JP2014090290A - Vibration piece, vibration device, electronic apparatus and mobile - Google Patents

Abstract

An object of the present invention is to provide a resonator element that can be reduced in plane size.
A quartz crystal vibrating piece 1 rotates on the + Z side in the −Y direction of the Y axis with the X axis as a rotation axis among the X axis, the Y axis, and the Z axis, which are crystal axes of the crystal. The axis tilted in this way is the Z ′ axis, the Y axis is the Y ′ axis that is tilted so that the + Y side rotates in the + Z direction of the Z axis, the plane parallel to the X axis and the Z ′ axis is the main surface, An AT-cut quartz substrate 10 whose thickness direction is parallel to the Y ′ axis, and excitation electrodes 13 and 14 disposed in the vibration regions of both main surfaces 11 and 12 of the AT-cut quartz substrate 10, The cut quartz substrate 10 is a rectangle whose long side is along the X-axis direction and whose short side is along the Z′-axis direction, and which is resonated in the thickness-shear vibration mode, and is thinner than the vibration unit 15 in plan view. And an outer peripheral portion 16 surrounding the vibrating portion 15 at any end along the X-axis direction of the outer peripheral portion 16. Mount electrodes 17 and 18 is provided with drawn from the electrodes 13 and 14.
[Selection] Figure 1

Description

  The present invention relates to a vibrating piece, a vibrating device including the vibrating piece, an electronic apparatus, and a moving body.

2. Description of the Related Art Conventionally, as a resonator element that is one of the constituent elements of a vibration device typified by a crystal resonator used in an electronic device or the like, it is made of an AT cut crystal substrate, and the direction parallel to the Y ′ axis is the thickness direction. A piezoelectric substrate, and excitation electrodes arranged so as to face the vibration regions of both principal surfaces of the piezoelectric substrate on the front and back sides, the piezoelectric substrate having a side parallel to the X axis as a long side and a Z ′ axis A rectangular excitation part having a short side as a parallel side, and a peripheral part having a smaller thickness than the excitation part and formed around the excitation part, and a pad at one end in the X-axis direction. A piezoelectric vibrating piece having a structure provided is known (see, for example, Patent Document 1).
In addition, the thickness-shear vibration of the AT-cut quartz crystal vibrating piece corresponding to the piezoelectric vibrating piece has an elastic constant different depending on the crystal axis direction due to the anisotropy of the crystal, so that the vibration energy distribution is confined in an elliptical shape. It is known that The ratio of the major axis (X-axis direction) to the minor axis (Z′-axis direction) of this ellipse (major axis: minor axis) is said to be 1.26: 1 (see, for example, Patent Document 2). .

JP 2012-114495 A JP 2007-158486 A

The piezoelectric vibrating piece of Patent Document 1 is provided with a pad (hereinafter referred to as a mount electrode) at the end in the X-axis direction.
As described in Patent Document 2, the thickness-shear vibration of the AT-cut quartz crystal vibrating piece is more easily propagated in the X-axis direction than in the Z′-axis direction. In order to avoid leakage of vibration energy from a certain mount electrode to an external member, a considerable distance is ensured between the excitation part (hereinafter referred to as the vibration part) and the mount electrode so that thickness-shear vibration does not propagate to the mount electrode. There is a need to.
Due to the restriction on the distance between the vibrating portion and the mount electrode, the piezoelectric vibrating piece of Patent Document 1 may be hindered from being further reduced in planar size.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] The resonator element according to this application example rotates the X axis among the crystal axis of quartz, the X axis as an electric axis, the Y axis as a mechanical axis, and the Z axis as an optical axis. As an axis, an axis tilted so that the Z axis rotates in the -Y direction of the Y axis on the + Z side is set as a Z 'axis, and an axis tilted so that the Y axis rotates in the + Z direction of the Z axis on the + Y side Is an AT-cut quartz substrate having a plane parallel to the X-axis and the Z'-axis as a principal plane, and a direction parallel to the Y'-axis being a thickness direction, and the principal axis of the AT-cut quartz substrate An excitation electrode disposed in a vibration region of the surface, and a vibration part that vibrates by thickness-shear vibration, and an outer peripheral part that is thinner than the vibration part and surrounds the vibration part in plan view. Any one end portion of the outer peripheral portion along the X-axis direction is connected to the excitation electrode. Characterized in that the mount electrodes are provided.

According to this, the vibration piece (corresponding to the piezoelectric vibration piece) includes a vibration part (corresponding to an excitation part) that resonates in the thickness-shear vibration mode, and an outer periphery that is thinner than the vibration part and surrounds the vibration part in plan view. And a mount electrode led out from the excitation electrode is provided at any end in the Z′-axis direction of the outer peripheral portion.
As a result, the end of the vibrating piece in the Z′-axis direction is fixed to an external member such as a package via the mount electrode.

As described above, in the resonator element that resonates in the thickness shear vibration mode, the propagation of the thickness shear vibration is more in the Z′-axis direction orthogonal to the main vibration direction than in the main vibration direction (X-axis direction) of the thickness shear vibration. It is considered that there is little leakage of vibration energy.
According to this, since the resonator element can make the distance between the vibration part and the mount electrode shorter than the conventional one (configuration of Patent Document 1), it has excellent vibration characteristics (frequency characteristics). The planar size can be reduced while maintaining.
Specifically, the distance between the vibration part and the mount electrode is set to the ratio of the long axis (X-axis direction) and the short axis (Z′-axis direction) of the above-described ellipse (long axis: short axis) 1.26. : 1 can be reduced to 1 / 1.26 of the conventional distance.

  Application Example 2 In the resonator element according to the application example described above, the vibration unit is provided so as to be biased to one side of any one of the end portions along the X-axis direction of the outer peripheral portion in a plan view. In addition, the mount electrode is preferably provided on the other side of any one of the end portions along the X-axis direction of the outer peripheral portion.

