[go: up one dir, main page]

TW201404733A - Splitting apparatus for brittle material substrate - Google Patents

Splitting apparatus for brittle material substrate Download PDF

Info

Publication number
TW201404733A
TW201404733A TW102108993A TW102108993A TW201404733A TW 201404733 A TW201404733 A TW 201404733A TW 102108993 A TW102108993 A TW 102108993A TW 102108993 A TW102108993 A TW 102108993A TW 201404733 A TW201404733 A TW 201404733A
Authority
TW
Taiwan
Prior art keywords
substrate
along
bars
split
platform
Prior art date
Application number
TW102108993A
Other languages
Chinese (zh)
Other versions
TWI603928B (en
Inventor
Toru Naruo
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201404733A publication Critical patent/TW201404733A/en
Application granted granted Critical
Publication of TWI603928B publication Critical patent/TWI603928B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/222Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/08Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Conveying And Assembling Of Building Elements In Situ (AREA)
  • Dicing (AREA)

Abstract

The present invention provides a splitting apparatus, which can shorten the time required to split a brittle material substrate and consists of a platform 2 to bear a substrate W, a beam 7 arranged on the top of the platform 2 and being parallel to the bearing face, a guiding axis 8 installed at the beam 7 along the extension direction of the beam 7, and a plurality of splitting rods 10 formed to move along the guiding axis 8. In addition, the splitting apparatus is formed by the following manner: each splitting rod 10 being formed to be liftable via a lift axis 12 and being formed to be rotatable by the axis of being perpendicular to the bearing face of the platform 2 as a center. Thereby, a plurality of splitting rods 10 are formed in a serial configuration being serially arranged along the extension direction of the beam 7 and a separation configuration being parallel to each other along the direction orthogonal to the extension direction of the beam 7.

Description

脆性材料基板之裂斷裝置 Cracking device for brittle material substrate

本發明係關於由玻璃、陶瓷、藍寶石及半導體晶圓等之脆性材料所構成之基板之裂斷裝置。本發明尤其是關於將在前段步驟中形成刻劃線(切槽)之脆型材料基板,沿著其刻劃線進行裂斷並取出單位基板之裂斷裝置。 The present invention relates to a cracking device for a substrate composed of a brittle material such as glass, ceramic, sapphire or a semiconductor wafer. More particularly, the present invention relates to a cracking device in which a substrate of a brittle material which is scribed (grooved) is formed in a preceding step, and a unit substrate is cut along the scribe line.

習知有對脆性材料基板(以下,簡稱「基板」)之表面,利用刀輪(亦稱刻劃輪)或固定刀刃、或雷射光束等之刻劃手段,形成相互正交之X方向及Y方向之刻劃線,之後,沿該刻劃線施以外力而進行裂斷,而藉此將基板分斷成單位基板之方法,例如,揭示於專利文獻1或專利文獻2。 It is known that the surface of a brittle material substrate (hereinafter referred to as "substrate") is formed by a scribing wheel (also referred to as a scoring wheel) or a fixed blade or a laser beam to form mutually orthogonal X directions and In the case of the scribe line in the Y direction, a method of breaking the substrate into a unit substrate by performing an external force along the scribe line is disclosed, for example, in Patent Document 1 or Patent Document 2.

圖5,係表示基板之一般的裂斷裝置之立體圖。裂斷裝置21,具備有載置並保持成為加工對象之基板W之水平之平台22。平台22,成為可藉由內藏馬達之旋轉驅動部23而在水平面內進行旋動,且構成為可沿水平之軌條24移動於Y方向。在平台22之上方設置有於X方向水平延伸之樑(橫架)25,而在該樑25安裝有與該樑平行並於X方向延伸之板狀之裂斷桿26,且成為可透過藉由汽缸27而驅動之升降軸28進行升降。 Fig. 5 is a perspective view showing a general cracking device of a substrate. The breaking device 21 is provided with a stage 22 on which the level of the substrate W to be processed is placed and held. The platform 22 is rotatable in a horizontal plane by a rotary drive unit 23 of the built-in motor, and is configured to be movable in the Y direction along the horizontal rails 24. A beam (cross frame) 25 extending horizontally in the X direction is disposed above the platform 22, and a plate-shaped cracking rod 26 extending parallel to the beam and extending in the X direction is attached to the beam 25, and is permeable. The lifting shaft 28 driven by the cylinder 27 is raised and lowered.

