JP2014019813A - Thermosetting resin composition, adhesive film, dicing tape integrated adhesive film, semiconductor device, multilayer circuit board and electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, an adhesive film and a dicing tape integrated adhesive film having high connectability, heat resistance and flexibility and, also, to provide a semiconductor device, a multilayer circuit board and an electronic component having excellent reliability using the thermosetting resin composition, the adhesive film and the dicing tape integrated adhesive film.SOLUTION: There is provided a thermosetting resin composition which constitutes a resin composition layer used for a solder joint surface of a first component, comprising an epoxy resin, a phenolic curing agent, and a compound with a flux function having an alkyl carboxyl group and two or more phenolic hydroxy groups positioned within a molecule.

Description

  The present invention relates to a thermosetting resin composition, an adhesive film, a dicing tape integrated adhesive film, a semiconductor device, a multilayer circuit board, and an electronic component.

With recent demands for higher functionality and lighter, thinner and smaller electronic devices, semiconductor packages used in these electronic devices are becoming smaller and multi-pin than ever. In order to obtain an electrical connection between these electronic components, solder bonding is used. Examples of the solder bonding include a conductive bonding portion between semiconductor chips, a conductive bonding portion between a semiconductor chip such as a package mounted in a flip chip and a circuit board, a conductive bonding portion between circuit boards, and the like. In order to ensure electrical connection strength and mechanical connection strength, a sealing resin generally called an underfill material is injected into the solder joint portion (underfill sealing).

  When the gap (gap) generated by the solder joint is reinforced with a liquid sealing resin (underfill material), the liquid sealing resin (underfill material) is supplied after the solder joint, and the solder is bonded by curing it. The part is reinforced. However, as the electronic components become thinner and smaller, the solder joints are narrowed in pitch / narrow gap. Therefore, even if liquid sealing resin (underfill material) is supplied after soldering, the liquid sealing between the gaps There is a problem that the stop resin (underfill material) does not spread and it becomes difficult to completely fill the resin.

  In order to solve such a problem, a method is known in which solder bonding and adhesion are collectively performed through a resin composition having a flux function (see, for example, Patent Document 1).

In addition, recently, for the production of bumps (spherical solder), use of a tin alloy not containing lead, that is, a so-called lead-free solder (spherical solder) instead of the Pb-Sn eutectic alloy has been studied. ing. By removing the oxide film on the surface of this lead-free solder bump (spherical solder), joint formation between the bump electrode and the electrode (soldering) and curing of the underfill (sealing filler) are performed simultaneously. Therefore, even under relatively high melting temperatures of this lead-free solder, a sufficient flux function is exhibited, and the reflow temperature is increased, and underfill (encapsulation) where moderate thermosetting proceeds under the high temperature conditions. Stop filler) is required.

JP 2007-107006 A

  Accordingly, an object of the present invention is to provide a thermosetting resin composition that is excellent in workability in flip chip connection and has high connection reliability.

Such an object is achieved by the present invention described in the following (1) to (12).
(1) A thermosetting resin composition constituting a resin composition layer used for a solder joint surface of a first member, which is an epoxy resin, a phenol-based curing agent, an alkyl carboxyl group, and two or more phenols A thermosetting resin composition comprising a compound having a flux function in which a functional hydroxyl group is arranged in a molecule.
(2) The thermosetting resin composition according to the above (1), wherein in the compound having the flux function, a value obtained by dividing the number of phenolic hydroxyl groups by the number of alkyl carboxyl groups is 1 to 3.
(3) The thermosetting resin composition according to (1) or (2), wherein the compound having the flux function is represented by the general formula (1).

In General formula (1), R1-R4 is H or OH, and n is an integer of 1-6.
(4) The compounding quantity of the compound which has the said flux function is the thermosetting as described in said (1) or (2) which is 0.01-30 weight% among the said thermosetting resin compositions after solvent volatilization. Resin composition.
(5) The thermosetting resin composition according to any one of (1) to (4), wherein the phenolic curing agent is solid at 25 ° C.
(6) The thermosetting resin composition according to the above (1) to (5), wherein the phenolic curing agent has a weight average molecular weight of 300 to 1500.
(7) Said (1) comprised so that the transmittance | permeability of the said resin composition layer in the light of wavelength 600nm may be 5% or more when the said resin composition layer of a non-hardened state is provided by average thickness of 30 micrometers. Thru | or the thermosetting resin composition in any one of (6).
(8) An adhesive film, wherein the thermosetting resin composition according to any one of (1) to (7) is in the form of a film.
(9) A dicing tape-integrated adhesive film, wherein the adhesive film according to (8) and a dicing tape are laminated.
(10) The solder joint surface of the first member and the solder joint of the second member using the thermosetting resin composition or the cured adhesive film according to any one of (1) to (9) above. A semiconductor device bonded to a surface.
(11) The solder joint surface of the first member and the solder joint of the second member by the thermosetting resin composition or the cured adhesive film according to any one of (1) to (8) above Multi-layer circuit board joined to the surface.
(12) The solder joint surface of the first member and the solder joint of the second member by the thermosetting resin composition or the cured adhesive film according to any one of (1) to (9) above An electronic component joined to the surface.

  According to the present invention, a flexible thermosetting resin composition can be provided without lowering the connectivity and heat resistance of the thermosetting resin composition having a flux function.

It is sectional drawing which shows an example of a thermosetting resin composition. It is sectional drawing which shows an example of the solder joining using a thermosetting resin composition. It is sectional drawing which shows an example of the manufacturing method of a multilayer circuit board. It is sectional drawing which shows an example of the manufacturing method of a dicing tape integrated adhesive film. It is sectional drawing which shows an example of the electronic component using the dicing tape integrated adhesive film.

  Hereinafter, the present invention will be described in detail.

(Thermosetting resin composition)
First, the thermosetting resin composition of the present invention will be described.
The thermosetting resin composition of the present invention can be suitably used regardless of whether it is a film or a liquid.

  The thermosetting resin composition of the present invention is a thermosetting resin composition having adhesiveness, and is used, for example, on the solder joint surface of a first member where solder joint is considered. Examples of the first member include a semiconductor chip, a semiconductor package, and a circuit board. In this specification, the circuit board means, for example, a semiconductor wafer, a rigid board, a flexible board, a rigid flexible board, or the like on which a wiring circuit is formed.

FIG. 1 is a cross-sectional view showing an embodiment in which the thermosetting resin composition of the present invention is applied to an adhesive film.
The adhesive film (resin composition layer) 1 may be installed between the cover film 2 and the base film 3 when not used as shown in FIG. The cover film 2 and the base film 3 have a function of protecting the adhesive film 1 and are peeled off when the adhesive film is used. As a cover film and a base film, the thing similar to the support film mentioned later can be used conveniently.

  The thermosetting resin composition constituting such an adhesive film 1 is a compound having an epoxy resin, a phenolic curing agent, a flux function in which an alkyl carboxyl group and two or more phenolic hydroxyl groups are arranged in the molecule. Is included.

In the present embodiment, the thermosetting resin composition can be composed of, for example, the following components.
In the present embodiment, the thermosetting resin composition constituting the adhesive film has a flux function. For example, (A) an epoxy resin (hereinafter also referred to as compound (A)), (B). A phenolic curing agent (hereinafter also referred to as compound (B)) and (C) a compound having a flux function in which an alkyl carboxyl group and two or more phenolic hydroxyl groups are arranged in the molecule (hereinafter referred to as compound (C )))). Furthermore, if necessary, other components such as (D) a film-forming resin having a weight average molecular weight of 10,000 to 1,000,000 (hereinafter also referred to as compound (D)) can be used as appropriate.

The conventional resin composition having a flux function has a problem that the connectivity and the heat resistance of the resin are good, while the film-like resin composition becomes brittle.
On the other hand, the thermosetting resin composition of the present invention uses a compound having a flux function in which an alkyl carboxyl group and two or more phenolic hydroxyl groups are arranged in the molecule, so that the film-like resin composition is flexible. In addition, the connectivity and heat resistance can be improved. The compound having the flux function will be described in detail later.

