JP2016088810A - Scribing method and scribing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a scribing apparatus for scribing a sealant portion of a mother substrate bonded through a sealant, capable of sufficiently deeply penetrating cracks.SOLUTION: A scribing method comprises: scribing a mother substrate 10 along a scribing schedule line SL1 defining a functional area of one end when scribing the mother substrate; scribing the mother substrate along a scribing line SL2 defining an adjacent functional area; and sequentially scribing the mother substrate not so as to position a scribe line formed at the N+1th time(N is an integer) out of scribe lines between any of scribe lines formed up to the Nth time. Thereby, without leaving a scribing schedule line after the next time between the existing scribing lines, cracks can be deeply penetrated.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a scribing method and a scribing apparatus for dividing a mother substrate obtained by bonding two substrates together into functional regions.

  A liquid crystal panel such as a liquid crystal display device has a structure in which two glass plates are bonded together. Patent Document 1 describes a method in which functional areas are formed in a lattice pattern on a mother substrate, and each functional area is cut out to form a liquid crystal panel. The mother substrate is formed by bonding a substrate on which a thin film transistor (TFT) is formed and a substrate on which a color filter (CF) is formed with a sealant interposed therebetween. The sealing material is arranged so that a space serving as a liquid crystal injection region remains in a state where the two substrates are bonded to each other. When the liquid crystal panel is cut out from the mother substrate, scribe lines are formed on the upper and lower surfaces of the mother substrate. Then, by dividing the upper and lower substrates of the mother substrate along the scribe line, individual liquid crystal panels can be obtained.

  Patent Document 2 proposes a scribing device for simultaneously scribing a mother substrate from both sides. In this scribing device, two scribing heads each having a scribing wheel at the tip are arranged so as to sandwich the mother substrate, and the both sides of the mother substrate are scribed by moving in a direction parallel to the surface of the mother substrate.

JP 2006-137441 A JP 2012-240902 A

  FIG. 1A is a cross-sectional view showing an example of a conventional mother substrate for a liquid crystal panel. As shown in the figure, a liquid crystal injection region is provided between the glass substrates 101 and 102 via a sealing material 103, but there is a region where the sealing material 103 is not interposed between adjacent liquid crystal injection regions. . Therefore, as indicated by the alternate long and short dash line, a scribe line was simultaneously formed on both sides of the mother substrate by the two scribing wheels 104 in a region where the seal material 103 was not interposed, and the scribe line could be divided along the scribe line. When the scribe line is formed in this manner and the mother substrate is divided, a frame region having a predetermined width remains around the functional region where the liquid crystal is injected in the liquid crystal panel.

  However, in recent years, especially in mobile liquid crystal panels, it has become mainstream to narrow the frame area to the limit. For this reason, as shown in FIG. 1B, the mother substrate composed of the substrates 111 and 112 is configured such that a region where the sealing material 113 is not interposed is omitted and adjacent liquid crystal injection regions are separated by only one sealing material 113. It is considered. When scribing both surfaces of such a mother substrate at the same time, scribe lines are formed directly above and below the sealing material, as shown in the alternate long and short dash line in FIG. 1 (b) and in FIG. 1 (c). It is necessary to do.

  However, when the scribe lines of Patent Document 2 are used to simultaneously form scribe lines immediately above and below the seal material, the scribe lines SL1 and SL2 are scribed with a gap as shown in FIG. To do. In this case, if the scribe line SL3 sandwiched between the scribe lines SL1 and SL2 already formed is scribed, the cracks of the scribe lines SL1 and SL2 are affected by the stress to open, and the cracks are difficult to penetrate. There is a problem.

  Similarly, when the scribe lines SL1 and SL2 are already scribed as shown in FIG. 2B, even if the scribe lines SL3, SL4 and SL5 are scribed in the meantime, the cracks penetrate during these scribes. The problem that it becomes difficult arises. And when a break occurs in a state where cracks are insufficient, a fine crack or breakage occurs at the edge of the substrate after the break, resulting in a problem that the strength of the glass substrate is lowered.

  The present invention has been made paying attention to such a conventional problem, and is sufficient for scribing the surface of a mother substrate obtained by bonding two substrates together with a sealing material along the sealing material. An object of the present invention is to provide a scribing method and a scribing device capable of forming and breaking a crack having a depth.

  In order to solve this problem, the scribing method of the present invention includes a scribing method in which a plurality of scribing lines are formed in parallel in the same direction on the surface of a mother substrate obtained by bonding a first substrate and a second substrate through a sealing material. In the method, each of the plurality of scribe lines is formed at a position facing the seal material, and a scribe line formed N + 1 times (N is an integer) among the plurality of scribe lines is: The scribing is performed sequentially so as not to be positioned between any of the scribe lines formed up to the Nth time.