According to this, in the resonator element, the vibration portion is provided to be biased to one side of any end portion along the X-axis direction of the outer peripheral portion, and the mount electrode is provided to the other side. Therefore, compared with the case where the center of the vibration part in the Z′-axis direction coincides with the center of the AT-cut quartz crystal substrate, the width of the outer peripheral part on one end side without the mount electrode can be reduced. .
As a result, the vibration piece can be further reduced in planar size.

  Application Example 3 In the resonator element according to the application example described above, a distance from one end portion of the outer peripheral portion along the X-axis direction to the end portion of the vibration portion is ΔZ, and a thickness of the vibration portion is t. It is preferable that 0.8 ≦ ΔZ / t ≦ 1.3 is satisfied.

According to this, when the distance from the one end portion along the X-axis direction of the outer peripheral portion to the end portion of the vibrating portion is ΔZ and the thickness of the vibrating portion is t, the resonator element is 0.8 ≦ ΔZ Since /t≦1.3 is satisfied, the temperature characteristics of the CI (crystal impedance) value can be improved (the fluctuation of the CI value is reduced with respect to the ambient temperature change).
As a result, the resonator element can obtain excellent frequency temperature characteristics while reducing the planar size. In addition, the said numerical range is based on the knowledge obtained based on the simulation analysis, experiment result, etc. of inventors.

  Application Example 4 In the resonator element according to the application example described above, it is preferable that at least a part of the side wall of the vibration unit has a plurality of steps.

According to this, since at least a part of the side wall of the vibration part has a plurality of steps, the vibration piece can enhance the effect of confining the energy of the thickness shear vibration.
Thereby, the resonator element can efficiently vibrate in thickness and can obtain excellent vibration characteristics.

  Application Example 5 A vibration device according to this application example includes the vibration piece according to any one of the application examples described above and a container in which the vibration piece is accommodated.

  According to this, since the vibration device includes the resonator element according to any one of the application examples described above and the container in which the resonator element is accommodated, the effect according to any one of the application examples can be obtained. A reflected vibration device can be provided.

  Application Example 6 It is preferable that the vibration device according to the application example further includes an oscillation circuit that drives the vibration piece.

  According to this, since the vibration device further includes an oscillation circuit that drives the vibration piece, it is possible to provide an oscillator as a vibration device in which the effect described in any of the application examples is reflected.

  Application Example 7 An electronic apparatus according to this application example includes the resonator element according to any one of the application examples described above.

  According to this, since the electronic device of this configuration includes the resonator element according to any one of the application examples, the electronic device in which the effect according to any of the application examples is reflected is provided. Can do.

  Application Example 8 A moving body according to this application example includes the resonator element according to any one of the application examples described above.

  According to this, since the moving body of the present configuration includes the resonator element according to any one of the application examples, the moving object reflecting the effect according to any of the application examples is provided. Can do.

1 is a schematic perspective view showing a schematic configuration of a crystal resonator element according to a first embodiment. FIG. 2 is a schematic plan sectional view of the quartz crystal resonator element of FIG. 1, (a) is a plan view viewed from the Y′-axis direction, (b) is a sectional view taken along line AA in (a), Sectional drawing in the BB line of a). The graph which shows the relationship between (DELTA) Z / t of a crystal vibrating piece, and the temperature characteristic of CI value. The model perspective view which shows schematic structure of the quartz crystal vibrating piece of the modification 1 of 1st Embodiment. The model perspective view which shows schematic structure of the quartz crystal vibrating piece of the modification 2 of 1st Embodiment. The model perspective view which shows schematic structure of the quartz crystal vibrating piece of the modification 3 of 1st Embodiment. The model perspective view which shows schematic structure of the quartz crystal vibrating piece of the modification 4 of 1st Embodiment. The model perspective view which shows schematic structure of the quartz crystal vibrating piece of the modification 5 of 1st Embodiment. The model perspective view which shows schematic structure of the quartz crystal vibrating piece of the modification 6 of 1st Embodiment. The model perspective view which shows schematic structure of the quartz crystal vibrating piece of the modification 7 of 1st Embodiment. The model perspective view which shows schematic structure of the quartz crystal vibrating piece of the modification 8 of 1st Embodiment. The model perspective view which shows schematic structure of the quartz crystal vibrating piece of the modification 9 of 1st Embodiment. It is a schematic diagram which shows schematic structure of the crystal oscillator of 2nd Embodiment, (a) is a top view seen from the lid (lid body) side, (b) is sectional drawing in the AA of (a). (C) is sectional drawing in the CC line of (a). It is a schematic diagram which shows schematic structure of the crystal oscillator of 3rd Embodiment, (a) is the top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) is Sectional drawing in the DD line of (a). The model perspective view which shows the mobile telephone of 4th Embodiment. The model perspective view which shows the motor vehicle of 5th Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

(First embodiment)
First, a quartz crystal resonator element as an example of a resonator element will be described.
FIG. 1 is a schematic perspective view illustrating a schematic configuration of the quartz crystal resonator element according to the first embodiment. 2 is a schematic plan sectional view of the quartz crystal vibrating piece of FIG. 1, FIG. 2 (a) is a plan view seen from the Y′-axis direction, and FIG. 2 (b) is an A- FIG. 2C is a sectional view taken along line A, and FIG. 2C is a sectional view taken along line BB in FIG. In addition, in order to make it intelligible, the dimension ratio of each component differs from actual.

  As shown in FIGS. 1 and 2, the quartz crystal vibrating piece 1 has an X axis among the X axis as an electric axis, the Y axis as a mechanical axis, and the Z axis as an optical axis, which are crystal axes of quartz. As the rotation axis, the axis tilted so that the Z axis rotates in the − (minus) Y direction of the Y axis and the + (plus) Z side rotates as the Z ′ axis, and the Y axis rotates in the + Z direction of the Z axis so that the + Y side rotates. It is cut out from a quartz crystal (Lambert) with the Y 'axis as the axis tilted in the direction, the main surfaces 11 and 12 as the surfaces parallel to the X and Z' axes, and the thickness direction as the direction parallel to the Y 'axis. The AT cut quartz crystal substrate 10 is provided. The quartz crystal resonator element 1 includes substantially rectangular excitation electrodes 13 and 14 that are arranged so as to overlap each other in a plan view in the vibration regions of both the main surfaces 11 and 12 of the AT-cut quartz crystal substrate 10. .