When the thermosetting resin composition (adhesive film 1) contains (A) an epoxy resin (hereinafter also referred to as compound (A)), the adhesive film is bonded to the circuit board. Unevenness (gap) generated by a plurality of wiring circuits or the like can be embedded more effectively. Moreover, since a softness | flexibility and flexibility can be provided to a thermosetting resin composition (adhesive film 1) by this, the thermosetting resin composition (adhesive film 1) excellent in handling property can be obtained. it can. In addition, electrical connection between the semiconductor chip and the circuit board can be improved.

  Examples of the compound (A) include bisphenol A type epoxy resins, bisphenol F type epoxy resins, glycidyl amine type epoxy resins, glycidyl ester type epoxy resins, and the like. Among these, the thermosetting resin composition (adhesive film 1) that satisfies the above-described relationship can be obtained more easily, and the semiconductor chip and substrate of the thermosetting resin composition (adhesive film 1) can be obtained. A bisphenol A type epoxy resin and a bisphenol F type epoxy resin, which are excellent in adhesion to a support or adherend such as the above, and further excellent in mechanical properties after curing of the thermosetting resin composition (adhesive film 1), are preferred.

  Moreover, as said compound (A) epoxy resin, More preferably, it is a liquid at 25 degreeC, and the viscosity in 25 degreeC is 500-50,000 mPa * s, More preferably, it is 800-40,000 mPa *. An epoxy resin which is s is mentioned. By setting the viscosity at 25 ° C. to the above lower limit value or more, the tackiness of the thermosetting resin composition becomes strong, and the handling property can be prevented from being lowered. Moreover, the softness | flexibility and flexibility of a thermosetting resin composition (adhesive film 1) are securable by making the viscosity in 25 degreeC below the said upper limit. Further, by using an epoxy resin having such a viscosity, a thermosetting resin composition satisfying the above-described relationship can be obtained more easily.

  Moreover, content of the said compound (A) epoxy resin is although it does not specifically limit, It is preferable that it is 10 to 80 weight%, and it is more preferable that it is 15 to 75 weight%. Thereby, the softness | flexibility and flexibility of a thermosetting resin composition (adhesive film 1) can be expressed more effectively. Moreover, by this, the tackiness of an adhesive film becomes strong and it can prevent more effectively that handling property falls.

  Moreover, when the thermosetting resin composition contains the compound (B), the glass transition temperature of the cured product of the thermosetting resin composition (adhesive film 1) is increased, and the phenolic novolak resin that is outgassed. The amount can be reduced, and the ion migration resistance can be improved. Moreover, since moderate softness | flexibility can be provided to a thermosetting resin composition (adhesive film 1), it becomes possible to improve the brittleness of the adhesive film 1. FIG. Furthermore, since an appropriate tackiness can be imparted to the thermosetting resin composition, an adhesive film excellent in workability can be obtained. Further, the electrical connection between the first member and the member facing the first member can be made better.

  The compound (B) is not particularly limited, and examples thereof include phenol novolak resin, cresol novolak resin, bisphenol A type novolak resin, bisphenol F type novolak resin, bisphenol AF type novolak resin and the like. Among them, the above-described relationship can be satisfied more easily, and the glass transition temperature of the cured product of the adhesive film 1 can be effectively increased, and the amount of phenolic novolak resin that becomes outgas is reduced. It is preferable to use a phenol novolac resin or a cresol novolac resin.

The content of the compound (B) in the thermosetting resin composition (adhesive film 1) is not particularly limited, but is preferably 3 to 30% by weight, and 5 to 25% by weight. It is more preferable. By setting the content of the compound (B) within the above range, when the resin composition (adhesive film 1) is bonded to the circuit board, the unevenness (gap) caused by a plurality of wiring circuits on the circuit board is more increased. Can be embedded effectively. In addition, it is possible to simultaneously increase the glass transition temperature of the cured product of the resin composition (adhesive film 1) and effectively reduce the amount of a material that causes outgassing, such as a phenol-based novolac resin. it can.

  The total content of mononuclear to trinuclear in the compound (B) is preferably more than 30% by weight (the total content of four or more nuclei is 70% by weight or less). Thereby, the reactivity with (A) epoxy resin can be made a suitable balance, and the amount of unreacted phenolic novolak resin remaining in the cured product of the thermosetting resin composition (adhesive film 1) can be reduced. And migration resistance can be improved. Furthermore, since moderate softness | flexibility is provided, it can be made suitable at the time of the operation | work of a thermosetting resin composition (adhesive film 1).

  Furthermore, the total content of mononuclear to trinuclear in the compound (B) is preferably less than 70% by weight. Thereby, since the amount of outgas at the time of hardening a thermosetting resin composition (adhesive film 1) can be reduced, contamination of the surface of a support or adherend such as a semiconductor chip or a substrate, or migration resistance Can be suppressed. Furthermore, the tackiness of the thermosetting resin composition (adhesive film 1) can be made suitable, and the workability at the time of adhesion of the thermosetting resin composition (adhesive film 1) can be improved.

  Although the total content of the binuclear body and the trinuclear body in the compound (B) is not particularly limited, it is preferably 30 to 70%. Thereby, the amount of outgas at the time of curing the thermosetting resin composition (adhesive film 1) increases, and it is more effective to contaminate the surface of a support or adherend such as a semiconductor chip or a circuit board. Can be prevented. Thereby, the softness | flexibility and flexibility of a thermosetting resin composition (adhesive film 1) can be ensured more effectively.

  The content of the mononuclear substance in the compound (B) is not particularly limited, but is preferably 1% or less, and particularly preferably 0.8% or less. By setting the content of the mononuclear body within the above range, the amount of outgas when the thermosetting resin composition (adhesive film 1) is cured can be reduced, and a support such as a semiconductor chip or a circuit board. Alternatively, contamination of the adherend can be suppressed, and migration resistance can be improved.

  Although the weight average molecular weight of the said compound (B) is not specifically limited, It is preferable that it is 300-1,500, and it is especially preferable that it is 400-1,400. Thereby, the amount of outgas at the time of curing the thermosetting resin composition (adhesive film 1) increases, and it is more effective to contaminate the surface of a support or adherend such as a semiconductor chip or a circuit board. Can be prevented. Thereby, the softness | flexibility and flexibility of a thermosetting resin composition (adhesive film 1) can be ensured more effectively. Here, the weight average molecular weight can be measured by GPC (gel permeation chromatogram).

  In addition, the resin composition (adhesive film 1) includes (C) a compound having a flux function in which an alkyl carboxyl group and two or more phenolic hydroxyl groups are arranged in the molecule, whereby the first member (semiconductor chip, Removing the oxide film on the solder surface of at least one of the first terminal of the substrate or the like and the second terminal of the second member (semiconductor chip, substrate or the like). Since the oxide film on the surface of the first terminal and the second terminal of the second member can be removed, and the first terminal and the second terminal can be securely soldered, connection reliability A multilayer circuit board, an electronic component, a semiconductor device and the like having a high height can be obtained.

However, the conventional resin composition has a problem that the film-like resin composition becomes brittle while the connectivity and the heat resistance of the resin are good due to the selection of the compound having a flux function. .
The resin composition of the present invention comprises (C) a compound having a flux function in which an alkyl carboxyl group and two or more phenolic hydroxyl groups are arranged in the molecule. Thereby, the fall of the flux function by heating can be prevented, and the electrical connection between the semiconductor chip and the circuit board can be performed satisfactorily.

  Such a compound (C) can give a softness | flexibility to the adhesive film before hardening with the alkyl carboxyl group which exists in a molecule | numerator. Furthermore, it has 3 or more cross-linking points in the molecule. The heat resistance after curing of the adhesive film can be increased.

Alkyl chain length of the compound (C) _(-CH 2 -) as the n, the value of n is preferably 1-6, 2-4 is more preferable. As a result, it is possible to prevent a decrease in the heat resistance of the cured product resulting from a longer distance between the crosslinking points and a lower crosslinking density.

  In the compound (C), the value obtained by dividing the number of phenolic hydroxyl groups by the number of alkyl carboxyl groups is preferably 1 to 3, and particularly preferably 2. By setting the value obtained by dividing the number of phenolic hydroxyl groups by the number of alkyl carboxyl groups within the above range, the heat resistance of the resin and the film flexibility before curing can be achieved at a suitable value.

