JP2012211352A - Evaporation source, organic el-device manufacturing device and organic el-device manufacturing method - Google Patents

Abstract

【Task】
An object of the present invention is to provide an evaporation source that can reduce the loss of material or prevent a change in internal pressure that prevents stable deposition. Moreover, it is providing the organic EL device manufacturing apparatus and organic EL device manufacturing method suitable for the said evaporation source.
[Solution]
The present invention provides a vapor deposition in which a crucible having a vapor deposition material therein, heating means for heating and evaporating / sublimating the vapor deposition material, and a plurality of vapor deposition nozzles for ejecting the vaporized / sublimated vapor deposition material are arranged in a line. A first feature of the evaporation source having an object injection port portion is that the evaporation source port portion includes a plurality of the deposit material injection port portions, and has an opening / closing means that opens and closes for each of the deposit material injection port portions. Further, the present invention opens at least one of the plurality of deposit injection port portions, and closes all the deposit injection port portions of the other deposit injection port portions at that time. Thus, a second feature is to have a control means for controlling the opening and closing means.
[Selection] Figure 1

Description

  The present invention relates to an evaporation source, an organic electroluminescence (hereinafter referred to as organic EL) device manufacturing apparatus, and an organic EL device manufacturing method, and more particularly to an evaporation source, an organic EL device manufacturing apparatus, and an organic EL device manufacturing method with little loss of vapor deposition material. .

  The common electrode layer and the organic light emitting layer of the organic EL are formed by, for example, vacuum deposition. The vacuum vapor deposition apparatus includes a crucible in which a material for a layer to be formed is stored in a vacuum chamber and an evaporation source including a heater for heating the crucible, and a direction in which the vapor deposition material evaporates and sublimates, a so-called crucible vapor deposition nozzle or opening. It has a structure in which a vapor-deposited glass substrate (hereinafter referred to as a substrate) is arranged on the surface side of the part. Then, molecules of the evaporation material evaporated and sublimated from the evaporation source are evaporated on the evaporation target substrate.

  In the vapor deposition of organic EL, the organic material in the evaporation source crucible is heated by a heater to evaporate and sublimate to reach the deposition target substrate to form a film. In the case of a device that requires high-level positioning such as FPD (Flat panel display), the time required for substrate replacement and the time required for alignment between the substrate and mask cannot be deposited. Attempts have been made to solve such problems.

  First, in the substrate exchange time and positioning time zone, there is a first method in which the deposition is substantially stopped by blocking a deposit on the deposition target substrate by a substrate shutter mechanism or the like. Alternatively, there is a second method in which the vapor deposition is stopped or returned by controlling the current of the heater that is heating the crucible.

  Furthermore, in order to suppress evaporation / sublimation of the vapor deposition material that does not contribute to film formation, such as substrate replacement time, a flow rate adjusting valve is provided at the material evaporation port to suppress evaporation / sublimation of the vapor deposition material from the valve (crucible). There are three methods, and as an improved method, an escape passage is provided in order to suppress an increase in pressure inside the crucible when the valve is closed (Patent Document 1).

JP 2005-281808 A

  Although it is an organic EL device having characteristics superior to those of other FPD / lighting devices, the manufacturing cost tends to be higher than that of other devices. The main causes are the use of expensive vapor deposition materials and low material efficiency.

  The first method (Patent Document 1) for substantially stopping vapor deposition by a substrate shutter mechanism or the like is to evaporate and sublimate the vapor deposition material at a predetermined vapor deposition rate during continuous operation, and the vapor deposition is blocked by the substrate shutter or the like. The material that is evaporated and sublimated during this time becomes a discarded material that does not contribute to the material efficiency, and there is a problem that a considerable amount of the expensive organic EL material cannot reach the substrate and is discarded. The second method (Patent Document 2) for controlling the current takes an extremely long response time, so that material evaporation / sublimation from the evaporation source cannot be arbitrarily stopped by controlling the heating. For this reason, the second method cannot be employed in an apparatus that requires continuous operation. In addition, the third method for suppressing evaporation / sublimation of the vapor deposition material from the crucible with a valve or the like has problems such as a change in evaporation / sublimation speed at the time of re-opening due to an increase in internal pressure and a material alteration.

