JP2015023209A - Multilayer ceramic capacitor with interposer, and interposer for multilayer ceramic capacitor - Google Patents

Abstract

An object of the present invention is to provide a multilayer ceramic capacitor with an interposer that can surely suppress noise that may occur due to electrostriction of a capacitor body when mounted on a circuit board or the like. An interposer 20 includes two connection electrodes 22 provided on an upper surface of an insulating substrate 21, two mounting electrodes 23 provided on a lower surface of the insulating substrate 21, one connection electrode 22 and one mounting electrode. A cylindrical first through-via 24 provided in the insulating substrate 21 so as to connect the second connecting electrode 22 and the one mounting electrode 23 so as to connect the first mounting electrode 23 to the cylindrical first through-hole 24 provided in the insulating substrate 21 so as to connect to the second cylindrical electrode. 2 through vias 24 and solder non-adhering films 25 provided so as to close the upper end openings of the inner holes 24a of the first and second through vias 24. The surface of each connection electrode 22 has a multilayer ceramic capacitor 10 One surface of the wraparound portion 12b of each external electrode 12 is joined via solder SOL. [Selection] Figure 2

Description

  The present invention relates to a multilayer ceramic capacitor with an interposer in which an interposer is attached to a multilayer ceramic capacitor, and an interposer for a multilayer ceramic capacitor used when the multilayer ceramic capacitor is mounted on a circuit board or the like.

  In paragraphs 0024 to 0036 and FIG. 1 (A) and FIGS. 2 (A) to 2 (D) of Patent Document 1 described later, a chip component structure 10 corresponding to the multilayer ceramic capacitor with an interposer is described.

  The chip component structure 10 includes a multilayer ceramic capacitor 20 and an interposer 30, and arc-shaped recesses 310 penetrating in the thickness direction are formed at both ends in the longitudinal direction of the insulating substrate 31 of the interposer 30. In addition, the first mounting electrode 321 and the second mounting electrode 331 are formed on the first main surface of the insulating substrate 31, and the first external connection electrode 322 and the second external connection electrode are formed on the second main surface. 332 is formed. Further, connection conductors 343 are formed on the arc-shaped side wall surfaces of the respective recesses 310 of the insulating substrate 31, and the first mounting electrodes 321 and the first external connection electrodes 322 are electrically connected by the connection conductors 343, so that the second The mounting electrode 331 and the second external connection electrode 332 are electrically connected. On the other hand, the first external electrode 221 of the multilayer ceramic capacitor 20 is bonded to the first mounting electrode 321 of the interposer 30, and the second external electrode 222 is bonded to the second mounting electrode 331 of the interposer 30.

  Further, the chip component structure 10 is used for the first external connection as described in paragraphs 0037 and 0038 of Patent Document 1 described later and FIGS. 1B, 3A, and 3B. The electrode 322 and the second external connection electrode 332 are mounted on the external circuit board 90 by bonding to each mounting land 901 using a bonding agent 400 (for example, solder).

  By the way, in paragraphs 0039 and 0040 of Patent Document 1 described later, a fillet of the bonding agent 400 is formed on each connection conductor 343 of the interposer 30 by the mounting, and a fillet of the bonding agent 400 is formed on each connection conductor 343. However, it is described that the bonding agent 400 hardly reaches the main surfaces (end surfaces in the length direction of the multilayer ceramic capacitor 20) of the first external electrode 221 and the second external electrode 222 of the multilayer ceramic capacitor 20.

  However, as is apparent from FIGS. 1B, 3A, and 3B of Patent Document 1 described later, each connection conductor 343 of the interposer 30 is connected to the first external electrode 221 of the multilayer ceramic capacitor 20 and Since it is below the end surface of the second external electrode 222, it is difficult to suppress the bonding agent 400 from getting wet to the end surfaces of the first external electrode 221 and the second external electrode 222.

  In short, in the chip component structure 10, the fillet of the bonding agent 400 is applied from the mounting lands 901 of the external circuit board 90 to the end surfaces of the first external electrode 221 and the second external electrode 222 of the multilayer ceramic capacitor 20 by the mounting. It cannot be avoided that it is formed. Therefore, when a voltage, particularly an AC voltage, is applied to the multilayer ceramic capacitor 20 in the mounted state to cause an electrostriction phenomenon in the ceramic multilayer body 21, warpage associated with the electrostriction phenomenon and its restoration occur in the external circuit board 90. It is easy to generate a so-called sound.

JP 2012-204572 A

  An object of the present invention is to provide a multilayer ceramic capacitor with an interposer and an interposer for a multilayer ceramic capacitor that can surely suppress the noise that may occur due to the electrostriction phenomenon of the capacitor body when mounted on a circuit board or the like. is there.

