JP2015148698A - Photocurable composition - Google Patents
Photocurable composition Download PDFInfo
- Publication number
- JP2015148698A JP2015148698A JP2014021054A JP2014021054A JP2015148698A JP 2015148698 A JP2015148698 A JP 2015148698A JP 2014021054 A JP2014021054 A JP 2014021054A JP 2014021054 A JP2014021054 A JP 2014021054A JP 2015148698 A JP2015148698 A JP 2015148698A
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- carbon atoms
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- 239000000203 mixture Substances 0.000 title claims abstract description 79
- 150000001875 compounds Chemical class 0.000 claims abstract description 114
- 239000004593 Epoxy Substances 0.000 claims abstract description 38
- 239000002253 acid Substances 0.000 claims abstract description 25
- 239000003086 colorant Substances 0.000 claims abstract description 16
- 239000003999 initiator Substances 0.000 claims abstract description 16
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 11
- 150000007519 polyprotic acids Polymers 0.000 claims abstract description 11
- 238000005886 esterification reaction Methods 0.000 claims abstract description 5
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 4
- -1 R 21 Chemical compound 0.000 claims description 106
- 125000004432 carbon atom Chemical group C* 0.000 claims description 75
- 125000000217 alkyl group Chemical group 0.000 claims description 32
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 25
- 125000000623 heterocyclic group Chemical group 0.000 claims description 17
- 125000003118 aryl group Chemical group 0.000 claims description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 16
- 125000005843 halogen group Chemical group 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 239000000049 pigment Substances 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 6
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 5
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 5
- 125000001424 substituent group Chemical group 0.000 claims description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 125000003342 alkenyl group Chemical group 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000001118 alkylidene group Chemical group 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 125000004434 sulfur atom Chemical group 0.000 claims description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical group [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 2
- 125000004429 atom Chemical group 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- 229910052711 selenium Inorganic materials 0.000 claims description 2
- 230000035945 sensitivity Effects 0.000 abstract description 8
- 230000032050 esterification Effects 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 46
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 24
- 239000000463 material Substances 0.000 description 20
- 239000002904 solvent Substances 0.000 description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 239000000975 dye Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 229920003986 novolac Polymers 0.000 description 12
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 229920002554 vinyl polymer Polymers 0.000 description 9
- 229940049920 malate Drugs 0.000 description 8
- BJEPYKJPYRNKOW-UHFFFAOYSA-L malate(2-) Chemical compound [O-]C(=O)C(O)CC([O-])=O BJEPYKJPYRNKOW-UHFFFAOYSA-L 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 7
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 7
- 150000008064 anhydrides Chemical class 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 229940014800 succinic anhydride Drugs 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 150000001299 aldehydes Chemical class 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- PQNFLJBBNBOBRQ-UHFFFAOYSA-N indane Chemical compound C1=CC=C2CCCC2=C1 PQNFLJBBNBOBRQ-UHFFFAOYSA-N 0.000 description 6
- 150000002484 inorganic compounds Chemical class 0.000 description 6
- 229910010272 inorganic material Inorganic materials 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000003513 alkali Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000006482 condensation reaction Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 239000002270 dispersing agent Substances 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- OGRAOKJKVGDSFR-UHFFFAOYSA-N 2,3,5-trimethylphenol Chemical compound CC1=CC(C)=C(C)C(O)=C1 OGRAOKJKVGDSFR-UHFFFAOYSA-N 0.000 description 4
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 4
- 239000003377 acid catalyst Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000976 ink Substances 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical class OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000012429 reaction media Substances 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
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- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 238000011161 development Methods 0.000 description 3
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- 238000001035 drying Methods 0.000 description 3
- 239000003759 ester based solvent Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 3
- XMGQYMWWDOXHJM-JTQLQIEISA-N (+)-α-limonene Chemical compound CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 2
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- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
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- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 2
- CWNOEVURTVLUNV-UHFFFAOYSA-N 2-(propoxymethyl)oxirane Chemical compound CCCOCC1CO1 CWNOEVURTVLUNV-UHFFFAOYSA-N 0.000 description 2
- LCSAOPVSVLGDLE-UHFFFAOYSA-N 2-[[4-[9-[4-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1C1(C2=CC=CC=C2C2=CC=CC=C21)C(C=C1)=CC=C1OCC1CO1 LCSAOPVSVLGDLE-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- RFMXKZGZSGFZES-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;2-sulfanylacetic acid Chemical compound OC(=O)CS.OC(=O)CS.OC(=O)CS.CCC(CO)(CO)CO RFMXKZGZSGFZES-UHFFFAOYSA-N 0.000 description 2
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical compound CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 description 2
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- 125000004226 phenanthren-1-yl group Chemical group [H]C1=C([H])C([H])=C2C(C([H])=C([H])C3=C(*)C([H])=C([H])C([H])=C23)=C1[H] 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000001007 phthalocyanine dye Substances 0.000 description 1
- 125000003386 piperidinyl group Chemical group 0.000 description 1
- 125000005936 piperidyl group Chemical group 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000004309 pyranyl group Chemical group O1C(C=CC=C1)* 0.000 description 1
- 125000003226 pyrazolyl group Chemical group 0.000 description 1
- 125000005495 pyridazyl group Chemical group 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 125000000714 pyrimidinyl group Chemical group 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 125000005493 quinolyl group Chemical group 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ADXGNEYLLLSOAR-UHFFFAOYSA-N tasosartan Chemical compound C12=NC(C)=NC(C)=C2CCC(=O)N1CC(C=C1)=CC=C1C1=CC=CC=C1C=1N=NNN=1 ADXGNEYLLLSOAR-UHFFFAOYSA-N 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- 125000006337 tetrafluoro ethyl group Chemical group 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 125000003718 tetrahydrofuranyl group Chemical group 0.000 description 1
- 125000005329 tetralinyl group Chemical group C1(CCCC2=CC=CC=C12)* 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000001113 thiadiazolyl group Chemical group 0.000 description 1
- 239000001017 thiazole dye Substances 0.000 description 1
- 125000000335 thiazolyl group Chemical group 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 description 1
- 125000004568 thiomorpholinyl group Chemical group 0.000 description 1
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 description 1
- 229940103494 thiosalicylic acid Drugs 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000001003 triarylmethane dye Substances 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 125000001425 triazolyl group Chemical group 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000004205 trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- XHGIFBQQEGRTPB-UHFFFAOYSA-N tris(prop-2-enyl) phosphate Chemical compound C=CCOP(=O)(OCC=C)OCC=C XHGIFBQQEGRTPB-UHFFFAOYSA-N 0.000 description 1
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- UIYCHXAGWOYNNA-UHFFFAOYSA-N vinyl sulfide Chemical compound C=CSC=C UIYCHXAGWOYNNA-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000001018 xanthene dye Substances 0.000 description 1
- 150000003732 xanthenes Chemical class 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical group O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
Abstract
Description
本発明は、特定の構造を有する光重合性不飽和化合物を含有する光硬化性組成物に関する。 The present invention relates to a photocurable composition containing a photopolymerizable unsaturated compound having a specific structure.
光硬化性組成物は、通常、着色剤、光重合性不飽和化合物及び光重合開始剤を含有するものである。この光硬化性組成物は、紫外線又は電子線を照射することによって重合硬化させることができるので、着色剤として、特に黒色顔料を用いた場合、表示コントラストや発色効果を高めるためにカラーフィルタのR、G、Bの着色層間の境界部分に設けられたブラックマトリックスとして有用である。
最近、ブラックマトリックスの製造工程において、露光、現像、ポストキュアを経て得られた黒色パターンの透明基板との密着性が十分ではなく、黒色パターンを形成していく剥離工程を繰り返すことで、先に形成した着色パターンの一部が同時に剥離され、パターンが欠落したり、露光硬化部が透明基板上に残留したりするという問題がある。
The photocurable composition usually contains a colorant, a photopolymerizable unsaturated compound, and a photopolymerization initiator. Since this photocurable composition can be polymerized and cured by irradiating with ultraviolet rays or electron beams, particularly when a black pigment is used as a colorant, the R of the color filter is used in order to enhance display contrast and coloring effect. , G and B are useful as a black matrix provided at the boundary between colored layers.
Recently, in the black matrix manufacturing process, the adhesion of the black pattern obtained through exposure, development, and post-cure is not sufficient, and by repeating the peeling process to form the black pattern, There is a problem that a part of the formed colored pattern is peeled off at the same time, the pattern is lost, or the exposed and cured part remains on the transparent substrate.
下記特許文献1には、ε‐カプロラクトンで変性されたイソシアヌレート骨格を有するモノマーを含有する光硬化性インク組成物が開示され、下記特許文献2には、バインダー樹脂がトリアジン構造を持つモノマーを含有するカラーフィルタ用着色組成物が開示され、下記特許文献3には、イソシアヌレート骨格含有モノマーを含有するカラーフィルタ用着色組成物が開示され、下記特許文献4には、分子中に重合性反応基とアルキレンオキシド鎖を有するイソシアヌル酸誘導体を含む硬化性組成物が開示されている。
しかしながら、これらの文献に記載の光硬化性組成物では、感度及び密着性において不十分であった。
Patent Document 1 below discloses a photocurable ink composition containing a monomer having an isocyanurate skeleton modified with ε-caprolactone, and Patent Document 2 below contains a monomer having a triazine structure as a binder resin. A color composition for a color filter is disclosed. Patent Document 3 below discloses a color composition for a color filter containing an isocyanurate skeleton-containing monomer. Patent Document 4 below discloses a polymerizable reactive group in the molecule. And a curable composition comprising an isocyanuric acid derivative having an alkylene oxide chain.
However, the photocurable compositions described in these documents are insufficient in sensitivity and adhesion.
従って、本発明の目的は、感度及び密着性に優れ、カラーフィルターとして好適な光硬化性組成物を提供することにある。 Accordingly, an object of the present invention is to provide a photocurable composition which is excellent in sensitivity and adhesion and suitable as a color filter.
本発明者等は、鋭意検討を重ねた結果、光重合性不飽和化合物、光重合開始剤及び着色剤を含有する光硬化性組成物において、光重合性不飽和化合物として、特定の構造を有する2種類の化合物を用いることにより、上記目的を達成できることを知見した。
即ち、本発明は、下記一般式(1)で表されるエポキシ化合物に不飽和一塩基酸を付加させた構造を有するエポキシ付加化合物と、多塩基酸無水物とのエステル化反応により得られる反応生成物である構造を有する光重合性不飽和化合物(A)、下記一般式(2)で表される光重合性不飽和化合物(B)、光重合開始剤(C)及び着色剤(D)を含有する光硬化性組成物を提供するものである。
As a result of extensive studies, the present inventors have a specific structure as a photopolymerizable unsaturated compound in a photocurable composition containing a photopolymerizable unsaturated compound, a photopolymerization initiator, and a colorant. It has been found that the above object can be achieved by using two kinds of compounds.
That is, the present invention provides a reaction obtained by an esterification reaction of an epoxy addition compound having a structure in which an unsaturated monobasic acid is added to an epoxy compound represented by the following general formula (1) and a polybasic acid anhydride. Photopolymerizable unsaturated compound (A) having a structure as a product, photopolymerizable unsaturated compound (B) represented by the following general formula (2), photopolymerization initiator (C), and colorant (D) The photocurable composition containing is provided.
また、本発明は、上記光硬化性組成物を用いたカラーフィルタを提供するものである。 Moreover, this invention provides the color filter using the said photocurable composition.
本発明の光硬化性組成物は、特定の構造を有する2種類の光重合性不飽和化合物を含有することにより、感度、密着性に優れるものである。また、その硬化物は、表示デバイス用カラーフィルタ及び液晶表示パネル並びに有機EL表示パネルに好適なものである。 The photocurable composition of the present invention is excellent in sensitivity and adhesion by containing two kinds of photopolymerizable unsaturated compounds having a specific structure. The cured product is suitable for a color filter for display devices, a liquid crystal display panel, and an organic EL display panel.
以下、本発明の光硬化性組成物について、好ましい実施形態に基づき説明する。 Hereinafter, the photocurable composition of the present invention will be described based on preferred embodiments.
本発明の光硬化性組成物は上記一般式(1)で表されるエポキシ化合物に不飽和一塩基酸を付加させた構造を有するエポキシ付加化合物と、多塩基酸無水物とのエステル化反応により得られる反応生成物である構造を有する光重合性不飽和化合物(A)、上記一般式(5)で表される光重合性不飽和化合物(B)、光重合開始剤(C)及び着色剤(D)を含有する。以下、各成分について順に説明する。 The photocurable composition of the present invention is obtained by an esterification reaction between an epoxy addition compound having a structure in which an unsaturated monobasic acid is added to the epoxy compound represented by the general formula (1) and a polybasic acid anhydride. Photopolymerizable unsaturated compound (A) having a structure which is a reaction product obtained, photopolymerizable unsaturated compound (B) represented by the above general formula (5), photopolymerization initiator (C) and colorant (D) is contained. Hereinafter, each component will be described in order.
<光重合性不飽和化合物(A)及び(B)>
本発明の光硬化性組成物に用いられる光重合性不飽和化合物は、光重合開始剤が光照射により活性化された状態で重合し得る特性を有する。
光重合性不飽和化合物(A)は、上記一般式(1)で表わされるエポキシ化合物に不飽和一塩基酸を付加させた構造を有するエポキシ付加化合物と、多塩基酸無水物とのエステル化反応により得られる反応生成物である構造を有する。
<Photopolymerizable unsaturated compounds (A) and (B)>
The photopolymerizable unsaturated compound used in the photocurable composition of the present invention has characteristics that allow polymerization in a state where the photopolymerization initiator is activated by light irradiation.
The photopolymerizable unsaturated compound (A) is an esterification reaction between an epoxy addition compound having a structure in which an unsaturated monobasic acid is added to the epoxy compound represented by the general formula (1) and a polybasic acid anhydride. The structure is a reaction product obtained by
上記一般式(1)中、X1で表される炭素原子数1〜4のアルキリデン基としては、メチリデン、エチリデン、プロピリデン、イソプロピリデン、ブチリデン、イソブチリデン、トリフルオロメチリデン、ジトリフルオロイソプロピリデン等が挙げられ、
X1で表される炭素原子数3〜20の脂環式炭化水素基としては、シクロプロピリデン、シクロブチリデン、シクロペンチリデン、シクロヘキシリデン、3−メチルシクロペンチリデン、シクロペンテニリデン、シクロヘキセニリデン、3−メチルシクロヘキシリデン、3,3−ジメチルシクロヘキシリデン、3,5−ジメチルシクロヘキシリデン等が挙げられ、
R1、R2、R3及びR4で表される炭素原子数1〜5のアルキル基としては、メチル、エチル、プロピル、iso−プロピル、ブチル、sec−ブチル、tert−ブチル、iso−ブチル、アミル、iso−アミル、tert−アミル等が挙げられ、
R1、R2、R3及びR4で表される炭素原子数1〜8のアルコキシ基としては、メチルオキシ、エチルオキシ、iso−プロピルオキシ、プロピルオキシ、ブチルオキシ、ペンチルオキシ、iso−ペンチルオキシ、ヘキシルオキシ、ヘプチルオキシ、オクチルオキシ、2−エチルヘキシルオキシ等が挙げられ、
R1、R2、R3及びR4で表される炭素原子数2〜5のアルケニル基としては、ビニル、アリル、ブテニル、プロペニル等が挙げられ、
R1、R2、R3及びR4で表されるハロゲン原子としては、フッ素、塩素、臭素、ヨウ素が挙げられる。
In the general formula (1), examples of the alkylidene group having 1 to 4 carbon atoms represented by X 1 include methylidene, ethylidene, propylidene, isopropylidene, butylidene, isobutylidene, trifluoromethylidene, and ditrifluoroisopropylidene. Named,
Examples of the alicyclic hydrocarbon group having 3 to 20 carbon atoms represented by X 1 include cyclopropylidene, cyclobutylidene, cyclopentylidene, cyclohexylidene, 3-methylcyclopentylidene, cyclopentenylidene, Cyclohexenylidene, 3-methylcyclohexylidene, 3,3-dimethylcyclohexylidene, 3,5-dimethylcyclohexylidene, etc.
