JP2015198160A - Imprint mold substrate and method for producing the same, imprint method, imprint mold and method for regenerating the same - Google Patents

Abstract

An imprint mold substrate having a concave portion with a desired accuracy and partially reusable, a method for manufacturing the same, an imprint mold manufactured from the imprint mold substrate, and the imprint mold An imprint method used and a method for regenerating the imprint mold are provided. An imprint mold substrate (1) includes a thin plate portion (2) having a main surface (2A), a hollow cylindrical support portion (3) that supports a facing surface (2B) facing the main surface (2A) of the thin plate portion (2), and a thin plate portion (2). And the joint portion 4 that joins the thin plate portion 2 and the support portion 3 so as to close the opening end 31 of the support portion 3 with the facing surface 2B, and the facing surface 2B side of the thin plate portion 2 A light-shielding portion 5 that can shield light so that light traveling in the thickness direction of the thin plate portion 2 from the main surface 2A side or the main surface 2A side toward the opposing surface 2B side is not irradiated to the joint portion 4; Is composed of a pressure-sensitive adhesive composition that exhibits adhesiveness or has reduced adhesive strength when irradiated with light. [Selection] Figure 1

Description

  The present invention relates to an imprint mold substrate, a manufacturing method thereof, an imprint mold, an imprint method using the imprint mold, and a method of regenerating the imprint mold.

  Nanoimprint technology as a microfabrication technology uses a mold member (imprint mold) in which a fine concavo-convex pattern is formed on the surface of a substrate, and transfers the fine concavo-convex pattern onto a workpiece such as an imprint resin. This is a pattern formation technique for transferring a fine concavo-convex pattern at an equal magnification (see Patent Document 1). In particular, with the progress of further miniaturization of wiring patterns and the like in semiconductor devices, nanoimprint technology is gaining more and more attention in semiconductor device manufacturing processes and the like.

  In such a nanoimprint technique, a strong force is required to peel off the imprint mold from a state where the imprint mold and the imprint resin as a workpiece are in close contact with each other. Therefore, when the imprint mold is peeled off, the fine uneven pattern transferred to the imprint resin or the imprint mold may be destroyed.

  Conventionally, in order to solve such a problem, an imprint having a concave portion formed so that a recess becomes deeper from the outer edge portion of the substrate toward the central portion of the substrate on the surface facing the surface on which the fine unevenness pattern is formed. A mold has been proposed (see Patent Document 2).

US Pat. No. 5,772,905 JP 2009-170773 A

  In the imprint mold disclosed in Patent Document 2, the imprint mold has a concave portion on the surface facing the surface on which the fine concavo-convex pattern is formed, so that the imprint mold is peeled off from the imprint resin. Can be bent and can be released with a smaller force.

  However, the technique for processing the recess for making the imprint mold bendable is a very advanced technique. This is because when the concave portion that can bend the imprint mold to the extent that the desired peeling performance is obtained is formed by machining using a cutting tool or the like, control of the thickness of the bottom portion of the concave portion, surface finishing, etc. The processing difficulty is very high. Therefore, it takes time to manufacture the imprint mold having the intended concave shape, which may cause a problem of yield. Moreover, expensive capital investment for manufacturing the imprint mold which has the said recessed part is needed.

  In general, a fine uneven pattern is formed using a fine processing technique such as electron beam exposure or self-organization, and a mold having a concave portion on a surface facing the surface on which the fine uneven pattern is formed (master mold). ) And an imprint process using the master mold is formed on the surface opposite to the surface on which the micro uneven pattern is formed by reversing the micro uneven pattern of the master mold and the surface on which the micro uneven pattern is formed. A large number of molds (replica molds) having recessed portions formed are produced. This replica mold is usually used for imprint processing, which is one of the manufacturing processes for semiconductor products and the like. The reason why imprint processing is performed using such a replica mold is to reduce the risk of damage to the master mold, which requires a great amount of time and cost for production.

  The master mold and replica mold may be damaged and discarded. At that time, it is not preferable to discard the master mold or the replica mold having the recesses formed with high precision as it is from the viewpoint of manufacturing cost and environment.

  In view of the above-described problems, the present invention provides a substrate for imprint mold that has a concave portion with a desired accuracy and is partially reusable, a method for manufacturing the same, and an imprint mold manufactured from the imprint mold substrate. It is another object of the present invention to provide an imprint method using the imprint mold and a method for regenerating the imprint mold.

  In order to solve the above problems, the present invention provides a thin plate portion having a main surface on which a fine concavo-convex pattern can be formed, a hollow cylindrical support portion that supports a facing surface facing the main surface of the thin plate portion, A joining portion that is interposed between the thin plate portion and the support portion, and joins the thin plate portion and the support portion so as to close one end of the opening of the hollow cylindrical support portion with the facing surface; and the thin plate portion The light that travels in the thickness direction of the thin plate portion from the main surface side of the thin plate portion to the main surface side of the thin plate portion is prevented from being irradiated to the joint portion. A light-shielding part that shields the light, and the joint part is an adhesive composition that exhibits adhesiveness when irradiated with light, or an adhesive composition whose adhesive strength decreases when irradiated with light. Imprint mold characterized by comprising Providing a substrate (invention 1).

  The thin plate portion having the main surface on which the fine uneven pattern can be formed and the hollow cylindrical support portion are closed with the opening end of the hollow cylindrical support portion facing the main surface of the thin plate portion. By being bonded via the bonding portion, an imprint mold substrate having a highly accurate recess can be obtained. In this imprint mold substrate, when the pressure-sensitive adhesive composition constituting the joint portion is cured by light irradiation and exhibits adhesiveness, an imprint mold produced from the imprint mold substrate is obtained. When used in the optical imprint process, and the light during the imprint process is also irradiated to the joint, the joint is contracted by the progress of curing of the adhesive composition constituting the joint, and the thin plate portion There is a possibility that the bonding state with the support portion changes. As a result, for example, it affects the flatness of the main surface of the thin plate portion (the surface on which the fine concavo-convex pattern is formed), reduces the accuracy of the pattern formed by the imprint process, or causes pattern defects. There is a risk. In addition, when the pressure-sensitive adhesive composition that constitutes the joint is one that reduces the adhesive strength by light irradiation, if the light during the imprint process is irradiated to the joint, the imprint process is particularly effective. There is a possibility that the thin plate portion and the support portion are separated when the print mold is peeled off. However, according to the substrate for imprint molds according to the above invention (Invention 1), the light shielding portion is such that light that travels in the thickness direction from the facing surface side to the main surface side of the thin plate portion is not irradiated to the joint portion. In this case, the light is not irradiated to the joint during the optical imprint process using the imprint mold produced from the imprint mold substrate. Therefore, the influence of the light irradiation on the joint (shrinkage of the joint, thin plate) And the like can be reduced.