  In order to solve this problem, the scribing apparatus of the present invention is a scribing apparatus that forms a plurality of scribing lines in parallel in the same direction on the surface of a mother substrate formed by bonding a first substrate and a second substrate with a sealing material. A scribing head for scribing the surface of the mother substrate along the sealing material, wherein at least one of the scribing head and the mother substrate is moved relative to the surface of the mother substrate in parallel. The scribe lines formed at the (N + 1) th (N is an integer) among the scribe lines are sequentially placed on the surface of the mother substrate as the sealing material so as not to be positioned between any of the scribe lines formed up to the Nth. Scribe along.

  Here, the plurality of scribe lines may be formed using a plurality of scribe heads.

  According to the present invention having such a feature, cracks having a sufficient depth are formed on both surfaces of the substrate by determining the scribe order so that the next and subsequent scribe lines are not formed between the existing scribe lines. be able to. Therefore, there is no effect that a fine crack or breakage does not occur at the edge of the substrate after the break, and the defect of the substrate after the division can be prevented in advance.

FIG. 1 is a front view showing a conventional mother board for a liquid crystal panel and its breaking process. FIG. 2 is a cross-sectional view showing a conventional mother board for a liquid crystal panel and its breaking process. FIG. 3 is a front view showing an example of a mother substrate to be processed according to the embodiment of the present invention. FIG. 4 is a cross-sectional view showing a part of a mother substrate to be processed in the present embodiment. FIG. 5A is a side view showing an example of a scribing apparatus according to an embodiment of the present invention. FIG. 5B is a side view showing an example of a scribing apparatus according to the embodiment of the present invention. FIG. 6 is a diagram showing a first example of the scribing method in the present embodiment. FIG. 7 is a diagram showing a second example of the scribing method according to the embodiment of the present invention. FIG. 8 is a diagram showing a first example of the scribing method by the scribing apparatus using the multi-scribe head of the present invention. FIG. 9 is a diagram showing a second example of the scribing method by the scribing apparatus using the multi-scribe head of the present invention.

  First, a mother substrate for manufacturing a liquid crystal display panel to be processed will be described. As shown in the front view of FIG. 3, the mother substrate 10 is configured by bonding two substrates on which patterns of a plurality of unit display panels (unit substrates) are formed. The mother substrate 10 has a large number of functional areas formed in a lattice shape as shown in the figure.

  FIG. 4 is a cross-sectional view showing a part of the mother substrate 10. A mother substrate 10 includes a first substrate 11 (also referred to as a CF substrate) on which a plurality of color filters are formed, and a second substrate (also referred to as a TFT substrate) 12 on which a plurality of TFTs and terminal regions are formed. It is pasted together. As shown in FIG. 4A, one sealing material 13 defines adjacent functional areas, and a liquid crystal 14 is sealed between the sealing materials 13. When the substrate is divided into display panels for each functional area, it is necessary to scribe the seal material 13 directly in the vertical and horizontal directions to separate them.

  5A and 5B are schematic views of the scribing apparatus according to the embodiment of the present invention as seen from the side. As shown in these drawings, a pair of left and right support columns 20a and 20b are mounted on a base 21 and blocks 22a and 22b. Movable guide columns 23a and 23b are provided in parallel at the upper part between the columns, and movable guide columns 24a and 24b are provided in the lower side. The movable guide columns 23a, 23b and 24a, 24b move the horizontal slide members 25, 26 in the x-axis direction (left-right direction), respectively. The horizontal slide members 25 and 26 are provided with vertical slide members 27 and 28 for moving the scribe head in the z-axis direction (vertical direction), respectively. A scribe head 29 is provided at the lower end of the vertical slide member 27. A scribe head 30 is provided at the upper end of the vertical slide member 28. The scribing heads 29 and 30 hold the scribing wheels 31 and 32 at their tips, respectively.

  Here, the scribe head 29 is a first scribe head, and the scribe head 30 is a second scribe head. The vertical slide members 27 and 28 constitute a moving unit for moving these scribing heads in directions toward or away from each other. The movable guide columns 23a, 23b, 24a and 24b and the horizontal slide members 25 and 26 are scribed. A moving unit is configured to move the heads 29 and 30 in the x-axis direction.