Examples of the alkyl group having 1 to 5 carbon atoms represented by R 1 , R 2 , R 3 and R 4 include methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso-butyl. , Amyl, iso-amyl, tert-amyl, etc.,
The R 1, R 2, R 3 and alkoxy group having 1 to 8 carbon atoms represented by R 4, methyloxy, ethyloxy, iso- propyloxy, propyloxy, butyloxy, pentyloxy, iso- pentyloxy, Hexyloxy, heptyloxy, octyloxy, 2-ethylhexyloxy, etc.
Examples of the alkenyl group having 2 to 5 carbon atoms represented by R 1 , R 2 , R 3 and R 4 include vinyl, allyl, butenyl, propenyl,
Examples of the halogen atom represented by R 1 , R 2 , R 3 and R 4 include fluorine, chlorine, bromine and iodine.
上記一般式(1)中のX1である(イ)において、Y1で表される炭素原子数1〜20のアルキル基としては、上記R1、R2、R3及びR4の説明で例示したものの他、ヘキシル、ヘプチル、イソヘプチル、t−ヘプチル、n−オクチル、イソオクチル、t−オクチル、2−エチルヘキシル、n−ノニル、n−デシル、トリフルオロメチル、ジフルオロメチル、モノフルオロメチル、ペンタフルオロエチル、テトラフルオロエチル、トリフルオロエチル、ジフルオロエチル、ヘプタフルオロプロピル、ヘキサフルオロプロピル、ペンタフルオロプロピル、テトラフルオロプロピル、トリフルオロプロピル、パーフルオロブチル、シクロプロピル、シクロブチル、シクロペンチル、シクロヘキシル、シクロヘプチル、シクロオクチル、シクロノニル、シクロデシル等が挙げられ、
Y1で表される炭素原子数6〜30のアリール基としては、フェニル、ナフチル、アントラセン−1−イル、フェナントレン−1−イル、o−トリル、m−トリル、p−トリル、4−ビニルフェニル、3−イソプロピルフェニル、4−イソプロピルフェニル、4−ブチルフェニル、4−イソブチルフェニル、4−t−ブチルフェニル、4−ヘキシルフェニル、4−シクロヘキシルフェニル、4−オクチルフェニル、4−(2−エチルヘキシル)フェニル、2,3−ジメチルフェニル、2,4−ジメチルフェニル、2,5−ジメチルフェニル、2,6−ジメチルフェニル、3,4−ジメチルフェニル、3,5−ジメチルフェニル、2,4−ジ−t−ブチルフェニル、2,5−ジ−t−ブチルフェニル、2,6−ジ−t−ブチルフェニル、2,4−ジ−t−ペンチルフェニル、2,5−ジ−t−アミルフェニル、シクロヘキシルフェニル、ビフェニル、2,4,5−トリメチルフェニル、4−クロロフェニル、3,4−ジクロロフェニル、4−トリクロロフェニル、4−トリフルオロフェニル、パーフルオロフェニル等が挙げられ、
Y1で表される炭素原子数7〜30のアリールアルキル基としては、ベンジル、フェネチル、2−フェニルプロピル、ジフェニルメチル、トリフェニルメチル、スチリル、シンナミル、4−クロロフェニルメチル等が挙げられ、
Y1で表される炭素原子数2〜20の複素環基としては、ピロリル、ピリジル、ピリミジル、ピリダジル、ピペラジル、ピペリジル、ピラニル、ピラゾリル、トリアジル、ピロリジル、キノリル、イソキノリル、イミダゾリル、ベンゾイミダゾリル、トリアゾリル、フリル、フラニル、ベンゾフラニル、チエニル、チオフェニル、ベンゾチオフェニル、チアジアゾリル、チアゾリル、ベンゾチアゾリル、オキサゾリル、ベンゾオキサゾリル、イソチアゾリル、イソオキサゾリル、インドリル、ユロリジル、モルフォリニル、チオモルフォリニル、2−ピロリジノン−1−イル、2−ピペリドン−1−イル、2,4−ジオキシイミダゾリジン−3−イル、2,4−ジオキシオキサゾリジン−3−イル等が挙げられる。
Y1で表されるハロゲン原子としては、上記R1、R2、R3及びR4の説明で例示したものが挙げられる。
隣接するY1同士で形成してもよい環としては、シクロペンタン環、シクロヘキサン環、シクロペンテン環、ベンゼン環、ピペリジン環、モルフォリン環、ラクトン環、ラクタム環等の5〜7員環及びナフタレン環、アントラセン環、フルオレン環、アセナフテン環、インダン環、テトラリン環等の縮合環が挙げられる。
In (i) which is X 1 in the general formula (1), examples of the alkyl group having 1 to 20 carbon atoms represented by Y 1 include the description of R 1 , R 2 , R 3 and R 4 . In addition to those exemplified, hexyl, heptyl, isoheptyl, t-heptyl, n-octyl, isooctyl, t-octyl, 2-ethylhexyl, n-nonyl, n-decyl, trifluoromethyl, difluoromethyl, monofluoromethyl, pentafluoro Ethyl, tetrafluoroethyl, trifluoroethyl, difluoroethyl, heptafluoropropyl, hexafluoropropyl, pentafluoropropyl, tetrafluoropropyl, trifluoropropyl, perfluorobutyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclo Octyl, cyclono Le, cyclodecyl and the like,
Examples of the aryl group having 6 to 30 carbon atoms represented by Y 1 include phenyl, naphthyl, anthracen-1-yl, phenanthren-1-yl, o-tolyl, m-tolyl, p-tolyl, and 4-vinylphenyl. 3-isopropylphenyl, 4-isopropylphenyl, 4-butylphenyl, 4-isobutylphenyl, 4-t-butylphenyl, 4-hexylphenyl, 4-cyclohexylphenyl, 4-octylphenyl, 4- (2-ethylhexyl) Phenyl, 2,3-dimethylphenyl, 2,4-dimethylphenyl, 2,5-dimethylphenyl, 2,6-dimethylphenyl, 3,4-dimethylphenyl, 3,5-dimethylphenyl, 2,4-di- t-butylphenyl, 2,5-di-t-butylphenyl, 2,6-di-t-butylphenyl, 2,4 Di-t-pentylphenyl, 2,5-di-t-amylphenyl, cyclohexylphenyl, biphenyl, 2,4,5-trimethylphenyl, 4-chlorophenyl, 3,4-dichlorophenyl, 4-trichlorophenyl, 4-triphenyl Fluorophenyl, perfluorophenyl and the like,
Examples of the arylalkyl group having 7 to 30 carbon atoms represented by Y 1 include benzyl, phenethyl, 2-phenylpropyl, diphenylmethyl, triphenylmethyl, styryl, cinnamyl, 4-chlorophenylmethyl, and the like.
Examples of the heterocyclic group having 2 to 20 carbon atoms represented by Y 1 include pyrrolyl, pyridyl, pyrimidyl, pyridazyl, piperazyl, piperidyl, pyranyl, pyrazolyl, triazyl, pyrrolidyl, quinolyl, isoquinolyl, imidazolyl, benzimidazolyl, triazolyl, furyl , Furanyl, benzofuranyl, thienyl, thiophenyl, benzothiophenyl, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl, isothiazolyl, isoxazolyl, indolyl, urolidyl, morpholinyl, thiomorpholinyl, 2-pyrrolidinon-1-yl, 2 -Piperidone-1-yl, 2,4-dioxyimidazolidin-3-yl, 2,4-dioxyoxazolidine-3-yl and the like.
Examples of the halogen atom represented by Y 1 include those exemplified in the description of R 1 , R 2 , R 3 and R 4 above.
Rings that may be formed by adjacent Y 1 include cyclopentane ring, cyclohexane ring, cyclopentene ring, benzene ring, piperidine ring, morpholine ring, lactone ring, lactam ring and the like, and naphthalene ring , Condensed rings such as anthracene ring, fluorene ring, acenaphthene ring, indane ring and tetralin ring.
上記一般式(1)中のX1である(ハ)において、Y2及びZ2で表される炭素原子数1〜20の炭素原子数1〜20のアルキル基、炭素原子数6〜30のアリール基、炭素原子数7〜30のアリールアルキル基及び炭素原子数2〜20の複素環基としては、上記一般式(1)中のX1である(イ)の説明において例示したものが挙げられる。
隣接するZ2同士で形成してもよい環としては、上記一般式(1)中のX1である(イ)における隣接するY1同士で形成してもよい環と同様の環が挙げられる。
In (c) which is X 1 in the general formula (1), the alkyl group having 1 to 20 carbon atoms represented by Y 2 and Z 2 , and having 6 to 30 carbon atoms Examples of the aryl group, the arylalkyl group having 7 to 30 carbon atoms and the heterocyclic group having 2 to 20 carbon atoms include those exemplified in the description of (i) which is X 1 in the general formula (1). It is done.
Examples of the ring that may be formed by adjacent Z 2 include the same ring as the ring that may be formed by adjacent Y 1 in (i) which is X 1 in the general formula (1). .
上記一般式(I)で表されるエポキシ化合物の中でも、X1が上記式(イ)、(ロ)又は(ハ)で表される置換基であるものが好ましい。 Among the epoxy compounds represented by the above general formula (I), those in which X 1 is a substituent represented by the above formula (A), (B) or (C) are preferable.
上記エポキシ化合物のエポキシ基に作用させる上記不飽和一塩基酸としては、アクリル酸、メタクリル酸、クロトン酸、桂皮酸、ソルビン酸、ヒドロキシエチルメタクリレート・マレート、等が挙げられる。ヒドロキシエチルアクリレート・マレート、ヒドロキシプロピルメタクリレート・マレート、ヒドロキシプロピルアクリレート・マレート、ジシクロペンタジエン・マレート等が挙げられ、中でも、アクリル酸、メタクリル酸が好ましい。
また、上記不飽和一塩基酸を付加させた後にエステル化反応させる上記多塩基酸無水物としては、ビフェニルテトラカルボン酸二無水物、テトラヒドロ無水フタル酸、無水コハク酸、無水マレイン酸、トリメリット酸無水物、ピロメリット酸無水物、2,2'−3,3'−ベンゾフェノンテトラカルボン酸無水物、エチレングリコールビスアンヒドロトリメリテート、グリセロールトリスアンヒドロトリメリテート、ヘキサヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、ナジック酸無水物、メチルナジック酸無水物、トリアルキルテトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、5−(2,5−ジオキソテトラヒドロフリル)−3−メチル−3−シクロヘキセン−1,2−ジカルボン酸無水物、トリアルキルテトラヒドロ無水フタル酸−無水マレイン酸付加物、ドデセニル無水コハク酸、無水メチルハイミック酸等が挙げられ、中でも、無水コハク酸、ビフェニルテトラカルボン酸二無水物、ピロメリット酸無水物等の二酸無水物、又は前記二酸無水物と、無水コハク酸等の一酸無水物の組み合わせが好ましい。
Examples of the unsaturated monobasic acid that acts on the epoxy group of the epoxy compound include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, sorbic acid, hydroxyethyl methacrylate / malate, and the like. Examples thereof include hydroxyethyl acrylate / malate, hydroxypropyl methacrylate / malate, hydroxypropyl acrylate / malate and dicyclopentadiene / malate, among which acrylic acid and methacrylic acid are preferable.
In addition, the polybasic acid anhydride to be esterified after adding the unsaturated monobasic acid includes biphenyltetracarboxylic dianhydride, tetrahydrophthalic anhydride, succinic anhydride, maleic anhydride, trimellitic acid Anhydride, pyromellitic anhydride, 2,2'-3,3'-benzophenone tetracarboxylic anhydride, ethylene glycol bisanhydro trimellitate, glycerol tris anhydro trimellitate, hexahydrophthalic anhydride, methyl tetrahydro Phthalic anhydride, nadic anhydride, methyl nadic anhydride, trialkyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1, 2-dicarboxylic anhydride, trialkyltetrahydro Phthalic acid-maleic anhydride adduct, dodecenyl succinic anhydride, methyl hymic anhydride and the like, among them, succinic anhydride, biphenyltetracarboxylic dianhydride, diacid anhydrides such as pyromellitic anhydride, Alternatively, a combination of the diacid anhydride and a monoacid anhydride such as succinic anhydride is preferable.
上記エポキシ化合物、上記不飽和一塩基酸及び上記多塩基酸無水物の反応モル比は、以下の通りとすることが好ましい。
即ち、上記エポキシ化合物のエポキシ基1個に対し、上記不飽和一塩基酸のカルボキシル基が0.1〜1.0個、好ましくは0.3〜1.0個で付加させた構造を有するエポキシ付加物において、該エポキシ付加物の水酸基1個に対し、上記多塩基酸無水物の酸無水物構造が0.1〜1.0個、好ましくは0.3〜1.0個となる比率となるようにするのが好ましい。
上記エポキシ化合物、上記不飽和一塩基酸及び上記多塩基酸無水物の反応は、常法に従って行なうことができる。
The reaction molar ratio of the epoxy compound, the unsaturated monobasic acid and the polybasic acid anhydride is preferably as follows.
That is, an epoxy having a structure in which 0.1 to 1.0, preferably 0.3 to 1.0, carboxyl groups of the unsaturated monobasic acid are added to one epoxy group of the epoxy compound. In the adduct, the ratio of the acid anhydride structure of the polybasic acid anhydride is 0.1 to 1.0, preferably 0.3 to 1.0, with respect to one hydroxyl group of the epoxy adduct. It is preferable to do so.
Reaction of the said epoxy compound, the said unsaturated monobasic acid, and the said polybasic acid anhydride can be performed in accordance with a conventional method.
本発明の光硬化性組成物に用いられる光重合性不飽和化合物(B)は、上記一般式(2)で表される化合物である。 The photopolymerizable unsaturated compound (B) used in the photocurable composition of the present invention is a compound represented by the above general formula (2).
上記一般式(2)中、R5、R6及びR7で表される炭素原子数1〜20のアルキル基、炭素原子数6〜30のアリール基、炭素原子数7〜30のアリールアルキル基及び炭素原子数2〜20の複素環基としては、上記一般式(1)中のX1である(イ)の説明で例示したものが挙げられる。
上記一般式(2)で表される化合物の中でも、R5、R6及びR7が、上記一般式(3)又は(4)で表されるものが、密着性が高いので好ましい。
In the general formula (2), an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms represented by R 5 , R 6 and R 7 and the heterocyclic group having 2 to 20 carbon atoms, those exemplified in the description of which is X 1 in the general formula (1) (b) and the like.
Among the compounds represented by the general formula (2), those in which R 5 , R 6 and R 7 are represented by the general formula (3) or (4) are preferable because of high adhesion.
