JP2009087959A - Imprint transfer die, imprint transfer method, imprinter, manufacturing method of imprint transfer die, and imprint transfer matter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imprint transfer die capable of preventing a harmful influence to imprint results in advance by directly excluding bubbles mixed between a transfer die and a transfer object during actual imprinting. <P>SOLUTION: In the imprint transfer die for transferring the shape of the body surface of the transfer die 1 to the transfer object, recessed and projecting parts 1a, 1b formed on the body surface of the transfer die 1 are made thicker than the depth of the recessed and projecting parts of a transfer material ultimately left on the surface of the transfer object. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present application relates to a technical field to which, for example, nanoimprint lithography is applied, and in particular, an imprint transfer mold and an imprint transfer method for transferring the shape of a transfer mold main body surface to a transfer material in which a transfer material is thinly formed on a substrate And an imprint apparatus, a method for producing an imprint transfer mold, and an imprint transfer product produced by the imprint transfer mold.

  Conventionally, as a technique for preventing air bubbles from being mixed into the transfer material during imprinting in which the shape of the transfer mold surface is transferred to the transfer material on which a transfer material is formed on a substrate, for example, Patent Documents 1 and 2 There is an invention disclosed in.

  The invention disclosed in Patent Document 1 uses a roll-shaped mold provided with a shape obtained by reversing the fine irregularities of an optical article, from a cured product of a radiation curable resin liquid on a translucent base film. In the method for producing an optical article by transferring the fine uneven shape, the radiation curable resin liquid is preliminarily stored in a vacuum container having a degree of vacuum of 400 Pa or less, or in a temperature range of 30 ° C. to 100 ° C. The air bubbles mixed in the radiation curable resin liquid are removed by disposing them in any one of the heating containers held in the container.

Further, in the invention disclosed in Patent Document 2, when the UV curable resin liquid is spin-coated between the template and the substrate surface in the imprint lithography process, the template and the substrate Air bubbles are not formed in the gap between the two.
JP 2004-90539 A Special table 2003-517727

  However, as in the invention disclosed in Patent Document 1, the method of removing bubbles previously mixed in the radiation curable resin liquid with a decompression container or a heating container is performed in advance, not at the time of actual imprinting. Since it is a process, bubbles may be mixed during actual imprinting.

  In such a prior defoaming process, it is impossible to cope with bubbles mixed between the transfer mold and the transferred material when imprinting is actually performed, resulting in imprint results containing bubbles. There is.

  Further, in the invention disclosed in Patent Document 2, imprinting is required in a decompression container in order to avoid mixing bubbles during imprinting. As described above, in the method of performing imprinting in the decompression container, the imprint apparatus must be disposed in the decompression container.

  In particular, in an imprint apparatus using an ultraviolet curable resin, the transfer mold and the transferred material are overlapped at room temperature and normal pressure, and the pressure difference between the atmospheric pressure due to a slight vacuum environment is applied to the pressure for pressing the transfer mold against the transferred material. Since it has been frequently used, there are problems such as difficulty in disposing in a vacuum environment or a reduced pressure environment for the purpose of removing bubbles between the transfer mold and the ultraviolet curable resin in advance.

  By the way, the resin softened at the time of imprinting may generate bubbles when heated, or else bubbles may be mixed when the transfer mold is pressed against the resin. However, this was an important issue for normal imprinting.

  By the way, if the resin is cured with air bubbles mixed in, the imprint transfer product will be uneven, and the quality of the transfer product will deteriorate and cannot be used, resulting in poor yield and production efficiency. There is a problem that it is significantly reduced.

  Therefore, as described above, the bubbles generated by sufficiently heating the resin as in the inventions disclosed in Patent Documents 1 and 2 are removed, or the entire transfer product is placed in a vacuum or a reduced-pressure atmosphere to remove bubbles. When imprinting is performed in an environment, there is a problem that facilities for the imprinting are necessary, which complicates the equipment and increases the equipment cost.

