JP2013138146A - Laminated coil and electronic component using the same - Google Patents

Abstract

The present invention provides a laminated coil capable of increasing an allowable value of displacement of a connecting conductor.
An inner peripheral end portion 54A of a first coil layer 54 is wound in a circumferential direction with respect to an inner peripheral end portion 56A of a second coil layer 56. The inner peripheral side end 58 </ b> A of the layer 58 is connected to the via hole conductor 50. The inner peripheral side end portion 60A of the fourth coil layer 60 is located at a position advanced around the inner peripheral side end portion 58A of the third layer coil layer 58 in the circumferential direction. The peripheral end 56A is connected to the via-hole conductor 52. The winding directions of the coil layers 54 and 56 and the coil layers 58 and 60 are opposite. The via-hole conductor 50 is formed at the center position of the portion of the coil layer 56 where the number of turns is small, and the via-hole conductor 52 is formed at the center position of the portion of the coil layer 58 where the number of turns is small. Is done.
[Selection] Figure 2

Description

  The present invention relates to a laminated coil in which a coil pattern is laminated and an electronic component using the laminated coil, and relates to an improvement of a laminated coil suitable for a common mode choke coil or the like.

  In recent years, portable personal computers, particularly tablet-type personal computers, are rapidly spreading. At the same time, high-speed data writing and reading are being performed by adopting an HDD compatible SSD storage device. Thus, the data transfer speed has been further increased, and a super speed mode has been added as an operation mode. Along with this progress, the frequency of the signal transmitted to the signal line is increased, and it is required to take countermeasures against noise while maintaining a sufficient signal quality even in the conventional common mode choke coil. For example, a high impedance specification such as 80 to 100Ω at 100 MHz has been demanded while having a size of about 0.6 mm × 0.5 mm.

  Common mode choke coils generally have a configuration in which one coil is divided into two layers and connected. For example, there is one described in Patent Document 1 below. In Patent Document 1, the following structure is adopted in order to provide a small-sized laminated common mode noise filter having a high noise suppression effect and high production efficiency. That is, a conductor through for stacking the inner conductor of one coil in a staggered manner so as to sandwich the inner conductor of the other coil, and connecting the inner conductor to the other inner conductor paired with the inner conductor of the coil. In addition to the hole, a conductor through hole which is not related to the connection with the coil internal conductor is passed through.

  FIG. 6 shows four coil layers constituting a laminated common mode choke coil having a connection structure similar to that of the background art. FIG. 6A shows a first coil layer 110 formed on the first insulating layer 100. In the coil layer 110, a connecting land 110C is formed at an end portion 110A on the inner peripheral side, and a lead-out portion 110D is formed at an end portion 110B on the outer peripheral side. FIG. 6B shows a second layer coil 112 formed on the second insulating layer 102. The coil layer 112 circulates in the same direction as the coil layer 110 of the first layer, and a land 112C is formed at the inner end 112A, and a lead portion 112D is formed at the outer end 112B. ing. Further, another land 112E is formed inside the circuit portion along with the land 112C.

  FIG. 6C shows a third coil layer 114 formed on the third insulating layer 104. The coil layer 114 has a rotating direction opposite to that of the coil layers 110 and 112. A land 114C is connected to the inner end 114A, and a lead 114D is formed at the outer end 114B. Further, another land 114E is formed inside the circuit portion along with the land 114C. FIG. 6D shows a fourth coil layer 116 formed on the fourth insulating layer 106. The coil layer 116 circulates in the same direction as the coil layer 114. A land 116C is formed at the inner end 116A, and a lead-out portion 116D is formed at the outer end 116B.

  When the fourth insulating layer 106 is laminated from the first insulating layer 100, the inner peripheral end 110C of the first coil layer 110 and the inner peripheral end of the third coil layer 114 are stacked. The land 114C is connected to the second-layer land 112E by a via-hole conductor 122 (see FIG. 7). The land 112C at the inner peripheral end of the second coil layer 112 and the land 116C at the inner peripheral end of the fourth layer are connected to the land 114E of the third layer and the via-hole conductor 120 (see FIG. 7).