  In order to achieve the above object, the multilayer ceramic capacitor with an interposer of the present invention is a multilayer ceramic capacitor with an interposer in which the interposer is attached to the multilayer ceramic capacitor, and (1) the multilayer ceramic capacitor has a length> width and height. A substantially rectangular parallelepiped capacitor body having a capacity forming portion having a structure in which a plurality of internal electrode layers are stacked via a dielectric layer, and a length of the capacitor body. A substantially rectangular end surface portion covering each of the end surfaces in the direction, and a substantially rectangular tubular wraparound portion covering a part of the four side surfaces of the capacitor body continuously with each end surface portion, and the plurality of internal portions Two external electrodes, one part of which is connected to one side and the other part is connected to the other, (2) the interposer has a length> width and It has a substantially rectangular parallelepiped shape that satisfies the height relationship, and is provided so as to face one surface of the wraparound portion of the two external electrodes on one surface in the thickness direction of the insulating substrate. Two substantially rectangular connection electrodes, two substantially rectangular mounting electrodes provided on the other surface in the thickness direction of the insulating substrate so as to face the two connection electrodes, and the insulating substrate. One of the two connection electrodes and one of the two mounting electrodes are connected to the inner side of the end face in the length direction, and one end of the inner hole is opened on one surface of the two connection electrodes. A cylindrical first through via provided with an end opened on one surface of the two mounting electrodes, the other of the two connection electrodes on the inner side of the end surface in the length direction of the insulating substrate, and the Connect the other of the two mounting electrodes And a cylindrical second through via provided so that one end of the inner hole is opened on the other surface of the two connection electrodes and the other end is opened on the other surface of the two mounting electrodes. A solder non-adhering film provided to close one end opening of the inner hole of the first through via and one end opening of the inner hole of the second through via, and (3) the two connections of the interposer One surface of each of the wraparound portions of the two external electrodes of the multilayer ceramic capacitor is bonded to each of the electrode surfaces via solder. (4) The other end of the inner hole of the first through via of the interposer The region from the opening to the solder non-adhering film and the region from the other end opening of the inner hole of the second through via to the solder non-adhering film are both empty.

  On the other hand, the interposer for a multilayer ceramic capacitor of the present invention is an interposer for a multilayer ceramic capacitor used when the multilayer ceramic capacitor is mounted on a circuit board or the like. (1) The multilayer ceramic capacitor has a length> width and height. A substantially rectangular parallelepiped capacitor body having a capacity forming portion having a structure in which a plurality of internal electrode layers are stacked via a dielectric layer, and a length of the capacitor body. A substantially rectangular end surface portion covering each of the end surfaces in the direction, and a substantially rectangular tubular wraparound portion covering a part of the four side surfaces of the capacitor body continuously with each end surface portion, and the plurality of internal portions It has two external electrodes in which a part of the electrode layer is connected to one side and the remaining part is connected to the other. (2) The interposer satisfies the relationship of length> width and height A substantially rectangular parallelepiped-shaped insulating substrate, and a substantially rectangular-shaped insulating substrate provided on one surface in the thickness direction of the insulating substrate so as to face one surface of the wraparound portion of the two external electrodes. From two connection electrodes, two substantially rectangular mounting electrodes provided on the other surface in the thickness direction of the insulating substrate so as to face each of the two connection electrodes, and an end surface in the length direction of the insulating substrate Also, one of the two connection electrodes and one of the two mounting electrodes are connected inside, and one end of an inner hole is opened on one surface of the two connection electrodes, and the other end is mounted on the two mounting electrodes. A cylindrical first through via provided to open on one surface of the electrode, and the other of the two connection electrodes and the other of the two mounting electrodes on the inner side of the end surface in the length direction of the insulating substrate And so on A cylindrical second through via provided so that one end of the first connection hole is opened on the other surface of the two connection electrodes and the other end is opened on the other surface of the two mounting electrodes; A solder non-adhesion film provided to close one end opening of the inner hole and one end opening of the inner hole of the second through-via, and (3) each of the surfaces of the two connection electrodes of the interposer For joining each one surface of the wraparound portion of the two external electrodes of the multilayer ceramic capacitor via solder, (4) from the other end opening of the inner hole of the first through via of the interposer The region reaching the adhesion film and the region extending from the other end opening of the inner hole of the second through via to the solder non-adhesion film are both empty.

  According to the present invention, it is possible to provide a multilayer ceramic capacitor with an interposer and an interposer for a multilayer ceramic capacitor that can surely suppress the noise that may occur due to the electrostriction phenomenon of the capacitor body when mounted on a circuit board or the like. it can.

  The above and other objects of the present invention, and the features and effects according to the respective objects will become apparent from the following description and the accompanying drawings.

FIG. 1 is a top view of a multilayer ceramic capacitor with an interposer to which the present invention is applied (first embodiment). 2 is a cross-sectional view taken along line X1-X1 of FIG. FIG. 3 is a top view of the multilayer ceramic capacitor shown in FIG. 4 is a cross-sectional view taken along line X2-X2 of FIG. FIG. 5 is a top view of the interposer shown in FIG. FIG. 6 is a bottom view of the interposer shown in FIG. FIG. 7 is a cross-sectional view taken along line X3-X3 in FIG. 8 is a cross-sectional view corresponding to FIG. 4 showing a state in which the multilayer ceramic capacitor with an interposer shown in FIG. 1 is mounted on a circuit board. FIG. 9 is a top view of the interposer in the multilayer ceramic capacitor with an interposer to which the present invention is applied (second embodiment). 10 is a cross-sectional view taken along line X4-X4 of FIG. FIG. 11 is a cross-sectional view of a multilayer ceramic capacitor with an interposer (second embodiment) corresponding to FIG. FIG. 12 is a top view of an interposer in a multilayer ceramic capacitor with an interposer to which the present invention is applied (third embodiment). 13 is a cross-sectional view taken along line X5-X5 in FIG. FIG. 14 is a cross-sectional view corresponding to FIG. 2 of the multilayer ceramic capacitor with an interposer (third embodiment). FIG. 15 is a top view of an interposer in a multilayer ceramic capacitor with an interposer to which the present invention is applied (fourth embodiment). FIG. 16 is a bottom view of the interposer shown in FIG. 17 is a cross-sectional view taken along line X6-X6 in FIG. 18 is a cross-sectional view corresponding to FIG. 2 of a multilayer ceramic capacitor with an interposer (fourth embodiment). FIG. 19 is a top view of an interposer in a multilayer ceramic capacitor with an interposer to which the present invention is applied (fifth embodiment). 20 is a cross-sectional view taken along line X7-X7 in FIG. FIG. 21 is a cross-sectional view of a multilayer ceramic capacitor with an interposer (fifth embodiment) corresponding to FIG. FIG. 22 is a top view of the multilayer ceramic capacitor in the multilayer ceramic capacitor with an interposer to which the present invention is applied (sixth embodiment). 23 is a cross-sectional view taken along line X8-X8 in FIG. FIG. 24 is a cross-sectional view of the multilayer ceramic capacitor with an interposer (sixth embodiment) corresponding to FIG.