  This application was made in consideration of the above circumstances, and one example of the problem is to directly eliminate the air bubbles mixed between the transfer mold and the transferred material when actually imprinting, and to obtain the imprint result. It is an object of the present invention to provide an imprint transfer mold, an imprint transfer method, an imprint apparatus, a method for producing an imprint transfer mold, and an imprint transfer product that can prevent adverse effects.

  In order to solve the above-mentioned problems, an imprint transfer mold according to claim 1 pushes the transfer mold main body against a transfer product on which a transfer material having fluidity is formed when heated to at least room temperature on a substrate. In the imprint transfer mold for curing the transfer material, separating the transfer mold main body, and transferring the shape of the transfer mold main body surface to the transferred material, the uneven portion formed on the transfer mold main body surface Is made thicker than the unevenness depth of the transfer material to be finally left on the surface of the transfer product.

  An imprint transfer product according to a sixth aspect is characterized by being produced by the imprint transfer mold according to any one of the first to fifth aspects.

  The imprint transfer method according to claim 7 includes a pressing step of pressing a transfer mold body against a transfer material on which a transfer material having fluidity is formed when heated to at least room temperature on a substrate, and the transfer material In the imprint transfer method, comprising the curing step of curing the transfer mold body and the peeling step of peeling off the transfer mold body from the cured transfer material, the pressing process in which the shape of the surface of the transfer mold body is transferred to the transferred material Then, the thickness of the concavo-convex portion formed on the surface of the transfer mold main body is made thicker than the concavo-convex depth of the transfer material to be finally left on the surface of the transfer product, and is pressed against the transfer product.

  The imprint apparatus according to claim 8 presses a transfer mold against a transfer material in which a transfer material having fluidity is formed on a substrate when heated to at least room temperature or more, and cures the transfer material to transfer the transfer material. In the imprint apparatus in which the mold is peeled off and the shape of the transfer mold surface is transferred to the transfer product, the transfer mold has an uneven portion formed on the surface, and finally the thickness of the uneven portion is determined by the transfer product. It is characterized by being thicker than the uneven depth of the transfer material to be left on the surface.

  The imprint transfer mold manufacturing method according to claim 11 is a method of manufacturing an imprint transfer mold in which an imprint transfer mold is manufactured by removing the mask from a transfer mold substrate with a mask prepared in advance through an etching process. The method is characterized in that, in the etching step, the thickness of the concavo-convex portion formed on the surface of the transfer mold is formed to be thicker than the concavo-convex depth of the transfer material to be finally left on the surface of the transfer product during imprinting. .

  The imprint transfer mold manufacturing method according to claim 12 is an imprint transfer mold for manufacturing an imprint transfer mold through an electroforming process for electroforming a preform prepared in advance and a polishing process for polishing the original mold. In the mold manufacturing method, in the polishing step, the thickness of the concavo-convex portion formed on the surface of the transfer mold is formed to be thicker than the concavo-convex depth of the transfer material that is ultimately desired to remain on the surface of the transfer product during imprinting. Features.

  Hereinafter, embodiments of the present application will be described with reference to the drawings. In the following embodiments, semiconductor manufacturing apparatuses, magnetic recording apparatuses such as discrete track media and patterned media, MEMS (Micro Electro Mechanical Systems), NEMS (Nano Electro Mechanical Systems) microfabricated parts, next generation hard disks, It is an imprint transfer type applied to nanoimprint lithography in next-generation recording media such as next-generation optical discs.

(First embodiment)
FIG. 1 is a perspective view showing a first embodiment of an imprint transfer mold of the present application, and FIG. 2 is a cross-sectional view of FIG. In the drawings, the upper side is the back side, and the lower side is the front side.