Japanese Patent Laid-Open No. 2004-72006

  However, in the background art as described above, what can be satisfied with respect to the demand for increasing the number of windings and realizing miniaturization has not been realized. For example, if the conventional technology is used to meet the demand for downsizing, the via hole position tolerance (positional deviation tolerance) is small, and the yield is as low as about 80%, which hinders mass production. In the background art of FIG. 6, the via-hole conductor 122 that connects the first coil layer 110 and the third coil layer 114 is provided around the second coil layer 112 as shown in FIG. It is formed so that the middle position of the width WB of the portion where the inner winding is large is the center. In addition, the via-hole conductor 120 that connects the second coil layer 112 and the fourth coil layer 116 has many windings inside the inner peripheral portion of the third coil layer 114 as shown in FIG. 6C. It is formed so that the middle position of the width WB ′ of the portion is the center.

  Therefore, as shown in FIGS. 7A-1 and 7B-1, when the via hole conductors 120 and 122 are extremely misaligned, no short-circuit failure occurs, but the allowable value is negligible. When the displacement becomes larger than that and contacts with the coil surrounding part, as shown in FIGS. 7 (A-2) and (B-2), FIGS. 7 (A-3) and (B-3), they are parallel to each other. The circuit becomes conductive and short circuit failure occurs. On the contrary, if the position of the via hole is shifted and deviated from the land (not shown), the connection between the coils cannot be obtained and the circuit becomes an open defect. As the product size becomes smaller, the allowable value of misalignment becomes smaller and the above-mentioned problems are likely to occur. The present invention addresses and solves these problems.

  The present invention pays attention to the above points, and by increasing the allowable value of the displacement of the connecting conductor, a multilayer coil capable of taking noise countermeasures while maintaining a sufficient signal quality while being small in size. The purpose is to provide an electronic component using the.

  The present invention is a laminated coil obtained by laminating a plurality of insulating layers on a surface of a coil that circulates in a planar shape. The first layer coil and the second layer coil circulate in the same direction, and the third layer The coil and the fourth layer coil circulate in the opposite direction to the first layer and the second layer coil, and in the thickness direction of the insulating layer on the inner side of the circulation part of the first to fourth layer coils. Two rows of connecting conductors are arranged, and the inner peripheral end of the first layer coil is wound in the circumferential direction with respect to the inner peripheral end of the second layer coil, and the three layers are formed by one connecting conductor. The inner peripheral end of the fourth layer coil is connected to the inner peripheral end of the eye coil, and the inner peripheral end of the fourth layer coil is wound in the circumferential direction from the inner peripheral end of the third layer coil. While connecting to the inner peripheral end of the second layer coil, the two rows of connecting conductors are connected to the inside of the coiled portion. What it is obtained by arranged in a central position of the width of the winding little portion of the coil.

  Another invention is a laminated coil in which a plurality of insulating layers each having a planar coil formed on a surface thereof are laminated, the inner peripheral end of the coil on the first insulating layer and the third insulating layer A pair of coils connected by a first via-hole conductor penetrating the first and second insulating layers, and an inner peripheral end of the coil on the second insulating layer; The inner peripheral end of the coil on the fourth insulating layer and another pair of coils connected by a second via-hole conductor that penetrates the second and third insulating layers, The coils on the first and second insulating layers are circulated in the same direction, and the coils on the third and fourth insulating layers are respectively connected on the first and second insulating layers. The first via-hole conductor is wound in a direction opposite to the coil, and has a width of a portion with a small amount of winding of the inner peripheral portion of the coil on the second insulating layer. The second via-hole conductor passes through the central position of the width of the portion of the inner peripheral portion of the coil on the third insulating layer with less winding, and passes through the center position, and the first insulating layer The inner peripheral end of the coil on the layer is connected to the first via-hole conductor at a position where the coil is deeply wound, and the inner peripheral end of the coil on the second insulating layer is The coil is connected to the second via-hole conductor at a shallow position in the winding direction, and the inner peripheral end of the coil on the third insulating layer is positioned at a shallow position in the winding direction of the coil. The inner peripheral end of the coil on the fourth insulating layer is connected to the second via-hole conductor at a position where the coil is deeply wound in the winding direction. It is what.