  In the said invention (invention 1), the said light-shielding part may be located in the said support part side rather than the said junction part, and may be located in the said thin-plate part side (invention 2). Moreover, in this invention (invention 1 and 2), the said light-shielding part may be provided between the said support part and the said junction part (invention 3), and may be inherent in the said support part. (Invention 4), may be provided on the inner peripheral wall of the hollow cylindrical support portion (Invention 5).

In the said invention (invention 1-5), it is preferable that the optical density of the said light-shielding part is 2 or more (invention 6).
In the said invention (invention 1-6), it is preferable that the said thin-plate part is comprised by the material which permeate | transmits light (invention 7), and the said support part is comprised by the material which permeate | transmits light. Preferred (Invention 8).

  Moreover, this invention provides the imprint mold characterized by forming the fine uneven | corrugated pattern in the said main surface of the said thin-plate part of the substrate for imprint molds concerning the said invention (invention 1-8). (Invention 9).

  Furthermore, the present invention is interposed between a thin plate portion having a main surface, a hollow cylindrical support portion that supports a facing surface facing the main surface of the thin plate portion, and between the thin plate portion and the support portion, A method for manufacturing an imprint mold substrate comprising a bonding portion for bonding them, wherein the thin plate portion of the imprint mold substrate is directed from the facing surface side toward the main surface side or of the thin plate portion. A step of providing a light-shielding portion on the support portion or the thin plate portion so that light traveling in the thickness direction of the thin plate portion from the main surface side toward the opposing surface side is not irradiated to the joint portion; When the thin plate portion and the support portion are overlapped with each other so that the opening end of the portion is closed by the opposing surface of the thin plate portion, an adhesive layer is formed on the thin plate portion and / or the overlapping portion of the support portion. Forming the adhesive layer A pressure-sensitive adhesive composition in which the thin plate portion and the support portion are superposed and the thin plate portion and the support portion are joined together, and the pressure-sensitive adhesive layer exhibits adhesiveness by light irradiation. Provided is a method for producing an imprint mold substrate, characterized in that it is composed of a pressure-sensitive adhesive composition whose adhesive strength is reduced by irradiation of an object or light (Invention 10).

  In the said invention (invention 10), the said adhesive layer is comprised with the adhesive composition which expresses adhesiveness by irradiation of light, and the said main surface side of the said thin-plate part in the said process, or the said opposition It is preferable to join the thin plate portion and the support portion by irradiating the pressure-sensitive adhesive layer with light from the surface side (Invention 11).

  Furthermore, the present invention is such that the imprint mold according to the above invention (Invention 9) is brought into contact with the imprint resin supplied on the main surface of the substrate to be processed, and the imprint resin is made to be the main component of the substrate to be processed. A step of spreading on the surface, a step of curing the imprint resin developed on the main surface of the substrate to be processed, and a step of peeling the imprint mold from the cured imprint resin. A characteristic imprint method is provided (Invention 12).

  In the above invention (Invention 12), the imprint resin is a photocurable resin, and in the step of curing the imprint resin, the opposing surface side along the thickness direction of the thin plate portion of the imprint mold. It is preferable to irradiate light from the main surface side toward the main surface side or from the main surface side toward the opposing surface side (Invention 13).

  The present invention is also a method for regenerating an imprint mold according to the above invention (Invention 9), wherein the thin plate portion having the fine concavo-convex pattern is separated from the support portion, and the thin plate portion is separated. When the thin plate portion and the support portion are overlapped with each other so that the opening end of the support portion is closed with a new thin plate portion, the thin plate portion and / or the overlapping portion of the support portion is irradiated with light. A step of forming a pressure-sensitive adhesive composition that develops a pressure-sensitive adhesive composition that develops a pressure-sensitive adhesive composition by irradiating light, or a pressure-sensitive adhesive composition that reduces the pressure-sensitive adhesive strength by irradiating light, the thin plate portion and the support A method of regenerating an imprint mold, comprising the step of adhering a part to the adhesive layer with the pressure-sensitive adhesive layer (Invention 14).

  According to the present invention, a substrate for imprint mold having a concave portion with a desired accuracy and partially reusable, a method for manufacturing the same, an imprint mold manufactured from the substrate for imprint mold, and the imprint mold An imprint method using a print mold and a method for regenerating the imprint mold can be provided.

1A is a cut end view showing a schematic configuration of an imprint mold substrate according to an embodiment of the present invention, and FIG. 1B is an imprint mold substrate shown in FIG. FIG. FIG. 2 is an exploded perspective view showing a schematic configuration of an imprint mold substrate according to an embodiment of the present invention. FIG. 3 is a cut end view schematically showing another configuration example of the imprint mold substrate according to the embodiment of the present invention. FIG. 4 is a cut end view schematically showing another configuration example of the light shielding portion in the imprint mold substrate according to the embodiment of the present invention. 5A and 5B are partially enlarged cut end views schematically showing another configuration example in the vicinity of the joint portion in the imprint mold substrate according to the embodiment of the present invention. FIG. 6 is a process flow diagram showing each step of the method for manufacturing an imprint mold substrate according to the embodiment of the present invention in a cross-sectional view. FIG. 7 is a cut end view showing a schematic configuration of an imprint mold in one embodiment of the present invention. FIG. 8 is a plan view showing a schematic configuration of an imprint mold in one embodiment of the present invention. FIG. 9 is a process flow diagram showing each step of the imprint mold manufacturing method according to the embodiment of the present invention in a cut end view. FIG. 10 is a process flow diagram illustrating the imprint method according to the embodiment of the present invention in a cut end view. FIG. 11 is a process flow diagram showing the respective steps of the method for regenerating an imprint mold substrate in an embodiment of the present invention in cross-sectional views. FIG. 12 is a partially enlarged cut end view schematically showing a configuration in the vicinity of a joint portion of an imprint mold substrate according to another embodiment of the present invention.

