

  The light source unit 10a is configured to emit red light toward the prism 11a. The light source unit 10b is configured to emit green light toward the prism 11b. The light source unit 10c is configured to emit blue light toward the prism 11c.

  The three prisms 11a to 11c are configured to synthesize three laser beams (red (R), green (G), and blue (B)) and align the optical axes of the three laser beams. .

  The light source driver 12 is configured to receive a drive signal from the control unit 7 and emit light at a predetermined timing from the light source units 10a to 10c.

  The optical scanning unit 2 includes a horizontal light scanning unit 3, a vertical light scanning unit 4, a base unit 5, and a mirror driver 6.

  The horizontal light scanning unit 3 and the vertical light scanning unit 4 have the same configuration. Therefore, in the following, the horizontal light scanning unit 3 will be described in detail, and the vertical light scanning unit 4 will be described with respect to differences from the horizontal light scanning unit 3 (the description of the same configuration as the horizontal light scanning unit 3 will be omitted). To do).

  The horizontal light scanning unit 3 is configured to reflect light from the light emitting unit 1 and to scan light in the horizontal direction with respect to the screen 91. Further, the horizontal light scanning unit 3 includes a flexible wiring board 3a and a MEMS (Micro Electro Mechanical Systems) mirror package 3b. The MEMS mirror package 3b is an example of the “vibrating mirror package” in the present invention.

  The flexible wiring board 3a is connected to a later-described second electrode 35 (see FIG. 2) of the MEMS mirror package 3b, so that a signal (drive signal and drive signal) required for driving between the MEMS mirror package 3b and the control unit 7 is obtained. Feedback signals) are transmitted to each other.

  As shown in FIG. 2, the MEMS mirror package 3b includes a MEMS mirror element 31 and a mounting plate 33 to which the MEMS mirror element 31 is attached. The MEMS mirror element 31 is an example of the “vibrating mirror element” in the present invention. The mounting plate 33 is an example of the “mounting member” and “reinforcing member” in the present invention.

  Both the MEMS mirror element 31 and the mounting plate 33 are formed in a rectangular shape and a flat plate shape. Further, the MEMS mirror element 31 and the mounting plate 33 are arranged in parallel to each other.

  Here, in the following description, the long side direction of the mounting plate 33 is the A direction. Further, the short side direction of the mounting plate 33 is a B direction.

  The mounting plate 33 is configured such that light for projecting the image 90 (see FIG. 4) passes through one side. Therefore, the surface of the mounting plate 33 on the light path side with respect to the mounting plate 33 is defined as a first surface 33a. In addition, a surface opposite to the first surface 33a of the mounting plate 33 is a second surface 33b. Further, a direction orthogonal to the first surface 33a and the second surface 33b is defined as a C direction. Further, a direction from the second surface 33b toward the first surface 33a in the C direction is defined as a C1 direction. Further, the direction opposite to the C1 direction is defined as a C2 direction.

  The MEMS mirror element 31 includes a mirror unit 31a, a pair of drive units 31b that drive the mirror unit 31a, and a first electrode 32.

  Further, the MEMS mirror element 31 is configured to be accommodated from the C2 direction side in a later-described recess 33c provided on the second surface 33b of the mounting plate 33. Further, as shown in FIG. 3, the MEMS mirror element 31 is configured to be bonded to the mounting plate 33 by the conductive adhesive 8. In addition, as the conductive adhesive 8, one having a curing temperature lower than the heat resistant temperature of the MEMS mirror element 31 is used.

  The mirror unit 31a is configured to reflect light. The mirror part 31a is formed in a circular shape. Moreover, the mirror part 31a is arrange | positioned at the one surface side (C1 direction side) of the MEMS mirror element 31. FIG. Here, one surface of the MEMS mirror element 31 on the side where the mirror part 31a is irradiated with light is referred to as a light incident surface 31c.

  The pair of drive units 31b are each formed in a bar shape. Each of the pair of drive parts 31b supports the mirror part 31a at one end so as to be swingable. Further, the pair of drive parts 31b are arranged on the same axis α so as to sandwich the mirror part 31a. The axis α extends in the B direction. The drive unit 31b includes a piezoelectric element (not shown) connected to the first electrode 32 by wiring (not shown).