Accordingly, a first object of the present invention is to provide an evaporation source that can reduce the loss of material or prevent a change in internal pressure that hinders stable deposition.
In addition, a second object of the present invention is to provide an organic EL device manufacturing apparatus and an organic EL device manufacturing method suitable for an evaporation source that can achieve the first object.

In order to achieve the above object, the present invention has at least the following features.
In the present invention, a crucible having a vapor deposition material in the center, heating means for heating and evaporating / sublimating the vapor deposition material, and a plurality of vapor deposition nozzles for ejecting the vaporized / sublimated vapor deposition material are arranged in a line. A first feature of the evaporation source having a deposit injection port portion is that a plurality of the deposit injection port portions are provided, and opening / closing means is provided for opening and closing each of the deposit injection port portions.

Further, according to the present invention, the opening / closing means includes: a plate-like body having an opening corresponding to the position of the vapor deposition material injection port; and a driving unit that moves the plate-like body along the vapor deposition material injection port portion. It has the second feature.
Furthermore, the present invention is characterized in that a plurality of the crucibles are provided along the deposited material injection port.

In addition, the present invention has a fourth feature that a plurality of the deposited material injection port portions are 2, and the two deposited material injection port portions are provided on the opposite side of the crucible.
Furthermore, the present invention is characterized in that a plurality of the deposit spray ports are 3 or 4, and the three or four deposit spray ports spray in different directions.

Further, in the present invention, a plurality of the deposit spray ports are four, and two of the four deposit jet ports are present on the opposite side of the crucible as one set, and two sets of the deposit jets The sixth feature is that the spray is alternately performed from the mouth.
Further, the present invention opens at least one of the plurality of deposit injection port portions, and at that time, at least one of the other deposit injection port portions, the deposit injection port portion. A seventh feature is that it has control means for controlling the opening and closing means so as to close the door.

  In addition, the present invention provides an organic EL device manufacturing apparatus or an organic EL device manufacturing method in which a substrate is transported to a plurality of processing units in a vacuum deposition chamber, and a deposition material is deposited on the substrate. The substrate is directly opposed to the deposit spray port according to any one of the above, and held in a vertical or substantially vertical state, and at least one of the deposit jet ports is a plurality of the deposit spray ports. Opening and then controlling to close at least one of the other deposit spray ports, and performing the deposition by moving the evaporation source along the substrate. Eight features.

  Furthermore, the present invention provides the processing unit according to claim 4, wherein the plurality of processing units are two, and the substrates are alternately transported to the two processing units, and the two substrates provided so as to face each other. It is a ninth feature that vapor deposition is alternately carried out from the two vapor deposit outlets of the evaporation source and vapor deposited on the substrate of the two processing units.

  Further, in the present invention, the plurality of processing units are three or four, and the substrate is transported to the three or four processing units in a predetermined order, and the three or four evaporation sources according to claim 5. According to a tenth feature, the substrate is deposited in the predetermined order by controlling one of the deposit outlets.

  In the present invention, the substrate is transported with the vapor deposition surface of the substrate as an upper surface, and is horizontally placed on a substrate holding portion that holds the substrate, and the substrate holding portion is moved from the horizontal state to the vertical or substantially vertical. This is an eleventh feature.

  ADVANTAGE OF THE INVENTION According to this invention, the evaporation source which can reduce the loss of a material or prevents the change of the internal pressure which prevents stable vapor deposition can be provided.

  Moreover, according to this invention, the organic EL device manufacturing apparatus suitable for the evaporation source which can achieve the 1st objective, and the organic EL device manufacturing method can be provided.

