JP2014063368A - Frequency adjustment method and rf-id medium manufactured using the same - Google Patents

Abstract

Resonance frequency for transmitting and receiving data is adjusted without providing a separate line process from a general RF-ID media manufacturing process and without increasing the manufacturing process.
A method of acquiring a frequency of a single antenna formed on a base substrate, and an inlet of an IC chip when an IC chip is connected to an antenna having the acquired frequency and mounted at a reference position of the base substrate. A step of calculating a resonance frequency, a step of calculating a capacitance amount necessary for filling a difference of the calculated resonance frequency with respect to a resonance frequency for the inlet to transmit / receive data, a reference position, and a calculated capacitance Determining the mounting position of the IC chip on the base substrate based on the amount and the area where the IC chip and the antenna overlap.
[Selection] Figure 4

Description

  The present invention relates to an RF-ID medium that transmits and receives data at a predetermined resonance frequency, and more particularly to a method for adjusting a resonance frequency.

  In recent years, with the progress of the information society, information is recorded on a card, and information management and settlement using the card are performed. Information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag. In information management using such a card, label, or tag, a non-contact type IC card, non-contact type IC label, or non-contact type that transmits / receives data in a non-contact state to the card, label, or tag Type IC tags are rapidly spreading due to their excellent convenience.

  RF-ID media such as a non-contact type IC card, a non-contact type IC label, or a non-contact type IC tag is formed such that a conductive antenna is formed on a base substrate and is connected to the antenna. An inlet on which an IC chip is mounted is configured to be sandwiched between a surface sheet and a card substrate, and transmits and receives data at a predetermined resonance frequency. Therefore, the shape of the antenna is designed so that the RF-ID media can transmit and receive data at a predetermined resonance frequency.

  However, in the etching or printing process for forming the antenna on the base substrate, the shape of the antenna does not become such a shape that the RF-ID media can transmit and receive data at a predetermined resonance frequency. There is. In particular, in the RF-ID media that transmits and receives data by the electromagnetic induction method, it is necessary to cross the coiled antenna at a part thereof, but variation occurs when forming the jumper part of the crossed part, In many cases, data cannot be transmitted / received at a predetermined resonance frequency.

  Therefore, an adjustment pattern connected to the antenna is provided, and trimming the adjustment pattern to adjust the inductance and capacitance of the antenna, so that the RF-ID medium can transmit and receive data at a predetermined resonance frequency. (See, for example, Patent Documents 1 and 2).

JP 2011-238016 A JP 2004-153716 A

  However, as described above, in the technology for adjusting the inductance and capacitance of the antenna by trimming the adjustment pattern by providing the adjustment pattern connected to the antenna, the antenna and the adjustment pattern are formed on the base substrate. Then, after the IC chip is mounted so as to be connected to the antenna, the adjustment pattern is trimmed in accordance with the resonance frequency at which the RF-ID medium transmits and receives data. There is a problem that the number of processes on a line different from the process is newly increased, the manufacturing process becomes complicated, and the manufacturing cost increases.

  Further, when trimming with a non-contact laser, it is necessary to provide a processing hole in a manufacturing table on which an RF-ID medium is mounted, which causes a problem that manufacturing cost increases.

  The present invention has been made in view of the problems of the conventional techniques as described above, and without providing a separate line process from a general RF-ID media manufacturing process, and the manufacturing process. An object of the present invention is to provide a frequency adjustment method capable of adjusting a resonance frequency for transmitting and receiving data without increasing the frequency, and an RF-ID medium manufactured using the frequency adjustment method.

In order to achieve the above object, the present invention provides:
A frequency adjustment method for adjusting the resonance frequency in an RF-ID medium in which an antenna is formed on a base substrate and an IC chip is mounted connected to the antenna and transmits and receives data at the resonance frequency
Obtaining a frequency of a single antenna formed on the base substrate;
Calculating the resonance frequency of the RF-ID medium when the IC chip is connected to the antenna having the acquired frequency and mounted at a reference position on the base substrate;
Calculating the amount of capacitance required to fill the difference of the calculated resonance frequency with respect to the resonance frequency for the RF-ID media to transmit and receive data;
Determining a mounting position of the IC chip on the base substrate based on the reference position, the calculated capacitance amount, and an area where the IC chip and the antenna overlap.

