[go: up one dir, main page]

JP2013171880A - Method for manufacturing coil component and method for connecting wire - Google Patents

Method for manufacturing coil component and method for connecting wire Download PDF

Info

Publication number
JP2013171880A
JP2013171880A JP2012033271A JP2012033271A JP2013171880A JP 2013171880 A JP2013171880 A JP 2013171880A JP 2012033271 A JP2012033271 A JP 2012033271A JP 2012033271 A JP2012033271 A JP 2012033271A JP 2013171880 A JP2013171880 A JP 2013171880A
Authority
JP
Japan
Prior art keywords
lead portion
connection
lead
terminal
metal fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012033271A
Other languages
Japanese (ja)
Other versions
JP5652413B2 (en
Inventor
Akira Akasaka
朗 赤坂
Hiroyuki Uemura
博之 植村
Hiroshi Saito
洋志 斎藤
Toru Takashima
亨 鷹島
Hiroaki Ito
広明 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2012033271A priority Critical patent/JP5652413B2/en
Publication of JP2013171880A publication Critical patent/JP2013171880A/en
Application granted granted Critical
Publication of JP5652413B2 publication Critical patent/JP5652413B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

【課題】絶縁被膜の剥離不具合を低減することが可能であり、ワイヤのリード部と端子電極との接続の信頼性が向上するワイヤの継線方法とコイル部品の製造方法を提供すること。
【解決手段】絶縁被膜14が施されたワイヤ10のリード部10aを、端子金具20の接続予定部27aから持ち上げた状態で、リード部10aのY軸方向の両側にレーザLを照射し、リード部10aの外周に形成してある絶縁被膜14を除去する。絶縁被膜12が除去されたリード部10aを端子金具20の接続予定部27aに接触させ、リード部10aを端子金具20の接続予定部27aに接続する。
【選択図】図1
An object of the present invention is to provide a wire connecting method and a coil component manufacturing method capable of reducing defects in peeling off an insulating film and improving the reliability of connection between a lead portion of a wire and a terminal electrode.
In a state where a lead portion 10a of a wire 10 to which an insulating film 14 is applied is lifted from a connection planned portion 27a of a terminal metal fitting 20, a laser L is applied to both sides of the lead portion 10a in the Y-axis direction. The insulating film 14 formed on the outer periphery of the portion 10a is removed. The lead portion 10a from which the insulating coating 12 has been removed is brought into contact with the connection planned portion 27a of the terminal fitting 20, and the lead portion 10a is connected to the connection planned portion 27a of the terminal fitting 20.
[Selection] Figure 1

Description

本発明は、コイル部品の製造方法とワイヤの継線方法に関する。   The present invention relates to a coil component manufacturing method and a wire connecting method.

トランスなどのコイル部品、あるいはその他の電子部品を製造する場合に、ワイヤのリード部を端子金具に接続するワイヤの継線方法が用いられることがある。コイル部品のワイヤには、絶縁被覆が施してあるため、ワイヤのリード部を端子金具に接続するには、リード部の絶縁被覆を除去する作業が必要となる。   When manufacturing a coil component such as a transformer or other electronic components, a wire connecting method in which a lead portion of a wire is connected to a terminal fitting may be used. Since the wire of the coil component is provided with an insulation coating, it is necessary to remove the insulation coating of the lead portion in order to connect the lead portion of the wire to the terminal fitting.

被覆線の絶縁被膜を除去する方法としては、たとえば特許文献1に示すように、反射鏡を用いて、被覆線の両側からレーザ光を同時に照射し、絶縁被膜を除去する方法が知られている。しかしながら、この方法は、端子電極と絶縁被膜ワイヤとの継線を考慮しておらず、端子電極と絶縁被膜ワイヤとの継線に際しては使いにくいという課題を有している。   As a method for removing the insulating film from the coated wire, for example, as shown in Patent Document 1, a method is known in which a laser beam is simultaneously irradiated from both sides of the coated wire using a reflecting mirror to remove the insulating film. . However, this method does not consider the connection between the terminal electrode and the insulating coating wire, and has a problem that it is difficult to use when connecting the terminal electrode and the insulating coating wire.

たとえば端子電極と絶縁被膜ワイヤとの継線に際しては、ワイヤのリード部は、端子電極に接触した状態であり、しかも、端子電極には溶接片や仮固定片などの障害物が存在し、その状態では、ワイヤのリード部に両側からレーザ光を照射することが困難である。   For example, when connecting a terminal electrode and an insulation coating wire, the lead portion of the wire is in contact with the terminal electrode, and the terminal electrode has obstacles such as a welded piece and a temporarily fixed piece, In the state, it is difficult to irradiate the lead portion of the wire with laser light from both sides.

特に、複数のコイル部品をまとめて(姿勢変更することなく)一括処理しようとすると、ワイヤのリード部の両側から絶縁被膜を全周剥離するようにレーザ光を当てることが困難であり、部分的にしか絶縁被膜を剥離できなかった。絶縁被膜の剥離残りや剥離カスの付着などの剥離不具合が生じると、ワイヤのリード部と端子電極との接続が不完全になるおそれがあり、不良品の発生の原因となる。   In particular, when a plurality of coil parts are collectively processed (without changing the posture), it is difficult to irradiate the laser beam so as to peel off the insulating film from both sides of the lead portion of the wire. Only the insulating film could be peeled off. If a peeling failure such as the remaining peeling of the insulating coating or the adhesion of peeling residue occurs, the connection between the lead portion of the wire and the terminal electrode may be incomplete, which may cause defective products.

また、剥離不具合をなくすために、レーザ光の出力を高めすぎると、リード部が変形したり、断線が生じたりするおそれがあり、やはり、ワイヤのリード部と端子電極との接続が不完全になり、不良品の発生の原因となる。   Moreover, if the output of the laser beam is increased too much in order to eliminate the peeling failure, the lead portion may be deformed or the wire may be broken. Again, the connection between the lead portion of the wire and the terminal electrode is incomplete. This may cause defective products.

特開平8−191518号公報JP-A-8-191518

本発明は、このような実状に鑑みてなされ、その目的は、絶縁被膜の剥離不具合を低減することが可能であり、ワイヤのリード部と端子電極との接続の信頼性が向上するワイヤの継線方法とコイル部品の製造方法を提供することである。   The present invention has been made in view of such a situation, and an object of the present invention is to reduce the problem of peeling of the insulating film and to improve the reliability of the connection between the lead portion of the wire and the terminal electrode. It is to provide a wire method and a method of manufacturing a coil component.

上記目的を達成するために、本発明に係るワイヤの継線方法は、
絶縁被膜が施されたワイヤのリード部を、端子金具の接続予定部から持ち上げた状態で、前記リード部の両側にレーザを照射し、前記リード部の外周に形成してある絶縁被膜を除去する工程と、
前記絶縁被膜が除去された前記リード部を前記端子金具の接続予定部に接触させ、前記リード部を前記端子金具の接続予定部に接続する工程とを有する。
In order to achieve the above object, a wire connecting method according to the present invention includes:
In the state where the lead portion of the wire coated with the insulating coating is lifted from the connection portion of the terminal fitting, the both sides of the lead portion are irradiated with laser to remove the insulating coating formed on the outer periphery of the lead portion. Process,
A step of bringing the lead portion from which the insulating coating has been removed into contact with a planned connection portion of the terminal fitting, and connecting the lead portion to the planned connection portion of the terminal fitting.

本発明に係るコイル部品の製造方法は、
絶縁被膜が施されたワイヤのリード部を、端子金具の接続予定部から持ち上げた状態で、前記リード部の両側にレーザを照射し、前記リード部の外周に形成してある絶縁被膜を除去する工程と、
前記絶縁被膜が除去された前記リード部を前記端子金具の接続予定部に接触させ、前記リード部を前記端子金具の接続予定部に接続する工程とを有する。
A method for manufacturing a coil component according to the present invention includes:
In the state where the lead portion of the wire coated with the insulating coating is lifted from the connection portion of the terminal fitting, the both sides of the lead portion are irradiated with laser to remove the insulating coating formed on the outer periphery of the lead portion. Process,
A step of bringing the lead portion from which the insulating coating has been removed into contact with a planned connection portion of the terminal fitting, and connecting the lead portion to the planned connection portion of the terminal fitting.