圖8,係表示在前階段之刻劃步驟中,藉由刻劃手段於表面形成相互正交之縱、橫之刻劃線S1、S2之長方形之基板W者,W1係在裂斷後成為製品之單位基板,W2係在裂斷後被棄置之端材區域。當在裂斷裝 置21中對該基板W進行裂斷,刻劃線S1、S2之任一方,例如如圖5所示,成為基板之長邊方向之刻劃線S1沿著X方向,並於平台22上夾持並載置由彈性材料所構成之緩衝片13。該情形,如圖7(a)所示,預先使刻劃線S1、S2成為下面。之後,如圖7(b)所示,使裂斷桿26從基板W之上方朝向刻劃線S1下降並按壓基板W,且藉由使該基板W在緩衝片13上僅彎曲成V字狀,而使刻劃線S1之裂痕延伸而對基板W進行裂斷。如此在全部裂斷長邊方向之刻劃線S1之後,如圖6所示,以基板之短邊方向之刻劃線S2朝向X方向之方式使平台22進行90度旋轉。而且與上述同樣地,使裂斷桿26下降並裂斷所有之刻劃線S2後,取出如圖8所示之單位基板W1,並將端緣部之端材區域W2予以棄置。 Fig. 8 is a view showing a substrate W having a rectangular shape in which the vertical and horizontal scribe lines S1 and S2 are orthogonal to each other by a scribing means in the scribing step of the preceding stage, and the W1 is formed into a product after being broken. The unit substrate, W2 is the end material area that is disposed after the crack. When in the split In the case of 21, the substrate W is broken, and either one of the scribe lines S1 and S2 is formed, for example, as shown in FIG. 5, the scribe line S1 in the longitudinal direction of the substrate is along the X direction, and is sandwiched on the stage 22. A buffer sheet 13 made of an elastic material is placed and placed. In this case, as shown in FIG. 7(a), the score lines S1 and S2 are set to the lower side in advance. Thereafter, as shown in FIG. 7(b), the split rod 26 is lowered from the upper side of the substrate W toward the scribe line S1 and the substrate W is pressed, and the substrate W is bent only in a V shape on the buffer sheet 13. The crack of the scribe line S1 is extended to break the substrate W. After the scribe line S1 is cut in the longitudinal direction of all the cracks as described above, as shown in FIG. 6, the stage 22 is rotated by 90 degrees so that the scribe line S2 in the short-side direction of the substrate faces the X direction. Further, in the same manner as described above, the split rod 26 is lowered and the scribe line S2 is cut, and the unit substrate W1 shown in Fig. 8 is taken out, and the end portion W2 of the end portion is discarded.

專利文獻1:日本特許第3787489號公報 Patent Document 1: Japanese Patent No. 3787489

專利文獻2:日本特開2002-187098號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2002-187098

在上述之習知之裂斷裝置21中,係藉由與樑25平行、並於X方向延伸之一個裂斷桿26進行裂斷者,因此必需使裂斷桿升降刻劃線之數量次數,亦即合計長邊方向之刻劃線S1與短邊方向之刻劃線S2之數量次數。通常在1枚大型基板形成有許多之刻劃線,因此對應刻劃線之數量增加而使得裂斷所需之時間變長,並且亦影響裂斷桿或其升降機構之磨耗或壽命等。 In the above-mentioned conventional breaking device 21, the crack is broken by a split rod 26 extending parallel to the beam 25 and extending in the X direction. Therefore, it is necessary to raise and lower the number of times the split rod is lifted and scored. That is, the number of times of the scribe line S1 in the long-side direction and the scribe line S2 in the short-side direction is totaled. Usually, a large number of large-scale substrates are formed with a plurality of scribe lines, so that the number of scribe lines increases, the time required for the rupture becomes longer, and the wear or life of the rupture rod or its lifting mechanism is also affected.

因此,本發明之目的係提供一種可解決上述課題且縮短裂斷所需之時間之裂斷裝置。 Accordingly, it is an object of the present invention to provide a breaking device which can solve the above problems and shorten the time required for cracking.

為了解決上述課題,在本發明中提出如下述之技術性手段。 亦即,本發明之裂斷裝置,由具有載置脆性材料基板之載置面之平台、在該平台之上方配置成與該載置面平行之樑、沿著該樑之延伸方向並設置於該樑之導引軸、以及形成為可沿著該導引軸移動之多個裂斷桿所構成;且以如下方式形成:該多個裂斷桿之各個,形成為可透過升降軸而升降,且形成為可以與該載置面垂直之軸作為中心而可旋轉,藉此該多個裂斷桿成為沿著樑之延伸方向串列地排列之串列姿勢、與沿著與樑之延伸方向正交之方向成為相互平行之分離姿勢。 In order to solve the above problems, the following technical means are proposed in the present invention. In other words, the cracking device of the present invention is disposed on the platform having the mounting surface on which the brittle material substrate is placed, and is disposed above the platform so as to be parallel to the mounting surface, and is disposed along the extending direction of the beam. a guiding shaft of the beam and a plurality of splitting bars formed to be movable along the guiding axis; and being formed in such a manner that each of the plurality of cracking bars is formed to be lifted and lowered through the lifting shaft And being formed so as to be rotatable about an axis perpendicular to the mounting surface, whereby the plurality of crack bars are arranged in series in a row along the extending direction of the beam, and extending along the beam The directions in which the directions are orthogonal are mutually separated postures.