上記一般式(2)で表される化合物としては、市販のものを用いることもでき、例えば、A−9300−1CL、A−9300−2CL、A−9300−3CL、A−9300−6CL(新中村化学工業社製)、CIC酸アクリレート(四国化成社製)、アロニックスM−327、アロニックスM−325(東亞合成社製)等が挙げられる。 As the compound represented by the general formula (2), commercially available compounds may be used. For example, A-9300-1CL, A-9300-2CL, A-9300-3CL, A-9300-6CL (new Nakamura Chemical Co., Ltd.), CIC acid acrylate (Shikoku Kasei Co., Ltd.), Aronix M-327, Aronix M-325 (Toagosei Co., Ltd.) and the like.
本発明の光硬化性組成物において、上記光重合性不飽和化合物の含有量は、組成物(但し、溶媒は除く)中、上記光重合性不飽和化合物(A)及び(B)の合計で、好ましくは10〜80質量%であり、より好ましくは、15〜70質量%である。
また、上記光重合性不飽和化合物(A)及び(B)の比率は、質量比で、上記光重合性不飽和化合物(A):上記光重合性不飽和化合物(B)=35〜95:5〜65であるのが好ましく、40〜90:10〜60であるのがより好ましい。
In the photocurable composition of the present invention, the content of the photopolymerizable unsaturated compound is the sum of the photopolymerizable unsaturated compounds (A) and (B) in the composition (excluding the solvent). , Preferably, it is 10-80 mass%, More preferably, it is 15-70 mass%.
Moreover, the ratio of the said photopolymerizable unsaturated compound (A) and (B) is a mass ratio, The said photopolymerizable unsaturated compound (A): The said photopolymerizable unsaturated compound (B) = 35-95: It is preferable that it is 5-65, and it is more preferable that it is 40-90: 10-60.
<光重合開始剤(C)>
本発明の光硬化性組成物に用いられる光重合開始剤(C)としては、従来既知の化合物を用いることが可能であり、例えば、ベンゾフェノン、フェニルビフェニルケトン、1−ヒドロキシ−1−ベンゾイルシクロヘキサン、4−ベンゾイル−4'−メチルジフェニルスルフィド、ベンゾインブチルエーテル、2−ヒドロキシ−2−ベンゾイルプロパン、2−ヒドロキシ−2−(4'−イソプロピル)ベンゾイルプロパン、4−ブチルベンゾイルトリクロロメタン、4−フェノキシベンゾイルジクロロメタン、ベンゾイル蟻酸メチル、ベンゾイン、2−モルホリル−2−(4'−メチルメルカプト)ベンゾイルプロパン、2,2−ジメトキシ−1,2−ジフェニルエタン−1−オン、1−ベンジル−1−ジメチルアミノ−1−(4'−モルホリノベンゾイル)プロパン等のアルキルフェノン系化合物;1,2−オクタンジオン,1−[4−(フェニルチオ)−,2−(O−ベンゾイルオキシム)]、エタノン,1−[9−エチル−6−(2−メチルベンゾイル)−9H−カルバゾール−3−イル]−,1−(O−アセチルオキシム)等のオキシムエステル化合物;チオキサントン、1−クロル−4−プロポキシチオキサントン、イソプロピルチオキサントン、ジエチルチオキサントン等のチオキサントン化合物;エチルアントラキノン等のアントラキノン化合物;2,2−ビス(2−クロロフェニル)−4,5,4’,5’−テトラフェニル−1−2’−ビイミダゾール等のビイミダゾール化合物;2−メチル−4,6−ビス(トリクロロメチル)−s−トリアジン、2−フェニル−4,6−ビス(トリクロロメチル)−s−トリアジン、2−ナフチル−4,6−ビス(トリクロロメチル)−s−トリアジン等のトリアジン化合物;4、4−アゾビスイソブチロニトリル等のアゾ化合物;過酸化ベンゾイル等の過酸化物;1,7−ビス(9'−アクリジニル)ヘプタン、9−n−ブチル−3,6−ビス(2'−モルホリノイソブチロイル)カルバゾール、トリフェニルホスフィン、カンファーキノン等が挙げられ、市販品としては、N−1414、N−1717、N−1919、PZ−808、NCI−831、NCI−930((株)ADEKA社製)、IRGACURE184、IRGACURE369、IRGACURE651、IRGACURE907、IRGACURE OXE 01、IRGACURE OXE 02(BASF(株)社製)等が挙げられる。
<Photopolymerization initiator (C)>
As the photopolymerization initiator (C) used in the photocurable composition of the present invention, conventionally known compounds can be used. For example, benzophenone, phenylbiphenyl ketone, 1-hydroxy-1-benzoylcyclohexane, 4-benzoyl-4′-methyldiphenyl sulfide, benzoin butyl ether, 2-hydroxy-2-benzoylpropane, 2-hydroxy-2- (4′-isopropyl) benzoylpropane, 4-butylbenzoyltrichloromethane, 4-phenoxybenzoyldichloromethane , Methyl benzoylformate, benzoin, 2-morpholyl-2- (4′-methylmercapto) benzoylpropane, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-benzyl-1-dimethylamino-1 -(4'-morpholinoben Zoyl) propane and other alkylphenone compounds; 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], ethanone, 1- [9-ethyl-6- (2 Oxime ester compounds such as -methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime); thioxanthone compounds such as thioxanthone, 1-chloro-4-propoxythioxanthone, isopropylthioxanthone, diethylthioxanthone; Anthraquinone compounds such as ethyl anthraquinone; biimidazole compounds such as 2,2-bis (2-chlorophenyl) -4,5,4 ′, 5′-tetraphenyl-1-2′-biimidazole; 2-methyl-4, 6-bis (trichloromethyl) -s-triazine, 2-phenyl-4,6-bis (to Triazine compounds such as (lichloromethyl) -s-triazine and 2-naphthyl-4,6-bis (trichloromethyl) -s-triazine; azo compounds such as 4,4-azobisisobutyronitrile; Oxides; 1,7-bis (9′-acridinyl) heptane, 9-n-butyl-3,6-bis (2′-morpholinoisobutyroyl) carbazole, triphenylphosphine, camphorquinone, etc. As products, N-1414, N-1717, N-1919, PZ-808, NCI-831, NCI-930 (manufactured by ADEKA), IRGACURE 184, IRGACURE 369, IRGACURE 651, IRGACURE 907, IRGACURE OXE 01, IRGACURE OX 01 02 (BASF Corporation) Manufacturing), and the like.
本発明の光硬化性組成物に用いられる光重合開始剤としては、特に、下記一般式(5)で表される化合物が、感度及び耐熱性の点から好ましい。 Especially as a photoinitiator used for the photocurable composition of this invention, the compound represented by following General formula (5) is preferable from a sensitivity and heat resistant point.
R15及びR16は、それぞれ独立に、水素原子、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基、R17、OR18、SR19、NR20R21、COR22、SOR23、SO2R24又はCONR25R26を表し、R15及びR16は、互いに結合して環を形成していてもよく、
R17、R18、R19、R20、R21、R22、R23、R24、R25及びR26は、それぞれ独立に、炭素原子数1〜20のアルキル基、炭素原子数6〜30のアリール基、炭素原子数7〜30のアリールアルキル基又は炭素原子数2〜20の複素環基を表し、
X2は、酸素原子、硫黄原子、セレン原子、CR27R28、CO、NR29又はPR30を表し、
X3は、単結合又はCOを表し、
R27、R28、R29及びR30は、それぞれ独立に、水素原子、炭素原子数1〜20のアルキル基、炭素原子数6〜30のアリール基又は炭素原子数7〜30のアリールアルキル基を表し、上記アルキル基又はアリールアルキル基は、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基又は複素環基で置換されてもよく、上記アルキル基又はアリールアルキル基中のメチレン基は−O−で中断されていてもよく、
R27、R28、R29及びR30は、それぞれ独立に、隣接するどちらかのベンゼン環と一緒になって環を形成していてもよく、
aは、0〜4の整数を表し、
bは、0〜5の整数を表す。)
R 15 and R 16 are each independently a hydrogen atom, halogen atom, nitro group, cyano group, hydroxyl group, carboxyl group, R 17 , OR 18 , SR 19 , NR 20 R 21 , COR 22 , SOR 23 , SO 2. R 24 or CONR 25 R 26 , R 15 and R 16 may be bonded to each other to form a ring;
R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 and R 26 are each independently an alkyl group having 1 to 20 carbon atoms, 6 to 6 carbon atoms A 30 aryl group, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms;
X 2 represents an oxygen atom, a sulfur atom, a selenium atom, CR 27 R 28 , CO, NR 29 or PR 30 ;
X 3 represents a single bond or CO,
R 27 , R 28 , R 29 and R 30 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an arylalkyl group having 7 to 30 carbon atoms. The alkyl group or arylalkyl group may be substituted with a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group or a heterocyclic group, and the methylene group in the alkyl group or arylalkyl group is —O. -May be interrupted by-
R 27 , R 28 , R 29 and R 30 may each independently form a ring together with one of the adjacent benzene rings,
a represents an integer of 0 to 4,
b represents an integer of 0 to 5. )
上記一般式(5)中、R13、R14、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29及びR30で表される炭素原子数1〜20のアルキル基、炭素原子数6〜30のアリール基及び炭素原子数7〜30のアリールアルキル基
R13、R14、R17、R18、R19、R20、R21、R22、R23、R24、R25及びR26で表される炭素原子数2〜20の複素環基としては上記一般式(1)中のX1である(イ)の説明で例示したものが挙げられる。
R27、R28、R29及びR30で表されるアルキル基又はアリールアルキル基を置換してもよい複素環基としては、上記一般式(1)中のX1である(イ)の説明で例示した複素環基と同様のものが挙げられる。
R15及びR16が互いに結合して形成してもよい環としては、上記一般式(1)中のX1である(イ)における隣接するY1同士で形成してもよい環と同様の環が挙げられる。
In the above general formula (5), R 13 , R 14 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 and R 30 , an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and an arylalkyl group having 7 to 30 carbon atoms R 13 , R 14 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 and R 26 , the heterocyclic group having 2 to 20 carbon atoms is represented by X 1 in the general formula (1). What is illustrated in the description of (A).
Examples of the heterocyclic group that may be substituted for the alkyl group or arylalkyl group represented by R 27 , R 28 , R 29, and R 30 are X 1 in the above general formula (1). Examples thereof are the same as the heterocyclic groups exemplified in the above.
The ring which R 15 and R 16 may be bonded to each other is the same as the ring which may be formed by adjacent Y 1 in (a) which is X 1 in the general formula (1). A ring is mentioned.
上記一般式(5)で表される化合物の中でも、下記一般式(5')で表される化合物が好ましく、中でも、R16が、ニトロ基又はCOR22であるものが特に好ましい。
本発明の光硬化性組成物において、上記光重合開始剤(C)の含有量は、本発明の光硬化性組成物の固形分中、0.1〜30質量%、特に0.5〜10質量%が好ましい。上記光重合開始剤の含有量が0.1質量%より小さいと、露光による硬化が不十分になる場合があり、30質量%より大きいと、樹脂組成物中に開始剤が析出する場合がある。 In the photocurable composition of the present invention, the content of the photopolymerization initiator (C) is 0.1 to 30% by mass, particularly 0.5 to 10%, in the solid content of the photocurable composition of the present invention. Mass% is preferred. When the content of the photopolymerization initiator is less than 0.1% by mass, curing by exposure may be insufficient, and when it is greater than 30% by mass, the initiator may be precipitated in the resin composition. .
<着色剤(D)>
本発明の光硬化性組成物に用いられる着色剤(D)としては、無機色材又は有機色材を用いることができ、これらは単独で又は2種以上を混合して用いることができる。
上記無機色材又は有機色材としては、例えば、ニトロソ化合物、ニトロ化合物、アゾ化合物、ジアゾ化合物、キサンテン化合物、キノリン化合物、アントラキノン化合物、クマリン化合物、フタロシアニン化合物、イソインドリノン化合物、イソインドリン化合物、キナクリドン化合物、アンタンスロン化合物、ペリノン化合物、ペリレン化合物、ジケトピロロピロール化合物、チオインジゴ化合物、ジオキサジン化合物、トリフェニルメタン化合物、キノフタロン化合物、ナフタレンテトラカルボン酸;アゾ染料、シアニン染料の金属錯体化合物;レーキ顔料;疎水性樹脂、酸化クロム緑、ミロリブルー、コバルト緑、コバルト青、マンガン系、フェロシアン化物、リン酸塩群青、紺青、ウルトラマリン、セルリアンブルー、ピリジアン、エメラルドグリーン、硫酸鉛、黄色鉛、亜鉛黄、べんがら(赤色酸化鉄(III))、カドミウム赤、アンバー等の無機顔料又は有機顔料を用いることができる。
<Colorant (D)>
As the colorant (D) used in the photocurable composition of the present invention, an inorganic color material or an organic color material can be used, and these can be used alone or in admixture of two or more.
Examples of the inorganic color material or organic color material include nitroso compounds, nitro compounds, azo compounds, diazo compounds, xanthene compounds, quinoline compounds, anthraquinone compounds, coumarin compounds, phthalocyanine compounds, isoindolinone compounds, isoindoline compounds, and quinacridones. Compound, anthanthrone compound, perinone compound, perylene compound, diketopyrrolopyrrole compound, thioindigo compound, dioxazine compound, triphenylmethane compound, quinophthalone compound, naphthalenetetracarboxylic acid; azo dye, metal complex compound of cyanine dye; lake pigment; hydrophobic Resin, chromium oxide green, miloli blue, cobalt green, cobalt blue, manganese, ferrocyanide, phosphate ultramarine, bitumen, ultramarine, cerulean blue, pyridian, Main lardo green, lead sulfate, yellow lead, zinc yellow, red iron oxide (red iron oxide (III)), cadmium red, can be used inorganic or organic pigments amber like.
上記無機色材又は有機色材としては、市販の顔料を用いることもでき、例えば、ピグメントレッド1、2、3、9、10、14、17、22、23、31、38、41、48、49、88、90、97、112、119、122、123、144、149、166、168、169、170、171、177、179、180、184、185、192、200、202、209、215、216、217、220、223、224、226、227、228、240、254;ピグメントオレンジ13、31、34、36、38、43、46、48、49、51、52、55、59、60、61、62、64、65、71;ピグメントイエロー1、3、12、13、14、16、17、20、24、55、60、73、81、83、86、93、95、97、98、100、109、110、113、114、117、120、125、126、127、129、137、138、139、147、148、150、151、152、153、154、166、168、175、180、185;ピグメントグリ−ン7、10、36;ピグメントブルー15、15:1、15:2、15:3、15:4、15:5、15:6、22、24、56、60、61、62、64;ピグメントバイオレット1、19、23、27、29、30、32、37、40、50等が挙げられる。 As the inorganic color material or organic color material, commercially available pigments can also be used. For example, Pigment Red 1, 2, 3, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48, 49, 88, 90, 97, 112, 119, 122, 123, 144, 149, 166, 168, 169, 170, 171, 177, 179, 180, 184, 185, 192, 200, 202, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 254; Pigment Orange 13, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 65, 71; Pigment Yellow 1, 3, 12, 13, 14, 16, 17, 20, 24, 55, 60, 73, 81, 83, 86, 3, 95, 97, 98, 100, 109, 110, 113, 114, 117, 120, 125, 126, 127, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 166, 168, 175, 180, 185; Pigment Green 7, 10, 36; Pigment Blue 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 5, 15: 6, 22, 24, 56, 60, 61, 62, 64; pigment violet 1, 19, 23, 27, 29, 30, 32, 37, 40, 50, and the like.