The AT-cut quartz substrate 10 is formed in a rectangular (rectangular) shape having a long side along the X-axis direction (parallel to the X-axis direction) and a short side along the Z′-axis direction (parallel to the Z′-axis direction). . The AT-cut quartz substrate 10 integrally includes a rectangular vibrating portion 15 and a rectangular frame-shaped outer peripheral portion 16 that is thinner than the vibrating portion 15 and surrounds the vibrating portion 15 in plan view. .
A mounting electrode 17 drawn from each of the excitation electrodes 13 and 14 is disposed at one end portion (here, the end portion on the −Z ′ side) along the X-axis direction of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10. , 18 are provided, and the other end along the X-axis direction (here, the end on the + Z ′ side) is a free end.

The mount electrode 17 covers the main surface 11 of the vibration part 15 and the excitation electrode 13 provided so as to cover a part of the main surface 11 of the outer peripheral part 16. (Axial direction) is drawn to the end portion on the −Z ′ side of the outer peripheral portion 16, wraps around the main surface 12 of the outer peripheral portion 16 along the side surface of the end portion, and extends to the vicinity of the excitation electrode 14.
The mount electrode 18 extends along the short side direction of the AT-cut quartz crystal substrate 10 from the excitation electrode 14 provided so as to cover the main surface 12 of the vibration part 15 and a part of the main surface 12 of the outer peripheral part 16. It is pulled out to the end portion on the −Z ′ side of the outer peripheral portion 16, wraps around the main surface 11 of the outer peripheral portion 16 along the side surface of the end portion, and extends to the vicinity of the excitation electrode 13.
The excitation electrodes 13 and 14 and the mount electrodes 17 and 18 are, for example, metal films having a structure in which Cr (chrome) is used as a base layer and Au (gold) is stacked thereon.
The main surfaces 11 and 12 include surfaces that are orthogonal to the Y ′ axis of the vibrating portion 15 and the outer peripheral portion 16.

As shown in FIG. 2 (a), the crystal resonator element 1 is provided such that the vibrating portion 15 is biased toward one end on the + Z ′ side of the end portion along the X-axis direction of the outer peripheral portion 16 in plan view. In addition, the mount electrodes 17 and 18 are preferably provided at the other end on the −Z ′ side.
In other words, in the crystal vibrating piece 1, in the Z′-axis direction, the center line of the AT-cut crystal substrate 10 (here, the AA line) and the center line L of the vibration unit 15 do not coincide with each other. The 15 center lines L are preferably located on the + Z ′ side of the center line (AA line) of the AT-cut quartz crystal substrate 10.
The crystal resonator element 1 is preferably provided with mount electrodes 17 and 18 at the end of the outer peripheral portion 16 that is widened by the bias toward the + Z ′ side of the vibrating portion 15 on the −Z ′ side.

Further, as shown in FIGS. 2A and 2C, the quartz crystal vibrating piece 1 is an end on the + Z ′ side that is one end portion along the X-axis direction of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10. When the distance from the portion to the end on the + Z ′ side of the vibrating portion 15 is ΔZ and the thickness of the vibrating portion 15 is t, 0.8 ≦ ΔZ / t ≦ 1.3 is satisfied. preferable. In addition, the said numerical range is based on the knowledge acquired based on the simulation analysis of the inventors, an experimental result, etc. (details are mentioned later).
Here, ΔZ and t may include the thickness of the excitation electrodes 13 and 14.

As described above, the crystal resonator element 1 has the rectangular shape in which the long side of the AT-cut crystal substrate 10 is along the X-axis direction and the short side is along the Z′-axis direction, and the resonating unit 15 resonates in the thickness shear vibration mode. An outer peripheral portion 16 having a thickness smaller than that of the vibrating portion 15 and surrounding the vibrating portion 15 in a plan view, and at the end on the −Z ′ side along the X-axis direction of the outer peripheral portion 16, Mount electrodes 17 and 18 drawn from 14 are provided.
As a result, the crystal vibrating piece 1 has the −Z ′ end along the X-axis direction fixed to an external member such as a package via the mount electrodes 17 and 18, and the + Z ′ end is not fixed. It will be a free end.
In addition, the quartz crystal vibrating piece 1 has a vibrating portion 15 that protrudes in the Y′-axis direction from the outer peripheral portion 16 (mesa shape), so that the thickness-shear vibration of the flat plate-shaped AT-cut quartz vibrating piece has a constant thickness. It is configured to easily confine vibration energy.

As described above, in the resonator element that resonates in the thickness shear vibration mode, the propagation of the thickness shear vibration is more in the Z′-axis direction orthogonal to the main vibration direction than in the main vibration direction (X-axis direction) of the thickness shear vibration. It is considered that there is little leakage of vibration energy.
According to this, in the quartz crystal resonator element 1, the distance L <b> 1 (see FIG. 2A) between the vibrating portion 15 and the mount electrodes 17 and 18 can be made shorter than the conventional one (configuration of Patent Document 1). Therefore, the planar size can be reduced while maintaining excellent vibration characteristics (frequency characteristics).
Specifically, the distance L1 between the vibrating portion 15 and the mount electrodes 17 and 18 is set to the ratio of the long axis (X-axis direction) to the short axis (Z′-axis direction) of the ellipse (long axis: short). (Axis) can be reduced to 1 / 1.26 of the conventional distance according to 1.26: 1.

Further, in the crystal resonator element 1, the vibrating portion 15 is provided so as to be biased toward the end portion on the + Z ′ side among the end portions along the X-axis direction of the outer peripheral portion 16, and the mount electrodes 17 and 18 are −Z Compared with the case where the center line L of the vibration part 15 in the Z′-axis direction is coincident with the center line (A-A line) of the AT-cut quartz crystal substrate 10 because it is provided at the “end” side. Thus, the width (ΔZ) of the outer peripheral portion 16 on the end side on the + Z ′ side without the mount electrodes 17 and 18 can be reduced.
As a result, the crystal resonator element 1 can further reduce the planar size.