  In addition, the compound having a flux function in which an alkyl carboxyl group and two or more phenolic hydroxyl groups are arranged in the molecule preferably has, for example, a structure represented by the chemical formula (1). Specific examples include 2,2bis (4-hydroxyphenyl) propionic acid, 2,2bis (4-hydroxyphenyl) pentanoic acid, 2,2bis (4-hydroxyphenyl) butanoic acid, and the like.

  The compounding amount of the compound (C) is preferably 1 to 20% by weight, and more preferably 3 to 10% by weight. When the compounding amount of the compound (C) is in the above range, the flux activity can be exhibited more efficiently. Further, when the resin composition (adhesive film 1) is cured, it is possible to prevent the unreacted compound (A), compound (B), and compound (C) from remaining, thereby improving migration resistance. be able to.

  Further, the thermosetting resin composition may include (D) a film-forming resin that improves the film-forming property of the adhesive film 1. Thereby, it becomes easy to make a thermosetting resin composition into a film state. Also, the mechanical properties of the adhesive film 1 are excellent.

  Examples of the film-forming resin (D) include (meth) acrylic resins, phenoxy resins, polyester resins, polyurethane resins, polyimide resins, siloxane-modified polyimide resins, polybutadiene, polypropylene, styrene-butadiene-styrene copolymers, Styrene-ethylene-butylene-styrene copolymer, polyacetal resin, polyvinyl butyral resin, polyvinyl acetal resin, butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-butadiene -Styrene copolymer, polyvinyl acetate, nylon and the like. These may be used alone or in combination of two or more. Among these, as the (D) film-forming resin, it is preferable to use at least one selected from the group consisting of (meth) acrylic resins, phenoxy resins, and polyimide resins.

  The weight average molecular weight of the film-forming resin (D) is not particularly limited, but is preferably 10,000 or more, more preferably 20,000 to 1,000,000, still more preferably 30,000 to 900,000. When the weight average molecular weight is in the above range, the film formability of the adhesive film 1 can be further improved.

The content of the film-forming resin (D) is not particularly limited, but 1 to 1 in the thermosetting resin composition.
It is preferably 40% by weight, more preferably 2 to 25% by weight, still more preferably 3 to 10% by weight. When the content is within the above range, the fluidity of the thermosetting resin composition (adhesive film 1) can be suppressed, and handling of the adhesive film 1 becomes easy.

Moreover, the thermosetting resin composition (adhesive film 1) may further contain a curing accelerator. A hardening accelerator can be suitably selected according to the kind etc. of curable resin. As the curing accelerator, for example, an imidazole compound having a melting point of 150 ° C. or higher can be used. When the melting accelerator used has a melting point of 150 ° C. or higher, the solder component constituting the solder bump can move to the surface of the internal electrode provided on the semiconductor chip before the curing of the adhesive film 1 is completed. The electrical connection between the internal electrodes can be made good. Examples of the imidazole compound having a melting point of 150 ° C. or higher include 2-phenyl-4-methylimidazole, 2-phenylhydroxyimidazole, 2-phenyl-4-methylhydroxyimidazole, and the like. They can be used in combination.

The content of the curing accelerator in the thermosetting resin composition (adhesive film 1) is not particularly limited, but is preferably 0.005 to 10% by weight, and 0.01 to 5% by weight. Is more preferable. Thereby, the function as a curing accelerator can be exhibited more effectively, the curability of the thermosetting resin composition can be improved, and the melt viscosity of the resin at the melting temperature of the solder components constituting the solder bumps. Therefore, a good solder joint structure can be obtained. Moreover, the preservability of the thermosetting resin composition (adhesive film 1) can be further improved.
These curing accelerators may be used alone or in combination of two or more.

  Moreover, the thermosetting resin composition of the present invention may further contain a silane coupling agent. By including the silane coupling agent, the adhesion of the thermosetting resin composition (adhesive film 1) to the first member or the second member such as a semiconductor chip or a substrate can be enhanced. As the silane coupling agent, for example, an epoxy silane coupling agent, an aromatic-containing aminosilane coupling agent and the like can be used. These may be used alone or in combination of two or more. The blending amount of the silane coupling agent may be appropriately selected, but is preferably 0.01 to 10% by weight, more preferably 0.05 to 5% by weight, based on the entire resin composition. More preferably, it is 0.1 to 2% by weight.

  The thermosetting resin composition (adhesive film 1) of the present invention may further contain an inorganic filler. Thereby, the linear expansion coefficient of the adhesive film 1 can be reduced, thereby improving the reliability.

  Examples of the inorganic filler include silver, titanium oxide, silica, mica, and the like. Among these, silica is preferable. Moreover, as a shape of a silica filler, although there exists crushing silica, spherical silica, etc., spherical silica is especially preferable.

  The average particle diameter of the inorganic filler is not particularly limited, but is preferably 0.01 μm or more and 20 μm or less, and more preferably 0.1 μm or more and 5 μm or less. By setting it as the said range, aggregation of a filler can be suppressed in the adhesive film 1, and an external appearance can be improved.

  Although content of the said inorganic filler is not specifically limited, It is preferable that it is 0.1 to 80 weight% with respect to the whole resin composition, and it is more preferable that it is 20 to 70 weight%. By setting the above range, the difference in linear expansion coefficient between the cured adhesive film 1 and the contacted body is reduced, and the stress generated during thermal shock can be reduced. Can be more reliably suppressed. Furthermore, since it can suppress that the elasticity modulus of the adhesive film 1 after hardening becomes high too much, reliability of a semiconductor device, a multilayer circuit board, an electronic component, etc. rises.

The adhesive film 1 is obtained by applying a varnish obtained by mixing each resin component as described above in a solvent onto a base material (base film 3) subjected to a peeling treatment such as a polyester sheet, at a predetermined temperature. It can be obtained by drying to such an extent that it does not substantially contain a solvent. The solvent used here is not particularly limited as long as it is inert to the components used, but ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, DIBK (diisobutyl ketone), cyclohexanone, DAA (diacetone alcohol), etc. Benzene,
Aromatic hydrocarbons such as xylene and toluene, alcohols such as methyl alcohol, ethyl alcohol, isopropyl alcohol and n-butyl alcohol, cellosolve such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate, NMP (N-methyl-2-pyrrolidone), THF (tetrahydrofuran), DMF (dimethylformamide), DBE (dibasic acid ester), EEP (ethyl 3-ethoxypropionate), DMC (dimethyl carbonate) and the like are preferably used. . The amount of the solvent used is preferably in the range where the solid content of the components mixed in the solvent is 10 to 60% by weight.

  Although the thickness of the adhesive film 1 is not specifically limited, It is preferable that it is 1-300 micrometers, and it is more preferable that it is 5-200 micrometers. When the thickness is within the above range, the resin component can be sufficiently filled in the gap between the joint portions, and the mechanical adhesive strength after curing of the resin component can be ensured.

  When the adhesive film 1 is provided with an average thickness of 30 μm, the transmittance of the adhesive film 1 with respect to light having a wavelength of 600 nm is preferably 5% or more. Thereby, the alignment recognition accuracy at the time of mounting a member with an adhesive film on a circuit board etc. can be performed without a problem.

  The adhesive film 1 preferably has a minimum melt viscosity at 25 to 250 ° C. of 0.01 to 100,000 Pa · s. Thereby, the embedding property to the unevenness can be further improved. Furthermore, the minimum melt viscosity at 25 to 250 ° C. is more preferably 0.05 to 70,000 Pa · s, and particularly preferably 0.1 to 30,000 Pa · s. Thereby, it can be excellent in the exclusion property of the adhesive film in a bump part, and the suppression performance of a seepage.

  In the above description, the case where the thermosetting resin composition is applied to a film is described, but it may be liquid. Moreover, the adhesive film in this invention refers to the film which the thermosetting resin composition of this invention is a film form at 25 degreeC, and can adhere | attach two to-be-adhered bodies. Moreover, it is preferable that an adhesive film has the softness | flexibility of the grade which can be wound in roll shape.

(Semiconductor device in which the solder joint surface of the first member and the solder joint surface of the second member are joined by the thermosetting resin composition or the cured product of the adhesive film)
Next, a semiconductor device using the thermosetting resin composition or adhesive film of the present invention and a manufacturing method thereof will be described.

FIG. 2 is a cross-sectional view showing an example of a method for manufacturing a semiconductor device.
As shown in FIG. 2, a circuit board 4 (first member) having a substrate 41, a wiring circuit 42, an insulating part 43, and a pad part 44 is prepared (FIG. 2A).

