JP2013008748A - Semiconductor device - Google Patents

Abstract

A semiconductor device capable of efficiently dissipating heat generated by an electronic component through a metal plate and a mold resin and ensuring electrical insulation.
A semiconductor device 10 includes a substrate 20 having lands 23 and 24 on one surface 20a, electrodes on both surfaces, and a first main surface disposed so as to face the one surface 20a. Includes a vertical element 30 connected to the land 23 by a solder 60, a facing portion 41 disposed to face the second main surface of the vertical device 30, and a leg portion 42 extending from the facing portion 41. The opposing part 41 is connected to the electrode of the second main surface by the solder 61, and the metal plate 40 in which the leg part 42 is connected to the land 24 by the solder 62 and the mold resin 50 are provided. And the thickness of the opposing part 41 is thicker than the thickness of the leg part 42.
[Selection] Figure 2

Description

  The present invention includes an electronic component having electrodes on both sides, an electronic component mounting member in which the electronic component is disposed and electrically connected to one of the electrodes, and an electronic component disposed on the electronic component and electrically connected to the other of the electrodes The present invention relates to a semiconductor device comprising: a metal plate, an electronic component, at least a part of an electronic component mounting member, and a mold resin that integrally seals the metal plate.

  Conventionally, for example, semiconductor devices having configurations described in Patent Documents 1 and 2 are known. The semiconductor device includes an electronic component having electrodes on both sides, an electronic component mounting member in which the electronic component is disposed and electrically connected to one of the electrodes, and an electronic component mounted on the electronic component and electrically connected to the other electrode. A connected metal plate, an electronic component, at least a part of the electronic component mounting member, and a mold resin that integrally seals the metal plate are provided. Specifically, an electronic component is connected to a die pad as an electronic component mounting member via solder, and one end of the metal plate is connected to the electronic component via solder and the other end is molded resin. It is connected to the lead extended from the solder via solder.

  In this semiconductor device, since a metal plate is used instead of the bonding wire, the conduction loss can be reduced and the electrical characteristics of the semiconductor device can be improved. In addition, since the metal plate is more effective as a thermal mass than the bonding wire, the mold resin that covers the metal plate on the opposite side of the metal plate and the electronic component of the metal plate (hereinafter referred to as a coating portion) It is possible to improve the heat dissipation to the outside via.

JP 2010-123686 A JP 2001-291823 A

  By the way, in the conventional semiconductor device shown by patent document 1, 2, the thickness of a metal plate is uniform. That is, in the metal plate, the thickness of the facing portion facing the electronic component and connected to the electronic component and the leg portion extending from the facing portion and connected to the lead are equal. For this reason, it cannot be said that the heat radiation function by the metal plate (opposing portion) is sufficient.

  Further, since the thickness of the facing portion is the same as the thickness of the leg portion, the load applied to the solder from the facing portion is small. For this reason, the effect of reducing the variation in the amount of solder applied by the load is small, and the variation in the thickness of the coating portion of the mold resin is relatively large in the thickness direction of the electronic component. For example, when the thickness of the covering portion is larger than a desired thickness, the heat dissipation through the metal plate and the covering portion is reduced, and when the thickness of the covering portion is thin, the electrical insulation is deteriorated.

  In view of the above problems, an object of the present invention is to provide a semiconductor device capable of efficiently dissipating heat generated by an electronic component through a metal plate and a mold resin and ensuring electrical insulation. .

In order to achieve the above object, a semiconductor device according to claim 1 comprises:
An electronic component mounting member (20, 27) having a first connection part (23) and a second connection part (24) electrically separated from the first connection part (23) on one surface (20a, 27a); ,
The electrode has electrodes on both the first main surface and the second main surface opposite to the first main surface, the first main surface is disposed so as to face one surface (20a), and solder (60) An electronic component (30) in which the electrode on the first main surface is connected to the first connection portion (23),
The electronic component (30) includes a facing portion (41) disposed to face the second main surface, and a leg portion (42) extending from the facing portion (41) and bent with respect to the facing portion (41). The opposing plate (41) is connected to the electrode on the second main surface by the solder (61), and the leg (42) is connected to the second connecting portion (24) by the solder (62). When,
A mold resin (50) for integrally sealing at least a part of the electronic component mounting members (20, 27), the electronic component (30), and the metal plate (40);
The thickness of the opposing part (41) of the metal plate (40) is larger than the thickness of the leg part (42).

  As described above, in the present invention, the thickness of the metal plate (40) is not uniform, and the thickness of the facing portion (41) is larger than the thickness of the leg portion (42). For this reason, compared with the conventional structure using the metal plate (40) with uniform thickness, the heat storage function of the facing portion (41) is high, and as a result, the mold that covers the facing portion (41) and the facing portion (41). Heat dissipation to the outside through the resin (50) coating is high.