Further, the quartz crystal resonator element 1 has a distance from the + Z ′ side end of the outer peripheral portion 16 along the X-axis direction to the + Z ′ side end of the vibrating portion 15 (the width on the + Z ′ side of the outer peripheral portion 16) ΔZ When the thickness of the vibration part 15 is t, 0.8 ≦ ΔZ / t ≦ 1.3 is satisfied, and therefore the temperature characteristic of the CI value can be improved.
As a result, the quartz crystal resonator element 1 can obtain excellent frequency temperature characteristics while reducing the planar size. In addition, the said numerical range is based on the knowledge obtained based on the simulation analysis, experiment result, etc. of inventors.

The above will be described in detail with reference to the drawings.
FIG. 3 is a graph group showing the relationship between ΔZ / t of the quartz crystal vibrating piece and the temperature characteristic of the CI value, created based on the simulation analysis and experimental results of the inventors. The vertical axis of each graph is CI value (ohm, Ω) is represented, and the horizontal axis represents temperature (° C.).
In each graph, the value of ΔZ / t increases as it goes from the lower side to the upper side of the drawing, and the width Z in the Z′-axis direction of the crystal vibrating piece increases from the left side to the right side of the drawing as Z = 0.970 ( mm), Z = 0.975 (mm), and Z = 0.980 (mm).

As shown in FIG. 3, the crystal resonator element 1 has a substantially constant CI value in a wide temperature range (−40 ° C. to 120 ° C.) as long as 0.8 ≦ ΔZ / t ≦ 1.3. It can be seen that (about 40Ω, about 60Ω) is shown.
On the other hand, in the crystal resonator element 1, when ΔZ / t is 0.6 or 0.4, the CI value rapidly increases in a specific temperature range regardless of the width Z in the Z′-axis direction. Is recognized.
This is considered to be because the thickness shear vibration is inhibited by the combination of the thickness shear vibration mode which is the main vibration mode of the quartz crystal resonator element 1 and an unnecessary vibration mode such as contour vibration (bending vibration). It is done.
From this, the crystal vibrating piece 1 satisfies 0.8 ≦ ΔZ / t ≦ 1.3, so that the thickness-shear vibration mode that is the main vibration mode and the unnecessary vibration mode such as the contour vibration are coupled. It can be seen that the temperature characteristic of the CI value is improved by suppressing the above and maintaining stable thickness-shear vibration.

Next, a modification of the first embodiment will be described.
(Modification 1)
FIG. 4 is a schematic perspective view illustrating a schematic configuration of a crystal resonator element according to Modification 1 of the first embodiment. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 4, the quartz crystal resonator element 2 of Modification 1 is different from the first embodiment in the configuration of the vibrating portion 15 of the AT-cut quartz crystal substrate 10.
The vibration part 15 of the quartz crystal vibrating piece 2 is provided so as to be thicker in a step shape (here, two steps) than the thickness of the outer peripheral part 16 from the outer peripheral part 16 side toward the center. In other words, the side wall of the vibration part 15 has a plurality of steps.

According to this, the crystal vibrating piece 2 is provided so as to be thicker in a stepped manner than the thickness of the outer peripheral portion 16 as the vibrating portion 15 moves from the outer peripheral portion 16 side toward the center (multi-stage mesa shape). Therefore, the effect of confining the vibration energy of the thickness shear vibration can be further enhanced as compared with the first embodiment.
The distance from the end on the + Z ′ side that is one end along the X-axis direction of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10 to the end on the + Z ′ side of the vibration unit 15 is ΔZ.
Thereby, the crystal vibrating piece 2 can further suppress the coupling between the thickness shear vibration mode and the unnecessary vibration mode.

(Modification 2)
FIG. 5 is a schematic perspective view illustrating a schematic configuration of a crystal resonator element according to Modification 2 of the first embodiment. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 5, the quartz crystal resonator element 3 of the second modification is different from the first embodiment in the configuration of the vibrating portion 15 of the AT-cut quartz crystal substrate 10.
The vibrating portion 15 of the quartz crystal resonator element 3 is provided so as to be thicker in a step shape (here, two steps) than the thickness of the outer peripheral portion 16 toward the center from the outer peripheral portion 16 side in the X-axis direction. It has been. In other words, a part of the side wall of the vibration part 15 has a plurality of steps.
Further, the distance from the + Z ′ end, which is one end along the X-axis direction, of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10 to the + Z ′ end of the vibration unit 15 is ΔZ. .

According to this, the crystal vibrating piece 3 is provided so that the vibrating portion 15 becomes thicker in a stepped manner than the thickness of the outer peripheral portion 16 as it goes from the outer peripheral portion 16 side in the X-axis direction to the center. The effect of confining the vibration energy of the thickness shear vibration can be further enhanced as compared with the first embodiment.
Thereby, the crystal vibrating piece 3 can further suppress the coupling between the thickness shear vibration mode and the unnecessary vibration mode.

(Modification 3)
FIG. 6 is a schematic perspective view illustrating a schematic configuration of a crystal resonator element according to Modification 3 of the first embodiment. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 6, the quartz crystal resonator element 4 of Modification 3 is different from the first embodiment in the configuration of the vibrating portion 15 of the AT-cut quartz crystal substrate 10.
Further, the distance from the + Z′-side end which is one end along the X-axis direction of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10 to the + Z′-side end of the vibration unit 15 is ΔZ. .
The vibrating portion 15 of the quartz crystal vibrating piece 4 has curved rounded corners at the four corners in plan view (the four corners are rounded into an arc).
According to this, since the crystal vibrating piece 4 is rounded at the four corners of the vibration part 15 in a plan view, the planar shape of the vibration part 15 is a confinement shape (elliptical shape) of vibration energy distribution of thickness-shear vibration. Will approach.
As a result, the quartz crystal resonator element 4 can further enhance the effect of confining the vibration energy of the thickness shear vibration as compared with the first embodiment.
Thereby, the crystal vibrating piece 4 can further suppress the coupling between the thickness shear vibration mode and the unnecessary vibration mode.