  The “length”, “width”, “height”, “thickness”, “dimension”, and “distance” used in the following description all indicate design standard values. It does not indicate a specific value within the value ± tolerance.

<< 1st Embodiment (FIGS. 1-8) >>
The multilayer ceramic capacitor with an interposer (no symbol) shown in FIGS. 1 and 2 is obtained by attaching an interposer 20 to the multilayer ceramic capacitor 10.

  As shown in FIGS. 3 and 4, the multilayer ceramic capacitor 10 has a substantially rectangular parallelepiped shape that satisfies the relationship of length L10> width W10 and height H10. The multilayer ceramic capacitor 10 includes a capacitor body 11 having a substantially rectangular parallelepiped shape having a capacitance forming portion 11a having a structure in which a plurality of internal electrode layers 11a1 are stacked via a dielectric layer 11a2, and an end face in the length direction of the capacitor body 11 A substantially rectangular end surface portion 12a covering each of them, and a substantially rectangular tube-shaped wraparound portion 12b covering a part of the four side surfaces of the capacitor body 11 continuously with each end surface portion 12a, and a plurality of internal electrodes Two external electrodes 12 having a part of the layer 11a1 connected to one side and the remaining part connected to the other are provided.

  If it supplements, the capacitor | condenser main body 11 will go from the one side of a height direction to the other side by the capacity | capacitance formation part 11a and the protection part 11b of the structure where several dielectric material layers (no code | symbol) were laminated | stacked in the height direction. The protective portion 11b, the capacitance forming portion 11a, and the protective portion 11b are provided in this order.

  The thicknesses of the plurality of internal electrode layers 11a1 included in the capacitance forming portion 11a are equal, and the dimensions that define the outline (substantially rectangular) of the plurality of internal electrode layers 11a1 are also equal. The plurality of internal electrode layers 11a1 included in the capacitance forming portion 11a are made of the same material, and a metal such as nickel, copper, palladium, platinum, silver, gold, or an alloy thereof is used as the material. Further, the plurality of internal electrode layers 11a1 included in the capacitance forming portion 11a are alternately shifted in the length direction, and the odd-numbered end edges from the top in FIG. 4 are connected to the left external electrode 12 in FIG. The even-numbered edge from the top in FIG. 4 is connected to the right external electrode 12 in FIG.

  The plurality of dielectric layers 11a2 included in the capacitance forming portion 11a are equal in thickness, and the dielectric layers constituting the protection portion 11b are equal in thickness. The plurality of dielectric layers 11a2 included in the capacitance forming portion 11a and the dielectric layers constituting the protective portion 11b are made of the same material, and the materials include barium titanate, strontium titanate, calcium titanate, and magnesium titanate. Dielectric ceramics such as calcium zirconate, calcium zirconate titanate, barium zirconate, and titanium oxide, and preferably dielectric ceramics of ε> 1000 or class 2 (high dielectric constant) are used.

  The thicknesses of the two external electrodes 12 are equal, and each external electrode 12 has a substantially rectangular end surface portion 12a covering the end surface in the length direction of the capacitor main body 11, and four end surfaces of the capacitor main body 11 continuous with the end surface portion 12a. It has a substantially quadrangular cylindrical wraparound portion 12b that covers a part. The length L12 of each external electrode 12 is in the range of 1/7 to 1/3 of the length L10 of the multilayer ceramic capacitor 10, and the width W12 of each external electrode 12 defines the width W12 of the multilayer ceramic capacitor 10. The height H12 of each external electrode 12 defines the height H10 of the multilayer ceramic capacitor 10.

  Although not shown, each external electrode 12 has a two-layer structure of a base film that is in close contact with the outer surface of the capacitor body 11 and a surface film that is in close contact with the outer surface of the base film, or between the base film and the surface film. It has a multilayer structure having at least one intermediate film. The base film is made of, for example, a baked metal film, and a metal such as nickel, copper, palladium, platinum, silver, gold, or an alloy thereof is used as the material. The surface film is made of, for example, a plated metal film, and a metal such as tin, palladium, gold, or zinc is used as the material. The intermediate film is made of, for example, a plated metal film, and a metal such as platinum, palladium, gold, copper, or nickel is used as the material.