本発明に係るワイヤの継線方法とコイル部品の製造方法によれば、絶縁被膜が施されたワイヤのリード部を、端子金具の接続予定部から持ち上げた状態で、リード部の両側にレーザを照射する。このため、端子金具の接続予定部の近くに、溶接片や仮固定片などの障害物が存在してあったしても、それらの障害物を避けて、リード部の両側にレーザを照射することが可能になる。   According to the wire connecting method and the coil component manufacturing method according to the present invention, a laser is applied to both sides of the lead portion in a state where the lead portion of the wire coated with the insulating film is lifted from the connection planned portion of the terminal fitting. Irradiate. For this reason, even if there are obstacles such as welded pieces and temporarily fixed pieces near the planned connection part of the terminal fitting, avoid those obstacles and irradiate the laser on both sides of the lead part It becomes possible.

したがって本発明の方法では、絶縁被膜の剥離残りや剥離カスの付着などの剥離不具合が生じ難くなり、絶縁被膜の剥離不具合を低減することが可能である。また、レーザ光が絶縁被膜の全周に沿って略均一に照射されることから、レーザ光の出力の調整が容易になり、リード部の変形や断線が防止される。したがって、その後の工程において、絶縁被膜が除去されたリード部を端子金具の接続予定部に接触させ、リード部を端子金具の接続予定部に接続する際に、ワイヤのリード部と端子電極との接続の信頼性が向上する。   Therefore, according to the method of the present invention, it is difficult to cause a peeling failure such as the remaining peeling of the insulating coating and adhesion of peeling residue, and it is possible to reduce the peeling failure of the insulating coating. Further, since the laser beam is irradiated substantially uniformly along the entire circumference of the insulating coating, the adjustment of the output of the laser beam is facilitated, and the lead portion is prevented from being deformed or disconnected. Therefore, in the subsequent process, when the lead part from which the insulating coating has been removed is brought into contact with the connection planned part of the terminal metal fitting, and the lead part is connected to the connection planned part of the terminal metal fitting, the lead part of the wire and the terminal electrode Connection reliability is improved.

好ましくは、前記端子金具の金具本体には、前記リード部の先端が仮止めされる巻線補助片が形成してあり、前記金具本体に対する前記巻線補助片の折曲角度を調節することで、前記端子金具の接続予定部から前記リード部を持ち上げ、または、前記リード部を前記端子金具の接続予定部に接触させる。   Preferably, the metal fitting main body of the terminal fitting is formed with a winding auxiliary piece for temporarily fixing the tip of the lead portion, and the bending angle of the winding auxiliary piece with respect to the metal fitting main body is adjusted. Then, the lead portion is lifted from the connection planned portion of the terminal fitting, or the lead portion is brought into contact with the connection planned portion of the terminal fitting.

端子金具の金具本体に巻線補助片が形成してあることで、ワイヤの巻線作業が容易になると共に、しかも、この巻線補助片を利用して、端子金具の接続予定部からリード部を持ち上げ、その後に、リード部を端子金具の接続予定部に接触させる作業が容易になる。   Since the winding auxiliary piece is formed on the metal fitting body of the terminal fitting, the winding work of the wire is facilitated, and the lead fitting portion is connected to the terminal fitting connection portion by using this winding auxiliary piece. After that, the work of bringing the lead portion into contact with the connection planned portion of the terminal fitting becomes easy.

前記リード部を前記端子金具の接続予定部に接続した後は、前記巻線補助片が前記端子金具から除去されてもよい。巻線補助片は、コイル部品などの製品が完成した後には、一般には不要となる部分なので除去される。   After the lead portion is connected to the connection scheduled portion of the terminal fitting, the auxiliary winding piece may be removed from the terminal fitting. The winding auxiliary piece is removed because it is generally an unnecessary part after the product such as the coil component is completed.

好ましくは、前記端子金具の接続予定部は、前記金具本体に対して折曲自在に一体化された羽根片を前記金具本体に対して折りたたむことで形成される前記羽根片の表面である。   Preferably, the connection scheduled portion of the terminal fitting is a surface of the blade piece formed by folding a blade piece integrated with the metal fitting body so as to be foldable with respect to the metal fitting body.

羽根片は、従来では、ワイヤのリード部の上から覆うための部分であり、リード部の両側からレーザ光を照射する際に、レーザ光の邪魔になっていた部分である。その邪魔になっていた羽根片を、金具本体に対して折りたたみ、折りたたむことで形成される羽根片の表面を接続予定部にすることで、障害物を避けて、リード部の両側にレーザを照射することが容易になる。なお、羽根片自体を除去する構造も考えられるが、羽根片自体を除去する構造に比較して、リード部を端子金具の接続予定部に安定して接触させ易く、リード部と端子金具との接続が確実である。   Conventionally, the blade piece is a portion for covering the lead portion of the wire from above, and is a portion that obstructs the laser beam when the laser beam is irradiated from both sides of the lead portion. Folding the wing piece that was in the way to the bracket body and folding it, the surface of the wing piece that is formed is made the connection planned part, avoiding obstacles and irradiating laser on both sides of the lead part Easy to do. A structure that removes the blade piece itself is also conceivable. However, compared to a structure that removes the blade piece itself, the lead portion can be easily and stably brought into contact with the connection portion of the terminal metal fitting. Connection is secure.

好ましくは、前記端子金具の金具本体には、前記金具本体に対して折曲自在に一体化される仮押さえ片が形成してあり、前記仮押さえ片と前記金具本体との間で、前記リード部の途中を仮押さえ片において仮保持可能になっており、前記リード部の長手方向に沿って前記仮押さえ片と前記巻線補助片との間に、前記接続予定部が位置する。   Preferably, the metal fitting body of the terminal fitting is formed with a temporary holding piece that is foldable and integrated with the metal fitting body, and the lead between the temporary holding piece and the metal fitting body. The temporary holding piece can be temporarily held in the middle of the portion, and the planned connection portion is located between the temporary holding piece and the auxiliary winding piece along the longitudinal direction of the lead portion.

このような構造の場合に、金具本体に対する巻線補助片の折曲角度を調節することで、端子金具の接続予定部からリード部を持ち上げ、または、リード部を端子金具の接続予定部に接触させる作業が容易になる。   In such a structure, by adjusting the bending angle of the winding auxiliary piece with respect to the metal fitting body, the lead part is lifted from the terminal metal fitting planned connection part, or the lead part is in contact with the terminal metal fitting connection part. This makes it easier to work.

好ましくは、前記リード部の両側には、それぞれマイクロプリズムが配置され、前記リード部の両側には、各マイクロプリズムを通して、単一のレーザ光源からのレーザ光を、異なるタイミングで照射する。マイクロプリズムを用いることで、複数のレーザ光源が不要となり経済的である。また特に、複数のコイル部品のワイヤ被覆をまとめて姿勢変更することなく、絶縁被膜の除去作業が容易になる。   Preferably, microprisms are arranged on both sides of the lead part, and laser light from a single laser light source is irradiated at different timings through the microprisms on both sides of the lead part. By using a microprism, a plurality of laser light sources are not required, which is economical. In particular, the insulating film can be easily removed without changing the posture of the wire covering of the plurality of coil parts at once.

さらに、リード部の両側には、各マイクロプリズムを通して、単一のレーザ光源からのレーザ光を、異なるタイミングで照射するように構成することで、リード部への熱負荷を低減することが可能になる。そのため、リード部の変形や断線を有効に防止することができ、しかも、リード部の全周に亘り略均一にレーザ光を照射し、絶縁被膜の全周剥離が確実になる。   Furthermore, it is possible to reduce the thermal load on the lead part by configuring each side of the lead part to irradiate laser light from a single laser light source through different microprisms at different timings. Become. Therefore, deformation and disconnection of the lead portion can be effectively prevented, and furthermore, the laser beam is irradiated substantially uniformly over the entire circumference of the lead portion, and the entire circumference of the insulating coating is surely peeled off.