(Modification 4)
FIG. 7 is a schematic perspective view showing a schematic configuration of a crystal resonator element according to Modification 4 of the first embodiment. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 7, the quartz crystal resonator element 5 of Modification 4 is different from the first embodiment in the configuration of the vibrating portion 15 of the AT-cut quartz crystal substrate 10.
The vibrating portion 15 of the quartz crystal vibrating piece 5 is provided so as to be thicker in a stepped shape (here, two steps) than the thickness of the outer peripheral portion 16 from the outer peripheral portion 16 side toward the center. In other words, the side wall of the vibration part 15 has a plurality of steps. In addition, the vibrating portion 15 of the crystal vibrating piece 5 is rounded at the four corners of each step in plan view.
Further, the distance from the + Z ′ end, which is one end along the X-axis direction, of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10 to the + Z ′ end of the vibration unit 15 is ΔZ. .

According to this, since the crystal vibrating piece 5 is provided so that the vibration part 15 becomes thicker stepwise than the thickness of the outer peripheral part 16 as it goes from the outer peripheral part 16 side to the center, The effect of confining the vibration energy can be further enhanced as compared with the first embodiment.
In addition, since the crystal resonator element 5 is rounded at the four corners of each stage of the vibration part 15 in a plan view, the planar shape of the vibration part 15 is a confinement shape (elliptical shape) of vibration energy distribution of thickness-shear vibration. ).
As a result, the quartz crystal resonator element 5 can further enhance the effect of confining the vibration energy of the thickness shear vibration as compared with the first embodiment.
Accordingly, the crystal vibrating piece 5 can further suppress the coupling between the thickness shear vibration mode and the unnecessary vibration mode.

(Modification 5)
FIG. 8 is a schematic perspective view illustrating a schematic configuration of a quartz crystal resonator element according to Modification 5 of the first embodiment. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 8, the quartz crystal resonator element 6 of the modified example 5 is different from the first embodiment in the configuration of the vibration unit 15 of the AT cut quartz crystal substrate 10.
The vibrating portion 15 of the quartz crystal vibrating piece 6 is provided so as to be thicker in a step shape (here, two steps) than the thickness of the outer peripheral portion 16 from the outer peripheral portion 16 side in the X-axis direction toward the center. It has been. In other words, a part of the side wall of the vibration part 15 has a plurality of steps. In addition, the vibrating portion 15 of the crystal vibrating piece 6 is rounded at the four corners of each step in plan view.
Further, the distance from the + Z ′ end, which is one end along the X-axis direction, of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10 to the + Z ′ end of the vibration unit 15 is ΔZ. .

According to this, the quartz crystal vibrating piece 6 is provided so that the vibrating portion 15 becomes thicker in a stepped manner than the thickness of the outer peripheral portion 16 as it goes from the outer peripheral portion 16 side in the X-axis direction to the center. The effect of confining the vibration energy of the thickness shear vibration can be further enhanced as compared with the first embodiment.
In addition, since the crystal vibrating piece 6 is rounded at the four corners of each stage of the vibration part 15 in a plan view, the planar shape of the vibration part 15 is a confined shape (elliptical shape) of vibration energy distribution of thickness shear vibration. ).
As a result, the quartz crystal resonator element 6 can further enhance the effect of confining the vibration energy of the thickness shear vibration as compared with the first embodiment.
Accordingly, the crystal vibrating piece 6 can further suppress the coupling between the thickness shear vibration mode and the unnecessary vibration mode.

(Modification 6)
FIG. 9 is a schematic perspective view illustrating a schematic configuration of a crystal resonator element according to Modification 6 of the first embodiment. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 9, the crystal vibrating piece 7 of Modification 6 is different from the first embodiment in the configuration of the vibrating portion 15 of the AT-cut crystal substrate 10.
The vibration part 15 of the quartz crystal resonator element 7 is provided so as to be thicker in a step shape (here, two steps) than the thickness of the outer peripheral part 16 as it goes from the outer peripheral part 16 side to the center. In other words, the side wall of the vibration part 15 has a plurality of steps. In addition, the vibrating portion 15 of the crystal vibrating piece 7 is rounded at the four corners of the lower step (the step in contact with the outer peripheral portion 16) in plan view.
Further, the distance from the + Z ′ end, which is one end along the X-axis direction, of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10 to the + Z ′ end of the vibration unit 15 is ΔZ. .

According to this, since the crystal vibrating piece 7 is provided so that the vibration part 15 becomes thicker stepwise than the thickness of the outer peripheral part 16 as it goes from the outer peripheral part 16 side to the center, The effect of confining the vibration energy can be further enhanced as compared with the first embodiment.
In addition, since the crystal vibrating piece 7 has rounded corners at the lower four corners of the vibrating portion 15 in plan view, the lower planar shape of the vibrating portion 15 is a confined shape of vibration energy distribution of thickness shear vibration (elliptical shape). Shape).
As a result, the quartz crystal resonator element 7 can further enhance the effect of confining the vibration energy of the thickness shear vibration as compared with the first embodiment.
Accordingly, the crystal vibrating piece 7 can further suppress the coupling between the thickness shear vibration mode and the unnecessary vibration mode.

(Modification 7)
FIG. 10 is a schematic perspective view illustrating a schematic configuration of a crystal resonator element according to Modification 7 of the first embodiment. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 10, the quartz crystal resonator element 8 of the modified example 7 is different from the first embodiment in the configuration of the vibration unit 15 of the AT-cut quartz crystal substrate 10.
The vibrating portion 15 of the quartz crystal resonator element 8 is provided so as to be thicker in a step shape (here, two steps) than the thickness of the outer peripheral portion 16 from the outer peripheral portion 16 side in the X-axis direction toward the center. It has been. In other words, a part of the side wall of the vibration part 15 has a plurality of steps. In addition, the vibrating portion 15 of the crystal vibrating piece 8 has rounded corners at the lower four corners in plan view.
Further, the distance from the + Z ′ end, which is one end along the X-axis direction, of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10 to the + Z ′ end of the vibration unit 15 is ΔZ. .