The average thickness of the wiring circuit 42 on the circuit board 4 is preferably 1 to 30 μm, and more preferably 5 to 20 μm. Thereby, the circuit board 4 is obtained by the thermosetting resin composition 1.
Unevenness (gap) generated by the plurality of wiring circuits 42 above can be more reliably embedded.
The distance between the centers of the adjacent wiring circuits 42 is preferably 1 to 500 μm, and more preferably 5 to 300 μm. Thereby, the thermosetting resin composition 1 can reliably bury the unevenness (gap) generated between the circuit board 4 and the semiconductor chip 5 (second member).

  The thermosetting resin composition 1 is applied so as to cover the entire surface of the circuit board 4 (FIG. 2B). When the resin composition 1 is in a liquid state, the applying method includes knife coating method, roll coating method, spray coating method, gravure coating method, bar coating method, curtain coating method, screen coating method, die coating method, metal mask, A printing method using a mesh mask, a spin coating method, a method of attaching a sheet formed on a release film, or the like can be used. Moreover, when the thermosetting resin composition 1 is a film form (adhesion film), as a method to provide, a roll laminator, a flat plate press, a wafer laminator etc. are mentioned.

Next, the semiconductor chip 5 (second member) provided with the solder bumps 51 is prepared.
While aligning the solder bumps 51 of the semiconductor chip 5 and the pad portions 44 of the circuit board 4, the semiconductor chip 5 and the circuit board 4 are temporarily press-bonded via the thermosetting resin composition 1. The semiconductor chip 5 is fixed to (Fig. 2 (c)).

  A method for temporary pressure bonding is not particularly limited, but a pressure bonding machine, a flip chip bonder, or the like can be used. The conditions for temporary pressure bonding are not particularly limited, but the temperature is preferably 60 to 200 ° C, particularly preferably 80 to 180 ° C. The time is preferably from 0.1 to 60 seconds, particularly preferably from 1 to 60 seconds. Furthermore, the pressure is preferably from 0.1 to 2.0 MPa, particularly preferably from 0.3 to 1.5 MPa. As a result, the semiconductor chip 5 can be securely temporarily bonded to the circuit board 4.

Next, the solder bump 51 is melted to form a solder connection portion 511 to be soldered to the pad portion 44 (FIG. 2D).
Although the conditions for solder connection depend on the type of solder used, for example, in the case of Sn3.5Ag, the temperature is preferably 220 to 260 ° C, particularly preferably 230 to 250 ° C. The time is preferably 5 to 500 seconds, particularly preferably 10 to 100 seconds. Furthermore, the pressure is preferably from 0.1 to 2.0 MPa, particularly preferably from 0.3 to 1.5 MPa. The conditions for solder connection can be appropriately selected depending on the solder used.

  This solder bonding is preferably performed under conditions such that the thermosetting resin composition 1 is cured after the solder bumps 51 are melted. That is, the solder bonding is preferably performed under the condition that the solder bump 51 is melted but the curing reaction of the thermosetting resin composition 1 does not proceed so much. Thereby, the shape of the solder connection part at the time of soldering can be made into the stable shape which is excellent in connection reliability.

Next, the thermosetting resin composition 1 is heated and cured. The conditions for curing are not particularly limited, but the temperature is preferably from 130 to 220 ° C, particularly preferably from 150 to 200 ° C. The time is preferably 30 to 500 minutes, particularly preferably 60 to 180 minutes. Further, the thermosetting resin composition 1 may be cured under a pressurized atmosphere. Although it does not specifically limit as a pressurization method, It can carry out by introduce | transducing pressurized fluids, such as nitrogen and argon, in oven. The applied pressure is preferably 0.1 to 10 MPa, particularly preferably 0.5 to 5 MPa. Thereby, the void in the thermosetting resin composition 1 can be reduced.
In this way, a semiconductor device 10 in which the circuit board 4 and the semiconductor chip 5 are bonded with the cured product 1 ′ of the thermosetting resin composition 1 as shown in FIG. 2D can be obtained. Since the semiconductor device 10 is bonded with the cured product 1 ′ of the thermosetting resin composition 1 as described above, it has excellent electrical connection reliability.

(Multilayer circuit board and electronic component in which the solder joint surface of the first member and the solder joint surface of the second member are joined by the thermosetting resin composition or the cured product of the adhesive film)
Next, a multilayer circuit board, an electronic component and a manufacturing method thereof using the thermosetting resin composition of the present invention will be described.

FIG. 3 is a cross-sectional view showing an example of a method for manufacturing a multilayer circuit board.
First, a circuit board 6 (first member) having a substrate 61, a wiring circuit 62, an insulating part 63, and a pad part 64 is prepared (FIG. 3A).
On the other hand, a circuit board 7 (second member) having a base 71, a wiring circuit 72, an insulating part 73, a solder bump 75, and a pad part 74 is prepared, and thermosetting is performed so as to cover the solder joint surface of the circuit board 7. After applying the functional resin composition 1 in the same manner as described above (FIG. 3B), the circuit board 6 and the circuit board 6 are aligned while aligning the pad portions 64 of the circuit board 6 and the solder bumps 75 of the circuit board 7. The circuit board 7 is temporarily pressure-bonded under the same conditions as described above (FIG. 3C).

Next, the solder bumps 75 are melted under the same conditions as the above-described solder joints to form solder joint portions 711 that are soldered to the respective pad portions 64 (FIG. 3D).
Thereafter, the thermosetting resin composition 1 is cured under the same conditions as the curing conditions of the thermosetting resin composition 1 described above, and the circuit board 6 and the circuit board 7 as shown in FIG. The multilayer circuit board 100 adhered with the cured product 1 ′ of the thermosetting resin composition 1 can be obtained. Since the multilayer circuit board 100 is bonded with the cured product 1 ′ of the thermosetting resin composition 1 as described above, it has excellent electrical connection reliability.

In the present embodiment, an embodiment in which two layers of circuit boards are stacked has been described, but the number of boards to be stacked may be three or more. When three or more layers are stacked, the method of sequentially stacking can be used as described above. Moreover, after producing the laminated body of the state which pressure-bonded three or more layers, you may use the method of solder-joining each solder joint part of the said laminated body collectively.
Moreover, the electronic component which adhere | attached the semiconductor chip and the semiconductor chip with the hardened | cured material 1 'of the thermosetting resin composition 1 by the method similar to the above can be obtained.

As mentioned above, although this invention was demonstrated based on suitable embodiment, this invention is not limited to these.
For example, a method for manufacturing a semiconductor device, a multilayer circuit board, and an electronic component is not limited to the above method.

(Dicing tape integrated adhesive film)
The dicing tape-integrated adhesive film of the present invention has an adhesive film in which the thermosetting resin composition is formed into a film and a dicing tape. In addition, an intervening layer and an outer layer described later may be provided. The dicing tape-integrated adhesive film of the present invention electrically connects the first terminal of the first member and the second terminal of the second member, and the first member and the second member. These members can be bonded.

  In the dicing tape-integrated adhesive film of the present invention, only the adhesive film is a constituent element of a semiconductor device, a multilayer circuit board, an electronic component, or the like. By combining the adhesive film and other members in the dicing tape-integrated adhesive film, the dicing tape-integrated adhesive film of the present invention is excellent in workability.

(Dicing tape)
The dicing tape can be used as long as it is composed of a support film and an adhesive layer, and any generally used dicing tape can be used.
The support film of the dicing tape preferably has radiolucency. Examples of the support film include polyethylene, polypropylene, ethylene / propylene copolymer, polyolefin, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, polyvinylidene chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate. Phthalate, polyurethane, ethylene / vinyl acetate copolymer, ionomer, ethylene / (meth) acrylic acid copolymer, ethylene / (meth) acrylic acid ester copolymer, polystyrene, vinyl polyisoprene, polycarbonate, polyphenylene sulfide, polyether Examples include ether ketone, acrylonitrile / butadiene / styrene copolymer, polyimide, polyetherimide, polyamide, and fluororesin. May be used alone or a mixture of two or more.

