JP2014066648A - Substrate inspection method and apparatus - Google Patents

Abstract

To detect efficiently a detected defect using an image acquisition device such as a camera.
A substrate inspection apparatus 100 detects position coordinates of a defect present on a substrate by irradiating the substrate 1 while moving inspection light relative to the substrate 1. When no defect exists in the image 85 of the first visual field range acquired by the observation system unit 80 moved above the position coordinates of the detected defect, a second visual field is separately provided around the first visual field range. By acquiring the range images 861 to 864, 851 to 859 and specifying whether or not there is a defect in the second field of view range image, the time required for the position specifying operation at the time of manual observation is shortened, The capture rate of defects (foreign matter) has been greatly improved.
[Selection] Figure 5

Description

  The present invention relates to a substrate inspection method and apparatus for detecting defects such as glass substrates and plastic substrates used for manufacturing display panels and the like, and in particular, the detected defects are acquired and observed using an image acquisition device such as a camera. The present invention relates to a substrate inspection method and apparatus suitable for the above.

  Manufacture of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electro Luminescence) display panel substrates, etc. for liquid crystal display devices used as display panels is a glass substrate by photolithography technology. Or by forming a pattern on a plastic substrate or the like. At that time, if a defect such as a scratch or a foreign substance exists on the surface or inside of the substrate, the pattern is not formed well, which causes a defect. For this reason, a substrate inspection apparatus is used to inspect defects such as scratches and foreign matters on the substrate surface and inside.

  In recent years, a substrate inspection apparatus configured to acquire an image of a detected defect with an image acquisition device such as a camera and observe the defect in detail has been developed. As such a substrate inspection apparatus, the one described in Patent Document 1 is known.

JP 2008-191020 A

  The substrate inspection apparatus described in Patent Document 1 moves the observation system including an image acquisition device such as a camera accurately above the defect based on the coordinates of the position of the detected defect, and details the defect. It is configured to observe. As the size of the substrate to be inspected increases, the amount of deflection of the substrate itself increases, and a deviation occurs between the position coordinates of the detected defect and the position coordinates of the defect actually present on the board, Even when observing with an observation system including an image acquisition device such as a camera, the position of the defect may be out of the imaging range of the image acquisition device, and an image of the defect may not be acquired.

  The present invention has been made in view of the above points, and an object thereof is to provide a substrate inspection method and apparatus capable of efficiently observing detected defects using an image acquisition device such as a camera. To do.

  According to a first aspect of the substrate inspection method of the present invention, in the substrate inspection method for detecting position coordinates of a defect existing on the substrate by irradiating the inspection light while moving the inspection light relative to the substrate. When the observation means for acquiring an image of a defect is moved above the position coordinates of the defect to acquire an image of the first visual field range of the observation means, and the defect does not exist in the image of the first visual field range Acquiring an image around the first visual field range as an image of the second visual field range using the observation means, and acquiring an image of the defect based on the image of the second visual field range. is there. This is because when there is no defect in the image of the first visual field range acquired by the observation means moved above the position coordinates of the detected defect, a second visual field is separately provided around the first visual field range. By acquiring an image of the range and specifying whether or not there is a defect in the image of the second visual field range, the time required for the position specifying operation during manual observation is shortened, and the defect (foreign matter) capture rate Is to improve significantly.

  A second feature of the substrate inspection method according to the present invention is that, in the substrate inspection method according to the first feature, eight images around the first field-of-view range image are used as the second field-of-view range image. It is to acquire an image. In this case, eight images are acquired as images around the visual field image.

  According to a second feature of the substrate inspection method of the present invention, in the substrate inspection method according to the first feature, the image of the first visual field range is divided into four as the image of the second visual field range. The purpose is to acquire images at four locations around the image so as to include a part. In this case, four images are acquired as images around the visual field image so as to include a part of the first visual field image.

  According to a fourth aspect of the substrate inspection method of the present invention, in the substrate inspection method according to the second or third aspect, the observation means is used when the defect is not present in the image in the second visual field range. Is used to acquire an image around the second visual field range as an image of the third visual field range, and acquire an image of the defect based on the image of the third visual field range. In this case, when there is no defect image in the surrounding image of the first visual field image, the surrounding image is further acquired.

  A fifth feature of the substrate inspection method according to the present invention is that, in the substrate inspection method according to the first, second, third, or fourth feature, when a plurality of the defect images exist, the substrate has already been observed. And the image close to the center coordinate of the first visual field range is used as an image of the defect at the position coordinate of the defect. A specific method for specifying which image is identified as a defect at the position coordinate when there are a plurality of defect images is defined.