Embodiments of the present invention will be described with reference to the drawings.
[Imprint mold substrate]
1A is a cut end view showing a schematic configuration of the imprint mold substrate according to the present embodiment, and FIG. 1B is a portion A in the imprint mold substrate shown in FIG. FIG. 2 is an enlarged perspective view, FIG. 2 is an exploded perspective view showing a schematic configuration of the imprint mold substrate according to the present embodiment, and FIG. 3 is another configuration example of the imprint mold substrate according to the present embodiment. FIG. 4 is a cut end view schematically showing, and FIG. 4 is a cut end view schematically showing another configuration example of the light shielding layer in the imprint mold substrate according to the present embodiment. B) is a partially enlarged cut end view schematically showing another configuration example in the vicinity of the joint in the imprint mold substrate according to the present embodiment.

  As shown in FIGS. 1A, 1B, and 2, an imprint mold substrate 1 according to this embodiment includes a thin plate portion 2 having a main surface 2A on which a fine uneven pattern of the imprint mold can be formed. And a hollow cylindrical support portion 3 that supports the opposing surface 2B facing the main surface 2A of the thin plate portion 2, and the thin plate portion 2 and the support portion 3 are interposed between the thin plate portion 2 and the support portion 3. A joining portion 4 and a light shielding layer 5 interposed between the support portion 3 and the joining portion 4 are provided.

  The thin plate portion 2 is joined to the support portion 3 via the joint portion 4 so as to close the opening end 31 (see FIG. 2) of the hollow cylindrical support portion 3. Thus, the substrate 1 for imprint molds according to the present embodiment has the concave portion 7 constituted by the hollow portion 30 of the support portion 3 and the facing surface 2B of the thin plate portion 2 that closes the opening end 31. Therefore, the opposing surface 2B of the thin plate portion 2 is configured as a flat surface to the extent required for the bottom surface of the concave portion 7 of the substrate 1 for imprint mold.

  Examples of the thin plate portion 2 include a glass substrate such as a quartz glass substrate, a soda glass substrate, a fluorite substrate, a calcium fluoride substrate, a magnesium fluoride substrate, an acrylic glass substrate, and a borosilicate glass substrate; a polycarbonate substrate, a polypropylene substrate, and polyethylene. A transparent substrate such as a single-layer substrate made of a substrate, a resin substrate such as a polyolefin substrate, or a laminated substrate formed by laminating two or more arbitrarily selected from the above substrates can be used.

  In this embodiment, “transparent” means light having a wavelength capable of curing a photocurable resin as an imprint resin, for example, light having a wavelength of 200 to 400 nm. When irradiating from one side of 2), it means that light reaches the side opposite to the irradiated side. The reason why the thin plate portion 2 is transparent is to cure the photocurable resin (imprint resin) during the imprint process and to irradiate the joint portion 4 with light. Is 60% or more, preferably 90% or more, particularly preferably 96% or more.

  In the present embodiment, the shape (planar shape) of the thin plate portion 2 is a substantially rectangular shape, but is not limited to such a shape, and is an application of an imprint mold manufactured from the imprint mold substrate 1. It may be an arbitrary shape according to, for example, a substantially circular shape. Further, the size (size in plan view) of the thin plate portion 2 is not particularly limited, and can be set to a size according to the use of the imprint mold produced from the imprint mold substrate 1. .

  Furthermore, the thickness T2 of the thin plate portion 2 can be appropriately set according to the material of the thin plate portion 2, the use of the imprint mold produced from the imprint mold substrate 1, and the thin plate portion 2 is made of quartz glass. When configured, it may be set to about 0.3 to 1.5 mm. The imprint mold 10 (see FIG. 7) produced from the imprint mold substrate 1 according to the present embodiment is formed by closing the opening end 31 of the hollow portion 30 of the support portion 3 by the thin plate portion 2. By having the concave portion 7, at the time of imprint processing, particularly at the time of peeling of the imprint mold 10, at least the region of the thin plate portion 2 where the fine uneven pattern is formed can be curved, and the imprint mold 10 ( (See FIG. 7). Therefore, if the thickness T2 of the thin plate portion 2 is too thin or too thick, it may be difficult to bend as intended when the imprint mold 10 is peeled off. Moreover, when the thickness T2 of the thin plate portion 2 is too thin, the strength of the imprint mold 10 may be reduced.

  In the imprint mold substrate 1 according to this embodiment, the support portion 3 is bonded to the vicinity of the outer edge portion of the facing surface 2B facing the main surface 2A of the thin plate portion 2 via the bonding portion 4. Of the opposing surface 2B of the portion 2, at least the surface in the vicinity of the outer edge portion that is in contact with the joint portion 4 is subjected to a treatment for improving the adhesion with the joint portion 4 such as roughening or adhesion layer formation. It is preferable. By performing the treatment on the surface in the vicinity of the outer edge portion, when separating the thin plate portion 2 and the support portion 3, it becomes easier to leave the joint portion 4 on the thin plate portion 2 side. Can be reused more easily.

  In the present embodiment, as shown in FIG. 3A, the thin plate portion 2 may have a so-called mesa structure having a convex structure portion 21 on the main surface 2A side. Further, as shown in FIG. 3B, the main surface 2A of the thin plate portion 2 has a chromium-based material such as Cr or a nitride of Cr; silicon, an alloy containing silicon, silicon oxide, silicon nitride, or the like. A hard mask layer 6 made of a silicon-based material or the like may be formed.

  The support portion 3 has a hollow rectangular tube shape whose outer shape is substantially rectangular in plan view, and a substantially circular hollow portion 30 is formed at a substantially center in plan view. 3 A of main surfaces of the support part 3 are joined to the opposing surface 2B of the thin plate part 2 via the junction part 4 so that the opening end 31 of the support part 3 may be obstruct | occluded by the thin plate part 2 (opposing surface 2B). Thereby, the bottomed substantially cylindrical recessed part 7 is formed.

  The material which comprises the support part 3 is not specifically limited, The same material as the material which comprises the thin plate part 2 may be sufficient, and a different material may be sufficient as it. When the support part 3 is comprised with a material different from the material which comprises the thin-plate part 2, as a material which comprises the said support part 3, as a silicon-type material, a metal material, quartz glass, soda glass, fluorite, Examples include glass materials such as calcium fluoride, magnesium fluoride, acrylic glass, and borosilicate glass; resin materials such as polycarbonate, polypropylene, polyethylene, and other polyolefins, and ceramic materials such as low expansion ceramics. In particular, when a transparent material is used as the material constituting the support portion 3 in the same manner as the thin plate portion 2, the effect of the light shielding portion 5 of the imprint mold substrate 1 according to the present embodiment is remarkably exhibited.

