JP2013012542A - Crimp apparatus and temperature control method - Google Patents

Abstract

The present invention provides a technique capable of appropriately performing temperature control on a workpiece to be heat-treated.
The temperature of a workpiece clamped by an upper clamper unit and a lower clamper unit is controlled. First, the workpiece W is clamped by the upper clamper 27 and the lower clamper 28 provided with the cooling unit 32 and the heating unit 33 in this order from the clamp surface 27a side. Next, heating is continued by the temperature control mechanism 61 having the cooling unit 32 and the heating unit 33. Here, in the temperature control mechanism 61, the on operation and the off operation of the cooling unit 32 are repeated while the heating unit 33 is turned on.
[Selection] Figure 3

Description

  The present invention relates to a crimping apparatus and a temperature control method, and more particularly to a technique effectively applied to temperature control (temperature adjustment) when a workpiece is clamped and each member is crimped in the crimping apparatus.

  Japanese Patent Laid-Open No. 2004-47670 (Patent Document 1) discloses a flip in which a substrate is sucked and held on a stage, a flip chip held by chip suction is pressurized on the substrate while being heated, and the substrate is forcibly cooled from the stage side at the same time. A chip mounting method is disclosed.

JP 2004-47670 A

  When an electronic component such as a semiconductor chip or a capacitor chip is mounted on a substrate such as a wiring board or semiconductor substrate, the connection terminals (for example, connection bumps) of the electronic component and the connection terminals (for example, connection pads) of the substrate are surely electrically connected. Need to be connected to. In addition, in order to protect and electrically isolate the connection terminals, an insulating resin (for example, an adhesive layer) may be provided between the electronic component and the substrate to ensure connection reliability. As the connection bump, for example, a metal bump such as a solder bump or a gold bump is used. Moreover, as a connection pad, metal pads, such as copper or its alloy, are used, for example. As the adhesive layer, for example, NCF (Non Conductive Film) or NCP (Non Conductive Paste) is used.

  For example, a plurality of semiconductor chips are stacked on a wiring board via an adhesive layer, and the wiring board and the plurality of semiconductor chips are collectively pressure-bonded (finally bonded) to a work that has been temporarily pressure-bonded (temporarily bonded). In this case, the connection bumps of the semiconductor chip are heated until they are melted, and then pressed to be electrically connected to the connection pads of the wiring board.

  However, for example, when the time until the adhesive layer is hardened is shorter than the time until the connection bump melts, the adhesive layer is connected before the connection bump and the connection pad are electrically connected (joined). May harden and cause poor connection (for example, no connection between connection terminals). In addition, when the heating time for the workpiece becomes long, depending on the adhesive layer, fine air mixed in advance may expand or foam due to heating, which may cause connection failure (for example, peeling of the semiconductor chip from the wiring board).

  The objective of this invention is providing the technique which can perform temperature control appropriately with respect to the workpiece | work which heat-processes. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows. A crimping apparatus according to an embodiment of the present invention is a crimping apparatus that includes a pair of clamper portions that clamp a workpiece, and that crimps each member of the workpiece by heating and pressing the workpiece while the workpiece is clamped by the pair of clamper portions. One of the clamper portions is provided with a temperature sensor provided on the clamp surface side, a cooling portion provided away from the temperature sensor from the clamp surface side, and provided away from the cooling portion from the clamp surface side. A heating unit that controls the temperature of the workpiece by on / off controlling the cooling unit and the heating unit based on a detection value of the temperature sensor.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the embodiment, the heat of the heating unit can be blocked by the cooling unit closer to the work piece than the heating unit, and the temperature can be quickly controlled. Can be performed appropriately.

It is sectional drawing which shows typically the crimping | compression-bonding apparatus provided with the temperature control mechanism in one Embodiment of this invention. It is sectional drawing which shows typically the crimping | compression-bonding apparatus provided with the temperature control mechanism in operation | movement following FIG. It is sectional drawing which shows typically the crimping | compression-bonding apparatus provided with the temperature control mechanism in operation | movement following FIG. It is a figure for demonstrating the temperature control function of the crimping | compression-bonding apparatus of FIG. It is sectional drawing which shows typically the crimping | compression-bonding apparatus provided with the temperature control mechanism in other embodiment of this invention. It is sectional drawing which shows typically the crimping | compression-bonding apparatus provided with the temperature control mechanism in operation | movement following FIG. It is sectional drawing which shows typically the crimping | compression-bonding apparatus provided with the temperature control mechanism in operation | movement following FIG. It is sectional drawing which shows typically the semiconductor device in the manufacturing process in one Embodiment of this invention. FIG. 9 is a cross-sectional view schematically showing the semiconductor device in the manufacturing process following FIG. 8. FIG. 10 is a cross-sectional view schematically showing the semiconductor device in the manufacturing process following FIG. 9.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof may be omitted.

(Embodiment 1)
In the crimping apparatus having the temperature control mechanism according to the first embodiment of the present invention, a workpiece including a plurality of stacked members is sandwiched between an upper clamper portion and a lower clamper portion (a pair of clamper portions) provided to face each other. Clamp and crimp each member.

  First, the workpiece | work in this embodiment is demonstrated with reference to FIGS. The principal part of the workpiece | work W of the state after clamping from before clamping to FIGS. 8-10 is shown.

  The workpiece W is obtained by stacking the semiconductor chip 3 on the wiring board 2 as a plurality of stacked members. A plurality of semiconductor chips 3 are arranged in alignment on the wiring board 2. In FIG. 8 to FIG. 10, for clarity of explanation, one semiconductor chip 3 on the wiring board 2 is used as a main part. Show.

