JP2014080542A - Resin composition and electronic device - Google Patents

Abstract

A resin composition capable of obtaining an electronic device having high bondability between electrodes and high insulation reliability, and an electronic device having a cured product of the resin composition.
A film-like electrode connecting resin composition that is interposed between electrodes facing each other and electrically connects the electrodes facing each other, wherein the resin composition comprises (A) a polyphthalene having a naphthalene skeleton. A resin composition comprising a functional epoxy resin, (B) a compound having a phenolic hydroxyl group and a carboxyl group in one molecule, and (C) a film-forming resin.
[Selection] Figure 3

Description

  The present invention relates to a resin composition and an electronic device.

  The electronic device performs, for example, a process of joining the electrode of the semiconductor element and the electrode of another semiconductor element, the electrode of the semiconductor element and the electrode of the substrate, or the electrode of the substrate and the electrode of another substrate using solder. Manufactured by.

  Since gaps are formed between semiconductor elements after bonding using solder, between the semiconductor elements and the substrate, or between the substrates, it is necessary to fill the gaps with a cured resin. Conventionally, after joining using solder, a fluid thermosetting resin composition is poured into this gap, and then the thermosetting resin is cured to fill gaps between semiconductor elements and the like.

  However, in recent years, before bonding using solder, a resin layer containing a compound having a flux function is disposed between semiconductor elements and the like, and then heated at a temperature equal to or higher than the melting point of the solder to perform solder bonding. Subsequently, a method for curing the resin layer has been studied.

  For example, Japanese Patent Laid-Open No. 3-184695 (Patent Document 1) discloses a solder paste containing an epoxy resin as a main component and containing an organic acid or an organic acid salt and solder particles. Japanese Patent Application Laid-Open No. 2001-311005 (Patent Document 2) discloses at least one thermosetting resin selected from an epoxy resin, a phenol resin, a diallyl phthalate resin, and a benzocyclobutene resin, and a flux component. A thermosetting resin sheet characterized by molding a composition containing the above into a sheet shape is disclosed.

Japanese Patent Laid-Open No. 3-184695 JP 2001-311005 A

  However, even when the conventional techniques as shown in Patent Documents 1 and 2 are used, when the electrodes are bonded to each other, a bonding failure may occur or the insulation reliability may be lowered. Therefore, a resin composition capable of producing a more reliable electronic device has been desired.

  The present invention provides a resin composition capable of obtaining an electronic device having high bondability between electrodes and high insulation reliability, and an electronic device having a cured product of the resin composition.

The resin composition of the present invention is a film-like electrode connecting resin composition that is interposed between electrodes facing each other and electrically connects the electrodes facing each other,
The resin composition is
(A) a polyfunctional epoxy resin having a naphthalene skeleton;
(B) a compound having a phenolic hydroxyl group and a carboxyl group in one molecule;
(C) a film-forming resin;
It is characterized by containing.

  In the resin composition of the present invention, the component (B) can be a compound having two or more phenolic hydroxyl groups and one or more carboxyl groups in one molecule.

  In the resin composition of the present invention, the component (B) can be a compound having two or more phenolic hydroxyl groups in one molecule and one or more carboxyl groups directly bonded to an aromatic ring.

  In the resin composition of the present invention, the content of the component (A) is 1% by mass or more and 20% by mass or less with respect to the entire resin composition, and the content of the component (B) is 3% by mass. As mentioned above, it can be 25 mass% or less.

  In the resin composition of the present invention, the content mass ratio [(B) / (A)] of the component (A) and the component (B) can be 0.2 or more and 16 or less.

  The resin composition of the present invention can further contain (D) a phenol resin.

  And the electronic device of this invention has the hardened | cured material of the resin composition of the said invention, It is characterized by the above-mentioned.

In the present invention, the resin composition (A) a polyfunctional epoxy resin having a naphthalene skeleton,
(B) a compound having a phenolic hydroxyl group and a carboxyl group in one molecule;
(C) a film-forming resin;
By containing, it is possible to obtain an electronic device that is excellent in connectivity and insulation reliability between opposing electrodes.

  ADVANTAGE OF THE INVENTION According to this invention, it has a resin composition which can provide an electronic device with high connectivity between opposing electrodes and high insulation reliability, and an electron having high connectivity and insulation reliability having a cured product of this resin composition. An apparatus is provided.

It is process drawing which shows the one manufacturing process about the electronic device of this invention. It is process drawing which shows the one manufacturing process about the electronic device of this invention. It is process drawing which shows the one manufacturing process about the electronic device of this invention.

  Hereinafter, this embodiment will be described.

[Electronic device]
1 to 3 show a process in which the first substrate 110 having the electrode 111 and the second substrate 120 having the electrode 121 are joined via the resin composition 130 to form the electronic device 100.
As shown in FIG. 3, in the electronic device 100, the electrode 111 formed on one surface of the first substrate 110 and the electrode 121 formed on one surface of the second substrate 120 are individually joined to each other, and the first substrate 110. A resin layer 130 is filled between the first substrate 120 and the second substrate 120.

[Resin composition]
First, the resin composition used for the resin layer 130 will be described.
The resin composition in the present invention is formed on one surface of the second substrate 120 and the electrode 111 (gold 111a / nickel 111b / copper pillar 111c) formed on one surface of the first substrate 110 as an example of the embodiment. It is a resin composition that is introduced between the electrodes 121 (solder bumps 121a / copper pillars 121b) and thermally cured after the solder bumps 111a of the electrodes 111 and the gold 121a of the electrodes 121 are joined. In other words, in the electronic device 100 finally obtained, the resin layer 130 may be formed so as to fill the gap between the first substrate 110 and the second substrate 120. In the present embodiment, the second substrate 120 is a semiconductor chip.