上記無機色材又は有機色材としては、公知の染料を用いることも可能である。公知の染料としては例えば、アゾ染料、アントラキノン染料、インジゴイド染料、トリアリールメタン染料、キサンテン染料、アリザリン染料、アクリジン染料スチルベン染料、チアゾール染料、ナフトール染料、キノリン染料、ニトロ染料、インダミン染料、オキサジン染料、フタロシアニン染料、シアニン染料等の染料等が挙げられる。 As the inorganic color material or organic color material, known dyes can be used. Known dyes include, for example, azo dyes, anthraquinone dyes, indigoid dyes, triarylmethane dyes, xanthene dyes, alizarin dyes, acridine dyes stilbene dyes, thiazole dyes, naphthol dyes, quinoline dyes, nitro dyes, indamine dyes, oxazine dyes, Examples thereof include phthalocyanine dyes and cyanine dyes.
本発明の光硬化性組成物において、上記着色剤(D)の含有量は、上記光重合性不飽和化合物(A)及び(B)の合計100質量部に対して、好ましくは10〜350質量部、より好ましくは20〜250質量部である。350質量部を超えると、着色剤が凝集しやすくなり保存安定性が悪くなる。 In the photocurable composition of the present invention, the content of the colorant (D) is preferably 10 to 350 masses with respect to a total of 100 mass parts of the photopolymerizable unsaturated compounds (A) and (B). Part, more preferably 20 to 250 parts by weight. When it exceeds 350 parts by mass, the colorant tends to aggregate and storage stability is deteriorated.
本発明の光硬化性組成物には、更に分散剤を用いることができる。該分散剤としては、着色剤(D)を分散、安定化できるものであれば何でも良く、市販の分散剤、例えばビックケミー社製、BYKシリーズ等を用いることができ、塩基性官能基を有するポリエステル、ポリエーテル、ポリウレタンからなる高分子分散剤、塩基性官能基として窒素原子を有し、窒素原子を有する官能基がアミン、及び/又はその四級塩であり、アミン価が1〜100mgKOH/gのものが好適に用いられる。 A dispersant can be further used in the photocurable composition of the present invention. As the dispersant, any dispersant can be used as long as it can disperse and stabilize the colorant (D). Commercially available dispersants such as BYK series manufactured by Big Chemie can be used, and polyester having a basic functional group. , A polymer dispersant made of polyether or polyurethane, having a nitrogen atom as a basic functional group, the functional group having a nitrogen atom is an amine and / or a quaternary salt thereof, and an amine value of 1 to 100 mgKOH / g Are preferably used.
本発明の光硬化性組成物には、更に、上記一般式(2)で表される以外のエチレン性不飽和結合を有する重合性化合物を用いることができる。該エチレン性不飽和結合を有する重合性化合物としては、特に限定されず、従来、感光性組成物に用いられているものを用いることができるが、例えば、エチレン、プロピレン、ブチレン、イソブチレン、塩化ビニル、塩化ビニリデン、フッ化ビニリデン、テトラフルオロエチレン等の不飽和脂肪族炭化水素;(メタ)アクリル酸、α―クロルアクリル酸、イタコン酸、マレイン酸、シトラコン酸、フマル酸、ハイミック酸、クロトン酸、イソクロトン酸、ビニル酢酸、アリル酢酸、桂皮酸、ソルビン酸、メサコン酸、コハク酸モノ[2−(メタ)アクリロイロキシエチル]、フタル酸モノ[2−(メタ)アクリロイロキシエチル]、ω−カルボキシポリカプロラクトンモノ(メタ)アクリレート等の両末端にカルボキシ基と水酸基とを有するポリマーのモノ(メタ)アクリレート;ヒドロキシエチル(メタ)アクリレート・マレート、ヒドロキシプロピル(メタ)アクリレート・マレート、ジシクロペンタジエン・マレート或いは1個のカルボキシル基と2個以上の(メタ)アクリロイル基とを有する多官能(メタ)アクリレート等の不飽和一塩基酸;(メタ)アクリル酸−2−ヒドロキシエチル、(メタ)アクリル酸−2−ヒドロキシプロピル、(メタ)アクリル酸グリシジル、下記化合物No.A1〜No.A4、(メタ)アクリル酸メチル、 (メタ)アクリル酸ブチル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸−t−ブチル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸n−オクチル、(メタ)アクリル酸イソオクチル、(メタ)アクリル酸イソノニル、(メタ)アクリル酸ステアリル、(メタ)アクリル酸ラウリル、(メタ)アクリル酸メトキシエチル、(メタ)アクリル酸ジメチルアミノメチル、(メタ)アクリル酸ジメチルアミノエチル、(メタ)アクリル酸アミノプロピル、(メタ)アクリル酸ジメチルアミノプロピル、(メタ)アクリル酸エトキシエチル、(メタ)アクリル酸ポリ(エトキシ)エチル、(メタ)アクリル酸ブトキシエトキシエチル、(メタ)アクリル酸エチルヘキシル、(メタ)アクリル酸フェノキシエチル、(メタ)アクリル酸テトラヒドロフリル、(メタ)アクリル酸ビニル、(メタ)アクリル酸アリル、(メタ)アクリル酸ベンジル、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、プロピレングリコールジ(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、トリメチロールエタントリ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、トリシクロデカンジメチロールジ(メタ)アクリレート、トリ[(メタ)アクリロイルエチル]イソシアヌレート、ポリエステル(メタ)アクリレートオリゴマー等の不飽和一塩基酸及び多価アルコール又は多価フェノールのエステル;(メタ)アクリル酸亜鉛、(メタ)アクリル酸マグネシウム等の不飽和多塩基酸の金属塩;マレイン酸無水物、イタコン酸無水物、シトラコン酸無水物、メチルテトラヒドロ無水フタル酸、テトラヒドロ無水フタル酸、トリアルキルテトラヒドロ無水フタル酸、5−(2,5−ジオキソテトラヒドロフリル)−3−メチル−3−シクロヘキセン−1,2−ジカルボン酸無水物、トリアルキルテトラヒドロ無水フタル酸−無水マレイン酸付加物、ドデセニル無水コハク酸、無水メチルハイミック酸等の不飽和多塩基酸の酸無水物;(メタ)アクリルアミド、メチレンビス−(メタ)アクリルアミド、ジエチレントリアミントリス(メタ)アクリルアミド、キシリレンビス(メタ)アクリルアミド、α−クロロアクリルアミド、N−2−ヒドロキシエチル(メタ)アクリルアミド等の不飽和一塩基酸及び多価アミンのアミド;アクロレイン等の不飽和アルデヒド;(メタ)アクリロニトリル、α−クロロアクリロニトリル、シアン化ビニリデン、シアン化アリル等の不飽和ニトリル;スチレン、4−メチルスチレン、4−エチルスチレン、4−メトキシスチレン、4−ヒドロキシスチレン、4−クロロスチレン、ジビニルベンゼン、ビニルトルエン、ビニル安息香酸、ビニルフェノール、ビニルスルホン酸、4−ビニルベンゼンスルホン酸、ビニルベンジルメチルエーテル、ビニルベンジルグリシジルエーテル等の不飽和芳香族化合物;メチルビニルケトン等の不飽和ケトン;ビニルアミン、アリルアミン、N−ビニルピロリドン、ビニルピペリジン等の不飽和アミン化合物;アリルアルコール、クロチルアルコール等のビニルアルコール;ビニルメチルエーテル、ビニルエチルエーテル、n−ブチルビニルエーテル、イソブチルビニルエーテル、アリルグリシジルエーテル等のビニルエーテル;マレイミド、N−フェニルマレイミド、N−シクロヘキシルマレイミド等の不飽和イミド類;インデン、1−メチルインデン等のインデン類;1,3−ブタジエン、イソプレン、クロロプレン等の脂肪族共役ジエン類;ポリスチレン、ポリメチル(メタ)アクリレート、ポリ−n−ブチル(メタ)アクリレート、ポリシロキサン等の重合体分子鎖の末端にモノ(メタ)アクリロイル基を有するマクロモノマー類;ビニルクロリド、ビニリデンクロリド、ジビニルスクシナート、ジアリルフタラート、トリアリルホスファート、トリアリルイソシアヌラート、ビニルチオエーテル、ビニルイミダゾール、ビニルオキサゾリン、ビニルカルバゾール、ビニルピロリドン、ビニルピリジン、水酸基含有ビニルモノマー及びポリイソシアネート化合物のビニルウレタン化合物、水酸基含有ビニルモノマー及びポリエポキシ化合物のビニルエポキシ化合物が挙げられる。 In the photocurable composition of the present invention, a polymerizable compound having an ethylenically unsaturated bond other than that represented by the general formula (2) can be further used. The polymerizable compound having an ethylenically unsaturated bond is not particularly limited, and those conventionally used in photosensitive compositions can be used. For example, ethylene, propylene, butylene, isobutylene, vinyl chloride can be used. , Unsaturated aliphatic hydrocarbons such as vinylidene chloride, vinylidene fluoride, tetrafluoroethylene; (meth) acrylic acid, α-chloroacrylic acid, itaconic acid, maleic acid, citraconic acid, fumaric acid, hymic acid, crotonic acid, Isocrotonic acid, vinyl acetate, allyl acetate, cinnamic acid, sorbic acid, mesaconic acid, succinic acid mono [2- (meth) acryloyloxyethyl], phthalic acid mono [2- (meth) acryloyloxyethyl], ω- A carboxypolycaprolactone mono (meth) acrylate, etc. having a carboxy group and a hydroxyl group at both ends Mer mono (meth) acrylates; having hydroxyethyl (meth) acrylate malate, hydroxypropyl (meth) acrylate malate, dicyclopentadiene malate or one carboxyl group and two or more (meth) acryloyl groups Unsaturated monobasic acids such as polyfunctional (meth) acrylates; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, the following compound No. A1-No. A4, methyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, (t-butyl) (meth) acrylate, cyclohexyl (meth) acrylate, n-octyl (meth) acrylate, ( Isooctyl (meth) acrylate, isononyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, methoxyethyl (meth) acrylate, dimethylaminomethyl (meth) acrylate, dimethyl (meth) acrylate Aminoethyl, aminopropyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, ethoxyethyl (meth) acrylate, poly (ethoxy) ethyl (meth) acrylate, butoxyethoxyethyl (meth) acrylate, (meta ) Ethylhexyl acrylate, (meth) acrylic acid Phenoxyethyl, tetrahydrofuryl (meth) acrylate, vinyl (meth) acrylate, allyl (meth) acrylate, benzyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol Di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylolethanetri (Meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol Unsaturated monobasic acids such as tra (meth) acrylate, pentaerythritol tri (meth) acrylate, tricyclodecane dimethylol di (meth) acrylate, tri [(meth) acryloylethyl] isocyanurate, polyester (meth) acrylate oligomers and the like Esters of polyhydric alcohols or polyphenols; metal salts of unsaturated polybasic acids such as zinc (meth) acrylate and magnesium (meth) acrylate; maleic anhydride, itaconic anhydride, citraconic anhydride, methyl Tetrahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydro Phthalic anhydride-anhydrous Acid anhydrides of unsaturated polybasic acids such as rain acid adducts, dodecenyl succinic anhydride, methyl hymic anhydride; (meth) acrylamide, methylene bis- (meth) acrylamide, diethylenetriamine tris (meth) acrylamide, xylylene bis (meth) Unsaturated monobasic acids such as acrylamide, α-chloroacrylamide, N-2-hydroxyethyl (meth) acrylamide and amides of polyvalent amines; unsaturated aldehydes such as acrolein; (meth) acrylonitrile, α-chloroacrylonitrile, cyanide Unsaturated nitriles such as vinylidene and allyl cyanide; styrene, 4-methylstyrene, 4-ethylstyrene, 4-methoxystyrene, 4-hydroxystyrene, 4-chlorostyrene, divinylbenzene, vinyltoluene, vinylbenzoic acid, vinyl Unsaturated aromatic compounds such as ruphenol, vinyl sulfonic acid, 4-vinylbenzene sulfonic acid, vinyl benzyl methyl ether, vinyl benzyl glycidyl ether; unsaturated ketones such as methyl vinyl ketone; vinyl amine, allyl amine, N-vinyl pyrrolidone, vinyl Unsaturated amine compounds such as piperidine; vinyl alcohols such as allyl alcohol and crotyl alcohol; vinyl ethers such as vinyl methyl ether, vinyl ethyl ether, n-butyl vinyl ether, isobutyl vinyl ether, allyl glycidyl ether; maleimide, N-phenylmaleimide, N -Unsaturated imides such as cyclohexylmaleimide; Indenes such as indene and 1-methylindene; Aliphatic conjugated dienes such as 1,3-butadiene, isoprene and chloroprene Macromolecules having a mono (meth) acryloyl group at the end of a polymer molecular chain such as polystyrene, polymethyl (meth) acrylate, poly-n-butyl (meth) acrylate, polysiloxane, etc .; vinyl chloride, vinylidene chloride, divinyls Cuccinate, diallyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl thioether, vinyl imidazole, vinyl oxazoline, vinyl carbazole, vinyl pyrrolidone, vinyl pyridine, hydroxyl group-containing vinyl monomers and vinyl isocyanate compounds of polyisocyanate compounds, hydroxyl groups Examples thereof include vinyl monomers containing vinyl monomers and polyepoxy compounds.
また、上記エチレン性不飽和結合を有する重合性化合物としては、アクリル酸エステルの共重合体や、フェノール及び/又はクレゾールノボラックエポキシ樹脂、多官能エポキシ基を有するポリフェニルメタン型エポキシ樹脂を用いることもできる。 In addition, as the polymerizable compound having an ethylenically unsaturated bond, an acrylic ester copolymer, a phenol and / or cresol novolac epoxy resin, or a polyphenylmethane type epoxy resin having a polyfunctional epoxy group may be used. it can.
上記エチレン性不飽和結合を有する重合性化合物の中でも、酸価を有する化合物を用いた場合、本発明の光硬化性組成物にアルカリ現像性を付与することができる。上記酸価を有する化合物を用いる場合、その使用量は上記エチレン性不飽和結合を有する重合性化合物全体の50〜99質量%となるようにすることが好ましい。
また、上記酸価を有する化合物は、更に単官能又は多官能エポキシ化合物を反応させることにより酸価を調整してから用いることもできる。上記酸価を有する化合物の酸価を調整することにより、光硬化性組成物のアルカリ現像性を改良することができる。上記酸価を有する化合物(即ちアルカリ現像性を付与するエチレン性不飽和結合を有する重合性化合物)は、固形分の酸価が5〜120mgKOH/gの範囲であることが好ましく、単官能又は多官能エポキシ化合物の使用量は、上記酸価を満たすように選択するのが好ましい。
Among the polymerizable compounds having an ethylenically unsaturated bond, when a compound having an acid value is used, alkali developability can be imparted to the photocurable composition of the present invention. When using the compound which has the said acid value, it is preferable to make the usage-amount become 50-99 mass% of the whole polymeric compound which has the said ethylenically unsaturated bond.
The compound having the acid value can be used after adjusting the acid value by further reacting with a monofunctional or polyfunctional epoxy compound. By adjusting the acid value of the compound having an acid value, the alkali developability of the photocurable composition can be improved. The compound having an acid value (that is, a polymerizable compound having an ethylenically unsaturated bond imparting alkali developability) preferably has a solid content acid value in the range of 5 to 120 mgKOH / g, and is monofunctional or polyfunctional. The amount of the functional epoxy compound used is preferably selected so as to satisfy the acid value.