由於本發明係為如上述者,因此具有如下之效果:在應進行裂斷之刻劃線之長度較各個裂斷桿之長度為短之情形,使多個裂斷桿成為沿著與樑之延伸方向正交之方向並成為相互平行之分離姿勢,而朝向基板之刻劃線同時地下降,藉此可使多個刻劃線同時地進行裂斷,且可縮短裂斷所需之時間。此外,在應進行裂斷之刻劃線較各個裂斷桿之長度為長之情形,可藉由使2個裂斷桿成為在樑之延伸方向串列地排列之串列姿勢而進行裂斷。 Since the present invention is as described above, it has the effect that the length of the scribe line is shorter than the length of each cleavage rod when the rupture is to be made, so that the plurality of rupture rods become along the beam The directions in which the extending directions are orthogonal to each other are separated from each other, and the scribe lines toward the substrate are simultaneously lowered, whereby the plurality of scribe lines can be simultaneously broken, and the time required for the rupture can be shortened. Further, in the case where the scribe line to be broken is longer than the length of each of the rupture bars, the two rupture bars can be broken by being arranged in series in the extending direction of the beam. .

在本發明中,較佳為形成如下方式:該多個裂斷桿,在成為相互平行之分離姿勢中,可在維持裂斷桿彼此之間隔下沿著該導引軸同時地進行移動,並且亦可個別單獨地進行移動。藉此,在以多個裂斷桿成為相互平行之分離姿勢之方式進行裂斷之情形,可使多個裂斷桿之刻劃線之裂斷以相同之間距連續地進行,且可使作業效率化。此外,由於亦可個別單獨地進行移動,因此即使在應進行裂斷之基板之刻劃線之間距已改變之情形,亦可同時地對多條刻劃線進行裂斷。 In the present invention, it is preferable that the plurality of split bars are simultaneously moved along the guide axis while maintaining the interval between the split bars in the separated postures which are parallel to each other, and It can also be moved individually and individually. Thereby, in the case where the plurality of split bars are broken in such a manner that they are parallel to each other, the splitting of the plurality of split bars can be continuously performed at the same distance, and the work can be performed. Efficiency. Further, since the movement can be performed individually and individually, even if the distance between the scribe lines is changed in the case where the substrate to be broken is changed, the plurality of scribe lines can be simultaneously broken.

W‧‧‧脆性材料基板 W‧‧‧Battery material substrate

S1‧‧‧長邊方向之刻劃線 S1‧‧‧ long-term direction marking

S2‧‧‧短邊方向之刻劃線 S2‧‧‧Drawing in the direction of the short side

1‧‧‧裂斷裝置 1‧‧‧breaking device

2‧‧‧平台 2‧‧‧ platform

7‧‧‧樑 7‧‧ ‧ beams

8‧‧‧導引軸 8‧‧‧Guidance axis

9‧‧‧保持具 9‧‧‧Holding

10‧‧‧裂斷桿 10‧‧‧crack

11‧‧‧流體汽缸 11‧‧‧ fluid cylinder

12‧‧‧升降軸 12‧‧‧ Lifting shaft

13‧‧‧緩衝片 13‧‧‧buffer

圖1,係表示在本發明之裂斷裝置中,對基板之短邊方向之刻劃線進行裂斷之情形之一例之立體圖。 Fig. 1 is a perspective view showing an example of a case where a scribe line in a short side direction of a substrate is broken in the cracking device of the present invention.

圖2,係表示對基板之長邊方向之刻劃線進行裂斷之情形之與圖1同樣之立體圖。 Fig. 2 is a perspective view similar to Fig. 1 showing a state in which the scribe line in the longitudinal direction of the substrate is broken.

圖3,係表示基板裂斷時之狀態之剖面圖。 Fig. 3 is a cross-sectional view showing a state in which the substrate is broken.

圖4,係表示裂斷桿之另一實施例之部分立體圖。 Figure 4 is a partial perspective view showing another embodiment of a split rod.

圖5,係表示在習知之裂斷裝置中,對基板之長邊方向之刻劃線進行裂斷之情形之一例之立體圖。 Fig. 5 is a perspective view showing an example of a case where a scribe line in the longitudinal direction of the substrate is broken in the conventional rupturing device.