  On the other hand, as shown in FIGS. 5 to 7, the interposer 20 has a substantially rectangular parallelepiped shape that satisfies the relationship of length L20> width W20 and height H20. The interposer 20 has a substantially rectangular parallelepiped insulating substrate 21 and a substantially rectangular shape provided on one surface (upper surface) in the thickness direction of the insulating substrate 21 so as to face one surface of the wraparound portion 12b of the two external electrodes 12. The two connecting electrodes 22, two substantially rectangular mounting electrodes 23 provided on the other surface (lower surface) of the insulating substrate 21 in the thickness direction so as to face the two connecting electrodes 22, and the insulating substrate 21. One of the two connection electrodes 22 and one of the two mounting electrodes 23 are connected inside the end face in the length direction, and one end (upper end) of the inner hole 24a is one surface of the two connection electrodes 22 The first through-via 24 having a substantially cylindrical shape provided so that the other end (lower end) is opened on one surface of the two mounting electrodes 23, and on the inner side of the end surface in the length direction of the insulating substrate 21. 2 connections One end (upper end) of the inner hole 24a is opened on the other surface of the two connection electrodes 22 and the other end (lower end) is two mounted so as to connect the other of the poles 22 and the other of the two mounting electrodes 23. A substantially cylindrical second through via 24 provided so as to open on the other surface of the electrode 23, one end opening (upper end opening) of the inner hole 24 a of the first through via 24, and an inner hole of the second through via 24. A substantially rectangular solder non-adhesion film 25 is provided so as to close one end opening (upper end opening) of 24a.

  In other words, the thickness of the insulating substrate 21 is substantially constant, the length L21 of the insulating substrate 21 defines the length L20 of the interposer 20, and the width W21 of the insulating substrate 21 defines the width W20 of the interposer 20. Yes. The insulating substrate 21 may be made of ceramics such as silicon dioxide, aluminum oxide, silicon nitride, or epoxy resin, phenol resin, polyimide resin, urea resin, melamine resin, unsaturated polyester resin, bismaleimide resin, polyurethane resin, Thermosetting plastics such as diallyl phthalate resin, silicone resin, and cyanate resin, or thermosetting plastics containing these with reinforcing fillers are used.

  The thicknesses of the two connection electrodes 22 are equal, and the dimensions (including the length L22 and the width W22) that define the contours of the two connection electrodes 22 are also equal. Further, the thicknesses of the two mounting electrodes 23 are equal, and the dimensions (including the length L23 and the width W23) that define the contours of the two mounting electrodes 23 are also equal. Furthermore, the thickness of the first and second through vias 24 is equal to the diameter of the inner hole 24a, and the first and second through vias 24 are located as far as possible from the end face in the length direction of the insulating substrate 21, in other words, insulating. The substrate 21 is provided near the center in the length direction. Incidentally, there is a substantially semicircular protruding portion 22a at the center of the inner edge of each connection electrode 22, and there is a substantially semicircular protruding portion 23a at the center of the inner edge of each mounting electrode 23 so as to face these. Is a device for positioning the first and second through vias 24 closer to the center in the length direction of the insulating substrate 21. Furthermore, the connection electrodes 22, the mounting electrodes 23, and the first and second through vias 24 are made of metal such as nickel, copper, palladium, platinum, silver, gold, and alloys thereof.

  The solder non-adhesion film 25 is formed on a part (inner part) of each of the surfaces of the two connection electrodes 22 and the insulating substrate so as to block one end opening (upper end opening) of each of the inner holes 24a of the first and second through vias 24. 21 is continuously formed on a part of one surface (upper surface) in the thickness direction 21 (a portion between two connection electrodes 22). That is, the region from the other end opening (lower end opening) of each of the inner holes 24a of the first and second through vias 24 to the solder non-adhering film 25 is empty. In addition, since a part (inner part) of the surface of each connection electrode 22 is covered with the solder non-adhesion film 25, the surface of each connection electrode 22 has a substantially rectangular shape where the solder non-adhesion film 25 is not formed. The remaining part (outer part) is an effective connection region 22 b of each connection electrode 22. Further, the surface of the solder non-adhesion film 25 is substantially flat, and the thickness on the surface of each connection electrode 22 is thinner than the thickness on one surface (upper surface) in the thickness direction of the insulating substrate 21. Further, the material of the solder non-adhering film 25 is a material to which solder SOL described later does not adhere, for example, (1) a well-known solder resist, (2) epoxy resin, phenol resin, polyimide resin, urea resin, melamine resin, unsaturated polyester resin. , Thermosetting plastics such as bismaleimide resin, polyurethane resin, diallyl phthalate resin, silicone resin, cyanate resin, or (3) inorganic insulating materials such as silicon dioxide, aluminum oxide, silicon nitride, ie, no metal components Insulating material is used.

  Here, the relationship between the dimension of the multilayer ceramic capacitor 10 and the dimension of the interposer 20 will be described. The length L20 of the interposer 20 (= the length L21 of the insulating substrate 21) is slightly longer than the length L10 of the multilayer ceramic capacitor 10, and the width W20 of the interposer 20 (= the width W21 of the insulating substrate 21) is the multilayer ceramic capacitor 10. The height H20 of the interposer 20 is in a range of 1/8 to 1/2 of the height H10 of the multilayer ceramic capacitor 10. The distance D22 between the outer edges along the length direction of the two connection electrodes 22 of the interposer 20 is equal to the length L10 of the multilayer ceramic capacitor 10, and the width W22 of each connection electrode 22 is equal to the width W10 of the multilayer ceramic capacitor 10. Equally, the length L22b of the effective connection region 22b of each connection electrode 22 is slightly shorter than the length L12 of each external electrode of the multilayer ceramic capacitor 10. Further, the length of the solder non-adhesion film 25 of the interposer 20 is long enough to close one end opening (upper end opening) of each of the inner holes 24a of the first and second through vias 24. The width of the adhesion film 25 is equal to the width W21 of the insulating substrate 21. Furthermore, the distance D23 between the outer edges along the length direction of the two mounting electrodes 23 of the interposer 20 is equal to the length L10 of the multilayer ceramic capacitor 10, and the width W23 of each mounting electrode 23 is equal to the width W10 of the multilayer ceramic capacitor 10. equal.