上記単官能エポキシ化合物としては、グリシジルメタクリレート、メチルグリシジルエーテル、エチルグリシジルエーテル、プロピルグリシジルエーテル、イソプロピルグリシジルエーテル、ブチルグリシジルエーテル、イソブチルグリシジルエーテル、t−ブチルグリシジルエーテル、ペンチルグリシジルエーテル、ヘキシルグリシジルエーテル、ヘプチルグリシジルエーテル、オクチルグリシジルエーテル、ノニルグリシジルエーテル、デシルグリシジルエーテル、ウンデシルグリシジルエーテル、ドデシルグリシジルエーテル、トリデシルグリシジルエーテル、テトラデシルグリシジルエーテル、ペンタデシルグリシジルエーテル、ヘキサデシルグリシジルエーテル、2−エチルヘキシルグリシジルエーテル、アリルグリシジルエーテル、プロパルギルグリシジルエーテル、p−メトキシエチルグリシジルエーテル、フェニルグリシジルエーテル、p−メトキシグリシジルエーテル、p−ブチルフェノールグリシジルエーテル、クレジルグリシジルエーテル、2−メチルクレジルグリシジルエーテル、4−ノニルフェニルグリシジルエーテル、ベンジルグリシジルエーテル、p−クミルフェニルグリシジルエーテル、トリチルグリシジルエーテル、2,3−エポキシプロピルメタクリレート、エポキシ化大豆油、エポキシ化アマニ油、グリシジルブチレート、ビニルシクロヘキサンモノオキシド、1,2−エポキシ−4−ビニルシクロヘキサン、スチレンオキシド、ピネンオキシド、メチルスチレンオキシド、シクロヘキセンオキシド、プロピレンオキシド、上記化合物No.A2、No.A3等が挙げられる。 Examples of the monofunctional epoxy compound include glycidyl methacrylate, methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, isopropyl glycidyl ether, butyl glycidyl ether, isobutyl glycidyl ether, t-butyl glycidyl ether, pentyl glycidyl ether, hexyl glycidyl ether, heptyl. Glycidyl ether, octyl glycidyl ether, nonyl glycidyl ether, decyl glycidyl ether, undecyl glycidyl ether, dodecyl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadecyl glycidyl ether, hexadecyl glycidyl ether, 2-ethylhexyl glycidyl ether, Allyl glycidylate , Propargyl glycidyl ether, p-methoxyethyl glycidyl ether, phenyl glycidyl ether, p-methoxy glycidyl ether, p-butylphenol glycidyl ether, cresyl glycidyl ether, 2-methyl cresyl glycidyl ether, 4-nonylphenyl glycidyl ether, benzyl glycidyl Ether, p-cumylphenyl glycidyl ether, trityl glycidyl ether, 2,3-epoxypropyl methacrylate, epoxidized soybean oil, epoxidized linseed oil, glycidyl butyrate, vinylcyclohexane monooxide, 1,2-epoxy-4-vinyl Cyclohexane, styrene oxide, pinene oxide, methyl styrene oxide, cyclohexene oxide, propylene oxide, the above-mentioned compound no. A2, No. A3 etc. are mentioned.
上記多官能エポキシ化合物としては、ビスフェノール型エポキシ化合物及びグリシジルエーテル類からなる群から選択される一種以上の化合物を用いると、特性の一層良好な光硬化性組成物を得ることができるので好ましい。
上記ビスフェノール型エポキシ化合物としては、上記一般式(1)で表されるエポキシ化合物を用いることができる他、例えば、水添ビスフェノール型エポキシ化合物等のビスフェノール型エポキシ化合物も用いることができる。
また上記グリシジルエーテル類としては、エチレングリコールジグリシジルエーテル、プロピレングリコールジグリシジルエーテル、1,4−ブタンジオールジグリシジルエーテル、1,6−ヘキサンジオールジグリシジルエーテル、1,8−オクタンジオールジグリシジルエーテル、1,10−デカンジオールジグリシジルエーテル、2,2−ジメチル−1,3−プロパンジオールジグリシジルエーテル、ジエチレングリコールジグリシジルエーテル、トリエチレングリコールジグリシジルエーテル、テトラエチレングリコールジグリシジルエーテル、ヘキサエチレングリコールジグリシジルエーテル、1,4−シクロヘキサンジメタノールジグリシジルエーテル、1,1,1−トリ(グリシジルオキシメチル)プロパン、1,1,1−トリ(グリシジルオキシメチル)エタン、1,1,1−トリ(グリシジルオキシメチル)メタン、1,1,1,1−テトラ(グリシジルオキシメチル)メタン等を用いることができる。
その他、フェノールノボラック型エポキシ化合物、ビフェニルノボラック型エポキシ化合物、クレゾールノボラック型エポキシ化合物、ビスフェノールAノボラック型エポキシ化合物、ジシクロペンタジエンノボラック型エポキシ化合物等のノボラック型エポキシ化合物;3,4−エポキシ−6−メチルシクロヘキシルメチル−3,4−エポキシ−6−メチルシクロヘキサンカルボキシレート、3,4−エポキシシクロヘキシルメチル−3,4−エポキシシクロヘキサンカルボキシレート、1−エポキシエチル−3,4−エポキシシクロヘキサン等の脂環式エポキシ化合物;フタル酸ジグリシジルエステル、テトラヒドロフタル酸ジグリシジルエステル、ダイマー酸グリシジルエステル等のグリシジルエステル類;テトラグリシジルジアミノジフェニルメタン、トリグリシジルP−アミノフェノール、N,N−ジグリシジルアニリン等のグリシジルアミン類;1,3−ジグリシジル−5,5−ジメチルヒダントイン、トリグリシジルイソシアヌレート等の複素環式エポキシ化合物;ジシクロペンタジエンジオキシド等のジオキシド化合物;ナフタレン型エポキシ化合物;トリフェニルメタン型エポキシ化合物;ジシクロペンタジエン型エポキシ化合物等を用いることもできる。
As the polyfunctional epoxy compound, it is preferable to use one or more compounds selected from the group consisting of bisphenol-type epoxy compounds and glycidyl ethers because a photocurable composition with better characteristics can be obtained.
As said bisphenol-type epoxy compound, the epoxy compound represented by the said General formula (1) can be used, For example, bisphenol-type epoxy compounds, such as a hydrogenated bisphenol-type epoxy compound, can also be used.
Examples of the glycidyl ethers include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1,8-octanediol diglycidyl ether, 1,10-decanediol diglycidyl ether, 2,2-dimethyl-1,3-propanediol diglycidyl ether, diethylene glycol diglycidyl ether, triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, hexaethylene glycol diglycidyl Ether, 1,4-cyclohexanedimethanol diglycidyl ether, 1,1,1-tri (glycidyloxymethyl) propane, 1,1,1-to (Glycidyloxymethyl) ethane, 1,1,1-tri (glycidyloxymethyl) methane, 1,1,1,1- tetra (glycidyloxymethyl) can be used such as methane.
Other novolac epoxy compounds such as phenol novolac epoxy compounds, biphenyl novolac epoxy compounds, cresol novolac epoxy compounds, bisphenol A novolac epoxy compounds, dicyclopentadiene novolac epoxy compounds; 3,4-epoxy-6-methyl Cycloaliphatic epoxies such as cyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 1-epoxyethyl-3,4-epoxycyclohexane Compound: Glycidyl esters such as diglycidyl phthalate, diglycidyl tetrahydrophthalate, glycidyl dimer, tetraglycidyl diamino Glycidylamines such as phenylmethane, triglycidyl P-aminophenol and N, N-diglycidylaniline; heterocyclic epoxy compounds such as 1,3-diglycidyl-5,5-dimethylhydantoin and triglycidyl isocyanurate; Dioxide compounds such as pentadiene dioxide; naphthalene type epoxy compounds; triphenylmethane type epoxy compounds; dicyclopentadiene type epoxy compounds can also be used.
また、本発明の光硬化性組成物は、エチレン性不飽和結合を有さず、アルカリ現像性を付与する化合物を含有してもよく、そのような化合物としては、酸価を有することでアルカリ水溶液に可溶な化合物であれば特に限定されないが、代表的なものとしてアルカリ可溶性ノボラック樹脂(以下、単に「ノボラック樹脂」という)が挙げられる。ノボラック樹脂は、フェノール類とアルデヒド類とを酸触媒の存在下に重縮合して得られる。 In addition, the photocurable composition of the present invention may contain a compound that does not have an ethylenically unsaturated bond and imparts alkali developability. The compound is not particularly limited as long as it is a compound that is soluble in an aqueous solution, but a typical example is an alkali-soluble novolak resin (hereinafter simply referred to as “novolak resin”). The novolak resin is obtained by polycondensation of phenols and aldehydes in the presence of an acid catalyst.
上記フェノール類としては、例えばフェノール、o−クレゾール、m−クレゾール、p−クレゾール、o−エチルフェノール、m−エチルフェノール、p−エチルフェノール、o−ブチルフェノール、m−ブチルフェノール、p−ブチルフェノール、2,3−キシレノール、2,4−キシレノール、2,5−キシレノール、3,4−キシレノール、3,5−キシレノール、2,3,5−トリメチルフェノール、p−フェニルフェノール、ヒドロキノン、カテコール、レゾルシノール、2−メチルレゾルシノール、ピロガロール、α−ナフトール、ビスフェノールA、ジヒドロキシ安息香酸エステル、没食子酸エステル等が用いられ、これらのフェノール類のうちフェノール、o−クレゾール、m−クレゾール、p−クレゾール、2,5−キシレノール、3,5−キシレノール、2,3,5−トリメチルフェノール、レゾルシノール、2−メチルレゾルシノール及びビスフェノールAが好ましい。これらのフェノール類は、単独で又は2種以上混合して用いられる。 Examples of the phenols include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, p-butylphenol, 2, 3-xylenol, 2,4-xylenol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol, 2,3,5-trimethylphenol, p-phenylphenol, hydroquinone, catechol, resorcinol, 2- Methyl resorcinol, pyrogallol, α-naphthol, bisphenol A, dihydroxybenzoic acid ester, gallic acid ester and the like are used. Among these phenols, phenol, o-cresol, m-cresol, p-cresol, 2,5-xy Nord, 3,5-xylenol, 2,3,5-trimethylphenol, resorcinol, 2-methyl resorcinol and bisphenol A are preferred. These phenols are used alone or in combination of two or more.
上記アルデヒド類としては、例えばホルムアルデヒド、パラホルムアルデヒド、アセトアルデヒド、プロピルアルデヒド、ベンズアルデヒド、フェニルアセトアルデヒド、α−フェニルプロピルアルデヒド、β−フェニルプロピルアルデヒド、o−ヒドロキシベンズアルデヒド、m−ヒドロキシベンズアルデヒド、p−ヒドロキシベンズアルデヒド、o−クロロベンズアルデヒド、m−クロロベンズアルデヒド、p−クロロベンズアルデヒド、o−ニトロベンズアルデヒド、m−ニトロベンズアルデヒド、p−ニトロベンズアルデヒド、o−メチルベンズアルデヒド、m−メチルベンズアルデヒド、p−メチルベンズアルデヒド、p−エチルベンズアルデヒド、p−n−ブチルベンズアルデヒド等が用いられ、これらの化合物のうちホルムアルデヒド、アセトアルデヒド及びベンズアルデヒドが好ましい。これらのアルデヒド類は、単独で又は2種以上混合して用いられる。アルデヒド類はフェノール類1モル当たり、好ましくは0.7〜3モル、特に好ましくは0.7〜2モルの割合で使用される。 Examples of the aldehydes include formaldehyde, paraformaldehyde, acetaldehyde, propylaldehyde, benzaldehyde, phenylacetaldehyde, α-phenylpropylaldehyde, β-phenylpropylaldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, o -Chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-nitrobenzaldehyde, m-nitrobenzaldehyde, p-nitrobenzaldehyde, o-methylbenzaldehyde, m-methylbenzaldehyde, p-methylbenzaldehyde, p-ethylbenzaldehyde, p N-butylbenzaldehyde and the like are used, and among these compounds, formal Dehydr, acetaldehyde and benzaldehyde are preferred. These aldehydes may be used alone or in combination of two or more. Aldehydes are preferably used in a proportion of 0.7 to 3 mol, particularly preferably 0.7 to 2 mol, per mol of phenol.
上記酸触媒としては、例えば塩酸、硝酸、硫酸等の無機酸、又は蟻酸、蓚酸、酢酸等の有機酸が用いられる。これらの酸触媒の使用量は、フェノール類1モル当たり、1×10-4〜5×10-1モルが好ましい。縮合反応においては、通常、反応媒質として水が用いられるが、縮合反応に用いられるフェノール類がアルデヒド類の水溶液に溶解せず、反応初期から不均一系になる場合には、反応媒質として親水性溶媒を使用することもできる。これらの親水性溶媒としては、例えばメタノール、エタノール、プロパノール、ブタノール等のアルコール類、又はテトラヒドロフラン、ジオキサン等の環状エーテル類が挙げられる。これらの反応媒質の使用量は、通常、反応原料100質量部当たり、20〜1000質量部である。縮合反応の反応温度は、反応原料の反応性に応じて適宜調整することができるが、通常、10〜200℃、好ましくは70〜150℃である。縮合反応終了後、系内に存在する未反応原料、酸触媒及び反応媒質を除去するため、一般的には内温を130〜230℃に上昇させ、減圧下に揮撥分を留去し、次いで熔融したノボラック樹脂をスチール製ベルト等の上に流涎して回収する。
また縮合反応終了後に、前記親水性溶媒に反応混合物を溶解し、水、n−ヘキサン、n−ヘプタン等の沈殿剤に添加することにより、ノボラック樹脂を析出させ、析出物を分離し、加熱乾燥することにより回収することもできる。
Examples of the acid catalyst include inorganic acids such as hydrochloric acid, nitric acid, and sulfuric acid, or organic acids such as formic acid, oxalic acid, and acetic acid. The amount of these acid catalysts used is preferably 1 × 10 −4 to 5 × 10 −1 mol per mol of phenols. In the condensation reaction, water is usually used as a reaction medium. However, if the phenols used in the condensation reaction do not dissolve in an aqueous solution of aldehydes and become heterogeneous from the beginning of the reaction, the reaction medium is hydrophilic. A solvent can also be used. Examples of these hydrophilic solvents include alcohols such as methanol, ethanol, propanol and butanol, and cyclic ethers such as tetrahydrofuran and dioxane. The amount of these reaction media used is usually 20 to 1000 parts by mass per 100 parts by mass of the reaction raw material. Although the reaction temperature of a condensation reaction can be suitably adjusted according to the reactivity of a reaction raw material, it is 10-200 degreeC normally, Preferably it is 70-150 degreeC. After completion of the condensation reaction, in order to remove unreacted raw materials, acid catalyst and reaction medium present in the system, the internal temperature is generally raised to 130 to 230 ° C., and the volatile component is distilled off under reduced pressure. Next, the melted novolac resin is collected on a steel belt or the like.
After completion of the condensation reaction, the reaction mixture is dissolved in the hydrophilic solvent and added to a precipitating agent such as water, n-hexane or n-heptane to precipitate a novolak resin, and the precipitate is separated and dried by heating. It can also be recovered by doing so.
上記ノボラック樹脂以外の例としては、ポリヒドロキシスチレン又はその誘導体、スチレン−無水マレイン酸共重合体、ポリビニルヒドロキシベンゾエート等が挙げられる。 Examples other than the novolak resin include polyhydroxystyrene or a derivative thereof, styrene-maleic anhydride copolymer, polyvinylhydroxybenzoate, and the like.