  In the present invention configured as described above, after the antenna is formed on the base substrate, first, the frequency of the single antenna formed on the base substrate is acquired, and the IC chip is set to the acquired frequency. The resonance frequency of the RF-ID media is calculated when the antenna is connected to the antenna and mounted at the reference position on the base substrate. Next, the amount of capacitance required to fill the difference of the calculated resonance frequency with respect to the resonance frequency for the RF-ID media to transmit and receive data is calculated, and then the IC chip is mounted on the base substrate. The mounting position of the IC chip on the base substrate is determined based on the reference position, the calculated capacitance, and the area where the IC chip and the antenna overlap. Then, the IC chip is mounted at the calculated mounting position.

  As described above, after the antenna is formed on the base substrate, the mounting position of the IC chip connected to the antenna and mounted on the base substrate is used for the resonance frequency of the RF-ID medium to transmit and receive data. Since the IC chip is mounted at that position, the IC chip is mounted in-line in the process from the formation of the antenna to the mounting of the IC chip on the base substrate. The position is determined and the resonant frequency of the RF-ID media is adjusted.

  In the present invention, after the antenna is formed on the base substrate, the mounting position of the IC chip connected to the antenna and mounted on the base substrate is set so that the resonance frequency of the RF-ID medium transmits and receives data. Since the IC chip is mounted at that position, in the process from the formation of the antenna to the mounting of the IC chip on the base substrate, the IC chip is mounted in-line. The mounting position is determined, and the resonance frequency of the RF-ID media is adjusted, so that a process separate from the general RF-ID media manufacturing process is not provided and the manufacturing process is not increased. The resonance frequency for transmitting and receiving data can be adjusted.

It is a figure which shows one Embodiment of RF-ID media by which the resonant frequency is adjusted with the frequency adjustment method of this invention, (a) is a figure which shows the structure of the surface, (b) is A shown to (a) It is -A 'sectional drawing. It is a flowchart for demonstrating the manufacturing method of the inlet shown in FIG. It is a figure which shows one Embodiment of the frequency adjustment apparatus which adjusts the resonant frequency of the inlet shown in FIG. It is a flowchart for demonstrating the frequency adjustment method which adjusts the resonant frequency of an inlet using the frequency adjustment apparatus shown in FIG. It is a figure which shows the value of the resonant frequency of an inlet by the area where an IC chip and an antenna overlap. It is a figure which shows the difference in the area where an IC chip and an antenna overlap by the mounting position of the IC chip on the base base material in the inlet shown in FIG. It is a figure which shows other embodiment of RF-ID media which can adjust a resonant frequency, (a) is an enlarged view of the area | region where an IC chip is mounted, (b) is IC in the area | region shown to (a). It is a figure which shows the state in which the chip | tip was mounted.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a diagram showing an embodiment of an RF-ID medium in which the resonance frequency is adjusted by the frequency adjusting method of the present invention, where (a) is a diagram showing the configuration of the surface, and (b) is (a). It is AA 'sectional drawing shown in FIG.

  As shown in FIG. 1, the RF-ID media of this embodiment is an inlet 1 in which a conductive antenna 4 is formed on a base substrate 2 made of an insulating material such as a resin and an IC chip 3 is mounted. is there.

  The antenna 4 is formed in a coil shape on the base substrate 2 by etching, printing, or the like, and part of the antenna 4 is guided from the outside to the inside of the coil via an insulating layer in order to place both ends in the coil. The jumper portion 5 is provided.

  The IC chip 3 has a size of, for example, 1 mm □ or more, and is connected to the antenna 4 when bumps (not shown) provided on the back surface are in contact with both ends of the coiled antenna 4, so that it is on the base substrate 2. And mounted on the base substrate 2 by being bonded to the base substrate 2 by means such as thermocompression bonding or ultrasonic bonding.

  In the inlet 1 configured as described above, the antenna 4 is brought into close proximity to an information writing / reading device (not shown) provided outside, by electromagnetic induction by electromagnetic waves output from the information writing / reading device. Current is supplied to the IC chip 3, whereby data is transmitted and received between the information writing / reading device and the IC chip 3 in a non-contact state. Such an inlet is sandwiched between card substrates and used as a non-contact IC card, or is attached to a label substrate and used as a non-contact IC label. Therefore, when the resonance frequency of the inlet 1 is configured as a non-contact IC card or a non-contact IC label, the frequency of the electromagnetic wave output from the information writing / reading device, for example, 13.56 MHz is set. ing.