  As shown in FIGS. 1 and 2, the transfer mold 1 as a transfer mold main body is formed in a disk shape as a whole. Further, the transfer mold 1 is formed with a concave portion 1a and a convex portion 1b, and transfers the concavo-convex shape on the surface of the transfer mold 1 to a transfer material to be described later. The recess 1 a is formed as a through hole in a straight line up to the back surface of the transfer mold 1. Furthermore, the convex part 1b is formed with the same width to the back. Accordingly, the concavo-convex portions 1a and 1b formed on the transfer mold 1 reach the back surface.

  Next, an imprint process using the transfer mold 1 will be described with reference to FIGS.

  First, as shown in FIG. 3A, a thin resin 7 having a thickness of 100 nm or less is uniformly formed on the transfer material 5 on the substrate 6 as a transfer material when heated to room temperature or higher. ing. In this case, the transfer material other than the resin 7 may be any material that has fluidity when heated to room temperature or higher, such as metal glass.

  Next, as shown in FIG. 3B, the transfer mold 1 shown in FIGS. 1 and 2 is pressed against a thin resin 7 having fluidity. In this pressing step, the uneven portions 1 a and 1 b formed on the surface of the transfer mold 1 are made thicker than the resin 7 and pressed against the transfer product 5. Thereafter, the thin resin 7 is cured by cooling or light irradiation.

  Then, as shown in FIG. 3C, the transfer mold 1 is peeled from the cured resin 7. Through such a process, the uneven shape on the surface of the transfer mold 1 can be copied onto the transfer product 5.

  Next, an example of a method for manufacturing the transfer mold 1 will be described with reference to FIGS.

  First, as shown in FIG. 4A, a masked substrate 10 in which a mask 12 that is a resin pattern is formed in advance on a mold substrate 11 is prepared. The mask 12 is produced by applying a resist resin by a well-known lithography technique and then exposing and developing the resist resin. Moreover, you may produce the mask 12 by irradiating a laser beam or an electron beam, for example.

  Next, as shown in FIG. 4B, the mold substrate 11 is dry-etched from above the mask 12.

  Further, as shown in FIG. 4C, dry etching is performed up to the back surface of the mold substrate 11. That is, in this etching step, dry etching is performed so that the thickness of the uneven portions 1a and 1b to be formed is thicker than the thickness of the transfer material before imprinting. In the present embodiment, the concavo-convex portions 1a and 1b reach the back surface.

  Then, as shown in FIG. 4D, by removing the mask 12, the transfer mold 1 shown in FIGS. 1 and 2 is completed.

  Further, another manufacturing method of the transfer mold 1 will be described with reference to FIGS.

  First, a prototype 15 having a pattern formed as shown in FIG. 5A is manufactured by the same method as in FIG.

  Next, as shown in FIG. 5B, a metal mold 16 is formed on the master 15 by electroforming. Here, when the metal mold 16 is formed by electroforming, the electroforming may be terminated before the entire pattern is covered.

  Further, as shown in FIG. 5C, the surface of the metal mold 16 after electroforming is polished to expose the pattern surface of the prototype 15. In this polishing step, polishing is performed so that the thickness of the concavo-convex portions 1a and 1b to be the transfer mold 1 is greater than the thickness of the transfer material before imprinting. In this manufacturing method, the concavo-convex portions 1a and 1b reach the back as in the manufacturing method shown in FIG.

  Thereafter, as shown in FIG. 5D, the transfer mold 1 shown in FIGS. 1 and 2 obtained by peeling the master 15 and polishing the surface of the metal mold 16 is completed.

  Next, the operation of this embodiment will be described.

  When actually imprinting, the softened resin 7 shown in FIG. 3 (A) generates bubbles when heated, or otherwise bubbles are mixed when the transfer mold 1 is pressed against the resin 7. However, in the transfer mold 1 of the present embodiment, since the uneven portions 1a and 1b reach the back surface, the air bubbles mixed between the transfer mold 1 and the transfer product 5 can be directly and easily discharged from the back surface. And the imprint result is not adversely affected.