According to this, the quartz crystal vibrating piece 8 is provided so that the vibrating portion 15 becomes thicker in a stepped manner than the thickness of the outer peripheral portion 16 as it goes from the outer peripheral portion 16 side in the X-axis direction to the center. The effect of confining the vibration energy of the thickness shear vibration can be further enhanced as compared with the first embodiment.
In addition, since the crystal vibrating piece 8 has rounded corners at the lower four corners of the vibrating portion 15 in plan view, the lower planar shape of the vibrating portion 15 is a confined shape of the vibration energy distribution of the thickness shear vibration (ellipse). Shape).
As a result, the quartz crystal resonator element 8 can further enhance the effect of confining the vibration energy of the thickness shear vibration as compared with the first embodiment.
Accordingly, the crystal vibrating piece 8 can further suppress the coupling between the thickness shear vibration mode and the unnecessary vibration mode.

(Modification 8)
FIG. 11 is a schematic perspective view illustrating a schematic configuration of a crystal resonator element according to Modification 8 of the first embodiment. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 11, the crystal resonator element 9 </ b> A of Modification 8 is different from the first embodiment in the configuration of the vibration unit 15 of the AT-cut crystal substrate 10.
The vibrating portion 15 of the quartz crystal vibrating piece 9A is formed in an elliptical shape having the major axis in the X-axis direction and the minor axis in the Z′-axis direction.
The distance from the end on the + Z ′ side that is one end along the X-axis direction of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10 to the end on the + Z ′ side that is the length of the short axis of the vibration unit 15 is ΔZ.

According to this, in the crystal vibrating piece 9A, the vibration part 15 is formed in an elliptical shape with the X axis direction as the major axis and the Z ′ axis direction as the minor axis, and thus the planar shape of the vibration part 15 is thick. This is substantially equal to the elliptical shape, which is the confinement shape of the vibration energy distribution of the slip vibration.
As a result, the crystal vibrating piece 9A can further enhance the effect of confining the vibration energy of the thickness shear vibration as compared with the first embodiment.
Thereby, the crystal vibrating piece 9A can further suppress the coupling between the thickness shear vibration mode and the unnecessary vibration mode.

(Modification 9)
FIG. 12 is a schematic perspective view illustrating a schematic configuration of a crystal resonator element according to Modification 9 of the first embodiment. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 12, the quartz crystal resonator element 9 </ b> B of Modification 9 is different from the first embodiment in the configuration of the vibrating portion 15 of the AT-cut quartz crystal substrate 10.
The vibrating portion 15 of the quartz crystal vibrating piece 9B is formed in an elliptical shape having the X-axis direction as the long axis and the Z′-axis direction as the short axis. In addition, the vibrating portion 15 of the crystal vibrating piece 9B is provided so as to be thicker in a staircase shape (here, two steps) than the thickness of the outer peripheral portion 16 from the outer peripheral portion 16 side toward the center. ing. In other words, the side wall of the vibration part 15 has a plurality of steps.
Further, from the end portion on the + Z ′ side, which is one end portion along the X-axis direction, of the outer peripheral portion 16 of the AT-cut quartz crystal substrate 10 to the end portion on the + Z ′ side that is the length of the short axis of the vibration unit 15. The distance is ΔZ.

According to this, the crystal vibrating piece 9B is formed in an elliptical shape in which the vibration part 15 has the major axis in the X-axis direction and the minor axis in the Z′-axis direction. This is substantially equal to the elliptical shape, which is the confinement shape of the vibration energy distribution of the slip vibration. In addition, the crystal vibrating piece 9B is provided so as to be thicker in a stepped shape (here, two steps) than the thickness of the outer peripheral portion 16 as the vibrating portion 15 moves from the outer peripheral portion 16 side toward the center. Therefore, the effect of confining the vibration energy of the thickness shear vibration can be further enhanced as compared with the first embodiment.
Thereby, the crystal vibrating piece 9B can further suppress the coupling between the thickness shear vibration mode and the unnecessary vibration mode.

In addition, in the said embodiment and each modification, the excitation electrodes 13 and 14 may remain in the main surfaces 11 and 12 of the vibration part 15, without extending to the outer peripheral part 16. FIG. The mount electrodes 17 and 18 may be located closer to each other than the illustrated position in the X-axis direction. Further, the number of steps of the step-like vibrating portion 15 may be three or more.
In addition, as an example of the external size of each quartz crystal resonator element, the long side (X-axis direction) is about 1.4 mm, the short side (Z′-axis direction, Z) is about 1 mm, and the thickness (Y′-axis direction, t ) Is assumed to be about 0.06 mm (60 μm).

(Second Embodiment)
Next, a crystal resonator as an example of a vibration device including the above-described crystal resonator element as the resonator element and a package as a container in which the crystal resonator element is accommodated will be described.

  FIG. 13 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the second embodiment. 13A is a plan view seen from the lid side, FIG. 13B is a cross-sectional view taken along line AA in FIG. 13A, and FIG. 13C is FIG. It is sectional drawing in the CC line of (a). In the plan view, the lid is omitted. Also, common parts with the first embodiment will be denoted by the same reference numerals, detailed description thereof will be omitted, and different parts from the first embodiment will be mainly described.

As shown in FIG. 13, the crystal resonator 101 is either the crystal vibrating piece 1 of the first embodiment or the crystal vibrating piece (2 or the like) of each modified example (here, the crystal vibrating piece 1). And a package 20 in which the crystal vibrating piece 1 is accommodated.
The package 20 includes a package base 21 having a substantially rectangular planar shape and provided with a recess 22 and a flat lid (cover) 23 that covers the recess 22 of the package base 21 and is formed in a substantially rectangular parallelepiped shape. Yes.

The package base 21 includes an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a glass ceramic sintered body, etc., which are formed by stacking and firing ceramic green sheets. Ceramic-based insulating materials such as quartz, glass, and silicon (high resistance silicon) are used.
The lid 23 is made of the same material as the package base 21 or a metal such as Kovar or 42 alloy.