  Further, since the thickness of the facing portion (41) is larger than that of the leg portion (42), the load applied to the solder (60, 61) from the facing portion (41) is larger than that of the conventional configuration. For this reason, the effect of reducing the variation in the amount of solder applied by the load is great, and the variation in the thickness of the coating portion of the mold resin (50) in the vertical direction can be reduced as compared with the conventional case. That is, the thickness of the coating portion of the mold resin (50) can be set to a desired value.

  As described above, according to the present invention, heat generated by the electronic component (30) can be efficiently radiated through the metal plate (40) and the mold resin (50), and electrical insulation can be ensured.

  Furthermore, since the leg portion (42) is thinner than the facing portion (41), the leg portion (42) can have a predetermined shape with respect to the facing portion (41).

As claimed in claim 2,
A plurality of electronic components (31, 32) are provided,
The electrodes on the second main surface of each electronic component (31, 32) are preferably connected to the same facing portion (41).

  As described above, since the facing portion (41) is thicker than the leg portion (42), the heat of the plurality of electronic components (31, 32) can be efficiently radiated collectively.

As claimed in claim 3,
When the thickness of multiple electronic components (31, 32) is different,
In the vertical direction, the opposing part (41) of the metal plate (40) is arranged so that the sum of the thicknesses of the opposing part (41) and the electronic parts (31, 32) is equal. It is preferable that the opposing surface (41a) facing the two main surfaces has a step and has a partially different thickness.

  According to this, while the thickness of the plurality of electronic components (31, 32) is different, the thickness of the covering portion that covers the facing portion (41) of the metal plate (40) in the mold resin (50) is It can be made substantially uniform throughout the opposing portion (41), that is, the inclination of the opposing portion (41) can be suppressed. Therefore, the heat generated by the plurality of electronic components (31, 32) can be efficiently radiated through the metal plate (40) and the mold resin (50), and electrical insulation can be ensured.

As claimed in claim 4,
The facing portion (41) of the metal plate (40) has a groove portion (44) on the back surface (41b) opposite to the facing surface (41a) facing the second main surface of the electronic component (30),
The groove portion (44) is preferably open at an end portion on a side surface (41c) connecting the opposing surface (41a) and the back surface (41b).

  According to this, when shape | molding mold resin (50), the fluidity | liquidity of the resin of the direction along a groove part (44) can be improved. For this reason, in order to improve heat dissipation, even if the opposing area | region of the inner surface of a type | mold and the opposing part (41) of a metal plate (40) is narrow, resin can be spread over an opposing area | region.

  Further, the groove (44) increases the contact area between the facing portion (41) of the metal plate (40) and the mold resin (50). Thereby, it becomes difficult to peel mold resin (50) from an opposing part (41), and can improve heat dissipation over a long period of time.

As claimed in claim 5,
The facing portion (41) of the metal plate (40) connects the facing surface (41a) facing the second main surface of the electronic component (30) and the back surface (41b) opposite to the facing surface (41a). You may have an uneven | corrugated | grooved part (45) in a side surface (41c).

  According to this, the mold resin (50) is difficult to peel from the side surface (41c) of the facing portion (41) of the metal plate (40) due to the uneven portion (45). For this reason, it can suppress that peeling progresses to the back surface (41b) side of an opposing part (41) from the peeling of a side surface (41c), and, thereby, heat dissipation falls.

As claimed in claim 6,
The electronic component mounting member (20) is a substrate in which wiring is formed on the insulating base material (21).
The first connection portion (23) is a land formed on one surface (20a) of the substrate (20),
The 2nd connection part (24) can employ | adopt the structure which is a land formed away from the 1st connection part (23) in the one surface (20a) of a board | substrate (20).

As described in claim 7,
An electronic component (33) disposed on an area (20a) of the substrate (20) different from the area where the metal plate (40) is disposed,
The mold resin (50) contacts the surface (33b) opposite to the substrate (20) of the electronic component (33),
In the vertical direction, the surface (41b) opposite to the substrate (20) in the facing portion (41) of the metal plate (40) and the surface (33b) opposite to the substrate (20) in the electronic component (33) are set to the same position. It is good to have a configuration.

  According to this, the inner surface of the mold and the surface are compared with the configuration in which the opposite surface (41) and the surface (41b, 33b) opposite to the substrate (20) of the electronic component (33) are in different positions in the vertical direction. (41b, 33b), the resin easily flows from the facing portion (41) side to the electronic component (33), or from the electronic component (33) side to the facing portion (41) side. That is, the moldability of the mold resin (50) can be improved. Thereby, resin can spread over the opposing area | region of the opposing part (41) of a metal plate (40), and the inner surface of a type | mold, and electrical insulation can be ensured.