  It should be noted that the mounting position of the IC chip 3 may be outside rather than inside the coil shape as described above. In that case, both ends of the antenna 4 are arranged outside the coil. Further, when the antenna 4 is formed on both surfaces of the base substrate 2, the IC chip 3 may be mounted on any surface of the base substrate 2.

  Below, the manufacturing method of the inlet 1 mentioned above is demonstrated.

  FIG. 2 is a flowchart for explaining a method of manufacturing the inlet 1 shown in FIG.

  When the inlet 1 shown in FIG. 1 is manufactured, first, the antenna 4 is formed on the base substrate 2 by etching, printing, or the like, and further, the jumper portion 5 is formed by printing (step 1).

  Next, the frequency of the antenna 4 alone formed on the base substrate 2 is measured (step 2). Note that the step 1 and the step 2 do not need to be performed continuously. For example, in step 1, an antenna sheet formed by imposing a plurality of antennas 4 and jumper portions 5 on the base substrate 2 is wound up in a roll shape, and then the antenna sheet is pulled out to measure the frequency of the antenna 4 alone. May be.

  Next, an adhesive is applied to the region of the base substrate 2 where the IC chip 3 is mounted (step 3). As this adhesive, a conductive adhesive in which conductive particles are contained in a resin binder is generally used, but an adhesive not containing conductive particles may be used.

  Next, the IC chip 3 is mounted on the area of the base substrate 2 to which the adhesive has been applied (step 4), and the IC chip 3 is bonded to the base substrate 2 with the adhesive by applying pressure while applying heat. (Step 5). Thus, the IC chip 3 is mounted on the base substrate 2 in a state where the bumps provided on the back surface of the IC chip 3 and the antenna 4 are reliably electrically connected.

  Thereafter, the frequency of the inlet 1 is measured to complete the inlet 1 (step 6).

  It can be considered that the completed inlet 1 is wound into a roll shape as an inlet sheet and stored.

  Below, the method to adjust the resonant frequency in the inlet 1 mentioned above is demonstrated.

  FIG. 3 is a diagram illustrating an embodiment of a frequency adjustment device that adjusts the resonance frequency of the inlet 1 illustrated in FIG. 1.

  As shown in FIG. 3, the frequency adjustment device of this embodiment includes an antenna frequency acquisition unit 10, an inlet frequency calculation unit 20, a capacitance amount calculation unit 30, and a mounting position determination unit 40.

  The antenna frequency acquisition unit 10 acquires the frequency of the antenna 4 alone formed on the base substrate 2.

  The inlet frequency calculation unit 20 refers to the frequency data table 51, and the IC chip 3 is connected to the antenna having the frequency acquired by the antenna frequency acquisition unit 10 so as to be at a predetermined reference position of the base substrate 2. When mounted, the resonance frequency of the inlet 1 is calculated.

  The capacitance amount calculation unit 30 calculates the capacitance amount necessary to fill the difference between the resonance frequencies calculated by the inlet frequency calculation unit 20 and the resonance frequencies for the inlet 1 to transmit and receive data.

  The mounting position determination unit 40 refers to the mounting position data table 52, the reference position where the IC chip 3 is mounted on the base substrate 2, the capacitance amount calculated by the capacitance amount calculation unit 30, the IC chip 3, Based on the area where the antenna 4 overlaps, the mounting position of the IC chip 3 on the base substrate 2 is determined and determined.

  FIG. 4 is a flowchart for explaining a frequency adjustment method for adjusting the resonance frequency of the inlet 1 using the frequency adjustment apparatus shown in FIG.

  First, the antenna frequency acquisition unit 10 acquires the frequency of the single antenna 4 measured in step 2 described above (step 11).

  Next, the inlet frequency calculation unit 20 refers to the frequency data table 51, and the IC chip 3 is connected to the antenna having the frequency acquired by the antenna frequency acquisition unit 10 and determined in advance on the base substrate 2. The resonance frequency of the inlet 1 when mounted at the reference position is calculated (step 12). In the frequency data table 51, the frequency of the antenna alone is associated with the resonance frequency of the inlet 1 when the IC chip 3 connected to the antenna is mounted at a predetermined reference position on the base substrate 2. It has been. Therefore, when the frequency of the antenna 4 alone is acquired by the antenna frequency acquisition unit 10, the resonance of the inlet 1 in a state where the IC chip 3 is mounted at the reference position on the base substrate 2 and connected to the antenna 4. The frequency can be calculated. The reference position where the IC chip 3 is mounted on the base substrate 2 is determined in advance, and the mounting position of the IC chip 3 is determined based on this reference position.