好ましくは、前記リード部の両側に配置してある一対のマイクロプリズムは、一方のマイクロプリズムから前記リード部に向けて照射されるレーザ光が、他方のマイクロプリズムには入射しないように配置してある。この場合には、一方のマイクロプリズムからのレーザ光が他方のマイクロプリズムへ入射せず、レーザ光が光路を逆向きに辿ってレーザ光源を損傷することを有効に防止できる。   Preferably, the pair of microprisms arranged on both sides of the lead portion are arranged so that laser light emitted from one microprism toward the lead portion does not enter the other microprism. is there. In this case, the laser light from one microprism does not enter the other microprism, and the laser light can be effectively prevented from following the optical path in the reverse direction and damaging the laser light source.

好ましくは、前記絶縁被膜が除去された前記リード部を前記端子金具の接続予定部に接触させた後、前記端子金具の接続予定部である表面に対して略垂直方向からレーザ光を照射することで、前記リード部を前記端子金具の接続予定部に接続する。この場合には、絶縁被膜の剥離不具合が無い状態で、端子金具とワイヤのリード部を良好に接合することができる。   Preferably, after the lead portion from which the insulating coating has been removed is brought into contact with the connection planned portion of the terminal metal fitting, laser light is irradiated from a substantially vertical direction to the surface which is the connection planned portion of the terminal metal fitting. Then, the lead portion is connected to the connection planned portion of the terminal fitting. In this case, it is possible to satisfactorily join the terminal fitting and the lead portion of the wire in a state where there is no problem of peeling off the insulating coating.

図1は本発明の一実施形態に係るコイル部品の製造途中の斜視図である。FIG. 1 is a perspective view in the middle of manufacturing a coil component according to an embodiment of the present invention. 図2は図1に示すコイル部品のリード部における絶縁被膜の剥離処理を行う剥離装置の平面図である。FIG. 2 is a plan view of a peeling apparatus that performs a peeling process of the insulating film in the lead portion of the coil component shown in FIG. 図3は図2に示すIII−III線に沿うマイクロプリズムの断面図である。FIG. 3 is a cross-sectional view of the microprism along the line III-III shown in FIG. 図4は図2に示す剥離装置に用いられる光学系の概略図である。FIG. 4 is a schematic view of an optical system used in the peeling apparatus shown in FIG. 図5(A)〜図5(C)は図1に示すコイル部品のリード部における絶縁被膜の剥離処理を含む継線方法の各工程を示す概略図である。5 (A) to 5 (C) are schematic views showing each step of the connecting method including a stripping process of the insulating film in the lead part of the coil component shown in FIG. 図6は図1に示すコイル部品のリード部における絶縁被膜の剥離処理に用いられるレーザ光の照射状態を示す概略斜視図である。FIG. 6 is a schematic perspective view showing an irradiation state of a laser beam used for the insulating film peeling process at the lead part of the coil component shown in FIG. 図7(a)〜図7(d)は絶縁被膜の剥離状態を示す概略図である。Fig.7 (a)-FIG.7 (d) are schematic which shows the peeling state of an insulating film.

以下、本発明を、図面に示す実施形態に基づき説明する。
図1に示すように、
Hereinafter, the present invention will be described based on embodiments shown in the drawings.
As shown in FIG.

本発明の一実施形態に係るコイル部品2は、コア8を有する。コア8は、たとえば(Ni,Zn)Fe、(Mn,Zn)Fe、CoFe、CuFeなどのフェライト材料で構成され、少なくとも1本のワイヤ10が巻回される巻芯部4と、巻芯部4の軸方向の両端に形成される一対の鍔部6とを有する。なお、コア8は、フェライトコアのみならずアルミナなど他のセラミックスコアを用いて構成されてもよい。 The coil component 2 according to an embodiment of the present invention has a core 8. The core 8 is made of a ferrite material such as (Ni, Zn) Fe 2 O 4 , (Mn, Zn) Fe 2 O 4 , CoFe 2 O 4 , CuFe 2 O 4 , and at least one wire 10 is wound. It has the core part 4 to be rotated and a pair of flange parts 6 formed at both ends in the axial direction of the core part 4. The core 8 may be configured using not only a ferrite core but also other ceramic scores such as alumina.

それぞれの鍔部6には、少なくとも1つの端子金具20が装着してあり、巻芯部4で巻軸(X軸)方向に巻回してあるワイヤ10の端部であるリード部10aが端子金具20に接続される。図1は、コア8の巻芯部4にワイヤ10を巻軸(X軸)方向にコイル状に巻回した後に、ワイヤ10の各リード部10aを、端子金具に継線する前の状態を示している。   At least one terminal fitting 20 is attached to each collar portion 6, and a lead portion 10 a that is an end portion of the wire 10 wound in the winding axis (X-axis) direction by the winding core portion 4 is a terminal fitting. 20. FIG. 1 shows a state before each lead portion 10a of the wire 10 is connected to a terminal fitting after the wire 10 is wound around the winding core portion 4 of the core 8 in a coil shape in the winding axis (X-axis) direction. Show.

各ワイヤ10としては、たとえば丸線や角線のエナメル線(マグネットワイヤー)、撚り線、複層線などの導線の表面に絶縁被膜が形成してある線材が用いられる。絶縁被膜の材質は、特に限定されないが、たとえばポリウレタン、ポリエステル、ポリアミドイミド、ポリイミド、ポリエステルイミドなどが例示される。   As each wire 10, for example, a wire material in which an insulating coating is formed on the surface of a conducting wire such as a round wire or a rectangular enamel wire (magnet wire), a stranded wire, or a multilayer wire is used. The material of the insulating coating is not particularly limited, and examples thereof include polyurethane, polyester, polyamideimide, polyimide, and polyesterimide.

本実施形態では、各端子金具20は、たとえばFe、Ni、Cu(タフピッチ銅やリン青銅)、A1、またはこれらにSnめっきを施したものなどの金属で構成される。各端子金具20は、コア8の各鍔部6におけるX軸方向の端面6aにそれぞれ装着される第1金具本体22と、各第1金具本体22に対して折り曲げられて一体に形成され各鍔部6におけるZ軸方向の上側面6bのY軸方向の中央部に装着される第2金具本体24とを有する。なお、図面において、X軸とY軸とZ軸とは相互に垂直であり、X軸は、ワイヤ10の巻軸方向に一致する。   In the present embodiment, each terminal fitting 20 is made of, for example, Fe, Ni, Cu (tough pitch copper or phosphor bronze), A1, or a metal such as those plated with Sn. Each terminal fitting 20 is formed integrally with each first fitting main body 22 by being bent with respect to each first fitting main body 22 and the first fitting main body 22 mounted on the end surface 6a in the X-axis direction of each flange 6 of the core 8. And a second metal fitting body 24 attached to the central portion in the Y-axis direction of the upper side surface 6b in the Z-axis direction of the portion 6. In the drawing, the X axis, the Y axis, and the Z axis are perpendicular to each other, and the X axis coincides with the winding axis direction of the wire 10.

第1金具本体22は、各鍔部6における端面6aにおいてY軸方向の中央部でZ軸方向に延びる中央片22aと、その中央片22aのY軸方向の両側に位置する側部片22bおよび22cとを有し、これらはZ軸方向の下方に位置する基部片22dにおいて一体的に連続している。中央片22aのZ軸方向先端には、前述した第2金具本体24が連続して形成してある。   The first metal fitting main body 22 includes a central piece 22a extending in the Z-axis direction at the center portion in the Y-axis direction on the end surface 6a of each flange portion 6, side piece pieces 22b positioned on both sides in the Y-axis direction of the central piece 22a, and 22c, and these are integrally continuous at a base piece 22d located below in the Z-axis direction. The second metal fitting body 24 described above is formed continuously at the Z-axis direction tip of the central piece 22a.