Further, as described in claim 8,
The electronic component mounting member (27) is a lead frame,
The first connection portion (23) is a connection portion with the electronic component (30) in the die pad (28) of the lead frame (27),
The second connection portion (24) is a portion (29) electrically separated from the die pad (28) on which the electronic component (30) is disposed, and is connected to the leg portion (42) of the metal plate (40). A configuration that is a connecting portion can also be adopted.

  In addition, since the effect of the invention of Claim 9 is the same as the effect of the invention of Claim 7, the description is abbreviate | omitted.

It is a top view which shows schematic structure of the semiconductor device which concerns on 1st Embodiment, and mold resin is abbreviate | omitted for convenience. It is sectional drawing which follows the II-II line | wire of FIG. It is sectional drawing which shows the manufacturing method of the semiconductor device of 1st Embodiment, and shows the formation process of the unit formed by integrating a vertical element and a metal plate. It is sectional drawing which shows the manufacturing method of the semiconductor device of 1st Embodiment, and shows the process of preparing a board | substrate. It is sectional drawing which shows the manufacturing method of the semiconductor device of 1st Embodiment, and shows the process of mounting a unit on a board | substrate. It is sectional drawing which shows schematic structure of the semiconductor device which concerns on 2nd Embodiment. It is sectional drawing which shows schematic structure of the semiconductor device which concerns on 3rd Embodiment. It is sectional drawing which shows schematic structure of the semiconductor device of 4th Embodiment. It is sectional drawing which shows another modification. It is sectional drawing which shows another modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each drawing, common or related elements are given the same reference numerals. In addition, the thickness direction of the vertical element (electronic component), in other words, the direction perpendicular to the first main surface and the second main surface of the vertical element is simply referred to as the thickness direction, and is perpendicular to the thickness direction. The direction is simply indicated as the vertical direction. Unless otherwise specified, the thickness indicates a length along the thickness direction.

(First embodiment)
The semiconductor device 10 shown in FIGS. 1 and 2 includes a substrate 20, a vertical element 30 disposed on one surface 20 a of the substrate 20, and a vertical element 30, that is, opposite to the substrate 20 with respect to the vertical element 30. The metal plate 40 which is arrange | positioned at the side and the other electrode of the vertical element 30 was electrically connected, and the mold resin 50 are provided.

  The board | substrate 20 provides a wiring part in the insulating base material 21 formed using insulating materials, such as resin and a ceramic, and is equivalent to the electronic component mounting member as described in a claim. And, on one surface 20a, there is a land 22 as a part of the wiring portion. Of the lands 22, the land 23 corresponds to the first connection portion described in the claims, and the land 24 corresponds to the second connection portion. To do. The land 22 also includes a land 25 to which an electronic component 33 other than the vertical element 30 is connected.

  In this embodiment, the land 22 is formed by patterning a copper foil. Among the lands 23, the land 23a is a land for a gate electrode of an IGBT 31 described later, the land 23b is a land for an emitter electrode, and the land 23c is a land for an anode electrode of an FWD 32 described later. Furthermore, the substrate 20 is a multilayer substrate in which a conductive pattern constituting a wiring portion is arranged in multiple layers on an insulating base material 21 made of an epoxy resin material. In the wiring portion, portions other than the land 22, conductor patterns, and interlayer connection portions are not shown.

  On the other hand, a pad 26 for external connection is formed on the back surface 20 b opposite to the one surface 20 a of the substrate 20. The pad 26 is electrically connected to, for example, the electrode of the vertical element 30 through the above-described wiring portion (not shown).

  The vertical element 30 is an element having electrodes on each of the first main surface and the second main surface forming both ends in the thickness direction, and corresponds to an electronic component having electrodes on both surfaces described in the claims. The surface facing the substrate 20 is a first main surface, and the surface facing the metal plate 40 is a second main surface. As such a vertical element 30, a power semiconductor element, such as an IGBT or MOSFET, a diode, an IC, or the like, which generates a large amount of heat can be employed. The vertical element 30 is electrically and mechanically connected to the corresponding land 23 formed on the one surface 20 a of the substrate 20 through the solder 60.

  In the present embodiment, four vertical elements 30 are arranged with respect to the substrate 20. And the electrode of the 1st main surface of each vertical element 30 is electrically and mechanically connected with the corresponding land 23 (23a-23c) by the Sn-Ag-Cu-type solder 60. FIG. Of the four vertical elements 30, two are IGBTs 31 and the remaining two are commutation diodes 32 (hereinafter referred to as FWD 32). One FWD 32 is connected in reverse parallel to one IGBT 31, and one set of IGBT 31 and FWD 32 is connected to each of the two metal plates 40 (40a, 40b). In the present embodiment, the thicknesses of the IGBT 31 and the FWD 32 connected to the common metal plate 40 are substantially equal.