  For example, if the specific value when the multilayer ceramic capacitor 10 is 2125 size is shown as an example, the length L10 of the multilayer ceramic capacitor 10 is 2.0 mm, the width W10 is 1.25 mm, and the height H10 is 1.25 mm. The length L12 of each external electrode 12 is 0.5 mm. On the other hand, the length L20 of the interposer 20 (= the length L21 of the insulating substrate 21) is 2.2 mm, the width W20 (= the width W21 of the insulating substrate 21) is 1.45 mm, and the height H20 is 0.45 mm. The length L22 of each connection electrode 22 is 0.7 mm, the width W22 is 1.25 mm, the distance D22 is 2.0 mm, and the length L22b of the effective connection region 22b is 0.4 mm. Further, the length L23 of each mounting electrode 23 is 0.7 mm, the width W23 is 1.25 mm, and the distance D23 is 2.0 mm. Further, the length (D22-2 × L22b) of the solder non-adhering film 25 is 1.2 mm and the width is 1.45 mm.

  Incidentally, the thickness of each external electrode 12 of the multilayer ceramic capacitor 10 is 0.01 mm. Further, the thickness of the insulating substrate 21 of the interposer 20 is 0.3 mm, and the thicknesses of the connection electrodes 22, the mounting electrodes 23, and the first and second through vias 24 are 0.05 mm. The diameter of the inner hole 24a of the two through vias 24 is 0.25 mm, and the thickness on the surface of each connection electrode 22 of the solder non-adhering film 25 is 0.05 mm.

  When the multilayer ceramic capacitor with an interposer shown in FIGS. 1 and 2 is manufactured, cream solder is applied to the surface of the effective connection region 22b of each connection electrode 22 of the interposer 20, and each external electrode 12 is applied to the applied cream solder. After mounting the multilayer ceramic capacitor 10 so that one surface of the wraparound portion 12b is in contact, the cream solder is once melted and cured by a heat treatment such as a reflow soldering method, and each external electrode 12 of the multilayer ceramic capacitor 10 is soldered with the solder SOL. To each connection electrode 22 of the interposer 20.

  Since one end opening (upper end opening) of each of the inner holes 24a of the first and second through vias 24 of the interposer 20 is blocked by the solder non-adhering film 25, the cream solder enters the inner holes 24a at the time of mounting. This can be prevented, and each inner hole 24a can be left empty. In addition, since a material that does not adhere the solder SOL to the solder non-adhering film 25 is used, the molten solder does not wet the surface of the solder non-adhering film 25 during the heat treatment.

  Further, since the length L22 of the effective connection region 22b of each connection electrode 22 of the interposer 20 is slightly shorter than the length L12 of each external electrode of the multilayer ceramic capacitor 10, the cream applied to the surface of each effective connection region 22b Depending on the amount of solder, one surface of the wrap portion 12b of each external electrode 12 is brought into contact with the surface of the solder non-adhering film 25 at the time of mounting, so that one surface of the wrap portion 12b of each external electrode 12 and each connection electrode 22 are connected. It is also possible to manage the gap between the surface of the effective connection region 22b, that is, the thickness of the solder SOL interposed between one surface of the wraparound portion 12b of each external electrode 12 and the surface of the effective connection region 22b of each connection electrode 22. it can.

  When the multilayer ceramic capacitor with an interposer shown in FIGS. 1 and 2 is mounted on the circuit board 30 shown in FIG. 8, cream solder is applied to the surfaces of the two conductor pads 32 provided on the surface of the board body 31. After mounting the multilayer ceramic capacitor with an interposer so that the surface of each mounting electrode 23 is in contact with the applied cream solder, the cream solder is once melted and cured by a heat treatment such as a reflow soldering method, and the multilayer ceramic with an interposer Each mounting electrode 23 of the capacitor is bonded to each conductor pad 32 of the circuit board 30 via solder SOL. Incidentally, each conductor pad 32 of the circuit board 30 has a substantially rectangular outline slightly larger than each mounting electrode 23.

  Since the other end opening (lower end opening) of each of the inner holes 24a of the first and second through vias 24 of the interposer 20 is open and each inner hole 24a is in an empty state, The surplus solder can be positively penetrated into each inner hole 24a. That is, it is possible to avoid as much as possible that the excess amount of cream solder protrudes outside the surface of each mounting electrode 23 during the mounting, so that the molten solder passes through the end face in the length direction of the insulating substrate 21 during the heat treatment. Wetting on the end face of each external electrode 12 of the capacitor 10, that is, a solder SOL fillet extending from each conductor pad 32 of the circuit board 30 to the end face of each external electrode 12 of the multilayer ceramic capacitor 10 after the heat treatment. There is no.

  Therefore, even when a voltage, particularly an AC voltage is applied to the multilayer ceramic capacitor 10 in a state where the multilayer ceramic capacitor with an interposer is mounted on the circuit board 30, an electrostriction phenomenon occurs in the capacitor body 11. The warp that can occur in the circuit board 30 and its restoration can be reduced, and the noise can be reliably suppressed.