It is a schematic diagram which shows 1st Embodiment of the evaporation source of this invention. It is a figure which shows the organic EL device manufacturing apparatus which is the 1st Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the conveyance chamber and processing chamber of the organic electroluminescent device manufacturing apparatus which is the 1st Embodiment of this invention. It is a figure which shows the evaporation source scanning means which moves the evaporation source provided horizontally in order to vapor-deposit over the whole substrate surface. It is a figure which shows the vacuum evaporation flow in the organic EL device manufacturing apparatus which is the 1st Embodiment of this invention. It is a schematic diagram which shows 2nd Embodiment of the evaporation source of this invention. It is a figure which shows the organic EL device manufacturing apparatus which is the 2nd Embodiment of this invention. It is a figure which shows the vacuum evaporation flow in the organic EL device manufacturing apparatus which is the 2nd Embodiment of this invention. It is a figure which shows embodiment of the other organic EL device manufacturing apparatus of this invention.

Embodiments of the present invention will be described below with reference to the drawings.
Fig.1 (a) is a schematic diagram which shows 1st Embodiment of the evaporation source 7 of this invention, FIG.1 (b) is an arrow line view from the AA cross section in Fig.1 (a). The main body of the evaporation source 7 has a quadrangular prism (rectangular) shape as shown in FIG. 1A, and a plurality of crucibles 71 shown in FIG. Heaters 7 3 are arranged above and below each crucible 71, and the crucible 1 is heated to a temperature suitable for vapor deposition of the vapor deposition material 2. Further, a reflection plate 74 is provided around the periphery thereof so that the heat in the evaporation source 7 can be trapped inside without letting it escape to the outside. Further, a water cooling box 75 for heat insulation is provided on the outer periphery thereof, so that the heat leaked from the reflection plate 74 does not affect the outside, and has a substantially quadrangular prism shape. However, other members may be provided around the evaporation source, and the appearance does not always have a prismatic shape such as a quadrangular prism.

  A vapor deposition material 72 is placed inside each crucible 71 and heated by a heater 73 to evaporate and sublimate, and a plurality of vapor deposition nozzles 78 serving as vapor deposits are arranged in a line in the longitudinal direction of the long surface of the quadrangular column. Injected from the deposit outlet. In this embodiment, as shown in FIG.1 (b), the vapor deposition nozzles 78a and 78b are provided so that it may become back-to-back at the two long sides of the left-right direction which has a quadrilateral cross section. Then, there are plate-like shutters 76a and 76b which are opening / closing means for blocking the vapor deposition nozzles 78a and 78b, and are moved up and down by actuators 77a and 77b which are driving means provided at both ends of the long side of the evaporation source 7. The shutters 76a and 76b have openings 79a and 79b at positions corresponding to the vapor deposition nozzles 78a and 78b of the respective crucibles 71. When the openings 79a and 79b come to the vapor deposition nozzles 78a and 78b, the openings are opened. The vaporized and sublimated vapor deposition material 72 is ejected from the portions 79a and 79b, and when the openings 79a and 79b come to positions other than the vapor deposition nozzles 78a and 78b, the ejection is blocked. That is, the opening / closing operations of the vapor deposition nozzles 78a and 78b are controlled by the actuators 77a and 77b, respectively. The opening / closing operation is always opened only on one side. The shutters 76a and 76b are heated so as not to cause clogging at the nozzle portion. The openings 79a and 79b have a diameter that matches the diameter of the vapor deposition nozzle, but may be a long and narrow opening having a diameter of the vapor deposition nozzle that covers all the vapor deposition nozzles.

  According to the evaporation source 7 of the first embodiment described above, two vapor deposition nozzles back to back, that is, two vapor deposition nozzles provided on the opposite side of the crucible alternately provide substrates to be vapor deposited on one side. When the deposition of the substrate is completed, the deposition nozzle corresponding to the substrate is closed, the other deposition nozzle is opened, and the corresponding substrate is deposited, so that the loss of the material can be reduced. That is, if another substrate can be deposited during the substrate replacement time or alignment time, the actual operation rate of the evaporation source can be brought close to 100%.

  In addition, according to the evaporation source 7 of the first embodiment described above, the vapor deposition nozzle is always opened only on one side toward the substrate, thereby suppressing an increase in the crucible internal pressure, and preventing material deterioration and evaporation / sublimation rate changes. It is possible to prevent vapor deposition with high reliability.

  An organic EL device manufacturing apparatus capable of exhibiting the effect of the evaporation source using the evaporation source shown in FIG. 1 will be described with reference to FIGS.