本発明の光硬化性組成物には、更にシランカップリング剤を用いることができる。該シランカップリング剤としては、例えば、ジメチルジメトキシシラン、ジメチルジエトキシシラン、メチルエチルジメトキシシラン、メチルエチルジエトキシシラン、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリメトキシシラン、エチルトリメトキシシラン等のアルキル官能性アルコキシシラン、ビニルトリクロロシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、アリルトリメトキシシラン等のアルケニル官能性アルコキシシラン、3−メタクリロキシプロピルトリエトキシシラン、3−メタクリロキシプロピルトリメトキシシラン、3−メタクリロキシプロピルメチルジエトキシシラン、3−メタクリロキシプロピルメチルジメトキシシラン、2−メタクリロキシプロピルトリメトキシシラン等の(メタ)アクリル酸エステル官能性アルコキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルメチルジエトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−(3,4−エポキシシクロヘキシル)プロピルトリメトキシシラン等のエポキシ官能性アルコキシシラン、N−β(アミノエチル)−γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、N−フェニル−γ −アミノプロピルトリメトキシシラン等のアミノ官能性アルコキシシラン、γ−メルカプトプロピルトリメトキシシラン等のメルカプト官能性アルコキシシラン、チタンテトライソプロポキシド、チタンテトラノルマルブトキシド等のチタンアルコキシド類、チタンジオクチロキシビス(オクチレングリコレート)、チタンジイソプロポキシビス(エチルアセトアセテート)等のチタンキレート類、ジルコニウムテトラアセチルアセトネート、ジルコニウムトリブトキシモノアセチルアセトネート等のジルコニウムキレート類、ジルコニウムトリブトキシモノステアレート等のジルコニウムアシレート類、メチルトリイソシアネートシラン等のイソシアネートシラン類等を用いることができ、特に、アルキル官能性アルコキシシラン、エポキシ官能性アルコキシシラン、イソシアネートシランが、耐湿熱試験における密着性が高いので好ましい。 A silane coupling agent can be further used in the photocurable composition of the present invention. Examples of the silane coupling agent include dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, and ethyltrimethoxysilane. Alkyl-functional alkoxysilanes, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane and other alkenyl-functional alkoxysilanes, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane , 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethoxysilane, etc. (Meth) acrylic acid ester functional alkoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- ( Epoxy-functional alkoxysilanes such as 3,4-epoxycyclohexyl) propyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-amino Amino-functional alkoxysilanes such as propyltrimethoxysilane, mercaptofunctional alkoxysilanes such as γ-mercaptopropyltrimethoxysilane, titanium alkoxides such as titanium tetraisopropoxide, titanium tetranormal butoxide, titanium dioctyro Titanium chelates such as cibis (octylene glycolate) and titanium diisopropoxybis (ethyl acetoacetate), zirconium chelates such as zirconium tetraacetylacetonate and zirconium tributoxymonoacetylacetonate, zirconium tributoxy monostearate, etc. Zirconium acylates, isocyanate silanes such as methyl triisocyanate silane, etc. can be used, and in particular, alkyl functional alkoxy silane, epoxy functional alkoxy silane, and isocyanate silane are preferable because of high adhesion in a heat and humidity test. .
上記シランカップリング剤の使用量は、特に限定されないが、好ましくは、光硬化性組成物中の固形物の全量100質量部に対して、1〜20質量部の範囲である。 Although the usage-amount of the said silane coupling agent is not specifically limited, Preferably, it is the range of 1-20 mass parts with respect to 100 mass parts of whole quantity of the solid substance in a photocurable composition.
本発明の光硬化性組成物には、更に溶媒を加えることができる。該溶媒としては、通常、必要に応じて上記の各成分(本発明の光重合性不飽和化合物(A)及び(B)、光重合開始剤(C)、着色剤(D)等)を溶解又は分散しえる溶媒、例えば、メチルエチルケトン、メチルアミルケトン、ジエチルケトン、アセトン、メチルイソプロピルケトン、メチルイソブチルケトン、シクロヘキサノン、2−ヘプタノン等のケトン類;エチルエーテル、ジオキサン、テトラヒドロフラン、1,2−ジメトキシエタン、1,2−ジエトキシエタン、ジプロピレングリコールジメチルエーテル等のエーテル系溶媒;酢酸メチル、酢酸エチル、酢酸−n−プロピル、酢酸イソプロピル、酢酸n−ブチル、酢酸シクロヘキシル、乳酸エチル、コハク酸ジメチル、テキサノール等のエステル系溶媒;エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル等のセロソルブ系溶媒;メタノール、エタノール、イソ−又はn−プロパノール、イソ−又はn−ブタノール、アミルアルコール等のアルコール系溶媒;エチレングリコールモノメチルアセテート、エチレングリコールモノエチルアセテート、プロピレングリコール−1−モノメチルエーテル−2−アセテート(PGMEA)、ジプロピレングリコールモノメチルエーテルアセテート、3−メトキシブチルアセテート、エトキシエチルプロピオネート等のエーテルエステル系溶媒;ベンゼン、トルエン、キシレン等のBTX系溶媒;ヘキサン、ヘプタン、オクタン、シクロヘキサン等の脂肪族炭化水素系溶媒;テレピン油、D−リモネン、ピネン等のテルペン系炭化水素油;ミネラルスピリット、スワゾール#310(コスモ松山石油(株))、ソルベッソ#100(エクソン化学(株))等のパラフィン系溶媒;四塩化炭素、クロロホルム、トリクロロエチレン、塩化メチレン、1,2−ジクロロエタン等のハロゲン化脂肪族炭化水素系溶媒;クロロベンゼン等のハロゲン化芳香族炭化水素系溶媒;カルビトール系溶媒、アニリン、トリエチルアミン、ピリジン、酢酸、アセトニトリル、二硫化炭素、N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、N−メチルピロリドン、ジメチルスルホキシド、水等が挙げられ、これらの溶媒は1種又は2種以上の混合溶媒として使用することができる。これらの中でもケトン類、エーテルエステル系溶媒等、特にプロピレングリコール−1−モノメチルエーテル−2−アセテート(PGMEA)、シクロヘキサノン等が、着色組成物においてレジストと光重合開始剤の相溶性がよいので好ましい。 A solvent can be further added to the photocurable composition of the present invention. As the solvent, the above components (photopolymerizable unsaturated compounds (A) and (B) of the present invention, photopolymerization initiator (C), colorant (D), etc.) are usually dissolved as necessary. Or dispersible solvents such as ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, 2-heptanone; ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane Ether solvents such as 1,2-diethoxyethane and dipropylene glycol dimethyl ether; methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, texanol Ester solvents such as ethylene glycol mono Cellosolve solvents such as tilether, ethylene glycol monoethyl ether; alcohol solvents such as methanol, ethanol, iso- or n-propanol, iso- or n-butanol, amyl alcohol; ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, Ether ester solvents such as propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate and ethoxyethyl propionate; BTX solvents such as benzene, toluene and xylene Aliphatic hydrocarbon solvents such as hexane, heptane, octane and cyclohexane; terpene hydrocarbon oils such as turpentine oil, D-limonene and pinene; minerals Paraffin solvents such as Pirit, Swazol # 310 (Cosmo Matsuyama Oil Co., Ltd.), Solvesso # 100 (Exxon Chemical Co., Ltd.); Halogenation of carbon tetrachloride, chloroform, trichloroethylene, methylene chloride, 1,2-dichloroethane, etc. Aliphatic hydrocarbon solvents; halogenated aromatic hydrocarbon solvents such as chlorobenzene; carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N-dimethylformamide, N, N-dimethyl Examples include acetamide, N-methylpyrrolidone, dimethyl sulfoxide, water, and the like, and these solvents can be used as one or a mixture of two or more. Among these, ketones, ether ester solvents and the like, particularly propylene glycol-1-monomethyl ether-2-acetate (PGMEA), cyclohexanone, and the like are preferable because the compatibility of the resist and the photopolymerization initiator in the colored composition is good.
本発明の光硬化性組成物において、上記溶媒の使用量は、溶媒以外の組成物の濃度が5〜30質量%になることが好ましく、5質量%より小さい場合、膜厚を厚くする事が困難であり所望の波長光を十分に吸収できないため好ましくなく、30質量%を超える場合、組成物の析出による組成物の保存性が低下したり、粘度が向上したりするためハンドリングが低下するため好ましくない。 In the photocurable composition of the present invention, the amount of the solvent used is preferably such that the concentration of the composition other than the solvent is 5 to 30% by mass, and if it is less than 5% by mass, the film thickness may be increased. It is difficult and is not preferable because it cannot sufficiently absorb light of a desired wavelength. When it exceeds 30% by mass, the storage stability of the composition due to the precipitation of the composition is reduced, and the handling is reduced because the viscosity is improved. It is not preferable.
本発明の光硬化性組成物には、更に無機化合物を含有させることができる。該無機化合物としては、例えば、酸化ニッケル、酸化鉄、酸化イリジウム、酸化チタン、酸化亜鉛、酸化マグネシウム、酸化カルシウム、酸化カリウム、シリカ、アルミナ等の金属酸化物;層状粘土鉱物、ミロリブルー、炭酸カルシウム、炭酸マグネシウム、コバルト系、マンガン系、ガラス粉末、マイカ、タルク、カオリン、フェロシアン化物、各種金属硫酸塩、硫化物、セレン化物、アルミニウムシリケート、カルシウムシリケート、水酸化アルミニウム、白金、金、銀、銅等が挙げられ、これらの中でも、酸化チタン、シリカ、層状粘土鉱物、銀等が好ましい。本発明の光硬化性組成物において、無機化合物の含有量は、上記光重合性不飽和化合物(A)及び(B)の合計100質量部に対して、好ましくは0.1〜50質量部、より好ましくは0.5〜20質量部であり、これらの無機化合物は1種又は2種以上を使用することができる。 The photocurable composition of the present invention can further contain an inorganic compound. Examples of the inorganic compound include metal oxides such as nickel oxide, iron oxide, iridium oxide, titanium oxide, zinc oxide, magnesium oxide, calcium oxide, potassium oxide, silica, and alumina; lamellar clay mineral, miloli blue, calcium carbonate, Magnesium carbonate, cobalt, manganese, glass powder, mica, talc, kaolin, ferrocyanide, various metal sulfates, sulfides, selenides, aluminum silicate, calcium silicate, aluminum hydroxide, platinum, gold, silver, copper Among these, titanium oxide, silica, layered clay mineral, silver and the like are preferable. In the photocurable composition of the present invention, the content of the inorganic compound is preferably 0.1 to 50 parts by mass with respect to a total of 100 parts by mass of the photopolymerizable unsaturated compounds (A) and (B). More preferably, it is 0.5-20 mass parts, and these inorganic compounds can use 1 type (s) or 2 or more types.
本発明の光硬化性組成物に無機化合物を含有させることで、感光性ペースト組成物として用いることができる。該感光性ペースト組成物は、プラズマディスプレイパネルの隔壁パターン、誘電体パターン、電極パターン及びブラックマトリックスパターン等の焼成物パターンを形成するために用いられる。
また、これら無機化合物は、例えば、充填剤、反射防止剤、導電剤、安定剤、難燃剤、機械的強度向上剤、特殊波長吸収剤、撥インク剤等としても好適に用いられる。
By containing an inorganic compound in the photocurable composition of the present invention, it can be used as a photosensitive paste composition. The photosensitive paste composition is used to form a fired product pattern such as a partition pattern, a dielectric pattern, an electrode pattern, and a black matrix pattern of a plasma display panel.
These inorganic compounds are also suitably used as, for example, fillers, antireflection agents, conductive agents, stabilizers, flame retardants, mechanical strength improvers, special wavelength absorbers, ink repellents, and the like.
また、本発明の光硬化性組成物には、必要に応じて、p−アニソール、ハイドロキノン、ピロカテコール、t−ブチルカテコール、フェノチアジン等の熱重合抑制剤;可塑剤;接着促進剤;充填剤;消泡剤;レベリング剤;表面調整剤;酸化防止剤;紫外線吸収剤;分散助剤;凝集防止剤;触媒;効果促進剤;架橋剤;増粘剤等の慣用の添加物を加えることができる。 In addition, the photocurable composition of the present invention includes, if necessary, a thermal polymerization inhibitor such as p-anisole, hydroquinone, pyrocatechol, t-butylcatechol, phenothiazine; a plasticizer; an adhesion promoter; a filler; Conventional additives such as an antifoaming agent, a leveling agent, a surface conditioner, an antioxidant, an ultraviolet absorber, a dispersion aid, a coagulation inhibitor, a catalyst, an effect promoter, a crosslinking agent, and a thickener can be added. .
本発明の光硬化性組成物において、光重合性不飽和化合物(A)及び(B)、光重合開始剤(C)、着色剤(D)以外の任意成分(但し、溶媒は除く)の含有量は、その使用目的に応じて適宜選択され特に制限されないが、好ましくは、上記光重合性不飽和化合物(A)及び(B)の合計100質量部に対して合計で50質量部以下とする。 In the photocurable composition of the present invention, the inclusion of optional components other than the photopolymerizable unsaturated compounds (A) and (B), the photopolymerization initiator (C), and the colorant (D) (excluding the solvent) The amount is appropriately selected according to the purpose of use and is not particularly limited, but is preferably 50 parts by mass or less in total with respect to 100 parts by mass in total of the photopolymerizable unsaturated compounds (A) and (B). .
本発明の光硬化性組成物には、更に、連鎖移動剤、増感剤、界面活性剤、メラミン化合物等を併用することができる。 Further, a chain transfer agent, a sensitizer, a surfactant, a melamine compound and the like can be used in combination with the photocurable composition of the present invention.