  The first electrode 32 is disposed near the four corners of the light incident surface 31c where the mirror portion 31a is not disposed. Further, the conductive adhesive 8 is evenly applied in the vicinity of the four corners of the light incident surface 31c.

  The mounting plate 33 includes a recess 33 c, an electrode connection portion 34, a light guide hole portion 33 f, and a second electrode 35.

  The mounting plate 33 is made of resin. The attachment plate 33 is configured to reinforce the MEMS mirror element 31 to be attached. Further, the mounting plate 33 has a wiring pattern 36 formed on the surface thereof, in which an electrode connection portion 34 is provided at one end. The second electrode 35 is connected to the other end of the wiring pattern 36. That is, the electrode connection portion 34 and the second electrode 35 are electrically connected by the wiring pattern 36. A method for forming the wiring pattern 36 will be described later.

  The recess 33c is provided at the approximate center of the second surface 33b. Moreover, as shown in FIG. 4, the recessed part 33c is comprised from the bottom face 33d and the side surface 33e. Moreover, the recessed part 33c is formed in the rectangular shape (refer FIG. 3) in planar view. Further, the depth in the C direction of the concave portion 33 c is configured to be larger than the thickness in the C direction of the MEMS mirror element 31. The bottom surface 33d and the side surface 33e are examples of the “inside surface” of the present invention.

  Further, the side surface 33e of the concave portion 33c constitutes a positioning portion for positioning the MEMS mirror element 31. That is, as shown in FIG. 3, the outer shape (rectangular shape) of the concave portion 33 c is slightly larger than the outer shape (rectangular shape) of the MEMS mirror element 31 to the extent that the housing of the MEMS mirror element 31 is not hindered in plan view. It is comprised so that it may become. Accordingly, the concave portion 33c regulates the movement of the MEMS mirror element 31 accommodated by the side surface 33e, so that the horizontal position of the MEMS mirror element 31 (position in a direction parallel to the bottom surface 33d (position in the A direction and B direction)). Is configured to position.

  Further, the recess 33c is electrically conductive in the vicinity of the edge where the MEMS mirror element 31 is disposed and on the bottom surface 33d (adhesion surface) to which the MEMS mirror element 31 (light incident surface 31c) is adhered by the conductive adhesive 8. An adhesive escape hole 81 for releasing the adhesive 8 is provided. Specifically, the adhesive relief hole 81 is formed at each of the four corners of the edge of the bottom surface 33d (adhesion surface) of the recess 33c. The adhesive escape hole 81 is configured to penetrate the attachment plate 33 in the thickness direction (C direction). The adhesive escape hole 81 is an example of the “adhesive escape part” in the present invention.

  The electrode connecting portion 34 is provided at a position corresponding to the first electrode 32 of the MEMS mirror element 31. In other words, the electrode connecting portion 34 is provided at a predetermined position on the bottom surface 33d that is disposed at a position facing the light incident surface 31c of the MEMS mirror element 31 on which the first electrode 32 is provided.

  Here, in the first embodiment, the mounting plate 33 and the MEMS mirror element 31 are electrically conductive in a state where the electrode connecting portion 34 of the mounting plate 33 and the first electrode 32 of the MEMS mirror element 31 are arranged to face each other. It is configured to be bonded by the adhesive 8. Thereby, the electrode connection part 34 and the 1st electrode 32 are comprised so that it may be electrically connected and it may mutually be fixed. Accordingly, the second electrode 35 of the mounting plate 33 is configured to be electrically connected to the first electrode 32 of the MEMS mirror element 31 via the wiring pattern 36, the electrode connection portion 34, and the conductive adhesive 8. ing.

  As shown in FIGS. 4 and 5, the light guide hole 33f is configured to penetrate from the first surface 33a to the recess 33c. In addition, the light guide hole 33f is provided substantially at the center of the first surface 33a. Further, the light guide hole portion 33f is configured to pass light irradiated to the mirror portion 31a of the MEMS mirror element 31.

  The light guide hole 33f is provided in a range slightly larger than the range in which the mirror 31a and the drive unit 31b of the MEMS mirror element 31 are arranged in plan view. Thereby, the light guide hole 33f secures the drive range of the mirror 31a and the drive unit 31b, and prevents the mirror 31a and drive 31b to be driven from contacting the mounting plate 33.