The surface of the support film can be subjected to chemical or physical surface treatment in order to improve the adhesion with the pressure-sensitive adhesive layer.
The support film may contain various additives (filler, plasticizer, antioxidant, flame retardant, antistatic agent) as long as the effects of the present invention are not impaired.

  Although the thickness of a support film is not specifically limited, It is preferable that it is about 5-200 micrometers, and it is more preferable that it is about 30-150 micrometers. When the thickness of the support film is within the above range, the support film has appropriate rigidity, so that the dicing tape and the adhesive film are securely supported, and the handling of the dicing tape-integrated adhesive film is easy. In addition, since the dicing tape-integrated adhesive film is appropriately curved, the adhesion with the first member having the first terminal can be enhanced.

  The pressure-sensitive adhesive layer of the dicing tape is composed of a first resin composition containing an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a vinyl alkyl ether-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, and the like. A thing can be used and an acrylic adhesive is preferable among these.

Examples of the acrylic pressure-sensitive adhesive include resins composed of (meth) acrylic acid and esters thereof, (meth) acrylic acid and esters thereof, and unsaturated monomers copolymerizable therewith (for example, vinyl acetate, Copolymers with styrene, acrylonitrile, etc.) are used. Two or more kinds of these copolymers may be mixed.
Of these, one or more selected from the group consisting of methyl (meth) acrylate, ethylhexyl (meth) acrylate and butyl (meth) acrylate, and selected from hydroxyethyl (meth) acrylate and vinyl acetate Preferred are copolymers with one or more of the above. This makes it easy to control the adhesiveness and adhesiveness with a partner (for example, an intervening layer, a support film, etc. described later) to which the adhesive layer of the dicing tape adheres.

In addition, in order to control tackiness (adhesiveness), monomers such as urethane acrylate, acrylate monomers, polyisocyanate compounds (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate) and the like monomers and An oligomer may be added.
Furthermore, you may add the photoinitiator similar to what is used for the resin layer mentioned later to the adhesive layer of a dicing tape.

Also, for the purpose of increasing adhesive strength and shear strength, tackifying rosin resin, terpene resin, coumarone resin, phenol resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin, aliphatic aromatic petroleum resin, etc. An agent or the like may be added.
The pressure-sensitive adhesive layer may contain various additives (fillers, plasticizers, antioxidants, thickeners, crosslinking agents, antistatic agents) as long as the effects of the present invention are not impaired. .

  Although the thickness of the adhesive layer of a dicing tape is not specifically limited, It is preferable that it is about 1-100 micrometers, and it is more preferable that it is especially about 3-50 micrometers. When the thickness of the pressure-sensitive adhesive layer is within the above range, it does not peel off at the time of dicing, it can be peeled off relatively easily along with the tensile load at the time of picking up, and it is difficult to be deformed at the time of dicing or picking up. Excellent in picking up and picking up.

  When the dicing tape-integrated adhesive film has an intervening layer described later between the adhesive layer of the dicing tape and the adhesive film, the adhesive layer of the dicing tape is preferably higher in adhesiveness than the intervening layer. Thereby, the adhesive force of the adhesive layer of the dicing tape with respect to the intervening layer and the support film becomes larger than the adhesive force of the intervening layer with respect to the adhesive film. Therefore, in a pickup process in manufacturing a semiconductor device described later, it is possible to cause peeling at a desired interface (that is, an interface between the intervening layer and the adhesive film) where peeling should occur.

(Intervening layer and outer layer)
Further, the dicing tape-integrated adhesive film of the present invention may be provided with one or more intervening layers in addition to the above-mentioned adhesive film and dicing tape. Layer. Moreover, you may provide one or more outer layers in one side or both surfaces of a dicing tape integrated adhesive film, and the following base films are mentioned as an outer layer. By providing the outer layer, it also has a function as a protective film for protecting from contamination and impact.

(Base film)
Examples of the base film include polyethylene, polypropylene, ethylene / propylene copolymer, polyolefin, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, polyvinylidene chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyethylene. Naphthalate, polyurethane, ethylene / vinyl acetate copolymer, ionomer, ethylene / (meth) acrylic acid copolymer, ethylene / (meth) acrylic acid ester copolymer, polystyrene, vinyl polyisoprene, polycarbonate, polyphenylene sulfide, poly Examples include ether ether ketone, acrylonitrile / butadiene / styrene copolymer, polyimide, polyetherimide, polyamide, and fluororesin. The one or more surface of the mixture base film can be used in the can to enhance the adhesion between the resin layer described later, the chemical or physical surface treatment is conducted.

  The base film may contain various additives (fillers, plasticizers, antioxidants, flame retardants, antistatic agents) as long as the effects of the present invention are not impaired.

  Although the average thickness of a base film is not specifically limited, It is preferable that it is about 5-200 micrometers, and it is more preferable that it is about 10-150 micrometers. Thereby, since a base film becomes what has moderate rigidity, it can support a dicing tape and an adhesive film reliably, and can handle the dicing tape integrated adhesive film easily.

(Resin layer)
The resin layer is composed of a general pressure-sensitive adhesive, specifically, a resin containing an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a vinyl alkyl ether-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, and the like. What is comprised with the resin composition for layers can be used, Among these, an acrylic adhesive is preferable.
Examples of the acrylic pressure-sensitive adhesive include resins composed of (meth) acrylic acid and esters thereof, (meth) acrylic acid and esters thereof, and unsaturated monomers copolymerizable therewith (for example, vinyl acetate, And copolymers with styrene, acrylonitrile, etc.). Two or more of these resins may be mixed.

  Among these, one or more selected from the group consisting of methyl (meth) acrylate, ethylhexyl (meth) acrylate and butyl (meth) acrylate, and hydroxyethyl (meth) acrylate and vinyl acetate A copolymer with one or more selected is preferred. As a result, it becomes easy to control the adhesiveness and adhesiveness with the member and base material with which the resin layer is in contact.

  The resin layer has an isocyanate such as urethane acrylate, an acrylate monomer, a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate) in order to control adhesiveness (adhesiveness). Monomers and oligomers such as compounds may be added.

  Further, when the resin layer is cured by ultraviolet rays or the like, the resin layer is formed by using methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- as a photopolymerization initiator. [4- (Methylthio) -phenyl] -2-morpholinopropane-1 and other acetophenone compounds, benzophenone compounds, benzoin compounds, benzoin isobutyl ether compounds, benzoin benzoic acid methyl compounds, benzoin benzoic acid compounds, benzoin Methyl ether compounds, benzylfinyl sulfide compounds, benzyl compounds, dibenzyl compounds, diacetyl compounds and the like may be added.

  The resin layer has a rosin resin, terpene resin, coumarone resin, phenol resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin, aliphatic aromatic petroleum oil for the purpose of increasing adhesive strength and shear strength. You may add tackifiers, such as resin.

  The resin layer may contain various additives (fillers, plasticizers, antioxidants, thickeners, crosslinking agents, antistatic agents) as long as the effects of the present invention are not impaired.

The average thickness of such a resin layer is not particularly limited, but is preferably about 1 to 100 μm, and more preferably about 3 to 50 μm. If the thickness of the resin layer is within the above range, it will not peel off during dicing, it can be peeled off relatively easily along with the tensile load during picking up, and it is difficult to cause deformation during dicing or picking up. Excellent pickup performance.
In addition, film formation of the base film or the resin layer as an intervening layer is performed by applying each of the above resin compositions by various application methods and then drying the applied film, or a film made of each resin composition. Can be carried out by a method of laminating. Further, the coating film may be cured by irradiating radiation such as ultraviolet rays.

  Examples of the coating method include knife coating, roll coating, spray coating, gravure coating, bar coating, curtain coating, screen coating, and die coating.

The thickness of the dicing tape-integrated adhesive film (total thickness of other constituent layers such as a dicing tape composed of a support film and an adhesive layer, an adhesive film and an intervening layer) is not particularly limited, but is 10 to 1000 μm. Is preferably about 20 to 500 μm. When the thickness of the dicing tape-integrated adhesive film is within the above range, the dicing tape-integrated adhesive film is excellent in workability from the semiconductor wafer singulation process to the semiconductor chip bonding process in the manufacture of a semiconductor device. Furthermore, the ratio of the thickness of the adhesive layer of the dicing tape and the thickness of the adhesive film, the ratio of the thickness of the dicing tape (total thickness of the support film and the adhesive layer), and the thickness of the adhesive film, etc. are adjusted. Thus, dicing properties and pickup properties can be improved.