上記連鎖移動剤、増感剤としては、一般的に硫黄原子含有化合物が用いられる。例えばチオグリコール酸、チオリンゴ酸、チオサリチル酸、2−メルカプトプロピオン酸、3−メルカプトプロピオン酸、3−メルカプト酪酸、N−(2−メルカプトプロピオニル)グリシン、2−メルカプトニコチン酸、3−[N−(2−メルカプトエチル)カルバモイル]プロピオン酸、3−[N−(2−メルカプトエチル)アミノ]プロピオン酸、N−(3−メルカプトプロピオニル)アラニン、2−メルカプトエタンスルホン酸、3−メルカプトプロパンスルホン酸、4−メルカプトブタンスルホン酸、ドデシル(4−メチルチオ)フェニルエーテル、2−メルカプトエタノール、3−メルカプト−1,2−プロパンジオール、1−メルカプト−2−プロパノール、3−メルカプト−2−ブタノール、メルカプトフェノール、2−メルカプトエチルアミン、2−メルカプトイミダゾール、2−メルカプトベンゾイミダゾール、2−メルカプト−3−ピリジノール、2−メルカプトベンゾチアゾール、メルカプト酢酸、トリメチロールプロパントリス(3−メルカプトプロピオネート)、ペンタエリスリトールテトラキス(3−メルカプトプロピオネート)等のメルカプト化合物、該メルカプト化合物を酸化して得られるジスルフィド化合物、ヨード酢酸、ヨードプロピオン酸、2−ヨードエタノール、2−ヨードエタンスルホン酸、3−ヨードプロパンスルホン酸等のヨード化アルキル化合物、トリメチロールプロパントリス(3−メルカプトイソブチレート)、ブタンジオールビス(3−メルカプトイソブチレート)、ヘキサンジチオール、デカンジチオール、1,4−ジメチルメルカプトベンゼン、ブタンジオールビスチオプロピオネート、ブタンジオールビスチオグリコレート、エチレングリコールビスチオグリコレート、トリメチロールプロパントリスチオグリコレート、ブタンジオールビスチオプロピオネート、トリメチロールプロパントリスチオプロピオネート、トリメチロールプロパントリスチオグリコレート、ペンタエリスリトールテトラキスチオプロピオネート、ペンタエリスリトールテトラキスチオグリコレート、トリスヒドロキシエチルトリスチオプロピオネート、下記化合物No.C1、昭和電工社製カレンズPE1、NR1等が挙げられる。 As the chain transfer agent and sensitizer, a sulfur atom-containing compound is generally used. For example, thioglycolic acid, thiomalic acid, thiosalicylic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, N- (2-mercaptopropionyl) glycine, 2-mercaptonicotinic acid, 3- [N- ( 2-mercaptoethyl) carbamoyl] propionic acid, 3- [N- (2-mercaptoethyl) amino] propionic acid, N- (3-mercaptopropionyl) alanine, 2-mercaptoethanesulfonic acid, 3-mercaptopropanesulfonic acid, 4-mercaptobutanesulfonic acid, dodecyl (4-methylthio) phenyl ether, 2-mercaptoethanol, 3-mercapto-1,2-propanediol, 1-mercapto-2-propanol, 3-mercapto-2-butanol, mercaptophenol , 2-me Captoethylamine, 2-mercaptoimidazole, 2-mercaptobenzimidazole, 2-mercapto-3-pyridinol, 2-mercaptobenzothiazole, mercaptoacetic acid, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3- Mercapto compounds such as mercaptopropionate), disulfide compounds obtained by oxidizing the mercapto compounds, iodoacetic acid, iodopropionic acid, 2-iodoethanol, 2-iodoethanesulfonic acid, 3-iodopropanesulfonic acid, etc. Alkyl compound, trimethylolpropane tris (3-mercaptoisobutyrate), butanediol bis (3-mercaptoisobutyrate), hexanedithiol, decanedithiol, 1,4- Methyl mercaptobenzene, butanediol bisthiopropionate, butanediol bisthioglycolate, ethylene glycol bisthioglycolate, trimethylolpropane tristhioglycolate, butanediol bisthiopropionate, trimethylolpropane tristhiopropionate , Trimethylolpropane tristhioglycolate, pentaerythritol tetrakisthiopropionate, pentaerythritol tetrakisthioglycolate, trishydroxyethyl tristhiopropionate, the following compound no. C1, Karenz PE1, NR1 manufactured by Showa Denko KK and the like.
上記界面活性剤としては、パーフルオロアルキルリン酸エステル、パーフルオロアルキルカルボン酸塩等のフッ素界面活性剤、高級脂肪酸アルカリ塩、アルキルスルホン酸塩、アルキル硫酸塩等のアニオン系界面活性剤、高級アミンハロゲン酸塩、第四級アンモニウム塩等のカチオン系界面活性剤、ポリエチレングリコールアルキルエーテル、ポリエチレングリコール脂肪酸エステル、ソルビタン脂肪酸エステル、脂肪酸モノグリセリド等の非イオン界面活性剤、両性界面活性剤、シリコーン系界面活性剤等の界面活性剤を用いることができ、これらは組み合わせて用いてもよい。 Examples of the surfactant include fluorine surfactants such as perfluoroalkyl phosphates and perfluoroalkyl carboxylates, anionic surfactants such as higher fatty acid alkali salts, alkyl sulfonates, and alkyl sulfates, and higher amines. Cationic surfactants such as halogenates and quaternary ammonium salts, nonionic surfactants such as polyethylene glycol alkyl ethers, polyethylene glycol fatty acid esters, sorbitan fatty acid esters and fatty acid monoglycerides, amphoteric surfactants, silicone surfactants Surfactants such as agents can be used, and these may be used in combination.
上記メラミン化合物としては、(ポリ)メチロールメラミン、(ポリ)メチロールグリコールウリル、(ポリ)メチロールベンゾグアナミン、(ポリ)メチロールウレア等の窒素化合物中の活性メチロール基(CH2OH基)の全部又は一部(少なくとも2つ)がアルキルエーテル化された化合物を挙げることができる。ここで、アルキルエーテルを構成するアルキル基としては、メチル基、エチル基又はブチル基が挙げられ、互いに同一であってもよいし、異なっていてもよい。また、アルキルエーテル化されていないメチロール基は、一分子内で自己縮合していてもよく、二分子間で縮合して、その結果オリゴマー成分が形成されていてもよい。具体的には、ヘキサメトキシメチルメラミン、ヘキサブトキシメチルメラミン、テトラメトキシメチルグリコールウリル、テトラブトキシメチルグリコールウリル等を用いることができる。これらのなかでも、ヘキサメトキシメチルメラミン、ヘキサブトキシメチルメラミン等のアルキルエーテル化されたメラミンが好ましい。 Examples of the melamine compound include all or part of active methylol groups (CH 2 OH groups) in nitrogen compounds such as (poly) methylol melamine, (poly) methylol glycoluril, (poly) methylol benzoguanamine, and (poly) methylol urea. Mention may be made of compounds in which (at least two) are alkyl etherified. Here, examples of the alkyl group constituting the alkyl ether include a methyl group, an ethyl group, and a butyl group, which may be the same as or different from each other. Moreover, the methylol group which is not alkyletherified may be self-condensed within one molecule, or may be condensed between two molecules, and as a result, an oligomer component may be formed. Specifically, hexamethoxymethyl melamine, hexabutoxymethyl melamine, tetramethoxymethyl glycoluril, tetrabutoxymethyl glycoluril and the like can be used. Among these, alkyl etherified melamines such as hexamethoxymethyl melamine and hexabutoxymethyl melamine are preferable.
本発明の光硬化性組成物において、体積抵抗率は、1×1011Ω・cm以上であり、非導電性の点から、好ましくは1×1013Ω・cm以上である。表面抵抗率は、1×1013Ω・cm以上であり、非導電性の点から、好ましくは1×1014Ω・cm以上である。 In the photocurable composition of the present invention, the volume resistivity is 1 × 10 11 Ω · cm or more, and preferably 1 × 10 13 Ω · cm or more from the viewpoint of non-conductivity. The surface resistivity is 1 × 10 13 Ω · cm or more, and preferably 1 × 10 14 Ω · cm or more from the viewpoint of non-conductivity.
本発明の光硬化性組成物は、スピンコーター、ロールコーター、バーコーター、ダイコーター、カーテンコーター、各種の印刷、浸漬等の公知の手段で、ソーダガラス、石英ガラス、半導体基板、金属、紙、プラスチック等の支持基体上に適用することができる。また、一旦フィルム等の支持基体上に施した後、他の支持基体上に転写することもでき、その適用方法に制限はない。 The photocurable composition of the present invention is a known method such as spin coater, roll coater, bar coater, die coater, curtain coater, various printing, dipping, soda glass, quartz glass, semiconductor substrate, metal, paper, It can be applied on a supporting substrate such as plastic. Moreover, after once applying on support bases, such as a film, it can also transfer on another support base | substrate, There is no restriction | limiting in the application method.
また、本発明の光硬化性組成物を硬化させる際に用いられる活性光の光源としては、波長300〜450nmの光を発光するものを用いることができ、例えば、超高圧水銀、水銀蒸気アーク、カーボンアーク、キセノンアーク等を用いることができる。 Moreover, as the light source of the active light used when curing the photocurable composition of the present invention, one that emits light having a wavelength of 300 to 450 nm can be used, for example, ultrahigh pressure mercury, mercury vapor arc, Carbon arc, xenon arc, etc. can be used.
更に、露光光源にレーザー光を用いることにより、マスクを用いずに、コンピューター等のデジタル情報から直接画像を形成するレーザー直接描画法が、生産性のみならず、解像性や位置精度等の向上も図れることから有用であり、そのレーザー光としては、340〜430nmの波長の光が好適に使用されるが、アルゴンイオンレーザー、ヘリウムネオンレーザー、YAGレーザー、及び半導体レーザー等の可視から赤外領域の光を発するものも用いられる。これらのレーザーを使用する場合には、可視から赤外の当該領域を吸収する増感色素が加えられる。 Furthermore, by using laser light as the exposure light source, the laser direct drawing method that directly forms an image from digital information such as a computer without using a mask improves not only productivity but also resolution and positional accuracy. As the laser light, light having a wavelength of 340 to 430 nm is preferably used, but an argon ion laser, a helium neon laser, a YAG laser, a semiconductor laser, etc. are visible to infrared region. Those that emit light are also used. When these lasers are used, a sensitizing dye that absorbs the region from visible to infrared is added.
本発明の光硬化性組成物(又はその硬化物)は、光硬化性塗料或いはワニス、光硬化性接着剤、プリント基板、或いはカラーテレビ、PCモニタ、携帯情報端末、デジタルカメラ等のカラー表示の液晶表示パネルにおけるカラーフィルタ、CCDイメージセンサのカラーフィルタ、タッチパネル、プラズマ表示パネル用の電極材料、粉末コーティング、印刷インク、印刷版、接着剤、ゲルコート、電子工学用のフォトレジスト、電気メッキレジスト、エッチングレジスト、液状及び乾燥膜の双方、はんだレジスト、絶縁膜、種々の表示用途用のカラーフィルタを製造するための或いはプラズマ表示パネル、電気発光表示装置、及びLCDの製造工程において構造を形成するためのレジスト、電気及び電子部品を封入するための組成物、ソルダーレジスト、磁気記録材料、微小機械部品、導波路、光スイッチ、めっき用マスク、エッチングマスク、カラー試験系、ガラス繊維ケーブルコーティング、スクリーン印刷用ステンシル、ステレオリトグラフィによって三次元物体を製造するための材料、ホログラフィ記録用材料、画像記録材料、微細電子回路、脱色材料、画像記録材料のための脱色材料、マイクロカプセルを使用する画像記録材料用の脱色材料、印刷配線板用フォトレジスト材料、UV及び可視レーザー直接画像系用のフォトレジスト材料、プリント回路基板の逐次積層における誘電体層形成に使用するフォトレジスト材料或いは保護膜等の各種の用途に使用することができ、その用途に特に制限はない。 The photocurable composition of the present invention (or a cured product thereof) is a photocurable paint or varnish, a photocurable adhesive, a printed circuit board, a color television, a PC monitor, a portable information terminal, a digital camera or the like. Color filters for LCD panels, color filters for CCD image sensors, touch panels, electrode materials for plasma display panels, powder coatings, printing inks, printing plates, adhesives, gel coats, photoresists for electronics, electroplating resists, etching For manufacturing resists, liquid and dry films, solder resists, insulating films, color filters for various display applications, or for forming structures in the manufacturing process of plasma display panels, electroluminescent display devices, and LCDs Composition, solder for encapsulating resist, electrical and electronic components Resist, magnetic recording materials, micromechanical components, waveguides, optical switches, plating masks, etching masks, color test systems, glass fiber cable coatings, stencils for screen printing, materials for manufacturing 3D objects by stereolithography Holographic recording material, image recording material, fine electronic circuit, decoloring material, decoloring material for image recording material, decoloring material for image recording material using microcapsules, photoresist material for printed wiring board, UV and visible It can be used for various applications such as a photoresist material for a laser direct image system, a photoresist material used for forming a dielectric layer in the sequential lamination of printed circuit boards, or a protective film, and the application is not particularly limited.
本発明の光硬化性組成物は、黒色顔料を用いた場合、ブラックマトリックスを形成する目的で使用され、該ブラックマトリックスは、特に液晶表示パネル等の画像表示装置用の表示デバイス用カラーフィルタに有用である。 The photocurable composition of the present invention is used for the purpose of forming a black matrix when a black pigment is used, and the black matrix is particularly useful for a color filter for a display device for an image display device such as a liquid crystal display panel. It is.
上記ブラックマトリックスは、(1)本発明の光硬化性組成物の塗膜を基板上に形成する工程、(2)該塗膜に所定のパターン形状を有するマスクを介して活性光を照射する工程、(3)露光後の被膜を現像液(特にアルカリ現像液)にて現像する工程、(4)現像後の該被膜を加熱する工程により好ましく形成される。また、本発明の光硬化性組成物は、現像工程の無いインクジェット方式組成物としても有用である。
液晶表示パネル等に用いるカラーフィルタの製造は、本発明又はそれ以外の光硬化性組成物を用いて、上記(1)〜(4)の工程を繰り返し行い、2色以上のパターンを組み合わせて作成することができる。
The black matrix comprises (1) a step of forming a coating film of the photocurable composition of the present invention on a substrate, and (2) a step of irradiating the coating film with active light through a mask having a predetermined pattern shape. (3) The step of developing the exposed film with a developer (particularly an alkali developer) and (4) the step of heating the film after development are preferably formed. The photocurable composition of the present invention is also useful as an ink jet system composition without a development step.
Manufacture of color filters for use in liquid crystal display panels, etc. is made by repeating the above steps (1) to (4) using the photocurable composition of the present invention or other combinations, and combining patterns of two or more colors. can do.
以下、実施例等を挙げて本発明を更に詳細に説明するが、本発明はこれらの実施例等に限定されるものではない。 Hereinafter, although an example etc. are given and the present invention is explained still in detail, the present invention is not limited to these examples.
[製造例1]光重合性不飽和化合物No.1の製造
1,1−ビス〔4−(2,3−エポキシプロピルオキシ)フェニル〕インダンの30.0g、アクリル酸7.52g、2,6−ジ−t−ブチル−p−クレゾール0.080g、テトラブチルアンモニウムクロリド0.183g及び、PGMEA11.0gを仕込み、90℃で1時間、105℃で1時間及び120℃で17時間撹拌した。室温まで冷却し、無水コハク酸8.11g、テトラブチルアンモニウムクロリド0.427g及びPGMEA11.1gを加えて、100℃で5時間撹拌した。さらに、1,1−ビス〔4−(2,3−エポキシプロピルオキシ)フェニル〕インダン12.0g、2,6−ジ−t−ブチル−p−クレゾール0.080g及び、PGMEA0.600gを加えて、90℃で90分、120℃で5時間撹拌後、PGMEA24.0gを加えて、PGMEA溶液として光重合性不飽和化合物No.1を得た。
[Production Example 1] Photopolymerizable unsaturated compound No. 1 Production of 1 1,1-bis [4- (2,3-epoxypropyloxy) phenyl] indane 30.0 g, acrylic acid 7.52 g, 2,6-di-t-butyl-p-cresol 0.080 g Then, 0.183 g of tetrabutylammonium chloride and 11.0 g of PGMEA were charged and stirred at 90 ° C. for 1 hour, 105 ° C. for 1 hour and 120 ° C. for 17 hours. After cooling to room temperature, 8.11 g of succinic anhydride, 0.427 g of tetrabutylammonium chloride and 11.1 g of PGMEA were added, and the mixture was stirred at 100 ° C. for 5 hours. Further, 12.0 g of 1,1-bis [4- (2,3-epoxypropyloxy) phenyl] indane, 0.080 g of 2,6-di-t-butyl-p-cresol and 0.600 g of PGMEA were added. After stirring at 90 ° C. for 90 minutes and at 120 ° C. for 5 hours, 24.0 g of PGMEA was added to prepare PGMEA solution as a photopolymerizable unsaturated compound no. 1 was obtained.