  As shown in FIG. 4, the second electrode 35 is provided in the vicinity of the end portion in the A direction (longitudinal direction) of the second surface 33b. The second electrode 35 is configured such that the other end portion of the wiring pattern 36 provided with the electrode connection portion 34 at one end portion is connected.

  In addition, bumps 35 a are formed on the surface of the second electrode 35. The second electrode 35 is configured to melt the bump 35a and to be electrically connected to the flexible wiring board 3a by locally applying heat to the bump 35a in order to suppress the temperature rise of the mirror portion 31a. Has been. Note that Au, solder, or the like is used as the material of the bump 35a.

  Here, the wiring pattern 36 of the mounting plate 33 is three-dimensionally formed on the respective surfaces of the bottom surface 33d of the recess 33c, the side surface 33e of the recess 33c, and the second surface 33b on which the second electrode 35 is provided. ing. For forming such a three-dimensional wiring pattern 36, a MID (Molded Interconnect Device) method is used. The MID method is a method of forming a metal thin film on the surface of a non-conductive three-dimensional molded product (in the present invention, the mounting plate 33) such as a resin by sputtering, and then partially forming the metal thin film by laser processing. This is a method of forming a three-dimensional wiring pattern on the surface of a three-dimensional molded product by removing the three-dimensional molded product.

  As shown in FIG. 1, the vertical light scanning unit 4 is configured to reflect light from the horizontal light scanning unit 3 and to scan light in the vertical direction with respect to the screen 91. Similarly to the horizontal light scanning unit 3, the vertical light scanning unit 4 includes a flexible wiring board 4a and a MEMS mirror package 4b.

  As shown in FIG. 6, the MEMS mirror package 4 b includes a MEMS mirror element 41 and a mounting plate 43.

  As with the mounting plate 33, the long side direction of the mounting plate 43 is the A direction. Further, the mounting plate 43 has a D direction in which the short side direction is inclined from the B direction. Similarly to the MEMS mirror element 31, the MEMS mirror element 41 includes a mirror part 41 a, a pair of drive parts 41 b that drive the mirror part 41 a, and a first electrode 42.

  As with the mounting plate 33, the mounting plate 43 includes a concave portion 43 c, an electrode connection portion 44, a light guide hole portion 43 f, and a second electrode 45. The pair of drive parts 41b are arranged on the same axis β so as to sandwich the mirror part 41a. The axis β extends in the A direction.

  The recessed part 43c is comprised from the bottom face 43d and the side surface 43e similarly to the recessed part 33c. Moreover, the recessed part 43c has the adhesive agent escape hole part 81 similarly to the recessed part 33c. The electrode connecting portion 44 and the second electrode 45 are electrically connected by a wiring pattern 46. Similarly to the second electrode 35, bumps 45 a are formed on the surface of the second electrode 45. The bottom surface 43d and the side surface 43e are examples of the “inside surface” of the present invention.

  As shown in FIG. 1, the MEMS mirror packages 3b and 4b are attached to one base unit 5 respectively. Specifically, as shown in FIG. 2, the base 5 (see FIG. 1) makes the mirrors 31 a and 41 a face each other, and the MEMS mirror packages 3 b and 4 b having a flat plate shape have V shapes. The MEMS mirror packages 3b and 4b are configured to be fixed in a state where they are arranged.

  As shown in FIG. 1, the mirror driver 6 receives a drive signal from the control unit 7 and applies a voltage to the piezoelectric elements (not shown) of the drive units 31b and 41b (see FIG. 2). The mirror portions 31a and 41a (see FIG. 2) are configured to be driven (swinged).

  The control unit 7 is configured to control the light emitting unit 1 and the optical scanning unit 2 based on a video signal input from the outside. Specifically, the control unit 7 controls the emission of light from the light source units 10a to 10c via the light source driver 12 based on the video signal, and the mirror unit 31a and the mirror unit 6 via the mirror driver 6 based on the video signal. 41a (see FIG. 2) is configured to be controlled. The control unit 7 is configured to adjust the timing of light emission from the light source units 10a to 10c and the timing of swinging of the mirror units 31a and 41a.

  In the first embodiment, the following effects can be obtained.