  According to a first aspect of the substrate inspection apparatus of the present invention, in the substrate inspection apparatus that detects the position coordinates of a defect present on the substrate by irradiating the inspection light while moving the inspection light relative to the substrate. When the defect does not exist in the observation means for acquiring the image of the defect, the moving means for moving the observation means above the position coordinates of the defect, and the image in the first visual field range acquired by the observation means And moving the observation means so as to acquire an image around the first visual field range as an image of the second visual field range, and acquiring the image of the defect based on the image of the second visual field range. And a control means. This is an invention of a substrate inspection apparatus which realizes the one described in the first feature of the substrate inspection method.

  According to a second feature of the substrate inspection apparatus of the present invention, in the substrate inspection apparatus according to the first feature, the control means uses the image of the first field of view as the image of the second field of view. It is to acquire images at four locations around. This is an invention of a substrate inspection apparatus that realizes the second feature of the substrate inspection method.

  According to a third feature of the substrate inspection apparatus of the present invention, in the substrate inspection apparatus according to the first feature, the control means uses the image of the first field of view as the image of the second field of view. It is to acquire images at 8 locations around the. This is an invention of a substrate inspection apparatus that realizes the third feature of the substrate inspection method.

  According to a fourth aspect of the substrate inspection apparatus of the present invention, in the substrate inspection apparatus according to the second or third aspect, the control unit has the defect that the defect does not exist in the image in the second visual field range. Acquiring an image around the second visual field range as an image of the third visual field range using the observation means, and acquiring an image of the defect based on the image of the third visual field range. is there. This is an invention of a substrate inspection apparatus that realizes the fourth feature of the substrate inspection method.

  According to a fifth aspect of the substrate inspection apparatus of the present invention, in the substrate inspection apparatus according to the first, second, third, or fourth feature, the control unit includes a plurality of the defect images. Is to exclude images that have already been observed, and to use an image of the defect at the position coordinates of the defect that is close to the center coordinate of the first visual field range. This is an invention of a substrate inspection apparatus that realizes the fifth feature of the substrate inspection method.

  According to the present invention, there is an effect that a detected defect can be efficiently observed using an image acquisition device such as a camera.

It is the top view which looked at the board | substrate inspection apparatus which concerns on this invention from the upper side. It is the side view which looked at the board | substrate inspection apparatus of FIG. 1 from the paper surface front side. It is a figure which shows schematic structure of the optical system and control system of the board | substrate inspection apparatus of FIG.1 and FIG.2. It is a perspective view which shows schematic structure of the light projection system and light reception system of an optical system unit. It is a figure which shows the concept of the foreign material observation process which the board | substrate inspection apparatus which concerns on this embodiment performs. It is a flowchart figure which shows an example of operation | movement of a foreign material observation process.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a top view of the substrate inspection apparatus according to the present invention as viewed from above, and FIG. 2 is a side view of the substrate inspection apparatus of FIG. 1 as viewed from the front side of the drawing. The glass substrate inspection apparatus 100 is roughly divided into a base frame 2, an inspection stage 20, an optical unit 3, and lift pins 9.

  The base frame 2 is composed of a welded structure of a plurality of square pipes, and is installed on the floor by having legs at the bottom. The inspection stage 20 is fixed close to the substrate insertion port side of the upper part of the base frame 2. The optical unit 3 has a gate-type gantry structure, and is movably mounted on the linear guides 7a and 7b arranged in parallel along the glass substrate loading direction at the top of the base frame 2. ing. The optical unit 3 reciprocates in the X direction, which is the glass substrate loading direction, by the optical unit X driving unit 5 provided on the side surface of the base frame 2. The optical system units 4a and 4b are for inspecting defects and foreign matters on the surface of the glass substrate, and according to guides 8a and 8b provided along the side surface Y direction of the optical unit 3, an optical unit Y driving unit (not shown). 1), the shift operation is performed in the Y direction, which is perpendicular to the X direction. The observation system unit 80 is attached at a position adjacent to the attachment base of the optical system unit 4a.