(Manufacturing method of dicing tape integrated adhesive film)
The position embodiment of the manufacturing method of the dicing tape integrated adhesive film of this invention is demonstrated below.
First, a base material 3a shown in FIG. 4A is prepared, and an intervening layer 21 is formed on one surface of the base material 3a to produce a laminate 2a. Examples of the method for producing the laminate 2a include a casting method, a calendar method, an extrusion method, a dry lamination method, and the like.

Further, similarly to the laminate 2a, as shown in FIG. 4 (a), an adhesive film 1 is formed on one surface of the prepared base material 3b, whereby the base material 3b and the adhesive film 1 are formed. The laminate 2b is obtained.
Further, in the same manner as each of the laminates 2a and 2b, as shown in FIG. 4A, an adhesive layer 22 of a dicing tape is formed on one surface of the prepared support film 3, thereby supporting the laminate. A laminate 2c of the film 4 and the adhesive layer 22 of the dicing tape is obtained.

  Next, as shown in FIG. 4B, the laminated body 2a and the laminated body 2b are laminated so that the intervening layer 21 and the adhesive film 1 are in contact with each other to obtain a laminated body 2d. This lamination can be performed by, for example, a roll lamination method.

  Next, as shown in FIG. 4C, the base material 3a is peeled from the laminate 2d. And as shown in FIG.4 (d), the outer side part of the effective area | region of the said adhesive film 1 and the said intervening layer 21 is removed, leaving the base material 3b with respect to the laminated body 2d which peeled the said base material 3a. To do. Here, the effective region refers to a region whose outer periphery is slightly smaller than the outer diameter of the semiconductor wafer (first member) 5 a or larger than the outer diameter and smaller than the inner diameter of the wafer ring 9. .

  Next, as shown in FIG. 4E, a laminate 2d in which the substrate 3a is peeled off and the outer portion of the effective area is removed in a ring shape so that the adhesive layer 22 of the dicing tape is in contact with the exposed surface of the intervening layer 21. And laminate 2c. Then, the base material 3b is peeled off to obtain the dicing tape integrated adhesive film 20 shown in FIG. In addition, you may use the base material 3b as an outer layer of a dicing tape integrated adhesive film, without peeling.

  As mentioned above, although one embodiment of the method for producing a dicing tape integrated adhesive film by directly forming a dicing tape on the support film has been described above, the adhesive layer 22 and the intervening layer 21 of the dicing tape are also provided on the support film. The adhesive film 1 may be formed in a desired order to produce a dicing tape integrated adhesive film. Further, the base material 3b of the adhesive film 1 is applied as an intervening layer as it is, and the dicing tape pressure-sensitive adhesive layer 22, the intervening layer 21 (base material 3b), and the adhesive film 1 are formed in the desired order on the support film, and then dicing is performed. A tape-integrated adhesive film may be produced. Although the dicing tape-integrated adhesive film having the intervening layer 21 has been described, the dicing tape-integrated adhesive film of the present invention achieves the object of the present invention even in an embodiment without the intervening layer 21. be able to.

In addition, although the intervening layer 21, the adhesive layer 22 of the dicing tape, and the adhesive film 1 have different adhesive forces, it is preferable that they have the following characteristics.
First, the adhesive force of the intervening layer 21 to the adhesive film 1 is preferably smaller than the adhesive force of the intervening layer 21 to the dicing tape pressure-sensitive adhesive layer 22 and the adhesive force of the dicing tape pressure-sensitive adhesive layer 22 to the support film 4. Thereby, in the 3rd process mentioned below, when picking up the 2nd layered product 83, between adhesive layer 22 of dicing tape and support film 4, it does not exfoliate but adhesive film 1 and intervening layer 21 Is selectively peeled off. When dicing, the laminated body 8 can be reliably supported by the wafer ring 9.

(Semiconductor device, multilayer circuit board, and electronic component in which the solder joint surface of the first member and the solder joint surface of the second member are joined by the cured product of the adhesive film of the dicing tape-integrated adhesive film)
Next, a semiconductor device, a multilayer circuit board and an electronic component manufactured using the dicing tape integrated adhesive film of the present invention will be described.

  As shown in FIG. 5A, the adhesive film 1 in the dicing tape integrated adhesive film 20 as described above and the semiconductor wafer 5a are brought into close contact with each other, and the dicing tape integrated adhesive film 20 and the semiconductor wafer (first Member) 5a. Here, in the semiconductor wafer (first member) 5a, a surface (solder bonding surface) to be bonded to the adhesive film 1 has a first terminal (not shown). In the dicing tape-integrated adhesive film 20 shown in FIG. 4, the size and shape of the adhesive film 1 in plan view are slightly smaller than the outer diameter of the semiconductor wafer 5a or larger than the outer diameter, and the wafer A shape smaller than the inner diameter of the ring 9 is set in advance. For this reason, the entire lower surface of the semiconductor wafer 5 a is in close contact with the entire upper surface of the adhesive film 1, whereby the semiconductor wafer 5 a is supported by the dicing tape-integrated adhesive film 20.

A dicing tape-integrated adhesive film 20 is laminated so as to be covered with the solder bonding surface (surface having the first terminals) adhesive film 1 of the semiconductor wafer 5a (FIG. 5A).
Examples of the method of laminating the dicing tape integrated adhesive film 20 on the semiconductor wafer 5a include a roll laminator, a flat plate press, a wafer laminator and the like.
Among these, a method of laminating under vacuum (vacuum laminator) is preferable in order to prevent air from being involved during lamination.

  Moreover, the conditions for laminating are not particularly limited as long as it can be laminated without voids. Specifically, the conditions of heating at 50 to 150 ° C. for 1 second to 120 seconds are preferable, and particularly 60 to 120 ° C. for 5 to 60 seconds. Heating conditions are preferred. When the laminating conditions are within the above range, the balance between the sticking property, the effect of suppressing the protrusion of the resin, and the degree of curing of the resin is excellent.

  Moreover, although pressurization conditions are not specifically limited, 0.2-2.0 MPa is preferable and 0.5-1.5 MPa is especially preferable.

  As a result of the above-described lamination, as shown in FIG. 5B, a laminate 8 in which the dicing tape-integrated adhesive film 20 and the semiconductor wafer 5a are laminated is obtained.

Next, a wafer ring 9 is prepared. Subsequently, the laminate 8 and the wafer ring 9 are laminated so that the upper surface of the outer peripheral portion of the adhesive layer 22 of the dicing tape and the lower surface of the wafer ring 9 are in close contact with each other. Thereby, the outer peripheral part of the laminated body 8 is supported by the wafer ring 9.
Since the wafer ring 9 is generally composed of various metal materials such as stainless steel and aluminum, the wafer ring 9 has high rigidity and can surely prevent the laminate 8 from being deformed.

Next, a dicer table (not shown in FIG. 5) is prepared, and the laminate 8 is placed on the dicer table so that the dicer table and the support film 3 are in contact with each other.
Subsequently, as shown in FIG. 5C, a plurality of cuts 81 are formed in the laminate 8 using a dicing blade 82 (dicing). The dicing blade 82 is constituted by a disk-shaped diamond blade or the like, and a cut 81 is formed by pressing the dicing blade 82 against the surface of the stacked body 8 on the semiconductor wafer 5a side. Then, the semiconductor wafer 5a is separated into a plurality of semiconductor chips 5b by relatively moving the dicing blade 82 along the gap between the circuit patterns formed on the semiconductor wafer 5a (second step). ). Similarly, the adhesive film 1 is divided into a plurality of adhesive films 11. In such dicing, vibration and impact are applied to the semiconductor wafer 5a. However, since the lower surface of the semiconductor wafer 5a is supported by the dicing tape-integrated adhesive film 20, the vibration and impact are alleviated. It becomes. As a result, the occurrence of defects such as cracks and chippings in the semiconductor wafer 5 can be reliably prevented.