  In the first embodiment, as described above, the MEMS mirror element 31 (41) and the mounting plate 33 (43) are arranged so that the first electrode 32 (42) and the electrode connecting portion 34 (44) face each other. In this state, the first electrode 32 (42) and the electrode connecting portion 34 (44) are electrically connected and fixed to each other by bonding with the conductive adhesive 8. Thereby, since the MEMS mirror element 31 (41) and the mounting plate 33 (43) are electrically connected and fixed to each other by the conductive adhesive 8, as in the case of using a conventional bonding wire, It is possible to prevent a short circuit and noise from occurring. In other words, the conductive adhesive 8 can appropriately perform electrical connection to the MEMS mirror element 31 (41). In the present invention, the MEMS mirror element 31 (41) including the first electrode 32 (42) is housed in the recess 33c (43c). Thereby, since the MEMS mirror element 31 (41) is accommodated in the recessed part 33c (43c) of the attachment plate 33 (43), components can be arrange | positioned efficiently. As a result, the apparatus can be reduced in size. In the present invention, the electrode connecting portion 34 (44) which is one end portion of the wiring pattern 36 (46) is located at a position corresponding to the first electrode 32 (42) of the bottom surface 33d (43d) of the recess 33c (43c). And a wiring pattern 36 (46) is formed on the surface of the mounting plate 33 (43). Thereby, since the wiring pattern 36 (46) is formed on the surface of the mounting plate 33 (43), it is possible to prevent the optical path from being restricted by the bonding wire as in the case of using the conventional bonding wire. be able to. As a result, a wide range of light scanning angles can be secured.

  In the first embodiment, as described above, the second electrode 35 (45) connected to the other end of the wiring pattern 36 (46) is provided on the second surface 33b of the mounting plate 33 (43). As a result, the MEMS mirror element 31 (41) has a flexible wiring at a position separated from the MEMS mirror element 31 (41) by the second electrode 35 (45) connected to the other end of the wiring pattern 36 (46). It can be electrically connected to the substrate 3a (3b). Thereby, when electrically connecting the 2nd electrode 35 (45) and the exterior, it can suppress that the MEMS mirror element 31 (41) is exposed to the high temperature exceeding heat-resistant temperature. As a result, it is possible to suppress the MEMS mirror element 31 (41) from being damaged by heat.

  In the first embodiment, as described above, the MEMS mirror element is located near the edge where the MEMS mirror element 31 (41) is disposed with respect to the recess 33c (43c) of the mounting plate 33 (43). An adhesive relief hole 81 for allowing the conductive adhesive 8 to escape is provided on the adhesive surface to which 31 (41) is adhered by the conductive adhesive 8. Thereby, since the application amount of the conductive adhesive 8 can be balanced by escaping the excess conductive adhesive 8 to the adhesive escape hole 81, the MEMS is attached to the mounting plate 33 (43). It can suppress that the mirror element 31 (41) adhere | attaches in the state inclined.

  Moreover, in 1st Embodiment, as mentioned above, the adhesive agent escape hole part 81 is each formed in the some corner part of the edge part of an adhesion surface. Thereby, since the excess conductive adhesive 8 can be released in a well-balanced manner by the adhesive escape holes 81 formed respectively at the plurality of corners, the balance of the application amount of the conductive adhesive 8 can be stabilized more stably. Can be taken. As a result, the MEMS mirror element 31 (41) can be further prevented from being attached to the mounting plate 33 (43) in a tilted state.

  Moreover, in 1st Embodiment, the positioning part which positions the MEMS mirror element 31 (41) is comprised by the side surface 33e (43e) of the recessed part 33c (43c) of the attachment plate 33 (43) as mentioned above. Accordingly, the MEMS mirror element 31 (41) can be easily positioned and fixed with respect to the mounting plate 33 (43) by the side surface 33e (43e) of the recess 33c (43c) constituting the positioning portion. The work burden on the installation worker can be reduced.