  The work W shown in FIG. 8 is formed by aligning a plurality of connection pads 5 (for example, copper pads) exposed from the insulating layer 8 (for example, solder resist) and a plurality of corresponding connection bumps 6 (for example, solder bumps). The semiconductor chip 3 is temporarily pressed (temporarily bonded) onto the substrate 2 via, for example, a thermosetting resin adhesive layer 4 (for example, NCF or NCP). The workpiece W shown in FIG. 9 is in a state where the corresponding connection pads 5 and the connection bumps 6 are in contact with each other. In the workpiece W shown in FIG. 10, the corresponding connection pads 5 and connection bumps 6 are electrically bonded (flip chip bonding), and the semiconductor chip 3 is pressure-bonded onto the wiring substrate 2 via the adhesive layer 4. It is.

  Next, the crimping apparatus provided with the temperature control mechanism in the present embodiment will be described with reference to FIGS. 1 to 3 show the crimping apparatus 1 in a series of operating states.

  The crimping device 1 includes an upper die 11 and a lower die 12 that are provided facing each other in the vertical direction (die opening / closing direction) and sandwich the workpiece W therebetween. The upper die 11 is fixedly assembled to the central portion of the movable platen 13, and the lower die 12 is fixedly assembled to the central portion of the fixed platen 14. The movable platen 13 and the fixed platen 14 are connected to each other by a plurality of tie bars 15. For example, if the movable platen 13 and the fixed platen 14 are rectangular plates, they are connected at the four corners. The fixed platen 14 is fixed to the tie bar 15, and the movable platen 13 is configured to slide with the tie bar 15. Further, the movable platen 13 and the fixed platen 14 are configured so that the parallelism of the surfaces facing each other is maintained. Note that the casing portion composed of the movable platen 13, the fixed platen 14, and the tie bar 15 is also called a die set.

  The movable platen 13 can be moved up and down (movable up and down) by a drive unit 19 (for example, a cylinder). As a result, the upper mold 11 can be raised and lowered with respect to the lower mold 12. Due to the vertical positional relationship between the movable platen 13 and the fixed platen 14, the workpiece W is supplied (loaded) between the upper die 11 and the lower die 12 in a state where the upper die 11 and the lower die 12 are separated and opened. (See FIG. 1). Further, when the upper mold 11 and the lower mold 12 are close to each other and are closed, a sealed space 16 (chamber) is formed (see FIGS. 2 and 3). In addition, since the parallelism of the mutually opposing surface of the movable platen 13 and the fixed platen 14 is maintained, the upper mold | type 11 and the lower mold | type 12 are also comprised so that the parallelism of the mutually opposing surface may be maintained.

  In such an upper mold 11, the crimping apparatus 1 includes an upper clamper portion 27 having a temperature control mechanism 61 and an upper seal portion 42. In the lower mold 12, the crimping device 1 includes a lower clamper portion 28, a leveling portion 29, a push block 30 (push portion), a guide portion 26, and a lower seal portion 43. Furthermore, the crimping device 1 includes a pressure adjusting unit 47 outside the upper mold 11 and the lower mold 12.

  The upper clamper unit 27 and the lower clamper unit 28 are provided to face each other. In the present embodiment, the lower clamper unit 28 can be moved up and down with respect to the upper clamper unit 27. The work 28 is sandwiched and clamped by the portion 28. The lower clamper unit 28 can be moved up and down by a drive unit (not shown) configured by an air cylinder or the like provided below the push block 30.

  The upper seal portion 42 and the lower seal portion 43 are provided to face each other, and are in contact with each other to form the sealed space 16 (see FIGS. 2 and 3). The upper seal portion 42 and the lower seal portion 43 include the upper clamper portion 27 and the lower clamper portion 28, respectively. Further, the lower seal portion 43 includes a leveling portion 29, a push block 30, and a guide portion 26.

  The push block 30 is pushed up by a drive unit (not shown) when the lower clamper unit 28 is moved up and down (moved up and down) with respect to the upper clamper unit 27. Further, the leveling portion 29 is provided between the lower clamper portion 28 and the push block 30 and clamps the lower clamper portion 28 against the lower surface of the spacer block 22 (or the clamp surface 27a of the upper base block 21) described later. It is provided to smoothly move up and down while maintaining the surface 28a in parallel. Further, the guide portion 26 guides when the lower clamper portion 28 moves up and down. The pressure adjusting unit 47 adjusts (controls) the pressure of, for example, compressed air filled in the sealed space 16. The mechanism including the push block 30, the leveling portion 29, and the guide portion 26 is also referred to as a parallel lifting mechanism because the lower clamper portion 28 is lifted and lowered in parallel.

  Before describing the details of the upper clamper portion 27, the lower clamper portion 28, the upper seal portion 42, the lower seal portion 43, the leveling portion 29, the push block 30, the guide portion 26, and the pressure adjusting portion 47, first, the upper mold 11 and the components of the lower mold 12 will be outlined.

  The upper mold 11 includes a fixed block 17, a plurality of posts 18 (post-like blocks), an upper base block 21, a spacer block 22, and an upper seal block 23. These blocks are made of alloy tool steel, for example. A fixed block 17 is fixed and assembled under the movable platen 13. A plurality of posts 18 are arranged under the fixed block 17 so as to stand downward and fixedly assembled. The upper base block 21 is fixed and assembled at the front end surfaces of the plurality of posts 18. A cylindrical upper seal block 23 in which a through hole 23a is formed is fixed and assembled to the outer peripheral portion on the lower surface side of the upper base block 21. In addition, a spacer block 22 is fixedly assembled to the lower base portion of the upper base block 21.

  The lower mold 12 has a lower base block 24 and a lower seal block 25. These blocks are made of alloy tool steel, for example. On the fixed platen 14, a cylindrical lower base block 24 having a through hole 24a is fixed and assembled. A cylindrical lower seal block 25 communicating with the through-hole 24a and having a through-hole 25a having a larger inner diameter is fixed and assembled to the outer peripheral portion on the upper surface side of the lower base block 24. A cylindrical guide portion 26 is concentrically fitted into the through hole 25 a of the lower seal block 25 and is fixedly assembled to the inner peripheral side of the upper surface of the lower base block 24.