  Therefore, a good imprint result can be obtained even with a weak pressing force such as a pressure difference from the atmospheric pressure during imprinting.

  Further, in the imprint process, conventionally, as shown in FIG. 6A, there is a difference in the balance between the volume of the concave portion 21 and the volume of the resin 7 to be filled depending on the pattern density of the concave and convex portions 21 and 22 of the transfer mold 20. There is a problem that the amount of the resin 7 that is generated and remains after the filling is locally changed, and a difference in thickness called a residue is generated at the bottom of the pattern of the uneven portions 21 and 22.

  Even in this case, in the transfer mold 1 of the present embodiment, since the uneven portions 1a and 1b reach the back as shown in FIG. 6B, the difference in pattern density between the uneven portions 1a and 1b is determined as the height of the pattern. It can be absorbed reliably in the direction and the residue can be prevented beforehand.

  In general, in imprint processes and presses, it was considered that the uneven pattern formed on the surface of the transferred material was used as it was, so the shape of such a transfer mold was the resin and transfer mold inside the pattern. The upper surface of the pattern may become convex or concave due to wettability and surface tension, or the height of the pattern changes depending on the pattern density, so it cannot be used. It was.

  However, when the pattern of the concavo-convex portions 1a and 1b according to the present embodiment is used as an etching mask, the transfer mold 1 according to the present embodiment can be used effectively because some unevenness on the pattern surface is irrelevant.

  Further, in the actual imprint process, the transfer mold 1 is superposed on the transfer product 5, and the transfer is performed by the weight of the transfer mold 1 or by reducing the pressure in the chamber and applying a pressure difference from the atmospheric pressure. If necessary, pressure may be applied to a pressing device having a shape that does not hinder the discharge of bubbles by pressure applying means such as hydraulic pressure or pneumatic pressure. By imprinting in this way, the bubble discharge hole which is the recess 1a on the back surface of the transfer mold 1 is not blocked.

  As described above, according to the present embodiment, since the uneven portions 1a and 1b of the transfer mold 1 reach the back surface of the transfer mold 1, air bubbles mixed between the transfer mold 1 and the transferred material 5 can be directly and easily obtained. It can be discharged, and the imprint result is not adversely affected.

(Second Embodiment)
FIG. 7 is a cross-sectional view showing a second embodiment of the imprint transfer mold of the present application.

  In the present embodiment, as shown in FIG. 7, a wall 33 is formed on the back side of the recess 31 of the transfer mold 30, and an exhaust hole 31 a is formed in the wall 33. The exhaust hole 31a has a diameter larger than bubbles, that is, air molecules.

  By the way, since it is important to discharge air bubbles between the transfer mold 30 and the transfer product, the recess 31 does not need to reach the back surface of the transfer mold 1 as in the first embodiment.

  If at least one exhaust hole 31a is formed in the recess 31 as in the present embodiment, bubbles mixed between the transfer mold 30 and the transferred product 5 during imprinting are directly and easily discharged from the exhaust hole 31a. be able to.

  As described above, according to the present embodiment, the rigidity of the transfer mold 30 can be remarkably improved by reducing the area extending to the back surface of the recess 31 of the transfer mold 30.

  In this embodiment, an example in which one exhaust hole 31 a is formed for one recess 31 is described. However, the present invention is not limited to this, and a plurality of exhaust holes 31 a are formed for one recess 31. May be. Further, since the manufacturing method and the imprint method are the same as those in the first embodiment, description thereof will be omitted. The same applies to each of the following embodiments.

(Third embodiment)
FIG. 8 is a sectional view showing a third embodiment of the imprint transfer mold of the present application.

  As shown in FIG. 8, in this embodiment, in addition to the configuration of the second embodiment shown in FIG. 7, a deaeration device 35 is attached to the back side of the recess 31 of the transfer mold 30.