圖6,係表示對基板之短邊方向之刻劃線進行裂斷之情形之與圖5同樣之立體圖。 Fig. 6 is a perspective view similar to Fig. 5 showing a state in which the scribe line in the short side direction of the substrate is broken.

圖7,係表示習知之裂斷裝置之基板裂斷時之狀態之剖面圖。 Fig. 7 is a cross-sectional view showing a state in which a substrate of a conventional cracking device is broken.

圖8,係表示形成有刻劃線之基板之一例之俯視圖。 Fig. 8 is a plan view showing an example of a substrate on which a score line is formed.

在以下,針對本發明之裂斷裝置根據圖式進行詳細地說明。圖1,係表示本發明之裂斷裝置之一例之立體圖,係表示對基板之短邊方向之刻劃線進行裂斷之情形者;圖2,係表示對基板之長邊方向之刻劃線進行裂斷之情形之與圖1同樣之立體圖;圖3,係基板裂斷時之放大剖面圖。 Hereinafter, the breaking device of the present invention will be described in detail based on the drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of a cracking device of the present invention, showing a case where a scribe line in a short side direction of a substrate is broken; and Fig. 2 is a line showing a direction of a long side of a substrate. The same perspective view as in Fig. 1 is performed in the case of cracking; Fig. 3 is an enlarged cross-sectional view of the substrate when it is broken.

裂斷裝置1,具備有載置應進行裂斷之基板W之平台2。該平台2,成為可沿著水平之軌條3,3並於Y方向進行移動,透過藉由馬達M1而旋轉之螺桿軸4驅動。此外,平台2成為可藉由內藏馬達之驅動部5在水平面內進行旋動。 The breaking device 1 is provided with a stage 2 on which a substrate W to be broken is placed. The platform 2 is movable along the horizontal rails 3, 3 in the Y direction and is driven by a screw shaft 4 that is rotated by a motor M1. Further, the platform 2 is rotatable in the horizontal plane by the drive unit 5 of the built-in motor.

平台2,為了可保持載置於其上之基板W於固定位置而具備有保持手段。作為該保持手段,例如可藉由來自於平台2開口之多個小的吸附孔(未圖示)之吸氣而吸附保持基板W。 The platform 2 is provided with a holding means for holding the substrate W placed thereon at a fixed position. As the holding means, for example, the substrate W can be adsorbed and held by suction from a plurality of small adsorption holes (not shown) through which the platform 2 is opened.

在夾持平台2而立設之支持柱6,6,係以於X方向延伸之水平之樑(橫架)7橫跨平台2之方式架設。在樑7,沿著梁7之延伸方向亦即X方向而設置有藉由馬達M2而驅動之導引軸8。沿著該導引軸8安裝有可移動之2個保持具9,9,在該保持具9,9分別安裝有左右一對之長條板狀之裂斷桿10,10。 The support columns 6, 6 erected on the clamping platform 2 are erected so that the horizontal beam (cross frame) 7 extending in the X direction straddles the platform 2. In the beam 7, a guide shaft 8 driven by a motor M2 is provided along the direction in which the beam 7 extends, that is, in the X direction. Two movable holders 9, 9 are attached along the guide shaft 8, and a pair of left and right long plate-shaped split bars 10, 10 are attached to the holders 9, 9.

左右之裂斷桿10,10,沿著梁7之延伸方向並配置於一直線上,且藉由流體汽缸11、及由該流體汽缸11驅動之升降軸12而形成為可升降。此外,裂斷桿10之下端,如圖3所示,以於長度方向具有稜線10a之倒三角形而形成。進一步地,各裂斷桿10,10,以與平台2之面垂直之軸(在本實施例中為升降軸12)為中心而形成為可旋轉,藉此,該2個裂斷桿10,10,以成為如圖1所示般沿著梁7之延伸方向亦即X方向串列地排列之串列姿勢、與如圖2所示般沿著與梁7之延伸方向正交之方向亦即Y方向而成為相互平行之分離姿勢之方式而形成。在本實施例中,於升降軸12固接有裂斷桿10,且該升降軸12成為可藉由裝入保持具9內之旋動機構(未圖示)進行旋動而藉此使裂斷桿10進行旋轉。 The left and right split bars 10, 10 are arranged on the straight line along the extending direction of the beam 7, and are formed to be movable up and down by the fluid cylinder 11 and the lifting shaft 12 driven by the fluid cylinder 11. Further, the lower end of the split rod 10, as shown in Fig. 3, is formed by an inverted triangle having a ridge line 10a in the longitudinal direction. Further, each of the split bars 10, 10 is formed to be rotatable about an axis perpendicular to the face of the platform 2 (the lift shaft 12 in this embodiment), whereby the two split bars 10, 10, in a series arrangement in which the direction of the beam 7 is extended in the X direction as shown in FIG. 1, and the direction orthogonal to the direction in which the beam 7 extends is as shown in FIG. That is, the Y direction is formed in such a manner that they are separated from each other. In the present embodiment, the split shaft 10 is fixed to the lifting shaft 12, and the lifting shaft 12 is screwed by a turning mechanism (not shown) inserted into the holder 9 to thereby split the lifting shaft 12. The broken rod 10 is rotated.