  Moreover, in 1st Embodiment, as mentioned above, it penetrates from the 1st surface 33a on the opposite side to the recessed part 33c (43c) to the recessed part 33c (43c) with respect to the attachment plate 33 (43), and the mirror part 32a The electrode connecting portion 34 is formed on the second surface 33b opposite to the light guide hole portion 33f (43f) by the wiring pattern 36 (46) through the light guide hole portion 33f (43f) through which light irradiated to (42a) passes. The second electrode 35 (45) electrically connected to (44) is provided, the mirror portion 32a (42a) of the MEMS mirror element 31 (41) is provided, and the MEMS mirror element 31 (41) is provided with the conductive adhesive 8. It arrange | positions to the adhesion surface side adhere | attached by. Thereby, the 1st electrode 32 (42) and the mirror part 32a (42a) adhere | attached with respect to the electrode connection part 34 (44) of the attachment board 33 (43) with the conductive adhesive 8 are the same surfaces ( Since the first electrode 32 (42) and the mirror part 32a (42a) are arranged on the light incident surface 31c) side, wiring for electrically connecting the first electrode 32 (42) and the mirror part 32a (42a) Can be easily formed.

  In the first embodiment, as described above, the MEMS mirror element 31 (41) is reinforced by the mounting plate 33 (43). Thereby, since the MEMS mirror element 31 (41) is reinforced by the mounting plate 33 (43) having a function as a reinforcing member, the MEMS mirror element 31 (41) is prevented from being deformed by heat or external stress. can do.

(Second Embodiment)
Next, a second embodiment will be described with reference to FIGS. 1 and 7. In the second embodiment, unlike the first embodiment in which the concave portion 33c (43c) of the mounting plate 33 (43) has an adhesive escape hole 81, the concave portion 33c of the mounting plate 233 is an adhesive escape hole. An example in which the portion 81 is not provided will be described. In addition, the same structure as the said 1st Embodiment attaches | subjects and shows the same code | symbol as 1st Embodiment, and abbreviate | omits description. The mounting plate 233 is an example of the “mounting member” and “reinforcing member” in the present invention.

  As shown in FIG. 7, in the projector 200 according to the second embodiment (see FIG. 1), the bottom surface 33d of the mounting plate 233 on the horizontal light scanning unit 3 side is provided with an adhesive escape hole 81 as in the first embodiment. It is not formed at the four corners, and the outer edge is formed in a square shape. Note that a mounting plate (not shown) on the vertical light scanning unit side is also configured in the same manner, and a description thereof will be omitted.

  In the second embodiment, the following effects can be obtained.

  In the second embodiment, similarly to the first embodiment, the conductive adhesive 8 with the MEMS mirror element 31 and the mounting plate 233 disposed so that the first electrode 32 and the electrode connecting portion 34 face each other. The first electrode 32 and the electrode connecting portion 34 are electrically connected and fixed to each other by bonding together. Thereby, the electrically conductive adhesive 8 can appropriately perform electrical connection to the MEMS mirror element 31.

(Third embodiment)
Next, a third embodiment will be described with reference to FIG. 1, FIG. 8, and FIG. In the third embodiment, an example will be described in which a recess 333c is provided on the first surface 33a, unlike the first embodiment in which the recess 36 (46) is provided on the second surface 33b. In addition, the same structure as the said 1st Embodiment attaches | subjects and shows the same code | symbol as 1st Embodiment, and abbreviate | omits description.

  As shown in FIGS. 7 and 8, in the projector 300 (see FIG. 1) according to the third embodiment, the MEMS mirror package 3 b of the horizontal light scanning unit 3 (see FIG. 1) includes a MEMS mirror element 331 and a mounting plate 333. And. In the following description, the vertical light scanning unit 4 has the same configuration as the horizontal light scanning unit 3, and thus the description thereof is omitted. The MEMS mirror package 3b is an example of the “vibrating mirror package” in the present invention. The MEMS mirror element 331 is an example of the “vibrating mirror element” in the present invention. The mounting plate 333 is an example of the “mounting member” and “reinforcing member” in the present invention.

  The MEMS mirror element 331 includes a mirror unit 31a, a pair of drive units 31b that drive the mirror unit 31a, a fixed unit 33c, and a first electrode 332. Further, the MEMS mirror element 331 is configured to be accommodated in a later-described recess 333 c of the mounting plate 333.

  The mirror part 31 a is disposed on the surface opposite to the bonding surface to which the MEMS mirror element 331 is bonded by the conductive adhesive 8. That is, unlike the first embodiment, the MEMS mirror element 331 is bonded to the mounting plate 333 by the conductive adhesive 8 on the surface opposite to the light incident surface 31c.