  The upper clamper 27 and the lower clamper 28 sandwich and clamp the work W and heat and press. The upper clamper 27 is provided at the center of the upper base block 21. The upper clamper unit 27 includes a plurality of temperature sensors 31, a cooling unit 32, and a heating unit 33 arranged (built in) in this order in a direction away from the clamp surface 27a side of the upper clamper unit 27. On the basis of the detected value 31, the temperature of the workpiece W (see FIG. 3) clamped by on / off control of the cooling unit 32 and the heating unit 33 is controlled (adjusted). That is, the upper clamper unit 27 includes a cooling unit 32 provided on the clamp surface 27a side to control the temperature of the clamped workpiece W, and a heating unit provided far from the cooling unit 32 from the clamp surface 27a side. And a temperature control mechanism 61 having the number 33.

  In the present embodiment, the spacer block 22 directly clamps the workpiece W. However, a description will be given assuming that the clamp surface 27 a is formed at the center of the upper base block 21. This is because the spacer block 22 is provided by being adjusted according to the thickness of the workpiece W, and may be unnecessary depending on the thickness of the workpiece W.

  The heating unit 33 included in the upper clamper unit 27 includes a plurality of heaters 35 extending (extending) in parallel with the clamp surface 27a of the upper clamper unit 27 in order to improve the heating capability. The heating capacity of the heater 35 is a temperature at which the connection bumps 6 (solder) of the semiconductor chip 3 are melted in consideration of the heat capacity of members such as the upper base block 21 and the adhesive layer 4 (NCF or NCP) is used. It is necessary that the temperature for heat curing be applied to the clamped workpiece W. The melting point of the solder used in this embodiment is, for example, about 250 to 260 ° C. The melting point of NCF or NCP is, for example, about 200 ° C. to 260 ° C., and is cured by heating and pressurizing for a predetermined time.

  The cooling unit 32 included in the upper clamper unit 27 extends (extends) in parallel with the clamp surface 27a of the upper clamper unit 27, and includes a plurality of cooling pipes 34 through which gas or liquid refrigerant circulates. Yes. In the crimping apparatus 1, for example, in a state where the heating unit 33 is turned on with respect to the clamped workpiece W, the cooling unit 32 is repeatedly turned on and off to maintain a predetermined temperature for the workpiece W for a predetermined time. Thus, the heating temperature is controlled. For this reason, by providing the cooling unit 32 on the clamp surface 27a side closer to the workpiece W than the heating unit 33, the temperature applied to the workpiece W by the on / off operation of the cooling unit 32 can be easily followed.

  Specifically, the temperature control mechanism 61 stops the flow of the refrigerant when the cooling unit 32 is in the off operation, and causes the refrigerant to flow during the on operation. Since the on / off operation of the cooling unit 32 is switching of the flow by the movement of the refrigerant, it can be easily and quickly controlled. Although a Peltier element may be used as the cooling unit 32, the pressure bonding apparatus 1 has a structure in which the workpiece W is heated by the heating unit 33 arranged farther from the clamp surface 27 a than the cooling unit 32. The temperature can be controlled by cooling or heating the clamp surface 27a more quickly than using the circulating cooling pipe 34.

  Here, in order to explain the temperature control mechanism 61 (temperature control method) of the crimping apparatus 1 for the clamped workpiece W, FIG. 4 shows an example of the elapsed time-work temperature (t-T) characteristic. When the workpiece W placed on the lower clamper portion 28 is clamped by being sandwiched between the upper clamper portion 27 and the lower clamper portion 28 that are preheated by the heating portion 33 (for example, set to 300 ° C.), the workpiece W The temperature rises.

  In the temperature control mechanism 61, the workpiece is continuously heated from the side of the upper clamp part 27 having the cooling part 32 and the heating part 33 so as to be within a range R (eg, ± 5 ° C.) of a predetermined temperature (eg, 260 ° C.). Specifically, while the heating unit 33 is turned on, the cooling unit 32 is repeatedly turned on and off. By providing the cooling unit 32 on the clamp surface 27a side closer to the workpiece W than the heating unit 33, the heating unit 33 side functions to block heat from the heating unit 33, and the clamp surface 27a side cools the workpiece W. The work W can be quickly cooled.

  Thereby, as shown to the continuous line A in FIG. 4, predetermined temperature can be maintained for predetermined time (for example, 30 minutes-60 minutes). Further, the temperature control mechanism 61 can quickly increase the heating temperature of the workpiece W while preventing overshoot, and can prevent damage to the workpiece W due to overheating and expansion beyond the schedule. Thus, in the pressure bonding apparatus 1 provided with the temperature control mechanism 61, temperature control can be appropriately performed on the workpiece W to be heat-treated.

  Further, since the workpiece W can be rapidly heated and cooled by the temperature control mechanism 61 (upper clamper unit 27) having the cooling unit 32 and the heating unit 33, in the pressure bonding apparatus 1, the adhesive layer 4 is cured by heat. Before, the connection bump 6 can be melted in a short time by rapid heating. Then, a predetermined heating temperature can be maintained for a predetermined time, and the connection between the wiring board 2 and the semiconductor chip 3 is performed by appropriately bonding the connection pads 5 and the connection bumps 6 and curing the adhesive layer 4. Reliability can be improved.

  In addition, the broken line B in FIG. 4 is a graph when the cooling unit 32 is continuously turned off while the heating unit 33 is turned on, and the broken line C is a state where the heating unit 33 is turned on. The graph figure at the time of continuing making the cooling part 32 operate | move on is shown. From this, it can be seen that the repetition of the on / off operation of the cooling section 32 is effective for the temperature control.