  FIG. 2 shows an organic EL device manufacturing apparatus 100 according to the first embodiment of the present invention. Organic EL device manufacturing equipment is not simply a structure in which a light emitting material layer (EL layer) is formed and sandwiched between electrodes, but a hole injection layer or transport layer on the anode, and an electron injection layer or transport layer on the cathode. A multilayer structure in which various materials are formed as a thin film is formed, and a substrate is cleaned. FIG. 2 shows an example of the manufacturing apparatus.

  The organic EL device manufacturing apparatus 100 according to the present embodiment is roughly divided into a load cluster 3 that carries a substrate 6 to be processed, four clusters (A to D) that process the substrate 6, between each cluster, or between the cluster and the load cluster 3, or It is comprised from the five delivery chambers 4 installed between the following processes (sealing process). In this embodiment, the substrate is transported with the deposition surface of the substrate as the upper surface, and the substrate is erected and deposited when vapor deposition is performed.

  The load cluster 3 includes a load lock chamber 31 having a gate valve 10 in order to maintain a vacuum in front and back, and a transfer robot 5R that receives a substrate from the load lock chamber 31 and turns to carry the substrate 6 into the delivery chamber 4a. Become. Each load lock chamber 31 and each delivery chamber 4 have a gate valve 10 in the front and rear, and deliver the substrate to the load cluster 3 or the next cluster while controlling the opening and closing of the gate valve 10 and maintaining a vacuum.

  Each cluster (A to D) includes a transfer chamber 2 having a single transfer robot 5 and two processing chambers 1 (first) arranged on the upper and lower sides in the drawing for receiving a substrate from the transfer robot 5 and performing a predetermined process. 1 subscripts a to d indicate clusters, and second subscripts u and d indicate upper and lower sides). A gate valve 10 is provided between the transfer chamber 2 and the processing chamber 1.

  FIG. 3 shows an outline of the configuration of the transfer chamber 2 and the processing chamber 1. Although the configuration of the processing chamber 1 varies depending on the content of processing, a vacuum deposition chamber 1bu that deposits a deposition material in a vacuum to form an EL layer will be described as an example. FIG. 3 is a schematic diagram and an operation explanatory diagram of the configuration of the transfer chamber 2b and the vacuum deposition chamber 1bu at that time. The transfer robot 5 in FIG. 3 has an arm 57 with a link structure that can move up and down (see arrow 59) and can be turned left and right, and has a comb-like hand 58 for transferring the substrate at the tip. .

  In this embodiment, as shown in FIG. 3, two processing lines are provided in one vacuum deposition chamber, and while vapor deposition is performed on one line (L line in FIG. 3), a substrate is disposed on the other R line. The substrate 6 and the mask 8 are aligned to complete the preparation for vapor deposition. By alternately performing this process, it is possible to reduce the time during which the substrate 6 is evaporated and sublimated without being evaporated.

  In order to realize the above, the vacuum deposition chamber 1bu includes a substrate holding unit 9 for transferring the transfer robot 5 and the substrate 6 to each line, a substrate turning driving unit 93 for turning and standing up the comb-like hand 91 of the substrate holding unit, and A mask 8 for alignment with the upright substrate 6 is provided, and an evaporation source 7 is provided horizontally between the substrate holders 9 of both lines and parallel to the substrate holder 9. The substrate turning means 93 turns the substrate holding part 9 so as to face the evaporation source 7.

FIG. 4 shows an evaporation source scanning means 43 for moving the evaporation source 7 provided horizontally in order to evaporate the entire surface of the substrate 6. The evaporation source 7 is fixed to an evaporation source fixing base 42d that moves up and down by an evaporation source scanning means 43. The evaporation source scanning means 43 drives the ball screw 43b by a ball screw drive motor 43m, and moves the evaporation source fixing base 42d up and down by a nut 43n.
The ball screw drive motor 43m is provided outside the vacuum deposition chamber 1bu through a vacuum seal 43s. As a result, excessive heat generated by the heat generated by the ball screw drive motor 43m is prevented from entering the vacuum deposition chamber 1bu. Note that. In FIG. 4, the evaporation source is arranged horizontally and moved up and down, but an evaporation source 7A described later may be provided vertically and moved left and right.