側部片22bおよび22cの内、いずれか一方の側部片22bのZ軸方向上端部には、巻線補助片26が、第1金具本体22に対して所定角度θ(図5(A)参照)で折り曲げて一体に成形してある。巻線補助片26の先端部には、Y軸方向に向けて突出する突出片26aが一体に形成してあり、その突出片26aの先端部には、係止片28が一体に形成してある。   Of the side pieces 22b and 22c, the winding auxiliary piece 26 is at a predetermined angle θ with respect to the first metal fitting body 22 at the upper end in the Z-axis direction of either one of the side pieces 22b (FIG. 5A). (Refer to the above). A protruding piece 26a protruding in the Y-axis direction is integrally formed at the tip of the winding auxiliary piece 26, and a locking piece 28 is integrally formed at the tip of the protruding piece 26a. is there.

巻線補助片26に形成してある係止片28は、コア8のY軸方向の略中央位置に位置するように、単一のコイル部品2において、相互に対向する端子金具20は、同一形状の金具で構成される。すなわち、X−Y軸平面において、巻線補助片26は、相互に点対称位置となるように一対の同じ形状の端子金具20がコア8のX軸方向の両端に配置される。端子金具20をコア8の鍔部6に取り付けるには、接着、カシメ、はめ込み、挿入などの手段が採用される。   In the single coil component 2, the terminal fittings 20 facing each other are the same so that the locking piece 28 formed on the winding auxiliary piece 26 is positioned at a substantially central position in the Y-axis direction of the core 8. Consists of shaped metal fittings. That is, in the XY axis plane, a pair of terminal fittings 20 having the same shape are arranged at both ends of the core 8 in the X-axis direction so that the winding auxiliary pieces 26 are point-symmetric with each other. In order to attach the terminal fitting 20 to the flange portion 6 of the core 8, means such as adhesion, caulking, fitting, and insertion are employed.

第2金具本体24は、第1金具本体22の中央片22aと同じY軸方向幅で一体に形成してある基部片24aを有する。基部片24aには、仮押さえ片25と羽根片27とが一体に形成してある。仮押さえ片25、羽根片27および基部片24aを含めて、端子金具20は、一枚の板材を切り抜き加工した後に、折曲加工することにより形成される。   The second metal fitting body 24 has a base piece 24 a that is integrally formed with the same width in the Y-axis direction as the central piece 22 a of the first metal fitting body 22. A temporary holding piece 25 and a blade piece 27 are integrally formed on the base piece 24a. The terminal fitting 20 including the temporary holding piece 25, the blade piece 27, and the base piece 24a is formed by cutting a single plate material and then bending it.

仮押さえ片25は、ワイヤ10の巻線工程の段階では、基部片24aに対して開いた状態であり、ワイヤ10のリード部10aを、仮押さえ片25と基部片24aとの間で挟んではいない。ただし、羽根片27に関しては、ワイヤ10の巻線工程の段階またはその前の工程の段階で、基部片24aに対して折り重なるように折り曲げてあることが好ましい。巻線の邪魔にならないようにするためであるが、巻線の邪魔にならないのであれば、絶縁被膜の剥離工程の前段階までは、羽根片27に関しても、仮押さえ片25と同様に、基部片24aに対して、160度〜180度の角度で開いていても良い。   The temporary holding piece 25 is in an open state with respect to the base piece 24a at the stage of the winding process of the wire 10, and the lead portion 10a of the wire 10 is sandwiched between the temporary holding piece 25 and the base piece 24a. Not in. However, the blade piece 27 is preferably bent so as to be folded over the base piece 24a at the stage of the winding process of the wire 10 or at the stage of the previous process. This is to prevent the winding from getting in the way, but if it does not get in the way of the winding, the base part of the blade piece 27 is also similar to the temporary holding piece 25 until the previous stage of the insulating film peeling step. You may open at the angle of 160 to 180 degree | times with respect to the piece 24a.

コア8の巻芯部4に対するに対するワイヤ10の巻線工程では、フライヤー付き巻線装置などを用いる。まず、ワイヤ10における巻始め端に相当するリード部10aの先端を、一方の端子金具20の係止片28に巻き付けて、基部片24aに折り重ねてある羽根片27の上を通し、次に仮押さえ片25と基部片24aとの間の隙間を通し、巻芯部4の外周に沿って巻軸方向Xにワイヤ10を巻き付ける。   In the winding process of the wire 10 with respect to the core portion 4 of the core 8, a winding device with a fryer is used. First, the tip of the lead portion 10a corresponding to the winding start end of the wire 10 is wound around the locking piece 28 of one terminal fitting 20, passed over the blade piece 27 folded on the base piece 24a, The wire 10 is wound in the winding axis direction X along the outer periphery of the winding core portion 4 through the gap between the temporary holding piece 25 and the base piece 24a.

巻芯部4へのワイヤ10の巻回が終了した段階で、そのワイヤの巻き終わり端に相当するリード部10aを、他方の端子金具20における仮押さえ片25と基部片24aとの間の隙間を通し、基部片24aに折り重ねてある羽根片27の上を通し、最後に、他方の端子金具20の係止片28に巻き付ける。   At the stage where the winding of the wire 10 around the core 4 is completed, the lead 10a corresponding to the end of winding of the wire is connected to the gap between the temporary holding piece 25 and the base piece 24a in the other terminal fitting 20. Is passed over the blade piece 27 folded on the base piece 24a, and finally wound around the locking piece 28 of the other terminal fitting 20.

巻線工程において、仮押さえ片25が基部片24aに対して開いている場合には、仮押さえ片25を基部片24aの上に重ねるように折り曲げ、それらの間に挟まれているリード部10aを第2金具本体24に対して仮固定する。また、巻線工程において、羽根片27が基部片24aに対して開いていた場合には、巻線工程の終了後に、羽根片27を基部片24aに対して完全に折り重なるように折り曲げ、その上に、リード部10aの一部が位置するようにする。その状態を図1に示す。基部片24aに対して完全に折り重なるように折り曲げられた羽根片27の表面が、後述する接続予定部27aとなる。   In the winding process, when the temporary holding piece 25 is open with respect to the base piece 24a, the temporary holding piece 25 is bent so as to overlap the base piece 24a, and the lead portion 10a sandwiched therebetween. Is temporarily fixed to the second metal fitting body 24. In the winding process, if the blade piece 27 is open to the base piece 24a, the blade piece 27 is bent so as to be completely folded over the base piece 24a after the winding process is completed. In addition, a part of the lead portion 10a is positioned. The state is shown in FIG. A surface of the blade piece 27 bent so as to be completely folded with respect to the base piece 24a becomes a connection planned portion 27a described later.

このようにして巻線工程が終了した図1に示すコイル部品2は、図2に示す絶縁被膜の剥離装置100にセットされる。剥離装置100にセットされるコイル部品2では、巻線補助片26の第1金具本体22に対する折り曲げ角度θは、90度以上になるように調整される。折り曲げ角度θを、90度以上、好ましくは100〜120度に設定することで、図5(A)に示すように、端子金具20の接続予定部27aにリード部10aが接触しないように、リード部10bを接続予定部27aから持ち上げることができる。このような折り曲げ角度θの調整は、巻線工程の前に行っても良い。   The coil component 2 shown in FIG. 1 that has completed the winding process in this way is set in the insulating film peeling apparatus 100 shown in FIG. In the coil component 2 set in the peeling apparatus 100, the bending angle θ of the winding auxiliary piece 26 with respect to the first metal fitting body 22 is adjusted to be 90 degrees or more. By setting the bending angle θ to 90 degrees or more, preferably 100 to 120 degrees, as shown in FIG. 5 (A), the lead portion 10a does not come into contact with the planned connection portion 27a of the terminal fitting 20. The part 10b can be lifted from the connection scheduled part 27a. Such adjustment of the bending angle θ may be performed before the winding process.