  The size of the outer shape of the support portion 3 in plan view may be substantially the same as the size of the thin plate portion 2 or may be larger than the thin plate portion 2. When the sizes are substantially the same, there is no step when viewed from the thin plate portion 2 side. For example, when the thin plate portion 2 and the support portion 3 are joined together, chamfering of the end surface portion is necessary. Can be easily implemented. On the other hand, when the support part 3 is larger than the thin plate part 2, for example, when the support part 3 and the thin plate part 2 are separated, the part where the difference in size is generated is held as an area where the support part 3 can be held. It becomes possible. Further, positional deviation at the time of joining is allowed.

  Further, the size of the hollow portion 30 (opening end 31 closed by the thin plate portion 2) in plan view is a size that can include at least a region where a fine uneven pattern is formed on the main surface 2A of the thin plate portion 2. It is. When the imprint process using the imprint mold 10 (see FIG. 7) produced from the imprint mold substrate 1 is performed, in particular, the hollow portion 30 has such a size that the hollow portion 30 can include a fine uneven pattern. When the imprint mold 10 is peeled off, the effect of facilitating peeling from the imprint resin by curving at least the region where the fine uneven pattern is formed can be exhibited.

  The thickness T3 of the support part 3 can be appropriately set according to the design value of the depth of the recess 7 of the imprint mold 10 produced from the imprint mold substrate 1 according to the present embodiment. It can be set to about 10 mm.

  The joining part 4 is comprised by the adhesive hardened | cured material formed by hardening the adhesive composition which can adhere | attach the thin plate part 2 and the support part 3. As shown in FIG. This pressure-sensitive adhesive composition can exhibit adhesiveness when irradiated with light, or can decrease adhesive strength when irradiated with light. Joining of the thin plate part 2 and the support part 3 becomes easy by the joining part 4 being comprised with the hardened | cured material of the adhesive composition which can express adhesiveness by irradiation of light. Moreover, the imprint mold 10 (made from the substrate 1 for imprint molds which concerns on this embodiment by comprising the junction part 4 with the hardened | cured material of the adhesive composition which can reduce adhesive force by irradiation of light. When reproducing (see FIG. 7), the thin plate portion 2 and the support portion 3 can be easily separated by irradiating the joint portion 4 with light (see FIG. 11).

  As an adhesive composition which can express adhesiveness by light irradiation, adhesive resin materials, such as an epoxy resin, an acrylic resin, a urethane resin, etc. can be used, for example. In order to increase the bonding strength, it is preferable to select an optimum material suitable for the material of the adherend (in this embodiment, the thin plate portion 2 and the support portion 3) as the pressure-sensitive adhesive composition. The tackifying resin material (tackfire) that can express high tackiness with respect to the part 2 and the support part 3) may be mixed with the adhesive resin material. For example, if the thin plate portion 2 and the support portion 3 made of quartz or silicon are joined, a rosin derivative as a tackifier resin (tackfire), a polyterpene resin or the like to a (meth) acrylic polymer as an adhesive resin material You may use what mixed these as said adhesive composition. In order to further increase the bonding strength, a primer may be further used in combination. As a method of joining the thin plate portion 2 and the support portion 3 using a primer, for example, a silane coupling agent is applied to the surface of the thin plate portion 2 and the support portion 3 made of quartz or the like as a primer, and bonding to quartz or the like is performed. The method etc. which join the thin-plate part 2 and the support part 3 through the adhesive resin material with low intensity | strength can be mentioned. Thereby, the adhesive resin material with low joint strength with respect to quartz like polyimide can be used as the said adhesive composition. Since the polyimide-based material mentioned here is superior in chemical resistance compared to the acrylic-based material, it imparts some chemical properties (chemical resistance when using a polyimide-based material) to the pressure-sensitive adhesive composition. In this case, it is effective to use a primer when the thin plate portion 2 or the support portion 3 is made of a hard-to-bond material such as quartz. In addition, the pressure-sensitive adhesive composition capable of reducing the adhesive strength by light irradiation is not changed to the basic resin, and examples thereof include an epoxy resin, an acrylic resin, and a urethane resin. The causes of the difference in the phenomenon of bonding and peeling due to light irradiation include, for example, the difference in elasticity increase due to UV irradiation, ease of increase in Tg, presence / absence of tackifying resin, and the like. For example, when the above-mentioned (meth) acrylic polymer is used alone, if the weight average molecular weight of the (meth) acrylic polymer is 100,000 or more, the cohesive force of the adhesive resin layer mainly comprising this is large. The so-called adhesive residue is reduced, and the adhesive strength is likely to be reduced by light irradiation.

  So-called photopolymerization that causes polymerization by light in any material (adhesive composition that can exhibit adhesiveness by light irradiation or adhesive composition that can reduce adhesiveness by light irradiation) Contains initiator. Examples of the polymerization reaction at this time include radical reactions (anion polymerization reaction and cation polymerization reaction) and ionic reactions.

  The adhesive strength of the above-mentioned pressure-sensitive adhesive composition (adhesive strength to the thin plate portion 2 and the support portion 3 as the adherend) is applied to the imprint mold produced from the imprint mold substrate 1 according to this embodiment. It is sufficient that the thin plate portion 2 and the support portion 3 are not separated during use, and the thin plate portion 2 is peeled off in the vertical direction from the cured imprint resin (photo-curable resin). As long as it can withstand a force of 2 times or more, preferably 5 times or more of the force required for the above. For example, when both the thin plate portion 2 and the support portion 3 are made of quartz, the maximum force required to peel the thin plate portion 2 from the cured imprint resin (photo-curing resin) in the vertical direction is 20N. If there is, the maximum value of the force required to peel off the pressure-sensitive adhesive composition adhered to the quartz in the same area as the contact area between the cured imprint resin (photo-curable resin) and the thin plate portion 2 is It is preferably 40N or more. However, in the actual imprint process, the thin plate portion 2 is curved when the imprint mold is peeled off, so that the joint portion 4 has a resultant force of a vertical force and a horizontal force due to the thin plate portion 2 being curved. Therefore, in order to prevent repeated use in imprint processing and peeling due to an unexpected external force other than imprint processing, the thin plate portion 2 is peeled off from the cured imprint resin (photo-curable resin) in the vertical direction. It is preferable to set it to 5 times or more (100 N or more) of the force required for.