  Next, the operation when the mother substrate 10 is scribed and divided into functional areas will be described with reference to FIG. First, as shown in FIG. 6A, the upper surface and the lower surface of the mother substrate 10 are simultaneously scribed along a planned scribe line SL1 that defines the leftmost functional region and the functional region adjacent thereto. . In this case, scribe lines are formed immediately above and below the sealing material 13 in the adjacent region. In the following description, the scribe line after the scribe is indicated by a solid line, and the scribe line is indicated by a one-dot chain line. Next, as shown in FIG. 6B, the scribe line SL2 adjacent to the scribe line SL1 is scribed. Further, scribing is performed without sequentially leaving the scheduled scribe lines SL3, SL4,. That is, the scribe lines formed at the (N + 1) th time (N is an integer) among the plurality of scribe lines are sequentially scribed from both sides of the mother substrate so as not to be positioned between any of the scribe lines formed up to the Nth time. .

  Next, the table is rotated 90 °, and the scribe lines are sequentially scribed from one end in the same manner perpendicularly to the scribe lines already formed, thereby forming the scribe lines in a lattice shape. By doing so, the next and subsequent scribe lines are not left between the scribe lines that have already been formed, and the crack penetrates deeply, so that the break can be normally performed in the break process.

  Instead of sequentially scribing from one end, a scribe line SL1 is formed in the center as shown in FIG. 7A, and then scribe lines SL2 and SL3 are formed on both sides thereof as shown in FIG. 7B. Further, the scribe lines SL4 and SL5 may be formed on the outer sides of the respective scribe lines, and the scribe lines may be sequentially formed on the outer sides. Also in this case, since the next scheduled scribe line is not left between the already scribed scribe lines, a deep crack can be formed.

  In this embodiment, a scribe device having a scribe head above and below is described as shown in FIG. 4, but the present invention can also be applied to a multi-head scribe device having a plurality of scribe heads above and below. In some cases, all of the scribe heads may be used at the same time, or only some of the heads may be used.

  When the mother substrate 10 is scribed by the multi-head scribing device, for example, as shown in FIG. 8A, three scribe lines SL1, SL2, and SL3 are simultaneously scribed from one end of the mother substrate 10. Next, the scribe lines SL4 to SL6 are scribed as shown in FIG. 8B, and then the scribe lines SL7 to SL9 are scribed. In this way, even when scribing in units of three, scribing is performed sequentially with no gap between adjacent scribe planned lines. In this way, if the scribe lines are sequentially squeezed between the existing scribe lines so that the next scheduled scribe line is not left, the cracks can be deeply penetrated.

  Instead of sequentially scribing from one end, scribe lines SL1 to SL3 are formed in the center as shown in FIG. 9A, and then scribe lines SL4 to SL6 are formed outside one as shown in FIG. 9B. Form. Next, scribe lines SL7 to SL9 are formed on the other outer side. In the same manner, it may be sequentially scribed outward. Also in this case, since the next and subsequent scribe lines are not left between the existing scribe lines, a deep crack can be formed.

  The present invention can be applied to a scribing device and a cutting device for scribing the surface of a mother substrate formed by bonding two substrates together with a sealing material along the sealing material.

DESCRIPTION OF SYMBOLS 10 Mother board | substrate 11 1st board | substrate 12 2nd board | substrate 13 Sealing material 14 Liquid crystal 20a, 20b Support | pillar 23a, 23b, 24a, 24b Movable guide support | pillar 25, 26 Horizontal slide member 27.28 Vertical slide member 29, 30 Scribe head 31, 32 Scribing wheel

Claims (4)

A scribing method for forming a plurality of scribe lines in parallel in the same direction on a surface of a mother substrate obtained by bonding a first substrate and a second substrate through a sealing material,
Each of the plurality of scribe lines is formed at a position facing the sealing material,
A scribing method in which a scribe line formed N + 1 times (N is an integer) among the plurality of scribe lines is sequentially scribed so as not to be positioned between any of the scribe lines formed up to the Nth time.   The scribing method according to claim 1, wherein the plurality of scribe lines are formed using a plurality of scribe heads. A scribing device that forms a plurality of scribe lines in parallel in the same direction on the surface of a mother substrate formed by bonding a first substrate and a second substrate with a sealing material,
A scribing head for scribing the surface of the mother substrate along the sealing material;
Moving at least one of the scribe head and the mother substrate relatively parallel to the surface of the mother substrate;
Among the plurality of scribe lines, the surface of the mother substrate is sequentially sealed so that the scribe line formed at the N + 1th time (N is an integer) is not positioned between any of the scribe lines formed up to the Nth time. A scribing device that scribes along the material.   The scribing apparatus according to claim 3, wherein the plurality of scribe lines are formed using a plurality of scribe heads.

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