  The lower clamper unit 28 clamps the workpiece W together with the upper clamper unit 27. The lower clamper portion 28 is inserted into a sliding hole 26 a formed in the guide portion 26. The lower clamper section 28 has a support block 36 and a plurality of support rods 37 arranged upright from the support block 36, and supports the workpiece W in a floating manner at the tips of the plurality of support rods 37. A fixed block 38 is fixedly assembled on the support block 36. The fixing block 38 is to prevent (fix) the retaining block 38 with a rod head on one end side of the support rod 37. The workpiece W is supported (placed) on the other end side of the plurality of support rods 37 thus provided. That is, the clamp surface 28a of the lower clamper portion 28 is formed by the tip surfaces of the plurality of support rods 37 on the same horizontal plane.

  The plurality of support rods 37 are arranged in a matrix, for example, and support the workpiece W via the support plate 41. The support rods 37 are arranged at equal intervals so that the support plate 41 does not bend due to its own weight and the height is not uniform. By supporting the workpiece W using the support plate 41, the workpiece W can be arranged in parallel with the clamp surface 27 a of the upper clamp portion 27.

  In this embodiment, although the workpiece | work W is clamped via the support plate 41, it demonstrates as what the clamp surface 28a is formed in the front end surface of each support rod 37 on the same horizontal surface. This is because the support plate 41 can be omitted when a substrate (for example, a ceramic substrate) having high rigidity and little bending is used as the wiring substrate 2.

  By floatingly supporting the workpiece W with the plurality of support rods 37, the heat capacity of the lower clamper portion 28 is reduced and the lower portion (for example, the support block 36) of the clamp surface 28a is thermally separated. . For this reason, the lower clamper portion 28 can maintain a low temperature (for example, 50 ° C. or less) when the workpiece W is placed (supported), and the high temperature when the workpiece W is clamped together with the upper clamper portion 27. (For example, 260 ° C.) can be maintained.

  The guide part 26 guides when the lower clamper part 28 moves up and down. The guide portion 26 is a cylindrical block in which a sliding hole 26a is formed, and is made of, for example, alloy tool steel. The guide part 26 is supported by the center part on the inner peripheral side of the upper surface of the base block 24 so that the through hole 24a of the base block 24 and the sliding hole 26a communicate with each other. The lower seal block 25 is fitted into the through hole 25a concentrically and fixedly assembled. The lower clamper portion 28, the leveling portion 29, and the push block 30 are inserted into the sliding hole 26a. In order to raise and lower the lower clamper part 28, the leveling part 29 and the push block 30, a drive part for raising and lowering the push block 30 is arranged as a drive source different from the drive part 19 above and below the sliding hole 26a. ing.

  In addition, when the drive part 19 of the movable platen 13 applies pressure to the sealed space 16, a clamping force necessary to prevent gas from leaking is generated, whereas the push block 30 is connected to the corresponding connection pad 5 of the workpiece W. It is necessary to generate a clamping force capable of joining the connection bump 6. In this case, the clamping force of the push block 30 is appropriately set based on the size of the workpiece, the number of bumps, or the type of bump. For example, when the workpiece size is large and the number of bumps is large, or in the case of a bump that requires a high clamping force for bonding (for example, a copper bump), it is necessary to use a drive unit that generates a high clamping force. The push block 30 is preferably one that can be finely adjusted, for example, every 1 kg in order to join the fine connection pads 5 and the connection bumps 6.

  The leveling portion 29 is provided for smoothly raising and lowering the lower clamper portion 28 while maintaining the upper and lower clamp surfaces 27a and 28a in parallel. The leveling portion 29 includes a mounting block 52 and a spring portion 51 that are inserted into the sliding hole 26 a of the guide portion 26. A support block 36 of the lower clamper portion 28 is provided on the mounting block 52 (see FIG. 1).

  In the leveling part 29, the mounting block 52 is pressed against the inner wall surface of the sliding hole 26a via the spring part 51. For this reason, when the lower clamper portion 28 is moved up and down by the push block 30, the mounting block 52 slides while being positioned in the slide hole 26 a, so that the clamp surface 28 a of the lower clamper portion 28 is moved to the upper clamper portion 27. A high degree of parallelism can be maintained with respect to the clamp surface 27a.

  The upper seal portion 42 and the lower seal portion 43 (portions surrounded by broken lines in FIG. 1) are provided to face each other and form a sealed space 16 (see FIG. 2 and FIG. 3) in contact with each other. is there. The lower seal portion 43 has a through hole that communicates with the lower base block 24 having the through hole 24a and the through hole 24a on the central portion of the fixed platen 14 so as to be a concave box portion that opens to the upper seal portion 42 side. A lower seal block 25 having a hole 25a is formed so as to overlap. At the boundary portion between the surfaces where the lower base block 24 and the lower seal block 25 are in contact with each other, the respective members are fixed and assembled with, for example, bolts, and thus are sealed. The lower clamper portion 28 is accommodated in such a lower seal portion 43. A seal member 44 (for example, an O-ring) is provided at the edge of the lower seal portion 43.

  Further, the upper seal portion 42 is formed by providing an upper seal block 23 having a through hole 23a below the outer peripheral portion of the upper base block 21 so as to be a concave box portion that opens to the lower seal portion 43 side. Yes. At the boundary portion of the surface where the upper base block 21 and the upper seal block 23 are in contact with each other, the respective members are fixed and assembled with, for example, bolts, and thus are sealed. The upper clamper portion 27 is accommodated in such an upper seal portion 42. Further, the edge of the lower seal 43 is brought into contact with the edge of the upper seal 42 via the seal member 44.