  The thickness T4 of the joint portion 4 is preferably as thin as possible, but can be set as appropriate according to the material constituting the joint portion 4 and the thin plate portion 2. When the thickness T4 of the joint portion 4 is reduced, the internal stress that can be generated in the thin plate portion 2 when the thin plate portion 2 and the support portion 3 are joined is further reduced. For example, the thickness T4 of the bonding portion 4 can be about 3 to 100 nm. The internal stress that can occur in the thin plate portion 2 depends on, for example, the shrinkage rate and expansion rate of the pressure-sensitive adhesive composition (bonding portion 4) before and after bonding, and further the thermal expansion coefficient. For this reason, when the adhesive composition having a low shrinkage rate or expansion coefficient or having a thermal expansion coefficient close to that of the thin plate portion 2 is used as the joint portion 4, the thickness T4 of the joint portion 4 is set to the above-described numerical range (3 to 3). 100 nm). Further, when the imprint mold produced from the imprint mold substrate 1 according to the present embodiment is used for an application in which internal stress that can occur in the thin plate portion 2 can be ignored, the above numerical range is satisfied. Regardless, for example, an adhesive composition having a thickness T4 of submicron or micron unit can be used as the bonding portion 4. As will be described later, in order to configure the main surface 2A of the thin plate portion 2 as a flat surface, the bonding portion 4 adjusts the internal stress that can be generated in the thin plate portion 2 for the purpose of applying a tensile stress to the thin plate portion 2. It may be a possible layer.

  In the present embodiment, a light shielding part 5 made of metal chromium, its oxide, nitride or the like is provided between the support part 3 and the joint part 4. In the optical imprint process using the imprint mold 10 (see FIG. 7) manufactured from the imprint mold substrate 1 according to the present embodiment, the light irradiated to the imprint resin is light including ultraviolet rays. And it is the light of the wavelength which can make hardening of the adhesive composition which comprises the junction part 4, or can reduce adhesive force. Therefore, when the imprint resin is irradiated with light to be applied to the imprint resin during the imprint process using the imprint mold 10 (see FIG. 7), the adhesive constituting the joint 4. As the curing of the agent composition proceeds, the flatness of the main surface 2A of the thin plate portion 2 is affected, or the adhesive strength of the joint portion 4 is reduced, and the thin plate portion 2 and the support portion 3 are separated. . However, by having the light shielding part 5, the light traveling in the thickness direction of the thin plate part 2 from the opposing surface 2B side of the thin plate part 2 toward the main surface 2A side, that is, the light irradiated during the imprint process, Irradiation to the joint 4 can be prevented. In other words, in the present embodiment, the light traveling in the thickness direction of the thin plate portion 2 from the facing surface 2B side of the thin plate portion 2 toward the main surface 2A side (light irradiated during imprint processing) The light shielding portion 5 is provided at a position where the light is not irradiated to the light shielding portion 4.

  The light-shielding portion 5 may be a layer that does not irradiate the joint 4 with light, and is preferably a layer having an optical density (OD) of 2 or more, and particularly preferably a layer having an optical density of 3 or more. If the optical density of the light shielding part 5 is less than 2, energy may be transmitted to the joint part 4. The thickness T5 of the light shielding part 5 is not particularly limited as long as the thickness T5 can exhibit a desired light shielding performance (optical density). For example, when metal chromium is used as a material constituting the light shielding part 5 The thickness of the light shielding part 5 for realizing the optical density 2 to 3 can be set to about 70 to 100 nm.

  The position where the light-shielding part 5 is provided on the imprint mold substrate 1 is not only between the support part 3 and the joint part 4, but also shields light irradiated during imprint processing, and the light is joined to the joint part 4. There is no particular limitation as long as the position is such that it is not irradiated. For example, the light shielding portion 5 may be provided between the main surface 3A of the support portion 3 and the opposing surface 3B (see FIG. 4A), or provided on the opposing surface 3B of the support portion 3. It may be provided (see FIG. 4B) or may be provided on the inner wall 3C constituting the hollow portion 30 of the support portion 3 (see FIG. 4C).

  In addition, the peeling layer 8 may be further provided between the support part 3 and the light-shielding part 5 (refer FIG. 5). When the thin plate portion 2 and the support portion 3 are separated, if the joint portion 4 remains on the support portion 3 side, the joint portion 4 needs to be removed when the support portion 3 is reused. As shown, by having the release layer 8 between the support part 3 and the light-shielding part 5, the joining part 4 tends to remain on the thin plate part 2 side, and the reuse of the support part 3 can be made easier. it can.

  The imprint mold substrate 1 having the above-described configuration has a configuration in which the thin plate portion 2 and the support portion 3 are joined via the joint portion 4, thereby closing the hollow portion 30 of the support portion 3 and the opening end 31 thereof. The thin plate portion 2 (opposing surface 2B) forms a bottomed substantially cylindrical recess 7. And since the hollow part 30 of the support part 3 can be formed with high precision by an easy processing technique, and the opposing surface 2B of the thin plate part 2 can be configured as a surface having high flatness, The imprint mold substrate 1 has a highly accurate recess 7. Moreover, by having the light shielding part 5 at a position where the light that travels in the thickness direction of the thin plate part 2 from the facing surface 2B side of the thin plate part 2 toward the main surface 2A side is not irradiated to the joint part 4, It is possible to prevent light from being applied to the joint portion 4 during imprint processing using the imprint mold produced from the imprint mold substrate 1, and when the imprint mold is discarded, the joint portion 4 is prevented. Is composed of a pressure-sensitive adhesive composition capable of reducing the adhesive strength by light irradiation, the thin plate portion 2 and the support portion 3 can be easily attached only by irradiating the joint portion 4 with light from the thin plate portion 2 side. They can be separated and at least the support 3 can be reused.

[Method for producing imprint mold substrate]
The imprint mold substrate 1 having the above-described configuration can be manufactured as follows. FIG. 6 is a process flow diagram schematically showing the manufacturing process of the imprint mold substrate 1 according to this embodiment in a cross-sectional view.

  As shown in FIG. 6A, first, the thin plate portion 2 and the support portion 3 are prepared, the light shielding portion 5 is formed on the main surface 3A of the support portion 3, and the joint portion 4 is formed on the light shielding portion 5. To do. In addition, in the part which contact | abuts the junction part 4 in the opposing surface 2B of the thin-plate part 2, surface treatment (roughening process, contact | adherence layer formation process, etc.) is performed as needed. Further, a hard mask layer 6 (see FIG. 3B) may be formed on the main surface 2A of the thin plate portion 2 in advance.