  In addition, each external electrode 12 of the multilayer ceramic capacitor 10 is bonded only to each connection electrode 22 of the interposer 20 via the solder SOL, and each mounting electrode 23 of the interposer 20 is connected to each conductor of the circuit board 30 via the solder SOL. Since the structure bonded only to the pad 32 can be realized, the stress transmitted from the multilayer ceramic capacitor 10 to the circuit board 30 when the electrostriction phenomenon occurs in the capacitor body 11 is caused between the multilayer ceramic capacitor 10 and the circuit board 30. Can be mitigated by the interposer 20 interposed between the two, thereby making it possible to more reliably suppress the noise.

  Furthermore, the first and second through vias 24 of the interposer 20 are located closer to the center in the length direction of the insulating substrate 21, and more inside than the center in the length direction of each external electrode 12 of the multilayer ceramic capacitor 10. Therefore, the stress transmitted from the multilayer ceramic capacitor 10 to the interposer 20 when an electrostriction phenomenon occurs in the capacitor body 11 can be relieved by the portions where the external electrodes 12 of the insulating substrate 31 face each other. The squealing can be more reliably suppressed.

<< 2nd Embodiment (FIGS. 9-11) >>
The multilayer ceramic capacitor with an interposer (not shown) shown in FIG. 11 includes the multilayer ceramic capacitor with an interposer shown in FIG. 1 and FIG.
In place of the interposer 20, an interposer 20-1 in which the length L22 of each connection electrode 22 is slightly shortened and the distance D22 is slightly shorter than the length L10 of the multilayer ceramic capacitor 10 is used ( (See FIGS. 9 and 10)
The configuration is different.

  For reference, if the specific value when the multilayer ceramic capacitor 10 is 2125 size is shown as an example, the specific value illustrated in the first embodiment column is 0.6 mm in length L22 of each connection electrode 22 of the interposer 20-1. The distance D22 is 1.8 mm, and the length L22b of the effective connection region 22b is 0.3 mm.

  This multilayer ceramic capacitor with an interposer and the multilayer ceramic capacitor interposer can also provide the same operations and effects as the operations and effects described in the first embodiment.

  As with each connection electrode 22, the length L23 of each mounting electrode 23 of the interposer 20-1 may be slightly shortened to make the distance D23 slightly shorter than the length L10 of the multilayer ceramic capacitor 10.

<< 3rd Embodiment (FIGS. 12-14) >>
The multilayer ceramic capacitor with an interposer shown in FIG. 14 (without reference numeral) is a multilayer ceramic capacitor with an interposer shown in FIG. 1 and FIG.
Instead of the interposer 20, the length L22 of each connection electrode 22 is slightly increased so that the distance D22 is slightly longer than the length L10 of the multilayer ceramic capacitor 10 and equal to the length L21 of the insulating substrate 21. Points using the interposer 20-2 (see Fig. 12 and Fig. 13)
The configuration is different.

  For reference, if the specific value when the multilayer ceramic capacitor 10 is 2125 size is shown as an example, the specific value exemplified in the first embodiment column is that the length L22 of each connection electrode 22 of the interposer 20-2 is 0.8 mm. The distance D22 is 2.2 mm, and the length L22b of the effective connection region 22b is 0.5 mm.

  This multilayer ceramic capacitor with an interposer and the multilayer ceramic capacitor interposer can also provide the same operations and effects as the operations and effects described in the first embodiment.

  Similarly to each connection electrode 22, the length L23 of each mounting electrode 23 of the interposer 20-2 is slightly increased so that the distance D23 is slightly longer than the length L10 of the multilayer ceramic capacitor 10, and the insulating substrate. 21 may be equal to the length L21.

<< 4th Embodiment (FIGS. 15-18) >>
The multilayer ceramic capacitor with an interposer shown in FIG. 18 (without reference numeral) is a multilayer ceramic capacitor with an interposer shown in FIG. 1 and FIG.
Instead of the interposer 20, the substantially semicircular protruding portions 22a are excluded from the connection electrodes 22 to make each inner edge straight, and from the mounting electrodes 23, the approximately semicircular protruding portions 23a The point of using the interposer 20-3 with the inner edges straight, excluding the points (see FIGS. 15 to 17)
The configuration is different.

  For reference, specific values when the multilayer ceramic capacitor 10 is 2125 size are shown as an example. The length L22 (0.7 mm) and distance D22 (2.0 mm) of each connection electrode 22 of the interposer 20-3 and the effective connection region. The length L22b (0.4 mm) of 22b and the length L23 (0.7 mm) and the distance D23 (2.0 mm) of each mounting electrode 23 are the same as the specific values exemplified in the first embodiment column. .

  This multilayer ceramic capacitor with an interposer and the multilayer ceramic capacitor interposer can also provide the same operations and effects as the operations and effects described in the first embodiment.

<< 5th Embodiment (FIGS. 19-21) >>
The multilayer ceramic capacitor with an interposer shown in FIG. 21 (without reference numeral) is a multilayer ceramic capacitor with an interposer shown in FIG. 1 and FIG.
Instead of the interposer 20, each of the connection electrodes 22 is configured so that the two solder non-adhering films 25 having a substantially rectangular shape close the one end openings (upper end openings) of the inner holes 24 a of the first and second through vias 24. 19 using the interposer 20-4 individually formed on a part of the surface (inner part) and part of one surface (upper surface) in the thickness direction of the insulating substrate 21 (part close to each connection electrode 22) (FIG. 19). And see FIG. 20)
The configuration is different.

  For reference, if the specific value when the multilayer ceramic capacitor 10 is 2125 size is shown as an example, the length L22 (0.7 mm) and distance D22 (2.0 mm) of each connection electrode 22 of the interposer 20-4 and the effective connection area The length L22b (0.4 mm) of 22b is the same as the specific value exemplified in the first embodiment column. Moreover, it differs from the specific values exemplified in the first embodiment column in that the length of each solder non-adhesion film 25 is 0.3 mm.