  The two IGBTs 31 are connected in series with each other, and the four vertical elements 30 constitute an inverter. A connection point (middle point) between the two IGBTs 31 is connected to a load such as a motor via the pad 26 of the substrate 20. In FIG. 1, the vertical elements 30 (31, 32) are indicated by broken lines, and the vertical elements 31, 32 on the metal plate 40a side constitute the high side (high potential) side arm of the inverter. The vertical elements 31 and 32 on the 40b side constitute a low side arm.

  The IGBT 31 has a gate electrode and an emitter electrode on the first main surface, and a collector electrode on the second main surface. On the other hand, the FWD 32 has an anode electrode on the first main surface and a cathode electrode on the second main surface. In the IGBT 31 and the FWD 32 connected to the common metal plate 40, the emitter electrode of the IGBT 31 and the anode electrode of the FWD 32 are electrically connected via the solder 60, the lands 23b and 23c, and a wiring portion (not shown) of the substrate 20. Has been. The collector electrode of the IGBT 31 and the cathode electrode of the FWD 32 are electrically connected via the solder 61 and the metal plate 40. In addition, the thickness of each solder 60 is substantially equal to each other, and the thickness of each solder 61 is approximately equal to each other.

  In the present embodiment, as shown in FIG. 1, electronic components 33 other than the vertical elements 30 (31, 32) are also arranged on the one surface 20 a of the substrate 20. In addition, as such an electronic component 33, a capacitor | condenser, a coil, resistance, etc. are employable. In the present embodiment, an electronic component 33 that is taller (thicker) than the vertical element 30 (31, 32), such as a chip capacitor, is employed. Similar to the vertical element 30, the electronic component 33 is electrically and mechanically connected to the corresponding land 25 formed on the one surface 20 a of the substrate 20 by the Sn—Ag—Cu-based solder 63.

  The metal plate 40 functions as a current path for the vertical element 30 and also functions to store and dissipate heat generated by the vertical element 30. The constituent material of the metal plate 40 is not particularly limited as long as it is a metal material having higher thermal conductivity than the mold resin 50. For example, copper, copper alloy, aluminum or the like can be employed. In the present embodiment, the metal plate 40 made of copper is employed from the viewpoint of high thermal conductivity, easy processing, and low cost.

  The metal plate 40 is disposed so as to face the second main surface of the vertical element 30, and is opposed to the facing portion 41 electrically connected by the solder 61 to the electrode formed on the second main surface of the vertical element 30. A leg portion 42 extending from the portion 41 and connected to the land 24 by a solder 62 and bent with respect to the facing portion 41. Further, the thickness of the facing portion 41 is thicker than the thickness of the leg portion 42. Further, the metal plate 40 is mounted on the substrate 20, and in the thickness direction, the back surface 41b (hereinafter referred to as the upper surface 41b) opposite to the opposing surface 41a (hereinafter referred to as the lower surface 41a) of the opposing portion 41 with the substrate 20 in the thickness direction. Is substantially the same position as the position of the back surface 33b (hereinafter referred to as the upper surface 33b) opposite to the surface 33a (hereinafter referred to as the lower surface 33a) facing the substrate 20 in the tall electronic component 33 described above. It has become. Further, the upper surface 41 b of the facing portion 41 is substantially parallel to the one surface 20 a of the substrate 20.

  The facing portion 41 of the present embodiment has a predetermined thickness, and the planar shape along the vertical direction is a rectangular flat plate shape. And each electrode formed in the 2nd main surface of IGBT31 and FWD32 with respect to the opposing surface 41a with the board | substrate 20 in the opposing part 41 is electrically, mechanically, and heat | fever by the Sn-Cu-Ni type solder 61. Connected. On the other hand, the leg portions 42 are respectively provided in the vicinity of the four corners of the rectangular portion of the facing portion 41, and the tips of the leg portions 42 correspond to the Sn-Ag—Cu-based solder 62 as in the vertical element 30. The land 24 is electrically and mechanically connected.

  The mold resin 50 integrally seals at least a part of the substrate 20, the vertical element 30, and the metal plate 40. For this reason, the solder 60 connected to the vertical element 30 (31, 32), the solder 61 connecting the vertical element 30 and the facing portion 41 of the metal plate 40, and the solder connected to the leg portion 42 of the metal plate 40. 62 is also sealed with the mold resin 50. The lands 23 (23 a to 23 c) corresponding to the vertical elements 30 (31, 32) and the lands 24 corresponding to the leg portions 42 of the metal plate 40 are also sealed with the mold resin 50.

  As a constituent material of the mold resin 50, a known resin material such as an epoxy resin can be employed. In the present embodiment, the mold resin 50 is formed by transfer molding using an epoxy resin. In addition, the entire surface 20 a where the vertical element 30 is arranged in the substrate 20 is covered with the mold resin 50. For this reason, the electronic component 33 other than the vertical element 30 is also sealed with the mold resin 50.