  An electronic component of the present invention uses any one of the laminated coils described above. The above and other objects, features and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings.

  According to the present invention, in a laminated coil obtained by laminating planarly wound coils with an insulating layer in between, the first layer coil and the second layer coil are paired and circulate in the same direction. The coil and the fourth layer coil are paired and circulate in the opposite direction to the first and second layer coils. Then, two rows of connecting conductors are arranged in the thickness direction of the insulating layer inside the coiled portion. The inner peripheral end of the first layer coil is connected to the inner peripheral end of the third layer coil by one connecting conductor at a position advanced in the circumferential direction from the inner peripheral end of the second layer coil. On the other hand, the inner peripheral end of the fourth layer coil is connected to the inner peripheral end of the second layer coil by the other connecting conductor at a position advanced in the circumferential direction from the inner peripheral end of the third layer coil. . At this time, since the two rows of connection conductors are arranged at the center position of the width of the portion where the winding of the coil is small, the allowable value of the displacement of the connection conductors can be increased. Thereby, although it is small, sufficient signal quality can be maintained and noise countermeasures can be taken. In addition, the product yield is improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the common mode choke coil of Example 1 of this invention, (A) is an external appearance perspective view which shows the whole structure, (B) is the said (A) cut | disconnected along a # A- # A line, and an arrow It is sectional drawing which shows the lamination | stacking state seen in the direction. It is a disassembled perspective view which shows the internal structure of the laminated body of the said Example 1. FIG. (A) is an external perspective view of the fourth green sheet to which the coil layer is transferred, and (B) to (E) are diagrams showing the manufacturing process of the coil layer. It corresponds to a cross section cut along the direction of arrow. FIG. 3 is a plan view showing a deviation between a via-hole conductor and a land in the second green sheet of Example 1; It is a top view which shows the coil pattern of this invention, and the coil pattern of a conventional structure. It is a top view which shows the green sheet in which the coil layer which comprises the common mode choke coil of background art was formed. It is a top view which shows the shift | offset | difference of the via-hole conductor and land in the green sheet of the 2nd layer of the common mode choke coil of a comparative example.

  Hereinafter, the best mode for carrying out the present invention will be described in detail based on examples.

  First, Embodiment 1 of the present invention will be described with reference to FIG. 1 and FIG. In this embodiment, the present invention is applied to a common mode choke coil. FIG. 1 (A) is an external perspective view showing the overall structure, and FIG. 1 (B) shows the laminated state when (A) is viewed in the direction of the cutting arrow along the line # A- # A. A cross-sectional view is shown. FIG. 2 is an exploded perspective view showing the internal structure of the laminate constituting the common mode choke coil. As shown in FIG. 1, the common mode choke coil 10 of the present embodiment has a configuration in which terminal electrodes 14, 16, 18, and 20 are provided on a pair of opposed end faces 12A and 12B of a substantially rectangular parallelepiped laminated body 12. It has become. The terminal electrodes 14 and 16 are formed in the vertical direction of one end surface 12A, and a part of the upper surface and the lower surface of the laminated body 12 is applied. The terminal electrodes 18 and 20 are formed in the vertical direction of the other end surface 12 </ b> B, and a part of the upper surface and the lower surface of the multilayer body 12 is applied.

  The laminate 12 has a structure in which a coil laminate 30 in which a plurality of coil layers are laminated is sandwiched between an upper magnetic layer 22 and a lower magnetic layer 24. As shown in FIGS. 1B and 2, the coil laminate 30 is formed by a plurality of insulator layers 32 to 40 and coil layers 54 to 60 sandwiched therebetween. The first coil layer 54 is formed on the first insulating layer 34 so as to circulate in a planar shape. The coil layer 54 has a connecting land 54 </ b> C formed at an inner peripheral end 54 </ b> A and a lead portion 54 </ b> D formed at an outer peripheral end 54 </ b> B. The second coil layer 56 is formed on the second insulating layer 36 so as to circulate in a plane. The coil layer 56 circulates in the same direction as the first coil layer 54, and a land 56 </ b> C is formed at the inner end 56 </ b> A, and a lead-out portion 56 </ b> D is formed at the outer end 56 </ b> B. ing. Further, another land 56E is formed on the inner side of the circuit portion along with the land 56C.