  Therefore, in the present embodiment, bubbles mixed between the transfer mold 30 and the transfer product 5 during imprinting can be forcibly discharged from the exhaust hole 31a.

  As described above, according to the present embodiment, by attaching the deaeration device 35 to the back side of the recess 31 of the transfer mold 30, air bubbles mixed between the transfer mold 30 and the transfer product 5 at the time of imprinting are exhausted. It is possible to reliably discharge from 31a.

(Fourth embodiment)
FIG. 9 is a sectional view showing a fourth embodiment of the imprint transfer mold of the present application.

  In this embodiment, as shown in FIG. 9, a transfer mold holding member 40 having a mesh structure is attached to the back side of the transfer mold 30 with an adhesive. Note that the mesh structure of the transfer-type holding member 40 is formed to be fine enough to discharge bubbles.

  Therefore, in the present embodiment, bubbles mixed between the transfer mold 1 and the transfer product 5 during imprinting can be reliably discharged from the recess 1a, which is an exhaust hole, through the mesh of the transfer mold holding member 40.

  Thus, according to this embodiment, the transfer mold holding member 40 has a function as a backing of the transfer mold 30 by attaching the transfer mold holding member 40 having a mesh structure to the back side of the transfer mold 30. Accordingly, it is possible to prevent the uneven pattern from falling off.

  In addition, when the pattern of the concavo-convex portion that has been removed to the back surface of the transfer mold 30 extends over the entire circumferential direction, the inside of the pattern will fall off.

(Fifth embodiment)
FIG. 10 is a cross-sectional view showing a fifth embodiment of the imprint transfer mold of the present application, and FIG. 11 is a cross-sectional view showing an imprint process in the fifth embodiment.

  In the present application, the concave and convex portions 1 a and 1 b of the transfer mold 1 do not have to reach the back surface of the transfer mold 1 as in the first and fourth embodiments. Further, in the present application, the exhaust hole 31a may not be formed on the back side of the recess 31 as in the second and third embodiments.

  That is, in this embodiment, as shown in FIGS. 10 and 11, the thickness of the concavo-convex portions 51 and 52 is sufficient to accommodate bubbles generated when the resin 7 is heated or when the transfer mold 50 is pressed. Is set to

  Therefore, in the present embodiment, the thickness of the concave and convex portions 51 and 52 is set to a thickness that can accommodate bubbles generated when the resin 7 is heated or when the transfer mold 50 is pressed. Since the air bubbles mixed between the transfer mold 50 and the transfer product 5 are reliably accommodated in the recess 51 without discharging the air bubbles from the back surface of the transfer mold 50 as in the fourth embodiment, the imprint result is adversely affected. No longer give.

  As described above, according to the present embodiment, even if the thickness of the concavo-convex portions 51 and 52 is set to a thickness sufficient to accommodate the generated bubbles, the same effect as in the first embodiment can be obtained.

  Further, according to the present embodiment, since the back surface of the recess 51 of the transfer mold 50 is not removed, the rigidity of the transfer mold 50 can be remarkably improved.

(Example)
By the way, the present application is not intended to completely fill the uneven shape formed on the surface of the transfer mold 1 with the resin 7, but has an application in which the transfer material is used as an etching mask. Deep patterns are needed.

  In general, the area of the concavo-convex shape of the transfer mold is small relative to the entire surface of the transfer mold, and when imprinting by pressing the transfer mold in a short time against a transfer material having fluidity, the transfer material is microscopically It is not necessary to take into consideration that the toner is reduced by being pushed out from the end of the transfer mold.

  Next, the principle of setting the thickness of the uneven portions 1a and 1b formed on the surface of the transfer mold 1 with respect to the transfer material formed on the surface of the transfer product 5 will be described.