The resin composition in the present invention is
A film-like electrode connecting resin composition that is interposed between opposing electrodes and electrically connects the opposing electrodes,
(A) a polyfunctional epoxy resin having a naphthalene skeleton;
(B) a compound having a phenolic hydroxyl group and a carboxyl group in one molecule;
(C) a film-forming resin;
It is characterized by containing.

In the resin composition of the present invention, (A) a polyfunctional epoxy resin having a naphthalene skeleton is used. Thereby, Tg of the hardened | cured material of the resin composition of this invention can be improved, and insulation reliability can be improved.
The component (A) used in the resin composition of the present invention has a naphthalene structure in the molecular structure and has a structure in which two or more glycidyl ether groups are bonded to the naphthalene ring, or these A mixture is mentioned.

  The (A) polyfunctional epoxy resin having a naphthalene skeleton is not particularly limited. Specifically, diglycidyl ethers of dihydroquinaphthalene, polyglycidyl ethers of polyhydroxybinaphthalene, and And polyglycidyl ethers of compounds obtained by condensation reaction of polyhydroxynaphthalene and aldehydes.

  Examples of the diglycidyl ethers of dihydroquinaphthalene include 1,3-diglycidyloxynaphthalene, 1,4-diglycidyloxynaphthalene, 1,5-diglycidyloxynaphthalene, 1,6-diglycidyloxynaphthalene, 2, Examples include 3-diglycidyloxynaphthalene, 2,6-diglycidyloxynaphthalene, and 2,7-diglycidyloxynaphthalene.

  Examples of the polyglycidyl ethers of the polyhydroxybinaphthalene include 1,1′-bi- (2-glycidyloxy) naphthyl and 1- (2,7-diglycidyloxy) -1 ′-(2′-glycidyl). Oxy) binaphthyl, 1,1′-bi- (2,7-diglycidyloxy) naphthyl and the like.

  Examples of polyglycidyl ethers of compounds obtained by the condensation reaction of polyhydroxynaphthalene and aldehydes include 1,1′-bis (2,7-diglycidyloxynaphthyl) methane, 1- (2,7- And diglycidyloxynaphthyl) -1 ′-(2′-glycidyloxynaphthyl) methane, 1,1′-bis (2-glycidyloxynaphthyl) methane, and the like.

Among these, polyglycidyl ethers of polyhydroxybinaphthalene and polyglycidyl ethers of compounds obtained by condensation reaction of polyhydroxynaphthalene and aldehydes are preferred, and in particular, 1, 1'-bis (2,7-diglycidyl-oxy naphthyl) methane, 1- (2,7-diglycidyl-oxy naphthyl) -1 '- _(2' - glycidyloxy naphthyl) methane, 1- (2,7-di glycidyloxy) -1 '- _(2' - glycidyloxy) binaphthyl, 1,1'-bi - (2,7-diglycidyl-oxy) naphthyl are preferable from the viewpoint of excellent insulation reliability.

In the resin composition of the present invention, the content of the component (A) with respect to the entire resin composition is not particularly limited, but is preferably 1% by mass or more and 20% by mass or less. More preferably, it is 1 mass% or more and 17 mass% or less.
By making content of (A) component in a resin composition more than the said lower limit, an effect can be exhibited in the improvement of Tg. Moreover, the flexibility of the resin composition before hardening can be ensured by setting it as the said upper limit or less.

In the resin composition of the present invention, in addition to the component (A), other thermosetting resins can be used together.
The thermosetting resin used here is not particularly limited, and examples thereof include epoxy resins, oxetane resins, phenol resins, (meth) acrylate resins, unsaturated polyester resins, diallyl phthalate resins, and maleimide resins.
Among these, an epoxy resin is preferable. Epoxy resins are excellent in curability and storage stability, heat resistance of cured products, moisture resistance, chemical resistance, and the like.

  The epoxy resin that can be contained in the resin composition of the present invention may be either an epoxy resin that is solid at room temperature or an epoxy resin that is liquid at room temperature, or both of them. When the resin composition according to the present invention contains an epoxy resin, the degree of freedom in designing the melting behavior of the resin layer can be further increased.

  Among the epoxy resins that can be contained in the resin composition of the present invention, the epoxy resin that is solid at room temperature is not particularly limited, and examples thereof include bisphenol A type epoxy resins, bisphenol S type epoxy resins, and phenol novolac type epoxy resins. Cresol novolac type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin and the like. These may be used alone or in combination of two or more.

  Of the epoxy resins that can be contained in the resin composition of the present invention, the epoxy resin that is liquid at room temperature is not particularly limited, and examples thereof include bisphenol A type epoxy resins, bisphenol F type epoxy resins, and phenol novolac type epoxy resins. Allylated bisphenol A type epoxy resin, modified epoxy resin, cyclohexanedimethanol diglycidyl ether and the like. These may be used alone or in combination of two or more. The epoxy equivalent of the epoxy resin that is liquid at room temperature is preferably 120 to 400, more preferably 140 to 360, and still more preferably 160 to 320. Thereby, it can prevent that the shrinkage | contraction rate in the hardened | cured material of a resin layer becomes large, and can prevent that a curvature arises in an electronic device.

  In the resin composition of the present invention, (B) a compound having a phenolic hydroxyl group and a carboxyl group in one molecule is used. Thereby, the flux function can be imparted to the resin composition, the connectivity between the electrodes and the insulation reliability can be improved, and the resin can react with the component (A). Since it can be taken into the skeleton, it can have stable insulating properties.