図2に示す剥離装置100は、複数の剥離装置40を有することが好ましく、複数の剥離装置40が、Y軸方向に沿って所定間隔で配置してあることが好ましい。各剥離装置40は、一対のマイクロプリズム30の内のそれぞれを保持する一対のプリズム保持装置42を有する。一対のマイクロプリズム30が、各コイル部品2の巻軸(X軸)方向に沿って平行となり、且つプリズム30のY軸方向の両側に位置するように、プリズム保持装置42がX軸方向の両側に配置される。   The peeling device 100 shown in FIG. 2 preferably includes a plurality of peeling devices 40, and the plurality of peeling devices 40 are preferably arranged at predetermined intervals along the Y-axis direction. Each peeling device 40 includes a pair of prism holding devices 42 that hold each of the pair of microprisms 30. The prism holding devices 42 are arranged on both sides in the X-axis direction so that the pair of microprisms 30 are parallel to each other along the winding axis (X-axis) direction of each coil component 2 and on both sides of the prism 30 in the Y-axis direction. Placed in.

各プリズム保持装置42は、それぞれマイクロプリズム30を,X軸回りに回転調整自在に、且つX軸、Y軸およびZ軸方向に位置調整自在に保持する。各プリズム保持装置42による各マイクロプリズム30のX軸回りの回転角度の制御と、各マイクロプリズム30のX軸、Y軸およびZ軸方向に位置調整は、図3および図6に示すように、一方のマイクロプリズム30からコイル部品2のリード部10aに向けて照射されるレーザ光Lが、他方のマイクロプリズム30には入射しないように行われる。   Each prism holding device 42 holds the microprism 30 so that the microprism 30 can be rotated and adjusted around the X axis, and the position can be adjusted in the X axis, Y axis, and Z axis directions. As shown in FIGS. 3 and 6, control of the rotation angle around the X axis of each microprism 30 by each prism holding device 42 and position adjustment of each microprism 30 in the X axis, Y axis, and Z axis directions are as shown in FIGS. Laser light L emitted from one microprism 30 toward the lead portion 10a of the coil component 2 is performed so as not to enter the other microprism 30.

図2に示す複数の装置40に保持される複数のコイル部品2の各リード部10a(図2では図示省略してあるので図1参照)には、図4に示す光学系の単一のレーザ光源50を用いてレーザ光Lが照射される。レーザ光源50としては、たとえば波長λが532nmのSHGレーザが用いられるが、これに限定されず、その他のレーザ光源を用いても良い。   A single laser of the optical system shown in FIG. 4 is provided in each lead portion 10a of the plurality of coil components 2 held by the plurality of devices 40 shown in FIG. Laser light L is irradiated using the light source 50. As the laser light source 50, for example, an SHG laser having a wavelength λ of 532 nm is used, but the present invention is not limited to this, and other laser light sources may be used.

レーザ光源50から出射されたレーザ光Lは、ビーム拡大およびコリメータとしての機能を有するエキスパンダ52を通り、X軸ガルバノミラー54で反射され、Y軸ガルバノミラー56で反射または透過し、fθレンズ58を通して、各マイクロプリズム30に送られる。マイクロプリズム30に入射したレーザ光は、そこを通して、支持台60の上に設置してあるコイル部品2のY軸方向の両側に照射される。   The laser light L emitted from the laser light source 50 passes through an expander 52 having functions of beam expansion and collimator, is reflected by an X-axis galvano mirror 54, is reflected or transmitted by a Y-axis galvano mirror 56, and is an fθ lens 58. And sent to each microprism 30. The laser light incident on the microprism 30 is applied to both sides of the coil component 2 installed on the support base 60 in the Y-axis direction.

X軸ガルバノミラー54およびY軸ガルバノミラー56の角度を調整することで、単一のレーザ光源50から出射されたレーザ光Lは、図2に示す複数対のマイクロプリズム30の内の4つの照射位置S1〜S4の内のいずれかに順次に入射するようになっている。   By adjusting the angles of the X-axis galvanometer mirror 54 and the Y-axis galvanometer mirror 56, the laser light L emitted from the single laser light source 50 is irradiated with the four irradiations of the plurality of pairs of microprisms 30 shown in FIG. It sequentially enters any one of the positions S1 to S4.

図2に示す複数対のマイクロプリズム30の内の4つの照射位置S1〜S4の内のいずれに入射するかに関しては、たとえば最初は、図2の最も左側に位置する一対のマイクロプリズム30の内の第1照射位置S1にレーザ光Lを、0.5〜1.5秒間で照射する。その後に、直ぐに、第2照射位置S2に、レーザ光Lを第1照射位置S1での照射時間と同じ時間で照射し、順次、同様にして、第3照射位置S3および第4照射位置S4に照射する。   With regard to which of the four irradiation positions S1 to S4 of the plurality of pairs of microprisms 30 shown in FIG. 2 is incident, for example, initially, the inside of the pair of microprisms 30 positioned on the leftmost side in FIG. The first irradiation position S1 is irradiated with the laser beam L for 0.5 to 1.5 seconds. Immediately thereafter, the second irradiation position S2 is irradiated with the laser light L for the same time as the irradiation time at the first irradiation position S1, and sequentially, similarly, the third irradiation position S3 and the fourth irradiation position S4 are irradiated. Irradiate.

その後に、照射が終了した剥離装置40の隣に位置する剥離装置40に保持してある一対のマイクロプリズム30に対しても、同様にしてレーザ光を照射し、順次、照射が終了した剥離装置40の隣に位置する剥離装置40に保持してある一対のマイクロプリズム30に対して同様にしてレーザ光を照射する。   Thereafter, a pair of microprisms 30 held in the peeling device 40 located next to the peeling device 40 that has been irradiated are also irradiated with laser light in the same manner, and the peeling devices that have been irradiated in order. The pair of microprisms 30 held in the peeling device 40 located next to 40 is irradiated with laser light in the same manner.

このようにしてレーザ光Lをマイクロプリズム30の所定の照射位置S1〜S4に順次に照射していくことで、図1および図5(A)に示すコイル部品2における接続予定部27aのZ軸方向上に離れて位置するリード部10aに対して、図3および図6に示すように、Y軸方向の両側からレーザ光Lが、異なるタイミングで照射される。   By sequentially irradiating the laser beam L to the predetermined irradiation positions S1 to S4 of the microprism 30 in this way, the Z-axis of the connection scheduled portion 27a in the coil component 2 shown in FIGS. 1 and 5A. As shown in FIG. 3 and FIG. 6, the laser beam L is irradiated at different timings from both sides in the Y-axis direction to the lead portion 10 a positioned away in the direction.

本実施形態の方法によれば、たとえば図7(a)に示す絶縁被膜14が施されたワイヤ10のリード部10aを、図5(A)に示すように、端子金具20の接続予定部27aから持ち上げた状態で、図3および図6に示すように、リード部10aのY軸方向の両側からレーザ光Lを照射する。このため、端子金具20の接続予定部27aの近くに、溶接片や仮固定片などの障害物が存在してあったしても、それらの障害物を避けて、リード部10aのY軸方向両側にレーザ光Lを照射することが可能になる。   According to the method of the present embodiment, for example, the lead portion 10a of the wire 10 on which the insulating film 14 shown in FIG. 7A is applied is connected to the planned connection portion 27a of the terminal fitting 20 as shown in FIG. 5A. As shown in FIGS. 3 and 6, the laser beam L is irradiated from both sides of the lead portion 10a in the Y-axis direction. For this reason, even if there are obstacles such as welded pieces and temporarily fixed pieces near the planned connection portion 27a of the terminal fitting 20, avoid these obstacles and move the lead portion 10a in the Y-axis direction. It becomes possible to irradiate the laser beam L on both sides.