Next, the vacuum deposition flow in the organic EL device manufacturing apparatus of this embodiment will be described with reference to FIG.
First, in the L line, the substrate 6L is carried in, the substrate 6L is set up vertically (or substantially vertical), and alignment with the mask 8L is performed (Step L1 to Step L3). At this time, the substrate 6 is transported with the vapor deposition surface facing upward in order to perform vertical alignment immediately. For the alignment, as shown in the drawing of FIG. 3, the mask 8 is imaged by the CCD camera 86 so that the alignment mark 84 provided on the substrate 6 comes to the center of the opening 85 provided on the mask 8. This is performed by controlling with an alignment driving means (not shown).

  When the alignment is completed, the deposition nozzles are selected by controlling the shutters 76a and 76b so that the deposition material can be injected only from the deposition nozzle on the L line side (Step L4), and deposition is performed on the substrate 6L (Step L5). On the other hand, until the deposition of the L line is completed, the processing from Step R1 to Step R3 is performed in the R line in the same manner as in the L line. That is, another substrate 6R is loaded, the substrate 6R is vertically (or substantially vertically) aligned, and aligned with the mask 8R. When the deposition of the L-line substrate 6L is completed, the deposition nozzle is immediately switched, that is, the deposition nozzle is selected by controlling the shutters 76a and 76b so that the deposition material can be sprayed from only the deposition nozzle on the R line side (Step R4). It vapor-deposits on the board | substrate 6R (StepR5). Since this switching is performed in an instant, almost no vapor deposition material is wasted. FIG. 3 shows the state of StepL5 and StepR1. That is, vapor deposition is started in the L line, and the substrate is carried into the vacuum vapor deposition chamber 1bu in the R line. Thereafter, the above processing flow is repeated.

  According to the first embodiment of the organic EL device manufacturing apparatus described above, it is possible to carry the substrate on one line and deposit the substrate on the other line during alignment without using a deposition material almost wastefully. In addition, since the vapor deposition can be switched from one line to the other in an instant, there is almost no time for injecting the vapor deposition material, that is, the actual operating rate of the evaporation source can be brought close to 100%.

  According to the first embodiment of the organic EL device manufacturing apparatus described above, it is possible to provide an organic EL device manufacturing apparatus and an organic EL device manufacturing method with high throughput that can eliminate almost no time not used for vapor deposition.

  Next, a second embodiment 7A of the evaporation source 7 of the present invention will be described with reference to FIG. FIG. 6 is a view corresponding to FIG. 1B, and is an arrow view from the cross section corresponding to FIG. 1A of the evaporation source 7A in the second embodiment. In FIG. 6, components having the same functions as those in the first embodiment are denoted by the same reference numerals. The second embodiment is different from the first embodiment in the following points.

First, in the first embodiment, the crucibles 71 are horizontally arranged in the longitudinal direction of the long surface of the evaporation source, whereas in the second embodiment, each of the crucibles 71 is arranged in the longitudinal direction of the long surface of the evaporation source. This is a vertical type in which crucibles 71 are arranged vertically. Therefore, in 2nd Embodiment, sectional drawing shown in FIG. 6 turns into an arrow view which sees the bottom face in which the vapor deposition material 72 is provided. Secondly, the evaporation source has vapor deposition nozzles 78a, 78b, 78c in three directions, and the shutter is also provided with 76a, 76b, 77c in three directions. In the second embodiment, vapor deposition nozzles can be provided in four directions.
Further, similarly to the first embodiment, only the vapor deposition nozzle on one side is opened in the second embodiment.

  Also in the second embodiment 7A of the evaporation source 7 described above, the loss of the material can be reduced by arranging the substrate corresponding to each surface having the vapor deposition nozzle and sequentially vapor-depositing the substrate. That is, if another substrate can be deposited during the substrate replacement time or alignment time, the actual operation rate of the evaporation source can be brought close to 100%.