  The third coil layer 58 is formed on the third insulating layer 38 so as to circulate in a plane. The coil layer 58 has a rotating direction opposite to that of the first and second coil layers 54 and 56. A land 58C is connected to the inner peripheral end 58A, and a lead-out portion 58D is formed at the outer peripheral end 58B. Further, another land 58E is formed inside the circuit portion along with the land 58C. The fourth coil layer 60 is formed on the fourth insulating layer 40 so as to circulate in a planar shape. The coil layer 60 circulates in the same direction as the third coil layer 58. Further, a land 60C is formed at the inner peripheral end 60A, and a lead-out portion 60D is formed at the outer peripheral end 60B.

  The coil laminate 30 is formed by laminating the first insulating layer 34 to the fourth insulating layer 40 and further stacking another insulating layer 32 on the first coil layer 54. The During lamination, the land 54C at the inner peripheral end of the first coil layer 54 and the land 58C at the inner peripheral end of the third coil layer 58 are connected by the second land 56E and the via-hole conductor 50. The The via-hole conductor 50 is filled in each of the via hole 42 formed in the first insulating layer 34 and the via hole 44 formed in the second insulating layer 36.

  The land 56C at the inner peripheral end of the coil layer 56 of the second layer and the land 60C at the inner peripheral end of the fourth layer are connected to the land 58E of the third layer and the via-hole conductor 52. The via hole conductor 52 is filled in each of the via hole 46 formed in the second insulating layer 36 and the via hole 48 formed in the third insulating layer 38. That is, when the insulating layers 34 to 40 are stacked, two rows of via-hole conductors 50 and 52 are formed inside the coiled portion. The lead portion 54 </ b> D of the first coil layer 54 is connected to the terminal electrode 14, and the lead portion 56 </ b> D of the second coil layer 56 is connected to the terminal electrode 16. The lead portion 58D of the third coil layer 58 is connected to the terminal electrode 18, and the lead portion 60D of the fourth coil layer 60 is connected to the terminal electrode 20.

  Next, a method for manufacturing the common mode choke coil of this embodiment will be described. First, a green sheet of a glass material used as the insulating layers 32 to 40, for example, a borosilicate glass sheet is prepared, and holes are formed at predetermined positions of the glass material green sheet. Specifically, a via hole 42 is formed in the glass material green sheet used as the first insulating layer 34, and via holes 44 and 46 are formed in the glass material green sheet used as the second insulating layer 36. To do. A via hole 48 is formed in the glass material green sheet used as the third insulating layer 38. The fourth insulating layer 40 and the insulating layer 32 provided on the first coil layer 54 are not perforated. The size of the glass material green sheet is, for example, about 0.6 mm × 0.5 mm × 30 μm. When using a thin glass material green sheet, several sheets may be stacked.

  The glass green sheet is perforated by, for example, processing by controlling the irradiation position and power of a carbon dioxide laser. Then, the formed via holes 42 to 48 are printed by a screen printing method with a pattern coinciding with the positions of the via holes 42 to 48 and filled with silver paste. After filling, the silver paste is dried to produce a green sheet in which the via hole is filled with the silver paste. In the illustrated example, for convenience of explanation, the via-hole conductor connecting the coil layer 54 and the coil layer 58 is 50, and the via-hole conductor connecting the coil layer 56 and the coil layer 60 is 52. These via-hole conductors 50 and 52 are , Both are formed by filling the same silver paste. The diameter of the via holes 42 to 48 is, for example, about 100 μm.

  Next, a manufacturing method of the coil layers 54 to 60 will be described with reference to FIG. FIG. 3A is an external perspective view showing a state where the coil layer is transferred to the fourth insulating layer, and FIGS. 3B to 3E are views showing the manufacturing process of the coil layer. This corresponds to a cross section cut along line B- # B and viewed in the direction of the arrow. First, as shown in FIG. 3 (B), a resist 72 is applied to the surface of the stainless steel substrate 70, and a coil pattern (land and lead portions) is formed on the resist 72 as shown in FIG. Are also formed). The opening 74 is subjected to, for example, electrolytic silver plating. At this time, as shown in FIG. 3D, the coiled plating conductor 76 is formed so as to rise from the surface of the resist 72. In the same procedure, a stainless steel substrate 70 on which a plated conductor 76 having a shape corresponding to the pattern of the first to third coil layers 54, 56, and 58 is formed is prepared.