  Further, the height of the mold resin 50 from the one surface 20a of the substrate 20 is such that the portion 51 (hereinafter referred to as the covering portion 51) covering the upper surface 41b of the facing portion 41 of the metal plate 40 and the tall electronic component 33 The portion 52 (hereinafter referred to as the covering portion 52) covering the upper surface 33b has substantially the same height. Further, the thickness of the covering portion 51 that covers the facing portion 41 of the metal plate 40 has a predetermined thickness and is substantially the same as the thickness of the covering portion 52 that covers the electronic component 33. In other words, in the thickness direction, the upper surface 41b of the facing portion 41 of the metal plate 40 and the upper surface 33b of the electronic component 33 are substantially at the same position.

  The heat generated by the vertical element 30 (31, 32) is transmitted to the facing portion 41 of the metal plate 40 via the solder 61, and the covering portion 51 of the mold resin 50 is passed from the facing portion 41 of the metal plate 40. Heat is radiated to the outside of the semiconductor device 10. For this reason, heat dissipation can be improved, so that the thickness of the coating | coated part 51 is thin. On the other hand, since a large current flows through the vertical element 30, the covering portion 51 is necessary. However, as the covering portion 51 is thicker, the electrical insulation can be improved. Considering this point, in the present embodiment, the thickness of the covering portion 51 is set to a predetermined thickness that can ensure electrical insulation while improving heat dissipation.

  Next, an example of a method for manufacturing the semiconductor device 10 will be described with reference to FIGS.

  First, the vertical element 30 (31, 32) is placed on the lower surface 41a so that the second main surface faces the lower surface 41a of the facing portion 41 of the metal plate 40. At this time, for example, paste-like solder 61 is interposed between the lower surface 41 a of the facing portion 41 and the electrode on the second main surface of the vertical element 30. In this state, the electrode on the second main surface of the vertical element 30 (31, 32) is joined to the facing portion 41 of the metal plate 40 via the solder 61 by reflow. Thereby, as shown in FIG. 3, the unit 70 formed by integrating the vertical elements 30 (31, 32) and the metal plate 40 is formed. Instead of reflow, the electrode on the second main surface of the vertical element 30 (31, 32) may be electrically and mechanically connected to the facing portion 41 of the metal plate 40 by die bonding.

  Further, as shown in FIG. 4, the substrate 20 is separately prepared, and, for example, paste solder 60 a is applied onto the lands 23 (23 a to 23 c) as the first connection portions of the lands 22 of the substrate 20. Similarly, paste solder 62a, for example, is applied on the land 24 as the second connection portion, and paste solder 63a, for example, is also applied on the land 25. In this embodiment, since each solder 60a, 62a, 63a consists of the same material, it apply | coats collectively.

  The electrodes formed on the first main surface of the vertical element 30 and the tips of the leg portions 42 of the metal plate 40 are in contact with the solders 60a and 62a on the corresponding lands 22 (23, 24) of the substrate 20. As described above, the unit 70 is placed on the one surface 20 a of the substrate 20. And the land 22 (23a-23c) corresponding to the electrode of the 1st main surface of the vertical element 30 (31, 32) is joined via the solder 60 by reflow. Moreover, the leg part 42 of the metal plate 40 and the corresponding land 24 are joined through the solder 62 by this reflow. By this step, the unit 70 is integrated with the substrate 20 as shown in FIG. In this step, the electronic component 33 is also placed together with the unit 70 on the one surface 20 a of the substrate 20. Then, the electrodes of the electronic component 33 and the corresponding lands 25 are joined via solder 63 by reflow. Therefore, the unit 70 and the electronic component 33 are integrated with the substrate 20.

  Next, the substrate 20 in which the unit 70 and the like are integrated is placed in a mold cavity (not shown), and a resin is injected into the cavity to mold the mold resin 50. In this embodiment, the mold resin 50 is formed by transfer molding using an epoxy resin. Thus, the semiconductor device 10 shown in FIGS. 1 and 2 can be obtained.

  Next, the effect of the characteristic part of the semiconductor device 10 described above will be described.

  In the present embodiment, the thickness of the metal plate 40 is the same between the facing portion 41 facing the vertical element 30 (31, 32) and the leg portion 42 connected to the land 24 as the second connecting portion, that is, The thickness of the facing portion 41 is made larger than the thickness of the leg portion 42 instead of being uniform throughout the metal plate 40. For this reason, compared with the conventional structure using the metal plate 40 with uniform thickness, the heat storage function of the facing portion 41 is high, and as a result, heat dissipation to the outside through the facing portion 41 and the covering portion 51 of the mold resin 50 is performed. Is expensive.