  Also in the second embodiment 7A of the evaporation source 7 described above, by always opening the vapor deposition nozzle toward the substrate only on one side, the rise in the crucible internal pressure is suppressed, the material is altered, and the evaporation / sublimation rate is changed. Therefore, highly reliable vapor deposition can be performed.

  FIG. 7 is a view showing an organic EL device manufacturing apparatus suitable for the second embodiment of the evaporation source 7. FIG. 7 is a diagram schematically showing a cluster B as an example of the four clusters shown in FIG. Of course, the number of clusters is not four, but may be one or five or more. In the following description, reference numerals indicating clusters are omitted.

The cluster includes two transfer chambers 2a and 2b having one transfer robot 5a and 5b, and a vacuum evaporation chamber 1 which is one process chamber 1 that receives a substrate from the transfer robot 5 and performs a vacuum evaporation process. The vacuum deposition chamber 1 has three lines R, M, and L arranged in a T shape, and an evaporation source 7A that is arranged at the center of the three lines and moves as indicated by an arrow H.
In each line, as in the first embodiment of the organic EL device manufacturing apparatus shown in FIG. 2, the substrate holding unit 9 for transferring the transfer robot 5a or 5b and the substrate 6 and the substrate turning for rotating the substrate holding unit 9 upright. It has a mask 8 that aligns with driving means (not shown) and an upright substrate 6.

  Similarly to the evaporation source 7, the evaporation source 7A is provided with the vapor deposition material 72 in one of R (red), G (green), and B (blue), so that the transfer robots 5a and 5b are provided with the delivery chamber 4b. Then, the substrate is transferred to each line, and the substrate deposited on each line is transferred to the delivery chamber 4c. A gate valve 10 is provided between the processing lines R, M, and L in the two transfer chambers 2a and 2b.

  At this time, the evaporation source 7A moves as indicated by an arrow H in accordance with the operation of the transfer robots 5a and 5b. It is arranged for each mask so that the position where the deposition of the L line is completed becomes the deposition start position of the M line and the position where the deposition of the M line is completed becomes the deposition start position of the R line. The By arranging in this way, loss of the vapor deposition material 72 occurs for the time required to move from the L line to the R line, but the vapor deposition material 72 can be moved between other lines without loss.

  FIG. 8 is a diagram illustrating an example of a vacuum deposition flow in the present embodiment using the above-described three lines and two transfer robots. In FIG. 8, the solid thick frame 4 indicates the operation of the transfer robot 5a, and the broken thick frame indicates the operation of the transfer robot 5b. In addition, the contents described below each line indicate the processing of each line including the thick frame portion. Step 1 to Step 5 indicate initial operations, and Step 6 to Step 15 indicated by bold numerals indicate subsequent repeated operations. In the following description, for example, M in M5 indicates the M line, and the numeral indicates Step shown in FIG.

  First, the transfer robot 5a carries the substrate 6 (R) for the R line from the delivery chamber 4b into the M line (Step M1), and the transfer robot 5b carries the substrate 6 (R) from the M line to the R line (Step R2). ). Thereafter, the transfer robot 5a carries the M line substrate 6 (M) from the delivery chamber 4b into the M line (Step M3), and then the transfer robot 5a removes the L line substrate 6 (L) from the delivery chamber 4b to L. It carries in to a line (StepL4). After carrying in the substrate 6, in each line, the substrate and the mask are aligned (Step R3, M4, L5), and vapor deposition is performed in the order indicated by the arrow H (Step R4, M5, L6). In the R line, after vapor deposition, the substrate 6 (R) is carried out to the delivery chamber 4c until vapor deposition in the M line is completed (Step L5).

Next, in the M line, during vapor deposition in the L line, the transfer robot 5b carries the vapor-deposited substrate 6 (M) to the delivery chamber 4c (Step M6), and then the transfer robot 5a removes the substrate for the R line from the delivery chamber 4b. A new substrate 6 (R) is carried into the M line (Step M7), and the transfer robot 5b carries the new substrate 6 (R) from the M line into the R line (Step R8). Thereafter, a new substrate 6 (R) is aligned on the R line (Step R9).
Next, the evaporation source 7A is moved from the R line to the L line (Step 10).