In the resin composition of this invention, what has one phenolic hydroxyl group and one carboxyl group in 1 molecule can be used as said (B) component.
As such component (B), 2-hydroxybenzoic acid, 3-hydroxybenzoic acid, 4-hydroxybenzoic acid, 1-hydroxy-2-naphthoic acid, 2-hydroxy-1-naphthoic acid, 3-hydroxy- 2-naphthoic acid, 6-hydroxy-1-naphthoic acid, hydroxynaphthoic acid such as 6-hydroxy-2-naphthoic acid, 2-hydroxycinnamic acid, 3-hydroxycinnamic acid, 4-hydroxycinnamic acid, etc. Examples thereof include hydroxycinnamic acids.
Such a component (B) can impart a flux action to the resin composition, and even when an epoxy resin other than the component (A) or the component (A) is used in combination, an addition reaction with these epoxy resins. can do.

Moreover, in the resin composition of this invention, what has two or more phenolic hydroxyl groups and one or more carboxyl groups in 1 molecule can be used as said (B) component. Examples of such component (B) include diphenolic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, Benzoic acid derivatives such as 3,4-dihydroxybenzoic acid and gallic acid (3,4,5-trihydroxybenzoic acid); 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, Examples include naphthoic acid derivatives such as 3,7-dihydroxy-2-naphthoic acid; phenolphthaline; and pamoic acid. These may be used alone or in combination of two or more.
Such a component (B) can impart a flux action to the resin composition, and even when an epoxy resin other than the component (A) or the component (A) is used in combination with these epoxy resins. The reaction can act as the curing agent.

Further, in the resin composition of the present invention, as the component (B), a compound having two or more phenolic hydroxyl groups and one or more carboxyl groups directly bonded to an aromatic ring in one molecule is used. Can do.
Examples of such component (B) include 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, Benzoic acid derivatives such as 4-dihydroxybenzoic acid and gallic acid (3,4,5-trihydroxybenzoic acid), 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, 3, Examples thereof include naphthoic acid derivatives such as 7-dihydroxy-2-naphthoic acid, phenolphthaline, pamoic acid and the like, and these may be used alone or in combination of two or more.
Such a component (B) can impart a flux action to the resin composition, and even when an epoxy resin other than the component (A) or the component (A) is used in combination with these epoxy resins. The reaction can act as the curing agent.

  The resin composition of this invention can obtain the resin composition which has the solder connection property resulting from high insulation and a flux effect | action by using the said (A) component and (B) component together.

In the resin composition of the present invention, the content of the component (B) with respect to the entire resin composition is not particularly limited, but is preferably 3% by mass or more and 25% by mass or less. More preferably, it is 3.5 mass% or more and 20 mass% or less.
By making content of (B) component in a resin composition more than the said lower limit, the insulation of the resin composition after hardening can be ensured. Moreover, by setting it as the said upper limit or less, the solder connectivity by expression of an effective flux effect | action can be ensured.

In the resin composition of the present invention, the mass ratio [(B) / (A)] of the component (A) and the component (B) in the resin composition is 0.2 or more and 16 or less. Preferably there is. More preferably, it is 0.5 or more and 13 or less, and particularly preferably 0.7 or more and 10 or less.
By making the said mass ratio more than the said lower limit, the effective flux effect | action of a resin composition, film formability, and a flexibility can be ensured. Moreover, by setting it as the said upper limit or less, the insulation of the resin composition after hardening, film-forming property, and a flexibility can be ensured.

  In the resin composition of the present invention, (C) a film-forming resin is used. Thereby, a resin composition can be easily made into a film form and the electronic device excellent in connectivity and insulation reliability can be produced efficiently.

Examples of the film-forming resin include (meth) acrylic resin, phenoxy resin, polyester resin, polyurethane resin, polyimide resin, siloxane-modified polyimide resin, polybutadiene, polypropylene, styrene-butadiene-styrene copolymer, styrene-ethylene- Butylene-styrene copolymer, polyacetal resin, polyvinyl butyral resin, polyvinyl acetal resin, butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer Examples include coalescence, polyvinyl acetate, and nylon.
Among these, (meth) acrylic resins and phenoxy resins are preferable. By applying a (meth) acrylic resin or a phenoxy resin, it is possible to achieve both film formability and adhesion to a support and an adherend.
The film-forming resin may be used alone or in combination of two or more.

  In the film-forming resin, the (meth) acrylic resin is a polymer of (meth) acrylic acid and derivatives thereof, or a copolymer of (meth) acrylic acid and derivatives thereof with other monomers. means. Here, when it describes with (meth) acrylic acid etc., it means acrylic acid or methacrylic acid.

Specific examples of the acrylic resin used as the film-forming resin include polyacrylic acid, polymethacrylic acid, polymethyl acrylate, polyethyl acrylate, polybutyl acrylate, and polyacrylic acid-2-ethylhexyl. Polyacrylic acid ester; polymethacrylic acid ester such as polymethyl methacrylate, polyethyl methacrylate, polybutyl methacrylate; polyacrylonitrile, polymethacrylonitrile, polyacrylamide, butyl acrylate-ethyl acrylate-acrylonitrile copolymer, Acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-styrene copolymer, methyl methacrylate-styrene copolymer , Methyl methacrylate-acrylonitrile copolymer, methyl methacrylate-α-methylstyrene copolymer, butyl acrylate-ethyl acrylate-acrylonitrile-2-hydroxyethyl methacrylate-methacrylic acid copolymer, butyl acrylate-acrylic acid Ethyl-acrylonitrile-2-hydroxyethyl methacrylate-acrylic acid copolymer, butyl acrylate-acrylonitrile-2-hydroxyethyl methacrylate copolymer, butyl acrylate-acrylonitrile-acrylic acid copolymer, butyl acrylate-ethyl acrylate -An acrylonitrile copolymer, an ethyl acrylate- acrylonitrile-N, N dimethylacrylamide copolymer, etc. are mentioned.
Among these, butyl acrylate-ethyl acrylate-acrylonitrile copolymer and ethyl acrylate-acrylonitrile-N, N dimethylacrylamide copolymer are preferable.