  Moreover, since the thickness of the opposing part 41 is thicker than the leg part 42, compared with the conventional structure with the thickness of the opposing part 41 equal to the thickness of the leg part 42, it is provided to the solders 60 and 61 from the opposing part 41. The load is large. For this reason, even if the application amount of the solder 60 (60a) to the lands 23 (23a to 23c) varies, this variation can be reduced more effectively than the conventional case by the load. Thereby, in the vertical direction, the variation in the position of the upper surface 41b of the facing portion 41 of the metal plate 40 with respect to the one surface 20a of the substrate 20, in other words, the variation in the thickness of the covering portion 51 of the mold resin 50 is reduced as compared with the conventional case. be able to. That is, the thickness of the covering portion 51 of the mold resin 50 can be set to a desired value.

  As described above, according to the present embodiment, the heat generated by the vertical elements 30 (31, 32) can be efficiently radiated through the facing portion 41 of the metal plate 40 and the covering portion 51 of the mold resin 50, and the electric Insulation can be ensured.

  Furthermore, since the leg part 42 is thinner than the opposing part 41, it can be made into the predetermined shape which bent the leg part 42 with respect to the opposing part 41 in order to join the front-end | tip of the leg part 42 to the corresponding land 24. FIG.

  Moreover, in this embodiment, although the some vertical element 30 (31, 32) is connected to the opposing part 41 of the same metal plate 40 (40a or 40b), as above mentioned, the opposing part 41 is Since it is thicker than the legs 42, the heat of the plurality of vertical elements 30 (31, 32) can be efficiently radiated collectively compared to the conventional configuration in which the thickness of the metal plate 40 is uniform.

  In the present embodiment, the substrate 20 is employed as the electronic component mounting member, and a part of the land 22 formed on the one surface 20a of the substrate 20 is a land 23 (23a to 23c) as a first connection portion, and a land. Another part 22 is a land 24 as a second connection portion. Furthermore, another part of the land 22 is a land 25 to which the electronic component 33 is connected. As described above, when the substrate 20 is employed, wiring is easy even if there are a plurality of electronic components sealed in the mold resin 50 (four vertical elements 30 and three electronic components 33 in this embodiment). It is.

  In the present embodiment, apart from the vertical element 30, a tall electronic component 33 is mounted on the substrate 20, and the electronic component 3 is also sealed with the mold resin 50. In the thickness direction, the upper surface 41b of the facing portion 41 of the metal plate 40 and the upper surface 33b of the tall electronic component 33 are at the same position. When such a configuration is employed, the electronic component 33 or the electronic component 33 from the facing portion 41 side between the inner surface of the mold and the upper surfaces 41b and 33b, compared to a configuration in which the upper surfaces 41b and 33b are different from each other in the vertical direction, The resin easily flows from the electronic component 33 side to the facing portion 41 side. That is, the moldability of the mold resin 50 can be improved. Thereby, resin can spread over the opposing area | region of the opposing part 41 of the metal plate 40, and the inner surface of a type | mold, and electrical insulation can be ensured. 2 is a broken line indicating that the upper surface 41b of the facing portion 41 in the metal plate 40 and the upper surface 33b of the tall electronic component 33 are at the same position in the thickness direction.

  In the present embodiment, the legs 42 of the metal plate 40 are connected to the lands 24 of the substrate 20, and the semiconductor device 10 has the back surface 20 b of the substrate 20 that is not covered with the mold resin 50 with the pads 26 for external connection. Provided. Thus, since there is no lead for external connection, the size of the semiconductor device 10 can be reduced in the vertical direction.

(Second Embodiment)
In the present embodiment, description of portions common to the semiconductor device 10 shown in the above embodiment is omitted. In the first embodiment, the example in which the thicknesses of the plurality of vertical elements 31 and 32 connected to the same metal plate 40 (40a or 40b) are substantially the same is shown.

  On the other hand, in the present embodiment, as shown in FIG. 6, the thicknesses of the plurality of vertical elements 31 and 32 are different from each other. In FIG. 6, the FWD 32 is thicker than the IGBT 31. In the vertical direction, the opposing portion 41 of the metal plate 40 has a lower surface 41a of the opposing portion 41 so that the sum of the thickness of the opposing portion 41 and the IGBT 31 and the sum of the thickness of the opposing portion 41 and the FWD 32 are equal. Have a step and partly different in thickness.

  Specifically, a concave portion 43 is formed on the lower surface 41a of the facing portion 41 of the metal plate 40 corresponding to the thick FWD 32, thereby providing a step on the lower surface 41a. The FWD 32 is connected to the bottom surface portion of the recess 43 in the lower surface 41 a of the facing portion 41 via the solder 61. Also in this embodiment, the thicknesses of the solders 60 are substantially equal to each other, and the thicknesses of the solders 61 are substantially equal to each other.