Then, during vapor deposition on the R line, the substrate 6 (L) vapor deposited on the L line on the M line is carried out to the delivery chamber 4c by the transfer robots 5a and 5b (Step M11, M12), and a new substrate 6 is transferred by the transfer robot 5a. (M) is carried in (from the delivery chamber 4b) (Step M13), and a new substrate 6 (M) is aligned (Step M14). afterwards. In the L line, before the deposition of the M line is completed, a new substrate 6 (L) is carried in from the delivery chamber 4b by the transfer robot 5a (Step L14), and the alignment of the new substrate 6 (L) is performed (Step M15). ).
Thereafter, Step 6 to Step 15 are repeated.

  In FIG. 8, the substrates are loaded in the order of R line, M line, and L line, and the substrates are vapor-deposited and carried out in that order. Although the order mentioned above can be considered in various ways, it is important to deposit and carry out in the order of loading.

  According to the second embodiment of the organic EL device manufacturing apparatus described above, although there is some loss of the vapor deposition material during the movement from the L line to the R line, 3 provided in one vacuum vapor deposition chamber. By sequentially vapor-depositing with one processing line, the time for injecting the vapor deposition material can be greatly reduced, that is, the actual operation rate of the evaporation source can be close to 100%.

  According to the second embodiment of the organic EL device manufacturing apparatus described above, it is possible to provide an organic EL device manufacturing apparatus and an organic EL device manufacturing method with high throughput that can significantly reduce the time not used for vapor deposition.

It was previously described that the evaporation source 7A, which is the second embodiment of the evaporation source, can be provided with four-direction vapor deposition nozzles. For example, as shown in FIG. 9A, it is also possible to perform vapor deposition by providing four vapor deposition processing lines arranged at 90 ° positions and sequentially selecting vapor deposition nozzles in four directions.
Further, as shown in FIG. 9B, four vapor deposition processing lines arranged at 90 degrees from each other are provided, and the substrate holder 9 and the mask of the four vapor deposition processing lines, or the substrate and the mask after alignment are provided. Can be moved in the directions of arrows F and I, respectively, and two of the four vapor deposition lines can be brought closer to the evaporation source 7A, and vapor can be vapor-deposited simultaneously from the opposite two-direction vapor deposition nozzles. It is. At this time, the remaining two opposing vapor deposition nozzles are closed. In other words, by always depositing the vapor deposition nozzle in two directions and closing the vapor deposition nozzles in the other two directions, the pressure inside the crucible can be suppressed, and the quality change of the material and the change in evaporation / sublimation rate can be prevented. High vapor deposition can be achieved.

  Although four processing lines are provided in FIG. 9, three or five or more processing lines are arranged in a polygonal shape and have a polygonal column cross-sectional shape with the same number of processing lines as the number of processing lines. It is also possible to perform evaporation by moving an evaporation source having a nozzle as shown in FIGS. 9A and 9B.

  Also in the other organic EL device manufacturing apparatuses described above, the same effect as that of the organic EL device manufacturing apparatus of the first or second embodiment can be obtained.

1: processing chamber 1bu: vacuum deposition chamber 2: transfer chamber 3: load lock chamber 4, 4a to 4e: delivery chamber 5, 5R, 5a, 5b: transfer robot 6: substrate 7, 7A: evaporation source 8: mask 9: Substrate holder 10: Gate valve 43: Evaporation source scanning means 71: Crucible 72: Evaporation material 73: Heater 74: Reflector plate 75: Water cooling box 76a, 76b: Shutter 77a, 77b: Actuator 78a, 78b: Evaporation nozzle 79a, 79b : Shutter opening 93: Substrate turning drive means 100: Organic EL device manufacturing apparatus A to D: Cluster

Claims (14)