  The support part 3 is obtained by preparing a base material having a predetermined shape and forming the hollow part 30 at substantially the center of the base material. The formation method of the hollow part 30 is not specifically limited, For example, the method of processing mechanically using a cutting tool etc. may be sufficient, the resist pattern etc. which have the opening part corresponding to the hollow part 30, etc. It may be a method of forming and etching.

  Examples of the method of providing the light shielding part 5 on the main surface 3A of the support part 3 include a sputtering method using a material constituting the light shielding part 5. Moreover, as a method of providing the junction part 4 on the light-shielding part 5, arbitrary coating methods, such as the spin coat method, the inkjet method, the dispenser method, the vapor deposition method which volatilizes and applies the said adhesive resin material, are mentioned, for example. . In the case where the release layer 8 (see FIG. 5) is provided between the support portion 3 and the light shielding portion 5, the light shielding portion is formed on the release layer 8 after the release layer 8 is formed on the main surface 3A of the support portion 3. 5 may be provided.

  Next, as shown in FIG. 6B, the opposing surface 2B of the thin plate portion 2 and the main surface of the supporting portion 3 so that the opening end 31 of the supporting portion 3 is closed by the thin plate portion 2 (opposing surface 2B). 3A is joined via the joint 4. Thereby, the imprint mold substrate 1 according to the present embodiment can be manufactured.

  As a method for joining the thin plate portion 2 and the support portion 3, for example, when the joint portion 4 is made of a photocurable pressure-sensitive adhesive composition, the thin plate portion 2 and the main surface 3 </ b> A of the support portion 3 are provided. For example, a method of bonding the bonding portion 4 and irradiating light from the thin plate portion 2 side may be used.

[Imprint mold]
Next, an imprint mold that can be produced from the above-described imprint mold substrate 1 according to the present embodiment will be described. FIG. 7 is a cut end view showing the imprint mold 10 in this embodiment, and FIG. 8 is a plan view showing the imprint mold 10.

  As shown in FIG. 7, the imprint mold 10 in the present embodiment has a desired fine uneven pattern 11 formed on the main surface 2 </ b> A of the thin plate portion 2 of the imprint mold substrate 1 according to the present embodiment. . The shape, dimensions, aspect ratio, and the like of the fine concavo-convex pattern 11 can be appropriately set according to the application of the imprint mold 10.

  As shown in FIG. 8, in the plan view of the imprint mold 10, the region PA where the fine uneven pattern 11 is formed is included in the region HA defined by the outer shape of the hollow portion 30 of the support portion 3. Therefore, at the time of the imprint process using the imprint mold 10, at least the region PA where the fine uneven pattern 11 is formed in the thin plate portion 2 of the imprint mold 10 can be curved. It can be easily peeled off from the imprint resin.

  The imprint mold 10 has a configuration in which the thin plate portion 2 and the support portion 3 are joined via the joint portion 4 and includes the light shielding portion 5 that can shield light from the joint portion 4. Since predetermined light is not irradiated to the joining portion 4 during the optical imprint processing, the thin plate portion 2 and the support portion 3 can be used for the optical imprint processing without being separated.

[Imprint Mold Manufacturing Method]
The imprint mold 10 can be manufactured, for example, as follows. FIG. 9 is a process flow diagram showing the respective steps of the imprint mold manufacturing method according to the present embodiment in cross-sectional views.

  In the method of manufacturing the imprint mold 10 in the present embodiment, first, an imprint mold substrate 1 in which a hard mask layer 6 such as a metal chromium film is provided on the main surface 2A of the thin plate portion 2 is prepared, and fine irregularities are prepared. A resist pattern 50 corresponding to the pattern 11 is formed on the region PA where the fine unevenness pattern 11 of the main surface 2A is to be formed (see FIG. 9A).

  The thickness of the hard mask layer 6 is appropriately determined in consideration of the etching selection ratio according to the material constituting the thin plate portion 2 of the imprint mold substrate 1, the aspect ratio of the fine uneven pattern 11 in the imprint mold 10, and the like. Can be set.

  The resist material constituting the resist pattern 50 is not particularly limited, and a conventionally known energy ray sensitive resist material (for example, an electron beam sensitive resist material, an ultraviolet sensitive resist material, etc.) or the like may be used. it can.

  The method for forming the resist pattern 50 is not particularly limited. For example, the resist pattern 50 can be formed by an electron beam lithography method, a photolithography method, or the like.

  Subsequently, the hard mask layer 6 is etched by dry etching using the resist pattern 50 as a mask to form a hard mask pattern 61 (see FIG. 9B). Then, using the hard mask pattern 61 as a mask, the main surface 2A of the thin plate portion 2 of the imprint mold substrate 1 is etched to form the fine uneven pattern 11.

  Finally, the hard mask pattern 61 is removed (see FIG. 9C). Thereby, the fine uneven | corrugated pattern 11 is formed in 2 A of main surfaces of the thin-plate part 2, and the imprint mold 10 which has the highly accurate recessed part 7 can be manufactured.

  In addition, when using the photolithographic method when forming the resist pattern 50, it is necessary to prevent exposure light from being irradiated to the junction part 4 of the base material 1 for imprint molds when it sees from the exposure light source side. For example, a photomask used when the resist pattern 50 is formed by a photolithography method may be used that has a light shielding portion capable of shielding exposure light to the joint portion 4.

  Further, when the resist pattern 50 is formed by an electron beam lithography method or a photolithography method, it is more preferable that the thin plate portion 2 has no deflection when viewed from the exposure light source side. Therefore, it is preferable that the thin plate portion 2 has a thickness corresponding to the size or is attached to the support portion 3 so as to have a tension.

[Imprint method]
Next, an imprint method using the imprint mold 10 will be described. FIG. 10 is a process flow diagram showing the respective steps of the imprint method according to the present embodiment in cross-sectional views.

  In the present embodiment, first, the imprint mold 10 is prepared, and an imprint resin (ultraviolet curable resin) 70 is dropped onto the transfer substrate 9 in a discrete manner using an ink jet type resin coating apparatus ( (See FIG. 10A). In the present embodiment, the transfer substrate 9 includes a convex structure portion 92 that protrudes from one surface 91A of the base material 91 and a concave portion 93 that is positioned on the opposing surface 91B of the base material 91, and has a convex structure. The upper surface 92A of the portion 92 will be described as an example of a surface on which a pattern is formed. However, the present invention is not limited to such a mode. Generally, any substrate that can form a pattern can be used. It can be used as a transfer substrate 9.

  The dropping position of the imprint resin 70 on the transfer substrate 9 (the upper surface 92A of the convex structure portion 92) determines the fluidity of the imprint resin 70 in accordance with the shape and size of the fine uneven pattern 11 of the imprint mold 10. It can be set as appropriate in consideration.