  The inspection by the glass substrate inspection apparatus 100 is performed by irradiating the surface or the inside of the glass substrate with inspection light and receiving the scattered light. At this time, the optical system units 4 a and 4 b can inspect the surface and the inside of the glass substrate only in the recessed portion between the mounting bars of the inspection stage 20. Therefore, once the scanning is completed, the glass substrate is shifted in the Y direction and the remaining portion is inspected. The entire surface of the glass substrate can be inspected by the reciprocating operation in the X direction and the Y direction shifting operation of the optical unit 3 and the shifting operation in the Y direction of the glass substrate by the lift pins 9.

  As shown in FIG. 2, linear guides 12a and 12b are installed inside the base frame 2 in parallel in the Y direction, and a first lifter vertical base on which a pin Y drive unit 11 and a pin vertical drive unit 10 are mounted. A table 13 is installed. The inspection stage 20 is provided with a plurality of holes for allowing the lift pins 9 for lifting the glass substrate to pass therethrough. A plurality of lift pins 9 are installed on the upper surface side of the lifter unit base 14 mounted on the pin vertical drive unit 10. The lift pins 9 are raised when the glass substrate is received, and lowered after being received, thereby delivering the glass substrate to the inspection stage 20. Further, the lift pins 9 are lifted to lift the glass substrate and perform a shift operation in the Y direction.

  The lifter unit base 14 rides on a ball bearing 16 on the second lifter upper and lower base 15 and is freely movable in the X direction and the Y direction. The movement in the X direction and the Y direction is performed by driving an X direction alignment motor and a Y direction alignment motor mounted on the lifter upper and lower base 15 (not shown). The lifter vertical base 15 is moved in the vertical direction by driving the pin vertical drive unit 10. By raising the lifter upper / lower base 15, the lifter unit base 14 and the lift pins 9 are also raised, and the glass substrate on the inspection stage 20 is lifted away from the mounting bar constituting the inspection stage 20, and alignment and The glass substrate can be shifted during the inspection operation.

  FIG. 3 is a diagram showing a schematic configuration of an optical system and a control system of the substrate inspection apparatus of FIGS. 1 and 2. FIG. 3 shows the configuration of the optical system unit 4a. Since the optical system unit 4b has the same configuration as the optical system unit 4a, the description thereof is omitted. The optical system unit 4a includes a light projecting system that irradiates the substrate 1 with inspection light, a reflected light detection system that detects reflected light from the substrate 1, and a light receiving system that receives scattered light from the substrate 1. . The control system includes a focus adjustment control circuit 40, a signal processing circuit 50, an optical system movement control circuit 60, a memory 70, an observation system unit 80, an observation system movement mechanism 82, an observation system movement control circuit 83, a notification device 90, an input device 90, An output device 91 and a CPU 95 are included.

  FIG. 4 is a perspective view showing a schematic configuration of a light projecting system and a light receiving system of the optical system unit. The light projecting system includes a laser light source 21, a lens group 22, and a mirror 23. The laser light source 21 generates laser light serving as inspection light. The lens group 22 condenses the inspection light generated from the laser light source 21, spreads the collected inspection light in a direction (Y direction) orthogonal to the substrate movement direction (X direction), and moves the spread inspection light to the substrate. Focus in the direction (X direction). The mirror 23 obliquely irradiates the surface of the substrate 1 with the inspection light collected by the lens group 22. The inspection light applied to the surface of the substrate 1 is focused on the surface of the substrate 1 in the substrate movement direction (X direction) and has a predetermined width in a direction (Y direction) orthogonal to the substrate movement direction (X direction). It becomes a long inspection light. When the substrate 1 moves in the substrate movement direction (X direction), the inspection light with a predetermined width irradiated from the light projecting system scans the substrate 1, and inspection of defects in the scanning region is performed.

  When there are no defects such as scratches or foreign matter on the surface of the substrate 1, part of the inspection light irradiated obliquely onto the surface of the substrate 1 is reflected by the surface of the substrate 1, and the remaining inspection light is inside the substrate 1. And is emitted from the back surface of the substrate 1. If the surface of the substrate 1 has defects such as scratches or foreign matter, the light irradiated to the defects such as scratches or foreign matter on the surface of the substrate 1 is scattered as scattered light in the inspection light irradiated to the surface of the substrate 1. In the same manner as described above, a part of the light irradiated to other portions is reflected on the surface, and the rest is transmitted.

  In FIG. 3, the reflected light detection system includes a mirror 25, a lens 26, and a CCD line sensor 27. Reflected light from the surface of the substrate 1 enters the lens 26 through the mirror 25. The lens 26 focuses the reflected light from the substrate 1 and forms an image on the light receiving surface of the CCD line sensor 27.