A crucible containing vapor deposition material therein; heating means for heating and evaporating and sublimating the vapor deposition material; and a vapor deposition jet port portion in which a plurality of vapor deposition jets for injecting the vaporized and sublimated vapor deposition material are arranged in a line. In the evaporation source having
An evaporation source, comprising: a plurality of the deposit injection port portions, and an opening / closing means for opening and closing each deposit deposit port portion.   The opening / closing means includes a plate-like body having an opening corresponding to the position of the deposit ejection port, and a drive unit that moves the plate-like body along the deposit jet port. The evaporation source according to claim 1.   The evaporation source according to claim 1, wherein a plurality of the crucibles are provided along the deposited material injection port.   4. The evaporation source according to claim 1, wherein a plurality of the deposited material injection port portions are two, and the two deposited material injection port portions are provided on the opposite side of the crucible.   4. The evaporation source according to claim 1, wherein a plurality of the deposited material injection port portions are 3 or 4, and the 3 or 4 deposited material injection port portions spray in different directions.   A plurality of the deposit injection port portions are four, and two of the four deposit deposit injection port portions existing on the opposite side of the crucible are set as one set and jetted alternately from the two sets of the deposit jet port portions. The evaporation source according to claim 1, wherein:   The opening / closing means is configured to open at least one of the plurality of deposits in the plurality of deposits, and then close all the deposits in the other deposits at that time. The evaporation source according to claim 1, further comprising a control unit that controls the evaporation source. A vacuum deposition chamber having a plurality of processing units for depositing a deposition material on a substrate, a delivery chamber for carrying in or carrying out the substrate, and a transport means for transporting the substrate between the delivery chamber and the plurality of processing units. In an organic EL device manufacturing apparatus having a cluster which is a vacuum chamber comprising:
The vacuum deposition chamber opens the evaporation source according to any one of claims 1 to 6 and at least one of the plurality of deposit injection ports, and then the other vapor deposition Control means for controlling the opening and closing means so as to close all the deposit injection port portions of the deposit injection port portion, and the processing unit causes the substrate to be directly opposed to the deposit injection port portion, and An organic EL device manufacturing apparatus, comprising: a substrate holding portion that can be held in a substantially vertical state, and moving means for moving the evaporation source along the substrate.   The vacuum deposition chamber includes the evaporation source according to claim 4, the plurality of processing units are two, and two substrate holding units included in the two processing units are provided so as to face each other, 9. The organic EL device manufacturing apparatus according to claim 8, wherein the control unit alternately ejects the substrates of the two processing units by alternately ejecting the deposits from the two deposited material ejection ports.   The vacuum deposition chamber includes the evaporation source according to claim 5, wherein the plurality of processing units are three or four, and the substrate is transferred to the three or four processing units in a predetermined order, 9. The organic EL device manufacturing apparatus according to claim 8, wherein the control unit controls opening and closing of three or four deposited material injection ports and deposits the substrate in the predetermined order.   The processing unit includes a substrate turning drive unit that moves the substrate holding unit from a horizontal state to the vertical or substantially vertical, and the transfer unit transfers the substrate with the deposition surface of the substrate as an upper surface, and holds the substrate. The organic EL device manufacturing apparatus according to claim 8, wherein the organic EL device manufacturing apparatus is placed horizontally on the part. In the organic EL device manufacturing method of transporting a substrate to each of a plurality of processing units in a vacuum deposition chamber and depositing a deposition material on the substrate,
The substrate is directly opposed to the deposit outlet part of the evaporation source according to claim 1 and held in a vertical or substantially vertical state, and at least of the plurality of deposit outlet parts. Open one of the deposit spray ports, and then control all the deposit spray ports of the other deposit jet ports to close, and move the evaporation source along the substrate. An organic EL device manufacturing method comprising performing the vapor deposition.   The plurality of processing units are two, and the substrates are alternately transported to the two processing units, and two of the evaporation sources according to claim 4 are provided on the two substrates that are provided to face each other. The organic EL device manufacturing method according to claim 12, wherein the vapor deposition material is alternately ejected from a vapor deposition port portion and vapor-deposited on the substrate of the two processing units.   6. The plurality of processing units are three or four, and the substrate is transported to the three or four processing units in a predetermined order, and the three or four evaporation deposits of the evaporation source according to claim 5. The organic EL device manufacturing method according to claim 12, wherein the substrate is deposited in the predetermined order by controlling a mouth portion.

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