  In addition, as an acrylic resin used as a film-forming resin, by using a (meth) acrylic resin obtained by copolymerizing a monomer having a functional group such as a nitrile group, an epoxy group, a hydroxyl group, or a carboxyl group, The adhesion of the film-like resin composition to the support and adherend, and compatibility with the thermosetting resin and the like can be improved.

The acrylic resin has a weight average molecular weight of 1,000 to 1,000,000, for example,
000 to 900,000 is preferable.
When the weight average molecular weight of the acrylic resin is within the above range, the film-forming property of the resin composition can be further improved and the fluidity at the time of curing can be ensured.

When a phenoxy resin is used as the film-forming resin, a phenoxy resin having a number average molecular weight of 5000 to 20000 is preferable.
By using such a phenoxy resin having a number average molecular weight, the fluidity of the film-like resin composition can be suppressed, and the thickness of the film-like resin composition can be made uniform.

  The skeleton of the phenoxy resin is not particularly limited, and examples thereof include bisphenol A type, bisphenol F type, biphenyl skeleton type, and biphenol skeleton type.

In the resin composition of the present invention, the content of the component (C) with respect to the entire resin composition is not particularly limited, but is preferably 0.1% by mass or more and 20% by mass or less, more preferably 0. It is 2 mass% or more and 10 mass% or less.
By controlling the content of the component (C) in the resin composition within the above range, the elasticity of the film-shaped resin composition after curing is suppressed while suppressing a decrease in film formability of the film-shaped resin composition. Increase can be suppressed. As a result, the adhesion between the film-shaped resin composition, the support and the adherend can be further improved. Furthermore, an increase in the melt viscosity of the film-like resin composition can be suppressed.

The resin composition of the present invention is not particularly limited, but in addition to the above components (A) to (C), when an epoxy resin is used together with the component (A) as a thermosetting resin, it contains a curing agent. It is preferable to do. Such a hardening | curing agent should just act as a hardening | curing agent of an epoxy resin, and is selected suitably.
Specifically, polyamines including aliphatic polyamines such as diethylenetriamine, triethylenetetramine, and metaxylylenediamine, aromatic polyamines such as diaminodiphenylmethane, m-phenylenediamine, and diaminodiphenylsulfone, dicyandiamide, and organic acid dihydrazide Amine-based curing agents such as compounds, aliphatic acid anhydrides such as hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, aromatic acid anhydrides such as tritometic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic acid, etc. Acid anhydride curing agent, phenol novolac resin, cresol novolac resin, phenol aralkyl (including phenylene and biphenylene skeleton) resin, naphthol aralkyl (including phenylene and biphenylene skeleton) resin Triphenol methane resin, dicyclopentadiene type phenol resin, bis (mono or di t-butylphenol) propane, methylene bis (2-propenyl) phenol, propylene bis (2-propenyl) phenol, bis [(2-propenyloxy) phenyl] Methane, bis [(2-propenyloxy) phenyl] propane, 4,4 ′-(1-methylethylidene) bis [2- (2-propenyl) phenol], 4,4 ′-(1-methylethylidene) bis [ 2- (1-phenylethyl) phenol], 4,4 ′-(1-methylethylidene) bis [2-methyl-6-hydroxymethylphenol], 4,4 ′-(1-methylethylidene) bis [2- Methyl-6- (2-propenyl) phenol], 4,4 ′-(1-methyltetradecylidene) bis Examples thereof include phenolic curing agents such as phenol.
Among these, when a phenol resin (the above-described phenol-based curing agent) is used, the glass transition temperature of the cured product of the resin composition can be effectively increased, and components that become outgas can be reduced.

When using the said hardening | curing agent, the usage-amount of a hardening | curing agent calculates | requires from the ratio of the epoxy equivalent of an epoxy resin, and the equivalent of a hardening | curing agent. When the curing agent is a phenol resin, the equivalent ratio (Ep / OH) between the epoxy group (Ep) of the epoxy resin and the phenolic hydroxyl group (OH) of the curing agent is preferably 0.5 to 1.5, 0.7 -1.3 is particularly preferred. By setting it as the said range, heat resistance and preservability of a film-form resin composition can be made compatible.
In addition, when calculating the quantity of the said phenolic hydroxyl group (OH), it is preferable to calculate by adding the phenolic hydroxyl group of a hardening | curing agent and the phenolic hydroxyl group and carboxyl group which (B) component has.

  Further, the resin composition of the present invention is not particularly limited. However, in addition to the above components (A) to (C), when an epoxy resin is used together with the component (A) as a thermosetting resin, curing is accelerated. An agent can be contained. Such a curing accelerator may be selected as long as it accelerates the curing reaction between the epoxy resin and the curing agent. Specific examples include imidazoles, amine-based catalysts such as 1,8-diazabicyclo (5,4,0) undecene, and phosphorus compounds such as salts of triphenylphosphine and tetra-substituted phosphonium with polyfunctional phenol compounds. Among these, imidazoles and phosphorus compounds that achieve both fast curability of the film-like resin layer, storage stability, and corrosivity of the aluminum pad on the semiconductor element are preferable.