  At this time, the light receiving position of the reflected light on the light receiving surface of the CCD line sensor 27 varies depending on the height of the surface of the substrate 1. When the height of the surface of the substrate 1 shown in FIG. 4 is used as a reference and the height of the surface of the substrate 1 is lower than the reference, the position where the inspection light is irradiated and reflected on the surface of the substrate 1 moves to the left side of the drawing. Then, the light receiving position of the reflected light on the light receiving surface of the CCD line sensor 27 moves to the right side of the drawing. On the contrary, when the height of the surface of the substrate 1 is higher than the reference, the position where the inspection light is irradiated and reflected on the surface of the substrate 1 moves to the right side of the drawing, and the light receiving surface of the CCD line sensor 27 receives the reflected light. The position moves to the left side of the drawing.

  The CCD line sensor 27 outputs a detection signal corresponding to the intensity (signal level) of the reflected light received by the light receiving surface to the focus adjustment control circuit 40. In accordance with a command from the CPU 95, the focus adjustment control circuit 40 focuses so that the reflected light from the surface of the substrate 1 is received at the center position of the light receiving surface of the CCD line sensor 27 based on the detection signal of the CCD line sensor 27. The adjustment mechanism 41 is driven to move the optical system unit 4a. The focus adjustment mechanism 41 includes a pulse motor 42, a cam 43, and a cam follower 44. An eccentric cam 43 is attached to the rotation shaft of the pulse motor 42, and a cam follower 44 is attached to the optical system unit 4a. By supplying a drive pulse from the focus adjustment control circuit 40 to the pulse motor 42, the pulse motor 42 is driven to rotate the cam 43, the optical system unit 4a is moved up and down, and the focal position of the optical system unit 4a is changed. Be controlled.

  3 and 4, the light receiving system includes a condenser lens 28, an imaging lens 29, and a CCD line sensor 30. The condensing lens 28 condenses the scattered light from the substrate 1, and the imaging lens 29 images the scattered light collected by the condensing lens 28 on the light receiving surface of the CCD line sensor 30. 3 and 4, the CCD line sensor 30 converts a detection signal corresponding to the intensity (signal level) of the scattered light received by the light receiving surface into a digital signal and outputs the digital signal to the signal processing circuit 50.

  In FIG. 3, the optical system movement control circuit 60 supplies current to the coil 19 in accordance with a command from the CPU 95, and the optical system unit 4a is orthogonal to the substrate movement direction (X direction) (Y direction: drawing depth direction). To change the scanning area of the substrate 1 scanned by the inspection light of a predetermined width from the light projecting system of the optical system unit 4a. The glass substrate inspection apparatus 100 performs inspection of the entire surface of the substrate 1 by repeating scanning of the substrate 1 with inspection light and changing the scanning region. The CPU 95 sequentially stores the coordinates of the position on the surface of the substrate 1 and the light intensity (signal level) of the detected defect in the memory 70.

  When observing defects on the surface of the substrate 1 detected after the inspection, the CPU 95 sends an observation system unit to the observation system movement control circuit 83 based on the position coordinates of the defects stored in the memory 70 and the light intensity (signal level). 80 movement is instructed. The observation system movement control circuit 83 controls the observation system movement mechanism 82 based on the X coordinate and Y coordinate of the position supported by the CPU 95. The observation system moving mechanism 82 includes, for example, a linear motion motor, and moves the observation system unit 80 in the X direction and the Y direction (the depth direction in the drawing) to move the observation system unit 80 above the defect. The observation system unit 80 includes an image acquisition device 81 such as a camera, and acquires an image of a defect vertically from above the substrate 1 supported by the inspection stage 20.

  FIG. 5 is a diagram showing a concept of foreign matter observation processing executed by the substrate inspection apparatus according to this embodiment. FIG. 5A shows an example of an acquired image after the image acquisition device 81 of the observation system unit 80 has moved above the coordinate position 86 where the defect exists. The visual field range 85 of the image acquisition device 81 has a rectangular shape centered on the coordinate position 86. That is, the center coordinate 86 of the visual field range 85 coincides with the coordinate position 86. When an image showing a defect (foreign matter) exists in the visual field range 85, the image acquisition device 81 acquires an image of the visual field range 85 as a defect (foreign matter) image.