  The cutting depth may be set so that the tip of the dicing blade 82 stays in the intervening layer 21. In other words, the dicing is performed so that the front end of the cut 81 does not reach the support film 4 and remains in either the intervening layer 21 or the adhesive layer 22 of the dicing tape. In this way, since the shavings of the support film 4 cannot be generated, the problems associated with the generation of the shavings are surely solved. That is, when the semiconductor chip 5b is picked up, the occurrence of catching or the like is prevented, and when the picked-up semiconductor chip 5b is mounted on the substrate (second member) 4a, the intrusion of foreign matters and poor solder joints are caused. Is prevented. As a result, the manufacturing yield of the semiconductor device 100 can be improved, and the highly reliable semiconductor device 100 can be obtained.

  Next, the laminated body 8 formed with a plurality of cuts 81 is radially expanded (expanded) by an expanding device (not shown). As a result, as shown in FIG. 5D, the width of the cuts 81 formed in the stacked body 8 is increased, and the interval between the separated semiconductor chips 5b is increased accordingly. As a result, there is no possibility that the semiconductor chips 5b interfere with each other, and it becomes easy to pick up the individual semiconductor chips 5b. Note that the expanding device is configured to maintain such an expanded state even in a process described later.

  Next, as shown in FIG. 5E, the die bonder 250 attracts one of the separated semiconductor chips 5b by the die bonder collet (chip attracting portion) 260 and pulls it upward. As a result, as shown in FIG. 5 (e), the interface between the adhesive film 11 and the intervening layer 21 is selectively peeled, and a second laminate 83 in which the semiconductor chip 5b and the adhesive film 11 are laminated is obtained. Picked up (third step).

  Note that the reason why the interface between the adhesive film 11 and the intervening layer 21 is selectively peeled is that the adhesive layer 22 of the dicing tape is higher in adhesiveness than the intervening layer 21 as described above. The adhesive force at the interface between the adhesive layer 22 of the dicing tape and the adhesive force at the interface with the intervening layer 21 of the adhesive layer 22 of the dicing tape is greater than the adhesive force between the intervening layer 21 and the adhesive film 1. It is. That is, when the semiconductor chip 5b is picked up, the interface between the intervening layer 21 having the smallest adhesive force and the adhesive film 1 is selectively peeled among these three locations.

  Further, when picking up the second laminated body 83, the second laminated body 83 to be picked up may be selectively pushed up by the push-up device 400 from below the dicing tape-integrated adhesive film 20. . Thereby, since the 2nd laminated body 83 is pushed up from the laminated body 8, it becomes possible to pick up the 2nd laminated body 83 mentioned above more easily. Note that a needle-like body (needle) or the like that pushes up the dicing tape-integrated adhesive film 20 from below is used to push up the second laminate 83 (not shown).

Next, a substrate 4a for mounting (mounting) the semiconductor chip 5b is prepared.
The substrate 4a has a second terminal (not shown) on a surface (solder bonding surface) to be bonded to the adhesive film 11. Examples of the substrate 4a include a substrate, a semiconductor chip, a semiconductor wafer, and the like on which a semiconductor chip 5b is mounted and wiring is provided for electrically connecting the semiconductor chip 5b and the outside.
Examples of the first terminal and the second terminal include an electrode pad and a solder bump. Moreover, it is preferable that solder exists in at least one of the first terminal and the second terminal.

Next, as shown in FIG. 5 (f), the picked up second laminated body 83 is placed on the substrate 4 a. At this time, the first terminal of the semiconductor chip 5b and the second terminal of the substrate 4a are temporarily bonded via the adhesive film 11 while being aligned.
Next, the substrate 4a and the semiconductor chip 5b are joined by soldering. Solder bonding can be performed using the same solder bonding conditions as in the other embodiments described above.

  Examples of the substrate 4a include a printed wiring board such as a semiconductor wafer, a semiconductor chip, a rigid substrate, a flexible substrate, and a rigid flexible substrate. When a semiconductor chip is used as the substrate 4a, an electronic component bonded with a cured product of the adhesive film 11 can be obtained. Moreover, when using a printed wiring board etc. as the board | substrate 4a, the semiconductor device joined by the hardened | cured material of the adhesive film 11 can be obtained.

  The dicing tape-integrated adhesive film, semiconductor device, multilayer circuit board, and electronic component of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part is as follows. It can be replaced with any configuration having a similar function. In addition, any other component may be added to the present invention. Moreover, the manufacturing method of a semiconductor device, a multilayer circuit board, and an electronic component is not limited to the said method.

EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example and a comparative example, this invention is not limited to this.
The adhesive films of each Example and each Comparative Example were produced as follows.

Example 1
<Preparation of resin varnish containing resin composition>
19.0 parts by weight of compound (A): phenol novolac resin (manufactured by Sumitomo Bakelite, PR55617) and compound (B): liquid bisphenol A type epoxy resin (manufactured by Dainippon Ink and Chemicals, EPICLON-840S) 58.2 1 part by weight of compound (C): flux activator (manufactured by Tokyo Chemical Industry Co., Ltd., diphenolic acid) and compound (D): bisphenol A type phenoxy resin (Toto Kasei Co., Ltd.) as a film-forming resin Manufactured by YP-50) 16.8 parts by weight, and 1.0 part by weight of β- (3,4 epoxy cyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403) as a silane coupling agent, 0.12 parts by weight of an acrylic copolymer (product name “BYK361N”, manufactured by Big Chemie) as a leveling agent, and as a curing accelerator 0.02 part by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) and 108 parts by weight of silica (manufactured by Admattex, SC1050) as an inorganic filler are dissolved in methyl ethyl ketone, A resin varnish with a resin concentration of 50.6% was prepared.

(Example 2)
<Preparation of resin varnish containing resin composition>
19.0 parts by weight of compound (A): phenol novolac resin (manufactured by Sumitomo Bakelite, PR55617) and compound (B): liquid bisphenol A type epoxy resin (manufactured by Dainippon Ink and Chemicals, EPICLON-840S) 58.2 Parts by weight, compound (C): flux activator (2,2 bis (4-hydroxyphenyl) pentanoic acid) 12.5 parts by weight, and compound (D): bisphenol A type phenoxy resin ( 16.8 parts by weight of Toto Kasei Co., Ltd., YP-50) and 1.0 weight of β- (3,4 epoxy cyclohexyl) ethyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., KBM-403) as a silane coupling agent And 0.12 parts by weight of an acrylic copolymer (trade name “BYK361N”, manufactured by Big Chemie) as a leveling agent, and curing 0.02 part by weight of 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) as an accelerator and 108 parts by weight of silica (manufactured by Admattex Co., Ltd., SC1050) as methyl filler A resin varnish having a resin concentration of 50.6% was prepared.

(Example 3)
<Preparation of resin varnish containing resin composition>
Compound (A): 6.5 parts by weight of a phenol novolac resin (manufactured by Sumitomo Bakelite, PR55617) and compound (B): liquid bisphenol A type epoxy resin (manufactured by Dainippon Ink and Chemicals, EPICLON-840S) 58.2 Part by weight, compound (C): flux activator (Tokyo Chemical Industry Co., Ltd., diphenolic acid) 25.0 parts by weight, compound (D): bisphenol A type phenoxy resin (Toto Kasei Co., Ltd.) as a film-forming resin Manufactured by YP-50) 16.8 parts by weight, and 1.0 part by weight of β- (3,4 epoxy cyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403) as a silane coupling agent, 0.12 parts by weight of an acrylic copolymer (trade name “BYK361N”, manufactured by Big Chemie) as a leveling agent, and a curing accelerator -0.04 part by weight of phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) and 108 parts by weight of silica (manufactured by Admattex, SC1050) as an inorganic filler were dissolved in methyl ethyl ketone, and resin A resin varnish with a concentration of 50.6% was prepared.

(Comparative Example 1)
<Preparation of resin varnish containing resin composition>
19.0 parts by weight of compound (A): phenol novolac resin (manufactured by Sumitomo Bakelite, PR55617) and compound (B): liquid bisphenol A type epoxy resin (manufactured by Dainippon Ink and Chemicals, EPICLON-840S) 58.2 Part by weight, compound (C): flux activator (Tokyo Kasei Kogyo Co., Ltd., sebacic acid) 4.4 parts by weight, compound (D): bisphenol A type phenoxy resin (manufactured by Tohto Kasei Co., Ltd.) as a film-forming resin YP-50) 16.8 parts by weight, β- (3,4 epoxy cyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403) as a silane coupling agent, 1.0 part by weight, and leveling 0.12 parts by weight of an acrylic copolymer (manufactured by Big Chemie, trade name “BYK361N”) as an agent and 2 as a curing accelerator 0.04 part by weight of phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) and 108 parts by weight of silica (manufactured by Admattex, SC1050) as an inorganic filler were dissolved in methyl ethyl ketone, and the resin concentration A 50.9% resin varnish was prepared.