[製造例2] 光重合性不飽和化合物No.2の製造
9,9−ビス(4−グリシジルオキシフェニル)フルオレン75.0g、アクリル酸23.8g、2,6−ジ−t−ブチル−p−クレゾール0.273g、テトラブチルアンモニウムクロリド0.585g、及びPGMEA65.9gを仕込み、90℃で1時間、100℃ で1時間、110℃ で1時間及び120℃ で14時間撹拌した。室温まで冷却し、無水コハク酸25.9g、テトラブチルアンモニウムクロリド0.427g、及びPGMEA1.37gを加えて、100℃ で5時間撹拌した。さらに、9,9−ビス(4−グリシジルオキシフェニル)フルオレン30.0g、2,6−ジ−t−ブチル−p−クレゾール0.269g、及びPGMEA1.50gを加えて、90℃ で90分、120℃ で4時間撹拌後、PGMEA93.4gを加えて、PGMEA溶液として目的物である光重合性不飽和化合物No.2を得た。
[Production Example 2] Photopolymerizable unsaturated compound No. 1 Production of 2 9,9-bis (4-glycidyloxyphenyl) fluorene 75.0 g, acrylic acid 23.8 g, 2,6-di-t-butyl-p-cresol 0.273 g, tetrabutylammonium chloride 0.585 g And PGMEA 65.9 g, and stirred at 90 ° C. for 1 hour, 100 ° C. for 1 hour, 110 ° C. for 1 hour and 120 ° C. for 14 hours. After cooling to room temperature, 25.9 g of succinic anhydride, 0.427 g of tetrabutylammonium chloride, and 1.37 g of PGMEA were added, and the mixture was stirred at 100 ° C. for 5 hours. Further, 90.0 g of 9,9-bis (4-glycidyloxyphenyl) fluorene, 0.269 g of 2,6-di-t-butyl-p-cresol and 1.50 g of PGMEA were added, and 90 minutes at 90 ° C. After stirring at 120 ° C. for 4 hours, 93.4 g of PGMEA was added, and the photopolymerizable unsaturated compound No. 1 as the target product as a PGMEA solution was added. 2 was obtained.
[製造例3] 光重合性不飽和化合物No.3の製造
ビス〔4−(2,3−エポキシプロポキシ)フェニル〕−4−ビフェニリル(シクロヘキシル)メタン89.9g 、アクリル酸23.5g、2,6−ジ−tert−ブチル−p−クレゾール0.457g 、ベンジルトリエチルアンモニウムクロリド0.534g及びPGMEA75.6gを仕込み、120℃ で16時間撹拌した。室温まで冷却し、2,4−ペンタンジオン12.0g、トリエチルアミン1.0gを仕込み、92℃ で17時間撹拌した。室温まで冷却し、無水コハク酸25.6g、テトラ−n−ブチルアンモニウムブロマイド1.39g 、PGMEA40.42gを加えて100℃ で5時間撹拌した。室温まで冷却し、PGMEA46.7gを加えて、PGMEA溶液として目的物である光重合性不飽和化合物No.3を得た。
[Production Example 3] Photopolymerizable unsaturated compound No. 1 3 Preparation of bis [4- (2,3-epoxypropoxy) phenyl] -4-biphenylyl (cyclohexyl) methane 89.9 g, acrylic acid 23.5 g, 2,6-di-tert-butyl-p-cresol 457 g, benzyltriethylammonium chloride 0.534 g and PGMEA 75.6 g were charged and stirred at 120 ° C. for 16 hours. The mixture was cooled to room temperature, charged with 12.0 g of 2,4-pentanedione and 1.0 g of triethylamine, and stirred at 92 ° C. for 17 hours. After cooling to room temperature, 25.6 g of succinic anhydride, 1.39 g of tetra-n-butylammonium bromide and 40.42 g of PGMEA were added and stirred at 100 ° C. for 5 hours. After cooling to room temperature, 46.7 g of PGMEA was added, and the photopolymerizable unsaturated compound No. 1 as the target product as a PGMEA solution was added. 3 was obtained.
[比較製造例1]比較光重合性不飽和化合物No.1の製造
ビスフェノールAジグリシジルエーテルの35.0g、アクリル酸7.52g、2,6−ジ−t−ブチル−p−クレゾール0.080g、テトラブチルアンモニウムクロリド0.183g及び、PGMEA11.0gを仕込み、90℃で1時間、105℃で1時間及び120℃で17時間撹拌した。室温まで冷却し、無水コハク酸8.11g、テトラブチルアンモニウムクロリド0.427g及びPGMEA11.1gを加えて、100℃で5時間撹拌した。さらに、1,1−ビス〔4−(2,3−エポキシプロピルオキシ)フェニル〕インダン12.0g、2,6−ジ−t−ブチル−p−クレゾール0.080g及び、PGMEA0.600gを加えて、90℃で90分、120℃で5時間撹拌後、PGMEA24.0gを加えて、PGMEA溶液として比較光重合性不飽和化合物No.1を得た。
[Comparative Production Example 1] Comparative photopolymerizable unsaturated compound No. 1 1 Preparation of 35.0 g of bisphenol A diglycidyl ether, 7.52 g of acrylic acid, 0.080 g of 2,6-di-t-butyl-p-cresol, 0.183 g of tetrabutylammonium chloride and 11.0 g of PGMEA The mixture was stirred at 90 ° C. for 1 hour, 105 ° C. for 1 hour, and 120 ° C. for 17 hours. After cooling to room temperature, 8.11 g of succinic anhydride, 0.427 g of tetrabutylammonium chloride and 11.1 g of PGMEA were added, and the mixture was stirred at 100 ° C. for 5 hours. Further, 12.0 g of 1,1-bis [4- (2,3-epoxypropyloxy) phenyl] indane, 0.080 g of 2,6-di-t-butyl-p-cresol and 0.600 g of PGMEA were added. After stirring at 90 ° C. for 90 minutes and at 120 ° C. for 5 hours, 24.0 g of PGMEA was added to prepare a PGMEA solution as a comparative photopolymerizable unsaturated compound no. 1 was obtained.
[実施例1〜5及び比較例1〜4]光硬化性組成物No.1〜No.5及び比較光硬化性組成物No.1〜No.4の調製
[表1]の配合に従って各成分を混合し、ボールミルで微粉砕して、実施例1〜5の光硬化性組成物No.1〜No.5及び比較例1〜4の比較光硬化性組成物No.1〜No.4を得た。尚、数字は質量部を表す。
[Examples 1 to 5 and Comparative Examples 1 to 4] Photocurable composition No. 1-No. 5 and comparative photocurable composition No. 1-No. Preparation of 4
Each component was mixed in accordance with the formulation of [Table 1], and finely pulverized with a ball mill. 1-No. No. 5 and Comparative Photocurable Composition Nos. 1-No. 4 was obtained. In addition, a number represents a mass part.
A−1 光重合性不飽和化合物No.1
A−2 光重合性不飽和化合物No.2
A−3 光重合性不飽和化合物No.3
A’−1 比較光重合性不飽和化合物No.1
B−1 アロニックスM−327(一般式(2)で表される化合物;東亞合成社製)
B'−1 カヤラッドDPHA(ジペンタエリスリトールヘキサアクリレート;日本化薬社製)
B’−2 アロニックスM−315(イソシアヌレート含有トリアクリレート;東亞合成社製)
B'−3 カヤラッドDPCA−120(ジペンタエリスリトールカプロラクトン変性ヘキサアクリレート;日本化薬社製)
C−1 NCI−831(一般式(5')で表される化合物;ADEKA社製)
C−2 OXE−02(BASF社製)
D−1 MA100(カーボンブラック;三菱化学社製)
E−1 KBM403(アルコキシシランカップリング剤;信越化学)
E−2 PGMEA
A-1 Photopolymerizable unsaturated compound No. 1 1
A-2 Photopolymerizable unsaturated compound No. 2
A-3 Photopolymerizable unsaturated compound No. 3
A′-1 Comparative photopolymerizable unsaturated compound No. 1 1
B-1 Aronix M-327 (compound represented by general formula (2); manufactured by Toagosei Co., Ltd.)
B'-1 Kayalad DPHA (dipentaerythritol hexaacrylate; manufactured by Nippon Kayaku Co., Ltd.)
B'-2 Aronix M-315 (isocyanurate-containing triacrylate; manufactured by Toagosei Co., Ltd.)
B'-3 Kayarad DPCA-120 (dipentaerythritol caprolactone-modified hexaacrylate; manufactured by Nippon Kayaku Co., Ltd.)
C-1 NCI-831 (Compound represented by the general formula (5 ′); manufactured by ADEKA)
C-2 OXE-02 (manufactured by BASF)
D-1 MA100 (carbon black; manufactured by Mitsubishi Chemical Corporation)
E-1 KBM403 (alkoxysilane coupling agent; Shin-Etsu Chemical)
E-2 PGMEA
[評価例1〜5及び比較評価例1〜4]
基板上にγ−グリシドキシプロピルメチルエトキシシランをスピンコートして良くスピン乾燥させた後、実施例1〜5で得られた光硬化性組成物No.1〜No.5及び比較例1〜4で得られた比較光硬化性組成物No.1〜No.4をスピンコート(1300r.p.m、50秒間)し乾燥させた。70℃で20分間プリベークを行った後、ポリビニルアルコール5%溶液をコートして酸素遮断膜とした。70℃ にて20分間の乾燥後、所定のマスクを用い、光源として超高圧水銀ランプを用いて露光後、2.5%炭酸ナトリウム溶液に25℃で30秒間浸漬して現像し、良く水洗した。水洗乾燥後、230℃ で1時間ベークしてパターンを定着させた。得られたパターンについて、以下の感度及び密着性の評価(シール強度及び密着性試験)の測定を行った。結果を[表1]に示す。
(感度)
露光時に、露光量が70mJ/cm2で十分だったものをa、70mJ/cm2では不十分で、100mJ/cm2で露光したものをb、100mJ/cm2では不十分で、150mJ/cm2で露光したものをcとした。
(シール強度)
ガラス基板に6mm×3.5mmの面積で熱硬化接着剤(シール剤:三井化学社製XN−21S)を塗布し、樹脂製ブラックマトリックス層のあるガラス基板と貼り合わせ、接着剤を硬化させた。貼り合わされた基板を120℃、2atm、相対湿度100%の条件の高温高湿装置内に5時間静置した。このサンプルについて島津製EZ−Graphにて3点支持曲げ試験を実施し、密着強度を測定してシール強度とした。
(密着性試験)
120℃、2atm、相対湿度100%の条件の高温高湿装置内に5時間静置された塗膜にJIS D 0202の試験方法に従い、基盤目状にクロスカットを入れ、次いでセロハンテープによってピーリングテストを行い、基盤目の剥離の状態を目視により評価した。全く剥離が認められなかったものを○、剥離が認められたものを×とした。
[Evaluation Examples 1 to 5 and Comparative Evaluation Examples 1 to 4]
After spin coating γ-glycidoxypropylmethylethoxysilane on the substrate and spin drying well, the photocurable compositions No. 1 obtained in Examples 1 to 5 were used. 1-No. 5 and Comparative Photocurable Composition Nos. Obtained in Comparative Examples 1-4. 1-No. 4 was spin coated (1300 rpm, 50 seconds) and dried. After pre-baking at 70 ° C. for 20 minutes, a 5% polyvinyl alcohol solution was coated to form an oxygen barrier film. After drying at 70 ° C. for 20 minutes, using a predetermined mask, using an ultra-high pressure mercury lamp as a light source, exposure was performed, soaked in a 2.5% sodium carbonate solution at 25 ° C. for 30 seconds, developed, and washed thoroughly with water. . After washing with water and drying, the pattern was fixed by baking at 230 ° C. for 1 hour. About the obtained pattern, the following sensitivity and adhesion evaluation (seal strength and adhesion test) were measured. The results are shown in [Table 1].
(sensitivity)
During exposure, what exposure was sufficient 70 mJ / cm 2 a, inadequate in 70 mJ / cm 2, those exposed at 100 mJ / cm 2 b, insufficient in 100mJ / cm 2, 150mJ / cm The one exposed in 2 was designated as c.
(Seal strength)
A thermosetting adhesive (sealing agent: XN-21S manufactured by Mitsui Chemicals, Inc.) was applied to a glass substrate with an area of 6 mm × 3.5 mm, and bonded to a glass substrate having a resin black matrix layer to cure the adhesive. . The bonded substrates were left in a high temperature and high humidity apparatus under conditions of 120 ° C., 2 atm, and relative humidity 100% for 5 hours. This sample was subjected to a three-point support bending test using Shimadzu EZ-Graph, and the adhesion strength was measured to obtain the seal strength.
(Adhesion test)
According to the test method of JIS D 0202, a cross-cut is put in a base form in a coating film that has been allowed to stand in a high-temperature and high-humidity device under conditions of 120 ° C., 2 atm, and relative humidity of 100%. Then, the peeled state of the substrate eyes was visually evaluated. A sample in which no peeling was observed was marked with ○, and a sample in which peeling was observed was marked with ×.
以上の結果より、特定の構造を有する光重合性不飽和化合物を含有する本発明の光硬化性組成物は感度及び密着性に優れる。よって、本発明の光硬化性組成物はカラーフィルタに有用である。 From the above results, the photocurable composition of the present invention containing a photopolymerizable unsaturated compound having a specific structure is excellent in sensitivity and adhesion. Therefore, the photocurable composition of the present invention is useful for a color filter.
Claims (5)
R15及びR16は、それぞれ独立に、水素原子、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基、R17、OR18、SR19、NR20R21、COR22、SOR23、SO2R24又はCONR25R26を表し、R15及びR16は、互いに結合して環を形成していてもよく、
R17、R18、R19、R20、R21、R22、R23、R24、R25及びR26は、それぞれ独立に、炭素原子数1〜20のアルキル基、炭素原子数6〜30のアリール基、炭素原子数7〜30のアリールアルキル基又は炭素原子数2〜20の複素環基を表し、
X2は、酸素原子、硫黄原子、セレン原子、CR27R28、CO、NR29又はPR30を表し、
X3は、単結合又はCOを表し、
R27、R28、R29及びR30は、それぞれ独立に、水素原子、炭素原子数1〜20のアルキル基、炭素原子数6〜30のアリール基又は炭素原子数7〜30のアリールアルキル基を表し、上記アルキル基又はアリールアルキル基は、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基又は複素環基で置換されてもよく、上記アルキル基又はアリールアルキル基中のメチレン基は−O−で中断されていてもよく、
R27、R28、R29及びR30は、それぞれ独立に、隣接するどちらかのベンゼン環と一緒になって環を形成していてもよく、
aは、0〜4の整数を表し、
bは、0〜5の整数を表す。) The photocurable composition according to claim 1, wherein the photopolymerization initiator (B) is represented by the following general formula (5).
R 15 and R 16 are each independently a hydrogen atom, halogen atom, nitro group, cyano group, hydroxyl group, carboxyl group, R 17 , OR 18 , SR 19 , NR 20 R 21 , COR 22 , SOR 23 , SO 2. R 24 or CONR 25 R 26 , R 15 and R 16 may be bonded to each other to form a ring;
R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 and R 26 are each independently an alkyl group having 1 to 20 carbon atoms, 6 to 6 carbon atoms A 30 aryl group, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms;
X 2 represents an oxygen atom, a sulfur atom, a selenium atom, CR 27 R 28 , CO, NR 29 or PR 30 ;
X 3 represents a single bond or CO,
R 27 , R 28 , R 29 and R 30 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms or an arylalkyl group having 7 to 30 carbon atoms. The alkyl group or arylalkyl group may be substituted with a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group or a heterocyclic group, and the methylene group in the alkyl group or arylalkyl group is —O. -May be interrupted by-
R 27 , R 28 , R 29 and R 30 may each independently form a ring together with one of the adjacent benzene rings,
a represents an integer of 0 to 4,
b represents an integer of 0 to 5. )
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