  On the other hand, as shown in FIG. 5A, there is a case where no defect (foreign matter) is present in the visual field range 85 and defects (foreign matter) F0 to F2 are present in the vicinity thereof. In such a case, as illustrated in FIG. 5B, peripheral images 851 to 859 are acquired for eight places around the visual field range 85. Then, defects (foreign matter) F0 to F2 that did not exist in the visual field range 85 are present in these peripheral images 851 to 859. In the case of FIG. 5B, the defect (foreign matter) F0 exists in the peripheral image 857, the defect (foreign matter) F1 exists in the peripheral image 851, and the defect (foreign matter) F2 exists in the peripheral image 855. In this embodiment, in this case, the one closest to the center coordinate 86 of the visual field range 85, that is, the defect (foreign matter) F0 is determined as the defect at the coordinate position, and the peripheral image 857 is recognized as the defect (foreign matter) image. To do.

  In addition, as shown in FIG. 5C, peripheral images may be acquired at four locations around the visual field range 85. In FIG. 5C, the visual field range is set so as to include a part of the visual field range 85 divided into four parts. In the case of FIG. 5C, only the defects (foreign matter) F0 and F1 exist in the surrounding images 861 to 864 around the visual field range 85, and the defect (foreign matter) F3 is excluded in the initial stage. become. In addition, when the closest thing to the center coordinate 86 of the visual field range 85 has already been observed, let the 2nd nearest thing be a defect.

  FIG. 6 is a flowchart illustrating an example of the operation of the foreign object observation process. In step S61, the CPU 95 moves the observation system unit 80 in the X direction and the Y direction (the depth direction in the drawing), and moves the observation system unit 80 above the defect. It is determined whether or not a foreign object exists within the visual field range. If a foreign object exists (yes), the process proceeds to step S62, and if no foreign object exists (no), the process proceeds to step S63. In step S62, since there is a foreign substance in the field of view, the CPU 95 can observe the foreign substance in this state, and when the foreign object is observed, A flag is set, the observation system unit 80 is moved to the next observation coordinate, and the process returns to execute the same processing. Note that the search mode such as the order of observation system movement may be appropriately changed according to the light intensity (signal level).

  In step S63, since there is no foreign object in the visual field range, the CPU 95 performs acquisition processing of four peripheral images 861 to 864 as shown in FIG. In step S64, the CPU 95 executes a foreign object search process for each of the peripheral images acquired in the previous step. When a plurality of defects (foreign matter) are present in the peripheral image, the defect (foreign matter) closest to the center coordinate of the visual field range is recognized as a defect (foreign matter) at that coordinate. In step S65, it is determined whether or not a foreign object exists in the peripheral image as a result of the search process in the previous step. If a foreign object exists (yes), the process proceeds to step S62, and if no foreign object exists (no), the process proceeds to step S66. In step S66, the CPU 95 increments the variable n whose initial state is set to “0” by “1”. In step S67, the CPU 95 determines whether or not the variable n has reached “2”. If yes, the process proceeds to step S68. If no, the process returns to step S63.

  The fact that it is determined to be “no” in step S67 means that no foreign object is present in the four surrounding images as shown in FIG. 5C, and therefore in step S63, processing according to the value of the variable n. Execute. That is, when the variable n is “0” in the initial state, four peripheral images 861 to 864 as shown in FIG. 5C are acquired. When the variable n is “1”, the CPU 95 In order to acquire peripheral images widely, acquisition processing of eight peripheral images 851 to 859 as shown in FIG. In step S64, the foreign object search process is performed again on these eight peripheral images 851 to 859. If there are a plurality of defects (foreign matter) in the peripheral images 851 to 859, the defect (foreign matter) closest to the center coordinate of the visual field range is recognized as a defect (foreign matter) at that coordinate. If it is determined in step S65 that no foreign matter is present (no), the variable n becomes “2” by executing step S66, so the determination in step S67 is yes, and the process of step S68 is executed. . In step S68, the CPU 95 sets a no foreign matter flag indicating that no foreign matter exists at the corresponding coordinates, moves the observation system unit 80 to the next observation coordinate, and returns to execute the same processing.

  In step S62, the CPU 95 may capture the image at that time and store it in the memory 70 while observing the foreign matter. Further, the shape and area of the defect (foreign material) may be extracted based on the captured image, and the subsequent foreign material matching processing may be performed based on the extracted shape and area. Furthermore, the range in which the peripheral image is acquired, that is, the value of the variable n may be varied according to the magnification of the observation system unit 80.