  Next, the fine concavo-convex pattern 11 of the imprint mold 10 and the imprint resin 70 on the transferred substrate 9 are brought into contact with each other to spread the imprint resin 70 on the transferred substrate 9 (see FIG. 10B).

  Then, after the imprint resin 70 is sufficiently filled in the fine concavo-convex pattern 11 of the imprint mold 10, the imprint resin 70 is passed through the thin plate portion 2 from the facing surface 2 </ b> B side of the thin plate portion 2 of the imprint mold 10. The imprint resin 70 is cured by irradiation with light (ultraviolet) UV (see FIG. 10C). At this time, in the imprint mold 10, since the light shielding part 5 is provided at a position where the light (ultraviolet) UV is not irradiated to the joint 4, the light (ultraviolet) UV is irradiated to the joint 4. It will not be done. Therefore, a pattern caused by an adverse effect (for example, the main surface 2A of the thin plate portion 2 (the surface on which the fine concavo-convex pattern 11 is formed) is affected by the irradiation of the bonding portion 4 with light (ultraviolet rays) UV. The imprint process can be performed without causing a decrease in accuracy, occurrence of pattern defects, separation of the thin plate portion 2 and the support portion 3, and the like.

  Finally, the cured imprint resin 70 and the imprint mold 10 are peeled off (see FIG. 10D). At this time, since the imprint mold 10 has the high-precision concave portion 7 constituted by the facing surface 2B of the thin plate portion 2 and the hollow portion 30 of the support portion 3, the thin plate portion 2 is effectively curved at the time of peeling. (See FIG. 10D). Therefore, according to the present embodiment, there is an effect that the imprint mold 10 can be easily peeled off from the cured imprint resin 70. Thus, the fine uneven | corrugated pattern 71 which consists of the imprint resin 70 can be formed on the to-be-transferred substrate 9 by the imprint process using the said imprint mold 10 (refer FIG.10 (E)).

[Reproduction method of imprint mold]
Next, a method for regenerating the imprint mold 10 will be described. FIG. 11 is a process flow diagram showing the respective steps of the imprint mold regeneration method according to the present embodiment in a cross-sectional view. In addition, in this embodiment, the junction part 4 in the imprint mold 10 demonstrates and mentions as an example the aspect comprised by the adhesive composition which can reduce adhesive force by irradiation of light.

  In the present embodiment, first, light L having a predetermined wavelength is irradiated onto the joint 4 of the used imprint mold 10 (see FIG. 11A). By irradiating the joint portion 4 with the light L having the above wavelength, the adhesive strength of the adhesive composition constituting the joint portion 4 is reduced. At this time, if a release layer 8 (see FIGS. 5A and 5B) is provided between the joint portion 4 and the support portion 3, the joint portion 4 is left on the thin plate portion 2 side. The thin plate portion 2 and the support portion 3 can be easily separated. In particular, since the peeling layer 8 is provided between the joint portion 4 and the light shielding portion 5 (see FIG. 5B), the light shielding portion 5 is supported while the joint portion 4 remains on the thin plate portion 2 side. The thin plate portion 2 and the support portion 3 can be separated by remaining on the portion 3 side. Thereby, the support part 3 can be reused without newly providing the light shielding part 5 in the support part 3 after separation.

  Next, if necessary, the joint 4 remaining on the main surface 3A of the support portion 3 is removed, the main surface 3A is cleaned, the light-shielding portion 5 is re-formed, and a new thin plate portion 2 ′ is separately prepared. The opposing surface 2B ′ of the thin plate portion 2 ′ and the main surface 3A of the support portion 3 are joined via the joint portion 4 ′ so that the opening end 31 of the support portion 3 is closed by the thin plate portion 2 ′. To do. (See FIG. 11B). As a result, the used imprint mold 10 can be regenerated as the imprint mold substrate 1.

  In addition, the light shielding part 5 and the joining part 4 are formed in this order on the surface 3B of the supporting part 3 of the used imprint mold 10 facing the main surface 3A to which the thin plate part 2 was joined, and a new thin plate is separately prepared. The part 2 ′ may be joined and regenerated as the imprint mold substrate 1.

  A hard mask layer 6 (see FIG. 3B) made of a metal chromium film or the like may be formed on the main surface 2A 'of the thin plate portion 2'. As a method for joining the thin plate portion 2 and the support portion 3 via the joint portion 4, the same method as that described in the method for manufacturing the imprint mold substrate 1 (see FIG. 6B) is employed. can do.

  And the imprint mold 10 can be reproduced | regenerated by manufacturing the imprint mold 10 by the method shown in FIG. 9 using the reproduced | regenerated imprint mold board | substrate 1. FIG.

  As described above, according to the imprint mold regeneration method in the present embodiment, at least the support portion 3 can be reused, and the used imprint mold 10 can be regenerated.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  In the said embodiment, the light-shielding part 5 is provided in the position where the light which advances to a thickness direction toward the main surface 2A side from the opposing surface 2B side of the thin-plate part 2 is not irradiated with respect to the junction part 4. FIG. However, the present invention is not limited to such an embodiment. For example, the light-shielding part 5 may be provided at a position where the light that travels in the thickness direction from the main surface 2A side to the opposing surface 2B side of the thin plate part 2 is not irradiated to the joint part 4. Specifically, as shown in FIGS. 12A and 12B, the light shielding portion 5 may be formed on the main surface 2A or the opposing surface 2B of the thin plate portion 2, or FIG. As shown in FIG. 5, the light shielding portion 5 may be inherent in the thin plate portion 2. When the transferred substrate 9 (see FIG. 10) patterned by the imprint mold 10 manufactured from the imprint mold substrate 1 is made of a transparent material such as a quartz glass substrate, the transferred substrate is used during the imprint process. Light may be irradiated from the side toward the imprint mold 10. In such a case, as shown in FIGS. 12A and 12B, light traveling in the thickness direction from the main surface 2 </ b> A side of the thin plate portion 2 toward the opposing surface 2 </ b> B side is applied to the joint portion 4. By providing the light shielding portion 5 at a position where no irradiation is performed, it is possible to prevent light from being applied to the bonding portion 4 during the imprint process.