分別保持裂斷桿10,10之2個保持具9,9,形成為可藉由驅動馬達M2,而在保持相互之間隔下沿著導引軸8同時地連動而進行移動,並且亦可個別單獨地進行移動。藉由該單獨之移動,可調整裂斷桿10,10彼此之間隔。該構成,例如可在保持具9與導引軸8之嚙合部,藉由使離合器 等之傳動遮斷機構(未圖示)介於其間而可達成解除嚙合並使兩者間之傳動暫時地遮斷。在調整裂斷桿10,10之間隔之情形,打開任一方之保持具9之傳動遮斷機構,且驅動馬達M2而僅使另一方之保持具9進行移動。此外,在保持間隔下使裂斷桿10,10進行移動之情形,若可解除兩方之傳動遮斷機構而成為傳動狀態即可。 The two retaining members 9, 9 are respectively held by the splitting bars 10, 10, and are formed to be movable simultaneously along the guiding shaft 8 while being kept at a mutual interval by the driving motor M2, and may be individually Move separately. By this separate movement, the split bars 10, 10 can be adjusted to each other. This configuration can be, for example, at the meshing portion of the holder 9 and the guide shaft 8, by making the clutch When a transmission blocking mechanism (not shown) is interposed therebetween, the disengagement can be achieved and the transmission between the two can be temporarily interrupted. In the case of adjusting the interval between the split bars 10, 10, the drive breaking mechanism of either of the holders 9 is opened, and the motor M2 is driven to move only the other holder 9. Further, in the case where the split bars 10, 10 are moved at the holding interval, the drive cut-off mechanism can be released and the transmission state can be achieved.

接著,針對利用上述之裂斷裝置1,對在圖8所示之基板W,亦即以既定之間距形成有於表面相互正交之刻劃線S1,S2之長方形之基板W進行裂斷之動作進行說明。首先,在對基板W之長邊方向之刻劃線S1進行分斷時,如圖1所示,使2個裂斷桿10,10沿著X方向串列地排列。在本實施例中成為相互連結之連結狀態。而且如圖3(a)所示,以刻劃線S1,S2成為朝下之方式將基板W載置於平台2上之緩衝片13之上面。在該情形,將基板W載置成長邊方向之刻劃線S1與裂斷桿10,10之連結方向亦即X方向為一致。另外,連結2個裂斷桿10,10時之長度,預先設定成較應進行裂斷之長邊方向之刻劃線S1之長度為長。在該狀態下,使連結之裂斷桿10,10從刻劃線S1之正上方下降,並對最初之刻劃線S1進行裂斷,接著,僅使平台2以刻劃線S1之間距程度往Y方向移動並對下一個刻劃線S1進行裂斷。在所圖示之基板W中,由於長邊方向之刻劃線S1有2條,因此藉由使裂斷桿10下降2次,可裂斷所有之長邊方向之刻劃線S1。 Next, with respect to the cracking apparatus 1 described above, the substrate W shown in FIG. 8 is cut, that is, the rectangular substrate W having the scribe lines S1, S2 orthogonal to each other at a predetermined interval is formed. The action is explained. First, when the scribe line S1 is cut in the longitudinal direction of the substrate W, as shown in FIG. 1, the two rupture bars 10, 10 are arranged in series along the X direction. In the present embodiment, they are connected to each other. Further, as shown in FIG. 3(a), the substrate W is placed on the upper surface of the buffer sheet 13 on the stage 2 with the scribe lines S1 and S2 facing downward. In this case, the direction in which the substrate W is placed in the direction of the growth direction and the direction in which the crack bars 10 and 10 are connected to each other, that is, the X direction. Further, the length at which the two split bars 10 and 10 are connected is set to be longer than the length of the score line S1 in the longitudinal direction corresponding to the break. In this state, the joined splitting bars 10, 10 are lowered from directly above the score line S1, and the first line S1 is cut, and then only the distance between the platforms 2 and the score line S1 is made. Move in the Y direction and break the next score line S1. In the substrate W shown, since there are two scribe lines S1 in the longitudinal direction, by cutting the rupture rod 10 twice, all the scribe lines S1 in the longitudinal direction can be broken.