したがって本実施形態の方法では、図7(b)に示す絶縁被膜14の剥離残り14aや図7(c)に示す剥離カス14bの付着などの剥離不具合が生じ難くなり、図7(a)に示すように、必要な部分で、絶縁皮膜14を完全に除去できる。そのため、本実施形態の方法では、ワイヤ10の導線12の外周を完全に露出させることができ、絶縁被膜の剥離不具合を低減することが可能である。   Therefore, in the method according to the present embodiment, it is difficult to cause a peeling failure such as adhesion of the peeling residue 14a of the insulating film 14 shown in FIG. 7B or the peeling residue 14b shown in FIG. 7C. As shown, the insulating film 14 can be completely removed at necessary portions. Therefore, in the method of this embodiment, the outer periphery of the conducting wire 12 of the wire 10 can be completely exposed, and it is possible to reduce the peeling defect of the insulating coating.

また、図6に示すように、レーザ光Lが絶縁被膜14の全周に沿って略均一に照射されることから、レーザ光Lの出力の調整が容易になり、図7(d)に示すリード部10aの変形や断線(図示省略)が防止される。したがって、その後の工程において、リード部10aを端子金具20の接続予定部27aに接続する際に、ワイヤ10のリード部10aと端子電極20との接続の信頼性が向上する。   Further, as shown in FIG. 6, since the laser light L is irradiated substantially uniformly along the entire circumference of the insulating coating 14, the adjustment of the output of the laser light L becomes easy, as shown in FIG. Deformation and disconnection (not shown) of the lead portion 10a are prevented. Accordingly, when the lead portion 10a is connected to the connection scheduled portion 27a of the terminal fitting 20 in the subsequent process, the reliability of the connection between the lead portion 10a of the wire 10 and the terminal electrode 20 is improved.

なお、リード部10aを端子金具20の接続予定部27aに接続する際には、具体的には、たとえばまず、図5(B)に示すように、巻線補助片26の第1金具本体22に対しての折り曲げ角度θaを、図5(A)に示す角度θに対して小さくなるように変化させる。そのことにより、絶縁被膜14が除去されたリード部10aを端子金具20の接続予定部27aに最大限に接触(好ましくは押し付け)させることができる。その状態で、Z軸方向の上部から、絶縁膜剥離用レーザ光とは出力が異なるレーザ光を、接続予定部27aの表面に対して略垂直方向上から照射する。   When connecting the lead portion 10a to the scheduled connection portion 27a of the terminal fitting 20, specifically, for example, as shown in FIG. 5B, first, the first fitting main body 22 of the winding auxiliary piece 26 is used. The bending angle θa is changed so as to be smaller than the angle θ shown in FIG. As a result, the lead portion 10a from which the insulating coating 14 has been removed can be maximally contacted (preferably pressed) with the planned connection portion 27a of the terminal fitting 20. In this state, a laser beam having an output different from that of the laser beam for insulating film peeling is irradiated from above in the Z-axis direction from above in a direction substantially perpendicular to the surface of the connection scheduled portion 27a.

図5(B)に示す状態で、レーザ光を接続予定部27aの表面に対して垂直方向上から照射することで、図5(C)に示すように、リード部10aにおいて絶縁被膜14が除去された導線12と羽根片27とが溶融して溶接部10bが形成され、リード部10aの導線12が羽根片27に対して強固に接続され、導線12と端子金具20との電気的接続が達成される。   In the state shown in FIG. 5B, the insulating film 14 is removed from the lead portion 10a as shown in FIG. 5C by irradiating the surface of the connection-scheduled portion 27a with laser light from above in the vertical direction. The welded wire 12 and the blade piece 27 are melted to form the welded portion 10b, the lead wire 12 of the lead portion 10a is firmly connected to the blade piece 27, and the electrical connection between the wire 12 and the terminal fitting 20 is established. Achieved.

同時に、端子金具20の巻線補助片26の弾性力などにより、余分なリード部10a’は、溶接部10bから自動的に離れる。その後に、巻線補助片26は、第1金具本体22との折り曲げ部付近で、第1金具本体22から切断されて除去される。同時に、余分なリード部10a’も、巻線補助片26と共にコイル部品2から除去される。巻線補助片26は、コイル部品2が完成した後には、一般には不要となる部分なので除去される。   At the same time, due to the elastic force of the winding auxiliary piece 26 of the terminal fitting 20, the excessive lead portion 10a 'is automatically separated from the welded portion 10b. Thereafter, the winding auxiliary piece 26 is cut and removed from the first metal fitting body 22 in the vicinity of the bent portion with the first metal fitting body 22. At the same time, the excessive lead portion 10 a ′ is also removed from the coil component 2 together with the winding auxiliary piece 26. Since the coil auxiliary piece 26 is generally an unnecessary part after the coil component 2 is completed, the winding auxiliary piece 26 is removed.

このように本実施形態の方法では、端子金具20の第1金具本体22に巻線補助片26が形成してあることで、ワイヤ10の巻線作業が容易になると共に、しかも、この巻線補助片26を利用して、端子金具20の接続予定部27aからリード部10aを持ち上げ、その後に、リード部10aを端子金具20の接続予定部27aに接触させる作業が容易になる。   As described above, in the method of the present embodiment, the winding auxiliary piece 26 is formed on the first metal fitting body 22 of the terminal metal fitting 20, so that the wire 10 can be easily wound, and this winding Using the auxiliary piece 26, the lead portion 10a is lifted from the connection planned portion 27a of the terminal fitting 20, and thereafter, the operation of bringing the lead portion 10a into contact with the connection planned portion 27a of the terminal fitting 20 is facilitated.

なお、羽根片27は、従来では、ワイヤ10のリード部10aの上から覆うための部分であり、リード部10aの両側からレーザ光を照射する際に、レーザ光の邪魔になっていた部分である。その邪魔になっていた羽根片27を、第2金具本体24に対して折りたたみ、折りたたむことで形成される羽根片27の表面を接続予定部27aにすることで、障害物を避けて、リード部10aの両側にレーザ光Lを照射することが容易になる。なお、羽根片27自体を除去する構造も考えられるが、羽根片27自体を除去する構造に比較して、巻線補助片26の折り曲げ角度θaを調整するのみで、リード部10aを端子金具20の接続予定部27aに安定して接触させ易く、リード部10aと端子金具20との接続が確実である。   The blade piece 27 is a portion that is conventionally covered from above the lead portion 10a of the wire 10, and is a portion that obstructs the laser light when the laser beam is irradiated from both sides of the lead portion 10a. is there. The surface of the blade piece 27 that is formed by folding and folding the blade piece 27 that has been obstructed with respect to the second metal fitting body 24 is used as a connection-scheduled portion 27a, thereby avoiding an obstacle and leading the lead portion. It becomes easy to irradiate the laser beam L on both sides of 10a. In addition, although the structure which removes blade piece 27 itself is also considered, compared with the structure which removes blade piece 27 itself, only by adjusting bending angle (theta) a of the coil auxiliary piece 26, the lead | read | reed part 10a is attached to the terminal metal fitting 20. Therefore, the lead portion 10a and the terminal fitting 20 are securely connected to each other.

また本実施形態では、端子金具20の第2金具本体24には、金具本体24に対して折曲自在に一体化される仮押さえ片25が形成してあり、仮押さえ片25と金具本体24との間で、リード部10aの途中を仮押さえ片25において仮保持可能になっており、リード部10aの長手方向に沿って仮押さえ片25と巻線補助片26との間に、折り畳まれた羽根片27の接続予定部27aが位置する。   In the present embodiment, the second metal fitting body 24 of the terminal metal fitting 20 is formed with a temporary holding piece 25 that is foldably integrated with the metal fitting main body 24, and the temporary holding piece 25 and the metal fitting body 24. The temporary holding piece 25 can be temporarily held in the middle of the lead portion 10a and is folded between the temporary holding piece 25 and the winding auxiliary piece 26 along the longitudinal direction of the lead portion 10a. The scheduled connection portion 27a of the blade piece 27 is located.

このような構造の場合には、第1金具本体22に対する巻線補助片26の折曲角度θまたはθaを調節することで、接続予定部27aからリード部10aを持ち上げ、または、リード部10aを端子金具20の接続予定部27aに接触させる作業が容易になる。   In the case of such a structure, by adjusting the bending angle θ or θa of the winding auxiliary piece 26 with respect to the first metal fitting body 22, the lead portion 10 a is lifted from the planned connection portion 27 a or the lead portion 10 a is The operation | work made to contact the connection plan part 27a of the terminal metal fitting 20 becomes easy.