  In this embodiment, the coil pattern is formed by a photolithographic technique, and the photolithographic mask used for this is formed based on CAD data, so that a free plane pattern can be formed. Moreover, since the hole by laser processing is performed by NC control with the data created based on CAD data, it can be opened in a desired predetermined position. The coil pattern is transferred from the stainless steel substrate 70 to the green sheet side by pressing and pressing the raised plating conductor 76 against the green sheet in the stage of sequentially laminating the glass material green sheets. (FIG. 3 (E)). The coil layer thus transferred onto the insulating layer has a conductor width of about 10 μm and a conductor spacing of about 5 μm.

These coil patterns are formed so as to satisfy the following conditions in a state after the plating conductor 76 is laminated while being transferred to a glass material green sheet.
(1) The first coil layer 54 and the second coil layer 56 are paired and circulate in the same direction.
(2) The third coil layer 58 and the fourth coil layer 60 are paired so as to circulate in the opposite direction to the coil layers 54 and 56.
(3) The end 54A on the inner peripheral side of the first coil layer 54 is formed so that the winding in the circumferential direction is deeper than the end 56A on the inner peripheral side of the second coil layer 56. .
(4) The end 60A on the inner peripheral side of the fourth coil layer 60 is formed so that the winding in the circumferential direction is deeper than the end 58A on the inner peripheral side of the third coil layer 58. .

Further, it is formed so as to satisfy the following conditions in the positional relationship with the via holes 42 to 48.
(1) A portion in which the winding of the second coil layer 56 is small between the via hole conductor 50 filled in the via holes 42 and 44, the first land 54C, the second land 56E, and the third land 58C. Is formed at a position corresponding to the center of the width WA (see FIGS. 2 and 4A-1).
(2) A portion in which the winding of the third coil layer 58 is small in the via hole conductor 52 filled in the via holes 46, 48, the second land 56C, the third land 58E, and the fourth land 60C. Is formed at a position corresponding to the center of the width WA ′ (see FIG. 2).
The widths WA and WA ′ are, for example, about 180 μm.

  By forming the coil pattern and the via hole so as to satisfy such a positional relationship, after the lamination of the glass material green sheet, the first coil layer end 54A and the third coil layer end 58A, The via-hole conductor 50 is connected to the lands 54C, 56E, and 58C to form a pair of coils. The second coil layer end 56A and the fourth coil layer end 60A are connected to each other via the via-hole conductor 52 and the lands 56C, 58E, and 60C to form a pair of coils.

  Then, a ferrite material green sheet is stacked on the upper and lower sides of the coil laminate 30 as a magnetic material layer 22 and 24 and pressure-bonded, and then the binder 12 is removed and fired to obtain the laminate 12. Terminal electrodes 14 to 20 connected to the lead portions 54D, 56D, 58D, and 60D of the internal coil conductor are formed at predetermined positions on the end faces 12A and 12B of the multilayer body 12 by, for example, applying silver paste. Then, the silver paste is baked and combined with the element body, and the surfaces of the terminal electrodes 14 to 20 are plated to obtain the common mode choke coil 10. As the ferrite green sheet, for example, Ni—Zn ferrite is used.

  In the common mode choke coil 10 manufactured as described above, the via-hole conductor 50 connecting the first coil layer 54 and the third coil layer 58 is formed as shown in FIG. The layer 56 is formed so that the middle position of the width WA of the portion with a small amount of winding inside the circumferential portion is the center. In addition, the via hole conductor 52 connecting the second coil layer 56 and the fourth coil layer 60 has an intermediate position of the width WA ′ of the portion of the third coil layer 58 where the inner winding portion is less wound. It is formed to be the center. Therefore, the allowable value of the displacement of the connection position between the via-hole conductors 50 and 52 and the coil is larger than that in the background art described above. 4 (A-1) to (A-3) and (B-1) to (B-3) show the second coil layer 56 in the case where the amount of deviation is the same as that of the background art shown in FIG. And the positional relationship between the via-hole conductors 50 and 50B. As shown in FIG. 4, even in the case of the same shift amount as that of the background art, no short circuit defect occurs in this embodiment.