  When the upper seal portion 42 and the lower seal portion 43 are close to each other, the edge portion of the upper clamper portion 42 and the edge portion of the lower clamper portion 43 are in contact with each other to form a sealed space 16 (see FIG. 2). In other words, when the upper mold 11 and the lower mold 12 are close to each other, the mold is closed and the sealed space 16 is formed inside. In such a sealed space 16, since the workpiece W before and after the clamping is included, the workpiece W can be heated more rapidly by the upper clamper portion 42. The upper seal portion 42 and the lower seal portion 43 are close to form the sealed space 16 and do not clamp the workpiece W. The upper clamper 27 and the lower clamper 28 clamp the workpiece W.

  Further, a heater 45 extending in the depth direction is provided on the seal surface side of the lower seal block 25 constituting the lower seal portion 43, and a cooling pipe 46 (the refrigerant circulates inside the lower base block 24 side). Is provided).

  By providing the heater 45 on the seal member 44 side, that is, in the vicinity of the lower clamper portion 28, the heater can be heated from the lower clamper portion 28 side together with the upper clamp portion 27. Further, by providing the heater 45 in the vicinity of the lower clamper portion 28, the guide portion 26 assembled to the lower seal block 25 is thermally expanded in accordance with the heated lower clamper portion 28 by clamping the workpiece W. The lower clamper portion 28 can be smoothly raised and lowered within the sliding hole 26a. In addition, by providing the cooling pipe 46 near the lower base block 24 side, that is, in the vicinity of the drive unit that moves up and down the lower clamper unit 28, the periphery of the push block 30 can be cooled, and the push block 30 can malfunction. Can be prevented.

  The pressure adjusting unit 47 adjusts (controls) the pressure in the sealed space 16. In the present embodiment, the pressure adjusting unit 47 performs, for example, a compression process on the sealed space 16 through the air passage 48 formed in the upper seal block 23. For this reason, the pressure adjusting unit 47 has a compressor (for example, a compressor) connected to the sealed space 16.

  In the sealed space 16, when the adhesive layer 4 is heated by the upper clamp portion 27, a void is generated in the adhesive layer 4 and the adhesive layer 4 expands, and the semiconductor chip 3 may be separated from the wiring board 2. Therefore, the generation of voids can be suppressed by using the sealed space 16 as a compression space. Moreover, since the crimping | compression-bonding apparatus 1 is the structure which joins the several semiconductor chip 3 to the wiring board 2 collectively in a compression space, it can heat while suppressing generation | occurrence | production of a void and applying a uniform pressure. . Therefore, the connection reliability of the plurality of semiconductor chips 3 through the adhesive layer 4 on the wiring board 2 can be improved.

  Next, using the function of the crimping apparatus 1 according to the present embodiment, together with a crimping method (joining method) for joining a plurality of semiconductor chips 3 on the wiring substrate 2 together, a method for manufacturing the semiconductor device 7 manufactured thereby. Will be described with reference to FIGS. 1 to 3 and FIGS. FIG. 1 and the like are cross-sectional views schematically showing the crimping device 1 in operation, and FIG. 8 and the like are drawings of the workpiece W shown in FIG. 1 and the like in order to clarify the workpiece W in the crimping device 1 in operation. The main part is shown enlarged.

  The crimping method according to the present embodiment can be summarized as follows. The workpiece W including the wiring substrate 2 and the semiconductor chip 3 stacked via the adhesive layer 4 is sandwiched between the upper clamper portion 27 and the lower clamper portion 28 provided to face each other. And clamping the wiring board 2 and the semiconductor chip.

  First, a plurality of connection pads 5 of the wiring substrate 2 and a plurality of connection bumps 6 of each semiconductor chip 3 corresponding to each other are aligned to face each other, and a plurality of layers stacked on the wiring substrate 2 with an adhesive layer 4 interposed therebetween. A workpiece W including the semiconductor chip 3 is prepared (see FIG. 8).

  The workpiece W is temporarily bonded to the wiring substrate 2 to which the adhesive layer 4 is bonded by aligning a plurality of semiconductor chips 3 in a matrix form from the adhesive layer 4 side using a known flip chip bonder. Temporary joining). The wiring board 2 is, for example, a glass epoxy board, in which a wiring pattern is formed, and connection pads 5 exposed from the insulating layer 8 are formed. Further, the semiconductor chip 3 is, for example, a MIS (Metal Insulator Semiconductor) transistor formed on a silicon substrate, and solder bumps are used as the connection bumps 6.

  Subsequently, as shown in FIG. 1, the workpiece W is placed on the lower mold 12 by a transfer device (not shown) in a state where the upper mold 11 and the lower mold 12 are separated from each other. Specifically, the workpiece W is transported between the upper clamp portion 27 and the lower clamper portion 28, and the workpiece W is supported in a floating manner by the clamp surfaces 28a formed by the tip surfaces of the plurality of support rods 37 of the lower clamper portion 28. To do. In this embodiment, in order to prevent deterioration of the adhesive layer 4, the workpiece W is supported in a floating manner so as to be supported at a low temperature (50 ° C. or less).

  Subsequently, as shown in FIG. 2, the upper mold part 11 and the lower mold 12 are brought close to each other so as to be opposed to each other, and the upper seal part 42 and the lower clamper part 28 each including the upper clamper part 27 and the lower clamper part 28 The sealed space 16 is formed by bringing the seal portion 43 into contact therewith. Next, a compression process for introducing compressed air is performed on the sealed space 16 sealed by the pressure adjusting unit 47 to form a compressed space. For example, this compression space is formed until the seal of the sealed space 16 is released. The sealed space 16 is preferably formed until at least the adhesive layer 4 is cured in order to prevent air from foaming.