さらに本実施形態では、図2に示すように、各コイル部品2のY軸方向の両側には、それぞれマイクロプリズム30が配置され、各マイクロプリズム30を通して、図に示す単一のレーザ光源50からのレーザ光Lを、異なるタイミングでリード部10aの両側に照射する。マイクロプリズム30を用いることで、複数のレーザ光源が不要となり経済的である。また特に、図2に示すように、複数のコイル部品2のワイヤ被覆をまとめて姿勢変更することなく、図4に示すミラー54および56の角度を制御するのみで、絶縁被膜の除去作業が容易になる。   Furthermore, in the present embodiment, as shown in FIG. 2, microprisms 30 are arranged on both sides of each coil component 2 in the Y-axis direction, and each microprism 30 is passed through a single laser light source 50 shown in the drawing. Are irradiated on both sides of the lead portion 10a at different timings. Use of the microprism 30 eliminates the need for a plurality of laser light sources and is economical. In particular, as shown in FIG. 2, it is easy to remove the insulation coating by controlling the angles of the mirrors 54 and 56 shown in FIG. 4 without changing the posture of the wire covering of the plurality of coil parts 2 at once. become.

さらに、リード部10aの両側には、各マイクロプリズム30を通して、単一のレーザ光源からのレーザ光を、異なるタイミングで照射するように構成することで、リード部10aへの熱負荷を低減することが可能になる。そのため、リード部10aの変形や断線を有効に防止することができ、しかも、リード部10aの全周に亘り略均一にレーザ光を照射し、絶縁被膜14の全周剥離が確実になる。   Furthermore, it is possible to reduce the thermal load on the lead portion 10a by irradiating laser light from a single laser light source at different timings through the microprisms 30 on both sides of the lead portion 10a. Is possible. Therefore, the deformation and disconnection of the lead portion 10a can be effectively prevented, and the laser beam is irradiated substantially uniformly over the entire circumference of the lead portion 10a, and the entire circumference of the insulating coating 14 is surely peeled off.

しかも本実施形態では、リード部10aの両側に配置してある一対のマイクロプリズム30は、一方のマイクロプリズム30からリード部10aに向けて照射されるレーザ光Lが、他方のマイクロプリズム30には入射しないように配置してある。そのため、一方のマイクロプリズム30からのレーザ光が他方のマイクロプリズム30へ入射せず、レーザ光Lが光路を逆向きに辿ってレーザ光源50を損傷することを有効に防止できる。   In addition, in the present embodiment, the pair of microprisms 30 disposed on both sides of the lead portion 10 a is irradiated with the laser light L emitted from one microprism 30 toward the lead portion 10 a, and the other microprism 30 is irradiated with the laser beam L. It arrange | positions so that it may not enter. Therefore, the laser light from one microprism 30 does not enter the other microprism 30, and the laser light L can be effectively prevented from following the optical path in the reverse direction and damaging the laser light source 50.

なお、本発明は、上述した実施形態に限定されるものではなく、本発明の範囲内で種々に改変することができる。
たとえば、上述した実施形態では、コイル部品の製造方法に用いられるワイヤの継線方法について説明したが、本発明に係るワイヤの継線方法は、コイル部品以外に、トランス、ヒーター、リードリレー、抵抗やコンデンサ等のリード付き受動部品、小型コネクタなどの電子部品におけるリード部と端子電極との接合方法にも適用することができる。
The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.
For example, in the above-described embodiment, the wire connecting method used in the coil component manufacturing method has been described. However, the wire connecting method according to the present invention includes a transformer, a heater, a reed relay, a resistor in addition to the coil component. The present invention can also be applied to a method of joining lead portions and terminal electrodes in passive components with leads such as capacitors and electronic components such as small connectors.

2… コイル部品
4… 巻芯部
6… 鍔部
8… コア
10… ワイヤ
10a… リード部
12… 導線
14… 絶縁被膜
20… 端子金具
22… 第1金具本体
24… 第2金具本体
25… 仮押さえ片
26… 巻線補助片
27… 羽根片
27a… 接続予定部
30… マイクロプリズム
40,100… 剥離装置
50… レーザ光源
DESCRIPTION OF SYMBOLS 2 ... Coil parts 4 ... Core part 6 ... Eaves part 8 ... Core 10 ... Wire 10a ... Lead part 12 ... Conductor 14 ... Insulation coating 20 ... Terminal metal fitting 22 ... First metal fitting main body 24 ... Second metal fitting main body 25 ... Temporary presser Piece 26 ... Winding auxiliary piece 27 ... Blade piece 27a ... Connection scheduled part 30 ... Micro prism 40, 100 ... Stripping device 50 ... Laser light source

Claims (9)

絶縁被膜が施されたワイヤのリード部を、端子金具の接続予定部から持ち上げた状態で、前記リード部の両側にレーザを照射し、前記リード部の外周に形成してある絶縁被膜を除去する工程と、
前記絶縁被膜が除去された前記リード部を前記端子金具の接続予定部に接触させ、前記リード部を前記端子金具の接続予定部に接続する工程とを有する
コイル部品の製造方法。
In the state where the lead portion of the wire coated with the insulating coating is lifted from the connection portion of the terminal fitting, the both sides of the lead portion are irradiated with laser to remove the insulating coating formed on the outer periphery of the lead portion. Process,
A method of manufacturing a coil component, comprising: bringing the lead portion from which the insulating coating has been removed into contact with a planned connection portion of the terminal fitting, and connecting the lead portion to the planned connection portion of the terminal fitting.
前記端子金具の金具本体には、前記リード部の先端が仮止めされる巻線補助片が形成してあり、前記金具本体に対する前記巻線補助片の折曲角度を調節することで、前記端子金具の接続予定部から前記リード部を持ち上げ、または、前記リード部を前記端子金具の接続予定部に接触させることを特徴とする請求項1に記載のコイル部品の製造方法。   A winding auxiliary piece for temporarily fixing the tip of the lead portion is formed on the metal fitting body of the terminal metal fitting, and the terminal is adjusted by adjusting a bending angle of the winding auxiliary piece with respect to the metal fitting body. The method of manufacturing a coil component according to claim 1, wherein the lead part is lifted from a connection planned part of the metal fitting, or the lead part is brought into contact with the connection planned part of the terminal metal fitting. 前記リード部を前記端子金具の接続予定部に接続した後は、前記巻線補助片が前記端子金具から除去される請求項2に記載のコイル部品の製造方法。   3. The method of manufacturing a coil component according to claim 2, wherein after the lead portion is connected to the connection scheduled portion of the terminal fitting, the winding auxiliary piece is removed from the terminal fitting. 前記端子金具の接続予定部は、前記金具本体に対して折曲自在に一体化された羽根片を前記金具本体に対して折りたたむことで形成される前記羽根片の表面である請求項1〜3のいずれかに記載のコイル部品の製造方法。   The connection scheduled portion of the terminal metal fitting is a surface of the blade piece formed by folding a blade piece integrated with the metal fitting body so as to be foldable with respect to the metal fitting body. The manufacturing method of the coil components in any one of. 前記端子金具の金具本体には、前記金具本体に対して折曲自在に一体化される仮押さえ片が形成してあり、前記仮押さえ片と前記金具本体との間で、前記リード部の途中を仮押さえ片において仮保持可能になっており、前記リード部の長手方向に沿って前記仮押さえ片と前記巻線補助片との間に、前記接続予定部が位置する請求項1〜4のいずれかに記載のコイル部品の製造方法。   The metal fitting body of the terminal fitting is formed with a temporary holding piece that is foldable and integrated with the metal fitting body, and the intermediate portion of the lead portion between the temporary holding piece and the metal fitting body. The temporary connection piece can be temporarily held, and the connection-scheduled portion is located between the temporary hold piece and the auxiliary winding piece along the longitudinal direction of the lead portion. The manufacturing method of the coil components in any one. 前記リード部の両側には、それぞれマイクロプリズムが配置され、前記リード部の両側には、各マイクロプリズムを通して、単一のレーザ光源からのレーザ光を、異なるタイミングで照射することを特徴とする請求項1〜5のいずれかに記載のコイル部品の製造方法。   The microprisms are respectively disposed on both sides of the lead part, and laser light from a single laser light source is irradiated at different timings through the microprisms on both sides of the lead part. Item 6. A method for manufacturing a coil component according to any one of Items 1 to 5. 前記リード部の両側に配置してある一対のマイクロプリズムは、一方のマイクロプリズムから前記リード部に向けて照射されるレーザ光が、他方のマイクロプリズムには入射しないように配置してある請求項6に記載のコイル部品の製造方法。   The pair of microprisms arranged on both sides of the lead part is arranged so that laser light emitted from one microprism toward the lead part does not enter the other microprism. 6. A method for manufacturing a coil component according to 6. 前記絶縁被膜が除去された前記リード部を前記端子金具の接続予定部に接触させた後、前記端子金具の接続予定部である表面に対して略垂直方向からレーザ光を照射することで、前記リード部を前記端子金具の接続予定部に接続する請求項1〜7のいずれかに記載のコイル部品の製造方法。   By bringing the lead portion from which the insulating coating has been removed into contact with the connection planned portion of the terminal metal fitting, by irradiating the surface of the terminal metal fitting connection portion with a laser beam from a substantially vertical direction, The manufacturing method of the coil component in any one of Claims 1-7 which connects a lead part to the connection plan part of the said terminal metal fitting. 絶縁被膜が施されたワイヤのリード部を、端子金具の接続予定部から持ち上げた状態で、前記リード部の両側にレーザを照射し、前記リード部の外周に形成してある絶縁被膜を除去する工程と、
前記絶縁被膜が除去された前記リード部を前記端子金具の接続予定部に接触させ、前記リード部を前記端子金具の接続予定部に接続する工程とを有する
ワイヤの継線方法。
In the state where the lead portion of the wire coated with the insulating coating is lifted from the connection portion of the terminal fitting, the both sides of the lead portion are irradiated with laser to remove the insulating coating formed on the outer periphery of the lead portion. Process,
Connecting the lead portion from which the insulating coating has been removed to the connection planned portion of the terminal fitting, and connecting the lead portion to the connection planned portion of the terminal fitting.
JP2012033271A 2012-02-17 2012-02-17 Coil parts manufacturing method and wire connecting method Active JP5652413B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012033271A JP5652413B2 (en) 2012-02-17 2012-02-17 Coil parts manufacturing method and wire connecting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012033271A JP5652413B2 (en) 2012-02-17 2012-02-17 Coil parts manufacturing method and wire connecting method