When bubbles in the pattern of the transfer mold 1 are not discharged from the back surface, the pressure by which the transfer mold 1 presses the transfer material by its own weight or pressurizing means is M [Pa], and the pressure of the imprint atmosphere is P [Pa] (atmospheric pressure 1 X10 ⁵ [Pa] or a reduced pressure environment) The air height K−k [nm] when the transferred material enters k [nm] in the pattern with the depth K [nm] compressed by the transfer mold 1. ] Is represented by Kk = {P / (P + M)} * K [nm] according to Boyle's law, where the product of pressure and volume is constant under isothermal conditions.

  When rewritten, in order to obtain a transferred product shape having a height of k [nm], the thickness of the concavo-convex portions 1a and 1b of the transfer mold 1 should be K = {(P + M) / M} * k [nm]. The air can be transferred without any problem even if the air is enclosed in the concave and convex portions 1 a and 1 b of the transfer mold 1.

For example, when using the transfer mold 1 to which a pressure of about 40 Pa is applied under its own weight, a concavo-convex shape height of a transferred material of 100 nm is required.
a) When imprinting is performed only by the weight of the transfer mold under atmospheric pressure, the thickness of the uneven portions 1a and 1b of the transfer mold 1 may be 0.25 mm or more.

  b) When a pressure of about 1 kg is placed on the transfer mold 1 under atmospheric pressure and the pressing pressure is set to 1 kPa, the thickness of the uneven portions 1a and 1b of the transfer mold 1 may be 9.9 μm or more. .

  c) In the case of imprinting with only the transfer mold's own weight in an environment reduced to 1 kPa, the thickness of the uneven shape of the transfer mold 1 may be 2.6 μm or more.

  d) In an environment where the pressure is reduced to 1 kPa, and when a pressing pressure is set to 1 kPa by placing a weight of about 1 kg on the transfer mold 1, the thickness of the uneven portions 1a, 1b of the transfer mold 1 is 200 nm or more. I just need it.

  e) Even when imprinting is performed only by the weight of the transfer mold 1 under atmospheric pressure, if the uneven portions 1a and 1b of the transfer mold 1 reach the back surface, the transfer mold has a thickness greater than that of the transfer material. Any thickness is acceptable.

  In this way, in the present application, the thickness of the concavo-convex portions 1 a and 1 b formed on the surface of the transfer mold 1 is not necessarily discharged from the back surface of the transfer mold 1, and it is finally desired to leave the thickness on the surface of the transfer product 5. What is necessary is just to make it thicker than the uneven | corrugated depth of a transfer material. Therefore, in the present application, as in the fifth embodiment, the thickness of the uneven portions 51 and 52 is sufficient to accommodate bubbles generated when the resin 7 is heated or when the transfer mold 1 is pressed. Good.

It is a perspective view which shows 1st Embodiment of the transfer mold for imprint of this application. FIG. 2 is a cross-sectional view of FIG. (A)-(C) are sectional drawings which show the imprint process by the transfer mold of 1st Embodiment. (A)-(D) are sectional drawings which show an example of the manufacturing method of the transfer type | mold in 1st Embodiment. (A)-(D) are sectional drawings which show the other manufacturing method of the transfer type | mold in 1st Embodiment. (A) is sectional drawing which shows the imprint process of a prior art example, (B) is sectional drawing which shows the imprint process of this application. It is sectional drawing which shows 2nd Embodiment of the transfer mold for imprint of this application. It is sectional drawing which shows 3rd Embodiment of the transfer mold for imprint of this application. It is sectional drawing which shows 4th Embodiment of the transfer mold for imprint of this application. It is sectional drawing which shows 5th Embodiment of the transfer mold for imprint of this application. It is sectional drawing which shows the imprint process in 5th Embodiment.