  Subsequently, as shown in FIG. 3, the lower clamper portion 28 that can be moved up and down in the sliding hole 26a of the guide portion 26 from the state shown in FIG. The work W is sandwiched and clamped by the lower clamper unit 28. Thus, the workpiece W sandwiched from both sides by the upper clamper portion 27 and the lower clamper portion 28 and directly heated starts to be heated rapidly. Since the temperature in the sealed space 16 is increased by the radiant heat from the heater 35 of the heating unit 33 and the heater 45 of the lower seal block 25, the workpiece W is indirectly heated.

  When the temperature of the workpiece W rises rapidly, the connection bumps 6 and the adhesive layer 4 are in a molten state. For this reason, in the clamped workpiece W, the melted adhesive layer 4 is pushed away so that the connection bump 6 comes into contact with the connection pad 5 (see FIG. 9), and the melted connection bump 6 and the connection pad 5 are joined (FIG. 10). reference).

  Next, the workpiece W is heated and pressurized while being clamped by the upper clamper portion 27 and the lower clamper portion 28. Here, using the cooling unit 32 and the heating unit 33 included in the temperature control mechanism 61 (upper clamp unit 27), the workpiece W is continuously heated within a predetermined temperature range while being clamped. Specifically, the ON operation and the OFF operation of the cooling unit 32 provided near the heating unit 33 on the clamp surface 27a side of the upper clamper unit 27 are repeated while the heating unit 33 is turned on.

  Thereby, the temperature and time which the contact bonding layer 4 hardens | cures can be maintained, maintaining the temperature which the connection bump 6 fuse | melts. For example, as described with reference to FIG. 4, a predetermined temperature (for example, 260 ° C.) can be maintained for a predetermined time (for example, 30 to 60 minutes). Thus, temperature control can be appropriately performed on the workpiece W to be heat-treated. Therefore, the connection reliability between the wiring substrate 2 and the semiconductor chip 3 laminated via the adhesive layer 4 can be improved. In addition, unlike the configuration in which the temperature does not increase naturally by stopping heating by the heating unit 33, for example, the temperature can be forcibly stopped while the temperature is quickly increased to a predetermined temperature, so that the temperature is quickly increased. However, there is no overshoot. Thereby, the problem that the semiconductor chip 3 is damaged due to the temperature of the workpiece W becoming too high can be efficiently avoided.

  In the present embodiment, the cooling part 32 extends (extends) in parallel with the clamp surface 27a of the upper clamper part 27, and has a cooling conduit 34 through which the refrigerant circulates, and the cooling part 32 is turned off. At this time, the flow of the refrigerant is stopped, and the workpiece W clamped via the cooling pipe 34 is heated by the heating unit 33. In this way, by quickly controlling the cooling unit 32, the predetermined temperature can be maintained for a predetermined time, and the temperature control can be appropriately performed on the workpiece W to be heat-treated.

  Next, after the joining of the workpieces W is completed (see FIG. 3), the pressurization to the sealed space 16 by the pressure adjusting unit 47 is stopped, the lower clamper unit 28 is lowered, and the workpiece W placed thereon is moved. Separated from the clamp surface 27a of the upper clamper 27 (see FIG. 2). Next, the upper mold 11 and the lower mold 12 are separated from each other to open the sealed space 16 constituted by the upper seal portion 42 and the lower seal portion 43, and the work W is carried out from the lower mold 12 by a transfer device (not shown). Thus, the operation for joining one workpiece W is completed. That is, the semiconductor device 7 in which the semiconductor chip 3 is mounted on the wiring board 2 is manufactured (see FIG. 10). In addition, after supporting the workpiece | work W with the support rod 37, the temperature of the connection bump 6 may be lowered | hung by maintaining for a predetermined time, and you may carry out.

(Embodiment 2)
In the first embodiment, the case where the cooling unit 32 and the heating unit 33 are built in the upper base block 21 of the upper clamper unit 27 as the temperature control mechanism 61 has been described. In the second embodiment of the present invention, a case will be described in which the cooling unit 32A of the upper clamper unit 27A is movable toward and away from the heating unit 33A as the temperature control mechanism 61A. Since other configurations are the same as those of the first embodiment, description of the configurations may be omitted.

  As shown in FIG. 5, the temperature control mechanism 61A is provided in the upper clamper portion 27A. The upper clamper 27A, together with the lower clamper 28, sandwiches and clamps (heats and presses) the workpiece W. In the upper clamper portion 27A, a temperature sensor 31, a cooling portion 32A, and a heating portion 33A are arranged in this order in a direction away from the clamp surface 27b side of the upper clamper portion 27A, and the cooling portion 32A is based on the detection value of the temperature sensor 31. And the temperature of the workpiece | work W (refer FIG. 6) clamped by carrying out on-off control of the heating part 33A is controlled (adjusted).

  Specifically, the temperature sensor 31 and the cooling unit 32A are disposed (built in) the movable spacer block 22A. The movable spacer block 22A has a plate shape that is sufficiently thinner than the upper base block 21, and a cooling portion 22A is disposed along the clamp surface 27b therein. The heating unit 33A is disposed (built in) the upper base block 21. In the upper base block 21, the heating unit 33A is disposed along the contact surface with the movable spacer block 22A. As described above, the upper clamper portion 27A has a temperature control mechanism in which the cooling portion 32A provided on the clamp surface 27b side and the heating portion 33A provided far from the cooling portion 32A from the clamp surface 27b side can move toward and away from each other. 61A is provided.

  The movable spacer block 22A is connected to a plurality of drive units 63 via a plurality of drive rods 62 (shown by broken lines in FIGS. 5 to 7) provided on the outer periphery. The drive unit 63 is for raising and lowering the movable spacer block 22 </ b> A in the vertical direction (mold opening / closing direction) via the drive rod 62, and is provided on the movable platen 13. The drive rod 62 is inserted into the through hole so as to communicate the movable platen 13, the fixed block 17, the post 18, and the upper base block 21. One end of the drive rod 62 is connected to the movable spacer block 22 </ b> A, and the other end is connected to the drive unit 63. The crimping apparatus 1A includes a drive rod 62 and a drive unit 63, and can move the cooling unit 32A toward and away from the heating unit 33A.