一旦完成長邊方向之刻劃線S1之裂斷,如圖2所示,使2個裂斷桿10,10分離,並成為沿著與梁7之延伸方向正交之方向亦即Y方向而成為相互平行之分離姿勢,並且調整裂斷桿10,10之間隔成為與刻劃線S2之間距一致。另外,各別之裂斷桿10之長度,預先設定成較應進行裂斷之 短邊方向之刻劃線S2之長度為長。在該狀態下,使2個裂斷桿10,10從刻劃線S2,S2之正上方同時地下降,藉此同時地裂斷2條刻劃線S2,S2(參照圖3)。接著,使裂斷桿10,10在保持其間隔下,沿著導引軸8移動至接下來應進行裂斷之刻劃線S2,S2之正上方,且與上述同樣地使其下降並進行裂斷。重複進行該動作直到裂斷所有之短邊方向之刻劃線S2。在所圖示之基板W中,由於短邊方向之刻劃線S2有5條,因此藉由使裂斷桿10,10下降3次而完成短邊方向之刻劃線S2之裂斷。若短邊方向之刻劃線S2有10條,則藉由5次的下降便可裂斷所有10條之刻劃線S2。 Once the crack of the scribe line S1 in the longitudinal direction is completed, as shown in FIG. 2, the two rupture bars 10, 10 are separated and become in the Y direction which is orthogonal to the direction in which the beam 7 extends. The separation postures are parallel to each other, and the interval between the split bars 10, 10 is adjusted to coincide with the distance between the score lines S2. In addition, the length of each of the splitting bars 10 is preset to be more likely to be broken. The length of the line S2 in the short side direction is long. In this state, the two split bars 10, 10 are simultaneously lowered from directly above the score lines S2, S2, thereby simultaneously breaking the two score lines S2, S2 (see Fig. 3). Next, the split bars 10, 10 are moved along the guide shaft 8 to the right side of the score lines S2, S2 which are to be broken next, and are lowered and carried out in the same manner as described above while maintaining the interval therebetween. Broken. This action is repeated until all the short-side direction marks S2 are broken. In the substrate W shown, since there are five score lines S2 in the short-side direction, the cracks of the score line S2 in the short-side direction are completed by lowering the split bars 10, 10 three times. If there are 10 lines S2 in the short side direction, all 10 lines S2 can be broken by 5 times of lowering.

如此,藉由使成為分離姿勢之2個裂斷桿10,10同時地下降,可對2條刻劃線同時進行裂斷並可縮短裂斷所需之時間,並且,使其在維持相互之間隔下沿著導引軸8移動,藉此可以相同間隔連續地進行裂斷。 In this way, by simultaneously lowering the two split bars 10, 10 in the separated posture, the two score lines can be simultaneously broken and the time required for the break can be shortened, and the mutual retention can be maintained. The movement is carried out along the guide shaft 8 at intervals, whereby the breakage can be continuously performed at the same interval.

此外,在基板W之長邊方向之刻劃線S1之長度較各裂斷桿10,10之長度為短之情形,與短邊方向之刻劃線S2之裂斷時相同般,使裂斷桿10,10成為相互平行之分離姿勢,且使平台2旋轉而以刻劃線S1與Y方向一致之方式配置基板W,藉此亦可對2條長邊方向之刻劃線S1同時進行裂斷。藉此,可進一步有助於裂斷所需時間之縮短。 Further, the length of the scribe line S1 in the longitudinal direction of the substrate W is shorter than the length of each of the rupture bars 10, 10, and is the same as when the scribe line S2 in the short-side direction is broken. The rods 10, 10 are in a mutually parallel separation posture, and the stage 2 is rotated to arrange the substrate W so that the scribe lines S1 and the Y direction coincide with each other, whereby the two long-side scribe lines S1 can be simultaneously split. Broken. Thereby, the shortening of the time required for the cracking can be further contributed.

另外,如圖4所示,在使2個裂斷桿10,10於一直線上連結時,於裂斷桿10,10之鄰接之側端部,可設置相互嚙合之凹部10c與凸部10b。藉此,可確實地保持2個裂斷桿10,10兩者之直線之連結狀態。 Further, as shown in Fig. 4, when the two split bars 10, 10 are connected in a straight line, the mutually adjacent concave end portions 10c and the convex portions 10b may be provided at the side end portions adjacent to the split bars 10, 10. Thereby, the state in which the two split bars 10 and 10 are connected in a straight line can be surely maintained.

以上,已針對本發明之代表性之實施例進行說明,但本發明並不一定僅限定於上述之實施例。例如,在上述實施例中,雖揭示設置有2 個裂斷桿10,但亦可設置3個或其以上。而且,在達成本發明之目的、不脫離請求範圍之範圍內,可做適當地修正、變更。 The representative embodiments of the present invention have been described above, but the present invention is not necessarily limited to the above embodiments. For example, in the above embodiment, although it is disclosed that there are 2 One broken rod 10, but three or more may be provided. Further, it is possible to appropriately modify and change the scope of the present invention without departing from the scope of the claims.