  According to this, although the thickness of the plurality of vertical elements 31 and 32 is different, the thickness of the covering portion 51 of the mold resin 50 is made substantially equal between the upper portion of the IGBT 31 and the upper portion of the FWD 32, that is, facing each other. The entire area of the portion 41 can be made substantially uniform. Thereby, the inclination of the opposing part 41 can be suppressed. Therefore, the heat generated by the vertical elements 31 and 32 can be efficiently radiated through the opposing portion 41 of the metal plate 40 and the covering portion 51 of the mold resin 50, respectively, and electrical insulation can be ensured. .

(Third embodiment)
In the present embodiment, description of portions common to the semiconductor device 10 shown in the above embodiment is omitted. In the said embodiment, the example in which the upper surface 41a in the opposing part 41 of the metal plate 40 was flat was shown. On the other hand, in this embodiment, as shown in FIG. 7, the opposing part 41 of the metal plate 40 has the groove part 44 in the upper surface 41b. The groove portion 44 has an end portion opened on a side surface 41 c that connects the lower surface 41 a and the upper surface 41 b of the facing portion 41. Specifically, the groove portion 44 is formed so that the plane along the vertical direction straddles the opposite side surface 41 c in the rectangular facing portion 41.

  According to this, when molding the mold resin 50, the fluidity of the resin in the direction along the groove 44 can be improved in the facing region between the upper surface 41a of the facing portion 41 of the metal plate 40 and the inner surface of the mold. . For this reason, in order to improve heat dissipation, even if the opposing area | region of the upper surface 41a of the opposing part 41 of the metal plate 40 and the inner surface of a type | mold is narrow, resin can be spread over an opposing area | region. That is, electrical insulation can be ensured.

  Moreover, since the contact area of the opposing part 41 of the metal plate 40 and the mold resin 50 increases by the groove part 44, it becomes difficult to peel the mold resin 50 from the opposing part 41, and it can improve heat dissipation over a long period of time.

  The shape of the groove 44 is not limited to a linear shape along one direction in the vertical direction. For example, a lattice shape may be used.

(Fourth embodiment)
In the present embodiment, description of portions common to the semiconductor device 10 shown in the above embodiment is omitted. In 3rd Embodiment, the opposing part 41 of the metal plate 40 showed the example which has the groove part 44 in the upper surface 41a. On the other hand, in this embodiment, as shown in FIG. 8, the opposing part 41 of the metal plate 40 has the uneven part 45 in the side surface 41c.

  According to this, since the contact area between the facing portion 41 of the metal plate 40 and the mold resin 50 is increased by the concavo-convex portion 45, the mold resin 50 is difficult to peel from the side surface 41 c of the facing portion 41 of the metal plate 40. For this reason, it can suppress that peeling progresses to the upper surface 41b side of the opposing part 41 from the peeling of the side surface 41c, and, thereby, heat dissipation falls.

  In addition, when the uneven | corrugated | grooved part 45 is made into the same groove shape as 3rd Embodiment, the fluidity | liquidity of the mold resin 50 which coat | covers the side surface 41c can be improved.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  In the above embodiment, an example in which two vertical elements 30 (31, 32) are arranged on one metal plate 40 has been described. However, the number of the vertical elements 30 is not limited to the above example. For example, as shown in FIG. 9, one vertical element 30 (for example, IGBT) may be arranged on one metal plate 40. As another example, three or more vertical elements 30 may be arranged for one metal plate 40.

  In the said embodiment, the example of the board | substrate 20 was shown as an electronic component mounting member. However, as shown in FIG. 10, a lead frame 27 may be adopted as the electronic component mounting member. In FIG. 10, an IGBT is employed as the vertical element 30, and among the die pads 28 in the lead frame 27, the gate electrode of the vertical element 30 (IGBT) is connected to the die pad 28a by the solder 60, and the vertical type is connected to the die pad 28b. The emitter electrode of element 30 (IGBT) is connected by solder 60. That is, in each die pad 28 (28a, 28b), the connection portion of the solder 60 on one surface 27a of the lead frame 27 is the first connection portion described in the claims. The die pads 28a and 28b are electrically separated.

  The lead frame 27 has a lead 29 partially extended from the mold resin 50 as a terminal for external connection, and a leg portion 42 of the metal plate 40 is attached to one end of the lead 29 by solder 62. It is connected. The lead 29 is electrically separated from the die pad 28 forming the first connection portion. In addition, a part of the lead 29 on the one surface 27a of the lead frame 27 that is covered with the mold resin 50 is a second connecting portion described in the claims. In the semiconductor device 10 shown in FIG. 10, the die pad 28 (28a, 28b) is sealed by the mold resin 50, and the heat generated by the vertical element 30 is radiated to the first main surface side in the thickness direction. It has become a configuration. However, the heat generated by the vertical element 30 can be transmitted to the facing portion 41 of the metal plate 40 via the solder 61 and radiated from the facing portion 41 to the outside via the covering portion 51 of the mold resin 50.