When the effect accelerator is used, the content of the curing accelerator is preferably 0.001 to 10% by weight, more preferably 0.03 to 7% by weight, and 0.05 to 5% by weight with respect to the entire resin composition. % Is more preferable.
By setting it as the said range, it becomes possible to maintain the balance of sclerosis | hardenability and preservability of a film-form resin composition, and the physical property after hardening.

  Moreover, the resin composition of this invention is although it does not specifically limit, In addition to the said (A)-(C) component, it can contain an inorganic filler. Thereby, the linear expansion coefficient in the hardened | cured material of a film-form resin composition can be made small, and the connectivity and insulation reliability of an electronic device using this can be improved. Further, the tack force of the film-like resin composition can be more easily adjusted. For example, when a support is used together with the film-like resin composition, the peelability from the support is more suitable. In addition, the adhesion to a substrate having an electrode, a semiconductor chip or the like can be made particularly excellent.

  Examples of the inorganic filler include silver, titanium oxide, silica, mica and the like. Among these, silica is preferable. Moreover, although there exist crushing silica and spherical silica as a shape of a silica, spherical silica is preferable.

The average particle size of the inorganic filler is not particularly limited, but is preferably 0.01 μm or more and 20 μm or less, and more preferably 0.03 μm or more and 5 μm or less.
By setting it as the said range, aggregation of the inorganic filler in a film-form resin composition can be suppressed, and the homogeneous resin composition without the aggregate of an inorganic filler can be obtained.

Although content of the said inorganic filler is not specifically limited, It is preferable that it is 1-80 mass% with respect to the whole resin composition, It is more preferable that it is 20-75 mass%, It is 30-70 mass%. More preferably.
By setting the above range, the difference in linear expansion coefficient between the cured resin composition and the substrate or semiconductor chip having the electrode is reduced, and the stress generated during the temperature cycle test can be reduced, and after the curing Since it can suppress that the elasticity modulus of this resin composition becomes high too much, the connectivity and insulation reliability in an electronic device can be improved.

In addition to the components described above, the resin composition of the present invention includes a coupling agent, a flux activator for enhancing the activity of a compound having a flux action, a low stress agent, an antioxidant, a leveling agent, and other resins. You may contain suitably the various additives for improving various characteristics, such as compatibility, stability, workability | operativity.

  In order to mold the resin composition of the present invention into a film, for example, after dissolving solvent-soluble components including the components (A) to (C) in the solvent, an inorganic filler is added to the resin composition. It can be obtained by preparing a product varnish, applying it to a support having been subjected to a peeling treatment such as a polyester sheet, removing the solvent at a predetermined temperature and drying it.

  Examples of the solvent used for preparing the resin composition varnish include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, DIBK (diisobutyl ketone), cyclohexanone, and DAA (diacetone alcohol), benzene, xylene, and toluene. Aromatic hydrocarbons such as methyl alcohol, ethyl alcohol, isopropyl alcohol, n-butyl alcohol, methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl cellosolve acetate, ethyl cellosolve acetate, BCSA (butyrocellsolve acetate), etc. Cellosolve, NMP (N-methyl-2-pyrrolidone), THF (tetrahydrofuran), DMF (dimethylformamide), DBE (dibasic acid ester), EEP (3 Ethyl ethoxypropionate), DMC (dimethyl carbonate) and the like.

  Moreover, the thickness (average) of the film-like resin composition is not particularly limited, but is preferably about 3 to 100 μm, and more preferably about 5 to 50 μm.

[Electronic device]
Next, the electronic device of the present invention will be described. The electronic device of the present invention is characterized by having a cured product of the above-described resin composition of the present invention.
An example of a method for manufacturing the electronic device 100 of the present invention will be described below.

  First, as shown in FIG. 1, the electrode 111 (gold 111a / nickel 111b / copper pillar 111c) is formed on one surface of the first substrate 110, and the electrode 121 (solder bump 121a / copper pillar 121b) is similarly formed on the second substrate. 120 is formed on one surface.

  The solder used for joining the electrode 111 and the electrode 121 (joining of the solder bump 121a and the gold 111a) is not particularly limited and is selected from the group consisting of tin, silver, lead, zinc, bismuth, indium and copper. And alloys containing at least two or more of them. The melting point of the solder is 100 to 350 ° C.

  Next, a film-like resin composition 130 is introduced between the electrode 111 of the first substrate 110 and the electrode 121 of the second substrate 120, and as shown in FIG. The resin layer 130 is filled between the first substrate 110 and the second substrate 120 while being melt-bonded to the electrode 121 of the second substrate 120.

  That is, in this embodiment, the resin composition 130 is laminated by sandwiching the resin composition 130 between the electrode 111 of the first substrate 110 and the electrode 121 of the second substrate 120, and melt-bonding the electrode 111 and the electrode 121. The material 130 melts and spreads, and the space between the first substrate 110 and the second substrate 120 can be filled with the resin composition 130 while soldering.

  The solder bonding may be performed at a temperature equal to or higher than the melting point of the solder, for example, 130 to 380 ° C.

  As shown in FIG. 3, after the electrode 111 of the first substrate 110 and the electrode 121 of the second substrate 120 are melt-bonded, the resin composition 130 is thermoset. Thereby, the electronic device 100 can be obtained.

  The heating temperature may be any temperature as long as it is equal to or higher than the curing temperature of the resin composition 130, and is appropriately selected. The heating time is appropriately selected depending on the type of the resin composition 130, but is usually 0.5 to 8 hours, preferably 1 to 3 hours.