  As described above, the upper clamper portion 27A is provided so that the cooling portion 32A can be separated from the heating portion 33A. Therefore, the temperature control mechanism 61A blocks the heat from the heating portion 33A and cools the workpiece W by the cooling portion 32A. Thus, the temperature can be rapidly lowered.

  Next, using the function of the crimping apparatus 1A according to the present embodiment, together with a crimping method (joining method) for joining a plurality of semiconductor chips 3 on the wiring substrate 2 at once, a method for manufacturing the semiconductor device 7 manufactured thereby. Will be described.

  As shown in FIG. 5, the workpiece W is placed on the lower mold 12 by a transfer device (not shown) in a state where the upper mold 11 and the lower mold 12 are separated from each other. Specifically, the workpiece W is transported between the upper clamp portion 27A and the lower clamper portion 28, and the workpiece W is supported in a floating manner by the clamp surfaces 28a formed by the tip surfaces of the plurality of support rods 37 of the lower clamper portion 28. To do.

  Subsequently, as shown in FIG. 6, the upper mold 11 and the lower mold 12 are brought close to each other so that the upper seal portion 42 and the lower seal portion 43 are brought into contact with each other to form the sealed space 16. Next, a compression process for introducing compressed air is performed on the sealed space 16 sealed by the pressure adjusting unit 47 to form a compressed space.

  Next, the lower clamper portion 28 that can be raised and lowered within the sliding hole 26a of the guide portion 26 is raised to the upper clamper portion 27A side, and the workpiece W is sandwiched and clamped by the upper clamper portion 27A and the lower clamper portion 28. Specifically, in a state where the cooling unit 32A and the heating unit 33A are in contact with each other, the workpiece W is sandwiched and clamped by the cooling unit 32A and the lower clamp unit 28 of the upper clamper unit 27A.

  Next, the workpiece W is heated and pressurized while being clamped by the upper clamper portion 27A and the lower clamper portion 28. Here, using the cooling unit 32A and the heating unit 33A of the temperature control mechanism 61A (upper clamp unit 27A), the workpiece W is continuously heated within a predetermined temperature range while being clamped. Specifically, while the heating unit 33A is turned on, the on and off operations of the cooling unit 32A provided near the heating unit 33 on the clamp surface 27b side of the upper clamper unit 27A are repeated.

  Thereby, the temperature and time which the contact bonding layer 4 hardens | cures can be maintained, maintaining the temperature which the connection bump 6 fuse | melts. For example, as described with reference to FIG. 4, a predetermined temperature (for example, 260 ° C.) can be maintained for a predetermined time (for example, 30 to 60 minutes). Thereby, by sufficiently heating the adhesive layer 4 to complete the curing, connection reliability is ensured, and the wiring substrate 2 and the semiconductor chip 2 stacked via the adhesive layer 4 are pressure-bonded (joined). .

  Subsequently, as shown in FIG. 7, the cooling part 32 </ b> A is lowered following the lowering of the lower clamper part 28. That is, the workpiece W is lowered while being clamped by the cooling unit 32A and the lower clamper unit 28, the cooling unit 32A is separated from the heating unit 33A, and the workpiece W is cooled by the ON operation of the cooling unit 32A. By separating the cooling unit 32A from the heating unit 33A, a gap is formed between the cooling unit 32A and the heating unit 33A. The conduction of heat from the heating unit 33A to the workpiece W via the movable spacer block 22A is blocked by this gap. Since the workpiece W from which heat conduction from the heating unit 33A is cut off is cooled by the ON operation of the cooling unit 32A, the bumps 6 are cooled and solidified. Therefore, even if an external force is applied during transportation, the bumps 6 The electrical connection by is not impaired. In this case, since the heat transmission from the heating unit 33A is interrupted and cooled by the cooling unit 32A disposed in the movable spacer block 22A that is sufficiently thin and has a low heat capacity, the temperature can be rapidly lowered. For this reason, the time required for cooling can be shortened and the cycle time can be shortened.

  Next, pressurization to the sealed space 16 by the pressure adjusting unit 47 is stopped, the lower clamper unit 28 is lowered, and the workpiece W placed is separated from the clamp surface 27b of the upper clamper unit 27A (cooling unit 32A). . Next, the upper mold 11 and the lower mold 12 are separated from each other to open the sealed space 16 constituted by the upper seal portion 42 and the lower seal portion 43, and the work W is carried out from the lower mold 12 by a transfer device (not shown). Thus, the operation for joining one workpiece W is completed. That is, the semiconductor device 7 in which the semiconductor chip 3 is mounted on the wiring board 2 is manufactured (see FIG. 10).

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  For example, in the embodiment, the case where the workpiece W is placed on the lower mold 12 has been described. Not only this but the structure which supports the workpiece | work W in the upper mold | type 11 by adsorption | suction or holding | grip with a nail | claw may be sufficient. Thereby, a temperature control mechanism can be provided in the lower clamper portion. For example, a temperature control mechanism can be configured by providing a cooling unit and a heating unit in order from the clamp surface side of the lower clamper unit.

  Further, for example, in the above-described embodiment, the case where the cooling pipe 34 through which the refrigerant circulates is used as the cooling unit 32, but the cooling pipe 34 through which both air and water circulate is used. Also good. Alternatively, a part of the cooling unit 32 may be used for air cooling and the other part may be used for water cooling. In this case, air cooling can be used to stabilize the temperature during crimping (clamping), and water cooling can be performed when initial heating is stopped or when cooling is completed (when not clamping). Productivity can be improved when pressure bonding is repeatedly performed on W.