Next, specific data regarding the allowable value of deviation will be shown. 5A shows a coil pattern employing the structure of the present invention, and FIG. 5B shows a coil pattern having a conventional structure. In the illustrated example, the number of turns of the coil is about 6 to 7 turns, but the actual tests were performed in the case of sample 1 (around 2 turns) and sample 2 (around 5 turns). ) And sample 3 (number of laps 6.5). The results for samples 1 to 3 are shown below.
(1) In the coil pattern of sample 1 (around 2 turns, the pitch between windings in the turn part is 24 μm or less)
In the present invention, the allowable displacement is 0.057 mm,
Position shift tolerance for conventional structure: 0.045 mm,
The allowable value is about 1.27 times that of the conventional method, that is, about 30% higher.
(2) In the coil pattern of sample 2 (the number of laps is about 5 and the pitch between windings of the lap portion is 15 μm or less),
In the present invention, the allowable displacement is 0.014 mm,
In the case of the conventional structure, the allowable displacement is 0.007 mm,
The allowable value is about 2.0 times that of the conventional method, that is, 100%.
(3) In the coil pattern of sample 3 (example shown in FIG. 5) (the number of turns is 6.5, the pitch between windings is 20 μm, L / S = 10/10 μm),
In the present invention, the allowable displacement is 0.019 mm,
In the case of the conventional structure, the allowable displacement is 0.009 mm,
The allowable value is about 2.1 times that of the conventional method, that is, 110% higher.
Since the via hole misalignment tolerance increases by about 30% to 110%, the yield can be improved to about 97% to 100%.

  Thus, according to Example 1, a pair of coils in which the first coil layer 54 and the third coil layer 58 are connected by the via-hole conductor 50, the second coil layer 54, and the fourth layer The coil layer 60 includes a pair of coils connected by via-hole conductors 52. Since the connection via hole of one coil is arranged so that the position penetrating the other coil is further away from the coiled portion, the possibility of short-circuiting when the position of the via hole is slightly shifted is reduced. To do. In addition, the tolerance value of the via hole misalignment is increased, and as a result, the yield can be improved. Furthermore, although it is small in size, sufficient signal quality can be maintained and noise countermeasures can be taken.

In addition, this invention is not limited to the Example mentioned above, A various change can be added in the range which does not deviate from the summary of this invention. For example, the following are also included.
(1) The shapes and dimensions shown in the above-described embodiments are merely examples, and can be appropriately changed within a range where similar effects can be obtained.
(2) The materials shown in the above embodiments are also examples, and various known materials can be used.
(3) The number of coil turns shown in the above embodiment is also an example, and may be appropriately increased or decreased as necessary. Also, the design of the pitch of the coiled portion may be changed as appropriate.
(4) The manufacturing method of the via-hole conductors 50 and 52 and the coil layers 54 to 60 shown in the above embodiment is also an example, and does not hinder the manufacturing by other methods.
(5) When the present invention is applied to a common mode choke coil as in the first embodiment, the first coil layer 54 and the second coil layer 56 circulate in the same direction, and the third layer The coil layer 58 and the fourth coil layer 60 circulate in the opposite direction to the coil layers 54 and 56. However, this is also an example, and the increase in the allowable value of misalignment according to the present invention can be applied to a laminated coil component in which all coil patterns in the laminated direction are wound in the same direction.
(6) The present invention does not prevent application of the laminated coil of the present invention to electronic components other than the common mode choke coil.