Further, when the resin composition 130 is cured, it may be pressurized. The pressurization is preferably 0.1 MPa or more and 10 MPa or less, more preferably 0.5 MPa or more and 5 MPa or less.
Thereby, generation | occurrence | production of the space | gap (void) in the hardened | cured material of a resin composition can be suppressed. The pressurization is preferably performed using a fluid, and examples thereof include gases such as nitrogen gas, argon gas, and air. Air is preferable in terms of inexpensiveness, but nitrogen is preferable from the viewpoint of suppressing oxidation of the resin composition.

  As a method of curing the resin composition 130 while being pressurized with a pressurized fluid, for example, a processing object to be heated is placed in a pressure vessel, and then the pressurized fluid is introduced into the pressure vessel and added. A method of heating an object to be processed while pressing, more specifically, the object to be processed is placed in a pressure oven, and processing is performed in a pressure oven while introducing a gas for pressurization into the pressure oven. The method of heating a target object is mentioned.

  In addition, this invention is not limited to the above-mentioned embodiment, A various deformation | transformation is accept | permitted in the range which does not deviate from the summary.

  In addition, embodiment mentioned above and a some modification can be combined in the range in which the content does not conflict. Further, in the above-described embodiments and modifications, the structure of each part has been specifically described, but the structure and the like can be changed in various ways within a range that satisfies the present invention.

  Next, examples of the present invention will be described.

  The raw materials used for preparing the resin compositions in Examples and Comparative Examples are as follows.

(A) Polyfunctional epoxy resin having a naphthalene skeleton (a1) Bifunctional naphthalene type epoxy resin (manufactured by DIC Corporation / “EPICLON HP-4770”), epoxy equivalent 204
(A2) Trifunctional naphthalene type epoxy resin (manufactured by DIC Corporation / “EPICLON HP-4750”), epoxy equivalent 188
(A3) Tetrafunctional naphthalene type epoxy resin (DIC Corporation / "EPICLON HP-4700"), epoxy equivalent 165

(B) Compound having phenolic hydroxyl group and carboxyl group in one molecule (b1) Phenolphthaline (manufactured by Tokyo Chemical Industry Co., Ltd.)
(B2) Diphenolic acid (manufactured by Tokyo Chemical Industry Co., Ltd.)
(B3) 2-hydroxybenzoic acid (manufactured by Tokyo Chemical Industry Co., Ltd.)

(C) Film-forming resin (c1) Phenoxy resin (Mitsubishi Chemical Corporation / “YX6954”), number average molecular weight 14000

Other (d) Bisphenol F type epoxy resin (Mitsubishi Chemical Corporation / “jER806”), epoxy equivalent 165
(F) Silica (manufactured by Admatechs / “SC1050-LC”), average particle size 0.25 μm
(G) Novolac type phenolic resin (manufactured by Sumitomo Bakelite Co., Ltd./“PR-55617 ”), hydroxyl group equivalent 103
(H) 2-Phenyl-4-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd./"2P4MZ ")
(I) Coupling agent (Shin-Etsu Chemical Co., Ltd./"KBE403 ")
(J) Acrylic leveling agent (BIC Chemie Japan KK / "BYK361N")
(K) Adipic acid (manufactured by Kanto Chemical Co., Inc.)

<Example 1>
-Preparation of resin composition In addition to 6 parts by weight of "EPICLON HP-4770" as component (A), 6 parts by weight of "phenolphthaline" as component (B), 2 parts by weight of "YX6954" as component (C), 24 parts by mass of “jER806”, 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone. Furthermore, 50 parts by mass of “SC1050-LC” was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
The obtained resin composition varnish was applied to a polyester film substrate (base film, manufactured by Teijin DuPont Films, trade name: Purex A53) to a thickness of 50 μm, and then dried at 100 ° C. for 5 minutes. Then, the solvent was removed by evaporation to obtain a film-like resin composition having a thickness of 25 μm.
-Fabrication of electronic device The film-shaped resin composition obtained above was applied to a semiconductor chip (size 10 x 10 x 0.2 mm) having solder bumps with a height of 20 µm and a pitch of 60 µm, and a vacuum laminator (name machine stock) (Manufactured by MVLP) was laminated at 100 ° C. and 0.8 MPa for 30 seconds to obtain a semiconductor chip with a film-like resin composition.
Using a flip chip bonder (manufactured by Panasonic, FCB3), a predetermined alignment mark of the semiconductor chip and silicon so that the protruding electrode of the silicon circuit board having the protruding electrode and the electrode with the solder bump come into contact with each other. Alignment is performed by automatically recognizing a predetermined alignment mark on the circuit board with a flip chip bonder, and the semiconductor chip is heated on the silicon circuit board at 235 ° C. for 5 seconds to melt the solder of the electrodes with solder bumps. Solder connection was made.
Then, the film-shaped resin composition is cured by heating at 180 ° C. for 60 minutes in an atmosphere of fluid pressure (air pressure) of 0.8 MPa, and the semiconductor chip and the silicon circuit board are formed into a film-shaped resin composition. An electronic device (semiconductor device) bonded through a cured product was obtained.