  The first electrode 332 is provided on the surface opposite to the light incident surface 31c. The first electrode 332 is electrically connected to a piezoelectric element (not shown) included in the drive unit 31b by wiring (not shown) provided in a through hole or the like.

  The mounting plate 333 includes a recess 333 c, an electrode connection part 34, a wiring hole part 338, and a second electrode 35.

  Further, the mounting plate 333 has a wiring pattern 336 formed on the surface thereof, in which the electrode connection portion 34 is provided at one end. The second electrode 37b is connected to the other end of the wiring pattern 336.

  The recess 333c is provided at the approximate center of the first surface 33a.

  The electrode connecting portion 34 is provided at a predetermined position on the bottom surface 33 d corresponding to the first electrode 332 of the MEMS mirror element 331.

  The wiring hole 333f is configured so that the wiring hole 333f penetrates from the second surface 33b to the recess 333c. Further, the wiring hole portion 333f is provided in the approximate center of the second surface 33b. A wiring pattern 336 is passed through the surface of the wiring hole 338 in the hole.

  The second electrode 35 is provided in the vicinity of the end of the second surface 33b in the A direction.

  In the third embodiment, the following effects can be obtained.

  In the third embodiment, similarly to the first embodiment, the conductive adhesive 8 with the MEMS mirror element 331 and the mounting plate 333 disposed so that the first electrode 332 and the electrode connecting portion 34 face each other. The first electrode 332 and the electrode connecting portion 34 are electrically connected and fixed to each other by bonding together. As a result, the conductive adhesive 8 can appropriately make electrical connection to the MEMS mirror element 331.

  In the third embodiment, as described above, the mounting plate 333 is disposed on the surface (second surface 33b) opposite to the concave portion 333c, and is connected to the electrode connection portion 34 by the wiring pattern 336. The electrode 35 is provided, and the mirror portion 32 a of the MEMS mirror element 331 is disposed on the surface opposite to the bonding surface side to which the MEMS mirror element 331 is bonded by the conductive adhesive 8. That is, the surface opposite to the light incident surface 31c is used as an adhesive surface. Thereby, since the recessed part 333c of the attachment plate 333 is provided in the 1st surface 33a, the MEMS mirror element 331 can be attached from the opposite side to the 2nd electrode 35 side (installation surface side) of the attachment plate 333. That is, the MEMS mirror element 331 can be disposed on the exposed surface side (light path side) of the mounting plate 333. As a result, unlike the case where the MEMS mirror element is attached to the mounting plate from the installation surface side, it is not necessary to provide a hole for guiding light (light guide hole), so that the hole for guiding light (light guide hole) The optical path length can be shortened by the depth of).

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first to third embodiments, the example in which the present invention is applied to the projector including the MEMS mirror package has been described. However, the present invention is applied to an apparatus including the MEMS mirror package other than the projector or the MEMS mirror package alone. May be. For example, the present invention may be applied to a head-up display.

  Moreover, in the said 1st-3rd embodiment, although the example which formed the wiring pattern by the MID method was shown, this invention is not limited to this. In the present invention, for example, a wiring pattern may be formed by attaching a metal part to be a wiring pattern to an attachment plate (attachment member).

  Moreover, although the said 1st-3rd embodiment showed the example which respectively scanned the horizontal direction and the vertical direction with respect to the screen with a separate MEMS mirror element, this invention is not limited to this. In the present invention, light may be scanned in the horizontal direction and the vertical direction with respect to the screen by one MEMS mirror element.

  Moreover, although the said 1st-3rd embodiment showed the example which formed the attachment board as an attachment member (reinforcement member) of this invention with resin, this invention is not limited to this. In the present invention, the mounting plate may be formed of a material other than resin as long as it has non-conductivity. For example, the attachment member (reinforcing member) may be formed of ceramics.

  Moreover, in the said 1st-3rd embodiment, although the example which positions a MEMS mirror element with respect to an attachment plate (attachment member) by the side surface was shown, this invention is not limited to this. In the present invention, for example, the MEMS mirror element may be positioned with respect to the mounting plate (mounting member) by providing a positioning boss in the recess.