  With respect to the configuration employing the lead frame 27 as described above, the configuration shown in the above embodiment can be employed by replacing the lead frame 27 with the substrate 20. 10 shows an example in which the leg portion 42 of the metal plate 40 is connected to the lead 29. For example, when the die pad 38 is electrically separated from the die pad 38 and the electronic component 33 is mounted, The leg portion 42 can be connected to the die pad via the solder 62.

10 ... Semiconductor device 20 ... Substrate (electronic component mounting member)
20a ... one surface 23, 23a-23c ... land, first connecting portion 24 ... land, second connecting portion 27 ... lead frame (electronic component mounting member)
28 ... Die pad 29 ... Lead 30 ... Vertical element (electronic component having electrodes on both sides)
31 ... IGBT
32 ... FWD
40, 40a, 40b ... Metal plate 41 ... Opposing part 41b ... Upper surface 42 ... Leg part 50 ... Mold resin 51 ... Covering part 60-63 ... Solder

Claims (9)

An electronic component mounting member (20, 27) having a first connection part (23) and a second connection part (24) electrically separated from the first connection part (23) on one surface (20a, 27a); ,
On one surface (20a) of the electronic component mounting member (20) having electrodes on both the first main surface and the second main surface opposite to the first main surface, and facing the first main surface And an electronic component (30) in which the electrode of the first main surface is connected to the first connection portion (23) by solder (60),
A facing portion (41) disposed to face the second main surface of the electronic component (30); and a leg portion (42) extending from the facing portion (41) and bent with respect to the facing portion (41). The opposing portion (41) is connected to the electrode of the second main surface of the electronic component (30) by the solder (61), and the leg portion (42) is connected to the second connecting portion by the solder (62). A metal plate (40) connected to (24);
A semiconductor device comprising: a mold resin (50) for integrally sealing at least a part of the electronic component mounting member (20, 27), the electronic component (30), and the metal plate (40). And
The semiconductor device according to claim 1, wherein a thickness of the facing portion (41) of the metal plate (40) is larger than a thickness of the leg portion (42). A plurality of the electronic components (31, 32);
2. The semiconductor device according to claim 1, wherein an electrode on a second main surface of each electronic component is connected to the same facing portion. The plurality of electronic components (31, 32) have different thicknesses from each other,
In the vertical direction, the opposing part (41) of the metal plate (40) has the electronic component (41) so that the sum of the thicknesses of the opposing part (41) and the electronic component (31, 32) is equal. 30. The semiconductor device according to claim 2, wherein the opposing surface (41a) facing the second main surface of (30) has a step and has a partially different thickness. The facing portion (41) of the metal plate (40) has a groove portion (44) on the back surface (41b) opposite to the facing surface (41a) facing the second main surface of the electronic component (30),
The groove portion (44) has an end portion opened to a side surface (41c) connecting the opposing surface (41a) and the back surface (41b). The semiconductor device described.   The facing portion (41) of the metal plate (40) includes a facing surface (41a) facing the second main surface of the electronic component (30) and a back surface (41b) opposite to the facing surface (41a). The semiconductor device according to any one of claims 1 to 4, wherein the side surface (41c) to be connected has an uneven portion (45). The electronic component mounting member (20) is a substrate in which wiring is formed on an insulating base material (21),
The first connection part (23) is a land formed on one surface (20a) of the substrate (20),
The said 2nd connection part (24) is a land formed apart from the said 1st connection part (23) in the one surface (20a) of the said board | substrate (20), The one of Claims 1-5 characterized by the above-mentioned. 2. A semiconductor device according to item 1. An electronic component (33) disposed on a region (20a) of the substrate (20) different from a region where the metal plate (40) is disposed,
The mold resin (50) contacts the surface (33b) opposite to the substrate (20) of the electronic component (33),
In the vertical direction, the surface (41b) opposite to the substrate (20) in the facing portion (41) of the metal plate (40) and the surface (33b) opposite to the substrate (20) in the electronic component (33) are the same. The semiconductor device according to claim 6, wherein the semiconductor device is positioned. The electronic component mounting member (27) is a lead frame,
The first connection portion (23) is a connection portion with the electronic component (30) in the die pad (28) of the lead frame (27),
The second connection part (24) is a part (29) electrically separated from the die pad (28) on which the electronic component (30) is arranged in the lead frame (27), and the metal plate ( The semiconductor device according to any one of claims 1 to 5, wherein the semiconductor device is a connection portion with a leg portion (40). An electronic component (33) disposed on the lead frame (27) and in contact with the mold resin (50) on a surface (33b) opposite to the lead frame (27),
In the vertical direction, a surface (41b) opposite to the lead frame (27) in the facing portion (41) of the metal plate (40) and a surface (33b) opposite to the lead frame (27) in the electronic component (33). 9. The semiconductor device according to claim 8, wherein the same position is set at the same position.

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