<Example 2>
In preparing the resin composition,
(A) 6 parts by weight of “EPICLON HP-4750” as component, (B) 6 parts by weight of “phenolphthaline”, (C) 2 parts by weight of “YX6954”, and 24 parts by weight of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 3>
In preparing the resin composition,
(E) 6 parts by mass of “EPICLON HP-4700” as component (A), 6 parts by mass of “phenolphthaline” as component (B), 2 parts by mass of “YX6954” as component (C), and 24 parts by mass of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 4>
In preparing the resin composition,
(E) 1 part by weight of “EPICLON HP-4700” as component (A), 6 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), 21.7 “jER806” 1 part by weight, 19 parts by weight of “PR-55617”, 0.1 part by weight of “2P4MZ”, 0.1 part by weight of “KBE403”, 0.1 part by weight of “BYK361N” are dissolved in methyl ethyl ketone, and further “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 5>
In preparing the resin composition,
In addition to 1 part by weight of “EPICLON HP-4700” as component (A), 25 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), 21.7 “jER806” Part by mass, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403”, 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and further, 50 parts by mass of “SC1050-LC” are mixed, A resin composition varnish having a solid content ratio of 50% by mass was prepared.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 6>
In preparing the resin composition,
(A) 20 parts by weight of “EPICLON HP-4700” as component, 3 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), 13 parts by weight of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 7>
In preparing the resin composition,
(E) 15 parts by mass of “EPICLON HP-4700” as component (A), 15 parts by mass of “phenolphthaline” as component (B), 2 parts by mass of “YX6954” as component (C), and 6 parts by mass of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 8>
In preparing the resin composition,
In addition to 0.5 parts by weight of “EPICLON HP-4700” as component (A), 6 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), “jER806” 29 .5 parts by mass, “PR-55617” 11.7 parts by mass, “2P4MZ” 0.1 part by mass, “KBE403” 0.1 part by mass, “BYK361N” 0.1 part by mass were dissolved in methyl ethyl ketone. , “SC1050-LC” (50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 9>
In preparing the resin composition,
(A) 21 parts by weight of “EPICLON HP-4700” as component, 6 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), 9 parts by weight of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 10>
In preparing the resin composition,
(A) 6 parts by weight of “EPICLON HP-4700” as component, 2 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), and 24 parts by weight of “jER806” , 15.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 11>
In preparing the resin composition,
(E) 2 parts by weight of “EPICLON HP-4700” as component (A), 26 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), and 19.7 of “jER806” Part by mass, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403”, 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and further, 50 parts by mass of “SC1050-LC” are mixed, A resin composition varnish having a solid content ratio of 50% by mass was prepared.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 12>
In preparing the resin composition,
(E) 6 parts by mass of “EPICLON HP-4700” as component (A), 6 parts by mass of “diphenolic acid” as component (B), 2 parts by mass of “YX6954” as component (C), and 24 parts by mass of “jER806” , 11.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 13>
In preparing the resin composition,
(E) 6 parts by mass of “EPICLON HP-4700” as component (A), 6 parts by mass of “2-hydroxybenzoic acid” as component (B), 2 parts by mass of “YX6954” as component (C), “jER806” 24 1 part by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone. SC1050-LC "50 parts by mass was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 14>
In preparing the resin composition,
(A) 6 parts by weight of “EPICLON HP-4700” as component, 4 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), 24 parts by weight of “jER806” , 13.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403”, 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and further, “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 15>
In preparing the resin composition,
(E) 6 parts by mass of “EPICLON HP-4700” as component (A), 5 parts by mass of “phenolphthaline” as component (B), 2 parts by mass of “YX6954” as component (C), and 24 parts by mass of “jER806” , 12.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and further, “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 16>
In preparing the resin composition,
(A) 1 part by weight of “EPICLON HP-4700” as component, 17 parts by weight of “phenolphthaline” as (B) component, 2 parts by weight of “YX6954” as component (C), and 24 parts by weight of “jER806” , 5.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and further, “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 17>
In preparing the resin composition,
(E) 1 part by weight of “EPICLON HP-4700” as component (A), 13.5 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), “jER806” 24 Mass parts, "PR-55617" 9.2 parts by mass, "2P4MZ" 0.1 parts by mass, "KBE403" 0.1 parts by mass, "BYK361N" 0.1 parts by mass dissolved in methyl ethyl ketone, SC1050-LC "50 parts by mass was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 18>
In preparing the resin composition,
(A) 1 part by weight of “EPICLON HP-4700” as component, 11.5 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), and “jER806” 24 Part by mass, “PR-55617”, 11.2 parts by mass, “2P4MZ”, 0.1 part by mass, “KBE403”, 0.1 part by mass, and “BYK361N”, 0.1 part by mass, are dissolved in methyl ethyl ketone. SC1050-LC "50 parts by mass was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 19>
In preparing the resin composition,
(A) 1 part by weight of “EPICLON HP-4700” as component, 9 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), and 24 parts by weight of “jER806” , 13.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403”, 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and further, “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 20>
In preparing the resin composition,
(A) 3 parts by weight of “EPICLON HP-4700” as component, 12 parts by weight of “phenolphthaline” as (B) component, 2 parts by weight of “YX6954” as component (C), 24 parts by weight of “jER806” , "PR-55617" 8.7 parts by mass, "2P4MZ" 0.1 parts by mass, "KBE403" 0.1 parts by mass, "BYK361N" 0.1 parts by mass dissolved in methyl ethyl ketone, and further "SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Example 21>
In preparing the resin composition,
(A) 6 parts by mass of “EPICLON HP-4700” as component, 12 parts by mass of “phenolphthaline” as (B) component, 2 parts by mass of “YX6954” as component (C), and 24 parts by mass of “jER806” , 5.7 parts by mass of “PR-55617”, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403” and 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and further, “SC1050- LC ”(50 parts by mass) was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Comparative Example 1>
In preparing the resin composition,
(A) “EPICLON HP-4770” 15 parts by mass as component, (B) component not used, (C) component “YX6954” 2 parts by mass, “jER806” 6 parts by mass, “PR-55617” 11.7 parts by mass, “adipic acid” 15 parts by mass, “2P4MZ” 0.1 part by mass, “KBE403” 0.1 part by mass, “BYK361N” 0.1 part by mass are dissolved in methyl ethyl ketone, SC1050-LC "50 parts by mass was mixed to prepare a resin composition varnish having a solid content ratio of 50% by mass.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Comparative Example 2>
In preparing the resin composition,
(A) “EPICLON HP-4770” 15 parts by mass as component, (B) component not used, (C) component “YX6954” 2 parts by mass, “jER806” 6 parts by mass, “PR-55617” 26.7 parts by mass, 0.1 part by mass of “2P4MZ”, 0.1 part by mass of “KBE403”, 0.1 part by mass of “BYK361N” are dissolved in methyl ethyl ketone, and 50 parts by mass of “SC1050-LC” are further dissolved. By mixing, a resin composition varnish with a solid content ratio of 50 mass% was prepared.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