  In the above embodiment, the light shielding portion 5 and the joint portion 4 are formed in this order on the main surface 3A of the support portion 3, and the opening end 31 of the support portion 3 is closed by the facing surface 2B of the thin plate portion 2. Although the imprint mold substrate 1 is manufactured by joining the thin plate portion 2 and the support portion 3, the present invention is not limited to such an embodiment. For example, the light shielding part 5 is formed on the main surface 3A of the support part 3 and the surface in the vicinity of the outer edge part of the facing surface 2B of the thin plate part 2 (the overlapping part when the thin plate part 2 and the support part 3 are overlapped). The imprint mold substrate 1 may be manufactured by forming the joint portion 4 in the above structure and joining the thin plate portion 2 and the support portion 3 together. In addition, joint portions 4 are formed on the surface in the vicinity of the outer edge portion of the facing surface 2B of the thin plate portion 2 (the overlapping portion when the thin plate portion 2 and the support portion 3 are overlapped) and the main surface 3A of the support portion 3, respectively. Then, the imprint mold substrate 1 may be manufactured by joining the thin plate portion 2 and the support portion 3.

  In the said embodiment, the fine uneven | corrugated pattern 11 is formed on 2 A of main surfaces of the thin plate part 2 of the board | substrate 1 for imprint molds which joins the thin plate part 2 and the support part 3 via the junction part 4. FIG. Although the imprint mold 10 is manufactured by this, this invention is not limited to such an aspect. For example, the thin plate portion 2 in which the fine uneven pattern 11 is formed on the main surface 2A and the support portion 3 are prepared, and the thin plate portion 2 and the support portion 3 are connected to the opening end 31 of the support portion 3 with the thin plate portion 2. The imprint mold 10 may be manufactured by being bonded via the bonding portion 4 so as to be covered with the opposite surface 2B.

  The present invention is useful in the field of microfabrication technology in which a nanoimprint process is performed using an imprint mold in order to form a fine uneven pattern on a semiconductor substrate or the like.

DESCRIPTION OF SYMBOLS 1 ... Imprint mold substrate 2, 2 '... Thin plate part 2A ... Main surface 2B ... Opposing surface 3 ... Supporting part 3A ... Main surface 31 ... Opening end 4, 4' ... Joint part 5 ... Photocatalyst layer 6 ... Light shielding layer 8 ... Recess 9 ... Peeling layer 10 ... Imprint mold 11 ... Fine uneven pattern

Claims (14)

A thin plate portion having a main surface on which a fine uneven pattern can be formed;
A hollow cylindrical support portion that supports a facing surface facing the main surface of the thin plate portion;
A joining portion that is interposed between the thin plate portion and the support portion, and joins the thin plate portion and the support portion so as to close an opening end of the hollow cylindrical support portion with the facing surface;
Light that travels in the thickness direction of the thin plate portion from the opposing surface side of the thin plate portion toward the main surface side or from the main surface side of the thin plate portion toward the opposing surface side is irradiated to the joint portion. A light shielding part for shielding the light,
For the imprint mold, the joint portion is composed of an adhesive composition that develops adhesiveness when irradiated with light, or an adhesive composition that decreases in adhesive strength when irradiated with light. substrate.   The imprint mold substrate according to claim 1, wherein the light shielding portion is located closer to the support portion or the thin plate portion than the joint portion.   The imprint mold substrate according to claim 1, wherein the light shielding portion is provided between the support portion and the joint portion.   The imprint mold substrate according to claim 1, wherein the light-shielding portion is embedded in the support portion.   The imprint mold substrate according to claim 1, wherein the light shielding portion is provided on an inner peripheral wall of the hollow cylindrical support portion.   The imprint mold substrate according to claim 1, wherein an optical density of the light shielding portion is 2 or more.   The imprint mold substrate according to claim 1, wherein the thin plate portion is made of a material that transmits light.   The imprint mold substrate according to claim 1, wherein the support portion is made of a material that transmits light.   An imprint mold, wherein a fine concavo-convex pattern is formed on the main surface of the thin plate portion of the imprint mold substrate according to claim 1. A thin plate portion having a main surface, a hollow cylindrical support portion that supports a facing surface facing the main surface of the thin plate portion, and a joint portion that is interposed between the thin plate portion and the support portion and joins them together A method for manufacturing an imprint mold substrate comprising:
Proceeding in the thickness direction of the thin plate portion from the opposing surface side of the thin plate portion of the imprint mold substrate toward the main surface side or from the main surface side of the thin plate portion toward the opposing surface side. A step of providing a light-shielding portion on the support portion or the thin plate portion so that light is not irradiated to the joint portion;
An adhesive is applied to the thin plate portion and / or the overlapping portion of the support portion when the thin plate portion and the support portion are overlapped so that one end of the opening of the support portion is closed by the opposing surface of the thin plate portion. Forming a layer;
A step of superposing the thin plate portion and the support portion with the adhesive layer interposed therebetween, and joining the thin plate portion and the support portion;
The said adhesive layer is comprised by the adhesive composition which expresses adhesiveness by irradiation of light, or the adhesive composition which adhesive force falls by irradiation of light, The manufacture of the board | substrate for imprint molds characterized by the above-mentioned Method. The pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive composition that exhibits adhesiveness by light irradiation,
The thin plate portion and the support portion are joined by irradiating light to the pressure-sensitive adhesive layer from the main surface side or the opposed surface side of the thin plate portion in the joining step. The manufacturing method of the board | substrate for imprint molds of description. Contacting the imprint mold according to claim 9 with the imprint resin supplied on the main surface of the substrate to be processed, and spreading the imprint resin on the main surface of the substrate to be processed;
Curing the imprint resin developed on the main surface of the substrate to be processed;
And a step of peeling off the imprint mold from the cured imprint resin. The imprint resin is a photocurable resin,
In the step of curing the imprint resin, from the facing surface side toward the main surface side or from the main surface side toward the facing surface side along the thickness direction of the thin plate portion of the imprint mold. The imprint method according to claim 12, wherein light is irradiated. A method for regenerating the imprint mold according to claim 9, comprising:
Separating the thin plate portion having the fine concavo-convex pattern from the support portion;
When the thin plate portion and the support portion are overlapped so that the opening end of the support portion from which the thin plate portion is separated is closed with a new thin plate portion, the thin plate portion and / or the support portion overlap. Forming a pressure-sensitive adhesive layer composed of a pressure-sensitive adhesive composition that exhibits adhesiveness by irradiating light on the mating portion, or a pressure-sensitive adhesive composition that decreases in adhesive strength by irradiating light; and
A method for regenerating an imprint mold, comprising the step of bonding the thin plate portion and the support portion with the pressure-sensitive adhesive layer.

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