Next, the capacitance amount calculation unit 30 calculates the capacitance amount necessary to fill the difference of the resonance frequency calculated by the inlet frequency calculation unit 20 with respect to the resonance frequency for the inlet 1 to transmit and receive data ( Step 13). The resonance frequency f of the inlet 1 is such that the inductance component of the inlet 1 is L and the capacitance component is C.
f = 1 / [2π (LC) ^1/2 ]
Therefore, using this equation, the capacitance amount C required to fill the difference f of the resonance frequency calculated by the inlet frequency calculation unit 20 with respect to the resonance frequency for the inlet 1 to transmit and receive data. Can be calculated.

  Next, the mounting position determination unit 40 refers to the mounting position data table 52, the reference position where the IC chip 3 is mounted on the base substrate 2, the capacitance amount calculated by the capacitance amount calculation unit 30, and Based on the area where the IC chip 3 and the antenna 4 overlap, the mounting position of the IC chip 3 on the base substrate 2 is determined and determined (step 14).

  FIG. 5 is a diagram showing the value of the resonance frequency of the inlet 1 depending on the area where the IC chip 3 and the antenna 4 overlap.

  As shown in FIG. 5, the resonance frequency of the inlet 1 varies depending on the area where the IC chip 3 and the antenna 4 overlap. Therefore, in the mounting position data table 52, the amount of capacitance necessary for filling the difference of the resonance frequency calculated by the inlet frequency calculation unit 20 with respect to the resonance frequency for the inlet 1 to transmit and receive data, and the IC chip 3 is associated with a displacement amount from the reference position of the mounting position of the IC chip 3 so that the area where the antenna 4 and the antenna 4 overlap becomes an area necessary for obtaining the capacitance amount. For example, in the mounting position data table 52, the resonance frequency calculated by the inlet frequency calculation unit 20 is used to fill the difference with the above-described equation with respect to the resonance frequency for the inlet 1 to transmit and receive data. When it is necessary to reduce the capacitance amount, the amount of capacitance including the increase / decrease condition is the amount of displacement from the reference position where the area where the IC chip 3 and the antenna 4 overlap is reduced by an amount corresponding to the capacitance amount to be reduced. Is associated with. Further, the resonance frequency calculated by the inlet frequency calculation unit 20 needs to increase the capacitance amount in order to fill the difference with respect to the resonance frequency for the inlet 1 to transmit and receive data by the above-described equation. In this case, the amount of displacement from the reference position where the area where the IC chip 3 and the antenna 4 overlap decreases by the amount corresponding to the amount of capacitance to be increased is associated with the amount of capacitance including the increase / decrease condition.

  In view of this, the mounting position determination unit 40 refers to the mounting position data table 52 so that the resonance frequency of the inlet 1 becomes the resonance frequency for transmitting and receiving data on the base substrate 2 of the IC chip 3. The amount of displacement of the mounting position from the reference position is determined, and the mounting position of the IC chip 3 on the base substrate 2 is determined based on the amount of displacement and the reference position.

  FIG. 6 is a diagram showing the difference in the area where the IC chip 3 and the antenna 4 overlap depending on the mounting position of the IC chip 3 on the base substrate 2 in the inlet 1 shown in FIG.

  When the position where the IC chip 3 is mounted as shown in FIG. 6A is a reference position, the IC chip 3 is shifted in the Y direction as shown in FIGS. 3 and the area where the antenna 4 overlaps can be changed, whereby the resonance frequency of the inlet 1 can be changed. This shift amount is due to the change in the area where the IC chip 3 and the antenna 4 overlap with each other in order to fill the difference in the resonance frequency calculated by the inlet frequency calculation unit 20 with respect to the resonance frequency for the inlet 1 to transmit and receive data. The required capacitance can be obtained. In general RF-ID media, since the mounting accuracy of the IC chip 3 to the base substrate 2 is about ± 100 to 300 μm, the shift amount of the IC chip 3 is preferably 300 μm or more. When the position where the IC chip 3 is mounted is used as the reference position as shown in FIG. 6A, the area where the IC chip 3 and the antenna 4 overlap is reduced by shifting the IC chip 3 in the Y direction. However, if the position where the IC chip 3 is mounted is set as the reference position as shown in FIG. 6B, the IC chip 3 is shifted in the direction as shown in FIG. 6C. Thus, the area where the IC chip 3 and the antenna 4 overlap can be reduced to reduce the amount of capacitance, and the IC chip 3 and the antenna 4 can be shifted by shifting the IC chip 3 in the direction as shown in FIG. The amount of capacitance can be increased by increasing the area where and overlap.