Publications (2)

Publication Number Publication Date
JP2013171880A true JP2013171880A (en) 2013-09-02
JP5652413B2 JP5652413B2 (en) 2015-01-14

Family

ID=49265675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012033271A Active JP5652413B2 (en) 2012-02-17 2012-02-17 Coil parts manufacturing method and wire connecting method

Country Status (1)

Country Link
JP (1) JP5652413B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017168538A (en) * 2016-03-14 2017-09-21 Tdk株式会社 Coil device
CN107437463A (en) * 2016-05-25 2017-12-05 株式会社村田制作所 Coil component manufacture method and coil component manufacture device
JP2018148079A (en) * 2017-03-07 2018-09-20 株式会社村田製作所 Coil component
CN109741935A (en) * 2019-03-12 2019-05-10 广西岑科电子工业有限公司 A kind of inductance coil spooling equipment
JP2019216263A (en) * 2016-08-02 2019-12-19 太陽誘電株式会社 Manufacturing method for coil component
US10861638B2 (en) 2017-03-07 2020-12-08 Murata Manufacturing Co., Ltd. Coil component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01295609A (en) * 1988-05-24 1989-11-29 Matsushita Electric Ind Co Ltd Insulating covering film removing method and device
JP2006121013A (en) * 2004-10-25 2006-05-11 Tdk Corp Manufacturing method of coil component
JP2009016502A (en) * 2007-07-03 2009-01-22 Tdk Corp Wire coating separation method, manufacturing method of coil component, wire coating separation device, and manufacturing device of coil component
JP2010034338A (en) * 2008-07-30 2010-02-12 Tdk Corp Relaying method and relaying structure of coil component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01295609A (en) * 1988-05-24 1989-11-29 Matsushita Electric Ind Co Ltd Insulating covering film removing method and device
JP2006121013A (en) * 2004-10-25 2006-05-11 Tdk Corp Manufacturing method of coil component
JP2009016502A (en) * 2007-07-03 2009-01-22 Tdk Corp Wire coating separation method, manufacturing method of coil component, wire coating separation device, and manufacturing device of coil component
JP2010034338A (en) * 2008-07-30 2010-02-12 Tdk Corp Relaying method and relaying structure of coil component

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017168538A (en) * 2016-03-14 2017-09-21 Tdk株式会社 Coil device
CN107437463A (en) * 2016-05-25 2017-12-05 株式会社村田制作所 Coil component manufacture method and coil component manufacture device
CN107437463B (en) * 2016-05-25 2020-04-17 株式会社村田制作所 Coil component manufacturing method and coil component manufacturing apparatus
JP2019216263A (en) * 2016-08-02 2019-12-19 太陽誘電株式会社 Manufacturing method for coil component
JP2018148079A (en) * 2017-03-07 2018-09-20 株式会社村田製作所 Coil component
US10720273B2 (en) 2017-03-07 2020-07-21 Murata Manufacturing Co., Ltd. Coil component
US10861638B2 (en) 2017-03-07 2020-12-08 Murata Manufacturing Co., Ltd. Coil component
CN109741935A (en) * 2019-03-12 2019-05-10 广西岑科电子工业有限公司 A kind of inductance coil spooling equipment
CN109741935B (en) * 2019-03-12 2024-02-09 广西岑科电子工业有限公司 Inductance coil winding equipment

Also Published As

Publication number Publication date
JP5652413B2 (en) 2015-01-14

Similar Documents

Publication Publication Date Title
JP5652413B2 (en) Coil parts manufacturing method and wire connecting method
JP4184395B2 (en) Coil component and method for manufacturing coil component
US10388453B2 (en) Coil component
JP2008010752A (en) Coil parts
JP4844848B2 (en) Connection structure of electronic components
JP6604295B2 (en) Coil parts manufacturing method
JP4312409B2 (en) Common mode filter
US10262787B2 (en) Coil component
US10163559B2 (en) Coil component
CN108335821B (en) coil element
JP2006121013A (en) Manufacturing method of coil component
JP5019132B2 (en) Coil component connection method and connection structure
JP4836056B2 (en) Coil component manufacturing method and coil component manufacturing apparatus
JP4275120B2 (en) Coil parts manufacturing method and manufacturing apparatus
JP7286936B2 (en) Coil devices, pulse transformers and electronic components
US20190269020A1 (en) System and method for connecting flat flexible cable to printed circuit board
JPS642411Y2 (en)
JP2000295821A (en) Arrangement of pairs of conductors, method of joining ends of pairs of conductors, and method of manufacturing windings of rotating electrical machine using the same
JP2000091146A (en) Wire connecting structure of electric or electronic component
JPH11149951A (en) Joined body of flexible wire distribution body
WO2016068260A1 (en) Printed circuit board, method for producing printed circuit board, and method for bonding conductive member
CN107112641B (en) Connection structure of coaxial cable
JP2003086260A (en) Terminal junction structure of covered electric wire and its jointing method
CN117616518A (en) Bonded body and method for manufacturing the bonded body
CN105449915B (en) Motor and method of energization crimping

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130918

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140129

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140204

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140328

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141021

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141103

R150 Certificate of patent or registration of utility model

Ref document number: 5652413

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250