  This multilayer ceramic capacitor with an interposer and the multilayer ceramic capacitor interposer can also provide the same operations and effects as the operations and effects described in the first embodiment.

<< 6th Embodiment (FIGS. 22-24) >>
The multilayer ceramic capacitor with an interposer shown in FIG. 24 (without reference numeral) is a multilayer ceramic capacitor with an interposer shown in FIG. 1 and FIG.
A multilayer ceramic in which the length L12 of each external electrode 12 is slightly shorter than the length L22b (see FIG. 5) of the effective connection region 22b of each connection electrode 22 of the interposer 20, instead of the multilayer ceramic capacitor 10. Points using capacitor 10-1 (See Figs. 22 and 23)
In other words, instead of the interposer 20, an interposer in which the length L22b of the effective connection region 22b of each connection electrode 22 is slightly longer than the length L12 of each external electrode 12 of the multilayer ceramic capacitor 10 is used. The configuration is different.

  For reference, if the specific value in the case where the multilayer ceramic capacitor 10-1 is 2125 is shown as an example, the specific value illustrated in the first embodiment column is the length L12 of each external electrode 12 of the multilayer ceramic capacitor 10-1. Is 0.35 mm.

  This multilayer ceramic capacitor with an interposer and the multilayer ceramic capacitor interposer can also provide the same operations and effects as the operations and effects described in the first embodiment.

<< Other embodiments (not shown) >>
In the first to sixth embodiments, the width of the solder non-adhesion film 25 having a substantially rectangular shape as the interposers 20, 20-1, 20-2, 20-3 and 20-4 is made equal to the width W21 of the insulating substrate 21. Although shown, if the one end opening (upper end opening) of each of the inner holes 24a of the first and second through vias 24 can be closed, the width of the solder non-adhering film 25 is made smaller than the width W21 of the insulating substrate 21. However, the same operations and effects as those described in the first embodiment can be obtained.

  Further, in the first to sixth embodiments, the interposers 20, 20-1, 20-2, 20-3, and 20-4 have been shown in which the outline of the solder non-adhering film 25 is substantially rectangular. If the one end opening (upper end opening) of each of the inner holes 24a of the first and second through vias 24 can be closed, the contour shape of the solder non-adhering film 25 may be a polygonal shape other than a substantially rectangular shape, a circular shape, an elliptical shape, or the like. However, the same operations and effects as those described in the first embodiment can be obtained.

  Furthermore, in the first to sixth embodiments, the interposers 20, 20-1, 20-2, 20-3 and 20-4 have the width W22 of each connection electrode 22 equal to the width W10 of the multilayer ceramic capacitor 10. However, even if the width W22 of each connection electrode 22 is slightly narrower or slightly wider than the width W10 of the multilayer ceramic capacitor 10, the operations and effects described in the first embodiment column can be obtained. Similar actions and effects can be obtained.

  Furthermore, in the first to sixth embodiments, the interposers 20, 20-1, 20-2, 20-3 and 20-4 are provided with the first and second conductive vias 24 having substantially cylindrical shapes. However, even if the three-dimensional shape of the first and second conductor vias 24 is a substantially elliptical cylinder shape or a substantially polygonal cylinder shape other than a substantially cylindrical shape, the same actions and effects as those described in the first embodiment column and An effect can be obtained.

  Further, in the first to sixth embodiments, the interposers 20, 20-1, 20-2, 20-3 and 20-4 are provided with the first and second conductor vias 24 one by one. Even if at least one of the first and second conductor vias 24 is two or more, the same operation and effect as those described in the first embodiment can be obtained.

  DESCRIPTION OF SYMBOLS 10,10-1 ... Multilayer ceramic capacitor, 11 ... Capacitor main body, 11a ... Capacity | capacitance formation part, 11a1 ... Internal electrode layer, 11a2 ... Dielectric layer, 12 ... External electrode, 12a ... End surface part, 12b ... Rounding part, 20, 20-1, 20-2, 20-3, 20-4 ... interposer, 21 ... insulating substrate, 22 ... connection electrode, 23 ... mounting electrode, 24 ... first and second through vias, 24a ... first and second Inner hole of through-via, 25 ... solder non-adhering film, SOL ... solder.

Claims (10)