  Further, when the position where the IC chip 3 is mounted is used as the reference position as shown in FIG. 6D, the shape of the antenna 104 connected to the IC chip 3 is changed as shown in FIG. By shifting the IC chip 3 in the X direction, the area where the IC chip 3 and the antenna 104 overlap can be changed.

  Further, when the position where the IC chip 3 is mounted is set as the reference position as shown in FIG. 6A, the IC chip 3 is rotated and shifted in the θ direction as shown in FIG. The area where the chip 3 and the antenna 4 overlap can also be changed.

  If the change in the area where the IC chip 3 and the antenna 4 overlap is the same as described above, the direction in which the IC chip 3 is shifted is the same in at least two directions of the X direction, the Y direction, and the θ direction. The mounting position of the chip 3 may be shifted in any of the X direction, the Y direction, and the θ direction, but a priority order may be given in consideration of a later process.

  When the mounting position of the IC chip 3 is determined as described above, in step 4, the IC chip 3 is mounted and bonded to the mounting position on the base substrate 2 to which the adhesive is applied. Chip 3 is mounted.

  As described above, after the antenna 4 is formed on the base substrate 2, the mounting position of the IC chip 3 connected to the antenna 4 and mounted on the base substrate 2 is the transmission frequency of the resonance frequency of the inlet 1. In the process from the formation of the antenna 4 to the mounting of the IC chip 3 on the base substrate 2, the IC chip 3 is mounted at that position. The mounting position of the IC chip 3 is determined in-line, the resonance frequency of the inlet 1 is adjusted, and the manufacturing process is performed without providing a separate line process from the general manufacturing process of the inlet 1. The resonance frequency for transmitting and receiving data can be adjusted without increasing.

(Other embodiments)
7A and 7B are diagrams showing another embodiment of the RF-ID medium in which the resonance frequency can be adjusted. FIG. 7A is an enlarged view of a region where an IC chip is mounted, and FIG. It is a figure which shows the state by which the IC chip was mounted in the left area.

  As shown in FIG. 7, it can be considered that there are a plurality of IC chip mounting positions and the antenna 204 has a different shape in each region. In that case, as shown in FIG. 7 (b), the areas where the IC chips 3a to 3c mounted in the respective regions overlap with the antenna 204 are different from each other, thereby changing the mounting position of the IC chip, The resonant frequency of the RF-ID media can be adjusted to transmit and receive data. Also, when a plurality of IC chips are mounted, the mounting position can be determined for each of the plurality of IC chips.

  In the embodiment described above, the coil-shaped antenna 4 has been described as an example of the inlet 1 in which data is transmitted and received by electromagnetic induction by electromagnetic waves output from the information writing / reading device. The RF-ID medium whose resonance frequency is adjusted in the present invention may be a medium having a dipole antenna and resonating with a radio wave having a frequency in the UHF band to transmit / receive data.

DESCRIPTION OF SYMBOLS 1 Inlet 2 Base base material 3,3a, 3b, 3c IC chip 4,104,204 Antenna 5 Jumper part 10 Antenna frequency acquisition part 20 Inlet frequency calculation part 30 Capacitance amount calculation part 40 Mounting position determination part 51 Frequency data table 52 Mounting Position data table

Claims (2)

A frequency adjustment method for adjusting the resonance frequency in an RF-ID medium in which an antenna is formed on a base substrate and an IC chip is mounted connected to the antenna and transmits and receives data at the resonance frequency
Obtaining a frequency of a single antenna formed on the base substrate;
Calculating the resonance frequency of the RF-ID medium when the IC chip is connected to the antenna having the acquired frequency and mounted at a reference position on the base substrate;
Calculating the amount of capacitance required to fill the difference of the calculated resonance frequency with respect to the resonance frequency for the RF-ID media to transmit and receive data;
Determining a mounting position of the IC chip on the base substrate based on the reference position, the calculated capacitance amount, and an area where the IC chip and the antenna overlap with each other. Method.   An RF-ID medium manufactured by mounting the IC chip at a mounting position determined by the frequency adjustment method according to claim 1.

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