  Moreover, in the said 1st and 2nd embodiment, although the example which escapes a conductive adhesive with a through-hole was shown, this invention is not limited to this. In the present invention, for example, the conductive adhesive may be released by the groove.

  In the first and third embodiments, the example in which the second electrode is connected to the flexible wiring board by the Au bump is shown, but the present invention is not limited to this. In this invention, you may connect to a flexible wiring board with a conductive adhesive, for example.

3b, 4b MEMS mirror package (vibration mirror package)
8 Conductive adhesive 10a to 10c Light source part 31, 41, 331 MEMS mirror element (vibration mirror element)
31a, 41a, mirror part 31b, 41b drive part 32, 42, 332 first electrode 33, 43, 233, 333 mounting plate (mounting member, reinforcing member)
33c, 43c, 333c Recess 33d, 43d Bottom (inner surface)
33e, 43e Side surface (inside surface)
33f, 43f Light guide hole 34, 44 Electrode connection 35, 45 Second electrode 36, 46, 336 Wiring pattern 81 Adhesive escape hole (adhesive escape part)
90 images 100, 200, 300 projectors

Claims (9)

A vibrating mirror element including a mirror unit, a drive unit for driving the mirror unit, and a first electrode;
A recess for accommodating the oscillating mirror element; and an electrode connecting portion provided at a position corresponding to the first electrode of the oscillating mirror element on an inner surface of the recess, wherein the electrode connecting portion is provided at one end. A wiring pattern formed on the surface, and a mounting member,
The vibrating mirror element and the mounting member are bonded with a conductive adhesive in a state where the first electrode and the electrode connecting portion are arranged to face each other, whereby the first electrode and the electrode connection are connected. A vibrating mirror package configured to be electrically connected to each other and fixed to each other.   2. The vibration according to claim 1, wherein the attachment member further includes a second electrode that is provided on a surface different from a surface on the light irradiation side of the mirror portion and connected to the other end portion of the wiring pattern. Mirror package.   The concave portion of the mounting member is an adhesive that allows the conductive adhesive to escape to the vicinity of an edge where the vibrating mirror element is disposed and to an adhesive surface to which the vibrating mirror element is bonded by the conductive adhesive. The vibrating mirror package according to claim 1, wherein the vibrating mirror package has a relief portion.   The vibrating mirror package according to claim 3, wherein the adhesive relief portion is formed at each of a plurality of corners of an edge portion of the adhesion surface.   5. The vibrating mirror package according to claim 1, wherein the inner side surface of the concave portion of the mounting member constitutes a positioning portion for positioning the vibrating mirror element. The mounting member is provided on the surface opposite to the light guide hole portion, and a light guide hole portion that penetrates from the surface opposite to the recess portion to the recess portion and transmits light irradiated to the mirror portion. A second electrode electrically connected to the electrode connection portion by the wiring pattern;
The oscillating mirror package according to claim 1, wherein the mirror part of the oscillating mirror element is disposed on an adhesive surface side to which the oscillating mirror element is bonded by the conductive adhesive. The attachment member further includes a second electrode provided on a surface opposite to the concave portion and connected to the electrode connection portion by the wiring pattern;
The mirror part of the oscillating mirror element according to any one of claims 1 to 5, wherein the mirror part is disposed on a surface opposite to a bonding surface side to which the oscillating mirror element is bonded by the conductive adhesive. The described vibration mirror package.   The vibrating mirror package according to claim 1, wherein the attachment member is a reinforcing member that reinforces the vibrating mirror element. A light source that emits light for image projection;
A vibrating mirror element including a mirror part that reflects light from the light source part, a drive part that drives the mirror part, and a first electrode;
A recess for accommodating the oscillating mirror element; and an electrode connecting portion provided at a position corresponding to the first electrode of the oscillating mirror element on an inner surface of the recess, wherein the electrode connecting portion is provided at one end. A wiring pattern to be provided and a mounting member formed on the surface;
The vibrating mirror element and the mounting member are bonded with a conductive adhesive in a state where the first electrode and the electrode connecting portion are arranged to face each other, whereby the first electrode and the electrode connection are connected. The projector is configured to be electrically connected to each other and fixed to each other.

Images