  Moreover, although the said embodiment demonstrated the case where a compressor was used for the pressure adjustment part 47, the decompressor (for example, vacuum pump) which decompresses the sealed space 16 may be connected instead of a compressor. This is because by reducing the pressure, fine air in the adhesive layer 4 and foreign matters (floating matter) in the sealed space 16 can be removed. Further, the pressure adjusting unit 47 can perform processing using both a decompressor and a compressor. For example, heating is started after positive air is positively removed from the adhesive layer 4 or the foreign matter in the space is removed by setting the inside of the sealed space 16 in a reduced pressure atmosphere, and generation of voids is suppressed as a compressed space. Thus, a synergistic effect can be obtained, and the connection reliability of the plurality of semiconductor chips 3 via the adhesive layer 4 on the wiring substrate 2 can be further improved. As described above, the pressure adjusting unit 47 may include at least one of a compressor and a decompressor connected to the sealed space 16.

  Further, for example, in the embodiment, the case where the workpiece W including the wiring substrate 2 and the semiconductor chip 3 is used as the first and second members stacked via the adhesive layer has been described. The present invention can also be applied to a workpiece in which fourth,. For example, the present invention can also be applied to a work in which a wiring substrate is used as the first member, and semiconductor chips are used as the second and third members, respectively, with an adhesive layer interposed therebetween. Further, for example, a lead frame or a wafer other than the wiring substrate 2 may be used as the substrate. Further, for example, a chip component such as a capacitor chip in addition to the semiconductor chip 3 may be used as the electronic component.

  Further, for example, in the above-described embodiment, a work W (see FIG. 8) in a state where the connection pads 5 of the wiring board 2 and the connection bumps 6 of the semiconductor chip 3 are not in contact is prepared, and the work W is clamped and wired. The case where the semiconductor device 7 (see FIG. 10) is manufactured by collectively bonding the plurality of electronic components 3 to the substrate 2 has been described. Not limited to this, a work W (see FIG. 9) in a state where the connection pads 5 of the wiring board 2 and the connection bumps 6 of the semiconductor chip 3 are in contact with each other is prepared. The semiconductor device 7 may be manufactured by bonding the semiconductor chips 3 together. This is because, when the work W in which the connection bump 6 is melted is heated and pressed, the displacement between the connection pad 5 and the connection bump 6 can be suppressed.

  For example, in the above embodiment, the case where the connection bumps 6 of the semiconductor chip 3 are melted by heating has been described. Not limited to this, even if the connection pads 5 of the wiring board 2 are melted or the connection pads 5 of the wiring board 2 and the connection bumps 6 of the semiconductor chip 3 are also melted, the wiring board 2 and the semiconductor chip 3 are bonded together. Can be joined.

  For example, in the above-described embodiment, the case where the upper mold 11 is fixed and assembled to the movable platen 13 and the lower mold 12 is fixed and assembled to the fixed platen 14 has been described. However, the present invention is not limited to this, and the upper mold 11 may be fixed to the fixed platen and the lower mold 12 may be fixed and assembled to the movable platen, and the lower mold 12 may be raised and lowered with respect to the upper mold 11.

27 Upper clamper part 27a Clamp surface 28 Lower clamper parts 32, 32A Cooling part 33, 33A Heating part W Workpiece

Claims (7)

A crimping device comprising a pair of clamper portions for clamping a workpiece, and crimping each member of the workpiece by heating and pressing while clamping the workpiece by the pair of clamper portions,
One clamper part includes a temperature sensor provided on the clamp surface side, a cooling part provided away from the temperature sensor from the clamp face side, and a heating provided away from the cooling part from the clamp face side. A pressure bonding apparatus, wherein the temperature of the workpiece is controlled by on / off controlling the cooling unit and the heating unit based on a detection value of the temperature sensor. The crimping apparatus according to claim 1,
The cooling part includes a cooling pipe line that extends in parallel with the clamp surface of the one clamper part and in which a refrigerant circulates.
A pressure bonding apparatus that stops the flow of the refrigerant when the cooling unit is turned off. The crimping apparatus according to claim 1 or 2,
The one clamper part has a base block in which the heating part is incorporated, and a movable block in which the cooling part is incorporated,
A pressure bonding apparatus comprising: a drive unit that moves the cooling unit toward and away from the heating unit. The crimping device according to claim 3.
After the cooling unit and the heating unit are in contact with each other, the workpiece is clamped and heated and pressurized by the pair of clamper units, and then the cooling unit is separated from the heating unit by the drive unit, A pressure bonding apparatus, wherein the work is cooled by an ON operation of the cooling part while the work is clamped by the cooling part and the other clamper part. A temperature control method for controlling the temperature of a workpiece that is clamped and heated and pressurized by one clamper portion and the other clamper portion facing the one clamper portion,
(A) a step of clamping the workpiece with the one clamper unit provided with a cooling unit and a heating unit in order from the clamp surface side, and the other clamper unit;
(B) after the step (a), continuing to heat the work from the one clamper part side,
In the step (b), the temperature control method is characterized by maintaining the predetermined temperature for a predetermined time by repeating the ON operation and the OFF operation of the cooling unit while turning on the heating unit. The temperature control method according to claim 5, wherein
The cooling unit has a cooling pipe line that extends in parallel with the clamp surface of the one clamper unit, and in which a refrigerant circulates.
In the step (b), the flow of the refrigerant is stopped when the cooling unit is turned off. The temperature control method according to claim 5 or 6,
In the one clamper part, the cooling part is provided so as to be separated from the heating part,
In the step (a), in a state where the cooling unit and the heating unit are in contact, the workpiece is clamped by the cooling unit and the other clamper unit of the one clamper unit,
After the step (b), with the work clamped by the cooling part and the other clamper part, the cooling part is separated from the heating part, and the work is cooled by turning on the cooling part. The temperature control method characterized by this.

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