  In the above-described embodiment, the optical system unit 4a is controlled separately by the optical system movement control circuit 60, and the observation system unit 80 is controlled separately by the observation system movement control circuit 83. A system unit 80 may be mounted and the movement of the observation system unit 80 may be controlled by the optical system movement control circuit 60.

1 ... substrate,
10: Pin vertical drive unit,
100: Glass substrate inspection device,
11: Pin Y drive unit,
12a, 12b ... linear guide,
13 ... Lifter top / bottom base,
14 ... Lifter unit base,
15 ... Lifter top / bottom base,
16 ... Ball bearing,
19 ... coil,
2 ... Base frame,
20 ... Inspection stage,
21 ... Laser light source,
22 ... Lens group,
23, 25 ... mirror,
26 ... Lens,
27 ... CCD line sensor,
28 ... Condensing lens,
29 ... imaging lens,
3 Optical part,
30 ... CCD line sensor,
40. Focus adjustment control circuit,
41. Focus adjustment mechanism,
42 ... pulse motor,
43 ... cam,
44 ... Cam follower,
4a, 4b ... optical system unit,
5 ... Optical part X drive part,
50. Signal processing circuit,
60: Optical system movement control circuit,
70 ... Memory,
7a, 7b ... linear guide,
80: Observation system unit,
81. Image acquisition device,
82 ... Observation system moving mechanism,
83. Observation system movement control circuit,
85 ... View range,
851-859 ... neighboring images,
86 ... coordinate position (center coordinate),
861 to 864 ... neighboring images,
8a, 8b ... guide,
9 ... Lift pin,
90 ... Reporting device,
91 ... I / O device,
95 ... CPU

Claims (10)

  In the substrate inspection method for detecting the position coordinates of the defects existing on the substrate by irradiating the substrate while moving the inspection light relatively to the substrate, the observation means for acquiring the defect image is used as the position coordinates of the defects. To obtain an image of the first visual field range of the observation means, and when the defect does not exist in the image of the first visual field range, the first visual field range is obtained using the observation means. An image of the defect is acquired as an image in the second visual field range, and an image of the defect is acquired based on the image in the second visual field range.   2. The substrate inspection method according to claim 1, wherein eight images around the first field-of-view range image are acquired as the second field-of-view range image.   2. The substrate inspection method according to claim 1, wherein as the second field-of-view range image, four surrounding images are acquired so as to include a part of the first field-of-view range image divided into four parts. A substrate inspection method.   4. The substrate inspection method according to claim 2, wherein when the defect is not present in the image in the second visual field range, an image around the second visual field range is converted into a third image using the observation unit. A substrate inspection method which is obtained as an image of a visual field range and obtains an image of the defect based on the image of the third visual field range.   5. The substrate inspection method according to claim 1, wherein when there are a plurality of the defect images, those already observed are excluded, and those close to the center coordinates of the first visual field range are excluded. A substrate inspection method, wherein an image of a defect at a position coordinate of the defect is used. In the substrate inspection apparatus for detecting the position coordinates of the defects present on the substrate by irradiating the substrate while moving the inspection light relatively to the substrate,
An observation means for acquiring an image of the defect;
Moving means for moving the observation means above the position coordinates of the defect;
When the defect is not present in the image of the first visual field range acquired by the observation device, the observation device is configured to acquire an image around the first visual field range as an image of the second visual field range. And a control unit that moves and acquires the image of the defect based on the image of the second visual field range.   7. The substrate inspection apparatus according to claim 6, wherein the control unit acquires eight images around the first field-of-view image as the second field-of-view image. apparatus.   7. The substrate inspection apparatus according to claim 6, wherein four peripheral images are acquired so as to include a part of the first visual field range image divided into four as the second visual field range image. A board inspection apparatus that is characterized.   9. The substrate inspection apparatus according to claim 7, wherein when the defect is not present in the image of the second visual field range, the control unit uses the observation unit to detect the periphery of the second visual field range. A substrate inspection apparatus, wherein an image is acquired as an image of a third visual field range, and an image of the defect is acquired based on the image of the third visual field range.   10. The substrate inspection apparatus according to claim 6, 7, 8 or 9, wherein the control means excludes already observed images when there are a plurality of the defect images, and controls the center of the first visual field range. A substrate inspection apparatus characterized in that an image close to the coordinates is an image of a defect at the position coordinates of the defect.

Images