<Comparative Example 3>
In preparing the resin composition,
(A) Component is not used, 17.7 parts by weight of “phenolphthaline” as component (B), 2 parts by weight of “YX6954” as component (C), 30 parts by weight of “jER806”, “2P4MZ” 0 .1 part by weight, 0.1 part by weight of “KBE403” and 0.1 part by weight of “BYK361N” are dissolved in methyl ethyl ketone, and further 50 parts by weight of “SC1050-LC” are mixed, and the solid content ratio is 50% by weight. A resin composition varnish was prepared.
Thereafter, a film-like resin composition and an electronic device were obtained in the same manner as in Example 1.

・ Characteristics evaluation <Connectivity evaluation>
For each of the 10 electronic devices obtained in the above examples and comparative examples, the connection resistance value between the semiconductor chip and the silicon circuit board is measured with a digital multimeter, and the evaluation result based on the connection resistance value is based on the following criteria. Judged.
[◎]: The connection resistance value of all 10 electronic devices was 10Ω or less.
[◯]: Connection resistance values of all 10 electronic devices were higher than 10Ω and 30Ω or lower.
[×]: One or more electronic devices having a connection resistance value higher than 30Ω.

<Insulation reliability evaluation>
Each of the 10 electronic devices obtained in each of the above examples and comparative examples was processed for 200 hours while applying a voltage of 3 V in an environment of 130 ° C. and 85% RH, and the insulation resistance value between adjacent bumps was continuously measured. Was evaluated by
The evaluation results were determined according to the following criteria.
[◎]: The insulation resistance values of all 10 electronic devices were always 1.0 × 10 ⁷ Ω or more after 200 hours of treatment.
[O]: The insulation resistance value of one or more electronic devices was 1.0 × 10 ⁴ Ω or more and less than 1.0 × 10 ⁷ Ω after 200 hours of treatment.
[×]: The insulation resistance value of one or more electronic devices was less than 1.0 × 10 ⁴ Ω after 200 hours of treatment.

  Tables 1 to 3 show the composition of the resin compositions and the evaluation results of the electronic device in the above Examples and Comparative Examples.

From the results of Tables 1 to 3, Examples 1 to 21 are all resin compositions containing the component (A), the component (B), and the component (C), and any electronic device using this is a resin composition. Excellent connectivity and insulation reliability.
In particular, in Examples 2 to 4, 7, 12, 14, 15, and 17 to 21, (A) component is a trifunctional epoxy resin and / or a tetrafunctional epoxy resin, and (B) component is in one molecule. In addition to the compound having two or more phenolic hydroxyl groups and one or more carboxyl groups, the content of the component (A), the content of the component (B) in the resin composition, and (A) Since the mass ratio [(B) / (A)] of the component and the component (B) was within a suitable range, the above characteristics were particularly excellent.
On the other hand, although the comparative example 1 uses adipic acid without using the component (B), adipic acid that does not participate in the reaction with the epoxy resin is present in the resin composition although the flux function can be provided. Therefore, the insulation reliability has been greatly reduced. In Comparative Example 2, the component (B) was not used, but the flux function could not be expressed and the connectivity was greatly reduced. And although the comparative example 3 was a thing which did not use the (A) component, since the heat resistance was insufficient, the insulation reliability fell significantly.

100 Electronic device 110 First substrate 111 Electrode 111a formed on first substrate Gold 111b Nickel 111c Copper pillar 120 Second substrate 121 Electrode 121a formed on first substrate Solder bump 121b Copper pillar 130 Resin composition

Claims (8)

A film-like electrode connecting resin composition that is interposed between opposing electrodes and electrically connects the opposing electrodes,
The resin composition is
(A) a polyfunctional epoxy resin having a naphthalene skeleton;
(B) a compound having a phenolic hydroxyl group and a carboxyl group in one molecule;
(C) a film-forming resin;
A resin composition comprising: In the resin composition according to claim 1,
The resin composition, wherein the component (B) is a compound having two or more phenolic hydroxyl groups and one or more carboxyl groups in one molecule. In the resin composition according to claim 1 or 2,
The resin composition, wherein the component (B) is a compound having two or more phenolic hydroxyl groups in one molecule and one or more carboxyl groups directly bonded to an aromatic ring. In the resin composition according to any one of claims 1 to 3,
The component (A) is a trifunctional epoxy resin and / or a tetrafunctional epoxy resin. In the resin composition according to any one of claims 1 to 4,
The content of the component (A) is 1% by mass or more and 20% by mass or less with respect to the entire resin composition, and the content of the component (B) is 3% by mass or more and 25% by mass or less. The resin composition characterized by the above-mentioned. In the resin composition according to any one of claims 1 to 5,
The resin composition, wherein a content mass ratio [(B) / (A)] of the component (A) and the component (B) is 0.2 or more and 16 or less. In the resin composition according to any one of claims 1 to 5,
Furthermore, (D) phenol resin, The resin composition characterized by the above-mentioned.   An electronic device comprising the cured product of the resin composition according to any one of claims 1 to 7.

Images