A multilayer ceramic capacitor with an interposer in which an interposer is attached to the multilayer ceramic capacitor,
(1) The multilayer ceramic capacitor has a substantially rectangular parallelepiped shape satisfying a relationship of length> width and height, and a capacitance forming portion having a structure in which a plurality of internal electrode layers are stacked via a dielectric layer. A substantially rectangular parallelepiped capacitor body, a substantially rectangular end surface portion covering each end surface in the length direction of the capacitor body, and a substantially four corners covering a part of the four side surfaces of the capacitor body continuously with the end surface portions. It has a cylindrical wraparound part, and includes two external electrodes in which a part of the plurality of internal electrode layers is connected to one side and the remaining part is connected to the other,
(2) The interposer has a substantially rectangular parallelepiped shape that satisfies the relationship of length> width and height, and the two external electrodes on one surface in the thickness direction of the insulating substrate. Two substantially rectangular connection electrodes provided to face one surface of each wraparound portion, and a substantially rectangular shape provided to face each of the two connection electrodes on the other surface in the thickness direction of the insulating substrate The two mounting electrodes are connected to one of the two mounting electrodes and one of the two mounting electrodes on the inner side of the end surface in the length direction of the insulating substrate, and one end of the inner hole is connected to the 2 A cylindrical first through via provided on one surface of one of the connection electrodes and the other end opening on one surface of the two mounting electrodes; and a lengthwise end surface of the insulating substrate In addition to the two connection electrodes on the inside So that one end of an inner hole is opened on the other surface of the two connection electrodes and the other end is opened on the other surface of the two mounting electrodes. A cylindrical second through-via provided, a solder non-adhesion film provided to close one end opening of the inner hole of the first through via and one end opening of the inner hole of the second through via; ,
(3) Each surface of the two external electrodes of the multilayer ceramic capacitor is joined to each of the surfaces of the two connection electrodes of the interposer via solder,
(4) A region from the other end opening of the inner hole of the first through via of the interposer to the solder non-adhesion film and a region from the other end opening of the inner hole of the second through via to the solder non-adhesion film Both are empty.
A multilayer ceramic capacitor with an interposer. The solder non-adhesion film of the interposer is formed on at least a part of each of the surfaces of the two connection electrodes so as to block one end opening of the inner hole of the first through via and one end opening of the inner hole of the second through via. Formed,
The solder is interposed between the remaining portions of the surfaces of the two connection electrodes and one surface of the wraparound portion of the two external electrodes of the multilayer ceramic capacitor,
The multilayer ceramic capacitor with an interposer according to claim 1. The solder non-adhesion film of the interposer is continuously formed on a part of one surface in the thickness direction of the insulating substrate in addition to a part of each of the surfaces of the two connection electrodes.
The multilayer ceramic capacitor with an interposer according to claim 2. When the distance between the outer edges along the length direction of the two connection electrodes of the interposer is D22 and the length of the insulating substrate of the interposer is L21, the two satisfy the relationship of D22 ≦ L21. ,
The multilayer ceramic capacitor with an interposer according to any one of claims 1 to 3. When the distance between the outer edges along the length direction of the two connection electrodes of the interposer is D22 and the length of the multilayer ceramic capacitor is L10, both satisfy the relationship of D22 ≦ L10.
The multilayer ceramic capacitor with an interposer according to any one of claims 1 to 4, wherein the multilayer ceramic capacitor has an interposer. An interposer for a multilayer ceramic capacitor used for mounting a multilayer ceramic capacitor on a circuit board or the like,
(1) The multilayer ceramic capacitor has a substantially rectangular parallelepiped shape satisfying a relationship of length> width and height, and a capacitance forming portion having a structure in which a plurality of internal electrode layers are stacked via a dielectric layer. A substantially rectangular parallelepiped capacitor body, a substantially rectangular end surface portion covering each end surface in the length direction of the capacitor body, and a substantially four corners covering a part of the four side surfaces of the capacitor body continuously with the end surface portions. It has a cylindrical wraparound part, and includes two external electrodes in which a part of the plurality of internal electrode layers is connected to one side and the remaining part is connected to the other,
(2) The interposer has a substantially rectangular parallelepiped shape that satisfies the relationship of length> width and height, and the two external electrodes on one surface in the thickness direction of the insulating substrate. Two substantially rectangular connection electrodes provided to face one surface of each wraparound portion, and a substantially rectangular shape provided to face each of the two connection electrodes on the other surface in the thickness direction of the insulating substrate The two mounting electrodes are connected to one of the two mounting electrodes and one of the two mounting electrodes on the inner side of the end surface in the length direction of the insulating substrate, and one end of the inner hole is connected to the 2 A cylindrical first through via provided on one surface of one of the connection electrodes and the other end opening on one surface of the two mounting electrodes; and a lengthwise end surface of the insulating substrate In addition to the two connection electrodes on the inside So that one end of an inner hole is opened on the other surface of the two connection electrodes and the other end is opened on the other surface of the two mounting electrodes. A cylindrical second through-via provided, a solder non-adhesion film provided to close one end opening of the inner hole of the first through via and one end opening of the inner hole of the second through via; ,
(3) Each of the surfaces of the two connection electrodes of the interposer is for joining one surface of the wraparound portion of the two external electrodes of the multilayer ceramic capacitor via solder,
(4) A region from the other end opening of the inner hole of the first through via of the interposer to the solder non-adhesion film and a region from the other end opening of the inner hole of the second through via to the solder non-adhesion film Both are empty.
An interposer for multilayer ceramic capacitors. The solder non-adhesion film of the interposer is formed on at least a part of each of the surfaces of the two connection electrodes so as to block one end opening of the inner hole of the first through via and one end opening of the inner hole of the second through via. Formed,
The interposer for a multilayer ceramic capacitor according to claim 6. The solder non-adhesion film of the interposer is continuously formed on a part of one surface in the thickness direction of the insulating substrate in addition to a part of each of the surfaces of the two connection electrodes.
The interposer for multilayer ceramic capacitors according to claim 7. When the distance between the outer edges along the length direction of the two connection electrodes of the interposer is D22 and the length of the insulating substrate of the interposer is L21, the two satisfy the relationship of D22 ≦ L21. ,
The multilayer ceramic capacitor interposer according to any one of claims 6 to 8, wherein the interposer is a multilayer ceramic capacitor. When the distance between the outer edges along the length direction of the two connection electrodes of the interposer is D22 and the length of the multilayer ceramic capacitor is L10, both satisfy the relationship of D22 ≦ L10.
The interposer for multilayer ceramic capacitors according to any one of claims 6 to 9.

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