Internal terminals 24 a and 24 b are provided on the step 22 a in the recess 22 of the package base 21 at positions facing the mount electrodes 17 and 18 of the crystal vibrating piece 1.
In the quartz crystal resonator element 1, the mount electrodes 17 and 18 are bonded to the internal terminals 24 a and 24 b via a conductive adhesive 30 such as an epoxy, silicone, or polyimide that is mixed with a conductive material such as a metal filler. Has been.

Rectangular electrode terminals 26 a and 26 b are provided on the outer bottom surface 25 (outer bottom surface) of the package base 21 opposite to the recess 22.
The electrode terminals 26a and 26b are electrically connected to the internal terminals 24a and 24b by internal wiring (not shown). Specifically, the electrode terminal 26a is electrically connected to the internal terminal 24a, and the electrode terminal 26b is electrically connected to the internal terminal 24b.
The internal terminals 24a and 24b and the electrode terminals 26a and 26b are formed by, for example, laminating respective coatings such as Ni (nickel) and Au (gold) on a metallized layer such as W (tungsten) and Mo (molybdenum) by plating or the like. It consists of a metal coating.

In the crystal resonator 101, the recess 22 of the package base 21 is covered with the lid 23 in a state where the crystal resonator element 1 is bonded to the internal terminals 24 a and 24 b of the package base 21, and the package base 21 and the lid 23 are seamed. The recess 22 of the package base 21 is hermetically sealed by bonding with a bonding member 27 such as low melting glass or adhesive.
Note that the hermetically sealed recess 22 of the package base 21 is in a vacuum state (a high degree of vacuum) or a state filled with an inert gas such as nitrogen, helium, or argon.

  The package 20 may be composed of a flat package base 21 and a lid 23 having a recess. The package 20 may have a recess in both the package base 21 and the lid 23.

  In the crystal resonator 101, for example, the crystal resonator element 1 is excited by the thickness shear vibration by a drive signal applied from the oscillation circuit integrated in the IC chip of the electronic device through the electrode terminals 26a and 26b. Resonance (oscillation) at a predetermined frequency, and a resonance signal (oscillation signal) is output from the electrode terminals 26a and 26b.

As described above, the crystal resonator 101 according to the second embodiment includes the crystal resonator element 1 and the package 20 in which the crystal resonator element 1 is accommodated, and thus the effects described in the first embodiment. It is possible to provide a crystal resonator as a vibration device reflecting the above. Specifically, a quartz resonator having a small size and excellent frequency temperature characteristics can be provided.
Note that the quartz crystal resonator 101 may be replaced with the quartz crystal vibrating piece 1 and the quartz vibrating piece (2 or the like) of each modification may be used. It is possible to provide a crystal resonator in which a specific effect is reflected.
In the crystal resonator 101, the electrical connection between the mount electrodes 17 and 18 and the internal terminals 24a and 24b may be performed by wire bonding using a metal wire.

(Third embodiment)
Next, a crystal oscillator as an example of a vibration device including the above-described crystal resonator element as the resonator element, a package as a container in which the crystal resonator element is accommodated, and an oscillation circuit that drives the crystal resonator element Will be described.

  FIG. 14 is a schematic diagram illustrating a schematic configuration of the crystal oscillator according to the third embodiment. 14A is a plan view seen from the lid side, FIG. 14B is a cross-sectional view taken along line AA in FIG. 14A, and FIG. 14C is FIG. It is sectional drawing in the DD line of (a). In the plan view, the lid is omitted. In addition, common portions with the first embodiment and the second embodiment are denoted by the same reference numerals, detailed description thereof is omitted, and description will be made focusing on portions different from the first embodiment and the second embodiment. .

  As shown in FIG. 14, the crystal oscillator 102 includes either the crystal vibrating piece 1 of the first embodiment or the crystal vibrating piece (2 or the like) of each modified example (here, the crystal vibrating piece 1); An IC chip 40 as an oscillation circuit that drives (oscillates) the crystal vibrating piece 1 and a package 20 in which the crystal vibrating piece 1 and the IC chip 40 are housed are provided.

On the bottom of the concave portion 22 of the package base 21, a housing portion 22 b for the IC chip 40 formed in a concave shape is provided. The IC chip 40 incorporating the oscillation circuit is fixed to the bottom surface of the housing portion 22b of the package base 21 using an adhesive (not shown).
In the IC chip 40, connection pads (not shown) are electrically connected to the internal connection terminals 22c in the housing portion 22b by metal wires 41 such as Au (gold) and Al (aluminum).

The internal connection terminal 22c is made of a metal film in which a film such as Ni (nickel) or Au (gold) is laminated on a metallized layer such as W (tungsten) or Mo (molybdenum) by plating or the like, via an internal wiring (not shown). The electrode terminals 26a, 26b, 26c, and 26d provided at the four corners of the outer bottom surface 25 of the package 20 and the internal terminals 24a and 24b are electrically connected.
The connection between the connection pad of the IC chip 40 and the internal connection terminal 22c uses a connection method by flip chip mounting by inverting the IC chip 40 in addition to the connection method by wire bonding using the metal wire 41. May be.

The crystal oscillator 102 resonates at a predetermined frequency when the crystal resonator element 1 is excited by thickness shear vibration by a drive signal applied from the IC chip 40 via the internal connection terminal 22c, the internal terminals 24a, 24b, and the like ( Oscillate).
The crystal oscillator 102 outputs an oscillation signal generated along with the oscillation to the outside via the IC chip 40, the electrode terminals 26a and 26b (26c and 26d), and the like.

As described above, the crystal oscillator 102 of the third embodiment includes the crystal resonator element 1, the IC chip 40 that drives the crystal oscillator piece 1, the package 20 in which the crystal oscillator piece 1 and the IC chip 40 are accommodated, Therefore, it is possible to provide a crystal oscillator as a vibrating device in which the effects described in the first embodiment are reflected. Specifically, a crystal oscillator having a small size and excellent frequency temperature characteristics can be provided.
Note that the crystal oscillator 102 can be replaced with the quartz crystal resonator element 1 by using the crystal oscillator pieces (2 etc.) of the respective modified examples, and the same effects as those described above and the characteristics of the crystal oscillator pieces (2 etc.) of the respective modified examples. Thus, it is possible to provide a crystal oscillator in which the effects of the above are reflected.
The crystal oscillator 102 may be a module structure in which the IC chip 40 is not built in the package 20 but is externally attached (for example, a structure in which the crystal resonator and the IC chip are individually mounted on one substrate). Good.