本發明可適用於由玻璃、陶瓷、藍寶石、及半導體晶圓等之脆性材料所構成之基板之裂斷裝置。 The present invention is applicable to a cracking device for a substrate composed of a brittle material such as glass, ceramic, sapphire, or a semiconductor wafer.

W‧‧‧脆性材料基板 W‧‧‧Battery material substrate

S1‧‧‧長邊方向之刻劃線 S1‧‧‧ long-term direction marking

S2‧‧‧短邊方向之刻劃線 S2‧‧‧Drawing in the direction of the short side

M1,M2‧‧‧馬達 M1, M2‧‧‧ motor

1‧‧‧裂斷裝置 1‧‧‧breaking device

2‧‧‧平台 2‧‧‧ platform

3‧‧‧軌條 3‧‧‧ rails

4‧‧‧螺桿軸 4‧‧‧ Screw shaft

5‧‧‧驅動部 5‧‧‧ Drive Department

6‧‧‧支持柱 6‧‧‧Support column

7‧‧‧樑 7‧‧ ‧ beams

8‧‧‧導引軸 8‧‧‧Guidance axis

9‧‧‧保持具 9‧‧‧Holding

10‧‧‧裂斷桿 10‧‧‧crack

11‧‧‧流體汽缸 11‧‧‧ fluid cylinder

12‧‧‧升降軸 12‧‧‧ Lifting shaft

13‧‧‧緩衝片 13‧‧‧buffer

Claims (2)

一種脆性材料基板之裂斷裝置,係由具有載置脆性材料基板之載置面之平台、在該平台之上方配置成與該載置面平行之樑、沿著該樑之延伸方向並設置於該樑之導引軸、以及形成為可沿著該導引軸移動之多個裂斷桿所構成,以如下方式形成:該多個裂斷桿之各個,形成為可透過升降軸而升降,且形成為可以與該載置面垂直之軸作為中心而旋轉,藉此該多個裂斷桿成為沿著樑之延伸方向串列地排列之串列姿勢、以及沿著與樑之延伸方向正交之方向成為相互平行之分離姿勢。 A cracking device for a brittle material substrate is provided on a platform having a mounting surface on which a substrate of a brittle material is placed, a beam disposed parallel to the mounting surface above the platform, and disposed along a direction in which the beam extends The guide shaft of the beam and the plurality of split rods formed to be movable along the guide shaft are formed in such a manner that each of the plurality of split rods is formed to be movable up and down through the lifting shaft. And being formed so as to be rotatable about a shaft perpendicular to the mounting surface, whereby the plurality of split bars are arranged in series in a row along the extending direction of the beam, and along the direction in which the beam extends The direction of intersection becomes a separate posture that is parallel to each other. 如申請專利範圍第1項之裂斷裝置,其中,該多個裂斷桿,在該分離姿勢中,可在維持裂斷桿彼此之間隔下沿著該導引軸同時地進行移動,並且亦可個別單獨地進行移動。 The rupture device of claim 1, wherein the plurality of rupture bars are simultaneously movable along the guiding axis while maintaining the spacing between the rupture bars in the separating posture, and It can be moved individually and individually.
TW102108993A 2012-07-18 2013-03-14 Breaking device of brittle material substrate TWI603928B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012159262A JP5981791B2 (en) 2012-07-18 2012-07-18 Breaking device for brittle material substrate

Publications (2)

Publication Number Publication Date
TW201404733A true TW201404733A (en) 2014-02-01
TWI603928B TWI603928B (en) 2017-11-01

Family

ID=50041204

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102108993A TWI603928B (en) 2012-07-18 2013-03-14 Breaking device of brittle material substrate

Country Status (4)