(Comparative Example 2)
<Preparation of resin varnish containing resin composition>
Compound (A): 32.5 parts by weight of phenol novolac resin (Sumitomo Bakelite, PR55617) and compound (B): Liquid bisphenol A type epoxy resin (Dainippon Ink Chemical Co., EPICLON-840S) 58.2 1 part by weight of compound (D): bisphenol A type phenoxy resin (manufactured by Tohto Kasei Co., Ltd., YP-50) as a film-forming resin, and β- (3,4 epoxy) as a silane coupling agent (Cyclohexyl) ethyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403) 1.0 part by weight, acrylic copolymer as a leveling agent (manufactured by Big Chemie, trade name “BYK361N”) 0.12 part by weight, 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., 2P4MZ) 0.02 wt. If, silica as the inorganic filler (address map Tex Co., SC1050) and 108 parts by weight, was dissolved in methyl ethyl ketone to prepare a resin concentration 50.9% of the resin varnish.

  Table 1 shows the compounding ratios of the resin compositions in Examples 1 to 5 and Comparative Examples 1 and 2.

<Manufacture of adhesive film>
The obtained resin varnish is applied to a base polyester film (base film, trade name: Lumirror) to a thickness of 50 μm, dried at 100 ° C. for 5 minutes, and a flux of 25 μm thickness. A functional resin composition (adhesive film) was obtained.

  Table 1 shows the compositions of the resin compositions of the examples and comparative examples. In Table 1, diphenolic acid is indicated as C1,2,2bis (4-hydroxyphenyl) pentanoic acid as C2, and sebacic acid as C3.

<Evaluation of resin flexibility>
The adhesive film was cut into a length of 10 cm and a width of 3 cm, and bent 180 ° with the resin surface facing outward. It was visually confirmed whether a crack occurred on the resin surface. The number of repetitions was N = 3 for each level, and when N = 3, no resin cracking occurred, and ○ when one or more resin cracking occurred. The results are shown in Table 2.

<Evaluation of resin heat resistance>
The glass transition point Tg of the cured product was measured as an index for evaluating the resin heat resistance. The measuring method is shown below. Laminate the film to about 100 μm and heat cure at 180 ° C./120 minutes.
This film was cut into 25 mm × 3 mm to obtain test pieces. In order to make the measurement surface parallel to the test piece, it was polished with sandpaper having a small particle size of # 1500 or more. Measurement was performed by TMA / tensile method using Seiko Instruments Inc., Thermal Mechanical Analysis, TMA / SS 6000. Measurement conditions were 30 at a temperature rise of 5 ° C / min.
The temperature was raised from 0 ° C. to 300 ° C., and the load was measured at 50 mN. The glass transition temperature is calculated from the data at the time of the final temperature increase, and is calculated from the intersection of tangents determined by the least square method between 50 ° C. and 150 ° C. The results are shown in Table 2.

<Manufacture of semiconductor devices>
A circuit board (size 20 mm × 20 mm, wiring circuit average thickness 12 μm, spacing between adjacent wiring circuits 50 μm) having a plurality of wiring circuits and pad portions was prepared.
Next, the resin composition (adhesive film) obtained on the circuit board was laminated at 80 ° C. with a vacuum wafer laminator so as to cover the wiring circuit to obtain a circuit board with an adhesive film. In addition, the pressure P at the time of lamination was 0.3 MPa, and the atmospheric pressure was 400 Pa.
Next, a semiconductor chip having a solder bump (size 10 mm × 10 mm, thickness 0.3 mm) is prepared, and the semiconductor is placed on the circuit board while aligning the pad portion of the circuit board with the solder bump. The chip was temporarily pressure-bonded at 100 ° C. for 30 seconds.
Next, the solder bumps were melted by heating at 235 ° C. for 30 seconds to perform solder connection.
And it heated at 180 degreeC for 60 minute (s), the adhesive film was hardened, and the semiconductor device with which the semiconductor chip and the circuit board were adhere | attached with the hardened | cured material of the resin composition (adhesive film) was obtained.

<Connection reliability>
About 20 semiconductor devices obtained by using the resin compositions (adhesive films) of each Example and Comparative Example (each at each bonding temperature) for 30 minutes under the condition of −55 ° C., under the condition of 125 ° C. 100 cycles of the temperature cycle test, with each cycle exposed to 30 minutes alternately, measuring the connection resistance value of the semiconductor chip and the circuit board with a digital multimeter for the semiconductor device after the test, and improving the connection reliability evaluated. Table 2 shows the number of semiconductor devices having a connection resistance value of 10Ω or less.

As is apparent from Table 2, in Examples 1 to 5, the resin composition (adhesive film) was excellent in flexibility, heat resistance, and connection reliability of the semiconductor device. On the other hand, in Comparative Examples 1 and 2, sufficient results were not obtained.

DESCRIPTION OF SYMBOLS 1,11 Thermosetting resin composition, resin composition layer, adhesive film 1 ′ cured product 10, 10 ′ semiconductor device 100 multilayer circuit board 2 cover film 20 dicing tape integrated adhesive film 21 intervening layer 22 dicing tape adhesive layer 2a, 2b, 2c, 2d Laminate 250 Die bonder 260 Collet 270 units (heater)
280 Device body 3 Support film, base films 3a and 3b Base material 4 Circuit board (first member)
4a Substrate (second member)
41 Substrate 42 Wiring circuit 43 Insulating part 44 Pad part 45 Solder bump 400 units (push-up device)
5, 5b Semiconductor chip 5a Semiconductor wafer (first member)
511 Solder connection portion 6 Circuit board (first member)
61 Substrate 62 Wiring circuit 63 Insulating part 64 Pad part 7 Circuit board (second member)
71 Substrate 72 Wiring circuit 73 Insulating part 74 Pad part 75 Solder bump 711 Solder joint part 8 First laminated body 81 Notch 82 Dicing blade 83 Second laminated body 9 Wafer ring

Claims (12)

  A thermosetting resin composition constituting a resin composition layer used for a solder joint surface of a first member, comprising an epoxy resin, a phenolic curing agent, an alkyl carboxyl group, and two or more phenolic hydroxyl groups. A thermosetting resin composition comprising a compound having a flux function arranged in a molecule.   The thermosetting resin composition according to claim 1, wherein in the compound having the flux function, a value obtained by dividing the number of phenolic hydroxyl groups by the number of alkyl carboxyl groups is 1 to 3. The thermosetting resin composition according to claim 1 or 2, wherein the compound having the flux function is represented by the general formula (1).


(R1 to R4 are H or OH, and n is an integer of 1 to 6)   The thermosetting resin composition according to claim 1 or 2, wherein the compounding amount of the compound having the flux function is 0.01 to 30% by weight in the thermosetting resin composition after solvent volatilization.   The thermosetting resin composition according to any one of claims 1 to 4, wherein the phenolic curing agent is solid at 25 ° C. The thermosetting resin composition according to claim 1, wherein the phenol-based curing agent has a weight average molecular weight of 300 to 1500. 7. The structure according to claim 1, wherein when the uncured resin composition layer is provided with an average thickness of 30 μm, the resin composition layer has a transmittance of 5% or more for light having a wavelength of 600 nm. The thermosetting resin composition according to claim 1.   An adhesive film, wherein the thermosetting resin composition according to claim 1 is in the form of a film. A dicing tape-integrated adhesive film, wherein the adhesive film according to claim 8 and a dicing tape are laminated.   The solder joint surface of the first member and the solder joint surface of the second member are joined by the thermosetting resin composition or the cured product of the adhesive film according to any one of claims 1 to 9. Semiconductor device.   The solder joint surface of the first member and the solder joint surface of the second member are joined by the thermosetting resin composition or the cured product of the adhesive film according to any one of claims 1 to 8. Multi-layer circuit board. The solder joint surface of the first member and the solder joint surface of the second member are joined by the thermosetting resin composition or the cured product of the adhesive film according to any one of claims 1 to 9. Electronic components.