Explanation of symbols

1: Transfer mold 1a: Concavity 1b: Convex 5: Transfer 6: Substrate 7: Resin 10: Substrate with mask 11: Mold substrate 12: Mask 15: Prototype 16: Metal mold 30: Transfer mold 31: Concavity 31a: Exhaust Hole 33: Wall 35: Deaeration device 40: Transfer mold holding member 50: Transfer mold 51: Concave part 52: Convex part

Claims (12)

The transfer mold body is pressed against a transfer material on which a transfer material having fluidity is formed when heated to at least room temperature on the substrate, the transfer material is cured to peel off the transfer mold body, and the transfer material In the imprint transfer mold for transferring the shape of the transfer mold main body surface to
A transfer mold for imprint, wherein the thickness of the concavo-convex portion formed on the surface of the transfer mold main body is made thicker than the concavo-convex depth of the transfer material to be finally left on the surface of the transfer product. The imprint transfer mold according to claim 1,
A transfer mold for imprinting, wherein the thickness of the concavo-convex portion formed on the surface of the transfer mold main body is made thicker than the thickness of the transfer material formed on the surface of the transfer body before imprinting. The imprint transfer mold according to claim 1,
When the pressure at which the transfer mold body presses the transfer material is M, the pressure of the imprint atmosphere is P, and the uneven depth of the transfer material to be finally left on the transferred material is k, the surface of the transfer mold body The imprint transfer mold is characterized in that the thickness of the concavo-convex portion formed on the substrate is thicker than the length represented by {(P + M) / M} * k. The imprint transfer mold according to claim 1,
An imprint transfer mold characterized in that at least a part of the concave portion of the concavo-convex portion formed on the surface of the transfer mold main body reaches the back surface of the transfer mold main body. The imprint transfer mold according to claim 4,
A transfer mold for imprinting, characterized in that a transfer mold holding member for holding the transfer mold main body is disposed in contact with the back surface of the transfer mold main body while discharging bubbles contained in the transfer mold main body. .   An imprint transfer product produced by the imprint transfer mold according to any one of claims 1 to 5. A pressing step of pressing a transfer mold body against a transfer product on which a transfer material having fluidity is formed when heated to at least room temperature on a substrate; a curing step of curing the transfer material; and the cured transfer In an imprint transfer method comprising a peeling step of peeling the transfer mold main body from a material, and transferring the shape of the transfer mold main body surface to the transferred material,
In the pressing step, the thickness of the concavo-convex portion formed on the surface of the transfer mold main body is finally made thicker than the concavo-convex depth of the transfer material that is desired to remain on the surface of the transfer material, and is pressed against the transfer material. A characteristic imprint transfer method. A transfer mold is pressed against a transfer material on which a transfer material having fluidity is formed when heated to at least room temperature on the substrate, the transfer material is cured to peel off the transfer mold, and the transfer material is applied to the transfer material. In the imprint device that transfers the shape of the transfer mold surface,
The transfer mold has an uneven portion formed on a surface thereof, and the thickness of the uneven portion is made thicker than the uneven depth of a transfer material to be finally left on the surface of the transfer product. The imprint apparatus according to claim 8, wherein
An imprint apparatus characterized in that, on the back surface of the transfer mold, a transfer mold holding member that discharges bubbles contained in the transfer mold and holds the transfer mold is in contact. The imprint apparatus according to claim 8 or 9,
An imprint apparatus comprising a deaeration device for removing air bubbles from the back surface of the transfer mold. In the imprint transfer mold manufacturing method, the mask is removed through an etching process on a transfer mold substrate with a mask prepared in advance, and an imprint transfer mold is manufactured.
In the etching step, the thickness of the concavo-convex portion formed on the surface of the transfer mold is formed to be thicker than the concavo-convex depth of the transfer material to be finally left on the surface of the transfer product during imprinting. A method for producing a transfer mold. In the method for producing an imprint transfer mold for producing an imprint transfer mold through an electroforming process for electroforming an original mold prepared in advance and a polishing process for polishing the original mold,
In the polishing step, the thickness of the concavo-convex portion formed on the surface of the transfer mold is formed to be thicker than the concavo-convex depth of the transfer material to be finally left on the surface of the transfer product during imprinting. A method for producing a transfer mold.

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