  According to the present invention, in a laminated coil obtained by laminating planarly wound coils with an insulating layer in between, the first layer coil and the second layer coil are paired and circulate in the same direction. The coil and the fourth layer coil are paired and circulate in the opposite direction to the first and second layer coils. Then, two rows of connecting conductors are arranged in the thickness direction of the insulating layer inside the coiled portion. The inner peripheral end of the first layer coil is connected to the inner peripheral end of the third layer coil by one connecting conductor at a position advanced in the circumferential direction from the inner peripheral end of the second layer coil. On the other hand, the inner peripheral end of the fourth layer coil is connected to the inner peripheral end of the second layer coil by the other connecting conductor at a position advanced in the circumferential direction from the inner peripheral end of the third layer coil. . At this time, since the two rows of connection conductors are arranged at the center position of the width of the portion where the coil is less wound, the allowable value of the displacement of the connection conductors is increased. It can be applied to the use of laminated coils.

DESCRIPTION OF SYMBOLS 10: Common mode choke coil 12: Laminated body 12A, 12B: End surface 14-20: Terminal electrode 22, 24: Magnetic body layer 30: Coil laminated body 32-40: Insulating layer 42-48: Via hole 50, 52: Via hole conductor 54-60: Coil layer 54A, 54B, 56A, 56B, 58A, 58B, 60A, 60B: End part 54C, 56C, 56E, 58C, 58E, 60C: Land 54D, 56D, 58E, 60E: Lead part 70: Stainless steel Substrate 72: Resist 74: Opening 76: Plating conductors 100 to 106: Insulating layers 110 to 116: Coil layers 110A, 110B, 112A, 112B, 114A, 114B, 116A, 116B: End portions 110C, 112C, 112E, 114C, 114E, 116C: Land 110D, 112D, 114D, 116D: Lead portions 120, 122: Via hole conductors WA, WB: Width

Claims (3)

A laminated coil in which a plurality of insulating layers formed on a surface of a coil that circulates in a planar shape is laminated,
The first layer coil and the second layer coil circulate in the same direction, the third layer coil and the fourth layer coil circulate in the opposite direction to the first layer and the second layer coil,
Two rows of connecting conductors are arranged in the thickness direction of the insulating layer on the inner side of the coil portion of the first to fourth layers,
The inner peripheral end of the first layer coil is connected to the inner peripheral end of the third layer coil by one connecting conductor at a position advanced in the circumferential direction from the inner peripheral end of the second layer coil. And
The inner peripheral end of the fourth layer coil is connected to the inner peripheral end of the second layer coil by the other connecting conductor at a position advanced in the circumferential direction from the inner peripheral end of the third layer coil. And
The laminated coil, wherein the two rows of connecting conductors are arranged at the center of the width of a portion where the coil is not wound, inside the coiled portion of the coil. A laminated coil in which a plurality of insulating layers formed on a surface of a coil that circulates in a planar shape is laminated,
The inner peripheral end of the coil on the first insulating layer and the inner peripheral end of the coil on the third insulating layer are connected by a first via-hole conductor that penetrates the first and second insulating layers. A pair of coils,
The inner peripheral end of the coil on the second insulating layer and the inner peripheral end of the coil on the fourth insulating layer are connected by a second via-hole conductor that penetrates the second and third insulating layers. And another pair of coils
The coils on the first and second insulating layers are circulated in the same direction, and the coils on the third and fourth insulating layers are on the first and second insulating layers. It is circulated in the opposite direction to each coil of
The first via-hole conductor passes through a central position of the width of the portion with less winding of the inner peripheral portion of the coil on the second insulating layer,
The second via-hole conductor passes through a central position of a width of a portion with less winding of an inner peripheral portion of the coil on the third insulating layer,
The inner peripheral end of the coil on the first insulating layer is connected to the first via-hole conductor at a position where the winding of the coil in the winding direction is deep,
The inner peripheral end of the coil on the second insulating layer is connected to the second via-hole conductor at a position where the winding of the coil in the winding direction is shallow,
The inner peripheral end of the coil on the third insulating layer is connected to the first via-hole conductor at a position where the winding of the coil in the winding direction is shallow,
A laminated coil, wherein an inner peripheral end of a coil on the fourth insulating layer is connected to the second via-hole conductor at a position where the coil is deeply wound in a circumferential direction.   An electronic component using the laminated coil according to claim 1.

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