(Fourth embodiment)
Next, a mobile phone will be described as an example of an electronic device including the above-described quartz crystal resonator element as a resonator element.
FIG. 15 is a schematic perspective view showing the mobile phone of the fourth embodiment.
A mobile phone 700 is a mobile phone including the crystal resonator element 1 of the first embodiment or the crystal resonator element (2 or the like) of each modification.
A cellular phone 700 shown in FIG. 15 uses the above-described quartz crystal resonator element (such as 1 or 2) as a timing device such as a reference clock oscillation source, and further includes a liquid crystal display device 701, a plurality of operation buttons 702, and an earpiece 703. , And a mouthpiece 704.
According to this, since the mobile phone 700 includes the crystal vibrating piece (such as 1 or 2), the effects described in the first embodiment and each modification are reflected, and excellent performance is exhibited. Can do.
The form of the mobile phone 700 is not limited to the illustrated type, and may be a so-called smartphone type.

  The above-described crystal vibrating piece is not limited to the mobile phone such as the mobile phone 700, but an electronic book, a personal computer, a television, a digital still camera, a video camera, a video recorder, a navigation device, a pager, an electronic notebook, a calculator, a word processor, An electronic device that can be suitably used as a timing device such as a workstation, a videophone, a POS terminal, or a device equipped with a touch panel, and in any case, an electronic device in which the effects described in the first embodiment and each modification are reflected. Can be provided.

(Fifth embodiment)
Next, an automobile will be described as an example of a moving body including the above-described quartz crystal vibrating piece as the vibrating piece.
FIG. 16 is a schematic perspective view showing the automobile of the fifth embodiment.
The automobile 800 is an automobile provided with the quartz crystal vibrating piece 1 of the first embodiment or the quartz crystal vibrating piece (2 or the like) of each modified example.
The automobile 800 includes, for example, various electronically controlled devices (for example, an electronically controlled fuel injection device, an electronically controlled ABS device, an electronically controlled constant speed traveling) mounted on the crystal vibrating piece (1 or 2) described above. It is used as a timing device that generates a reference clock for a device.
According to this, since the automobile 800 includes the quartz crystal vibrating piece (1 or 2 or the like), the effects described in the first embodiment and the respective modifications are reflected, and excellent performance can be exhibited. it can.

  The above-mentioned crystal resonator element can be suitably used as a timing device for mobile objects including not only the automobile 800 but also a self-propelled robot, a self-propelled transport device, a train, a ship, an airplane, an artificial satellite, etc. Also in this case, it is possible to provide a moving body in which the effects described in the first embodiment and each modification are reflected.

  1,2,3,4,5,6,7,8,9A, 9B ... quartz resonator element as resonator element, 10 ... AT-cut quartz substrate, 11, 12 ... main surface, 13, 14 ... excitation electrode, 15 DESCRIPTION OF SYMBOLS ... Vibration part, 16 ... Outer peripheral part, 17, 18 ... Mount electrode, 20 ... Package as a container, 21 ... Package base, 22 ... Recessed part, 22a ... Step part, 22b ... Housing part, 22c ... Internal connection terminal, 23 ... Lids (lids), 24a, 24b ... internal terminals, 25 ... outer bottom surface, 26a, 26b, 26c, 26d ... electrode terminals, 27 ... joining member, 30 ... conductive adhesive, 40 ... IC chip as an oscillation circuit, DESCRIPTION OF SYMBOLS 41 ... Metal wire, 101 ... Crystal oscillator as vibration device, 102 ... Crystal oscillator as vibration device, 700 ... Mobile phone as electronic device, 701 ... Liquid crystal display device, 702 ... Operation button, 703 ... Story outlet, 704 ... mouthpiece, 800 ... a motor vehicle as a moving body.

Claims (8)

Of the crystal axes of quartz, the X axis as the electrical axis, the Y axis as the mechanical axis, and the Z axis as the optical axis, the X axis is the rotation axis, and the Z axis is the −Y direction of the Y axis The axis tilted so that the + Z side rotates is defined as the Z ′ axis, the Y axis is defined as the Y ′ axis, and the axis tilted so that the + Y side rotates in the + Z direction of the Z axis is defined as the X axis and the Z ′ axis. An AT-cut quartz substrate having a plane parallel to the main surface and a direction parallel to the Y ′ axis as a thickness direction;
An excitation electrode disposed in a vibration region of the main surface of the AT-cut quartz crystal substrate,
A vibrating portion that vibrates by thickness shear vibration, and an outer peripheral portion that is thinner than the vibrating portion and surrounds the vibrating portion in plan view,
A resonator element, wherein a mount electrode connected to the excitation electrode is provided at any end portion of the outer peripheral portion along the X-axis direction. In claim 1,
The vibrating portion is provided to be biased to one side of the end portions along the X-axis direction of the outer peripheral portion in a plan view, and the mount electrode is provided on the X-axis of the outer peripheral portion. It is provided in the other side among the said any edge parts along a direction, The vibration piece characterized by the above-mentioned. In claim 1 or claim 2,
When the distance from one end portion of the outer peripheral portion along the X-axis direction to the end portion of the vibrating portion is ΔZ, and the thickness of the vibrating portion is t,
0.8 ≦ ΔZ / t ≦ 1.3
A vibrating piece characterized by satisfying In any one of Claims 1 to 3,
At least a part of the side wall of the vibration part has a plurality of steps. A vibrating piece according to any one of claims 1 to 4,
A container in which the vibrating piece is accommodated;
A vibration device comprising: In claim 5,
An oscillating device further comprising an oscillating circuit for driving the oscillating piece.   An electronic apparatus comprising the resonator element according to claim 1.   A moving body comprising the resonator element according to claim 1.

Images