Country Link
JP (1) JP5981791B2 (en)
KR (1) KR101788645B1 (en)
CN (2) CN103568073B (en)
TW (1) TWI603928B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI639566B (en) * 2014-04-28 2018-11-01 日商三星鑽石工業股份有限公司 Cracking device for brittle material substrate
TWI659934B (en) * 2014-12-10 2019-05-21 日商三星鑽石工業股份有限公司 Substrate breaking method and scribing device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104786289B (en) * 2015-03-19 2017-01-04 浙江泰科节能材料有限公司 Geothermal foam board circular arc groove slotting device
CN104912488B (en) * 2015-04-10 2017-03-15 北京安泰钢研超硬材料制品有限责任公司 Diamond core boring bit head of rod and preparation method thereof is drawn for sapphire
JP6627326B2 (en) * 2015-08-20 2020-01-08 三星ダイヤモンド工業株式会社 Break device
CN107445466B (en) * 2017-09-22 2020-04-21 方鼎科技有限公司 Device for separating glass sheets
JP6949371B2 (en) * 2017-12-15 2021-10-13 三星ダイヤモンド工業株式会社 Board divider
CN110695553A (en) * 2019-09-26 2020-01-17 上海君屹工业自动化股份有限公司 Laser welding transplanting and copper nozzle plugging mechanism for lithium battery
JP2021154502A (en) * 2020-03-25 2021-10-07 三星ダイヤモンド工業株式会社 Breaking method of brittle material substrate and substrate processing device
JP2024031714A (en) * 2022-08-25 2024-03-07 株式会社AC-X Tech braking device
CN115972311B (en) * 2023-03-20 2023-05-23 中电科风华信息装备股份有限公司 Electric claw breaking mechanism for panel fracture and separation

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0784006B2 (en) * 1986-07-29 1995-09-13 松下電器産業株式会社 Substrate dividing device
JPH0696247B2 (en) * 1988-12-07 1994-11-30 松下電器産業株式会社 Substrate dividing device
JPH08194200A (en) * 1995-01-17 1996-07-30 Ookubo Seisakusho:Kk Method for parting liquid crystal cell and device therefor
JP2002096299A (en) * 2000-09-14 2002-04-02 Stanley Electric Co Ltd Cutting method of resin plate for light guide plate
JP3787489B2 (en) * 2000-10-02 2006-06-21 三星ダイヤモンド工業株式会社 Method and apparatus for breaking brittle substrate
JP3792508B2 (en) * 2000-12-19 2006-07-05 三星ダイヤモンド工業株式会社 Method for dividing bonded brittle substrates
KR100817129B1 (en) * 2002-02-07 2008-03-27 엘지.필립스 엘시디 주식회사 Cutting device and method of liquid crystal panel
KR100751575B1 (en) * 2003-09-24 2007-08-22 미쓰보시 다이야몬도 고교 가부시키가이샤 Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method
KR100863438B1 (en) * 2006-05-08 2008-10-16 주식회사 탑 엔지니어링 Scribing device using multi-axis synchronous control and its method
TWI508153B (en) * 2010-04-30 2015-11-11 三星鑽石工業股份有限公司 Disconnection device and disconnection method of brittle material substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI639566B (en) * 2014-04-28 2018-11-01 日商三星鑽石工業股份有限公司 Cracking device for brittle material substrate
TWI659934B (en) * 2014-12-10 2019-05-21 日商三星鑽石工業股份有限公司 Substrate breaking method and scribing device

Also Published As

Publication number Publication date
CN107127900B (en) 2019-02-26
CN107127900A (en) 2017-09-05
KR101788645B1 (en) 2017-10-20
JP2014019044A (en) 2014-02-03
JP5981791B2 (en) 2016-08-31
CN103568073B (en) 2017-03-29
CN103568073A (en) 2014-02-12
KR20140011469A (en) 2014-01-28
TWI603928B (en) 2017-11-01

Similar Documents

Publication Publication Date Title
TWI603928B (en) Breaking device of brittle material substrate
JP4965632B2 (en) Substrate cutting system, substrate manufacturing apparatus, substrate scribing method, and substrate cutting method
TWI410313B (en) Substrate breaking device
TWI650292B (en) Breaking method of brittle material substrate and breaking device
KR101383644B1 (en) Substrate separation device and for method for separating the substrate using thereof
TWI623402B (en) Method and device for cutting brittle material substrate
JP2009208237A (en) Scribing device and its method
TWI619684B (en) Breaking device
JP2010052995A (en) Method for scribing mother substrate
JP6364789B2 (en) Scribing equipment
JP6085384B2 (en) Breaking device for brittle material substrate
TW201540680A (en) Breaking method and breaking device
TWI532088B (en) Breaking device
JP2010023071A (en) Method for machining terminal of laminated substrate
JP2019196281A (en) Substrate dividing device
TW201608625A (en) Substrate breaking device
TW201432842A (en) Substrate processing apparatus
TW201515800A (en) Expander, breaking device and breaking method
JP4447654B2 (en) Scribing apparatus and scribing method
TWI458690B (en) Method of breaking the substrate
KR20150090812A (en) Scribing apparatus of brittle material substrate
TWI619588B (en) Fracture method and device for brittle material substrate
KR20120034295A (en) Scribing method of glass panel
JP2014019604A (en) Fragile material substrate breaking device
KR101980606B1 (en) Tilting type panel breaking device of brittle material substrate and tilting type panel breaking method using the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees